Mini LED display module with high ink color consistency and display screen

Abstract

The invention discloses a Mini LED display module with high ink color consistency and a display screen, and belongs to the technical field of display. The Mini LED display module comprises a carrier plate, a chip and a packaging cover plate, wherein the chip is transferred to the carrier plate through a Die Bonding device to achieve electric connection, the packaging cover plate is pasted and fixed to the carrier plate 100 in an attaching mode, and the sum of the thickness h1 of a BM layer of the Mini LED cover plate and the thickness h2 of the BM layer of the carrier plate is larger than or equal to the height H of a Mini LED chip 200. By the adoption of the Mini LED display module with the high ink color consistency and the display screen, the technical problems that in the prior art, due to the fact that a Mini LED direct display module is large in substrate silk-screen printing ink thickness, the packaging adhesive film thickness and manufacturing process fluctuation, the ink color consistency is poor, the sorting cost is increased, and the product utilization rate is reduced are solved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a MiniLED display module and display screen with high ink color consistency. Background Art

[0002] The existing MiniLED direct display module is assembled from a carrier board, a chip and a packaging film; the substrate is screen-printed with black ink, and the ink thickness is large, resulting in poor ink color consistency of the substrate; the packaging film is assembled from a single layer or a multi-layer film, and the ink color of the MiniLED display module is further aggravated due to fluctuations in the thickness of the film itself and the manufacturing process; the MiniLED display module is lit up and sorted by ink color for shipment, which greatly increases the sorting cost and reduces product utilization.

[0003] Chinese patent CN220510036U discloses an LED display module and an LED display screen, in which a black material layer is 3D printed on a substrate between a number of LED light-emitting units to improve the color difference of the substrate. Compared with inkjet printing an ink layer on the substrate, the production process is less. In addition, the 3D printed black material layer can also facilitate seamless contact with a number of LED light-emitting units, achieving a waterproof and moisture-proof effect; however, the 3D printing efficiency used in this patent is extremely low. At the same time, when the ink thickness is lower than the chip, the printed ink has high fluidity and is easy to cover the chip, causing uneven display; when the printed ink is higher than the chip, the overall transmittance is reduced, resulting in excessive brightness loss. Summary of the invention

[0004] The purpose of this application is to provide a MiniLED display module and display screen with high ink color consistency, to solve the problems of poor ink color consistency of the MiniLED direct display module in the prior art due to the large thickness of the screen-printed ink on the substrate, the thickness of the packaging film and the fluctuations in the process technology, as well as the increased sorting cost and reduced product utilization caused by this, while overcoming the technical problems of low printing efficiency, uneven display or excessive brightness loss when the ink thickness is not appropriate in the 3D printed black material layer in the Chinese patent CN220510036U.

[0005] The present application provides a MiniLED display module with high ink color consistency. The MiniLED display module includes a MiniLED carrier, a chip transferred to the MiniLED carrier through a DieBonding device to achieve electrical connection, and a packaging cover plate that is pasted and fixed to the MiniLED carrier through a bonding method. The sum of the BM layer thickness h1 of the MiniLED cover plate and the BM thickness h2 of the MiniLED carrier is ≥ the MiniLED chip height H.

[0006] Preferably, the Mini LED carrier includes a substrate and a BM layer arranged on a surface of the substrate, and the packaging cover plate includes a cover plate made of a transparent glass material and a BM layer arranged on a surface of the cover plate.

[0007] Preferably, the expansion and contraction rate of the substrate is 1 to 15*10e6; the BM layer of the Mini LED carrier and the packaging cover is a black ink layer, which is manufactured by a photo process, and the tolerance fluctuation range of the thickness value h1 of the BM layer of the packaging cover and the thickness value h2 of the BM layer of the Mini LED carrier is 0.01um to 2um.

[0008] Preferably, the package cover plate is provided with windows corresponding to the chip positions one by one, and the width w1 of the windows is ≥ the width W of the chip.

[0009] Preferably, the BM layer fits tightly around the chip to form a barrier to prevent light leakage from the sides of the Mini LED display module.

[0010] Preferably, the steps for preparing the package cover plate are as follows:

[0011] Step 1: Select transparent glass as the cover material;

[0012] Step 2: Apply a BM layer on the surface of the cover plate by Slit Coating technology;

[0013] Step 3: Apply PR glue on the surface of the BM layer by Slit Coating technology to form a PR glue layer;

[0014] Step 5: Expose and develop the PR adhesive layer to form a pattern through a yellow light photo process;

[0015] Step 6: Etching to remove the unprotected part and retain the pattern part;

[0016] Step 7. Remove the PR glue and leave the final pattern.

[0017] Preferably, the steps for preparing the Mini LED substrate are as follows:

[0018] Step 1: Select transparent glass as the substrate material;

[0019] Step 2: coating the BM layer on the surface of the substrate by Slit Coating technology;

[0020] Step 3: Apply PR glue on the surface of the BM layer by Slit Coating technology to form a PR glue layer;

[0021] Step 5: Expose and develop the PR adhesive layer to form a pattern through a yellow light photo process;

[0022] Step 6: Etching to remove the unprotected part and retain the pattern part;

[0023] Step 7. Remove the PR glue, leaving the final pattern for placing the chip.

[0024] The present application provides a Mini LED display screen, including the above-mentioned Mini LED display module.

[0025] Therefore, the present application provides a Mini LED display module and display screen with high ink color consistency, which has the following beneficial effects:

[0026] 1. The carrier is made of low expansion and contraction material (such as glass). The BM layer is made on the substrate through the photo process. The BM thickness fluctuation is very small, which can effectively ensure the consistency of the carrier ink color. At the same time, the cover is made of a patterned BM layer through the photo process. The BM layer is opened at the position of the MiniLED chip and the BM has a very high thickness consistency, which ensures the consistency of the ink color of the cover.

[0027] 2. The sum of the BM thickness h1 of the cover plate and the BM thickness h2 of the carrier plate ≥ the height H of the MiniLED chip; this can ensure the high consistency of the MiniLED display module; at the same time, the package cover plate is designed with windows at the corresponding chip positions to ensure the transmittance of the LED and greatly reduce the brightness loss of the MiniLED; at the same time, the photo process is used for one-time processing and high efficiency; a high-brightness / low-power display design can be produced;

[0028] 3. Reduce the selection of Mini LED display modules and improve the utilization rate of Mini LED display modules to reduce production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic diagram of the Mini LED display module design solution of this application;

[0030] Figure 2 This is a schematic diagram of the packaging cover manufacturing process of this application.

[0031] Reference numerals

[0032] 100, Mini LED carrier; 110, substrate; 120, BM layer 2; 200, Mini LED chip; 300, packaging cover plate; 310, cover plate; 320, BM layer 1; 330, PR adhesive layer 1. DETAILED DESCRIPTION

[0033] The technical solution of the present invention is further illustrated by the following examples.

[0034] Example 1

[0035] like Figure 1-2 As shown, the present application provides a Mini LED display module with high ink color consistency, the Mini LED display module includes a Mini LED carrier 100, a Mini LED chip 200 transferred to the Mini LED carrier 100 by a Die Bonding device to achieve electrical connection, and a packaging cover plate 300 pasted and fixed to the Mini LED carrier 100 by a full bonding method, the sum of the thickness h1 of the BM layer 1 320 of the packaging cover plate 300 and the thickness h2 of the BM layer 2 120 of the Mini LED carrier 100 is ≥ the height H of the Mini LED chip 200.

[0036] The Mini LED carrier 100 is composed of a substrate 110 and a BM layer 120 arranged on the surface of the substrate 110. The Mini LED carrier 100 provides a circuit layer, which can be optionally composed of low expansion and contraction materials such as glass, with an expansion and contraction rate of 1 to 15*10e6; the BM layer 120 is a black ink layer, which is manufactured by a photo process and provides an extremely precise thickness value h2, and the tolerance fluctuation range of h2 is 0.01um to 2um.

[0037] The package cover plate 300 includes a cover plate 310 made of transparent glass and a BM layer 1 320 disposed on the surface of the cover plate 310. The BM layer 1 320 is a black ink layer, which is made by photo process and provides an extremely precise thickness value h2. The tolerance fluctuation range of the thickness h2 of the BM layer 120 and the thickness h1 of the BM layer 1 320 is 0.01um to 2um.

[0038] The package cover plate 300 is provided with windows corresponding to the positions of the Mini LED chips 200, and the width w1 of the windows is ≥ the width W of the Mini LED chips. The BM layer is tightly attached around the Mini LED chips 200 to form a barrier to prevent light leakage from the side of the Mini LED display module.

[0039] The steps for preparing the package cover plate 300 are as follows:

[0040] Step 1: Select transparent glass as the material of the cover plate 310;

[0041] Step 2: coating a BM layer 320 on the surface of the cover plate 310 by Slit Coating technology;

[0042] Step 3: Apply PR glue on the surface of the BM layer 320 by Slit Coating technology to form a uniform and smooth PR glue layer 330 on the BM layer;

[0043] Step 5: Expose and develop the PR adhesive layer to form a pattern through a yellow light photo process;

[0044] Step 6: Etching is performed according to the pattern formed in step 5 to remove the unprotected portion and retain the pattern portion;

[0045] Step 7: After etching is completed, remove the PR glue and leave the final pattern.

[0046] The steps for preparing the Mini LED carrier 100 are as follows:

[0047] Step 1: Select transparent glass as the material of the substrate 110;

[0048] Step 2: coating a second BM layer 120 on the surface of the substrate 110 by Slit Coating technology;

[0049] Step 3: Apply PR glue on the surface of the second BM layer 120 by Slit Coating technology to form a uniform and smooth PR glue layer on the BM layer;

[0050] Step 5: Expose and develop the PR adhesive layer to form a pattern through a yellow light photo process;

[0051] Step 6: Etching is performed according to the pattern formed in step 5 to remove the unprotected portion and retain the pattern portion;

[0052] Step 7. After etching is completed, remove the PR glue, leaving the final pattern for placing the chip.

[0053] After testing, the ink thickness is 3-5um, the uniformity is 95%, and the measurement data DeltaE is less than 0.15.

[0054] The BM is manufactured on the substrate 110 through the photo process, and the BM thickness fluctuation is extremely small, which can effectively ensure the consistency of the ink color of the carrier. At the same time, the cover plate 310 is manufactured into a patterned BM layer through the photo process, and the BM is windowed at the position of the Mini LED chip and has extremely high thickness consistency, ensuring the ink color consistency of the cover plate 310. This design can ensure the high consistency of the Mini LED display module. At the same time, the packaging cover plate 300 is designed with windows at the corresponding LED chip positions to ensure the transmittance of the LED and greatly reduce the brightness loss of the Mini LED. At the same time, the photo process is used for one-time processing with high production efficiency; a high-brightness / low-power display design can be produced; this BM design is manufactured using the photo process, which is an existing technology and can be quickly mass-produced.

[0055] Comparative Example 1

[0056] The BM layer was produced by screen printing process, and the other preparation steps were the same as those in Example 1. After testing, the DeltaE was 0.49.

[0057] Therefore, the present application provides a Mini LED display module and display screen with high ink color consistency, which can effectively ensure the ink color consistency of the carrier board; the transmittance of the LED greatly reduces the brightness loss of the Mini LED.

[0058] In the description of this specification, the description with reference to the terms "an experimental example", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the experimental example or example are included in at least one experimental example or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same experimental example or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more experimental examples or examples in a suitable manner.

[0059] Finally, it should be noted that the above experimental examples are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred experimental examples, those skilled in the art should understand that they can still modify or replace the technical solution of the present invention with equivalents, and these modifications or equivalent replacements cannot cause the modified technical solution to deviate from the spirit and scope of the technical solution of the present invention.

Claims

1. A Mini LED display module with high ink color consistency, characterized in that: The Mini LED display module includes a Mini LED carrier, a chip transferred to the Mini LED carrier through Die Bonding equipment to achieve electrical connection, and a packaging cover plate that is pasted and fixed to the Mini LED carrier through bonding. The sum of the BM layer thickness h1 of the Mini LED cover plate and the BM thickness h2 of the Mini LED carrier is ≥ the height H of the Mini LED chip.

2. According to claim 1, a Mini LED display module with high ink color consistency is characterized in that: The Mini LED carrier includes a substrate and a BM layer arranged on the surface of the substrate, and the packaging cover includes a cover made of transparent glass material and a BM layer arranged on the surface of the cover.

3. The Mini LED display module with high ink color consistency according to claim 2, characterized in that: The expansion and shrinkage rate of the substrate is 1~15*10e6; the BM layer of the Mini LED carrier and the packaging cover is a black ink layer, which is manufactured through a photo process. The tolerance fluctuation range of the thickness value h1 of the BM layer of the packaging cover and the thickness value h2 of the BM layer of the Mini LED carrier is 0.01um~2um.

4. The Mini LED display module with high ink color consistency according to claim 1, characterized in that: The package cover plate is provided with windows corresponding to the chip positions one by one, and the width w1 of the windows is ≥ the width W of the chip.

5. The Mini LED display module with high ink color consistency according to claim 2, characterized in that: The BM layer fits tightly around the chip to form a barrier to prevent light leakage from the sides of the Mini LED display module.

6. The Mini LED display module with high ink color consistency according to claim 2, characterized in that: The steps for preparing the package cover are as follows: Step 1: Select transparent glass as the cover material; Step 2: Apply a BM layer on the surface of the cover plate by Slit Coating technology; Step 3: Apply PR glue on the surface of the BM layer by Slit Coating technology to form a PR glue layer; Step 5: Expose and develop the PR adhesive layer to form a pattern through a yellow light photo process; Step 6: Etching to remove the unprotected part and retain the pattern part; Step 7: Remove the PR glue, leaving the final pattern with windows at equal distances.

7. The Mini LED display module with high ink color consistency according to claim 2, characterized in that: The steps for preparing the Mini LED carrier are as follows: Step 1: Select transparent glass as the substrate material; Step 2: coating the BM layer on the surface of the substrate by Slit Coating technology; Step 3: Apply PR glue on the surface of the BM layer by Slit Coating technology to form a PR glue layer; Step 5: Expose and develop the PR adhesive layer to form a pattern through a yellow light photo process; Step 6: Etching to remove the unprotected part and retain the pattern part; Step 7. Remove the PR glue, leaving the final pattern for placing the chip.

8. A Mini LED display screen, characterized in that: A Mini LED display module comprising any one of claims 1 to 7.

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