Display module and preparation method thereof

Abstract

The invention discloses a display module and a preparation method thereof. The display module comprises a light-emitting substrate which comprises a substrate and a light-emitting layer, the light-emitting layer is arranged on one side of the substrate and comprises a plurality of light-emitting units, the light-emitting units are light-emitting diodes, and the substrate is a transparent substrate; the micro-fluidic function layer is arranged on one side, far away from the light-emitting layer, of the substrate, the micro-fluidic function layer comprises a driving circuit layer, the micro-fluidic function layer comprises a plurality of light-emitting pixel areas and a plurality of channel pixel areas, the light-emitting pixel areas are provided with assembling grooves, quantum dot layers are arranged in the assembling grooves, and the channel pixel areas are not provided with assembling grooves; wherein the assembling groove and the light-emitting unit are arranged in an aligned mode, a plurality of through holes are formed in the substrate, and the driving circuit layer is electrically connected with the light-emitting unit through the through holes. Through the arrangement, the preparation difficulty of the quantum dot layer is reduced, the preparation efficiency is improved, the technological process is saved, full-color display is convenient to realize, the driving circuit layer can simultaneously drive the micro-fluidic function layer and the light-emitting unit, and the structure of the driving circuit layer of the display module is simplified.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a method for preparing the same. Background Art

[0002] Micro LED display is a display technology that has developed rapidly in recent years, with outstanding features such as low power consumption, fast response, long life, and wide color gamut. In the field of display applications, the main pursuit is full-color display. The current mainstream methods mainly include red, green and blue primary color direct display technology and the use of ultraviolet or blue Micro LED as an excitation light source to excite the quantum dots in the color conversion layer to achieve full-color display.

[0003] At present, the methods for preparing quantum dot color conversion layers mainly include: ① using inkjet printing technology to deposit quantum dots in a pre-deposited patterned area to prepare a color conversion layer; ② using photolithography to prepare a color conversion layer; ③ using nanoimprint technology to prepare a color conversion layer.

[0004] In the related art, the display module has the problems of difficulty in preparing the quantum dot layer, low preparation efficiency, complex process flow, and difficulty in achieving full-color display. Summary of the invention

[0005] The present application mainly provides a display module and a preparation method thereof to solve the problems in the related art that the quantum dot layer of the display module is difficult to prepare, has low preparation efficiency, is complex in process, and is difficult to achieve full-color display.

[0006] In order to solve the above technical problems, a technical solution adopted by the present application is: to provide a display module, including: A light-emitting substrate comprises a substrate and a light-emitting layer; the light-emitting layer is arranged on one side of the substrate and comprises a plurality of light-emitting units; the light-emitting units are light-emitting diodes, and the substrate is a transparent substrate; A microfluidic functional layer is arranged on a side of the substrate away from the light-emitting layer; the microfluidic functional layer includes a driving circuit layer; the microfluidic functional layer includes a plurality of light-emitting pixel areas and a plurality of channel pixel areas, the light-emitting pixel area has an assembly groove, and a quantum dot layer is arranged in the assembly groove; the channel pixel area does not have an assembly groove; The assembly groove is arranged in alignment with the light-emitting unit; the substrate is provided with a plurality of through holes, and the driving circuit layer is electrically connected to the light-emitting unit through the through holes.

[0007] Wherein, the driving circuit layer includes a plurality of first driving transistors and a plurality of second driving transistors; The first driving transistor is electrically connected to the light emitting unit through the through hole; The microfluidic functional layer further includes a microfluidic electrode layer, which is spaced apart from the driving circuit layer; the microfluidic electrode layer is connected to the second driving transistor via hole.

[0008] Wherein, the microfluidic functional layer comprises the driving circuit layer, the insulating layer, the microfluidic electrode layer and the flat layer which are sequentially arranged on the side of the substrate away from the light-emitting layer, and the flat layer is provided with the assembly groove; A hydrophobic layer is disposed on a side of the planar layer away from the substrate.

[0009] Wherein, the flat layer is a light-proof layer, and / or the hydrophobic layer is a light-proof layer.

[0010] Wherein, the microfluidic functional layer further includes a black matrix layer, and the black matrix layer is located between the hydrophobic layer and the flat layer, and covers the surface of the flat layer away from the substrate.

[0011] Wherein, the light-emitting unit comprises a first electrode, a second electrode and a light-emitting functional layer; the light-emitting functional layer is located on a side of the first electrode and the second electrode away from the substrate; The plurality of through holes are respectively arranged in alignment with the first electrode and the second electrode; a conductive structure is arranged in the through hole, and the first driving transistor is respectively electrically connected to the first electrode and the second electrode via the conductive structure.

[0012] The plurality of light-emitting pixel regions and the plurality of channel pixel regions are distributed in multiple rows, each row of the light-emitting pixel regions is adjacent to at least one row of the channel pixel regions, and each row of the channel pixel regions forms a transport channel.

[0013] Wherein, the light emitting side of the light emitting unit is arranged away from the substrate; A reflective layer is disposed on a side of the light emitting layer away from the substrate.

[0014] In order to solve the above technical problems, another technical solution adopted by the present application is: to provide a method for preparing a display module, comprising: A light-emitting substrate is provided; wherein the light-emitting substrate comprises a substrate and a light-emitting layer, the light-emitting layer is arranged on one side of the substrate and comprises a plurality of light-emitting units; the light-emitting units are light-emitting diodes, and the substrate is a transparent substrate; A through hole is opened in the substrate by using a glass drilling technology, and a conductive metal is filled in the through hole to form a conductive structure; A microfluidic functional layer is prepared on a side of the substrate away from the light-emitting layer; wherein the microfluidic functional layer includes a driving circuit layer; the microfluidic functional layer includes a plurality of light-emitting pixel regions and a plurality of channel pixel regions, the light-emitting pixel regions have assembly grooves, and the assembly grooves are aligned with the light-emitting units; the channel pixel regions do not have assembly grooves; the driving circuit layer is electrically connected to the light-emitting units through the conductive structure in the through hole; A quantum dot solution is arranged on a surface of the microfluidic functional layer away from the substrate, and the quantum dot solution is driven to move into the assembly groove.

[0015] Wherein, the light-emitting substrate further comprises a reflective layer arranged on a side of the light-emitting layer away from the substrate; And / or, the step of preparing a microfluidic functional layer on a side of the substrate away from the light-emitting layer comprises: A driving circuit layer, an insulating layer, a microfluidic electrode layer and a flat layer are sequentially prepared on a side of the substrate away from the light-emitting layer; wherein the flat layer has the assembly groove; the driving circuit layer includes a plurality of first driving transistors and a plurality of second driving transistors, the first driving transistors are electrically connected to the light-emitting unit through the conductive structure in the through hole; the microfluidic electrode layer is connected to the second driving transistor through a via hole; And / or, after the step of driving the quantum dot solution to move into the assembly tank, the method further includes: The quantum dot solution in the assembly groove is solidified to form a quantum dot layer.

[0016] The beneficial effects of the present application are as follows: Different from the prior art, the present application discloses a display module and a method for preparing the same. The display module comprises: a light-emitting substrate, comprising a substrate and a light-emitting layer, the light-emitting layer being arranged on one side of the substrate, comprising a plurality of light-emitting units, the light-emitting units being light-emitting diodes, and the substrate being a transparent substrate; a microfluidic functional layer being arranged on the side of the substrate away from the light-emitting layer, the microfluidic functional layer comprising a driving circuit layer, the microfluidic functional layer comprising a plurality of light-emitting pixel regions and a plurality of channel pixel regions, the light-emitting pixel regions having an assembly groove, a quantum dot layer being arranged in the assembly groove, and the channel pixel regions not having an assembly groove; wherein the assembly groove is arranged in alignment with the light-emitting unit, the substrate is provided with a plurality of through holes, and the driving circuit layer is electrically connected to the light-emitting unit through the through holes. By integrating the microfluidic functional layer and the light-emitting substrate into a display module, the microfluidic functional layer as a part of the display module is conducive to simplifying the structure of the display module. During the preparation of the display module, the quantum dot solution can be transported from the channel pixel area to the assembly groove of the light-emitting pixel area to directly form a quantum dot layer, which reduces the difficulty of preparing the quantum dot layer and improves the preparation efficiency. There is no need to use a separate transfer substrate to transfer the quantum dot solution to the light-emitting substrate, which saves the preparation process flow and is more convenient to achieve full-color display. The problem of difficulty in preparing the quantum dot layer of the display module in the related art, low preparation efficiency, complex process, and difficulty in achieving full-color display is solved; moreover, the light-emitting unit and the microfluidic functional layer are respectively located on opposite sides of the substrate. By setting a through hole in the substrate, the electrical connection between the driving circuit layer and the light-emitting unit is realized. The driving circuit layer can simultaneously drive and control the microfluidic functional layer and the light-emitting unit, which is convenient to simplify the structure of the driving circuit layer of the display module, save space, and then facilitate thinning the thickness of the display module to meet more usage requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work, among which: Figure 1 is a schematic diagram of a top view of a display module according to a first embodiment of the present application; Figure 2 is a schematic diagram of a top view of another embodiment of the display module provided in the first embodiment of the present application; Figure 3 yes Figure 1 A cross-sectional schematic diagram of an embodiment of a display module is provided; Figure 4 yes Figure 1 A cross-sectional schematic diagram of another embodiment of the display module provided; Figure 5 is a schematic flow chart of a method for preparing a display module provided in a second embodiment of the present application; Figure 6 yes Figure 5 A structural schematic diagram corresponding to step S1 of an embodiment of the provided method for preparing a display module; Figure 7 yes Figure 5 A structural schematic diagram corresponding to step S2 of an embodiment of the provided method for preparing a display module; Figure 8 yes Figure 5 A structural schematic diagram corresponding to step S3 of an embodiment of the provided method for preparing a display module; Fig. 9 yes Figure 5 A structural schematic diagram corresponding to another embodiment of step S3 of the method for preparing a display module provided; Fig.10 yes Figure 5 A structural schematic diagram corresponding to step S4 of an embodiment of the provided method for preparing a display module; Fig.11 yes Figure 5 A structural schematic diagram corresponding to another embodiment of step S4 of a method for preparing a display module is provided.

[0018] Figure Number: 100. Display module; 1. Light-emitting substrate; 11. Substrate; 111. Through hole; 112. Conductive structure; 12. Light-emitting layer; 121. Light-emitting unit; 122. First electrode; 123. Second electrode; 124. Light-emitting functional layer; 13. Reflective layer; 2. Microfluidic functional layer; 21. Light-emitting pixel area; 211. Assembly groove; 212. First sub-light-emitting pixel area; 213. Second sub-light-emitting pixel area; 214. Third sub-light-emitting pixel area; 22. Channel pixel area; 23. Driving circuit layer; 231. First driving transistor; 232. Second driving transistor; 24. Insulating layer; 241. Via hole; 25. Microfluidic electrode layer; 26. Flat layer; 27. Hydrophobic layer; 28. Black matrix layer; 3. Quantum dot layer; 31. First sub-quantum dot layer; 32. Second sub-quantum dot layer; 33. Third sub-quantum dot layer; 4. Quantum dot solution. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0020] The terms "first", "second", "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0021] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0022] See also Figures 1 to 4 , Figure 1 is a schematic diagram of a top view of a display module according to a first embodiment of the present application. Figure 2 is a schematic diagram of a top view of another embodiment of the display module provided in the first embodiment of the present application, Figure 3 yes Figure 1 A cross-sectional schematic diagram of an embodiment of a display module is provided, Figure 4 yes Figure 1 A cross-sectional schematic diagram of another embodiment of a display module is provided.

[0023] See also Figures 1 to 4 The first embodiment of the present application provides a display module 100, such as Figure 3 and Figure 4 As shown, the display module 100 includes a light-emitting substrate 1 and a microfluidic functional layer 2. The light-emitting substrate 1 includes a substrate 11 and a light-emitting layer 12, the light-emitting layer 12 is arranged on one side of the substrate 11, and the microfluidic functional layer 2 is arranged on the side of the substrate 11 away from the light-emitting layer 12.

[0024] The light-emitting layer 12 includes a plurality of light-emitting units 121. Specifically, the light-emitting unit 121 is a Micro LED (Micro Light Emitting Diode), or the light-emitting unit 121 is an LED (Light Emitting Diode). The substrate 11 is a transparent substrate with full light transmittance. For example, the substrate 11 may be a glass substrate. In a specific embodiment, the light-emitting unit 121 may be a blue Micro LED, which may emit blue light.

[0025] The microfluidic functional layer 2 includes a plurality of light-emitting pixel areas 21 and a plurality of channel pixel areas 22, wherein the light-emitting pixel area 21 has an assembly groove 211, in which a quantum dot layer 3 is arranged, and the channel pixel area 22 does not have an assembly groove 211. The assembly groove 211 is arranged in alignment with the light-emitting unit 121. Specifically, the number of the assembly grooves 211 and the light-emitting unit 121 is equal, and the assembly grooves 211 of the plurality of light-emitting pixel areas 21 are arranged one-to-one with the plurality of light-emitting units 121. The microfluidic functional layer 2 includes a driving circuit layer 23, and the substrate 11 of the light-emitting substrate 1 is provided with a plurality of through holes 111, and the driving circuit layer 23 is electrically connected to the light-emitting unit 121 through the through holes 111. Specifically, the substrate 11 can be a glass substrate, and the plurality of through holes 111 in the substrate 11 can be prepared by glass punching technology.

[0026] It can be understood that by integrating the microfluidic functional layer 2 and the light-emitting substrate 1 into a display module 100, the microfluidic functional layer 2 is arranged on one side of the light-emitting substrate 1, and the microfluidic functional layer 2 is arranged to include a light-emitting pixel area 21 and a channel pixel area 22, and an assembly groove 211 is arranged in the light-emitting pixel area 21. During the preparation process of the display module 100, the quantum dot solution can be transported from the channel pixel area 22 to the assembly groove 211 of the light-emitting pixel area 21, and the quantum dot layer 3 is directly formed in the assembly groove 211 of the light-emitting pixel area 21 by curing the quantum dot solution, thereby reducing the difficulty of preparing the quantum dot layer 3 and improving the preparation efficiency. There is no need to use a separate transfer substrate to transfer the quantum dot solution to the light-emitting substrate 1, which saves the preparation process flow and is more convenient to realize full-color display. In addition, the microfluidic functional layer 2 is used as a part of the display module 100, which saves process costs. It is beneficial to improve the preparation efficiency of the display module 100, and solves the problems of difficulty in preparing the quantum dot layer of the display module in the related art, low preparation efficiency, complex process, and difficulty in achieving full-color display; at the same time, the microfluidic functional layer 2 is arranged on the side of the substrate 11 away from the light-emitting layer 12, and the driving circuit layer 23 of the microfluidic functional layer 2 and the light-emitting unit 121 of the light-emitting layer 12 are respectively located on the opposite sides of the substrate 11, and by setting a through hole 111 in the substrate 11, the driving circuit layer 23 and the light-emitting unit 121 can be electrically connected through the through hole 111, which is convenient for the driving circuit layer 23 to drive and control the light-emitting unit 121 to realize the light-emitting function. The driving circuit layer 23 can simultaneously drive and control the microfluidic functional layer 2 and the light-emitting unit 121, which is convenient for simplifying the structure of the driving circuit layer 23 of the display module 100, saving space, and then facilitating the thinning of the thickness of the display module 100 to meet more usage requirements. Furthermore, the substrate 11 is set as a transparent substrate, and the assembly groove 211 is aligned with the light-emitting unit 121 of the light-emitting substrate 1. The light emitted by the light-emitting unit 121 can irradiate the quantum dot layer 3 in the assembly groove 211 to stimulate the quantum dot layer 3 to emit light of different colors, so that the display module 100 can realize full-color image display. Through the above arrangement, the structure of the display module 100 can be simplified, and the preparation efficiency and display performance of the display module 100 can be improved.

[0027] In some embodiments, Figure 3 and Figure 4 As shown, the light emitting side of the light emitting unit 121 is arranged away from the substrate 11 , that is, the light emitting side of the light emitting unit 121 faces the side of the substrate 11 away from the microfluidic functional layer 2 .

[0028] Specifically, Figure 3 and Figure 4As shown, in one embodiment, the light-emitting unit 121 includes a first electrode 122, a second electrode 123 and a light-emitting functional layer 124, and the light-emitting functional layer 124 is located on the side of the first electrode 122 and the second electrode 123 away from the substrate 11. In a specific embodiment, the first electrode 122 and the second electrode 123 are arranged on the surface of the substrate 11 away from the microfluidic functional layer 2, the first electrode 122 and the second electrode 123 are used to be electrically connected to the driving circuit layer 23, and the light-emitting functional layer 124 is used to emit light. It can be understood that by arranging the light-emitting side of the light-emitting unit 121 away from the substrate 11, that is, the light-emitting functional layer 124 is arranged on the side of the first electrode 122 and the second electrode 123 away from the substrate 11, it is more convenient to directly realize the electrical connection between the driving circuit layer 23 and the first electrode 122 and the second electrode 123 of the light-emitting unit 121 through the through hole 111 arranged in the substrate 11, so that the driving circuit layer 23 drives and controls the light-emitting unit 121 to realize the light-emitting function. The above arrangement is beneficial to simplifying the structure of the light-emitting substrate 1 and is also more convenient for preparing the light-emitting substrate 1 , thereby saving the process flow and preparation cost of the display module 100 and improving the preparation efficiency of the display module 100 .

[0029] In some embodiments, Figure 3 and Figure 4 As shown, a reflective layer 13 is provided on the side of the light-emitting layer 12 of the light-emitting substrate 1 away from the substrate 11, that is, a reflective layer 13 is provided on the light-emitting side of the light-emitting unit 121. Figure 3 and Figure 4 As shown, in a specific embodiment, the reflective layer 13 covers the surface of the light-emitting layer 12 of the light-emitting substrate 1 away from the substrate 11, wherein the light-emitting layer 12 is a planarization layer, the surface of the light-emitting layer 12 away from the substrate 11 is a plane, and the light-emitting unit 121 is buried in the light-emitting layer 12. It can be understood that by providing the reflective layer 13, the light emitted by the light-emitting unit 121 can be reflected to the side of the microfluidic functional layer 2 via the reflective layer 13, reducing light loss, improving the utilization rate of light, so that the light can be more fully irradiated to the quantum dot layer 3 in the assembly groove 211, and then more fully stimulate the quantum dot layer 3 to emit light, which is conducive to improving the light-emitting effect of the quantum dot layer 3 and improving the display effect of the display module 100.

[0030] In other embodiments, the light-emitting side of the light-emitting unit 121 of the light-emitting substrate 1 may also be directly arranged toward the side of the microfluidic functional layer 2, and the side of the light-emitting layer 12 of the light-emitting substrate 1 away from the substrate 11 may not be provided with the reflective layer 13. For example, the light-emitting functional layer 124 of the light-emitting unit 121 may be arranged on the surface of the substrate 11 away from the microfluidic functional layer 2, and the first electrode 122 and the second electrode 123 may be arranged on the side of the light-emitting functional layer 124 away from the substrate 11. Other vias may be arranged in the light-emitting layer 12, so that the driving circuit layer 23 of the microfluidic functional layer 2 can be electrically connected to the light-emitting unit 121 via the through hole 111 in the substrate 11 and the via in the light-emitting layer 12 in sequence. The specific arrangement of the light-emitting unit 121 can be designed as needed, as long as the electrical connection between the light-emitting unit 121 and the driving circuit layer 23 can be achieved.

[0031] See also Figure 3 and Figure 4 In some embodiments, the driving circuit layer 23 includes a plurality of first driving transistors 231 and a plurality of second driving transistors 232, wherein the first driving transistors 231 are electrically connected to the light-emitting unit 121 through the through hole 111 in the substrate 11. The microfluidic functional layer 2 also includes a microfluidic electrode layer 25, which is spaced apart from the driving circuit layer 23, and the microfluidic electrode layer 25 is connected to the second driving transistor 232 through the via 241. By setting a plurality of first driving transistors 231 and a plurality of second driving transistors 232 in the driving circuit layer 23, the first driving transistor 231 is electrically connected to the light-emitting unit 121 through the through hole 111 in the substrate 11, and the second driving transistor 232 is electrically connected to the microfluidic electrode layer 25 through the via 241, the first driving transistor 231 and the second driving transistor 232 can respectively drive and control the light-emitting unit 121 and the microfluidic electrode layer 25, so as to realize independent control of the microfluidic electrode layer 25 and the light-emitting unit 121, and the driving of the microfluidic electrode layer 25 and the light-emitting unit 121 does not affect each other, so as to facilitate the improvement of the performance of the display module 100, and the first driving transistor 231 and the second driving transistor 232 are set in the same layer, so as to save the thickness of the driving circuit layer 23, thereby facilitating the thinning of the thickness of the display module 100 and meeting more usage requirements. Specifically, the first driving transistor 231 and the second driving transistor 232 can be thin film transistors (TFT).

[0032] In a specific embodiment, Figure 3 and Figure 4As shown, the light-emitting unit 121 includes a first electrode 122, a second electrode 123 and a light-emitting functional layer 124, and the light-emitting functional layer 124 is located on the side of the first electrode 122 and the second electrode 123 away from the substrate 11. The plurality of through holes 111 in the substrate 11 are respectively arranged in alignment with the first electrode 122 and the second electrode 123 of the light-emitting unit 121. Conductive structures 112 are arranged in the plurality of through holes 111 of the substrate 11. Specifically, the conductive structures 112 in the through holes 111 can be conductive metals filled in the through holes 111. The first driving transistor 231 of the driving circuit layer 23 is electrically connected to the first electrode 122 and the second electrode 123 of the light-emitting unit 121 through the conductive structures 112 in the through holes 111.

[0033] For details, see Figure 3 and Figure 4 The microfluidic functional layer 2 includes a driving circuit layer 23, an insulating layer 24, a microfluidic electrode layer 25 and a flat layer 26 which are sequentially arranged on the side of the substrate 11 away from the light-emitting layer 12. The flat layer 26 is provided with a mounting groove 211, and a hydrophobic layer 27 is provided on the side of the flat layer 26 away from the substrate 11. That is, the microfluidic electrode layer 25 is arranged on the side of the insulating layer 24 away from the driving circuit layer 23. Specifically, the microfluidic electrode layer 25 is arranged corresponding to the channel pixel area 22, and the microfluidic electrode layer 25 is electrically connected to the second driving transistor 232 of the driving circuit layer 23 through a via 241 arranged in the insulating layer 24. In a specific embodiment, as Figure 3 and Figure 4 As shown, the microfluidic electrode layer 25 is disposed on a surface of the insulating layer 24 away from the driving circuit layer 23 . The microfluidic electrode layer 25 may be a transparent conductive layer, for example, ITO (indium tin oxide).

[0034] The assembly groove 211 is disposed in the flat layer 26. In a specific embodiment, along the thickness direction of the display module 100, the assembly groove 211 penetrates the flat layer 26 and exposes a portion of the surface of the insulating layer 24 away from the driving circuit layer 23. In other embodiments, the end of the assembly groove 211 close to the light-emitting substrate 1 can also be partially disposed in the insulating layer 24.

[0035] In a specific embodiment, the hydrophobic layer 27 is disposed on the surface of the flat layer 26 away from the substrate 11, and the hydrophobic layer 27 can extend to the side wall of the assembly groove 211. For example, the hydrophobic layer 27 can completely cover the side wall of the assembly groove 211, or can also partially cover the side wall of the assembly groove 211. It can be understood that the flat layer 26 is disposed on the side of the insulating layer 24 away from the driving circuit layer 23, so that the surface of the flat layer 26 away from the substrate 11 is a plane, and then the hydrophobic layer 27 is disposed on the surface of the flat layer 26 away from the substrate 11. In the process of preparing the display module 100, it is convenient to improve the transportation efficiency of the quantum dot solution in the channel pixel area 22 on the surface of the microfluidic functional layer 2 away from the substrate 11, and ensure that the quantum dot solution can be transported to the right place.

[0036] In a specific embodiment, the flat layer 26 is an opaque layer, and the flat layer 26 plays a light shielding role. It can be understood that since the assembly groove 211 is set in the flat layer 26 and penetrates the flat layer 26 along the thickness direction of the display module 100, the assembly groove 211 is arranged in alignment with the light-emitting unit 121. By setting the flat layer 26 as an opaque layer, the microfluidic functional layer 2 located on the substrate 11 side of the light-emitting substrate 1 has light passing only at the position of the assembly groove 211, and the light at the remaining positions except the assembly groove 211 is blocked or absorbed by the flat layer 26, ensuring that the display module 100 can only emit light at the position of the assembly groove 211 of the light-emitting pixel area 21, thereby improving the light emitting efficiency, reducing light scattering or loss, and avoiding crosstalk between light in different light-emitting pixel areas 21, which is conducive to improving the display effect of the display module 100 and improving the user experience.

[0037] In a specific embodiment, the hydrophobic layer 27 can be set as an opaque layer. It can be understood that setting the hydrophobic layer 27 as an opaque layer can not only facilitate the improvement of the transport efficiency of the quantum dot solution in the channel pixel area 22 on the surface of the microfluidic functional layer 2 away from the substrate 11, and ensure that the quantum dot solution can be transported to the right place, but also the hydrophobic layer 27 can also play a light shielding role. The hydrophobic layer 27 arranged on the side of the flat layer 26 away from the substrate 11 blocks or absorbs the light at the remaining positions except the assembly groove 211, ensuring that the display module 100 can only emit light at the assembly groove 211 position of the light-emitting pixel area 21, thereby improving the luminous efficiency, reducing light scattering or loss, and avoiding crosstalk between light in different light-emitting pixel areas 21, which is conducive to improving the display effect of the display module 100 and improving the user experience.

[0038] In a specific embodiment, the flat layer 26 and the hydrophobic layer 27 can both be set as opaque layers, which can more effectively avoid crosstalk between light from different light-emitting pixel areas 21 and scattering or loss of light, and more effectively ensure that the display module 100 can only emit light at the assembly groove 211 position of the light-emitting pixel area 21, thereby improving the display effect of the display module 100.

[0039] It can be understood that by directly setting the flat layer 26 and / or the hydrophobic layer 27 as an opaque layer, the flat layer 26 and / or the hydrophobic layer 27 can directly play a shading role, and there is no need to set a separate shading layer. This is beneficial to simplifying the preparation process of the display module 100 and saving preparation costs. At the same time, the thickness of the display module 100 can also be reduced, the taste of the display module 100 can be improved, and more usage requirements can be met.

[0040] In one embodiment, if Figure 4 As shown, the microfluidic functional layer 2 of the display module 100 further includes a black matrix layer 28, which is located between the hydrophobic layer 27 and the flat layer 26, and covers the surface of the flat layer 26 away from the substrate 11. In a specific embodiment, the black matrix layer 28 can extend to the side wall of the assembly groove 211, and specifically, can completely cover the side wall of the assembly groove 211.

[0041] It can be understood that by setting a separate black matrix layer 28 between the hydrophobic layer 27 and the flat layer 26, the black matrix layer 28 blocks or absorbs the light irradiated from the light-emitting unit 121 of the light-emitting substrate 1 to the microfluidic functional layer 2 except the assembly groove 211 position, and the black matrix layer 28 has a better light shielding effect, ensuring that the display module 100 can only emit light at the assembly groove 211 position of the light-emitting pixel area 21, thereby improving the luminous efficiency, reducing light scattering or loss, and avoiding crosstalk between light from different light-emitting pixel areas 21, which is conducive to improving the display effect of the display module 100 and improving the user experience. In this embodiment, the flat layer 26 and the hydrophobic layer 27 can be set as a light-transmitting layer, or the flat layer 26 and / or the hydrophobic layer 27 can also be set as an opaque layer, so as to more effectively ensure the light shielding effect and improve the display effect of the display module 100.

[0042] See also Figure 1 and Figure 2In some embodiments, the plurality of light-emitting pixel regions 21 and the plurality of channel pixel regions 22 are distributed in multiple rows, each row of light-emitting pixel regions 21 is disposed adjacent to at least one row of channel pixel regions 22, and each row of channel pixel regions 22 forms a delivery channel. That is, each row of light-emitting pixel regions 21 may be disposed adjacent to only one row of channel pixel regions 22, for example, along the column direction, a row of channel pixel regions 22 may be disposed on one side of a row of light-emitting pixel regions 21, or each row of light-emitting pixel regions 21 may be disposed adjacent to multiple rows of channel pixel regions 22, for example, a row of light-emitting pixel regions 21 may be adjacent to two rows of channel pixel regions 22, and the two rows of channel pixel regions 22 are disposed corresponding to the opposite sides of the light-emitting pixel regions 21, and each row of channel pixel regions 22 forms a delivery channel. The quantum dot solution is delivered to the assembly groove 211 of the light-emitting pixel region 21 corresponding thereto by the delivery channel, so as to form the quantum dot layer 3.

[0043] Specifically, Figure 1 As shown, in one embodiment, along the column direction, the light-emitting pixel areas 21 and the channel pixel areas 22 are alternately distributed, and the number of the light-emitting pixel areas 21 and the number of the channel pixel areas 22 can be equal. In the process of preparing the display module 100, a row of channel pixel areas 22 adjacent to each row of light-emitting pixel areas 21 can transport the quantum dot solution to the assembly groove 211 of the corresponding light-emitting pixel area 21, so as to form the quantum dot layer 3 in the assembly groove 211. Each light-emitting pixel area 21 has a corresponding channel pixel area 22 that transports the quantum dot solution to its assembly groove 211 to form the quantum dot layer 3. Multiple rows of channel pixel areas 22 can simultaneously transport the quantum dot solution to the corresponding multiple rows of light-emitting pixel areas 21, which is conducive to improving the transport efficiency, thereby improving the preparation efficiency of the display module 100.

[0044] In another embodiment, Figure 2As shown, two rows of light-emitting pixel areas 21 may be arranged between two adjacent rows of channel pixel areas 22, that is, each row of light-emitting pixel areas 21 may be arranged adjacent to a row of channel pixel areas 22. During the preparation process of the display module 100, the same row of channel pixel areas 22 may transport the quantum dot solution to the assembly grooves 211 of the two adjacent rows of light-emitting pixel areas 21. Specifically, a row of channel pixel areas 22 may first transport the quantum dot solution to the assembly grooves 211 of one of the adjacent rows of light-emitting pixel areas 21, and after transporting the quantum dot solution to the assembly grooves 211 of the row of light-emitting pixel areas 21, the quantum dot solution may be transported to the assembly grooves 211 of another adjacent row of light-emitting pixel areas 21, that is, the timing of transporting the quantum dot solution to the assembly grooves 211 of the two adjacent rows of light-emitting pixel areas 21 to the row of channel pixel areas 22 is different. It can be understood that by setting two rows of luminous pixel areas 21 between two adjacent rows of channel pixel areas 22, the two rows of luminous pixel areas 21 located on both sides of the same row of channel pixel areas 22 can share the row of channel pixel areas 22 as a transmission channel, which is beneficial to reducing the number of rows of channel pixel areas 22, thereby improving the distribution rate of the luminous pixel areas 21 of the display module 100, and further beneficial to improving the pixel aperture ratio of the display module 100 and improving the display performance of the display module 100.

[0045] like Figure 1 and Figure 2 As shown, in a specific embodiment, the shapes of the light-emitting pixel area 21 and the channel pixel area 22 are both rectangular. In other embodiments, the shapes of the light-emitting pixel area 21 and the channel pixel area 22 can be any shape such as rectangle, rhombus, square, regular hexagon, etc., and can be designed as needed.

[0046] In some embodiments, Figure 1 and Figure 2 As shown, in each row of light-emitting pixel areas 21, the colors of the quantum dot layers 3 in the assembly grooves 211 of each of the three adjacent light-emitting pixel areas 21 are different. Specifically, each of the three adjacent light-emitting pixel areas 21 may be the first sub-light-emitting pixel area 212, the second sub-light-emitting pixel area 213, and the third sub-light-emitting pixel area 214, respectively, and the quantum dot layers 3 in the assembly grooves 211 of the first sub-light-emitting pixel area 212, the second sub-light-emitting pixel area 213, and the third sub-light-emitting pixel area 214 are respectively the first sub-quantum dot layer 31, the second sub-quantum dot layer 32, and the third sub-quantum dot layer 33, wherein the colors of the first sub-quantum dot layer 31, the second sub-quantum dot layer 32, and the third sub-quantum dot layer 33 may be the first color, the second color, and the third color, respectively, and the first sub-quantum dot layer 31, the second sub-quantum dot layer 32, and the third sub-quantum dot layer 33 may be excited by the light emitted by the light-emitting unit 121 to emit light of different colors. Specifically, the first color, the second color, and the third color may be red, green, and blue, respectively, so that the display module 100 can achieve full-color display.

[0047] See also Figures 5 to 11 , Figure 5 is a flow chart of a method for preparing a display module provided in the second embodiment of the present application, Figure 6 yes Figure 5 A structural schematic diagram corresponding to step S1 of an embodiment of the method for preparing a display module is provided, Figure 7 yes Figure 5 A structural schematic diagram corresponding to step S2 of an embodiment of the method for preparing a display module is provided, Figure 8 yes Figure 5 A structural schematic diagram corresponding to step S3 of an embodiment of the method for preparing a display module is provided, Fig. 9 yes Figure 5 A structural schematic diagram corresponding to another embodiment of step S3 of the method for preparing a display module is provided, Fig.10 yes Figure 5 A structural schematic diagram corresponding to step S4 of an embodiment of the method for preparing a display module is provided, Fig.11 yes Figure 5 A structural schematic diagram corresponding to another embodiment of step S4 of a method for preparing a display module is provided.

[0048] See also Figures 5 to 11 The second embodiment of the present application provides a method for preparing a display module 100, which is used to prepare any display module 100 as described above. Specifically, Figure 5 As shown, the method for preparing the display module 100 includes: S1: Provide a light-emitting substrate 1.

[0049] First, a light emitting substrate 1 is provided, specifically, Figure 6 As shown, the light-emitting substrate 1 includes a substrate 11 and a light-emitting layer 12, the light-emitting layer 12 is arranged on one side of the substrate 11, and the light-emitting layer 12 includes a plurality of light-emitting units 121. Specifically, the light-emitting unit 121 is a MicroLED, or the light-emitting unit 121 is an LED, and the substrate 11 is a transparent substrate with full light transmittance, for example, the substrate 11 can be a glass substrate. In a specific embodiment, the light-emitting unit 121 can be a blue Micro LED, which can emit blue light.

[0050] In one embodiment, if Figure 6 As shown, the light-emitting unit 121 includes a first electrode 122, a second electrode 123 and a light-emitting functional layer 124. The light-emitting functional layer 124 is located on the side of the first electrode 122 and the second electrode 123 away from the substrate 11. The light-emitting side of the light-emitting unit 121 is arranged away from the substrate 11. In a specific embodiment, the first electrode 122 and the second electrode 123 are arranged on the surface of the substrate 11 away from the microfluidic functional layer 2.

[0051] In a specific embodiment, Figure 6 As shown, the light-emitting substrate 1 further includes a reflective layer 13 disposed on a side of the light-emitting layer 12 away from the substrate 11. The reflective layer 13 is used to reflect the light emitted by the light-emitting functional layer 124 of the light-emitting unit 121, so as to reflect the light emitted by the light-emitting unit 121 to the side of the microfluidic functional layer 2 in the subsequent process (see Figure 3 and Figure 4 ).

[0052] S2: using glass drilling technology to open a through hole 111 in the substrate 11 , and filling the through hole 111 with conductive metal to form a conductive structure 112 .

[0053] Specifically, the substrate 11 is a glass substrate, such as Figure 7 As shown, the substrate 11 of the light-emitting substrate 1 is punched using a glass punching technology to form a plurality of through holes 111 in the substrate 11. Specifically, the plurality of through holes 111 are arranged at intervals from each other. After the punching process, conductive metal materials are respectively filled in the plurality of through holes 111 to form conductive structures 112 in the through holes 111.

[0054] In a specific embodiment, Figure 7 As shown, the plurality of through holes 111 are respectively aligned with the first electrode 122 and the second electrode 123 of the light emitting unit 121 , and the conductive structure 112 in the through hole 111 is respectively electrically connected with the first electrode 122 and the second electrode 123 .

[0055] S3: preparing a microfluidic functional layer 2 on a side of the substrate 11 away from the light-emitting layer 12 .

[0056] Specifically, a microfluidic functional layer 2 is prepared on the side of the substrate 11 of the light-emitting substrate 1 away from the light-emitting layer 12, wherein the microfluidic functional layer 2 includes a plurality of light-emitting pixel areas 21 and a plurality of channel pixel areas 22, the light-emitting pixel area 21 has an assembly groove 211, and the channel pixel area 22 does not have an assembly groove 211. The assembly groove 211 of the light-emitting pixel area 21 is arranged in alignment with the light-emitting unit 121, specifically, the number of the assembly grooves 211 and the light-emitting unit 121 is equal, and the assembly grooves 211 of the plurality of light-emitting pixel areas 21 are arranged in one-to-one correspondence with the plurality of light-emitting units 121. The microfluidic functional layer 2 includes a driving circuit layer 23, and the driving circuit layer 23 is electrically connected to the light-emitting unit 121 through the conductive structure 112 in the through hole 111.

[0057] It can be understood that by preparing the microfluidic functional layer 2 on the side of the substrate 11 of the light-emitting substrate 1 away from the light-emitting layer 12, the microfluidic functional layer 2 and the light-emitting substrate 1 are integrated together, the microfluidic functional layer 2 is set to include a light-emitting pixel area 21 and a channel pixel area 22, and an assembly groove 211 is set in the light-emitting pixel area 21. In the subsequent process, the quantum dot solution 4 (such as Fig.10 and Fig.11 As shown), so as to form the quantum dot layer 3 directly in the assembly groove 211 of the light-emitting pixel area 21 by using the microfluidic functional layer 2 (see Figure 3 and Figure 4 ), the preparation difficulty of the quantum dot layer 3 is reduced and the preparation efficiency is improved. There is no need to use a separate transfer substrate to transfer the quantum dot solution 4 to the light-emitting substrate 1, and the microfluidic functional layer 2 is used as a part of the prepared display module 100, which saves process costs, is conducive to improving the preparation efficiency of the display module 100, and is more convenient to achieve full-color display, solving the problems of difficulty in preparing the quantum dot layer of the display module in the related art, low preparation efficiency, complex process, and difficulty in achieving full-color display; at the same time, the microfluidic functional layer 2 is arranged on the side of the substrate 11 away from the light-emitting layer 12, and the driving circuit layer 23 of the microfluidic functional layer 2 and the light-emitting unit 121 of the light-emitting layer 12 are respectively located on opposite sides of the substrate 11, and a through hole 111 is arranged in the substrate 11, so that the driving circuit layer 23 and the light-emitting unit 1 21 can be electrically connected through the through hole 111, so that the driving circuit layer 23 can drive and control the light-emitting unit 121 to realize the light-emitting function. The driving circuit layer 23 can simultaneously drive and control the microfluidic functional layer 2 and the light-emitting unit 121, so as to simplify the structure of the driving circuit layer 23 of the display module 100 prepared and formed, save space, and then facilitate the thickness of the display module 100 prepared and formed to be thinned to meet more usage requirements; moreover, the substrate 11 is set as a transparent substrate, and the assembly groove 211 is aligned with the light-emitting unit 121 of the light-emitting substrate 1. The light emitted by the light-emitting unit 121 can be irradiated to the quantum dot layer 3 in the assembly groove 211 prepared in the subsequent process to excite the quantum dot layer 3 to emit light of different colors, so that the prepared display module 100 can realize the full-color image display function. Through the above-mentioned setting, the preparation efficiency of the display module 100 can be improved, the structure of the prepared display module 100 can be simplified, and the display performance of the prepared display module 100 can be improved.

[0058] In a specific embodiment, the step of preparing the microfluidic functional layer 2 on the side of the substrate 11 away from the light-emitting layer 12 in step S3 specifically includes: A driving circuit layer 23 , an insulating layer 24 , a microfluidic electrode layer 25 and a planar layer 26 are sequentially prepared on a side of the substrate 11 away from the light-emitting layer 12 .

[0059] Specifically, a driving circuit layer 23, an insulating layer 24, a microfluidic electrode layer 25 and a flat layer 26 are sequentially prepared on the side of the substrate 11 of the light-emitting substrate 1 away from the light-emitting layer 12, and the flat layer 26 has an assembly groove 211. Figure 8 and Fig. 9 As shown, the driving circuit layer 23 includes multiple first driving transistors 231 and multiple second driving transistors 232. The first driving transistors 231 are electrically connected to the light-emitting unit 121 through the conductive structure 112 in the through hole 111, and the microfluidic electrode layer 25 is connected to the second driving transistors 232 through the via 241. By setting a plurality of first driving transistors 231 and a plurality of second driving transistors 232 in the driving circuit layer 23, the first driving transistor 231 is electrically connected to the light-emitting unit 121 through the through hole 111 in the substrate 11, and the second driving transistor 232 is electrically connected to the microfluidic electrode layer 25 through the via 241, the first driving transistor 231 and the second driving transistor 232 can respectively drive and control the light-emitting unit 121 and the microfluidic electrode layer 25, so as to realize independent control of the microfluidic electrode layer 25 and the light-emitting unit 121, and the driving of the microfluidic electrode layer 25 and the light-emitting unit 121 does not affect each other, so as to facilitate the improvement of the performance of the prepared display module 100, and the first driving transistor 231 and the second driving transistor 232 are set in the same layer, so as to save the thickness of the driving circuit layer 23, thereby facilitating the reduction of the thickness of the prepared display module 100, and meeting more usage requirements. Specifically, the first driving transistor 231 and the second driving transistor 232 can be thin film transistors (TFT).

[0060] In a specific embodiment, Figure 8 and Fig. 9 As shown, the light-emitting unit 121 includes a first electrode 122, a second electrode 123 and a light-emitting functional layer 124, and the light-emitting functional layer 124 is located on a side of the first electrode 122 and the second electrode 123 away from the substrate 11. A plurality of through holes 111 in the substrate 11 are respectively arranged in alignment with the first electrode 122 and the second electrode 123 of the light-emitting unit 121, and a conductive structure 112 is arranged in the plurality of through holes 111 of the substrate 11, and a first driving transistor 231 of the driving circuit layer 23 is respectively electrically connected to the first electrode 122 and the second electrode 123 of the light-emitting unit 121 through the conductive structure 112 in the through hole 111.

[0061] The microfluidic electrode layer 25 is disposed on a side of the insulating layer 24 away from the driving circuit layer 23, and the microfluidic electrode layer 25 is electrically connected to the second driving transistor 232 of the driving circuit layer 23 through a via 241 disposed in the insulating layer 24. Figure 8 and Fig. 9As shown, the microfluidic electrode layer 25 is arranged on the surface of the insulating layer 24 away from the driving circuit layer 23. The microfluidic electrode layer 25 can be a transparent conductive layer, for example, ITO (indium tin oxide). The assembly groove 211 is arranged on the flat layer 26. In a specific embodiment, along the thickness direction of the display module 100, the assembly groove 211 penetrates the flat layer 26 and exposes a portion of the surface of the insulating layer 24 away from the driving circuit layer 23. In other embodiments, the end of the assembly groove 211 close to the light-emitting substrate 1 can also be partially arranged in the insulating layer 24.

[0062] In a specific embodiment, the step of preparing the microfluidic functional layer 2 on the side of the substrate 11 away from the light-emitting layer 12 in step S3 further includes: preparing a hydrophobic layer 27 on the side of the planar layer 26 away from the substrate 11 .

[0063] For details, see Figure 8 The hydrophobic layer 27 is disposed on the side of the flat layer 26 away from the substrate 11. For example, the hydrophobic layer 27 is disposed on the surface of the flat layer 26 away from the substrate 11. The hydrophobic layer 27 may extend to the side wall of the assembly groove 211. For example, the hydrophobic layer 27 may completely cover the side wall of the assembly groove 211, or may partially cover the side wall of the assembly groove 211. It can be understood that the flat layer 26 is disposed on the side of the insulating layer 24 away from the driving circuit layer 23, so that the surface of the flat layer 26 away from the substrate 11 is a plane, and then the hydrophobic layer 27 is disposed on the surface of the flat layer 26 away from the substrate 11. In the subsequent process, it is convenient to improve the transport efficiency of the quantum dot solution 4 in the channel pixel area 22 on the surface of the microfluidic functional layer 2 away from the substrate 11, and ensure that the quantum dot solution 4 in the subsequent process can be transported to the right place (see Fig.10 and Fig.11 ).

[0064] See also Figure 8In one embodiment, the flat layer 26 is a light-proof layer, and the flat layer 26 plays a light-shielding role, and / or, in one embodiment, the hydrophobic layer 27 can be set as a light-proof layer. It can be understood that since the assembly groove 211 is set in the flat layer 26 and penetrates the flat layer 26 along the thickness direction of the display module 100, the assembly groove 211 is arranged in alignment with the light-emitting unit 121. By setting the flat layer 26 and / or the hydrophobic layer 27 as an opaque layer, the microfluidic functional layer 2 of the prepared display module 100 only has light passing through at the position of the assembly groove 211, and the light at other positions except the assembly groove 211 is blocked or absorbed by the flat layer 26 and / or the hydrophobic layer 27, ensuring that the prepared display module 100 can only emit light at the position of the assembly groove 211 in the light-emitting pixel area 21, which is convenient for improving the luminous efficiency of the prepared display module 100, reducing light scattering or loss, and avoiding crosstalk between light in different light-emitting pixel areas 21, which is beneficial to improving the display effect of the prepared display module 100 and improving the user experience.

[0065] In a specific embodiment, the flat layer 26 and the hydrophobic layer 27 can both be set as opaque layers, which can more effectively avoid crosstalk between light from different light-emitting pixel areas 21 and scattering or loss of light, and more effectively ensure that the prepared display module 100 can only emit light at the assembly groove 211 position of the light-emitting pixel area 21, thereby improving the display effect of the prepared display module 100. By directly setting the flat layer 26 and / or the hydrophobic layer 27 as an opaque layer, the flat layer 26 and / or the hydrophobic layer 27 directly play a light-shielding role, and there is no need to prepare a separate light-shielding layer, which is conducive to simplifying the preparation process of the display module 100 and saving costs. At the same time, the thickness of the prepared display module 100 can also be reduced, and the taste of the prepared display module 100 can be improved to meet more usage requirements.

[0066] In another specific embodiment, the step of preparing the microfluidic functional layer 2 on the side of the substrate 11 away from the light-emitting layer 12 in step S3 further includes: sequentially preparing a black matrix layer 28 and a hydrophobic layer 27 on the side of the planar layer 26 away from the substrate 11.

[0067] Specifically, in this embodiment, a black matrix layer 28 and a hydrophobic layer 27 are sequentially prepared on the side of the planar layer 26 away from the substrate 11, such as Fig. 9 As shown, the microfluidic functional layer 2 includes a black matrix layer 28, which is located between the hydrophobic layer 27 and the flat layer 26, and covers the surface of the flat layer 26 away from the substrate 11. In a specific embodiment, the black matrix layer 28 can extend to the side wall of the assembly groove 211, and specifically, can completely cover the side wall of the assembly groove 211.

[0068] By setting a separate black matrix layer 28 between the hydrophobic layer 27 and the flat layer 26, the black matrix layer 28 blocks or absorbs the light irradiated from the light-emitting unit 121 of the light-emitting substrate 1 to the microfluidic functional layer 2 except the assembly groove 211 position, and the black matrix layer 28 has a better light shielding effect, ensuring that the display module 100 formed can only emit light at the assembly groove 211 position of the light-emitting pixel area 21, which is convenient for improving the luminous efficiency, reducing light scattering or loss, and avoiding crosstalk between lights in different light-emitting pixel areas 21, which is conducive to improving the display effect of the display module 100 formed and improving the user experience. In this embodiment, the flat layer 26 and the hydrophobic layer 27 can be set as a light-transmitting layer, or the flat layer 26 and / or the hydrophobic layer 27 can also be set as an opaque layer, so as to more effectively ensure the light shielding effect and improve the display effect of the display module 100 formed.

[0069] S4: placing a quantum dot solution 4 on the surface of the microfluidic functional layer 2 away from the substrate 11 , and driving the quantum dot solution 4 to move into the assembly groove 211 .

[0070] For details, see Fig.10 and Fig.11 , a quantum dot solution 4 is arranged on the surface of the microfluidic functional layer 2 away from the substrate 11, and the quantum dot solution 4 is driven to move into the assembly groove 211 of the light-emitting pixel area 21. Specifically, the microfluidic electrode layer 25 is arranged corresponding to the channel pixel area 22, and the quantum dot solution 4 located on the surface of the microfluidic functional layer 2 away from the substrate 11 is driven by the microfluidic electrode layer 25 to move in the channel pixel area 22, so as to transport the quantum dot solution 4 to the assembly groove 211 of the light-emitting pixel area 21. By directly using the microfluidic electrode layer 25 to drive the quantum dot solution 4 to move in the channel pixel area 22, the quantum dot solution 4 can be directly transported to the assembly groove 211, so as to facilitate the formation of the quantum dot layer 3 (such as Figure 3 and Figure 4 As shown in the figure, the difficulty of preparing the quantum dot layer is reduced and the preparation efficiency is improved. There is no need to use a separate transfer substrate to transfer the quantum dot solution 4 to the light-emitting substrate 1, which saves the preparation process flow and is more convenient to achieve full-color display. It solves the problems of difficult preparation of the quantum dot layer of the display module in the related art, low preparation efficiency, complex process, and difficulty in achieving full-color display.

[0071] Specifically, in some embodiments, see Figure 1 and Figure 2, the multiple light-emitting pixel areas 21 and the multiple channel pixel areas 22 of the microfluidic functional layer 2 are distributed in multiple rows, each row of light-emitting pixel areas 21 is adjacent to at least one row of channel pixel areas 22, and each row of channel pixel areas 22 forms a delivery channel. That is, each row of light-emitting pixel areas 21 can be adjacent to only one row of channel pixel areas 22, for example, along the column direction, a row of channel pixel areas 22 can be arranged on one side of a row of light-emitting pixel areas 21, or each row of light-emitting pixel areas 21 can also be adjacent to multiple rows of channel pixel areas 22, for example, one row of light-emitting pixel areas 21 can be adjacent to two rows of channel pixel areas 22, and the two rows of channel pixel areas 22 are arranged corresponding to the opposite sides of the light-emitting pixel areas 21, and each row of channel pixel areas 22 forms a delivery channel, which can deliver the quantum dot solution 4 to the assembly groove 211 of the light-emitting pixel area 21 corresponding to it.

[0072] Specifically, in one embodiment, Figure 1 As shown, along the column direction, the light-emitting pixel areas 21 and the channel pixel areas 22 are alternately distributed, the number of the light-emitting pixel areas 21 and the number of the channel pixel areas 22 can be equal, and the quantum dot solution 4 can be transported to the assembly groove 211 of the corresponding light-emitting pixel area 21 by a row of channel pixel areas 22 adjacent to each row of light-emitting pixel areas 21. Each light-emitting pixel area 21 has a corresponding channel pixel area 22 to transport the quantum dot solution 4 to its assembly groove 211, and multiple rows of channel pixel areas 22 can simultaneously transport the quantum dot solution 4 to the corresponding multiple rows of light-emitting pixel areas 21, which is conducive to improving the transportation efficiency, thereby improving the preparation efficiency of the display module 100.

[0073] In another embodiment, Figure 2As shown, two rows of light-emitting pixel areas 21 may be arranged between two adjacent rows of channel pixel areas 22, that is, each row of light-emitting pixel areas 21 may be arranged adjacent to a row of channel pixel areas 22, and the same row of channel pixel areas 22 may transport the quantum dot solution 4 to the assembly grooves 211 of the two adjacent rows of light-emitting pixel areas 21. Specifically, a row of channel pixel areas 22 may first transport the quantum dot solution 4 to the assembly grooves 211 of one of the adjacent rows of light-emitting pixel areas 21, and after transporting the quantum dot solution 4 to the assembly grooves 211 of the row of light-emitting pixel areas 21, the quantum dot solution 4 may be transported to the assembly grooves 211 of another adjacent row of light-emitting pixel areas 21, that is, the timing of transporting the quantum dot solution 4 to the assembly grooves 211 of the two adjacent rows of light-emitting pixel areas 21 to the row of channel pixel areas 22 is different. It can be understood that by setting two rows of luminous pixel areas 21 between two adjacent rows of channel pixel areas 22, the two rows of luminous pixel areas 21 located on both sides of the same row of channel pixel areas 22 can share the row of channel pixel areas 22 as a transmission channel, which is beneficial to reducing the number of rows of channel pixel areas 22, thereby improving the distribution rate of the luminous pixel areas 21 of the prepared display module 100, and further helping to improve the pixel aperture ratio of the display module 100 and improve the display performance of the display module 100.

[0074] like Figure 1 and Figure 2 As shown, in a specific embodiment, the shapes of the light-emitting pixel area 21 and the channel pixel area 22 are both rectangular. In other embodiments, the shapes of the light-emitting pixel area 21 and the channel pixel area 22 can be any shape such as rectangle, rhombus, square, regular hexagon, etc., and can be designed as needed.

[0075] In one embodiment, after the step of driving the quantum dot solution 4 to move into the assembly tank 211, the method further includes: The quantum dot solution 4 in the assembly groove 211 is solidified to form a quantum dot layer 3 .

[0076] Specifically, after the quantum dot solution 4 is transported into the assembly groove 211 of the light-emitting pixel area 21 by using the channel pixel area 22 of the microfluidic functional layer 2, the quantum dot solution 4 in the assembly groove 211 can be cured or other treatments to remove the solvent in the quantum dot solution 4, and finally a quantum dot layer 3 (such as Figure 3 and Figure 4 As shown), it is convenient to emit light under the stimulation of the light emitted by the light-emitting unit 121, so that the prepared display module 100 can realize the image display function and realize full-color display.

[0077] In some embodiments, the method for preparing the display module 100 further includes preparing an encapsulation layer (not shown) on the side of the hydrophobic layer 27 away from the substrate 11. Specifically, the encapsulation layer covers the surface of the hydrophobic layer 27 away from the substrate 11 to encapsulate the display module 100. The encapsulation layer can encapsulate the display module 100 to prevent harmful substances such as oxygen and water vapor from entering the interior of the prepared display module 100, which helps to extend the service life of the prepared display module 100.

[0078] By using the manufacturing method of the display module 100 provided in the second embodiment of the present application, the display module 100 can be finally manufactured as follows: Figure 3 or Figure 4 The display module 100 is shown.

[0079] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display module, characterized in that: include: A light-emitting substrate, comprising a substrate and a light-emitting layer; The light-emitting layer is disposed on one side of the substrate and includes a plurality of light-emitting units; The light-emitting unit is a light-emitting diode, and the substrate is a transparent substrate; A microfluidic functional layer is arranged on a side of the substrate away from the light-emitting layer; the microfluidic functional layer includes a driving circuit layer; the microfluidic functional layer includes a plurality of light-emitting pixel areas and a plurality of channel pixel areas, the light-emitting pixel area has an assembly groove, and a quantum dot layer is arranged in the assembly groove; the channel pixel area does not have an assembly groove; The assembly groove is arranged in alignment with the light-emitting unit; the substrate is provided with a plurality of through holes, and the driving circuit layer is electrically connected to the light-emitting unit through the through holes.

2. The display module according to claim 1, characterized in that: The driving circuit layer includes a plurality of first driving transistors and a plurality of second driving transistors; The first driving transistor is electrically connected to the light emitting unit through the through hole; The microfluidic functional layer further includes a microfluidic electrode layer, which is spaced apart from the driving circuit layer; the microfluidic electrode layer is connected to the second driving transistor via hole.

3. The display module according to claim 2, characterized in that: The microfluidic functional layer comprises the driving circuit layer, the insulating layer, the microfluidic electrode layer and the flat layer which are sequentially arranged on the side of the substrate away from the light-emitting layer, and the flat layer is provided with the assembly groove; A hydrophobic layer is disposed on a side of the planar layer away from the substrate.

4. The display module according to claim 3, characterized in that: The flat layer is a light-impermeable layer, and / or the hydrophobic layer is a light-impermeable layer.

5. The display module according to claim 3, characterized in that: The microfluidic functional layer further includes a black matrix layer, which is located between the hydrophobic layer and the flat layer and covers a surface of the flat layer away from the substrate.

6. The display module according to claim 2, characterized in that: The light-emitting unit comprises a first electrode, a second electrode and a light-emitting functional layer; the light-emitting functional layer is located on a side of the first electrode and the second electrode away from the substrate; The plurality of through holes are respectively arranged in alignment with the first electrode and the second electrode; a conductive structure is arranged in the through hole, and the first driving transistor is respectively electrically connected to the first electrode and the second electrode via the conductive structure.

7. The display module according to claim 1, characterized in that: The plurality of light-emitting pixel regions and the plurality of channel pixel regions are distributed in multiple rows, each row of the light-emitting pixel regions is arranged adjacent to at least one row of the channel pixel regions, and each row of the channel pixel regions forms a transport channel.

8. The display module according to any one of claims 1 to 7, characterized in that: The light emitting side of the light emitting unit is arranged away from the substrate; A reflective layer is disposed on a side of the light emitting layer away from the substrate.

9. A method for preparing a display module, characterized in that: include: A light-emitting substrate is provided; wherein the light-emitting substrate comprises a substrate and a light-emitting layer, the light-emitting layer is arranged on one side of the substrate and comprises a plurality of light-emitting units; the light-emitting units are light-emitting diodes, and the substrate is a transparent substrate; A through hole is opened in the substrate by using a glass drilling technology, and a conductive metal is filled in the through hole to form a conductive structure; A microfluidic functional layer is prepared on a side of the substrate away from the light-emitting layer; wherein the microfluidic functional layer includes a driving circuit layer; the microfluidic functional layer includes a plurality of light-emitting pixel regions and a plurality of channel pixel regions, the light-emitting pixel regions have assembly grooves, and the assembly grooves are aligned with the light-emitting units; the channel pixel regions do not have assembly grooves; the driving circuit layer is electrically connected to the light-emitting units through the conductive structure in the through hole; A quantum dot solution is arranged on a surface of the microfluidic functional layer away from the substrate, and the quantum dot solution is driven to move into the assembly groove.

10. The method for preparing a display module according to claim 9, characterized in that: The light-emitting substrate further comprises a reflective layer disposed on a side of the light-emitting layer away from the substrate; And / or, the step of preparing a microfluidic functional layer on a side of the substrate away from the light-emitting layer comprises: A driving circuit layer, an insulating layer, a microfluidic electrode layer and a flat layer are sequentially prepared on a side of the substrate away from the light-emitting layer; wherein the flat layer has the assembly groove; the driving circuit layer includes a plurality of first driving transistors and a plurality of second driving transistors, the first driving transistors are electrically connected to the light-emitting unit through the conductive structure in the through hole; the microfluidic electrode layer is connected to the second driving transistor through a via hole; And / or, after the step of driving the quantum dot solution to move into the assembly tank, the method further includes: The quantum dot solution in the assembly groove is solidified to form a quantum dot layer.

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