Display panel and preparation method thereof, display device and display assembly

Abstract

The invention discloses a display panel and a preparation method thereof, a display device and a display assembly, the display panel comprises a display area and a frame area, and the display panel further comprises a substrate, an array layer, a barrier dam and a packaging layer. Wherein the array layer is located on one side of the substrate and located in the display area; the blocking dam is arranged on one side, away from the substrate, of the array layer and located in the frame area; the packaging layer is arranged on the side, away from the substrate, of the blocking dam, and the orthographic projection of the packaging layer on the substrate covers the array layer and the orthographic projection of the blocking dam on the substrate; the surface, facing the substrate, of the blocking dam and / or the surface, deviating from the substrate, of the blocking dam is provided with a first patterned structure. The blocking dams and the adjacent film layers are tightly combined through the first pattern structures, and a narrow frame is achieved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a preparation method thereof, a display device, and a display assembly. Background Art

[0002] At present, the narrow border technology solutions of existing display devices mainly focus on integrating the circuits in the border area into the display area, and the size compression of the border area is limited, so it is impossible to further achieve a narrow border.

[0003] Therefore, there is an urgent need to improve the display panel to further achieve a narrow frame. Summary of the invention

[0004] The present application mainly provides a display panel and a manufacturing method thereof, a display device, and a display assembly, which can improve the reliability of the display panel.

[0005] In order to solve the above technical problems, the technical solution adopted in the present application is: to provide a display panel, which includes a display area and a frame area, and the display panel also includes a substrate, an array layer, a barrier dam and an encapsulation layer. The array layer is located on one side of the substrate and in the display area; the barrier dam is arranged on the side of the array layer away from the substrate and in the frame area; the encapsulation layer is arranged on the side of the barrier dam away from the substrate, and the orthographic projection of the encapsulation layer on the substrate covers the orthographic projection of the array layer and the barrier dam on the substrate; the surface of the barrier dam facing the substrate and / or the surface of the barrier dam away from the substrate is provided with a first patterned structure.

[0006] In order to solve the above technical problem, another technical solution adopted by the present application is: to provide a display device, which includes the display panel in the above embodiment.

[0007] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide a display component, which includes at least two display sub-components connected to each other, and the display sub-components include a substrate, an array layer and a packaging layer stacked in sequence, wherein at the connection between two adjacent display sub-components, the array layers of the two adjacent display sub-components are continuous and uninterrupted, and the packaging layers are continuous and uninterrupted.

[0008] In order to solve the above technical problems, another technical solution adopted in the present application is: providing a method for preparing a display panel, the method comprising: providing a display component, the display component comprising at least two display sub-components connected to each other, the display sub-components comprising a substrate, an array layer and a packaging layer stacked in sequence, wherein at the connection between two adjacent display sub-components, the array layers in the two adjacent display sub-components are continuous and uninterrupted, and the packaging layers are continuous and uninterrupted; etching the connection between two adjacent display sub-components to separate the two adjacent display sub-components.

[0009] The beneficial effect of the present application is that a first patterned structure is provided on the surface of the blocking dam facing the substrate and / or the surface of the blocking dam facing away from the substrate, and the first patterned structure is used to achieve close bonding between the blocking dam and the adjacent film layer, thereby enhancing the packaging effect and achieving a narrow frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0011] Figure 1 This is a schematic structural diagram of an embodiment of a display panel in the present application;

[0012] Figure 2 It is a structural schematic diagram of another embodiment of the display panel in the present application;

[0013] Figure 3 It is a structural schematic diagram of another embodiment of the display panel in the present application;

[0014] Figure 4 It is a structural schematic diagram of another embodiment of the display panel in the present application;

[0015] Figure 5 It is a structural schematic diagram of another embodiment of the display panel in the present application;

[0016] Figure 6 It is a structural schematic diagram of another embodiment of the display panel in the present application;

[0017] Figure 7 It is a structural schematic diagram of an embodiment of a display component in this application;

[0018] Figure 8 It is a preparation flow chart of an embodiment of a display panel in this application.

[0019] Explanation of the figure numbers: 100 display panel; 1 display area; 2 border area; 10 substrate; 20 array layer; 21 first inorganic layer; 30 barrier dam; 40 encapsulation layer; 41 second inorganic layer; 42 first organic layer; 43 third inorganic layer; 50 first patterned structure; 51 first protruding structure; 52 first groove structure; 53 second groove structure; 54 second protruding structure; 55 third protruding structure; 56 third groove structure; 57 fourth groove structure; 58 fourth protruding structure; 60 second patterned structure; 61 fifth protruding structure; 62 sixth groove structure; 70 third patterned structure; 71 fifth groove structure; 72 sixth protruding structure; 200 display component; 201 display subcomponent; 202 connection; 80 fourth patterned structure; 90 fifth patterned structure. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0022] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0023] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0024] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0025] See also Figure 1 , Figure 2 , Figure 3 and Figure 4 The present application provides a display panel 100, which includes a display area 1 and a frame area 2. The display panel 100 also includes a substrate 10, an array layer 20, a barrier dam 30 and an encapsulation layer 40. The array layer 20 is located on one side of the substrate 10 and is located in the display area 1; the barrier dam 30 is arranged on the side of the array layer 20 away from the substrate 10 and is located in the frame area 2; the encapsulation layer 40 is arranged on the side of the barrier dam 30 away from the substrate 10, and the orthographic projection of the encapsulation layer 40 on the substrate 10 covers the orthographic projections of the array layer 20 and the barrier dam 30 on the substrate 10; the surface of the barrier dam 30 facing the substrate 10 and / or the surface of the barrier dam 30 away from the substrate 10 is provided with a first patterned structure 50.

[0026] Among them, the substrate 10 plays a supporting role, and it can be a flexible substrate or a rigid substrate. Specifically, when the substrate 10 is a flexible substrate, it can be a flexible carrier, such as: polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate PEN, etc., or it can be a metal foil, such as copper foil, aluminum foil, etc. Of course, in other embodiments, the substrate 10 can be a rigid substrate, such as rigid glass. The array layer 20 is located on one side of the substrate 10, which includes a driving circuit (for example, a 7T1C circuit) for controlling the light-emitting pixels in the light-emitting layer (not shown). In the border area 2, a blocking dam 30 is provided on the side of the array layer 20 away from the substrate 10, and the blocking dam 30 can be used to prevent water vapor from invading the display area 1. The encapsulation layer 40 is disposed on the side of the array layer 20 and the barrier dam 30 facing away from the substrate 10, and covers the surface of the array layer 20 and the barrier dam 30 facing away from the substrate 10, so as to protect the array layer 20 and the barrier dam 30 from the invasion of external water vapor, thereby affecting the service life.

[0027] In the present application, a first patterned structure 50 is provided on the surface of the barrier dam 30 facing the substrate 10 and / or the surface of the barrier dam 30 facing away from the substrate 10. Specifically, the first patterned structure 50 may be located on the surface of the barrier dam 30 facing the substrate 10, or the first patterned structure 50 may be located on the surface of the barrier dam 30 facing away from the substrate 10, or the first patterned structure 50 may be provided on both the surface of the barrier dam 30 facing the substrate 10 and the surface of the barrier dam 30 facing away from the substrate 10. The first patterned structure is used to achieve close bonding between the barrier dam 30 and the adjacent film layer, thereby enhancing the packaging effect and achieving a narrow frame.

[0028] Please continue reading Figure 1 , Figure 2 , Figure 3 and Figure 4 The first patterned structure 50 includes at least one of a protrusion structure and a groove structure. The protrusion structure and the groove structure are easy to prepare and have good fixing effect, which can effectively increase the bonding force.

[0029] Please continue reading Figure 1 In the first embodiment, the first patterned structure 50 provided on the surface of the blocking dam 30 facing the substrate 10 includes a first protruding structure 51, and the surface of the array layer 20 facing away from the substrate 10 is provided with a first groove structure 52 matching the first protruding structure 51; specifically, the first patterned structure 50 includes the first protruding structure 51, the surface of the blocking dam 30 facing the substrate 10 is provided with the first protruding structure 51, and the surface of the array layer 20 facing away from the substrate 10 is provided with the first groove structure 52, and the first groove structure 52 matches the first protruding structure 51. The combination of the two can enhance the bonding effect between the array layer 20 and the blocking dam 30 in the border area 2 and improve the packaging reliability.

[0030] Please continue reading Figure 2 In the second embodiment, the first patterned structure 50 provided on the surface of the blocking dam 30 facing the substrate 10 includes a second groove structure 53, and the surface of the array layer 20 facing away from the substrate 10 is provided with a second protrusion structure 54 matching the second groove structure 53; specifically, the first patterned structure 50 includes the second groove structure 53, the surface of the blocking dam 30 facing the substrate 10 is provided with the second groove structure 53, and the surface of the array layer 20 facing away from the substrate 10 is provided with a second protrusion structure 54, and the second protrusion structure 54 matches the second groove structure 53. The combination of the two can enhance the bonding effect between the array layer 20 and the blocking dam 30 in the border area 2 and improve the packaging reliability.

[0031] Please continue reading Figure 3In the third embodiment, the first patterned structure 50 provided on the surface of the blocking dam 30 facing away from the substrate 10 includes a third protruding structure 55, and the surface of the encapsulation layer 40 facing the substrate 10 is provided with a third groove structure 56 matching the third protruding structure 55; specifically, the first patterned structure 50 includes the third protruding structure 55, the surface of the blocking dam 30 facing away from the substrate 10 is provided with the third protruding structure 55, and the surface of the encapsulation layer 40 facing the substrate 10 is provided with a third groove structure 56, and the third groove structure 56 matches the third protruding structure 55. The combined use of the two can enhance the bonding effect between the encapsulation layer 40 and the blocking dam 30 in the border area 2 and improve the encapsulation reliability.

[0032] Please continue reading Figure 4 In the fourth embodiment, the first patterned structure 50 provided on the surface of the barrier dam 30 facing away from the substrate 10 includes a fourth groove structure 57, and the surface of the encapsulation layer 40 facing the substrate 10 is provided with a fourth protrusion structure 58 matching the fourth groove structure 57. Specifically, the first patterned structure 50 includes the fourth groove structure 57, the surface of the barrier dam 30 facing away from the substrate 10 is provided with the fourth groove structure 57, and the surface of the encapsulation layer 40 facing the substrate 10 is provided with the fourth protrusion structure 58, and the fourth protrusion structure 58 matches the fourth groove structure 57. The combination of the two can enhance the bonding effect between the encapsulation layer 40 and the barrier dam 30 in the border area 2 and improve the encapsulation reliability.

[0033] The structural features in the above embodiments may also be used in combination, for example, a combination of Embodiment 1 and Embodiment 3, a combination of Embodiment 1 and Embodiment 4, a combination of Embodiment 2 and Embodiment 3, and a combination of Embodiment 2 and Embodiment 4.

[0034] Please continue reading Figure 1 , Figure 2 , Figure 3 and Figure 4 , the encapsulation layer 40 further extends from the inner side of the barrier dam 30 to the outer side of the barrier dam 30, and the encapsulation layer 40 extending to the outer side of the barrier dam 30 is connected to the array layer 20. Specifically, the encapsulation layer 40 extends from the inner side of the barrier dam 30 to the outer side of the barrier dam 30, and the encapsulation layer 40 is prepared as a whole layer. There is no need to use a mask plate to prepare the encapsulation layer 40, and the preparation process is simple. The encapsulation layer 40 extending to the outer side of the barrier dam 30 is connected to the array layer 20, which enhances the bonding effect of the encapsulation layer 40 and the array layer 20 in the frame area 2 and achieves overall structural stability. It should be noted that the inner side of the barrier dam 30 refers to the side of the barrier dam 30 close to the display area 1, and the outer side of the barrier dam 30 refers to the side of the barrier dam 30 away from the display area 1.

[0035] See also Figure 5 and Figure 6, the surface of the encapsulation layer 40 extending to the outside of the blocking dam 30 facing the substrate 10 is provided with a second patterned structure 60, and the surface of the array layer 20 facing away from the substrate 10 is provided with a third patterned structure 70 matching the second patterned structure 60. Specifically, on the outside of the blocking dam 30, the surface of the encapsulation layer 40 facing the substrate 10 is provided with the second patterned structure 60, and the surface of the array layer 20 facing away from the substrate 10 is provided with the third patterned structure 70. The second patterned structure 60 and the third patterned structure 70 are used in combination, which, on the one hand, enhances the bonding force between the array layer 20 and the encapsulation layer 40 outside the blocking dam 30, and at the same time, the structure can intercept the transverse cracks generated in the array layer 20 when cutting.

[0036] See also Figure 5 In the fifth embodiment, the second patterned structure 60 includes a fifth protrusion structure 61, and the third patterned structure 70 includes a fifth groove structure 71 matching the fifth protrusion structure 61; the surface of the encapsulation layer 40 facing the substrate 10 is provided with the fifth protrusion structure 61, and the surface of the array layer 20 facing away from the substrate 10 is provided with the fifth groove structure 71. The fifth protrusion structure 61 and the fifth groove structure 71 are used in combination to ensure the bonding force while facilitating the preparation.

[0037] See also Figure 6 In the sixth embodiment, the second patterned structure 60 includes a sixth groove structure 62, and the third patterned structure 70 includes a sixth convex structure 72 matching the sixth groove structure 62. The surface of the encapsulation layer 40 facing the substrate 10 is provided with the sixth groove structure 62, and the surface of the array layer 20 facing away from the substrate 10 is provided with the sixth convex structure 72. The sixth convex structure 72 and the sixth groove structure 62 are used in combination to ensure the bonding force and facilitate the preparation.

[0038] The fifth embodiment can be used in combination with the first to fourth embodiments, and the sixth embodiment can be used in combination with the first to fourth embodiments. When used in combination, the effects are superimposed.

[0039] Please continue reading Figure 5 and Figure 6 , the array layer 20 includes a first inorganic layer 21, and the encapsulation layer 40 includes a second inorganic layer 41, and the first inorganic layer 21 and the second inorganic layer 41 both extend from the inner side of the blocking dam 30 to the outer side of the blocking dam 30; and on the outer side of the blocking dam 30, the first inorganic layer 21 in the array layer 20 is in contact with and connected to the second inorganic layer 41 in the encapsulation layer 40. Specifically, the first inorganic layer 21 in the array layer 20 and the second inorganic layer 41 in the encapsulation layer 40 are both prepared on the entire surface, and the preparation process is simple and easy to prepare. At the same time, on the outer side of the blocking dam 30, the first inorganic layer 21 in the array layer 20 and the second inorganic layer 41 in the encapsulation layer 40 are in contact with and connected, which increases the inorganic bonding path and enhances the bonding force between the array layer 20 and the encapsulation layer 40.

[0040] Please continue reading Figure 5 and Figure 6 The encapsulation layer 40 further includes a first organic layer 42 and a third inorganic layer 43 which are sequentially stacked on the side of the second inorganic layer 41 away from the substrate 10; the first organic layer 42 is located on the inner side of the blocking dam 30, and the third inorganic layer 43 extends from the inner side of the blocking dam 30 to the outer side of the blocking dam 30, and on the outer side of the blocking dam 30, the second inorganic layer 41 is in contact with the third inorganic layer 43. On the inner side of the blocking dam 30, the organic layer covers the surface of the first inorganic layer 21 on the side away from the substrate 10. When dust particles fall on the surface of the second inorganic layer 41 in the production environment, the organic layer can fix it to prevent the particles from piercing the second inorganic layer 41, forming a water vapor leakage channel, and further preventing water vapor from contacting and corroding the light-emitting pixels through the leakage channel. The third inorganic layer 43 can play a role in isolating water vapor and preventing water vapor from invading the organic layer. At the same time, the second inorganic layer 41 and the third inorganic layer 43 provide double protection for the light-emitting layer, and the effect of isolating water vapor is better. In addition, the third inorganic layer 43 is also a film layer prepared on the entire surface, so that the second inorganic layer 41 is in contact and connected with the third inorganic layer 43 outside the barrier dam 30 , thereby ensuring the protective effect of the encapsulation layer 40 on the display area 1 .

[0041] In one embodiment, the second inorganic layer 41 and the third inorganic layer 43 are made of the same material. In one embodiment, the second inorganic layer 41 and the third inorganic layer 43 are made of the same material, so that the second inorganic layer 41 and the third inorganic layer 43 can be prepared using the same process, reducing the difficulty of preparation and saving preparation costs.

[0042] In one embodiment, the material of the second inorganic layer 41 or the third inorganic layer 43 includes at least one of silicon nitride SiNx and silicon dioxide SiO2.

[0043] Please continue reading Figures 1 to 4 The array layer 20 and the encapsulation layer 40 are projected onto the substrate 10 and extend outside the substrate 10; in the direction from the display area 1 to the frame area 2, the substrate 10 is retracted relative to the array layer 20, so as to facilitate direct splitting through the subsequent etching process, avoid cracks and heat effects caused by laser cutting of the frame area 2, and realize a narrow frame.

[0044] In another embodiment, the outer edges of the encapsulation layer 40, the array layer 20 and the substrate 10 are flush; Figure 5 and Figure 6 As shown, the flush design of the outer edges facilitates preparation.

[0045] In one embodiment, the number of the barrier dam 30 is one. Through the preparation of the first patterned structure 50, etc., the present application uses only one barrier dam 30, which can not only prevent the overflow of the organic layer, but also effectively prevent external water vapor from invading the display area 1 from the frame area 2, thereby achieving a narrow frame.

[0046] The present application also provides a display device, which includes the display panel 100 in the above embodiment.

[0047] The display device in the embodiment of the present invention may be any product or component with a display function, such as electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame or a navigator.

[0048] See also Figure 7 The present application also provides a display assembly 200, which includes at least two display subassemblies 201 connected to each other, and the display subassembly 201 includes a substrate 10, an array layer 20, and an encapsulation layer 40 stacked in sequence, wherein at a connection 202 between two adjacent display subassemblies 201, the array layers 20 of the two adjacent display subassemblies 201 are continuous and uninterrupted, and the encapsulation layers 40 are continuous and uninterrupted. Specifically, the array layers 20 and the encapsulation layers 40 in the adjacent display subassemblies 201 in the display assembly 200 are continuous, which facilitates the mass production of multiple display subassemblies 201 at the same time and improves the production efficiency.

[0049] See also Figure 8 The following describes a process for preparing the display panel 100 by using the display assembly 200. The method includes:

[0050] S10: Provide a display component 200, the display component 200 includes at least two display sub-components 201 connected to each other, the display sub-components 201 include a substrate 10, an array layer 20 and a packaging layer 40 stacked in sequence, wherein at a connection 202 between two adjacent display sub-components 201, the array layers 20 in the two adjacent display sub-components 201 are continuous and uninterrupted, and the packaging layers 40 are continuous and uninterrupted.

[0051] The specific structure of the display assembly 200 can be found in the above-mentioned related contents, which will not be described in detail here.

[0052] S20 : ​​performing etching processing on the connection portion 202 between two adjacent display sub-assemblies 201 to separate the two adjacent display sub-assemblies 201 .

[0053] Adjacent display sub-assemblies 201 are separated by an etching process to achieve a better packaging effect. At the same time, the etching process is used instead of the cutting process to effectively improve the accuracy of the splitting. At the same time, laser cutting will leave cutting cracks on the display sub-assembly 201. At the same time, the high temperature during cutting has a thermal effect on the display sub-assembly 201. The etching process is used instead of the cutting process, which can effectively avoid the crack influence and thermal influence caused by the laser cutting process, and facilitate the realization of a narrow frame.

[0054] Please continue reading Figure 7 The array layer 20 includes a first inorganic layer 21, and the encapsulation layer 40 includes a second inorganic layer 41. At the connection 202 of two adjacent display sub-assemblies 201, the first inorganic layer 21 is in contact with and connected to the second inorganic layer 41. Both the first inorganic layer 21 and the second inorganic layer 41 are made of inorganic materials, and both inorganic materials have the function of blocking external water vapor. When the two are in contact with and connected, the bonding force between the encapsulation layer 40 and the array layer 20 can be effectively increased, thereby enhancing the encapsulation effect.

[0055] Please continue reading Figure 7 At the connection 202 of two adjacent display sub-assemblies 201, the surface of the array layer 20 facing away from the substrate 10 is provided with a fourth patterned structure 80, and the surface of the encapsulation layer 40 facing the substrate 10 is provided with a fifth patterned structure 90 matching the fourth patterned structure 80; the fourth patterned structure 80 and the fifth patterned structure 90 are matched and arranged, thereby increasing the bonding effect of the array layer 20 and the encapsulation layer 40. The combined use of the fourth patterned structure 80 and the fifth patterned structure 90 can intercept cracks generated by the cutting process when separating adjacent display sub-assemblies 201, thereby improving the yield of the display sub-assemblies 201.

[0056] In one embodiment, the fourth patterned structure 80 is one of a groove or a protrusion, and the fifth patterned structure 90 is the other of the groove or the protrusion.

[0057] In one embodiment, if Figure 7 As shown, the substrates 10 in two adjacent display subassemblies 201 are arranged at intervals. At this time, when performing the etching process in step S20, there is no need to perform a separation process on the substrate 10, which can simplify the preparation process and improve the preparation efficiency. That is, at this time, step S20 specifically includes:

[0058] S21: etching the encapsulation layer 40 and the array layer 20 at the connection 202 of two adjacent display sub-assemblies 201.

[0059] That is to say, there is no need to separate the substrate 10 , and the display subassembly 201 can be separated by etching the encapsulation layer 40 and the array layer 20 at the connection 202 using an etching process.

[0060] Of course, in other embodiments, the substrates 10 in two adjacent display subassemblies 201 may be continuous and uninterrupted, in which case the substrate 10 has a better supporting effect in the subsequent film preparation process. In this case, step S20 specifically includes: S22: etching the encapsulation layer 40, the array layer 20, and the substrate 10 at the connection 202 of the two adjacent display subassemblies 201.

[0061] Specifically, the substrate 10 in adjacent display sub-assemblies 201 is continuous and uninterrupted, so during etching, the encapsulation layer 40, the array layer 20 and the substrate 10 need to be etched at the connection 202 of the display sub-assembly 201 to complete the separation of the adjacent display sub-assemblies 201.

[0062] In one embodiment, if Figure 7 As shown, the display subassembly 201 further includes a barrier dam 30, and the barrier dams 30 in two adjacent display subassemblies 201 are arranged at intervals. The barrier dams 30 are respectively located in the frame area 2 of each display subassembly 201, and the barrier dams 30 in adjacent display subassemblies 201 are arranged at intervals, which can ensure the packaging effect.

[0063] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel includes a display area and a frame area, and the display panel further includes: substrate; An array layer, located on one side of the substrate and in the display area; A blocking dam is arranged on a side of the array layer away from the substrate and located in the border area; an encapsulation layer, arranged on a side of the blocking dam away from the substrate, wherein the orthographic projection of the encapsulation layer on the substrate covers the array layer and the orthographic projection of the blocking dam on the substrate; Wherein, a first patterned structure is provided on a surface of the blocking dam facing the substrate and / or on a surface of the blocking dam facing away from the substrate.

2. The display panel according to claim 1, characterized in that: The first patterned structure includes at least one of a protrusion structure and a groove structure; Preferably, the first patterned structure disposed on the surface of the barrier dam facing the substrate includes a first protruding structure, and the surface of the array layer facing away from the substrate is provided with a first groove structure matching the first protruding structure; And / or, the first patterned structure provided on the surface of the blocking dam facing the substrate includes a second groove structure, and the surface of the array layer facing away from the substrate is provided with a second protrusion structure matching the second groove structure; And / or, the first patterned structure provided on the surface of the blocking dam facing away from the substrate includes a third protruding structure, and the surface of the encapsulation layer facing the substrate is provided with a third groove structure matching the third protruding structure; And / or, the first patterned structure provided on the surface of the blocking dam facing away from the substrate includes a fourth groove structure, and the surface of the encapsulation layer facing the substrate is provided with a fourth protrusion structure matching the fourth groove structure.

3. The display panel according to claim 1, characterized in that: The encapsulation layer extends from the inner side of the blocking dam to the outer side of the blocking dam, and the encapsulation layer extending to the outer side of the blocking dam is connected to the array layer; Preferably, a second patterned structure is provided on a surface of the encapsulation layer extending to the outside of the blocking dam and facing the substrate, and a third patterned structure matching the second patterned structure is provided on a surface of the array layer facing away from the substrate; Preferably, the second patterned structure includes a fifth protruding structure, and the third patterned structure includes a fifth groove structure matching the fifth protruding structure; And / or, the second patterned structure includes a sixth groove structure, and the third patterned structure includes a sixth protrusion structure matching the sixth groove structure.

4. The display panel according to claim 3, characterized in that: The array layer includes a first inorganic layer, and the encapsulation layer includes a second inorganic layer, wherein the first inorganic layer and the second inorganic layer both extend from the inner side of the blocking dam to the outer side of the blocking dam; and on the outer side of the blocking dam, the first inorganic layer in the array layer is in contact with and connected to the second inorganic layer in the encapsulation layer; Preferably, the encapsulation layer further comprises a first organic layer and a third inorganic layer which are sequentially stacked on a side of the second inorganic layer away from the substrate; the first organic layer is located on the inner side of the blocking dam, the third inorganic layer extends from the inner side of the blocking dam to the outer side of the blocking dam, and the second inorganic layer is in contact with the third inorganic layer on the outer side of the blocking dam; Preferably, the second inorganic layer and the third inorganic layer are made of the same material.

5. The display panel according to claim 1, characterized in that: The orthographic projections of the array layer and the packaging layer on the substrate cover and extend outside the substrate; Alternatively, outer edges of the encapsulation layer, the array layer, and the substrate are flush; Preferably, the number of the barrier dam is one.

6. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 1 to 5.

7. A display component, characterized in that: It comprises at least two display sub-assemblies connected to each other, wherein the display sub-assemblies comprise a substrate, an array layer and a packaging layer stacked in sequence, wherein at the connection between two adjacent display sub-assemblies, the array layers of the two adjacent display sub-assemblies are continuous and uninterrupted, and the packaging layers are continuous and uninterrupted.

8. The display assembly according to claim 7, characterized in that: The array layer includes a first inorganic layer, the encapsulation layer includes a second inorganic layer, and at the connection point of two adjacent display sub-assemblies, the first inorganic layer is in contact with and connected to the second inorganic layer; Preferably, at the connection between two adjacent display sub-assemblies, a fourth patterned structure is provided on the surface of the array layer facing away from the substrate, and a fifth patterned structure matching the fourth patterned structure is provided on the surface of the encapsulation layer facing the substrate; Preferably, the substrates in two adjacent display subassemblies are arranged at intervals, or the substrates in two adjacent display subassemblies are continuous and uninterrupted; Preferably, the display subassembly further comprises a barrier dam, and the barrier dams in two adjacent display subassemblies are arranged at intervals.

9. A method for preparing a display panel, characterized in that: The method comprises: A display assembly is provided, the display assembly comprising at least two display subassemblies connected to each other, the display subassembly comprising a substrate, an array layer and an encapsulation layer stacked in sequence, wherein at a connection point between two adjacent display subassemblies, the array layers in the two adjacent display subassemblies are continuous and uninterrupted, and the encapsulation layers are continuous and uninterrupted; The connection between two adjacent display sub-assemblies is etched to separate the two adjacent display sub-assemblies.

10. The preparation method according to claim 9, characterized in that: The substrates in two adjacent display subassemblies are spaced apart, and the step of etching the connection between the two adjacent display subassemblies to separate the two adjacent display subassemblies includes: Performing etching processing on the encapsulation layer and the array layer at the connection between two adjacent display sub-assemblies; Alternatively, the substrates in two adjacent display subassemblies are continuous and uninterrupted, and the step of etching the connection between the two adjacent display subassemblies to separate the two adjacent display subassemblies includes: The encapsulation layer, the array layer and the substrate at the connection between two adjacent display sub-assemblies are etched.

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