Display panel, manufacturing method and display device

Abstract

The invention is suitable for the technical field of display, and provides a display panel, a manufacturing method and a display device.The display panel comprises a substrate and a blocking structure arranged on one side of the substrate, the display panel comprises a display area and a non-display area arranged in the circumferential direction of the display area, and the blocking structure comprises at least one dam arranged in the non-display area; the dam comprises supporting walls arranged at intervals in the direction away from the display area and a filling part arranged between the supporting walls, the supporting walls comprise inorganic materials, and the filling part comprises organic materials; according to the display panel, the supporting wall can have a small width, the filling part can also have a small width through the arrangement of the supporting wall, it can be guaranteed that the dam has a small width on the whole, the width occupied by the dam in the non-display area can be reduced, then the width of the non-display area can be reduced, and the high screen-to-body ratio of the display panel can be achieved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a manufacturing method and a display device. Background Art

[0002] Compared with liquid crystal display technology, OLED (Organic Light-Emitting Diode) display technology has many advantages, such as high contrast, wide color gamut, low power consumption, thinner structure, and flexible bending. At present, OLED display technology is widely used in mobile phones, computers, televisions and other fields.

[0003] With the development of display technology, narrow bezels and high screen-to-body ratio have become new development directions, and consumers' demand for full screens is also increasing. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a display panel, aiming to provide a solution for reducing the width of the border of the display screen.

[0005] An embodiment of the present application is implemented as follows: a display panel includes a substrate and a blocking structure located on one side of the substrate, the display panel includes a display area and a non-display area arranged around the display area, the blocking structure includes at least one dam arranged in the non-display area, the dam includes support walls spaced apart in a direction away from the display area, and a filling portion arranged between the support walls; the support walls include an inorganic material, and the filling portion includes an organic material.

[0006] In one embodiment, the support wall includes a plurality of support portions arranged in a stacked manner;

[0007] Preferably, the material of each of the supporting parts includes at least one of silicon oxide and silicon nitride;

[0008] Preferably, the filling portion comprises a plurality of stacked filling sub-portions;

[0009] Preferably, the material of at least one of the filling sub-portions is the same as the material of at least part of the display area;

[0010] Preferably, a material of at least one of the filling sub-portions is the same as a material of at least one of the planarization layer, the pixel definition layer and the spacer layer.

[0011] In one embodiment, the number of the filling sub-sections in the dam is greater than or equal to the number of the supporting sections in the supporting wall;

[0012] Preferably, the height of the filling portion is greater than or equal to the height of the supporting wall;

[0013] Preferably, the non-display area includes an outer frame area arranged at the periphery of the display area;

[0014] Preferably, the outer frame area includes a bending area located at one side of the display area, and part of the dam is located between the bending area and the display area; the height of at least part of the dam located between the bending area and the display area is greater than the height of the dam at other positions in the non-display area;

[0015] Preferably, the width of the dam located between the bending area and the display area is greater than or equal to the width of the dam at other positions in the non-display area;

[0016] Preferably, a through hole is provided on the display panel, and the non-display area further includes an inner frame area located in the circumference of the through hole, and the dam surrounding the through hole is provided in the inner frame area.

[0017] In one embodiment, the blocking structure includes a first dam close to the display area, and a second dam disposed on a side of the first dam away from the display area and spaced apart from the first dam;

[0018] Preferably, the height of the second dam is greater than or equal to the height of the first dam;

[0019] Preferably, the number of the supporting portions in the second dam is greater than the number of the supporting portions in the first dam, and / or the number of the filling sub-portions in the second dam is greater than the number of the filling sub-portions in the first dam.

[0020] In one embodiment, the width of the gap between the first dam and the second dam is greater than or equal to 10 microns;

[0021] Preferably, the width of the gap is less than or equal to 30 microns;

[0022] Preferably, a width of the gap at a side close to the substrate is smaller than a width of the gap at a side away from the substrate.

[0023] In one embodiment, the width of the support portion is greater than or equal to 3 microns;

[0024] The width of the filling sub-portion is greater than or equal to 6 microns;

[0025] Preferably, in the thickness direction of the substrate, the width of the support wall at a side close to the substrate is greater than the width at a side away from the substrate;

[0026] Preferably, in the support wall, in the thickness direction of the substrate, the width of the support portion close to the substrate is greater than the width of the support portion far from the substrate.

[0027] In one embodiment, the display panel further comprises a plurality of light emitting devices disposed in the display area, and wirings at least partially disposed in the non-display area and connected to the light emitting devices, wherein the wirings comprise sub-wirings located between the dam and the substrate and / or sub-wirings between two adjacent layers of the support portions;

[0028] Preferably, the blocking structure includes a first dam close to the display area, and a second dam arranged on a side of the first dam away from the display area, a gap is provided between the first dam and the second dam, and a plurality of the sub-routes are interconnected in the gap.

[0029] In one embodiment, the display panel further comprises a first encapsulation layer, a portion of the first encapsulation layer is disposed on a side of the dam away from the substrate, and an orthographic projection of the blocking structure on the substrate is located within an orthographic projection of the first encapsulation layer on the substrate;

[0030] Preferably, the material of the first encapsulation layer comprises an inorganic material;

[0031] Preferably, on the substrate, an organic material layer is provided on a side of the dam close to the display area and / or a side away from the display area, the dam and the organic material layer are spaced apart, and a portion of the first encapsulation layer is provided between the dam and the organic material layer.

[0032] Another object of the present application is to provide a method for manufacturing a display panel, which comprises:

[0033] Spaced supporting walls are formed on one side of the substrate, and filling parts are formed between the supporting walls.

[0034] Another object of the present application is to provide a display device, comprising the display panel as described in the above embodiments, or comprising a display panel manufactured by the method for manufacturing the display panel as described in the above embodiments.

[0035] The display panel, manufacturing method and display device provided by the embodiments of the present application have the following beneficial effects:

[0036] The display panel provided in the embodiment of the present application includes a substrate and a blocking structure arranged on one side of the substrate. The display panel includes a display area and a non-display area arranged in the circumference of the display area. The blocking structure includes at least one dam arranged in the non-display area. The dam includes support walls arranged at intervals in a direction away from the display area, and a filling part arranged between the support walls. The support walls include inorganic materials, and the filling part includes organic materials. The supporting walls provide support for the filling part, and the filling part provides a certain flexibility. The supporting walls themselves can have a smaller width, and the filling part can also have a smaller width due to the setting of the supporting walls. On the whole, it can be ensured that the dam has a smaller width, the width occupied by the dam in the non-display area can be reduced, and then the width of the non-display area can be reduced, which is conducive to achieving a high screen-to-body ratio of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0038] Figure 1 is a plan view of a display panel provided in an embodiment of the present application;

[0039] Figure 2 yes Figure 1 Sectional view at the middle BB;

[0040] Figure 3 yes Figure 1 Sectional view at CC;

[0041] Figure 4 yes Figure 1 Sectional view at DD in the middle;

[0042] Figure 5 It is a flowchart of the steps of the method for manufacturing a display panel provided in an embodiment of the present application.

[0043] The meanings of the marks in the figure are:

[0044] 100-display panel;

[0045] 1-substrate, 10-display area, 11-non-display area, 12-outer frame area, 121-upper frame area, 122-lower frame area, 123-left frame area, 124-right frame area, 13-inner frame area, 15-through hole, 16-bending area, 17-binding area, 18-display driver chip, 191-circuit board, 192-touch driver chip, 141-substrate, 142-array layer;

[0046] 2- blocking structure;

[0047] 21- levee, 211- first levee, 212- second levee, 210- gap;

[0048] 23-support wall, 231-support portion, 2311-first support portion, 2312-second support portion, 2313-third support portion; 238-inner support wall, 239-outer support wall;

[0049] 24-filling portion, 241-filling sub-portion, 2411-first filling sub-portion, 2412-second filling sub-portion, 2413-third filling sub-portion, 2414-fourth filling sub-portion;

[0050] 26-first encapsulation layer;

[0051] 3-light emitting device, 31-routing, 311-sub-routing;

[0052] 41-first organic material layer, 42-second organic material layer, 40-hollowed area;

[0053] PLN-planarization layer, PLN1-first planarization layer, PLN2-second planarization layer, PDL-pixel definition layer, SPC-spacer layer;

[0054] X-thickness direction, Y-width direction. DETAILED DESCRIPTION

[0055] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0056] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly or indirectly fixed or disposed on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the accompanying drawings and is only for the convenience of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation of this patent. The terms "first" and "second" are only used for the convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0057] In order to illustrate the technical solution described in this application, a detailed description is given below in conjunction with specific drawings and embodiments.

[0058] In the related art, a plurality of dams are arranged in the frame of the display screen, and the plurality of dams are arranged from the inside to the outside. Specifically, the dams are made of organic materials. Due to the fluidity of the organic materials, in order to ensure that the dams can be formed, the dams need to have a certain width, and a certain spacing width needs to be ensured between the dams. Therefore, the width of the frame area is relatively large.

[0059] The embodiments of the present application provide a display panel that can reduce the width of a non-display area and ensure a packaging effect.

[0060] See also Figure 1 and Figure 2 As shown, the embodiment of the present application first provides a display panel 100, which includes a substrate 1, a light-emitting device 3 arranged on one side of the substrate 1, and a blocking structure 2 arranged on one side of the substrate 1. The display panel 100 includes a display area 10 and a non-display area 11 arranged in a circumferential direction of the display area 10 and in a closed ring shape. The light-emitting device 3 is arranged in the display area 10 to form a display picture, and the blocking structure 2 is arranged in the non-display area 11 to encapsulate and seal the periphery of the light-emitting device 3 to ensure that the internal light-emitting device 3 is isolated from external water, oxygen, etc.

[0061] like Figure 1 , Figure 2 and Figure 4 As shown, the blocking structure 2 includes at least one bank 21 ( Figure 1 In the figure, the dam 21 is shown by a dotted line, the dam 21 includes two supporting walls 23 spaced apart from each other in a direction away from the display area 10, and a filling portion 24 disposed between the two supporting walls 23. In a direction from the display area 10 to the non-display area 11, the supporting wall 23, the filling portion 24 and the supporting wall 23 are arranged in sequence.

[0062] The two supporting walls 23 are mainly used as two supporting retaining walls, and play the functions of supporting and limiting the filling part 24 therebetween.

[0063] The material of the support wall 23 includes an inorganic material, and the material of the filling portion 24 includes an organic material.

[0064] The display panel 100 provided in the embodiment of the present application, wherein the dam 21 disposed in the non-display area 11 includes a support wall 23 that is annular and spaced from each other, and a filling portion 24 disposed between the support portions 231. The support wall 23 provides support for the filling portion 24, and the filling portion 24 provides a certain flexibility, so that the support wall 23 itself can have a smaller width, and the filling portion 24 can also have a smaller width by virtue of the arrangement of the support wall 23. Thus, the dam 21 can be ensured to have a smaller width as a whole, and the width and area occupied by the dam 21 in the non-display area 11 can be reduced, thereby reducing the width of the non-display area 11, which is conducive to achieving a high screen-to-body ratio of the display panel 100.

[0065] The substrate 1 may include a first area and a second area, the area for setting the light-emitting device 3 is the first area, and at least the first area of ​​the substrate 1 and the light-emitting device 3 in the first area together constitute the display area 10 of the display panel 100, and the blocking structure 2 is set in the second area, and at least the second area and the blocking structure 2 in the second area together constitute the non-display area 11 of the display panel 100.

[0066] In an optional embodiment, the material of the support wall 23 is an inorganic material, and the material of the filling part 24 is an organic material.

[0067] like Figure 2 As shown, of the two support walls 23, the one close to the display area 10 is the inner support wall 238, and the one away from the display area 10 is the outer support wall 239. That is, the outer support wall 239 is arranged on the side of the inner support wall 238 away from the display area 10 and is spaced apart from the inner support wall 238.

[0068] See also Figure 1 , Figure 2 and Figure 3 As shown, in some embodiments, the non-display area 11 is located outside the display area 10. In this case, the non-display area 11 serves as the outer frame area 12 of the entire display panel 100. In the outer frame area 12, the dam 21 surrounds the display area 10 in a closed ring shape. In some embodiments, the display panel 100 is provided with a through hole 15 for setting a sensor module such as a camera (not shown). In this case, a portion of the non-display area 11 is also located around the through hole 15 and is surrounded by the display area 10, and can serve as the inner frame area 13 of the entire display panel 100. In the inner frame area 13, the dam 21 surrounds the through hole 15 in a closed ring shape. Please refer to Figure 1 and Figure 4 In some embodiments, the non-display area 11 includes both the outer frame area 12 and the inner frame area 13. In each of the non-display areas 11, at least one dam 21 is provided.

[0069] Depending on the position of the non-display area 11 and the packaging requirements, the number of dams 21 may not be exactly the same. For the inner frame area 13 around the through hole 15, the dam 21 may be one or more. Figure 1 and Figure 4 As shown, there is one dam 21 to minimize the width of the inner frame area 13. For the outer frame area 12 outside the display area 10, there can be one or more dams 21. In an optional embodiment, please refer to Figures 1 to 3 As shown, the dam 21 is at least two ( Figures 1 to 3 Two dams 21 are shown in the figure, and the plurality of dams 21 are sequentially spaced apart in a direction away from the display area 10.

[0070] In other optional embodiments, there may be other numbers of dams 21 in different positions of the non-display area 11 .

[0071] See also Figure 1 As shown, based on the user's usage habits of the display panel 100, the outer frame area 12 may include an upper frame area 121, a lower frame area 122, a left frame area 123, and a right frame area 124. The dams 21 provided in the upper frame area 121, the lower frame area 122, the left frame area 123, and the right frame area 124 are sequentially connected and form a closed ring around the display area 10. In other optional embodiments, the display panel 100 may have other shapes, such as a hexagon or an octagon, etc., and correspondingly, the outer frame area 12 may be divided into more parts.

[0072] For some examples, see Figure 1 As shown, the non-display area 11 of the display panel 100 may also include a bending area 16 located on one side of the display area 10, specifically, the lower frame area 122, which is away from the display area 10, and a binding area 17 located on the side of the bending area 16 away from the display area 10. The binding area 17 is located on the back of the display panel 100 and is used to set a display driver chip 18, etc. Figure 1 In the figure, the bending area 16 and the binding area 17 are flattened to the front of the display area 10. In some embodiments, the binding area 17 can be located on the front of the display panel 100, and the bending area 16 is eliminated.

[0073] It should also be noted that the width direction Y determined by the above-mentioned "width" refers to the direction from the display area 10 to the non-display area 11, and the width direction Y is parallel to the surface of the substrate 1. For different positions of the non-display area 11, the specific direction of the width direction Y is different. For example, for the upper frame area 121 and the lower frame area 122, the width direction Y can be the up and down direction, for the left frame area 123 and the right frame area 124, the width direction Y can be the left and right direction, and for the inner frame area 13, the width direction Y can be the radial direction of the through hole 15 (the through hole 15 is circular or can be equivalent to a circle).

[0074] See also Figure 2 , Figure 3 and Figure 4 As shown, in one embodiment, the support wall 23 includes a plurality of support portions 231 stacked in sequence in the thickness direction X of the substrate 1 .

[0075] The purpose of such arrangement is that the support wall 23 is formed by a plurality of stacked support parts 231, which is conducive to manufacturing the support wall 23 of a desired height and reduces the difficulty of manufacturing the support wall 23. Here, the height direction and the thickness direction X are the same direction.

[0076] Furthermore, the width of the support wall 23 can be reduced, and thus, the width of the dam 21 can be reduced as much as possible. Taking the case where the material of the support wall 23 is an inorganic material, each support portion 231 is made by a photomask process: a plurality of stacked support portions 231 can be made in steps, and the corresponding inorganic material layers are formed into support portions 231 by dry etching. Therefore, the widths of different support portions 231 do not have to be limited to the same photomask process, but can be designed separately, and the width of each support portion 231 can only consider its own process technology. In this way, it is helpful to ensure that the width of each support portion 231 can be as small as possible.

[0077] In other optional embodiments, the support wall 23 may be composed of one support portion 231. For example, when there is another padding structure on the side of the support wall 23 close to the substrate 1 so that the support wall 23 can provide a sufficient height, or when the width of the non-display area 11 allows, the support wall 23 may be manufactured by a single photomask process.

[0078] See also Figure 2 , Figure 3 to Figure 4 As shown, in the thickness direction X of the substrate 1, the width of the support wall 23 close to the substrate 1 is greater than the width of the side away from the substrate 1. That is, overall, the width of the support wall 23 decreases in the direction away from the substrate 1. The support wall 23 is trapezoidal.

[0079] For each support portion 231, in the thickness direction X of the substrate 1, the width of the side close to the substrate 1 is greater than the width of the side away from the substrate 1. The purpose of this arrangement is that the trapezoidal support portion 231 and the support wall 23 are easier to manufacture, and the process parameters in the dry etching process are easier to implement.

[0080] In other optional embodiments, the support portion 231 may be rectangular, and the support wall 23 may be rectangular. Alternatively, the support wall 23 and its support portion 231 may be in an inverted trapezoidal shape. Specifically, the support wall 23 of a desired shape may be obtained by controlling the dry etching process.

[0081] In one embodiment, the width of the support wall 23 is greater than or equal to 3 microns. It should be noted that, for the support wall 23 with inconsistent widths at various locations in the thickness direction X of the substrate 1, its width may be the maximum value of the width values ​​at various locations. For example, for a trapezoidal support wall 23, its width may be the width of the side close to the substrate 1.

[0082] In one embodiment, the width of each support portion 231 is greater than or equal to 3 micrometers. The purpose of this setting is that the support portion 231 with this width range is easier to manufacture and shape based on the dry etching process, avoiding the problem of unsealed defects such as gaps in some parts of the support portion 231.

[0083] Optionally, the width of the support wall 23 is greater than or equal to 4 microns, and the width of each support portion 231 is greater than or equal to 4 microns, so as to further ensure that the support portion 231 is completely etched and formed, and at the same time, each support portion 231 itself has sufficient strength to provide sufficient supporting force. Further optionally, the width of the support wall 23 is greater than or equal to 5 microns, and the width of each support portion 231 is greater than or equal to 5 microns.

[0084] In one embodiment, the width of the filling portion 24 is greater than or equal to 6 microns. It should be noted here that the shape of the filling portion 24 is determined by the surface shape of the two supporting walls 23 on the side close to each other. Therefore, the value position of the width of the filling portion 24 can be based on the value position of the width of the supporting wall 23, that is, the widths of the three can be based on the same position, or based on the same height from the substrate 1. For example, when the width of the supporting wall 23 refers to its width on the side close to the substrate 1, the width of the filling portion 24 also refers to its width on the side close to the substrate 1. Other examples will not be given one by one.

[0085] Optionally, the width of the filling sub-portion 241 is greater than or equal to 6 micrometers. Similarly, the value position of the width of the filling sub-portion 241 is determined based on the value position of the width of the supporting portion 231 .

[0086] In an optional embodiment, along the same width direction Y, the widths of the outer support wall 239 and the inner support wall 238 may be equal or unequal. For example, the widths of the outer support wall 239 and the inner support wall 238 are allowed to have a certain difference based on process deviations.

[0087] For the support parts 231 located at the same layer, their widths may be equal or unequal.

[0088] In one embodiment, for each support wall 23, in the thickness direction X, the shapes of the support portions 231 are consistent, such as all are trapezoidal, or all are rectangular, or all are inverted trapezoidal. Figures 2 to 3As shown, each support portion 231 is trapezoidal, and the support wall 23 is trapezoidal.

[0089] Optionally, in the thickness direction X of the substrate 1, in each supporting wall 23, the width of the supporting portion 231 close to the substrate 1 is greater than the width of the supporting portion 231 away from the substrate 1, that is, the widths of different supporting portions 231 decrease in the direction away from the substrate 1. Similarly, it should be noted here that for supporting portions 231 with different widths at various locations in the thickness direction X, the width of each supporting portion 231 needs to be determined based on the same position. For example, the width of each supporting portion 231 refers to the maximum value of their widths at various locations. Specifically, for each trapezoidal supporting portion 231, their width refers to the width of the side close to the substrate 1.

[0090] Since different support parts 231 are manufactured in steps, the materials and / or thicknesses of different support parts 231 may be different.

[0091] See also Figures 2 to 4 As shown, for a plurality of stacked support portions 231 of a support wall 23, starting from the side close to the substrate 1, they are sequentially defined as a first support portion 2311, a second support portion 2312, a third support portion 2313, etc. In the same dam 21, the first support portions 2311 of the two support walls 23 are in the same layer, the second support portions 2312 of the two support portions 231 are in the same layer, and the third support portions 2313 of the two support portions 231 are in the same layer; and so on.

[0092] In the same supporting wall 23 , the materials and thicknesses of the first supporting portion 2311 , the second supporting portion 2312 and the third supporting portion 2313 may be the same or different.

[0093] In one embodiment, the material of the support wall 23 includes at least one of silicon nitride and silicon oxide. Then, the material of each support portion 231 includes at least one of silicon nitride and silicon oxide.

[0094] For example, for a support wall 23, the support portion 231 of one layer is silicon nitride, and the support portion 231 of an adjacent layer is silicon oxide; or, the support portions 231 of each layer are all silicon oxide, all silicon nitride, or all mixed layers of silicon oxide and silicon nitride.

[0095] See also Figures 2 to 4 As shown, the filling portion 24 includes at least one filling sub-portion 241. The number of the filling sub-portions 241 does not have to be consistent with the number of the supporting portions 231 in the supporting wall 23. This depends on the material and manufacturing process of the filling portion 24.

[0096] Optionally, at least part of the material of the filling portion 24 may be the same as at least part of the material of the display area 10 of the substrate 1 .

[0097] For some examples, see Figures 2 to 4 As shown, the filling portion 24 includes a plurality of filling sub-portions 241, and the material of at least one filling sub-portion 241 is the same as at least part of the material of the display area 10 of the substrate 1. In other words, at least one filling sub-portion 241 can be formed simultaneously with a part of the film layer of the display area 10. The purpose of such a setting is to be compatible with existing processes, save process, and reduce the manufacturing cost of the display panel 100.

[0098] like Figures 2 to 4 As shown, starting from the side close to the substrate 1, the plurality of filling sub-portions 241 are sequentially defined as a first filling sub-portion 2411, a second filling sub-portion 2412, a third filling sub-portion 2413, a fourth filling sub-portion 2414, and so on.

[0099] In an optional embodiment, in one dam 21, the number of filling sub-portions 241 is greater than or equal to the number of supporting portions 231 in one supporting wall 23. When manufacturing the dam 21, two supporting walls 23 or supporting portions 231 in two supporting walls 23 are first manufactured, and then the filling portion 24 between the supporting walls 23 or the filling sub-portions 241 between the supporting portions 231 are manufactured, so that at least part of the filling sub-portions 241 can be formed behind the supporting portions 231 in a one-to-one correspondence.

[0100] For example, the first filling sub-portion 2411 is manufactured after the first supporting portion 2311 ; the second filling sub-portion 2412 is manufactured after the second supporting portion 2312 ; and the third filling sub-portion 2413 is manufactured after the third supporting portion 2313 . And so on.

[0101] In other optional embodiments, based on specific process requirements, the number of filling sub-portions 241 may be smaller than the number of supporting portions 231 .

[0102] In some embodiments, the height of the filling portion 24 does not have to be completely consistent with the height of the support wall 23. Figure 3 As shown, the height of the filling portion 24 can be substantially equal to the height of the supporting wall 23. For example, the difference between the height of the filling portion 24 and the height of the supporting wall 23 does not exceed 0.5 micrometers. Figure 2 and Figure 4 As shown, the height of the filling portion 24 may be greater than the height of the supporting portion 231 .

[0103] In a specific embodiment, Figure 2 and Figure 4As shown, the number of filling sub-sections 241 is greater than the number of supporting sections 231. Furthermore, the height of the filling section 24 is greater than the height of the supporting wall 23. At this time, the height of the dam 21 is determined by the height of the filling section 24. The purpose of such a setting is to obtain a supporting wall 23 of a certain height by a smaller number of supporting sections 231 to ensure the supporting effect on the filling section 24, and to obtain a dam 21 of a required height by a larger number of filling sub-sections 241, which can meet the height requirement of the dam 21 on the basis of taking into account the manufacturing process and cost of the dam 21.

[0104] In a specific embodiment, Figure 3 As shown, the number of the filling sub-portions 241 is equal to the number of the supporting portions 231. Further, the height of the filling portion 24 is substantially equal to the height of the supporting wall 23.

[0105] The height relationship between the support portion 231 and the corresponding filling sub-portion 241 is not limited. For example, the filling sub-portion 241 of organic material can be obtained by filling the support portions 231 with organic material in a self-leveling manner and curing, so the height of the filling sub-portion 241 is less than or equal to the height of the corresponding support portion 231. Of course, according to specific process requirements, if allowed, the height of at least one filling sub-portion 241 can also be slightly greater than the height of the corresponding support portion 231. For example, see Figure 2 and Figure 4 As shown, there is no need to provide support portions 231 on both sides of the fourth filling sub-portion 2414 , and the fourth filling sub-portion 2414 can be formed by depositing and etching an organic material.

[0106] See also Figure 2 As shown, in one embodiment, the substrate 1 includes a substrate 141 and an array layer 142 disposed on one side of the substrate 141, and the array layer 142 includes a plurality of circuit layers and an insulating layer disposed between the circuit layers (neither of which is shown in the figure). The plurality of circuit layers form a driving circuit for driving the light-emitting device 3 to emit light. The light-emitting device 3 may be an organic electroluminescent diode, which includes a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence on one side of the substrate 1. The first electrode may be an anode, and the second electrode may be a cathode. The cathode is located on the side of the anode facing away from the substrate 1.

[0107] The number of circuit layers varies according to the specific structure of the array layer 142 and the driving circuit. For example, in one embodiment, the number of circuit layers is five, and in another embodiment, the number of circuit layers is four. In more embodiments, the number of circuit layers can be other values.

[0108] Please refer to Figures 2 to 4 As shown, at least part of the circuit layer of the array layer 142 also extends to the border area to form a wiring 31 for connecting the light-emitting device 3 .

[0109] For example, the wiring 31 is formed by at least one of the first metal layer, the second metal layer, the third metal layer, and the fourth metal layer. In addition, there may be at least one metal layer not shown, which is used to form, for example, a shielding layer, a gate layer, etc. The wiring 31 here may be a power line, for example, a cathode power line, which is used to provide a fixed voltage to the cathode of the light-emitting device 3. Of course, according to the specific settings, the wiring 31 here may also be other signal lines.

[0110] In some embodiments, the anode of the light emitting device 3 may be formed by a fourth metal layer. In this case, a portion of the fourth metal layer used to form the anode and a portion of the fourth metal layer used to form the sub-wire 311 are spaced apart from each other and are not connected.

[0111] like Figure 3 , Figure 4 and Figure 5 As shown, the wiring 31 is at least partially disposed between the dam 21 and the substrate 1 and / or between two adjacent layers of support portions 231 .

[0112] The portion of the wiring 31 disposed between the dam 21 and the substrate 1 may be formed by a first metal layer and a second metal layer, see Figure 2 The two sub-routes 311 in the embodiment, the partial routes 31 (respectively one sub-routes 311 ) arranged between two adjacent layers of support portions 231 may be formed by the third metal layer and / or the fourth metal layer.

[0113] In a specific embodiment, at least one sub-routing 311 of the routing 31 is disposed between the dam 21 and the substrate 1 , and at least another sub-routing 311 is disposed between two adjacent layers of support portions 231 .

[0114] See also Figures 2 to 4 As shown, in one embodiment, the display panel 100 further includes a first encapsulation layer 26, at least a portion of which is disposed on a side of the dam 21 away from the substrate 1 and a side of the dam 21 close to the display area 10 and away from the display area 10. In other words, the orthographic projection of the blocking structure 2 on the substrate 1 is completely within the orthographic projection of the first encapsulation layer 26 on the substrate 1, so that the first encapsulation layer 26 further encapsulates the dam 21, reducing the possibility of water and oxygen from the outside entering the dam 21.

[0115] In the process of manufacturing the substrate 1 and the light-emitting device 3, at least one planarization layer PLN, a pixel definition layer PDL, and a spacer layer SPC are generally formed. Among them, the planarization layer PLN is used to be set on the inorganic material pattern to facilitate the continued manufacture of the circuit layer, the pixel definition layer PDL is used to form a pixel opening on the anode to expose at least part of the anode, and the spacer layer SPC is used to be manufactured after the light-emitting device 3 is formed, and to support the light-emitting device 3 around it to reduce the influence of other film layers and external stress on the light-emitting device 3.

[0116] In one embodiment, at least one filling sub-portion 241 of the filling portion 24 may be made of the same material as at least one of the planarization layer PLN, the pixel definition layer PDL, and the spacer layer SPC, and may be formed simultaneously.

[0117] In one embodiment, if Figure 2 As shown, taking the support wall 23 including four stacked support parts 231 as an example, the sub-route 311 formed by the first metal layer and the second metal layer is located between the first support part 2311 and the substrate 1, the sub-route 311 formed by the third metal layer is located between the first support part 2311 and the second support part 2312, and the sub-route 311 formed by the fourth metal layer is located between the second support part 2312 and the third support part 2313.

[0118] See also Figure 2 As shown, in one embodiment, taking the filling portion 24 including four filling sub-portions 241 as an example, the first filling sub-portion 2411 is made of the same material as the first planarization layer PLN1, the second filling sub-portion 2412 is made of the same material as the second planarization layer PLN2, the third filling sub-portion 2413 is made of the same material as the pixel definition layer PDL, and the fourth filling sub-portion 2414 is made of the same material as the spacer layer SPC.

[0119] For example, the filling portion 24 includes three filling sub-portions 241. Figure 3 As shown, the first filling sub-portion 2411 is made of the same material as any one of the planarization layers PLN (the first planarization layer PLN1 or the second planarization layer PLN2), the second filling sub-portion 2412 is made of the same material as the pixel definition layer PDL, and the third filling sub-portion 2413 is made of the same material as the spacer layer SPC.

[0120] Alternatively, taking the filling portion 24 including three filling sub-portions 241 as an example, see Figure 2 As shown, the first filling sub-portion 2411 is made of the same material as the first planarization layer PLN1, the second filling sub-portion 2412 is made of the same material as the second planarization layer PLN2, and the third filling sub-portion 2413 is made of the same material as the pixel definition layer PDL.

[0121] In more other optional embodiments, each filling sub-portion 241 may have other corresponding relationships with the planarization layer PLN, the pixel definition layer PDL, and the spacer layer SPC, as long as the filling sub-portion 241 can be formed simultaneously with one of the film layers in the manufacturing sequence.

[0122] Please refer to Figure 2 and Figure 3 As shown, at least one organic material layer is provided on at least one side of the lower frame region 122, the side of the dam 21 close to the display region 10 and the side close to the bending region 16, respectively. Figure 3 As shown, the organic material layer located on the side of the dam 21 close to the display area 10 is defined as a first organic material layer 41, and the organic material layer located on the side of the dam 21 away from the display area 10 is defined as a second organic material layer 42. The organic material layer is one of the planarization layer PLN, the pixel definition layer PDL, and the spacer layer SPC, and is formed during the manufacturing process of the substrate 1 and the light-emitting device 3.

[0123] In some embodiments, the organic material layers on both sides are made of the same material as the material of the at least one filling sub-portion 241 .

[0124] The materials of the first organic material layer 41 and the second organic material layer 42 may be at least partially the same, or different.

[0125] In an optional embodiment, in the lower frame area 122, the first encapsulation layer 26 is attached to the substrate 1 on the side of the dam 21 close to the display area 10 and the side away from the display area 10. That is, in the lower frame area 122, the side of the dam 21 close to the display area 10 and the side away from the display area 10, the organic material layer is hollowed out, see Figure 3 As shown, the dam 21 and the first organic material layer 41 are spaced apart, and a hollow area 40 is provided between the dam 21 and the first organic material layer 41. The dam 21 and the second organic material layer 42 are spaced apart, and a hollow area 40 is also provided between the dam 21 and the second organic material layer 42. In the two hollow areas 40, the first encapsulation layer 26 is connected to the substrate 1. The purpose of this design is to physically separate the filling part 24 of the organic material from the organic material layers on both sides of the dam 21, thereby cutting off the path of water and oxygen transmission along the organic material, which can further ensure the water and oxygen isolation effect of the dam 21.

[0126] Since the arrangement of the hollowed-out area 40 also occupies a certain width in the outer frame area 12, the width of the hollowed-out area 40 should be as small as possible. For example, in some embodiments, the width of the hollowed-out area 40 is greater than or equal to 10 microns to ensure the molding of the hollowed-out area 40 and to achieve the complete separation of the organic materials on both sides of the dam 21. On this basis, the width of the hollowed-out area 40 is less than or equal to 30 microns. Further optionally, the width of the hollowed-out area 40 is less than or equal to 25 microns. In some specific embodiments, the width of the hollowed-out area 40 can be 10 microns, 12 microns, 15 microns, 18 microns, 20 microns, 22 microns, 25 microns, 28 microns, 30 microns, etc. The widths of the two hollowed-out areas 40 can be equal or unequal.

[0127] In one embodiment, the height of the dam 21 is 1 micrometer to 8 micrometers. Specifically, according to the packaging requirements of different positions on the display panel 100, the size of the display panel 100, etc., the heights of the dam 21 at different positions can be the same or different.

[0128] Furthermore, the height of the dam 21 may also be different depending on the material and quantity of the filling sub-portion 241 and / or the supporting portion 231 .

[0129] In one embodiment, the height of the support portion 231 may be 1 micrometer to 2 micrometers. In a specific application, the height of the support portion 231 needs to be determined according to the height of the support wall 23 and the number of the support portions 231 .

[0130] The thickness of the planarization layer PLN may be 1 micrometer to 3 micrometers. Optionally, the thickness of the planarization layer PLN may be 1.5 micrometers to 2.5 micrometers. Specifically, for example, the thickness of the planarization layer PLN is 1 micrometer, 1.2 micrometers, 1.5 micrometers, 1.8 micrometers, 2.0 micrometers, 2.2 micrometers, 2.5 micrometers, 2.8 micrometers, 3.0 micrometers, etc.

[0131] The thickness of the pixel definition layer PDL may be 0.5 micrometer to 2 micrometers. Optionally, the thickness of the pixel definition layer PDL may be 1 micrometer to 2 micrometers. Specifically, the thickness of the pixel definition layer PDL may be 0.5 micrometer, 0.8 micrometer, 1.0 micrometer, 1.2 micrometer, 1.5 micrometer, 1.8 micrometer, 2.0 micrometer, etc.

[0132] The thickness of the spacer layer SPC may be 0.5 micrometers to 3 micrometers. Optionally, the thickness of the spacer layer SPC may be 1.0 micrometers to 2.5 micrometers. Specifically, the thickness of the spacer layer SPC is 0.5 micrometers, 0.8 micrometers, 1 micrometer, 1.2 micrometers, 1.5 micrometers, 1.8 micrometers, 2.0 micrometers, 2.2 micrometers, 2.5 micrometers, 2.8 micrometers, 3.0 micrometers, etc.

[0133] In some embodiments, the height of the dam 21 may be 1 micrometer to 5 micrometers. Alternatively, the height of the dam 21 may be 1 micrometer to 4 micrometers. Further, optionally, the height of the dam 21 may be 2 micrometers to 4 micrometers.

[0134] In some embodiments, the height of the bank 21 may be 2 micrometers to 8 micrometers. Alternatively, the height of the bank 21 may be 2 micrometers to 7 micrometers. Further, optionally, the height of the bank 21 may be 4 micrometers to 7 micrometers.

[0135] In some embodiments, the height of the dam 21 can be 2 microns, 2.5 microns, 3 microns, 3.5 microns, 4 microns, 4.5 microns, 5 microns, 5.5 microns, 6 microns, 6.5 microns, 7 microns, 7.5 microns, 8 microns, etc.

[0136] In some embodiments, the height of the portion of the dam 21 located in the lower border area 122 can be set to be smaller. Specifically, the height of the portion of the dam 21 located between the bending area 16 and the display area 10 is smaller than the height of the portion of the dam 21 at other positions in the non-display area 11. For example, the height of the portion of the dam 21 located in the lower border area 122 is smaller than the height of other portions of the dam 21 in the outer border area 12.

[0137] The purpose of such arrangement is that, for the display panel 100 with touch function, a touch function layer (not shown) is further provided on the side of the light emitting device 3 away from the substrate 1, and the touch driver chip 192 is provided in the binding area 17 or on a circuit board 191 (such as a flexible circuit board) at least partially located in the binding area 17, and the touch signal line of the touch function layer needs to be changed through the dam 21 and then connected to the touch driver chip 192. At this time, the lower dam 21 is conducive to ensuring the change of the touch signal line, and avoiding the problem of large step difference and disconnection of the touch signal line due to the excessive height of the dam 21.

[0138] For details, please refer to Figure 2 and Figure 3 As shown, the number of filling sub-portions 241 in the partial dam 21 located in the lower frame area 122 is less than the number of filling sub-portions 241 in the other partial dams 21 in the outer frame area 12. Specifically, the partial dam 21 located in the lower frame area 122 includes three stacked filling sub-portions 241, while the other partial dams 21 in the outer frame area 12 include four stacked filling sub-portions 241. In this way, the height of the partial dam 21 in the lower frame area 122 can be smaller.

[0139] In other optional embodiments, the number of supporting portions 231 in the partial dam 21 located in the lower frame area 122 may be smaller than the number of supporting portions 231 in the other partial dams 21 in the outer frame area 12. Specifically, the partial dam 21 located in the lower frame area 122 includes three stacked supporting portions 231, while the other partial dams 21 in the outer frame area 12 include four supporting portions 231. In this way, the height of the partial dam 21 in the lower frame area 122 may be smaller.

[0140] See also Figure 2 and Figure 3 As shown, in one embodiment, in the outer frame area 12, the barrier structure 2 includes at least two dams 21, and the at least two dams 21 include a first dam 211 close to the display area 10, and a second dam 212 arranged on the side of the first dam 211 away from the display area 10 and spaced from the first dam 211. In other words, at the edge of the display area 10, the light-emitting device 3 is encapsulated by two layers of dams 21 spaced apart. This can further improve the encapsulation effect of the dam 21, enhance the ability to isolate water and oxygen, and further ensure the functional reliability of the light-emitting device 3.

[0141] In other optional embodiments, a third dam (not shown) may be further provided on the side of the second dam 212 away from the first dam 211 .

[0142] The first dam 211 and the second dam 212 also function to block the organic material and prevent the organic material from overflowing during the manufacturing process of the display area 10 and the light-emitting device 3. Therefore, the two dams 21 arranged at intervals can enhance the blocking of the organic material and greatly reduce the risk of the organic material overflowing from the second dam 212.

[0143] See also Figure 2 and Figure 3 As shown, the height of the second dam 212 is greater than or equal to the height of the first dam 211. The purpose of this arrangement is to further reduce the risk of organic materials overflowing from the second dam 212.

[0144] In an optional embodiment, the number of support portions 231 in the second dam 212 (here referring to the number of support portions 231 in a support wall 23) is greater than the number of external support portions 231 in the first dam 211, and / or the number of filling sub-portions 241 in the second dam 212 is greater than the number of filling sub-portions 241 in the first dam 211.

[0145] Specifically, by providing different numbers of support portions 231 in the first dam 211 and the second dam 212, the first dam 211 and the second dam 212 can have different heights. Alternatively, by providing different numbers of filling sub-portions 241 in the first dam 211 and the second dam 212, the first dam 211 and the second dam 212 can have different heights. Alternatively, the first dam 211 and the second dam 212 have different numbers of support portions 231 and different numbers of filling sub-portions 241, so that the first dam 211 and the second dam 212 have different heights.

[0146] like Figure 1 , Figure 2 and Figure 3 As shown, in a specific embodiment, in the left frame area 123, the right frame area 124 and the upper frame area 121, the first dam 211 includes three stacked sub-filling portions 24, and the second dam 212 includes four stacked sub-filling portions 24. In the lower frame area 122, the first dam 211 includes two stacked sub-filling portions 24, and the second dam 212 includes three stacked sub-filling portions 24.

[0147] like Figure 1 , Figure 2 and Figure 3 As shown, in a specific embodiment, in the left frame area 123, the right frame area 124 and the upper frame area 121, the first dam 211 includes two stacked support portions 231, and the second dam 212 includes three stacked support portions 231. In the lower frame area 122, the first dam 211 includes two stacked support portions 231, and the second dam 212 includes three stacked support portions 231.

[0148] In other optional embodiments, the height of the second dam 212 may also be set to be equal to the height of the first dam 211, or less than the height of the first dam 211. Moreover, this may also be achieved by setting the number of support portions 231 and / or the number of filling sub-portions 241 in the first dam 211 and the second dam 212. The details will not be repeated.

[0149] When the number of the supporting parts 231 in the first dam 211 and the second dam 212 is different, for example, when the number of the supporting parts 231 in the first dam 211 is less than the number of the supporting parts 231 in the second dam 211, each supporting part 231 of the first dam 211 and part of the supporting parts 231 in the second dam 212 are arranged in the same layer. Figure 2 and Figure 3As shown, the first support portion 2311 of the first dam 211 and the second support portion 2312 of the second dam 212 are made of the same layer of material, and the second support portion 2312 of the first dam 211 and the third support portion 2313 of the second dam 212 are made of the same layer of material.

[0150] Please continue reading Figures 2 to 4 As shown, since the second dam 212 is located on the side of the first dam 211 away from the display area 10, the end of each sub-wire 311 away from the display area 10 can be hidden in the second dam 212. Specifically, the sub-wire 311 formed by the first metal layer and the second metal layer is located on the side of the first supporting portion 2311 of the first dam 211 and the second dam 212 facing the substrate 1, the sub-wire 311 formed by the third metal layer is located on the side of the first supporting portion 2311 of the first dam 211 facing the substrate 1, in the gap 210, and between the second supporting portion 2312 and the first supporting portion 2311 of the second dam 212, and the sub-wire 311 formed by the fourth metal layer is located between the second supporting portion 2312 and the first supporting portion 2311 of the first dam 211, in the gap 210, and between the third supporting portion 2313 and the second supporting portion 2312 of the second dam 212.

[0151] In other optional embodiments, according to the corresponding relationship between the supporting parts 231 in the first dam 211 and the supporting parts 231 in the second dam 212 on the same layer, each sub-route 311 can be located between the supporting parts 231 or between the supporting parts 231 and the substrate 1 in other forms, as long as the sequential stacking relationship between the supporting parts 231, the metal layer and the filling sub-part 241 on the same layer is satisfied.

[0152] Since the lower frame area 122 is close to the bending area 16, the stress it is subjected to is relatively large, and the packaging requirements are higher. Therefore, in one embodiment, the width of the portion of the dam 21 located directly between the bending area 16 and the display area 10 is greater than or equal to the width of the dam 21 at other positions in the non-display area 11. Specifically, the width of the portion of the dam 21 located in the lower frame area 122 is greater than or equal to the width of the other portions of the dam 21 in the outer frame area 12, so as to increase the ability of the dam 21 to resist stress and extend the water and oxygen intrusion path. Optionally, the width of the portion of the dam 21 located in the lower frame area 122 is greater than the width of the other portions of the dam 21 in the outer frame area 12.

[0153] The width of the supporting wall 23 and / or the filling portion 24 of the part of the dam 21 located in the lower frame area 122 is greater than or equal to the width of the supporting wall 23 and / or the filling portion 24 of the other part of the dam 21 in the outer frame area 12. In other words, by differentially setting the width of the supporting wall 23 and / or the filling portion 24, the width of the dam 21 in the lower frame area 122 is larger.

[0154] like Figure 2 and Figure 3 As shown, in one embodiment, the width of the supporting wall 23 and / or the filling portion 24 of the portion of the first dam 211 located in the lower frame area 122 is greater than or equal to the width of the supporting wall 23 and / or the filling portion 24 of the other portion of the first dam 211 in the outer frame area 12. The width of the supporting wall 23 and / or the filling portion 24 of the portion of the second dam 212 located in the lower frame area 122 is greater than or equal to the width of the supporting wall 23 and / or the filling portion 24 of the other portion of the second dam 212 in the outer frame area 12.

[0155] like Figure 2 and Figure 3 As shown, in one embodiment, the width of the gap 210 between the first dam 211 and the second dam 212 is greater than or equal to 10 microns. The purpose of such a setting is that, on the one hand, there is a sufficient width between the first dam 211 and the second dam 212, which is convenient for process implementation, for example, it is convenient for etching inorganic materials to form the support wall 23, and it is conducive to completely etching and removing the organic material in the gap 210, avoiding the problem of organic material remaining in the gap 210, the organic material forming a connection with the filling part 24, and the display area 10; on the other hand, the sufficient width between the first dam 211 and the second dam 212 actually increases the propagation path of water and oxygen from the second dam 212 to the display area 10, thereby improving the encapsulation effect of the dam 21.

[0156] For the purpose of reducing the width of the dam 21, the width of the gap 210 between the first dam 211 and the second dam 212 should be as small as possible. For example, in one embodiment, the width of the gap 210 between the first dam 211 and the second dam 212 is less than or equal to 30 microns. Optionally, the width of the gap 210 between the first dam 211 and the second dam 212 is less than or equal to 25 microns. Further optionally, the width of the gap 210 between the first dam 211 and the second dam 212 is less than or equal to 20 microns.

[0157] like Figure 2 and Figure 3As shown, the shape of the gap 210 is determined by the shape of the supporting wall 23 on the side close to each other of the first dam 211 and the second dam 212. For example, the supporting wall 23 is a trapezoid, and the surfaces of the two supporting walls 23 on the side close to each other in the first dam 211 and the second dam 212 are close to each other in the direction close to the substrate 1, then the gap 210 is an inverted trapezoid, and the width of the gap 210 on the side close to the substrate 1 is smaller than the width on the side away from the substrate 1. The width of the gap 210 mentioned here is consistent with the value position of the width of the supporting wall 23. For example, the width of the inverted trapezoidal gap 210 can refer to the minimum value of the width of the gap 210 at various locations, that is, the width of the gap 210 on the side close to the substrate 1.

[0158] Please continue reading Figures 2 to 4 As shown, the sub-routes 311 formed by different metal layers are connected in the gap 210. Specifically, the sub-routes 311 formed by the first metal layer, the second metal layer, the third metal layer, and the fourth metal layer are stacked in sequence in the gap 210 and connected.

[0159] Next, a specific example is provided.

[0160] Comparative example: Taking the dam including the first dam and the second dam as an example, in the upper frame area, the left frame area and the right frame area, the width of the first dam is 30 microns, the width of the second dam is 40 microns, and the width of the gap between the first dam and the second dam is 30 microns, then the total width of the dam is 100 microns. In the lower frame area, the width of the first dam is 50 microns, the width of the second dam is 30 microns, and the width of the gap between the first dam and the second dam is 35 microns, then the total width of the dam is 115 microns; the width of the hollowed-out area inside the first dam can be, for example, 30 microns, and the width of the hollowed-out area outside the second dam can be, for example, 70 to 80 microns.

[0161] An embodiment of the present application: Taking the dam 21 including the first dam 211 and the second dam 212 as an example, in the upper frame area 121, the left frame area 123 and the right frame area 124, in the first dam 211, the width of the support wall 23 is 5 microns, and the width of the filling part 24 is 10 microns, then the total width of the first dam 211 is 20 microns; in the second dam 212, the width of the support wall 23 is 5 microns, and the width of the filling part 24 is 15 microns, then the total width of the second dam 212 is 25 microns; the width of the gap 210 between the first dam 211 and the second dam 212 is 20 microns, then the total width of the dam 21 is 65 microns. In the lower frame area 122, in the first dam 211, the width of the support wall 23 is 5 microns, the width of the filling portion 24 is 15 microns, and the total width of the first dam 211 is 25 microns; in the second dam 212, the width of the support wall 23 is 5 microns, the width of the filling portion 24 is 20 microns, and the total width of the second dam 212 is 30 microns; the width of the gap 210 between the first dam 211 and the second dam 212 is 25 microns, and the total width of the dam 21 is 75 microns. The width of the hollowed-out area 40 of the first dam 211 close to the display area 10 can be, for example, 30 microns, and the width of the hollowed-out area 40 of the second dam 212 away from the display area 10 can be, for example, 70 to 80 microns.

[0162] See also Figure 5 As shown, the embodiment of the present application also provides a method for manufacturing a display panel, including:

[0163] Step S1, making two support walls 23 spaced apart from each other on one side of the substrate 1;

[0164] Step S2 , making a filling portion 24 between the supporting walls 23 .

[0165] It is understandable that the above-mentioned limitation of step S1 and step S2 does not mean that the two must occur in a unique order. Without departing from the inventive principle of the present application, the above-mentioned step S1 and step S2 may occur alternately or cyclically.

[0166] For example, the supporting wall 23 includes at least one supporting portion 231, and the filling portion 24 includes at least one filling sub-portion 241. In the above-mentioned method for manufacturing a display panel, step S1 includes manufacturing two mutually spaced supporting portions 231 on one side of the substrate 1, and step S2 includes manufacturing a filling sub-portion 241 between the supporting portions 231.

[0167] Furthermore, step S1 further includes, on the side of the support portion 231 and the filling sub-portion 241 facing away from the substrate 1, continuing to form two mutually spaced support portions 231, and step S2 further includes, continuing to form a filling sub-portion 241 between the two support portions 231. That is, this is equivalent to, on the basis of the aforementioned step S1 and step S2, continuing to repeat step S1 and step S2.

[0168] By analogy, step S1 and step S2 can be repeated multiple times as needed.

[0169] Taking the preparation of the first support portion 2311 as an example, the steps of preparing the support portion 231 include: depositing an inorganic material layer on one side of the substrate 1, depositing a photoresist material layer on the inorganic material layer, providing a photomask, and exposing the photoresist material layer through the photomask, developing the exposed photoresist material layer to obtain a photoresist material pattern, and etching the inorganic material layer with the photoresist material pattern as a shield to obtain a support portion 231 corresponding to the photoresist material pattern layer;

[0170] The step of making the filling sub-portion 241 between the supporting portions 231 includes: forming a layer of organic material on one side of the substrate 1 by inkjet printing, and partially filling the organic material between the supporting portions 231; and curing the organic material to obtain the filling sub-portion 241 located between the supporting portions 231.

[0171] Finally, the present application also provides a display device (not shown), including the display panel 100 described in the above embodiments, or the display panel 100 manufactured by the above display panel manufacturing method. The features and effects of the display device can be referred to the above embodiments, and will not be described in detail.

[0172] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: The invention comprises a substrate and a blocking structure located on one side of the substrate, wherein the display panel comprises a display area and a non-display area arranged in the circumference of the display area, the blocking structure comprises at least one dam arranged in the non-display area, the dam comprises support walls arranged at intervals in a direction away from the display area, and a filling portion arranged between the support walls; the support walls comprise an inorganic material, and the filling portion comprises an organic material.

2. The display panel according to claim 1, wherein: The support wall includes a plurality of support portions arranged in a stacked manner; Preferably, the material of each of the supporting parts includes at least one of silicon oxide and silicon nitride; Preferably, the filling portion comprises a plurality of stacked filling sub-portions; Preferably, the material of at least one of the filling sub-portions is the same as the material of at least part of the display area; Preferably, a material of at least one of the filling sub-portions is the same as a material of at least one of the planarization layer, the pixel definition layer and the spacer layer.

3. The display panel according to claim 2, wherein: The number of the filling subsections in the dam is greater than or equal to the number of the supporting sections in the supporting wall; Preferably, the height of the filling portion is greater than or equal to the height of the supporting wall; Preferably, the non-display area includes an outer frame area arranged at the periphery of the display area; Preferably, the outer frame area includes a bending area located at one side of the display area, and part of the dam is located between the bending area and the display area; the height of at least part of the dam located between the bending area and the display area is greater than the height of the dam at other positions in the non-display area; Preferably, the width of the dam located between the bending area and the display area is greater than or equal to the width of the dam at other positions in the non-display area; Preferably, a through hole is provided on the display panel, and the non-display area further includes an inner frame area located in the circumference of the through hole, and the dam surrounding the through hole is provided in the inner frame area.

4. The display panel according to claim 2, wherein: The blocking structure includes a first dam close to the display area, and a second dam disposed on a side of the first dam away from the display area and spaced apart from the first dam; Preferably, the height of the second dam is greater than or equal to the height of the first dam; Preferably, the number of the supporting portions in the second dam is greater than the number of the supporting portions in the first dam, and / or the number of the filling sub-portions in the second dam is greater than the number of the filling sub-portions in the first dam.

5. The display panel according to claim 4, wherein: The width of the gap between the first dam and the second dam is greater than or equal to 10 micrometers; Preferably, the width of the gap is less than or equal to 30 microns; Preferably, a width of the gap at a side close to the substrate is smaller than a width of the gap at a side away from the substrate.

6. The display panel according to claim 2, wherein: The width of the support portion is greater than or equal to 3 microns; Preferably, the width of the filling sub-portion is greater than or equal to 6 microns; Preferably, in the thickness direction of the substrate, the width of the support wall at a side close to the substrate is greater than the width at a side away from the substrate; Preferably, in the support wall, in the thickness direction of the substrate, the width of the support portion close to the substrate is greater than the width of the support portion far from the substrate.

7. The display panel according to claim 2, wherein: The display panel further comprises a plurality of light emitting devices disposed in the display area, and wirings at least partially disposed in the non-display area and connected to the light emitting devices, wherein the wirings comprise sub-wirings between the dam and the substrate and / or sub-wirings between two adjacent layers of the support portions; Preferably, the blocking structure includes a first dam close to the display area, and a second dam arranged on a side of the first dam away from the display area, a gap is provided between the first dam and the second dam, and a plurality of the sub-routes are interconnected in the gap.

8. The display panel according to any one of claims 1 to 7, characterized in that: The display panel further comprises a first encapsulation layer, a portion of the first encapsulation layer is disposed on a side of the dam away from the substrate, and an orthographic projection of the blocking structure on the substrate is located within an orthographic projection of the first encapsulation layer on the substrate; Preferably, the material of the first encapsulation layer comprises an inorganic material; Preferably, on the substrate, an organic material layer is provided on a side of the dam close to the display area and / or a side away from the display area, the dam and the organic material layer are spaced apart, and a portion of the first encapsulation layer is provided between the dam and the organic material layer.

9. A method for manufacturing a display panel, characterized in that: include: Spaced supporting walls are formed on one side of the substrate, and filling parts are formed between the supporting walls.

10. A display device, characterized in that: A display panel comprising any one of claims 1 to 8, or a display panel manufactured by the method for manufacturing a display panel according to claim 9.

Images