Display panel, manufacturing method of display panel and display equipment

Abstract

The invention provides a display panel, a display device and a manufacturing method of the display panel, the display panel comprises a substrate, a partition structure, a plurality of light emitting units and a plurality of inorganic packaging structures, the partition structure is arranged on one side of the substrate and forms a plurality of partition openings in an enclosing mode, the partition structure comprises a first structural body, a second structural body and a covering part, the second structural body is located on the side, away from the substrate, of the first structural body, the covering part is arranged on the side surface, facing the partition opening, of the first structural body, the first structural body is made of an organic material, and the covering part is made of a conductive material; the light-emitting unit and the partition opening are correspondingly arranged, at least part of the light-emitting unit and the inorganic packaging structure are located in the partition opening, and the light-emitting unit is conductively connected with one end, close to the substrate, of the covering part; the inorganic packaging structure is in lap joint with the covering part. Therefore, when the display panel is bent, the partition structure can elastically deform to release part of bending stress, and the light emitting reliability of the display panel can be improved.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of display technology, and in particular, to a display panel, a method for manufacturing a display panel, and a display device. Background Art

[0002] As electronic display devices are widely used, people have higher requirements for the performance of electronic display devices. Display panels based on technologies such as organic light emitting diodes (OLED) and light emitting diodes (LED) are widely used in various electronic display devices such as mobile phones, televisions, laptops, and desktop computers due to their advantages of high image quality, power saving, and thin body.

[0003] In the process of traditional display panel preparation, the graphicization of luminous pixels is usually achieved through a fine metal mask (FMM). FMM technology is mature and has rich experience in mass production. However, FMM technology also has problems such as limited accuracy, high development cost, and long development cycle. The non-fine metal mask technology eliminates the limitations of traditional OLED processes on display screen size, resolution and other screen performance, and has the advantages of high performance, full-domain size, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A record the relevant content of the non-fine metal mask technology for reference.

[0004] In the related art, the display panel includes a display area and a non-display area, and the display panel also includes a partition structure, a packaging structure and a light-emitting structure. The partition structure and the packaging structure are overlapped, and the light-emitting structure is enclosed inside to protect the light-emitting structure. For electronic products that require the display panel to be bent, such as four-curve products (i.e., curved edges on all sides), curved screen products, and folding screen products, when the display panel is bent, stress is easily generated at the bend, and this stress is easy to damage the overlap between the partition structure and the packaging structure, thereby causing external water vapor to easily invade the light-emitting structure through the damaged part, resulting in poor light-emitting reliability of the display panel. Summary of the invention

[0005] In order to solve the above problems, embodiments of the present application provide a display panel, a display device and a method for manufacturing a display panel, so as to at least partially solve the above problems.

[0006] In a first aspect, the present application provides a display panel, the display panel comprising a display area and a non-display area, the display panel comprising:

[0007] substrate;

[0008] A partition structure is arranged on one side of the substrate, the partition structure encloses a plurality of partition openings, the partition structure comprises a first structure, a second structure and a covering portion, the second structure is located on a side of the first structure away from the substrate, the orthographic projection of the first structure on the substrate is located within the orthographic projection range of the second structure on the substrate, the covering portion is arranged on a side surface of the first structure facing the partition openings, the material of the first structure comprises an organic material, and the material of the covering portion comprises a conductive material;

[0009] A plurality of light-emitting units, wherein the light-emitting units and the partition openings are arranged correspondingly, at least some of the light-emitting units are located in the partition openings, and the light-emitting units are conductively connected to an end of the cover portion close to the substrate;

[0010] A plurality of inorganic packaging structures are arranged on a side of the corresponding light-emitting unit away from the substrate, and the inorganic packaging structure is overlapped with the covering portion.

[0011] In a possible embodiment, the partition structure further includes a connecting portion, the connecting portion is located on a surface of the first structure body on a side away from the substrate, and two sides of the connecting portion are electrically connected to two covering portions corresponding to two adjacent partition openings;

[0012] Preferably, the material of the covering portion is the same as the material of the connecting portion;

[0013] Preferably, the thickness of the covering portion is greater than 300 nanometers;

[0014] Preferably, the material of the covering portion includes aluminum, copper, or silver.

[0015] Preferably, the inorganic packaging structure and an end of the covering portion close to the substrate are overlapped.

[0016] In a possible embodiment, the connecting portion covers a partial area of ​​the surface of the first structure on a side away from the substrate, and the second structure is stacked on the first structure and the surface of the connecting portion on a side away from the substrate. Preferably, the material of the second structure includes an organic material.

[0017] Preferably, the material of the first structure is different from the material of the second structure;

[0018] Preferably, the covering portion is not provided on a surface of the second structure body facing the partition opening.

[0019] In a possible embodiment, the orthographic projection of the lower surface of the second structure on the substrate coincides with the orthographic projection of the upper surface of the second structure on the substrate, and the second structure includes an arcuate surface, the arcuate surface is concave toward the second structure, and one side of the arcuate surface is connected to the side edge of the first structure;

[0020] Preferably, the orthographic projection of the upper surface of the first structure on the substrate is located within the orthographic projection range of the lower surface of the first structure on the substrate, and an acute angle is formed between the side surface of the first structure and the thickness direction of the display panel;

[0021] Preferably, the inorganic packaging structure and the second structure have overlapping side surfaces facing the isolation opening.

[0022] In a possible embodiment, a surface of the second structure body facing away from the substrate includes a first region and a second region, and the second region surrounds the first region, wherein:

[0023] Part of the light-emitting unit and part of the inorganic packaging structure are sequentially stacked in the second area, and the first area is not covered by the light-emitting unit and the inorganic packaging structure;

[0024] Preferably, the inorganic encapsulation structure is continuously distributed between the second regions of adjacent partition structures.

[0025] In a possible embodiment, the display panel further includes a first encapsulation layer, and the first encapsulation layer is arranged on a side of the inorganic encapsulation structure away from the substrate;

[0026] Preferably, the material of the first encapsulation layer includes organic material;

[0027] Preferably, the first encapsulation layer is stacked on the first region of the second structure body.

[0028] In a possible embodiment, the display panel further includes a second encapsulation layer, where the second encapsulation layer is disposed on a side of the first encapsulation layer away from the substrate;

[0029] Preferably, the material of the second encapsulation layer includes an inorganic material.

[0030] In a possible embodiment, the display panel further includes a pixel defining layer, the pixel defining layer is disposed between the substrate and the partition structure, the pixel defining layer includes a plurality of pixel openings, the pixel openings correspond to the partition openings, the pixel openings are connected to the corresponding partition openings, the orthographic projection of the pixel openings on the substrate is located within the orthographic projection range of the corresponding partition openings on the substrate, and part of the light-emitting units are located in the pixel openings;

[0031] Wherein, one end of the covering portion close to the substrate is connected to a surface of the pixel defining layer on a side away from the substrate;

[0032] Preferably, the material of the pixel defining layer includes an inorganic material.

[0033] In a possible embodiment, the light-emitting unit includes a first electrode, a light-emitting structure, and a second electrode which are sequentially stacked in a direction away from the substrate, the first electrode is disposed between the substrate and the pixel defining layer, a portion of the first electrode is exposed in the corresponding pixel opening, and the light-emitting structure is stacked on a surface of the first electrode exposed in the pixel opening;

[0034] Preferably, the second electrode is conductively connected to an end of the covering portion close to the substrate.

[0035] In a possible embodiment, the substrate includes a substrate and a driving circuit layer, the driving circuit layer is arranged between the pixel defining layer and the substrate, the first electrode is located on a side of the driving circuit layer away from the substrate, and the first electrode is electrically connected to the driving circuit in the driving circuit layer.

[0036] In a possible embodiment, the plurality of light-emitting units include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, the partition opening includes a first partition opening, a second partition opening, and a third partition opening, the first light-emitting unit is arranged corresponding to the first partition opening, the second light-emitting unit is arranged corresponding to the second partition opening, and the third light-emitting unit is arranged corresponding to the third partition opening;

[0037] The first light emitting unit and the second light emitting unit emit different colors of light, the first light emitting unit and the third light emitting unit emit different colors of light, and the second light emitting unit and the third light emitting unit emit different colors of light.

[0038] In a second aspect, the present application provides another display panel, the display panel comprising:

[0039] substrate;

[0040] A partition structure is arranged on one side of the substrate, the partition structure encloses a plurality of partition openings, the partition structure comprises a first structure, a second structure and a covering portion, the second structure is located on a side of the first structure away from the substrate, the orthographic projection of the first structure on the substrate is located within the orthographic projection range of the second structure on the substrate, the covering portion is arranged on a side surface of the first structure facing the partition openings, the material of the first structure comprises an organic material, and the material of the covering portion comprises a conductive material;

[0041] A plurality of light-emitting units, wherein the light-emitting units and the partition openings are arranged correspondingly, at least some of the light-emitting units are located in the partition openings, and the light-emitting units are conductively connected to an end of the cover portion close to the substrate;

[0042] A plurality of inorganic packaging structures are arranged on a side of the corresponding light-emitting unit away from the substrate, and the inorganic packaging structure and the covering portion are overlapped;

[0043] a pixel defining layer, the pixel defining layer being disposed between the substrate and the partition structure, the pixel defining layer comprising a plurality of pixel openings, the pixel openings corresponding to the partition openings, the pixel openings being connected to the corresponding partition openings, the orthographic projections of the pixel openings on the substrate being within the orthographic projection range of the corresponding partition openings on the substrate, and part of the light emitting units being located in the pixel openings;

[0044] Wherein, one end of the covering portion close to the substrate is connected to a surface of the pixel defining layer facing away from the substrate.

[0045] In a possible embodiment, the partition structure further includes a connecting portion, the connecting portion is located on a surface of the first structure body on a side away from the substrate, and two sides of the connecting portion are electrically connected to two covering portions corresponding to two adjacent partition openings;

[0046] Preferably, the thickness of the covering portion is greater than 300 nanometers;

[0047] Preferably, the material of the covering portion includes aluminum, copper, or silver;

[0048] Preferably, the inorganic packaging structure and an end of the covering portion close to the substrate are overlapped.

[0049] In a possible embodiment, the connecting portion covers a partial area of ​​a surface of the first structure on a side away from the substrate, and the second structure is stacked on the first structure and the surface of the connecting portion on a side away from the substrate;

[0050] Preferably, the material of the second structure includes an organic material;

[0051] Preferably, the material of the first structure is different from the material of the second structure;

[0052] Preferably, the covering portion is not provided on the surface of the second structure facing the partition opening;

[0053] Preferably, the orthographic projection of the lower surface of the second structure on the substrate coincides with the orthographic projection of the upper surface of the second structure on the substrate, and the second structure comprises an arc-shaped surface, the arc-shaped surface is concave toward the second structure, and one side of the arc-shaped surface is connected to the side edge of the first structure;

[0054] Preferably, the orthographic projection of the upper surface of the first structure on the substrate is located within the orthographic projection range of the lower surface of the first structure on the substrate, and an acute angle is formed between the side surface of the first structure and the thickness direction of the display panel;

[0055] Preferably, the inorganic encapsulation structure overlaps with a side surface of the first structure body facing the partition opening, and overlaps with a side surface of the second structure body facing the partition opening.

[0056] In a possible embodiment, a surface of the second structure body facing away from the substrate includes a first region and a second region, and the second region surrounds the first region, wherein:

[0057] Part of the light-emitting unit and part of the inorganic packaging structure are sequentially stacked in the second area, and the first area is not covered by the light-emitting unit and the inorganic packaging structure;

[0058] Preferably, the inorganic encapsulation structure is continuously distributed between the second regions of adjacent partition structures;

[0059] Preferably, the display panel further comprises a first encapsulation layer and a second encapsulation layer, the first encapsulation layer is arranged on a side of the inorganic encapsulation structure away from the substrate, and the second encapsulation layer is arranged on a side of the first encapsulation layer away from the substrate;

[0060] Preferably, the material of the first encapsulation layer includes an organic material, and the material of the second encapsulation layer includes an inorganic material;

[0061] Preferably, the first encapsulation layer is stacked on the first region of the second structure body.

[0062] In a third aspect, the present application provides a method for manufacturing a display panel, comprising:

[0063] A partition structure is formed on one side of the substrate, the partition structure encloses a plurality of partition openings, the partition structure comprises a first structure body, a second structure body and a covering portion, the covering portion is arranged on a side surface of the first structure body facing the partition openings, the material of the first structure body comprises an organic material, and the material of the covering portion comprises a conductive material;

[0064] A light-emitting unit and an inorganic packaging structure are sequentially formed on a side of the substrate facing the partition structure, the light-emitting unit and the partition opening are correspondingly arranged, at least part of the light-emitting unit is located in the partition opening, the light-emitting unit and an end of the covering portion close to the substrate are conductively connected, the inorganic packaging structure is arranged on a side of the light-emitting unit away from the substrate, and the inorganic packaging structure and the covering portion are overlapped.

[0065] In a fourth aspect, the present application provides a display device, which includes the above-mentioned display panel, or a display panel manufactured by the above-mentioned display panel manufacturing method.

[0066] Based on the above-mentioned display panel provided by the present application, since the material of the partition structure arranged in the display area includes organic material, the partition structure has a large elastic modulus. When the display panel is bent in the display area, the partition structure can undergo elastic deformation to release at least part of the bending stress, thereby reducing the probability of the bending stress damaging the overlap between the metal covering part and the inorganic packaging structure, and reducing the risk of external water vapor invading the light-emitting unit through the overlap between the metal covering part and the inorganic packaging structure, which can help improve the light-emitting reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0067] The following drawings are intended only to illustrate and explain the present application, and do not limit the scope of the present application.

[0068] Figure 1 is a schematic diagram of the structure of a display panel provided according to some embodiments of the present application;

[0069] Figure 2 is a schematic diagram of the positions of the covering portion and the connecting portion distributed on a side of the first structure away from the substrate in a display panel provided according to some embodiments of the present application;

[0070] Figure 3 is a schematic diagram of the structure of a display panel provided according to some embodiments of the present application;

[0071] Figure 4 is a schematic diagram of the structure of a display panel provided according to some embodiments of the present application;

[0072] Figure 5is a schematic diagram of the structure of a display panel provided according to some embodiments of the present application;

[0073] Figure 6 is a schematic diagram of the structure of a display panel provided according to some embodiments of the present application;

[0074] Figure 7 is a flow chart of a method for manufacturing a display panel provided by the present application;

[0075] Figure 8a is a structural schematic diagram of a method for manufacturing a display panel provided according to an embodiment of the present application;

[0076] Figure 8b is a structural schematic diagram of a method for manufacturing a display panel provided according to an embodiment of the present application;

[0077] Figure 8c It is a structural schematic diagram of a method for manufacturing a display panel provided according to an embodiment of the present application.

[0078] Description of reference numerals:

[0079] 10-substrate, 11-substrate, 12-driving circuit layer,

[0080] 20-partition structure, 21-first structure, 22-second structure, 23-covering part, 24-connecting part,

[0081] 201-first area, 202-second area,

[0082] 30-pixel definition layer, 40-inorganic packaging structure,

[0083] 50 - light-emitting unit, 51 - first electrode, 52 - light-emitting structure, 53 - second electrode,

[0084] 501-first light emitting unit, 502-second light emitting unit, 503-third light emitting unit,

[0085] 61 - first encapsulation layer, 62 - second encapsulation layer, A0 - display area, A1 - non-display area. DETAILED DESCRIPTION

[0086] In order to have a clearer understanding of the technical features, purposes and effects of the embodiments of the present application, the specific implementation methods of the embodiments of the present application are now described with reference to the accompanying drawings.

[0087] In this document, “exemplary” means “serving as an example, instance or illustration”, and any diagram or implementation described in this document as “exemplary” should not be interpreted as a more preferred or more advantageous technical solution.

[0088] In order to simplify the drawings, only the parts related to the present application are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one or more of the parts with the same structure or function are schematically drawn or only one or more of them are marked.

[0089] The present application provides a display panel, referring to Figure 1 The display panel includes a substrate 10, a partition structure 20, a plurality of light-emitting units 50 and a plurality of inorganic packaging structures 40. The partition structure 20 is arranged on one side of the substrate 10, and the partition structure 20 is enclosed to form a plurality of partition openings. The partition structure 20 includes a first structure 21, a second structure 22 and a covering portion 23. The second structure 22 is located on the side of the first structure away from the substrate 10, and the orthographic projection of the first structure 21 on the substrate 10 is located within the orthographic projection range of the second structure 22 on the substrate 10. The covering portion 23 is arranged on the side surface of the first structure 21 facing the partition opening. The material of the first structure 21 includes an organic material, and the material of the covering portion 23 includes a conductive material. The light-emitting units 50 and the partition openings are arranged correspondingly, and at least part of the light-emitting units 50 are located in the partition openings. The light-emitting units 50 and the end of the covering portion 23 close to the substrate 10 are conductively connected. The inorganic packaging structure 40 is arranged on the side of the corresponding light-emitting unit 50 away from the substrate 10, and the inorganic packaging structure 40 and the covering portion 23 are overlapped.

[0090] Based on the above technical solution, it can be known that the light-emitting unit 50 can be used to emit light, and the partition structure 20 can separate adjacent light-emitting units 50 to avoid interference between adjacent light-emitting units 50. Along the extension direction of the substrate 10, the second structure 22 can extend out of the side wall of the first structure 21 to form an eaves-like structure. Then, when preparing the light-emitting unit 50, the light-emitting unit 50 will not be continuous near the eaves-like structure, but intermittent. In this way, the partition structure 20 can reliably separate adjacent light-emitting units 50. By conductively connecting the light-emitting unit 50 and the covering portion 23, adjacent light-emitting units 50 can be electrically connected together through the covering portion 23, which is conducive to achieving the conductive uniformity of each light-emitting unit 50. Since the light-emitting unit 50 and the end of the cover 23 close to the substrate 10 are conductively connected, the end or edge of the light-emitting unit 50 overlaps with the end of the cover 23 close to the substrate 10, and since the inorganic encapsulation structure 40 overlaps with the cover 23, the cover 23 overlaps with the end of the inorganic encapsulation structure 40 and the end of the light-emitting unit 50, respectively. Therefore, the cover 23 can protect the light-emitting unit 50 together with the inorganic encapsulation structure 40, and reduce the probability of external water vapor invading the light-emitting unit 50 through the partition structure 20 with organic material. Since the material of the first structure 21 includes organic material, the first structure 21 has a large elastic modulus. When the display panel is bent, the partition structure 20 can be elastically deformed to release at least part of the bending stress, thereby reducing the probability of the bending stress damaging the overlap between the cover 23 and the inorganic encapsulation structure 40, thereby reducing the risk of external water vapor invading the light-emitting unit 50 through the overlap between the cover 23 and the inorganic encapsulation structure 40, which can be beneficial to improve the light-emitting reliability of the display panel.

[0091] In a possible example, the display panel includes a display area A0 and a non-display area A1, and the partition structure 20, the light emitting unit 50 and the inorganic packaging structure 40 are all located in the display area.

[0092] In one possible implementation, reference Figure 1 and Figure 2 The partition structure 20 further includes a connecting portion 24, which is located on the surface of the first structure 21 on the side away from the substrate 10, and the two sides of the connecting portion 24 are electrically connected to the two covering portions 23 corresponding to the two adjacent partition openings. Through this technical solution, the adjacent light-emitting units 50 can be electrically connected through the covering portion 23 and the connecting portion 24. In this way, the light-emitting units 50 can be electrically connected through the covering portion 23 of the partition structure 20, which is conducive to achieving the uniformity of the electrical conductivity of each light-emitting unit 50.

[0093] Preferably, the material of the covering portion 23 is the same as the material of the connecting portion 24;

[0094] Preferably, the material of the covering portion 23 includes aluminum, copper, or silver.

[0095] Preferably, the thickness of the covering portion 23 is greater than 300 nanometers. Thus, the covering portion 23 has sufficient thickness to provide reliable packaging for the light emitting unit 50 together with the inorganic packaging structure 40 , and can also reduce the conductive resistance between adjacent light emitting units 50 .

[0096] Preferably, the inorganic packaging structure 40 and an end of the covering portion 23 close to the substrate 10 are overlapped.

[0097] In one possible implementation, reference Figure 1 , the connection portion 24 covers a portion of the surface of the first structure 21 on the side away from the substrate 10, and the second structure 22 is superimposed on the surface of the first structure 21 and the connection portion 24 on the side away from the substrate 10. In this way, on the surface of the second structure 22 facing the substrate 10, a portion of the area is directly connected to the first structure 21, and another portion of the area is directly connected to the connection portion 24.

[0098] In one example, the material of the second structure body 22 includes an organic material.

[0099] In one example, the material of the first structure 21 is different from the material of the second structure 22. In this way, the partition structure 20 can have good elasticity to release bending stress.

[0100] In one example, the covering portion 23 is not provided on the surface of the second structure 22 facing the partition opening. In this way, the size of the covering portion 23 can be controlled in the thickness direction of the substrate 10 to prevent the covering portion 23 from covering the surface of the second structure 22, thereby allowing the second structure 22 to have a larger elastic deformation capacity and absorb or release more bending stress.

[0101] In a possible embodiment, the orthographic projection of the lower surface of the second structure 22 on the substrate 10 is located and coincides with the orthographic projection of the upper surface of the second structure 22 on the substrate 10, and the second structure 22 includes an arcuate surface, the arcuate surface is concave toward the second structure 22, and one side of the arcuate surface is connected to the side edge of the first structure 21. It should be understood that the upper surface of the first structure 21 refers to the surface of the first structure 21 on the side away from the substrate 10, and the lower surface of the second structure 22 refers to the surface of the second structure 22 on the side facing the substrate 10, and the surface is connected to the upper surface of the first structure 21. Based on this technical solution, since the orthographic projection of the lower surface of the second structure 22 on the substrate 10 coincides with the orthographic projection of the upper surface of the second structure 22 on the substrate 10, the curved surface can be smoothly transitioned and connected with the side surface of the first structure 21 facing the partition opening, which is beneficial to the stable connection between the first structure 21 and the second structure 22, and is beneficial to the inorganic packaging structure 40 being set on the side surface of the partition structure 20 facing the partition opening, thereby facilitating the improvement of the packaging reliability and the luminous reliability of the display panel.

[0102] In one example, the orthographic projection of the upper surface of the first structure 21 on the substrate 10 is within the orthographic projection range of the lower surface of the first structure 21 on the substrate 10, and an acute angle is formed between the side surface of the first structure 21 and the thickness direction of the display panel. In this way, the cross section of the end of the first structure 21 away from the substrate 10 is smaller, and the cross section of the end close to the substrate 10 is larger. The side surface of the first structure 21, that is, the side surface facing the partition opening, is inclined relative to the thickness direction of the display panel, which is beneficial to the connection reliability between the cover 23 and the side surface of the first structure 21.

[0103] In one example, the inorganic encapsulation structure 40 overlaps the side surface of the second structure 22 facing the partition opening. In this way, the inorganic encapsulation structure 40 overlaps not only the end of the cover 23 away from the substrate 10, but also the side surface of the second structure 22, which is beneficial to improve the packaging reliability of the inorganic encapsulation structure 40 for the light-emitting unit 50, thereby being beneficial to improving the light-emitting reliability of the light-emitting unit 50.

[0104] In one possible implementation, reference Figure 3, the surface of the second structure 22 on the side away from the substrate 10 includes a first region 201 and a second region 202, the second region 202 surrounds the first region 201, wherein part of the light-emitting unit 50 and part of the inorganic encapsulation structure 40 are sequentially stacked on the second region 202, and the first region 201 is not covered by the light-emitting unit 50 and the inorganic encapsulation structure 40. In this way, it is equivalent to covering the second region 202 with part of the light-emitting unit 50 and the inorganic encapsulation structure 40 on the surface of the partition structure 20 on the side away from the substrate 10, and the light-emitting unit 50 and the inorganic encapsulation structure 40 corresponding to the second region 202 are enclosed together to form a gap, and the gap can expose the first region 201. By exposing the first region 201, when undergoing a high-temperature baking process, since the partition structure 20 includes an organic material, the water molecules or gas in the partition structure 20 can overflow from the first region 201, thereby improving the structural stability of the partition structure 20.

[0105] In one example, the inorganic encapsulation structure 40 is continuously distributed between the second regions 202 of adjacent partition structures 20. That is, the inorganic encapsulation structure 40 corresponding to one partition opening is continuously distributed, and the inorganic encapsulation structure 40 may extend from the light emitting unit 50 to opposite sides, and is continuously distributed along the side surface of the partition structure 20 facing the partition opening to the second region 202 of the partition structure 20.

[0106] In one possible embodiment, reference Figure 4 The display panel further includes a first encapsulation layer 61, which is disposed on the side of the inorganic encapsulation structure 40 and the partition structure 20 away from the substrate 10. In this way, the first encapsulation layer 61 can play the role of isolating and encapsulating both the inorganic encapsulation structure 40 and the partition structure 20.

[0107] In one example, the material of the first encapsulation layer 61 includes an organic material. For example, the material of the first encapsulation layer 61 includes an organic insulating material.

[0108] In one example, the first encapsulation layer 61 is stacked on the first region 201 of the second structure 22. That is, the first encapsulation layer 61 is directly overlapped on the first region 201 of the partition structure 20.

[0109] In one possible embodiment, reference Figure 5 The display panel further includes a second encapsulation layer 62, which is disposed on the side of the first encapsulation layer 61 away from the substrate 10. In this way, the second encapsulation layer 62 can protect the first encapsulation layer 61, and the second encapsulation layer 62 and the first encapsulation layer 61 can jointly play the role of isolating and encapsulating the inorganic encapsulation structure 40 and the partition structure 20.

[0110] In one example, the material of the second encapsulation layer 62 includes an inorganic material. For example, the material of the second encapsulation layer 62 includes an inorganic insulating material.

[0111] In one possible implementation, reference Figure 1 The display panel further includes a pixel defining layer 30, which is disposed between the substrate 10 and the partition structure 20. The pixel defining layer 30 includes a plurality of pixel openings, the pixel openings correspond to the partition openings, the pixel openings are connected to the corresponding partition openings, the orthographic projections of the pixel openings on the substrate 10 are located within the orthographic projection range of the corresponding partition openings on the substrate 10, and part of the light emitting unit 50 is located in the pixel openings; wherein, one end of the covering portion 23 close to the substrate 10 is connected to the surface of the pixel defining layer 30 on the side away from the substrate 10. For example, the orthographic projection of the pixel opening on the substrate 10 is located within the orthographic projection range of the corresponding partition opening on the substrate 10.

[0112] Based on the above technical solution, it can be known that the end of the light-emitting unit 50 extends through the surface of the pixel defining layer 30 on the side away from the substrate 10 to overlap with the end of the cover 23 close to the substrate 10. At the same time, the end of the cover 23 close to the substrate 10 is connected to the surface of the pixel defining layer 30 on the side away from the substrate 10. Therefore, the cover 23, the inorganic packaging structure 40 and the pixel defining layer 30 can jointly encapsulate the corresponding light-emitting unit 50, prevent water vapor from invading the light-emitting unit 50, improve the packaging effect, and help improve the light-emitting reliability of the display panel. Among them, the material of the pixel defining layer 30 can include inorganic materials.

[0113] In one possible embodiment, reference Figure 1 The light-emitting unit 50 includes a first electrode 51, a light-emitting structure 52, and a second electrode 53 which are sequentially stacked in a direction away from the substrate 10. The first electrode 51 is disposed between the substrate 10 and the pixel defining layer 30. A portion of the first electrode 51 is exposed in the corresponding pixel opening. The light-emitting structure 52 is stacked on the surface of the first electrode 51 which is exposed in the pixel opening. In this way, under the conductive action of the first electrode 51 and the second electrode 53, the light-emitting structure 52 can emit light, and the light-emitting range of the light-emitting structure 52 is the range defined by the isolation opening.

[0114] In one example, the second electrode 53 is conductively connected to an end of the cover portion 23 close to the substrate 10 . In this way, the second electrodes 53 can be electrically connected to each other through the partition structure 20 , which is conducive to achieving conductive uniformity of the second electrodes 53 .

[0115] One of the first electrode 51 and the second electrode 53 may be an anode, and the other may be a cathode.

[0116] Among them, the light-emitting structure 52 may include: one or more of: HIL (Hole Injection Layer), HTL (Hole Transfer Layer), EML (Emitting Layer) and ETL (Electron Transfer Layer). Among them, the organic light-emitting materials in the light-emitting structure 52 are generally divided into: high molecular polymers, small molecule organic substances and complex light-emitting materials; high molecular polymers are usually conductive conjugated polymers or semiconductor conjugated polymers, which can be formed into films by spin coating, are simple to make and low in cost, but their purity is not easy to improve, and they are inferior to small molecule organic compounds in terms of durability, brightness and color. Organic small molecule light-emitting materials are mainly organic dyes, which have the advantages of strong chemical modification, wide selection range, easy purification, high quantum efficiency, and can produce various color emission peaks such as red, green, blue, and yellow, but most of them have concentration quenching problems in the solid state. Complex light-emitting materials are between organic and inorganic substances, with both high fluorescence quantum efficiency of organic substances and high stability of inorganic substances, and are regarded as a type of light-emitting material with great application prospects.

[0117] In one possible implementation, reference Figure 3 The substrate 10 includes a substrate 11 and a driving circuit layer 12, the driving circuit layer 12 is disposed between the pixel defining layer 30 and the substrate 11, the first electrode 51 is located on the side of the driving circuit layer 12 away from the substrate 11, and the first electrode 51 is electrically connected to the driving circuit in the driving circuit layer 12. In this way, the light emission of the light-emitting unit 50 can be controlled by the electrical connection between the driving circuit and the first electrode 51.

[0118] Specifically, the driving circuit layer 12 may include multiple insulating material layers and multiple conductive structures disposed between the insulating material layers. Vias are disposed on the insulating material layers, and the first electrode 51 is connected to the conductive structure through the vias, thereby achieving electrical connection between the first electrode 51 and the driving circuit layer 12.

[0119] The display panel may further include a driving chip, which is disposed in the non-display area, and the driving circuit layer 12 is electrically connected to the driving chip. In this way, the driving circuit layer 12 can play a conductive role between the driving chip and the light-emitting unit 50.

[0120] In one example, the first electrode 51 may be located between the pixel defining layer 30 and the driving circuit layer 12, at least a portion of the surface of the first electrode 51 facing away from the substrate 10 is exposed in the pixel opening, the light emitting structure 52 is superimposed on the surface of the first electrode 51 facing away from the substrate 10 through the pixel opening, and the second electrode 53 is superimposed on the surface of the light emitting structure 52 facing away from the substrate 10. In this way, the first electrode 51, the light emitting structure 52, and the second electrode 53 can form a light emitting unit 50 capable of emitting light, and the pixel circuit can control the light emitting unit 50 to emit light by being electrically connected to the first electrode 51.

[0121] In one possible embodiment, reference Figure 6 , the plurality of light-emitting units 50 include a first light-emitting unit 501, a second light-emitting unit 502 and a third light-emitting unit 503, the partition opening includes a first partition opening, a second partition opening and a third partition opening, the first light-emitting unit 501 is arranged corresponding to the first partition opening, the second light-emitting unit 502 is arranged corresponding to the second partition opening, and the third light-emitting unit 503 is arranged corresponding to the third partition opening; the first light-emitting unit 501 and the second light-emitting unit 502 have different light-emitting colors, the first light-emitting unit 501 and the third light-emitting unit 503 have different light-emitting colors, and the second light-emitting unit 502 and the third light-emitting unit 503 have different light-emitting colors. In this way, light-emitting units 50 capable of emitting different colors can be arranged in different pixel openings. In this way, by arranging a plurality of light-emitting units 50, the display panel can present a plurality of display colors and effects.

[0122] This application also provides another display panel, referring to Figure 1The display panel includes a substrate 10, a pixel defining layer 30, a partition structure 20, a plurality of light-emitting units 50 and a plurality of inorganic packaging structures 40. The partition structure 20 is arranged on one side of the substrate 10, and the partition structure 20 is enclosed to form a plurality of partition openings. The partition structure 20 includes a first structure 21, a second structure 22 and a covering portion 23. The second structure 22 is located on the side of the first structure 21 away from the substrate 10, and the orthographic projection of the first structure 21 on the substrate 10 is located within the orthographic projection range of the second structure 22 on the substrate 10. The covering portion 23 is arranged on the side surface of the first structure 21 facing the partition opening. The material of the first structure 21 includes an organic material, and the material of the covering portion 23 includes a conductive material. The light-emitting unit 50 is arranged corresponding to the partition opening, at least part of the light-emitting unit 50 is located in the partition opening, and the end of the light-emitting unit 50 is conductively connected to the end of the covering portion 23 close to the substrate 10. The inorganic packaging structure 40 is arranged on the side of the corresponding light-emitting unit 50 away from the substrate 10, and the inorganic packaging structure 40 and the covering portion 23 are overlapped. The pixel defining layer 30 is disposed between the substrate 10 and the partition structure 20, and includes a plurality of pixel openings, the pixel openings correspond to the partition openings, the pixel openings are connected to the corresponding partition openings, the orthographic projections of the pixel openings on the substrate 10 are located within the orthographic projection range of the corresponding partition openings on the substrate 10, and part of the light emitting unit 50 is located in the pixel openings; wherein, one end of the covering portion 23 close to the substrate 10 is connected to the surface of the pixel defining layer 30 on the side away from the substrate 10. For example, the orthographic projection of the pixel opening on the substrate 10 is located within the orthographic projection range of the corresponding partition opening on the substrate 10.

[0123] Based on the above technical solution, it can be known that the light-emitting unit 50 can be used to emit light, and the partition structure 20 can separate adjacent light-emitting units 50 to avoid interference between adjacent light-emitting units 50. Along the extension direction of the substrate 10, the second structure 22 can extend out of the side wall of the first structure 21 to form an eaves-like structure. Then, when preparing the light-emitting unit 50, the light-emitting unit 50 will not be continuous near the eaves-like structure, but intermittent. In this way, the partition structure 20 can reliably separate adjacent light-emitting units 50. By conductively connecting the light-emitting unit 50 and the covering portion 23, adjacent light-emitting units 50 can be electrically connected together through the covering portion 23, which is conducive to achieving the conductive uniformity of each light-emitting unit 50. Since the light-emitting unit 50 and the end of the covering portion 23 close to the substrate 10 are conductively connected, the end or edge of the light-emitting unit 50 overlaps with the end of the covering portion 23 close to the substrate 10, and since the inorganic packaging structure 40 and the covering portion 23 overlap, the covering portion 23 and the light-emitting unit 50, the end of the inorganic packaging structure 40, and the pixel defining layer 30 are all connected. Therefore, the covering portion 23, the inorganic packaging structure 40 and the pixel defining layer 30 can jointly encapsulate the corresponding light-emitting unit 50 to prevent water vapor from invading the light-emitting unit 50, thereby improving the packaging effect and helping to improve the light-emitting reliability of the display panel. Since the material of the first structure 21 includes organic material, the first structure 21 has a large elastic modulus. When the display panel is bent in the display area, the partition structure 20 can be elastically deformed to release at least part of the bending stress, thereby reducing the probability of the bending stress damaging the overlap between the cover 23 and the inorganic packaging structure 40, thereby reducing the risk of external water vapor invading the light-emitting unit 50 through the overlap between the cover 23 and the inorganic packaging structure 40, which can help improve the light-emitting reliability of the display panel. Among them, the material of the pixel defining layer 30 can include inorganic material.

[0124] In one possible implementation, reference Figure 1 and Figure 2 The partition structure 20 further includes a connecting portion 24, which is located on the surface of the first structure 21 on the side away from the substrate 10, and the two sides of the connecting portion 24 are electrically connected to the two covering portions 23 corresponding to the two adjacent partition openings, so that the adjacent light-emitting units 50 can be electrically connected through the covering portions 23 and the connecting portion 24. In this way, the light-emitting units 50 can be electrically connected through the covering portions 23 of the partition structure 20, which is conducive to achieving the uniformity of the electrical conductivity of each light-emitting unit 50.

[0125] Preferably, the material of the covering portion 23 and the material of the connecting portion 24 are the same.

[0126] Preferably, the material of the covering portion 23 includes aluminum, copper, or silver.

[0127] Preferably, the thickness of the covering portion 23 is greater than 300 nanometers. Thus, the covering portion 23 has sufficient thickness to provide reliable packaging for the light emitting unit 50 together with the inorganic packaging structure 40 , and can also reduce the conductive resistance between adjacent light emitting units 50 .

[0128] Preferably, the inorganic packaging structure 40 and an end of the covering portion 23 close to the substrate 10 are overlapped.

[0129] In one possible implementation, reference Figure 1 , the connection portion 24 covers a portion of the surface of the first structure 21 on the side away from the substrate 10, and the second structure 22 is superimposed on the surface of the first structure 21 and the connection portion 24 on the side away from the substrate 10. In this way, on the surface of the second structure 22 facing the substrate 10, a portion of the area is directly connected to the first structure 21, and another portion of the area is directly connected to the connection portion 24.

[0130] In one example, the material of the second structure body 22 includes an organic material.

[0131] In one example, the material of the first structure 21 is different from the material of the second structure 22. In this way, the partition structure 20 can have good elasticity to release bending stress.

[0132] In one example, the covering portion 23 is not provided on the surface of the second structure 22 facing the partition opening. In this way, the size of the covering portion 23 can be controlled in the thickness direction of the substrate 10 to prevent the covering portion 23 from covering the surface of the second structure 22, thereby allowing the second structure 22 to have a larger elastic deformation capacity and absorb or release more bending stress.

[0133] In one example, the orthographic projection of the lower surface of the second structure 22 on the substrate 10 is located and coincides with the orthographic projection of the upper surface of the second structure 22 on the substrate 10, and the second structure 22 includes an arcuate surface, the arcuate surface is concave toward the second structure 22, and one side of the arcuate surface is connected to the side edge of the first structure 21. It should be understood that the upper surface of the first structure 21 refers to the surface of the first structure 21 on the side away from the substrate 10, and the lower surface of the second structure 22 refers to the surface of the second structure 22 on the side facing the substrate 10, and the surface is connected to the upper surface of the first structure 21. Based on this technical solution, since the orthographic projection of the lower surface of the second structure 22 on the substrate 10 coincides with the orthographic projection of the upper surface of the second structure 22 on the substrate 10, the curved surface can be smoothly transitioned and connected with the side surface of the first structure 21 facing the partition opening, which is beneficial to the stable connection between the first structure 21 and the second structure 22, and is beneficial to the inorganic packaging structure 40 being set on the side surface of the partition structure 20 facing the partition opening, thereby facilitating the improvement of the packaging reliability and the luminous reliability of the display panel.

[0134] In one example, the orthographic projection of the upper surface of the first structure 21 on the substrate 10 is within the orthographic projection range of the lower surface of the first structure 21 on the substrate 10, and an acute angle is formed between the side surface of the first structure 21 and the thickness direction of the display panel. In this way, the cross section of the end of the first structure 21 away from the substrate 10 is smaller, and the cross section of the end close to the substrate 10 is larger. The side surface of the first structure 21, that is, the side surface facing the partition opening, is inclined relative to the thickness direction of the display panel, which is beneficial to the connection reliability between the cover 23 and the side surface of the first structure 21.

[0135] In one example, the inorganic encapsulation structure 40 overlaps the side surface of the second structure 22 facing the partition opening. In this way, the inorganic encapsulation structure 40 overlaps not only the end of the cover 23 away from the substrate 10, but also the side surface of the second structure 22, which is beneficial to improve the packaging reliability of the inorganic encapsulation structure 40 for the light-emitting unit 50, thereby being beneficial to improving the light-emitting reliability of the light-emitting unit 50.

[0136] In a possible implementation, the surface of the second structure 22 on the side away from the substrate 10 includes a first region 201 and a second region 202, wherein the second region 202 surrounds the first region 201, wherein part of the light-emitting unit 50 and part of the inorganic encapsulation structure 40 are sequentially stacked on the second region 202, and the first region 201 is not covered by the light-emitting unit 50 and the inorganic encapsulation structure 40. In this way, it is equivalent to covering the second region 202 with part of the light-emitting unit 50 and the inorganic encapsulation structure 40 on the surface of the partition structure 20 on the side away from the substrate 10, and the light-emitting unit 50 and the inorganic encapsulation structure 40 corresponding to the second region 202 are enclosed together to form a gap, and the gap can expose the first region 201. By exposing the first region 201, when undergoing a high-temperature baking process, since the partition structure 20 includes an organic material, water molecules or gas in the partition structure 20 can overflow from the first region 201, thereby improving the structural stability of the partition structure 20.

[0137] In one example, the inorganic encapsulation structure 40 is continuously distributed between the second regions 202 of adjacent partition structures 20. That is, the inorganic encapsulation structure 40 corresponding to one partition opening is continuously distributed, and the inorganic encapsulation structure 40 can extend from the light-emitting unit 50 to opposite sides, and is continuously distributed along the side surface of the partition structure 20 to the second region 202 of the partition structure 20.

[0138] In a possible embodiment, the display panel further includes a first encapsulation layer 61 and a second encapsulation layer 62, wherein the first encapsulation layer 61 is disposed on a side of the inorganic encapsulation structure 40 and the partition structure 20 away from the substrate 10, and the second encapsulation layer 62 is disposed on a side of the first encapsulation layer 61 away from the substrate 10. In this way, the second encapsulation layer 62 and the first encapsulation layer 61 can jointly play a role in isolating and encapsulating the inorganic encapsulation structure 40 and the partition structure 20.

[0139] In one example, the first encapsulation layer 61 is stacked on the first region 201 of the second structure 22. That is, the first encapsulation layer 61 is directly overlapped on the first region 201 of the partition structure 20.

[0140] In one example, the material of the first encapsulation layer 61 includes an organic material. For example, the material of the first encapsulation layer 61 includes an organic insulating material.

[0141] In one example, the material of the first encapsulation layer 61 includes an organic material. For example, the material of the first encapsulation layer 61 includes an organic insulating material.

[0142] The present application also provides a method for manufacturing a display panel, referring to Figure 7 and Figure 1 , the preparation method comprises:

[0143] Step S701, forming a partition structure 20 on one side of the substrate 10, the partition structure 20 encloses a plurality of partition openings, the partition structure 20 comprises a first structure 21, a second structure 22 and a covering portion 23, the second structure 22 is located on the side of the first structure 21 away from the substrate 10, the orthographic projection of the first structure 21 on the substrate 10 is located within the range of the orthographic projection of the second structure 22 on the substrate 10, the covering portion 23 is disposed on the side surface of the first structure 21 facing the partition openings, the material of the first structure 21 comprises an organic material, and the material of the covering portion 23 comprises a conductive material;

[0144] Step S702, a light-emitting unit 50 and an inorganic packaging structure 40 are sequentially formed on the side of the substrate 10 facing the partition structure 20, the light-emitting unit 50 and the partition opening are arranged correspondingly, at least part of the light-emitting unit 50 is located in the partition opening, the light-emitting unit 50 and the end of the covering part 23 close to the substrate 10 are conductively connected, the inorganic packaging structure 40 is arranged on the side of the light-emitting unit 50 facing away from the substrate 10, and the inorganic packaging structure 40 and the covering part 23 are overlapped.

[0145] In the display panel manufactured by the above method, the partition structure 20 can separate adjacent light-emitting units 50 to avoid mutual interference between adjacent light-emitting units 50. The light-emitting unit 50 can be used for emitting light, and the opposite ends of the covering portion 23 overlap the ends of the inorganic encapsulation structure 40 and the ends of the light-emitting unit 50, respectively. Therefore, the covering portion 23 can protect the light-emitting unit 50 together with the inorganic encapsulation structure 40, and reduce the probability of external water vapor invading the light-emitting unit 50 through the partition structure 20 with organic material. Since the material of the partition structure 20 includes organic material, the partition structure 20 has a large elastic modulus. When the display panel is bent in the display area, the partition structure 20 can be elastically deformed to release at least part of the bending stress, thereby reducing the probability of the bending stress damaging the overlap between the covering portion 23 and the inorganic encapsulation structure 40, thereby reducing the risk of external water vapor invading the light-emitting unit 50 through the overlap between the covering portion 23 and the inorganic encapsulation structure 40, which can be beneficial to improve the light-emitting reliability of the display panel. In this way, a display panel with high light-emitting reliability is obtained.

[0146] Before forming the partition structure 20, a pixel defining layer 30 needs to be formed on one side of the substrate 10. The pixel defining layer 30 is arranged on the side of the substrate 10 facing the partition structure 20. The pixel defining layer 30 includes a plurality of pixel openings. The partition openings formed by the partition structure 20 correspond to the pixel openings.

[0147] Therefore, in the manufacturing method provided in the present application, step S701, forming a partition structure 20 on one side of the substrate 10, may include:

[0148] A first structure 21 is formed on the side of the pixel defining layer 30 facing away from the substrate 10. The material of the first structure 21 includes an organic material. Figure 8a ;

[0149] A covering portion 23 is formed on the side surface of the first structure 21 facing the isolation opening, and a connecting portion 24 is formed on the surface of the first structure 21 on the side away from the substrate. The connecting portion 24 is located on the surface of the first structure 21 on the side away from the substrate 10. Both sides of the connecting portion 24 are electrically connected to the two covering portions 23 corresponding to the two adjacent isolation openings. One end of the covering portion 23 close to the substrate 10 is connected to the surface of the pixel defining layer 30 on the side away from the substrate 10. Figure 8b ;

[0150] A second structure 22 is formed on the side of the first structure 21 and the connecting portion 24 away from the substrate 10. The material of the second structure 22 includes an organic material. The orthographic projection of the first structure 21 on the substrate 10 is located within the orthographic projection range of the second structure 22 on the substrate 10. The partition structure 20 includes the first structure 21, the second structure 22, the covering portion 23 and the connecting portion 24. The pixel opening corresponds to the partition opening, and the pixel opening is connected to the corresponding partition opening. Figure 8c .

[0151] It can be seen from the above technical solution that after forming the first structure 21 , the covering portion 23 is formed first, and then the second structure 22 is formed, so that the second structure 22 can avoid adverse effects on the formation process of the covering portion 23 .

[0152] In one example, a first organic material layer may be formed on the side of the pixel defining layer 30 facing away from the substrate 10, and then the first structure 21 may be obtained by exposure and development; then the covering portion 23 and the connecting portion 24 may be obtained by deposition, etching and other processes, the covering portion 23 being attached to the side surface of the first structure 21 facing the partition opening, and the connecting portion 24 covering a part of the surface of the first structure 21 facing away from the substrate, for example, the covering portion 23 and the connecting portion 24 may be formed together; then a second organic material layer may be formed on the side of the first structure 21 facing away from the substrate 10, and then the second structure 22 may be obtained by exposure and development. Thus, a partition structure 20 consisting of the first structure 21 and the second structure 22 and the covering portion 23 attached to the side surface of the partition structure 20 are obtained.

[0153] In the manufacturing method provided in the present application, the light emitting unit 50 and the inorganic packaging structure 40 are sequentially formed on the side of the substrate 10 facing the partition structure 20, which may include:

[0154] A first light emitting structure, a second electrode 53, and an inorganic packaging structure 40 corresponding to the first isolation opening are sequentially formed on one side of the substrate 10 facing the isolation structure 20;

[0155] A second light emitting structure, a second electrode 53, and an inorganic encapsulation structure 40 corresponding to the second isolation opening are sequentially formed on one side of the substrate 10 facing the isolation structure 20;

[0156] A third light emitting structure, a second electrode 53, and an inorganic encapsulation structure 40 corresponding to the third isolation opening are sequentially formed on one side of the substrate 10 facing the isolation structure 20;

[0157] The first sub-light emitting structure, the second light emitting structure and the third light emitting structure all have different light emitting colors, and the second light emitting structure and the third light emitting structure have different light emitting colors. The first electrode is located between the pixel defining layer and the substrate, and a portion of the surface of the first electrode is exposed in the pixel opening.

[0158] In the display panel obtained based on the above manufacturing method, the light-emitting unit 50 includes three types, namely, the first light-emitting unit 501, the second light-emitting unit 502 and the third light-emitting unit 503. The first light-emitting unit 501 includes a first electrode, a first light-emitting structure and a second electrode. The second light-emitting unit 502 includes a first electrode, a second light-emitting structure and a second electrode. The third light-emitting unit 503 includes a first electrode, a third light-emitting structure and a third electrode. The isolation opening includes a first isolation opening, a second isolation opening and a third isolation opening. The first light-emitting unit 501 is arranged corresponding to the first isolation opening, the second light-emitting unit 502 is arranged corresponding to the second isolation opening, and the third light-emitting unit 503 is arranged corresponding to the third isolation opening. Each light-emitting unit 50 corresponds to an inorganic packaging structure 40.

[0159] The surface of the second structure body facing away from the substrate 10 includes a first region 201 and a second region 202, and the second region 202 surrounds the first region 201; therefore, a first light-emitting structure, a second electrode 53, and an inorganic encapsulation structure 40 corresponding to the first isolation opening are sequentially formed on the side of the substrate 10 facing the partition structure 20, which may include:

[0160] A first light-emitting material layer, a conductive material layer, and an inorganic encapsulation material layer corresponding to the first light-emitting material layer are sequentially formed on a side of the substrate 10 facing the partition structure 20;

[0161] The inorganic packaging material layer, the conductive material layer and the first light-emitting material layer are etched in sequence to obtain the inorganic packaging structure 40, the second electrode 53 and the first light-emitting structure corresponding to the first isolation opening, wherein part of the second electrode 53, part of the first light-emitting structure and part of the inorganic packaging structure 40 are sequentially stacked in the second area 202, and the first area 201 is not covered by the second electrode 53, part of the first light-emitting structure and part of the inorganic packaging structure 40.

[0162] In the display panel obtained by the manufacturing method, on the surface of the partition structure 20 on the side away from the substrate 10, part of the light-emitting unit 50 and the inorganic encapsulation structure 40 cover the second area 202, and the light-emitting unit 50 and the inorganic encapsulation structure 40 corresponding to the second area 202 together enclose a gap, and the gap can expose the first area 201. By exposing the first area 201, when the partition structure 20 is subjected to a high-temperature baking process, since the partition structure 20 includes an organic material, water molecules or gas in the partition structure 20 can overflow from the first area 201, thereby improving the structural stability of the partition structure 20.

[0163] It should be understood that the first light emitting structure is formed by a first light emitting material layer, the second electrode is formed by a conductive material layer, and the inorganic encapsulation structure is formed by an inorganic encapsulation material layer.

[0164] Regarding the sequential formation of the second light-emitting structure, the second electrode 53, and the inorganic encapsulation structure 40 corresponding to the second isolation opening on the side of the substrate 10 facing the partition structure 20, reference may be made to the above-mentioned method of forming the first light-emitting structure, the second electrode 53, and the inorganic encapsulation structure 40 corresponding to the first isolation opening. Regarding the sequential formation of the third light-emitting structure, the second electrode 53, and the inorganic encapsulation structure 40 corresponding to the third isolation opening on the side of the substrate 10 facing the partition structure 20, reference may also be made to the above-mentioned method of forming the first light-emitting structure, the second electrode 53, and the inorganic encapsulation structure 40 corresponding to the first isolation opening.

[0165] The present application also provides a display device, which includes the display panel described above, or includes a display panel manufactured by the manufacturing method described above. Based on the beneficial effects of the display panel described above, the display device has the advantage of high production yield.

[0166] The display device can be applied to smart wearable devices (such as smart bracelets and smart watches), and can also be applied to smart phones, tablet computers, monitors and other devices. Other essential components of the display device should be understood by ordinary technicians in the field, and will not be repeated here, nor should they be used as limitations of the present invention.

[0167] It should be noted that, unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present application. The terms used herein in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0168] It should be understood that although the specific embodiments of the present application are described in detail in conjunction with the accompanying drawings, it should not be understood as limiting the scope of protection of the present application. Within the scope described in the claims, various modifications and variations that can be made by those skilled in the art without creative work still fall within the scope of protection of the present application. Although this specification is described according to various embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0169] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises: base(10); A partition structure (20) is arranged on one side of the substrate (10), the partition structure (20) encloses a plurality of partition openings, the partition structure (20) comprises a first structure (21), a second structure (22) and a covering portion (23), the second structure (22) is located on a side of the first structure (21) away from the substrate (10), the orthographic projection of the first structure (21) on the substrate (10) is located within the orthographic projection range of the second structure (22) on the substrate (10), the covering portion (23) is arranged on a side surface of the first structure (21) facing the partition openings, the material of the first structure (21) comprises an organic material, and the material of the covering portion (23) comprises a conductive material; a plurality of light-emitting units (50), the light-emitting units (50) and the partition opening being arranged correspondingly, at least part of the light-emitting units (50) being located in the partition opening, and the light-emitting units (50) being conductively connected to an end of the covering portion (23) close to the substrate (10); A plurality of inorganic packaging structures (40) are arranged on a side of the corresponding light-emitting unit (50) away from the substrate (10), and the inorganic packaging structure (40) and the covering portion (23) are overlapped.

2. The display panel according to claim 1, characterized in that: The partition structure (20) further comprises a connecting portion (24), the connecting portion (24) being located on a surface of the first structure (21) facing away from the substrate (10), and two sides of the connecting portion (24) being electrically connected to two covering portions (23) corresponding to two adjacent partition openings; Preferably, the material of the covering portion (23) is the same as the material of the connecting portion (24); Preferably, the thickness of the covering portion (23) is greater than 300 nanometers; Preferably, the material of the covering portion (23) includes aluminum, copper, or silver. Preferably, the inorganic packaging structure (40) and an end of the covering portion (23) close to the substrate (10) are overlapped.

3. The display panel according to claim 2, characterized in that: The connecting portion (24) covers a partial area of ​​the surface of the first structure (21) on a side away from the substrate (10), and the second structure (22) is stacked on the first structure (21) and the surface of the connecting portion (24) on a side away from the substrate (10), and preferably, the material of the second structure (22) includes an organic material; Preferably, the material of the first structure (21) is different from the material of the second structure (22); Preferably, the covering portion (23) is not provided on the surface of the second structure (22) facing the partition opening.

4. The display panel according to claim 3, characterized in that: The orthographic projection of the lower surface of the second structure (22) on the substrate (10) is located and coincides with the orthographic projection of the upper surface of the second structure (22) on the substrate (10), and the second structure (22) comprises an arcuate surface, the arcuate surface is concave toward the second structure (22), and one side of the arcuate surface is connected to the side edge of the first structure (21); Preferably, the orthographic projection of the upper surface of the first structure (21) on the substrate (10) is located within the orthographic projection range of the lower surface of the first structure (21) on the substrate (10), and an acute angle is formed between the side surface of the first structure (21) and the thickness direction of the display panel; Preferably, the inorganic packaging structure (40) and the second structure (22) have side surfaces facing the isolation opening overlapped.

5. The display panel according to claim 3, characterized in that: The surface of the second structure (22) facing away from the substrate (10) comprises a first region (201) and a second region (202), wherein the second region (202) surrounds the first region (201), wherein: A portion of the light-emitting unit (50) and a portion of the inorganic encapsulation structure (40) are sequentially stacked in the second region (202), and the first region (201) is not covered by the light-emitting unit (50) and the inorganic encapsulation structure (40); Preferably, the inorganic encapsulation structure (40) is continuously distributed between the second regions (202) of adjacent partition structures (20).

6. The display panel according to claim 5, characterized in that: The display panel further comprises a first encapsulation layer (61), wherein the first encapsulation layer (61) is arranged on a side of the inorganic encapsulation structure (40) away from the substrate (10); Preferably, the material of the first encapsulation layer (61) comprises an organic material; Preferably, the first encapsulation layer (61) is stacked on the first region (201) of the second structure (22).

7. The display panel according to claim 6, characterized in that: The display panel further comprises a second encapsulation layer (62), wherein the second encapsulation layer (62) is arranged on a side of the first encapsulation layer (61) away from the substrate (10); Preferably, the material of the second encapsulation layer (62) includes an inorganic material.

8. The display panel according to claim 1, characterized in that: The display panel further comprises a pixel defining layer (30), the pixel defining layer (30) being arranged between the substrate (10) and the partition structure (20), the pixel defining layer (30) comprising a plurality of pixel openings, the pixel openings corresponding to the partition openings, the pixel openings being connected to the corresponding partition openings, the orthographic projections of the pixel openings on the substrate (10) being located within the orthographic projection range of the corresponding partition openings on the substrate (10), and part of the light emitting units (50) being located in the pixel openings; Wherein, an end of the covering portion (23) close to the substrate (10) is connected to a surface of a side of the pixel defining layer (30) facing away from the substrate (10); Preferably, the material of the pixel defining layer (30) comprises an inorganic material.

9. The display panel according to claim 8, characterized in that: The light-emitting unit (50) comprises a first electrode (51), a light-emitting structure (52) and a second electrode (53) which are sequentially stacked in a direction away from the substrate (10), the first electrode (51) being arranged between the substrate (10) and the pixel defining layer (30), a portion of the first electrode (51) being exposed in the corresponding pixel opening, and the light-emitting structure (52) being stacked on a surface of the first electrode (51) exposed in the pixel opening; Preferably, the second electrode (53) is conductively connected to an end of the covering portion (23) close to the substrate (10).

10. The display panel according to claim 9, characterized in that: The substrate (10) comprises a substrate (11) and a driving circuit layer (12); the driving circuit layer (12) is arranged between the pixel defining layer (30) and the substrate (11); the first electrode (51) is located on a side of the driving circuit layer (12) away from the substrate (11); and the first electrode (51) is electrically connected to a driving circuit in the driving circuit layer (12).

11. The display panel according to claim 1, characterized in that: The plurality of light-emitting units (50) include a first light-emitting unit (501), a second light-emitting unit (502) and a third light-emitting unit (503); the partition opening includes a first partition opening, a second partition opening and a third partition opening; the first light-emitting unit (501) is arranged corresponding to the first partition opening, the second light-emitting unit (502) is arranged corresponding to the second partition opening, and the third light-emitting unit (503) is arranged corresponding to the third partition opening; The first light-emitting unit (501) and the second light-emitting unit (502) emit different colors of light, the first light-emitting unit (501) and the third light-emitting unit (503) emit different colors of light, and the second light-emitting unit (502) and the third light-emitting unit (503) emit different colors of light.

12. A display panel, characterized in that: include: base(10); A partition structure (20) is arranged on one side of the substrate (10), the partition structure (20) encloses a plurality of partition openings, the partition structure (20) comprises a first structure (21), a second structure (22) and a covering portion (23), the second structure (22) is located on a side of the first structure (21) away from the substrate (10), the orthographic projection of the first structure (21) on the substrate (10) is located within the orthographic projection range of the second structure (22) on the substrate (10), the covering portion (23) is arranged on a side surface of the first structure (21) facing the partition openings, the material of the first structure (21) comprises an organic material, and the material of the covering portion (23) comprises a conductive material; a plurality of light-emitting units (50), the light-emitting units (50) and the partition opening being arranged correspondingly, at least part of the light-emitting units (50) being located in the partition opening, and the light-emitting units (50) being conductively connected to an end of the covering portion (23) close to the substrate (10); A plurality of inorganic packaging structures (40) are arranged on a side of the corresponding light-emitting unit (50) away from the substrate (10), and the inorganic packaging structure (40) and the covering portion (23) are overlapped; a pixel defining layer (30), the pixel defining layer (30) being arranged between the substrate (10) and the partition structure (20), the pixel defining layer (30) comprising a plurality of pixel openings, the pixel openings corresponding to the partition openings, the pixel openings being connected to the corresponding partition openings, the orthographic projections of the pixel openings on the substrate (10) being located within the orthographic projection range of the corresponding partition openings on the substrate (10), and part of the light emitting units (50) being located in the pixel openings; Wherein, an end of the covering portion (23) close to the substrate (10) is connected to a surface of a side of the pixel defining layer (30) facing away from the substrate (10).

13. The display panel according to claim 12, characterized in that: The partition structure (20) further comprises a connecting portion (24), the connecting portion (24) being located on a surface of the first structure (21) facing away from the substrate (10), and two sides of the connecting portion (24) being electrically connected to two covering portions (23) corresponding to two adjacent partition openings; Preferably, the thickness of the covering portion (23) is greater than 300 nanometers; Preferably, the material of the covering portion (23) includes aluminum, copper, or silver; Preferably, the inorganic packaging structure (40) and an end of the covering portion (23) close to the substrate (10) are overlapped.

14. The display panel according to claim 13, characterized in that: The connecting portion (24) covers a partial area of ​​the surface of the first structure (21) on a side away from the substrate (10), and the second structure (22) is superimposed on the surfaces of the first structure (21) and the connecting portion (24) on a side away from the substrate (10); Preferably, the material of the second structure (22) comprises an organic material; Preferably, the material of the first structure (21) and the material of the second structure (22) are different; Preferably, the covering portion (23) is not provided on the surface of the second structure (22) facing the partition opening; Preferably, the orthographic projection of the lower surface of the second structure (22) on the substrate (10) coincides with the orthographic projection of the upper surface of the second structure (22) on the substrate (10), and the second structure (22) comprises an arcuate surface, the arcuate surface is concave toward the second structure (22), and one side of the arcuate surface is connected to the side edge of the first structure (21); Preferably, the orthographic projection of the upper surface of the first structure (21) on the substrate (10) is located within the orthographic projection range of the lower surface of the first structure (21) on the substrate (10), and an acute angle is formed between the side surface of the first structure (21) and the thickness direction of the display panel; Preferably, the inorganic packaging structure (40) overlaps with the side surface of the first structure (21) facing the partition opening, and overlaps with the side surface of the second structure (22) facing the partition opening.

15. The display panel according to claim 12, characterized in that: The surface of the second structure (22) facing away from the substrate (10) comprises a first region (201) and a second region (202), wherein the second region (202) surrounds the first region (201), wherein: A portion of the light-emitting unit (50) and a portion of the inorganic encapsulation structure (40) are sequentially stacked in the second region (202), and the first region (201) is not covered by the light-emitting unit (50) and the inorganic encapsulation structure (40); Preferably, the inorganic encapsulation structure (40) is continuously distributed between the second regions (202) of adjacent partition structures (20); Preferably, the display panel further comprises a first encapsulation layer (61) and a second encapsulation layer (62), wherein the first encapsulation layer (61) is arranged on a side of the inorganic encapsulation structure (40) away from the substrate (10), and the second encapsulation layer (62) is arranged on a side of the first encapsulation layer (61) away from the substrate (10); Preferably, the material of the first encapsulation layer (61) includes an organic material, and the material of the second encapsulation layer (62) includes an inorganic material; Preferably, the first encapsulation layer (61) is stacked on the first region (201) of the second structure (22).

16. A method for manufacturing a display panel, characterized in that: include: A partition structure (20) is formed on one side of the substrate (10), the partition structure (20) encloses a plurality of partition openings, the partition structure (20) comprises a first structure (21), a second structure (22) and a covering portion (23), the covering portion (23) is arranged on a side surface of the first structure (21) facing the partition openings, the material of the first structure (21) comprises an organic material, and the material of the covering portion (23) comprises a conductive material; A light-emitting unit (50) and an inorganic packaging structure (40) are sequentially formed on a side of the substrate (10) facing the partition structure (20); the light-emitting unit (50) and the partition opening are arranged correspondingly, at least a portion of the light-emitting unit (50) is located in the partition opening, the light-emitting unit (50) and an end of the covering portion (23) close to the substrate (10) are conductively connected, the inorganic packaging structure (40) is arranged on a side of the light-emitting unit (50) facing away from the substrate (10), and the inorganic packaging structure (40) and the covering portion (23) are overlapped.

17. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 15, or a display panel manufactured by the method for manufacturing a display panel according to any one of claim 16.

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