Display panel and display terminal

Abstract

The invention relates to a display panel and a display terminal. The display panel comprises a substrate, an anode, a luminescent material layer, a pixel definition layer and a cathode, the light-emitting material layer comprises a hole function layer and a light-emitting function layer, and the hole function layer is arranged on the side, away from the substrate, of the anode; the pixel definition layer is arranged on the side, away from the substrate, of the hole function layer, a plurality of pixel openings are formed in the pixel definition layer, and a light-emitting function layer is arranged in each pixel opening and makes contact with the hole function layer in the corresponding pixel opening; the cathode is arranged on one side, far away from the substrate, of the pixel definition layer and the light-emitting function layer. The hole function layer is arranged on the side, close to the substrate, of the pixel definition layer, and the cathode is arranged on the side, away from the substrate, of the pixel definition layer, so that the hole function layer is separated from the cathode through the pixel definition layer, and short circuit between the hole function layer and the cathode is avoided; the light-emitting material layer is arranged in the pixel opening of the pixel definition layer and can be in contact with the hole function layer and the cathode, and light emitting of the light-emitting material layer is not affected.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display terminal. Background Art

[0002] In the related art, a fine metal mask (FMM) is used to pattern sub-pixels, but the production of fine metal masks is complex and costly. Photolithography can pattern sub-pixels by exposing and developing the light-emitting material layer, thus eliminating the need for a fine metal mask and reducing the production cost of the display panel.

[0003] The light-emitting material layer includes a hole functional layer, a light-emitting functional layer, etc. The photolithography technology can realize the patterning of the light-emitting functional layer, but it is difficult to realize the patterning of the hole functional layer. In the related technology, in order to avoid increasing the difficulty of the process, the hole functional layer is formed as a whole layer, but after the hole functional layer is formed as a whole layer, it will short-circuit with the cathode and other film layers, affecting the normal display of the sub-pixel. Summary of the invention

[0004] The embodiments of the present application provide a display panel and a display terminal, which improve the display panel using photolithography technology. In order to avoid increasing the difficulty of the process, the hole functional layer is formed as a whole layer. However, after the hole functional layer is formed as a whole layer, it will short-circuit with the cathode and other film layers, affecting the normal display of sub-pixels. Technical problem.

[0005] In order to achieve the above object, according to a first aspect of the present application, a display panel is provided, comprising:

[0006] substrate;

[0007] A plurality of anodes are disposed on one side of the substrate;

[0008] a light-emitting material layer, comprising a hole function layer and a light-emitting function layer, wherein the hole function layer is disposed on a side of the anode away from the substrate;

[0009] A pixel definition layer is arranged on a side of the hole function layer away from the substrate, and a plurality of pixel openings are opened on the pixel definition layer. The light-emitting function layer is arranged in the pixel openings and the light-emitting function layer contacts the hole function layer in the pixel openings.

[0010] The cathode is arranged on a side of the pixel definition layer and the light emitting function layer away from the substrate.

[0011] Optionally, the hole functional layer includes a hole injection layer and a hole transport layer, the hole transport layer is arranged on a side of the hole injection layer away from the substrate, and the hole injection layer and the hole transport layer are arranged in an even layer.

[0012] Optionally, one of the anodes is arranged corresponding to one of the pixel openings, and the anode is arranged in contact with the hole functional layer.

[0013] Optionally, the material of the hole functional layer is a transparent material, and the reflectivity of the anode is greater than the reflectivity of the hole functional layer.

[0014] Optionally, the pattern of the hole function layer is the same as the pattern of the anode.

[0015] Optionally, the light-emitting functional layer includes a first unit, a second unit and a third unit, the first unit, the second unit and the third unit are configured to have different light-emitting colors, and the first unit, the second unit and the third unit are respectively arranged corresponding to one of the pixel openings;

[0016] The thickness of the hole functional layer corresponding to at least two of the first unit, the second unit and the third unit is different.

[0017] Optionally, the luminous color of the first unit is red, the luminous color of the second unit is green, and the luminous color of the third unit is blue;

[0018] The thickness of the hole functional layer corresponding to the first unit is greater than the thickness of the hole functional layer corresponding to the second unit, and the thickness of the hole functional layer corresponding to the second unit is greater than the thickness of the hole functional layer corresponding to the third unit.

[0019] Optionally, a first groove is provided on a surface of the hole functional layer corresponding to the second unit and facing away from the substrate, and a second groove is provided on a surface of the hole functional layer corresponding to the third unit and facing away from the substrate;

[0020] Wherein, the depth of the second groove is greater than the depth of the first groove.

[0021] Optionally, the pixel definition layer includes a plurality of retaining walls, and a plurality of adjacent retaining walls define the pixel opening;

[0022] The first unit, the second unit and the third unit all extend out of the pixel opening and cover a portion of the surface of the retaining wall away from the substrate, and adjacent materials of the light-emitting functional layers of different colors are overlapped on the retaining wall.

[0023] According to a second aspect of the present application, a display terminal is provided, comprising the above-mentioned display panel.

[0024] In the display panel of the embodiment of the present application, the hole function layer is arranged on the side of the pixel definition layer close to the substrate, and the cathode is arranged on the side of the pixel definition layer away from the substrate, so that the hole function layer and the cathode are separated by the pixel definition layer to avoid a short circuit between the hole function layer and the cathode; the light-emitting material layer is arranged in the pixel opening of the pixel definition layer, and can contact the hole function layer and the cathode, so as not to affect the light emission of the light-emitting material layer.

[0025] Other features and advantages of the present application will be described in detail in the subsequent specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0027] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same figure numbers represent the same parts in the following description.

[0028] Figure 1 is a schematic diagram of a top view structure of a display panel provided in an exemplary embodiment of the present disclosure;

[0029] Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure at CC in FIG.

[0030] Figure 3 yes Figure 2 A schematic diagram of a local structure enlargement structure;

[0031] Figure 4 It is a schematic diagram of the principle of realizing the light-emitting functional layer by photolithography technology;

[0032] FIG. 5A to FIG. 5F is a process flow chart of a display panel provided in an exemplary embodiment of the present disclosure;

[0033] Figure 6 It is a schematic structural diagram of a display terminal provided in an exemplary embodiment of the present disclosure.

[0034] Description of reference numerals:

[0035] Display panel 1, display area AA, non-display area NA, sub-pixel 11;

[0036] substrate 10;

[0037] Anode 20;

[0038] Light-emitting material layer 30, hole functional layer 31, first groove 31a, second groove 31b, first film layer 3101, second film layer 3102, third film layer 3103, hole injection layer 311, hole transport layer 312, light-emitting functional layer 32, first unit 321, second unit 322, third unit 323, electronic functional layer 33;

[0039] cathode 40;

[0040] Pixel definition layer 50;

[0041] Array layer 60, thin film transistor 61;

[0042] Encapsulation layer 70;

[0043] The thickness d1 of the hole functional layer 31 corresponding to the first unit 321, the thickness d2 of the hole functional layer 31 corresponding to the second unit 322, and the thickness d3 of the hole functional layer 31 corresponding to the third unit 323;

[0044] Display terminal 2, terminal body 3. DETAILED DESCRIPTION

[0045] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0046] In order to achieve the above object, according to the first aspect of the present application, Figure 1 to Figure 2 As shown, a display panel 1 is provided, including a substrate 10, multiple anodes 20, a light-emitting material layer 30, a pixel definition layer 50 and a cathode 40, wherein the anode 20 is arranged on one side of the substrate 10; the light-emitting material layer 30 includes a hole function layer 31 and a light-emitting function layer 32, and the hole function layer 31 is arranged on the side of the anode 20 away from the substrate 10; the pixel definition layer 50 is arranged on the side of the hole function layer 31 away from the substrate 10, and multiple pixel openings are opened on the pixel definition layer 50, and the light-emitting function layer 32 is arranged in the pixel opening and the light-emitting function layer 32 is in contact with the hole function layer 31 in the pixel opening; the cathode 40 is arranged on the side of the pixel definition layer 50 and the light-emitting function layer 32 away from the substrate 10.

[0047] In some embodiments, the display panel 1 may be an OLED panel or the like.

[0048] like Figure 1As shown, the display panel 1 includes a display area AA and a non-display area NA arranged outside the display area AA. The display area AA may be provided with a plurality of sub-pixels 11, and the sub-pixels 11 may include red sub-pixels, green sub-pixels, and blue sub-pixels, so as to achieve color display. The non-display area NA may be provided with a driving circuit, such as a gate driving circuit, etc., and the driving circuit may provide a driving signal for the sub-pixel 11.

[0049] In some embodiments, the substrate 10 may be a rigid substrate or a flexible substrate. The material of the rigid substrate may be a glass substrate, a quartz substrate or a silicon wafer. The material of the flexible substrate may be one of colorless polyimide (PI), polycarbonate (PC), polynorbornene (PNB) and polyethylene terephthalate (PET).

[0050] In some embodiments, the material of the anode 20 may be a metal or metal oxide material, such as a stack of one or more of indium tin oxide, indium zinc oxide, silver, and the like.

[0051] In some embodiments, the material of cathode 40 may be an alloy of one or more of silver, aluminum, magnesium, etc.

[0052] In some embodiments, the cathode 40 may be provided as a whole layer, thereby simplifying the manufacturing process of the cathode 40. The cathode 40 may be formed by physical vapor deposition (PVD).

[0053] In some embodiments, Figure 2 As shown, the light-emitting material layer 30 may further include an electronic functional layer 33. The electronic functional layer 33 may include an electron transport layer, which is located between the light-emitting functional layer 32 and the cathode 40. The electron transport layer is used to effectively transport electrons from the cathode 40 to the light-emitting functional layer 32 to ensure that the electrons can be quickly transported to the light-emitting functional layer 32 and recombine with holes to emit photons.

[0054] In some embodiments, the electronic functional layer 33 may further include an electron injection layer. The electron injection layer is located between the electron transport layer and the cathode 40. The electron injection layer is used to reduce the energy barrier for electrons to be injected from the cathode 40 into the light-emitting material layer 30, thereby improving the electron injection efficiency. The electron injection layer can take into account good interface contact and energy level matching with the cathode 40 and the electron transport layer, ensuring that electrons can be easily injected into the light-emitting functional layer 32 to participate in the light-emitting process.

[0055] In some embodiments, the light-emitting functional layer 32 may be a quantum dot light-emitting material, etc. The quantum dot light-emitting material may be patterned by photolithography technology.

[0056] Specifically, Figure 4As shown in (a) of FIG. 1 , a substrate 10 is provided. As shown in (b), a luminescent material is coated on the substrate 10, and the luminescent material is exposed and developed. As shown in (c), the luminescent material is patterned to form a luminescent functional layer 32. The luminescent material may include a photosensitive ligand, and exposing the luminescent material may change the solubility of the luminescent material. For example, the luminescent material in the unexposed area has a higher solubility and is removed, while the luminescent material in the exposed area has a lower solubility and is retained, thereby patterning the luminescent material to form a luminescent functional layer 32.

[0057] It should be noted that it is difficult to pattern the hole functional layer 31 by photolithography technology.

[0058] like Figure 2 As shown, the pixel definition layer 50 is disposed on the side of the hole function layer 31 away from the substrate 10. The pixel definition layer 50 can cover the area of ​​the hole function layer 31 except the pixel opening. That is to say, the pixel definition layer 50 can be disposed as a whole layer, and only the pixel opening exposes the hole function layer 31. One pixel opening corresponds to one sub-pixel 11.

[0059] In some embodiments, the material of the pixel definition layer 50 is an inorganic material or an organic material. The inorganic material may be silicon oxide, silicon nitride, silicon oxynitride, etc. The organic material may be a resin, etc.

[0060] like Figure 2 As shown, in the area within the pixel opening, the anode 20 injects holes, the hole function layer 31 is used to transfer the holes to the light-emitting function layer 32, the cathode 40 injects electrons, and the holes and electrons recombine in the light-emitting function layer 32 to emit light. In the area outside the pixel opening, the hole function layer 31 and the cathode 40 are separated by the pixel definition layer 50 and the light-emitting function layer 32, so as to avoid the hole function layer 31 and the cathode 40 from contacting and short-circuiting.

[0061] like Figure 2 As shown, the display panel 1 further includes an array layer 60 disposed between the substrate 10 and the anode 20, and the array layer 60 includes a plurality of thin film transistors 61. The thin film transistor 61 includes a source and a drain, and the drain can be electrically connected to the anode 20 for inputting a driving signal to the anode 20. The array layer 60 further includes a signal wiring, which is electrically connected to the cathode 40 for inputting a driving signal to the cathode 40. The light-emitting functional layer 32 is located between the anode 20 and the cathode 40, and emits light under the action of the driving signals of the anode 20 and the cathode 40, thereby realizing display.

[0062] In some embodiments, Figure 2As shown, the display panel 1 further includes an encapsulation layer 70. The encapsulation layer 70 is disposed on the side of the cathode 40 away from the substrate 10, and the encapsulation layer 70 may be formed by one or more organic layers and one or more inorganic layers stacked alternately. For example, the organic layer may be a single layer or multiple layers formed of any one of polyethylene terephthalate, polyimide, polycarbonate, epoxy resin, polyethylene, and polyacrylate. The inorganic layer may be a single layer or multiple layers of metal oxide or metal nitride, for example, silicon nitride, aluminum oxide, silicon oxide, etc.

[0063] Alternatively, if Figure 2 As shown, the hole functional layer 31 includes a hole injection layer 311 and a hole transport layer 312 . The hole transport layer 312 is disposed on the side of the hole injection layer 311 away from the substrate 10 . The hole injection layer 311 and the hole transport layer 312 are disposed in an even layer.

[0064] The hole injection layer 311 is used to reduce the energy barrier of injecting holes from the anode 20 into the light-emitting functional layer 32, so that holes can be more effectively transferred from the anode 20 to the hole transport layer 312, thereby improving the hole injection efficiency and thus improving the light-emitting efficiency and brightness of the pixel.

[0065] The hole transport layer 312 is used to effectively transport holes injected from the anode 20 to the light-emitting functional layer 32 , ensuring that the holes are effectively recombined with electrons in the light-emitting functional layer 32 to generate photons.

[0066] Alternatively, if Figure 2 As shown, one anode 20 is arranged corresponding to one pixel opening, and the anode 20 is arranged in contact with the hole function layer 31. One anode 20 corresponds to one sub-pixel 11. The sub-pixel 11 includes a stack of the anode 20, the light-emitting material layer 30 and the cathode 40.

[0067] Optionally, the material of the hole functional layer 31 is a transparent material, and the reflectivity of the anode 20 is greater than the reflectivity of the hole functional layer 31 .

[0068] In some embodiments, the material of the hole functional layer 31 is a transparent conductive material, such as ITO (indium tin oxide), IZO (indium zinc oxide), IZTO (indium zinc tin oxide), IAZO (indium aluminum zinc oxide), IGZO (indium gallium zinc oxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), IGZTO (indium gallium zinc tin oxide), IGO (indium gallium oxide), InO (indium oxide), etc., or a stack of one or more thereof.

[0069] When the material of the hole functional layer 31 is a transparent conductive material, the light emitted from the light-emitting functional layer 32 can pass through the hole functional layer 31 to be incident on the anode 20 and reflected by the anode 20. The light reflected by the anode 20 can be emitted from the light emitting direction, thereby improving the light emitting efficiency.

[0070] In some embodiments, the anode 20 is a stack of indium tin oxide, silver, and indium tin oxide. Silver has a high reflectivity and can reflect the light emitted from the light-emitting functional layer 32 toward the light-emitting direction of the display panel 1, thereby improving the light-emitting efficiency of the display panel 1. The light-emitting direction of the display panel 1 is the direction along the substrate 10 pointing to the light-emitting material layer 30.

[0071] Optionally, the pattern of the hole functional layer 31 is the same as the pattern of the anode 20. That is to say, the hole functional layer 31 can be formed by the same patterning process as the anode 20, so that the hole functional layer 31 can be patterned without adding a mask. Through the above arrangement, leakage current caused by the connection of the hole functional layer 31 between two adjacent sub-pixels 11 can be avoided, and adjacent sub-pixels 11 can be avoided from being secretly lit due to the presence of leakage current. When the hole functional layer 31 and the anode 20 are formed by the same patterning process, the patterning process includes processes such as coating photoresist, exposure and development, and etching.

[0072] It should be noted that transparent conductive materials are difficult to form by photolithography, so the hole function layer 31 is difficult to form by photolithography like the pixel light emitting function layer 32. If a single mask is used to form the hole function layer 31, the production cost will increase.

[0073] Alternatively, if Figure 2 As shown, the light-emitting functional layer 32 includes a first unit 321, a second unit 322 and a third unit 323, and the first unit 321, the second unit 322 and the third unit 323 are configured to have different light-emitting colors, and the first unit 321, the second unit 322 and the third unit 323 correspond to a pixel opening setting respectively; wherein, the thickness of the hole functional layer 31 corresponding to at least two of the first unit 321, the second unit 322 and the third unit 323 is different.

[0074] The film layer between the anode 20 and the cathode 40 will form an optical microcavity, in which light will interfere. For example, the light emitted from the light-emitting functional layer 32 is divided into two parts, one part is emitted in the light-emitting direction; the other part is incident on the anode 20 in the opposite direction of the light-emitting direction, and is emitted from the light-emitting direction after being reflected by the anode 20. The two parts of light will interfere, and when the peaks and troughs of the interfering light are superimposed, the light will be weakened; when the wavelengths of the interfering light are superimposed, resonance will be formed, and the light intensity will increase. Light of different colors has different wavelengths, and therefore, the length of the optical microcavity required for the resonance of the light-emitting functional layers 32 of different colors is also different. By making the thickness of the hole functional layer 31 corresponding to the light-emitting functional layers 32 of different colors different, the length of the optical microcavity can be adjusted, so that the light in the sub-pixels 11 of each color is strengthened after interference, forming resonance, increasing the light intensity, and improving the display brightness.

[0075] Alternatively, if Figure 3 As shown, the luminous color of the first unit 321 is red, the luminous color of the second unit 322 is green, and the luminous color of the third unit 323 is blue; wherein, the thickness d1 of the hole functional layer 31 corresponding to the first unit 321 is greater than the thickness d2 of the hole functional layer 31 corresponding to the second unit 322, and the thickness d2 of the hole functional layer 31 corresponding to the second unit 322 is greater than the thickness d3 of the hole functional layer 31 corresponding to the third unit 323.

[0076] In some embodiments, the wavelength of red light ranges from 620 nanometers to 750 nanometers, the wavelength of green light ranges from 495 nanometers to 570 nanometers, and the wavelength of blue light ranges from 450 nanometers to 495 nanometers. The wavelength of red light is greater than that of green light, and the wavelength of green light is greater than that of blue light.

[0077] By making the thickness d1 of the hole functional layer 31 corresponding to the first unit 321 greater than the thickness d2 of the hole functional layer 31 corresponding to the second unit 322, and the thickness d2 of the hole functional layer 31 corresponding to the second unit 322 greater than the thickness d3 of the hole functional layer 31 corresponding to the third unit 323, the length of the optical microcavity can be adjusted, so that the light in the sub-pixels 11 of each color is enhanced after interference, forming resonance, and increasing the light intensity.

[0078] Alternatively, if Figure 3 As shown, a first groove 31a is provided on the surface of the hole functional layer 31 corresponding to the second unit 322 and facing away from the substrate 10, and a second groove 31b is provided on the surface of the hole functional layer 31 corresponding to the third unit 323 and facing away from the substrate 10; wherein the depth of the second groove 31b is greater than the depth of the first groove 31a.

[0079] like Figure 3 As shown, the first groove 31a is recessed toward the side close to the substrate 10 relative to the hole functional layer 31 corresponding to the first unit 321, and the second groove 31b is recessed toward the side close to the substrate 10 relative to the hole functional layer 31 corresponding to the second unit 322, so that the thickness d1 of the hole functional layer 31 corresponding to the first unit 321 is greater than the thickness d2 of the hole functional layer 31 corresponding to the second unit 322, and the thickness d2 of the hole functional layer 31 corresponding to the second unit 322 is greater than the thickness d3 of the hole functional layer 31 corresponding to the third unit 323.

[0080] In some embodiments, the thickness of the hole function layer 31 can be achieved by multiple stacking of film formations and multiple local etchings.

[0081] Specifically, a first film layer 3101 is formed first. A second film layer 3102 is formed on the first film layer 3101, and then the second film layer 3102 corresponding to the third unit 323 is partially etched to form a groove, and the depth of the groove may be less than or equal to the thickness of the second film layer 3102. A third film layer 3103 is formed on the second film layer 3102, and the third film layer 3103 corresponding to the second unit 322 and the third film layer 3103 corresponding to the third unit 323 are partially etched to form another groove, and the depth of the groove may be less than or equal to the thickness of the second film layer 3102.

[0082] Since the third film layer 3103 corresponding to the second unit 322 forms only one groove, the depth of the groove is the depth of the first groove 31a. The second film layer 3102 and the third film layer 3103 corresponding to the third unit 323 both form grooves, so the depth of the second groove 31b is the depth of the groove of the second film layer 3102 plus the depth of the groove of the third film layer 3103. Through the above arrangement, the depth of the second groove 31b can be greater than the depth of the first groove 31a.

[0083] It should be noted that when the hole functional layer 31 includes only the hole injection layer 311, different thicknesses can be formed by partial etching of the first film layer 3101, the second film layer 3102, and the third film layer 3103. When the hole functional layer 31 includes both the hole injection layer 311 and the hole transport layer 312, one of the hole injection layer 311 and the hole transport layer 312 can be formed into different thicknesses by partial etching of the first film layer 3101, the second film layer 3102, and the third film layer 3103, and the other can be set as a whole layer. However, it is not limited to this, as long as the hole functional layer 31 is finally formed into different thicknesses.

[0084] Alternatively, if Figure 2 As shown, the pixel definition layer 50 includes a plurality of retaining walls, and adjacent plurality of retaining walls define a pixel opening; wherein the first unit 321, the second unit 322 and the third unit 323 all extend out of the pixel opening and cover a portion of the surface of the retaining wall facing away from the substrate 10, and the materials of adjacent light-emitting functional layers 32 of different colors are overlapped on the retaining walls.

[0085] The pixel definition layer 50 includes a plurality of pixel openings, and the barrier walls are arranged around the pixel openings. The pixel openings can accommodate the light emitting function layer 32 .

[0086] In the photolithography technology, the light-emitting functional layer material of the first color can be formed in an entire layer, and the light-emitting functional layer material of the first color is photolithographically processed, the first unit 321 is retained, and the light-emitting functional layer material of other regions is removed. Then, the light-emitting functional layer material of the second color is formed in an entire layer, and the light-emitting functional layer material of the second color is photolithographically processed, the second unit 322 is retained, and the light-emitting functional layer material of other regions is removed. Then, the light-emitting functional layer material of the third color is formed in an entire layer, and the light-emitting functional layer material of the third color is photolithographically processed, the third unit 323 is retained, and the light-emitting functional layer material of other regions is removed.

[0087] like Figure 2 As shown, by making the first unit 321 cover the upper surface of the retaining wall, the area of ​​the first unit 321 can be increased, and the precision requirement for processing the first unit 321 can be reduced. Similarly, the precision requirement for processing the second unit 322 and the third unit 323 can be reduced. At the same time, the distance between two adjacent light-emitting functional layers 32 can also be reduced to achieve a higher resolution.

[0088] It should be noted that, since the lower surface of the first unit 321 overlapping the retaining wall is not in direct contact with the hole functional layer 31, that is, the lower surface of the first unit 321 overlapping the retaining wall is separated from the hole functional layer 31 by the retaining wall, the first unit 321 overlapping the retaining wall is not easy to be illuminated. Similarly, the second unit 322 and the third unit 323 overlapping the retaining wall are not easy to be illuminated.

[0089] In some embodiments, Figure 2 As shown, on the upper surface of a retaining wall, adjacent first units 321 and second units 322 are arranged overlappingly. That is, the first unit 321 on one side of the retaining wall extends to the upper surface of the retaining wall, and the second unit 322 on the other side of the retaining wall extends to the upper surface of the same retaining wall and partially overlaps with the first unit 321.

[0090] In some embodiments, Figure 2 As shown, on the upper surface of a retaining wall, adjacent second units 322 and third units 323 are arranged overlappingly. That is, the second unit 322 on one side of the retaining wall extends to the upper surface of the retaining wall, and the third unit 323 on the other side of the retaining wall extends to the upper surface of the same retaining wall and partially overlaps with the second unit 322.

[0091] In some embodiments, Figure 2 As shown, on the upper surface of a retaining wall, adjacent first units 321 and third units 323 are arranged overlappingly. That is, the first unit 321 on one side of the retaining wall extends to the upper surface of the retaining wall, and the third unit 323 on the other side of the retaining wall extends to the upper surface of the same retaining wall and partially overlaps with the first unit 321.

[0092] It should be noted that the stacking order of any two of the first unit 321, the second unit 322, and the third unit 323 on the retaining wall is determined by the process sequence. That is to say, if the first unit 321 is formed first, then the second unit 322 is formed, and finally the third unit 323 is formed. Then the second unit 322 on the retaining wall is located on the side of the first unit 321 away from the substrate 10; the third unit 323 on the retaining wall is located on the side of the second unit 322 away from the substrate 10; the third unit 323 on the retaining wall is located on the side of the first unit 321 away from the substrate 10. When the process sequence changes, the stacking order of any two of the first unit 321, the second unit 322, and the third unit 323 on the retaining wall also changes accordingly.

[0093] FIG. 5A to FIG. 5F is a process flow chart of a display panel 1 provided in an exemplary embodiment of the present disclosure. FIG. 5A to FIG. 5E The production process of this application is described.

[0094] like Figure 5A As shown, an anode 20 is formed on one side of a substrate 10 , a hole injection layer 311 is formed on the anode 20 , and a hole transport layer 312 is formed on the hole injection layer 311 .

[0095] The hole injection layer 311 and the hole transport layer 312 can be formed by physical vapor deposition (PVD).

[0096] like Figure 5B As shown, a pixel definition layer 50 is formed on the hole transport layer 312 , and the pixel definition layer 50 is provided with a plurality of pixel openings, and one pixel opening is provided corresponding to one anode 20 .

[0097] like Figure 5C As shown, first units 321 are formed in regions corresponding to some pixel openings. The first units 321 are formed using photolithography technology.

[0098] Specifically, the light-emitting functional layer material of the first color may be formed in an entire layer first, and the light-emitting functional layer material of the first color may be photolithographically processed to retain the first unit 321 and remove the light-emitting functional layer material of other regions.

[0099] like Figure 5D As shown, second units 322 are formed in areas corresponding to other pixel openings. The second units 322 are formed using photolithography technology.

[0100] Specifically, the entire layer is formed with a light-emitting functional layer material of the second color, the light-emitting functional layer material of the second color is photolithographically processed, the second unit 322 is retained, and the light-emitting functional layer material of other regions is removed.

[0101] like Figure 5E As shown, a third unit 323 is formed in the area corresponding to other pixel openings. The third unit 323 is formed by using photolithography technology.

[0102] Specifically, the light-emitting functional layer material of the third color is formed as a whole layer, the light-emitting functional layer material of the third color is photolithographically processed, the third unit 323 is retained, and the light-emitting functional layer material of other regions is removed.

[0103] like Fig. 5F As shown, an electron transport layer is formed on the light emitting functional layer 32, and a cathode 40 is formed on the electron transport layer.

[0104] Optionally, in some embodiments, Fig. 5F As shown, an encapsulation layer 70 may also be formed on the cathode 40 .

[0105] According to the second aspect of the present application, Figure 6 As shown, a display terminal 2 is provided, comprising the above-mentioned display panel 1.

[0106] In this embodiment, if Figure 6 As shown, the display terminal 2 includes a display panel 1 and a terminal body 3, and the display panel 1 and the terminal body 3 are combined into one body.

[0107] In this embodiment, the display terminal 2 can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc.

[0108] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0109] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0110] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0111] The above is only a preferred embodiment of the present application and does not constitute any form of limitation to the present application. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present application without departing from the content of the technical solution of the present application shall still fall within the scope of the technical solution of the present application.

Claims

1. A display panel, characterized in that: include: substrate; A plurality of anodes are disposed on one side of the substrate; a light-emitting material layer, comprising a hole function layer and a light-emitting function layer, wherein the hole function layer is disposed on a side of the anode away from the substrate; A pixel definition layer is arranged on a side of the hole function layer away from the substrate, and a plurality of pixel openings are opened on the pixel definition layer. The light-emitting function layer is arranged in the pixel openings and the light-emitting function layer contacts the hole function layer in the pixel openings. The cathode is arranged on a side of the pixel definition layer and the light emitting function layer away from the substrate.

2. The display panel according to claim 1, characterized in that: The hole functional layer includes a hole injection layer and a hole transport layer. The hole transport layer is arranged on a side of the hole injection layer away from the substrate. The hole injection layer and the hole transport layer are arranged in an even layer.

3. The display panel according to claim 1, characterized in that: An anode is arranged corresponding to one of the pixel openings, and the anode is arranged in contact with the hole function layer.

4. The display panel according to claim 3, characterized in that: The material of the hole functional layer is a transparent material, and the reflectivity of the anode is greater than the reflectivity of the hole functional layer.

5. The display panel according to claim 1, characterized in that: The pattern of the hole function layer is the same as that of the anode.

6. The display panel according to any one of claims 1 to 4, characterized in that: The light-emitting functional layer includes a first unit, a second unit and a third unit, wherein the first unit, the second unit and the third unit are configured to have different light-emitting colors, and the first unit, the second unit and the third unit are respectively arranged corresponding to one of the pixel openings; The thickness of the hole functional layer corresponding to at least two of the first unit, the second unit and the third unit is different.

7. The display panel according to claim 6, characterized in that: The light emitting color of the first unit is red, the light emitting color of the second unit is green, and the light emitting color of the third unit is blue; The thickness of the hole functional layer corresponding to the first unit is greater than the thickness of the hole functional layer corresponding to the second unit, and the thickness of the hole functional layer corresponding to the second unit is greater than the thickness of the hole functional layer corresponding to the third unit.

8. The display panel according to claim 7, characterized in that: A first groove is provided on a surface of the hole functional layer corresponding to the second unit and facing away from the substrate, and a second groove is provided on a surface of the hole functional layer corresponding to the third unit and facing away from the substrate; Wherein, the depth of the second groove is greater than the depth of the first groove.

9. The display panel according to claim 6, characterized in that: The pixel definition layer includes a plurality of retaining walls, and a plurality of adjacent retaining walls define the pixel opening; The first unit, the second unit and the third unit all extend out of the pixel opening and cover a portion of the surface of the retaining wall away from the substrate, and adjacent materials of the light-emitting functional layers of different colors are overlapped on the retaining wall.

10. A display terminal, characterized in that: A display panel comprising any one of claims 1 to 9.

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