Display panel and display terminal

Abstract

The invention relates to a display panel and a display terminal. The display panel comprises a substrate, an anode and a first pixel definition layer. The anode is arranged on one side of the substrate; the first pixel definition layer is arranged on the side, away from the substrate, of the anode, the first pixel definition layer is provided with a plurality of first openings, and the first openings are arranged corresponding to the anode; wherein the first pixel definition layer comprises a first edge part, the first edge part is overlapped with the anode, and the surface of the side, close to the substrate, of the first edge part and the surface of the side, away from the substrate, of the anode are arranged at intervals. In the manufacturing process of the display panel, a sacrificial layer is formed on the upper surface of an anode, the sacrificial layer is etched after a first pixel definition layer is manufactured, foreign matter such as glue remaining on the sacrificial layer can be taken away when the sacrificial layer is removed, and therefore short circuit of the anode and a cathode caused by the foreign matter is avoided; a gap is formed between a lower surface of the first edge portion of the first pixel definition layer and an upper surface of the anode.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display terminal. Background Art

[0002] OLED (Organic Light-Emitting Diode) display technology is a new type of display technology. It has gradually attracted people's attention with its unique advantages such as low power consumption, high saturation, fast response time and wide viewing angle, and occupies a certain position in the field of panel display technology.

[0003] The light-emitting unit of the OLED panel includes an anode, a light-emitting layer and a cathode stacked in sequence. During the manufacturing process, foreign matter such as glue remaining on the light-emitting unit will cause a short circuit between the anode and the cathode, resulting in the light-emitting unit failing to emit light normally and forming a dark spot. Summary of the invention

[0004] The embodiments of the present application provide a display panel and a display terminal to improve the technical problem that foreign matter such as glue remaining on the light-emitting unit of the display panel may cause a short circuit between the anode and the cathode, resulting in the light-emitting unit being unable to emit light normally and forming a dark spot.

[0005] In order to achieve the above object, according to a first aspect of the present application, a display panel is provided, comprising:

[0006] substrate;

[0007] an anode, disposed on one side of the substrate;

[0008] A first pixel definition layer is disposed on a side of the anode away from the substrate, the first pixel definition layer is provided with a plurality of first openings, and the first openings are disposed corresponding to the anode;

[0009] The first pixel definition layer includes a first edge portion, the first edge portion overlaps with the anode, and a surface of the first edge portion close to the substrate is spaced apart from a surface of the anode side away from the substrate.

[0010] Optionally, the display panel includes a sacrificial layer arranged between the first edge and the anode, the first edge covers the sacrificial layer, and the distance between a surface of the first edge close to the substrate and a surface of the anode away from the substrate is equal to the thickness of the sacrificial layer.

[0011] Optionally, the display panel includes a light-emitting layer disposed in the first opening, and the light-emitting layer includes a hole injection layer disposed in contact with the anode;

[0012] The side wall of the sacrificial layer close to the center of the anode is spaced apart from the side wall of the first side close to the center of the anode, and the hole injection layer at least partially fills the space between the side surface of the first side close to the substrate and the side surface of the anode away from the substrate.

[0013] Optionally, the light-emitting layer includes a light-emitting main layer disposed on a side of the hole injection layer away from the substrate, the light-emitting main layer covers the hole injection layer and is in contact with a side wall of the first side portion close to the center of the anode.

[0014] Optionally, the display panel includes a cathode layer, and the cathode layer covers the light-emitting layer and the first pixel definition layer.

[0015] Optionally, the thickness of the sacrificial layer is smaller than the thickness of the light-emitting layer.

[0016] Optionally, a side wall of the sacrificial layer away from the center of the anode is flush with a side wall of the anode.

[0017] Optionally, the display panel includes a second pixel definition layer arranged on a side of the first pixel definition layer away from the substrate; the second pixel definition layer is provided with a second opening, the first opening and the second opening are connected, and the orthographic projection of the side wall of the second pixel definition layer on the sacrificial layer is located within the sacrificial layer.

[0018] Optionally, the etching rate of the sacrificial layer is greater than the etching rate of the anode.

[0019] According to a second aspect of the present application, a display terminal is provided, comprising the above-mentioned display panel.

[0020] In the display panel of the embodiment of the present application, in the manufacturing process of the display panel, a sacrificial layer is formed on the upper surface of the anode, and the sacrificial layer is etched after the first pixel definition layer is manufactured. When the sacrificial layer is removed, foreign matter such as glue remaining on the sacrificial layer can be taken away, thereby preventing the foreign matter from causing a short circuit between the anode and the cathode. After etching the sacrificial layer, a gap is formed between the lower surface of the first edge of the first pixel definition layer and the upper surface of the anode.

[0021] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0023] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same figure numbers represent the same parts in the following description.

[0024] Figure 1 It is a photo of the dark spot defective area of ​​the display panel under a microscope;

[0025] Figure 2 A schematic diagram of a top view structure of a display panel provided in an exemplary embodiment of the present disclosure;

[0026] Figure 3 yes Figure 2 A cross-sectional structural diagram at CC in the middle;

[0027] Figure 4 yes Figure 2 Another cross-sectional structure diagram at the middle CC;

[0028] FIG. 5A to FIG. 5E is a manufacturing process flow chart of a display panel provided in an exemplary embodiment of the present disclosure;

[0029] Figure 6 It is a schematic structural diagram of a display terminal provided in an exemplary embodiment of the present disclosure.

[0030] Description of reference numerals:

[0031] Display panel 1, display area AA, non-display area NA;

[0032] substrate 10;

[0033] Anode 20, first sublayer 21, second sublayer 22;

[0034] Light-emitting layer 30, light-emitting unit 301, hole injection layer 31, light-emitting main layer 32;

[0035] cathode 40;

[0036] A first pixel definition layer 51, a first opening 51a, a first side portion 511, a second pixel definition layer 52, and a second opening 52a;

[0037] Sacrificial layer 60;

[0038] Array layer 70;

[0039] The width w of the foreign matter, the thickness h1 of the sacrificial layer 60, the thickness h2 of the light-emitting layer 30, and the distance h3 between the surface of the first side portion 511 close to the substrate 10 and the surface of the anode 20 away from the substrate 10;

[0040] The distance s1 between the side wall of the sacrificial layer 60 close to the center of the anode 20 and the side wall of the first side portion 511 close to the center of the anode 20, and the width s2 of the sacrificial layer 60;

[0041] Display terminal 2, terminal body 3. DETAILED DESCRIPTION

[0042] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0043] In order to achieve the above object, according to the first aspect of the present application, Figures 2 to 4 As shown, a display panel 1 is provided, including a substrate 10, an anode 20 and a first pixel definition layer 51; the anode 20 is arranged on one side of the substrate 10; the first pixel definition layer 51 is arranged on the side of the anode 20 away from the substrate 10, and the first pixel definition layer 51 is provided with a plurality of first openings 51a, and the first openings 51a are arranged corresponding to the anode 20; wherein the first pixel definition layer 51 includes a first edge portion 511, the first edge portion 511 overlaps with the anode 20, and a surface of the first edge portion 511 close to the substrate 10 is spaced from a surface of the anode 20 away from the substrate 10.

[0044] The display panel 1 may be an OLED panel, a Mini-LED panel, a Micro-LED panel, etc.

[0045] like Figure 2 As shown, the display panel 1 includes a display area AA and a non-display area NA arranged outside the display area AA. The display area AA may be provided with a plurality of light emitting units 301, and the light emitting units 301 may include a red light emitting unit, a green light emitting unit, and a blue light emitting unit, so as to realize color display. The non-display area NA may be provided with a driving circuit, such as a gate driving circuit, etc., and the driving circuit may provide a driving signal for the light emitting unit 301.

[0046] like Figure 3 As shown, the light emitting unit 301 is disposed corresponding to the first opening 51 a , and one light emitting unit 301 is one sub-pixel.

[0047] In some embodiments, the light emitting unit 301 may be OLED, Mini-LED, Micro-LED, etc.

[0048] In some embodiments, the substrate 10 may be a rigid substrate or a flexible substrate. The material of the rigid substrate may be a glass substrate, a quartz substrate or a silicon wafer. The material of the flexible substrate may be one of polyimide (PI), polycarbonate (PC), polynorbornene (PNB) and polyethylene terephthalate (PET).

[0049] like Figure 3 As shown, the anode 20 is disposed on the substrate 10 , and the material of the anode 20 may be a metal or a metal oxide material, such as a stack of one or more of indium tin oxide, indium zinc oxide, silver and the like.

[0050] An array layer 70 is also provided on the substrate 10, and the array layer 70 is located between the substrate 10 and the anode 20. The array layer 70 is provided with a driving circuit. The driving circuit includes a plurality of thin film transistors, etc. The thin film transistor can be electrically connected to the anode 20, and is used to input a driving signal to the anode 20.

[0051] The array layer 70 further includes a flat layer (not shown in the figure), which is disposed in contact with the anode 20. The material of the flat layer can be an organic material, such as resin, etc. The organic material has leveling properties and can provide a flat surface for the anode 20.

[0052] like Figure 3 As shown, the first pixel definition layer 51 is disposed on the side of the anode 20 facing away from the substrate 10, the first pixel definition layer 51 covers the edge area of ​​the anode 20, and the first opening 51a of the first pixel definition layer 51 exposes the middle area of ​​the anode 20. The portion of the first pixel definition layer 51 that overlaps with the anode 20 is a first edge portion 511, and the first edge portion 511 is located on the side of the anode 20 facing away from the substrate 10.

[0053] In some embodiments, the material of the first pixel definition layer 51 may be an organic material, such as resin.

[0054] In the manufacturing process of the display panel 1, foreign matter is easy to remain on the upper surface of the anode 20. The foreign matter may be the material of the first pixel definition layer 51 that is not completely removed after the first opening 51a is made, or impurities dropped during the processing. These foreign matter remain on the anode 20. When the light-emitting unit 301 is subsequently formed, the foreign matter will cause a short circuit between adjacent film layers, causing the light-emitting unit 301 to fail to emit light normally, forming a dark spot defect.

[0055] like Figure 1 As shown, Figure 1 This is a photograph of a dark spot defective area of ​​the display panel 1 under a microscope. Figure 1The width w of the foreign matter is marked in FIG. According to actual measurements, the width of the foreign matter is usually less than 2 microns. Other film layers of the light-emitting unit 301 are formed on the foreign matter. Since the foreign matter protrudes from the surface of the anode 20, when the light-emitting unit 301 is formed, the foreign matter will cause a short circuit between adjacent stacked film layers, forming a dark spot defect.

[0056] like Figure 3 As shown, the side surface of the first side portion 511 close to the substrate 10 is spaced from the side surface of the anode 20 away from the substrate 10. That is to say, the lower surface of the first side portion 511 is spaced a certain distance from the upper surface of the anode 20, that is, the first side portion 511 is not in direct contact with the anode 20. The reason why the lower surface of the first side portion 511 is spaced a certain distance from the upper surface of the anode 20 is that in the manufacturing process of the display panel 1, a sacrificial layer 60 is formed on the upper surface of the anode 20, and the sacrificial layer 60 is etched after the first pixel definition layer 51 is manufactured. When removing the sacrificial layer 60, foreign matter such as glue remaining on the sacrificial layer 60 can be taken away, thereby preventing the foreign matter from causing a short circuit between the anode 20 and the cathode 40. After etching the sacrificial layer 60, a gap is formed between the lower surface of the first side portion 511 of the first pixel definition layer 51 and the upper surface of the anode 20. Please refer to the following content for the specific process flow.

[0057] Alternatively, if Figure 3 As shown, other film layers may be disposed between the lower surface of the first side portion 511 and the upper surface of the anode 20 .

[0058] Alternatively, if Figure 4 As shown, Figure 4 and Figure 3 The difference lies in the sacrificial layer 60. Figure 3 In the process, the sacrificial layer 60 is completely etched away. Figure 4 In the embodiment, the sacrificial layer 60 is not completely etched away. Figure 4 As shown, the display panel 1 includes a sacrificial layer 60 arranged between the first edge 511 and the anode 20, the first edge 511 covers the sacrificial layer 60, and the distance h3 between the side surface of the first edge 511 close to the substrate 10 and the side surface of the anode 20 away from the substrate 10 is equal to the thickness h1 of the sacrificial layer 60.

[0059] The sacrificial layer 60 may be formed on the upper surface of the anode 20. The first pixel definition layer 51 is formed after the sacrificial layer 60 is formed. Through the above arrangement, foreign matter will remain on the surface of the sacrificial layer 60. Since the sacrificial layer 60 will be removed in a subsequent process, when the sacrificial layer 60 is removed, the remaining foreign matter will also be removed, thereby avoiding dark spot defects caused by the remaining foreign matter.

[0060] The material of the sacrificial layer 60 can be a material that is easily etched by acid, such as a metal that is easily oxidized. The material of the sacrificial layer 60 can be indium gallium zinc oxide (IGZO), tungsten oxide (WO x ), etc., but not limited to these.

[0061] like Figure 4 As shown, the distance h3 between the surface of the first side portion 511 close to the substrate 10 and the surface of the anode 20 away from the substrate 10 is equal to the thickness h1 of the sacrificial layer 60. In other words, the first side portion 511 can cover the sacrificial layer 60, and after the sacrificial layer 60 is removed, the distance between the first side portion 511 and the anode 20 is equal to the thickness h1 of the sacrificial layer 60.

[0062] In order to prevent the anode 20 from being etched synchronously when etching the sacrificial layer 60, the etching rate of the sacrificial layer 60 can be made greater than the etching rate of the anode 20. The etching rate refers to the speed at which the sacrificial layer 60 reacts with the etching solution. The greater the etching rate, the faster the etching reaction; the smaller the etching rate, the slower the etching reaction.

[0063] Alternatively, if Figure 3 and Figure 4 As shown, the display panel 1 includes a light-emitting layer 30 arranged in the first opening 51a, and the light-emitting layer 30 includes a hole injection layer 31 arranged in contact with the anode 20; the side wall of the sacrificial layer 60 close to the center of the anode 20 is spaced apart from the side wall of the first side 511 close to the center of the anode 20, and the hole injection layer 31 at least partially fills between the side surface of the first side 511 close to the substrate 10 and the side surface of the anode 20 facing away from the substrate 10.

[0064] The light emitting layer 30 is disposed on the surface of the anode 20 facing away from the substrate 10 and is located in the first opening 51a. The light emitting layer 30 can emit light under the drive of voltage, thereby realizing the display of the display panel 1. The light emitting layer 30 can be made by inkjet printing or evaporation process, but is not limited thereto.

[0065] The light-emitting layer 30 includes a hole injection layer 31, which can be formed by inkjet printing or evaporation. The hole injection layer 31 can reduce the energy barrier of holes injected from the anode 20 into the light-emitting layer 30, making it easier for holes to be injected into the light-emitting layer 30, thereby improving the light-emitting efficiency of the display panel 1.

[0066] The side wall of the sacrificial layer 60 close to the center of the anode 20 is spaced apart from the side wall of the first side portion 511 close to the center of the anode 20. That is to say, the side wall of the sacrificial layer 60 close to the center of the anode 20 is recessed relative to the side wall of the first side portion 511 close to the center of the anode 20, forming an undercut structure.

[0067] In some embodiments, Figure 4As shown, the spacing s1 between the side wall of the sacrificial layer 60 close to the center of the anode 20 and the side wall of the first edge 511 close to the center of the anode 20 can be less than or equal to 1.5 microns, where s1 is the width of the bottom cut structure, thereby avoiding the situation where the width of the bottom cut structure is too large, resulting in uneven support force on the film layer above the first edge 511 and film separation.

[0068] In some embodiments, the value of s1 can be 0.1 micron, 0.2 micron, 0.3 micron, 0.4 micron, 0.5 micron, 0.6 micron, 0.7 micron, 0.8 micron, 0.9 micron, 1.0 micron, 1.1 micron, 1.2 micron, 1.3 micron, 1.4 micron, 1.5 micron, etc.

[0069] like Figure 3 and Figure 4 As shown, the hole injection layer 31 is at least partially filled between the surface of the first side portion 511 close to the substrate 10 and the surface of the anode 20 away from the substrate 10. Figure 4 As shown, the hole injection layer 31 can completely fill the space inside the undercut structure, and the hole injection layer 31 is in contact with the lower surface of the first side portion 511, the upper surface of the anode 20, and the side wall of the sacrificial layer 60 close to the center of the anode 20. Figure 3 As shown, the hole injection layer 31 can partially fill the space inside the bottom cut structure. At this time, the hole injection layer 31 is in contact with the lower surface of the first edge portion 511 and the upper surface of the anode 20, and the hole injection layer 31 is spaced apart from the side wall of the sacrificial layer 60 close to the center of the anode 20.

[0070] like Figure 3 and Figure 4 As shown, since the hole injection layer 31 is at least partially filled in the undercut structure, it is not easy for the hole injection layer 31 to climb along the side wall of the first side portion 511 close to the center of the anode 20, thereby reducing the risk of the hole injection layer 31 climbing along the side wall of the first side portion 511 and short-circuiting with the film layer above the light-emitting layer 30. The short-circuit between the hole injection layer 31 and the film layer above the light-emitting layer 30 will cause leakage current, affecting the light-emitting efficiency of the light-emitting layer 30.

[0071] Alternatively, if Figure 3 and Figure 4 As shown, the light-emitting layer 30 includes a light-emitting main layer 32 disposed on the side of the hole injection layer 31 away from the substrate 10, and the light-emitting main layer 32 covers the hole injection layer 31 and is disposed in contact with the side wall of the first side portion 511 on the side close to the center of the anode 20. The hole injection layer 31 injects holes generated by the anode 20 into the light-emitting main layer 32.

[0072] In some embodiments, the light-emitting layer 30 further includes a hole transport layer (not shown) located between the hole injection layer 31 and the light-emitting host layer 32 .

[0073] Alternatively, if Figure 3 and Figure 4 As shown, the display panel 1 includes a cathode 40 , and the cathode 40 covers the light emitting layer 30 and the first pixel definition layer 51 .

[0074] In some embodiments, the material of cathode 40 may be an alloy of one or more of silver, aluminum, magnesium, etc.

[0075] In some embodiments, an electron injection layer (not shown) and an electron transport layer (not shown) are further disposed between the cathode 40 and the light-emitting main layer 32 , and the electron transport layer is located on a side of the electron injection layer close to the light-emitting main layer 32 .

[0076] In some embodiments, the cathode 40 may be provided as a whole layer, that is, the cathode 40 may continuously cover a plurality of first openings 51a. The electron injection layer and the electron transport layer may also be provided as a whole layer, that is, the electron injection layer and the electron transport layer may continuously cover a plurality of first openings 51a.

[0077] The anode 20 injects holes, and the holes enter the hole transport layer through the hole injection layer 31. The hole transport layer is used to transport the holes to the light-emitting main layer 32. The cathode 40 injects electrons, and the electrons enter the electron transport layer through the electron injection layer. The electron transport layer is used to transport the electrons to the light-emitting main layer 32. The holes and electrons are recombined in the light-emitting main layer 32 to emit light.

[0078] Alternatively, if Figure 3 and Figure 4 As shown, the thickness h1 of the sacrificial layer 60 is less than the thickness h2 of the light emitting layer 30. Thickness refers to the dimension in a direction perpendicular to the supporting surface of the substrate 10. The thickness h2 of the light emitting layer 30 is the sum of the thickness of the hole injection layer 31 and the thickness of the light emitting main layer 32.

[0079] In some embodiments, the thickness h1 of the sacrificial layer 60 is greater than or equal to 10 nanometers.

[0080] By setting the thickness h1 of the sacrificial layer 60 to be smaller than the thickness h2 of the light-emitting layer 30, after the sacrificial layer 60 is etched, the surface of the light-emitting layer 30 facing away from the substrate 10 will be higher than the surface of the first edge 511 close to the substrate 10, that is, the upper surface of the light-emitting layer 30 will not be located in the undercut structure, thereby preventing the cathode 40 formed subsequently from being formed in the undercut structure. When the cathode 40 is formed in the undercut structure, the cathode 40 may be short-circuited with the hole injection layer 31, resulting in leakage current, which will reduce the luminous efficiency of the light-emitting layer 30.

[0081] Alternatively, if Figure 3 and Figure 4 As shown, the side wall of the sacrificial layer 60 away from the center of the anode 20 is flush with the side wall of the anode 20. Through the above arrangement, the sacrificial layer 60 and the anode 20 can be formed by the same patterning process, simplifying the manufacturing process of the sacrificial layer 60.

[0082] Alternatively, if Figure 3 and Figure 4 As shown, the display panel 1 includes a second pixel definition layer 52 arranged on the side of the first pixel definition layer 51 facing away from the substrate 10; the second pixel definition layer 52 is provided with a second opening 52a, the first opening 51a and the second opening 52a are connected, and the positive projection of the side wall of the second pixel definition layer 52 on the sacrificial layer 60 is located in the sacrificial layer 60.

[0083] In some embodiments, the first pixel definition layer 51 may be made of a hydrophilic material, and the second pixel definition layer 52 may be made of a hydrophobic material.

[0084] The light-emitting layer 30 can be made by inkjet printing. During inkjet printing, the organic light-emitting material ink is injected into the first opening 51a, and the light-emitting layer 30 is formed after drying. The material of the first pixel definition layer 51 is hydrophilic, so that the contact angle between the first pixel definition layer 51 and the organic light-emitting material ink is small. The material of the second pixel definition layer 52 is hydrophobic, so that the contact angle between the second pixel definition layer 52 and the organic light-emitting material ink is large. Through the above arrangement, the coffee ring effect can be reduced and an organic electroluminescent film with uniform film thickness can be formed. At the same time, since the second pixel definition layer 52 is hydrophobic, the organic light-emitting material ink is not easy to climb along the side wall of the second pixel definition layer 52, thereby preventing organic light-emitting material inks of different colors from flowing into the adjacent first opening 51a and causing color mixing.

[0085] In one embodiment, organic light-emitting material inks of the same color are separated by a first pixel definition layer 51, and the thickness of the first pixel definition layer 51 is small. The organic light-emitting material ink in the first pixel definition layer 51 can flow between multiple first openings 51a of the same color, so that the thickness of the organic light-emitting material ink in the first opening 51a is consistent. Organic light-emitting material inks of different colors are separated by a second pixel definition layer 52, and the second pixel definition layer 52 is located on the first pixel definition layer 51 to form a retaining wall to prevent organic light-emitting material inks of different colors from passing over the second pixel definition layer 52.

[0086] In some embodiments, Figure 3 and Figure 4 As shown, the orthographic projection of the sidewall of the second pixel definition layer 52 on the sacrificial layer 60 is located inside the sacrificial layer 60. Through the above arrangement, the sacrificial layer 60 can support the sidewall of the second pixel definition layer 52 to prevent the second pixel definition layer 52 from collapsing the undercut structure.

[0087] When the orthographic projection of the side wall of the second pixel definition layer 52 on the sacrificial layer 60 overlaps with the undercut structure, since the undercut structure is at least filled with the hole injection layer 31, the mechanical strength of the hole injection layer 31 is not as good as the mechanical strength of the sacrificial layer 60, which will cause the second pixel definition layer 52 to exert too much pressure on the undercut structure, resulting in stress concentration at the undercut structure, causing film separation or rupture. When the side wall of the second pixel definition layer 52 does not overlap with the first edge 511, when the width of the second pixel definition layer 52 is constant, the width of the first pixel definition layer 51 needs to be increased, which will reduce the aperture ratio of the display panel 1. The width of the first pixel definition layer 51 refers to Figure 3 The dimension in the horizontal direction along the center.

[0088] Optionally, the etching rate of the sacrificial layer 60 is greater than the etching rate of the anode 20. The sacrificial layer 60 is made of a material that is easily etched by acid, and the anode 20 is made of a material that is not easily etched by acid.

[0089] In some embodiments, Figure 3 and Figure 4 As shown, the anode 20 may be a stack of a first sublayer 21 and a second sublayer 22. The material of the first sublayer 21 may be ITO or IZO, etc. The material of the second sublayer 22 may be a metal such as silver or aluminum. For example, the anode 20 may include a first sublayer 21, a second sublayer 22, and a first sublayer 21 stacked in sequence.

[0090] FIG. 5A to FIG. 5D is a flowchart of a manufacturing process of a display panel 1 provided in an exemplary embodiment of the present disclosure. FIG. 5A to FIG. 5D The manufacturing process of the display panel of the present application is described. Figure 5A As shown, an anode 20 and a sacrificial layer 60 are formed on a substrate 10. The anode 20 and the sacrificial layer 60 may be formed by the same patterning process, and the sidewall of the anode 20 may be flush with the sidewall of the sacrificial layer 60.

[0091] It should be noted that the patterning process includes processes such as photoresist coating, exposure and development, etching, and photoresist removal. The sacrificial layer 60 and the anode 20 can be etched step by step, that is, the sacrificial layer 60 is etched first, and then the anode 20 is etched.

[0092] In some embodiments, the thickness h1 of the sacrificial layer 60 is greater than or equal to 10 nanometers.

[0093] like Figure 5BAs shown, a first pixel definition layer 51 is formed on the sacrificial layer 60, and a first opening 51a is formed on the first pixel definition layer 51. The first opening 51a is arranged corresponding to the anode 20, and the first opening 51a exposes the middle area between the anode 20 and the sacrificial layer 60, and the edge of the first pixel definition layer 51 overlaps with the edge area of ​​the anode 20 and the sacrificial layer 60.

[0094] The material of the first pixel definition layer 51 may be an organic material. The steps of forming the first pixel definition layer 51 include coating photoresist, exposure and development, and baking.

[0095] like Figure 5C As shown, a second pixel definition layer 52 is formed on the first pixel definition layer 51, and the manufacturing method of the second pixel definition layer 52 can be the same as that of the first pixel definition layer 51. A second opening 52a is formed on the second pixel definition layer 52. The second opening 52a is connected to the first opening 51a. Optionally, the second opening 52a is arranged in alignment with the first opening 51a.

[0096] like Figure 5D As shown, the sacrificial layer 60 is etched to remove at least the portion of the sacrificial layer 60 that is not covered by the first pixel definition layer 51 .

[0097] In some embodiments, the sacrificial layer 60 may be completely etched, that is, the sacrificial layer 60 does not exist, and the lower surface of the first side portion 511 is spaced apart from the upper surface of the anode.

[0098] In other embodiments, Figure 5D As shown, the sacrificial layer 60 can be partially etched. That is, the portion of the sacrificial layer 60 corresponding to the first opening 51a is etched, and the film layer of the sacrificial layer 60 located below the first pixel definition layer 51 is partially etched. Since the side of the sacrificial layer 60 close to the center of the anode 20 will contact the etching solution, the side of the sacrificial layer 60 close to the center of the anode 20 will be etched to form an undercut structure.

[0099] By adjusting the etching time, the width s2 of the remaining sacrificial layer 60 can be adjusted.

[0100] Alternatively, if Figure 5D As shown, the spacing s1 between the side wall of the sacrificial layer 60 close to the center of the anode 20 and the side wall of the first side 511 close to the center of the anode 20 is less than or equal to 1.5 microns. The width of the first side 511, s1+s2≥2 microns.

[0101] The sacrificial layer 60 is removed after etching, and foreign matter remaining on the surface of the sacrificial layer 60 is removed together, thereby avoiding dark spot defects caused by the remaining foreign matter.

[0102] like Figure 5EAs shown, the hole injection layer 31, the light-emitting main layer 32, and the cathode 40 are sequentially formed in the first opening 51a and the second opening 52a.

[0103] The hole injection layer 31 and the light-emitting main layer 32 can be made by inkjet printing. The cathode 40 can be formed by physical vapor deposition (PVD).

[0104] According to the second aspect of the present application, Figure 6 As shown, a display terminal 2 is provided, comprising the above-mentioned display panel 1.

[0105] In this embodiment, if Figure 6 As shown, the display terminal 2 includes a display panel 1 and a terminal body 3, and the display panel 1 and the terminal body 3 are combined into one body.

[0106] In this embodiment, the display terminal 2 can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc.

[0107] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0108] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0109] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0110] The above are only preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A display panel, characterized in that: include: substrate; an anode, disposed on one side of the substrate; A first pixel definition layer is disposed on a side of the anode away from the substrate, the first pixel definition layer is provided with a plurality of first openings, and the first openings are disposed corresponding to the anode; The first pixel definition layer includes a first edge portion, the first edge portion overlaps with the anode, and a surface of the first edge portion close to the substrate is spaced apart from a surface of the anode side away from the substrate.

2. The display panel according to claim 1, characterized in that: The display panel includes a sacrificial layer arranged between the first edge and the anode, the first edge covers the sacrificial layer, and the distance between a surface of the first edge close to the substrate and a surface of the anode away from the substrate is equal to the thickness of the sacrificial layer.

3. The display panel according to claim 2, characterized in that: The display panel includes a light-emitting layer disposed in the first opening, and the light-emitting layer includes a hole injection layer disposed in contact with the anode; The side wall of the sacrificial layer close to the center of the anode is spaced apart from the side wall of the first side close to the center of the anode, and the hole injection layer at least partially fills the space between the side surface of the first side close to the substrate and the side surface of the anode away from the substrate.

4. The display panel according to claim 3, characterized in that: The light-emitting layer includes a light-emitting main layer disposed on a side of the hole injection layer away from the substrate, the light-emitting main layer covers the hole injection layer and is in contact with a side wall of the first side portion close to the center of the anode.

5. The display panel according to claim 4, characterized in that: The display panel includes a cathode layer, and the cathode layer covers the light emitting layer and the first pixel definition layer.

6. The display panel according to claim 3, characterized in that: The thickness of the sacrificial layer is smaller than the thickness of the light emitting layer.

7. The display panel according to any one of claims 2 to 6, characterized in that: A side wall of the sacrificial layer away from the center of the anode is flush with the side wall of the anode.

8. The display panel according to any one of claims 2 to 6, characterized in that: The display panel includes a second pixel definition layer arranged on a side of the first pixel definition layer away from the substrate; the second pixel definition layer is provided with a second opening, the first opening and the second opening are connected, and the orthographic projection of the side wall of the second pixel definition layer on the sacrificial layer is located in the sacrificial layer.

9. The display panel according to any one of claims 2 to 6, characterized in that: The etching rate of the sacrificial layer is greater than the etching rate of the anode.

10. A display terminal, characterized in that: A display panel comprising any one of claims 1 to 9.

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