Display panel, preparation method of display panel and electronic equipment

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and electronic equipment, and relates to the technical field of display. In the display panel, a packaging unit comprises a first packaging part and a second packaging part which are connected with each other, at least part of the first packaging part is located on the side, facing an isolation opening, of an isolation structure, the second packaging part is located on the side, away from a substrate, of the isolation structure, and a packaging protection structure covers the first packaging part and the second packaging part of part of the packaging unit. According to the design, the first packaging part and the second packaging part can be protected through the packaging protection structure, packaging failure caused by damage of the first packaging part and the second packaging part is avoided, and the process yield of the display panel and the stability of the display effect are improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular, to a display panel, a method for preparing a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) is considered to be the next generation display technology after liquid crystal display technology. Due to its excellent color and picture quality, it is widely used in various consumer electronic devices such as smartphones, TVs, laptops, desktop computers, car displays, wearable devices, etc., and has become the mainstream technology in display panels.

[0003] In the process of traditional display panel preparation, the graphicization of luminous pixels is usually achieved through a fine metal mask (FMM). FMM technology is mature and has rich experience in mass production. However, FMM technology also has problems such as limited accuracy, high development cost, and long development cycle. The fine metal mask-free technology eliminates the limitations of traditional OLED processes on display screen size, resolution and other screen performance, and has the advantages of high performance, full-domain size, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN 117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A record the relevant content of the fine metal mask-free technology for reference.

[0004] However, the process performance of current OLED display products needs to be further improved. Summary of the invention

[0005] In order to overcome the technical problems mentioned in the above technical background, the present application provides a display panel, a method for preparing a display panel, and an electronic device.

[0006] In a first aspect of the present application, a display panel is provided, wherein the display panel further comprises:

[0007] substrate;

[0008] An isolation structure, located on one side of the substrate and enclosing an isolation opening on the substrate;

[0009] a light emitting device, at least partially located in the isolation opening;

[0010] a packaging unit, used to package the light-emitting device in the isolation opening, the packaging unit comprising a first packaging portion and a second packaging portion connected to each other, at least a portion of the first packaging portion is located on a side of the isolation structure facing the isolation opening, and the second packaging portion is located on a side of the isolation structure away from the substrate;

[0011] The packaging protection structure covers a portion of the first packaging part and the second packaging part.

[0012] In a possible implementation of the present application, the display panel further includes a pixel defining layer;

[0013] The pixel defining layer is located on the substrate, the isolation structure is located on a side of the pixel defining layer away from the substrate, the pixel defining layer includes a pixel opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate;

[0014] At least part of the light emitting device is located within the pixel opening;

[0015] Preferably, in a direction away from the substrate, the light-emitting device comprises a first electrode, a light-emitting material layer and a second electrode which are stacked, the first electrode is located on a side of the pixel defining layer facing the substrate, the pixel opening partially exposes the first electrode, and the second electrode overlaps the isolation structure;

[0016] Preferably, the orthographic projection of the encapsulation protection structure on the substrate partially overlaps with the orthographic projection of the light emitting device on the substrate;

[0017] Preferably, the orthographic projection of the encapsulation protection structure on the substrate is located outside the orthographic projection of the pixel opening on the substrate.

[0018] In a possible implementation of the present application, the isolation opening includes a first isolation opening and a second isolation opening, the light-emitting device includes a first light-emitting device and a second light-emitting device having different light-emitting colors, the encapsulation unit includes a first encapsulation unit and a second encapsulation unit, and the encapsulation protection structure includes a first encapsulation protection structure;

[0019] At least part of the first light-emitting device is located in the first isolation opening, at least part of the second light-emitting device is located in the second isolation opening, the first packaging unit is used to package the first light-emitting device in the first isolation opening, and the second packaging unit is used to package the second light-emitting device in the second isolation opening;

[0020] The first encapsulation protection structure covers a portion of the first encapsulation portion and the second encapsulation portion of the first encapsulation unit.

[0021] In a possible implementation of the present application, on a side of the isolation structure between the adjacent first isolation opening and the second isolation opening away from the substrate, the first encapsulation protection structure is connected to the second encapsulation unit;

[0022] In a direction away from the substrate, the first encapsulation protection structure includes a first film layer, a second film layer and a third film layer;

[0023] Preferably, the material of the first film layer is the same as the material of the light-emitting material layer in the second light-emitting device, the material of the second film layer is the same as the material of the second electrode in the second light-emitting device, and the material of the third film layer is the same as the material of the second encapsulation unit;

[0024] Preferably, at a side of the isolation structure between the adjacent first isolation opening and the second isolation opening away from the substrate, the third film layer of the first encapsulation protection structure is connected to the second encapsulation unit;

[0025] Preferably, the orthographic projection of the first encapsulation protection structure located on the side of the isolation structure away from the substrate on the substrate surrounds the orthographic projection of the first isolation opening on the substrate;

[0026] Preferably, on a side of the isolation structure between the adjacent first isolation opening and the second isolation opening away from the substrate, a film layer that is the same layer as the light-emitting material layer and the second electrode in the second light-emitting device is filled between the second encapsulation unit and the isolation structure.

[0027] In a possible implementation manner of the present application, the isolation opening further includes a third isolation opening, the light-emitting device includes a third light-emitting device with a light-emitting color different from that of the first light-emitting device and the second light-emitting device, the encapsulation unit includes a third encapsulation unit, and the encapsulation protection structure further includes a second encapsulation protection structure;

[0028] At least part of the third light emitting device is located in the third isolation opening, and the third encapsulation unit is used to encapsulate the third light emitting device in the third isolation opening;

[0029] The second encapsulation protection structure covers a portion of the first encapsulation portion and the second encapsulation portion of the second encapsulation unit.

[0030] In a possible implementation manner of the present application, on a side of the isolation structure between the adjacent second isolation opening and the third isolation opening away from the substrate, the second encapsulation protection structure is connected to the third encapsulation unit;

[0031] In a direction away from the substrate, the second encapsulation protection structure includes a fourth film layer, a fifth film layer and a sixth film layer;

[0032] Preferably, the material of the fourth film layer is the same as the material of the light-emitting material layer in the third light-emitting device, the material of the fifth film layer is the same as the material of the second electrode in the third light-emitting device, and the material of the sixth film layer is the same as the material of the third encapsulation unit;

[0033] Preferably, at a side of the isolation structure between the adjacent second isolation opening and the third isolation opening away from the substrate, the sixth film layer of the second encapsulation protection structure is connected to the third encapsulation unit;

[0034] Preferably, the orthographic projection of the second encapsulation protection structure located on the side of the isolation structure away from the substrate on the substrate surrounds a portion of the orthographic projection of the second isolation opening on the substrate;

[0035] Preferably, a gap exists between the first packaging unit and a side of the isolation structure away from the substrate, and a gap exists between at least part of the second packaging unit and a side of the isolation structure away from the substrate.

[0036] In a possible implementation manner of the present application, the isolation opening further includes a third isolation opening, the light-emitting device includes a third light-emitting device with a light-emitting color different from that of the first light-emitting device and the second light-emitting device, the encapsulation unit includes a third encapsulation unit, and the encapsulation protection structure further includes a second encapsulation protection structure;

[0037] At least part of the third light emitting device is located in the third isolation opening, and the third encapsulation unit is used to encapsulate the third light emitting device in the third isolation opening;

[0038] The second encapsulation protection structure covers the first encapsulation part and the second encapsulation part of the second encapsulation unit;

[0039] On a side of the isolation structure away from the substrate, the first packaging protection structure and the second packaging protection structure are connected and arranged in the same layer; the first packaging protection structure and the second packaging protection structure are arranged around the first isolation opening and the second isolation opening respectively;

[0040] Preferably, the first encapsulation protection structure and the second encapsulation protection structure have the same film layer structure;

[0041] In a direction away from the substrate, the first encapsulation protection structure includes a first film layer, a second film layer and a third film layer, and the second encapsulation protection structure includes a fourth film layer, a fifth film layer and a sixth film layer, wherein the first film layer and the fourth film layer are made of the same material, the second film layer and the fifth film layer are made of the same material, and the third film layer and the sixth film layer are made of the same material;

[0042] Preferably, the material of the first film layer and the fourth film layer is the same as the material of the light-emitting material layer in the third light-emitting device, the material of the second film layer and the fifth film layer is the same as the material of the second electrode in the third light-emitting device, and the material of the third film layer and the sixth film layer is the same as the material of the third encapsulation unit.

[0043] In a possible implementation manner of the present application, the contour line of the orthographic projection of the pixel opening on the substrate includes a first contour line corresponding to the first isolation opening, a second contour line corresponding to the second isolation opening, and a third contour line corresponding to the third isolation opening;

[0044] The contour line of the orthographic projection of the isolation structure on the substrate includes a fourth contour line corresponding to the first isolation opening, a fifth contour line corresponding to the second isolation opening, and a sixth contour line corresponding to the third isolation opening;

[0045] There is a first distance between the first contour line and the fourth contour line located on the same side, there is a second distance between the second contour line and the fifth contour line located on the same side, and there is a third distance between the third contour line and the sixth contour line located on the same side;

[0046] Preferably, in the first isolation opening, first distances located at different sides are equal, and in the third isolation opening, third distances located at different sides are equal, wherein the first distance is greater than the third distance.

[0047] In a possible implementation manner of the present application, in the second isolation opening, a second distance located at least on one side is equal to the first distance;

[0048] Preferably, in the second isolation opening, the second distances located on different sides are equal to the first distance;

[0049] Preferably, the first distance is 2.5 μm-5 μm, and the third distance is 1 μm-4 μm.

[0050] In a possible implementation manner of the present application, a contour line of an orthographic projection of the first encapsulation protection structure on the substrate includes a seventh contour line corresponding to the first isolation opening, and a contour line of an orthographic projection of the second encapsulation protection structure on the substrate includes an eighth contour line corresponding to the second isolation opening;

[0051] There is a fourth distance between the first contour line and the seventh contour line located on the same side, and there is a fifth distance between the second contour line and the eighth contour line located on the same side;

[0052] Preferably, the contour line of the orthographic projection of the third packaging unit on the substrate includes a ninth contour line corresponding to the third isolation opening, and the third contour line and the ninth contour line located on the same side have a sixth distance therebetween;

[0053] Preferably, the fourth distance, the fifth distance and the sixth distance are equal.

[0054] In a possible implementation of the present application, the encapsulation protection structure includes a first protection portion and a second protection portion;

[0055] The first protection portion covers a portion of the first packaging portion and the second packaging portion of the packaging unit, the second protection portion is in contact with a surface of the isolation structure away from the substrate, and the first protection portion and the second protection portion are connected to each other;

[0056] Preferably, the second protection portion is located between adjacent second packaging portions.

[0057] In a possible implementation of the present application, the first protection portion includes a first protection sub-portion covering the first packaging portion and a second protection sub-portion covering the second packaging portion;

[0058] The contour line of the orthographic projection of the first isolation opening on the substrate is located within the orthographic projection of the first protection sub-portion in the first encapsulation protection structure on the substrate;

[0059] The contour line of the orthographic projection of the second isolation opening on the substrate is located within the orthographic projection of the first protection sub-portion in the second encapsulation protection structure on the substrate; or,

[0060] The contour line portion of the orthographic projection of the second isolation opening on the substrate is located within the orthographic projection of the first protection sub-portion in the second encapsulation protection structure on the substrate;

[0061] Preferably, the remaining contour lines of the second isolation opening in the orthographic projection on the substrate except for the side close to the first isolation opening are all located within the orthographic projection of the first protection sub-portion in the second encapsulation protection structure on the substrate;

[0062] Preferably, a contour line of a side of the second isolation opening close to the third isolation opening in the orthographic projection on the substrate is located within the orthographic projection of the first protection sub-portion in the second encapsulation protection structure on the substrate.

[0063] According to a second aspect of the present application, a display panel is provided, comprising:

[0064] substrate;

[0065] A pixel defining layer, located on the substrate, wherein the pixel defining layer includes a pixel opening;

[0066] An isolation structure, located at a side of the pixel defining layer away from the substrate, the isolation structure comprising an isolation opening, the orthographic projection of the pixel opening on the substrate being located within the orthographic projection of the isolation opening on the substrate;

[0067] a light emitting device, at least partly located in the isolation opening,

[0068] The isolation opening includes a first isolation opening and a second isolation opening, the light-emitting device includes a first light-emitting device and a second light-emitting device with different light-emitting colors, at least part of the first light-emitting device is located in the first isolation opening, at least part of the second light-emitting device is located in the second isolation opening, and the contour line of the orthographic projection of the pixel opening on the substrate includes a first contour line corresponding to the first isolation opening and a second contour line corresponding to the second isolation opening;

[0069] The contour line of the orthographic projection of the isolation structure on the substrate includes a fourth contour line corresponding to the first isolation opening and a fifth contour line corresponding to the second isolation opening;

[0070] There is a first distance between the first contour line and the fourth contour line located on the same side, and there is a second distance between the second contour line and the fifth contour line located on the same side, wherein the first distance is greater than the second distance.

[0071] In a possible implementation of the present application, the isolation opening further includes a third isolation opening, the light-emitting device includes a third light-emitting device having a light-emitting color different from that of the first light-emitting device and the second light-emitting device, and at least part of the third light-emitting device is located in the third isolation opening;

[0072] The contour line of the orthographic projection of the pixel opening on the substrate includes a third contour line corresponding to the third isolation opening;

[0073] The contour line of the orthographic projection of the isolation structure on the substrate includes a sixth contour line corresponding to the third isolation opening;

[0074] A third distance exists between the third contour line and the sixth contour line located on the same side, wherein the third distance is smaller than the first distance;

[0075] Preferably, the first distance is 2.5 μm-5 μm, and the third distance is 1 μm-4 μm.

[0076] In a third aspect of the present application, a method for preparing a display panel is further provided, the method comprising:

[0077] providing a substrate;

[0078] Forming an isolation structure including an isolation opening on one side of the substrate;

[0079] A light-emitting device and a packaging unit for packaging the light-emitting device are manufactured in the isolation opening, wherein the packaging unit comprises a first packaging portion and a second packaging portion connected to each other, at least a portion of the first packaging portion is located on a side of the isolation structure facing the isolation opening, and the second packaging portion is located on a side of the isolation structure away from the substrate;

[0080] An encapsulation protection structure covering a portion of the first encapsulation portion and the second encapsulation portion is prepared.

[0081] In a possible implementation of the present application, the isolation opening includes a first isolation opening and a second isolation opening, the light-emitting device includes a first light-emitting device and a second light-emitting device of different light-emitting colors, the encapsulation unit includes a first encapsulation unit and a second encapsulation unit, the encapsulation protection structure includes a first encapsulation protection structure, and the steps of manufacturing the light-emitting device and the encapsulation unit for encapsulating the light-emitting device in the isolation opening include:

[0082] manufacturing a first light-emitting device and a first encapsulation unit for encapsulating the first light-emitting device in the first isolation opening;

[0083] The step of preparing an encapsulation protection structure covering a portion of the first encapsulation portion and the second encapsulation portion comprises:

[0084] A light-emitting material layer, a second electrode and a packaging material layer of a second light-emitting device are sequentially manufactured on the entire surface of one side of the substrate where the isolation structure is provided, and the second light-emitting device and a second packaging unit for packaging the second light-emitting device are formed in the second isolation opening;

[0085] A portion of the light emitting material layer, the second electrode and the packaging material layer covering the first light emitting device is removed by etching to form a first packaging protection structure covering the first packaging part and the second packaging part of the first packaging unit.

[0086] In a possible implementation of the present application, the isolation opening includes a third isolation opening, the light-emitting device also includes a third light-emitting device having a light-emitting color different from that of the first light-emitting device and the second light-emitting device, the encapsulation unit also includes a third encapsulation unit, the encapsulation protection structure also includes a second encapsulation protection structure, and the step of manufacturing the light-emitting device and the encapsulation unit for encapsulating the light-emitting device in the isolation opening further includes:

[0087] A light-emitting material layer, a second electrode and a packaging material layer of a third light-emitting device are sequentially manufactured on the entire surface of one side of the substrate where the isolation structure is provided, and a third light-emitting device and a third packaging unit for packaging the third light-emitting device are formed in the third isolation opening;

[0088] The step of preparing an encapsulation protection structure covering a portion of the first encapsulation portion and the second encapsulation portion further includes:

[0089] A portion of the light emitting material layer, the second electrode and the packaging material layer covering the second light emitting device is removed by etching to form a second packaging protection structure covering the first packaging part and the second packaging part of the second packaging unit.

[0090] In a possible implementation of the present application, the isolation opening includes a first isolation opening, a second isolation opening, and a third isolation opening; the light-emitting device includes a first light-emitting device, a second light-emitting device, and a third light-emitting device having different light-emitting colors; the encapsulation unit includes a first encapsulation unit, a second encapsulation unit, and a third encapsulation unit; the encapsulation protection structure includes a first encapsulation protection structure and a second protection structure; and the steps of manufacturing the light-emitting device and the encapsulation unit for encapsulating the light-emitting device in the isolation opening include:

[0091] manufacturing a first light-emitting device and a first encapsulation unit for encapsulating the first light-emitting device in the first isolation opening;

[0092] manufacturing a second light-emitting device and a second encapsulation unit for encapsulating the second light-emitting device in the second isolation opening;

[0093] A light-emitting material layer, a second electrode and a packaging material layer of a third light-emitting device are sequentially manufactured on the entire surface of one side of the substrate where the isolation structure is provided, and a third light-emitting device and a third packaging unit for packaging the third light-emitting device are formed in the third isolation opening;

[0094] The step of preparing an encapsulation protection structure covering a portion of the first encapsulation portion and the second encapsulation portion further includes:

[0095] The light-emitting material layer, the second electrode and the packaging material layer covering part of the first light-emitting device and the second light-emitting device are partially removed by etching to form a first packaging protection structure covering the first packaging part and the second packaging part of the first packaging unit, and a second packaging protection structure covering the first packaging part and the second packaging part of the second packaging unit.

[0096] In a fourth aspect of the present application, an electronic device is provided, comprising a display panel according to any possible implementation of the first aspect and the second aspect, or a display panel prepared according to any possible implementation of the third aspect.

[0097] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and an electronic device. In the display panel, the packaging unit includes a first packaging part and a second packaging part connected to each other, at least part of the first packaging part is located on the side of the isolation structure facing the isolation opening, and the second packaging part is located on the side of the isolation structure away from the substrate, and the packaging protection structure covers part of the first packaging part and the second packaging part. With such a design, the first packaging part and the second packaging part can be protected by the packaging protection structure to avoid packaging failure caused by damage to the above two parts, thereby improving the process yield of the display panel and the stability of the display effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0098] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0099] Figure 1 The schematic diagram of the distribution of the isolation structure and the isolation openings provided in this embodiment is illustrated;

[0100] Figure 2 Example Figure 1 One of the cross-sectional diagrams at the AA position;

[0101] Figure 3 Example Figure 1 The second cross-sectional diagram at the AA position;

[0102] Figure 4 Example Figure 1 The third cross-sectional diagram at the AA position;

[0103] Figure 5 Example Figure 1 The fourth cross-sectional diagram at the AA position;

[0104] Figure 6 Example Figure 1 The fifth cross-sectional diagram at the AA position;

[0105] Figure 7 Example Figure 5 A schematic diagram of the orthographic projection distribution of the middle pixel opening, isolation structure and packaging protection structure on the substrate;

[0106] Figure 8 Example Figure 6 A schematic diagram of the orthographic projection distribution of the middle pixel opening, isolation structure and packaging protection structure on the substrate;

[0107] Fig. 9 One of the schematic diagrams of the orthographic projection distribution of the isolation opening and the first protection sub-portion on the substrate is illustrated;

[0108] Fig.10 The second schematic diagram of the orthographic projection distribution of the isolation opening and the first protection sub-portion on the substrate is illustrated;

[0109] Fig.11 The third schematic diagram of the orthographic projection distribution of the isolation opening and the first protection sub-portion on the substrate is illustrated;

[0110] Fig.12 A schematic diagram illustrating a structure of the isolation structure provided by this embodiment;

[0111] Fig.13 Another structural schematic diagram illustrating the isolation structure provided by this embodiment;

[0112] Fig.14 Example Figure 1 The sixth cross-sectional diagram of the AA position;

[0113] Fig.15 A schematic diagram illustrating a process of a method for preparing a display panel provided in this embodiment;

[0114] Fig.16 Example Fig.15 The corresponding process diagram;

[0115] Fig.17 One of the partial process flow charts illustrating the method for manufacturing a display panel provided in this embodiment;

[0116] Fig.18 The second partial process flow chart of the method for manufacturing the display panel provided in this embodiment is illustrated.

[0117] Icons: 1-display panel; 11-substrate; 12-isolation structure; 1201-isolation opening; 1201a-first isolation opening; 1201b-second isolation opening; 1201c-third isolation opening; 121-first isolation portion; 122-second isolation portion; 123-third isolation portion; 13-light-emitting device; 13a-first light-emitting device; 13b-second light-emitting device; 13c-third light-emitting device; 131-first electrode; 132-light-emitting material layer; 133-second electrode; 141-packaging unit; 141a-first packaging unit; 141b-third Two packaging units; 141c-third packaging unit; 1411-first packaging part; 1412-second packaging part; 142-first packaging layer; 143-second packaging layer; 15-packaging protection structure; 15a-first packaging protection structure; 15b-second packaging protection structure; 151a-first protection sub-part; 151b-second protection sub-part; 1511-first film layer; 1512-second film layer; 1513-third film layer; 1514-fourth film layer; 1515-fifth film layer; 1516-sixth film layer; 16-pixel defining layer; 1601-pixel opening. DETAILED DESCRIPTION

[0118] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0119] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0120] Improving the density of light-emitting devices in a display panel (i.e., pixel density) is an important way to improve the display effect. However, the display panels currently made using fine metal evaporation mask (FMM) technology are unable to further increase the density of light-emitting devices due to technical limitations. After long-term research, the inventors found that in order to solve the technical problem that the density of light-emitting devices cannot be further increased, an isolation structure is set in some display panels. When the light-emitting material layer and the cathode are evaporated in the entire layer, the light-emitting material layer and the cathode can be disconnected at the isolation structure position. Through multiple evaporation and multiple etching processes, light-emitting devices of different colors can be formed in different isolation openings. The above process is called light-emitting device patterning.

[0121] The above display panel has the problem of displaying dark spots. In order to solve this problem, the inventor innovatively designs the following technical solution. The specific implementation scheme of this application will be described in detail below in conjunction with the accompanying drawings. It should be noted that the defects existing in the above solutions in the prior art are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above technical problems and the solutions proposed in this embodiment below for the above problems should all be the contributions made by the inventor to this application in the process of invention and creation, and should not be understood as the technical content known to those skilled in the art.

[0122] Please refer to Figure 1 and Figure 2 , Figure 1 The schematic diagram of the distribution of the isolation structure and the isolation openings provided in this embodiment is illustrated. Figure 2 Example Figure 1 In the present embodiment, the display panel 1 includes a substrate 11, an isolation structure 12, a light emitting device 13, a packaging unit 141 and a packaging protection structure 15. The isolation structure 12 is located on one side of the substrate 11 and encloses a plurality of isolation openings 1201 on the substrate 11, and the light emitting device 13 is at least partially located in the isolation openings 1201.

[0123] The packaging unit 141 is used to encapsulate the light-emitting device 13 in the isolation opening 1201. Exemplarily, the packaging unit 141 includes a first packaging portion 1411 and a second packaging portion 1412 that are interconnected, wherein at least a portion of the first packaging portion 1411 is located on a side of the isolation structure 12 facing the isolation opening 1201, and the second packaging portion 1412 is located on a side of the isolation structure 12 away from the substrate 11.

[0124] The encapsulation protection structure 15 covers a portion of the first encapsulation portion 1411 and the second encapsulation portion 1412 .

[0125] After analyzing the causes of poor display dark spots, the inventors found that the failure of the packaging unit 141 is an important cause of the above technical problems, and the failure of the packaging is mainly caused by the damage of the first packaging part 1411 and the second packaging part 1412. For example, the first packaging part 1411 of the previously manufactured packaging unit 141 is easily damaged by over-engraving during the subsequent patterning process of the light-emitting device 13, and the second packaging part 1412 of the packaging unit 141 is easily damaged in the subsequent process due to being suspended. The solution provided by the above embodiment can protect the first packaging part 1411 and the second packaging part 1412 through the packaging protection structure 15, avoid the packaging failure caused by the damage of the above two parts, and improve the process yield of the display panel 1 and the stability of the display effect.

[0126] For further information, please refer to Figure 3 The display panel 1 also includes a pixel defining layer 16, which is located on the substrate 11. The isolation structure 12 is located on the side of the pixel defining layer 16 away from the substrate 11. The pixel defining layer 16 includes a pixel opening 1601, which is connected to the isolation opening 1201. The orthographic projection of the pixel opening 1601 on the substrate 11 is located within the orthographic projection of the isolation opening 1201 on the substrate 11, that is, the orthographic projection area of ​​the pixel opening 1601 on the substrate 11 is smaller than the orthographic projection area of ​​the isolation opening 1201 on the substrate 11, and at least part of the light-emitting device 13 is located in the pixel opening 1601.

[0127] In the direction away from the substrate 11, the light emitting device 13 includes a first electrode 131, a light emitting material layer 132 and a second electrode 133 which are stacked, the first electrode 131 is located on the side of the pixel defining layer 16 facing the substrate 11, the pixel opening 1601 partially exposes the first electrode 131, and the second electrode 132 overlaps the isolation structure 12. Exemplarily, the first electrode 131 can be an anode of the light emitting device 13, the second electrode 132 can be a cathode of the light emitting device 13, the isolation structure 12 is a conductive isolation structure, and the isolation structure 12 connects the second electrodes 133 of different light emitting devices 13 together, and provides the same voltage signal to the second electrodes 133 of different light emitting devices 13, so as to ensure uniform display brightness in different display areas.

[0128] In this embodiment, the orthographic projection of the encapsulation protection structure 15 on the substrate 11 partially overlaps with the orthographic projection of the light-emitting device 13 on the substrate 11, wherein the orthographic projection of the light-emitting device 13 on the substrate 11 refers to the orthographic projection of the light-emitting material layer 132 in the light-emitting device 13 on the substrate 11, and the actual light-emitting area of ​​the light-emitting device 13 will be smaller than the area of ​​the light-emitting material layer 132. Optionally, the orthographic projection of the encapsulation protection structure 15 on the substrate 11 may be located outside the orthographic projection of the light-emitting area of ​​the light-emitting device 13 on the substrate 11, so as to avoid the influence of the encapsulation protection structure 15 on the light-emitting device 13. Exemplarily, the actual light-emitting area of ​​the light-emitting device 13 corresponds to the area of ​​the light-emitting material layer 132 at the pixel opening 1601, that is, the orthographic projection of the encapsulation protection structure 15 on the substrate 11 is located outside the orthographic projection of the pixel opening 1601 on the substrate 11.

[0129] Please refer to Figure 4 The isolation opening 1201 includes a first isolation opening 1201a and a second isolation opening 1201b, the light-emitting device 13 includes a first light-emitting device 13a and a second light-emitting device 13b with different light-emitting colors, the encapsulation unit 141 includes a first encapsulation unit 141a and a second encapsulation unit 141b, and the encapsulation protection structure 15 includes a first encapsulation protection structure 15a.

[0130] At least part of the first light-emitting device 13a is located in the first isolation opening 1201a, at least part of the second light-emitting device 13b is located in the second isolation opening 1201b, the first encapsulation unit 141a is used to encapsulate the first light-emitting device 13a in the first isolation opening 1201a, and the second encapsulation unit 141b is used to encapsulate the second light-emitting device 13b in the second isolation opening 1201b.

[0131] In this case, the first light-emitting device 13a can be manufactured before the second light-emitting device 13b. Specifically, first, the film layer (for example, the light-emitting material layer 132 and the second electrode 133) and the packaging material layer of the first light-emitting device 13a are manufactured on the entire surface of one side where the isolation structure 12 is set. The isolation structure 12 can separate the film layer of the first light-emitting device 13a, form the first light-emitting device 13a in the first isolation opening 1201a, and form a first packaging unit 141a covering the first light-emitting device 13a; then, remove the film layer in the second isolation opening, and manufacture the film layer and the packaging material layer of the second light-emitting device 13b on the entire surface, form the second light-emitting device 13b and the second packaging unit 141b for packaging the second light-emitting device 13b in the second isolation opening 1201b; then, remove the film layer covering the first packaging unit 141a. Since the isolation structure 12 will block the second electrode 133, the second electrode 133 will not be continuously distributed on the side of the isolation structure 12 facing the isolation opening 1201 (i.e., the position of the first packaging part 1411 of the first packaging unit 141a). In the process of etching and removing the film layer covering the first packaging unit 141a, the etching material can easily etch the first packaging part 1411 of the first packaging unit 141a, resulting in the first packaging unit 141a being over-etched and damaged, thereby affecting the packaging performance of the first packaging unit 141a. In addition, the second packaging part 1412 of the first packaging unit 141a is suspended, that is, there is a gap between the second packaging part 1412 of the first packaging unit 141a and the isolation structure 12. In the subsequent process, the second packaging part 1412 is easily damaged, causing the packaging of the first packaging unit 141a to fail. For this reason, in this embodiment, the first packaging protection structure 15a can cover the first packaging part 1411 and the second packaging part 1412 of the first packaging unit 141a.

[0132] Please refer again Figure 4 , on the side of the isolation structure 12 between the adjacent first isolation opening 1201a and the second isolation opening 1201b away from the substrate 11, the first encapsulation protection structure 15a is connected to the second encapsulation unit 141b. Exemplarily, in the direction away from the substrate 11, the first encapsulation protection structure 15a includes a first film layer 1511, a second film layer 1512 and a third film layer 1513, the material of the first film layer 1511 is the same as the material of the light-emitting material layer 132 in the second light-emitting device 13b, the material of the second film layer 1512 is the same as the material of the second electrode 133 in the second light-emitting device 13b, and the material of the third film layer 1513 is the same as the material of the second encapsulation unit 141b.

[0133] In this embodiment, the first film layer 1511 and the light-emitting material layer 132 of the second light-emitting device 13b are arranged in the same layer, the second film layer 1512 and the second electrode 133 of the second light-emitting device 13b are arranged in the same layer, and the third film layer 1513 and the second packaging unit 141b are arranged in the same layer, that is, the first film layer 1511 and the light-emitting material layer 132 of the second light-emitting device 13b can be manufactured and formed in the same process technology, the second film layer 1512 and the second electrode 133 of the second light-emitting device 13b can be manufactured and formed in the same process technology, and the third film layer 1513 and the second packaging unit 141b can be manufactured and formed in the same process technology.

[0134] Optionally, the orthographic projection of the first encapsulation protection structure 15 a on the substrate 11 located on the side of the isolation structure 12 facing away from the substrate 11 surrounds the orthographic projection of the first isolation opening 1201 a on the substrate 11 .

[0135] Optionally, the third film layer 1513 of the first encapsulation protection structure 15a is connected to the second encapsulation unit 141b on the side of the isolation structure 12 between the adjacent first isolation openings 1201a and the second isolation openings 1201b away from the substrate 11. The second encapsulation unit 141b and the isolation structure 12 are filled with a film layer that is the same layer as the light-emitting material layer 132 and the second electrode 133 in the second light-emitting device 13b.

[0136] For further information, please refer to Figure 5 , the isolation opening 1201 further includes a third isolation opening 1201c, the light emitting device 13 includes a third light emitting device 13c having a light emitting color different from that of the first light emitting device 13a and the second light emitting device 13b, the encapsulation unit 141 includes a third encapsulation unit 141c, and the encapsulation protection structure 15 further includes a second encapsulation protection structure 15b. At least part of the third light emitting device 13c is located in the third isolation opening 1201c, and the third encapsulation unit 141c is used to encapsulate the third light emitting device 13c in the third isolation opening 1201c. Exemplarily, the first light emitting device 13a, the second light emitting device 13b, and the third light emitting device 13c can be any one of a red light emitting device, a green light emitting device, and a blue light emitting device, respectively.

[0137] The second encapsulation protection structure 15 b partially covers the first encapsulation portion 1411 and the second encapsulation portion 1412 of the second encapsulation unit 141 b .

[0138] In one implementation, please refer again to Figure 5, on the side of the isolation structure 12 between the adjacent second isolation opening 1201b and the third isolation opening 1201c away from the substrate 11, the second encapsulation protection structure 15b is connected to the third encapsulation unit 141c. Exemplarily, in the direction away from the substrate 11, the second encapsulation protection structure 15b includes a fourth film layer 1514, a fifth film layer 1515 and a sixth film layer 1516. Optionally, the material of the fourth film layer 1514 is the same as the material of the light-emitting material layer 132 in the third light-emitting device 13c, the material of the fifth film layer 1515 is the same as the material of the second electrode 133 in the third light-emitting device 13c, and the material of the sixth film layer 1516 is the same as the material of the third encapsulation unit 141c.

[0139] In this embodiment, the fourth film layer 1514 and the light-emitting material layer 132 of the third light-emitting device 13c are arranged in the same layer, the fifth film layer 1515 and the second electrode 133 of the third light-emitting device 13c are arranged in the same layer, and the sixth film layer 1516 and the third packaging unit 141b are arranged in the same layer, that is, the fourth film layer 1514 and the light-emitting material layer 132 of the third light-emitting device 13c can be manufactured and formed in the same process technology, the fifth film layer 1515 and the second electrode 133 of the third light-emitting device 13c can be manufactured and formed in the same process technology, and the sixth film layer 1516 and the third packaging unit 141c can be manufactured and formed in the same process technology.

[0140] Optionally, at a side of the isolation structure 12 between the adjacent second isolation opening 1201 b and the third isolation opening 1201 c away from the substrate 11 , the sixth film layer 1516 of the second encapsulation protection structure 15 b is connected to the third encapsulation unit.

[0141] Optionally, the orthographic projection of the second encapsulation protection structure 15 b on the substrate 11 located on the side of the isolation structure 12 facing away from the substrate 11 surrounds a portion of the orthographic projection of the second isolation opening 1201 b on the substrate 11 .

[0142] In this embodiment, a gap exists between the first packaging unit 141 a and the side of the isolation structure 12 away from the substrate 11 , and a gap exists between part of the second packaging unit 141 b and the side of the isolation structure 12 away from the substrate 11 .

[0143] In another implementation, see Figure 6, on the side of the isolation structure 12 between the adjacent first isolation opening 1201a and the second isolation opening 1201b away from the substrate 11, the first encapsulation protection structure 15a and the second encapsulation protection structure 15b are connected and arranged in the same layer. The first encapsulation protection structure 15a and the second encapsulation protection structure 15b are arranged around the first isolation opening 1201a and the second isolation opening 1201b respectively, and the first encapsulation protection structure 15a and the second encapsulation protection structure 15b have the same film layer structure, wherein the first film layer 1511 and the fourth film layer 1514 are made of the same material, the second film layer 1512 and the fifth film layer 1515 are made of the same material, and the third film layer 1513 and the sixth film layer 1516 are made of the same material. On the side of the isolation structure 12 between the adjacent second isolation opening 1201b and the third isolation opening 1201c away from the substrate 11, the first film layer 1511 and the fourth film layer 1514 are connected, the second film layer 1512 and the fifth film layer 1515 are connected, and the third film layer 1513 and the sixth film layer 1516 are connected. On a side of the isolation structure 12 between the adjacent second isolation opening 1201 b and the third isolation opening 1201 c away from the substrate 11 , the second encapsulation protection structure 15 b is connected to the third encapsulation unit 141 c .

[0144] Preferably, the material of the first film layer 1511 and the fourth film 1514 is the same as the material of the light-emitting material layer 132 in the third light-emitting device 13c, the material of the second film layer 1512 and the fifth film layer 1515 is the same as the material of the second electrode 133 in the third light-emitting device 13c, and the material of the third film layer 1513 and the sixth film layer 1516 is the same as the material of the second encapsulation unit 141b.

[0145] In this embodiment, a gap exists between the first packaging unit 141 a and the side of the isolation structure 12 away from the substrate 11 , and a gap also exists between the second packaging unit 141 b and the side of the isolation structure 12 away from the substrate 11 .

[0146] Please refer to Figure 5 , Figure 6 , Figure 7 and Figure 8, the contour lines of the orthographic projection of the pixel opening 1601 on the substrate 11 include a first contour line L1 corresponding to the first isolation opening 1201a, a second contour line L2 corresponding to the second isolation opening 1202b, and a second contour line L3 corresponding to the third isolation opening 1202c. The contour lines of the orthographic projection of the isolation structure 12 on the substrate 11 include a fourth contour line L4 corresponding to the first isolation opening 1201a, a fifth contour line L5 corresponding to the second isolation opening 1201b, and a sixth contour line L6 corresponding to the third isolation opening 1201c. The first contour line L1 and the third contour line L4 located on the same side have a first distance d1 between them, the second contour line L2 and the fifth contour line L5 located on the same side have a second distance d2 between them, and the third contour line L3 and the sixth contour line L6 located on the same side have a third distance d3 between them.

[0147] In this embodiment, in the first isolation opening 1201a, the first distances d1 located at different sides are equal, and in the third isolation opening 1201b, the third distances d3 located at different sides are equal, wherein the first distance d1 is greater than the third distance d3. In this way, the first isolation opening 1201a has a space for accommodating the first encapsulation protection structure 15a, so as to prevent the first encapsulation protection structure 15a from blocking the first light-emitting device 13a and affecting the light emission of the first light-emitting device 13a.

[0148] In this embodiment, in the second isolation opening 1201b, the second distance d2 at least on one side is equal to the first distance d1. Optionally, in the second isolation opening 1201b, the second distances d2 at different sides are all equal to the first distance d1.

[0149] In this embodiment, the first distance d1 is 2.5 μm-5 μm, and exemplarily, the first distance d1 includes 2.5 μm, 2.65 μm, 2.82 μm, 2.95 μm, 3.25 μm, 3.66 μm, 3.98 μm, 4.15 μm, 4.35 μm, 4.65 μm, 4.92 μm or 5 μm. The second distance d2 is 1 μm-4 μm, and exemplarily, the third distance d3 includes 1 μm, 1.251 μm, 1.5 μm, 1.85 μm, 2.2 μm, 2.8 μm, 3.1 μm, 3.5 μm, 3.7 μm or 4 μm.

[0150] Further, please refer again to Figure 5 , Figure 6 , Figure 7 and Figure 8, the contour line of the orthographic projection of the first encapsulation protection structure 15a on the substrate 11 includes a seventh contour line L7 corresponding to the first isolation opening 1201a, and the contour line of the orthographic projection of the second encapsulation protection structure 15b on the substrate 11 includes an eighth contour line L8 corresponding to the second isolation opening 1201b. There is a fourth distance d4 between the first contour line L1 and the seventh contour line L8 located on the same side, and there is a fifth distance d5 between the second contour line L2 and the eighth contour line L8 located on the same side, wherein the fourth distance d4 is equal to the fifth distance d5. In this arrangement, the light emission angle range of the first light-emitting device 13a and the second light-emitting device 13b are consistent, so that the display color deviation problem caused by the inconsistent light emission angle range of the two can be improved.

[0151] Optionally, the contour line of the orthographic projection of the third packaging unit 141c on the substrate 11 includes a ninth contour line L9 corresponding to the third isolation opening 1201c, wherein the ninth contour line L9 may correspond to the orthographic projection of the position of point A in the third packaging unit 141c on the substrate 11, and a sixth distance d6 is provided between the third contour line L3 and the ninth contour line L9 located on the same side. The fourth distance d4, the fifth distance d5, and the sixth distance d6 are equal, and in this design, the light emission angle ranges of the first light emitting device 13a, the second light emitting device 13b, and the third light emitting device 13c are consistent, and thus the display color deviation problem caused by the inconsistent light emission angle ranges of the three can be improved.

[0152] Further, please refer again to Figure 3 In this embodiment, the encapsulation protection structure 15 includes a first protection portion 151 and a second protection portion 152. The first protection portion 151 covers a first encapsulation portion 1411 and a second encapsulation portion 1412 of a portion of the encapsulation unit 141. The second protection portion 152 contacts the surface of the isolation structure 12 away from the substrate 11. The first protection portion 151 and the second protection portion 152 are connected to each other.

[0153] Optionally, the second protection portion 152 is located between adjacent second packaging portions 1412 .

[0154] Furthermore, the first protection portion 151 includes a first protection sub-portion 151 a covering the first packaging portion 1411 and a second protection sub-portion 151 b covering the second packaging portion 1412 .

[0155] like Fig. 9As shown, in one implementation of this embodiment, the contour line L4 of the orthographic projection of the first isolation opening 1201a on the substrate 11 is located within the orthographic projection of the first protection sub-portion 151a in the first encapsulation protection structure 15a on the substrate 11. For example, when the contour line L4 of the orthographic projection of the first isolation opening 1201a on the substrate 11 is a rectangle, the orthographic projection of the first protection sub-portion 151a in the first encapsulation protection structure on the substrate 11 is a rectangular ring. The contour line L5 of the orthographic projection of the second isolation opening 1202a on the substrate 11 is located within the orthographic projection of the first protection sub-portion 151a in the second encapsulation protection structure 15b on the substrate 11.

[0156] like Fig.10 As shown in FIG. 11, in another implementation manner of the present embodiment, the contour line L4 of the orthographic projection of the first isolation opening 1201a on the substrate 11 is located within the orthographic projection of the first protection sub-portion 151a in the first encapsulation protection structure 15a on the substrate 11. For example, when the contour line L4 of the orthographic projection of the first isolation opening 1201a on the substrate 11 is a rectangle, the orthographic projection of the first protection sub-portion 151a in the first encapsulation protection structure on the substrate 11 is a rectangular ring. The contour line L5 of the orthographic projection of the second isolation opening 1202a on the substrate 11 is partially located within the orthographic projection of the first protection sub-portion 151a in the second encapsulation protection structure 15b on the substrate 11. For example, as Fig.10 As shown, in the orthographic projection of the second isolation opening 1201a on the substrate 11, except for the side close to the first isolation opening 1201a, all other contour lines are located within the orthographic projection of the first protection sub-portion 151a in the second encapsulation protection structure 15b on the substrate 11. For another example, Fig.11 As shown, the contour line of the second isolation opening 1201 a close to the third isolation opening 1201 c in the orthographic projection on the substrate 11 is located within the orthographic projection of the first protection sub-portion 151 a in the second encapsulation protection structure 15 b on the substrate 11 .

[0157] In this embodiment, please refer to Fig.12 In the direction away from the substrate 11, the isolation structure 12 includes a first isolation portion 121 and a second isolation portion 122 which are stacked in sequence, the orthographic projection of the first isolation portion 121 on the substrate 11 is located within the orthographic projection of the second isolation portion 122 on the substrate 11, and the second isolation portion 122 extends toward the corresponding isolation opening 1201 relative to the first isolation portion 121. In the cross section perpendicular to the plane where the substrate 11 is located and passing through the center of the isolation opening 1201, the cross section of the isolation structure 12 may be T-shaped. Among them, the first isolation portion 121 may be a conductive isolation portion, and the second electrode 133 of the light-emitting device 13 may overlap the first isolation portion 121.

[0158] For further information, please refer to Fig.13, the isolation structure 12 further includes a third isolation portion 123. In the direction away from the substrate 11, the third isolation portion 123, the first isolation portion 121 and the second isolation portion 122 are stacked in sequence. The orthographic projection of the first isolation portion 121 on the substrate 11 may be located within the orthographic projection of the third isolation portion 123 on the substrate 11. In the cross section perpendicular to the plane of the substrate 11 and passing through the center of the isolation opening 1201, the cross section of the isolation structure 12 may be in an I-shape. The third isolation portion 123 may be a conductive isolation portion, and the second electrode 133 of the light-emitting device 13 may also overlap the third isolation portion 123.

[0159] For further information, please refer to Fig.14 The display panel 1 further includes a first encapsulation layer 142, which is located on a side of the encapsulation unit 141 away from the substrate 11, and the first encapsulation layer 142 at least covers the encapsulation unit 141. The first encapsulation layer 142 also fills the gap between the encapsulation unit 141 and the isolation structure 12, and the first encapsulation layer 142 has a flat surface on a side away from the substrate 11.

[0160] Further, please refer again to Fig.14 The display panel 1 further includes a second encapsulation layer 143 , and the second encapsulation layer 143 is located on a side of the first encapsulation layer 142 away from the substrate 11 .

[0161] Optionally, the materials of the encapsulation unit 141 and the second encapsulation layer 143 include inorganic encapsulation materials, and the material of the first encapsulation layer 142 includes organic encapsulation materials. The encapsulation unit 141 and the second encapsulation layer 143 can be formed by chemical vapor deposition (CVD), and the first encapsulation layer 142 can be formed by inkjet printing (IJP).

[0162] It is understandable that the display panel 1 may also include a touch function layer, an optical adhesive layer, a polarizer, a cover plate and other film layers stacked in sequence on the side of the second packaging layer 143 away from the substrate 11. The above film layers are conventional film layers of the display panel and will not be described in detail here.

[0163] Based on the same inventive concept, this embodiment also provides a method for preparing a display panel, please refer to Fig.15 and Fig.16 ,in Fig.15 The schematic diagram of the process of the method for preparing the display panel provided in this embodiment is illustrated. Fig.16 Example Fig.15 The corresponding process diagram is combined with the following Fig.15 and Fig.16 The method for manufacturing the display panel provided in this embodiment is described in detail.

[0164] Step S11, providing a substrate 11.

[0165] In this embodiment, the substrate 11 is a multi-layer structure, and the substrate 11 includes at least a plurality of conductive layers and insulating layers between adjacent conductive layers. A pixel circuit for providing a driving signal for the light-emitting device is formed in the substrate 11.

[0166] Step S12 , forming an isolation structure 12 including an isolation opening 1201 on one side of the substrate 11 .

[0167] Step S13 , manufacturing the light emitting device 13 and the packaging unit 141 for packaging the light emitting device 13 in the isolation opening 1201 .

[0168] The packaging unit 141 includes a first packaging portion 1411 and a second packaging portion 1412 connected to each other. At least part of the first packaging portion 1411 is located on a side of the isolation structure 12 facing the isolation opening 1201 , and the second packaging portion 1412 is located on a side of the isolation structure 12 away from the substrate 11 .

[0169] Step S14 , preparing a packaging protection structure 15 covering a portion of the first packaging portion 1411 and the second packaging portion 1412 .

[0170] The orthographic projection of the encapsulation protection structure 15 on the substrate 11 partially overlaps with the orthographic projection of the light emitting device 13 on the substrate 11. The orthographic projection of the light emitting device 13 on the substrate 11 refers to the orthographic projection of the light emitting material layer in the light emitting device 13 on the substrate 11. The actual light emitting area of ​​the light emitting device 13 is smaller than the area of ​​the light emitting material layer. Optionally, the orthographic projection of the encapsulation protection structure 15 on the substrate 11 may be located outside the orthographic projection of the light emitting area of ​​the light emitting device 13 on the substrate 11, so as to avoid the influence of the encapsulation protection structure 15 on the light emitting of the light emitting device 13.

[0171] In a possible implementation of this embodiment, please refer to Fig.17 The isolation opening 1201 includes a first isolation opening 1201a and a second isolation opening 1201b, the light emitting device 13 includes a first light emitting device 13a and a second light emitting device 13b of different light emitting colors, the encapsulation unit 141 includes a first encapsulation unit 141a and a second encapsulation unit 141b, and the encapsulation protection structure 15 includes a first encapsulation protection structure 15a. Step S13 can be implemented in the following manner.

[0172] A first light emitting device 13 a and a first encapsulation unit 141 a for encapsulating the first light emitting device 13 a are fabricated in the first isolation opening 1201 a .

[0173] In this implementation, step S14 can be implemented in the following manner.

[0174] First, a light-emitting material layer 132, a second electrode 133 and a packaging material layer of the second light-emitting device 13b are sequentially manufactured on the entire surface of one side of the substrate 11 where the isolation structure 12 is set, and a second light-emitting device 13b and a second packaging unit 141b for packaging the second light-emitting device 13b are formed in the second isolation opening 1201b.

[0175] The light emitting material layer, the second electrode and the packaging material layer covering the first light emitting device 13 a are removed by etching to form a first packaging protection structure 15 a covering the first packaging portion 1411 and the second packaging portion 1412 of the first packaging unit 141 .

[0176] In the direction away from the substrate 11, the first encapsulation protection structure 15a includes a first film layer 1511, a second film layer 1512 and a third film layer 1513. The material of the first film layer 1511 is the same as the material of the light-emitting material layer 132 in the second light-emitting device 13b, the material of the second film layer 1512 is the same as the material of the second electrode 133 in the second light-emitting device 13b, and the material of the third film layer 1513 is the same as the material of the second encapsulation unit 141b.

[0177] Further, in this embodiment, please refer again to Fig.17 , the isolation opening 1201 further includes a third isolation opening 1201c, the light emitting device 13 further includes a third light emitting device 13c having a light emitting color different from that of the first light emitting device 13a and the second light emitting device 13b, the encapsulation unit 141 further includes a third encapsulation unit 141c, and the encapsulation protection structure 15 further includes a second encapsulation protection structure 15b. Step S13 may further include manufacturing a third light emitting device 13c in the third isolation opening 1201c and a third encapsulation unit 141c for encapsulating the third light emitting device 13c.

[0178] Step S14 may further include etching away the light emitting material layer 132 , the second electrode 133 and the packaging material layer covering the second light emitting device 13 b to form a second packaging protection structure 15 b covering the first packaging portion 1411 and the second packaging portion 1412 of the second packaging unit 13 b .

[0179] In the direction away from the substrate 11, the second encapsulation protection structure 15b includes a fourth film layer 1514, a fifth film layer 1515 and a sixth film layer 1516. Optionally, the material of the fourth film layer 1514 is the same as the material of the light-emitting material layer 132 in the third light-emitting device 13c, the material of the fifth film layer 1515 is the same as the material of the second electrode 133 in the third light-emitting device 13c, and the material of the sixth film layer 1516 is the same as the material of the third encapsulation unit 141c.

[0180] In a possible implementation of this embodiment, please refer to Fig.18The isolation opening 1201 includes a first isolation opening 1201a, a second isolation opening 1201b and a third isolation opening 1201c, the light-emitting device 13 includes a first light-emitting device 13a, a second light-emitting device 13b and a third light-emitting device 13c with different light-emitting colors, the encapsulation unit 141 includes a first encapsulation unit 141a, a second encapsulation unit 141b and a third encapsulation unit 141c, the encapsulation protection structure 15 includes a first encapsulation protection structure 15a and a second protection structure 15b, and step S13 can be implemented in the following way.

[0181] First, a first light emitting device 13 a and a first encapsulation unit 141 a for encapsulating the first light emitting device 13 a are manufactured in the first isolation opening 1201 a .

[0182] Next, a second light emitting device 13b and a second encapsulation unit 141b for encapsulating the second light emitting device 13b are manufactured in the second isolation opening 1201b.

[0183] Then, the light-emitting material layer 132, the second electrode 133 and the packaging material layer of the third light-emitting device 13c are sequentially manufactured on the entire surface of one side of the substrate 11 where the isolation structure 12 is set, and the third light-emitting device 13c and the third packaging unit 141c for packaging the third light-emitting device 13c are formed in the third isolation opening 1201c.

[0184] In this embodiment, step S14 can be implemented in the following manner.

[0185] The light-emitting material layer, the second electrode and the packaging material layer covering part of the first light-emitting device 13a and the second light-emitting device 13b are partially removed by etching to form a first packaging protection structure 15a covering the first packaging part 1411 and the second packaging part 1412 of the first packaging unit 141a, and a second packaging protection structure 15b covering the first packaging part 1411 and the second packaging part 1412 of the second packaging unit 141b.

[0186] In the direction away from the substrate 11, the first encapsulation protection structure 15a includes a first film layer 1511, a second film layer 1512 and a third film layer 1513, and the second encapsulation protection structure 15b includes a fourth film layer 1514, a fifth film layer 1515 and a sixth film layer 1516. The materials of the first film layer 1511 and the fourth film 1514 are the same as the materials of the light-emitting material layer 132 in the third light-emitting device 13c, the materials of the second film layer 1512 and the fifth film layer 1515 are the same as the materials of the second electrode 133 in the third light-emitting device 13c, and the materials of the third film layer 1513 and the sixth film layer 1516 are the same as the materials of the second encapsulation unit 141b.

[0187] Based on the same inventive concept, an embodiment of the present application also provides an electronic device, which includes the display panel provided in the present application, or includes a display panel prepared by the display panel preparation method provided in the present embodiment. The electronic device may include a smart phone, a tablet computer, a vehicle-mounted display device, a smart wearable device, a television, a laptop computer, and other devices with a display function.

[0188] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and an electronic device. In the display panel, a packaging unit includes a first packaging part and a second packaging part connected to each other, at least part of the first packaging part is located on the side of the isolation structure facing the isolation opening, and the second packaging part is located on the side of the isolation structure away from the substrate, and the packaging protection structure covers part of the first packaging part and the second packaging part of the packaging unit. With such a design, the first packaging part and the second packaging part can be protected by the packaging protection structure, thereby avoiding packaging failure caused by damage to the above two parts, and improving the process yield of the display panel and the stability of the display effect.

[0189] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; An isolation structure, located on one side of the substrate and enclosing an isolation opening on the substrate; a light emitting device, at least partially located in the isolation opening; a packaging unit, used to package the light-emitting device in the isolation opening, the packaging unit comprising a first packaging portion and a second packaging portion connected to each other, at least a portion of the first packaging portion is located on a side of the isolation structure facing the isolation opening, and the second packaging portion is located on a side of the isolation structure away from the substrate; The packaging protection structure covers a portion of the first packaging part and the second packaging part.

2. The display panel according to claim 1, wherein: The display panel also includes a pixel defining layer; The pixel defining layer is located on the substrate, the isolation structure is located on a side of the pixel defining layer away from the substrate, the pixel defining layer includes a pixel opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate; At least part of the light emitting device is located within the pixel opening; Preferably, in a direction away from the substrate, the light-emitting device comprises a first electrode, a light-emitting material layer and a second electrode which are stacked, the first electrode is located on a side of the pixel defining layer facing the substrate, the pixel opening partially exposes the first electrode, and the second electrode overlaps the isolation structure; Preferably, the orthographic projection of the encapsulation protection structure on the substrate partially overlaps with the orthographic projection of the light emitting device on the substrate; Preferably, an orthographic projection of the encapsulation protection structure on the substrate is located outside an orthographic projection of the pixel opening on the substrate.

3. The display panel according to claim 2, wherein: The isolation opening includes a first isolation opening and a second isolation opening, the light emitting device includes a first light emitting device and a second light emitting device with different light emitting colors, the encapsulation unit includes a first encapsulation unit and a second encapsulation unit, and the encapsulation protection structure includes a first encapsulation protection structure; At least part of the first light-emitting device is located in the first isolation opening, at least part of the second light-emitting device is located in the second isolation opening, the first packaging unit is used to package the first light-emitting device in the first isolation opening, and the second packaging unit is used to package the second light-emitting device in the second isolation opening; The first encapsulation protection structure covers a portion of the first encapsulation portion and the second encapsulation portion of the first encapsulation unit.

4. The display panel according to claim 3, wherein: On a side of the isolation structure between the adjacent first isolation opening and the second isolation opening away from the substrate, the first encapsulation protection structure is connected to the second encapsulation unit; In a direction away from the substrate, the first encapsulation protection structure includes a first film layer, a second film layer and a third film layer; Preferably, the material of the first film layer is the same as the material of the light-emitting material layer in the second light-emitting device, the material of the second film layer is the same as the material of the second electrode in the second light-emitting device, and the material of the third film layer is the same as the material of the second packaging unit; Preferably, at a side of the isolation structure between the adjacent first isolation opening and the second isolation opening away from the substrate, the third film layer of the first encapsulation protection structure is connected to the second encapsulation unit; Preferably, the orthographic projection of the first encapsulation protection structure located on the side of the isolation structure facing away from the substrate on the substrate surrounds the orthographic projection of the first isolation opening on the substrate; Preferably, on a side of the isolation structure between the adjacent first isolation opening and the second isolation opening away from the substrate, a film layer that is the same layer as the light-emitting material layer and the second electrode in the second light-emitting device is filled between the second encapsulation unit and the isolation structure.

5. The display panel according to claim 4, wherein: The isolation opening further includes a third isolation opening, the light emitting device includes a third light emitting device having a light emitting color different from that of the first light emitting device and the second light emitting device, the encapsulation unit includes a third encapsulation unit, and the encapsulation protection structure further includes a second encapsulation protection structure; At least part of the third light-emitting device is located in the third isolation opening, and the third encapsulation unit is used to encapsulate the third light-emitting device in the third isolation opening; The second encapsulation protection structure covers a portion of the first encapsulation portion and the second encapsulation portion of the second encapsulation unit.

6. The display panel according to claim 5, characterized in that: On a side of the isolation structure between the adjacent second isolation opening and the third isolation opening away from the substrate, the second encapsulation protection structure is connected to the third encapsulation unit; In a direction away from the substrate, the second encapsulation protection structure includes a fourth film layer, a fifth film layer and a sixth film layer; Preferably, the material of the fourth film layer is the same as the material of the light-emitting material layer in the third light-emitting device, the material of the fifth film layer is the same as the material of the second electrode in the third light-emitting device, and the material of the sixth film layer is the same as the material of the third encapsulation unit; Preferably, at a side of the isolation structure between the adjacent second isolation opening and the third isolation opening away from the substrate, the sixth film layer of the second encapsulation protection structure is connected to the third encapsulation unit; Preferably, the orthographic projection of the second encapsulation protection structure located on the side of the isolation structure away from the substrate on the substrate surrounds a portion of the orthographic projection of the second isolation opening on the substrate; Preferably, a gap exists between the first packaging unit and a side of the isolation structure away from the substrate, and a gap exists between at least part of the second packaging unit and a side of the isolation structure away from the substrate.

7. The display panel according to claim 3, wherein: The isolation opening further includes a third isolation opening, the light emitting device includes a third light emitting device having a light emitting color different from that of the first light emitting device and the second light emitting device, the encapsulation unit includes a third encapsulation unit, and the encapsulation protection structure further includes a second encapsulation protection structure; At least part of the third light-emitting device is located in the third isolation opening, and the third encapsulation unit is used to encapsulate the third light-emitting device in the third isolation opening; The second encapsulation protection structure covers the first encapsulation part and the second encapsulation part of the second encapsulation unit; On a side of the isolation structure away from the substrate, the first packaging protection structure and the second packaging protection structure are connected and arranged in the same layer; The first encapsulation protection structure and the second encapsulation protection structure are respectively arranged around the first isolation opening and the second isolation opening; Preferably, the first encapsulation protection structure and the second encapsulation protection structure have the same film layer structure; In a direction away from the substrate, the first encapsulation protection structure includes a first film layer, a second film layer and a third film layer, and the second encapsulation protection structure includes a fourth film layer, a fifth film layer and a sixth film layer, wherein the first film layer and the fourth film layer are made of the same material, the second film layer and the fifth film layer are made of the same material, and the third film layer and the sixth film layer are made of the same material; Preferably, the material of the first film layer and the fourth film layer is the same as the material of the light-emitting material layer in the third light-emitting device, the material of the second film layer and the fifth film layer is the same as the material of the second electrode in the third light-emitting device, and the material of the third film layer and the sixth film layer is the same as the material of the third encapsulation unit.

8. The display panel according to claim 6 or 7, characterized in that: The contour line of the positive projection of the pixel opening on the substrate includes a first contour line corresponding to the first isolation opening, a second contour line corresponding to the second isolation opening, and a third contour line corresponding to the third isolation opening; The contour line of the orthographic projection of the isolation structure on the substrate includes a fourth contour line corresponding to the first isolation opening, a fifth contour line corresponding to the second isolation opening, and a sixth contour line corresponding to the third isolation opening; There is a first distance between the first contour line and the fourth contour line located on the same side, there is a second distance between the second contour line and the fifth contour line located on the same side, and there is a third distance between the third contour line and the sixth contour line located on the same side; Preferably, in the first isolation opening, first distances located at different sides are equal, and in the third isolation opening, third distances located at different sides are equal, wherein the first distance is greater than the third distance.

9. The display panel according to claim 8, wherein: In the second isolation opening, a second distance located at least on one side is equal to the first distance; Preferably, in the second isolation opening, the second distances located on different sides are equal to the first distance; Preferably, the first distance is 2.5 μm-5 μm, and the third distance is 1 μm-4 μm.

10. The display panel according to claim 8, wherein: The contour line of the orthographic projection of the first encapsulation protection structure on the substrate includes a seventh contour line corresponding to the first isolation opening, and the contour line of the orthographic projection of the second encapsulation protection structure on the substrate includes an eighth contour line corresponding to the second isolation opening; There is a fourth distance between the first contour line and the seventh contour line located on the same side, and there is a fifth distance between the second contour line and the eighth contour line located on the same side; The fourth distance is equal to the fifth distance; Preferably, the contour line of the orthographic projection of the third packaging unit on the substrate includes a ninth contour line corresponding to the third isolation opening, and the third contour line and the ninth contour line located on the same side have a sixth distance therebetween; Preferably, the fourth distance, the fifth distance and the sixth distance are equal.

11. The display panel according to any one of claims 3 to 7, characterized in that: The encapsulation protection structure includes a first protection portion and a second protection portion; The first protection portion covers a portion of the first packaging portion and the second packaging portion of the packaging unit, the second protection portion is in contact with a surface of the isolation structure away from the substrate, and the first protection portion and the second protection portion are connected to each other; Preferably, the second protection portion is located between adjacent second packaging portions.

12. The display panel as claimed in claim 11, characterized in that: The first protection portion includes a first protection sub-portion covering the first packaging portion and a second protection sub-portion covering the second packaging portion; The contour line of the orthographic projection of the first isolation opening on the substrate is located within the orthographic projection of the first protection sub-portion in the first encapsulation protection structure on the substrate; The contour line of the orthographic projection of the second isolation opening on the substrate is located within the orthographic projection of the first protection sub-portion in the second encapsulation protection structure on the substrate; or, The contour line portion of the orthographic projection of the second isolation opening on the substrate is located within the orthographic projection of the first protection sub-portion in the second encapsulation protection structure on the substrate; Preferably, the remaining contour lines of the second isolation opening in the orthographic projection on the substrate except for the side close to the first isolation opening are all located within the orthographic projection of the first protection sub-portion in the second encapsulation protection structure on the substrate; Preferably, a contour line of a side of the second isolation opening close to the third isolation opening in the orthographic projection on the substrate is located within the orthographic projection of the first protection sub-portion in the second encapsulation protection structure on the substrate.

13. A display panel, characterized in that: The display panel comprises: substrate; A pixel defining layer, located on the substrate, wherein the pixel defining layer includes a pixel opening; An isolation structure, located at a side of the pixel defining layer away from the substrate, the isolation structure comprising an isolation opening, the orthographic projection of the pixel opening on the substrate being located within the orthographic projection of the isolation opening on the substrate; a light emitting device, at least partly located in the isolation opening, The isolation opening includes a first isolation opening and a second isolation opening, the light-emitting device includes a first light-emitting device and a second light-emitting device with different light-emitting colors, at least part of the first light-emitting device is located in the first isolation opening, at least part of the second light-emitting device is located in the second isolation opening, and the contour line of the orthographic projection of the pixel opening on the substrate includes a first contour line corresponding to the first isolation opening and a second contour line corresponding to the second isolation opening; The contour line of the orthographic projection of the isolation structure on the substrate includes a fourth contour line corresponding to the first isolation opening and a fifth contour line corresponding to the second isolation opening; There is a first distance between the first contour line and the fourth contour line located on the same side, and there is a second distance between the second contour line and the fifth contour line located on the same side, wherein the first distance is greater than the second distance.

14. The display panel according to claim 13, wherein: The isolation opening further includes a third isolation opening, the light emitting device includes a third light emitting device having a light emitting color different from that of the first light emitting device and the second light emitting device, and at least part of the third light emitting device is located in the third isolation opening; The contour line of the orthographic projection of the pixel opening on the substrate includes a third contour line corresponding to the third isolation opening; The contour line of the orthographic projection of the isolation structure on the substrate includes a sixth contour line corresponding to the third isolation opening; A third distance exists between the third contour line and the sixth contour line located on the same side, wherein the third distance is smaller than the first distance; Preferably, the first distance is 2.5 μm-5 μm, and the third distance is 1 μm-4 μm.

15. A method for preparing a display panel, characterized in that: The method comprises: providing a substrate; Forming an isolation structure including an isolation opening on one side of the substrate; A light-emitting device and a packaging unit for packaging the light-emitting device are manufactured in the isolation opening, wherein the packaging unit comprises a first packaging portion and a second packaging portion connected to each other, at least a portion of the first packaging portion is located on a side of the isolation structure facing the isolation opening, and the second packaging portion is located on a side of the isolation structure away from the substrate; An encapsulation protection structure covering a portion of the first encapsulation portion and the second encapsulation portion is prepared.

16. The method for manufacturing a display panel according to claim 15, wherein: The isolation opening includes a first isolation opening and a second isolation opening, the light-emitting device includes a first light-emitting device and a second light-emitting device of different light-emitting colors, the encapsulation unit includes a first encapsulation unit and a second encapsulation unit, the encapsulation protection structure includes a first encapsulation protection structure, and the steps of manufacturing the light-emitting device in the isolation opening and the encapsulation unit for encapsulating the light-emitting device include: manufacturing a first light-emitting device and a first encapsulation unit for encapsulating the first light-emitting device in the first isolation opening; The step of preparing an encapsulation protection structure covering a portion of the first encapsulation portion and the second encapsulation portion comprises: A light-emitting material layer, a second electrode and a packaging material layer of a second light-emitting device are sequentially manufactured on the entire surface of one side of the substrate where the isolation structure is provided, and the second light-emitting device and a second packaging unit for packaging the second light-emitting device are formed in the second isolation opening; A portion of the light emitting material layer, the second electrode and the packaging material layer covering the first light emitting device is removed by etching to form a first packaging protection structure covering the first packaging part and the second packaging part of the first packaging unit.

17. The method for manufacturing a display panel according to claim 16, wherein: The isolation opening includes a third isolation opening, the light-emitting device also includes a third light-emitting device having a light-emitting color different from that of the first light-emitting device and the second light-emitting device, the encapsulation unit also includes a third encapsulation unit, the encapsulation protection structure also includes a second encapsulation protection structure, and the step of manufacturing the light-emitting device in the isolation opening and the encapsulation unit for encapsulating the light-emitting device further includes: A light-emitting material layer, a second electrode and a packaging material layer of a third light-emitting device are sequentially manufactured on the entire surface of one side of the substrate where the isolation structure is provided, and a third light-emitting device and a third packaging unit for packaging the third light-emitting device are formed in the third isolation opening; The step of preparing an encapsulation protection structure covering a portion of the first encapsulation portion and the second encapsulation portion further includes: A portion of the light emitting material layer, the second electrode and the packaging material layer covering the second light emitting device is removed by etching to form a second packaging protection structure covering the first packaging part and the second packaging part of the second packaging unit.

18. The method for preparing a display panel according to claim 15, wherein: The isolation opening includes a first isolation opening, a second isolation opening, and a third isolation opening; the light-emitting device includes a first light-emitting device, a second light-emitting device, and a third light-emitting device having different light-emitting colors; the encapsulation unit includes a first encapsulation unit, a second encapsulation unit, and a third encapsulation unit; the encapsulation protection structure includes a first encapsulation protection structure and a second protection structure; and the steps of manufacturing the light-emitting device and the encapsulation unit for encapsulating the light-emitting device in the isolation opening include: manufacturing a first light-emitting device and a first encapsulation unit for encapsulating the first light-emitting device in the first isolation opening; manufacturing a second light-emitting device and a second encapsulation unit for encapsulating the second light-emitting device in the second isolation opening; A light-emitting material layer, a second electrode and a packaging material layer of a third light-emitting device are sequentially manufactured on the entire surface of one side of the substrate where the isolation structure is provided, and a third light-emitting device and a third packaging unit for packaging the third light-emitting device are formed in the third isolation opening; The step of preparing an encapsulation protection structure covering a portion of the first encapsulation portion and the second encapsulation portion further includes: The light-emitting material layer, the second electrode and the packaging material layer covering part of the first light-emitting device and the second light-emitting device are partially removed by etching to form a first packaging protection structure covering the first packaging part and the second packaging part of the first packaging unit, and a second packaging protection structure covering the first packaging part and the second packaging part of the second packaging unit.

19. An electronic device, characterized in that: The electronic device comprises the display panel described in any one of claims 1 to 14, or a display panel prepared by the method for preparing a display panel described in any one of claims 15 to 18.

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