Display mother board, manufacturing method of display mother board and display panel

Abstract

The invention provides a display mother board, a manufacturing method of the display mother board and a display panel, the display mother board comprises a substrate layer, an anti-etching layer and a functional layer, the substrate layer is etched to form a first substrate area and a second substrate area which are separated from each other, the anti-etching layer comprises a first anti-etching area and a second anti-etching area, and the functional layer is arranged on the first substrate area and the second substrate area. The functional layer comprises a first functional area and a second functional area, the body comprises a first substrate area, a first anti-etching area and a first functional area, and the test board comprises a second substrate area, a second anti-etching area and a second functional area. When the substrate layer is etched, due to blocking of the anti-etching layer, etching liquid only etches the substrate layer to form the first substrate area and the second substrate area which are separated, after the test board tests the body, the anti-etching layer and the functional layer can be cut in a cutting mode, it can be guaranteed that the quality is high when the test board is cut, and the edge cannot be broken; and the influence of the etching liquid is avoided.

Description

Technical Field

[0001] The present invention belongs to the technical field of display devices, and more specifically, relates to a display motherboard, a method for manufacturing the display motherboard, and a display panel. Background Art

[0002] Hybrid OLED (Organic Light-Emitting Diode) is a hybrid organic light-emitting diode technology that combines the glass substrate of rigid OLED with the thin film encapsulation (TFE) of flexible OLED. Hybrid OLED has advantages in medium and large-sized panels. More and more medium and large-sized products tend to adopt the hybrid structure. Its rigid substrate + flexible encapsulation features make it have both the light and thin characteristics of flexibility and the structural strength of rigidity, and it has high reliability and better optical performance.

[0003] However, in order to test each display motherboard before the display panel is formed, a test pad (also called a CT pad) is provided at the edge of the display motherboard. The CT pad needs to be removed after the test. The current CT pad removal process has many disadvantages. Summary of the invention

[0004] The purpose of the embodiments of the present invention is to provide a display motherboard, a method for manufacturing the display motherboard and a display panel, so as to solve the technical problem that the process of removing the test board in the prior art has many disadvantages.

[0005] To achieve the above object, the technical solution adopted by the present invention is: to provide a display motherboard, comprising

[0006] a substrate layer, the substrate layer comprising a first substrate region and a second substrate region separated from each other by etching;

[0007] an anti-etching layer, disposed on one side of the base layer, comprising a first anti-etching region and a second anti-etching region connected to each other; and

[0008] A functional layer is arranged on a side of the anti-etching layer away from the base layer, and the functional layer includes a first functional area and a second functional area that are interconnected and conductive;

[0009] The display motherboard includes a main body and a test board, the main body includes the first substrate area, the first anti-etching area and the first functional area, the test board includes the second substrate area, the second anti-etching area, and the second functional area, and the connection between the first anti-etching area and the second anti-etching area and the connection between the first functional area and the second functional area form a cutting area.

[0010] Optionally, the cutting area is cut by laser to form the main body and the test board separated from each other; and / or the first substrate area and the second substrate area are separated from each other by etching.

[0011] Optionally, the material of the base layer includes glass, and the material of the anti-etching layer includes polyimide.

[0012] Optionally, the orthographic projection of the anti-etching layer on the base layer completely covers the orthographic projection of the cutting area on the base layer, the first functional area includes a display area and a border area arranged around the display area, and the orthographic projection of the first anti-etching area is located within the orthographic projection of the border area.

[0013] Optionally, a separation gap is formed between the first substrate region and the second substrate region, the anti-etching layer is in a strip shape and extends along the length direction of the separation gap, and the width of the anti-etching layer is greater than the width of the separation gap.

[0014] The present invention also provides a method for manufacturing a display motherboard, which is used to manufacture the above-mentioned body, comprising the following steps:

[0015] providing a substrate layer, the substrate layer comprising a first substrate region, a second substrate region, and a connection region connecting the first substrate region and the second substrate region;

[0016] Covering the base layer with an anti-etching layer, wherein the anti-etching layer comprises a first anti-etching region and a second anti-etching region connected to each other;

[0017] Forming a functional layer on the exposed base layer and the anti-etching layer, wherein the functional layer includes a first functional area and a second functional area which are connected and conductive to each other;

[0018] Etching the connection region so that the base layer is separated into the first base region and the second base region which are separated from each other;

[0019] The anti-etching layer and the functional layer are cut opposite to the connection area to separate the first anti-etching area from the second anti-etching area and the first functional area from the second functional area, thereby forming the main body and the test board separated from each other, and the test board is used to detect the main body.

[0020] Optionally, in the step of cutting the anti-etching layer and the functional layer directly opposite to the connection region, the anti-etching layer and the functional layer are cut by laser.

[0021] Optionally, the base layer is made of glass, the anti-etching layer is made of polyimide, and hydrofluoric acid is used to etch the connection area.

[0022] Optionally, the orthographic projection of the anti-etching layer on the base layer completely covers the connection area, a portion of the functional layer covers the connection area, and another portion covers the base layer.

[0023] The present invention further provides a display panel, comprising a plurality of the above-mentioned bodies.

[0024] The display motherboard, the manufacturing method of the display motherboard and the display panel provided by the present invention have the beneficial effects that: compared with the prior art, the display motherboard of the present invention includes a base layer, an anti-etching layer and a functional layer, the functional layer includes a first functional area and a second functional area that are interconnected and conductive, the first functional area, the first anti-etching area and the first base area form a body, and the second functional area, the second anti-etching area and the second base area form a test board. When etching the base layer, due to the blocking of the anti-etching layer, the etching liquid only etches the base layer to form a separated first base area and a second base area, and the functional layer is not affected by the etching liquid. After the test board tests the body, the anti-etching layer and the functional layer can be cut by cutting, so that the test board is separated from the body. In this way, it can be ensured that the quality of the test board when cutting is high, the edge will not collapse, and it will not be affected by the etching liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A schematic diagram of the three-dimensional structure of a display motherboard provided by an embodiment of the present invention;

[0027] Figure 2 A schematic diagram of the main structure of a display motherboard provided by an embodiment of the present invention;

[0028] Figure 3 A schematic diagram of the side structure of a display motherboard provided by an embodiment of the present invention;

[0029] Figure 4 A schematic diagram of the side structure of the main body provided by an embodiment of the present invention;

[0030] Figure 5 A schematic flow chart of a method for manufacturing a display motherboard provided by an embodiment of the present invention.

[0031] Among them, the reference numerals in the figure are:

[0032] 10-base layer; 11-first base area; 12-second base area; 13-separation gap; 20-anti-etching layer; 21-first anti-etching area; 22-second anti-etching area; 30-functional layer; 31-first functional area; 311-organic light-emitting layer; 312-organic encapsulation layer; 313-touch layer; 314-secondary encapsulation layer; 32-second functional area; 40-main body; 50-test board; 60-cutting area. DETAILED DESCRIPTION

[0033] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0034] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0035] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0037] Hybrid OLED combines the thin film encapsulation (TFE) of ordinary flexible OLED with a rigid substrate, which is thinner while maintaining a certain rigidity. When cutting the glass substrate to form the shape of the display panel, laser + etching or wheel cutting + grinding are generally used. Both cutting methods have some problems in the production process of the display panel.

[0038] Laser + etching method: In order to test each display motherboard before the display panel is formed, a test board (which can be called CT pad) is provided at the edge of the display motherboard. Its function is to test the function of the panel during the display panel forming process in order to find problems and intercept defective products. If the laser + etching method is used for forming, the CT pad cannot be removed by the laser + etching process, because after the display motherboard enters the hydrofluoric acid again, the other three sides that have been formed will be deformed due to the etching of the liquid, and the liquid will corrode the flexible light-emitting layer and the packaging layer through the side gaps, thereby rendering the product function ineffective. If the CT pad is not retained during the thinning + shape etching process, the panel function cannot be tested until after the display panel is formed and before the binding station, resulting in problems that cannot be discovered in time and defective products flowing into subsequent processes, causing greater losses.

[0039] Wheel cutting + grinding method: When cutting the glass substrate, the strength of the cutting edge cannot be guaranteed, and edge collapse, cracks, etc. may occur.

[0040] In order to solve the above technical problems, the embodiments of the present invention provide a display motherboard, a manufacturing method of the display motherboard and a display panel. The display motherboard includes a base layer 10, an anti-etching layer 20 and a functional layer 30, and the functional layer 30 includes a first functional area 31 for realizing a display function and a second functional area 32 for realizing a test function. By arranging the anti-etching layer 20 between the base layer 10 and the functional layer 30, the etching liquid can protect the functional layer 30 when etching the base layer 10, and is not affected by the etching liquid. The base layer 10 is etched by the etching liquid to form a first base area 11 and a second base area 12. After the test board 50 is tested, the second functional area 32 and the second anti-etching area 22 of the test board 50 are directly removed by cutting. In this way, the body 40 can be tested before the binding step to prevent defective products from flowing into subsequent processes, and the cutting quality of the cutting edge can be guaranteed.

[0041] The display motherboard, the method for manufacturing the display motherboard, and the display panel provided in the embodiments of the present invention can be applied to the Hybrid OLED mentioned in the background technology, and can also be applied to other types of display panels.

[0042] The display motherboard provided by the embodiment of the present invention is now described.

[0043] Please also read Figures 1 to 3The display motherboard includes a substrate layer 10, an anti-etching layer 20 and a functional layer 30, the substrate layer 10 includes a first substrate area 11 and a second substrate area 12 separated from each other, the anti-etching layer 20 is arranged on one side of the substrate layer 10, and includes a first anti-etching area 21 and a second anti-etching area 22 connected to each other, the functional layer 30 is arranged on a side of the anti-etching layer 20 away from the substrate layer 10, the functional layer 30 includes a first functional area 31 and a second functional area 32 connected to each other and conductive, the display motherboard includes a body 40 and a test board 50, the body 40 includes a first substrate area 11, a first anti-etching area 21 and a first functional area 31, the test board 50 includes a second substrate area 12, a second anti-etching area 22, and a second functional area 32, and the connection between the first anti-etching area 21 and the second anti-etching area 22 and the connection between the first functional area 31 and the second functional area 32 form a cutting area 60.

[0044] The display motherboard mainly includes two parts: a main body 40 and a test board 50. When the test board 50 and the main body 40 are electrically connected, the test board 50 can perform a functional test on the main body 40. Only when the function of the main body 40 is normal will it flow into the next process. Through the test of the test board 50, defective products can be detected in advance to reduce unnecessary losses. After the test board 50 completes the test of the main body 40, the test board 50 needs to be removed to complete the subsequent process.

[0045] The base layer 10 is the basic structure of the display motherboard and provides a basis for realizing the functions of the display motherboard. The base layer 10 has a front side and a back side. The anti-etching layer 20 is attached to the front side of the base layer 10. The back side of the base layer 10 is the thinning side, and etching and thinning are performed from the back side of the base layer 10. The base layer 10 includes a first base area 11 and a second base area 12 separated from each other. It can be understood that before the base layer 10 is processed, the first base area 11 and the second base area 12 are connected to each other, and the first base area 11 and the second base area 12 are separated from each other by separating the connection between the first base area 11 and the second base area 12, and the first base area 11 and the second base area 12 are not connected to each other.

[0046] The anti-etching layer 20 does not react with the etching solution. The anti-etching layer 20 covers the front side of the base layer 10. When etching the back side of the base layer 10, even if the base layer 10 is penetrated, the etching solution will not react with the anti-etching layer 20, thereby protecting the functional layer 30. The anti-etching layer 20 includes a first anti-etching area 21 and a second anti-etching area 22 connected to each other. The first anti-etching area 21 and the second anti-etching area 22 are connected to each other in structure.

[0047] The functional layer 30 covers the side of the anti-etching layer 20 away from the base layer 10, and the functional layer 30 is used to realize the light-emitting function of the display motherboard and the test function of the test board 50. The functional layer 30 includes a first functional area 31 and a second functional area 32 that are connected and conductive to each other. The first functional area 31 and the second functional area 32 are not only structurally connected to each other, but also conductively connected. The first functional area 31 is used to realize the display function, and the second functional area 32 is used to realize the test function.

[0048] The body 40 includes a first substrate area 11, a first anti-etching area 21 and a first functional area 31, and is used to implement a display function. The test board 50 includes a second substrate area 12, a second anti-etching area 22 and a second functional area 32, and is used to implement a functional test on the body 40.

[0049] In the display motherboard of the present invention, the first substrate area 11 and the second substrate area 12 are separated from each other, and the first functional area 31 and the second functional area 32 remain connected and conductive. In this state, the test board 50 can perform a functional test on the main body 40 to prevent defective products from entering the next process. After the test is completed, the test board 50 is removed from the edge of the main body 40 by cutting. The connection between the first anti-etching area 21 and the second anti-etching area 22 and the connection between the first functional area 31 and the second functional area 32 form a cutting area 60, and when removing the test board 50, it is cut from the cutting area 60. In short, when removing the test board 50, the substrate layer 10 is separated by etching, and the anti-etching layer 20 and the functional layer 30 are separated by cutting.

[0050] The display motherboard in the above embodiment includes a base layer 10, an anti-etching layer 20 and a functional layer 30, wherein the functional layer 30 includes a first functional area 31 and a second functional area 32 which are connected and conductive to each other, wherein the first functional area 31, the first anti-etching area 21 and the first base area 11 form a body 40, and the second functional area 32, the second anti-etching area 22 and the second base area 12 form a test board 50. When etching the base layer 10, due to the blocking of the anti-etching layer 20, the etching liquid only etches the base layer 10 to form the separated first base area 11 and the second base area 12, and the functional layer 30 is not affected by the etching liquid. After the test board 50 tests the body 40, the anti-etching layer 20 and the functional layer 30 can be cut by cutting, thereby separating the test board 50 from the body 40. In this way, it is possible to ensure that the quality of the test board 50 is high when it is cut, and the edge will not collapse and will not be affected by the etching liquid.

[0051] In some embodiments of the present invention, the first substrate area 11 and the second substrate area 12 are separated from each other by etching. When processing to form a display motherboard, the raw material of the substrate layer 10 is a complete plate structure. After the anti-etching layer 20 and the functional layer 30 are formed on the substrate layer 10, it is necessary to cut the connection between the main body 40 and the test board 50, and separate the substrate layer 10 into the first substrate area 11 and the second substrate area 12 by etching. Under the barrier of the anti-etching layer 20, the functional layer 30 will not be affected, and the etching separation effect is better, which can reduce the occurrence of edge collapse, cracks, etc.

[0052] In some embodiments of the present invention, the cutting area 60 is cut by laser to form the separated body 40 and the test board 50. The laser cutting path is distributed along the extension direction of the cutting area 60, so that the connection between the display body and the test board 50 (cutting area 60) is separated by laser cutting.

[0053] The anti-etching layer 20 and the functional layer 30 are cut by laser cutting, which has low cost, mature technology and high cutting accuracy.

[0054] In some embodiments, the body 40 is square or approximately square (hereinafter referred to as square), and accordingly, the first substrate area 11, the first anti-etching area 21, and the first functional area 31 are square. One side of the test board 50 is connected to one side of the body 40. In this way, when cutting the test board 50, the cutting area 60 is located on one side of the body 40, and a cutting edge is formed only on one side, which will not affect the other three sides of the body 40.

[0055] In some embodiments, the cutting area 60 is in a strip shape and extends along one side of the body 40 . Only one side of the body 40 is cut, and the other sides are not affected by the cutting and etching.

[0056] Optionally, the cutting area 60 is linear or curved. The specific shape of the cutting area 60 is related to the shape of the body 40. When the edge of the body 40 is linear, the cutting area 60 is linear. When the edge of the body 40 is curved, for example, when the corner of the display motherboard is a rounded structure, the cutting area 60 is curved.

[0057] In some embodiments of the present invention, the material of the base layer 10 includes glass, and the material of the anti-etching layer 20 includes polyimide. The base layer 10 is glass, so that the display panel corresponding to the display motherboard is a Hybrid OLED, which has a high structural strength and is light and thin. The anti-etching layer 20 is polyimide (abbreviated as PI), which does not react with the etching solution.

[0058] By setting the base layer 10 to be glass, the structural strength of the body 40 can be ensured. By setting the anti-etching layer 20 to be polyimide, it is possible to prevent it from reacting with a conventional etching solution.

[0059] When etching the glass, a mask layer is first covered on the back of the base layer 10, and the etching solution etches the portion not covered by the mask layer. The etching solution reacts chemically with the base layer 10, so that the portion not covered by the base layer 10 is completely etched, and the base layer 10 is divided into a first base region 11 and a second base region 12, and then the mask layer is removed.

[0060] In other embodiments, the anti-etching layer 20 may also be made of other materials that do not react with the etching solution.

[0061] In some embodiments, the etching solution is hydrofluoric acid, which is a commonly used etching solution and the hydrofluoric acid etching process is relatively mature.

[0062] In some embodiments of the present invention, see Figure 3 , the orthographic projection of the anti-etching layer 20 on the base layer 10 completely covers the orthographic projection of the cutting area on the base layer 10. The separation gap 13 between the first base area 11 and the second base area 12 is the etching area, and the orthographic projection of the anti-etching layer 20 on the base layer 10 completely covers the orthographic projection of the cutting area on the base layer 10, that is, the anti-etching layer 20 completely covers the etching area, when the etching solution etches through the base layer 10, the etching solution and the anti-etching layer 20 are in contact with each other, and under the blocking of the anti-etching layer 20, the etching solution will not contact the functional layer 30, and will not affect the functional layer 30. The functional layer 30 completely covers the orthographic projection of the anti-etching layer 20 on the functional layer 30, which can be understood as, in the area of ​​the anti-etching layer 20 in the functional layer 30, the area of ​​the anti-etching layer 20 is smaller than the area of ​​the functional layer 30.

[0063] The anti-etching layer 20 completely covers the separation gap 13 between the first substrate area 11 and the second substrate area 12 , thereby completely blocking the etching liquid, so as to prevent the etching liquid from corroding the functional layer 30 .

[0064] In some embodiments, the functional layer 30 completely covers the anti-etching layer 20 . By making the functional layer 30 completely cover the anti-etching layer 20 , the area of ​​the anti-etching layer 20 can be reduced, and the anti-etching layer 20 only needs to block the separation gap 13 .

[0065] In some embodiments, the first functional area 31 includes a display area and a frame area arranged around the display area, and the orthographic projection of the first anti-etching area 21 is located within the orthographic projection of the frame area. The first anti-etching area 21 does not block the display area of ​​the first functional area 31, and the anti-etching layer 20 is only arranged at the connection area between the first functional area 31 and the second functional area 32, so as to facilitate the removal of the test board 50 without affecting the display effect of the display motherboard.

[0066] In some embodiments, the first functional area 31 completely covers the first anti-etching area 21 , the first functional area 31 completely overlaps with the first anti-etching area 21 , and the first functional area 31 and the first anti-etching area 21 have the same area.

[0067] In some embodiments, see Figure 3 and Figure 4 The first functional area 31 completely covers the first anti-etching area 21 , a portion of the first functional area 31 completely covers the first anti-etching area 21 , and another portion of the first functional area 31 covers the first base layer 10 .

[0068] In some embodiments, the second functional area 32 completely covers the second anti-etching area 22 , the second functional area 32 completely overlaps with the second anti-etching area 22 , and the first functional area 31 is equal to the first anti-etching area 21 .

[0069] In some embodiments, the second functional region 32 completely covers the second anti-etching region 22 , a portion of the second functional region 32 completely covers the second anti-etching region 22 , and another portion of the second functional region 32 covers the second base layer 10 .

[0070] In other embodiments, the second anti-etching region 22 is disposed beyond the second functional region 32 , and the area of ​​the second anti-etching region 22 is larger than the area of ​​the second functional region 32 .

[0071] In some embodiments, see Figures 1 to 3 , a separation gap is formed between the first substrate area 11 and the second substrate area 12, the anti-etching layer 20 is in the shape of a strip, and is extended along the length direction of the separation gap 13, and the width of the anti-etching layer 20 is greater than the width of the separation gap 13. The separation gap 13 is a strip structure, and the width of the separation gap 13 is the distance between the first substrate area 11 and the second substrate area 12. The anti-etching layer 20 is in the shape of a strip, and its length direction is the same as the length direction of the separation gap 13, and its width direction is the same as the width direction of the separation gap 13. The anti-etching layer 20 can completely block the separation gap 13 in the width direction. Among them, the width direction of the anti-etching layer 20 and the width direction of the separation gap 13 are both Figure 3 Horizontal direction in .

[0072] By setting the anti-etching layer 20 in a strip shape, the separation gap 13 can be completely covered to isolate the base layer 10 and the functional layer 30 , and the area of ​​the anti-etching layer 20 can be reduced, thereby reducing the cost of raw materials.

[0073] In some embodiments, the anti-etching layer 20 is a linear strip structure, and accordingly, the edge of the body 40 is also a linear structure.

[0074] In some embodiments, the anti-etching layer 20 is a curved strip structure, and accordingly, the edge of the body 40 is also a curved structure.

[0075] In some embodiments, the width of the anti-etching layer 20 is at least twice the width of the separation gap 13, and the center line of the anti-etching layer 20 in the width direction coincides with the center line of the separation gap 13 in the width direction, that is, the anti-etching layer 20 and the separation gap 13 form a symmetrical structure in the width direction. In this way, on the basis of shielding the separation gap 13, the anti-etching layer 20 has a safe distance between its two side edges in the width direction and the edges of the separation gap 13 to prevent the etching solution from invading the functional layer 30.

[0076] In some embodiments of the present invention, the two sides of the anti-etching layer 20 in the width direction are respectively the first side and the second side, and correspondingly, the two sides of the separation gap 13 in the width direction are respectively the first side and the second side, and the distance between the first side of the anti-etching layer 20 and the first side of the separation gap 13 is at least half of the width of the separation gap 13, so that there is a safety distance between the first side of the anti-etching layer 20 and the first side of the separation gap 13 to prevent the etching solution from invading the functional layer 30.

[0077] In some embodiments of the present invention, the distance between the second side of the anti-etching layer 20 and the second side of the separation gap 13 is at least half of the width of the separation gap 13, so that there is a safety distance between the second side of the anti-etching layer 20 and the second side of the separation gap 13 to prevent the etching solution from invading the functional layer 30.

[0078] In some embodiments of the present invention, before etching the base layer 10, a crack can be made on the back of the base layer 10 by laser, and then the crack can be etched by etching liquid to form the above-mentioned separation gap 13. By making the crack by laser first, the etching liquid can be guided so that the etching liquid etches at the crack, and the etching effect is better.

[0079] In some embodiments of the present invention, see Figure 4 The first functional area 31 includes an organic light emitting layer 311, an organic encapsulation layer 312, a touch layer 313 and a secondary encapsulation layer 314 stacked in sequence, wherein the organic light emitting layer 311 is arranged closer to the first substrate area 11 than the secondary encapsulation layer 314. The secondary encapsulation layer 314 may be a flexible encapsulation layer.

[0080] The manufacturing method of the display motherboard provided by the embodiment of the present invention is now described. The manufacturing method of the display motherboard provided by the embodiment of the present invention is used to manufacture the body 40 described in any of the above embodiments.

[0081] See also Figure 5 , the manufacturing method of the display motherboard comprises the following steps:

[0082] S10: stacking an anti-etching layer 20 and a functional layer 30 in sequence on a base layer 10 to provide a base layer 10, wherein the base layer 10 includes a first base region 11, a second base region 12, and a connection region connecting the first base region 11 and the second base region 12;

[0083] S20: Covering the base layer 10 with an anti-etching layer 20, wherein the anti-etching layer 20 includes a first anti-etching region 21 and a second anti-etching region 22 connected to each other;

[0084] S30: forming a functional layer 30 on the exposed base layer 10 and the anti-etching layer 20, wherein the functional layer 30 includes a first functional area 31 and a second functional area 32 that are connected and conductive to each other;

[0085] S40: etching the connection region so that the base layer 10 is separated into a first base region 11 and a second base region 12 which are separated from each other;

[0086] S50: Cut the anti-etching layer 20 and the functional layer 30 at the connection area to separate the first anti-etching area 21 and the second anti-etching area 22 from each other, and separate the first functional area 31 and the second functional area 32 from each other, to form a main body 40 and a test board 50 separated from each other, and the test board 50 is used to detect the main body 40.

[0087] In S30, the functional layer 30 is covered on the exposed base layer 10 and the anti-etching layer 20, and the functional layer 30 may partially cover the base layer 10 and partially cover the anti-etching layer 20. In S40, under the action of the anti-etching layer 20, only the base layer 10 is etched, and the functional layer 30 does not contact the etching solution.

[0088] The base layer 10 is the basic structure of the display motherboard and provides a basis for realizing the functions of the display motherboard. The base layer 10 has a front side and a back side. The anti-etching layer 20 is attached to the front side of the base layer 10. The back side of the base layer 10 is the thinning side. Etching and thinning are performed from the connection area on the back side of the base layer 10.

[0089] The anti-etching layer 20 does not react with the etching solution. The anti-etching layer 20 covers the front side of the base layer 10. When etching the back side of the base layer 10, even if the base layer 10 is penetrated, the etching solution will not react with the anti-etching layer 20, thereby protecting the functional layer 30. The anti-etching layer 20 includes a first anti-etching area 21 and a second anti-etching area 22 connected to each other. The first anti-etching area 21 and the second anti-etching area 22 are connected to each other in structure.

[0090] The functional layer 30 covers the side of the anti-etching layer 20 away from the base layer 10, and the functional layer 30 is used to realize the light-emitting function of the body 40 and the test function of the test board 50. The functional layer 30 includes a first functional area 31 and a second functional area 32 that are interconnected and conductive. The first functional area 31 and the second functional area 32 are not only structurally connected to each other, but also conductively connected. The first functional area 31 is used to realize the display function, and the second functional area 32 is used to realize the test function.

[0091] The first substrate area 11 , the first anti-etching area 21 , and the first functional area 31 form a body 40 for realizing a display function. The second substrate area 12 , the second anti-etching area 22 , and the second functional area 32 form a test board 50 for realizing a functional test on the body 40 .

[0092] Among them, the connection between the first substrate area 11 and the second substrate area 12 (connection area), the connection between the first anti-etching area 21 and the second anti-etching area 22, and the connection between the first functional area 31 and the second functional area 32 are arranged opposite to each other, so that the etching edge formed by the etched connection area and the cutting edge formed by the cutting together form the same side edge of the main body 40.

[0093] In the manufacturing method of the display motherboard in the above embodiment, the base layer 10 is separated into the first base area 11 and the second base area 12 by etching. Due to the blocking of the anti-etching layer 20, the functional layer 30 is not affected by the etching solution. After the test board 50 tests the main body 40, the anti-etching layer 20 and the functional layer 30 can be cut by cutting, thereby separating the test board 50 from the main body 40. In this way, the quality of the test board 50 during cutting can be ensured to be high, the edge will not collapse, and it will not be affected by the etching solution.

[0094] In some embodiments of the present invention, before S40 , the body 40 is tested by the test board 50 , that is, after the test is completed, the base layer 10 is etched.

[0095] In some embodiments of the present invention, between S40 and S50 , the body 40 is tested by the test board 50 , that is, after the base layer 10 is etched, the body 40 is tested again.

[0096] In some embodiments of the present invention, in the step of cutting the anti-etching layer 20 and the functional layer 30 at the connection area, the anti-etching layer 20 and the functional layer 30 are cut by laser. By cutting the anti-etching layer 20 and the functional layer 30 by laser, the anti-etching layer 20 is divided into the first anti-etching area 21 and the second anti-etching area 22, and the functional layer 30 is divided into the first functional area 31 and the second functional area 32.

[0097] Cutting the anti-etching layer 20 and the functional layer 30 by laser cutting has low cost, mature process and high cutting accuracy.

[0098] In some embodiments, the body 40 is square or approximately square (hereinafter referred to as square), and accordingly, the first substrate area 11, the first anti-etching area 21, and the first functional area 31 are square. One side of the test board 50 is connected to one side of the body 40. In this way, when cutting the test board 50, the cutting area 60 is located on one side of the body 40, and a cutting edge is formed only on one side, which will not affect the other three sides of the body 40.

[0099] In some embodiments, the connection area is in a strip shape and extends along one side of the body 40 . Only one side of the body 40 is cut, and the other sides are not affected by the cutting and etching.

[0100] Optionally, the connection area is linear or curved. The specific shape of the connection area is related to the shape of the body 40. When the edge of the body 40 is linear, the connection area is linear. When the edge of the body 40 is curved, for example, when the corner of the display motherboard is a rounded structure, the connection area is curved.

[0101] In some embodiments of the present invention, the base layer 10 is made of glass, the anti-etching layer 20 is made of polyimide, and the connection area is etched using hydrofluoric acid.

[0102] By setting the base layer 10 as glass, the structural strength of the display motherboard can be ensured. By setting the anti-etching layer 20 as polyimide, it can be prevented from reacting with conventional etching solutions. Hydrofluoric acid is a commonly used etching solution, and the hydrofluoric acid etching process is relatively mature.

[0103] In some embodiments of the present invention, see Figure 3 The orthographic projection of the anti-etching layer 20 on the base layer 10 completely covers the connection area, a portion of the functional layer 30 covers the connection area, and another portion covers the base layer 10 .

[0104] The area of ​​the functional layer 30 may be larger than that of the anti-etching layer 20 . The area of ​​the anti-etching layer 20 is relatively small and only needs to shield the connection area, thereby reducing the use of raw materials.

[0105] In other embodiments, the first functional area 31 completely covers the first anti-etching area 21 , the first functional area 31 completely overlaps with the first anti-etching area 21 , and the first functional area 31 and the first anti-etching area 21 have the same area.

[0106] In other embodiments, the second functional area 32 completely covers the second anti-etching area 22 , the second functional area 32 completely overlaps with the second anti-etching area 22 , and the first functional area 31 is equal to the first anti-etching area 21 .

[0107] In other embodiments, the second functional region 32 completely covers the second anti-etching region 22 , a portion of the second functional region 32 completely covers the second anti-etching region 22 , and another portion of the second functional region 32 covers the second base layer 10 .

[0108] In other embodiments, the second anti-etching region 22 is disposed beyond the second functional region 32 , and the area of ​​the second anti-etching region 22 is larger than the area of ​​the second functional region 32 .

[0109] The display panel provided by the embodiment of the present invention is now described.

[0110] The display panel provided by the present invention comprises a plurality of bodies 40 in any of the above embodiments, and the plurality of bodies 40 can be arranged in an array. The display panel can be applied to devices such as tablets, notebook computers, and televisions.

[0111] The display panel provided by the present invention adopts the above-mentioned body 40. During the manufacturing process of the body 40, when etching the base layer 10, due to the blocking of the anti-etching layer 20, the etching liquid only etches the base layer 10 to form the separated first base area 11 and the second base area 12, and the functional layer 30 is not affected by the etching liquid. After the test board 50 tests the body 40, the anti-etching layer 20 and the functional layer 30 can be cut by cutting, thereby separating the test board 50 from the body 40. In this way, it can ensure that the quality of the test board 50 is high when cutting, and the edge will not collapse and will not be affected by the etching liquid.

[0112] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A display motherboard, characterized in that: include a substrate layer, the substrate layer comprising a first substrate region and a second substrate region separated from each other; an anti-etching layer, disposed on one side of the base layer, comprising a first anti-etching region and a second anti-etching region connected to each other; and A functional layer is arranged on a side of the anti-etching layer away from the base layer, and the functional layer includes a first functional area and a second functional area that are interconnected and conductive; The display motherboard includes a main body and a test board, the main body includes the first substrate area, the first anti-etching area and the first functional area, the test board includes the second substrate area, the second anti-etching area, and the second functional area, and the connection between the first anti-etching area and the second anti-etching area and the connection between the first functional area and the second functional area form a cutting area.

2. The display motherboard according to claim 1, characterized in that: The cutting area is cut by laser to form the main body and the test board separated from each other; and / or the first substrate area and the second substrate area are separated from each other by etching.

3. The display motherboard according to claim 1, characterized in that: The material of the base layer includes glass, and the material of the anti-etching layer includes polyimide.

4. The display motherboard according to any one of claims 1 to 3, characterized in that: The orthographic projection of the anti-etching layer on the base layer completely covers the orthographic projection of the cutting area on the base layer. The first functional area includes a display area and a frame area arranged around the display area. The orthographic projection of the first anti-etching area is located within the orthographic projection of the frame area.

5. The display motherboard according to claim 4, characterized in that: A separation gap is formed between the first substrate region and the second substrate region. The anti-etching layer is in a strip shape and extends along the length direction of the separation gap. The width of the anti-etching layer is greater than the width of the separation gap.

6. A method for manufacturing a display motherboard, used for manufacturing the body according to any one of claims 1 to 5, characterized in that: The following steps are involved: providing a substrate layer, the substrate layer comprising a first substrate region, a second substrate region, and a connection region connecting the first substrate region and the second substrate region; Covering the base layer with an anti-etching layer, wherein the anti-etching layer comprises a first anti-etching region and a second anti-etching region connected to each other; Forming a functional layer on the exposed base layer and the anti-etching layer, wherein the functional layer includes a first functional area and a second functional area which are connected and conductive to each other; Etching the connection region so that the base layer is separated into the first base region and the second base region which are separated from each other; The anti-etching layer and the functional layer are cut opposite to the connection area to separate the first anti-etching area from the second anti-etching area and the first functional area from the second functional area, thereby forming the main body and the test board separated from each other, and the test board is used to detect the main body.

7. The method for manufacturing a display motherboard according to claim 6, wherein: In the step of cutting the anti-etching layer and the functional layer directly opposite to the connection region, the anti-etching layer and the functional layer are cut by laser.

8. The method for manufacturing a display motherboard according to claim 6, wherein: The base layer is made of glass, the anti-etching layer is made of polyimide, and the connection area is etched with hydrofluoric acid.

9. The method for manufacturing a display motherboard according to claim 6, wherein: The orthographic projection of the anti-etching layer on the base layer completely covers the connection area, a portion of the functional layer covers the connection area, and another portion covers the base layer.

10. A display panel, characterized in that: It comprises a plurality of bodies as described in any one of claims 1 to 5.

Images