Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The display panel comprises an array substrate, a base material layer arranged on one side of the array substrate, a metal layer arranged on the side, away from the array substrate, of the base material layer and wires. A via hole is arranged in the base material layer, and the wire is arranged in the via hole and connects the substrate with the metal layer. According to the display panel, the metal layer is additionally arranged to dissipate heat of the array substrate, meanwhile, the heat dissipation efficiency of the array substrate is improved through wiring, and heat accumulation in the display panel is prevented.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] With the continuous development of OLED (Organic Light-Emitting Diode) display technology, touch screens are increasingly commonly used in display devices such as smart phones and tablet computers.

[0003] The integrated circuit part of the OLED display module is prone to heat generation due to its high power, which not only affects the performance of the device, but may also cause the device to overheat and be damaged. Therefore, how to effectively solve the heat dissipation problem of the OLED display module is an important issue that needs to be solved in the current fields of OLED display technology, electronic equipment heat dissipation technology, and semiconductor device packaging technology. Summary of the invention

[0004] The object of the present invention is to provide a display panel and a method for manufacturing the same, and a display device, so as to solve the problem of poor heat dissipation of an OLED display module in the prior art.

[0005] To achieve the above object, the present invention provides a display panel, the display panel comprising an array substrate, a substrate layer, a metal layer and a wiring. The substrate layer is arranged on one side of the array substrate and is provided with a via hole. The metal layer is arranged on a side of the substrate layer away from the array substrate. The wiring is arranged in the via hole and connects the array substrate to the metal layer.

[0006] Further, the display panel includes a display area and a non-display area arranged on one side of the display area. The display panel also includes a light-emitting layer and a plurality of pads. The light-emitting layer is arranged on a side of the array substrate away from the base material layer and is located in the display area. The pads are arranged on a side of the array substrate away from the base material layer and are located in the non-display area. At least part of the pads are connected to the metal layer through the routing. Preferably, the orthographic projection of the via on the metal layer at least partially overlaps with the orthographic projection of the pad on the metal layer. Further preferably, the orthographic projections of at least three vias on the metal layer overlap with the orthographic projection of the same pad on the metal layer.

[0007] Furthermore, the display panel includes at least two functional wiring areas, each of which is provided with the pads. The metal layer includes at least two sub-sections, two adjacent sub-sections are arranged at intervals, and each of the functional wiring areas is provided with a sub-section, and at least some of the pads in each of the functional wiring areas are connected to the sub-sections through the wiring.

[0008] Further, the metal material in the metal layer is at least partially the same as the metal material in the array substrate. Preferably, the metal material in the metal layer includes at least one of aluminum, silver, copper, titanium, magnesium and molybdenum. Preferably, the metal layer is in a grid shape.

[0009] Furthermore, the display panel also includes a bonding component and a substrate structure. The substrate structure is bonded to a side of the metal layer away from the array substrate. One end of the bonding component is provided on a side of the array substrate away from the base material layer, and one end of the bonding component away from the array substrate is bent to a side of the substrate structure away from the array substrate. Preferably, a hollow portion is provided in the substrate structure, and a part of the surface of the metal layer is exposed in the hollow portion. The bonding component extends from the surface of the substrate structure away from the array substrate to the hollow portion, and the bonding component covers the exposed surface of the metal layer in the hollow portion. Preferably, the orthographic projection of the hollow portion on the base material layer is bonded within the range of the orthographic projection of the bonding component on the base material layer.

[0010] Furthermore, the display panel further comprises an encapsulation layer, a touch layer and a cover plate. The encapsulation layer is arranged on a side of the array substrate away from the base material layer. The touch layer is arranged on a side of the encapsulation layer away from the array substrate. The cover plate is arranged on a side of the touch layer away from the encapsulation layer. Preferably, the encapsulation layer extends from a side of the array substrate away from the base material layer to cover the side of the encapsulation layer, the base material layer and the metal layer perpendicular to the plane where the base material layer is located.

[0011] The present invention also provides a method for preparing a display panel, which includes: forming a via hole in a substrate layer by a drilling process, and filling the via hole with a thermal conductive material to form a wiring; forming a metal layer on one side of the substrate layer, the metal layer covering one end of the wiring; forming an array substrate on a side of the substrate layer away from the metal layer, the array substrate covering the other end of the wiring.

[0012] Furthermore, the display panel includes a display area and a non-display area provided on one side of the display area. After the step of forming the array substrate on the side of the substrate layer away from the metal layer, the step further includes: forming a pad corresponding to the via hole on the side of the array substrate in the non-display area away from the substrate layer; and forming a light-emitting layer on the side of the array substrate in the display area away from the substrate layer. Preferably, the orthographic projection of the via hole on the metal layer at least partially overlaps with the orthographic projection of the pad on the metal layer. Preferably, the display panel includes at least two functional wiring areas, and the step of forming the metal layer by vapor-depositing a layer of thermally conductive material on the entire surface of one side of the substrate layer through a vapor deposition process further includes: patterning the entire vapor-deposited thermally conductive material layer to form at least two sub-sections respectively located in the corresponding functional wiring areas. Preferably, the thermally conductive material includes metal.

[0013] The present invention further provides a display device, comprising the display panel as described above.

[0014] Furthermore, the display device further comprises an outer frame, the outer frame has a cavity, and the display panel is placed in the cavity. Preferably, the outer frame comprises a heat dissipation portion, and the metal layer in the display panel is connected to the heat dissipation portion. Further preferably, the material of the heat dissipation portion comprises metal.

[0015] Advantages of the present invention: Through the display panel and its preparation method proposed in the present application, a metal layer is added to the back of the panel to dissipate the heat of the panel, and the substrate is connected to the metal layer through wiring, thereby improving the heat dissipation efficiency, preventing heat accumulation in the panel, preventing the display device in the panel from being burned, and extending the service life of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 is a schematic diagram of a layered structure of a display panel in an embodiment of the present invention;

[0018] Figure 2 is a top view of a display panel in an embodiment of the present invention;

[0019] Figure 3 is a flow chart of a method for preparing a display panel according to an embodiment of the present invention;

[0020] Figure 4A schematic diagram of a layered structure after forming a via hole in an embodiment of the present invention;

[0021] Figure 5 It is a schematic diagram of a layered structure after wiring is formed in an embodiment of the present invention;

[0022] Figure 6 is a schematic diagram of a layered structure after a metal layer is formed in an embodiment of the present invention;

[0023] Figure 7 is a schematic diagram of a layered structure after an array substrate is formed in an embodiment of the present invention;

[0024] Figure 8 This is a schematic diagram of a layered structure after a light-emitting layer is formed in an embodiment of the present invention;

[0025] Fig. 9 is a schematic diagram of a layered structure of a display panel in another embodiment of the present invention;

[0026] Fig.10 is a top view of a display panel in another embodiment of the present invention;

[0027] Fig.11 Schematic diagram of the layered structure of the display device in an embodiment of the present invention.

[0028] The components in the figure are shown as follows:

[0029] Display device 100; Display panel 110;

[0030] A first functional wiring area 111; A second functional wiring area 112;

[0031] Display area AA;

[0032] Non-display area NA; Array substrate 11;

[0033] Light emitting layer 12; Solder pad 13;

[0034] Base material layer 2; Conductive hole 21;

[0035] Metal layer 3; Sub-section 31;

[0036] Routing 4; Packaging layer 5;

[0037] Bonding component 6; Substrate structure 7;

[0038] Hollow portion 71; Touch layer 8;

[0039] Cover plate 9; Middle frame 120;

[0040] Cavity 121; Heat dissipation portion 122. DETAILED DESCRIPTION

[0041] The preferred embodiments of the present invention are described below with reference to the drawings in the specification to prove that the present invention can be implemented. The embodiments of the invention can fully introduce the present invention to those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied through many different forms of embodiments of the invention, and the protection scope of the present invention is not limited to the embodiments mentioned in the text.

[0042] In the drawings, components with the same structure are indicated by the same numerical reference numerals, and components with similar structures or functions are indicated by similar numerical reference numerals. The size and thickness of each component shown in the drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component. In order to make the illustration clearer, the thickness of the components is appropriately exaggerated in some places in the drawings.

[0043] In addition, the following descriptions of the various embodiments of the invention are made with reference to the attached diagrams to illustrate specific embodiments of the invention that the present invention can be implemented with. The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer description and understanding of the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0044] When some components are described as being "on" another component, the component may be directly placed on the other component; there may also be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "mounted on" or "connected to" another component, the two may be understood to be directly "mounted on" or "connected", or one component may be indirectly "mounted on" or "connected to" another component via an intermediate component.

[0045] In an embodiment of the present invention, a display panel 110 is provided. Figure 1 As shown, the display panel 110 includes an array substrate 11 , a base material layer 2 , a metal layer 3 and wiring 4 .

[0046] The display panel 110 has a display area AA and a non-display area NA arranged on one side of the display area AA, and further includes a light-emitting layer 12 and a plurality of pads 13. The array substrate 11 covers the display area AA and the non-display area NA, and is provided with a plurality of thin film transistors and signal wiring. The light-emitting layer 12 is arranged on the side of the array substrate 11 away from the substrate layer 2, and includes a plurality of light-emitting devices, such as an OLED light-emitting device, a Mini-LED (sub-millimeter light-emitting diode) and a Micro-LED (micro light-emitting diode). The pad 13 is arranged on the side of the array substrate 11 away from the substrate layer 2 and is located in the non-display area NA. The light-emitting device in the light-emitting layer 12 is used to provide a display light source, and is electrically connected to at least one thin film transistor in the array substrate 11; the thin film transistor is used to control the opening and closing of the light-emitting device according to the display signal, thereby realizing the change of the display screen; the pad 13 is electrically connected to the thin film transistor through the signal wiring in the array substrate 11, and is a connecting pin for electrically connecting the signal wiring in the array substrate 11 to the driving component.

[0047] The substrate layer 2 is arranged on the surface of the array substrate 11 away from the light-emitting layer 12, and can be a flexible film such as a PI (Polyimide) film, or a hard substrate such as a glass plate or a quartz plate. In the non-display area NA, the substrate layer 2 is provided with a plurality of via holes 21, which penetrate the substrate layer 2, and the orthographic projection of the via hole 21 on the metal layer 3 overlaps with the orthographic projection of the pad 13 on the metal layer 3 at least partially, so that the end of the via hole 21 close to the array substrate 11 is connected to the pad 13.

[0048] The metal layer 3 is arranged on the side of the base material layer 2 away from the array substrate 11, and covers the opening of the via hole 21 away from the array substrate 11. It can be a whole metal film layer or a grid-shaped film layer. The wiring 4 is arranged in the via hole 21, one end of which is connected to the pad 13 in the array substrate 11, and the other end is connected to the metal layer 3, so that the metal layer 3 is connected to the array substrate 11 in the substrate 1. The heat of the signal wiring in the array substrate 11 is conducted to the metal layer 3 through the wiring 4, and the heat generated in the light-emitting layer 12 can also be indirectly conducted to the metal layer 3 through the array substrate 11, so as to prevent the heat in the array substrate 11 and the light-emitting layer 12 from accumulating, and reduce the probability of burning of the display device in the array substrate 11 and the light-emitting layer 12. Furthermore, the orthographic projections of at least three via holes 21 on the metal layer 3 overlap with the orthographic projections of the same pad 13 on the metal layer 3, that is, the same pad 13 can be connected to at least three wirings 4 at the same time, so as to improve the efficiency of heat conduction. The material of the metal layer 3 includes metal, which can be a whole metal film layer or a grid-shaped metal film layer. Optionally, the metal material in the metal layer 3 is at least partially the same as the metal material in the array substrate 11, and the metal material in the metal layer 3 can be at least one of aluminum, silver, copper, titanium, magnesium, molybdenum and other metal materials.

[0049] Furthermore, the array substrate 11 is provided with a variety of signal routing lines for transmitting different display signals, such as data signal routing lines, scanning signal routing lines, power signal routing lines, ground signal routing lines, etc., and different signal routing lines are provided with corresponding pads 13. Preferably, the routing line 4 is connected to the pad 13 connected to the ground signal routing line. In the array substrate 11, a through hole can be opened under the pad 13 and filled with metal material to enable the routing line 4 to pass through the insulating film layer in the array substrate 11 and indirectly connect to the pad 13.

[0050] Furthermore, the display panel 110 further includes an encapsulation layer 5, which is disposed on a side of the light-emitting layer 12 away from the array substrate 11 (i.e., a side of the array substrate 11 away from the substrate layer 2). The encapsulation layer 5 includes inorganic materials and organic materials, which are used to isolate water and oxygen to prevent water vapor from corroding the display device in the substrate 1. Optionally, the encapsulation layer 5 can be further extended from the surface of the light-emitting layer 12 away from the substrate layer 2 to cover the side of the array substrate 11 and the metal layer 3 perpendicular to the plane where the substrate layer 2 is located.

[0051] The present invention also provides a method for manufacturing a display panel 110, which is used to manufacture the display panel 110 as described above. The manufacturing process of the display panel 110 is as follows: Figure 3 As shown in , it includes steps S10-S40.

[0052] Step S10) forming a via hole 21 in the substrate layer 2 by drilling, and filling the via hole 21 with a thermally conductive material to form a trace 4:

[0053] Prepare a substrate layer 2, such as Figure 4 As shown in , a via hole 21 is formed by drilling a hole on the substrate layer 2 by laser; Figure 5 As shown in FIG, a thermally conductive material, such as metal, is filled in the via hole 21 to form a trace 4.

[0054] Step S20) at least one layer of heat-conducting material is evaporated on the entire surface of one side of the substrate layer 2 by an evaporation process to form a metal layer 3:

[0055] like Figure 6 As shown in FIG. 1 , a layer of heat-conducting material, such as metal, covering the exposed surface of the trace 4 in the via 21 is prepared on one surface of the substrate layer 2 by an evaporation process, thereby forming a metal layer 3 .

[0056] Step S30) forming an array substrate 11 on a side of the base material layer 2 away from the metal layer 3:

[0057] like Figure 7 As shown in the figure, a thin film transistor structure and a signal wiring circuit are prepared by an evaporation process on the surface of the substrate layer 2 away from the metal layer 3, thereby forming an array substrate 11, which covers the end of the wiring 4 away from the metal layer 3.

[0058] Step S40) forming a pad corresponding to the via hole 21 on a side of the array substrate 11 located in the non-display area NA away from the base material layer 2:

[0059] A layer of metal material is deposited on a side of the array substrate 11 away from the base material layer 2 , and the layer of metal material is patterned to form a pad 13 in the non-display area NA.

[0060] Step S50) forming a light emitting layer 12 on a side of the array substrate 11 located in the display area AA and away from the base material layer 2:

[0061] like Figure 8 As shown in FIG. 1 , the light emitting layer 12 is formed on the surface of the array substrate 11 away from the metal layer 3 by an evaporation process or an inkjet printing process.

[0062] Step S60) packaging the display panel 110:

[0063] A layer of the substrate 1 away from the base material layer 2 is formed on the surface of the substrate 1 by a TFE (Thin Film Encapsulation) process. Figure 1 The encapsulation layer 5 is shown in FIG.

[0064] In other embodiments of the present invention, the display panel 110 may further include a bonding component 6 and a substrate structure 7. Fig. 9As shown in , the substrate structure 7 is arranged on the surface of the metal layer 3 away from the array substrate 11, one end of the bonding component 6 is arranged on the side of the array substrate 11 away from the base material layer 2, and is electrically connected to the pad 13 located in the non-display NA, and the end of the bonding component 6 away from the array substrate 11 is bent to the side of the substrate structure 7 away from the array substrate 11. The bonding component 6 includes components such as a chip-on-chip film and a flexible circuit board, wherein the driving chip is arranged on the chip-on-chip film and is connected to the pad 13 through the chip-on-chip film, and the flexible circuit board is electrically connected to the end of the chip-on-chip film away from the pad 13. The substrate structure 7 includes an insulating film layer, which is provided with a hollow portion 71. The hollow portion 71 penetrates the substrate structure 7, so that the surface of the metal layer 3 away from the array substrate 11 is exposed in the hollow portion 71. The bonding component 6 is bent to the end of the metal layer 3 away from the array substrate 11 and extends from the surface of the substrate structure 7 away from the array substrate 11 to the hollow portion 71, and the bonding component 6 covers the exposed surface of the metal layer 3 in the hollow portion 71, so that the bonding component 6 is in contact with the metal layer 3, thereby improving the shielding property and ESD (Electro-Static Discharge) effect of the display panel 110. Optionally, the orthographic projection of the hollow portion 71 on the substrate layer 2 is within the orthographic projection range of the bonding component 6 on the substrate layer 2, so that the bonding component 6 can completely cover the metal layer 3 exposed in the hollow portion 71, prevent the metal layer 3 from being corroded due to exposure, and also prevent the metal layer 3 from being connected to other circuits through the hollow portion 71 and causing a short circuit in the circuit of the substrate 1.

[0065] Furthermore, the display panel 110 further includes a touch layer 8 and a cover plate 9. Fig. 9 As shown in FIG, the touch layer 8 is disposed on the side of the encapsulation layer 5 away from the substrate 1, and the cover plate 9 is disposed on the side of the touch layer 8 away from the encapsulation layer 5. The touch layer 8 is used to realize touch control, and the cover plate 9 is used to protect the surface of the display panel 110 to prevent the surface of the display panel 110 from being scratched.

[0066] In another embodiment of the present invention, the display panel 110 includes at least two functional wiring areas, specifically, Fig.10As shown in , the display panel 110 may include a first functional wiring area 111 and two second functional wiring areas 112, and the two second functional wiring areas 112 are arranged in sequence on the same side of the first functional wiring. In different functional wiring areas, signal wirings with different functions are provided in the substrate 1, for example: a ground signal wiring is provided in the first functional wiring area 111, and a power signal wiring is provided in the second functional wiring area 112. The metal layer 3 also includes at least two sub-sections 31. Specifically, a sub-section 31 is provided in each functional wiring area. A whole metal layer 3 can be divided into multiple sub-sections 31 by a patterning process, and two adjacent sub-sections 31 are provided at intervals. Each functional wiring area is respectively provided with a plurality of pads 13 and a plurality of via holes 21, and each via hole 21 is provided with a wiring 4, one end of the wiring 4 is connected to the corresponding sub-section 31, and the other end thereof is connected to the corresponding signal wiring, so that the signal wirings in different functional wiring areas are connected to the unused sub-sections 31, and the signal transmission in the substrate 1 is not affected, and at the same time, different circuits in the substrate 1 can dissipate heat through the metal layer 3, thereby improving the heat dissipation efficiency of the display panel 110.

[0067] The embodiment of the present invention further provides a display device 100, such as Fig.11 As shown in , the display device 100 includes the display panel 110 as described above and a frame. The frame includes a cavity 121, and the display panel 110 is installed in the cavity 121. Among them, the display panel 110 is used to provide an image screen for the display device 100, and the frame is used to protect the display panel 110. Further, the frame is provided with a heat dissipation portion 122, and the metal layer 3 in the display panel 110 can be connected to the heat dissipation portion 122 in the frame through a conductive tape or a metal trace, so that the heat in the metal layer 3 is further dissipated to the outside through the outer frame of the display device 100, thereby preventing the heat in the metal layer 3 of the display panel 110 from being accumulated. Preferably, the material of the heat dissipation portion 122 includes metal. Further, the entire frame can be made of metal, thereby further improving the heat dissipation efficiency of the display panel 110.

[0068] In an embodiment of the invention, a metal layer is added to the back of the display panel to dissipate heat for the array substrate and the light-emitting layer. At the same time, the signal wiring in the array substrate is connected to the metal layer through wiring, thereby improving the heat dissipation efficiency, thereby preventing heat accumulation in the array substrate and the light-emitting layer, preventing the display devices in the display panel from being burned, and extending the service life of the display panel.

[0069] Although the present invention is described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the present invention. It should therefore be understood that many modifications may be made to the exemplary embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the various dependent claims and features described herein may be combined in a manner different from that described in the original claims. It should also be understood that features described in conjunction with individual embodiments may be used in other described embodiments.

Claims

1. A display panel, characterized in that: include: An array substrate; A base material layer, disposed on one side of the array substrate, and provided with a conducting hole; A metal layer, disposed on a side of the base material layer away from the array substrate; A wiring is arranged in the via hole and connects the array substrate with the metal layer.

2. The display panel according to claim 1, wherein: The display panel includes a display area and a non-display area arranged on one side of the display area; The display panel further includes: A light emitting layer is provided on a side of the array substrate away from the base material layer and is located in the display area; A plurality of pads are arranged on a side of the array substrate away from the base material layer and located in the non-display area; At least part of the pads are connected to the metal layer through the routing lines; Preferably, the orthographic projection of the via on the metal layer at least partially overlaps with the orthographic projection of the pad on the metal layer; Further preferably, the orthographic projections of at least three of the vias on the metal layer overlap with the orthographic projection of the same pad on the metal layer.

3. The display panel according to claim 2, wherein: It comprises at least two functional wiring areas, each of which is provided with the pad; The metal layer includes at least two sub-sections, two adjacent sub-sections are arranged at intervals, and at least part of the pads in each of the functional wiring areas are connected to the sub-sections through the wiring.

4. The display panel according to claim 1, wherein: The metal material in the metal layer is at least partially the same as the metal material in the array substrate; Preferably, the metal material in the metal layer includes at least one of aluminum, silver, copper, titanium, magnesium and molybdenum; Preferably, the metal layer is in a grid shape.

5. The display panel according to claim 1, wherein: Also includes: A substrate structure, disposed on a side of the metal layer away from the array substrate; A bonding component, one end of which is disposed on a side of the array substrate away from the base material layer, and the end of the bonding component away from the array substrate is bent to a side of the substrate structure away from the array substrate; Preferably, a hollow portion is provided in the substrate structure, a portion of the surface of the metal layer is exposed in the hollow portion, and the bonding component covers the hollow portion and is located on the exposed surface of the metal layer; Preferably, the orthographic projection of the hollow portion on the substrate layer is located within the range of the orthographic projection of the bonding component on the substrate layer.

6. The display panel according to claim 1, wherein: Also includes: A packaging layer, disposed on a side of the array substrate away from the base material layer; A touch layer, disposed on a side of the packaging layer away from the array substrate; A cover plate, disposed on a side of the touch layer away from the encapsulation layer; Preferably, the encapsulation layer extends from a side of the array substrate away from the base material layer to cover the array substrate and the side surface of the metal layer that is perpendicular to the plane where the base material layer is located.

7. A method for preparing a display panel, characterized in that: include: Forming a via hole in the substrate layer by a drilling process, and filling the via hole with a conductive material to form a trace; At least one layer of conductive material is evaporated on the entire surface of one side of the substrate layer by an evaporation process to form a metal layer, wherein the metal layer covers one end of the wiring; An array substrate is formed on a side of the base material layer away from the metal layer, and the array substrate covers an end of the wiring away from the metal layer.

8. The method for preparing a display panel according to claim 7, wherein: The display panel includes a display area and a non-display area arranged on one side of the display area; After the step of forming the array substrate on a side of the base material layer away from the metal layer, the step includes: forming a pad corresponding to the via hole on a side of the array substrate located in the non-display area away from the base material layer; forming a light emitting layer on a side of the array substrate located in the display area away from the base material layer; Preferably, the orthographic projection of the via on the metal layer at least partially overlaps with the orthographic projection of the pad on the metal layer; Preferably, the display panel comprises at least two functional wiring areas, and the step of vapor-depositing a layer of conductive material on the entire surface of one side of the substrate layer by a vapor deposition process to form the metal layer further comprises: patterning the entire vapor-deposited conductive material layer to form at least two sub-parts respectively located in the corresponding functional wiring areas; Preferably, the conductive material comprises metal.

9. A display device, characterized in that: Comprising a display panel as described in any one of claims 1-6.

10. The display device according to claim 9, characterized in that Also includes: An outer frame having a cavity, wherein the display panel is placed in the cavity; Preferably, the outer frame includes a heat dissipation portion, and the metal layer in the display panel is connected to the heat dissipation portion; Further preferably, the material of the heat dissipation portion includes metal.

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