High-voltage contact seat forming device

Abstract

The invention relates to the field of high-pressure contact base forming, and discloses a high-pressure contact base forming device and method.The high-pressure contact base forming device comprises an injection structure, a liquid rising pipe, a pressing die structure, a movable die structure, an electromagnetic cleaner, an electromagnetic power structure and a control system.The injection structure comprises a heat preservation furnace, a liquid storage chamber, an injection punch, a temperature sensor, an injection chamber and a feeding port; the liquid storage chamber is arranged in the heat preservation furnace in a T shape, the temperature sensor is arranged on the inner wall of the liquid storage chamber, liquid metal can be contained in the liquid storage chamber, the injection chamber is arranged at the lower end of the liquid storage chamber, and the height of the connecting position of an outlet of the injection chamber and the injection punch exceeds the bottom end of the liquid storage chamber. The injection pressure and the mold filling speed are controlled through the control system, the purposes of energy saving and perfect forming are achieved, the electromagnetic cleaner is used for cleaning, the manual cleaning step is reduced, meanwhile, the service life of the mold is prolonged, and cost is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of high-voltage contact seat molding, and in particular to a high-voltage contact seat molding device and a molding method. Background Art

[0002] High-voltage contact holder is an electrical device used in high-voltage circuits. It is mainly used to connect and protect cables and electrical equipment. The main function of the high-voltage contact box is to transfer electrical energy from the power supply to the electrical equipment and protect the circuit from electric shock and other damage. The high-voltage contact box is usually composed of a shell, insulators, contacts and connectors. The shell is usually made of metal or plastic, with good pressure resistance and protection performance. The contact is the key part of connecting cables and electrical equipment. It is usually made of copper or aluminum and has good conductivity and stability.

[0003] The molding method of the metal shell of the high-voltage contact seat is extremely important. Die-casting is usually chosen for metal molding. The existing die-casting molding has a complicated mold cleaning method, which shortens the mold service life and increases costs. Summary of the invention

[0004] 1. Technical issues to be solved

[0005] In view of the deficiencies in the prior art, the present invention provides a high-voltage contact seat molding device and molding method, which has the advantages of saving labor costs and accurately controlling the injection pressure and filling speed in the die-casting process, thereby solving the problems in the above-mentioned background technology.

[0006] (II) Technical solution

[0007] In order to achieve the above-mentioned purpose of saving labor costs and accurately controlling the injection pressure and filling speed during the die-casting process, the present invention provides the following technical solutions: a high-voltage contact seat forming device and a forming method, including an injection structure, a liquid riser, a die structure, a movable die structure, an electromagnetic cleaner, an electromagnetic power structure and a control system, the injection structure including a heat preservation furnace, a liquid storage chamber, an injection punch, a temperature sensor, an injection chamber and a feed port, the liquid storage chamber is T-shaped and arranged in the heat preservation furnace, and the temperature sensor is arranged on the inner wall of the liquid storage chamber.

[0008] Preferably, an injection chamber is provided at the lower end of the liquid storage chamber, the height of the connection between the injection chamber outlet and the injection punch exceeds the bottom end of the liquid storage chamber, the number of the feed ports is two symmetrically arranged at the junction of the injection chamber and the bottom end of the liquid storage chamber, the injection punch is arranged at the injection chamber entrance, and the end of the injection chamber is connected to a liquid rising pipe.

[0009] Preferably, the die structure includes a fixed mold plate, a nozzle gate, a first mold, a second mold, a pull rod, a groove, a limiter and a cavity, the nozzle gate is arranged on the fixed mold plate, the nozzle gate is connected to the cavity through a riser tube, and the mold is composed of a first mold and a second mold.

[0010] Preferably, the cavity is opened inside the mold, the first mold and the second mold are movably connected, the limiter can be telescopically arranged in the middle of the back side of the first mold and the second mold, the number of the limiters is four and they are arranged at the four corners of the back side of the first mold and the second mold, the grooves on the first mold and the second mold correspond to the slide rails on the second movable mold plate, and the limiters on the first mold and the second mold are engaged with the upper limit holes of the second movable mold plate to fix the mold.

[0011] Preferably, the movable mold structure includes a first movable mold plate, a second movable mold plate, a separation column, a slide rail, a limiting hole, an electromagnet and an electromagnetic cleaner. The first movable mold plate is fixedly connected to a separation column, and the number of the separation columns is four. The separation columns are installed corresponding to the limiting holes, and the first movable mold plate and the second movable mold plate are movably connected by a pull rod.

[0012] Preferably, a limit hole and a slide rail are provided on the second movable template, the limit hole corresponds to the position of the limiter, the slide rail corresponds to the position of the groove on the mold, the first movable template can be pulled toward the second movable template by a pull rod, the separation column on the first movable template can separate the limiter from the limit hole, and the first mold and the second mold can be separated along the slide rail to replace the mold.

[0013] Preferably, the electromagnetic cleaner includes a metal shell, a metal cover, a magnet, a brush, a power supply, a cleaning liquid box, a paint box, a first pipe, a second pipe, a first solenoid valve, a second solenoid valve and a fan. The electromagnetic cleaner is arranged in an electromagnetic docking device. There are two electromagnets, which are respectively fixed at the middle position of the upper end and the middle position of the lower end of the second movable template. The magnet is arranged at the bottom of the metal shell. There are multiple holes on the magnet. The metal cover is arranged inside the metal shell. The power supply is fixed on the metal shell. The cleaning liquid box and the paint box are arranged above the metal cover. The cleaning liquid box and the paint box are respectively provided with a first pipe and a second pipe at the bottom leading to the bottom of the metal cover. The first pipe and the second pipe are equipped with a first solenoid valve and a second solenoid valve, and the brush is fixed under the magnet.

[0014] Preferably, the electromagnetic power structure includes a first electric slide rail, a second electric slide rail, a moving rod, an electromagnetic parking device and a spring. The first electric slide rail is fixed at the middle position of the top end of the second moving template. The second electric slide rail is perpendicular to and slidably connected to the first electric slide rail. The moving rod is arranged below the second electric slide rail and is slidably connected to the second electric slide rail. The electromagnetic parking device is arranged at the end of the moving rod. The electromagnetic parking device is C-shaped. The spring is arranged inside the electromagnetic parking device. The electromagnetic cleaner is docked in the electromagnetic parking device and is movably connected to the spring. An electromagnet is arranged inside the electromagnetic parking device. After power is turned on, the electromagnet can adsorb and fix the electromagnetic cleaner, and compress the spring during the adsorption and fixing process. When the electromagnetic parking device is powered off, the electromagnet cannot adsorb and fix the electromagnetic cleaner, and the spring rebounds to push the electromagnetic cleaner out.

[0015] Preferably, the control system includes the following specific operating steps:

[0016] Step 1: Liquid metal is placed in the liquid storage chamber, and the control system sets the working temperature of the holding furnace;

[0017] Step 2: Place or replace the required mold for compression molding, and select the required mold to be fixedly installed on the second movable mold plate;

[0018] Step 3: Use an electromagnetic cleaner to paint the cavity to prevent the molten metal from sticking to the inside of the cavity;

[0019] Step 4: Set the injection pressure and filling speed of the injection punch according to the temperature monitored by the temperature sensor and the size of the mold so that the liquid metal fills the mold;

[0020] Step 5: The cavity has been filled with liquid metal, and the liquid metal has been formed, and the formed high-voltage contact seat is demoulded;

[0021] Step 6: Use an electromagnetic cleaner to clean the cavity.

[0022] Preferably, the step 4 also includes the following specific operation steps:

[0023] Step 4 a1: According to the temperature of the injected liquid metal monitored by the temperature sensor, the metal density is deduced and the injection pressure of the injection punch is set. When the liquid metal density is a1, the injection pressure is set to p1;

[0024] Step 4 a2: When the density of the liquid metal is a2, the injection pressure is set to p2; when a1 is greater than a2, p1 is greater than p2;

[0025] Step 4 b1: First, set the filling speed according to the density of the metal being pushed out and the size of the cavity in the mold. When the density of the liquid metal is larger (a1) and the size of the cavity is larger (b1), the filling speed is t1;

[0026] Step 4 b2: When the density of liquid metal is smaller than a2 and the cavity is smaller and the size is b2, the filling speed is t2. When a1 is greater than a2 and b1 is greater than b2, t1 is greater than t2.

[0027] (III) Beneficial effects

[0028] Compared with the prior art, the present invention provides a high-voltage contact seat forming device and forming method, which have the following beneficial effects:

[0029] The high-voltage contact seat forming device and forming method manufacture the high-voltage contact seat by a die-casting forming method, measure the temperature of liquid metal by a temperature sensor to infer the metal density, and then control the injection pressure by the metal density to achieve the purpose of energy saving and perfect forming. At the same time, by detecting the temperature of the liquid metal in the liquid storage chamber, the temperature of the insulation furnace is changed at all times to keep the metal in a liquid state and prevent solidification.

[0030] The high-voltage contact seat molding device and molding method can control the mold filling speed according to the mold cavity size and liquid metal density of the mold, so that the desired molded object can be perfectly molded and automatically demolded after molding, thereby achieving the purpose of saving human resources.

[0031] The high-voltage contact seat forming device and forming method utilize the principle that a charged body is subjected to a force in a magnetic field, and design an electromagnetic cleaner to apply paint to the mold before molding and clean it after molding, thereby reducing the workload, increasing the service life of the mold, and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0033] Figure 2 is a schematic diagram of the injection structure of the present invention;

[0034] Figure 3 It is a schematic diagram of the die structure and the movable die structure of the present invention;

[0035] Figure 4 It is a side schematic diagram of the mold of the present invention;

[0036] Figure 5 It is a front schematic diagram of the movable mold structure of the present invention;

[0037] Figure 6 It is a side schematic diagram of the movable mold structure of the present invention;

[0038] Figure 7 It is a structural schematic diagram of the electromagnetic cleaner of the present invention;

[0039] Figure 8It is a structural schematic diagram of the electromagnetic cleaner of the present invention;

[0040] Fig. 9 It is a schematic diagram of the electromagnetic power structure of the present invention;

[0041] Fig.10 It is a schematic diagram of the electromagnetic power structure and mold structure of the present invention;

[0042] Fig.11 This is a state diagram of the electromagnetic parking device of the present invention after power failure;

[0043] Fig.12 It is the injection working flow chart of the present invention;

[0044] In the figure: 1, injection structure; 101, holding furnace; 102, liquid storage chamber; 103, injection punch; 104, injection chamber; 105, feed port; 106, temperature sensor;

[0045] 2. Riser pipe;

[0046] 3. Die structure; 301. Fixed die plate; 302. Nozzle gate; 303. First die; 304. Second die; 305. Tie rod; 306. Groove; 307. Stopper; 308. Cavity;

[0047] 4. Moving mold structure; 401. First moving mold plate; 402. Second moving mold plate; 403. Separation column; 404. Slide rail; 405. Limiting hole;

[0048] 5. Electromagnetic cleaner; 501. Electromagnet; 502. Metal housing; 503. Metal cover; 504. Magnet; 505. Brush; 506. Power supply; 507. Cleaning liquid box; 508. Paint box; 509. First pipeline; 510. Second pipeline; 511. First electromagnetic valve; 512. Second electromagnetic valve; 513. Fan;

[0049] 6. Electromagnetic power structure; 601. First electric slide rail; 602. Second electric slide rail; 603. Moving rod; 604. Electromagnetic parking device; 605. Spring. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0051] Example 1

[0052] The preferred embodiment of the high-voltage contact seat forming device and forming method provided by the present invention is as follows: Figures 1 to 5 As shown: a high-voltage contact seat forming device and forming method, including an injection structure 1, a liquid riser 2, a die structure 3, a movable die structure 4, an electromagnetic cleaner 5, an electromagnetic power structure 6 and a control system, the injection structure 1 includes a heat preservation furnace 101, a liquid storage chamber 102, an injection punch 103, an injection chamber 104 and a feed inlet 105, the liquid storage chamber 102 is T-shaped and arranged in the heat preservation furnace 101, the temperature sensor 106 is arranged on the inner wall of the liquid storage chamber 102, the liquid storage chamber 102 can be loaded with liquid metal, the lower end of the liquid storage chamber 102 is provided with an injection chamber 104, the height of the connection between the injection chamber 104 outlet and the injection punch 103 exceeds the bottom end of the liquid storage chamber 102, the number of the feed inlets 105 is two and they are symmetrically arranged at the junction of the injection chamber 104 and the bottom end of the liquid storage chamber 102, the injection punch 103 is arranged at the entrance of the injection chamber 104, and the end of the injection chamber 104 is connected with a liquid riser 2.

[0053] In this embodiment, the die structure 3 includes a fixed die plate 301, a nozzle gate 302, a first mold 303, a second mold 304, a pull rod 305, a groove 306, a stopper 307 and a cavity 308. The nozzle gate 302 is arranged on the fixed die plate 301, and the nozzle gate 302 is connected to the cavity 308 through the riser pipe 2. The mold is composed of the first mold 303 and the second mold 304. The cavity 308 is opened inside the mold. The first mold 303 and the second mold 304 are movable. Dynamic connection, the limiter 307 can be telescopically set in the middle of the back side of the first mold 303 and the second mold 304. There are four limiters 307 set at the four corners of the back side of the first mold 303 and the second mold 304. The grooves 306 on the first mold 303 and the second mold 304 correspond to the slide rails on the second movable mold plate 402. At the same time, the limiters on the first mold 303 and the second mold 304 are engaged with the upper limit holes on the second movable mold plate 402 to fix the mold.

[0054] Furthermore, the movable mold structure 4 includes a first movable mold plate 401, a second movable mold plate 402, a separation column 403, a slide rail 404 and a limiting hole 405. The first movable mold plate 401 is fixedly connected with a separation column 403, and the number of the separation columns 403 is four. The separation columns 403 are installed corresponding to the limiting holes 405. The first movable mold plate 401 and the second movable mold plate 402 are movably connected through a pull rod 305. The second movable mold plate 402 is provided with a limiting hole 405 and a slide rail 404. The limiting hole 405 corresponds to the position of the limiter 307, and the slide rail 404 corresponds to the position of the groove 306 on the mold. The first movable mold plate 401 can be pulled toward the second movable mold plate 402 by the pull rod 305. The separation column 404 on the first movable mold plate 401 can separate the limiter 307 from the limiting hole, and the first mold 303 and the second mold 304 are separated along the slide rail 404, and the mold can be replaced.

[0055] In addition, the electromagnetic cleaner 5 includes an electromagnet 501, a metal shell 502, a metal cover 503, a magnet 504, a brush 505, a power supply 506, a cleaning liquid box 507, a paint box 508, a first pipe 509, a second pipe 510, a first solenoid valve 511, a second solenoid valve 512 and a fan 513. The electromagnetic cleaner 5 is arranged in the electromagnetic parking device 604. There are two electromagnets 501, which are respectively fixed at the middle position of the upper end and the middle position of the lower end of the second movable template 402. The magnet 504 is arranged at the bottom of the metal shell 502. There are multiple holes on 504, the metal cover 503 is arranged inside the metal shell 502, the power supply 506 is fixed on the metal shell 502, the cleaning liquid box 507 and the paint box 508 are arranged above the metal cover 503, and the bottom of the cleaning liquid box 507 and the paint box 508 are respectively provided with a first pipe 509 and a second pipe 510 leading to the bottom of the metal cover 503, the first pipe 509 and the second pipe 510 are installed with a first solenoid valve 511 and a second solenoid valve 512, the brush 505 is fixed under the magnet 504, and the paint in the paint box 508 can be a release agent.

[0056] The electromagnetic power structure 6 includes a first electric slide rail 601, a second electric slide rail 602, a moving rod 603, an electromagnetic parking device 604 and a spring 605. The first electric slide rail 601 is fixed at the middle position of the top of the second movable template 402. The second electric slide rail 602 is vertically and slidably connected to the first electric slide rail 601. The moving rod 603 is arranged below the second electric slide rail 602 and is slidably connected to the second electric slide rail 602. The electromagnetic parking device 604 is arranged at the end of the moving rod 603. The electromagnetic parking device 604 is C-shaped. The spring 605 is arranged inside the electromagnetic parking device 604. The electromagnetic cleaner 5 is docked in the electromagnetic parking device 604 and is movably connected to the spring 605. An electromagnet is arranged inside the electromagnetic parking device 604. After power is turned on, the electromagnet can adsorb and fix the electromagnetic cleaner 5. The spring 605 is compressed during the adsorption and fixing process. When the electromagnetic parking device 604 is powered off, the electromagnet cannot adsorb and fix the electromagnetic cleaner 5. The spring 605 rebounds to push the electromagnetic cleaner 5 out.

[0057] When in use, before the mold needs to be molded, the second electric slide rail 602 is lowered to the bottom of the first electric slide rail 601, and the electromagnetic parking device 604 is moved to the inside of the cavity 308 by moving the moving rod 603 on the second electric slide rail 602, and the electromagnet 501 is turned on. An electromagnetic field is formed between the upper electromagnet 501 and the lower electromagnet 501, and the formed magnetic field is parallel to the second movable template 402. The second electromagnetic valve 512 on the second pipeline 510 of the electromagnetic cleaner 5 is opened, and the paint in the paint box 508 flows to the bottom of the metal cover 503. The power supply 506 is turned on to charge the metal shell 502, and the electromagnetic parking device 604 is powered off. At this time, the spring 605 will vertically move the electromagnetic cleaner 5 between the upper and lower electromagnets 501 The formed magnetic field is pushed into the cavity 308. Since the magnet 504 will adsorb the cavity 308 and the mold is in the magnetic field, the charged electromagnetic cleaner 5 enters the magnetic field formed by the electromagnet 501 vertically at the initial speed, and is subjected to the Lorentz force when cutting the magnetic induction lines. It will continue to move under the action of the magnetic field to paint the cavity 308 to prevent the molten metal from sticking to the cavity 308. When the painting is completed, the electromagnet 501 is turned off, and the electromagnetic parking device 604 is moved to the bottom end of the cavity 308. The electromagnet inside the electromagnetic parking device 604 is energized to adsorb the electromagnetic cleaner 5. After the electromagnetic cleaner 5 returns to the inside of the electromagnetic parking device 604, the electromagnetic parking device 604 is reset along the second electric slide rail 602 and the first electric slide rail 601.

[0058] After the molding is completed, the second electric slide rail 602 is lowered to the bottom of the first electric slide rail 601, and the electromagnetic parking device 604 is moved to the inside of the cavity 308 by moving the moving rod 603 on the second electric slide rail 602, and the electromagnet 501 is turned on. An electromagnetic field is formed between the upper electromagnet 501 and the lower electromagnet 501, and the formed magnetic field is parallel to the second movable template 402. The second electromagnetic valve 512 on the second pipeline 510 of the electromagnetic cleaner 5 is opened, and the paint in the paint box 508 flows to the bottom of the metal cover 503. The power supply 506 is turned on to charge the metal shell 502, and the electromagnetic parking device 604 is powered off. At this time, the spring 605 will push the electromagnetic cleaner 5 perpendicular to the magnetic field formed between the upper and lower electromagnets 501. Enter the cavity 308, because the magnet 504 will absorb the cavity 308, the mold is in the magnetic field, and at this time, the charged electromagnetic cleaner 5 enters the magnetic field formed by the electromagnet 501 vertically at the initial speed, and is subjected to the Lorentz force when cutting the magnetic induction line. It will keep moving under the action of the magnetic field to clean the cavity 308, and turn on the fan 513 to dry the cavity 308 with the cleaning liquid. When the cleaning is completed, turn off the electromagnet 501, move the electromagnetic parking device 604 to the bottom end of the cavity 308, and energize the electromagnet inside the electromagnetic parking device 604 to absorb the electromagnetic cleaner 5. After the electromagnetic cleaner 5 returns to the inside of the electromagnetic parking device 604, the electromagnetic parking device 604 is reset along the second electric slide rail 602 and the first electric slide rail 601.

[0059] Example 2

[0060] On the basis of Example 1, a preferred embodiment of a high-voltage contact seat forming device and forming method provided by the present invention is as follows: Figure 8 As shown: the control system is connected with the injection structure 1, the die structure 3, and the movable die structure 4;

[0061] The control system includes the following specific operation steps:

[0062] Step 1: Liquid metal is placed in the liquid storage chamber 102, and the control system sets the working temperature of the holding furnace 101;

[0063] Specifically, when the liquid metal is placed in the liquid storage chamber 102, the temperature sensor 106 monitors the temperature x1 of the liquid metal at this time, and the control system sets the working temperature of the insulation furnace 101 to x1 according to the temperature monitored by the temperature sensor 106. The temperature sensor 106 monitors the temperature of the liquid metal at all times. When the temperature x2 is monitored again and is less than x1, the working temperature of the insulation furnace 101 is set to x3. When x3 is greater than x1, the insulation furnace 101 is heated to prevent the liquid metal from solidifying.

[0064] Step 2: Place or replace the required mold for compression molding, and select the required mold to be fixedly installed on the second movable mold plate 402;

[0065] Specifically, if there is no mold on the die structure 3, the grooves 306 on the first mold 303 and the second mold 304 correspond to the slide rails 404 on the second movable mold plate 402, and the limiters 307 on the first mold 303 and the second mold 304 are engaged with the upper limit holes 405 on the second movable mold plate 402.

[0066] If there is a mold on the die structure 2, the first movable mold plate 401 is pulled toward the second movable mold plate 402 by the pull rod 305, and the separation column 403 on the first movable mold plate 401 is pushed toward the limiter 307 on the die structure 3, so that the limiter 307 is separated from the limit hole 405, and the first mold 303 and the second mold 304 slide along the slide rail 404 until they are separated from the second movable mold plate 402.

[0067] Step 3: Use the electromagnetic cleaner 5 to paint the cavity 308 to prevent the molten metal from sticking to the inside of the cavity 308;

[0068] Specifically, the speed of the electromagnetic cleaner 5 when pushed into the mold cavity 308 is adjusted according to the size of the mold cavity 308. According to the Lorentz force exerted on the charged object in the magnetic field, the orbit radius of the charged object is proportional to the movement speed. When the mold cavity 308 is larger, the current passing through the electromagnet in the electromagnetic parking device 604 is larger, the magnetic attraction formed is stronger, and the degree of compression of the spring 605 is deeper. When the electromagnetic parking device 604 is powered off, the force generated by the rebound of the spring 605 is greater, and the speed of pushing the electromagnetic cleaner 5 into the mold cavity 308 perpendicular to the magnetic field formed by the electromagnet 501 is faster. According to the characteristics of the Lorentz force, the movement trajectory of the electromagnetic cleaner 5 is relatively large. At the same time, the range that the electromagnetic cleaner 5 can be painted is larger. When the cavity 308 is smaller, the current passing through the electromagnet in the electromagnetic parking device 604 is smaller, the magnetic attraction formed is weaker, the degree of compression of the spring 605 is shallower, and when the electromagnetic parking device 604 is powered off, the force generated by the rebound of the spring 605 is smaller, and the speed of pushing the electromagnetic cleaner 5 into the cavity 308 perpendicular to the magnetic field formed by the electromagnet 501 is slower. According to the characteristics of the Lorentz force, the movement trajectory of the electromagnetic cleaner 5 is relatively small. At the same time, the range that the electromagnetic cleaner 5 can be painted is smaller, and the cavity 308 can be painted in all directions, completing the painting protection of the cavity 308 before die pressing.

[0069] Step 4: Setting the injection pressure and mold filling speed of the injection punch 103 according to the temperature monitored by the temperature sensor 106 and the mold size so that the liquid metal fills the mold;

[0070] Specifically, the steps include:

[0071] Step 4 a1: According to the temperature of the injected liquid metal monitored by the temperature sensor 106, the metal density is deduced. If the injected metal temperature is 650-680°C, the injected metal is aluminum; if the injected metal temperature is 1500-1550°C, the injected metal is iron; if the injected metal temperature is 1000-1200°C, the injected metal is copper; set the injection pressure of the injection punch 103. When the liquid metal density is a1, the injection pressure is set to p1.

[0072] Step 4 a2: When the density of the liquid metal is a2, the injection pressure is set to p2; when a1 is greater than a2, p1 is greater than p2. The greater the metal density, the greater the injection pressure, and the liquid metal can be injected into the cavity through the injection chamber 104 and evenly fill the cavity.

[0073] Step 4 b1: First, set the filling speed according to the density of the metal being pushed out and the size of the cavity 308 in the mold. When the density of the liquid metal is larger, i.e., a1, and the size of the cavity 308 is larger, i.e., b1, the filling speed is t1. At this time, the filling speed t1 can make the cavity 308 in the mold evenly filled with liquid metal. At this time, the control system controls the nozzle gate 302 on the fixed mold plate 301 to change to a suitable size, so that the filling speed is t1.

[0074] Step 4 b2: When the density of liquid metal is smaller than a2 and the cavity 308 is smaller and the size is b2, the filling speed is t2. At this time, the filling speed t2 can make the cavity 308 in the mold evenly filled with liquid metal; when a1 is greater than a2 and b1 is greater than b2, t1 is greater than t2; the control system controls the filling speed by controlling the size of the nozzle gate 302 on the fixed template 301. The larger the size of the nozzle gate 302 is opened, the faster the filling speed is, and the smaller the opening is, the slower the filling speed is.

[0075] Step 5: The cavity 308 has been filled with liquid metal, and the liquid metal has been formed, and the formed high-voltage contact seat is demoulded;

[0076] Specifically, the first movable template 401 is pulled toward the second movable template 402 by the pull rod 305, and the separation column 403 on the first movable template 401 is pushed toward the limiter 307 on the die structure 3, so that the limiter 307 is separated from the limit hole 405, and the second mold 304 slides along the slide rail 404 and separates from the first mold 303, so that the formed high-voltage contact seat is demolded.

[0077] Step 6: Use the electromagnetic cleaner 5 to clean the cavity 308;

[0078] Specifically, the speed of the electromagnetic cleaner 5 when pushed into the mold cavity 308 is adjusted according to the size of the mold cavity 308. According to the Lorentz force exerted on the charged object in the magnetic field, the orbit radius of the charged object is proportional to the movement speed. When the mold cavity 308 is larger, the current passing through the electromagnet in the electromagnetic parking device 604 is larger, the magnetic attraction formed is stronger, and the degree of compression of the spring 605 is deeper. When the electromagnetic parking device 604 is powered off, the force generated by the rebound of the spring 605 is greater, and the speed of pushing the electromagnetic cleaner 5 into the mold cavity 308 perpendicular to the magnetic field formed by the electromagnet 501 is faster. According to the characteristics of the Lorentz force, the movement trajectory of the electromagnetic cleaner 5 is relatively large. At the same time, the range that the electromagnetic cleaner 5 can be brushed is larger. When the cavity 308 is smaller, the current passing through the electromagnet in the electromagnetic parking device 604 is smaller, the magnetic attraction formed is weaker, and the degree of compression of the spring 605 is shallower. When the electromagnetic parking device 604 is powered off, the force generated by the rebound of the spring 605 is smaller, and the speed of pushing the electromagnetic cleaner 5 into the cavity 308 perpendicular to the magnetic field formed by the electromagnet 501 is slower. According to the characteristics of the Lorentz force, the movement trajectory of the electromagnetic cleaner 5 is relatively small, and the range that can be brushed is smaller. After cleaning, turn on the fan 513 on the electromagnetic cleaner 5 to dry the residual cleaning liquid in the cavity 308.

[0079] In summary, the above embodiments measure the temperature of liquid metal through a temperature sensor to infer the metal density, and then control the injection pressure through the metal density, so as to achieve the purpose of energy saving and perfect molding. At the same time, by detecting the temperature of the liquid metal in the liquid storage chamber, the temperature of the insulation furnace is changed at all times to keep the metal in liquid state and prevent solidification. The mold can be automatically replaced to save human resources, and the filling speed is controlled according to the mold cavity size and the liquid metal density, so that the required molded objects are perfectly formed and automatically demolded after molding.

[0080] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0081] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-voltage contact seat molding device, comprising an injection structure (1), a liquid riser (2), a die structure (3), a movable die structure (4), an electromagnetic cleaner (5), an electromagnetic power structure (6) and a control system, characterized in that: The injection structure (1) comprises a heat preservation furnace (101), a liquid storage chamber (102), an injection punch (103), a temperature sensor (106), an injection chamber (104) and a material inlet (105); the liquid storage chamber (102) is arranged in a T-shape in the heat preservation furnace (101); and the temperature sensor (106) is arranged on the inner wall of the liquid storage chamber (102).

2. A high voltage contact seat forming device according to claim 1, characterized in that: An injection chamber (104) is arranged at the lower end of the liquid storage chamber (102); the height of the connection between the injection chamber (104) outlet and the injection punch (103) exceeds the bottom end of the liquid storage chamber (102); two feed ports (105) are symmetrically arranged at the junction of the injection chamber (104) and the bottom end of the liquid storage chamber (102); the injection punch (103) is arranged at the inlet of the injection chamber (104); and the end of the injection chamber (104) is connected to a liquid riser (2).

3. A high voltage contact seat forming device according to claim 1, characterized in that: The die structure (3) comprises a fixed die plate (301), a nozzle gate (302), a first mold (303), a second mold (304), a pull rod (305), a groove (306), a stopper (307) and a cavity (308); the nozzle gate (302) is arranged on the fixed die plate (301); the nozzle gate (302) is connected to the cavity (308) through a liquid riser (2); and the mold is composed of a first mold (303) and a second mold (304).

4. A high voltage contact seat forming device according to claim 3, characterized in that: The mold cavity (308) is opened inside the mold, the first mold (303) and the second mold (304) are movably connected, and the limiter (307) can be telescopically arranged in the middle of the back of the first mold (303) and the second mold (304). The number of the limiters (307) is four and they are arranged at the four corners of the back of the first mold (303) and the second mold (304).

5. A high voltage contact seat forming device according to claim 4, characterized in that: The grooves (306) on the first mold (303) and the second mold (304) correspond to the slide rails on the second movable mold plate (402), and the limiters on the first mold (303) and the second mold (304) are engaged with the upper limit holes of the second movable mold plate (402) to fix the molds.

6. A high voltage contact seat forming device according to claim 1, characterized in that: The movable mold structure (4) comprises a first movable mold plate (401), a second movable mold plate (402), a separation column (403), a slide rail (404) and a limiting hole (405); the first movable mold plate (401) is fixedly connected with a separation column (403); the number of the separation columns (403) is four; the separation columns (403) are installed corresponding to the limiting holes (405); the first movable mold plate (401) and the second movable mold plate (402) are movably connected via a pull rod (305); the second movable mold plate (402) is provided with a A limiting hole (405) and a slide rail (404), wherein the limiting hole (405) corresponds to the position of the limiter (307), and the slide rail (404) corresponds to the position of the groove (306) on the mold. The first movable mold plate (401) can be pulled toward the second movable mold plate (402) by a pull rod (305), and the separation column (404) on the first movable mold plate (401) can separate the limiter (307) from the limiting hole, and the first mold (303) and the second mold (304) can be separated along the slide rail (404) to form a replaceable mold.

7. A high voltage contact seat forming device according to claim 1, characterized in that: The electromagnetic cleaner comprises a metal shell (502), a metal cover (503), a magnet (504), a brush (505), a power supply (506), a cleaning liquid box (507), a paint box (508), a first pipe (509), a second pipe (510), a first electromagnetic valve (511), a second electromagnetic valve (512) and a fan (513). The electromagnetic cleaner (5) is arranged in an electromagnetic parking device (604). There are two electromagnets (501), which are respectively fixed at the middle position of the upper end and the middle position of the lower end of the second movable template (402). The magnet (504) is arranged at the bottom end of the metal shell (502). The magnet (504) has a plurality of holes. The metal cover (503) is arranged inside the metal shell (502), the power supply (506) is fixed on the metal shell (502), the cleaning liquid box (507) and the paint box (508) are arranged above the metal cover (503), and the bottom of the cleaning liquid box (507) and the paint box (508) are respectively provided with a first pipe (509) and a second pipe (510) leading to the bottom of the metal cover (503), and the first pipe (509) and the second pipe (510) are installed with a first solenoid valve (511) and a second solenoid valve (512), the brush (505) is fixed under the magnet (504), and the paint box (508) may contain a release agent.

8. A high voltage contact seat forming device according to claim 1, characterized in that: The electromagnetic power structure (6) comprises a first electric slide rail (601), a second electric slide rail (602), a moving rod (603), an electromagnetic parking device (604) and a spring (605); the first electric slide rail (601) is fixed at the middle position of the top end of the second moving plate (402); the second electric slide rail (602) is vertically connected to the first electric slide rail (601) in a sliding manner; the moving rod (603) is arranged below the second electric slide rail (602) and is connected to the second electric slide rail (602) in a sliding manner; the electromagnetic parking device (604) is arranged at the end of the moving rod (603) The electromagnetic stopping device (604) is C-shaped, the spring (605) is arranged inside the electromagnetic stopping device (604), the electromagnetic cleaner (5) is stopped inside the electromagnetic stopping device (604) and is movably connected to the spring (605), an electromagnet is arranged inside the electromagnetic stopping device (604), and the electromagnet can adsorb and fix the electromagnetic cleaner (5) after power is turned on, and the spring (605) is compressed during the adsorption and fixing process. When the electromagnetic stopping device (604) is powered off, the electromagnet cannot adsorb and fix the electromagnetic cleaner (5), and the spring (605) rebounds to push the electromagnetic cleaner (5) out.

9. The molding method of a high-voltage contact seat molding device according to claim 1, characterized in that: The control system includes the following specific operation steps: Step 1: Liquid metal is placed in the liquid storage chamber (102), and the control system sets the working temperature of the insulation furnace (101); Step 2: Place or replace the required mold for compression molding, and select the required mold to be fixedly installed on the second movable mold plate (402); Step 3: Use an electromagnetic cleaner (5) to paint the cavity (308) to prevent the molten metal from sticking to the inside of the cavity (308); Step 4: setting the injection pressure and mold filling speed of the injection punch (103) according to the temperature monitored by the temperature sensor (106) and the size of the mold so that the liquid metal fills the mold; Step 5: the mold cavity (308) is filled with liquid metal, and the liquid metal is formed, and the formed high-voltage contact seat is demoulded; Step 6: Use an electromagnetic cleaner (5) to clean the cavity (308).

10. A molding method for a high-voltage contact seat molding device according to claim 8, characterized in that: The step 4 also includes the following specific operation steps: Step 4 a1: according to the temperature of the injected liquid metal monitored by the temperature sensor (106), the metal density is calculated and the injection pressure of the injection punch (103) is set. When the density of the liquid metal is a1, the injection pressure is set to p1; Step 4 a2: When the density of the liquid metal is a2, the injection pressure is set to p2; when a1 is greater than a2, p1 is greater than p2; Step 4 b1: first, set the mold filling speed according to the density of the metal to be pushed out and the size of the cavity (308) in the mold. When the density of the liquid metal is larger (a1) and the cavity 308 is larger (b1), the mold filling speed is t1; Step 4 b2: When the density of the liquid metal is smaller than a2 and the cavity 308 is smaller and has a size of b2, the filling speed is t2. When a1 is greater than a2 and b1 is greater than b2, t1 is greater than t2.

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