Loop heat pipes, housing components, and electronic equipment

Abstract

This application discloses a loop heat pipe, a housing component, and an electronic device. The loop heat pipe includes a base assembly, a first capillary structure, and a second capillary structure. The base assembly has a piping unit, a partition, and at least two evaporation chambers. The piping unit has a liquid replenishment channel, a reflux channel, and vapor channels corresponding to each evaporation chamber. Each evaporation chamber includes a steam outlet communicating with one end of the vapor channel and a liquid replenishment port communicating with the liquid replenishment channel. The reflux channel is disposed between two adjacent evaporation chambers. The partition is disposed between the liquid replenishment channel and the vapor channel. At least a portion of the first capillary structure is disposed within at least two evaporation chambers. The second capillary structure is disposed in at least one of the liquid replenishment channel and evaporation chamber to block the liquid replenishment port of the corresponding evaporation chamber and to contact the first capillary structure. This loop heat pipe can dissipate heat from at least two heat sources separately. The housing component and the electronic device utilize this loop heat pipe.

Description

Technical Field

[0001] This disclosure relates to the field of electronic technology, and in particular to a loop heat pipe, housing component, and electronic device. Background Technology

[0002] Mobile phones, tablets, and other electronic devices have become indispensable technological products in people's lives, studies, and entertainment. With the development of electronic devices, user experience has gradually become an important consideration for consumers when purchasing them.

[0003] In related technologies, loop heat pipes are typically used to improve heat dissipation efficiency. Loop heat pipes further enhance heat dissipation efficiency through a gas-liquid separation structure. Some electronic devices have at least two heat sources, and traditional heat dissipation methods require separate loop heat pipes for each, which takes up considerable space. While some loop heat pipes can dissipate heat from at least two heat sources separately, their manufacturing cost is too high, hindering efforts to reduce the overall cost of electronic devices. Summary of the Invention

[0004] This disclosure provides a loop heat pipe, a housing component, and an electronic device. The loop heat pipe can dissipate heat from at least two heat sources separately and is easy to manufacture, effectively reducing manufacturing costs. The housing component and electronic device utilize this loop heat pipe to achieve excellent heat dissipation performance, which helps reduce the heat dissipation costs of the electronic device.

[0005] The technical solution is as follows:

[0006] According to a first aspect of the present disclosure, a loop heat pipe is provided, including a substrate assembly, a first capillary structure, and a second capillary structure. The substrate assembly has a piping unit, a partition, and at least two evaporation chambers. The piping unit has a liquid replenishment channel, a reflux channel, and a vapor channel corresponding to each evaporation chamber. At least two evaporation chambers are spaced apart on the substrate assembly, each evaporation chamber including a steam outlet communicating with one end of the vapor channel and a liquid replenishment port communicating with the liquid replenishment channel. The reflux channel communicates with the liquid replenishment channel and is disposed between two adjacent evaporation chambers, and the reflux channel communicates with the other ends of two adjacent vapor channels. The partition is disposed between the liquid replenishment channel and the vapor channel to separate the liquid replenishment channel and the vapor channel. At least a portion of the first capillary structure is disposed within the liquid replenishment channel and at least two evaporation chambers. The second capillary structure is disposed in at least one of the liquid replenishment channel and evaporation chambers. The second capillary structure includes a first body corresponding to each evaporation chamber. The first body blocks the liquid replenishment port of the corresponding evaporation chamber, and at least a portion of the first body is in contact with the first capillary structure.

[0007] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0008] This loop heat pipe has at least two evaporation chambers, capable of dissipating heat from at least two heat sources. Adjacent evaporation chambers are separated by a first partition, preventing heat interference between them. Simultaneously, by placing the first body in at least one of the liquid replenishment channel and evaporation chambers to block the liquid replenishment port, an anti-backflow structure is formed. The liquid inside each evaporation chamber evaporates into vapor, which flows out from the vapor outlet to the pipe unit due to the blocked liquid replenishment port. This vapor flows through the pipe unit to the cold end, condenses into liquid, and flows back to the liquid replenishment port through the liquid replenishment channel. During this process, the first body absorbs the condensed liquid and transports it to the first capillary structure in contact with it. The first capillary structure then replenishes the liquid back to each evaporation chamber, improving the heat dissipation performance of the loop heat pipe. Thus, this loop heat pipe can dissipate heat from at least two heat sources separately, and the anti-backflow structure formed by the capillary structure makes it difficult for the evaporated vapor to flow out from the liquid replenishment port, achieving gas-liquid separation in the loop heat pipe. This makes the loop heat pipe easy to manufacture and implement, and can effectively reduce manufacturing costs.

[0009] The technical solution of this disclosure will be further explained below:

[0010] In one embodiment, the first body is stacked on the first capillary structure to block the liquid inlet.

[0011] Alternatively, at least a portion of the first body may be filled into the fluid replenishment channel to block the fluid replenishment port.

[0012] In one embodiment, the loop heat pipe further includes a working medium disposed within the pipe unit and at least two evaporation chambers, and the first body blocks the liquid inlet to allow the vaporized working medium to move toward the vapor outlet.

[0013] And / or, at least two evaporation chambers are spaced apart on the substrate assembly along the length of the substrate assembly.

[0014] In one embodiment, the thickness of the first capillary structure is H1, where 0.02 mm ≤ H1 ≤ 0.1 mm.

[0015] And / or, the second capillary structure comprises at least one capillary layer. And / or, the thickness of the second capillary structure is H2, 0.1 mm ≤ H2 ≤ 0.3 mm.

[0016] In one embodiment, the maximum thickness of the loop heat pipe is 0.2 mm to 0.5 mm.

[0017] In one embodiment, the second capillary structure covers the fluid replenishment channel.

[0018] And / or, at least a portion of the second capillary structure is disposed in the reflux channel.

[0019] In one embodiment, the first capillary structure covers the evaporation chamber, the replenishment channel, and the reflux channel.

[0020] And / or, a portion of the first capillary structure is disposed in the steam channel and is disposed near the steam chamber.

[0021] In one embodiment, at least two evaporation chambers include a first evaporation chamber and a second evaporation chamber, which are spaced apart at both ends of the substrate assembly along the length of the substrate assembly, and the evaporation area of ​​the first evaporation chamber is larger than the evaporation area of ​​the second evaporation chamber.

[0022] In one embodiment, there are at least two steam channels, including a first steam channel communicating with a first evaporation chamber and a second steam channel communicating with a second evaporation chamber. The return channel is positioned close to the second evaporation chamber relative to the first evaporation chamber, such that the length of the first steam channel is greater than the length of the second steam channel.

[0023] In one embodiment, the replenishment channel includes a first replenishment channel communicating with a first evaporation chamber and a second replenishment channel communicating with a second evaporation chamber.

[0024] At least a portion of the first capillary structure and at least a portion of the second capillary structure are stacked to fill the first and second replenishment channels.

[0025] In one embodiment, the partition includes a first partition disposed between the first liquid replenishment channel and the first steam channel and a second partition disposed between the second liquid replenishment channel and the second steam channel, wherein the first partition and the second partition are spaced apart along the length direction of the base assembly to form notches.

[0026] The reflux channel is connected to the first and second replenishment channels through a notch.

[0027] And / or, a portion of the second capillary structure passes through the notch and contacts the reflux channel, thus sealing the notch.

[0028] In one embodiment, the substrate assembly includes a first plate and a second plate, which cooperate to form a receiving cavity. A partition is disposed in the receiving cavity to divide the receiving cavity into a vapor channel, a reflux channel, a replenishment channel, and an evaporation cavity.

[0029] In one embodiment, the partition includes a baffle. The two ends of the baffle abut against the first plate and the second plate, respectively.

[0030] Alternatively, the partition may include a welded layer, which is welded to and fixed to the first plate and the second plate.

[0031] In one embodiment, at least one of the first plate and the second plate is provided with a groove, and the other of the first plate and the second plate covers the groove to form a receiving cavity.

[0032] In one embodiment, the first plate has a groove, the first capillary structure covers the bottom of the groove, and the first capillary structure has a clearance groove for the clearance partition, and the second capillary structure is disposed on the first capillary structure.

[0033] And / or, the partition is stamped with the second plate.

[0034] In one embodiment, the second plate is provided with a support column that avoids the second capillary structure and protrudes toward the first capillary structure.

[0035] The support column abuts against the first capillary structure.

[0036] Alternatively, when the second plate is in a non-compressed state, the support column is in clearance fit with the first capillary structure. When the second plate and / or the first plate is in a compressed state, the support column is in contact fit with the first capillary structure to support the first plate and the second plate.

[0037] In one embodiment, one of the first plate and the second plate includes a mid-frame or a battery cover.

[0038] According to a second aspect of the present disclosure, a housing component is also provided, including a housing assembly and a loop heat pipe as described in any of the above embodiments, the loop heat pipe being disposed on the housing assembly.

[0039] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0040] This housing component integrates a loop heat pipe onto the housing assembly, facilitating heat dissipation from at least two heat sources mounted on the housing assembly via an evaporation chamber. The heat is then transferred to the cooling section via a piping unit, thus fully utilizing the space within the housing assembly for heat dissipation. This enhances the heat dissipation performance of the housing assembly and improves the cooling efficiency for components integrated into it, particularly heat-generating sources such as motherboard chips (i.e., the CPU). Therefore, this housing component exhibits excellent heat dissipation performance.

[0041] The technical solution of this disclosure will be further explained below:

[0042] In one embodiment, the housing assembly has a receiving hole, and at least a portion of the loop heat pipe is disposed within the receiving hole, so that at least a portion of the loop heat pipe is embedded within the housing. In this way, by embedding at least a portion of the loop heat pipe into the housing through the receiving hole, the thickness space of the housing can be fully utilized to integrate the loop heat pipe, thereby actively reducing the thickness of the protruding heat dissipation structure and contributing to the thinning and lightening of electronic devices.

[0043] In one embodiment, the base assembly has a skirt, and the housing has a carrier disposed on the side wall of the receiving hole, with the skirt fixedly connected to the carrier.

[0044] According to a third aspect of the present disclosure, an electronic device is also provided, including a heat source and a loop heat pipe in any of the above embodiments, or a housing component in any of the above embodiments. The heat source includes at least two heat sources, each corresponding to an evaporation cavity. The heat sources cooperate with the heat dissipation of the base component, and at least a portion of the heat source overlaps with the evaporation cavity on the orthographic projection plane of the loop heat pipe in the thickness direction.

[0045] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0046] This electronic device utilizes the loop heat pipe or the housing component from any of the above embodiments, enabling it to dissipate heat from at least two heat sources, thus preventing localized overheating that could affect its performance or cause damage. The use of this loop heat pipe provides excellent heat dissipation performance, and the low manufacturing cost of the loop heat pipe further reduces the overall heat dissipation cost of the electronic device.

[0047] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0048] The accompanying drawings are provided to help understand the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the technical solutions of the present invention and do not constitute an improper limitation on the scope of protection of the present invention.

[0049] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0050] Figure 1 This is a schematic diagram of the structure of an electronic device shown in one embodiment.

[0051] Figure 2 for Figure 1 The diagram shows the structure of the housing component.

[0052] Figure 3 This is a schematic diagram of the loop heat pipe structure shown in one embodiment.

[0053] Figure 4 for Figure 2The diagram shows the structure of a loop heat pipe (with the main heat source and secondary heat source in operation).

[0054] Figure 5 for Figure 2 The diagram shows the internal structure of the loop heat pipe (with the main heat source in operation).

[0055] Figure 6 for Figure 5 The diagram shows a cross-sectional view of the loop heat pipe along the A-axis.

[0056] Figure 7 for Figure 5 The diagram shows a cross-sectional view of the loop heat pipe along the B-axis.

[0057] Figure 8 for Figure 5 The diagram shows a cross-sectional view of the loop heat pipe along the C-axis.

[0058] Figure 9 for Figure 5 The diagram shown is an exploded view of the loop heat pipe structure.

[0059] Figure 10 for Figure 1 The diagram shows a half-section of the electronic device along the X-axis.

[0060] Figure 11 This is a partial cross-sectional schematic diagram of a loop heat pipe according to another embodiment.

[0061] Figure 12 This is a half-sectional schematic diagram of a housing component according to another embodiment.

[0062] Figure 13 This is a schematic diagram of the hardware structure of an electronic device shown in one embodiment.

[0063] Explanation of reference numerals in the attached figures:

[0064] 10. Electronic device; 11. Processing component; 12. Memory; 13. Power supply component; 14. Multimedia component; 15. Audio component; 16. Input / output interface; 17. Sensor component; 18. Communication component; 10a. Housing component; 100. Housing assembly; 110. Receiving hole; 120. Carrier; 200. Loop heat pipe; 210. Substrate assembly; 211. Piping unit; 201. Liquid replenishment channel; 201a. First liquid replenishment channel; 201b. Second liquid replenishment channel; 202. Reflux channel; 203. Vapor channel; 203a. First vapor channel; 203b. 212 Second steam passage; 204 Steam outlet; 205 Liquid replenishment port; 206 First evaporation chamber; 207 Second evaporation chamber; 213 Separator; 2131 First separator; 2132 Second separator; 2133 Notch; 214 First plate; 208 Groove; 215 Second plate; 209 Support column; 216 Skirt; 220 First capillary structure; 221 Clearance groove; 230 Second capillary structure; 231 First body; 232 Second body; 300 Heat source; 310 Main heat source; 320 Secondary heat source; 400 Battery. Detailed Implementation

[0065] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative and do not limit the scope of protection of this disclosure.

[0066] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure.

[0067] Mobile phones, tablets, and other electronic devices have become indispensable technological products in people's lives, studies, and entertainment. With the development of electronic devices, their internal structures are becoming increasingly compact, and while the performance of related components is becoming more powerful, the heat generated is also increasing. For example, the number of cores in the CPU (Central Processing Unit) of electronic devices is increasing, and while performance is improving, heat generation is also increasing. This leads to increasingly greater heat generation in electronic devices, posing a growing challenge to their heat dissipation performance. Especially in recent years, temperature rise has gradually become an important consideration for consumers when purchasing electronic devices.

[0068] However, current heat dissipation technologies for electronic devices require increasing the size of the heat dissipation structure to improve heat dissipation efficiency, which occupies internal space. To improve heat dissipation efficiency, more and more electronic devices are using loop heat pipes with gas-liquid separation structures. Some electronic devices have at least two heat sources, and traditional heat dissipation methods require separate loop heat pipes for each, which takes up a lot of space. While some loop heat pipes can dissipate heat from at least two heat sources separately, their manufacturing cost is too high, leading to excessively high heat dissipation costs in electronic devices.

[0069] Based on this, the present disclosure provides a loop heat pipe that can dissipate heat from at least two heat sources separately, and is easy to manufacture, which can effectively reduce manufacturing costs.

[0070] To better understand the loop heat pipe of this disclosure, it is illustrated by an electronic device that uses the loop heat pipe.

[0071] like Figure 1 as well as Figure 2 As shown, this disclosure discloses an electronic device 10, which may be a mobile phone, tablet computer, e-reader, laptop computer, vehicle equipment, etc., and includes a heat source 300 and a loop heat pipe 200.

[0072] Among them, such as Figures 2 to 5 As shown, the loop heat pipe 200 includes a base assembly 210, a first capillary structure 220, and a second capillary structure 230. The base assembly 210 is provided with a piping unit 211, a partition 213, and at least two evaporation chambers 212. The piping unit 211 is provided with a liquid replenishment channel 201, a return channel 202, and a vapor channel 203 corresponding to each evaporation chamber 212. At least two evaporation chambers 212 are spaced apart on the base assembly 210. Each evaporation chamber 212 includes a steam outlet 204 communicating with one end of the vapor channel 203 and a liquid replenishment port 205 communicating with the liquid replenishment channel 201. The return channel 202 communicates with the liquid replenishment channel 201 and is located between two adjacent evaporation chambers 212. The return channel 202 is also connected to the other end of two adjacent vapor channels 203. A separator 213 is disposed between the replenishment channel 201 and the vapor channel 203 to separate the replenishment channel 201 and the vapor channel 203. At least a portion of the first capillary structure 220 is disposed within the replenishment channel 201 and at least two evaporation chambers 212. A second capillary structure 230 is disposed in at least one of the replenishment channel 201 and the evaporation chamber 212. The second capillary structure 230 includes a first body 231 corresponding to each evaporation chamber 212. The first body 231 blocks the replenishment port 205 of the corresponding evaporation chamber 212, and at least a portion of the first body 231 is in contact with the first capillary structure 220.

[0073] And combined Figure 2 As shown, the heat source 300 includes at least two, which correspond one-to-one with the evaporation cavity 212. The heat source 300 is heat dissipated in cooperation with the base component 210, and at least a portion of the heat source 300 overlaps with the evaporation cavity 212 on the orthographic projection plane of the loop heat pipe 200 in the thickness direction.

[0074] The loop heat pipe 200 has at least two evaporation chambers 212, capable of dissipating heat from at least two heat sources 300. Adjacent evaporation chambers 212 are separated by a first partition 2131, preventing heat interference between them. The liquid inlet 205 of each evaporation chamber 212 is connected to one end of the liquid supply channel 201, and the steam outlet 204 of each evaporation chamber 212 is connected to one end of the pipe unit. The other end of the pipe unit 211 is connected to the liquid supply channel 201. A backflow prevention structure is formed by placing the first body 231 at least one of the liquid supply channel 201 and the evaporation chamber 212 to block the liquid inlet 205. Thus, during the use of the electronic device 10, the heat generated by each heat source 300 is transferred to the corresponding evaporation chamber 212 through the base assembly 210. Consequently, the liquid inside each evaporation chamber 212 is heated and evaporates into steam. The steam is obstructed from flowing out of the liquid inlet 205 and instead flows out from the steam outlet 204 to the piping unit 211. The steam flows through the piping unit 211 to the cold end of the electronic device 10, where it condenses into liquid and flows back to the liquid inlet 205 via the liquid replenishment channel 201. During this process, the first body 231 absorbs the condensed liquid and transports it to the first capillary structure 220 in contact with it. The first capillary structure 220 then replenishes the liquid back to the evaporation chamber 212 for continuous evaporation and heat dissipation, thereby cooling the heat source 300 and preventing localized overheating of the electronic device 10 that could affect its performance or cause damage, thus improving the heat dissipation performance of the electronic device 10.

[0075] In addition, the second capillary structure 230 adsorbs the condensed liquid, which fills the capillary pores of the second capillary structure 230, allowing the second capillary structure 230 to better prevent steam from flowing out of the liquid inlet 205.

[0076] Understandably, the loop heat pipe 200 can dissipate heat from at least two heat sources 300 separately, and forms an anti-backflow structure through a capillary structure, making it difficult for the vapor formed by evaporation to flow out from the liquid inlet 205, thus achieving gas-liquid separation in the loop heat pipe 200. This makes the loop heat pipe 200 easy to manufacture and implement, effectively reducing manufacturing costs. Therefore, the electronic device 10, by using the loop heat pipe 200, not only has good heat dissipation performance, but also low manufacturing cost, thereby helping to reduce the heat dissipation cost of the electronic device 10.

[0077] Furthermore, the reflux channel 202 is located between two adjacent evaporation chambers 212, and the reflux channel 202 is connected to the other end of the two adjacent steam channels 203, and the liquid is returned to at least two evaporation chambers 212 through the replenishment channel 201. This makes the arrangement of the evaporation chambers 212 more flexible, and allows the heat sources 300 on the electronic device 10 with a certain distance to dissipate heat separately.

[0078] In one example, such as Figure 4 as well as Figure 5 As shown, the length direction of the substrate assembly 210 and the length direction of the electronic device 10 are both arranged along the X-axis. The width direction of the substrate assembly 210 and the width direction of the electronic device 10 are both arranged along the Y-axis. In some embodiments, at least two evaporation chambers 212 are spaced apart on the substrate assembly 210 along its length. Thus, the evaporation chambers 212 can dissipate heat from at least two heat sources 300 spaced apart along the length direction of the electronic device 10.

[0079] Combination Figure 4 as well as Figure 5 As shown, the steam channel 203 and the liquid replenishment channel 201 are separated along the width direction (Y-axis direction) of the base assembly 210.

[0080] It should be noted that "heat source 300 and substrate component 210 heat dissipation cooperation" should be interpreted broadly, including heat conduction achieved through direct or indirect contact between heat source 300 and substrate component 210, and heat dissipation of heat source 300 by substrate component 210 to avoid local overheating of heat source 300.

[0081] In some embodiments, the heat source 300 is connected to the substrate component 210 for heat dissipation via a thermally conductive medium. The thermally conductive medium includes, but is not limited to, thermally conductive silicone, thermally conductive mid-frame, etc.

[0082] It should be noted that "the second capillary structure 230 is disposed in at least one of the liquid replenishment channel 201 and the evaporation chamber 212" includes the second capillary structure 230 being disposed in the liquid replenishment channel 201, the second capillary structure 230 being disposed in the evaporation chamber 212, and the second capillary structure 230 being disposed between the liquid replenishment channel 201 and the evaporation chamber 212. It can block the liquid replenishment port 205 without affecting the delivery function of the pipeline unit 211; the evaporation function of the evaporation chamber 212 is sufficient.

[0083] It should be noted that "the second capillary structure 230 blocks the liquid inlet 205" can be interpreted in a broad sense, including but not limited to the second capillary structure 230 blocking part of the liquid inlet 205 to reduce the hollow area of ​​the liquid inlet 205, or the second capillary structure 230 filling the liquid inlet 205 to reduce the hollow area of ​​the liquid inlet 205.

[0084] It should be noted that by using the second capillary structure 230 to block the liquid inlet 205, it can be understood that the second capillary structure 230 can block the steam flow from the evaporation chamber 212 to the liquid inlet 205 side, but will not affect the liquid flow from the liquid inlet 205 to the evaporation chamber 212. The second capillary structure 230 is located between the evaporation chamber 212 and the liquid inlet 205, and the second capillary structure 230 can be stacked with or arranged side by side with the first capillary structure 220. When the first capillary structure 220 and the second capillary structure 230 are stacked, the sum of the dimensions of the first capillary structure 220 and the second capillary structure 230 in the thickness direction is equal to the inner dimension of the pipeline unit 211 in the thickness direction (e.g., ...). Figure 9 (As shown). When the first capillary structure 220 and the second capillary structure 230 are arranged side by side, the dimension of the second capillary structure 230 in the thickness direction is equal to the inner dimension of the pipeline unit 211 in the thickness direction.

[0085] The first capillary structure 220 and the second capillary structure 230 can be capillary structures with the same or different capillary densities. For example, the first capillary structure 220 and the second capillary structure 230 can be capillary structures with different thicknesses but the same capillary density, with the thickness of the first capillary structure 220 being less than the thickness of the second capillary structure 230. In this way, the first capillary structure 220 is used to transport the liquid working medium, and the second capillary structure 230 is used to block the flow of the gaseous working medium to the liquid replenishment port 205. In addition, the thickness and capillary density of the first capillary structure 220 and the second capillary structure 230 can be adjusted according to the actual stacking requirements.

[0086] It should be noted that the embodiments disclosed herein do not specifically limit the arrangement of the first capillary structure 220 and the second capillary structure 230, or parameters such as thickness. The above description is merely an example and not a limitation.

[0087] It should be noted that the first capillary structure 220 and the second capillary structure 230 can be implemented in various ways, such as grooved capillary structure, mesh (braided) capillary structure, fiber capillary structure and sintered capillary structure, etc.

[0088] like Figure 2 As shown, in some embodiments, the electronic device 10 further includes a housing assembly 100, on which a loop heat pipe 200 is disposed. In this way, integrating the loop heat pipe 200 onto the housing assembly 100 facilitates heat dissipation from the heat source 300 mounted on the housing assembly 100 using the evaporation chamber 212, and then transferring the heat to the cooling section using the piping unit 211. This allows for full utilization of the space within the housing assembly 100 for heat dissipation, thereby improving the heat dissipation performance of the housing assembly 100 and enhancing the heat dissipation efficiency for components integrated into the housing assembly 100, particularly heat sources 300 that are prone to generating heat (such as processors, i.e., CPUs).

[0089] It should be noted that the housing assembly 100 can be a mid-frame, a battery 400 cover, or a rear cover, etc. It is understood that the loop heat pipe 200 can be integrated with the housing assembly 100, for example, the loop heat pipe 200 can be embedded in the mid-frame to form an integrated mid-frame component, or the loop heat pipe 200 and the battery 400 cover can be integrated into an integrated housing component 10a. In other words, the embodiments disclosed herein do not specifically limit the type of housing assembly 100.

[0090] Optionally, the housing assembly 100 and the loop heat pipe 200 are modularly assembled to form the housing component 10a. This gives the housing component 10a good heat dissipation performance and facilitates improved assembly efficiency of the electronic device 10.

[0091] In some embodiments, the heat source 300 can be a control motherboard with a processor, a screen module, or a camera module, etc. The housing assembly 100 has a heat-conducting area (not shown) for the heat source 300, and it is disposed opposite to the evaporation chamber 212 along the thickness direction of the housing assembly 100. The heat source 300 cooperates with the evaporation chamber 212 for heat dissipation through the heat-conducting area of ​​the heat source 300. Therefore, the heat source 300 can increase its heat dissipation area through the housing assembly 100, and its heat dissipation efficiency can be improved by utilizing the loop heat pipe 200, effectively preventing the heat source 300 from overheating.

[0092] In this embodiment, the housing assembly 100 can serve as a support structure for the electronic device 10. In addition to integrating the loop heat pipe 200, at least some components of the electronic device 10 can be directly or indirectly disposed on the housing assembly 100 to assemble the electronic device 10. For example, a control motherboard is mounted on the housing assembly 100 so that the processor and the evaporation chamber 212 are disposed opposite each other along the thickness direction of the housing assembly 100.

[0093] Optionally, in some embodiments, the housing assembly 100 may be disposed inside the electronic device 10, and the edge of the housing assembly 100 may be designed as part of the outer casing of the electronic device 10. When the edge of the housing assembly 100 serves as the outer casing of the electronic device 10, it can protect the electronic device 10.

[0094] Optionally, in some embodiments, the housing assembly 100 may have a planar or planar structure, thus allowing visual differentiation of the two sides of the housing assembly 100, which may be referred to as the front and back of the housing assembly 100, or alternatively, one side and the other side of the housing assembly 100. The interior of the housing assembly 100 may be partially hollowed out as needed to accommodate other components in the electronic device 10.

[0095] It should be noted that part or all of the housing assembly 100 may be made of metal or alloy materials (e.g., aluminum alloy). Of course, the material of the housing assembly 100 may also be other, and this disclosure does not specifically limit this.

[0096] In some embodiments, the housing assembly 100 is made of aluminum alloy or steel. This gives the housing assembly 100 good thermal conductivity, facilitating the transfer of heat from the heat source 300 to the loop heat pipe 200.

[0097] It should be noted that the loop heat pipe 200 can be installed not only in the housing assembly 100, but also in other parts of the electronic device 10.

[0098] For example, in some embodiments, the loop heat pipe 200 is disposed between the screen and the mid-frame.

[0099] Furthermore, in some embodiments, the loop heat pipe 200 is located on one side of the battery 400 cover (also known as the rear cover).

[0100] That is, the loop heat pipe 200 is superimposed on other load-bearing components, heat dissipation components or heat source 300 along the thickness direction of electronic device 10, so as to directly or indirectly improve the heat dissipation efficiency of heat source 300 and avoid local overheating of electronic device 10.

[0101] In this embodiment of the disclosure, heat source 300 refers to a device in electronic device 10 that radiates a large amount of heat.

[0102] In practical applications, the heat radiated by components is usually positively correlated with the power consumption of the components; the greater the power consumption of the components, the greater the heat radiated by the components. Accordingly, the heat source 300 in this disclosure can be a component in the electronic device 10 whose power consumption exceeds M% of the total power consumption of the device, where M can be 20, 30, 40, 50, etc.

[0103] In some embodiments, the heat source 300 may include a central processing unit, a processing device integrating processing and storage functions, a power supply component (e.g., a battery 400), an ISP chip, a charging chip, a screen PMIC chip, etc. Of course, the heat source 300 may also be other components, such as an image sensor, etc., and this disclosure does not specifically limit it in this regard.

[0104] It should be noted that "cold end of electronic device 10" generally refers to the position where the temperature rises more slowly than that of heat source 300, that is, the position where the internal temperature of electronic device 10 is lower than that of "heat source 300" during the use of electronic device 10.

[0105] like Figure 4 as well as Figure 5As shown, in some embodiments, the loop heat pipe 200 further includes a working medium disposed within the piping unit 211 and at least two evaporation chambers 212. The first body 231 blocks the liquid inlet 205 to allow the vaporized working medium to move towards the vapor outlet 204. Thus, the liquid working fluid can be evaporated into vapor. The vaporized working fluid can flow into the piping unit 211 through the vapor outlet 204, and after being reliquefied within the piping unit 211, it can be transported to the liquid inlet 205 via a capillary structure.

[0106] Specifically, during the use of the electronic device 10, the heat generated by the heat source 300 is transferred to the evaporation chamber 212 through the substrate component 210. The working medium contained inside the evaporation chamber 212 is then heated and evaporates into steam. This steam is difficult to flow out from the liquid replenishment port 205, but instead flows out from the steam outlet 204 to the piping unit 211. The steam flows through the piping unit 211 to the cold end of the electronic device 10, where it condenses back into liquid working medium, and then flows back to the liquid replenishment port 205 through the liquid replenishment channel 201. During this process, the second capillary structure 230 adsorbs the condensed working medium and transports it to the first capillary structure 220 in contact with it. The first capillary structure 220 then replenishes the working medium back into the evaporation chamber 212 for continuous evaporation and heat dissipation, thereby cooling the heat source 300 and preventing localized overheating of the electronic device 10 that could affect its performance or cause damage, thus improving the heat dissipation performance of the electronic device 10.

[0107] It should be noted that the "working medium" includes, but is not limited to, coolant and other fluids that can be applied to the loop heat pipe 200, and the boiling point of the "working medium" can be adjusted according to actual needs, without limitation.

[0108] In some embodiments, the first capillary structure 220 is disposed in the evaporation chamber 212 to form an evaporator.

[0109] Furthermore, in some embodiments, at least a portion of the first capillary structure 220 is disposed within the liquid replenishment channel 201, the return channel 202, and at least two evaporation chambers 212. Thus, the first capillary structure 220 can better transfer the liquid working medium, replenish the evaporator in a timely manner, and improve the heat dissipation performance of the loop heat pipe 200.

[0110] Optionally, in some embodiments, a portion of the first capillary structure 220 is disposed within the steam channel 203 and close to the steam chamber. This facilitates increasing the evaporation area and the heat dissipation area of ​​the heat source 300.

[0111] Based on any of the above embodiments, such as Figure 4 , Figure 5 as well as Figure 9As shown, in some embodiments, the first body 231 is stacked on the first capillary structure 220 to block the liquid replenishment port 205. In this way, the contact area between the second capillary structure 230 and the first capillary structure 220 can be increased, and the liquid stored in the second capillary structure 230 can be better transported to the first capillary structure 220, so that the liquid can be replenished back to the evaporation chamber 212 through the first capillary structure 220.

[0112] Alternatively, in some other embodiments, at least a portion of the first body 231 fills the liquid replenishment channel 201 to block the liquid replenishment port 205. In this way, the second capillary structure 230 can be directly filled into the liquid replenishment channel 201 to block the liquid replenishment port 205, making the arrangement of the first capillary structure 220 and the second capillary structure 230 more flexible.

[0113] In one example, such as Figures 6 to 7 As shown, the thickness directions of the base component 210, the housing component 100, the first capillary structure 220, and the second capillary structure 230 are respectively set along the Z-axis direction.

[0114] Based on any of the above embodiments, in some embodiments, the thickness of the first capillary structure 220 is H1, where 0.02mm≤H1≤0.2mm. This allows for flexible adjustment of the thickness of the first capillary structure 220, ensuring that the evaporation chamber 212 has sufficient evaporation space to facilitate the rapid evaporation of the liquid stored in the first capillary structure 220 into gas.

[0115] In some embodiments, 0.1mm ≤ H1 ≤ 0.2mm.

[0116] In some embodiments, H1 = 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm.

[0117] It should be noted that H1 can be any value within the range of 0.02mm to 0.2mm, and the above examples are just examples and not limitations.

[0118] In some embodiments, the second capillary structure 230 includes at least one layer of capillary structure. Thus, the second capillary structure 230 can be formed by a single layer of capillary structure or by stacking multiple layers of capillary structures.

[0119] For example, a capillary structure can be cut into a predetermined shape, and multiple layers of this capillary structure can be stacked to form a second capillary structure 230. This capillary structure can also be cut into a first capillary structure 220. Thus, both the first capillary structure 220 and the second capillary structure 230 can be formed using a single capillary structure, which helps to save costs.

[0120] In some embodiments, the thickness of the second capillary structure 230 is H2, where 0.1mm ≤ H2 ≤ 0.3mm. Thus, the thickness of the second capillary structure 230 can be reasonably set according to the size of the liquid inlet 205, effectively blocking the liquid inlet 205 without affecting the liquid return flow.

[0121] In some embodiments, 0.1mm ≤ H2 ≤ 0.2mm.

[0122] In some embodiments, H2 = 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm, 0.21mm, 0.23mm, 0.25mm, 0.27mm, 0.3mm.

[0123] It should be noted that H2 can be any value within the range of 0.1mm to 0.3mm, and the above examples are just examples and not limitations.

[0124] Based on any of the above embodiments, in some embodiments, the maximum thickness of the loop heat pipe 200 is 0.2mm to 0.5mm. This makes the loop heat pipe 200 as thin as possible to meet the requirements of a thinner and lighter design for the electronic device 10.

[0125] In some embodiments, the maximum thickness of the loop heat pipe 200200 is one of 0.2mm, 0.22mm, 0.25mm, 0.28mm, 0.3mm, 0.31mm, 0.33mm, 0.35mm, 0.37mm, 0.4mm, 0.41mm, 0.43mm, 0.45mm, 0.47mm, or 0.5mm, to adapt to the thinner and lighter design of the electronic device 10.

[0126] It should be noted that the maximum thickness of the loop heat pipe 200 can be any value within the range of 0.2mm to 0.5mm. The above examples are just examples and are not limitations.

[0127] like Figures 5 to 8 As shown, in some embodiments, the second capillary structure 230 covers the liquid replenishment channel 201. Thus, the second capillary structure 230 can cooperate with the first capillary structure 220 to fill the liquid replenishment channel 201, increasing the smoothness of liquid reflux. Simultaneously, it can prevent the vaporized working medium from entering the liquid replenishment channel 201, achieving gas-liquid separation of the loop heat pipe 200.

[0128] Optionally, in some embodiments, the second capillary structure 230 includes a second body 232 disposed in the liquid replenishment channel 201. The first body 231 is in contact with the first capillary structure 220 and connected to the second body 232 to block the liquid replenishment port 205. Thus, placing the first body 231 in the evaporation chamber 212 and in contact with the first capillary structure 220 enables rapid delivery of liquid to the evaporation chamber 212, while the second body 232 disposed in the liquid replenishment channel 201 can improve the liquid absorption speed, thereby further improving the liquid replenishment speed of the evaporation chamber 212.

[0129] Understandably, connecting the second body 232 with at least two first bodies 231 together helps to increase the barrier thickness, improve the barrier effect on steam, and further improve the anti-backflow performance of the loop heat pipe 200.

[0130] like Figure 5 as well as Figure 8 As shown, in some embodiments, at least a portion of the second capillary structure 230 is disposed in the reflux channel 202. This facilitates the rapid guidance of liquid in the reflux channel 202 to the replenishment channel 201, thereby improving replenishment efficiency.

[0131] Reference Figure 1 as well as Figure 10 As shown, in the actual operation of large electronic devices 10 such as mobile phones and tablets, the heat source 300 is often not a single entity. Besides the main heat source 310 (such as the CPU), there are also secondary heat sources 320 such as the ISP chip, charging chip, and screen PMIC chip, which consume significant power. For example, in special usage scenarios such as playing games while charging, when the main heat source 310 and secondary heat sources 320 are working simultaneously, the temperature of each heat source 300 will rise at the same time, and crosstalk will occur between them. If heat dissipation is not timely, the temperature uniformity will decrease, the overall device and chip temperature will rise, and the electronic device 10 will not be able to perform at its best, affecting the gaming experience. However, using the above-mentioned technical solution, the evaporation chamber 212 is arranged along the length of the base component 210, spanning the battery 400 area, and dissipating heat from the CPU and charging chip at both ends of the battery 400. When the main heat source 310 and secondary heat source 320 are working simultaneously, both can be cooled, improving the overall heat dissipation capacity and performance of the device.

[0132] In combination with any of the above embodiments, such as Figures 4 to 8As shown, in some embodiments, at least two evaporation chambers 212 include a first evaporation chamber 206 and a second evaporation chamber 207. The first evaporation chamber 206 and the second evaporation chamber 207 are spaced apart at both ends of the base assembly 210 along the length direction of the base assembly 210, and the evaporation area of ​​the first evaporation chamber 206 is larger than the evaporation area of ​​the second evaporation chamber 207. This facilitates the use of the first evaporation chamber 206 to dissipate heat from the main heat source 310 of the electronic device 10, while the second evaporation chamber 207 is used to dissipate heat from the secondary heat source 320 of the electronic device 10, thus rationally allocating the heat dissipation performance of the loop heat pipe 200 and improving the overall heat dissipation capacity and performance of the device.

[0133] Furthermore, in some embodiments, there are at least two steam channels 203, including a first steam channel 203a communicating with the first evaporation chamber 206 and a second steam channel 203b communicating with the second evaporation chamber 207. The return channel 202 is positioned closer to the second evaporation chamber 207 than the first evaporation chamber 206, such that the length of the first steam channel 203a is greater than the length of the second steam channel 203b. Thus, because the main heat source 310 generates a large amount of heat, when the loop heat pipe 200 dissipates heat from it, the volume of vapor evaporated in the first evaporation chamber 206 is greater, and the heat generated is also greater. Furthermore, the greater length of the first steam channel 203a compared to the second steam channel 203b provides sufficient space to condense the working medium evaporated into a vapor state by the main heat source 310, ensuring timely heat dissipation from the main heat source 310.

[0134] Optionally, such as Figures 4 to 8 As shown, in some embodiments, the replenishment channel 201 includes a first replenishment channel 201a communicating with the first evaporation chamber 206 and a second replenishment channel 201b communicating with the second evaporation chamber 207. At least a portion of the first capillary structure 220 and at least a portion of the second capillary structure 230 are stacked to fill the first replenishment channel 201a and the second replenishment channel 201b. In this way, the second capillary structure 230 can cooperate with the first capillary structure 220 to fill the replenishment channel 201, thereby increasing the smoothness of liquid reflux. At the same time, it can prevent the vaporized working medium from entering the replenishment channel 201, realizing gas-liquid separation of the loop heat pipe 200.

[0135] Specifically, such as Figure 4 As shown, when the main heat source 310 and the secondary heat source 320 work simultaneously, the loop heat pipe 200 can form two distinct gas-liquid heat dissipation routes to dissipate heat from the main heat source 310 and the secondary heat source 320 respectively, thereby improving the overall heat dissipation capacity and performance of the machine.

[0136] like Figure 5As shown, when the main heat source 310 is working, the liquid working medium in the first evaporation chamber 206 absorbs heat from the main heat source 310 and evaporates into a vaporized working medium, which then flows to the first steam channel 203a. During its flow in the first steam channel 203a, the working medium condenses back into liquid and is transported to the replenishment channel 201 via the return channel 202. The first replenishment channel 201a then transports the liquid working medium back to the first steam chamber, continuously replenishing the first evaporation chamber 206 with liquid working medium. During this process, the replenishment port 205 is sealed by the first body 231 to prevent the vaporized working medium from entering the first replenishment channel 201a and causing gas-liquid mixing, thereby ensuring the circulation speed of the loop heat pipe 200 and improving its heat dissipation performance.

[0137] Continue to refer to Figure 5 As shown, if the heat of the main heat source 310 is too great, the second steam channel 203b, the second evaporation chamber 207 and the second liquid replenishment channel 201b can be used to dissipate heat, making full use of the heat dissipation performance of the loop heat pipe 200 to dissipate heat from the main heat source 310, and further improving the heat dissipation efficiency of the single heat source.

[0138] Similarly, when the secondary heat source 320 operates simultaneously, the liquid working medium in the second evaporation chamber 207 absorbs heat from the secondary heat source 320 and evaporates into a vaporized working medium, which flows to the second steam channel 203b. During its flow in the second steam channel 203b, the working medium condenses back into liquid and is transported to the second replenishment channel 201b via the return channel 202. The replenishment channel 201 then transports the liquid working medium back to the second steam chamber, continuously replenishing the second evaporation chamber 207 with liquid working medium. During this process, the first body 231 seals the replenishment port 205 to prevent the vaporized working medium from entering the second replenishment channel 201b and causing gas-liquid mixing, thereby ensuring the circulation speed of the loop heat pipe 200 and improving its heat dissipation performance.

[0139] like Figure 4 as well as Figure 5 As shown, in some embodiments, the partition 213 includes a first partition 2131 disposed between the first replenishment channel 201a and the first steam channel 203a, and a second partition 2132 disposed between the second replenishment channel 201b and the second steam channel 203b. The first partition 2131 and the second partition 2132 are spaced apart along the length of the substrate assembly 210 to form notches 2133. The return channel 202 communicates with the first replenishment channel 201a and the second replenishment channel 201b through the notches 2133. The spaced notches 2133 between the first partition 2131 and the second partition 2132 along the length of the substrate assembly 210 facilitate communication between the return channel 202 and the replenishment channel 201.

[0140] like Figure 5 as well as Figure 8 As shown, in some embodiments, a portion of the second capillary structure 230 passes through the notch 2133 and contacts the return channel 202, thus blocking the notch 2133. In this way, the second capillary structure 230 can cooperate with the first capillary structure 220 to seal the notch 2133, preventing the gaseous working medium from entering the replenishment channel 201 through the notch 2133 and causing gas-liquid mixing. This ensures the circulation speed of the loop heat pipe 200 and improves its heat dissipation performance.

[0141] It should be noted that the first partition 2131 can be implemented in various ways, including at least one of the following: partition plate, isolation strip, isolation hole, etc.

[0142] like Figure 9 As shown, in some embodiments, the first partition 2131 includes a first partition plate disposed between the liquid replenishment channel 201 and the steam channel 203. Thus, the liquid replenishment channel 201 and the steam channel 203 are separated by the partition plate to reduce mutual interference and facilitate implementation.

[0143] Optionally, in some embodiments, the first partition 2131 includes a first isolation hole for separating adjacent replenishment channels 201 and steam channels 203. This not only separates adjacent replenishment channels 201 and steam channels 203, reducing mutual interference, but also, by spacing adjacent replenishment channels 201 and steam channels 203 apart through the isolation hole, direct heat transfer through the substrate assembly 210 is reduced, further minimizing mutual interference.

[0144] Optionally, in some embodiments, the first partition 2131 includes a first partition and a first isolation hole, the first isolation hole cooperating with the first partition to separate adjacent liquid replenishment channels 201 and steam channels 203.

[0145] It should be noted that the substrate component 210 can be implemented in various ways, as long as it can form the piping unit 211 and the evaporation chamber 212. For example, it can be a plate component, a frame component, etc.

[0146] Based on any of the above embodiments, such as Figures 4 to 9As shown, in some embodiments, the substrate assembly 210 includes a first plate 214 and a second plate 215, which cooperate to form a receiving cavity. A partition 213 is disposed in the receiving cavity to divide the receiving cavity into a steam channel 203, a reflux channel 202, a liquid replenishment channel 201, and an evaporation cavity 212. Thus, through the cooperation of the first plate 214 and the second plate 215 with the partition 213, the receiving cavity is easily divided into at least two steam channels 203, a reflux channel 202, a liquid replenishment channel 201, and at least two evaporation cavities 212 corresponding to the steam channels 203, which is easy to implement.

[0147] It should be noted that the first plate 214 and the second plate 215 can be manufactured in various ways, including but not limited to stamping, etching, laser engraving, milling and turning.

[0148] Optionally, the first plate 214 and / or the second plate 215 are 0.1 mm to 0.2 mm thick.

[0149] In some embodiments, the first plate 214 and the second plate 215 are stamped and formed separately, and then assembled together.

[0150] In some embodiments, such as Figure 7 as well as Figure 9 As shown, the partition 213 includes a partition plate. The two ends of the partition plate abut against the first plate 214 and the second plate 215, respectively. In this way, the partition plate easily separates the vapor channel 203 from the liquid replenishment channel 201, reducing gas-liquid mixing and thus reducing the impact on the heat dissipation efficiency of the loop heat pipe 200.

[0151] Optionally, in some embodiments, the partition 213 includes a welded layer, which is welded and fixed to the first plate 214 and the second plate 215. In this way, a portion of the first plate 214 is welded and fixed to the second plate 215 by the welded layer, and a portion of the steam channel 203 is separated from the liquid replenishment channel 201, resulting in a compact structure and reliable connection.

[0152] Furthermore, in some embodiments, the isolation holes are formed in the weld layer. In this way, by forming isolation holes in the weld layer, the adjacent steam channels 203 and the liquid replenishment channels 201 are spaced apart, reducing the direct transfer of heat through the substrate assembly 210 and further reducing mutual interference.

[0153] Based on any embodiment of the first plate 214 described above, see back Figures 6 to 8 As shown, in some embodiments, at least one of the first plate 214 and the second plate 215 is provided with a groove 208, and the other of the first plate 214 and the second plate 215 covers the groove 208 to form a receiving cavity. In this way, the groove 208 facilitates the formation of a receiving cavity.

[0154] Optionally, the first plate 214 is provided with a groove 208, and the second plate 215 is used as a cover. That is, the second plate 215 covers the opening side of the groove 208 of the first plate 214, and the groove 208 on the first plate 214 and the second plate 215 together form a sealed pipeline unit 211 and an evaporation chamber 212.

[0155] Optionally, the second plate 215 is provided with a groove 208, and the first plate 214 is used as a cover. That is, the first plate 214 covers the opening side of the groove 208 of the second plate 215, and the groove 208 of the second plate 215 and the first plate 214 together form a sealed pipeline unit 211 and an evaporation chamber 212.

[0156] Optionally, both the first plate 214 and the second plate 215 are provided with grooves 208. That is, the openings of the grooves 208 on the first plate 214 and the second plate 215 are arranged opposite to each other, and the grooves 208 of the second plate 215 and the first plate 214 together form a closed pipeline unit 211 and an evaporation chamber 212.

[0157] Based on the above embodiments, such as Figures 6 to 9 As shown, in some embodiments, the first plate 214 is provided with a groove 208, the first capillary structure 220 covers the bottom of the groove 208, and the first capillary structure 220 is provided with a clearance groove 221 to avoid the partition portion 213. In this way, by covering the bottom of the groove 208 with the first capillary structure 220 and avoiding the partition portion 213 through the clearance groove 221, it is convenient to integrate the first capillary structure 220 onto the first plate 214. Then, the second capillary structure 230 is covered, and then assembled with the second plate 215, a loop heat pipe 200 can be manufactured, which makes the assembly efficiency of the loop heat pipe 200 high.

[0158] Based on any of the above embodiments, such as Figure 8 As shown, in some embodiments, the second plate 215 is provided with a support post 209. The support post 209 avoids the second capillary structure 230 and protrudes towards the first capillary structure 220. The support post 209 abuts against the first capillary structure 220. In this way, by providing the support post 209, the first plate 214 and the second plate 215 will not easily deform, which would cause the pipe unit 211 or the evaporation chamber 212 to be flattened and broken, thus improving the reliability of the loop heat pipe 200.

[0159] Or, such as Figure 11As shown, in another embodiment, when the second plate 215 is in a non-compressed state, the support column 209 is in clearance fit with the first capillary structure 220; when the second plate 215 and / or the first plate 214 is in a compressed state, the support column 209 is in contact fit with the first capillary structure 220 to support the first plate 214 and the second plate 215. Thus, because there is a gap between the first capillary structure 220 and the support portion, the support portion will not block the vaporized cooling medium inside the first capillary structure 220, thereby improving the flow efficiency of the cooling medium. When the body deforms, the support portion contacts the first capillary structure 220 to support the body. Therefore, the first capillary structure 220 can be used to buffer the force on the body, suppressing or preventing deformation of the body and avoiding situations where certain areas of the body cannot be effectively supported due to displacement, which could lead to deformation in those areas and affect heat dissipation.

[0160] Optionally, in some embodiments, one of the first plate 214 and the second plate 215 includes a mid-frame or a battery 400 cover. Thus, one of the first plate 214 and the second plate 215 is integrally formed with the mid-frame or battery 400 cover, facilitating full utilization of the thickness space of the mid-frame or battery 400 cover to integrate the loop heat pipe 200, which is beneficial for achieving a thinner and lighter electronic device 10.

[0161] Based on any embodiment of the reflux channel 202 described above, in some embodiments, the first capillary structure 220 is disposed within the evaporation chamber 212, the liquid replenishment channel 201, the vapor channel 203, and the reflux channel 202, and is spaced apart from the inner sidewall of the substrate assembly 210. Thus, the placement of the first capillary structure 220 will not cause blockage of the loop heat pipe 200.

[0162] Based on any of the above embodiments of the housing, such as Figure 12 As shown, in some embodiments, the housing is provided with a receiving hole 110, and at least a portion of the loop heat pipe 200 is disposed within the receiving hole 110, so that at least a portion of the loop heat pipe 200 is embedded in the housing. In this way, by embedding at least a portion of the loop heat pipe 200 into the housing through the receiving hole 110, the thickness space of the housing can be fully utilized to integrate the loop heat pipe 200, that is, the thickness dimension of the protruding heat dissipation structure can be actively reduced, which is beneficial to achieving the thinning and lightening of the electronic device 10.

[0163] In some embodiments, the base assembly 210 is provided with a skirt 216, and the housing is provided with a carrier 120 disposed on the side wall of the receiving hole 110, with the skirt 216 fixedly connected to the carrier 120. Thus, when the loop heat pipe 200 is assembled with the central control unit, the skirt 216 is snapped onto the carrier 120, and then the skirt 216 is fixedly connected to the carrier 120 by welding or bonding techniques, making it easy to embed at least a portion of the loop heat pipe 200 into the housing.

[0164] It should be noted that the "carrier 120" can be "part of the shell", that is, the "carrier 120" is integrally formed with "other parts of the shell, such as the shell body"; or it can be an independent component that can be separated from "other parts of the shell, such as the shell body", that is, the "carrier 120" can be manufactured independently and then combined with "other parts of the shell, such as the shell body" to form a whole.

[0165] Equivalently, "a certain body" or "a certain part" can be a portion of the corresponding "component," meaning that the "a certain body" or "a certain part" is integrally formed and manufactured with the "other parts of the component"; or it can be an independent component that can be separated from the "other parts of the component," meaning that the "a certain body" or "a certain part" can be manufactured independently and then combined with the "other parts of the component" to form a whole. The expression of "a certain body" or "a certain part" in this disclosure is merely one embodiment for ease of reading and is not intended to limit the scope of protection of this disclosure. Any solution that includes the above features and has the same function should be understood as an equivalent technical solution of this disclosure.

[0166] It should be noted that the "second plate 215" can be one of the parts of the "base component 210" module, that is, it can be assembled with the "other components of the base component 210" into a module and then modularly assembled; or it can be relatively independent from the "other components of the base component 210" and can be installed separately, so that it can form a whole with the "other components of the base component 210" in this device.

[0167] Similarly, the components included in the "units," "components," and "terminals" of this disclosure can also be flexibly combined. They can be modularly produced according to actual needs and assembled as an independent module; or they can be assembled separately to form a module in this device. The division of the above components in this disclosure is only one embodiment for ease of reading and is not intended to limit the scope of protection of this disclosure. Any technical solution that includes the above components and has the same function should be understood as an equivalent technical solution of this disclosure.

[0168] The present invention has the following technical effects:

[0169] It can achieve a thickness of 0.18mm to 0.3mm and an effective area of ​​2000mm². 2 ~7000mm 2 200 large-area loop heat pipe.

[0170] Compared to traditional heat exchangers, the heat transfer performance of multi-heat-source 300 is improved by more than 100% during operation, and the heat transfer performance of single-heat-source 300 is improved by more than 200% during operation.

[0171] It can achieve dual-channel multi-heat source 300 heat dissipation, and the overall heat source 300 layout is more flexible, which can reduce the absolute temperature of the motherboard area (CPU).

[0172] Reference Figure 13 As shown, in some embodiments, the electronic device 10 may further include one or more of the following components: a processing component 11, a memory 12, a power supply component 13, a multimedia component 14, an audio component 15, an input / output interface 16, a sensor component 17, and a communication component 18.

[0173] Processing components typically control the overall operation of electronic devices, such as operations associated with display, telephone calls, data communication, camera operation, and recording. A processing component may include one or more processors to execute instructions to complete all or part of the steps of the methods described above. Furthermore, a processing component may include one or more modules to facilitate interaction between the processing component and other components. For example, a processing component may include a multimedia module to facilitate interaction between multimedia components and the processing component.

[0174] Memory is configured to store various types of data to support the operation of electronic devices. Examples of this data include instructions for any application or method configured to operate on an electronic device, contact data, phonebook data, messages, pictures, videos, etc. Memory can be implemented from any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0175] The control board includes processing components and memory.

[0176] Power supply components provide power to various components of electronic devices. Power supply components may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to electronic devices.

[0177] The multimedia component includes the display module of this disclosure, facilitating human-computer interaction. If the display module includes a touch panel, the display module can be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors can sense not only the boundaries of touch or swipe actions but also the duration and pressure associated with the touch or swipe operation. In some embodiments, the multimedia component includes a front-facing camera and / or a rear-facing camera. When the electronic device is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera can receive external multimedia data. Each front-facing camera and rear-facing camera can be a fixed optical lens system or have focal length and optical zoom capabilities.

[0178] The audio component is configured to output and / or input audio signals. For example, the audio component includes a microphone (MIC) configured to receive external audio signals when the electronic device is in an operating mode, such as a call mode, recording mode, or voice recognition mode. The received audio signals may be further stored in memory or transmitted via a communication component. In some embodiments, the audio component also includes a speaker configured to output audio signals.

[0179] The input / output interface provides an interface between the processing component and the peripheral interface module, which can be a keyboard, click wheel, buttons, etc. These buttons may include, but are not limited to: home button, volume buttons, start button, and lock button.

[0180] The sensor assembly includes one or more sensors configured to provide state assessment of various aspects of the electronic device. For example, the sensor assembly can detect the on / off state of the electronic device, the relative positioning of components such as the display and keypad of the electronic device, changes in the position of the electronic device or a component of the electronic device, the presence or absence of user contact with the electronic device, the orientation or acceleration / deceleration of the electronic device, and temperature changes of the electronic device. The sensor assembly may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly may also include a photosensitive element, such as a CMOS or CCD image sensor, configured for use in imaging applications. In some embodiments, the sensor assembly may also include an accelerometer, a gyroscope, a magnetometer, a pressure sensor, or a temperature sensor.

[0181] The communication component is configured to facilitate wired or wireless communication between electronic devices and other devices. The electronic device can access wireless networks based on communication standards, such as WiFi, 2G, 3G, 4G, or 6G, or combinations thereof. In one exemplary embodiment, the communication component receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, the communication component also includes a Near Field Communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, Infrared Data Association (IrDA) technology, Ultra-Wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0182] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0183] The above embodiments are merely illustrative of several implementation methods of this disclosure, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the inventive concept of this disclosure, and these modifications and improvements all fall within the protection scope of this disclosure.

Claims

1. A loop heat pipe, characterized in that, Capable of dissipating heat from at least two heat sources, the loop heat pipe includes: The base assembly includes a piping unit, a partition, and evaporation chambers corresponding to the heat source. The piping unit includes a liquid replenishment channel, a reflux channel, and a steam channel corresponding to each evaporation chamber. At least two evaporation chambers are spaced apart on the base assembly. Each evaporation chamber includes a steam outlet connected to one end of the steam channel and a liquid replenishment port connected to the liquid replenishment channel. The reflux channel is connected to the liquid replenishment channel and is located between two adjacent evaporation chambers. The reflux channel is connected to the other end of two adjacent steam channels. The partition is located between the liquid replenishment channel and the steam channel to separate the liquid replenishment channel and the steam channel. A first capillary structure, at least a portion of which is disposed within the liquid replenishment channel and the at least two evaporation chambers; and The second capillary structure is disposed in at least one of the liquid replenishment channel and the evaporation chamber. The second capillary structure includes a first body corresponding to each of the evaporation chambers. The first body blocks the liquid replenishment port of the corresponding evaporation chamber. At least a portion of the first body is in contact with the first capillary structure.

2. The loop heat pipe according to claim 1, characterized in that, The first body is stacked on the first capillary structure to block the liquid inlet; Alternatively, at least a portion of the first body may be filled into the fluid replenishment channel to block the fluid replenishment port.

3. The loop heat pipe according to claim 1, characterized in that, The loop heat pipe also includes a working medium disposed in the pipe unit and the at least two evaporation chambers. The first body blocks the liquid inlet so that the vaporized working medium moves toward the vapor outlet. And / or, the at least two evaporation chambers are spaced apart on the substrate assembly along the length direction of the substrate assembly.

4. The loop heat pipe according to claim 1, characterized in that, The thickness of the first capillary structure is H1, where 0.02 mm ≤ H1 ≤ 0.1 mm; And / or, the second capillary structure includes at least one capillary layer; and / or, the thickness of the second capillary structure is H2, 0.1mm≤H2≤0.3mm.

5. The loop heat pipe according to claim 1, characterized in that, The maximum thickness of the loop heat pipe is 0.2mm to 0.5mm.

6. The loop heat pipe according to claim 1, characterized in that, The second capillary structure covers the fluid replenishment channel; And / or, at least a portion of the second capillary structure is disposed in the reflux channel.

7. The loop heat pipe according to claim 1, characterized in that, The first capillary structure covers the evaporation chamber, the liquid replenishment channel, and the reflux channel; And / or, a portion of the first capillary structure is disposed in the steam channel and is located near the steam chamber.

8. The loop heat pipe according to claim 1, characterized in that, The at least two evaporation chambers include a first evaporation chamber and a second evaporation chamber. The first evaporation chamber and the second evaporation chamber are spaced apart at both ends of the substrate assembly along the length direction of the substrate assembly, and the evaporation area of ​​the first evaporation chamber is larger than the evaporation area of ​​the second evaporation chamber.

9. The loop heat pipe according to claim 8, characterized in that, The steam passage is at least two, including a first steam passage communicating with the first evaporation chamber and a second steam passage communicating with the second evaporation chamber. The return passage is located close to the second evaporation chamber relative to the first evaporation chamber, such that the length of the first steam passage is greater than the length of the second steam passage.

10. The loop heat pipe according to claim 9, characterized in that, The replenishment channel includes a first replenishment channel communicating with the first evaporation chamber and a second replenishment channel communicating with the second evaporation chamber; At least a portion of the first capillary structure and at least a portion of the second capillary structure are stacked to fill the first and second replenishment channels.

11. The loop heat pipe according to claim 10, characterized in that, The partition includes a first partition disposed between the first liquid replenishment channel and the first steam channel and a second partition disposed between the second liquid replenishment channel and the second steam channel, wherein the first partition and the second partition are spaced apart along the length direction of the base component to form notches; The reflux channel is connected to the first replenishment channel and the second replenishment channel through the notch; And / or, a portion of the second capillary structure passes through the notch and contacts the return channel, thus blocking the notch.

12. The loop heat pipe according to any one of claims 1 to 11, characterized in that, The substrate assembly includes a first plate and a second plate, the first plate and the second plate cooperating to form a receiving cavity, and the partition is disposed in the receiving cavity to divide the receiving cavity into the vapor channel, the reflux channel, the liquid replenishment channel and the evaporation cavity.

13. The loop heat pipe according to claim 12, characterized in that, The partition includes a partition plate, and the two ends of the partition plate abut against the first plate body and the second plate body respectively; Alternatively, the partition may include a welding layer, which is welded to and fixed to the first plate and the second plate.

14. The loop heat pipe according to claim 12, characterized in that, At least one of the first plate and the second plate is provided with a groove, and the other of the first plate and the second plate covers the groove to form the receiving cavity.

15. The loop heat pipe according to claim 14, characterized in that, The first plate is provided with the groove, the first capillary structure covers the bottom of the groove, and the first capillary structure is provided with a clearance groove to avoid the partition, and the second capillary structure is disposed on the first capillary structure; And / or, the partition is stamped with the second plate.

16. The loop heat pipe according to claim 12, characterized in that, The second plate is provided with a support column, which avoids the second capillary structure and protrudes toward the first capillary structure; The support column abuts against the first capillary structure; Alternatively, when the second plate is in a non-compression state, the support column is in clearance fit with the first capillary structure; when the second plate and / or the first plate is in a compression state, the support column is in contact fit with the first capillary structure to support the first plate and the second plate.

17. The loop heat pipe according to claim 12, characterized in that, One of the first plate and the second plate includes a middle frame or a battery cover.

18. A housing component, characterized in that, It includes a housing assembly and a loop heat pipe as described in any one of claims 1 to 17, the loop heat pipe being disposed in the housing assembly.

19. The housing component according to claim 18, characterized in that, The housing assembly is provided with a receiving hole, and at least a portion of the loop heat pipe is disposed within the receiving hole so that at least a portion of the loop heat pipe is embedded within the housing assembly.

20. The housing component according to claim 19, characterized in that, The base assembly has a skirt, and the housing assembly has a support body disposed on the side wall of the receiving hole, and the skirt is fixedly connected to the support body.

21. An electronic device, characterized in that, The device includes a heat source and a loop heat pipe as described in any one of claims 1 to 17, or a housing component as described in any one of claims 18 to 20. The heat source includes at least two heat sources, each corresponding to one of the evaporation chambers. The heat source is heat-dissipating in conjunction with the base assembly, and at least a portion of the heat source overlaps with the corresponding evaporation chamber on the orthographic projection plane of the loop heat pipe in the thickness direction.

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