Equipment maintenance parameter monitoring method and device, equipment, medium and product
By obtaining the equipment maintenance monitoring plan, determining the parameters to be monitored and the early warning threshold, collecting and comparing the parameters, generating maintenance information to indicate the equipment maintenance plan, the problem of difficult to accurately judge the equipment maintenance time in the prior art is solved, and multi-parameter monitoring and targeted maintenance of the equipment are realized.
Patent Information
- Application Number
- CN202510043256.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-10
- Publication Date
- 2025-05-09
- Estimated Expiration
- Not applicable · inactive patent
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Figure CN119958631A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of equipment maintenance, and in particular to an equipment maintenance parameter monitoring method, device, equipment, medium and product. Background Art
[0002] Equipment maintenance is an essential part of the production process. Equipment maintenance can ensure the normal operation of the equipment, extend its service life and improve its operating efficiency. In order to ensure the effectiveness of maintenance, many companies currently install maintenance monitoring systems for their equipment to ensure that they can accurately perform maintenance based on the equipment's usage to ensure production efficiency.
[0003] In the related art, the maintenance time is usually determined based on the usage time of the equipment or the number of products produced, and often only a single parameter can be monitored, which cannot meet the actual maintenance needs of the equipment.
[0004] In view of this, there is a need for an equipment maintenance parameter monitoring method that can meet the actual maintenance needs of the equipment. Summary of the invention
[0005] In view of this, the present invention provides a method for monitoring equipment maintenance parameters, which can monitor multiple parameters to meet the actual maintenance needs of the equipment.
[0006] In a first aspect, the present invention provides a method for monitoring equipment maintenance parameters, which is applied to a semiconductor equipment maintenance system, and the method includes: obtaining a maintenance monitoring plan for the equipment to be maintained; the maintenance monitoring plan includes at least one parameter to be monitored and a warning threshold matching the parameter to be monitored; based on the maintenance monitoring plan, collecting the parameters to be monitored of the equipment to be maintained; comparing the parameters to be monitored and the warning threshold, and generating maintenance information based on the comparison result; the maintenance information is used to indicate the maintenance plan for the equipment to be maintained.
[0007] In this embodiment, by obtaining the maintenance monitoring scheme of the equipment to be maintained, the maintenance monitoring scheme includes at least one parameter to be monitored and an early warning threshold of the equipment to be maintained; by comparing the parameter to be monitored and the early warning threshold, maintenance information is generated to maintain the equipment to be maintained. The above scheme collects the parameters to be monitored and generates maintenance information according to the maintenance monitoring scheme of the equipment to generate a maintenance scheme. The parameters in the maintenance monitoring scheme can be updated and monitored to perform targeted maintenance on the equipment, thereby ensuring the production efficiency of the equipment.
[0008] In an optional embodiment, a maintenance monitoring plan for the equipment to be maintained is obtained, including: obtaining the maintenance requirements of the equipment to be maintained, and determining the type of parameters to be monitored for the equipment to be maintained based on the maintenance requirements; for each type of parameter to be monitored, determining a warning threshold value corresponding to the type of parameter to be monitored; and generating a maintenance monitoring plan including several types of parameters to be monitored and warning threshold values, wherein the types of parameters to be monitored and the warning threshold values correspond to each other.
[0009] In this embodiment, according to the maintenance requirements of the equipment to be maintained, the type of parameters to be monitored and the corresponding warning threshold of the equipment to be maintained are determined to generate a maintenance monitoring plan. The equipment to be maintained can be monitored in a targeted manner to avoid excessive maintenance that wastes resources and insufficient maintenance that causes accelerated equipment loss.
[0010] In an optional embodiment, comparing the parameter to be monitored with the warning threshold, and generating maintenance information based on the comparison result includes: comparing the parameter to be monitored with the warning threshold; when the parameter to be monitored is not within the range of the warning threshold, obtaining the parameter type of the parameter to be monitored, and generating maintenance information based on the parameter type.
[0011] In this embodiment, by comparing the parameters to be monitored with the warning threshold, the types of parameters to be monitored that are not within the range of the warning threshold are obtained, and maintenance information is generated according to the types of parameters to be monitored to maintain the equipment. The equipment can be maintained in a targeted manner according to the types of parameters to be monitored to avoid waste of resources.
[0012] In an optional implementation, after the maintenance information is generated, the method further includes: performing maintenance on the equipment to be maintained according to the maintenance information, and resetting corresponding parameters to be monitored.
[0013] In this embodiment, according to the maintenance information, after the equipment to be maintained is maintained, the corresponding parameters to be monitored are reset, so as to ensure the accuracy of the monitoring data and the validity of the maintenance information.
[0014] In an optional embodiment, the method also includes: updating the maintenance monitoring plan, and obtaining the type of monitored parameters and warning thresholds of the equipment to be maintained based on the updated maintenance monitoring plan, wherein the warning threshold matches the type of monitored parameters; and collecting corresponding monitored parameters based on the type of monitored parameters.
[0015] In this embodiment, by updating the maintenance monitoring plan and monitoring the equipment to be maintained according to the updated maintenance monitoring plan, the flexibility of equipment maintenance can be improved.
[0016] In an optional implementation, the method further includes: obtaining a ratio of the parameter to be monitored and a warning threshold, and displaying the ratio on a semiconductor equipment maintenance system.
[0017] In this embodiment, the ratio of the parameter to be monitored and the warning threshold is displayed on the semiconductor equipment maintenance system, so that the information can be displayed intuitively.
[0018] In a second aspect, the present invention provides an equipment maintenance parameter monitoring device, the device comprising: an acquisition module, used to acquire a maintenance monitoring plan for equipment to be maintained; the maintenance monitoring plan comprises at least one parameter to be monitored and a warning threshold value matching the parameter to be monitored; a collection module, used to collect the parameters to be monitored of the equipment to be maintained based on the maintenance monitoring plan; a generation module, used to compare the parameters to be monitored and the warning threshold value, and generate maintenance information based on the comparison result; the maintenance information is used to indicate the maintenance plan for the equipment to be maintained.
[0019] In a third aspect, the present invention provides a computer device, comprising: a memory and a processor, the memory and the processor being communicatively connected to each other, the memory storing computer instructions, and the processor executing the equipment maintenance parameter monitoring method of the first aspect or any corresponding embodiment thereof by executing the computer instructions.
[0020] In a fourth aspect, the present invention provides a computer-readable storage medium having computer instructions stored thereon, the computer instructions being used to enable a computer to execute the equipment maintenance parameter monitoring method of the first aspect or any corresponding embodiment thereof.
[0021] In a fifth aspect, the present invention provides a computer program product, comprising computer instructions for causing a computer to execute the equipment maintenance parameter monitoring method of the first aspect or any corresponding embodiment thereof. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0023] Figure 1 is a flow chart of a method for monitoring equipment maintenance parameters according to an embodiment of the present invention;
[0024] Figure 2 is a flow chart of another equipment maintenance parameter monitoring method according to an embodiment of the present invention;
[0025] Figure 3 is a flow chart of another equipment maintenance parameter monitoring method according to an embodiment of the present invention;
[0026] Figure 4 is a flow chart of another equipment maintenance parameter monitoring method according to an embodiment of the present invention;
[0027] Figure 5 is a structural block diagram of a device for monitoring equipment maintenance parameters according to an embodiment of the present invention;
[0028] Figure 6 It is a schematic diagram of the hardware structure of a computer device according to an embodiment of the present invention. DETAILED DESCRIPTION
[0029] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.
[0030] Equipment maintenance can ensure the normal operation of the equipment, extend the service life of the equipment and improve the operating efficiency of the equipment. In order to ensure the effectiveness of maintenance, in the relevant technology, a maintenance monitoring system is usually installed for the equipment to ensure that the equipment can be maintained in a targeted manner according to the use of the equipment to ensure production efficiency.
[0031] The maintenance system in the related art has a relatively single monitoring parameter. The maintenance time of most equipment is determined only based on the equipment's usage time or the number of products produced. There are many components involved in the production process of semiconductor equipment, and the usage is relatively complicated. In addition, under different working conditions, the usage method and frequency of semiconductor equipment are different. It is difficult to meet the actual maintenance needs of the equipment by only monitoring fixed maintenance parameters.
[0032] Under different usage conditions, semiconductor equipment has different standards for the same parameter. Using the same judgment standard for the same parameter ignores the diversity of equipment usage scenarios and will lead to deviations from actual conditions.
[0033] During the operation of semiconductor equipment, the number of parameters that need to be monitored simultaneously is complex and large, and many companies find it difficult to estimate the time for equipment maintenance. Failure to maintain semiconductor equipment in a timely manner may affect the normal production process of semiconductor equipment and cause semiconductor equipment failure.
[0034] The embodiment of the present invention provides a method for monitoring equipment maintenance parameters, which obtains a maintenance monitoring plan for the equipment to be maintained, and determines the type of the parameter to be monitored and the warning threshold value matching the parameter to be monitored according to the maintenance monitoring plan; generates maintenance information according to the comparison result between the collected parameter to be monitored and the warning threshold value, so as to maintain the equipment to be maintained. The maintenance monitoring plan can be specified by the staff according to the use environment of the semiconductor equipment to monitor multiple parameters of the equipment to be maintained, so as to ensure targeted maintenance operations for the equipment under different production conditions, so as to ensure the production efficiency of the semiconductor equipment.
[0035] According to an embodiment of the present invention, an embodiment of a method for monitoring equipment maintenance parameters is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.
[0036] In this embodiment, a device maintenance parameter monitoring method is provided, and the method is applied to a semiconductor device maintenance system. Figure 1 is a flow chart of a method for monitoring equipment maintenance parameters according to an embodiment of the present invention. Figure 1 As shown, the process includes the following steps:
[0037] Step S101, obtaining a maintenance monitoring plan for the equipment to be maintained; the maintenance monitoring plan includes at least one parameter to be monitored and a warning threshold value matching the parameter to be monitored.
[0038] Among them, the maintenance monitoring schemes for different equipment to be maintained are different. According to the monitoring scope of the equipment to be maintained, the parameter types that need to be monitored for the equipment to be maintained can be determined, and a maintenance monitoring scheme containing several groups of parameter types to be monitored can be generated. In this way, the maintenance parameters of the equipment to be maintained can be monitored in a targeted manner. When the structure of the equipment to be maintained is complex and contains many modules, the structures or modules in the equipment to be maintained can be grouped, and the corresponding maintenance monitoring scheme can be generated based on the grouping results.
[0039] The maintenance monitoring plan can include basic information and performance indicators of the equipment to be maintained. Based on the basic information, the equipment corresponding to the maintenance monitoring plan can be quickly determined, so that the equipment to be maintained can be maintained in time when the equipment to be maintained needs maintenance. The maintenance monitoring plan includes performance indicators. By monitoring the performance indicators of the equipment to be maintained, potential problems of the equipment can be discovered in time, so that preventive measures can be taken in time.
[0040] The content of the maintenance monitoring plan can be set by the staff according to the actual usage of the equipment to be maintained.
[0041] The warning threshold corresponds to the parameter type of the parameter to be monitored. The warning threshold can be determined by analyzing the historical operation data of the equipment to be maintained and determining the normal range of the parameter to be monitored, thereby determining the warning threshold. The warning threshold can also be predicted by the proportional risk model, etc., and the warning threshold is set according to the prediction result. In a practical application, the type of parameter to be monitored includes the service life of a component in the equipment to be maintained. The probability distribution model is used to estimate the remaining life of the component based on its service life data, and the warning threshold is set according to the remaining life.
[0042] Step S102: Based on the maintenance monitoring plan, the parameters to be monitored of the equipment to be maintained are collected.
[0043] According to the maintenance monitoring plan, the type of parameters to be monitored of the equipment to be maintained can be determined. The type of parameters to be monitored can be determined according to the production conditions and usage of the equipment to be maintained. In some optional implementations, the type of parameters to be monitored includes the number of gate valve openings and closings, system usage time, etc.
[0044] The parameters to be monitored can be collected in different ways according to the type of the parameters to be monitored. When the data type of the parameters to be monitored is the operating temperature, the temperature sensor can be set to collect the data to be monitored. After collecting the parameters to be monitored, the data can be preprocessed to remove duplicate values, abnormal values, etc. in the data.
[0045] Step S103, comparing the parameter to be monitored with the warning threshold, and generating maintenance information based on the comparison result; the maintenance information is used to indicate the maintenance plan of the equipment to be maintained.
[0046] By comparing the parameter to be monitored and the warning threshold, it can be determined whether the parameter to be monitored is within the warning threshold. When the parameter to be monitored is within the warning threshold, it means that the module or component corresponding to the parameter to be monitored does not need maintenance temporarily; when the parameter to be monitored exceeds the warning threshold, it means that the module or component corresponding to the parameter to be monitored needs maintenance.
[0047] The collected parameters to be monitored are compared with the thresholds corresponding to the parameters to be monitored. Based on the comparison results, it is possible to determine which modules or components in the equipment to be maintained need maintenance, and generate maintenance information.
[0048] After the maintenance information is generated, the staff can be reminded through alarms and other means to perform maintenance on the equipment to be maintained as soon as possible according to the maintenance information, and continue to monitor the parameters to be monitored after maintenance.
[0049] The equipment maintenance parameter monitoring method provided in this embodiment obtains the maintenance monitoring plan of the equipment to be maintained, and determines the monitored parameters and early warning thresholds of the equipment to be maintained according to the maintenance monitoring plan; and generates maintenance information by comparing the monitored parameters and the early warning thresholds to maintain the equipment to be maintained. The above scheme collects the monitored parameters and generates maintenance information according to the maintenance monitoring plan of the equipment to generate a maintenance plan, and can update and monitor the parameters in the maintenance monitoring plan to perform targeted maintenance on the equipment, thereby ensuring the production efficiency of the equipment. Compared with adding sensors to the equipment to be maintained, directly feeding back and counting the data obtained by the sensors can save costs, reduce the failure rate of semiconductor equipment, and improve the flexibility and applicability of monitoring projects. In addition, monitoring and calculation when the abnormal information of the semiconductor equipment is not obtained can reduce the lag in the maintenance of the semiconductor equipment and prevent the best maintenance time of the equipment from being missed.
[0050] In this embodiment, a device maintenance parameter monitoring method is provided, and the method is applied to a semiconductor device maintenance system. Figure 2 is a flow chart of a method for monitoring equipment maintenance parameters according to an embodiment of the present invention. Figure 2 As shown, the process includes the following steps:
[0051] Step S201, obtaining a maintenance monitoring plan for the equipment to be maintained; the maintenance monitoring plan includes at least one parameter to be monitored and a warning threshold value matching the parameter to be monitored.
[0052] Specifically, the above step S201 includes:
[0053] Step S2011, obtaining the maintenance requirements of the equipment to be maintained, and determining the type of parameters to be monitored of the equipment to be maintained based on the maintenance requirements.
[0054] The maintenance requirements may be determined based on the production conditions of the equipment to be maintained. The maintenance requirements may include cleaning maintenance, lubrication maintenance, tightening maintenance, etc. When the maintenance requirements include cleaning maintenance, the operating time of the equipment to be maintained may be tested.
[0055] When there are many types of parameters to be monitored, the types of parameters to be monitored can be managed in groups to improve the efficiency of monitoring. Among them, the parameters to be monitored with similar maintenance requirements can be grouped together.
[0056] Step S2012: for each parameter type to be monitored, determine a warning threshold value corresponding to the parameter type to be monitored.
[0057] Different types of parameters to be monitored have different ways of obtaining the warning threshold. The parameters to be monitored include the warning threshold that can be determined based on the technical documentation of the equipment to be maintained. It is also possible to predict the warning thresholds of some types of parameters to be monitored by building a neural network model.
[0058] In an actual application, the parameter types to be monitored include the remaining amount of lubricating oil in the equipment to be maintained. The minimum and maximum values of the remaining amount of lubricating oil in the equipment to be maintained can be obtained according to the technical documents of the equipment to be maintained to determine the warning threshold.
[0059] Step S2013, generating a maintenance monitoring plan including several types of parameters to be monitored and early warning thresholds, wherein the types of parameters to be monitored and the early warning thresholds correspond to each other.
[0060] The types of parameters to be monitored and the warning thresholds are matched, and a maintenance monitoring plan including several types of parameters to be monitored and the warning thresholds is generated for the equipment to be maintained. Targeted monitoring can be performed on the equipment to be maintained.
[0061] When there are many types of parameters to be monitored, the maintenance monitoring solution can group the types of parameters to be monitored according to the structure of the equipment to be maintained or the acquisition method of the types of parameters to be monitored, so as to facilitate the collection of the parameters to be monitored.
[0062] Step S202: Based on the maintenance monitoring plan, the parameters to be monitored of the equipment to be maintained are collected.
[0063] For details, please see Figure 1 Step S102 of the illustrated embodiment will not be described in detail here.
[0064] Step S203, comparing the parameter to be monitored with the warning threshold, and generating maintenance information based on the comparison result; the maintenance information is used to indicate the maintenance plan of the equipment to be maintained.
[0065] For details, please see Figure 1 Step S103 of the illustrated embodiment will not be described in detail here.
[0066] In some optional implementations, the above step S203 further includes:
[0067] Step S2031, comparing the parameter to be monitored with the warning threshold.
[0068] Among them, according to the type of the parameter to be monitored, the parameter to be monitored and the warning threshold are compared. When the warning threshold is an interval, it is necessary to determine whether the parameter to be monitored is within the interval of the warning threshold. When the warning threshold is only a numerical value, it is sufficient to determine whether the parameter to be monitored is greater than, less than, or equal to the warning threshold.
[0069] If the parameter to be monitored is within the range of the warning threshold, it means that the equipment to be maintained corresponding to the parameter to be monitored does not need maintenance temporarily and can continue to be monitored.
[0070] Step S2032: when the parameter to be monitored is not within the range of the warning threshold, the parameter type of the parameter to be monitored is obtained, and maintenance information is generated according to the parameter type.
[0071] In some optional implementations, when the parameter to be monitored is the number of times the switch device is opened, the warning threshold may be 50 times, that is, when the parameter to be monitored is less than or equal to the warning threshold, it indicates that the parameter to be monitored is within the range of the warning threshold. When the parameter to be monitored is greater than the warning threshold, it indicates that the parameter to be monitored is outside the range of the warning threshold.
[0072] In some optional embodiments, when the parameter to be monitored is the contact wear thickness, the warning threshold may be 1 mm, that is, when the parameter to be monitored is greater than or equal to the warning threshold, it indicates that the parameter to be monitored is within the range of the warning threshold. When the parameter to be detected is less than the warning threshold, it indicates that the parameter to be monitored is outside the range of the warning threshold.
[0073] When the parameter to be monitored is not within the range of the warning threshold, it means that the equipment to be maintained corresponding to the parameter to be monitored needs maintenance. According to the maintenance monitoring plan, the parameter type of the parameter to be monitored and the target component in the equipment to be maintained corresponding to the parameter type can be determined to generate maintenance information. The maintenance information includes maintenance of the target component.
[0074] By comparing the parameters to be monitored and the warning threshold, the types of parameters to be monitored that are not within the range of the warning threshold are obtained, and maintenance information is generated according to the types of parameters to be monitored to maintain the equipment. Targeted maintenance can be performed on the equipment based on the types of parameters to be monitored to avoid waste of resources.
[0075] The equipment maintenance parameter monitoring method provided in this embodiment determines the type of parameters to be monitored and the corresponding warning threshold of the equipment to be maintained according to the maintenance requirements of the equipment to be maintained, so as to generate a maintenance monitoring plan. The equipment to be maintained can be monitored in a targeted manner to avoid excessive maintenance that wastes resources and insufficient maintenance that causes accelerated equipment loss.
[0076] In this embodiment, a device maintenance parameter monitoring method is provided, and the method is applied to a semiconductor device maintenance system. Figure 3 is a flow chart of a method for monitoring equipment maintenance parameters according to an embodiment of the present invention. Figure 3 As shown, the process includes the following steps:
[0077] Step S301, obtaining a maintenance monitoring plan for the equipment to be maintained; the maintenance monitoring plan includes at least one parameter to be monitored and a warning threshold value matching the parameter to be monitored.
[0078] For details, please see Figure 1 Step S101 of the illustrated embodiment will not be described in detail here.
[0079] Step S302: Based on the maintenance monitoring plan, the parameters to be monitored of the equipment to be maintained are collected.
[0080] For details, please see Figure 1 Step S102 of the illustrated embodiment will not be described in detail here.
[0081] In some optional implementations, before step S303, the following steps are further included:
[0082] Step a1, updating the maintenance monitoring plan, and obtaining the type of parameter to be monitored and the warning threshold of the equipment to be maintained according to the updated maintenance monitoring plan, wherein the warning threshold matches the type of parameter to be monitored.
[0083] When the characteristics of the equipment to be maintained or the production environment change, the maintenance monitoring plan of the equipment to be maintained usually needs to be updated to effectively monitor the equipment to be maintained.
[0084] When new functional modules are added to the equipment to be maintained, the monitoring focus and the types of data to be collected will also change, and the maintenance monitoring plan needs to monitor these new data. As the equipment to be maintained ages, the parts of the equipment to be maintained will wear out, and some additional parameters need to be monitored. These parameters can be added to the maintenance monitoring plan.
[0085] The maintenance monitoring plan can be updated by the staff according to the actual situation.
[0086] Step a2: collecting corresponding parameters to be monitored according to the type of parameters to be monitored.
[0087] According to different types of parameters to be monitored, different sensors can be used to monitor the parameters to be monitored.
[0088] By updating the maintenance monitoring plan and monitoring the equipment to be maintained according to the updated maintenance monitoring plan, the flexibility of equipment maintenance can be improved.
[0089] Step S303, comparing the parameter to be monitored with the warning threshold, and generating maintenance information based on the comparison result; the maintenance information is used to indicate the maintenance plan of the equipment to be maintained.
[0090] For details, please see Figure 1Step S103 of the illustrated embodiment will not be described in detail here.
[0091] Step S304: perform maintenance on the equipment to be maintained according to the maintenance information, and reset the corresponding parameters to be monitored.
[0092] After maintaining the equipment to be maintained, the parameters to be monitored need to be reset to accurately monitor the condition of the equipment to be maintained.
[0093] After the reset, the parameters to be monitored can be collected again, and the parameters to be monitored can continue to be monitored continuously.
[0094] In some optional embodiments, the method further comprises:
[0095] Step b1, obtaining the ratio of the parameter to be monitored and the warning threshold, and displaying the ratio on the semiconductor equipment maintenance system.
[0096] The ratio of the parameter to be monitored to the corresponding warning threshold value may be displayed on the semiconductor equipment maintenance system in the form of a percentage or a progress bar.
[0097] In some optional implementations, changes in the parameters to be monitored may also be displayed on the semiconductor equipment maintenance system in the form of a line graph.
[0098] Displaying the ratio of the parameter to be monitored and the warning threshold on the semiconductor equipment maintenance system can intuitively display the information.
[0099] The equipment maintenance parameter monitoring method provided in this embodiment resets the corresponding parameters to be monitored according to the maintenance information and after the equipment to be maintained is maintained, so as to ensure the accuracy of the monitoring data and the validity of the maintenance information.
[0100] In this embodiment, a semiconductor equipment maintenance system is also provided. The staff can create a maintenance monitoring plan in the software interface of the semiconductor equipment maintenance system. The maintenance monitoring plan can be determined according to the use environment, components, etc. of the semiconductor equipment. In some optional implementations, the monitoring scope of the maintenance monitoring plan is a hardware module in the semiconductor equipment, and the staff can monitor different modules in the semiconductor equipment by creating multiple maintenance monitoring plans.
[0101] After creating a maintenance monitoring plan, you can select several parameters you want to monitor in the statistics interface of the semiconductor equipment maintenance system and add them to this maintenance monitoring plan. After forming a maintenance monitoring plan, you can still add or remove parameters in the maintenance monitoring plan at any time. When adding new parameters, the value of the parameter can be set to 0 first.
[0102] After determining the parameters that need to be monitored, numerical settings are made for these parameters respectively, that is, the warning thresholds corresponding to these parameters are determined. When the monitoring parameters reach the warning thresholds, the staff will be prompted to perform maintenance on the equipment to be maintained within the system.
[0103] In the semiconductor equipment maintenance system, the monitoring parameters can be visualized, and the monitored data can be dynamically updated and displayed in the semiconductor equipment maintenance system in the form of a progress bar or percentage.
[0104] After the staff has performed maintenance on the equipment to be maintained according to the prompts, the corresponding data information in the maintenance monitoring plan can be reset, and the reset data after each maintenance is recorded in the maintenance monitoring plan for subsequent data backtracking. In an actual application, the reset data is recorded in the details page of the maintenance monitoring plan.
[0105] The semiconductor equipment maintenance system generates personalized maintenance monitoring plans to conduct targeted monitoring of the equipment to be maintained, which can prevent the equipment from missing the best maintenance time and affecting production progress.
[0106] This embodiment provides a method for monitoring equipment maintenance parameters. Figure 4 As shown, a new table is first created in the database, wherein the table is used to store the maintenance monitoring scheme and the parameters to be monitored stored in the maintenance monitoring scheme. Then a new maintenance monitoring scheme is created in the table, and the parameters of the statistical items and the set values corresponding to the parameters, i.e., the warning values, are added therein. In some optional implementations. The parameters of the statistical items can be added or deleted directly by the staff. In some optional implementations, the maintenance monitoring scheme for the equipment to be maintained covers various important data in the semiconductor equipment, wherein the data may include the number of times important gate valves are switched on and off, the usage time of the system, etc. These data are counted by the software of the semiconductor equipment during use and then stored in the database for real-time update.
[0107] When the staff adds parameters to the maintenance monitoring plan, the parameter addition value table will be added. The semiconductor equipment maintenance system will obtain the parameter data at the moment of adding the parameter, and will include the value change of the added parameter in the parameter of the table, that is, the newly added parameter will be counted in the database and included in the monitoring range. The semiconductor equipment maintenance system will dynamically update the monitoring value of the parameter. In an actual application, the parameter includes the usage time of the first system. When adding the parameter to the database, the difference between the actual usage time of the first system and the corresponding warning threshold is obtained, and the difference is counted in the database, where the warning threshold is the expected usage time of the first system.
[0108] The semiconductor equipment maintenance system issues a maintenance reminder when the parameter value reaches the set value. The parameter value and set value are determined according to the maintenance monitoring plan. When the staff receives the maintenance reminder, they can arrange the maintenance steps according to different maintenance monitoring plans to ensure that the relevant parts of the equipment maintain qualified working efficiency.
[0109] The semiconductor equipment maintenance system determines whether the staff has performed maintenance on the equipment to be maintained. If not, the system continues to monitor the parameters that have reached the set values, records the value changes in the parameters in the table, and keeps the maintenance reminder until the equipment to be maintained is maintained.
[0110] After the staff has maintained the equipment to be maintained, the data of the maintenance monitoring plan is reset and the maintenance details are attached. That is, after the equipment to be maintained, the latest data of the parameters included in the maintenance monitoring plan is collected again, and compared with the actual data, and the difference is counted in the database. Among them, the maintenance details description may include maintenance items, etc. Before resetting the data, the staff can leave relevant maintenance information in advance. In an actual application, the maintenance information is in the details interface of the maintenance monitoring plan.
[0111] The equipment maintenance parameter monitoring method provided in this embodiment can be applied to semiconductor equipment with complex modules and components. By establishing a database and adding a maintenance monitoring plan to the database, the parameters in the maintenance monitoring plan are monitored and updated in real time. It is possible to customize a personalized maintenance plan based on the use of the equipment, ensuring that targeted maintenance operations can be performed on equipment under different production conditions, thereby ensuring the production efficiency of the equipment.
[0112] In this embodiment, a device for monitoring equipment maintenance parameters is also provided, which is used to implement the above-mentioned embodiments and preferred implementation modes, and the descriptions that have been made will not be repeated. As used below, the term "module" can be a combination of software and / or hardware that implements a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, the implementation of hardware, or a combination of software and hardware, is also possible and conceivable.
[0113] This embodiment provides a device for monitoring equipment maintenance parameters. Figure 5 As shown, including:
[0114] The acquisition module 501 is used to acquire a maintenance monitoring plan for the equipment to be maintained; the maintenance monitoring plan includes at least one parameter to be monitored and a warning threshold value matching the parameter to be monitored.
[0115] The collection module 502 is used to collect the parameters to be monitored of the equipment to be maintained based on the maintenance monitoring plan.
[0116] The generation module 503 is used to compare the parameter to be monitored with the warning threshold and generate maintenance information based on the comparison result; the maintenance information is used to indicate the maintenance plan of the equipment to be maintained.
[0117] In some optional implementations, the acquisition module 501 includes:
[0118] A type determination unit, used to obtain the maintenance requirements of the equipment to be maintained, and determine the type of parameters to be monitored of the equipment to be maintained based on the maintenance requirements;
[0119] A threshold determination unit, for determining, for each parameter type to be monitored, a warning threshold corresponding to the parameter type to be monitored;
[0120] The scheme generating unit is used to generate a maintenance monitoring scheme including a plurality of parameter types to be monitored and early warning thresholds, wherein the parameter types to be monitored and the early warning thresholds correspond to each other.
[0121] In some optional implementations, the generating module 503 includes:
[0122] A comparison unit, used to compare the parameter to be monitored with the warning threshold;
[0123] The information generating unit is used to obtain the parameter type of the parameter to be monitored when the parameter to be monitored is not within the range of the warning threshold value, and generate maintenance information according to the parameter type.
[0124] In some optional embodiments, the equipment maintenance device further comprises:
[0125] The reset module 504 is used to perform maintenance on the equipment to be maintained according to the maintenance information and reset the corresponding parameters to be monitored.
[0126] In some optional embodiments, the equipment maintenance parameter monitoring device further includes:
[0127] The updating module 505 is used to update the maintenance monitoring plan and obtain the type of the parameter to be monitored and the warning threshold of the equipment to be maintained according to the updated maintenance monitoring plan, wherein the warning threshold matches the type of the parameter to be monitored.
[0128] In some optional embodiments, the equipment maintenance parameter monitoring device further includes:
[0129] The display device 506 is used to obtain the ratio of the parameter to be monitored and the warning threshold, and display the ratio on the semiconductor equipment maintenance system.
[0130] The further functional description of each of the above modules and units is the same as that of the above corresponding embodiments and will not be repeated here.
[0131] The equipment maintenance parameter monitoring device in this embodiment is presented in the form of a functional unit, where the unit refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and memory that executes one or more software or fixed programs, and / or other devices that can provide the above functions.
[0132] The embodiment of the present invention also provides a computer device having the above Figure 5 Equipment maintenance parameter monitoring device shown.
[0133] See also Figure 6 , Figure 6 is a schematic diagram of the structure of a computer device provided by an optional embodiment of the present invention, such as Figure 6 As shown, the computer device includes: one or more processors 10, a memory 20, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. Various components are connected to each other using different buses for communication, and can be installed on a common mainboard or installed in other ways as needed. The processor can process the instructions executed in the computer device, including instructions stored in or on the memory to display the graphical information of the GUI on an external input / output device (such as, a display device coupled to the interface). In some optional embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple computer devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Figure 6 A processor 10 is taken as an example.
[0134] The processor 10 may be a central processing unit, a network processor or a combination thereof. The processor 10 may further include a hardware chip. The hardware chip may be a dedicated integrated circuit, a programmable logic device or a combination thereof. The programmable logic device may be a complex programmable logic device, a field programmable gate array, a general purpose array logic or any combination thereof.
[0135] The memory 20 stores instructions executable by at least one processor 10, so that at least one processor 10 executes the method shown in the above embodiment.
[0136] The memory 20 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the computer device, etc. In addition, the memory 20 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some optional embodiments, the memory 20 may optionally include a memory remotely arranged relative to the processor 10, and these remote memories may be connected to the computer device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.
[0137] The memory 20 may include a volatile memory, such as a random access memory; the memory may also include a non-volatile memory, such as a flash memory, a hard disk or a solid state drive; the memory 20 may also include a combination of the above types of memory.
[0138] The computer device also includes an input device 30 and an output device 40. The processor 10, the memory 20, the input device 30 and the output device 40 may be connected via a bus or other means. Figure 6 The example of connecting through bus is taken in the following.
[0139] The input device 30 can receive input digital or character information, and generate key signal input related to the user settings and function control of the computer device, such as a touch screen, a keypad, a mouse, a track pad, a touch pad, an indicator bar, one or more mouse buttons, a trackball, a joystick, etc. The output device 40 may include a display device, an auxiliary lighting device (e.g., an LED) and a tactile feedback device (e.g., a vibration motor), etc. The above-mentioned display device includes but is not limited to a liquid crystal display, a light emitting diode, a display and a plasma display. In some optional embodiments, the display device can be a touch screen.
[0140] The embodiment of the present invention also provides a computer-readable storage medium. The method according to the embodiment of the present invention can be implemented in hardware, firmware, or can be implemented as a computer code that can be recorded in a storage medium, or can be implemented as a computer code that is originally stored in a remote storage medium or a non-temporary machine-readable storage medium and will be stored in a local storage medium through a network download, so that the method described herein can be stored in such software processing on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. Among them, the storage medium can be a magnetic disk, an optical disk, a read-only storage memory, a random access memory, a flash memory, a hard disk or a solid-state hard disk, etc.; further, the storage medium can also include a combination of the above types of memories. It can be understood that a computer, a processor, a microprocessor controller, or programmable hardware includes a storage component that can store or receive software or computer code. When the software or computer code is accessed and executed by a computer, a processor, or hardware, the method shown in the above embodiment is implemented.
[0141] A part of the present invention may be applied as a computer program product, such as a computer program instruction, which, when executed by a computer, can call or provide the method and / or technical solution according to the present invention through the operation of the computer. Those skilled in the art should understand that the existence of the computer program instruction in a computer-readable medium includes, but is not limited to, a source file, an executable file, an installation package file, etc., and accordingly, the way in which the computer program instruction is executed by the computer includes, but is not limited to: the computer directly executes the instruction, or the computer compiles the instruction and then executes the corresponding compiled program, or the computer reads and executes the instruction, or the computer reads and installs the instruction and then executes the corresponding installed program. Here, the computer-readable medium may be any available computer-readable storage medium or communication medium accessible to the computer.
[0142] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.
Claims
1. A method for monitoring equipment maintenance parameters, characterized in that: The method is applied to a semiconductor equipment maintenance system, and the method comprises: Obtaining a maintenance monitoring plan for the equipment to be maintained; the maintenance monitoring plan includes at least one parameter to be monitored and an early warning threshold value matching the parameter to be monitored; Based on the maintenance monitoring plan, collecting the monitored parameters of the equipment to be maintained; The parameter to be monitored is compared with the warning threshold, and maintenance information is generated based on the comparison result; the maintenance information is used to indicate a maintenance plan for the equipment to be maintained.
2. The method according to claim 1, characterized in that: The step of obtaining a maintenance monitoring plan for the equipment to be maintained includes: Obtaining maintenance requirements of the equipment to be maintained, and determining the type of parameters to be monitored of the equipment to be maintained based on the maintenance requirements; For each parameter type to be monitored, determining a warning threshold value corresponding to the parameter type to be monitored; A maintenance monitoring plan is generated that includes a plurality of parameter types to be monitored and early warning thresholds, wherein the parameter types to be monitored and the early warning thresholds correspond to each other.
3. The method according to claim 1, characterized in that The comparing the parameter to be monitored with the warning threshold and generating maintenance information based on the comparison result includes: comparing the parameter to be monitored with the warning threshold; When the parameter to be monitored is not within the range of the warning threshold, the parameter type of the parameter to be monitored is obtained, and maintenance information is generated according to the parameter type.
4. The method according to claim 1, characterized in that: The generating of maintenance information further includes: According to the maintenance information, the equipment to be maintained is maintained, and corresponding parameters to be monitored are reset.
5. The method according to any one of claims 1 to 4, characterized in that: The method further comprises: Updating the maintenance monitoring plan, and obtaining the type of the parameter to be monitored and the early warning threshold of the equipment to be maintained according to the updated maintenance monitoring plan, wherein the early warning threshold matches the type of the parameter to be monitored; According to the type of the parameter to be monitored, corresponding parameters to be monitored are collected.
6. The method according to claim 1, characterized in that The method further comprises: The ratio of the parameter to be monitored to the warning threshold is obtained, and the ratio is displayed on the semiconductor equipment maintenance system.
7. An equipment maintenance parameter monitoring device, characterized in that: The device comprises: An acquisition module, used to acquire a maintenance monitoring plan for the equipment to be maintained; the maintenance monitoring plan includes at least one parameter to be monitored and a warning threshold value matching the parameter to be monitored; A collection module, used for collecting the monitored parameters of the equipment to be maintained based on the maintenance monitoring plan; A generation module is used to compare the parameter to be monitored with the warning threshold, and generate maintenance information based on the comparison result; the maintenance information is used to indicate the maintenance plan of the equipment to be maintained.
8. A computer device, characterized in that: include: A memory and a processor, wherein the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor executes the equipment maintenance parameter monitoring method according to any one of claims 1 to 6 by executing the computer instructions.
9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a computer to execute the equipment maintenance parameter monitoring method according to any one of claims 1 to 6.
10. A computer program product, characterized in that It comprises computer instructions, and the computer instructions are used to make a computer execute the equipment maintenance parameter monitoring method according to any one of claims 1 to 6.