Circuit board manufacturing process information matching method, system, equipment and medium
By integrating process execution parameters and identification information, an accurate IC board production process is constructed, which solves the problems of inefficiency and poor stability in the existing technology, and achieves efficient and reliable customized production.
Patent Information
- Application Number
- CN202411832232.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-12
- Publication Date
- 2025-05-09
AI Technical Summary
The existing IC board production process depends on the experience of operators, is inefficient and difficult to ensure process stability and product quality, and cannot meet customized production requirements.
By integrating process execution parameters and identification information from different sources, an accurate IC board production process is constructed, and the circuit board production process collection is used for parameter matching and identification processing to ensure the consistency and accuracy of process execution.
It improves the stability and reliability of the IC board production process, improves product quality and production efficiency, and meets customized production needs.
Smart Images
Figure CN119961685A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of IC boards, and in particular relates to a method, system, equipment and medium for matching process information of circuit board manufacturing. Background Art
[0002] IC board is the carrier of integrated circuit (IC). Through semiconductor manufacturing process, many transistors, resistors, capacitors and other components are made on a small single crystal silicon wafer, and the components are combined into a complete electronic circuit according to the method of multi-layer wiring or tunnel wiring. The production process of IC board includes printing circuit board, cutting copper clad board, pre-treating copper clad board, transferring circuit board, etching circuit board, drilling circuit board, pre-treating circuit board and welding electronic components.
[0003] In the existing IC board manufacturing process, the setting and adjustment of process parameters mostly rely on the operator's experience and experimental data. This method is not only inefficient, but also difficult to ensure process stability and product quality. In addition, with the development of technology and the diversification of needs, the fixed IC board manufacturing process can no longer meet the customized IC board production requirements. Summary of the invention
[0004] The present invention provides a circuit board manufacturing process information matching method, which constructs an accurate IC board manufacturing process by integrating process execution parameters and identification information from different sources to meet IC board manufacturing requirements.
[0005] Methods include: S101, obtaining the process execution parameters of the current IC board manufacturing process, and inputting the process execution parameters into the circuit board manufacturing process set; S102, matching the process execution parameters based on the existing circuit board manufacturing processes preset in the circuit board manufacturing process set to obtain a first process execution parameter and a corresponding first matching processing identifier; S103, matching the circuit board manufacturing process set with the customized process execution parameters in the current process requirements, and obtaining the matched second process execution parameters and the corresponding second matching processing identifier; S104 , constructing a current IC board manufacturing process in response to the first process execution parameter and the second process execution parameter.
[0006] It should be further explained that, before step S101, the steps include: configuring an existing circuit board manufacturing process; The existing circuit board manufacturing process includes: cutting the substrate material into a preset size; Lay out electronic components according to circuit diagram and drill holes in substrate; A layer of copper is deposited on the insulating hole wall after drilling to form a conductive glue; Affix photosensitive films to both sides of the plate; Use an automatic exposure machine to expose the circuit; Use developer to process the circuit to expose the copper; In the area where the brass is exposed, copper and tin are applied, and then the film is stripped, etched and tinned; Apply solder resist on the circuit pattern; Mark the component numbers on the substrate; Perform surface treatment, cut and bend substrates.
[0007] It should be further explained that the process execution parameters include: cutting size information, electronic component layout position information, drilling information, conductive glue processing information, exposure information, copper and tin pasting information, etching process information, tin stripping processing information, solder mask processing information, marking number information, surface treatment information and cutting and bending information.
[0008] It should be further explained that the circuit board manufacturing process set stores existing circuit board manufacturing processes with all process execution parameters.
[0009] It should be further explained that, in the method, the IC board manufacturing process execution terminal obtains the process execution parameters of the current IC board manufacturing process from the memory, or the IC board manufacturing process execution terminal receives the process execution parameters input by the user.
[0010] It should be further explained that the second matching processing identification in the method is based on the matching of process execution parameters in the customized IC board production process, and the process execution parameters are obtained and identified.
[0011] It should be further explained that, in the method, the process execution parameters are converted according to the data type matching the customized IC board production process through the circuit board manufacturing process set to obtain the process execution parameters under the data type.
[0012] The present application also provides a circuit board manufacturing process information matching system, the system comprising: A parameter acquisition module is used to acquire the process execution parameters of the current IC board manufacturing process and input the process execution parameters into the circuit board manufacturing process set; An existing parameter matching identification module is used to match the process execution parameters with the existing circuit board manufacturing process preset in the circuit board manufacturing process set to obtain a first process execution parameter and a corresponding first matching processing identification; A customized parameter editing module is used to match the circuit board manufacturing process set with the customized process execution parameters in the current process requirements, and obtain the matched second process execution parameters and the corresponding second matching processing identifier; The process configuration module constructs the current IC board manufacturing process based on the first process execution parameter and the second process execution parameter.
[0013] According to another embodiment of the present application, an electronic device is provided, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the circuit board manufacturing process information matching method when executing the program.
[0014] According to another embodiment of the present application, a storage medium is provided, on which a computer program is stored, characterized in that when the computer program is executed by a processor, the steps of the circuit board manufacturing process information matching method are implemented.
[0015] It can be seen from the above technical solutions that the present invention has the following advantages: In the circuit board manufacturing process information matching method provided in the present application, the process execution parameters of the current IC board manufacturing process are obtained; the process execution parameters are matched and processed using the circuit board manufacturing process set and the preset existing circuit board manufacturing process to obtain a first matching processing identifier corresponding to the process execution parameters; the circuit board manufacturing process set is matched and processed with the process execution parameters in the customized IC board production process that matches the current process requirements to obtain the matched process execution parameters and the corresponding second matching processing identifier. By integrating the process execution parameters and identification information from different sources, an accurate IC board manufacturing process is constructed. This embodiment can also ensure the stability and reliability of the IC board manufacturing process and improve product quality and production efficiency through verification and optimization processes. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solution of the present invention, the accompanying drawings required for use in the description will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.
[0017] Figure 1 A flow chart of the method for matching process information for circuit board production; Figure 2 Schematic diagram of the process information matching system for circuit board production; Figure 3 Schematic diagram of an electronic device. DETAILED DESCRIPTION
[0018] The circuit board manufacturing process information matching method provided by the present application is based on the process of configuring the circuit board manufacturing process before the circuit board is manufactured, so as to solve the problem that in the prior art, the circuit board manufacturing process information can only be manually set or arranged to each process to execute the corresponding process.
[0019] The present application can set up an IC board manufacturing process execution terminal in each process, and the IC board manufacturing process execution terminal will display the configured circuit board manufacturing process information. For the configuration process of the circuit board manufacturing process, a circuit board manufacturing process set can be preset, that is, the process execution parameters used in the past and the existing circuit board manufacturing process are configured into the preset circuit board manufacturing process set. When the operator configures the current circuit board manufacturing process, the process execution parameters required for the process are input into the IC board manufacturing process execution terminal. The IC board manufacturing process execution terminal matches the input process execution parameters with the process execution parameters in the circuit board manufacturing process set and the existing circuit board manufacturing process, and combines them into the IC board manufacturing process required by the current process conditions, thereby completing the configuration of the IC board manufacturing process.
[0020] This application can also ensure that each step of the manufacturing process strictly follows the preset standards and improve the consistency of process execution by real-time monitoring and matching process execution parameters. Deviations in the process execution process can be discovered and corrected in a timely manner, reducing errors and defects in the production process and improving the quality of circuit boards.
[0021] In the following, various embodiments of the circuit board manufacturing process information matching method will be described more fully. The present disclosure may have various embodiments, and adjustments and changes may be made therein. However, it should be understood that there is no intention to limit the various embodiments of the present disclosure to the specific embodiments disclosed herein, but the present disclosure should be understood to cover all adjustments, equivalents and / or alternatives that fall within the spirit and scope of the various embodiments of the present disclosure.
[0022] Hereinafter, the terms "include" or "may include" used in various embodiments of the present disclosure indicate the presence of disclosed functions, operations, or elements, and do not limit the addition of one or more functions, operations, or elements. In addition, as used in various embodiments of the present disclosure, the terms "include", "have", and their cognates are intended only to indicate specific features, numbers, steps, operations, elements, components, or a combination of the foregoing, and should not be understood as first excluding the presence of one or more other features, numbers, steps, operations, elements, components, or a combination of the foregoing or the possibility of adding one or more features, numbers, steps, operations, elements, components, or a combination of the foregoing.
[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0024] See also Figure 1 The figure is a flow chart of a circuit board manufacturing process information matching method in a specific embodiment, the method comprising: S101, obtaining process execution parameters of the current IC board manufacturing process, and inputting the process execution parameters into a circuit board manufacturing process set.
[0025] In this embodiment, the operator can input the process execution parameters of the current IC board manufacturing process through the IC board manufacturing process execution terminal.
[0026] The IC board manufacturing process of this embodiment is the execution process of executing the current IC board manufacturing process.
[0027] The circuit board manufacturing process involved in this embodiment includes cutting, drilling, copper deposition, circuit manufacturing, lamination, exposure, Development, pattern plating, solder mask, silk screen printing, surface treatment and appearance processing.
[0028] The corresponding process execution parameters include: cutting size information, electronic component layout position information, drilling information, conductive glue processing information, exposure information, copper and tin pasting information, etching process information, tin stripping processing information, solder mask processing information, marking number information, surface treatment information and cutting and bending information.
[0029] In this embodiment, the steps before step S101 include: configuring an existing circuit board manufacturing process; The existing circuit board manufacturing process includes: cutting the substrate material into preset sizes; laying out the electronic components according to the circuit diagram and drilling holes on the substrate; depositing a layer of copper on the insulating hole wall after drilling to form a conductive adhesive; sticking a photosensitive film on both sides of the board; using an automatic exposure machine to expose the circuit; using a developer to process the circuit to expose the copper; applying copper and tin to the area where the brass is exposed, and then stripping the film, etching and tin stripping; applying solder resist on the circuit pattern; marking the component numbers on the substrate; performing surface treatment, and cutting and bending the substrate.
[0030] The above-mentioned circuit board manufacturing process is only used as an exemplary description. The specific circuit board manufacturing process can be configured according to actual production conditions, and the specific circuit board manufacturing process parameters are not limited.
[0031] S102, matching processing is performed on the process execution parameters based on the existing circuit board manufacturing processes preset in the circuit board manufacturing process set to obtain a first process execution parameter and a corresponding first matching processing identifier.
[0032] In the circuit board manufacturing process set, the process execution parameters of the current IC board manufacturing process are compared and matched one by one with the preset existing circuit board manufacturing process. The matching process involves comparison of parameter ranges, verification of standard values, etc. For the successfully matched process execution parameters, a corresponding first matching processing identifier is generated. The first matching processing identifier is used to indicate which existing circuit board manufacturing process requirements or standards the parameter meets. The first process execution parameter and the corresponding first matching processing identifier are output to the subsequent processing link or display interface.
[0033] In this way, by matching the preset existing circuit board manufacturing process, it is possible to quickly determine whether the current process execution parameters meet certain known standards or requirements, ensuring the standardization and consistency of the production process and improving product quality and production efficiency.
[0034] Furthermore, through the first matching processing identifier, the corresponding relationship between the process execution parameters and the existing circuit board manufacturing process can be conveniently traced and queried.
[0035] S103, matching the circuit board manufacturing process set with the customized process execution parameters in the current process requirements, and obtaining the matched second process execution parameters and the corresponding second matching processing identifiers.
[0036] In this embodiment, the customized process execution parameters in the current process requirements are parsed. The parameters may involve specific requirements of the process, or process requirements in special application scenarios, etc.
[0037] In the circuit board manufacturing process set, matching processing is performed according to the parsed custom process execution parameters. The correlation and mutual influence between multiple parameters, as well as the logical relationship between process steps, are considered. For the successfully matched custom process execution parameters, a corresponding second matching processing identifier is generated, and it is output together with the second process execution parameter to the subsequent processing link or display interface.
[0038] It should be noted that the second process execution parameter and the corresponding second matching processing identifier are process execution parameters obtained by cross-matching different existing circuit board manufacturing processes. By flexibly matching and customizing the process execution parameters, specific customer needs or process requirements in special application scenarios can be met.
[0039] S104 , constructing a current IC board manufacturing process in response to the first process execution parameter and the second process execution parameter.
[0040] In this embodiment, the first process execution parameter, the first matching process identifier, the second process execution parameter, and the second matching process identifier are integrated. Based on the integrated parameter and identifier information, the current IC board manufacturing process is constructed. It may also involve the determination of the process flow, the adjustment of the process parameters, the optimization of the process steps, etc.
[0041] In this embodiment, the constructed IC board manufacturing process can also be verified and optimized. The feasibility and stability of the process can be verified by simulated production, small batch trial production, etc., and necessary adjustments and optimizations can be made according to the verification results.
[0042] It should be noted that this embodiment only describes the use of the first process execution parameter and the second process execution parameter, and may also involve the third process execution parameter and the fourth process execution parameter, etc. as needed. The specific number of process execution parameters and parameter contents may be set according to actual process requirements.
[0043] This embodiment integrates process execution parameters and identification information from different sources to construct an accurate IC board manufacturing process. This embodiment can also ensure the stability and reliability of the IC board manufacturing process through verification and optimization processes, thereby improving product quality and production efficiency.
[0044] Further, as a refinement and expansion of the specific implementation of the above-mentioned embodiment, in order to fully illustrate the specific implementation process in this embodiment, a specific circuit board manufacturing process information matching method is provided below. In the circuit board manufacturing process information matching method, the IC board manufacturing process execution terminal can obtain the process execution parameters of the current IC board manufacturing process, and input the process execution parameters into the circuit board manufacturing process set. The process execution parameters are input into the manufacturing process processing module through the circuit board manufacturing process set, and the manufacturing process processing module uses the preset existing circuit board manufacturing process to match the process execution parameters and obtain a first matching processing identifier corresponding to the process execution parameters.
[0045] The IC board manufacturing process execution terminal can input the process execution parameters into the customized IC board production process matching processing module through the circuit board manufacturing process set. The customized IC board production process matching processing module uses the customized IC board production process that matches the current process requirements to match the process execution parameters to obtain a second matching processing identifier corresponding to the process execution parameters.
[0046] The IC board manufacturing process execution terminal can input the process execution parameters and the first matching processing identifier and the second matching processing identifier corresponding to the process execution parameters into the manufacturing process preset module through the circuit board manufacturing process set. The manufacturing process preset module processes the process execution parameters to obtain the corresponding process execution parameters. The process execution parameters are input into the current IC board manufacturing process through the circuit board manufacturing process set.
[0047] In this embodiment, before the process execution parameters are input into the current IC board manufacturing process, the circuit board manufacturing process set is referenced, and the process execution parameters of the existing circuit board manufacturing process and the customized IC board production process are matched twice, and it is determined whether the process execution parameters can be directly matched based on the first matching processing identifier and the second matching processing identifier. If so, the process execution parameters corresponding to the process execution parameters are edited into the current IC board manufacturing process, which can avoid operations that may contain abnormal data in the data editing path of the current IC board manufacturing process, thereby ensuring the data accuracy of the current IC board manufacturing process.
[0048] Since the circuit board manufacturing process set provided in this embodiment can be decoupled and connected to the current IC board manufacturing process, it has strong flexibility and scalability.
[0049] In the execution process of the method, the process execution parameters of the current IC board manufacturing process can be obtained, and the process execution parameters can be input into the circuit board manufacturing process set.
[0050] In this embodiment, the IC board manufacturing process execution terminal can obtain the process execution parameters of the current IC board manufacturing process from the memory. Alternatively, the IC board manufacturing process execution terminal receives the process execution parameters input by the user. Alternatively, the IC board manufacturing process execution terminal can also access the circuit board manufacturing process set before the process parameter editing editing node of the current IC board manufacturing process to obtain the process execution parameters of the current IC board manufacturing process to be edited.
[0051] In this embodiment, the process execution parameters may be matched with a preset existing circuit board manufacturing process through a circuit board manufacturing process set to obtain the process execution parameters and the corresponding first matching processing identifier.
[0052] The first matching processing mark can mark the matching process execution parameters to facilitate query and use by operators.
[0053] In this embodiment, the circuit board manufacturing process set stores existing circuit board manufacturing processes for all process execution parameters. The IC board manufacturing process execution terminal can execute the processing instruction program corresponding to the preset existing circuit board manufacturing process through the circuit board manufacturing process set to match the process execution parameters with the preset existing circuit board manufacturing process.
[0054] In some implementations, when the process execution parameter does not trigger a matching condition in an existing circuit board manufacturing process, a first matching processing identifier corresponding to the process execution parameter may be generated.
[0055] The circuit board manufacturing process set is matched with the process execution parameters in the customized IC board production process that matches the current process requirements to obtain the matched process execution parameters and the corresponding second matching process identifier.
[0056] The second matching processing identification is based on the matching of process execution parameters in the customized IC board production process, and the process execution parameters are obtained and identified.
[0057] The customized IC board production process of this embodiment is an IC board production process customized according to actual production needs. Exemplarily, the circuit board manufacturing process set may also store a customized IC board production process that matches the current process requirements.
[0058] In this embodiment, the IC board manufacturing process execution terminal has a manufacturing process preset module, which can be used to perform matching processing on process execution parameters.
[0059] In this embodiment, the IC board manufacturing process execution terminal edits the process execution parameters into the current IC board manufacturing process process.
[0060] In the circuit board manufacturing process information matching method, the process execution parameters of the current IC board manufacturing process are obtained, the process execution parameters are input into the circuit board manufacturing process set, the process execution parameters are matched and processed by using the preset existing circuit board manufacturing process through the circuit board manufacturing process set to obtain a first matching processing identifier corresponding to the process execution parameter, the process execution parameters are matched and processed by using a customized IC board production process that matches the current process requirements to obtain a second matching processing identifier corresponding to the process execution parameter, in response to the first matching processing identifier and the second matching processing identifier satisfying the preset manufacturing process, the process execution parameters are matched and processed to obtain the corresponding process execution parameters, and by editing the process execution parameters into the current IC board manufacturing process, an IC board manufacturing process that meets the current process requirements can be executed.
[0061] In this embodiment, the current IC board manufacturing process can be executed by the PLC program and the PLC execution module, which can improve the efficiency of process editing and setting and improve the data accuracy of the current IC board manufacturing process.
[0062] In the embodiments of the present application, this can also be achieved in the following ways: The process execution parameters are converted according to the data type matched by the customized IC board production process through the circuit board manufacturing process set to obtain the process execution parameters under the data type; the process execution parameters are matched and processed using the customized IC board production process to obtain a second matching processing identifier corresponding to the process execution parameter.
[0063] Among them, the data type is for the data generated in each step, such as cutting process data, drilling process data, copper plating process data, circuit production process data, lamination process data, exposure process data, development process data, graphic electroplating process data, solder mask process data, silk screen printing process data, surface treatment process data, and shape processing process data.
[0064] Exemplarily, the customized IC board production process may include a data type that matches the current process requirements and process parameters related to the data type. The IC board manufacturing process execution terminal can convert the process execution parameters according to the data type corresponding to the customized IC board production process that matches the current process requirements through the circuit board manufacturing process set to obtain the process execution parameters under the data type. The matching method related to the data under the data type in the customized IC board production process is adopted through the circuit board manufacturing process set to match the process execution parameters to obtain a second matching processing identifier corresponding to the process execution parameters.
[0065] In this embodiment, the process execution parameters are converted according to the data type matched by the customized IC board production process, and the customized IC board production process is used to match the process execution parameters under the data type after the conversion of the process execution parameters, to obtain a second matching processing identifier corresponding to the process execution parameter, which can improve the flexibility of the matching processing of the process execution parameters and improve the accuracy of the matching processing.
[0066] In an embodiment of the present application, when the first matching processing identifier and the second matching processing identifier both belong to the existing circuit board manufacturing process, it is determined that the first matching processing identifier and the second matching processing identifier satisfy the preset manufacturing process; in response to the first matching processing identifier and the second matching processing identifier satisfying the preset manufacturing process, matching processing is performed using process execution parameters corresponding to the first matching processing identifier and the second matching processing identifier to obtain the current IC board manufacturing process.
[0067] It should be noted that the circuit board manufacturing process set stores preset manufacturing process parameters corresponding to the first matching process identifier and the second matching process identifier. It can be configured to operate according to the execution data corresponding to the matching process identifier. The IC board manufacturing process execution terminal can determine that the first matching process identifier and the second matching process identifier meet the preset manufacturing process through the circuit board manufacturing process set when both the first matching process identifier and the second matching process identifier belong to the existing circuit board manufacturing process. The process execution parameters are matched and processed in a manner corresponding to the first matching process identifier and the second matching process identifier to obtain the process execution parameters corresponding to the process execution parameters.
[0068] In this embodiment, by matching the process execution parameters according to the process execution parameters corresponding to the first matching processing identifier and the second matching processing identifier to obtain the corresponding process execution parameters, the efficiency of the matching processing and the data accuracy of the process execution parameters can be improved.
[0069] It should be understood that the order of execution of the steps in the above embodiment does not necessarily mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present invention.
[0070] The following is an embodiment of a circuit board manufacturing process information matching system provided in an embodiment of the present disclosure. This system and the circuit board manufacturing process information matching method of the above-mentioned embodiments belong to the same inventive concept. For details not described in detail in the embodiment of the circuit board manufacturing process information matching system, please refer to the embodiment of the above-mentioned circuit board manufacturing process information matching method.
[0071] like Figure 2 As shown, the parameter acquisition module is used to obtain the process execution parameters of the current IC board manufacturing process and input the process execution parameters into the circuit board manufacturing process set; An existing parameter matching identification module is used to match the process execution parameters with the existing circuit board manufacturing process preset in the circuit board manufacturing process set to obtain a first process execution parameter and a corresponding first matching processing identification; A customized parameter editing module is used to match the circuit board manufacturing process set with the customized process execution parameters in the current process requirements, and obtain the matched second process execution parameters and the corresponding second matching processing identifier; The process configuration module constructs the current IC board manufacturing process based on the first process execution parameter and the second process execution parameter.
[0072] like Figure 3 As shown, the present application also provides an electronic device, including a display module 103, a memory 102, a processor 101, and a computer program stored in the memory and executable on the processor 101, wherein the processor 101 implements the steps of the circuit board manufacturing process information matching method when executing the program.
[0073] In embodiments of the present invention, electronic devices include, but are not limited to, laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. Electronic devices may also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the embodiments of the present application described and / or required herein.
[0074] In the embodiment of the present application, the processor 101 can be implemented by using at least one of an application-specific integrated circuit (ASIC), a programmable logic device (PLD), a field programmable gate array (FPGA), a processor, a controller, a microcontroller, a microprocessor, and an electronic unit designed to perform the functions described herein. In some cases, such an implementation can be implemented in a controller. For software implementation, implementations such as processes or functions can be implemented with separate software modules that allow execution of at least one function or operation. The software code can be implemented by a software application (or program) written in any appropriate programming language, and the software code can be stored in a memory and executed by a controller.
[0075] The display module 103 is used to display information input by the user or information provided to the user. The display module 103 may include a display panel, which may be configured in the form of a liquid crystal display (LCD), an organic light-emitting diode (OLED), etc.
[0076] The memory 102 may be used to store software programs and various data. The memory 102 may include a high-speed random access memory and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage devices.
[0077] The present application also provides a storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of the circuit board manufacturing process information matching method are implemented.
[0078] The storage medium can adopt any combination of one or more readable media. The readable medium can be a readable signal medium or a readable storage medium. The readable storage medium can be, for example, but not limited to, a system, device or device of electricity, magnetism, light, electromagnetic, infrared, or semiconductor, or any combination of the above. More specific examples (non-exhaustive list) of readable storage media include: an electrical connection with one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.
[0079] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A circuit board manufacturing process information matching method, characterized in that: Methods include: S101, obtaining the process execution parameters of the current IC board manufacturing process, and inputting the process execution parameters into the circuit board manufacturing process set; S102, matching the process execution parameters based on the existing circuit board manufacturing processes preset in the circuit board manufacturing process set to obtain a first process execution parameter and a corresponding first matching processing identifier; S103, matching the circuit board manufacturing process set with the customized process execution parameters in the current process requirements, and obtaining the matched second process execution parameters and the corresponding second matching processing identifier; S104 , constructing a current IC board manufacturing process in response to the first process execution parameter and the second process execution parameter.
2. The circuit board manufacturing process information matching method according to claim 1, characterized in that: Before step S101, the steps include: configuring an existing circuit board manufacturing process; The existing circuit board manufacturing process includes: cutting the substrate material into a preset size; Lay out electronic components according to circuit diagram and drill holes in substrate; A layer of copper is deposited on the insulating hole wall after drilling to form a conductive glue; Affix photosensitive films to both sides of the plate; Use an automatic exposure machine to expose the circuit; Use developer to process the circuit to expose the copper; In the area where the brass is exposed, copper and tin are applied, and then the film is stripped, etched and tinned; Apply solder resist on the circuit pattern; Mark the component numbers on the substrate; Perform surface treatment, cut and bend substrates.
3. The circuit board manufacturing process information matching method according to claim 2, characterized in that: The process execution parameters include: cutting size information, electronic component layout position information, drilling information, conductive glue processing information, exposure information, copper and tin pasting information, etching process information, tin stripping information, solder mask processing information, marking number information, surface treatment information and cutting and bending information.
4. The circuit board manufacturing process information matching method according to claim 1 or 2, characterized in that: The circuit board manufacturing process set stores existing circuit board manufacturing processes with all process execution parameters.
5. The circuit board manufacturing process information matching method according to claim 1 or 2, characterized in that: In the method, the IC board manufacturing process execution terminal obtains the process execution parameters of the current IC board manufacturing process from the memory, or the IC board manufacturing process execution terminal receives the process execution parameters input by the user.
6. The circuit board manufacturing process information matching method according to claim 1 or 2, characterized in that: The second matching processing identification in the method is based on the matching of process execution parameters in the customized IC board production process, and the process execution parameters are obtained and identified.
7. The circuit board manufacturing process information matching method according to claim 1 or 2, characterized in that: In the method, the process execution parameters are converted according to the data type matched by the customized IC board production process through the circuit board manufacturing process set to obtain the process execution parameters under the data type.
8. A circuit board manufacturing process information matching system, characterized in that: The system is used to implement the circuit board manufacturing process information matching method according to any one of claims 1 to 7; the system comprises: A parameter acquisition module is used to acquire the process execution parameters of the current IC board manufacturing process and input the process execution parameters into the circuit board manufacturing process set; An existing parameter matching identification module is used to match the process execution parameters with the existing circuit board manufacturing process preset in the circuit board manufacturing process set to obtain a first process execution parameter and a corresponding first matching processing identification; A customized parameter editing module is used to match the circuit board manufacturing process set with the customized process execution parameters in the current process requirements, and obtain the matched second process execution parameters and the corresponding second matching processing identifier; The process configuration module constructs the current IC board manufacturing process based on the first process execution parameter and the second process execution parameter.
9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the program, the steps of the circuit board manufacturing process information matching method as described in any one of claims 1 to 7 are implemented.
10. A storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the circuit board manufacturing process information matching method as claimed in any one of claims 1 to 7 are implemented.
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