Packaging equipment for semiconductor electronic component

Abstract

The invention discloses packaging equipment for semiconductor electronic components, and relates to the technical field of electronic component packaging, the packaging equipment comprises a workbench, the top of the workbench is provided with an adjusting device, the top of the workbench is provided with a lifting device, and four corners of the bottom of the workbench are fixedly connected with supporting legs; and the adjusting device comprises a first concave plate, a driving motor, a first rotating rod, a mounting disc, a connecting plate, a placing frame, a first telescopic rod, a clamping plate and a spring, and the first concave plate is fixedly connected to the bottom of the workbench. The driving motor is started to drive the first rotating rod to rotate, the first rotating rod rotates to drive the mounting disc to rotate, the mounting disc rotates to drive the connecting plate to rotate, and the connecting plate rotates to drive the placing frame to rotate, so that the electronic elements placed in the placing frame are sequentially subjected to glue filling and packaging; and meanwhile, the scraper slides to scrape redundant sealant on the electronic element, so that overflow of the sealant on the electronic element is reduced, and the electronic element is sealed more beautifully.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component packaging, and in particular to packaging equipment for semiconductor electronic components. Background Art

[0002] Electronic components are basic elements in electronic circuits, usually in individual packages with two or more leads or metal contacts. Electronic components must be connected to each other to form an electronic circuit with specific functions. One of the common ways to connect electronic components is to solder them to a printed circuit board. Electronic components may be individual packages or groups of varying complexity.

[0003] Patent No. CN117174605A discloses an electronic component packaging device, including a machine table, the upper surface of which is connected to a frame, the top of which is connected to a loading mechanism, the frame is slidably connected to a lifting plate, and the shell of the lifting plate is connected to a packaging mechanism; the packaging mechanism includes a water tank inserted through the top of the lifting plate, a glue injection head inserted through the bottom of the water tank, and a sealing assembly arranged on the outside of the glue injection head and connected to the bottom of the water tank.

[0004] In order to solve the problem that traditional electronic component packaging equipment often causes the glue injection head to stick to the glue due to the viscosity of the glue, thus affecting the glue injection effect, the existing technology uses the heat emitted by the guide rod to heat the glue coated on the surface of the electronic component, thereby reducing the viscosity of the glue. However, too much glue may be injected during packaging, resulting in glue overflow, which in turn affects the aesthetics of the electronic component after sealing. Summary of the invention

[0005] The object of the present invention is to provide a semiconductor electronic component packaging device to solve the problems raised in the above background technology.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is: A semiconductor electronic component packaging device comprises a workbench, wherein an adjusting device is arranged on the top of the workbench, a lifting device is arranged on the top of the workbench, and supporting legs are fixedly connected to the four corners of the bottom of the workbench.

[0007] The adjusting device includes a first concave plate, a driving motor, a first rotating rod, a mounting plate, a connecting plate, a placing frame, a first telescopic rod, a clamping plate and a spring. The first concave plate is fixedly connected to the bottom of the workbench, the driving motor is fixedly installed on the top of the first concave plate, the first rotating rod is fixedly installed at the output end of the driving motor, and the first rotating rod movably passes through the workbench and extends upward, and the mounting plate is fixedly connected to the extending end of the first rotating rod.

[0008] A further improvement of the technical solution of the present invention is that: the connecting plate is fixedly connected to the outer wall of the mounting plate, and there are four connecting plates, the placement frame is fixedly connected to the top of the connecting plate, the first telescopic rod is fixedly installed on the inner wall side of the placement frame, the clamping plate is fixedly connected to the other end of the first telescopic rod, and the spring is sleeved on the outer wall of the first telescopic rod.

[0009] A further improvement of the technical solution of the present invention is that the adjusting device also includes a first transmission wheel, a transmission belt, a second transmission wheel, a second rotating rod, a first bevel gear, a second bevel gear, a second concave plate, a bidirectional threaded rod, a slider, a slide groove, a slot, a first fixed block, an insertion rod and a scraper. The first transmission wheel is fixedly sleeved on the outer wall of the first rotating rod, the second rotating rod is rotatably connected to the bottom of the workbench through a bearing, the second transmission wheel is fixedly sleeved on the outer wall of the second rotating rod, and the transmission belt is transmission-connected to the outer walls of the first transmission wheel and the second transmission wheel.

[0010] A further improvement of the technical solution of the present invention is that: the first bevel gear is fixedly sleeved on the outer wall of the second rotating rod, the second concave plate is fixedly connected to the bottom of the workbench, the bidirectional threaded rod is rotatably connected to the inner side of the second concave plate through a bearing, the second bevel gear is fixedly sleeved on the outer wall of the bidirectional threaded rod, and the first bevel gear is meshed with the second bevel gear.

[0011] A further improvement of the technical solution of the present invention is that: the slider is threadedly connected to the outer wall of the bidirectional threaded rod, the slide groove is fixedly opened on the surface of the workbench, and the slider is slidably connected to the inside of the slide groove, the slot is fixedly opened at the top of the slider, the first fixed block is arranged on the top of the slider, the plug rod is fixedly connected to the bottom of the first fixed block, and the plug rod is inserted into the inside of the slot, and the scraper is fixedly connected to the top of the first fixed block.

[0012] A further improvement of the technical solution of the present invention is that the lifting device includes a second telescopic rod, a top plate, a fixed rod, a movable block, a handle, a mounting groove, a first limiting groove, a second limiting groove, a connecting tube, a protrusion, a second fixed block and a glue filling machine, the second telescopic rod is fixedly installed on the top of the workbench, the top plate is fixedly connected to the other end of the second telescopic rod, the fixed rod is fixedly connected to the inside of the top plate, the movable block is movably connected to the outer wall of the fixed rod, and the handle is fixedly connected to the top of the movable block.

[0013] A further improvement of the technical solution of the present invention is that: the mounting groove is fixedly opened inside the movable block, the first limiting groove is fixedly opened on the inner wall side of the mounting groove, the second limiting groove is fixedly opened inside the mounting groove, the connecting tube is movably connected inside the mounting groove, the protrusion is fixedly connected to the outer wall of the connecting tube, and the protrusion is movably connected inside the first limiting groove and the second limiting groove, the second fixed block is fixedly connected to the bottom of the connecting tube, and the glue filling machine is fixedly installed at the bottom of the second fixed block.

[0014] Due to the adoption of the above technical solution, the present invention has the following technical advances compared with the prior art: 1. The present invention provides a packaging device for semiconductor electronic components. The driving motor is started to drive the first rotating rod to rotate, the first rotating rod drives the mounting plate to rotate, the mounting plate drives the connecting plate to rotate, the connecting plate drives the placement frame to rotate, so that the electronic components placed in the placement frame are sequentially filled with glue and packaged. The first telescopic rod is fixedly installed on the inner side of the placement frame, the other end of the first telescopic rod is fixedly connected to a clamping plate, the outer wall of the first telescopic rod is provided with a spring, and the two clamping plates are driven by the spring to clamp the electronic components.

[0015] 2. The present invention provides a packaging device for semiconductor electronic components, wherein the first rotating rod rotates to drive the first transmission wheel to rotate, the first transmission wheel rotates to drive the transmission belt, the transmission belt drives the second transmission wheel to rotate, the second transmission wheel rotates to drive the second rotating rod to rotate, the second rotating rod rotates to drive the first bevel gear to rotate, the first bevel gear rotates to drive the second bevel gear to rotate, the second bevel gear rotates to drive the bidirectional threaded rod to rotate, the bidirectional threaded rod rotates to drive the slider to slide in the slide groove, the insertion rod is inserted into the slot, so that the first fixed block and the slider are spliced, the sliding of the slider drives the sliding of the first fixed block, the sliding of the first fixed block drives the sliding of the scraper, the sliding of the scraper scrapes off the excess sealant on the electronic components, reduces the overflow of glue on the electronic components, and makes the sealing of the electronic components more beautiful.

[0016] 3. The present invention provides a packaging device for semiconductor electronic components. The top plate is lifted and lowered by telescoping the second telescopic rod, thereby adjusting the height of the glue potting machine. The movable block is driven to rotate on the outer wall of the fixed rod by pulling the handle, thereby adjusting the angle of the glue potting machine, so that the glue potting of the electronic components is more uniform. A mounting groove is fixedly provided at the bottom of the movable block, and a connecting tube is fixedly connected to the top of the second fixed block. A protrusion is fixedly connected to the outer wall of the connecting tube. After the protrusion is aligned with the first limiting groove, the connecting tube is inserted into the mounting groove, and then the connecting tube is rotated to drive the protrusion to move in the second limiting groove, thereby completing the assembly of the movable block and the second fixed block. The device is convenient for disassembling the glue potting machine and replenishing the glue in the glue potting machine in time. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the three-dimensional front structure of the present invention; Figure 3 It is a schematic diagram of the three-dimensional back structure of the present invention; Figure 4 It is a schematic diagram of the structure of the regulating device of the present invention; Figure 5 It is a schematic diagram of the structure of the lifting device of the present invention; Figure 6 It is a schematic diagram of the enlarged structure of point A of the present invention.

[0018] In the figure: 1, workbench; 2, adjustment device; 201, first concave plate; 202, drive motor; 203, first rotating rod; 204, mounting plate; 205, connecting plate; 206, placement frame; 207, first telescopic rod; 208, clamping plate; 209, spring; 210, first transmission wheel; 211, transmission belt; 212, second transmission wheel; 213, second rotating rod; 214, first bevel gear; 215, second bevel gear; 216, second concave plate; 217 , two-way threaded rod; 218, slider; 219, slide groove; 220, slot; 221, first fixed block; 222, plug rod; 223, scraper; 3, lifting device; 301, second telescopic rod; 302, top plate; 303, fixed rod; 304, movable block; 305, handle; 306, installation groove; 307, first limiting groove; 308, second limiting groove; 309, connecting tube; 310, protrusion; 311, second fixed block; 312, glue filling machine; 4, support leg. DETAILED DESCRIPTION

[0019] The present invention is further described in detail below in conjunction with embodiments: Example 1 like Figure 1-6As shown, the present invention provides a semiconductor electronic component packaging equipment, including a workbench 1, an adjusting device 2 is arranged on the top of the workbench 1, a lifting device 3 is arranged on the top of the workbench 1, and support legs 4 are fixedly connected to the four corners of the bottom of the workbench 1, the adjusting device 2 includes a first concave plate 201, a driving motor 202, a first rotating rod 203, a mounting plate 204, a connecting plate 205, a placement frame 206, a first telescopic rod 207, a clamping plate 208 and a spring 209, the first concave plate 201 is fixedly connected to the bottom of the workbench 1, the driving motor 202 is fixedly installed on the top of the first concave plate 201, the first rotating rod 203 is fixedly installed on the output end of the driving motor 202, and the first rotating rod 203 movably passes through the workbench 1 and extends upward, the mounting plate 204 is fixedly connected to the extension end of the first rotating rod 203, the connecting plate 205 is fixedly connected to the outer wall of the mounting plate 204, and the connecting plate 205 There are four of them. The placement frame 206 is fixedly connected to the top of the connecting plate 205. The first telescopic rod 207 is fixedly installed on the inner wall side of the placement frame 206. The clamping plate 208 is fixedly connected to the other end of the first telescopic rod 207. The spring 209 is sleeved on the outer wall of the first telescopic rod 207. By starting the driving motor 202, the first rotating rod 203 is driven to rotate. The rotation of the first rotating rod 203 drives the mounting disk 204 to rotate. The rotation of the mounting disk 204 drives the connecting plate 205 to rotate. The rotation of the connecting plate 205 drives the placement frame 206 to rotate, so that the electronic components placed in the placement frame 206 are glued and packaged in turn. The first telescopic rod 207 is fixedly installed on the inner side of the placement frame 206. The other end of the first telescopic rod 207 is fixedly connected with the clamping plate 208. The outer wall of the first telescopic rod 207 is sleeved with a spring 209. Under the action of the spring 209, the two clamping plates 208 are driven to clamp the electronic components.

[0020] Example 2 like Figure 1-6As shown, on the basis of Example 1, the present invention provides a technical solution: Preferably, the adjusting device 2 also includes a first transmission wheel 210, a transmission belt 211, a second transmission wheel 212, a second rotating rod 213, a first bevel gear 214, a second bevel gear 215, a second concave plate 216, a bidirectional threaded rod 217, a slider 218, a slide groove 219, a slot 220, a first fixed block 221, an insertion rod 222 and a scraper 223, the first transmission wheel 210 is fixedly sleeved on the outer wall of the first rotating rod 203, the second rotating rod 213 is rotatably connected to the bottom of the workbench 1 through a bearing, the second transmission wheel 212 is fixedly sleeved on the outer wall of the second rotating rod 213, the transmission belt 211, the second transmission wheel 212, the second rotating rod 213, the first bevel gear 214, the second bevel gear 215, the second concave plate 216, the bidirectional threaded rod 217, the slider 218, the slide groove 219, the slot 220, the first fixed block 221, the insertion rod 222 and the scraper 223, the first transmission wheel 210 is fixedly sleeved on the outer wall of the first rotating rod 203, the second rotating rod 213 is rotatably connected to the bottom of the workbench 1 through a bearing, the second transmission wheel 212 is fixedly sleeved on the outer wall of the second rotating rod 213, the transmission belt The belt 211 is transmission-connected to the outer wall of the first transmission wheel 210 and the second transmission wheel 212, the first bevel gear 214 is fixedly sleeved on the outer wall of the second rotating rod 213, the second concave plate 216 is fixedly connected to the bottom of the workbench 1, the bidirectional threaded rod 217 is rotationally connected to the inner side of the second concave plate 216 through a bearing, the second bevel gear 215 is fixedly sleeved on the outer wall of the bidirectional threaded rod 217, and the first bevel gear 214 is meshed with the second bevel gear 215, the slider 218 is threadedly connected to the outer wall of the bidirectional threaded rod 217, the slide groove 219 is fixedly opened on the surface of the workbench 1, and the slider 218 is slidably connected to the inside of the slide groove 219, and the slot 220 is fixedly opened on the slide The top of the block 218, the first fixed block 221 is set on the top of the slider 218, the plug rod 222 is fixedly connected to the bottom of the first fixed block 221, and the plug rod 222 is inserted into the inside of the slot 220, and the scraper 223 is fixedly connected to the top of the first fixed block 221, and the first rotating rod 203 rotates to drive the first transmission wheel 210 to rotate, the first transmission wheel 210 rotates to drive the transmission belt 211, the transmission belt 211 drives the second transmission wheel 212 to rotate, the second transmission wheel 212 rotates to drive the second rotating rod 213 to rotate, the second rotating rod 213 rotates to drive the first bevel gear 214 to rotate, and the first bevel gear 214 rotates to drive the second bevel gear 215 The second bevel gear 215 rotates to drive the bidirectional threaded rod 217 to rotate, and the bidirectional threaded rod 217 rotates to drive the slider 218 to slide in the slide groove 219. The top of the slider 218 is fixedly provided with a slot 220, and the bottom of the first fixed block 221 is fixedly connected with an insertion rod 222, which is inserted into the slot 220 to splice the first fixed block 221 and the slider 218. The sliding of the slider 218 drives the sliding of the first fixed block 221, and the sliding of the first fixed block 221 drives the sliding of the scraper 223. The scraper 223 slides to scrape off the excess sealant on the electronic components, thereby reducing the overflow of glue on the electronic components and making the sealing of the electronic components more beautiful.

[0021] Example 3 like Figure 1-6As shown, on the basis of Example 1, the present invention provides a technical solution: Preferably, the lifting device 3 includes a second telescopic rod 301, a top plate 302, a fixed rod 303, a movable block 304, a handle 305, a mounting groove 306, a first limiting groove 307, a second limiting groove 308, a connecting tube 309, a protrusion 310, a second fixed block 311 and a glue filling machine 312, the second telescopic rod 301 is fixedly installed on the top of the workbench 1, the top plate 302 is fixedly connected to the other end of the second telescopic rod 301, and the fixed rod 303 is fixedly connected to the other end of the second telescopic rod 301. The movable block 304 is fixedly connected to the inside of the top plate 302, and the movable block 304 is movably connected to the outer wall of the fixed rod 303. The handle 305 is fixedly connected to the top of the movable block 304. The mounting groove 306 is fixedly opened in the movable block 304. The first limiting groove 307 is fixedly opened on the inner wall side of the mounting groove 306. The second limiting groove 308 is fixedly opened in the mounting groove 306. The connecting tube 309 is movably connected to the inside of the mounting groove 306. The protrusion 310 is fixedly connected to the outer wall of the connecting tube 309, and the protrusion 310 is movably connected to the first limiting groove 307. The second fixing block 311 is fixedly connected to the bottom of the connecting tube 309 inside the first limiting groove 307 and the second limiting groove 308, and the glue filling machine 312 is fixedly installed at the bottom of the second fixing block 311. The top plate 302 is lifted and lowered by the extension of the second telescopic rod 301, so as to adjust the height of the glue filling machine 312. The movable block 304 is driven to rotate on the outer wall of the fixed rod 303 by pulling the handle 305, so as to adjust the angle of the glue filling machine 312, so that the glue filling of the electronic components is more uniform. The bottom of the movable block 304 is fixedly provided with a mounting hole. The mounting groove 306, the top of the second fixed block 311 is fixedly connected with a connecting tube 309, and the outer wall of the connecting tube 309 is fixedly connected with a protrusion 310. After aligning the protrusion 310 with the first limiting groove 307, the connecting tube 309 is inserted into the mounting groove 306, and then the connecting tube 309 is rotated to drive the protrusion 310 to move in the second limiting groove 308, thereby completing the assembly of the movable block 304 and the second fixed block 311. The device is convenient for disassembling the glue filling machine 312 and replenishing the glue in the glue filling machine 312 in time.

[0022] The following is a detailed description of the working principle of the semiconductor electronic component packaging equipment.

[0023] like Figure 1-6As shown, by starting the driving motor 202 to drive the first rotating rod 203 to rotate, the first rotating rod 203 rotates to drive the mounting plate 204 to rotate, the mounting plate 204 rotates to drive the connecting plate 205 to rotate, and the connecting plate 205 rotates to drive the placement frame 206 to rotate, so that the electronic components placed in the placement frame 206 are sequentially filled with glue and packaged, and the first telescopic rod 207 is fixedly installed on the inner side of the placement frame 206, and the other end of the first telescopic rod 207 is fixedly connected to a clamping plate 208, and the outer wall of the first telescopic rod 207 is provided with a spring 209, and under the action of the spring 209, the two clamping plates 208 are driven to clamp the electronic components. At the same time, the first rotating rod 207 The rotation of 203 drives the first transmission wheel 210 to rotate, the rotation of the first transmission wheel 210 drives the transmission belt 211 to drive, the transmission belt 211 drives the second transmission wheel 212 to rotate, the rotation of the second transmission wheel 212 drives the second rotating rod 213 to rotate, the rotation of the second rotating rod 213 drives the first bevel gear 214 to rotate, the rotation of the first bevel gear 214 drives the second bevel gear 215 to rotate, the rotation of the second bevel gear 215 drives the bidirectional threaded rod 217 to rotate, the rotation of the bidirectional threaded rod 217 drives the slider 218 to slide in the slide groove 219, the top of the slider 218 is fixed with a slot 220, and the bottom of the first fixed block 221 is fixed The first fixed block 221 is connected with an insertion rod 222, which is inserted into the slot 220 to splice the first fixed block 221 with the slider 218. The sliding of the slider 218 drives the first fixed block 221 to slide. The sliding of the first fixed block 221 drives the scraper 223 to slide. The scraper 223 slides to scrape off the excess sealant on the electronic components, thereby reducing the overflow of glue on the electronic components and making the seal of the electronic components more beautiful. The top plate 302 is lifted and lowered by the extension of the second telescopic rod 301, thereby adjusting the height of the glue filling machine 312. The movable block 304 is driven to rotate on the outer wall of the fixed rod 303 by pulling the handle 305, thereby adjusting the glue filling. The angle of the glue filling machine 312 makes the glue filling of electronic components more uniform. The bottom of the movable block 304 is fixedly provided with a mounting groove 306, the top of the second fixed block 311 is fixedly connected with a connecting cylinder 309, and the outer wall of the connecting cylinder 309 is fixedly connected with a protrusion 310. After aligning the protrusion 310 with the first limiting groove 307, the connecting cylinder 309 is inserted into the mounting groove 306, and then the connecting cylinder 309 is rotated to drive the protrusion 310 to move in the second limiting groove 308, thereby completing the assembly of the movable block 304 and the second fixed block 311. The device is convenient for disassembling the glue filling machine 312 and replenishing the glue in the glue filling machine 312 in time.

[0024] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not depart from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A semiconductor electronic component packaging device, comprising a workbench (1), characterized in that: An adjusting device (2) is provided on the top of the workbench (1), a lifting device (3) is provided on the top of the workbench (1), and supporting legs (4) are fixedly connected to the four corners of the bottom of the workbench (1); The adjusting device (2) comprises a first concave plate (201), a driving motor (202), a first rotating rod (203), a mounting plate (204), a connecting plate (205), a placing frame (206), a first telescopic rod (207), a clamping plate (208) and a spring (209); the first concave plate (201) is fixedly connected to the bottom of the workbench (1); the driving motor (202) is fixedly mounted on the top of the first concave plate (201); the first rotating rod (203) is fixedly mounted on the output end of the driving motor (202); the first rotating rod (203) movably passes through the workbench (1) and extends upward; and the mounting plate (204) is fixedly connected to the extended end of the first rotating rod (203).

2. A semiconductor electronic component packaging device according to claim 1, characterized in that: The connecting plate (205) is fixedly connected to the outer wall of the mounting plate (204), and the number of the connecting plates (205) is four. The placement frame (206) is fixedly connected to the top of the connecting plate (205). The first telescopic rod (207) is fixedly installed on the inner wall side of the placement frame (206). The clamping plate (208) is fixedly connected to the other end of the first telescopic rod (207). The spring (209) is sleeved on the outer wall of the first telescopic rod (207).

3. The semiconductor electronic component packaging device according to claim 1, characterized in that: The adjusting device (2) further comprises a first transmission wheel (210), a transmission belt (211), a second transmission wheel (212), a second rotating rod (213), a first bevel gear (214), a second bevel gear (215), a second concave plate (216), a bidirectional threaded rod (217), a slider (218), a slide groove (219), a slot (220), a first fixed block (221), an insert rod (222) and a scraper (223); the first transmission wheel (210) is fixedly sleeved on the outer wall of the first rotating rod (203); the second rotating rod (213) is rotatably connected to the bottom of the workbench (1) via a bearing; the second transmission wheel (212) is fixedly sleeved on the outer wall of the second rotating rod (213); and the transmission belt (211) is transmission-connected to the outer walls of the first transmission wheel (210) and the second transmission wheel (212).

4. A semiconductor electronic component packaging device according to claim 3, characterized in that: The first bevel gear (214) is fixedly sleeved on the outer wall of the second rotating rod (213); the second concave plate (216) is fixedly connected to the bottom of the workbench (1); the bidirectional threaded rod (217) is rotatably connected to the inner side of the second concave plate (216) via a bearing; the second bevel gear (215) is fixedly sleeved on the outer wall of the bidirectional threaded rod (217); and the first bevel gear (214) is meshed with the second bevel gear (215).

5. A semiconductor electronic component packaging device according to claim 4, characterized in that: The slider (218) is threadedly connected to the outer wall of the bidirectional threaded rod (217); the slide groove (219) is fixedly opened on the surface of the workbench (1), and the slider (218) is slidably connected inside the slide groove (219); the slot (220) is fixedly opened on the top of the slider (218); the first fixed block (221) is arranged on the top of the slider (218); the insertion rod (222) is fixedly connected to the bottom of the first fixed block (221), and the insertion rod (222) is inserted into the slot (220); and the scraper (223) is fixedly connected to the top of the first fixed block (221).

6. The semiconductor electronic component packaging device according to claim 1, characterized in that: The lifting device (3) comprises a second telescopic rod (301), a top plate (302), a fixed rod (303), a movable block (304), a handle (305), a mounting groove (306), a first limiting groove (307), a second limiting groove (308), a connecting tube (309), a protrusion (310), a second fixed block (311) and a glue filling machine (312); the second telescopic rod (301) is fixedly mounted on the top of the workbench (1); the top plate (302) is fixedly connected to the other end of the second telescopic rod (301); the fixed rod (303) is fixedly connected to the inside of the top plate (302); the movable block (304) is movably connected to the outer wall of the fixed rod (303); and the handle (305) is fixedly connected to the top of the movable block (304).

7. A semiconductor electronic component packaging device according to claim 6, characterized in that: The mounting groove (306) is fixedly provided inside the movable block (304); the first limiting groove (307) is fixedly provided on the inner wall side of the mounting groove (306); the second limiting groove (308) is fixedly provided inside the mounting groove (306); the connecting tube (309) is movably connected inside the mounting groove (306); the protrusion (310) is fixedly connected to the outer wall of the connecting tube (309); and the protrusion (310) is movably connected inside the first limiting groove (307) and the second limiting groove (308); the second fixed block (311) is fixedly connected to the bottom of the connecting tube (309); and the glue filling machine (312) is fixedly installed at the bottom of the second fixed block (311).

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