用于脑机接口系统的导线及其制造方法和脑机接口系统
By designing a multi-layered lead body and modular lead connectors, and by roughening the contact ring and insulation layer to enhance the bonding strength, the problems of limited signal acquisition and large implantation trauma of traditional implantable neurostimulators are solved, thus realizing the application of a highly efficient brain-computer interface system.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- LINGANG LAB
- Filing Date
- 2025-02-26
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional implantable neurostimulators have limited capacity for acquiring EEG signals, a small number of stimulation channels, and large implanted electrode sizes, resulting in limited treatment effectiveness and significant trauma, failing to meet the high requirements of brain-computer interface systems.
A wire for a brain-computer interface system is designed, employing a multi-layered wire body and modular wire connectors. The contact ring and insulation layer are roughened to enhance the bonding strength, including multiple roughened areas and contact features of a specific shape, thereby enhancing mechanical stability and signal transmission capability.
It improves the mechanical stability and signal transmission capability of the leads, reduces implantation trauma, and enhances the therapeutic effect and applicability of the brain-computer interface system.
Smart Images
Figure CN119965587B_ABST