Electronic device

Abstract

The application provides an electronic device. The electronic device comprises a housing, a camera module, a first circuit board and an electrical connection structure. The electrical connection structure comprises a metal spring and a screw, a first part of the metal spring is electrically connected to the camera module, a second part of the metal spring is fixedly connected to the first circuit board at least partially through the screw, and the camera module is electrically connected to a grounding end of the electronic device through the metal spring, the screw, the first circuit board and the electronic device. Alternatively, the electrical connection structure comprises a shielding cover, an insulating piece and a first conductive sheet, the shielding cover is electrically connected to the first circuit board, the insulating piece is fixedly connected to the shielding cover, a first part of the first conductive sheet is electrically connected to the camera module, and a second part of the first conductive sheet is fixedly connected to one side of the insulating piece away from the shielding cover at least partially, and the first conductive sheet, the insulating piece and the shielding cover form a capacitor. In this way, the electrical connection reliability in the process of coupling current grounding on the camera module is improved.

Description

Technical Field

[0001] This application relates to the field of terminal equipment technology, and more particularly to an electronic device. Background Technology

[0002] To improve the screen-to-body ratio of electronic devices and the overall aesthetics of mobile phone screens, the front camera module is placed as close to the outer casing as possible. As the distance between the front camera module and the antenna embedded in the casing decreases, the current coupled from the antenna to the front camera module increases. To prevent the coupled current from affecting the operation of the camera module, a conductive cloth is used to transfer the coupled current on the front camera module to the grounding structure, so that the coupled current on the front camera module is directly grounded.

[0003] However, the electrical connection between the conductive cloth and the grounding structure via conductive adhesive is unreliable, causing the coupling current on the camera module to fail to ground smoothly. This coupling current affects the operation of the camera module. Furthermore, at locations where the electrical connection between the conductive cloth and the grounding structure is unreliable, the coupling current is prone to radiating into the air, generating radiated spurious emission (RSE) current, which affects the wireless communication signal. Summary of the Invention

[0004] This application provides an electronic device. The electronic device includes a housing, a camera module, a first circuit board, and an electrical connection structure. The camera module and the first circuit board are disposed within the housing, and the electrical connection structure is electrically connected to the camera module. The first circuit board is electrically connected to the ground terminal of the electronic device.

[0005] The electrical connection structure includes a metal spring and a screw. A first portion of the metal spring is electrically connected to the camera module, and at least a portion of the second portion of the metal spring is fixedly connected to a first circuit board via the screw. The camera module and the ground terminal of the electronic device are electrically connected via the metal spring, the screw, and the first circuit board. Alternatively, the electrical connection structure includes a shield, an insulating component, and a first conductive sheet. The shield is electrically connected to the first circuit board, the insulating component is fixedly connected to the shield, a first portion of the first conductive sheet is electrically connected to the camera module, and at least a portion of the second portion of the first conductive sheet is fixedly connected to the side of the insulating component away from the shield. The first conductive sheet, the insulating component, and the shield form a capacitor.

[0006] Understandably, when the electrical connection structure includes a metal spring and screws, the metal spring is fixed to the first circuit board by the screws. This provides better connection strength between the metal spring and the first circuit board, reducing the risk of the metal spring detaching from the first circuit board due to external impact. The electrical connection between the metal spring and the first circuit board also offers better reliability. The coupling current on the camera module can be effectively grounded, reducing the risk of malfunction due to the coupling current. Furthermore, it avoids the coupling current radiating into the air during transmission due to unstable electrical connection caused by poor connection between the metal spring and the first circuit board, thus preventing radiated stray emission (RSE) current that could affect the quality of wireless communication.

[0007] When the electrical connection structure includes a shield, an insulating component, and a first conductive sheet, the coupling current on the camera module is grounded through capacitive coupling. Compared to the scheme where the first conductive sheet is directly electrically connected to the shield via conductive adhesive, the solution where the coupling current on the camera module is directly grounded uses an insulating material mixed with metal particles, with the metal particles serving as conductors. On one hand, metal particles are easily oxidized upon contact with air; on the other hand, metal particles generate heat during electrical transmission, further accelerating oxidation. Oxidation of the metal particles results in higher resistivity of the conductive adhesive and a decrease in its bonding strength, leading to a decrease in the reliability of the electrical connection between the first conductive sheet and the shield. The insulating component in this application is less prone to aging, resulting in better reliability of the electrical connection between the first conductive sheet and the shield. The coupling current on the camera module can be better grounded, reducing the risk of camera module failure due to coupling current. It also avoids the coupling current radiating into the air during transmission due to unstable electrical connections, generating RSE current and affecting the quality of wireless communication.

[0008] In one possible implementation, the insulating component is insulating adhesive.

[0009] Understandably, the insulating component can serve as both an insulating medium for the capacitor and a connection structure between the first conductive sheet and the shield, eliminating the need for an additional connection structure and facilitating the miniaturization of electronic devices.

[0010] In one possible implementation, the face-to-face area between the insulating element and the shielding cover is greater than 20 square millimeters.

[0011] It is understandable that the area between the insulating component and the shielding cover refers to the projected area of ​​the insulating component on the shielding cover along the first direction. The first direction refers to the direction in which the second portion 432 of the first conductive sheet faces the shielding cover. In this way, when the first conductive sheet is fixed to the shielding cover by the insulating component, the connection area between the first conductive sheet and the shielding cover is large, the connection reliability between the first conductive sheet and the shielding cover is better, and the coupling current on the camera module can be grounded better.

[0012] In one possible implementation, the thickness of the insulator is in the range of 0.03 mm to 0.05 mm. This reduces the risk of the insulator breaking down when the coupling current is large.

[0013] In one possible implementation, the thickness of the first conductive sheet is in the range of 0.03 mm to 0.05 mm. This allows for a smaller thickness of the electronic device in the Z-axis direction, which is beneficial for making the electronic device thinner and lighter.

[0014] In one possible implementation, the first conductive sheet is a nickel-plated conductive cloth, a gold-plated conductive cloth, a carbon-plated conductive cloth, or an aluminum foil fiber composite cloth; or the first conductive sheet is a copper foil.

[0015] Understandably, conductive cloth or copper foil is thinner and lighter, occupying less internal space in electronic devices. This allows for a smaller thickness along the Z-axis, contributing to the thinner and lighter design of electronic devices. Furthermore, the shape of the conductive cloth or copper foil is easy to cut and flexible, allowing for better adhesion to the camera module. This results in a larger contact area between the first conductive sheet and the camera module, leading to better connection reliability and lower impedance during conduction.

[0016] In one possible implementation, the metal spring is made of nickel-plated stainless steel or gold-plated stainless steel. This provides better strength for the metal spring and reduces the risk of it detaching from the first circuit board.

[0017] In one possible implementation, the thickness of the metal shrapnel is in the range of 0.2 mm to 0.3 mm.

[0018] In one possible implementation, the second part of the metal spring has a first through hole, and the first circuit board has a second through hole. A screw is fixed in both the first and second through holes, and the metal spring abuts against the grounding terminal of the first circuit board. This provides better connection reliability between the metal spring and the first circuit board. The coupled current on the camera module can be reliably transmitted to the grounding terminal of the first circuit board simultaneously through both the metal spring and the screw.

[0019] In one possible implementation, the electrical connection structure further includes a second conductive sheet, a portion of which is electrically connected to the camera module, and another portion of which is electrically connected to a metal spring. The camera module is electrically connected to the metal spring via the second conductive sheet.

[0020] It is understandable that by setting a second conductive sheet, the electrical connection area between the metal spring and the camera module can be increased, thereby improving the reliability of the electrical connection between the metal spring and the camera module.

[0021] In one possible implementation, the camera module includes a lens assembly, a housing, and a second circuit board. The housing and the second circuit board are fixedly connected, and the housing and the second circuit board enclose an accommodating space, within which the lens assembly is disposed.

[0022] The first portion of the first conductive sheet is electrically connected to the second circuit board. Alternatively, the first portion of the metal spring is electrically connected to the second circuit board.

[0023] It is understandable that, compared to the first part of the first conductive sheet being fixedly connected to the housing of the camera module, the first part of the first conductive sheet is fixedly connected to the side of the second circuit board away from the housing. The second circuit board has fewer peripheral structures, which facilitates the connection and assembly between the first conductive sheet and the camera module.

[0024] Similarly, compared to the first part of the metal spring and the housing of the camera module being fixedly connected, the first part of the metal spring and the side of the second circuit board away from the housing are fixedly connected. The second circuit board has fewer peripheral structures, which facilitates the connection and assembly between the metal spring and the camera module. Attached Figure Description

[0025] To illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0026] Figure 1 This is a schematic diagram of one embodiment of the electronic device provided in this application.

[0027] Figure 2 yes Figure 1 An exploded view of one embodiment of the electronic device shown;

[0028] Figure 3 yes Figure 1 The electronic device shown is a partial cross-sectional view along section line AA in one embodiment.

[0029] Figure 4 yes Figure 2 An exploded view of one embodiment of the camera module shown;

[0030] Figure 5 yes Figure 4A cross-sectional view of one embodiment of the camera module shown at section line BB;

[0031] Figure 6 yes Figure 3 A schematic diagram of the assembly of a portion of the structure shown from another angle;

[0032] Figure 7 yes Figure 3 An enlarged schematic diagram of one embodiment of the structure shown at point C;

[0033] Figure 8 yes Figure 5 An enlarged schematic diagram of one embodiment of the structure shown at point D;

[0034] Figure 9a yes Figure 1 A partial cross-sectional view of another embodiment of the electronic device shown at section line AA;

[0035] Figure 9b yes Figure 1 A partial cross-sectional view of another embodiment of the electronic device shown at section line AA;

[0036] Figure 10 yes Figure 9b A schematic diagram of the assembly of a portion of the structure shown from another angle;

[0037] Figure 11 yes Figure 9b The diagram shown is a schematic representation of one embodiment of the structure at point E. Detailed Implementation

[0038] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after the connection. The directional terms mentioned in the embodiments of this application, such as "top" and "bottom," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and do not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. Furthermore, "multiple" refers to at least two.

[0039] The embodiments of this application are described below with reference to the accompanying drawings.

[0040] Figure 1 This is a schematic diagram of one embodiment of the electronic device 1000 provided in this application.

[0041] Electronic device 1000 may include, but is not limited to, mobile phones, tablet personal computers, laptop computers, personal digital assistants (PDAs), cameras, personal computers, laptops, in-vehicle equipment, wearable devices, augmented reality (AR) glasses, AR headsets, virtual reality (VR) glasses, VR headsets, or drones, etc., electronic devices 1000 with camera and photography functions. Figure 1 The electronic device 1000 shown is illustrated using a mobile phone as an example.

[0042] It should be noted that, Figure 1 The accompanying drawings below only schematically illustrate some components included in the electronic device 1000; the actual shape, size, location, and construction of these components are not subject to change. Figure 1 And as defined in the accompanying figures below. For ease of description, the width direction of electronic device 1000 is defined as the X-axis. The length direction of electronic device 1000 is defined as the Y-axis. The thickness direction of electronic device 1000 is defined as the Z-axis. It is understood that the coordinate system settings of electronic device 1000 can be flexibly set according to specific practical needs.

[0043] Figure 2 yes Figure 1 An exploded view of one embodiment of the electronic device 1000 shown. Figure 3 yes Figure 1 The electronic device 1000 shown is a partial cross-sectional view along section line AA in one embodiment.

[0044] like Figure 2 and Figure 3 As shown, the electronic device 1000 may include a housing 100, a camera module 200, a motherboard 300, an electrical connection structure 400, a screen 500, and an antenna 600. The screen 500 and the antenna 600 are mounted on the housing 100. The screen 500 and the housing 100 enclose an internal space 1001 of the electronic device 1000. The camera module 200, the electrical connection structure 400, and the motherboard 300 are all mounted within the internal space 1001 of the electronic device 1000.

[0045] Screen 500 can be used to display images, videos, etc. In some embodiments, screen 500 may also have a touch sensing function, which is used to sense the user's touch actions to achieve human-computer interaction. For example, screen 500 can be a liquid crystal display (LCD), an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, a flexible light-emitting diode (FLED) display, a Mini-LED display, a Micro-LED display, a Micro-OLED display, a quantum dot light-emitting diode (QLED) display, etc.

[0046] In some implementations, when the electronic device 1000 is a device of some other form, the electronic device 1000 may not include the screen 500.

[0047] Exemplarily, the housing 100 may include a mid-frame 101 and a rear cover 102. The rear cover 102 is fixedly connected to the mid-frame 101. Exemplarily, the rear cover 102 may be fixed to the mid-frame 101 by adhesive. The screen 500 may be located on the side of the mid-frame 101 away from the rear cover 102. In this case, the screen 500 and the rear cover 102 are located on opposite sides of the mid-frame 101. The screen 500, the mid-frame 101, and the rear cover 102 together enclose the internal space of the electronic device 1000.

[0048] In some embodiments, the back cover 102 and the middle frame 101 can be connected by means of bonding, welding, snap-fit ​​connection, screw connection, etc. In some embodiments, the back cover 102 can also be integrally formed with the middle frame 101, that is, the back cover 102 and the middle frame 101 are a single integral structure.

[0049] The camera module 200 can be a front-facing camera module or a rear-facing camera module. This application uses a front-facing camera module 200 as an example for description. The light-receiving surface of the camera module 200 faces the screen 500. Exemplarily, the screen 500 may include a display area 501 and a light-transmitting area 502. The display area 501 is used to display images. The light-transmitting area 502 is used to allow light from outside the electronic device 1000 to enter the interior of the electronic device 1000 through the light-transmitting area. The camera module 200 may be positioned opposite to the light-transmitting area 502. The camera module 200 can capture ambient light entering the interior of the electronic device 1000. The light-transmitting area is not limited to... Figure 1 The circle shown.

[0050] For example, the camera module 200 can be a regular camera module (i.e., the optical axis of the camera module 200 is in the thickness direction of the electronic device 1000, i.e., the Z-axis direction). In some embodiments, the camera module 200 can also be a periscope camera module (i.e., the optical axis of the camera module 200 can be any direction on the XY plane). The accompanying drawings of this application are all described using a regular camera module as an example.

[0051] In some implementations, when the camera module 200 is a front-facing camera module 200, the camera module 200 can be located at the top of the electronic device 1000. The top of the electronic device 1000 refers to the end of the electronic device 1000 that is furthest from the ground when the user is using it. Similarly, the light-transmitting area 502 of the screen 500 can also be located at the top of the screen 500. For example, the distance L1 between the light-transmitting area 502 and the housing 100 can be in the range of 0mm to 0.2mm. The distance L2 between the camera module 200 and the housing 100 is less than L1. It is understood that by positioning the light-transmitting area 502 as close to the housing 100 as possible, the screen 500 can have more area for displaying images, resulting in a better user experience when using the electronic device.

[0052] For example, the motherboard 300 may include a first circuit board 310 and a first electronic component 320. The first electronic component 320 may be fixedly connected to the first circuit board 310. The first circuit board 310 may serve as a support structure for the first electronic component 320. The first circuit board 310 may be fixedly connected to the mid-frame 101. In some embodiments, the first circuit board 310 may also be fixedly mounted to the rear cover 102 of the housing 230.

[0053] For example, the first electronic component 320 can be an active device such as a chip, or a passive device such as a capacitor, inductor, or resistor. It is understood that those skilled in the art can form a motherboard 300 with specific functions by selecting the number, type, and arrangement of the first electronic component 320 on the circuit board.

[0054] Antenna 600 can be used to transmit and / or receive electromagnetic waves, achieving a radiation function. In some embodiments, electronic device 1000 may also include a communication module. The communication module may integrate one or more first electronic components 320 of at least one communication processing module, and the communication module can be used to perform frequency modulation, amplification, filtering, and other processing on the radiated signal from antenna 600. Exemplarily, the communication module may be located on motherboard 300.

[0055] In some embodiments, the antenna 600 may be fixedly connected to the housing 100. Exemplarily, the antenna 600 may be embedded within the middle frame 101 or adhered to the inner surface of the middle frame 101. The inner surface of the middle frame 101 faces the interior of the electronic device 1000. In some embodiments, the antenna 600 may also be embedded in the rear cover 102.

[0056] In some embodiments, the antenna 600 may be located on the top of the housing 100. The top of the housing 100 refers to the end of the housing 100 that is furthest from the ground when the user is using the electronic device 1000. It is understood that there are fewer electronic components near the top of the housing 100, and the antenna 600's radiation function is less susceptible to interference.

[0057] The electrical connection structure 400 can be electrically connected to the camera module 200. The electrical connection structure 400 can also be electrically connected to the first circuit board 310. The camera module 200 can be electrically connected to the first circuit board 310 via the electrical connection structure 400. When the first circuit board 310 is electrically connected to the ground terminal of the electronic device 1000, the camera module 200 can be electrically connected to the ground terminal of the electronic device 1000 via the electrical connection structure 400. The electrical connection structure 400 can be used to reliably ground the interference current of the camera module 200.

[0058] For example, the camera module 200 may include some metal structural components. When the camera module 200 is close to the antenna 600, the metal structural components on the camera module 200 can couple with the operating current of the antenna 600, generating a current (hereinafter referred to as the coupling current generated by the coupling between the metal structural components on the camera module 200 and the antenna 600). The coupling current on the camera module 200 can be transmitted to the ground terminal of the motherboard 300 through the electrical connection structure 400. By setting the electrical connection structure 400, on the one hand, the coupling current can be prevented from interfering with the operation of the camera module 200; on the other hand, the coupling current on the camera module 200 can also be prevented from interfering with the antenna 600's transmission and / or reception of electromagnetic waves.

[0059] In some embodiments, the middle frame 101 can serve as the ground terminal of the electronic device 1000, and the first circuit board 310 can be electrically connected to the middle frame 101. In this way, the coupling current on the camera module 200 can be grounded sequentially through the electrical connection structure 400, the first circuit board 310, and the middle frame 101.

[0060] In some embodiments, the electronic device 1000 may further include electronic components (not shown). These electronic components may be installed within the internal space of the electronic device 1000. Exemplarily, the electronic components may include a battery, a processor, a communication module, an audio module, a speaker, a microphone, and a subscriber identification module (SIM) card, etc.

[0061] In some embodiments, the electronic device 1000 may further include a circuit board bracket (not shown). Exemplarily, the circuit board bracket may be fixedly connected to the first circuit board 310. The circuit board bracket serves to prevent structures (such as the first electronic component 320 or other modules) disposed on the first circuit board 310 from interfering with other devices within the internal space of the electronic device 1000, thereby facilitating the assembly of the electronic device 1000.

[0062] The following section will describe several specific implementation methods for electrically connecting the camera module 200 to the grounding terminal of the electronic device 1000 via the electrical connection structure 400, with reference to the accompanying drawings.

[0063] Figure 4 yes Figure 2 An exploded view of one embodiment of the camera module 200 shown. Figure 5 yes Figure 4 The image shows a cross-sectional view of one embodiment of the camera module 200 at section line BB.

[0064] like Figure 4 and Figure 5As shown, the camera module 200 may include a lens 210, a motor 220, a housing 230, and a circuit module 240. The lens 210 may be a fixed-focus lens, an autofocus (AF) lens, or a zoom lens, etc. The lens 210 in this application is described using an AF lens as an example.

[0065] For example, the housing 230 may include a top cover 232 and a side wall 233. One end of the top cover 232 and the side wall 233 are connected. In some embodiments, the housing 230 may be made of a metallic material, such as stainless steel, aluminum alloy, etc.

[0066] Lens 210 can be fixedly connected to motor 220. Motor 220 can be used to drive lens 210 for focusing. Exemplarily, motor 220 can be provided with light transmission channel 221. Lens 210 can be accommodated in light transmission channel 221 and fixedly connected to motor 220. Lens 210 and motor 220 constitute lens assembly 290 of camera module 200.

[0067] For example, motor 220 can be an AF-OIS motor 220. That is, motor 220 can control the movement of lens 210 along the optical axis direction of lens 210 (in this embodiment, the optical axis direction of lens 210 is the Z-axis direction) to achieve autofocus (AF). When lens 210 is in the center position, lens 210 can move towards the light-incident side or towards the circuit module 240. That is, the center position of lens 210 can be understood as the initial position of lens 210 before focusing.

[0068] The motor 220 can also control the movement of the lens 210 along a plane perpendicular to the optical axis (in this embodiment, the plane perpendicular to the optical axis is the XY plane). Thus, when the camera module 200 collects ambient light, if the electronic device 1000 experiences shaking in the XY plane due to external forces, the movement of the lens 210 in the XY plane can be controlled by the motor 220 to counteract the shaking stroke of the lens 210 in the XY plane, thereby avoiding or reducing the positional shift of the lens 210 caused by shaking. In other words, the camera module 200 of this application can control the movement of the lens 210 in the XY plane via the motor 220, thereby achieving optical image stabilization (OIS) of the camera module 200 and improving the imaging quality of the camera module 200. In some embodiments, the motor 220 can also be an AF motor, an OIS motor, a voice coil motor, a shape memory alloy motor, a piezoelectric ceramic motor, a stepper motor, or a micro-electromechanical system (MEMS) motor, etc.

[0069] The circuit module 240 may include a photosensitive chip 241, a second electronic component 243, and a second circuit board 242. The photosensitive chip 241 and the second electronic component 243 may be fixedly connected to the second circuit board 242. The second circuit board 242 may be used to support the photosensitive chip 241 and the second electronic component 243. The photosensitive chip 241 may be used to collect ambient light and convert the image information carried by the ambient light into electrical signals. The second electronic component 243 may be an active device such as a chip, or a passive device such as a capacitor, inductor, resistor, or filter. The second electronic component 243 may be used to drive the motor 220 to operate.

[0070] For example, the second circuit board 242 may include a first surface 2421 and a second surface 2422, which are arranged back-to-back. The first surface 2421 is the side of the second circuit board 242 facing the lens 210. The second electronic component 243, the photosensitive chip 241, the motor 220, and the sidewall 233 of the housing 230 can be fixedly connected to the first surface 2421 of the second circuit board 242. The top cover 232 can be fixedly connected to the end of the sidewall 233 away from the second circuit board 242. Thus, the top cover 232, the sidewall 233, and the second circuit board 242 can enclose a receiving space 231. The lens 210 and the motor 220 can be disposed within the receiving space 231. In this way, the camera module 200 can be formed as a single unit, facilitating installation.

[0071] In some embodiments, the second side 2422 of the second circuit board 242 can serve as the ground terminal of the second circuit board 242.

[0072] In some embodiments, the second circuit board 242 may include a dielectric layer (not shown) and a metal layer (not shown). The metal layer is embedded within the dielectric layer. The dielectric layer can be used to protect and insulate the metal layer. The metal layer can be used to transmit electrical signals. The photosensitive chip 241 and the second electronic component 243 can be electrically connected to the metal layer. The metal layer of the second circuit board 242 can serve as the ground terminal of the second circuit board 242.

[0073] In some implementations, the second circuit board 242 may be a printed circuit board (PCB).

[0074] like Figure 3 and Figure 4 As shown, the electronic device 1000 may further include a flexible circuit board 250. One end of the flexible circuit board 250 may be electrically connected to the second circuit board 242, and the other end may be electrically connected to the motherboard 300. Signals from the second circuit board 242 (e.g., signals from the photosensitive chip 241) can be transmitted to the motherboard 300 via the flexible circuit board 250. Exemplarily, the flexible circuit board 250 may be electrically connected to the metal layer of the second circuit board 242.

[0075] Figure 6 yes Figure 3 The diagram shows a partial assembly of the structure from another angle. Figure 7 yes Figure 3 An enlarged schematic diagram of one embodiment of the structure shown at point C.

[0076] like Figure 3 , Figure 6 and Figure 7 As shown, the electrical connection structure 400 may include a shielding cover 410, an insulating member 420, and a first conductive sheet 430. A first portion 431 of the first conductive sheet 430 may be at least partially fixedly connected to the camera module 200. The first portion 431 of the first conductive sheet 430 may be electrically connected to the camera module 200. Exemplarily, the first portion 431 of the first conductive sheet 430 may be at least partially fixedly connected to the side of the second circuit board 242 away from the lens 210. The first portion 431 of the first conductive sheet 430 may be electrically connected to the second circuit board 242.

[0077] In some embodiments, the first portion 431 of the first conductive sheet 430 can be electrically connected to the second circuit board 242 by screws. In some embodiments, the first portion 431 of the first conductive sheet 430 can also be electrically connected to the second circuit board 242 by conductive adhesive.

[0078] In some embodiments, the first conductive sheet 430 can be a conductive cloth. For example, nickel-plated conductive cloth, gold-plated conductive cloth, carbon-plated conductive cloth, or aluminum foil fiber composite cloth. In some embodiments, the first conductive sheet 430 can also be a copper foil. It is understood that the conductive cloth or copper foil has a smaller thickness and lighter weight, occupies less internal space in the electronic device 1000, and the thickness of the electronic device 1000 in the Z-axis direction can be smaller, which is beneficial to the thinning and lightening of the electronic device 1000. Furthermore, the conductive cloth or copper foil is easy to cut and has a certain degree of flexibility, which can better fit the camera module 200, allowing for a larger contact area between the first conductive sheet 430 and the camera module 200, resulting in better connection reliability and lower impedance during conduction.

[0079] In some embodiments, the thickness of the first conductive sheet 430 can be in the range of 0.03 mm to 0.05 mm. This allows for a smaller thickness of the electronic device 1000 in the Z-axis direction, which is beneficial for making the electronic device 1000 thinner and lighter.

[0080] In some embodiments, the housing 230 of the camera module 200 can be electrically connected to the second circuit board 242. When the first portion 431 of the first conductive sheet 430 is electrically connected to the second circuit board 242, the housing 230 of the camera module 200 can be electrically connected to the first portion 431 of the first conductive sheet 430 through the second circuit board 242. In this way, the coupling current on the housing 230 can be conducted to the first conductive sheet 430 through the second circuit board 242.

[0081] like Figure 8 What is shown is Figure 5 The diagram shown is an enlarged view of one embodiment of the structure at point D. The camera module 200 may also include an electrical connector 260. The electrical connector 260 can be used to transmit coupled current on the camera module 200. The electrical connector 260 may include one or more of the following: a metal spring, a screw, a cable, a metal trace, a flexible circuit board, a conductive solder layer, conductive adhesive, etc. The housing 230 of the camera module 200 can be electrically connected to the second circuit board 242 via the electrical connector 260. For example, when the electrical connector 260 is a conductive solder layer, the housing 230 of the camera module 200 can be fixedly connected to the second circuit board 242 by soldering, and the coupled current generated on the housing 230 can be conducted to the second circuit board 242 through the electrical connector 260. As another example, when the electrical connector 260 is a screw, the housing 230 can be fixedly connected to the second circuit board 242 by a screw (not shown), and the coupled current generated on the housing 230 can be conducted to the second circuit board 242 through the screw.

[0082] In some implementations, the number of electrical connectors 260 can be one or more. When the camera module 200 includes multiple metal structural components that are coupled to the antenna 600 and generate coupling current, multiple electrical connectors 260 can be provided. Each of the multiple electrical connectors 260 is connected to one of the multiple structural components in the camera module 200 that generate coupling current, thereby grounding the coupling current generated by the different structures of the camera module 200 as much as possible.

[0083] In some embodiments, the first portion 431 of the first conductive sheet 430 may be at least partially connected to the second surface 2422 of the second circuit board 242. In some embodiments, the first portion 431 of the first conductive sheet 430 may also be at least partially connected to the flexible circuit board 250. In this way, the connection area between the first conductive sheet 430 and the camera module 200 is larger, and the connection reliability is better.

[0084] In some embodiments, the first portion 431 of the first conductive sheet 430 may also be electrically connected to the upper cover 232 of the camera module 200. It is understood that the position of the first conductive sheet 430 connected to the camera module 200 can be adjusted according to the internal installation scheme of the camera module 200 within the electronic device 1000. Simultaneously, multiple structural components within the camera module 200 that generate coupling current can conduct the coupling current to the structure electrically connected to the first conductive sheet 430 via the electrical connector 260.

[0085] The shield 410 can be electrically connected to the ground terminal of the electronic device 1000. For example, as shown... Figure 6 and Figure 7 As shown, the shielding cover 410 can be electrically connected to the ground terminal of the first circuit board 310. The shielding cover 410 can be used to shield the first electronic component 320 to be shielded, preventing the first electronic component 320 from being subjected to electromagnetic interference. Exemplarily, the shielding cover 410 can have a receiving space 411. The first electronic component 320 that requires electromagnetic shielding can be located in the receiving space 411.

[0086] In some implementations, the rear cover 102 can be the grounding terminal of the electronic device 1000. The shield 410 can also be electrically connected to the rear cover 102.

[0087] In some embodiments, the shield 410 may be made of a metallic conductive material. For example, the metallic material may be aluminum alloy, stainless steel, or nickel silver.

[0088] For example, the insulating element 420 can be fixedly connected to the shielding cover 410, and the insulating element 420 can be an insulating material. The second portion 432 of the first conductive sheet 430 can be at least partially fixedly connected to the side of the insulating element 420 away from the shielding cover 410. The first conductive sheet 430, the insulating element 420, and the shielding cover 410 form a capacitor. The first conductive sheet 430 and the shielding cover 410 are insulated from each other. The shielding cover 410 is electrically connected to the first circuit board 310. In this way, the coupling current on the camera module 200 can be coupled to the shielding cover 410 through the first conductive sheet 430, and conducted to the grounding terminal of the electronic device 1000 through the shielding cover 410 and the first circuit board 310.

[0089] Understandably, compared to the scheme where the first conductive sheet 430 is directly electrically connected to the shielding cover 410 via conductive adhesive, and the coupling current of the camera module 200 is directly grounded, the scheme in this embodiment can form a capacitor with the first conductive sheet 430, the insulating component 420, and the shielding cover 410. The coupling current on the camera module 200 is grounded through the capacitor, which can reduce the impedance of the coupling current during electrical transmission. Furthermore, the conductive adhesive uses an insulating material mixed with metal particles, which are used for conductivity. On the one hand, metal particles are easily oxidized upon contact with air; on the other hand, metal particles generate heat during electrical transmission, further accelerating oxidation. Oxidation of the metal particles results in higher resistivity of the conductive adhesive and a decrease in its bonding ability, leading to a decrease in the reliability of the electrical connection between the first conductive sheet 430 and the shielding cover 410. In contrast to the method of attaching the first conductive sheet 430 to the shielding cover 410 with conductive adhesive, the coupling current on the camera module 200 is grounded through capacitive coupling. This reduces the aging of the insulating component 420 and improves the reliability of the connection between the first conductive sheet 430 and the shielding cover 410. The improved electrical connection between the first conductive sheet 430 and the shielding cover 410 allows for better grounding of the coupling current on the camera module 200, reducing the risk of malfunction due to coupling current. Furthermore, it avoids the risk of radiated stray emission (RSE) current during transmission caused by unstable electrical connection between the first conductive sheet 430 and the shielding cover 410, which would affect the quality of wireless communication.

[0090] For example, the first circuit board 310 may include a dielectric layer 311 and a metal layer 312. The metal layer 312 is embedded within the dielectric layer 311. The dielectric layer 311 is made of an insulating material, and the metal layer 312 is made of a conductive metal. A first electronic component 320 may be electrically connected to the metal layer 312, and the metal layer 312 may be used for electrical signal transmission between the first electronic components 320 and for grounding. The metal layer 312 may serve as the grounding terminal of the first circuit board 310, electrically connected to the housing 100. For example, the middle frame 101 may serve as the grounding terminal of the electronic device 1000. The first circuit board 310 may be fixedly connected to the middle frame 101 by screws. The screws may pass through the metal layer 312 and be electrically connected to the middle frame 101. Thus, the shielding cover 410 may be electrically connected to the grounding terminal of the electronic device 1000 through the first circuit board 310. For example, the shielding cover 410 may be electrically connected to the metal layer 312 of the first circuit board 310 by soldering.

[0091] In some embodiments, the insulating element 420 may be made of insulating adhesive. The second portion 432 of the first conductive sheet 430 may be at least partially fixedly connected to the shielding cover 410 via the insulating element 420. In this way, the insulating element 420 can serve as both an insulating medium for the capacitor and a connection structure between the first conductive sheet 430 and the shielding cover 410, eliminating the need for an additional connection structure and facilitating the miniaturization of the electronic device 1000.

[0092] In some embodiments, the electrical connection structure 400 may also include insulating tape, a portion of which is fixedly connected to the side of the second portion 432 of the first conductive sheet 430 away from the shield 410, and another portion is fixedly connected to the shield 410, thereby achieving a fixed connection between at least a portion of the second portion 432 of the first conductive sheet 430 and the shield 410.

[0093] Understandably, compared to forming a capacitor between the first conductive sheet 430, the insulating component 420, and the first circuit board 310, forming a capacitor between the first conductive sheet 430, the insulating component 420, and the shielding cover 410 achieves grounding of the coupled current of the camera module 200 without requiring additional space on the first circuit board 310 for the first electronic component 320, thus reducing the size of the electronic device 1000. Furthermore, the shielding cover 410 has a larger area, which facilitates the placement of a larger insulating component 420, thereby increasing the reliability of the connection between the first conductive sheet 430 and the shielding cover 410. The coupled current on the camera module 200 can be grounded more effectively, thus reducing the risk of radiated spurious emission (RSE) current due to poor connection reliability between the first conductive sheet 430 and the shielding cover 410.

[0094] In some embodiments, the facing area between the insulating element 420 and the shielding cover 410 is greater than 20 square millimeters. The facing area between the insulating element 420 and the shielding cover 410 refers to the projected area of ​​the insulating element 420 onto the shielding cover 410 along a first direction. The first direction refers to the direction in which the second portion 432 of the first conductive sheet 430 faces the shielding cover 410. Thus, when the first conductive sheet 430 is fixedly connected to the shielding cover 410 via the insulating element 420, the connection area between the first conductive sheet 430 and the shielding cover 410 is large, resulting in better connection reliability. This allows the coupling current on the camera module 200 to be grounded more effectively, thereby preventing the coupling current from radiating into the air during transmission due to unstable electrical connection caused by poor connection reliability between the first conductive sheet 430 and the shielding cover 410, thus generating radiated spurious emission (RSE) current and affecting the quality of wireless communication.

[0095] In some embodiments, the insulating element 420 may be made of any one of polycarbonate (PC), polyvinyl chloride (PVC), or polyethylene (PE).

[0096] In some embodiments, the resistivity of the insulating element 420 can be in the range of 10. 9 Ohm·m to 10 22 Within the range of ohms and meters. This reduces the risk of insulation component 420 being broken down when the coupling current is large.

[0097] In some embodiments, the thickness of the insulating element 420 can be in the range of 0.03 mm to 0.05 mm. This reduces the risk of the insulating element 420 being broken down when the coupling current is large.

[0098] like Figure 9a What is shown is Figure 1 A partial cross-sectional view of another embodiment of the electronic device 1000 shown at section line AA.

[0099] like Figure 9aAs shown, the electrical connection structure 400 may include a metal spring 440. A first portion 441 of the metal spring 440 may be at least partially fixedly connected to the camera module 200. The first portion 441 of the metal spring 440 may be electrically connected to the camera module 200. A second portion 442 of the metal spring 440 may be electrically connected to the ground terminal of the electronic device 1000. For example, the ground terminal of the electronic device 1000 may be electrically connected to the ground terminal of the first circuit board 310, and the second portion 442 of the metal spring 440 may be electrically connected to the ground terminal of the first circuit board 310, wherein the second portion 442 of the metal spring 440 may be at least partially soldered to the first circuit board 310.

[0100] In some embodiments, the electrical connection structure 400 may further include screws 450, such as Figure 9b What is shown is Figure 1 The electronic device 1000 shown is a partial cross-sectional view of another embodiment at section line AA. Figure 10 yes Figure 9b The diagram shows a partial assembly of the structure from another angle.

[0101] like Figure 9b and Figure 10 As shown, the first portion 441 of the metal spring 440 can be electrically connected to the camera module 200. The first portion 441 of the metal spring 440 can be at least partially fixedly connected to the camera module 200. The second portion 442 of the metal spring 440 can be at least partially fixedly connected to the first circuit board 310 by screws. The second portion 442 of the metal spring 440 can be electrically connected to the first circuit board 310 by screws. The first circuit board 310 is electrically connected to the ground terminal of the electronic device 1000. Through the metal spring 440, screws 450, and the first circuit board 310, the camera module 200 can be electrically connected to the ground terminal of the electronic device 1000.

[0102] For example, the second portion 442 of the metal spring 440 can be electrically connected to the ground terminal of the first circuit board 310 via a screw. The ground terminal of the first circuit board 310 can be electrically connected to the ground terminal of the electronic device 1000. In this way, the coupled current on the camera module 200 can be conducted to the ground terminal of the electronic device 1000 via the metal spring 440, the screw 450, and the ground terminal of the first circuit board 310.

[0103] Understandably, compared to the scheme where the metal spring 440 is fixedly connected to the first circuit board 310 via conductive adhesive, in this embodiment, the metal spring 440 is fixed to the first circuit board 310 via screws 450. This provides better connection strength between the metal spring 440 and the first circuit board 310, reducing the risk of the metal spring 440 detaching from the first circuit board 310 due to external impact. The second part 442 of the metal spring 440 can be electrically connected to the first circuit board 310 via screws. The electrical connection between the metal spring 440 and the first circuit board 310 is more reliable, thus ensuring that the coupling current on the camera module 200 can be reliably grounded via the metal spring 440, screws 450, and the first circuit board 310. This avoids interference from the coupling current in the operation of the camera module 200 and also prevents the coupling current from radiating RSE current into the air due to unstable electrical connection during transmission, which could affect the wireless communication signal.

[0104] For example, the first portion 441 of the metal spring 440 may be at least partially fixedly connected to the side of the second circuit board 242 of the camera module 200 away from the housing 230. The first portion 441 of the metal spring 440 may be electrically connected to the second circuit board 242.

[0105] For example, the first portion 441 of the metal spring 440 can be electrically connected to the second circuit board 242 via screws.

[0106] In some embodiments, the electrical connection structure 400 may further include a second conductive sheet (not shown). A portion of the second conductive sheet may be electrically connected to the camera module 200, and another portion may be electrically connected to the metal spring 440. The camera module 200 can be electrically connected to the metal spring 440 via the second conductive sheet. Exemplarily, the second conductive sheet may be made of conductive cloth, such as nickel-plated conductive cloth, gold-plated conductive cloth, carbon-plated conductive cloth, or aluminum foil fiber composite cloth.

[0107] It is understandable that by setting a second conductive sheet, the electrical connection area between the metal spring 440 and the camera module 200 can be increased, thereby improving the reliability of the electrical connection between the metal spring 440 and the camera module 200.

[0108] Figure 11 yes Figure 9b The diagram shown is a schematic representation of one embodiment of the structure at point E.

[0109] like Figure 9b and Figure 11As shown, the second part 442 of the metal spring 440 may have a first through hole 4421, and the first circuit board 310 may have a second through hole 313. The grounding terminal of the first circuit board 310 may be exposed in the second through hole 313. The screw 450 may be fixed in the first through hole 4421 and the second through hole 313. The metal spring 440 may abut against the grounding terminal of the first circuit board 310. In this way, the coupling current of the camera module 200 may be transmitted to the grounding terminal of the first circuit board 310 through the metal spring 440 and the screw 450.

[0110] In some embodiments, the mid-frame 101 can serve as the grounding terminal of the electronic device 1000. The mid-frame 101 may also be provided with a third through hole 103, and screws 450 can be fixed in the first through hole 4421, the second through hole 313, and the third through hole 103. The coupling current of the camera module 200 can be electrically connected through the metal spring 440, screws 450, the first circuit board 310, and the mid-frame 101.

[0111] In some embodiments, the electrical connection structure 400 may further include foam 460. Foam 460 may be disposed between the metal spring 440 and the first circuit board 310. It is understood that the foam 460 can enhance the connection strength between the screw 450 and the first circuit board 310.

[0112] In some embodiments, the metal spring 440 may be made of nickel-plated stainless steel or gold-plated stainless steel. The metal spring 440 has good conductivity, and its impedance is low during the grounding process of the coupled current of the camera module 200.

[0113] In some embodiments, the thickness of the metal spring 440 is in the range of 0.2 mm to 0.3 mm. In this way, the thickness of the electronic device 1000 in the Z-axis direction can be small, which is beneficial to the thinning and lightening of the electronic device 1000.

[0114] It should be noted that the parts that are the same as those in the previous embodiments will not be described again in the embodiments of this application.

[0115] This application describes several electronic devices 1000 with reference to the accompanying drawings. The electronic device 1000 includes a housing 230, a camera module 200, a first circuit board 310, and an electrical connection structure 400, wherein the electrical connection structure 400 is electrically connected to the camera module 200, and the first circuit board 310 is electrically connected to the ground terminal of the electronic device 1000.

[0116] The electrical connection structure 400 may include a metal spring 440 and a screw 450. A first portion 441 of the metal spring 440 is electrically connected to the camera module 200. A second portion 442 of the metal spring 440 is at least partially fixedly connected to the first circuit board 310 via the screw 450. The camera module 200 and the ground terminal of the electronic device 1000 are electrically connected via the metal spring 440, screw 450, and first circuit board 310. It is understood that the metal spring 440 is fixed to the first circuit board 310 via the screw 450, resulting in a strong connection between the metal spring 440 and the first circuit board 310. This reduces the risk of the metal spring 440 detaching from the first circuit board 310 due to external impact, and improves the reliability of the electrical connection between the metal spring 440 and the first circuit board 310. The coupling current of the camera module 200 can be grounded well, reducing the risk of failure caused by the coupling current. It can also prevent the coupling current from radiating into the air during transmission due to unstable electrical connection, thus generating radiated spurious emission (RSE) current and affecting the quality of wireless communication.

[0117] Alternatively, the electrical connection structure 400 may include a shielding cover 410, an insulating member 420, and a first conductive sheet 430. The shielding cover 410 is electrically connected to the first circuit board 310, the insulating member 420 is fixedly connected to the shielding cover 410, a first portion 431 of the first conductive sheet 430 is electrically connected to the camera module 200, and at least a portion of the second portion 432 of the first conductive sheet 430 is fixedly connected to the side of the insulating member 420 away from the shielding cover 410. The first conductive sheet 430, the insulating member 420, and the shielding cover 410 form a capacitor. It is understood that compared to the scheme where the first conductive sheet 430 is directly electrically connected to the shielding cover 410 via conductive adhesive, and the coupling current of the camera module 200 is directly grounded, forming a capacitor with the first conductive sheet 430, the insulating member 420, and the shielding cover 410, and coupling the coupling current on the camera module 200 to ground through the capacitor, can reduce the impedance of the coupling current during electrical transmission. Furthermore, the conductive adhesive uses an insulating material mixed with metal particles, and the metal particles are used for conductivity. On the one hand, metal particles are easily oxidized upon contact with air; on the other hand, metal particles generate heat during electrical transmission, which further accelerates their oxidation. Oxidation of the metal particles increases the resistivity of the conductive adhesive and reduces its bonding strength, leading to a decrease in the reliability of the electrical connection between the first conductive sheet 430 and the shielding cover 410. In contrast, the technical solution of this application uses a capacitor to ground the coupling current of the camera module 200, making the insulating component 420 less prone to aging and improving the reliability of the connection between the first conductive sheet 430 and the shielding cover 410. This improved electrical connection reliability allows the coupling current on the camera module 200 to be grounded more effectively, reducing the risk of malfunction due to coupling current. It also prevents poor connection reliability between the first conductive sheet 430 and the shielding cover 410 from causing the coupling current to radiate into the air during transmission, resulting in radiated spurious emission (RSE) current and affecting the quality of wireless communication.

[0118] It is understood that, without conflict, the embodiments and features in the embodiments of this application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0119] It is understood that all the above figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application.

[0120] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device (1000), characterized by, It includes a housing (100), a camera module (200), a first circuit board (310), and an electrical connection structure (400), wherein the electrical connection structure (400) is electrically connected to the camera module (200), and the first circuit board (310) is electrically connected to the ground terminal of the electronic device (1000). The electrical connection structure (400) includes a metal spring (440) and a screw (450). A first portion (441) of the metal spring (440) is electrically connected to the camera module (200). A second portion (442) of the metal spring (440) is at least partially fixedly connected to the first circuit board (310) via the screw (450). The second portion (442) of the metal spring (440) has a first through hole (4421), and the first circuit board (310) has a second through hole (313). The screw (450) is fixed within the first through hole (4421) and the second through hole (313). The metal spring (440) abuts against the grounding terminal of the first circuit board (310). Through the metal spring (440), the screw (450), and the first circuit board (310), the camera module (200) is electrically connected to the grounding terminal of the electronic device (1000); or... The electrical connection structure (400) includes a shield (410), an insulating element (420), and a first conductive sheet (430). The shield (410) is electrically connected to the first circuit board (310), the insulating element (420) is fixedly connected to the shield (410), a first portion (431) of the first conductive sheet (430) is electrically connected to the camera module (200), and a second portion (432) of the first conductive sheet (430) is at least partially fixedly connected to the side of the insulating element (420) away from the shield (410). The first conductive sheet (430), the insulating element (420), and the shield (410) form a capacitor.

2. The electronic device (1000) according to claim 1, characterized by The insulating component (420) is insulating adhesive.

3. The electronic device (1000) according to claim 2, characterized in that, The area between the insulating element (420) and the shield (410) is greater than 20 square millimeters.

4. The electronic device (1000) according to any one of claims 1 to 3, characterized in that, The thickness of the insulating element (420) is in the range of 0.03 mm to 0.05 mm.

5. The electronic device (1000) according to any one of claims 1 to 4, characterized in that, The thickness of the first conductive sheet (430) is in the range of 0.03 mm to 0.05 mm.

6. The electronic device (1000) according to any one of claims 1 to 5, characterized by The first conductive sheet (430) is a nickel-plated conductive cloth, a gold-plated conductive cloth, a carbon-plated conductive cloth, or an aluminum foil fiber composite cloth; or The first conductive sheet (430) is a copper foil.

7. The electronic device (1000) according to claim 1, characterized in that, The metal spring (440) is a nickel-plated stainless steel sheet or a gold-plated stainless steel sheet.

8. The electronic device (1000) according to claim 1 or 7, characterized in that, The thickness of the metal spring (440) is in the range of 0.2 mm to 0.3 mm.

9. The electronic device (1000) according to claim 7 or 8, characterized in that, The electrical connection structure (400) further includes a second conductive sheet, which is electrically connected to the camera module (200) and the metal spring (440). The camera module (200) is electrically connected to the metal spring (440) through the second conductive sheet.

10. The electronic device (1000) according to claim 1, characterized in that, The camera module (200) includes a lens assembly (290), a housing (230), and a second circuit board (242). The housing (230) and the second circuit board (242) are fixedly connected. The housing (230) and the second circuit board (242) enclose an accommodating space (231). The lens assembly (290) is disposed in the accommodating space (231). The first portion (431) of the first conductive sheet (430) and the second circuit board (242) are electrically connected; Alternatively, the first portion (441) of the metal spring (440) and the second circuit board (242) are electrically connected.

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