A resist mask covering device for circuit board etching

Abstract

The application discloses a kind of resistance mask covering devices for circuit board etching, it is related to circuit board production technical field, including conveying table, the upper end surface center of conveying table is fixedly connected with cover body, cover body inside is provided with lifting plate, spraying machine is slidably connected on lifting plate, lifting plate is vertically slidably connected in cover body, can be while staff adjusts the height of spraying machine, resistance is applied to spraying machine, slow down the speed of spraying machine horizontal movement spraying, to facilitate staff to control the thickness of resistance film that spraying machine sprays and covers on the surface of circuit board, not only can accurately adjust resistance value, to meet the requirement of different circuit board, improve the accuracy and stability of resistor on circuit board, but also help to improve the corrosion resistance of circuit board, reduce the risk of resistance layer peeling, and improve the long-term reliability of circuit board, ensure the stability of heat dissipation in the working process of subsequent circuit board.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, specifically to a resistor mask covering device for circuit board etching. Background Technology

[0002] A resistor mask is a conductive thin film that is covered on a circuit board. It can directly form a resistor with a specific resistance value on the circuit board during the production process without the need for additional resistor components. This simplifies the manufacturing process and saves costs. In the circuit board production process, a spraying device is usually used to evenly spray the resistor mask onto the surface of the circuit board.

[0003] In the process of spraying circuit boards, existing spraying equipment faces challenges due to the varying sizes of circuit boards and the resulting differences in the required thickness of the resistive film. Controlling the coating thickness is cumbersome, requiring repeated data adjustments. This is because coating thickness is influenced by various factors, such as spraying distance and speed, leading to instability or exceeding of the specified range in the thickness of the resistive mask on the circuit board surface. This not only causes the resistance value to deviate from design requirements, resulting in unstable or inaccurate resistance performance, but also hinders effective heat dissipation during high-power operation of the resistors, thus affecting the stability and reliability of the circuit board.

[0004] Therefore, we propose a resistor mask covering device for PCB etching to solve the above problems. Summary of the Invention

[0005] (a) Technical problems to be solved

[0006] To address the shortcomings of existing technologies, this invention provides a resistor mask covering device for PCB etching, which can effectively solve the problem that the thickness of the resistor film sprayed on the PCB surface is affected by height and moving speed in existing technologies.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, the present invention can be accomplished through the following technical solutions:

[0009] A resistor mask covering device for circuit board etching includes a conveyor table. A cover is fixedly connected to the center of the upper surface of the conveyor table. A lifting plate is provided inside the cover. A spraying machine is slidably connected to the lifting plate. The lifting plate is vertically slidably connected to the cover. A spraying thickness adjustment mechanism is provided between the lifting plate and the cover. The spraying thickness adjustment mechanism includes a moving plate, which is fixedly connected to the upper surface of the spraying machine. The spraying thickness adjustment mechanism is used to control the height and moving speed of the spraying machine. A circuit board surface pretreatment mechanism is provided on the right side of the spraying thickness adjustment mechanism. The circuit board surface pretreatment mechanism is used to remove impurities remaining on the surface of the circuit board in advance.

[0010] As a further embodiment of the present invention: the coating thickness adjustment mechanism further includes a horizontal plate, a threaded rod is threadedly connected through the center of the horizontal plate, the threaded rod is rotatably connected to the center of the upper end face of the cover, and a connecting column is symmetrically and fixedly connected to the lower end face of the horizontal plate. The connecting columns are all slidably connected to the cover, and the lower ends of the connecting columns are all fixedly connected to the upper end face of the lifting plate.

[0011] As a further embodiment of the present invention: a resistance plate is symmetrically attached to the upper surface of the movable plate, and a sliding column is symmetrically fixedly connected to the upper surface of each resistance plate. The sliding column is slidably connected to the cover body. A spring is fixedly connected between the resistance plate and the inner top surface of the cover body, and the spring is sleeved on the sliding column.

[0012] As a further embodiment of the present invention: a knob is fixedly connected to the upper end of the threaded rod, a support frame is rotatably connected to the upper end of the outer surface of the threaded rod, the support frame is fixedly connected to the upper end surface of the cover, a limit groove is formed on the upper end surface of the support frame, a ring is vertically slidably connected to the outer surface of the knob, a locking block is symmetrically formed on the outer surface of the ring, the locking block is adapted to the limit groove, and an arc plate is symmetrically fixedly connected to the upper end surface of the ring.

[0013] As a further embodiment of the present invention: the circuit board surface pretreatment mechanism includes an air storage box, the air storage box is fixedly connected to the right side wall of the cover, a piston rod is slidably connected through the upper end of the air storage box at equal intervals, a connecting plate is fixedly connected between the upper ends of the piston rod, an air inlet is provided at equal intervals on the lower end of the side of the air storage box away from the conveyor table, and an air outlet is provided at equal intervals on the lower end of the side of the air storage box close to the conveyor table.

[0014] As a further embodiment of the present invention: a connecting rod is rotatably connected at the center of the upper surface of the connecting plate, a through groove is provided on the side of the connecting rod away from the connecting plate, a lever is slidably connected in the through groove, and the end of the lever away from the connecting rod is fixedly connected to the side wall of the moving plate.

[0015] As a further embodiment of the present invention: connecting blocks are fixedly connected to both the front and rear sides of the connecting plate, and elastic telescopic columns are fixedly connected to the lower ends of the connecting blocks. The ends of the elastic telescopic columns away from the connecting blocks are fixedly connected to the gas storage box.

[0016] As a further aspect of the present invention: an adsorption plate is fixedly connected to the side of the conveying platform away from the gas storage box, and the side of the adsorption plate near the gas storage box is an adhesive surface.

[0017] (III) Beneficial Effects

[0018] Compared with the prior art, the present invention provides a resistor mask covering device for circuit board etching, which has the following advantages:

[0019] 1. The spray coating thickness adjustment mechanism allows the operator to apply resistance to the sprayer while adjusting its height, slowing down the horizontal spraying speed. This facilitates control over the thickness of the resistive film sprayed onto the circuit board surface, enabling precise adjustment of the resistance value to meet the requirements of different circuit boards, improving the accuracy and stability of resistors on the circuit board. Furthermore, it helps improve the circuit board's corrosion resistance, reduces the risk of resistive layer detachment, enhances long-term reliability, and ensures stable heat dissipation for subsequent circuit boards during operation.

[0020] 2. By limiting the position of the locking block through the set limiting groove, the threaded rod can be prevented from rotating due to the vibration caused by the conveyor table and the spraying machine. This not only enhances the stability of the spraying machine during the spraying process on the circuit board surface and ensures the consistency of the thickness of the resistive film sprayed on the circuit board surface, but also enables the spraying machine to evenly spray the resistive film on the circuit board surface, improving the overall aesthetics and functionality of the circuit board.

[0021] 3. Through the pre-treatment mechanism for the circuit board surface, during the reciprocating spraying process of the sprayer on the circuit board surface inside the cover, impurities present on the subsequent circuit board surface can be cleaned at the same time. This not only avoids interference from impurities and dust and other contaminants on the adhesion of the resistive film, ensuring good adhesion between the resistive film and the circuit board and strengthening the adhesion of the resistive film, but also keeps the circuit board surface clean by cleaning impurities, which helps to ensure that the resistive film has good conductivity.

[0022] 4. The adsorption plate can be set up to collect the dust that is cleaned from the circuit board surface during the cleaning process of the air storage box. This not only makes it easier for the staff to handle the cleaned dust in a centralized manner, but also prevents the dust from being dispersed to the conveyor and subsequent circuit boards, thus ensuring the cleanliness of the working environment. Attached Figure Description

[0023] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings.

[0024] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 This is a schematic diagram of the connection structure of the coating thickness adjustment mechanism of the present invention;

[0026] Figure 3 For the present invention Figure 2 Enlarged structural diagram of region A in the middle;

[0027] Figure 4 For the present invention Figure 2 Enlarged structural diagram of region B in the middle;

[0028] Figure 5 This is a schematic diagram of the connection structure of the circuit board surface pretreatment mechanism of the present invention;

[0029] Figure 6 For the present invention Figure 5 Enlarged structural diagram of region C in the middle;

[0030] Figure 7 For the present invention Figure 5 Another perspective on the structure.

[0031] In the diagram: 1. Conveyor table; 2. Cover; 3. Lifting plate; 4. Spraying machine;

[0032] 5. Coating thickness adjustment mechanism; 501. Horizontal plate; 502. Threaded rod; 503. Connecting column; 504. Support frame; 505. Knob; 506. Moving plate; 507. Resistance plate; 508. Sliding column; 509. Spring; 510. Limiting groove; 511. Ring; 512. Locking block; 513. Arc plate;

[0033] 6. Circuit board surface pretreatment mechanism; 601. Gas storage box; 602. Connecting plate; 603. Adsorption plate; 604. Air inlet; 605. Connecting rod; 606. Through groove; 607. Toggle rod; 608. Elastic telescopic column; 609. Piston rod; 610. Connecting block; 611. Air outlet. Detailed Implementation

[0034] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] This embodiment provides a resistor mask covering device for circuit board etching, such as... Figure 1 - Figure 7 As shown, the device includes a conveyor table 1, a cover 2 fixedly connected to the center of the upper surface of the conveyor table 1, a lifting plate 3 inside the cover 2, a spraying machine 4 slidably connected to the lifting plate 3, the lifting plate 3 being vertically slidably connected inside the cover 2, and a spraying thickness adjustment mechanism 5 between the lifting plate 3 and the cover 2. The spraying thickness adjustment mechanism 5 includes a moving plate 506, which is fixedly connected to the upper surface of the spraying machine 4. The spraying thickness adjustment mechanism 5 is used to control the height and moving speed of the spraying machine 4.

[0036] In this embodiment, as Figure 2 As shown, the coating thickness adjustment mechanism 5 also includes a horizontal plate 501. A threaded rod 502 is threadedly connected through the center of the horizontal plate 501. The threaded rod 502 is rotatably connected to the center of the upper end face of the cover 2. A connecting column 503 is symmetrically and fixedly connected to the lower end face of the horizontal plate 501. The connecting columns 503 are all slidably connected to the cover 2. The lower ends of the connecting columns 503 are all fixedly connected to the upper end face of the lifting plate 3. When the threaded rod 502 rotates, the lifting plate 3 can be synchronously driven to rise inside the cover 2 through the horizontal plate 501 and the connecting column 503, thereby adjusting the height of the spraying machine 4 connected to the lifting plate 3.

[0037] In this embodiment, as Figure 3 As shown, a resistance plate 507 is symmetrically attached to the upper end of the moving plate 506. Sliding columns 508 are symmetrically fixedly connected to the upper end of the resistance plate 507. The sliding columns 508 are slidably connected to the cover 2. Springs 509 are fixedly connected between the resistance plate 507 and the inner top surface of the cover 2. The springs 509 are sleeved on the sliding columns 508. During the process of the moving plate 506 rising with the sprayer 4, the resistance plate 507 can simultaneously squeeze the springs 509. The pressure applied by the springs 509 to the resistance plate 507 can enhance the friction between the resistance plate 507 and the moving plate 506, thereby increasing the resistance encountered by the moving plate 506 during the movement and slowing down the movement speed of the sprayer 4 connected to the lower end of the moving plate 506.

[0038] In this embodiment, as Figure 4 As shown, a knob 505 is fixedly connected to the upper end of the threaded rod 502. A support frame 504 is rotatably connected to the upper end of the outer surface of the threaded rod 502. The support frame 504 is fixedly connected to the upper end face of the cover 2. A limiting groove 510 is opened on the upper end face of the support frame 504. A ring 511 is vertically slidably connected to the outer surface of the knob 505. A locking block 512 is symmetrically opened on the outer surface of the ring 511. The locking blocks 512 are all adapted to the limiting groove 510. An arc plate 513 is symmetrically fixedly connected to the upper end face of the ring 511. The locking blocks 512 and the limiting groove 510 are mutually locked, which can limit the ring 511, the knob 505 and the threaded rod 502, and prevent them from rotating due to external factors.

[0039] The effects achieved here are as follows: In the prior art, because the coating thickness is affected by various factors, such as spraying distance and spraying speed, the thickness of the resistor mask sprayed on the circuit board surface is unstable or exceeds the specified range. This not only causes the resistance value to deviate from the design requirements, resulting in unstable or inaccurate resistance performance, but also causes the circuit board to be unable to effectively dissipate heat under the high power operating conditions of the resistor during subsequent circuit board operation, thus affecting its stability and reliability. Compared with the prior art, the present invention can apply resistance to the spraying machine 4 while the operator adjusts the height of the spraying machine 4, slowing down the horizontal movement and spraying speed of the spraying machine 4. This makes it easier for the operator to control the thickness of the resistor film sprayed by the spraying machine 4 covering the circuit board surface. This not only allows for precise adjustment of the resistance value to meet the requirements of different circuit boards and improves the accuracy and stability of the resistors on the circuit board, but also helps to improve the corrosion resistance of the circuit board, reduce the risk of resistor layer peeling off, and improve the long-term reliability of the circuit board, ensuring the stability of heat dissipation of the subsequent circuit board during operation.

[0040] By limiting the position of the locking block 512 through the setting of the limiting groove 510, the threaded rod 502 can be prevented from rotating due to the vibration caused by the operation of the conveyor table 1 and the spraying machine 4. This not only enhances the stability of the spraying machine 4 during the spraying process on the circuit board surface and ensures the consistency of the thickness of the resistive film sprayed on the circuit board surface, but also enables the spraying machine 4 to evenly spray the resistive film on the circuit board surface, improving the overall aesthetics and functionality of the circuit board.

[0041] In other aspects, this embodiment also provides a circuit board surface pretreatment mechanism 6 for removing residual impurities on the circuit board surface in advance, such as... Figure 1 , Figure 5 - Figure 7 As shown, the circuit board surface pretreatment mechanism 6 includes an air storage box 601, which is fixedly connected to the right side wall of the cover 2. A piston rod 609 is equidistantly slidably connected to the upper end of the air storage box 601. A connecting plate 602 is fixedly connected between the upper ends of the piston rod 609. An air inlet 604 is equidistantly opened at the lower end of the air storage box 601 on the side away from the conveyor table 1, and an air outlet 611 is equidistantly opened at the lower end of the air storage box 601 on the side close to the conveyor table 1.

[0042] In this embodiment, as Figure 5 and Figure 6As shown, a connecting rod 605 is rotatably connected to the center of the upper end face of the connecting plate 602. A through groove 606 is provided on the side of the connecting rod 605 away from the connecting plate 602. A lever 607 is slidably connected in the through groove 606. The end of the lever 607 away from the connecting rod 605 is fixedly connected to the side wall of the moving plate 506. When the moving plate 506 moves back and forth with the spraying machine 4, it can drive the lever 607 to slide back and forth in the through groove 606, and drive the connecting rod 605 to move back and forth, causing the connecting plate 602, which is rotatably connected to the other end of the connecting rod 605, to move up and down back and forth.

[0043] In this embodiment, as Figure 5 and Figure 6 As shown, connecting blocks 610 are fixedly connected to both the front and rear sides of the connecting plate 602. Elastic telescopic columns 608 are fixedly connected to the lower end of each connecting block 610. The end of the elastic telescopic column 608 away from the connecting block 610 is fixedly connected to the gas storage box 601. Through the rebound force of the elastic telescopic column 608, it is easier for the connecting rod 605 to pull the connecting plate 602 upward.

[0044] In this embodiment, as Figure 5 and Figure 7 As shown, an adsorption plate 603 is fixedly connected to the side of the conveyor table 1 away from the air storage box 601. The side of the adsorption plate 603 near the air storage box 601 is an adhesive surface. Through the adsorption plate 603, the dust and impurities cleaned from the air storage box 601 can be collected in a concentrated manner.

[0045] The effect achieved here is as follows: Compared with the existing technology, during the reciprocating spraying process of the spraying machine 4 on the surface of the circuit board inside the cover 2, it can simultaneously clean the impurities present on the surface of the subsequent circuit board. This not only avoids the interference of impurities and dust and other contaminants on the adhesion of the resistive film, ensuring good adhesion between the resistive film and the circuit board and strengthening the adhesion of the resistive film, but also keeps the surface of the circuit board clean by cleaning impurities, which helps to ensure the good conductivity of the resistive film.

[0046] Secondly, the adsorption plate 603 can be set up so that the dust cleaned from the circuit board surface can be adhered and collected on the adsorption plate 603 during the dust cleaning process of the air storage box 601. This not only makes it easier for the staff to centrally handle the cleaned dust, but also prevents the dust from being dispersed to the conveyor table 1 and subsequent circuit boards, thereby ensuring the cleanliness of the working environment.

[0047] The overall working process and principles involved in the above embodiments are as follows:

[0048] When the operator needs to spray resistive film onto the surface of the circuit board, the circuit boards are first placed sequentially on the upper surface of the conveyor table 1. Then, the conveyor table 1 is opened to send the circuit boards into the housing 2 in turn. After the circuit boards are transported to the designated position, the operator, according to the required thickness of the resistive film covering the surface of the circuit board, lifts the arc-shaped plate 513 symmetrically connected to the upper surface of the ring 511, causing the ring 511 to slide upward on the outer surface of the knob 505. As the ring 511 rises, it can simultaneously drive the locking block 512 to slide out from the limiting groove 510 opened on the upper surface of the support frame 504, separating from the limiting groove 510. After the 0 is completely separated, the staff can drive the arc plate 513 to rotate horizontally, and drive the knob 505 to rotate synchronously through the ring 511. This causes the threaded rod 502 connected to the lower end of the knob 505 to rotate synchronously on the support frame 504 and the cover 2. During the rotation of the threaded rod 502, through the threaded connection with the horizontal plate 501, the horizontal plate 501 can move upward on the outer surface of the threaded rod 502, and synchronously drive the connecting column 503 symmetrically connected to the lower end of the horizontal plate 501 to slide out from the cover 2, pulling the lifting plate 3 connected to the lower end of the connecting column 503 to rise inside the cover 2, thereby adjusting the height of the sprayer 4 connected to the lifting plate 3.

[0049] When the lifting plate 3 raises to adjust the height of the spraying machine 4, the moving plate 506 connected to the upper end of the spraying machine 4 pushes the resistance plate 507 to move upward synchronously. This causes the sliding column 508 connected to the upper end of the resistance plate 507 to slide out from the cover 2 and simultaneously squeeze the spring 509. As the spring 509 squeezes, it continuously applies a downward pressure to the resistance plate 507, increasing the friction between the resistance plate 507 and the moving plate 506. This increases the resistance of the moving plate 506 during movement, slows down the speed of the spraying machine 4 during the reciprocating spraying process, and makes it easier for the operator to control the thickness of the resistive film sprayed by the spraying machine 4 and covering the surface of the circuit board. This not only allows for precise adjustment of the resistance value to meet the requirements of different circuit boards and improves the accuracy and stability of the resistors on the circuit board, but also helps to improve the corrosion resistance of the circuit board, reduce the risk of the resistive layer falling off, and improve the long-term reliability of the circuit board, ensuring the stability of heat dissipation of the subsequent circuit board during operation.

[0050] Once the height of the lifting plate 3 is adjusted, the operator can release the arc plate 513. At this time, under the influence of gravity, the arc plate 513 and the ring 511 will automatically slide downward on the outer surface of the knob 505, causing the locking block 512 connected to the outer surface of the ring 511 to automatically slide into the limiting groove 510, thus limiting the ring 511. This prevents the threaded rod 502 from rotating due to the vibration caused by the operation of the conveyor table 1 and the spraying machine 4. This not only enhances the stability of the spraying machine 4 during the spraying process on the circuit board surface and ensures the consistency of the thickness of the resistive film sprayed on the circuit board surface, but also enables the spraying machine 4 to evenly spray the resistive film on the circuit board surface, improving the overall aesthetics and functionality of the circuit board.

[0051] When the spraying machine 4 moves back and forth on the lifting plate 3, evenly spraying the resistive film onto the surface of the circuit board, the moving plate 506 connected to the upper end of the spraying machine 4 drives the lever 607 to move back and forth synchronously. When the lever 607 moves, it first slides along the through groove 606 opened on the connecting rod 605. When the connecting rod 605 can no longer slide in the through groove 606, it will pull one end of the connecting rod 605 to move back and forth horizontally. At this time, the connecting rod 605 will move back and forth from a near-horizontal position to a near-vertical position. The linkage 605 moves back and forth between different states. When the linkage 605 moves to a near-horizontal state, it will pull the connecting plate 602, which is rotatably connected to the other end of the linkage 605, to rise. This will cause the piston rod 609, which is connected to the lower end of the connecting plate 602, to slide out of the air storage box 601, drawing outside air into the air storage box 601 through the air inlet 604. During the rising process of the connecting plate 602, the rebound force of the elastic telescopic column 608 will push the connecting plate 602 to rise synchronously, so that the linkage 605 can pull the connecting plate 602 to move upward.

[0052] When the connecting rod 605 moves to a near-vertical position, it facilitates the downward movement of the connecting plate 602, causing the piston rod 609 connected to the connecting rod 605 to slide into the air storage box 601. The connecting block 610 then causes the elastic telescopic column 608 to contract, compressing it. As the piston rod 609 slides into the air storage box 601, the air drawn into the air storage box 601 is expelled through the air outlet 611 and blown onto the surface of the circuit board that has not yet entered the enclosure 2. This cleans impurities from the surface of the circuit board, preventing impurities and dust from interfering with the adhesion of the resistive film, ensuring good adhesion between the resistive film and the circuit board, and strengthening the adhesion of the resistive film. Furthermore, cleaning impurities keeps the circuit board surface clean, helping to ensure good conductivity of the resistive film.

[0053] During the cleaning process of dust and impurities remaining on the surface of subsequent circuit boards by the air storage box 601, the dust and impurities blown up will drift away from the air storage box 601 and come into contact with the adsorption plate 603, adhering to the side wall of the adsorption plate 603. This not only makes it easier for staff to centrally handle the cleaned dust, but also prevents the dust from being dispersed onto the conveyor table 1 and subsequent circuit boards, thus ensuring the cleanliness of the working environment.

[0054] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A resistor mask covering device for etching circuit boards, comprising a conveyor table (1), a cover (2) fixedly connected to the center of the upper surface of the conveyor table (1), a lifting plate (3) disposed inside the cover (2), and a spraying machine (4) slidably connected to the lifting plate (3), characterized in that, The lifting plate (3) is vertically slidably connected inside the cover (2); A coating thickness adjustment mechanism (5) is provided between the lifting plate (3) and the cover (2). The coating thickness adjustment mechanism (5) includes a moving plate (506). The moving plate (506) is fixedly connected to the upper end face of the spraying machine (4). The coating thickness adjustment mechanism (5) is used to control the height and moving speed of the spraying machine (4). The coating thickness adjustment mechanism (5) is provided with a circuit board surface pretreatment mechanism (6) on the right side. The circuit board surface pretreatment mechanism (6) is used to remove the impurities remaining on the surface of the circuit board in advance. The circuit board surface pretreatment mechanism (6) includes an air storage box (601), which is fixedly connected to the right side wall of the cover (2). A piston rod (609) is equidistantly slidably connected to the upper end of the air storage box (601). A connecting plate (602) is fixedly connected between the upper ends of the piston rod (609). An air inlet (604) is equidistantly opened at the lower end of the air storage box (601) on the side away from the conveyor table (1), and an air outlet (611) is equidistantly opened at the lower end of the air storage box (601) on the side close to the conveyor table (1). A connecting rod (605) is rotatably connected at the center of the upper end face of the connecting plate (602). A through groove (606) is provided on the side of the connecting rod (605) away from the connecting plate (602). A lever (607) is slidably connected in the through groove (606). The end of the lever (607) away from the connecting rod (605) is fixedly connected to the side wall of the moving plate (506). The connecting plate (602) is fixedly connected to both the front and rear sides with connecting blocks (610), and the lower end of each connecting block (610) is fixedly connected to an elastic telescopic column (608). The end of the elastic telescopic column (608) away from the connecting block (610) is fixedly connected to the gas storage box (601). An adsorption plate (603) is fixedly connected to the side of the conveyor table (1) away from the gas storage box (601), and the side of the adsorption plate (603) near the gas storage box (601) is an adhesive surface. The coating thickness adjustment mechanism (5) also includes a horizontal plate (501), with a threaded rod (502) threaded through the center of the horizontal plate (501). The threaded rod (502) is rotatably connected to the center of the upper end face of the cover (2). A connecting column (503) is symmetrically fixedly connected to the lower end face of the horizontal plate (501). The connecting columns (503) are all slidably connected to the cover (2), and the lower ends of the connecting columns (503) are all fixedly connected to the upper end face of the lifting plate (3).

2. The resistor mask covering device for circuit board etching according to claim 1, characterized in that, The upper end face of the movable plate (506) is symmetrically attached to the resistance plate (507), and the upper end face of the resistance plate (507) is symmetrically fixedly connected to the sliding column (508). The sliding column (508) is slidably connected to the cover (2). The resistance plate (507) and the inner top surface of the cover (2) are both fixedly connected to the spring (509), and the spring (509) is sleeved on the sliding column (508).

3. The resistor mask covering device for circuit board etching according to claim 2, characterized in that, A knob (505) is fixedly connected to the upper end of the threaded rod (502). A support frame (504) is rotatably connected to the upper end of the outer surface of the threaded rod (502). The support frame (504) is fixedly connected to the upper end face of the cover (2). A limiting groove (510) is opened on the upper end face of the support frame (504). A ring (511) is vertically slidably connected to the outer surface of the knob (505). A locking block (512) is symmetrically opened on the outer surface of the ring (511). The locking blocks (512) are all adapted to the limiting groove (510). An arc plate (513) is symmetrically fixedly connected to the upper end face of the ring (511).

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