Electrode connection element, light emitting device including the same, and method of manufacturing light

Abstract

The present invention relates to an electrode connection element, a light-emitting device including the same, and a method of manufacturing the same, and more particularly, to an electrode connection element electrically connecting an electrode terminal and an external driving circuit, a light-emitting device including the same, and a method of manufacturing the light-emitting device. An electrode connection element according to an exemplary embodiment includes: an upper connection member in contact with an upper surface of an electrode terminal formed on a substrate; a lower connection member configured to support a lower surface of the substrate; and a connecting member configured to connect the upper connecting member and the lower connecting member to each other.

Description

Technical Field

[0001] The present invention relates to an electrode connecting element, a light-emitting device including the electrode connecting element, and a method for manufacturing the light-emitting device, and more particularly to an electrode connecting element electrically connecting an electrode terminal and an external driving circuit, a light-emitting device including the electrode connecting element, and a method for manufacturing the light-emitting device. Background Art

[0002] A light-emitting device refers to a device that converts electrical signals into infrared rays or light using the characteristics of compound semiconductors and is used to send or receive signals or as a light source.

[0003] According to the rapid progress of technology for visually expressing electrical signals, research and development such as reducing thickness, weight and power consumption have been intensively conducted to show the excellent characteristics of light-emitting devices. Among them, organic light-emitting devices are used in various application products such as lighting devices and displays, which can have a small thickness and be bent through the use of self-luminous elements.

[0004] Such a light emitting device emits light in response to an electrical signal applied from an external driving circuit.

[0005] In order to apply an electrical signal from an external driving circuit to a light-emitting device, a film-on-glass (FOG) bonding method is generally used. The FOG bonding method refers to a method in which: an anisotropic conductive film (ACF) in which conductive particles are distributed in an adhesive resin film is attached to an electrode provided on glass; a flexible printed circuit board (FPCB) is provided on the anisotropic conductive film and appropriate pressure is applied; thus, the flexible printed circuit board and the electrode provided on the glass are electrically connected.

[0006] However, the method of applying an electrical signal using an anisotropic conductive film consists of a plurality of processes, and thus has limitations in that the working time consumed by the bonding process increases and productivity and working efficiency decrease.

[0007] (Related technical literature)

[0008] (Patent document 1) KR10-2004-0085897A. Summary of the invention

[0009] Technical issues

[0010] The present invention relates to an electrode connecting element, a light emitting device including the electrode connecting element, and a method for manufacturing the light emitting device, which can reliably electrically connect an electrode terminal and an external driving circuit through a simplified process.

[0011] Technical means

[0012] According to an exemplary embodiment, an electrode connecting element includes: the electrode connecting element includes: an upper connecting member contacting an upper surface of an electrode terminal formed on a substrate; a lower connecting member configured to support a lower surface of the substrate; a connecting member configured to connect the upper connecting member and the lower connecting member to each other; and an elastic member disposed between the substrate and the lower connecting member and configured to maintain contact between the upper surface of the electrode terminal and the upper connecting member.

[0013] The electrode terminal may be formed of a conductive non-metal material, and the upper connecting member may be formed of a conductive metal material.

[0014] The connecting member may include a first connecting member and a second connecting member, which are respectively bent from both ends of the upper connecting member, and the lower connecting member may include a first lower connecting member and a second lower connecting member, which are respectively bent from the first connecting member and the second lower connecting member.

[0015] The first lower connection member and the second lower connection member may be formed by bending the first connection member and the second connection member in a direction toward each other, and the elastic member may be supported on the first lower connection member and the second lower connection member and apply pressure to the substrate.

[0016] The elastic member may be formed such that a central portion of the elastic member is bent to protrude toward the lower surface of the substrate.

[0017] The upper connection member may include a plurality of protrusions protruding from a bottom surface of the upper connection member.

[0018] The connecting member may include a bolt and a nut, or a rivet.

[0019] According to another exemplary embodiment, a light-emitting device includes: a substrate including an active area and an inactive area; a light-emitting element formed on the active area; and an electrode connecting element formed on the inactive area and elastically supported by and coupled to the substrate to supply power to the light-emitting element.

[0020] The light emitting element may include an electrode terminal extending onto the inactive region, one side of the electrode connecting element may be in contact with the electrode terminal, and the other side of the electrode connecting element may be in contact with the substrate.

[0021] The electrode connection element may be coupled to the substrate by passing through the substrate.

[0022] The electrode connection element may be coupled to a side surface of the substrate.

[0023] According to an exemplary embodiment, a method for manufacturing a light-emitting device includes: preparing a substrate having an active area and an inactive area; forming a light-emitting element on the active area; and forming an electrode connecting element on the inactive area, the electrode connecting element being elastically supported by the substrate and configured to supply power to the light-emitting element.

[0024] The forming of the electrode connection element may include: forming a through hole through the substrate; and fixing the electrode connection element through the through hole.

[0025] The fixing of the electrode connecting element may include: providing a plate-like component on the substrate, the plate-like component including a horizontal portion and a plurality of vertical portions each bent from both ends of the horizontal portion; providing an elastic component formed under the substrate, so that a central portion of the elastic component is bent toward a lower surface of the substrate; inserting the vertical portions through the through hole; and bending the vertical portions exposed from the lower surface of the substrate inwardly to support the elastic component.

[0026] The method of manufacturing a light emitting device may further include soldering a wire for connecting the electrode connecting element to an external driving circuit to the electrode connecting element.

[0027] Beneficial Effects

[0028] According to the electrode connecting element of the exemplary embodiment, the light-emitting device including the electro-optical connecting member, and the method for manufacturing the light-emitting device, the electrode terminal can be electrically connected to the external driving circuit even without using an anisotropic conductive film, so the manufacturing cost can be reduced and the productivity can be improved.

[0029] In addition, the electrode connecting element for supplying power to the light emitting element is physically fixed so as to be supported by the substrate, and the external driving circuit is connected to the electrode connecting element, so the bonding process for electrically connecting the external driving circuit can be simplified and the configuration of the device can be simplified.

[0030] Furthermore, when the electrode terminal is disposed on the flexible substrate, although the flexible substrate is repeatedly deformed, the coupling property between the electrode terminal and the substrate can be improved, and thus, the electrical connection property and stability with the external driving circuit can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a view showing a state in which an external driving circuit is connected to a typical light emitting device.

[0032] Figure 2 is a schematic diagram of a light emitting device according to an exemplary embodiment.

[0033] Figure 3 is a schematic diagram of an electrode connection element according to an exemplary embodiment.

[0034] Figure 4 is a schematic diagram of an electrode connecting element according to another exemplary embodiment.

[0035] Figures 5 to 9 are views sequentially illustrating a method of manufacturing a light emitting device according to an exemplary embodiment.

[0036] Figures 10 to 12 are views sequentially illustrating a method of manufacturing a light emitting device according to another exemplary embodiment. DETAILED DESCRIPTION

[0037] Hereinafter, exemplary embodiments will be described in detail with reference to the drawings. However, the present invention can be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided to make the present invention thorough and complete, and to fully convey the scope of the present invention to those skilled in the art. In the drawings, the same reference numerals always represent the same elements.

[0038] It should be understood that when it is referred to as being “on,” “connected to,” “stacked” or “coupled to” another element, it can be directly on, connected, stacked or coupled to the other element or intervening elements may be present.

[0039] Spatially relative terms, such as "above" or "upper" and "below" or "lower", etc., may be used herein for ease of description to describe the relationship of one element or feature to another element or feature as shown in the figures. It should be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. The same view numerals refer to the same elements throughout.

[0040] Figure 1 is a view showing a state in which an external driving circuit is connected to a typical light emitting device.

[0041] like Figure 1 As shown, in order to electrically connect the light emitting element to an external driving circuit, a typical light emitting device uses an anisotropic conductive film (ACF) 60 having conductive particles distributed in an adhesive film.

[0042] That is, a typical light-emitting device uses a method in which an anisotropic conductive film 60 having conductive particles distributed in an adhesive film is adhered to an electrode terminal 30 extending from an electrode layer included in a light-emitting element, a flexible printed circuit board (FPCB) 70 is disposed on the anisotropic conductive film and pressed against a substrate 20, and thus, the flexible printed circuit board 70 is electrically connected to the electrode terminal 30 included in the light-emitting element.

[0043] This is because the electrode terminal 30 is formed of a conductive non-metallic material, and the conductive non-metallic material cannot be connected to an external driving circuit such as an external wire or a printed circuit board by welding. That is, a metal material and another metal material can be joined and electrically connected to each other by welding using solder or the like, but when connecting a non-metallic material and a metal material, such a welding method cannot be used.

[0044] However, the method of applying an electrical signal using such an anisotropic conductive film 60 may have limitations in that the adhesive resin of the anisotropic conductive film 60 melts and flows during the heat pressing process, at which time the conductive particles move together with the resin flow, thereby causing the external driving circuit to not be electrically connected, or an unexpected short circuit may occur between electrodes.

[0045] In addition, the bonding process is performed as a separate step using the ACF 60, and each of the loading, pre-bonding and main bonding and unloading processes is sequentially performed, and therefore, there may be limitations in that the working time of the bonding process increases, and productivity and working efficiency decrease.

[0046] Therefore, the electrode connection element according to the exemplary embodiment proposes a technical feature in which an external driving circuit and an electrode terminal can be electrically connected without using an ACF.

[0047] A configuration will be described exemplarily below, in which the electrode connection element according to the exemplary embodiment electrically connects the external driving circuit and the electrode terminal of the light-emitting element provided on the substrate. However, the electrode connection element can of course be applied not only to the electrode terminal of the light-emitting element, but also to various electrical elements connected to the power supply from the external driving circuit.

[0048] Figure 2 is a schematic diagram of a light emitting device according to an exemplary embodiment. Figure 3 is a schematic diagram of an electrode connection element according to an exemplary embodiment, and Figure 4 is a schematic diagram of an electrode connecting element according to another exemplary embodiment.

[0049] refer to Figures 2 to 4According to an exemplary embodiment, the electrode connecting element 300 includes: an upper connecting member 310 contacting an upper surface of an electrode terminal 210 formed on a substrate 100; a lower connecting member 350 supporting a lower surface of the substrate 100; and a connecting member 330 connecting the upper connecting member 310 and the lower connecting member 350 to each other.

[0050] In addition, the light-emitting device according to the exemplary embodiment is configured to include an electrode connecting element 300, and more particularly includes: a substrate 100 having an active area and an inactive area; a light-emitting element 200 disposed on the active area; and an electrode connecting element 300 disposed on the inactive area and supported by the upper and lower sides of the substrate 100 and coupled to the upper and lower sides of the substrate 100 so as to supply power to the light-emitting element 200.

[0051] Various insulating substrates may be used as the substrate 100. In addition, in order to realize a flexible display, the substrate 100 may be formed as a flexible transparent substrate, which has recently attracted attention as a new technology in the display field. In this case, the substrate 100 may be formed by using a polymer plastic having high heat resistance, such as a polymer plastic such as polyethersulphone PES, polyacrylate (PAR), polythienylimide (PEI), polyethylenenapthalate (PEN) or polyethylene terephthalate (PET).

[0052] In addition, the substrate 100 may be a thin film and have a thickness of about 0.1 mm or less, preferably about 50 μm to about 100 μm. Therefore, when the substrate 100 is formed as a flexible, thin, transparent plastic or other substrate, a flexible lighting device and a flexible display of a next generation display device that will not be damaged even if folded or rolled like paper can be realized.

[0053] The substrate 100 has an active area and an inactive area. Here, on the substrate 100, the active area refers to the area where the light emitting element 200 is formed and performs lighting or display functions, while the inactive area refers to the area where the external driving circuit is electrically connected to the active area.

[0054] The light emitting element 200 is formed on the active region. Here, the light emitting element 200 may be an organic light emitting element that utilizes a self-luminous phenomenon and includes an organic compound layer. Hereinafter, the light emitting element 200 is an example including an organic light emitting element, but is not limited thereto. The light emitting element 200 may be applied to various structures that are disposed on the active region of the substrate 100 and emit light.

[0055] The light emitting element 200 may include: an electrode layer formed on the substrate 100; an organic compound layer formed on the electrode layer; and a conductive layer formed on the organic compound layer.

[0056] The electrode layer and the conductive layer may be a cathode electrode and an anode electrode, respectively, for providing electrons and holes (holes) to the organic compound layer, and when the light emitting element 200 is used in a display device, the electrode layer and the conductive layer may be extended to form a data line and a scan line, respectively. In this case, the electrode terminal 210 may extend from the electrode layer or the conductive layer and be electrically connected to a thin film transistor (not shown) disposed on the substrate 100.

[0057] The electrode terminal 210 may be formed to extend from an active region on the substrate 100 to an inactive region. The electrode terminal 210 is mainly formed to extend from the electrode layer of the light emitting element 200 to one side, but of course, the conductive layer may also be formed to extend to the other side of the light emitting element 200 to form the electrode terminal 210. Here, when light is emitted from the organic light emitting layer toward the substrate 100, the conductive layer formed on the organic compound layer is not necessarily formed of a conductive non-metallic material. However, there may be limitations when the conductive layer is formed of a conductive non-metallic material because the electrode terminal 210 extending from the conductive layer may not be connected to an external driving circuit by welding, and therefore, the exemplary embodiment may also be applied to this case in the same manner.

[0058] The electrode layer may be formed of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), and indium tin zinc oxide (ITZO), so that light generated by the organic compound layer formed on the electrode layer may be emitted to the lower side of the substrate 100 without being interfered by the electrode layer.

[0059] The organic compound layer is formed on the electrode layer. Although not shown, the organic compound layer can be formed by stacking a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer. In the organic compound layer, when a driving signal is applied from an external driving circuit, electrons and holes are released from the corresponding electrode layer and the conductive layer, respectively, and the released electrons and holes emit visible light while recombining inside the light-emitting layer. At this time, the generated visible light can be emitted to the lower side of the substrate 100 through the electrode layer formed of a transparent conductive material, and is used to illuminate a target object or display a predetermined picture or image.

[0060] The electrode connection element 300 may be formed on the inactive region of the substrate 100 and supported by the upper and lower sides of the substrate 100 so as to supply power to the light emitting element 200. That is, the electrode connection element 300 contacts the electrode terminal 210 extending from the electrode layer to the inactive region and is electrically connected to the electrode layer, and the electrode connection element 300 has a structure supported by the upper and lower sides of the substrate 100 and physically connected to the electrode terminal 210 and the substrate 100.

[0061] As described above, the electrode connection element 300 includes: an upper connection member 310 that contacts the upper surface of the electrode terminal 210 formed on the substrate 100; a lower connection member 350 configured to support the lower surface of the substrate 100; and a connection member 330 configured to connect the upper connection member 310 and the lower connection member 350 to each other. That is, the upper connection member 310 is located above the substrate 100, and more specifically, the upper connection member 310 is located on the electrode terminal 210 extending to the inactive region of the substrate 100, and contacts and electrically connects to the electrode terminal 210. To this end, the upper connection member 310 can be formed of a conductive metal material. In addition, the lower connection member 350 is located below the substrate 100, and applies pressure to the lower surface of the substrate 100 and supports the lower surface of the substrate 100. Here, the connection member 330 connects the upper connection member 310 and the lower connection member 350 to each other, and thus the electrode connection element 300 can be supported on the upper and lower sides of the substrate and coupled to the upper and lower sides of the substrate.

[0062] In this way, the electrode connection element 300 contacts the electrode terminal 210 on the substrate 100 through the upper connection member 310, and the electrode connection element 300 can pass through the substrate 100 to apply pressure to the lower surface of the substrate 100 and support the lower surface of the substrate 100, so as to be coupled to the substrate 100 and the electrode terminal 210 through the lower connection member 350. In addition, although not shown, the electrode connection element 300 can of course also be coupled to one side surface of the substrate 100, that is, connected to the end of one side surface of the substrate 100, and in this way, the connection member 330 is formed by bending downward from one end of the upper connection member 310, and the lower connection member 350 is formed to extend from the lower end of the connection member 330 in a direction toward the upper connection member 310. In the following embodiment, the electrode connecting element 300 passes through the substrate 100 and is coupled to the substrate 100 and the electrode terminal 210, but the exemplary embodiment is not limited to this. Of course, the electrode connecting element can be applied to various structures in which the electrode connecting element is electrically connected to the electrode terminal 210 and is supported by the upper and lower sides of the substrate 100 and coupled to the upper and lower sides of the substrate 100.

[0063] like Figure 3As shown, the electrode connecting element 300 in the exemplary embodiment may include: an upper connecting member 310 contacting the upper surface of the electrode terminal 210; a lower connecting member 350 supporting the lower surface of the substrate 100; and a connecting member 330 connecting the upper connecting member 310 and the lower connecting member 350 to each other, wherein the connecting member 330 may include a first connecting member 332 and a second connecting member 334, which are respectively formed by bending from both ends of the upper connecting member 310, and the lower connecting member 350 may include a first lower connecting member 352 and a second lower connecting member 354, which are respectively formed by bending from the first connecting member 332 and the second connecting member 334.

[0064] Here, a through hole may be formed in the substrate 100 to couple the connection member. Generally, when light is emitted from the organic light emitting layer toward the substrate 100, a transparent glass substrate may be used as the substrate 100. However, in the light emitting device of the exemplary embodiment, in order to couple the electrode connection element 300, a through hole needs to be formed in the substrate 100. Since a glass substrate is more likely to crack when a through hole is formed, it is desirable to use a flexible transparent substrate rather than a glass substrate. In addition, the through hole may be formed in the substrate 100 by laser processing or the like, and Figure 3 In the example, two through holes are provided through both the electrode terminal 210 and the substrate 100 by laser processing, etc. However, when the electrode connection element 300 is formed so that the first connection member 332 and the second connection member 334 are provided outside the two ends of the electrode terminal 210, it is of course not necessary to provide a through hole in the electrode terminal 210.

[0065] Here, the electrode connection element 300 may be formed by processing a plate-like member, which is formed by using a plate-like member and includes a horizontal portion and vertical portions bent downward from both ends of the horizontal portion, respectively. That is, in a plate-like member having a horizontal portion corresponding to the upper connection member 310 and vertical portions bent downward from both ends of the horizontal portion, respectively, the first connection member 332 and the first lower connection member 352 are formed by bending the vertical portion bent from one end of the horizontal portion, and the second connection member 334 and the second lower connection member 354 are formed by bending the vertical portion bent from the other end of the horizontal portion. Therefore, the electrode connection element 300 may be formed to include an upper connection member 310 in contact with the upper surface of the electrode terminal 210, a lower connection member 350 supporting the lower surface of the substrate 100, and a connection member 330 connecting the upper connection member 310 and the lower connection member 350 to each other. The electrode connection element 300 may be formed in one piece and formed of a metal material having high electrical conductivity. In addition, the upper connection member 310 may include a plurality of protrusions 315 protruding from the bottom surface of the upper connection member 310. The protrusions 315 are formed integrally with the upper connection member 310 and improve contact between the upper connection member 310 and the electrode terminal 210. The protrusions 315 may be formed on the bottom surface of the upper connection member 310 by various methods, such as a method of increasing the roughness of the bottom surface of the upper connection member 310.

[0066] In the electrode connection element 300 of the exemplary embodiment, the first lower connection member 352 and the second lower connection member 354 may be formed by bending to the outside of the first connection member 332 and the second connection member 334, respectively, or may be formed by bending inward in the direction in which the first connection member 332 and the second connection member 334 face each other, respectively. In both cases, the electrode connection element 300 may be pressed against the lower surface of the substrate 100 and supported by the substrate 100 through the first lower connection member 352 and the second lower connection member 354, but when the first lower connection member 352 and the second lower connection member 354 are respectively formed by bending in the direction in which the first connection member 332 and the second connection member 334 face each other, the elastic member 370 may be easily fixed to the lower surface of the substrate 100 between the first lower connection member 352 and the second lower connection member 354.

[0067] The elastic member 370 is disposed between the substrate 100 and the lower connection member 350, and maintains the contact between the upper surface of the electrode 210 and the upper connection member 310. That is, the elastic member 370 applies pressure upward to the substrate 100 from the lower surface, and thus the electrode connection element 300 is elastically supported by the substrate, and the contact between the upper surface of the electrode terminal 210 and the upper connection member 310 can be maintained. In addition, the area of ​​the contact surface where the upper surface of the electrode terminal 210 contacts the upper connection member 310 can be increased by applying pressure to the elastic member 370. That is, the elastic member 370 provides an upward pressure to the substrate 100, and therefore, not only can the contact between the upper surface of the electrode terminal 210 and the upper connection member 310 be maintained, but also the area of ​​the contact surface can be increased. In addition, when a flexible substrate is used, even when the substrate 100 is folded or rolled up, the contact state between the upper surface of the electrode terminal 210 and the upper connection member 310 can be surely maintained.

[0068] The elastic member 370 disposed between the substrate 100 and the lower connection member 350 and pressing the substrate 100 upward may be provided in various forms. However, as described above, when the first lower connection member 352 and the second lower connection member 354 are formed by bending inwardly in the direction in which the first connection member 332 and the second connection member 334 are toward each other, both ends of the elastic member 370 may also be supported on the first lower connection member 352 and the second lower connection member 354 and press the substrate 100. In addition, the elastic member 370 may be disposed so that the central portion of the elastic member 370 is bent to protrude toward the lower surface of the substrate 100 and elastically presses the substrate 100 from below. In this case, the elastic member 370 is not necessarily formed of a conductive metal material, but may be formed of an insulating material to prevent defects such as short circuits from occurring.

[0069] On the contrary, Figure 4 As shown, another exemplary embodiment of an electrode connecting element 300 includes: an upper connecting member 310 in contact with the upper surface of the electrode terminal 210; a lower connecting member 350 supporting the lower surface of the substrate 100; and a connecting member 330 connecting the upper connecting member 310 and the lower connecting member 350 to each other, wherein the connecting member 330 can be formed to include bolts and nuts, or formed by rivets.

[0070] Here, a perforation may also be formed in the substrate 100 to couple the connection member. Therefore, a flexible transparent substrate is preferably used as the substrate 100, rather than a glass substrate which is more likely to generate cracks when forming a perforation, and a single perforation may be formed in the substrate 100 or in the substrate and the electrode terminal 210 by laser processing or the like.

[0071] Here, the electrode connection element 300 may be formed such that the upper connection member 310 having a perforation is disposed on the electrode terminal 210, and the lower connection member having a perforation is disposed under the substrate 100, and the upper connection member 310 and the lower connection member 350 are fixed by bolts and nuts or rivets. That is, the electrode connection element 300, which includes the upper connection member 310 contacting the upper surface of the electrode terminal 210, the lower connection member supporting the lower surface of the substrate 100, and the connection member 330 connecting the upper connection member 310 and the lower connection member 350 to each other, may be formed such that: a bolt is inserted from above the upper connection member 310 into the upper connection member 310 disposed on the electrode terminal 210 and the lower connection member 350 disposed under the substrate 100, and then a nut is fixed to the bolt exposed from the lower surface of the substrate 100; or, a rivet is inserted from above the upper connection member 310, and the end of the rivet exposed from the lower surface of the substrate 100 is processed. In this case, although not shown, the electrode connection element 300 may of course further include an elastic member which is coupled to the bolt or rivet exposed from the lower surface of the substrate 100 and applies pressure to the substrate 100 .

[0072] Here, the material forming the upper connection member 310 may include a metal material having high electrical conductivity, and may include a plurality of protrusions 315 protruding from the bottom surface of the upper connection member 310. In addition, the electrode connection element 300 of another exemplary embodiment may also include a washer disposed above the electrode terminal 210 or below the substrate 100 to protect the surface of the electrode terminal 210 or the substrate 100 and to improve the fastening force between the bolt and the nut.

[0073] Hereinafter, a method of manufacturing a light emitting device according to an exemplary embodiment will be described in detail. In describing the method of manufacturing a light emitting device according to an exemplary embodiment, descriptions of duplicate contents of the above exemplary embodiments regarding the light emitting device will be omitted.

[0074] Figures 5 to 9 are views sequentially illustrating a method of manufacturing a light emitting device according to an exemplary embodiment; Figures 10 to 12 are views sequentially illustrating a method of manufacturing a light emitting device according to another exemplary embodiment.

[0075] refer to Figures 5 to 12 , a method for manufacturing a light-emitting device of an exemplary embodiment includes: preparing a substrate 100 having an active area and an inactive area; forming a light-emitting element 200 on the active area; and forming an electrode connection element 300, which is supported on the upper and lower sides of the substrate on the inactive area so as to supply power to the light-emitting element 200.

[0076] When preparing the substrate 100, the substrate 100 in which the active area and the inactive area are defined is prepared. Here, in order to realize a flexible display, the substrate 100 may be formed by using a flexible transparent substrate, for example, using polymer plastic, or may also be formed in the form of a film.

[0077] When the light emitting element 200 is formed on the active region, the light emitting element 200 is formed in the active region on the substrate 100, and the light emitting element 200 may be an organic light emitting element including an organic compound layer using a self-luminous phenomenon. In addition, as described above, the light emitting element 200 may include an electrode layer formed on the substrate 100; an organic compound layer formed on the electrode layer; and a conductive layer formed on the organic compound layer. Forming the light emitting element 200 on the substrate 100 is generally known, and thus a detailed description thereof will be omitted.

[0078] When the electrode connection member 300 is formed, the electrode connection member 300 for supplying power to the light emitting element 200 is formed, and the electrode connection member 300 is supported by the upper and lower sides of the substrate 100 on the inactive region.

[0079] As described above, the electrode terminal 210 may be formed to extend from the electrode layer on the active region to the inactive region on the substrate 100. Here, the electrode terminal 210 may be formed of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), and indium tin zinc oxide (ITZO) in the same manner as the electrode layer, and thus, light generated from the organic compound layer formed on the electrode layer may be allowed to be emitted to the lower side of the substrate 100 without being disturbed by the electrode layer.

[0080] Therefore, when the electrode connection element 300 is formed, the electrode connection element 300 is formed to contact and electrically connect the electrode terminal 210 on the inactive region of the substrate 100. As described above, the electrode connection element 300 includes: an upper connection member 310 in contact with the upper surface of the electrode terminal 210; a lower connection member 350 supporting the lower surface of the substrate 100; and a connection member 330 connecting the upper connection member 310 and the lower connection member 350 to each other. Here, the upper connection member 310 is located above the substrate 100, and more specifically, the upper connection member 310 is located above the electrode terminal 210 extending to the inactive region of the substrate 100, and contacts and electrically connects the electrode terminal 210. In addition, the lower connection member 350 is located below the substrate 100 and presses and supports the lower surface of the substrate 100. Here, the connection member 330 connects the upper connection member 310 and the lower connection member 350 to each other, and therefore, the electrode connection element 300 can be supported by the upper and lower sides of the substrate and coupled to the upper and lower sides of the substrate.

[0081] The electrode connection element 300 may also be formed so that the connection member 330 is bent downward from one end of the upper connection member 310, and the lower connection member 350 is formed to extend from the lower end of the connection member 330 in a direction toward the upper connection member 310 so as to be engaged with one side surface, i.e., the side end of the substrate 100. However, the electrode connection element 300 may contact the electrode terminal 210 through the upper connection member 310 and may pass through the substrate 100 and be coupled to the substrate 100 and the electrode terminal 210 so as to press and support the lower surface of the substrate 100 through the lower connection member 350.

[0082] When the electrode connection element 300 is formed to pass through the substrate 100 and coupled to the substrate 100 and the electrode terminal 210 , the formation of the electrode connection element 300 may include: forming a through hole H passing through the substrate 100 ; and fixing the electrode connection element 300 through the through hole.

[0083] Here, you can Figures 5 to 9 The fixing of the electrode connection element 300 in the exemplary embodiment is performed as shown. That is, the fixing of the electrode connection element 300 in the exemplary embodiment may include: providing a plate-shaped member including a horizontal portion and vertical portions 331 and 333 bent downward from both ends of the horizontal portion; inserting the vertical portions 331 and 333 to pass through the through hole H; and bending the vertical portions 331 and 333 exposed from the lower surface of the substrate 100 inward.

[0084] That is, in order to fix the electrode connection element 300 of the exemplary embodiment, in the formation of the above-mentioned through-holes H, two through-holes are formed at positions corresponding to the vertical portions 331 and 333 respectively bent downward from both ends of the plate-like member. These through-holes H may be formed only in the substrate 100, or in both the substrate 100 and the electrode terminal 210.

[0085] After forming the through hole H in the substrate 100 or the substrate and the electrode terminal 210, a plate-like member including a horizontal portion and vertical portions 331 and 333 bent downward from both ends of the horizontal portion is disposed above the substrate 100, that is, disposed on the electrode terminal 210 formed on the substrate. Here, the plate-like member has a horizontal portion corresponding to the upper connection member 310 and vertical portions 331 and 333 bent downward from both ends of the horizontal portion. In addition, a plurality of protrusions 315 protruding from the bottom surface of the horizontal portion may be disposed on the bottom surface, and as described above, the contact between the horizontal portion and the electrode terminal 210 may be improved by the protrusions.

[0086] When the plate-like member is disposed above the electrode terminal 210, each of the vertical portions 331 and 333 is inserted into the through hole H by pressing the plate-like member downward. In this way, the vertical portions are inserted into the corresponding through holes H by pressing the plate-like member downward by pressing the plate-like member until the horizontal portion, that is, the upper connection member 310 contacts the upper surface of the electrode terminal 210, and when the upper connection member 310 contacts the upper surface of the electrode terminal 210 and presses the electrode terminal 210 with a predetermined pressure, the vertical portions 331 and 333 exposed from the lower surface of the substrate 100 through the through hole H are bent inwardly in directions opposite to each other. Here, each of the vertical portions 331 and 333 may be bent inwardly so that the vertical portions 331 and 333 are pressed against the lower surface of the substrate 100, and the connection member 330 and the lower connection member 350 may be formed by bending each of the vertical portions 331 and 333 inwardly.

[0087] In addition, the fixing of the electrode connection element 300 of the exemplary embodiment may further include: before the vertical portions 331 and 333 are inserted into the through hole H, an elastic member 370 is provided below the substrate 100, and the elastic member 370 is formed to be bent so that the central portion of the elastic member 370 protrudes toward the lower surface of the substrate 100. The provided elastic member 370 applies pressure to the substrate 100 while both ends thereof are supported by the first lower connection member 352 and the second lower connection member 354, which are formed by bending each of the vertical portions 331 and 333 inwardly. Therefore, the electrode connection element 300 is elastically supported by the substrate 100 and elastically presses the substrate 100 from below, and therefore, the contact between the upper surface of the electrode terminal 210 and the upper connection member 210 can be maintained. In addition, as described above, the elastic member 370 can elastically press the substrate 100 from below so that the central portion of the elastic member 370 is bent to protrude toward the lower surface of the substrate 100.

[0088] In addition, you can Figures 10 to 12 The fixing of the electrode connection element 300 of another exemplary embodiment is performed as shown. That is, the fixing of the electrode connection element 300 of another exemplary embodiment may include: positioning the upper connection member 310 and the lower connection member 350 respectively formed on the upper side and the lower side of the substrate 100; inserting the bolt 336 from the upper side of the upper connection member 310 and passing through the through hole H; and fastening the nut 338 to the bolt 336 exposed from the lower surface of the substrate 100.

[0089] That is, in order to fix the electrode connection element 300 of another exemplary embodiment, in the formation of the above-mentioned through hole H, a single through hole H for inserting the bolt 336 constituting the connection member 330 is formed in the substrate 100, or formed in the substrate 100 and the electrode terminal 210. In addition, the upper connection member 310 and the lower connection member 350 are formed to be penetrated corresponding to the through hole H, the upper connection member 310 formed through is located on the electrode terminal 210, and the lower connection member 350 formed through is located below the substrate 100. Here, the upper connection member 310 may include a plurality of protrusions 315 protruding from the bottom surface of the upper connection member 310, and as described above, the contact between the upper connection member 310 and the electrode terminal 210 can be improved by the protrusions.

[0090] As such, when the upper connection member 310 and the lower connection member 350 formed by penetration are positioned on the upper and lower sides of the substrate 100, the bolt 336 is inserted through the through hole H from above the upper connection member 310. The bolt 336 is inserted until one end thereof is exposed from the lower surface of the substrate 100, and when the one end is exposed from the lower surface of the substrate 100, the nut 338 may be fixed to the end of the bolt 336. The nut 338 may be tightened so that the upper connection member 310 contacts and presses the upper surface of the electrode terminal 210, and the lower connection member 350 is pressed to the lower surface of the substrate 100 by the bolt 336. Of course, such connection between the upper connection member 310 and the lower connection member 350 may also be performed by inserting a rivet (not shown) from above the upper connection member 310 and processing the end of the rivet exposed from the lower surface of the substrate 100. According to another exemplary embodiment, the connection member 330 may be formed by a bolt 336 and a nut 338 or a rivet, and thus, the electrode connection element 330 may be formed, which includes: an upper connection member 310 in contact with the upper surface of the electrode terminal 210; a lower connection member 350 supporting the lower surface of the substrate 100; and a connection member 330 connecting the upper connection member 310 and the lower connection member 350. In this case, as described above, the electrode connection element 300 may of course further include an elastic member that is coupled to the bolt or rivet exposed from the lower surface of the substrate 100 and applies pressure to the substrate 100.

[0091] When the electrode connection element 300 is formed on the inactive area of ​​the substrate 100 through the above process, the light emitting element 200 is electrically connected to the external circuit through the electrode connection element 300. That is, the method of manufacturing a light emitting device of the exemplary embodiment may further include welding a wiring L for connecting to an external circuit to the electrode connection element 300. As described above, the electrode connection element 300 (more specifically, the upper connection member 310 included in the electrode connection element 300) includes a metal material having a high electrical conductivity. Therefore, the wiring L for connecting to an external driving circuit, such as an external wire or a printed circuit board, can be electrically connected to the electrode connection element 300 through welding S.

[0092] In this way, according to the electrode connecting element of the exemplary embodiment, the light-emitting device including the electro-optical connecting component, and the method of manufacturing the light-emitting device, the electrode terminal 210 can be electrically connected to the external driving circuit even without using an anisotropic conductive film, so the manufacturing cost can be reduced and the productivity can be improved.

[0093] In addition, the electrode connecting element 300 for supplying power to the light emitting element 200 is physically fixed so as to be supported by the substrate 100, and the external driving circuit is connected to the electrode connecting element 300, so the bonding process for electrically connecting the external driving circuit can be simplified and the configuration of the device can be simplified.

[0094] Furthermore, when the electrode terminal 210 is formed on a flexible substrate, coupling of the electrode terminal 210 with the substrate may be improved despite repeated deformation of the flexible substrate, and thus, electrical connection characteristics and stability with an external driving circuit may be enhanced.

[0095] Although preferred exemplary embodiments have been described and illustrated using specific terms, these terms are only used to explain the exemplary embodiments, and it is apparent that various modifications and changes can be made to the exemplary embodiments and the terms used without departing from the spirit and scope defined by the appended claims. These various modified embodiments should not be interpreted as being separated from the spirit and scope of the present invention, but are included within the scope of the present invention.

Claims

1. An electrode connection element, comprising: an upper connection member in contact with an upper surface of an electrode terminal formed on the substrate; a lower connecting member configured to support a lower surface of the substrate; a connecting member configured to connect the upper connecting member and the lower connecting member to each other; as well as an elastic member disposed between the substrate and the lower connecting member and configured to maintain contact between the upper surface of the electrode terminal and the upper connecting member, The upper connection member includes a plurality of protrusions formed to protrude from a bottom surface of the upper connection member.

2. The electrode connection element according to claim 1, wherein: The electrode terminal is formed of a conductive non-metallic material, and The upper connecting member is formed of a conductive metal material.

3. The electrode connection element according to claim 1, wherein: The connecting member includes a first connecting member and a second connecting member, wherein the first connecting member and the second connecting member are formed by bending from both ends of the upper connecting member, respectively, and The lower connection member includes a first lower connection member and a second lower connection member, and the first lower connection member and the second lower connection member are bent from the first connection member and the second connection member, respectively.

4. The electrode connection element according to claim 3, wherein: The first lower connection member and the second lower connection member are formed by bending the first connection member and the second connection member in directions toward each other, and The elastic member is supported on the first lower connecting member and the second lower connecting member and applies pressure to the substrate.

5. The electrode connection element according to claim 4, wherein: The elastic member is formed such that a central portion of the elastic member is bent to protrude toward the lower surface of the substrate.

6. The electrode connection element according to claim 1, wherein: The connecting members include bolts and nuts, or rivets.

7. A light emitting device, comprising: a substrate including an active region and an inactive region; A light emitting element formed on the active region; and The electrode connection element according to any one of claims 1 to 6 is formed on the inactive area and is elastically supported by and coupled to the substrate to supply power to the light emitting element.

8. The light emitting device according to claim 7, wherein: The light emitting element comprises an electrode terminal extending onto the inactive region, One side of the electrode connecting element is in contact with the electrode terminal, and The other side of the electrode connection element is in contact with the substrate.

9. The light emitting device according to claim 7, wherein: The electrode connection element is coupled to the substrate by passing through the substrate.

10. The light emitting device according to claim 7, wherein: The electrode connection element is coupled to a side surface of the substrate.

11. A method for manufacturing a light emitting device, comprising: preparing a substrate having an active region and an inactive region; forming a light emitting element on the active region; and An electrode connection element according to any one of claims 1 to 6 is formed on the inactive area, the electrode connection element being elastically supported by the substrate and configured to supply power to the light emitting element.

12. The method according to claim 11, wherein: The steps of forming the electrode connection element include: forming a through hole through the substrate; and The electrode connecting element is fixed through the through hole.

13. The method according to claim 12, wherein: The step of fixing the electrode connection element comprises: providing a plate-shaped member on the substrate, the plate-shaped member comprising a horizontal portion and vertical portions bent downward from both ends of the horizontal portion respectively; providing an elastic member at a lower portion of the substrate, so that a central portion of the elastic member is bent toward a lower surface of the substrate; inserting the vertical portion through the through hole; as well as The vertical portion exposed from the lower surface of the substrate is bent inwardly to support the elastic member.

14. The method according to claim 11, further comprising soldering a wire for connecting to an external driving circuit to the electrode connecting element.

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