IC defect double-sided detection equipment

By designing a double-sided detection device for IC defects including a conveying mechanism, marking mechanism, material removal mechanism, flip mechanism and image detection mechanism, the problem of low detection efficiency of traditional ICs is solved, and the automated double-sided detection and material removal of IC products is realized, which significantly improves the detection efficiency.

CN119972539APending Publication Date: 2025-05-13HEFEI SENSOR TURNKEY SERVICE CORP
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Patent Information

Application Number
CN202510280379.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-11
Publication Date
2025-05-13

AI Technical Summary

Technical Problem

Traditional IC detection can only achieve one-sided detection, and the other side requires manual flip, which is relatively inefficient.

Method used

A double-sided detection equipment for IC defects is designed, including a conveying mechanism, marking mechanism, material removal mechanism, flip mechanism, dual-channel image detection mechanism, feeding mechanism, feeding mechanism and lifting platform to realize automatic loading and unloading, double-sided detection, automatic material removal, automatic flip and automatic marking of IC products.

Benefits of technology

Through the automation process, the inspection efficiency of IC products is improved, the automation of double-sided inspection is realized, and the detection efficiency and applicability are significantly improved.

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    Figure CN119972539A_ABST
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Abstract

The IC defect double-sided detection equipment comprises a machine base and a conveying mechanism located at the top of the machine base, a discharging mechanism and a feeding mechanism are arranged at the two ends of the conveying mechanism respectively, a marking mechanism is erected at the end, close to the discharging mechanism, of the conveying mechanism, and a double-channel image detection mechanism is arranged on one side of the other end of the conveying mechanism; the two sides of the conveying mechanism are provided with two sets of symmetrically-arranged material removing mechanisms and reversing mechanisms, and lifting platforms are arranged on the corresponding stations of the discharging mechanism, the feeding mechanism, the double-channel image detection mechanism, the material removing mechanisms and the reversing mechanisms. Through mutual cooperation of the conveying mechanism, the marking mechanism, the material removing mechanism, the overturning mechanism, the double-channel image detection mechanism, the discharging mechanism, the feeding mechanism and the lifting platform, the working procedures of feeding and discharging, double-face detection, automatic material removing, automatic overturning and automatic marking of the IC products are achieved, the product detection efficiency is improved, and good applicability is achieved.
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