Structure and system for testing optical performance of miniature optical device

By designing a structure including a hollow structure, a metal bearing stage, a wire and a probe, the problem of optical performance testing of micro-optical devices is solved, and power supply and measurement are realized in-cavity, which is suitable for optical performance testing of micro-optical devices.

CN119984764APending Publication Date: 2025-05-13ANHUI GUOSHENG QUANTUM TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202510367497.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-26
Publication Date
2025-05-13

AI Technical Summary

Technical Problem

The prior art is difficult to achieve optical performance testing of micro-optical devices, mainly due to the small size of the micro-structure and light source, divergent light, and the inability to supply internal power.

Method used

A structure including a hollow structure, a metal bearing stage, a wire and a probe is designed. The hollow structure consists of a detachable upper and lower half, and the inner wall is a spherical light reflective material for placing micro-optical devices and realizing power supply and measurement in the cavity.

Benefits of technology

The optical performance test of micro-optical devices is realized, including optical performance measurement of laser chip die and LED chip die, solving the difficulties of power supply and optical performance testing of micro-optical devices.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119984764A_ABST
    Figure CN119984764A_ABST
Patent Text Reader

Abstract

The invention provides a structure and system for testing the optical performance of a miniature optical device, and the structure comprises a hollow structure body which comprises an upper half part and a lower half part which are detachably connected, and the hollow inner wall surface is a spherical surface and is made of a light reflection material; a mounting hole and a measuring hole are formed in the upper half part, and the measuring hole is used for mounting an instrument for testing optical performance; the metal bearing platform is arranged on the inner wall of the lower half part, and a first insulating part is arranged between the mounting parts and is used for placing a to-be-tested micro optical device; the wire penetrates into the hollow structural body from the outside of the hollow structural body, is connected with the metal bearing table and is used for supplying power to the first electrode of the micro optical device; and the probe is installed in the installation hole and can abut against a second electrode of the miniature optical device so as to supply power to the second electrode, and a second insulating part is arranged on the hole wall of the installation hole. In-cavity power supply and measurement of a micro optical device are realized, the problem of optical performance test is solved, and the device can be applied to optical performance detection of a micron-scale or nano-scale diamond NV color center.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The invention relates to the field of optical detection, and in particular to a structure and system for testing the optical performance of a micro optical device. Background Art

[0002] When detecting light emitted by a light source, an existing detection device, such as an optical integrator, places the light source outside or on the surface of the detection device, and needs to introduce the light from the light source into the measurement device through an incident port for measurement.

[0003] However, for micro light sources and micro optical probes, such as laser diodes, LEDs and other bare chips, the above method cannot be used for optical inspection. The reasons are: 1. The size of the micro structure, probe and light source chip is extremely small, generally hundreds of microns, or even a few microns, which is not easy to install. 2. The light source is relatively divergent, and even if it is fixed at the opening on the surface of the device, it will still cause a large error. 3. If it is placed inside the detection device, it cannot meet its internal power supply requirements, because the existing method is to place the structure or device to be tested outside the detection device, generally using external power supply. If the device is to be powered internally, the structure of the existing measuring device needs to be modified.

[0004] For such micro-optical devices, how to implement their optical performance testing becomes a problem that needs to be solved. Summary of the invention

[0005] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a structure and system for optical performance testing of micro optical devices, so as to solve the problem that the optical performance testing of micro optical devices cannot be implemented in the prior art.

[0006] To achieve the above-mentioned and other related purposes, a first aspect of the present invention provides a structure for testing the optical performance of a micro-optical device, comprising: The hollow structure comprises a detachably connected upper half and a lower half, wherein the inner wall of the hollow is a spherical surface made of a light-reflecting material; the upper half is provided with a mounting hole and a measuring hole, and the measuring hole is used to install an instrument for optical performance testing; A metal bearing platform is mounted on the inner wall of the lower half, and a first insulating member is provided between the mounting parts of the two for placing the micro optical device to be tested; A wire is inserted into the hollow structure from the outside thereof and connected to the metal support platform, and is used to supply power to the first electrode of the micro-optical device through the metal support platform; The probe is installed in the installation hole and can abut against the second electrode of the micro-optical device to supply power to the second electrode. A second insulating member is arranged on the hole wall of the installation hole. The second insulating member has a surrounding surface surrounding the circumferential side of the probe.

[0007] Furthermore, the upper half is provided with an observation hole and is covered with a sealing cover which can be inserted into the hole.

[0008] Furthermore, it also includes a support rod, one end of which is installed on the outer wall of the lower half, and the other end is used for fixing; the end of the support rod connected to the lower half is provided with a hollow cavity, and the wire is inserted into the hollow structure through the hollow cavity.

[0009] Furthermore, the hollow structure includes an inner wall layer and an outer wall layer, and the inner wall layer is made of a light reflecting material.

[0010] Furthermore, the surrounding surface of the second insulating member forms an internal thread structure, the probe is embedded in a hollow cavity of a hollow screw, and the outer surface of the screw is provided with an external thread structure matching the internal thread.

[0011] Furthermore, it also includes an annular structure, which is located in the mounting hole, and the outer wall surface of an annular third insulating member is attached to the inner wall surface of the annular structure, the annular inner wall surface of the third insulating member forms an internal thread structure, the probe is embedded in the hollow cavity of a hollow screw, and the outer surface of the screw is provided with an external thread structure matching the internal thread; it also includes a plurality of transverse holes opened on the side wall of the mounting hole from the hole to the outside of the upper half, a plurality of adjusting rods corresponding to the transverse holes one by one, and a fixing structure, one end of each adjusting rod is fixedly connected to the outer wall surface of the annular structure, and the other end extends to the outside of the upper half along the corresponding transverse hole, and the annular structure can be moved in the transverse plane of the mounting hole by moving the adjusting rod, and the fixing structure is used to fix the position of the adjusting rod.

[0012] Furthermore, the diameter of the hollow cavity of the integrating sphere is 1-10 cm.

[0013] Furthermore, the support rod is formed by two sections of rods that are detachably connected.

[0014] To achieve the above-mentioned object and other related objects, the second aspect of the present invention provides a system for optical performance testing of diamond NV color centers, comprising: the structure for optical performance testing of micro-optical devices as described in any one of the first aspects, wherein the metal support platform is also used to place the diamond containing NV color centers to be tested; and further comprising one of the following structures: Structure 1: It also includes a laser chip bare die placed on a metal carrier, and power is supplied to the laser chip bare die through the metal carrier and the probe; Structure 2: It also includes an optical fiber, one end of which extends into the interior of the hollow structure, with the end face facing the diamond containing NV color centers to be tested, and the other end is located outside the hollow structure, and the end face is used to access the laser.

[0015] Furthermore, it also includes a filter which is detachably installed in the measuring hole.

[0016] As described above, the structure and system for testing the optical performance of a micro-optical device of the present invention have the following beneficial effects: 1. A metal support platform for placing the micro-optical device to be tested is set in the hollow structure, and a wire is set to connect the metal support platform for powering the first electrode. A mounting hole is set in the upper part to install a probe that can abut against the second electrode of the micro-optical device and supply power to it. A measurement hole is also set to install an instrument for optical performance testing. In this way, intra-cavity power supply and measurement are achieved, which is suitable for placing micro-optical devices, such as laser chip bare die, LED chip bare die, etc. in the hollow structure to solve the problem of their optical performance testing; 2. This structure is applied to the optical performance test system of diamond NV color center. By placing the bare laser chip and the diamond containing NV color center in the hollow structure, the problem of detecting the optical performance of micron- or nano-scale diamond NV color center is solved, and the problem of introducing the light source of diamond photoluminescence and the power supply problem of the laser chip, which is also a micro-optical device, are solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Shown is a schematic structural diagram of the present invention for testing the optical performance of a micro-optical device; Figure 2 Shown is a structural schematic diagram of the mounting hole of the present invention; Figure 3 Shown is a schematic diagram of the support rod structure of the present invention; Figure 4 Another schematic diagram showing the structure of the mounting hole of the present invention; Figure 5 Shown is a top view of the mounting holes; Figure 6 A cross-section view showing the mounting holes; Figure 7 It is a schematic diagram showing a first structure of a system for optical performance testing of diamond NV color centers according to the present invention; Figure 8 It shows a schematic diagram of the structure of the laser chip bare die and the diamond embedded in the fixing frame of the present invention; Fig. 9 Shown is a top view of the fixing frame of the present invention; Fig.10 It is a schematic diagram showing a second structure of the system for optical property testing of diamond NV color center according to the present invention.

[0018] Component number description: 1-hollow structure; 11-upper half; 12-lower half; 121-first insulating member; 13-mounting hole; 131-second insulating member; 132-screw; 133-ring structure; 134-third insulating member; 135-transverse hole; 136-adjusting rod; 1371-fastener; 1372-fastening hole; 138-connecting wire; 139-connecting hole; 14-measuring hole; 15-inner wall layer; 16-outer wall layer; 17-observation hole; 18 —sealing cover; 19—first threading hole; 2—metal support platform; 3—micro optical device; 4—conducting wire; 5—probe; 6—support rod; 61—first rod section; 62—second rod section; 63—protrusion; 64—groove; 65—external thread; 66—internal thread; 67—fixing sleeve; 68—hollow cavity; 69—second threading hole; 7—laser chip die; 8—diamond; 9—fixing frame; 91—first fixing hole; 92—second fixing hole; 10—filter; 20—optical fiber. DETAILED DESCRIPTION

[0019] The following describes the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0020] It should be noted that the illustrations provided in the following embodiments are only used to illustrate the basic concept of the present invention in a schematic manner, and thus the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0021] Embodiment 1: Figure 1 As shown, this embodiment provides a structure for testing the optical performance of a micro-optical device, including: The hollow structure 1 comprises a detachably connected upper half 11 and a lower half 12, wherein the inner wall of the hollow is a spherical surface made of a light-reflecting material; the upper half 11 is provided with a mounting hole 13 and a measuring hole 14, and the measuring hole 14 is used to install an instrument for optical performance testing; The metal support platform 2 is mounted on the inner wall of the lower half 12, and a first insulating member 121 is provided between the mounting parts of the two for placing the micro optical device 3 to be tested; A wire 4 is inserted from the outside of the hollow structure 1 into the inside thereof and connected to the metal support platform 2, and is used to supply power to the first electrode of the micro optical device 3 through the metal support platform 2; The probe 5 is installed in the mounting hole 13 and can abut against the second electrode of the micro-optical device 3 to supply power to the second electrode. A second insulating member 131 is provided on the hole wall of the mounting hole 13. The second insulating member 131 has a surrounding surface surrounding the circumferential side of the probe 5.

[0022] This embodiment can realize intracavity power supply and measurement simultaneously, and is suitable for placing micro optical devices, such as laser chip bare die, LED chip bare die, etc. in a hollow structure to solve the problem of optical performance testing thereof. Intracavity measurement can reduce light loss and improve measurement accuracy.

[0023] The first electrode and the second electrode can be any one of the anode and cathode of the micro-optical device, and form a yin-yang pair. For chips with the anode and cathode located on the top and bottom surfaces respectively, such as a bare laser chip, power supply is achieved through the contact between the probe and the metal carrier and the two electrodes of the chip. The structure is simple and the operation is convenient, playing the dual role of intracavity placement and power supply.

[0024] The hollow structure 1 is divided into an inner wall layer 15 and an outer wall layer 16 from the inside to the outside. The inner wall layer 15 is formed by covering the outer wall layer 16 with a light reflective material having a reflectivity of more than 95%. The formation method can adopt electroplating, vacuum evaporation, spin coating and other processes. The light reflective material can be polytetrafluoroethylene, barium sulfate or magnesium oxide. The upper half 11 and the lower half 12 are both hemispherical. The upper half 11 and the lower half 12 can be detachably connected by respectively setting protrusions and grooves on the connected end faces, or can be as Figure 2 As shown in the figure, matching internal and external threads are respectively provided at the two connected ends to realize detachable connection. Since the metal support platform 2 is connected to the wire 4, when the first electrode located on the bottom surface of the micro-optical device contacts the metal support platform, power can be supplied to the first electrode, and the second electrode located on the top surface is powered by the probe, thereby solving the power supply problem of the micro-optical device in the hollow structure. Even if the emitted light of the micro-optical device located in the hollow structure is dispersed, after spherical reflection in the cavity, the optical performance, such as optical power, wavelength, pulse frequency, etc., can be measured in the measuring hole. The instrument that can be installed in the measuring hole can be a spectrometer, a power meter, etc., or an optical fiber connector can be installed. The measuring hole can be set as a threaded hole to facilitate the replacement and installation of different instrument interfaces or optical fiber connectors. The optical fiber installed in the measuring hole 14 can also be a beam splitting optical fiber. The combined end is inserted into the measuring hole 14, and multiple branch ends are connected to the test instrument, so that multiple parameters, such as spectrum, optical power, etc. can be tested simultaneously.

[0025] In order to avoid blocking the light reflection in the hollow structure, the metal support platform 2 is selected to be a slender structure, and the size of its top end surface is suitable for placing the chip. The maximum size of the top end surface in a single dimension is 1-8mm, which can be Figure 1As shown, a cylindrical structure is selected.

[0026] like Figure 2 As shown, the surrounding surface of the second insulating member 131 forms an internal thread structure, and the probe 5 is embedded in the hollow cavity of a hollow screw 132. The outer surface of the screw 132 is provided with an external thread structure that matches the internal thread. The probe 5 is fixed by the hollow screw 132, and the length of the probe 5 extending into the cavity of the hollow structure 1 is adjusted by rotating the thread, so as to adapt to the power supply of micro optical devices of different sizes. The second insulating member 131 can be an insulating material layer covering the wall of the mounting hole 13, and the insulating material can be plastic, rubber, etc.

[0027] The metal support platform 2 and the probe 5 are electrically insulated from the hollow structure 1 by the first insulating member 121 and the second insulating member 131, respectively, to avoid affecting the power supply demand of the micro optical device 3 to be tested. The first insulating member 121 is located in the area connected between the metal support platform 2 and the inner wall surface of the lower half 12, and its shape is preferably attached to the connection surface, such as Figure 1 As shown, the bottom surface of the metal supporting platform 2 is connected to the inner wall surface of the lower half 12, and the first insulating member 121 is an insulating material layer, which is located between the connecting parts of the two and has an area no larger than the area of ​​the connecting part of the metal supporting platform 2 to maximize the light reflection area of ​​the inner wall surface of the lower half 12.

[0028] like Figure 2 As shown, the upper half is also provided with an observation hole 17, and is covered with a sealing cover 18 that can be inserted into the hole. The microscope observes the cavity of the hollow structure through the observation hole 17, for example, to observe whether the probe 5 is in contact with the second electrode of the micro-optical device. When observation is not required, the sealing cover 18 is covered to avoid light leakage and reduce measurement errors.

[0029] In order to fix the hollow structure, a support rod 6 is also included, one end of which is mounted on the outer wall of the lower half 12. Figure 1 In the example, it is shown that it is located at the bottom of the lower half 12, and the other end is used to be fixed on a plane such as a test platform. A hollow cavity 68 is opened inside the support rod 6. This hollow cavity is opened at the end of the support rod 6 connected to the lower half 12, which is used to accommodate the wire 4, and a first threading hole 19 is opened on the wall of the lower half 12. This threading hole also passes through the first insulating member 121. The cavity wall of the hollow cavity 68 is opened with a second threading hole 69, as shown in FIG. Figure 1 As shown, one end of the wire 4 contained in the hollow cavity passes through the first threading hole 19 and is connected to the metal support platform 2, and the other end passes through the second threading hole 69 and extends to the outside and is connected to the power supply device, so that the whole structure can be simplified and compactly designed.

[0030] In order to facilitate the operation of the hollow structure fixed on, for example, a test platform, the support rod 6 is designed to be a detachable connection of two sections of rods, such as Figure 3 As shown, the support rod 6 includes a first rod segment 61 and a second rod segment 62, and the side surfaces of the connecting ends of the two rod segments are respectively provided with mating protrusions 63 and grooves 64, and an external thread 65 is provided on the side surface of one of the rod segments. It also includes a set of fixing sleeves 67 with internal threads 66 provided on the inner wall of the outer side of any rod segment. After the protrusion 63 is mated with the groove 64, the internal thread 66 of the fixing sleeve 67 is mated with the external thread 65, so that the protrusion 63 and the groove 64 can be covered in their internal cavity. When disassembly is required, unscrew the fixing sleeve 67 to expose the protrusion 63 and the groove 64. The first rod segment 61 connected to the hollow structure 1 can be separated from the second rod segment 62 by separating the protrusion 63 and the groove 64. When the second rod segment 62 is fixed on the test platform, the micro-optical device located in the cavity thereof can be poured out by pouring out the lower half 12 of the hollow structure 1. This method can solve the problem that the micro-optical device is difficult to clamp out; and after the first rod segment 61 and the second rod segment 62 are connected again, the position of the observation hole remains unchanged. When observing the observation hole with a microscope, there is no need to adjust the position of the microscope relative to the observation hole again, and the operation is more convenient.

[0031] Since the measurement object in this embodiment is a micro optical device, the size of the hollow structure is smaller than that of the general case, and the maximum single dimension of its outer contour is 2-11 cm, and the diameter of the hollow cavity is 1-10 cm. When the area of ​​the measurement hole is constant, the smaller the radius of the hollow wall of the hollow structure, the greater the light energy received by the measurement hole, which can reduce the measurement error.

[0032] Embodiment 2: Figure 4 As shown, on the basis of the first embodiment, the surrounding surface of the second insulating member 131 of this embodiment does not need to form an internal thread structure. This embodiment includes an annular structure 133, which is located in the mounting hole 13. The outer wall surface of an annular third insulating member 134 is attached to the inner wall surface of the annular structure 133, and the annular inner wall surface of the third insulating member 134 forms an internal thread structure. It also includes a plurality of transverse holes 135 opened on the side wall of the mounting hole 13, which lead from the hole to the outside of the upper half 11, and a plurality of adjustment rods 136 corresponding to the transverse holes 135. One end of each adjustment rod 136 is fixedly connected to the outer wall surface of the annular structure 133, and the other end extends along the corresponding transverse hole 135 to the outside of the upper half 11. By moving the adjustment rod 136, the annular structure 133 can be moved in the transverse plane of the mounting hole 13. As shown Figure 4 , Figure 6As shown, there is a gap between the annular outer wall surface of the annular structure 133 and the surrounding surface of the second insulating member 131. By moving the adjustment rod in the transverse plane, the annular structure 133 can be moved in the transverse plane. When the screw 132 of the embedded probe 5 is screwed into the annular structure 133 and fixed relatively to the annular structure 133, the probe 5 will also move in the mounting hole 13, thereby realizing the transverse adjustment of the probe. A fixing structure is also included for fixing the position of the adjustment rod 136, as shown in FIG. Figure 4-6 As shown, the fixing structure includes an external thread structure formed on the outer side of the adjusting rod 136, and an annular fastener 1371 with an internal thread formed on the inner wall surface and sleeved on the free end of the adjusting rod 136. After the fastener 1371 is screwed in along the adjusting rod 136, it can abut against the circumferential surface of the outer end of the transverse hole 135 ( Figure 5 In this embodiment, the adjusting rod 136 can be adjusted to move the annular structure 133 to a predetermined position in the transverse plane, and this position enables the probe to face the electrode after insertion. After the position is fixed by the fixing structure, the screw 132 of the embedded probe 5 is screwed into the annular structure 133, and the longitudinal position is adjusted by screwing in and out, thereby realizing the precise positioning of the probe.

[0033] The annular structure and the second insulating member 131 are longitudinally connected. Figure 4 In the case where there is a gap as shown, in order to facilitate further fixing of the annular structure, the fixing structure also includes the following Figure 4-Figure 5 The longitudinal fastening hole 1372 shown leads from the outside to the mounting hole. A screw that can be screwed in and out through a thread is added to the fastening hole 1372, and the end face of the entry end of the screw is fixed against the upper end face of the annular structure.

[0034] In order to minimize the area occupied by the mounting hole 13 in the inner wall layer 15, enhance the light reflection efficiency of the inner wall layer, and reduce light loss, as Figure 4 As shown, the cross-sectional areas of the lower and upper ends of the mounting hole 13 are set smaller than the middle part, the annular structure 133 is located in the middle hole, and the probe extends into the cavity of the hollow structure from the hole at the lower end.

[0035] For example Figure 5 As shown, four transverse holes 135 and four adjusting rods 136 are arranged along the circumference of the mounting hole 13, and other numbers may also be arranged. Figure 4 As shown, the mounting hole 13 is provided with a detachable upper and lower part, so that the annular structure 133 can be installed therein by opening the upper part. The connecting line 138 in the figure indicates the boundary between the upper part and the lower part. To facilitate the setting of the adjustment rod, the upper end of the mounting hole 13 extends beyond the spherical surface of the upper half 11. Figure 5The connection hole 139 shown in the figure is detachably connected, and other connection methods are also possible. Figure 6 The cross-section of the mounting hole 13 and the cross-section of the annular structure 133 are both rectangular, and can also be set to other types of shapes, such as circular, etc. The diameter of the probe 5 is generally 0.1-0.5 mm, the maximum single dimension size (such as diameter or length) of the upper and lower ports of the mounting hole 13 is 1-3 mm, and the maximum single dimension size of the middle cavity is 1 cm-2 cm.

[0036] Embodiment 3: This embodiment provides a system for testing the optical properties of diamond NV color centers, such as Figure 7 As shown, it includes: the structure for testing the optical performance of a micro-optical device in Example 1 or Example 2, a laser chip bare die 7 placed on a metal supporting platform 2, power is supplied to the laser chip bare die 7 through the metal supporting platform 2 and a probe 5, and the metal supporting platform 2 is also used to place a diamond 8 containing NV color centers.

[0037] like Figure 7 As shown, the inner wall layer 15 in this embodiment is a single-layer structure made directly of light-reflecting material and is bonded to the outer wall layer 16. The light-reflecting material is polytetrafluoroethylene with a thickness of 1-8 mm. The upper and lower halves of the inner wall layer 15 are both hemispherical.

[0038] In the system of this embodiment, when the diamond 8 containing the NV color center to be tested is placed on the metal support platform 2, the laser emitted from the laser chip bare die 7 is irradiated on the diamond 8, and the NV color center generates fluorescence under the action of the laser, thereby realizing the optical properties of the diamond NV color center, such as the fluorescence power and wavelength generated by photoluminescence. Since the size of diamond is a micron-level or nano-level structure, the diamond containing the NV color center is used as a micro-optical device, which can also solve the problem of its optical performance testing, and the laser chip bare die is placed in the hollow structure to directly irradiate the diamond with laser, which also solves the problem of introducing the light source of the photoluminescence of the diamond, and the power supply problem of the laser chip which is also a micro-optical device.

[0039] The measuring hole 14 of this embodiment can measure the mixed light of laser and fluorescence, or Figure 7 As shown, it also includes a filter 10, which is detachably installed in the measuring hole 14. Different filters can be replaced according to the need to filter out wavelengths, and fluorescence or laser can be selectively measured. Figure 7As an example, the filter 10 is installed at one end of the measuring hole 14 close to the inner wall of the hollow structure, a groove is provided at this port, the filter 10 can be clamped in the groove from the inner wall of the hollow structure, and a thread is provided on the side wall of this port, and a fastening frame with a thread on the outer periphery is used to fasten and remove the filter by screwing in and out of the thread. In the case of not installing, the filter 10 can also be directly placed on one end of the measuring hole 14 located on the outer surface of the hollow structure, and fit on the detection surface of the detection instrument.

[0040] When the observation hole 17 is set, the observation hole 17 can also be used as a detection port for optical performance testing. Filters are respectively set at one end of the measuring hole 14 and the observation hole 17. One hole is selectively used to filter out the laser and the other hole is used to filter out the fluorescence, so as to achieve simultaneous testing of the optical properties of the laser chip bare die and the diamond containing NV color center, thereby improving the test efficiency.

[0041] This embodiment adopts Figure 4 The mounting hole structure shown can also be selected Figure 2 The mounting hole structure shown.

[0042] To prevent the laser chip die 7 and the diamond 8 from moving on the carrier, Figure 8-Figure 9 As shown, a fixing frame 9 is provided, including a first fixing hole 91 for embedding the laser chip die 7 therein, and a second fixing hole 92 for embedding the diamond 8 therein, and the two holes are connected, and the laser is transmitted to the diamond through the connecting channel. Alternatively, the diamond 8 is bonded to the metal carrier 2 with optical glue, and only the position of the laser chip die 7 is adjusted so that the light emitted by it irradiates the diamond and meets the power supply requirements.

[0043] Embodiment 4: This embodiment is different from Embodiment 2 in that it does not include the laser chip bare die 7, but includes an optical fiber 20, one end of which extends into the interior of the hollow structure 1, with the end face facing the diamond 8 containing NV color centers to be tested, and the other end is located outside the hollow structure 1, and the end face is used to access the laser.

[0044] like Fig.10 As shown, the diamond 8 can be connected to the end face of the optical fiber facing the diamond 8, for example, by optical adhesive bonding, and the optical fiber can be inserted into any hole of the mounting hole 13 and the observation hole 17, so that its two ends are respectively located inside and outside the hollow structure 1, and the fluorescence performance is tested through the measuring hole 14; Fig.10The mounting hole 13 is selected as an example, and the optical fiber is inserted into the mounting hole 13 when the probe is not inserted into the mounting hole 13. After the laser is transmitted to the diamond 8 by the optical fiber 20, the diamond generates fluorescence, which is reflected by the inner wall of the hollow structure 1 and then measured by the measuring hole 14. The optical fiber used can be a bare optical fiber, or an optical fiber covered with a protective layer on the outside. The protective layer is preferably a white light-reflecting material to enhance the reflection of the fluorescence in the cavity and improve the test accuracy.

[0045] In order to reduce the light loss caused by the excessive gap when the optical fiber passes through the installation hole 13 or the observation hole 17, glue, such as optical glue, is applied in the gap between the optical fiber and the hole wall to seal the excess gap. The glue can also fix the optical fiber. When the optical fiber needs to be removed, an organic solvent, such as alcohol, can be used to dissolve the glue.

[0046] This embodiment adopts Figure 2 The mounting hole structure shown can also be selected Figure 4 During installation, the upper part 11 is removed, the diamond connected to one end face of the optical fiber is placed on the metal support table, the other end of the optical fiber passes through the installation hole to the outside, and then the upper part 11 and the lower part 12 are installed together. At this time, the installation method adopts a clamping method, such as clamping through a protrusion and a groove.

[0047] This embodiment uses optical fiber to access the laser, and only by adding optical fiber in the hole opened on the wall of the original hollow structure, the optical test of the photoluminescence of the diamond NV color center can be realized. It can also be selectively used with the method in the second embodiment, realizing the diversity and flexibility of the test method.

[0048] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A structure for testing the optical performance of a micro-optical device, characterized in that: The structure comprises: The hollow structure (1) comprises an upper half (11) and a lower half (12) which are detachably connected, wherein the inner wall surface of the hollow is a spherical surface made of a light-reflecting material; the upper half (11) is provided with a mounting hole (13) and a measuring hole (14), and the measuring hole (14) is used to install an instrument for performing an optical performance test; A metal support platform (2) is mounted on the inner wall of the lower half (12), with a first insulating member (121) being provided between the mounting locations of the two and used for placing the micro optical device (3) to be tested; A wire (4) is inserted from the outside of the hollow structure (1) into the inside thereof, connected to the metal support platform (2), and used to supply power to the first electrode of the micro optical device (3) through the metal support platform (2); The probe (5) is mounted in the mounting hole (13) and can abut against the second electrode of the micro-optical device (3) to supply power to the second electrode. A second insulating member (131) is provided on the hole wall of the mounting hole (13). The second insulating member (131) has a surrounding surface surrounding the circumferential side surface of the probe (5).

2. The structure for testing the optical performance of a micro-optical device according to claim 1, characterized in that: The upper half (11) is also provided with an observation hole (17) and is covered with a sealing cover (18) that can be inserted into the hole.

3. The structure for testing the optical performance of a micro-optical device according to claim 1, characterized in that: It also includes a support rod (6), one end of which is mounted on the outer wall of the lower half (12), and the other end of which is used for fixing; the end of the support rod (6) connected to the lower half (12) is provided with a hollow cavity (68), and the wire (4) passes through the hollow cavity (68) into the hollow structure (1).

4. The structure for testing the optical performance of a micro-optical device according to claim 1, characterized in that: The hollow structure (1) comprises an inner wall layer (15) and an outer wall layer (16), and the inner wall layer (15) is made of a light-reflecting material.

5. The structure for testing the optical performance of a micro-optical device according to claim 1, characterized in that: The surrounding surface of the second insulating member (131) forms an internal thread structure, the probe (5) is embedded in the hollow cavity of a hollow screw (132), and the outer surface of the screw (132) is provided with an external thread structure matching the internal thread.

6. The structure for testing the optical performance of a micro-optical device according to claim 1, characterized in that: It also includes an annular structure (133) located in the mounting hole (13); the outer wall surface of an annular third insulating member (134) is attached to the inner wall surface of the annular structure (133); the annular inner wall surface of the third insulating member (134) forms an internal thread structure; the probe (5) is embedded in the hollow cavity of a hollow screw (132); the outer surface of the screw (132) is provided with an external thread structure matching the internal thread; and it also includes a plurality of openings opened on the side wall of the mounting hole (13) and leading from the hole to the upper half (11). The annular structure (133) is provided with an external transverse hole (135), a plurality of adjustment rods (136) corresponding one to the transverse holes (135), and a fixing structure, wherein one end of each adjustment rod (136) is fixedly connected to the outer wall surface of the annular structure (133), and the other end extends from the corresponding transverse hole (135) to the outside of the upper half (11); by moving the adjustment rod (136), the annular structure (133) can be moved within the transverse plane of the mounting hole (13); and the fixing structure is used to fix the position of the adjustment rod (136).

7. The structure for testing the optical performance of a micro-optical device according to claim 1, characterized in that: The diameter of the hollow cavity of the hollow structure (1) is 1-10 cm.

8. The structure for testing the optical performance of a micro-optical device according to claim 3, characterized in that: The support rod (6) is formed by two rod sections that are detachably connected.

9. A system for testing the optical properties of diamond NV color centers, characterized in that: The system comprises: a structure for testing the optical performance of a micro-optical device according to any one of claims 1 to 8, wherein the metal support platform (2) is also used to place a diamond (8) containing NV color centers to be tested; and further comprises one of the following structures: Structure 1: also includes a laser chip bare die (7) placed on a metal carrier platform (2), and power is supplied to the laser chip bare die (7) via the metal carrier platform (2) and a probe (5); Structure 2 also includes an optical fiber (20), one end of the optical fiber (20) extends into the interior of the hollow structure (1), with the end surface facing the diamond (8) containing NV color centers to be measured, and the other end is located outside the hollow structure (1), with the end surface used for receiving laser light.

10. The system for optical property testing of diamond NV color centers according to claim 9, characterized in that: It also includes a filter (10) which is detachably mounted in the measuring hole (14).