Conductive adhesive tape, conductive adhesive tape assembly and solar cell

Abstract

This invention discloses a conductive tape, a conductive tape assembly, and a solar cell. The conductive tape includes a conductive functional layer comprising a conductive material layer and a conductive adhesive layer. The conductive adhesive layer covers all or part of the outer surface of the conductive material layer. The conductive tape also includes a surface protective layer, which does not completely cover the outer surface of the conductive functional layer. The exposed conductive adhesive layer enables bonding and electrical connection with other conductive components, facilitating rapid connection and separation of the conductive tape from other conductive components. The surface protective layer protects the covered area of ​​the conductive functional layer from corrosion or electroplating.

Description

[0001] This application claims priority to Chinese patent application No. CN2023115711486, filed on November 23, 2023, the contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to the field of electroplating technology, specifically to a conductive tape, a conductive tape assembly, and a solar cell. Background Technology

[0003] Electroplating is a mainstream technology for forming metal grid lines on solar cells. The principle involves placing an anode in the electroplating solution and connecting it to the positive terminal of the electroplating power source. The solar cell is then immersed in the solution and connected to the negative terminal of the power source, positioned near or able to move close to the anode. This creates an electric field between the anode and the solar cell, which deposits metal cations from the electroplating solution onto the solar cell, forming the metal grid lines. The solar cell in the electroplating solution is typically connected to the negative terminal of the power source via conductive connectors, such as conductive clips, conductive leads, conductive rollers, or conductive probes. During the electroplating process, the connection points between the conductive connectors and the solar cell are electroplated, and sometimes even the entire surface of the connector immersed in the solution is electroplated. This makes it easy for the solar cell and the connector to stick together after electroplating. Separating the solar cell and connector after electroplating can easily lead to the solar cell breaking. After separation, the connector needs to be de-plated to prevent it from affecting the subsequent electroplating of the solar cell.

[0004] To address this issue, the applicant has developed a conductive tape to replace existing conductive connectors. The conductive tape and the solar cell are connected flexibly or elastically, unlike existing rigid connections, which reduces the breakage rate of the solar cell. As a consumable material, the conductive tape does not require deplating after separation from the solar cell, thus saving time in the electroplating process and improving electroplating efficiency.

[0005] However, how to improve the conductivity of conductive tape, how to protect local areas on conductive tape (such as corrosion and electroplating protection), and how to balance the conductivity and protection properties of conductive tape have become new technical problems that need to be solved. Summary of the Invention

[0006] The purpose of this invention is to provide a conductive tape, a conductive tape assembly, and a solar cell to solve one or more technical problems in the background art.

[0007] A first aspect of the present invention provides a conductive tape comprising a conductive functional layer, the conductive functional layer comprising a conductive material layer and a conductive adhesive layer, the conductive adhesive layer covering all or part of the outer surface of the conductive material layer, the conductive tape further comprising a surface protective layer, the surface protective layer not completely covering the outer surface of the conductive functional layer.

[0008] In some embodiments, the surface protective layer includes a shielding layer and a bonding adhesive layer, the shielding layer being connected to the outer surface of the conductive functional layer via the bonding adhesive layer; or, the surface protective layer includes an insulating coating being connected to the outer surface of the conductive functional layer.

[0009] In some embodiments, the conductive functional layer has at least a first exposed portion and a second exposed portion, a portion of the conductive adhesive layer is exposed from the first exposed portion, and a portion of the conductive material layer or another portion of the conductive adhesive layer is exposed from the second exposed portion, wherein the first exposed portion and the second exposed portion are located at different positions along the length of the conductive tape.

[0010] In some embodiments, the conductive tape has a layered structure, the upper surface of the conductive adhesive layer is connected to the lower surface of the conductive material layer, the conductive adhesive layer covers all or part of the lower surface of the conductive material layer, and the outer surface of the conductive functional layer includes the upper surface and the lower surface of the conductive functional layer, wherein the first exposed portion is located on the lower surface of the conductive functional layer, and the second exposed portion is located on the upper surface or the lower surface of the conductive functional layer.

[0011] In some embodiments, the conductive material layer includes a conductive substrate layer, the upper surface of the conductive adhesive layer is connected to the lower surface of the conductive substrate layer, and the conductive adhesive layer covers all or part of the area on the lower surface of the conductive substrate layer;

[0012] Alternatively, the conductive material layer includes a conductive substrate layer and a conductive coating layer, wherein the conductive coating layer is applied to the lower surface of the conductive substrate layer and covers all or part of the lower surface of the conductive substrate layer; the upper surface of the conductive adhesive layer is connected to the lower surface of the conductive coating layer and covers all or part of the lower surface of the conductive coating layer.

[0013] In some embodiments, the surface protective layer includes a first protective layer disposed on the upper surface of the conductive functional layer, the first protective layer covering all or part of the upper surface of the conductive functional layer;

[0014] And / or, the surface protective layer includes a second protective layer disposed on the lower surface of the conductive functional layer, and the second protective layer does not completely cover the lower surface of the conductive adhesive layer.

[0015] In some embodiments, the conductive tape includes the first protective layer, which completely covers the upper surface of the conductive functional layer.

[0016] In some embodiments, the conductive tape further includes the second protective layer, which does not completely cover the lower surface of the conductive functional layer, and the lower surface of one or both ends of the conductive functional layer is exposed and not covered.

[0017] In some embodiments, the conductive adhesive layer covers the lower surface of one or both ends of the conductive material layer and exposes the lower surface of the middle portion of the conductive material layer, and the second protective layer covers the lower surface of the middle portion of the conductive material layer and a portion of the lower surface of the conductive adhesive layer adjacent thereto.

[0018] In some embodiments, the conductive adhesive layer covers the lower surfaces of both ends of the conductive material layer and exposes the lower surface of the middle part of the conductive material layer. The second protective layer is suspended below the lower surface of the middle part of the conductive material layer, forming a hollow area between the conductive functional layer and the second protective layer. The second protective layer covers a portion of the lower surface of the conductive adhesive layer near the hollow area.

[0019] In some embodiments, the conductive tape further includes the second protective layer, which covers the lower surface of the middle part of the conductive functional layer and exposes the lower surfaces of both ends of the conductive functional layer, and a conductive covering layer is provided on the lower surface of one end of the conductive functional layer.

[0020] In some embodiments, the conductive tape further includes the second protective layer, which does not completely cover the lower surface of the conductive functional layer, with one end of the lower surface of the conductive functional layer exposed and not covered; the second protective layer is also provided with an adhesive groove, which penetrates the second protective layer, so that a portion of the lower surface of the conductive functional layer is exposed from the adhesive groove.

[0021] In some embodiments, the conductive tape includes the first protective layer and the second protective layer, wherein the first protective layer covers the upper surface of one end of the conductive functional layer, and the upper surface of the other end of the conductive functional layer is exposed; the second protective layer covers the lower surface of the other end of the conductive functional layer, and the lower surface of one end of the conductive functional layer is exposed.

[0022] The exposed area on the lower surface of the conductive functional layer forms the first exposed portion, and the exposed area on the upper surface of the conductive functional layer forms the second exposed portion. The first exposed portion and the second exposed portion are located at opposite ends along the length of the conductive tape.

[0023] In some embodiments, the conductive tape includes the second protective layer, which does not completely cover the lower surface of the conductive functional layer, and the lower surface of one or both ends of the conductive functional layer is exposed and not covered, wherein the conductive substrate layer is a material layer of surface passivated metal.

[0024] In some embodiments, the conductive tape includes a first protective layer and a second protective layer. The first protective layer covers the upper surface of one end of the conductive functional layer, while the upper surface of the other end of the conductive functional layer is exposed and not covered, forming the second exposed portion. The second protective layer is provided with an adhesive groove that penetrates the second protective layer, such that a portion of the lower surface of the conductive functional layer is exposed from the adhesive groove, forming the first exposed portion. The first exposed portion and the second exposed portion are spaced apart along the length of the conductive tape.

[0025] In some embodiments, in the conductive functional layer, the conductive adhesive layer covers a portion of the lower surface of the conductive material layer, and a third connecting groove is provided on the conductive adhesive layer, the third connecting groove penetrating the conductive adhesive layer, such that a portion of the lower surface of the conductive material layer is exposed from the third connecting groove; the conductive tape includes the first protective layer and the second protective layer, wherein...

[0026] The first protective layer completely covers the upper surface of the conductive functional layer, or the first protective layer is provided with a first connecting groove, the first connecting groove penetrates the first protective layer, so that part of the upper surface of the conductive material layer is exposed from the first connecting groove, and the first connecting groove is located directly above the third connecting groove.

[0027] The second protective layer is provided with a second connecting groove, which penetrates the second protective layer. The second connecting groove is located directly below the third connecting groove, so that the lower surface of the conductive material layer is exposed from the third connecting groove and the second connecting groove. The second protective layer does not cover the end of the conductive functional layer away from the second connecting groove, so that the conductive functional layer at that end is exposed.

[0028] In some embodiments, a portion of the conductive adhesive layer is exposed from the first exposed portion, and another portion of the conductive adhesive layer is exposed from the second exposed portion, wherein an anti-sticking sheet is provided on the lower surface of the conductive adhesive layer exposed from the second exposed portion.

[0029] In some embodiments, the conductive tape has a layered structure, and the conductive functional layer has two sets of conductive adhesive layers, referred to as a first conductive adhesive layer and a second conductive adhesive layer, respectively. The lower surface of the first conductive adhesive layer is connected to the upper surface of the conductive material layer, and the first conductive adhesive layer covers all or part of the upper surface of the conductive material layer; the upper surface of the first conductive adhesive layer forms the upper surface of the conductive functional layer. The upper surface of the second conductive adhesive layer is connected to the lower surface of the conductive material layer, and the second conductive adhesive layer covers all or part of the lower surface of the conductive material layer; the lower surface of the second conductive adhesive layer forms the lower surface of the conductive functional layer.

[0030] The surface protective layer includes a first protective layer, which is disposed on the upper surface of the conductive functional layer, and the first protective layer does not completely cover the upper surface of the first conductive adhesive layer.

[0031] And / or, the surface protective layer includes a second protective layer disposed on the lower surface of the conductive functional layer, and the second protective layer does not completely cover the lower surface of the second conductive adhesive layer.

[0032] In some embodiments, the length of the first exposed portion is a, the length of the second exposed portion is b, and the length of the conductive tape is L, wherein 0.05L≤a≤0.2L, 0.05L≤b≤0.4L, and 0.1L≤a+b≤0.6L.

[0033] In some embodiments, the first exposed portion is the lower surface of one end of the conductive functional layer, and the second exposed portion is the lower surface of the other end of the conductive functional layer;

[0034] Alternatively, the first exposed portion is the lower surface of one end of the conductive functional layer, and the second exposed portion is the upper surface of the other end of the conductive functional layer;

[0035] Alternatively, the first exposed portion is an adhesive groove connected to the lower surface of the conductive functional layer, and the second exposed portion is the lower surface of the conductive functional layer away from the adhesive groove.

[0036] In some embodiments, the first exposed portion is a portion of the lower surface of the conductive functional layer, and the second exposed portion is another portion of the lower surface of the conductive functional layer; the conductive tape also has a third exposed portion, a portion of the upper surface of the conductive functional layer is exposed from the third exposed portion, and the third exposed portion is located directly above the second exposed portion;

[0037] Alternatively, the first exposed portion is a portion of the lower surface of the conductive functional layer, and the second exposed portion is a portion of the upper surface of the conductive functional layer; the conductive functional layer also has a third exposed portion, from which another portion of the lower surface of the conductive functional layer is exposed, and the third exposed portion is located directly below the second exposed portion.

[0038] In some embodiments, the conductive tape is cylindrical or prismatic, the conductive adhesive layer covers the periphery of the conductive material layer, and the surface protective layer is a third protective layer covering the periphery of the conductive functional layer, wherein the third protective layer only covers the middle section of the conductive functional layer and exposes both ends of the conductive functional layer.

[0039] In some embodiments, the conductive adhesive layer includes an adhesive and a conductive filler. The adhesive includes epoxy resin, phenolic resin, polyimide, acrylic resin, or polyurethane. The conductive filler includes carbon, metal, or metal oxide, wherein the metal includes at least Au, Ag, Cu, or Ni.

[0040] In some embodiments, the conductive adhesive layer further includes one or more of a curing agent, a diluent, a plasticizer, a coupling agent, and a defoamer; wherein the plasticizer includes at least di-n-octyl phthalate or di-n-butyl phthalate.

[0041] A second aspect of the present invention provides a conductive tape assembly comprising a conductive tape as described above and a base film, wherein the conductive tape is adhered to the base film.

[0042] A third aspect of the present invention provides a solar cell on which the conductive tape described above is adhered.

[0043] Due to the application of the above technical solutions, the embodiments of the present invention have the following advantages compared with the prior art: the conductive tape in this embodiment achieves bonding and electrical connection with other conductive components through the exposed conductive adhesive layer, which facilitates the rapid connection and separation of the conductive tape with other conductive components. Under the protection of the surface protective layer, the covered area of ​​the conductive functional layer can be prevented from being corroded or electroplated. Attached Figure Description

[0044] Appendix Figure 1 This is a schematic diagram of the first structure of the conductive tape in Example 1;

[0045] Appendix Figure 2 This is a schematic diagram of the second structure of the conductive tape in Example 1;

[0046] Appendix Figure 3 This is a schematic diagram of the third structure of the conductive tape in Example 1;

[0047] Appendix Figure 4 This is a schematic diagram of the fourth structure of the conductive tape in Example 1;

[0048] Appendix Figure 5 This is a schematic diagram of the fifth structure of the conductive tape in Example 1;

[0049] Appendix Figure 6 This is a schematic diagram of the sixth structure of the conductive tape in Example 1;

[0050] Appendix Figure 7 This is a schematic diagram of the seventh structure of the conductive tape in Example 1;

[0051] Appendix Figure 8 This is a schematic diagram of the first structure of the conductive tape in Example 2;

[0052] Appendix Figure 9 This is a schematic diagram of the second structure of the conductive tape in Example 2;

[0053] Appendix Figure 10 This is a schematic diagram of the third structure of the conductive tape in Example 2;

[0054] Appendix Figure 11 This is a schematic diagram of the fourth structure of the conductive tape in Example 2;

[0055] Appendix Figure 12 This is a schematic diagram of the fifth structure of the conductive tape in Example 2;

[0056] Appendix Figure 13 This is a schematic diagram of the sixth structure of the conductive tape in Example 2;

[0057] Appendix Figure 14 This is a schematic diagram of the first structure of the conductive tape in Example 3;

[0058] Appendix Figure 15 This is a schematic diagram of the second structure of the conductive tape in Example 3;

[0059] Appendix Figure 16 This is a schematic diagram of the third structure of the conductive tape in Example 3;

[0060] Appendix Figure 17 This is a schematic diagram of the fourth structure of the conductive tape in Example 3;

[0061] Appendix Figure 18 This is a schematic diagram of the fifth structure of the conductive tape in Example 3;

[0062] Appendix Figure 19 This is a schematic diagram of the sixth structure of the conductive tape in Example 3;

[0063] Appendix Figure 20 This is a schematic diagram of the seventh structure of the conductive tape in Example 3;

[0064] Appendix Figure 21 This is a schematic diagram of the eighth structure of the conductive tape in Example 3;

[0065] Appendix Figure 22 This is a schematic diagram of the first structure of the conductive tape in Example 4;

[0066] Appendix Figure 23 This is a schematic diagram of the second structure of the conductive tape in Example 4;

[0067] Appendix Figure 24 This is a schematic diagram of the third structure of the conductive tape in Example 4;

[0068] Appendix Figure 25 This is a schematic diagram of the first structure of the conductive tape in Example 5;

[0069] Appendix Figure 26 This is a schematic diagram of the second structure of the conductive tape in Example 5;

[0070] Appendix Figure 27 This is a schematic diagram of the third structure of the conductive tape in Example 5;

[0071] Appendix Figure 28 This is a schematic diagram of the first structure of the conductive tape in Example 6;

[0072] Appendix Figure 29 This is a schematic diagram of the second structure of the conductive tape in Example 6;

[0073] Appendix Figure 30 This is a schematic diagram of the third structure of the conductive tape in Example 6;

[0074] Appendix Figure 31 This is a schematic diagram of the fourth structure of the conductive tape in Example 6;

[0075] Appendix Figure 32 This is a schematic diagram of the fifth structure of the conductive tape in Example 6;

[0076] Appendix Figure 33 This is a schematic diagram of the sixth structure of the conductive tape in Example 6;

[0077] Appendix Figure 34 This is a schematic diagram of the first structure of the conductive tape in Example 7;

[0078] Appendix Figure 35 This is a schematic diagram of the second structure of the conductive tape in Example 7;

[0079] Appendix Figure 36 This is a schematic diagram of the third structure of the conductive tape in Example 7;

[0080] Appendix Figure 37This is a schematic diagram of the fourth structure of the conductive tape in Example 7;

[0081] Appendix Figure 38 This is a schematic diagram of the fifth structure of the conductive tape in Example 7;

[0082] Appendix Figure 39 This is a schematic diagram of the sixth structure of the conductive tape in Example 7;

[0083] Appendix Figure 40 This is a schematic diagram of the seventh structure of the conductive tape in Example 7;

[0084] Appendix Figure 41 This is a schematic diagram of the first structure of the conductive tape in Example 8;

[0085] Appendix Figure 42 This is a schematic diagram of the second structure of the conductive tape in Example 8;

[0086] Appendix Figure 43 This is a schematic diagram of the third structure of the conductive tape in Example 8;

[0087] Appendix Figure 44 This is a schematic diagram of the fourth structure of the conductive tape in Example 8;

[0088] Appendix Figure 45 This is a schematic diagram of the fifth structure of the conductive tape in Example 8;

[0089] Appendix Figure 46 This is a schematic diagram of the sixth structure of the conductive tape in Example 8;

[0090] Appendix Figure 47 This is a schematic diagram of the first structure of the conductive tape in Example 9;

[0091] Appendix Figure 48 This is a schematic diagram showing the placement of the anti-sticking sheet in Example 9;

[0092] Appendix Figure 49 This is a schematic diagram of the second structure of the conductive tape in Example 9;

[0093] Appendix Figure 50 This is a schematic diagram of the third structure of the conductive tape in Example 9;

[0094] Appendix Figure 51 This is a schematic diagram of the first structure of the conductive tape in Example 10;

[0095] Appendix Figure 52 This is a schematic diagram of the second structure of the conductive tape in Example 10;

[0096] Appendix Figure 53 This is a schematic diagram of the third structure of the conductive tape in Example 10;

[0097] Appendix Figure 54 This is a schematic diagram of the fourth structure of the conductive tape in Example 10;

[0098] Appendix Figure 55 This is a schematic diagram of the fifth structure of the conductive tape in Example 10;

[0099] Appendix Figure 56 This is a schematic diagram of the sixth structure of the conductive tape in Example 10;

[0100] Appendix Figure 57 This is a cross-sectional schematic diagram of the first structure of the conductive tape in Example 11;

[0101] Appendix Figure 58 This is a left-side view of the first structure of the conductive tape in Example 11;

[0102] Appendix Figure 59 This is a left-side schematic diagram of the first structural deformation of the conductive tape in Example 11;

[0103] Appendix Figure 60 This is a cross-sectional schematic diagram of the second structure of the conductive tape in Example 11;

[0104] Appendix Figure 61 This is a left-side view of the second structure of the conductive tape in Example 11;

[0105] Appendix Figure 62 This is a cross-sectional schematic diagram of the third structure of the conductive tape in Example 11;

[0106] Appendix Figure 63 This is a left-side view of the third structure of the conductive tape in Example 11;

[0107] Appendix Figure 64 This is a schematic diagram of the first structure of the conductive tape in Example 12;

[0108] Appendix Figure 65 This is a schematic diagram of the second structure of the conductive tape in Example 12;

[0109] Appendix Figure 66 This is a schematic diagram of the third structure of the conductive tape in Example 12;

[0110] Appendix Figure 67 This is a schematic diagram of the first structure of the conductive tape assembly in Example 14;

[0111] Appendix Figure 68 This is a schematic diagram of the second structure of the conductive tape assembly in Example 14;

[0112] Appendix Figure 69 This is a schematic diagram of the first arrangement structure of conductive tape on the base film in Example 14;

[0113] Appendix Figure 70 This is a schematic diagram of the second arrangement structure of conductive tape on the base film in Example 14;

[0114] Appendix Figure 71 This is a schematic diagram of the third arrangement structure of conductive tape on the base film in Example 14;

[0115] Appendix Figure 72 This is a schematic diagram of the first structure of the solar cell with conductive tape in Example 15;

[0116] Appendix Figure 73 This is a schematic diagram of the second structure of the solar cell with conductive tape in Example 15;

[0117] In the attached diagrams above:

[0118] 1-Conductive tape;

[0119] 10-Conductive functional layer, 11-Conductive substrate layer, 12-Conductive adhesive layer, 12a-Kull-out area, 12b-Third connecting groove, 13-Conductive coating;

[0120] 20-First protective layer, 20b-First connecting groove, 21-First shielding layer, 22-First connecting adhesive layer, 23-First insulating coating;

[0121] 30-Second protective layer, 30a-Exposed adhesive groove, 30b-Second connecting groove, 31-Second shielding layer, 32-Second connecting adhesive layer, 33-Second insulating coating;

[0122] 40 - Conductive coating;

[0123] 50 - Base film, 51 - Third adhesive layer;

[0124] 60-Anti-sticking sheet;

[0125] 70 - Third protective layer, 71 - Third shielding layer, 72 - Third adhesive layer, 73 - Third insulating coating;

[0126] 2-Solar cell, 2a-Conductive connection. Detailed Implementation

[0127] This invention provides a conductive tape, comprising a conductive functional layer 10, which includes a conductive material layer and a conductive adhesive layer 12. The conductive adhesive layer 12 covers all or part of the outer surface of the conductive material layer. The conductive tape also includes a surface protective layer, which does not completely cover the outer surface of the conductive functional layer 10, leaving a portion of the conductive functional layer 10 exposed for bonding and electrical connection with other conductive components. This facilitates quick connection and separation of the conductive tape from other conductive components; simultaneously, it prevents corrosion or electroplating of the area of ​​the conductive functional layer 10 covered by the surface protective layer.

[0128] Specifically, the conductive functional layer 10 has at least a first exposed portion and a second exposed portion. A portion of the conductive adhesive layer 12 is exposed from the first exposed portion, and a portion of the conductive material layer or another portion of the conductive adhesive layer 12 is exposed from the second exposed portion. The first exposed portion and the second exposed portion are located at different positions along the length of the conductive adhesive tape. The first exposed portion is used to bond the electroplating area on the solar cell 2, and the second exposed portion is used to bond or connect other conductive components.

[0129] In some conductive tapes, the surface protective layer specifically includes a masking layer and a connecting adhesive layer. The masking layer is connected to the outer surface of the conductive functional layer 10 via the connecting adhesive layer, allowing the masking layer to adhere well to the outer surface of the conductive functional layer 10 and preventing it from easily detaching. In particular, when the surface protective layer is connected to the outer surface of the conductive adhesive layer 12, if the connecting adhesive layer is not provided and the masking layer is directly placed on the outer surface of the conductive adhesive layer 12, that is, the masking layer adheres to the conductive adhesive layer 12 through its adhesiveness, however, the adhesiveness and conductivity of the conductive adhesive layer 12 are negatively correlated. In order to balance the conductivity and adhesiveness of the conductive adhesive layer 12, the adhesiveness of the conductive adhesive layer 12 cannot be too strong. If the masking layer is directly placed on the outer surface of the conductive adhesive layer 12, the masking layer is prone to detachment during subsequent use. However, the masking layer is connected to the outer surface of the conductive adhesive layer 12 via the connecting adhesive layer, which can improve the adhesion between the masking layer and the conductive adhesive layer 12, thereby reducing the risk of the masking layer detaching. In some other conductive tapes, the surface protective layer may be an insulating coating that is attached to the outer surface of the conductive functional layer 10.

[0130] According to some embodiments of the present invention, the conductive tape has a layered structure. In the conductive functional layer 10, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive material layer, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive material layer; the lower surface of the conductive adhesive layer 12 is formed as the lower surface of the conductive functional layer 10, such as... Figures 1 to 50 In the illustrated embodiment; in some other embodiments, conductive adhesive layers 12 are provided on both the upper and lower surfaces of the conductive material layer, such as... Figures 51 to 56 The example shown.

[0131] When the conductive tape has a layered structure, the surface protective layer includes a first protective layer 20 and / or a second protective layer 30. The first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and the second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. When the second protective layer 30 is disposed on the lower surface of the conductive adhesive layer 12, the second protective layer 30 does not completely cover the lower surface of the conductive adhesive layer 12. In this embodiment, the conductive tape achieves bonding and electrical connection with other conductive components through the exposed conductive adhesive layer 12, facilitating rapid connection and separation of the conductive tape from other conductive components. Under the protection of the first protective layer 20 and / or the second protective layer 30, corrosion or electroplating of the covered area of ​​the conductive functional layer 10 can be avoided.

[0132] In some conductive tapes, the conductive material layer may consist only of a conductive substrate layer 11, meaning the conductive functional layer 10 consists only of a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive substrate layer 11. In other conductive tapes, the conductive material layer may include a conductive substrate layer 11 and a conductive coating layer 13, meaning the conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive substrate layer 11, covering all or part of the lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating layer 13.

[0133] In other embodiments of the present invention, the conductive tape is cylindrical or prismatic, the conductive adhesive layer 12 covers the periphery of the conductive material layer, and the surface protective layer is a third protective layer covering the periphery of the conductive functional layer 10. This third protective layer only covers the middle section of the conductive functional layer 10, leaving both ends of the conductive functional layer 10 exposed. Figures 57 to 63 The example shown.

[0134] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art. It should be noted that the description of these embodiments is for the purpose of aiding understanding the present invention, but does not constitute a limitation thereof. The embodiments described below are not merely one embodiment, but a collection of embodiments with similar schemes or features.

[0135] It should be noted that in this article, the terms "upper" and "lower" are defined based on the thickness direction of the conductive tape when the conductive tape has a layered structure. Figures 1 to 47 , Figures 49 to 56The directions shown; the terms "left" and "right" correspond to the length extension direction of the conductive tape, which are also... Figures 1 to 47 , Figures 49 to 57 , Figure 60 , Figure 62 , Figures 64 to 68 The left and right directions are shown above. The above orientations and positional relationships are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0136] Example 1

[0137] like Figures 1-7 The conductive tape shown includes a conductive functional layer 10 and a first protective layer 20 disposed on the upper surface of the conductive functional layer 10.

[0138] In some conductive tapes, the conductive functional layer 10 includes at least a conductive substrate layer 11 and a conductive adhesive layer 12. The conductive substrate layer 11 forms a conductive material layer, and the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive substrate layer 11. When the conductive adhesive layer 12 only covers a part of the lower surface of the conductive substrate layer 11, it may be that the conductive adhesive layer 12 only covers the lower surface of one end of the conductive substrate layer 11, or the conductive adhesive layer 12 does not cover the lower surface of the other end of the conductive substrate layer 11.

[0139] In some other conductive tapes, to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is also provided between the conductive substrate layer 11 and the conductive adhesive layer 12. The conductive coating 13 improves the conductivity of the conductive functional layer 10. The conductive substrate layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers all or part of the lower surface of the conductive substrate layer 11, and the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0140] The first protective layer 20 is connected to the upper surface of the conductive functional layer 10. The first protective layer 20 completely covers the upper surface of the conductive functional layer 10 to prevent the upper surface of the conductive functional layer 10 from being corroded or electroplated.

[0141] In this embodiment, the first structure of the conductive tape is as follows: Figure 1As shown, the conductive tape includes a conductive functional layer 10, and a first protective layer 20 is disposed on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire area of ​​the lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. In this first structure, the surface protective layer only includes the first protective layer 20, and the lower surface of the conductive adhesive layer 12 is completely exposed, with a portion forming a first exposed portion and another portion forming a second exposed portion. The second structure of the conductive tape in this embodiment is as follows. Figure 2 As shown, the conductive tape includes a conductive functional layer 10, and a first protective layer 20 is disposed on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the lower surface of the conductive substrate layer 11 and exposes the lower surface of the right end of the conductive substrate layer 11. For example, part or all of the area of ​​the conductive adhesive layer 12 covering the lower surface of the conductive substrate layer 11 forms a first exposed portion, which is adhered to the area to be electroplated on the solar cell. The exposed right end of the conductive substrate layer 11 forms a second exposed portion, which is connected to the conductive clip, so that the current used for electroplating the solar cell can flow sequentially through the conductive clip and the conductive tape to the area to be electroplated on the solar cell. The lower surface of the right end of the conductive substrate layer 11 is not provided with the conductive adhesive layer 12, which can prevent the lower surface of the right end of the conductive tape from adhering to the conductive clip and being unable to be separated. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated.

[0142] The third structure of the conductive tape in this embodiment is as follows: Figure 3As shown, the conductive tape includes a conductive functional layer 10, and a first protective layer 20 is disposed on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is coated on the lower surface of the conductive substrate layer 11 and together with the conductive substrate layer 11 forms a conductive material layer, covering the entire lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers the entire area of ​​the lower surface of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. In this third structure, the surface protective layer only includes the first protective layer 20, and the lower surface of the conductive adhesive layer 12 is completely exposed, with a portion forming the first exposed portion and another portion forming the second exposed portion.

[0143] The fourth structure of the conductive tape in this embodiment is as follows: Figure 4 As shown, the conductive tape includes a conductive functional layer 10, and a first protective layer 20 is disposed on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is coated on the lower surface of the conductive substrate layer 11, covering the entire lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the lower surface of the conductive coating layer 13 and exposing the lower surface of the right end of the conductive coating layer 13. For example, the conductive adhesive layer 12 covering the lower surface of the conductive coating layer 13 is bonded to the electroplating area on the solar cell, and the exposed right end of the conductive coating layer 13 is connected to a conductive clip, so that the current used for electroplating the solar cell can flow sequentially through the conductive clip and the conductive tape to the electroplating area on the solar cell. The lower surface of the right end of the conductive coating layer 13 is not provided with the conductive adhesive layer 12, which can prevent the lower surface of the right end of the conductive tape from sticking to the conductive clip and being unable to separate. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated.

[0144] The fifth structure of the conductive tape in this embodiment is as follows: Figure 5As shown, the conductive tape includes a conductive functional layer 10, and a first protective layer 20 is disposed on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive substrate layer 11, covering the lower surface of the conductive substrate layer 11 and exposing the lower surface of the right end of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers the entire area of ​​the lower surface of the conductive coating layer 13, keeping the lower surface of the right end of the conductive substrate layer 11 exposed. For example, the conductive adhesive layer 12 covering the lower surface of the conductive coating 13 is bonded to the electroplating area on the solar cell. The right end of the exposed conductive substrate layer 11 is connected to the conductive clip, so that the current used for electroplating the solar cell can flow sequentially through the conductive clip and the conductive tape to the electroplating area on the solar cell. The lower surface of the right end of the conductive substrate layer 11 is not provided with the conductive coating 13 and the conductive adhesive layer 12, which can prevent the lower surface of the right end of the conductive tape from sticking to the conductive clip and being unable to separate. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated.

[0145] The sixth structure of the conductive tape in this embodiment is as follows: Figure 6 As shown, the conductive tape includes a conductive functional layer 10, and a first protective layer 20 is disposed on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire area of ​​the lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first insulating coating 23, which completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated.

[0146] The seventh structure of the conductive tape in this embodiment is as follows: Figure 7As shown, the conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the lower surface of the conductive substrate layer 11 and exposes the lower surface of the right end of the conductive substrate layer 11. For example, the conductive adhesive layer 12 covering the lower surface of the conductive substrate layer 11 is bonded to the electroplating area on the solar cell. The exposed right end of the conductive substrate layer 11 is connected to a conductive clip, allowing the current used for electroplating the solar cell to flow sequentially through the conductive clip and the conductive adhesive tape to the electroplating area on the solar cell. The lower surface of the right end of the conductive substrate layer 11 is not provided with the conductive adhesive layer 12, which prevents the lower surface of the right end of the conductive adhesive tape from adhering to the conductive clip and becoming inseparable. The first protective layer 20 includes a first insulating coating 23, which completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated.

[0147] Example 2

[0148] like Figures 8-13 The conductive tape shown includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10.

[0149] In some conductive tapes, the conductive functional layer 10 includes at least a conductive substrate layer 11 and a conductive adhesive layer 12. The conductive substrate layer 11 forms a conductive material layer, and the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive substrate layer 11. When the conductive adhesive layer 12 only covers a part of the lower surface of the conductive substrate layer 11, it may be that the conductive adhesive layer 12 only covers the lower surface of one end of the conductive substrate layer 11, or the conductive adhesive layer 12 does not cover the lower surface of the other end of the conductive substrate layer 11.

[0150] In some other conductive tapes, to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is also provided between the conductive substrate layer 11 and the conductive adhesive layer 12. The conductive coating 13 improves the conductivity of the conductive functional layer 10. The conductive substrate layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers all or part of the lower surface of the conductive substrate layer 11, and the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0151] The first protective layer 20 is connected to the upper surface of the conductive functional layer 10, completely covering the upper surface of the conductive functional layer 10 to prevent corrosion or electroplating. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10, not completely covering it. The lower surface in the middle of the conductive functional layer 10 is covered, while the lower surfaces at both ends of the conductive functional layer 10 are exposed. The covered areas of the lower surface of the conductive functional layer 10 are protected from corrosion or electroplating, while the exposed areas can be used for conductive connections to other conductive components. At least one of the lower surfaces at the left and right ends of the conductive functional layer 10 is formed by the lower surface of the conductive tape 12, allowing one end of the conductive tape to be adhered to the electroplating area on the solar cell.

[0152] In this embodiment, the first structure of the conductive tape is as follows: Figure 8 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire area of ​​the lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12; the lower surfaces at both ends of the conductive adhesive layer 12 are exposed and not covered, forming a first exposed portion and a second exposed portion, respectively. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. In this embodiment, the second structure of the conductive tape is as follows... Figure 9As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers a portion of the lower surface of the conductive substrate layer 11, with the conductive adhesive layer 12 covering the lower surface of the conductive substrate layer 11 and exposing the lower surface of the right end of the conductive substrate layer 11. For example, a conductive adhesive layer 12 covering the lower surface of the conductive substrate layer 11 forms a first exposed portion, which is used to adhere to the electroplating area on the solar cell. The exposed right end of the conductive substrate layer 11 forms a second exposed portion, which is used to connect to the conductive clip, so that the current for electroplating the solar cell can flow sequentially through the conductive clip and the conductive tape to the electroplating area on the solar cell. The lower surface of the right end of the conductive substrate layer 11 is not provided with a conductive adhesive layer 12, which can prevent the lower surface of the right end of the conductive tape from adhering to the conductive clip and being unable to separate. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the left end of the conductive adhesive layer 12 is exposed and not covered. The area of ​​the lower surface of the conductive adhesive layer 12 that is covered can be prevented from being corroded or electroplated. The area of ​​the lower surface of the conductive adhesive layer 12 that is exposed can be used to conductively connect other conductive components.

[0153] The third structure of the conductive tape in this embodiment is as follows: Figure 10As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive substrate layer 11 and together with the conductive substrate layer 11 forms a conductive material layer, covering the entire lower surface of the conductive substrate layer 11 (i.e., the entire area on the lower surface). The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the entire lower surface of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22, completely covering the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surfaces at both ends of the conductive adhesive layer 12 are exposed and not covered, forming a first exposed portion and a second exposed portion, respectively. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0154] The fourth structure of the conductive tape in this embodiment is as follows: Figure 11As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive substrate layer 11 and together with the conductive substrate layer 11 forms a conductive material layer. The conductive coating layer 13 covers the entire lower surface of the conductive substrate layer 11 (i.e., the entire area on the lower surface). The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13. The conductive adhesive layer 12 covers a portion of the lower surface of the conductive coating layer 13 and exposes the lower surface of the right end of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12; the lower surface at the left end of the conductive adhesive layer 12 is exposed and not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0155] Based on the first to fourth structures described above, alternatively, the second shielding layer 31 can be directly disposed on the lower surface of the conductive adhesive layer 12. That is, the second shielding layer 31 adheres to the conductive adhesive layer 12 through its adhesiveness. However, the adhesiveness and conductivity of the conductive adhesive layer 12 are negatively correlated. To balance the conductivity and adhesiveness of the conductive adhesive layer 12, its adhesiveness cannot be too strong. If the second shielding layer 31 is directly disposed on the lower surface of the conductive adhesive layer 12, it is prone to detachment during subsequent use. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second connecting adhesive layer 32 can improve the adhesion between the second shielding layer 31 and the conductive adhesive layer 12, thereby reducing the risk of the second shielding layer 31 detaching. The fifth structure of the conductive tape in this embodiment is as follows: Figure 12As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first insulating coating 23, which completely covers the upper surface of the conductive substrate layer 11 to prevent corrosion or electroplating. The second protective layer 30 includes a second insulating coating 33, which covers the lower surface of the conductive adhesive layer 12 and exposes the lower surfaces at both ends of the conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area can be used for conductive connection to other conductive components.

[0156] The sixth structure of the conductive tape in this embodiment is as follows: Figure 13 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the lower surface of the conductive substrate layer 11 and exposes the lower surface of the right end of the conductive substrate layer 11. The lower surface of the right end of the conductive substrate layer 11 can be used for conductive connection to other conductive components. The first protective layer 20 includes a first insulating coating 23, which completely covers the upper surface of the conductive substrate layer 11 to prevent the upper surface of the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second insulating coating 33, which covers the lower surface of the conductive adhesive layer 12 and exposes the lower surface of the left end of the conductive adhesive layer 12, while keeping the lower surface of the right end of the conductive substrate layer 11 exposed. The area covered by the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0157] Example 3

[0158] like Figures 14-21 The conductive tape shown includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10.

[0159] In some conductive tapes, the conductive functional layer 10 includes at least a conductive substrate layer 11 and a conductive adhesive layer 12. The conductive substrate layer 11 forms a conductive material layer, and the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11. The conductive adhesive layer 12 covers a portion of the lower surface of the conductive substrate layer 11. Specifically, the conductive adhesive layer 12 covers the lower surface of one or both ends of the conductive substrate layer 11, exposing the lower surface of the middle part of the conductive substrate layer 11.

[0160] In some other conductive tapes, to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is also provided between the conductive substrate layer 11 and the conductive adhesive layer 12. The conductive coating 13 improves the conductivity of the conductive functional layer 10. The conductive substrate layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers all or part of the lower surface of the conductive substrate layer 11, and the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0161] The first protective layer 20 completely covers the upper surface of the conductive functional layer 10 to prevent the conductive functional layer 10 from being corroded or electroplated. The second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10, with the lower surfaces at both ends of the conductive functional layer 10 exposed. Optionally, the second protective layer 30 covers the lower surface of the middle part of the conductive material layer and a portion of the lower surface of the adjacent conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive functional layer 10 can be prevented from being corroded or electroplated, while the exposed area of ​​the lower surface of the conductive functional layer 10 can be used for conductive connection to other conductive components. Optionally, the conductive adhesive layer 12 covers the lower surfaces at both ends of the conductive material layer, exposing the lower surface of the middle part of the conductive material layer. The second protective layer 30 is suspended below the lower surface of the middle part of the conductive material layer, forming a hollow area 12a. The second protective layer 30 covers a portion of the conductive adhesive layer 12 near the hollow area 12a. In this embodiment, the conductive adhesive layer 12 is not provided on the lower surface of the middle part of the conductive material layer, which can reduce the amount of conductive adhesive layer 12 used, thereby reducing the overall cost of the conductive tape.

[0162] In this embodiment, the first structure of the conductive tape is as follows: Figure 14As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the lower surfaces of the left and right ends of the conductive substrate layer 11, exposing the lower surface of the middle part of the conductive substrate layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive functional layer 10 through the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the middle part of the conductive substrate layer 11 and a portion of the lower surface of the conductive adhesive layers 12 adjacent to it on the left and right sides. This can prevent the covered area from being corroded or electroplated. The exposed areas of the lower surfaces of the conductive adhesive layers 12 at both ends form the first exposed portion and the second exposed portion, which can be used for conductive connection to other conductive components.

[0163] In this embodiment, the second structure of the conductive tape is as follows: Figure 15 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11. The conductive adhesive layer 12 covers the lower surface of the left end of the conductive substrate layer 11, exposing the lower surface of the middle part and the lower surface of the right end of the conductive substrate layer 11. The lower surface of the right end of the conductive substrate layer 11 forms a second exposed portion, which can be used for conductive connection to other conductive components. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive functional layer 10 through the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the middle part of the conductive substrate layer 11 and part of the lower surface of the conductive adhesive layer 12 adjacent to it on the left, which can prevent the covered area from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 forms the first exposed part, which can be used to conductively connect other conductive components.

[0164] The third structure of the conductive tape in this embodiment is as follows: Figure 16As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive substrate layer 11 and together with the conductive substrate layer 11 forms a conductive material layer, covering the entire lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the lower surfaces of the left and right ends of the conductive coating layer 13, exposing the lower surface of the middle part of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22, completely covering the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive functional layer 10 through the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the middle part of the conductive coating 13 and a portion of the lower surface of the conductive adhesive layer 12 adjacent to it on the left and right sides, which can prevent the covered area from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0165] The fourth structure of the conductive tape in this embodiment is as follows: Figure 17As shown, the conductive tape includes a conductive functional layer 10. A first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive substrate layer 11, covering the entire lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the lower surface of the left end of the conductive coating layer 13, exposing the lower surface of the middle part and the lower surface of the right end of the conductive coating layer 13. The lower surface of the right end of the conductive coating layer 13 can be used for conductive connection to other conductive components. The first protective layer 20 includes a first shielding layer 21 and a first adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive functional layer 10 through the second adhesive layer 32. The second shielding layer 31 covers the lower surface of the middle part of the conductive coating layer 13 and part of the lower surface of the conductive adhesive layer 12 adjacent to it on the left, which can prevent the covered area from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0166] The fifth structure of the conductive tape in this embodiment is as follows: Figure 18 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the lower surfaces of the left and right ends of the conductive substrate layer 11, exposing the lower surface of the middle portion of the conductive substrate layer 11. The first protective layer 20 includes a first insulating coating 23, which completely covers the upper surface of the conductive substrate layer 11 to prevent corrosion or electroplating of the conductive substrate layer 11. The second protective layer 30 includes a second insulating coating 33, which covers the lower surface of the middle portion of the conductive substrate layer 11 and portions of the lower surfaces of the conductive adhesive layers 12 adjacent to it on the left and right sides, preventing corrosion or electroplating of the covered area. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0167] The sixth structure of the conductive tape in this embodiment is as follows: Figure 19As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the lower surfaces of the left and right ends of the conductive substrate layer 11, exposing the lower surface of the middle part of the conductive substrate layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second protective layer 30 (second shielding layer 31 and second connecting adhesive layer 32) is suspended below the lower surface of the middle part of the conductive substrate layer 11. A hollow area 12a is formed between the second protective layer 30 and the conductive functional layer 10. The second protective layer 30 covers the portion of the conductive adhesive layer 12 near the hollow area 12a, which can prevent the covered area from being corroded or electroplated. The exposed areas on the lower surfaces of the conductive adhesive layers 12 at both ends form a first exposed part and a second exposed part, which can be used for conductive connection to other conductive components.

[0168] The seventh structure of the conductive tape in this embodiment is as follows: Figure 20 As shown, the conductive tape includes a conductive functional layer 10. A first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive substrate layer 11, covering the entire lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the lower surfaces of the left and right ends of the conductive coating layer 13, exposing the lower surface of the middle part of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32) is suspended below the lower surface of the middle part of the conductive coating layer 13. A hollow area 12a is formed between the second protective layer 30 and the conductive functional layer 10. The second protective layer 30 covers a portion of the conductive adhesive layer 12 near the hollow area 12a, which can prevent the covered area from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0169] The eighth structure of the conductive tape in this embodiment is as follows: Figure 21 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the lower surfaces of the left and right ends of the conductive substrate layer 11, exposing the lower surface of the middle part of the conductive substrate layer 11. The first protective layer 20 includes a first insulating coating 23, which completely covers the upper surface of the conductive substrate layer 11 to prevent the upper surface of the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second insulating coating 33. The second protective layer 30 (second insulating coating 33) is suspended below the lower surface of the middle part of the conductive substrate layer 11. A hollow area 12a is formed between the second protective layer 30 and the conductive functional layer 10. The second protective layer 30 covers a portion of the conductive adhesive layer 12 near the hollow area 12a, which can prevent the covered area from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0170] Example 4

[0171] like Figures 22-24 The conductive tape shown includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10.

[0172] The conductive functional layer 10 includes at least a conductive substrate layer 11 and a conductive adhesive layer 12. The conductive substrate layer 11 forms a conductive material layer, and the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive substrate layer 11. When the conductive adhesive layer 12 only covers a part of the lower surface of the conductive substrate layer 11, it may be that the conductive adhesive layer 12 only covers the lower surface of one end of the conductive substrate layer 11, or the conductive adhesive layer 12 does not cover the lower surface of the other end of the conductive substrate layer 11.

[0173] To improve the conductivity of the conductive functional layer 10, a conductive coating layer 13 is provided between the conductive substrate layer 11 and the conductive adhesive layer 12. The conductive coating layer 13 enhances the conductivity of the conductive functional layer 10. The conductive substrate layer 11 and the conductive coating layer 13 together constitute a conductive material layer. The conductive coating layer 13 covers all or part of the lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating layer 13.

[0174] The first protective layer 20 is connected to the upper surface of the conductive functional layer 10, covering the upper surface of the left end of the conductive functional layer 10. The covered area of ​​the upper surface of the conductive functional layer 10 is protected from corrosion or electroplating. The exposed area of ​​the upper surface of the conductive functional layer 10 forms a second exposed portion, which can be used for conductive connection to other conductive components. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10, covering the lower surface of the right end of the conductive functional layer 10. The covered area of ​​the lower surface of the conductive functional layer 10 is protected from corrosion or electroplating. The exposed area of ​​the lower surface of the conductive functional layer 10 forms a first exposed portion, which can be used for conductive connection to other conductive components. In this configuration, the area of ​​the upper surface of the conductive functional layer 10 covered by the first protective layer 20 is larger than the area of ​​its uncovered area, and the area of ​​the lower surface of the conductive functional layer 10 covered by the second protective layer 30 is larger than the area of ​​its uncovered area.

[0175] In this embodiment, the first structure of the conductive tape is as follows: Figure 22 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire area of ​​the lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 covers the upper surface of the left end of the conductive substrate layer 11. The area of ​​the upper surface of the conductive substrate layer 11 covered can be prevented from being corroded or electroplated, and the exposed area of ​​the upper surface of the conductive substrate layer 11 can be used for conductive connection to other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the right end of the conductive adhesive layer 12. The area of ​​the lower surface of the conductive adhesive layer 12 that is covered can be prevented from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0176] In this embodiment, the second structure of the conductive tape is as follows: Figure 23As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive substrate layer 11, covering the entire area of ​​the lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the entire area of ​​the lower surface of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22, covering the upper surface of the left end of the conductive substrate layer 11. The covered area of ​​the upper surface of the conductive substrate layer 11 can be prevented from corrosion or electroplating, while the exposed area of ​​the upper surface of the conductive substrate layer 11 can be used for conductive connection to other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the right end of the conductive adhesive layer 12. The area of ​​the lower surface of the conductive adhesive layer 12 that is covered can be prevented from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0177] The third structure of the conductive tape in this embodiment is as follows: Figure 24 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first insulating coating 23, which covers the upper surface of the left end of the conductive substrate layer 11 to prevent corrosion or electroplating of the covered upper surface. The exposed area of ​​the upper surface of the conductive substrate layer 11 can be used for conductive connection to other conductive components. The second protective layer 30 includes a second insulating coating 33, which covers the lower surface of the right end of the conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0178] Example 5

[0179] like Figure 25-27 The conductive tape shown includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10.

[0180] In some conductive tapes, the conductive functional layer 10 includes at least a conductive substrate layer 11 and a conductive adhesive layer 12. The conductive substrate layer 11 forms a conductive material layer, and the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11. The conductive adhesive layer 12 covers the entire area on the lower surface of the conductive substrate layer 11.

[0181] In some other conductive tapes, to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is also provided between the conductive substrate layer 11 and the conductive adhesive layer 12. The conductive coating 13 improves the conductivity of the conductive functional layer 10. The conductive substrate layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers all or part of the lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0182] The first protective layer 20 is connected to the upper surface of the conductive functional layer 10, completely covering the upper surface of the conductive functional layer 10 to prevent corrosion or electroplating. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10, but does not completely cover the lower surface of the conductive functional layer 10. The lower surfaces at both ends of the conductive functional layer 10 are exposed, forming a first exposed portion and a second exposed portion, respectively. The covered areas of the lower surface of the conductive functional layer 10 can be prevented from being corroded or electroplated, while the exposed areas of the lower surface of the conductive functional layer 10 can be used for conductive connections to other conductive components. In some specific application environments, the exposed portion of the lower surface of the conductive functional layer 10 is a conductive adhesive layer 12. The conductive adhesive layer 12 exposed at one end of the conductive functional layer 10 is bonded to a conductive component, while the other end of the conductive functional layer 10 is connected to a conductive component through other means. This causes the conductive adhesive layer 12 exposed at the other end of the conductive functional layer 10 to affect the connection and disassembly. Therefore, in this embodiment, a conductive cover layer 40 is provided on the conductive adhesive layer 12 exposed at the other end of the conductive functional layer 10. The conductive cover layer 40 is made of a conductive material, such as conductive metals like copper, aluminum, iron, and stainless steel, or conductive silicone or other conductive materials.

[0183] In this embodiment, the first structure of the conductive tape is as follows: Figure 25As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire area of ​​the lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surfaces of the left and right ends of the conductive adhesive layer 12 are exposed and not covered. The covered areas of the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated. The exposed areas of the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. The exposed area on the lower surface of the right end of the conductive adhesive layer 12 is completely covered by the conductive covering layer 40 to prevent the exposed area on the lower surface of the right end of the conductive adhesive layer 12 from sticking to other conductive components.

[0184] In this embodiment, the second structure of the conductive tape is as follows: Figure 26As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive substrate layer 11, covering the entire area of ​​the lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the entire area of ​​the lower surface of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22, completely covering the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12; the lower surfaces at both ends of the conductive adhesive layer 12 are exposed and not covered. The covered areas of the lower surface of the conductive adhesive layer 12 can be protected from corrosion or electroplating, while the exposed areas can be used for conductive connections to other conductive components. The exposed area on the lower surface of the right end of the conductive adhesive layer 12 is completely covered by the conductive covering layer 40 to prevent the exposed area on the lower surface of the right end of the conductive adhesive layer 12 from adhering to other conductive components.

[0185] The third structure of the conductive tape in this embodiment is as follows: Figure 27 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire area of ​​the lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first insulating coating 23, which covers the entire area of ​​the upper surface of the conductive substrate layer 11 to prevent corrosion or electroplating of the upper surface of the conductive substrate layer 11. The second protective layer 30 includes a second insulating coating 33, which covers the lower surface of the conductive adhesive layer 12 and exposes the lower surfaces at both ends of the conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. The exposed area on the lower right surface of the conductive adhesive layer 12 is completely covered by the conductive cover layer 40 to prevent the exposed area on the lower right surface of the conductive adhesive layer 12 from adhering to other conductive components.

[0186] Example 6

[0187] like Figures 28-33 As shown, the conductive tape includes a conductive functional layer 10 and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10.

[0188] In some conductive tapes, the conductive functional layer 10 includes at least a conductive substrate layer 11 and a conductive adhesive layer 12. The conductive substrate layer 11 forms a conductive material layer, which is a material layer with a surface passivated metal, such as aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive substrate layer 11. When the conductive adhesive layer 12 only covers a part of the lower surface of the conductive substrate layer 11, it may be that the conductive adhesive layer 12 only covers the lower surface of one end of the conductive substrate layer 11, or the conductive adhesive layer 12 does not cover the lower surface of the other end of the conductive substrate layer 11.

[0189] In some other conductive tapes, to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is also provided between the conductive substrate layer 11 and the conductive adhesive layer 12. The conductive coating 13 improves the conductivity of the conductive functional layer 10. The conductive substrate layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers all or part of the lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0190] The second protective layer 30 is connected to the lower surface of the conductive functional layer 10. The second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10. The lower surface of one end or both ends of the conductive functional layer 10 is exposed and not covered. The covered area of ​​the lower surface of the conductive functional layer 10 can be prevented from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive functional layer 10 can be used for conductive connection to other conductive components.

[0191] In this embodiment, the first structure of the conductive tape is as follows: Figure 28As shown, the conductive tape includes a conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The conductive substrate layer 11 is preferably aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire area of ​​the lower surface of the conductive substrate layer 11. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12; the lower surfaces at both ends of the conductive adhesive layer 12 are exposed and not covered, forming a first exposed portion and a second exposed portion, respectively. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0192] In this embodiment, the second structure of the conductive tape is as follows: Figure 29 As shown, the conductive tape includes a conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The conductive substrate layer 11 is preferably an aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers a portion of the lower surface of the conductive substrate layer 11. The conductive adhesive layer 12 covers the lower surface of the conductive substrate layer 11 and exposes the lower surface of the right end of the conductive substrate layer 11. For example, the conductive adhesive layer 12 covering the lower surface of the conductive substrate layer 11 is bonded to the electroplating area on the solar cell. The exposed right end of the conductive substrate layer 11 is connected to a conductive clip, so that the current used for electroplating the solar cell can flow sequentially through the conductive clip and the conductive tape to the electroplating area on the solar cell. The lower surface of the right end of the conductive substrate layer 11 is not provided with a conductive adhesive layer 12, which can prevent the lower surface of the right end of the conductive tape from sticking to the conductive clip and being unable to be separated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the left end of the conductive adhesive layer 12 is exposed and not covered. The area of ​​the lower surface of the conductive adhesive layer 12 that is covered can be prevented from being corroded or electroplated. The area of ​​the lower surface of the conductive adhesive layer 12 that is exposed can be used to conductively connect other conductive components.

[0193] The third structure of the conductive tape in this embodiment is as follows: Figure 30As shown, the conductive tape includes a conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive substrate layer 11 is preferably aluminum foil. The conductive coating layer 13 is coated on the lower surface of the conductive substrate layer 11, covering the entire area of ​​the lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the entire area of ​​the lower surface of the conductive coating layer 13. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12; the lower surfaces at both ends of the conductive adhesive layer 12 are exposed and not covered. The covered areas of the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed areas of the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0194] The fourth structure of the conductive tape in this embodiment is as follows: Figure 31 As shown, the conductive tape includes a conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive substrate layer 11 is preferably aluminum foil. The conductive coating layer 13 is coated on the lower surface of the conductive substrate layer 11, covering the entire area of ​​the lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering a portion of the lower surface of the conductive coating layer 13. The conductive adhesive layer 12 covers the lower surface of the conductive coating layer 13 and exposes the lower surface of the right end of the conductive coating layer 13. The lower surface of the right end of the conductive coating layer 13 can be used for conductive connection to other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the left end of the conductive adhesive layer 12 is exposed and not covered. The area of ​​the lower surface of the conductive adhesive layer 12 that is covered can be prevented from being corroded or electroplated. The area of ​​the lower surface of the conductive adhesive layer 12 that is exposed can be used to conductively connect other conductive components.

[0195] The fifth structure of the conductive tape in this embodiment is as follows: Figure 32As shown, the conductive tape includes a conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The conductive substrate layer 11 is preferably aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive substrate layer 11. The second protective layer 30 includes a second insulating coating 33, which covers the lower surface of the conductive adhesive layer 12 and exposes the lower surfaces of the left and right ends of the conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0196] The sixth structure of the conductive tape in this embodiment is as follows: Figure 33 As shown, the conductive tape includes a conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The conductive substrate layer 11 is preferably an aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11. The conductive adhesive layer 12 covers the lower surface of the conductive substrate layer 11 and exposes the lower surface of the right end of the conductive substrate layer 11. The lower surface of the right end of the conductive substrate layer 11 can be used for conductive connection to other conductive components. The second protective layer 30 includes a second insulating coating 33. The second insulating coating 33 covers the lower surface of the conductive adhesive layer 12 and exposes the lower surface of the left end of the conductive adhesive layer 12, keeping the lower surface of the right end of the conductive substrate layer 11 exposed. The area of ​​the lower surface of the conductive adhesive layer 12 covered can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0197] Example 7

[0198] like Figures 34-40 The conductive tape shown includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10.

[0199] In some conductive tapes, the conductive functional layer 10 includes at least a conductive substrate layer 11 and a conductive adhesive layer 12. The conductive substrate layer 11 forms a conductive material layer, and the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive substrate layer 11. When the conductive adhesive layer 12 only covers a part of the lower surface of the conductive substrate layer 11, it may be that the conductive adhesive layer 12 only covers the lower surface of one end of the conductive substrate layer 11, or the conductive adhesive layer 12 does not cover the lower surface of the other end of the conductive substrate layer 11.

[0200] In some other conductive tapes, to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is also provided between the conductive substrate layer 11 and the conductive adhesive layer 12. The conductive coating 13 improves the conductivity of the conductive functional layer 10. The conductive substrate layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers all or part of the lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0201] The first protective layer 20 is connected to the upper surface of the conductive functional layer 10, covering all or part of the upper surface of the conductive functional layer 10. The covered area of ​​the upper surface of the conductive functional layer 10 is protected from corrosion or electroplating, while the exposed area can be used for conductive connection to other conductive components. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10, and has an adhesive groove 30a that extends through the second protective layer 30, exposing the lower surface of the conductive functional layer 10, that is, exposing the lower surface of the conductive adhesive layer 12. Preferably, the adhesive groove 30a extends along the width direction of the second protective layer 30 to the edge, dividing the second protective layer 30 into two segments. Preferably, when the first protective layer 20 covers the entire area of ​​the upper surface of the conductive functional layer 10, and the second protective layer 30 covers the lower surface of one end of the conductive functional layer 10, exposing the lower surface of the other end of the conductive functional layer 10, the adhesive groove 30a is disposed near one end of the conductive functional layer 10, that is, the end of the conductive functional layer 10 not covered by the second protective layer 30 and the adhesive groove 30a are disposed at different ends in the length direction of the conductive tape; when the first protective layer 20 covers the upper surface of one end of the conductive functional layer 10, exposing the upper surface of the other end of the conductive functional layer 10, and the second protective layer 30 covers the entire area of ​​the lower surface of the conductive functional layer 10 except for the adhesive groove 30a, the adhesive groove 30a is disposed near one end of the conductive functional layer 10, that is, the end of the upper surface of the conductive functional layer 10 not covered by the first protective layer 20 and the adhesive groove 30a are disposed at different ends in the length direction of the conductive tape. The area covered on the lower surface of the conductive functional layer 10 can be prevented from being corroded or electroplated, while the exposed area on the lower surface of the conductive functional layer 10 can be used for conductive connection to other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a. After the conductive adhesive layer 12 exposed from the adhesive exposure groove 30a adheres to other conductive components, the probability of the conductive adhesive layer 12 remaining on other conductive components can be reduced during the separation process, making it easier for the conductive adhesive layer 12 to be separated from other conductive components as a whole.

[0202] In this embodiment, the first structure of the conductive tape is as follows: Figure 34As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire area of ​​the lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 covers the upper surface of the left end of the conductive substrate layer 11. The area of ​​the upper surface of the conductive substrate layer 11 covered can be prevented from being corroded or electroplated, and the exposed area of ​​the upper surface of the conductive substrate layer 11 on the right end can be used for conductive connection to other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. An adhesive exposure groove 30a is provided near the left end of the second protective layer 30, extending through the second protective layer 30 in the width direction, so that a portion of the lower surface of the conductive adhesive layer 12 is exposed from the adhesive exposure groove 30a. The lower surface of the conductive adhesive layer 12, except for the area exposed from the adhesive exposure groove 30a, is covered by the second shielding layer 31. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a. After the conductive adhesive layer 12 exposed from the adhesive exposure groove 30a adheres to other conductive components, the probability of the conductive adhesive layer 12 remaining on other conductive components can be reduced during the separation process, making it easier for the conductive adhesive layer 12 to separate from other conductive components as a whole.

[0203] In this embodiment, the second structure of the conductive tape is as follows: Figure 35As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive substrate layer 11, covering the entire area of ​​the lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the entire area of ​​the lower surface of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22, covering the upper surface of the left end of the conductive substrate layer 11. The covered area of ​​the upper surface of the conductive substrate layer 11 can be prevented from corrosion or electroplating, while the exposed area of ​​the upper surface of the conductive substrate layer 11 can be used for conductive connection to other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. An adhesive exposure groove 30a is provided near the left end of the second protective layer 30, penetrating the second protective layer 30, so that a portion of the lower surface of the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a. The lower surface of the conductive adhesive layer 12, except for the area exposed through the adhesive exposure groove 30a, is covered by the second shielding layer 31. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, while the exposed area can be used for conductive connection to other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a. After the conductive adhesive layer 12 exposed from the adhesive exposure groove 30a adheres to other conductive components, the probability of the conductive adhesive layer 12 remaining on other conductive components during separation is reduced, making it easier for the conductive adhesive layer 12 to separate from other conductive components as a whole.

[0204] The third structure of the conductive tape in this embodiment is as follows: Figure 36As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first insulating coating 23, which covers the upper surface of the left end of the conductive substrate layer 11 to prevent the covered upper surface of the conductive substrate layer 11 from being corroded or electroplated. The upper surface of the right end of the conductive substrate layer 11 is exposed and can be used for conductive connection to other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. An adhesive exposure groove 30a is provided near the left end of the second protective layer 30, penetrating the second protective layer 30, so that a portion of the lower surface of the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a. The lower surface of the conductive adhesive layer 12, except for the area exposed through the adhesive exposure groove 30a, is covered by the second shielding layer 31. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, while the exposed area can be used for conductive connection to other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a. After the conductive adhesive layer 12 exposed from the adhesive exposure groove 30a adheres to other conductive components, the probability of the conductive adhesive layer 12 remaining on other conductive components during separation is reduced, making it easier for the conductive adhesive layer 12 to separate from other conductive components as a whole.

[0205] The fourth structure of the conductive tape in this embodiment is as follows: Figure 37As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire area of ​​the lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12, and it does not cover the lower surface of the right end of the conductive adhesive layer 12. An adhesive exposure groove 30a is provided near the left end of the second protective layer 30, penetrating the second protective layer 30 so that a portion of the lower surface of the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a. Excluding the area exposed through the adhesive exposure groove 30a and the lower surface of the right end of the conductive adhesive layer 12, the remaining areas of the lower surface of the conductive adhesive layer 12 are covered by the second shielding layer 31. The covered areas of the lower surface of the conductive adhesive layer 12 are protected from corrosion or electroplating, while the exposed areas can be used for conductive connections to other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a. After the conductive adhesive layer 12 exposed from the adhesive exposure groove 30a adheres to other conductive components, the probability of the conductive adhesive layer 12 remaining on other conductive components can be reduced during the separation process. The conductive adhesive layer 12 is easier to separate from other conductive components as a whole.

[0206] The fifth structure of the conductive tape in this embodiment is as follows: Figure 38As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers a portion of the lower surface of the conductive substrate layer 11, with the conductive adhesive layer 12 covering the lower surface of the conductive substrate layer 11 and exposing the lower surface of the right end of the conductive substrate layer 11. For example, a conductive adhesive layer 12 covering the lower surface of the conductive substrate layer 11 is bonded to the electroplating area on the solar cell. The exposed right end of the conductive substrate layer 11 is connected to a conductive clip, allowing the current for electroplating the solar cell to flow sequentially through the conductive clip and the conductive tape to the electroplating area on the solar cell. The lower surface of the right end of the conductive substrate layer 11 is not provided with a conductive adhesive layer 12, preventing the lower surface of the right end of the conductive tape from adhering to the conductive clip and becoming inseparable. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. An adhesive exposure groove 30a is provided near the left end of the second protective layer 30, penetrating the second protective layer 30, so that a portion of the lower surface of the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a. The lower surface of the conductive adhesive layer 12, except for the area exposed through the adhesive exposure groove 30a, is covered by the second shielding layer 31. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, while the exposed area can be used for conductive connection to other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a. After the conductive adhesive layer 12 exposed from the adhesive exposure groove 30a adheres to other conductive components, the probability of the conductive adhesive layer 12 remaining on other conductive components during separation is reduced, making it easier for the conductive adhesive layer 12 to separate from other conductive components as a whole.

[0207] The sixth structure of the conductive tape in this embodiment is as follows: Figure 39As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive substrate layer 11, covering the entire area of ​​the lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the entire area of ​​the lower surface of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22, completely covering the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. Specifically, the second shielding layer 31 does not cover the lower surface of the right end of the conductive adhesive layer 12. An adhesive exposure groove 30a is provided near the left end of the second protective layer 30, penetrating the second protective layer 30. This allows a portion of the lower surface of the conductive adhesive layer 12 to be exposed through the adhesive exposure groove 30a. Excluding the area exposed through the adhesive exposure groove 30a and the lower surface of the right end of the conductive adhesive layer 12, the remaining areas on the lower surface of the conductive adhesive layer 12 are covered by the second shielding layer 31. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area can be used for conductive connections to other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a. After the conductive adhesive layer 12 exposed from the adhesive exposure groove 30a adheres to other conductive components, the probability of the conductive adhesive layer 12 remaining on other conductive components can be reduced during the separation process. The conductive adhesive layer 12 is easier to separate from other conductive components as a whole.

[0208] The seventh structure of the conductive tape in this embodiment is as follows: Figure 40As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire area of ​​the lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first insulating coating 23, which covers the entire area of ​​the upper surface of the conductive substrate layer 11 to prevent the upper surface of the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second insulating coating 33. The second insulating coating 33 does not completely cover the lower surface of the conductive adhesive layer 12. Specifically, the second insulating coating 33 does not cover the lower surface of the right end of the conductive adhesive layer 12, and an exposed adhesive groove 30a is provided on the second insulating coating 33 near its left end. The exposed adhesive groove 30a penetrates the second insulating coating 33, so that a portion of the lower surface of the conductive adhesive layer 12 is exposed from the exposed adhesive groove 30a. Except for the area exposed from the exposed adhesive groove 30a and the lower surface of the right end of the conductive adhesive layer 12, the other areas on the lower surface of the conductive adhesive layer 12 are covered by the second insulating coating 33. The covered area on the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area on the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive exposure groove 30a. After the conductive adhesive layer 12 exposed from the adhesive exposure groove 30a adheres to other conductive components, the probability of the conductive adhesive layer 12 remaining on other conductive components can be reduced during the separation process. The conductive adhesive layer 12 is easier to separate from other conductive components as a whole.

[0209] Example 8

[0210] like Figures 41-46 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10.

[0211] In some conductive tapes, the conductive functional layer 10 includes at least a conductive substrate layer 11 and a conductive adhesive layer 12. The conductive substrate layer 11 forms a conductive material layer. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers a portion of the lower surface of the conductive substrate layer 11. A third connecting groove 12b is provided on the conductive adhesive layer 12, penetrating the conductive adhesive layer 12, so that a portion of the lower surface of the conductive substrate layer 11 is exposed from the third connecting groove 12b. Preferably, the third connecting groove 12b is provided adjacent to one end of the conductive adhesive layer 12.

[0212] In some other conductive tapes, to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is also provided between the conductive substrate layer 11 and the conductive adhesive layer 12. The conductive coating 13 improves the conductivity of the conductive functional layer 10. The conductive substrate layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers all or part of the lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0213] The first protective layer 20 completely covers the upper surface of the conductive functional layer 10 to prevent corrosion or electroplating of the conductive functional layer 10; alternatively, the first protective layer 20 has a first connecting groove 20b that penetrates the first protective layer 20, allowing a portion of the upper surface of the conductive substrate layer 11 to be exposed from the first connecting groove 20b, which is positioned directly above the third connecting groove 12b. The second protective layer 30 is disposed on the lower surface of the conductive functional layer 10, and has a second connecting groove 30b that penetrates the second protective layer 30, positioned directly below the third connecting groove 12b, allowing the lower surface of the conductive substrate layer 11 to be exposed from the second connecting groove 30b. The second protective layer 30 does not cover the end of the conductive functional layer 10 furthest from the second connecting groove 30b, exposing the conductive functional layer 10 at that end, thus exposing the conductive adhesive layer 12 at that end for conductive connection to other conductive components. In this embodiment, the upper surface of the conductive substrate layer 11 is exposed through the first connecting groove 20b, and the lower surface of the conductive substrate layer 11 is exposed through the third connecting groove 12b and the second connecting groove 30b. When conductive tape is used as a conductive connector, other conductive components directly contact and connect to the upper surface of the conductive substrate layer 11 through the first connecting groove 20b, and directly contact and connect to the lower surface of the conductive substrate layer 11 through the third connecting groove 12b and the second connecting groove 30b. This reduces the resistance of current flowing through the conductive tape and also improves the stability of the electrical connection between the other conductive components and the conductive tape. The aforementioned other conductive components can be conductive clips, conductive probes, etc.

[0214] In this embodiment, the first structure of the conductive tape is as follows: Figure 41As shown, the conductive tape includes a conductive functional layer 10. A first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers a portion of the lower surface of the conductive substrate layer 11. Specifically, a third connecting groove 12b is disposed on the conductive adhesive layer 12, and the third connecting groove 12b penetrates the conductive adhesive layer 12, so that a portion of the lower surface of the conductive substrate layer 11 is exposed from the third connecting groove 12b. Except for the area exposed from the third connecting groove 12b, the remaining area of ​​the lower surface of the conductive substrate layer 11 is covered by the conductive adhesive layer 12. Specifically, the third connecting groove 12b is disposed adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. A second connecting groove 30b is provided on the second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32). The second connecting groove 30b penetrates the second protective layer 30 and is located directly below the third connecting groove 12b, so that a portion of the lower surface of the conductive substrate layer 11 is exposed from the third connecting groove 12b and the second connecting groove 30b, forming a second exposed portion. The second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second connecting groove 30b, that is, the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed, forming a first exposed portion.

[0215] In this embodiment, the second structure of the conductive tape is as follows: Figure 42As shown, the conductive tape includes a conductive functional layer 10. A first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers a portion of the lower surface of the conductive substrate layer 11. A third connecting groove 12b is disposed on the conductive adhesive layer 12, penetrating the conductive adhesive layer 12, so that the lower surface of the conductive substrate layer 11 is exposed through the third connecting groove 12b. Except for the area exposed through the third connecting groove 12b, the remaining area of ​​the lower surface of the conductive substrate layer 11 is covered by the conductive adhesive layer 12. Specifically, the third connecting groove 12b is disposed adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 includes a first shielding layer 21 and a first adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first adhesive layer 22. The first shielding layer 21 partially covers the upper surface of the conductive substrate layer 11 to prevent the covered area on the conductive substrate layer 11 from being corroded or electroplated. A first connecting groove 20b is provided on the first protective layer 20 (the first shielding layer 21 and the first adhesive layer 22). The first connecting groove 20b penetrates the first protective layer 20, so that a portion of the upper surface of the conductive substrate layer 11 is exposed from the first connecting groove 20b. The first connecting groove 20b is located directly above the third connecting groove 12b. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. A second connecting groove 30b is provided on the second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32). The second connecting groove 30b penetrates the second protective layer 30 and is located directly below the third connecting groove 12b, so that a portion of the lower surface of the conductive substrate layer 11 is exposed from the third connecting groove 12b and the second connecting groove 30b. The second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second connecting groove 30b, that is, the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed, forming a first exposed portion. The area exposed on the upper surface of the conductive substrate layer 11 and the area exposed on the lower surface of the conductive substrate layer 11 respectively form the second exposed portion and the third exposed portion.

[0216] The third structure of the conductive tape in this embodiment is as follows: Figure 43As shown, the conductive tape includes a conductive functional layer 10. A first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive substrate layer 11, covering the entire area of ​​the lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering a portion of the lower surface of the conductive coating layer 13. A third connecting groove 12b is disposed on the conductive adhesive layer 12, penetrating the conductive adhesive layer 12, so that the lower surface of the conductive coating layer 13 is exposed from the third connecting groove 12b. Except for the area exposed from the third connecting groove 12b, the remaining area of ​​the lower surface of the conductive coating layer 13 is covered by the conductive adhesive layer 12. Specifically, the third connecting groove 12b is disposed adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. A second connecting groove 30b is provided on the second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32). The second connecting groove 30b penetrates the second protective layer 30 and is located directly below the third connecting groove 12b, so that a portion of the lower surface of the conductive coating 13 is exposed from the third connecting groove 12b and the second connecting groove 30b. The second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second connecting groove 30b, that is, the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed.

[0217] The fourth structure of the conductive tape in this embodiment is as follows: Figure 44As shown, the conductive tape includes a conductive functional layer 10. A first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive substrate layer 11, covering the entire area of ​​the lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering a portion of the lower surface of the conductive coating layer 13. A third connecting groove 12b is disposed on the conductive adhesive layer 12, penetrating the conductive adhesive layer 12, so that the lower surface of the conductive coating layer 13 is exposed from the third connecting groove 12b. Except for the area exposed from the third connecting groove 12b, the remaining area of ​​the lower surface of the conductive coating layer 13 is covered by the conductive adhesive layer 12. Specifically, the third connecting groove 12b is disposed adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 includes a first shielding layer 21 and a first adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first adhesive layer 22. The first shielding layer 21 partially covers the upper surface of the conductive substrate layer 11 to prevent the covered area on the conductive substrate layer 11 from being corroded or electroplated. A first connecting groove 20b is provided on the first protective layer 20 (the first shielding layer 21 and the first adhesive layer 22). The first connecting groove 20b penetrates the first protective layer 20, so that the upper surface of the conductive substrate layer 11 is exposed from the first connecting groove 20b. The first connecting groove 20b is located directly above the third connecting groove 12b. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. A second connecting groove 30b is provided on the second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32). The second connecting groove 30b penetrates the second protective layer 30 and is located directly below the third connecting groove 12b, so that a portion of the lower surface of the conductive coating 13 is exposed from the third connecting groove 12b and the second connecting groove 30b. The second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second connecting groove 30b, that is, the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed.

[0218] The fifth structure of the conductive tape in this embodiment is as follows: Figure 45As shown, the conductive tape includes a conductive functional layer 10. A first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers a portion of the lower surface of the conductive substrate layer 11. A third connecting groove 12b is disposed on the conductive adhesive layer 12, penetrating the conductive adhesive layer 12, so that a portion of the lower surface of the conductive substrate layer 11 is exposed from the third connecting groove 12b. Except for the area exposed from the third connecting groove 12b, the remaining area of ​​the lower surface of the conductive substrate layer 11 is covered by the conductive adhesive layer 12. Specifically, the third connecting groove 12b is disposed adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 includes a first insulating coating 23, which completely covers the upper surface of the conductive substrate layer 11 to prevent corrosion or electroplating of the upper surface of the conductive substrate layer 11. The second protective layer 30 includes a second insulating coating 33, and a second connecting groove 30b is provided on the second protective layer 30 (second insulating coating 33). The second connecting groove 30b penetrates the second protective layer 30 and is located directly below the third connecting groove 12b, so that the lower surface of the conductive substrate layer 11 is exposed from the third connecting groove 12b and the second connecting groove 30b. The second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second connecting groove 30b, that is, the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed.

[0219] The sixth structure of the conductive tape in this embodiment is as follows: Figure 46As shown, the conductive tape includes a conductive functional layer 10. A first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers a portion of the lower surface of the conductive substrate layer 11. A third connecting groove 12b is disposed on the conductive adhesive layer 12, penetrating the conductive adhesive layer 12, so that a portion of the lower surface of the conductive substrate layer 11 is exposed from the third connecting groove 12b. Except for the area exposed from the third connecting groove 12b, the remaining area of ​​the lower surface of the conductive substrate layer 11 is covered by the conductive adhesive layer 12. Specifically, the third connecting groove 12b is disposed adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 includes a first insulating coating 23, which partially covers the upper surface of the conductive substrate layer 11 to prevent corrosion or electroplating of the covered area on the conductive substrate layer 11. A first connecting groove 20b is provided on the first protective layer 20 (first insulating coating 23), penetrating the first protective layer 20 so that a portion of the upper surface of the conductive substrate layer 11 is exposed from the first connecting groove 20b. The first connecting groove 20b is located directly above the third connecting groove 12b. The second protective layer 30 includes a second insulating coating 33. A second connecting groove 30b is provided on the second protective layer 30 (second insulating coating 33). The second connecting groove 30b penetrates the second protective layer 30 and is located directly below the third connecting groove 12b, so that a portion of the lower surface of the conductive substrate layer 11 is exposed from the third connecting groove 12b and the second connecting groove 30b. The second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second connecting groove 30b, that is, the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed.

[0220] Example 9

[0221] like Figures 47-50 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10.

[0222] In some conductive tapes, the conductive functional layer 10 includes at least a conductive substrate layer 11 and a conductive adhesive layer 12. The conductive substrate layer 11 forms a conductive material layer, and the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11. The conductive adhesive layer 12 covers all or part of the lower surface of the conductive substrate layer 11. For example, the conductive adhesive layer 12 may only cover the lower surface of one end of the conductive substrate layer 11, or the conductive adhesive layer 12 may not cover the lower surface of the other end of the conductive substrate layer 11.

[0223] In some other conductive tapes, to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is also provided between the conductive substrate layer 11 and the conductive adhesive layer 12. The conductive coating 13 improves the conductivity of the conductive functional layer 10. The conductive substrate layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers all or part of the lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers all or part of the lower surface of the conductive coating 13.

[0224] The first protective layer 20 is connected to the upper surface of the conductive functional layer 10, completely covering the upper surface of the conductive functional layer 10 to prevent corrosion or electroplating. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10, not completely covering it. The lower surface of the middle portion of the conductive functional layer 10 is covered, while the lower surfaces at both ends are exposed. The covered areas of the lower surface of the conductive functional layer 10 are protected from corrosion or electroplating, while the exposed areas can be used for conductive connections to other conductive components. At least one end of the lower surface of the conductive functional layer 10 is exposed, forming the lower surface of the conductive adhesive layer 12. An anti-sticking sheet 60 is provided on this exposed lower surface of the conductive adhesive layer 12 to reduce its adhesion and the bonding area, thereby reducing the risk of residue left on the bonded components.

[0225] In this embodiment, the first structure of the conductive tape is as follows: Figures 47-48As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire area of ​​the lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12; the lower surface in the middle of the conductive adhesive layer 12 is covered, while the lower surfaces at both ends of the conductive adhesive layer 12 are exposed and not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. An anti-sticking sheet 60 is provided on the lower surface of the left end of the conductive adhesive layer 12. The anti-sticking sheet 60 can reduce the adhesion of the conductive adhesive layer 12, reduce the bonding area of ​​the lower surface of the conductive adhesive layer 12, and thus reduce the risk of the conductive adhesive layer 12 leaving residual adhesive on the components it is bonded to.

[0226] In this embodiment, the second structure of the conductive tape is as follows: Figure 49As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11, a conductive adhesive layer 12, and a conductive coating layer 13. The conductive coating layer 13 is applied to the lower surface of the conductive substrate layer 11, covering the entire area of ​​the lower surface of the conductive substrate layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, covering the entire area of ​​the lower surface of the conductive coating layer 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22, completely covering the upper surface of the conductive substrate layer 11 to prevent the conductive substrate layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12; the lower surface in the middle of the conductive adhesive layer 12 is covered, while the lower surfaces at both ends of the conductive adhesive layer 12 are exposed and not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components. An anti-sticking sheet 60 is provided on the lower surface of the left end of the conductive adhesive layer 12. The anti-sticking sheet 60 can reduce the adhesion of the conductive adhesive layer 12, reduce the bonding area of ​​the lower surface of the conductive adhesive layer 12, and thus reduce the risk of the conductive adhesive layer 12 leaving residual adhesive on the components it is bonded to.

[0227] The third structure of the conductive tape in this embodiment is as follows: Figure 50As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first insulating coating 23, which completely covers the upper surface of the conductive substrate layer 11 to prevent corrosion or electroplating. The second protective layer 30 includes a second insulating coating 33, which covers the lower surface of the conductive adhesive layer 12 and exposes the lower surfaces at both ends of the conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive adhesive layer 12 is protected from corrosion or electroplating, while the exposed area can be used for conductive connection to other conductive components. An anti-sticking sheet 60 is provided on the lower surface of the left end of the conductive adhesive layer 12. The anti-sticking sheet 60 can reduce the adhesion of the conductive adhesive layer 12 and reduce the bonding area of ​​the lower surface of the conductive adhesive layer 12, thereby reducing the risk of the conductive adhesive layer 12 leaving residual adhesive on the parts it is bonded to.

[0228] Example 10

[0229] like Figures 51-56 The conductive tape shown includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10.

[0230] The conductive functional layer 10 includes a conductive material layer and a conductive adhesive layer 12. In this embodiment, conductive adhesive layers 12 are provided on both the upper and lower surfaces of the conductive material layer. For ease of description, the conductive adhesive layers 12 provided on the upper and lower surfaces of the conductive material layer are respectively referred to as the first conductive adhesive layer and the second conductive adhesive layer.

[0231] In some conductive tapes, a conductive material layer is formed by a conductive substrate layer 11. A conductive adhesive layer 12 is provided on both the upper and lower surfaces of the conductive substrate layer 11. A first conductive adhesive layer covers all or part of the upper surface of the conductive substrate layer 11, and a second conductive adhesive layer covers all or part of the lower surface of the conductive substrate layer 11. For example, the first conductive adhesive layer only covers the upper surface of one end of the conductive substrate layer 11, and the second conductive adhesive layer only covers the lower surface of the corresponding end of the conductive substrate layer 11.

[0232] In other conductive tapes, to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is also provided between the conductive substrate layer 11 and the conductive adhesive layer 12. The conductive coating 13 enhances the conductivity of the conductive functional layer 10, meaning that the conductive substrate layer 11 and the conductive coating 13 together constitute a conductive material layer. Above the conductive substrate layer 11, the conductive coating 13 covers all or part of the upper surface of the conductive substrate layer 11. The lower surface of the first conductive adhesive layer is connected to the upper surface of the conductive coating 13, and the first conductive adhesive layer covers all or part of the upper surface of the conductive coating 13. Below the conductive substrate layer 11, the conductive coating 13 covers all or part of the lower surface of the conductive substrate layer 11. The upper surface of the second conductive adhesive layer is connected to the lower surface of the conductive coating 13, and the second conductive adhesive layer covers all or part of the lower surface of the conductive coating 13.

[0233] The first protective layer 20 does not completely cover the upper surface of the conductive functional layer 10. The upper surface of the middle part of the conductive functional layer 10 is covered, while the upper surfaces at both ends of the conductive functional layer 10 are exposed and not covered. The covered area of ​​the upper surface of the conductive functional layer 10 can be protected from corrosion or electroplating, while the exposed area of ​​the upper surface of the conductive functional layer 10 can be used for conductive connection to other conductive components. The second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10. The lower surface of the middle part of the conductive functional layer 10 is covered, while the lower surfaces at both ends of the conductive functional layer 10 are exposed and not covered. The covered area of ​​the lower surface of the conductive functional layer 10 can be protected from corrosion or electroplating, while the exposed area of ​​the lower surface of the conductive functional layer 10 can be used for conductive connection to other conductive components.

[0234] In specific application environments, the first and second conductive adhesive layers of a conductive tape can each bond one solar cell, meaning that one conductive tape can simultaneously bond two solar cells and electroplate both solar cells at the same time. This reduces the amount of conductive tape used as a consumable material, thereby lowering the cost of solar cell electroplating. Preferably, the solar cell is a single-sided electroplated solar cell, such as an IBC solar cell.

[0235] In this embodiment, the first structure of the conductive tape is as follows: Figure 51As shown, the conductive tape includes a conductive functional layer 10. A first protective layer 20 is disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 and a conductive adhesive layer 12. The conductive adhesive layer 12 is disposed on both the upper and lower surfaces of the conductive substrate layer 11. The first conductive adhesive layer covers the entire area of ​​the upper surface of the conductive substrate layer 11, and the second conductive adhesive layer covers the entire area of ​​the lower surface of the conductive substrate layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive substrate layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 does not completely cover the upper surface of the first conductive adhesive layer. The upper surface of the middle part of the first conductive adhesive layer is covered, while the upper surfaces at both ends of the first conductive adhesive layer are exposed and not covered. The covered area of ​​the upper surface of the first conductive adhesive layer can be prevented from being corroded or electroplated, and the exposed area of ​​the upper surface of the first conductive adhesive layer can be used for conductive connection to other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the second conductive adhesive layer through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the second conductive adhesive layer. The lower surface in the middle of the second conductive adhesive layer is covered, while the lower surfaces at both ends of the second conductive adhesive layer are exposed and not covered. The area of ​​the lower surface of the second conductive adhesive layer that is covered can be prevented from being corroded or electroplated. The area of ​​the lower surface of the second conductive adhesive layer that is exposed can be used to conductively connect other conductive components.

[0236] In this embodiment, the second structure of the conductive tape is as follows: Figure 52 As shown, the main difference between this embodiment and the first structure of the conductive tape is that the first conductive adhesive layer covers a portion of the upper surface of the conductive substrate layer 11, specifically, the first conductive adhesive layer covers the upper surface of the left end of the conductive substrate layer 11, exposing the upper surface of the right end of the conductive substrate layer 11, and the second conductive adhesive layer covers the entire area of ​​the lower surface of the conductive substrate layer 11. (Not shown in the figure) Alternatively, the conductive tape in this embodiment can also have the following structure: the first conductive adhesive layer covers the upper surface of the left end of the conductive substrate layer 11, exposing the upper surface of the right end of the conductive substrate layer 11, and the second conductive adhesive layer covers the lower surface of the left end of the conductive substrate layer 11, exposing the lower surface of the right end of the conductive substrate layer 11.

[0237] The third structure of the conductive tape in this embodiment is as follows: Figure 53As shown, the main difference from the first structure of the conductive tape in this embodiment is that, to improve the conductivity of the conductive functional layer 10, a conductive coating layer 13 is also provided between the conductive substrate layer 11 and the conductive adhesive layer 12. The conductive coating layer 13 enhances the conductivity of the conductive functional layer 10. Above the conductive substrate layer 11, the conductive coating layer 13 covers the entire area of ​​the upper surface of the conductive substrate layer 11, and the lower surface of the first conductive adhesive layer is connected to the upper surface of the conductive coating layer 13, covering the entire area of ​​the upper surface of the conductive coating layer 13. Below the conductive substrate layer 11, the conductive coating layer 13 covers the entire area of ​​the lower surface of the conductive substrate layer 11, and the upper surface of the second conductive adhesive layer is connected to the lower surface of the conductive coating layer 13, covering the entire area of ​​the lower surface of the conductive coating layer 13.

[0238] The fourth structure of the conductive tape in this embodiment is as follows: Figure 54 As shown, the difference from the second structure of the conductive tape in this embodiment is that a conductive coating 13 is also provided between the conductive substrate layer 11 and the conductive adhesive layer 12, which improves the conductivity of the conductive functional layer 10.

[0239] The fifth structure of the conductive tape in this embodiment is as follows: Figure 55 As shown, the difference between this protective layer 20 and the first structure of the conductive tape in this embodiment is as follows: The first protective layer 20 includes a first insulating coating 23, which is connected to the upper surface of the conductive substrate layer 11. The first insulating coating 23 does not completely cover the upper surface of the first conductive adhesive layer; the upper surface in the middle of the first conductive adhesive layer is covered, while the upper surfaces at both ends of the first conductive adhesive layer are exposed and not covered. The covered area of ​​the upper surface of the first conductive adhesive layer can be protected from corrosion or electroplating, and the exposed area of ​​the upper surface of the first conductive adhesive layer can be used for conductive connection to other conductive components. The second protective layer 30 includes a second insulating coating 33, which is connected to the lower surface of the second conductive adhesive layer. The second insulating coating 33 does not completely cover the lower surface of the second conductive adhesive layer; the lower surface in the middle of the second conductive adhesive layer is covered, while the lower surfaces at both ends of the second conductive adhesive layer are exposed and not covered. The covered area of ​​the lower surface of the second conductive adhesive layer can be protected from corrosion or electroplating, and the exposed area of ​​the lower surface of the second conductive adhesive layer can be used for conductive connection to other conductive components.

[0240] The sixth structure of the conductive tape in this embodiment is as follows: Figure 56As shown, the difference between this and the fifth structure of the conductive tape in this embodiment is that the first conductive adhesive layer covers a portion of the upper surface of the conductive substrate layer 11, that is, the first conductive adhesive layer covers the upper surface of the left end of the conductive substrate layer 11, exposing the upper surface of the right end of the conductive substrate layer 11, and the second conductive adhesive layer covers the entire area of ​​the lower surface of the conductive substrate layer 11. (Not shown in the figure) The conductive tape in this embodiment can also adopt the following structure: the first conductive adhesive layer covers the upper surface of the left end of the conductive substrate layer 11, exposing the upper surface of the right end of the conductive substrate layer 11, and the second conductive adhesive layer covers the lower surface of the left end of the conductive substrate layer 11, exposing the lower surface of the right end of the conductive substrate layer 11.

[0241] Example 11

[0242] like Figures 57-63 As shown, the conductive tape has a cylindrical structure, including a conductive functional layer 10 located at the center of the cylinder, and a third protective layer 70 covering the outer periphery of the conductive functional layer 10. The third protective layer 70 only covers the middle section of the conductive functional layer 10, leaving the two ends of the conductive functional layer 10 exposed. The third protective layer 70 prevents corrosion of the middle section of the conductive functional layer 10, and the exposed areas at both ends of the conductive functional layer 10 can be used for conductive connection to other conductive components. The conductive functional layer 10 includes a conductive substrate layer 11 located at the center of the cylinder, and a conductive adhesive layer 12 covering the outer periphery of the conductive substrate layer 11. To improve conductivity, a conductive coating layer 13 is also provided between the conductive substrate layer 11 and the conductive adhesive layer 12. The conductive material layer is formed by the conductive substrate layer 11, or the conductive material layer is formed by the conductive substrate layer 11 and the conductive coating layer 13 together.

[0243] In this embodiment, the first structure of the conductive tape is as follows: Figures 57-58 As shown, the third protective layer 70 specifically includes a third shielding layer 71 and a third adhesive layer 72. The third shielding layer 71 is bonded and covered around the conductive functional layer 10 via the third adhesive layer 72. The conductive functional layer 10 includes a conductive substrate layer 11 located at the center of the cylinder, and a conductive adhesive layer 12 covering the periphery of the conductive substrate layer 11. Figure 59 As shown, as a modified structure, the exposed ends of the conductive functional layer 10 are flat, which facilitates the bonding of the conductive adhesive layer 12 to other conductive components.

[0244] In this embodiment, the second structure of the conductive tape is as follows: Figures 60-61As shown, the main difference from the first structure of the conductive tape in this embodiment is that, in order to improve the conductivity of the conductive functional layer 10, a conductive coating layer 13 is further provided between the conductive substrate layer 11 and the conductive adhesive layer 12, thereby improving the conductivity of the conductive functional layer 10. The conductive coating layer 13 enhances the conductivity of the conductive functional layer 10. The conductive functional layer 10 includes a conductive substrate layer 11 located at the center of the cylinder, a conductive coating layer 13 covering the periphery of the conductive substrate layer 11, and a conductive adhesive layer 12 covering the periphery of the conductive coating layer 13.

[0245] The third structure of the conductive tape in this embodiment is as follows: Figures 62-63 As shown, the difference from the first structure of the conductive tape in this embodiment is that the third protective layer 70 specifically includes a third insulating coating 73, which is bonded and covered around the electrical functional layer 10.

[0246] In other embodiments, the conductive tape may be prismatic in shape, including a conductive functional layer 10 located at the center of the prism and a third protective layer 70 covering the outer periphery of the conductive functional layer 10; or the middle section of the conductive tape may be prismatic, and the two ends of the conductive tape may be flat. For example, the conductive tape may be triangular prism in shape, including a conductive functional layer 10 located at the center of the triangular prism and a third protective layer 70 covering the outer periphery of the conductive functional layer 10.

[0247] Example 12

[0248] like Figures 64-66 The conductive tape shown includes a conductive functional layer 10, a first protective layer 20 disposed on the upper surface of the conductive functional layer 10, and a second protective layer 30 disposed on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes at least a conductive substrate layer 11 and a conductive adhesive layer 12. The conductive substrate layer 11 constitutes a conductive material layer, and the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive substrate layer 11, covering all or part of the lower surface of the conductive substrate layer 11.

[0249] The first protective layer 20 and / or the second protective layer 30 may refer to or incorporate the structures described in embodiments 1-9 above. The conductive functional layer 10 has at least two exposed portions, one for bonding the first conductive component (a first exposed portion) and the other for bonding or connecting the second conductive component (a second exposed portion). In specific application embodiments, conductive tape is used as a conductive connector in the electroplating of solar cells. The first conductive component may be a seed layer or a TCO layer on the solar cell, and the second conductive component may be a conductive clip or a conductive support.

[0250] like Figure 64As shown, the first exposed portion is the lower surface of the left end of the conductive functional layer 10, specifically the lower surface of the left end of the conductive adhesive layer 12, and the second exposed portion is the lower surface of the right end of the conductive functional layer 10, specifically the lower surface of the right end of the conductive adhesive layer 12.

[0251] like Figure 65 As shown, the first exposed portion is the lower surface of the left end of the conductive functional layer 10, specifically the lower surface of the left end of the conductive adhesive layer 12, and the second exposed portion is the upper surface of the right end of the conductive functional layer 10, specifically the upper surface of the right end of the conductive substrate layer 11.

[0252] like Figure 66 As shown, the first exposed portion is the adhesive groove 30a connected to the lower surface of the conductive functional layer 10, specifically the adhesive groove 30a connected to the lower surface of the conductive adhesive layer 12, and the second exposed portion is the lower surface of the right end of the conductive functional layer 10, specifically the lower surface of the right end of the conductive adhesive layer 12.

[0253] Assuming the dimension of the first exposed portion extending along the length of the conductive tape is 'a', that is, the length of the first exposed portion is 'a', the dimension of the second exposed portion extending along the length of the conductive tape is 'b', that is, the length of the second exposed portion is 'b', and the length of the conductive tape is 'L', then the following conditions are met: 0.01L≤a<0.5L, 0.01L≤b<0.5L, 0.02L≤a+b<L; preferably, 0.05L≤a≤0.2L, 0.05L≤b≤0.4L, 0.1L≤a+b≤0.6L. The values ​​of a and b should be moderate. If they are too large, the conductive functional layer 10 will be excessively exposed, and the first protective layer 20 and / or the second protective layer 30 will not be able to provide adequate protection. In addition, if the area of ​​the first exposed part is too large, it will adhere too firmly to the first conductive component, and it will be easy to leave residual adhesive on the first conductive component. If they are too small, it will easily lead to poor contact. In addition, if the area of ​​the first exposed part is too small, it will not adhere tightly to the first conductive component, and the conductive tape will easily fall off the first conductive component.

[0254] Example 13

[0255] Based on the aforementioned embodiments 1-10, the conductive functional layer 10 includes at least a conductive substrate layer 11 and a conductive adhesive layer 12. The material of the conductive substrate layer 11 includes, but is not limited to, one or an alloy material composed of any two or more of gold, silver, platinum, copper, aluminum, nickel and stainless steel, or a multilayer structure formed by stacking multiple of gold, silver, platinum, copper, aluminum, nickel and stainless steel along the thickness direction.

[0256] The conductive adhesive layer 12 is a conductive pressure-sensitive adhesive layer, a conductive heat-sensitive adhesive layer, or a non-woven conductive adhesive layer. The conductive adhesive layer 12 includes a matrix and conductive fillers. The matrix includes an adhesive, a curing agent, and a diluent, and may also include additives such as plasticizers, coupling agents, and defoamers. The adhesive can be epoxy resin, phenolic resin, polyimide, acrylic resin, or polyurethane. The conductive filler can be carbon, metal, or metal oxide, preferably a single metal powder or a mixture of multiple metal powders with low resistivity, such as Au, Ag, Cu, and Ni. For example, the material composition of the conductive adhesive layer 12 includes a pressure-sensitive adhesive acrylic resin and a plasticizer, wherein the plasticizer can be di-n-octyl phthalate or di-n-butyl phthalate, which can improve the removability of the conductive adhesive layer 12 and reduce or avoid the risk of leaving residue during the peeling process between the conductive adhesive layer 12 and the adhered object. The conductive adhesive layer 12 may only include an adhesive and conductive fillers; for example, the conductive adhesive layer 12 includes acrylic resin and Ni powder.

[0257] The conductive functional layer 10 also includes a conductive coating 13, which can be a carbon coating layer, such as a carbon-coated copper foil or a carbon-coated aluminum foil.

[0258] The first shielding layer 21 can be an insulating film layer or a hydrophobic film layer, the second shielding layer 31 can be an insulating film layer or a hydrophobic film layer, and the third shielding layer 71 can be an insulating film layer or a hydrophobic film layer. The materials of the first shielding layer 21, the second shielding layer 31, and the third shielding layer 71 can all be polyethylene terephthalate (PET), polyethylene (PE), or polypropylene (PP). The materials of the first adhesive layer 22, the second adhesive layer 32, and the third adhesive layer 72 can all be silicone.

[0259] Example 14

[0260] Based on the aforementioned embodiments 1-11, as follows Figures 67-71 As shown, this embodiment provides a conductive tape assembly, which includes a conductive tape 1 and a base film 50. The conductive tape 1 is adhered to the base film 50, facilitating its storage and transportation. For example, by adhering the conductive tape 1 to the base film 50 and winding the conductive tape assembly, a roll material can be formed, facilitating the storage and transportation of the conductive tape 1. In use, the conductive tape 1 can be peeled off the base film 50. Figure 67 As shown, the conductive functional layer 10 of the conductive tape 1 is bonded to the base film 50. Specifically, the conductive functional layer 10 includes a conductive adhesive layer 12, which is bonded to the base film 50. Figure 68 As shown, the second protective layer 30 of the conductive tape 1 is bonded to the base film 50. Specifically, the second protective layer 30 may not have an adhesive function. A third connecting adhesive layer 51 is provided on the base film 50, and the second protective layer 30 is bonded to the base film 50 through the third connecting adhesive layer 51.

[0261] The arrangement structure of the conductive tape 1 on the base film 50 can be adopted as follows: Figures 69-71 The structure shown. (As illustrated) Figure 69 As shown, the conductive tape 1 extends in the same direction as the base film 50. The conductive tape 1 is arranged in a rectangular array on the base film 50, with multiple conductive tapes 1 arranged along the length of the base film 50 and also along its width. Figure 70 As shown, the length extension direction of the conductive tape 1 is the same as the width extension direction of the base film 50. The conductive tapes 1 are arranged in a linear array on the base film 50, with multiple conductive tapes 1 spaced apart along the length direction of the base film 50. Figure 71 As shown, the conductive tape 1 is divided into two groups along the width direction of the base film 50. Each group of conductive tape 1 is inclinedly arranged on the base film 50 and spaced apart along the length direction of the base film 50. Each group of conductive tape 1 is in a linear array.

[0262] Example 15

[0263] This embodiment provides a solar cell 2, on which a conductive tape 1 is adhered. The conductive tape 1 can refer to or incorporate the structure described in embodiments 1-11 above. When electroplating metal grid lines on the solar cell 2, the conductive tape 1 is used to connect the solar cell 2 and the negative terminal of the electroplating power source.

[0264] Specifically, the conductive tape 1 includes a conductive functional layer 10 and a surface protective layer (e.g., a first protective layer 20 and / or a second protective layer 30). The conductive functional layer 10 is covered by the surface protective layer, and at least two portions of the conductive functional layer 10 are exposed. One portion is used to bond the electroplating area on the solar cell 2, referred to as the first exposed portion, and the other portion is used to bond or connect a second conductive component, referred to as the second exposed portion. The second conductive component is electrically connected to the negative terminal of the electroplating power supply through a wire. The second conductive component can be a conductive clip or a conductive support. The second exposed portion can be bonded to the conductive clip or the conductive support, or the second exposed portion can be clamped by the conductive clip.

[0265] Specifically, such as Figures 72-73 As shown, the area to be electroplated on the solar cell 2 includes the conductive area at the edge of the solar cell 2, which is called the conductive connection portion 2a. There may be one or more conductive connection portions 2a. Figure 72 As shown, conductive connection portions 2a are provided on both sides of the solar cell 2, and multiple conductive connection portions 2a are provided on each side of the solar cell 2. One end of the conductive tape 1 is adhered to the conductive connection portion 2a, that is, the first exposed portion of the conductive tape 1 is connected to the conductive connection portion 2a. Conductive tape 1 is adhered to each conductive connection portion 2a. Figure 72As shown, the conductive tape 1 adhered to the solar cell 2 remains straight. To facilitate the connection of the second exposed portion of the conductive tape 1 to the second conductive component, the conductive tape 1 adhered to the solar cell 2 can be bent, as shown below. Figure 73 As shown, the conductive tape 1 adhered to the solar cell 2 is in a bent state.

[0266] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it. They should not be used to limit the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. An electrically conductive adhesive tape, characterized in that, The conductive tape includes a conductive functional layer, which comprises a conductive material layer and a conductive adhesive layer. The conductive adhesive layer covers all or part of the outer surface of the conductive material layer. The conductive tape also includes a surface protective layer, which does not completely cover the outer surface of the conductive functional layer. The surface protective layer includes a shielding layer and a connecting adhesive layer. The shielding layer is connected to the outer surface of the conductive functional layer through the connecting adhesive layer.

2. The conductive tape according to claim 1, wherein The conductive functional layer has at least a first exposed portion and a second exposed portion. A portion of the conductive adhesive layer is exposed from the first exposed portion, and a portion of the conductive material layer or another portion of the conductive adhesive layer is exposed from the second exposed portion. The first exposed portion and the second exposed portion are located at different positions along the length of the conductive tape.

3. The conductive tape according to claim 2, wherein The conductive tape has a layered structure, with the upper surface of the conductive adhesive layer connected to the lower surface of the conductive material layer. The conductive adhesive layer covers all or part of the lower surface of the conductive material layer. The outer surface of the conductive functional layer includes the upper surface and the lower surface of the conductive functional layer. The first exposed portion is located on the lower surface of the conductive functional layer, and the second exposed portion is located on the upper surface or the lower surface of the conductive functional layer.

4. The conductive tape according to claim 3, wherein The conductive material layer includes a conductive substrate layer, the upper surface of the conductive adhesive layer is connected to the lower surface of the conductive substrate layer, and the conductive adhesive layer covers all or part of the lower surface of the conductive substrate layer. Alternatively, the conductive material layer includes a conductive substrate layer and a conductive coating layer, wherein the conductive coating layer is applied to the lower surface of the conductive substrate layer and covers all or part of the lower surface of the conductive substrate layer; the upper surface of the conductive adhesive layer is connected to the lower surface of the conductive coating layer and covers all or part of the lower surface of the conductive coating layer.

5. The conductive tape according to claim 3, wherein The surface protective layer includes a first protective layer, which is disposed on the upper surface of the conductive functional layer and covers all or part of the upper surface of the conductive functional layer. And / or, the surface protective layer includes a second protective layer disposed on the lower surface of the conductive functional layer, and the second protective layer does not completely cover the lower surface of the conductive adhesive layer.

6. The conductive tape according to claim 5, wherein The conductive tape includes the first protective layer, which completely covers the upper surface of the conductive functional layer.

7. The conductive tape according to claim 6, characterized in that, The conductive tape also includes the second protective layer, which does not completely cover the lower surface of the conductive functional layer, and the lower surface of one or both ends of the conductive functional layer is exposed and not covered.

8. The conductive tape according to claim 7, characterized in that, The conductive adhesive layer covers the lower surface of one or both ends of the conductive material layer and exposes the lower surface of the middle part of the conductive material layer. The second protective layer covers the lower surface of the middle part of the conductive material layer and a portion of the lower surface of the conductive adhesive layer adjacent to it.

9. The conductive tape according to claim 7, characterized in that, The conductive adhesive layer covers the lower surfaces of both ends of the conductive material layer and exposes the lower surface of the middle part of the conductive material layer. The second protective layer is suspended below the lower surface of the middle part of the conductive material layer, forming a hollow area between the conductive functional layer and the second protective layer. The second protective layer covers a portion of the lower surface of the conductive adhesive layer near the hollow area.

10. The conductive tape according to claim 6, characterized in that, The conductive tape also includes the second protective layer, which covers the lower surface of the middle part of the conductive functional layer and exposes the lower surfaces of both ends of the conductive functional layer. A conductive covering layer is provided on the lower surface of one end of the conductive functional layer.

11. The conductive tape according to claim 6, characterized in that, The conductive tape also includes the second protective layer, which does not completely cover the lower surface of the conductive functional layer, with one end of the lower surface of the conductive functional layer exposed and not covered; the second protective layer is also provided with an adhesive groove, which penetrates the second protective layer, so that a portion of the lower surface of the conductive functional layer is exposed from the adhesive groove.

12. The conductive tape according to claim 5, characterized in that, The conductive tape includes a first protective layer and a second protective layer. The first protective layer covers the upper surface of one end of the conductive functional layer, while the upper surface of the other end of the conductive functional layer is exposed. The second protective layer covers the lower surface of the other end of the conductive functional layer, while the lower surface of one end of the conductive functional layer is exposed. The exposed area on the lower surface of the conductive functional layer forms the first exposed portion, and the exposed area on the upper surface of the conductive functional layer forms the second exposed portion. The first exposed portion and the second exposed portion are located at opposite ends along the length of the conductive tape.

13. The conductive tape according to claim 5, characterized in that, The conductive tape includes the second protective layer, which does not completely cover the lower surface of the conductive functional layer. The lower surface of one or both ends of the conductive functional layer is exposed and not covered. The conductive substrate layer is a material layer of surface passivated metal.

14. The conductive tape according to claim 5, characterized in that, The conductive tape includes the first protective layer and the second protective layer. The first protective layer covers the upper surface of one end of the conductive functional layer, while the upper surface of the other end of the conductive functional layer is exposed and not covered, forming the second exposed portion. The second protective layer is provided with an exposed adhesive groove, which penetrates the second protective layer, so that a portion of the lower surface of the conductive functional layer is exposed from the exposed adhesive groove, forming the first exposed portion; The first exposed portion and the second exposed portion are spaced apart along the length of the conductive tape.

15. The conductive tape according to claim 5, characterized in that, In the conductive functional layer, the conductive adhesive layer covers a portion of the lower surface of the conductive material layer. A third connecting groove is provided on the conductive adhesive layer, penetrating the conductive adhesive layer, so that a portion of the lower surface of the conductive material layer is exposed from the third connecting groove. The conductive tape includes the first protective layer and the second protective layer, wherein... The first protective layer completely covers the upper surface of the conductive functional layer, or the first protective layer is provided with a first connecting groove, the first connecting groove penetrates the first protective layer, so that part of the upper surface of the conductive material layer is exposed from the first connecting groove, and the first connecting groove is located directly above the third connecting groove. The second protective layer is provided with a second connecting groove, which penetrates the second protective layer. The second connecting groove is located directly below the third connecting groove, so that the lower surface of the conductive material layer is exposed from the third connecting groove and the second connecting groove. The second protective layer does not cover the end of the conductive functional layer away from the second connecting groove, so that the conductive functional layer at that end is exposed.

16. The conductive tape according to claim 2, characterized in that, A portion of the conductive adhesive layer is exposed from the first exposed portion, and another portion of the conductive adhesive layer is exposed from the second exposed portion, wherein an anti-sticking sheet is provided on the lower surface of the conductive adhesive layer exposed from the second exposed portion.

17. The conductive tape according to claim 2, characterized in that, The conductive tape has a layered structure, and the conductive functional layer has two sets of conductive adhesive layers, which are respectively referred to as the first conductive adhesive layer and the second conductive adhesive layer. The lower surface of the first conductive adhesive layer is connected to the upper surface of the conductive material layer, and the first conductive adhesive layer covers all or part of the upper surface of the conductive material layer. The upper surface of the first conductive adhesive layer is formed as the upper surface of the conductive functional layer. The upper surface of the second conductive adhesive layer is connected to the lower surface of the conductive material layer, and the second conductive adhesive layer covers all or part of the lower surface of the conductive material layer; the lower surface of the second conductive adhesive layer forms the lower surface of the conductive functional layer. The surface protective layer includes a first protective layer, which is disposed on the upper surface of the conductive functional layer, and the first protective layer does not completely cover the upper surface of the first conductive adhesive layer. And / or, the surface protective layer includes a second protective layer disposed on the lower surface of the conductive functional layer, and the second protective layer does not completely cover the lower surface of the second conductive adhesive layer.

18. The conductive tape according to claim 2, characterized in that, The length of the first exposed portion is a, the length of the second exposed portion is b, and the length of the conductive tape is L, wherein 0.05L≤a≤0.2L, 0.05L≤b≤0.4L, and 0.1L≤a+b≤0.6L.

19. The conductive tape according to claim 2, characterized in that, The first exposed portion is the lower surface of one end of the conductive functional layer, and the second exposed portion is the lower surface of the other end of the conductive functional layer; Alternatively, the first exposed portion is the lower surface of one end of the conductive functional layer, and the second exposed portion is the upper surface of the other end of the conductive functional layer; Alternatively, the first exposed portion is an adhesive groove connected to the lower surface of the conductive functional layer, and the second exposed portion is the lower surface of the conductive functional layer away from the adhesive groove.

20. The conductive tape according to claim 2, characterized in that, The first exposed portion is a portion of the lower surface of the conductive functional layer, and the second exposed portion is another portion of the lower surface of the conductive functional layer; the conductive tape also has a third exposed portion, a portion of the upper surface of the conductive functional layer is exposed from the third exposed portion, and the third exposed portion is located directly above the second exposed portion; Alternatively, the first exposed portion is a portion of the lower surface of the conductive functional layer, and the second exposed portion is a portion of the upper surface of the conductive functional layer; the conductive functional layer also has a third exposed portion, from which another portion of the lower surface of the conductive functional layer is exposed, and the third exposed portion is located directly below the second exposed portion.

21. The conductive tape according to claim 1, characterized in that, The conductive tape is cylindrical or prismatic. The conductive adhesive layer covers the outer periphery of the conductive material layer. The surface protective layer is a third protective layer covering the outer periphery of the conductive functional layer. The third protective layer only covers the middle section of the conductive functional layer, leaving both ends of the conductive functional layer exposed.

22. The conductive tape according to any one of claims 1 to 21, characterized in that, The conductive adhesive layer includes an adhesive and a conductive filler. The adhesive includes epoxy resin, phenolic resin, polyimide, acrylic resin or polyurethane. The conductive filler includes carbon, metal or metal oxide, wherein the metal includes at least Au, Ag, Cu or Ni.

23. The conductive tape according to claim 22, characterized in that, The conductive adhesive layer further includes one or more of a curing agent, a diluent, a plasticizer, a coupling agent, and a defoamer; wherein the plasticizer includes at least di-n-octyl phthalate or di-n-butyl phthalate.

24. A conductive tape assembly, characterized in that, The invention includes the conductive tape and the base film as described in any one of claims 1 to 23, wherein the conductive tape is adhered to the base film.

25. A solar cell, characterized in that, The solar cell is adhered with the conductive tape as described in any one of claims 1 to 23.

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