Light source module and manufacturing method thereof

Abstract

The invention discloses a light source module and a manufacturing method thereof. The light source module comprises a substrate, a light source and a packaging material. The light source is arranged on the substrate and comprises a light source top surface and a light source side surface; the packaging material is arranged on the substrate and wraps the light source, and a containing groove is formed in the packaging material and corresponds to the top face of the light source.

Description

Technical Field

[0001] The invention relates to a light source module, in particular to a light emitting diode light source module. Background Art

[0002] The light-emitting principle and structure of light-emitting diodes (LEDs) are different from those of traditional light sources. They have the advantages of low power consumption, long component life, no warm-up time, and fast response speed. In addition, they are small in size, vibration-resistant, suitable for mass production, and easy to be made into extremely small or array components according to application requirements. They are widely used in the market, for example, optical display devices, laser diodes, traffic signs, data storage devices, communication devices, lighting devices, and medical devices.

[0003] In the manufacturing process of existing light source modules (light emitting diode light source modules), multiple light source modules need to be separated from each other through a cutting process. However, during the cutting process, moisture may penetrate into the light source module, resulting in a decrease in the production yield of the light source module. Summary of the invention

[0004] The present invention is to solve the problems of the prior art and provide a light source module, comprising a substrate, a light source and a packaging material. The light source is arranged on the substrate, wherein the light source comprises a light source top surface and a light source side surface. The packaging material is arranged on the substrate and covers the light source, wherein the packaging material is formed with a receiving groove, and the receiving groove corresponds to the light source top surface.

[0005] In the light source module using the embodiment of the present invention, the reflective material and the wavelength conversion material are protected by the packaging material, so during the cutting process, the reflective material and the wavelength conversion material will not be contaminated by water vapor infiltration, thereby improving the production yield of the light source module. In addition, based on the structure of the packaging material, the setting position of the reflective material can be appropriately adjusted, so that the light output angle can be more easily controlled. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 is a schematic diagram of a light source module according to a first embodiment of the present invention;

[0007] Figure 2 is a schematic diagram of a light source module according to a second embodiment of the present invention;

[0008] Figure 3 is a schematic diagram of a light source module according to a third embodiment of the present invention;

[0009] Figure 4 is a schematic diagram of a light source module according to a fourth embodiment of the present invention;

[0010] Figure 5 is a flow chart of a method for manufacturing a light source module according to an embodiment of the present invention;

[0011] Figure 6 is a schematic diagram of an imprinting mold according to an embodiment of the present invention;

[0012] Figure 7 is a flow chart of a method for manufacturing a light source module according to another embodiment of the present invention;

[0013] Figure 8 A flowchart of a method for manufacturing a light source module according to another embodiment of the present invention;

[0014] Fig. 9A , Fig. 9B as well as Fig. 9C FIG. 4 is a top view of a light source module according to an embodiment of the present invention.

[0015] Explanation of symbols

[0016] M1, M2, M3, M4 ~ Light source module

[0017] 1~Substrate

[0018] 11. Reflective layer

[0019] 2. Light Source

[0020] 21~ Top surface of light source

[0021] 22~ Side of light source

[0022] 300, 301, 302, 303, 304~Packaging materials

[0023] 31, 31A, 31B, 31C, 31D, 31E, 31F~accommodation groove

[0024] 311~Side

[0025] 312~Bottom

[0026] 313~First accommodating groove section

[0027] 314~Second accommodating groove section

[0028] 41~Reflective material

[0029] 42~Wavelength conversion material

[0030] 5. Waterproof material

[0031] 51~Light-transmitting part

[0032] 52~Reflective part

[0033] 6. Mould

[0034] 61~Bump

[0035] L~Light

[0036] w1~maximum width

[0037] w2~maximum width

[0038] S11, S12, S13~Steps

[0039] S21, S22~Steps

[0040] S31, S32, S33~Steps

[0041] θ~Angle DETAILED DESCRIPTION

[0042] Figure 1 FIG. 1 is a light source module showing a first embodiment of the present invention. Figure 1 The light source module M1 of the first embodiment of the present invention comprises a substrate 1, a light source 2 and a packaging material 301. The light source 2 is disposed on the substrate 1, wherein the light source 2 comprises a light source top surface 21 and a light source side surface 22. The packaging material 301 is disposed on the substrate 1 and covers the light source 2, wherein the packaging material 301 is formed with a receiving groove 31A, and the receiving groove 31A corresponds to the light source top surface 21.

[0043] Reference Figure 1 In one embodiment, the light source module M1 further includes a reflective material 41, and the reflective material 41 is filled in the receiving groove 31A. Part of the light L provided by the light source 2 is suitable for being reflected by the reflective material 41 to adjust the light output angle. In one embodiment, a reflective layer 11 may also be provided on the surface of the substrate 1. The above disclosure does not limit the present invention.

[0044] In one embodiment, based on the configuration of the reflective material 41 and the receiving groove 31A, the central light output of the light source module M1 can be reduced, while the peripheral light output can be increased.

[0045] Reference Figure 1 In one embodiment, the depth of the receiving groove 31A is between 50 μm and 20 μm. The receiving groove section of the receiving groove 31A is a trapezoid, and there is an angle θ between the side 311 of the receiving groove section and the bottom 312 of the receiving groove section, and the angle θ is between 10 degrees and 80 degrees. The above numerical disclosure does not limit the present invention. For example, the numerical range of the angle θ may still be appropriately changed as needed.

[0046] exist Figure 1 In the embodiment of the present invention, the cross section of the receiving groove is a trapezoid. However, the above shape does not limit the present invention. In other embodiments, the cross section of the receiving groove can also be appropriately changed. Figure 2 FIG. 2 is a light source module according to a second embodiment of the present invention. Figure 2The light source module M2 of the second embodiment of the present invention includes a packaging material 302. The packaging material 302 is formed with a receiving groove 31B. In this embodiment, the receiving groove 31B has a rectangular cross section. The reflective material 41 is filled in the receiving groove 31B.

[0047] Figure 3 FIG. 2 is a light source module according to a third embodiment of the present invention. Figure 3 The light source module M3 of the third embodiment of the present invention includes a substrate 1, a light source 2 and a packaging material 303. The light source 2 is disposed on the substrate 1, wherein the light source 2 includes a light source top surface 21 and a light source side surface 22. The packaging material 303 is disposed on the substrate 1 and covers the light source 2, wherein the packaging material 303 forms a receiving groove 31C, and the receiving groove 31C corresponds to the light source top surface 21 and a portion of the light source side surface 22. In this embodiment, the light source module M3 also includes a reflective material 41, and the reflective material 41 is filled in the receiving groove 31C. Part of the light provided by the light source 2 is suitable for being reflected by the reflective material 41 to adjust the light output angle.

[0048] Reference Figure 3 In one embodiment, the light source 2 is coated with a wavelength conversion material 42, and the wavelength conversion material 42 includes quantum dot material, sulfide or phosphor. The L provided by the light source 2 is suitable for the wavelength conversion material 42 to adjust its characteristics, such as color.

[0049] Reference Figure 3 In one embodiment, the accommodating groove 31C includes a first accommodating groove section 313 and a second accommodating groove section 314. The first accommodating groove section 313 corresponds to the top surface 21 of the light source, and the second accommodating groove section 314 corresponds to a portion of the side surface 22 of the light source. The reflective material 41 is filled in the first accommodating groove section 313 and the second accommodating groove section 314. In this way, the reflective material 41 in the first accommodating groove section 313 and the second accommodating groove section 314 will reflect the light L emitted by the light source 2 to the side, forming a side-entry packaging structure.

[0050] Figure 4 FIG. 4 is a light source module according to a fourth embodiment of the present invention. Figure 4 The light source module M4 of the fourth embodiment of the present invention includes a substrate 1, a light source 2 and a packaging material 304. The light source 2 is disposed on the substrate 1, wherein the light source 2 includes a light source top surface 21 and a light source side surface 22. The packaging material 304 is disposed on the substrate 1 and covers the light source 2, wherein the packaging material 304 forms a receiving groove 31, and the receiving groove 31 corresponds to the light source top surface 21. In this embodiment, the light source module M4 also includes a wavelength conversion material 42, and the wavelength conversion material 42 is filled in the receiving groove 31, wherein the wavelength conversion material 42 includes quantum dot material, sulfide or phosphor. Part of the light L provided by the light source 2 is suitable for the wavelength conversion material 42 to adjust its characteristics, such as color.

[0051] Reference Figure 4 , the maximum width w1 of the accommodating groove 31 is smaller than the maximum width w2 of the packaging material 304 .

[0052] Reference Figure 4 In one embodiment, the light source module M4 further includes a waterproof material 5, wherein the waterproof material 5 covers the packaging material 304. In one embodiment, the waterproof coefficient WVTR (Water Vapor Transmission Rate) of the waterproof material is less than 10 -3 g / m 2 / day. The waterproof material 5 can be used to further block water vapor. In one embodiment, the waterproof material 5 can include glass (SiO2).

[0053] Reference Figure 4 In one embodiment, the waterproof material 5 includes a light-transmitting portion 51 and a light-reflecting portion 52 . The light-transmitting portion 51 covers the wavelength conversion material 42 , and the light-reflecting portion 52 surrounds the side of the packaging material 304 .

[0054] Figure 5 FIG. 1 is a flow chart showing a method for manufacturing a light source module according to an embodiment of the present invention. Figure 5 In one embodiment, the present invention further provides a method for manufacturing a light source module, comprising the following steps. First, a substrate and a plurality of light sources are provided, wherein the plurality of light sources are disposed on the substrate (S11). Then, a packaging material is provided, and the packaging material is disposed on the substrate to cover the plurality of light sources (S12). Next, a plurality of receiving grooves are formed on the packaging material by embossing, and the plurality of receiving grooves correspond to the plurality of light sources (S13).

[0055] In one embodiment, during the stamping process, the packaging material is controlled to be in an uncured state (semi-fluid, B-stage), so that the step of forming a plurality of receiving grooves by stamping can be achieved.

[0056] Figure 6 This is a mold for imprinting an embodiment of the present invention. Figure 1 , Figure 6 In one embodiment, the receiving groove 31A is formed by stamping of a mold 6, and the hardness of the mold 6 is greater than the hardness of the packaging material 301 when stamped. The mold 6 includes a plurality of protrusions 61, and the protrusions 61 are suitable for forming the receiving groove 31A.

[0057] Figure 7 FIG. 1 is a flow chart showing a method for manufacturing a light source module according to another embodiment of the present invention. Figure 1 , Figure 2 , Figure 3 , Figure 7In one embodiment, the method for manufacturing a light source module further includes the following steps: Filling a reflective material into a plurality of receiving grooves (S21). Then, cutting the substrate and the packaging material to form a plurality of light source modules (S22). Application Figure 5 , Figure 7 The light source module manufacturing method process shown in the embodiment can be used to manufacture the light source modules of the first, second and third embodiments mentioned above.

[0058] Figure 8 FIG. 1 is a flow chart showing a method for manufacturing a light source module according to another embodiment of the present invention. Figure 4 , Figure 7 In one embodiment, the light source module manufacturing method further includes the following steps: Filling a wavelength conversion material into a plurality of receiving grooves (S31). Then, covering the packaging material and the wavelength conversion material with a waterproof material (S32). Next, cutting the substrate and the waterproof material to form a plurality of light source modules (S33). Application Figure 5 , Figure 8 The light source module manufacturing method process shown in the embodiment can be used to manufacture the light source module of the fourth embodiment mentioned above.

[0059] In one embodiment, the cut light source module is a single package structure. In one embodiment, the cut light source module belongs to a near chip scale package (NCSP), which is a cavity-free structure.

[0060] Fig. 9A , Fig. 9B as well as Fig. 9C is a top view showing a light source module according to an embodiment of the present invention. Fig. 9A , Fig. 9B as well as Fig. 9C In the embodiment of the present invention, the shape of the receiving groove can be changed as needed. Fig. 9A In the embodiment, the receiving groove 31D is formed in the packaging material 300, and the receiving groove 31D is rectangular. Fig. 9B In the embodiment, the receiving groove 31E is formed in the packaging material 300, and the receiving groove 31E is circular. Fig. 9C In the embodiment, the receiving groove 31F is formed in the packaging material 300, and the receiving groove 31F is in a rhombus shape. By changing the shape of the receiving groove, the designer can adjust the light output angle conveniently. The above disclosure does not limit the present invention.

[0061] The light source module of the embodiment of the present invention can be applied to large light angle package light source module components, for example, automotive backlight, TV backlight, display backlight, where the requirement is a large light angle, and the light angle is defined as between 150 degrees and 170 degrees. In one embodiment, the light source module may include components such as a blue light source, a wavelength conversion material, and an optical film. In one embodiment, the light source module may include components such as a white light source and an optical film.

[0062] In one embodiment, when the light source is a chip scale package (CSP), the light source is suitable for being matched with a structure in which a reflective material is filled in the receiving groove.

[0063] In one embodiment, when the light source is a blue light chip, the light source is suitable for a structure in which a reflective material is filled in the receiving groove. Moreover, the blue light chip is also suitable for a structure in which a wavelength conversion material is filled in the receiving groove, wherein the wavelength conversion material includes quantum dot material, sulfide or phosphor.

[0064] In the light source module using the embodiment of the present invention, the reflective material / wavelength conversion material is protected by the packaging material, so the reflective material / wavelength conversion material will not be contaminated by water vapor infiltration during the cutting process, thereby improving the production yield of the light source module. In addition, based on the structure of the packaging material, the setting position of the reflective material can be appropriately adjusted, so that the light output angle can be more easily controlled.

[0065] Although the present invention has been disclosed as above with specific preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this technology can make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the definition of the attached claims.

Claims

1. A method for manufacturing a light source module, comprising the following steps: A substrate and a plurality of light sources are provided, wherein: The plurality of light sources are disposed on the substrate; Providing a packaging material, and placing the packaging material on the substrate to cover the plurality of light sources; as well as A plurality of accommodating grooves are formed on the packaging material by means of embossing, and the plurality of accommodating grooves correspond to the plurality of light sources.

2. The method for manufacturing a light source module according to claim 1, wherein: During the stamping process, the encapsulating material is controlled in an uncured state (B-stage).

3. The method for manufacturing a light source module according to claim 1, wherein: The containing groove is formed by stamping with a mold, and the hardness of the mold is greater than the hardness of the packaging material when stamped.

4. A light source module, comprising: substrate; A light source is disposed on the substrate, wherein the light source includes a light source top surface and a light source side surface; and The packaging material is arranged on the substrate and covers the light source, wherein the packaging material is formed with a receiving groove corresponding to the top surface of the light source.

5. The light source module according to claim 4, wherein: The light source includes a chip scale package (Chip Scale Package, CSP).

6. The light source module according to claim 4, wherein: The light source includes a blue light chip. 7 . The light source module as claimed in claim 5 , further comprising a reflective material filled in the receiving groove.

8. The light source module as claimed in claim 6, further comprising a wavelength conversion material, wherein the wavelength conversion material is filled in the receiving groove, wherein: The wavelength conversion material includes quantum dot material, sulfide or phosphor.

9. The light source module according to claim 8, further comprising a waterproof material, wherein: The waterproof material covers the packaging material.

10. The light source module according to claim 9, wherein: The waterproof material comprises a light-transmitting portion and a light-reflecting portion, wherein the light-transmitting portion covers the wavelength conversion material, and the light-reflecting portion surrounds the side of the packaging material.

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