Display panel, display device and preparation method of display panel

Abstract

The invention discloses a display panel, a display device and a preparation method of the display panel. The display panel comprises a substrate, a dam, a first conductive layer, a second conductive layer and an isolation structure. The isolation structure is electrically connected with a second conductive part of the second conductive layer, the second conductive part extends to the hole region, the isolation structure and the second conductive part are in different layers, and the second conductive part provides a channel close to one side of the substrate for the isolation structure and is electrically connected with a structure in the hole region before cutting, so that a primary battery structure is formed, and side etching of the isolation structure is realized. The resistivity of the second conductive part is greater than at least part of the isolation structure, and the second conductive part is difficult to corrode by electrolyte during subsequent reliability test, so that the packaging failure caused by corrosion invasion of the electrolyte is relieved, the packaging reliability of the isolation structure and the second conductive part is improved, and the side etching stability of the isolation structure is improved. Therefore, the use performance of the OLED display panel is improved.

Description

Technical Field

[0001] The present application relates to the display field, and in particular to a display panel, a display device and a method for manufacturing a display panel. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the invention

[0004] The embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel, aiming to improve the performance of OLED display products.

[0005] In a first aspect, an embodiment of the present application provides a display panel, which includes adjacent display areas and non-display areas, wherein the non-display area includes a transition area and a hole area, wherein the transition area is located between the display area and the hole area, and the display panel further includes: a substrate; a dam located on one side of the substrate and in the non-display area; a first conductive layer located between the substrate and the dam, wherein the first conductive layer includes a first conductive portion located in the transition area; a second conductive layer located between the substrate and the dam, wherein the second conductive layer includes a second conductive portion located in the transition area, wherein the second conductive portion extends to the hole area from a side of the display area; an isolation structure located on a side of the first conductive layer and the second conductive layer away from the substrate, wherein at least two isolation structures are spaced apart and connected by a bridge connected by the first conductive portion, wherein a portion of the isolation structure is electrically connected to the second conductive portion, and the resistivity of the second conductive portion is greater than the resistivity of at least a portion of the isolation structure.

[0006] According to the implementation of the first aspect of the present application, the display panel also includes: a first insulating layer, located between the second conductive layer and the isolation structure, the first insulating layer is provided with a first via hole, the first via hole is located in the transition zone, and part of the isolation structure is electrically connected to the second conductive part through the first via hole.

[0007] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel includes a first group of isolation structures and a second group of isolation structures, the first group of isolation structures includes at least two isolation structures, the second group of isolation structures includes at least one isolation structure, multiple isolation structures in the first group of isolation structures are electrically connected through a first conductive portion, and multiple isolation structures in the second group of isolation structures are electrically connected to the second conductive portion through a first via.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structures in the second group of isolation structures are electrically connected to the isolation structures in the first group of isolation structures.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the second group of isolation structures includes a plurality of isolation structures, and the plurality of isolation structures are electrically connected to the second conductive portion through a plurality of first vias.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, there are multiple first group isolation structures, there are multiple first conductive parts, and one group of first group isolation structures is electrically connected to one first conductive part.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel includes a first connecting portion, and the isolation structure in the second group of isolation structures is electrically connected to the isolation structure in the first group of isolation structures through the first connecting portion.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the first connecting portion and the isolation structure are arranged on the same layer.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel includes a second connecting portion, and adjacent first conductive portions are electrically connected via the second connecting portion.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the second connecting portion and the first conductive portion are provided in the same layer.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, the second conductive layer is located between the first conductive layer and the substrate.

[0016] According to any of the aforementioned implementations of the first aspect of the present application, the display panel includes an active layer located on one side of the substrate, and the second conductive layer is arranged on the same layer as the active layer.

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes a first metal layer, a second metal layer and a third metal layer arranged in sequence along the direction of the active layer away from the substrate, and the first conductive portion and one of the first metal layer, the second metal layer and the third metal layer are arranged on the same layer.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure is ring-shaped around the hole area.

[0019] According to any of the aforementioned embodiments of the first aspect of the present application, the first conductive portion is ring-shaped around the hole area.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, the second conductive portion is ring-shaped around the hole area.

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the second conductive portion on the substrate is located outside the orthographic projection of the first conductive portion on the substrate.

[0022] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes: a second insulating layer, located between the first conductive layer and the isolation structure, a second via hole is opened on the second insulating layer, the second via hole is located in the transition zone, and at least two adjacent isolation structures are electrically connected to the first conductive part through the second via hole.

[0023] An embodiment of a second aspect of the present application provides a display device, which includes a display panel according to any of the above embodiments.

[0024] An embodiment of a third aspect of the present application provides a method for manufacturing a display panel, wherein the display panel includes a display area and a non-display area adjacent to each other, wherein the non-display area includes a transition area and a hole area, and the transition area is located between the display area and the hole area, and the method includes:

[0025] A second conductive layer is prepared on the substrate, wherein the second conductive layer comprises a second conductive portion located in the transition area, and a side of the second conductive portion away from the display area extends to the hole area;

[0026] Preparing a first conductive layer on the substrate, the first conductive layer comprising a first conductive portion located in the transition region;

[0027] An isolation structure is prepared on the side of the first conductive layer and the second conductive layer facing away from the substrate, at least two isolation structures are arranged at intervals and connected by a first conductive part bridge, some isolation structures are electrically connected to the second conductive part, and the resistivity of the second conductive part is greater than the resistivity of at least some isolation structures.

[0028] According to the display panel of the embodiment of the present application, the display panel includes a display area and a non-display area, the display area is used to realize the luminous display of the display panel, the non-display area includes a transition area and a hole area, and the hole area is used to set the under-screen camera module. The display panel also includes a substrate, a dam, a first conductive layer, a second conductive layer and an isolation structure. At least two isolation structures are connected by a bridge through the first conductive part of the first conductive layer, so that the water vapor channel between the isolation structures is disconnected, and the water vapor needs to be corroded ring by ring along the isolation structure, which increases the difficulty of water vapor invading along the isolation structure. The isolation structure is electrically connected to the second conductive part of the second conductive layer, and the second conductive part extends to the hole area. The isolation structure and the second conductive part are different layers. The second conductive part provides a channel close to one side of the substrate for the isolation structure, and is electrically connected to the structure in the hole area before cutting to form a primary battery structure, so as to realize the side engraving of the isolation structure. And the isolation structure and the second conductive part are located in different layers, and it is difficult for water vapor to invade between the second conductive part and the isolation structure of different layers, which increases the difficulty of water vapor invasion. The resistivity of the second conductive part is greater than that of at least part of the isolation structure. During subsequent reliability testing, the second conductive part is difficult to be corroded by the electrolyte, thereby alleviating packaging failure caused by corrosion invasion of the electrolyte, improving the packaging reliability of the isolation structure and the second conductive part, and the side engraving stability of the isolation structure, thereby improving the performance of the OLED display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0030] Figure 1 is a schematic top view of a display panel provided in an embodiment of the present application;

[0031] Figure 2 is a partial cross-sectional view of a display panel provided in an embodiment of the present application;

[0032] Figure 3 is a partial cross-sectional view of a display panel provided by another embodiment;

[0033] Figure 4 is a partial cross-sectional view of a display panel provided by yet another embodiment;

[0034] Figure 5 is a partial cross-sectional view of a display panel provided in yet another embodiment;

[0035] Figure 6 is a partial cross-sectional view of a display panel provided by yet another embodiment;

[0036] Figure 7 is a partial top view of a display panel provided in an embodiment of the present application;

[0037] Figure 8 is a partial top view of a display panel provided by another embodiment;

[0038] Fig. 9 is a partial top view of a display panel provided in yet another embodiment;

[0039] Fig.10 It is a schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0040] Figures 11 to 16 This is a diagram of a preparation process of a display panel provided in an embodiment of the present application.

[0041] Description of reference numerals:

[0042] 10. Display panel; AA, display area; NA, non-display area; NA1, transition area; NA2, hole area;

[0043] 100. Substrate;

[0044] 200. embankment;

[0045] 300, first conductive layer; 310, first conductive portion; 320, second connecting portion;

[0046] 400, second conductive layer; 410, second conductive portion;

[0047] 500, isolation structure; 501, first group of isolation structures; 502, second group of isolation structures; 503, first connecting portion;

[0048] 600, first insulating layer; 610, first via hole;

[0049] 700, second insulating layer; 710, second via hole. DETAILED DESCRIPTION

[0050] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0051] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0052] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0053] The embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel. The embodiments of the display panel, the display device, and the method for manufacturing a display panel are described below in conjunction with the accompanying drawings.

[0054] An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel.

[0055] Please also read Figure 1 and Figure 2 , Figure 1 is a schematic top view of a display panel provided in an embodiment of the present application; Figure 2 It is a partial cross-sectional view of a display panel provided in an embodiment of the present application.

[0056] like Figure 1 and Figure 2As shown, the first embodiment of the present application provides a display panel 10, the display panel 10 includes a display area AA and a non-display area NA adjacent to each other, the non-display area NA includes a transition area NA1 and a hole area NA2, the transition area NA1 is located between the display area AA and the hole area NA2, the display panel 10 also includes: a substrate 100; a dam 200, located on one side of the substrate 100 and located in the non-display area NA; a first conductive layer 300, located between the substrate 100 and the dam 200, the first conductive layer 300 includes a first conductive portion 310 located in the transition area NA1; a second conductive layer 400 , located between the substrate 100 and the dam 200, the second conductive layer 400 includes a second conductive portion 410 located in the transition area NA1, and the second conductive portion 410 extends to the hole area NA2 away from the side of the display area AA; the isolation structure 500 is located on the side of the first conductive layer 300 and the second conductive layer 400 away from the substrate 100, at least two isolation structures 500 are arranged at intervals and connected by a bridge of the first conductive portion 310, part of the isolation structure 500 is electrically connected to the second conductive portion 410, and the resistivity of the second conductive portion 410 is greater than the resistivity of at least part of the isolation structure 500.

[0057] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a display area AA and a non-display area NA, the display area AA is used to realize the luminous display of the display panel 10, the non-display area NA includes a transition area NA1 and a hole area NA2, and the hole area NA2 is used to set the under-screen camera module. The display panel 10 also includes a substrate 100, a dam 200, a first conductive layer 300, a second conductive layer 400 and an isolation structure 500, at least two isolation structures 500 are connected by a bridge through the first conductive portion 310 of the first conductive layer 300, so that the water vapor channel between the isolation structures 500 is disconnected, and the water vapor needs to erode along the isolation structure 500 ring by ring, which increases the difficulty of water vapor invading along the isolation structure 500. The isolation structure 500 is electrically connected to the second conductive part 410 of the second conductive layer 400, and the second conductive part 410 extends to the hole area NA2. The isolation structure 500 and the second conductive part 410 are in different layers. The second conductive part 410 provides a channel for the isolation structure 500 close to the side of the substrate 100, and is electrically connected to the structure in the hole area NA2 before cutting to form a primary battery structure, so as to realize the side engraving of the isolation structure 500. In addition, the isolation structure 500 and the second conductive part 410 are located in different layers, and it is difficult for water vapor to invade between the second conductive part 410 and the isolation structure 500 in different layers, thereby increasing the difficulty of water vapor invasion. The resistivity of the second conductive part 410 is greater than that of at least part of the isolation structure 500. When the reliability test is performed later, the second conductive part 410 is difficult to be corroded by the electrolyte, so as to alleviate the packaging failure caused by the corrosion invasion of the electrolyte, improve the packaging reliability of the isolation structure 500 and the second conductive part 410, and the side engraving stability of the isolation structure 500, thereby improving the performance of the OLED display panel 10.

[0058] Optionally, the isolation structure 500 includes at least a first layer and a second layer, the second layer is located on the side of the first layer facing away from the substrate 100, the surface of the first layer close to the second layer is located within the orthographic projection of the surface of the second layer close to the first layer on the substrate 100, that is, the first layer is equivalent to a concave setting of the second layer, which can increase the invasion path of water vapor.

[0059] Optionally, the isolation structure 500 further includes a third layer, which is located on the side of the first layer close to the substrate 100. Since the etching rate of the first layer is relatively fast, the etching waste generated is relatively large and is easy to enter other positions of the display panel 10, thereby causing adverse effects. After the third layer is provided, the first layer can be well attached to the third layer, and the generated etching waste falls on the third layer, which is easy to clean.

[0060] Optionally, the second layer material is titanium (Ti) or molybdenum (Mo), the first layer material is aluminum (Al), silver (Ag) or copper (Cu), and the third layer material is titanium (Ti) or molybdenum (Mo). For example, the isolation structure 500 is a three-layer metal composite material of Ti / Al / Ti (titanium / aluminum / titanium) or Ti / Al / Mo (titanium / aluminum / molybdenum).

[0061] Before the hole area NA2 of the display panel 10 is cut, the display panel 10 is a motherboard. In the motherboard of the display panel 10, a plurality of spaced first conductive parts 310 and an isolation structure 500 are arranged in the hole area NA2. The isolation structure 500 is arranged on the side of the first conductive part 310 away from the substrate 100 and is in contact with and electrically connected to the first conductive part 310. The second conductive part 410 extends into the hole area NA2 and is electrically connected to the isolation structure 500 in the hole area NA2, thereby achieving electrical connection with the first conductive part 310 in the hole area NA2. In the subsequent wet process, the developer, the first conductive part 310 in the hole area NA2 and the isolation structure 500 in the transition area NA1 jointly form a primary battery structure, and the first layer of the isolation structure 500 in the transition area NA1, that is, the Al layer, undergoes electrochemical corrosion, thereby achieving side engraving of the isolation structure 500.

[0062] In some optional embodiments, the display panel 10 also includes: a first insulating layer 600, located between the second conductive layer 400 and the isolation structure 500, the first insulating layer 600 is provided with a first via hole 610, the first via hole 610 is located in the transition area NA1, and part of the isolation structure 500 is electrically connected to the second conductive part 410 through the first via hole 610.

[0063] In these optional embodiments, the first insulating layer 600 is located between the second conductive layer 400 and the isolation structure 500, the isolation structure 500 is electrically connected to the second conductive portion 410 through the first via 610, and the second conductive portion 410 of the second conductive layer 400 provides a channel below the first insulating layer 600 for the isolation structure 500 to achieve side engraving of the isolation structure 500. The second conductive layer 400 is located below the first insulating layer 600, so that the first insulating layer 600 encapsulates the second conductive layer 400, and it is difficult for water vapor to invade through the second conductive portion 410, thereby improving the encapsulation effect.

[0064] Optionally, the material of the first insulating layer 600 includes an inorganic material, which has good compactness and good water vapor barrier capability, thereby increasing the difficulty of water vapor invasion, for example, silicon oxide, silicon nitride, and the like.

[0065] Optionally, the first insulating layer 600 is located between the first conductive layer 300 and the second conductive layer 400 .

[0066] Optionally, the display panel 10 further includes a first planarization layer located on a side of the first insulating layer 600 facing away from the substrate 100 .

[0067] Optionally, the display panel 10 further includes a second planarization layer located on the side of the first planarization layer away from the substrate 100. The isolation structure 500 is prepared after the first planarization layer is prepared, and the second planarization layer is prepared after the second planarization layer is prepared. The first planarization layer and the second planarization layer are partially stacked in the non-display area NA to form a dam 200.

[0068] See also Figure 3 , Figure 3 is a partial cross-sectional view of a display panel provided by another embodiment.

[0069] like Figure 3 As shown, in some optional embodiments, the display panel 10 includes a first group of isolation structures 501 and a second group of isolation structures 502, the first group of isolation structures 501 includes at least two isolation structures 500, the second group of isolation structures 502 includes at least one isolation structure 500, the multiple isolation structures 500 in the first group of isolation structures 501 are electrically connected through the first conductive part 310, and the multiple isolation structures 500 in the second group of isolation structures 502 are electrically connected to the second conductive part 410 through the first via 610.

[0070] In these optional embodiments, in the first group of isolation structures 501, multiple isolation structures 500 are connected by a bridge through the same first conductive part 310, so that multiple isolation structures 500 are connected in the first conductive layer 300, thereby avoiding direct connection and connection of multiple isolation structures 500 in the same layer. The spacing of multiple isolation structures 500 makes the water vapor intrusion channel discontinuous, and the water vapor needs to corrode along the isolation structure 500 ring by ring, which increases the difficulty of water vapor intrusion along the isolation structure 500 and improves the packaging reliability. In the second group of isolation structures 502, the isolation structure 500 is electrically connected to the second conductive part 410 through the first via 610, and the second conductive part 410 of the second conductive layer 400 provides a channel below the first insulating layer 600 for the isolation structure 500 to achieve over-etching of the isolation structure 500.

[0071] In some optional embodiments, the isolation structures 500 in the second group of isolation structures 502 are electrically connected to the isolation structures 500 in the first group of isolation structures 501 .

[0072] In these optional embodiments, the isolation structures 500 in the first group of isolation structures 501 and the isolation structures 500 in the second group of isolation structures 502 are electrically connected, so that all isolation structures 500 can be turned on and connected to the hole area NA2 through the second conductive portion 410, thereby realizing side engraving of each isolation structure 500.

[0073] See also Figure 4 , Figure 4 is a partial cross-sectional view of a display panel provided by yet another embodiment.

[0074] like Figure 4 As shown, in some optional embodiments, the second group of isolation structures 502 includes a plurality of isolation structures 500 , and the plurality of isolation structures 500 are electrically connected to the second conductive portion 410 through a plurality of first vias 610 .

[0075] In these optional embodiments, in the second group of isolation structures 502, multiple isolation structures 500 are connected across the bridge through the same second conductive portion 410, so that the multiple isolation structures 500 are conductive in the second conductive layer 400, thereby avoiding direct connection and conduction between the multiple isolation structures 500 in the same layer. The spacing between the multiple isolation structures 500 makes the water vapor intrusion channel discontinuous, and the water vapor needs to corrode along the isolation structure 500 ring by ring, which increases the difficulty of water vapor invading along the isolation structure 500 and improves the packaging reliability.

[0076] See also Figure 5 , Figure 5 is a partial cross-sectional view of a display panel provided in yet another embodiment.

[0077] like Figure 5As shown, in some optional embodiments, there are multiple first group isolation structures 501 , there are multiple first conductive parts 310 , and one group of first group isolation structures 501 is electrically connected to one first conductive part 310 .

[0078] In these optional embodiments, the first group of isolation structures 501 is provided in plurality, that is, a plurality of isolation structures 500 are provided, and in each first group of isolation structures 501, a plurality of isolation structures 500 are connected by a bridge of the same first conductive portion 310. Providing a plurality of first groups of isolation structures 501 can further increase the path for water vapor to invade, and the number of isolation structures 500 that water vapor needs to corrode ring by ring is greater, further increasing the difficulty of water vapor invading along the isolation structure 500, thereby improving the reliability of packaging.

[0079] See also Figures 6 to 9 , Figure 6 is a partial cross-sectional view of a display panel provided by yet another embodiment; Figure 7 is a partial top view of a display panel provided in an embodiment of the present application; Figure 8 is a partial top view of a display panel provided by another embodiment; Fig. 9 FIG. 4 is a partial top view of a display panel provided in yet another embodiment.

[0080] like Figures 6 to 9 As shown, in some optional embodiments, the display panel 10 includes a first connecting portion 503 , and the isolation structure 500 in the second group of isolation structures 502 is electrically connected to the isolation structure 500 in the first group of isolation structures 501 via the first connecting portion 503 .

[0081] In these optional embodiments, the first connecting portion 503 is connected between the isolation structure 500 in the first group of isolation structures 501 and the isolation structure 500 in the second group of isolation structures 502, so that the isolation structure 500 in the first group of isolation structures 501 can be electrically conductive with the isolation structure 500 in the second group of isolation structures 502, and connected to the hole area NA2 through the second conductive portion 410, thereby realizing side engraving of each isolation structure 500.

[0082] Optionally, the first connection portion 503 and the isolation structure 500 are arranged in the same layer, so that the first connection portion 503 can be manufactured synchronously with the isolation structure 500, thereby simplifying the manufacturing process.

[0083] In some optional embodiments, the display panel 10 includes a second connection portion 320 , and adjacent first conductive portions 310 are electrically connected via the second connection portion 320 .

[0084] In these optional embodiments, in each group of first-group isolation structures 501, multiple isolation structures 500 are electrically connected through the same first conductive portion 310, and two adjacent first conductive portions 310 are connected through a second connecting portion 320, so that the multiple isolation structures 500 in two adjacent groups of first-group isolation structures 501 are electrically conductive, and all isolation structures 500 can be connected to the hole area NA2 through the second conductive portion 410, thereby realizing side engraving of the isolation structure 500.

[0085] Optionally, the second connection part 320 and the first conductive part 310 are arranged in the same layer, so that the second connection part 320 can be prepared simultaneously with the first conductive part 310, thereby simplifying the preparation process.

[0086] Optionally, the second conductive layer 400 is located between the first conductive layer 300 and the substrate 100 , and the first conductive layer 300 and the second conductive layer 400 are arranged in different layers, so that it is difficult for water vapor to invade between the first conductive layer 300 and the second conductive layer 400 .

[0087] In some optional embodiments, the display panel 10 includes an active layer located on one side of the substrate 100 , and the second conductive layer 400 is disposed on the same layer as the active layer.

[0088] In these optional embodiments, the second conductive layer 400 is disposed in the same layer as the active layer, so that the second conductive part 410 can be prepared synchronously with the active layer, simplifying the preparation process. The second conductive part 410 is made of the same material as the active layer, and the material of the second conductive part 410 includes semiconductor materials, such as doped polycrystalline silicon (P-Si), indium gallium zinc oxide (IGZO), etc. The semiconductor material has a large resistance and a good barrier effect to water vapor. When performing subsequent reliability testing, the second conductive part 410 is difficult to be corroded by the electrolyte, so as to alleviate the packaging failure caused by the corrosion invasion of the electrolyte, improve the packaging reliability of the isolation structure 500 and the second conductive part 410, and the side engraving stability of the isolation structure 500.

[0089] In some optional embodiments, the display panel 10 also includes a first metal layer, a second metal layer and a third metal layer arranged in sequence along the direction of the active layer away from the substrate 100, and the first conductive portion 310 is arranged on the same layer as one of the first metal layer, the second metal layer and the third metal layer.

[0090] In these optional embodiments, the first conductive portion 310 is arranged in the same layer as the first metal layer, the second metal layer, and the third metal layer, so that the first conductive portion 310 can be prepared simultaneously with the first metal layer, the second metal layer, and the third metal layer to simplify the preparation process. For example, the first metal layer includes a gate, the second metal layer includes a capacitor plate, and the third metal layer includes a source and a drain.

[0091] Optionally, the first conductive part 310 and the first metal layer are provided in the same layer.

[0092] Optionally, the material of the first conductive part 310 includes molybdenum (Mo).

[0093] Optionally, the isolation structure 500 is annular around the hole area NA2, and the annular isolation structure 500 is arranged around the hole area NA2, which increases the setting range of the isolation structure 500, improves the barrier ability of the isolation structure 500 to water vapor, and improves the packaging effect.

[0094] In some optional embodiments, the first conductive portion 310 is annular around the hole area NA2, and the annular first conductive portion 310 is arranged around the hole area NA2, thereby increasing the setting range of the first conductive portion 310, improving the water vapor barrier capability of the first conductive portion 310, and improving the packaging effect.

[0095] In some optional embodiments, the second conductive portion 410 is annular around the hole area NA2, and the annular second conductive portion 410 is arranged around the hole area NA2, thereby increasing the setting range of the second conductive portion 410, improving the water vapor barrier capability of the second conductive portion 410, and improving the packaging effect.

[0096] In some optional embodiments, the orthographic projection of the second conductive portion 410 on the substrate 100 is located outside the orthographic projection of the first conductive portion 310 on the substrate 100 .

[0097] In these optional embodiments, since the isolation structure 500 within the first group of isolation structures 501 is electrically connected via the first conductive part 310, and the isolation structure 500 within the second group of isolation structures 502 is electrically connected via the second conductive part 410, the first conductive part 310 and the second conductive part 410 are staggered, thereby avoiding interference between the connection channel between the isolation structure 500 and the first conductive part 310 and the connection channel between the isolation structure 500 and the second conductive part 410, thereby ensuring the electrical connection stability of the isolation structure 500.

[0098] In some optional embodiments, the display panel 10 also includes: a second insulating layer 700, located between the first conductive layer 300 and the isolation structure 500, a second via hole 710 is opened on the second insulating layer 700, and the second via hole 710 is located in the transition area NA1, and at least two adjacent isolation structures 500 are electrically connected to the first conductive part 310 through the second via hole 710.

[0099] In these optional embodiments, the second insulating layer 700 is located between the first conductive layer 300 and the isolation structure 500, the isolation structure 500 is electrically connected to the first conductive portion 310 through the second via 710, and the first conductive portion 310 of the first conductive layer 300 provides a channel below the second insulating layer 700 for the isolation structure 500, thereby realizing electrical connection of the mutually spaced isolation structures 500. The first conductive layer 300 is located below the second insulating layer 700, so that the second insulating layer 700 encapsulates the first conductive layer 300, and it is difficult for water vapor to invade through the first conductive portion 310, thereby improving the encapsulation effect.

[0100] Optionally, the first via hole 610 is provided through the first insulating layer 600 and the second insulating layer 700 .

[0101] Optionally, the material of the second insulating layer 700 includes an inorganic material, which has good compactness and good barrier capability to water vapor, thereby increasing the difficulty of water vapor intrusion, for example, silicon oxide, silicon nitride, and the like.

[0102] Optionally, the display panel 10 further includes: a first encapsulation layer located on a side of the isolation structure 500 facing away from the substrate 100 .

[0103] Optionally, the material of the first encapsulation layer includes an inorganic material. The inorganic material has good density and good barrier properties against water vapor and oxygen.

[0104] In some optional embodiments, the display panel 10 further includes: a second encapsulation layer, located on the side of the first encapsulation layer away from the substrate 100 and on the side of the dam 200 toward the display area AA; a third encapsulation layer, located on the side of the second encapsulation layer away from the substrate 100 and extending to the side of the dam 200 away from the display area AA.

[0105] In these optional embodiments, the second encapsulation layer is blocked by the dam 200 at the side of the dam 200 facing the display area AA, thereby preventing the second encapsulation layer from overflowing to the side of the dam 200 away from the display area AA.

[0106] Optionally, the material of the second encapsulation layer is an organic material.

[0107] Optionally, the material of the third encapsulation layer is an inorganic material. The first encapsulation layer, the second encapsulation layer and the third encapsulation layer are respectively encapsulated with an inorganic material, an organic material and an inorganic material to form a TFE (Thin Film Encapsulation, TFE) thin film encapsulation structure to further improve the encapsulation performance.

[0108] The structural design in this embodiment can be applied to other display panels 10 , and the specific selection can be made according to actual conditions, and this application does not impose any specific restrictions on it.

[0109] The embodiment of the second aspect of the present application further provides a display device, comprising the display panel 10 of any of the above embodiments. Since the display device provided by the embodiment of the second aspect of the present application comprises the display panel 10 of any of the above embodiments, the display device provided by the embodiment of the second aspect of the present application has the beneficial effects of the display panel 10 of any of the above embodiments, which will not be described in detail here.

[0110] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0111] The third aspect of the present application also provides a method for preparing a display panel 10. The display panel 10 may be the display panel 10 provided by any of the above embodiments. Figures 1 to 9 , and see Fig.10 Fig.16 , Fig.10 It is a schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application; Figures 11 to 16 1 is a diagram of a manufacturing process of a display panel provided by an embodiment of the present application. The display panel 10 includes adjacent display area AA and non-display area NA, the non-display area NA includes a transition area NA1 and a hole area NA2, the transition area NA1 is located between the display area AA and the hole area NA2, and the method includes:

[0112] Step S01: preparing a second conductive layer 400 on the substrate 100, the second conductive layer 400 includes a second conductive portion 410 located in the transition area NA1, and the second conductive portion 410 extends from a side away from the display area AA to the hole area NA2;

[0113] Step S02: preparing a first conductive layer 300 on the substrate 100, wherein the first conductive layer 300 includes a first conductive portion 310 located in the transition area NA1;

[0114] Step S03: Prepare an isolation structure 500 on the side of the first conductive layer 300 and the second conductive layer 400 facing away from the substrate 100, at least two isolation structures 500 are arranged at intervals and connected by a bridge of the first conductive part 310, part of the isolation structure 500 is electrically connected to the second conductive part 410, and the resistivity of the second conductive part 410 is greater than the resistivity of at least part of the isolation structure 500.

[0115] According to the preparation method of the embodiment of the present application, the second conductive layer 400 is prepared by step S01. The first conductive layer 300 is prepared by step S02. The isolation structure 500 is prepared by step S03. At least two isolation structures 500 are connected by the first conductive part 310 of the first conductive layer 300, so that the water vapor channel between the isolation structures 500 is disconnected, and the water vapor needs to be corroded ring by ring along the isolation structure 500, which increases the difficulty of water vapor invading along the isolation structure 500. The isolation structure 500 is electrically connected to the second conductive part 410 of the second conductive layer 400, and the second conductive part 410 extends to the hole area NA2. The isolation structure 500 and the second conductive part 410 are different layers. The second conductive part 410 provides a channel close to the side of the substrate 100 for the isolation structure 500, and is electrically connected to the structure in the hole area NA2 before cutting, forming a primary battery structure, and realizing the side engraving of the isolation structure 500. Furthermore, the isolation structure 500 and the second conductive part 410 are located in different layers, so it is difficult for water vapor to invade between the second conductive part 410 and the isolation structure 500 in different layers, thereby increasing the difficulty of water vapor invasion. The resistivity of the second conductive part 410 is greater than that of at least part of the isolation structure 500. During subsequent reliability testing, the second conductive part 410 is difficult to be corroded by the electrolyte, thereby alleviating the packaging failure caused by the corrosion invasion of the electrolyte, improving the packaging reliability of the isolation structure 500 and the second conductive part 410, and the side engraving stability of the isolation structure 500, thereby improving the performance of the OLED display panel 10.

[0116] like Fig.16 As shown, in some optional embodiments, after step S03, the method further includes:

[0117] The hole area NA2 of the display panel 10 is cut, and all film layers of the display panel 10 in the hole area NA2 are removed.

[0118] Before the hole area NA2 of the display panel 10 is cut, the display panel 10 is a motherboard. In the motherboard of the display panel 10, a plurality of spaced first conductive parts 310 and an isolation structure 500 are arranged in the hole area NA2. The isolation structure 500 is arranged on the side of the first conductive part 310 away from the substrate 100 and is in contact with and electrically connected to the first conductive part 310. The second conductive part 410 extends into the hole area NA2 and is electrically connected to the isolation structure 500 in the hole area NA2, thereby achieving electrical connection with the first conductive part 310 in the hole area NA2. In the subsequent wet process, the developer, the first conductive part 310 in the hole area NA2 and the isolation structure 500 in the transition area NA1 jointly form a primary battery structure, and the first layer of the isolation structure 500 in the transition area NA1, that is, the Al layer, undergoes electrochemical corrosion, thereby achieving side engraving of the isolation structure 500.

[0119] like Figures 11 to 15 As shown, optionally, after step S01, the method further includes:

[0120] A second insulating layer 700 is formed on a side of the second conductive layer 400 facing away from the substrate 100 .

[0121] Optionally, after step S02, the method further includes:

[0122] A first insulating layer 600 is prepared on a side of the first conductive layer 300 facing away from the substrate 100 , and a second via hole 710 penetrating the first insulating layer 600 and a second via hole 710 penetrating the first insulating layer 600 and the second insulating layer 700 are formed.

[0123] Optionally, after the step of preparing the first insulating layer 600 on the side of the first conductive layer 300 facing away from the substrate 100, the method further comprises:

[0124] A first planarization layer is formed on a side of the first insulating layer 600 facing away from the substrate 100 , and the first planarization layer is patterned to form a portion located in the non-display area NA.

[0125] Optionally, after step S03, the method further includes:

[0126] A second planarization layer is prepared on the side of the first planarization layer away from the substrate 100, and the second planarization layer is patterned to form a portion located in the non-display area NA. The portion of the first planarization layer in the non-display area NA and the portion of the second planarization layer in the non-display area NA are stacked to form a dam 200.

[0127] According to the embodiments described above, these embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: The display panel includes a display area and a non-display area adjacent to each other, the non-display area includes a transition area and a hole area, the transition area is located between the display area and the hole area, and the display panel further includes: substrate; A dam located on one side of the substrate and in the non-display area; A first conductive layer, located between the substrate and the dam, the first conductive layer comprising a first conductive portion located in the transition region; A second conductive layer is located between the substrate and the dam, the second conductive layer comprises a second conductive portion located in the transition area, and the second conductive portion extends to the hole area away from a side of the display area; The isolation structure is located on the side of the first conductive layer and the second conductive layer away from the substrate, at least two of the isolation structures are arranged at intervals and connected by a bridge across the first conductive part, some of the isolation structures are electrically connected to the second conductive part, and the resistivity of the second conductive part is greater than the resistivity of at least some of the isolation structures.

2. The display panel according to claim 1, characterized in that: The display panel further includes: The first insulating layer is located between the second conductive layer and the isolation structure. The first insulating layer is provided with a first via hole. The first via hole is located in the transition region. Part of the isolation structure is electrically connected to the second conductive portion through the first via hole.

3. The display panel according to claim 2, characterized in that: The display panel comprises a first group of isolation structures and a second group of isolation structures, the first group of isolation structures comprises at least two isolation structures, the second group of isolation structures comprises at least one isolation structure, a plurality of the isolation structures in the first group of isolation structures are electrically connected through the first conductive portion, and a plurality of the isolation structures in the second group of isolation structures are electrically connected to the second conductive portion through the first via hole; Preferably, the isolation structures in the second group of isolation structures are electrically connected to the isolation structures in the first group of isolation structures; Preferably, the second group of isolation structures includes a plurality of the isolation structures, and the plurality of the isolation structures are electrically connected to the second conductive part through a plurality of the first via holes; Preferably, there are a plurality of the first group of isolation structures, and a plurality of the first conductive parts, and a group of the first group of isolation structures is electrically connected to one of the first conductive parts.

4. The display panel according to claim 3, characterized in that: The display panel comprises a first connecting portion, and the isolation structure in the second group of isolation structures is electrically connected to the isolation structure in the first group of isolation structures through the first connecting portion; Preferably, the first connecting portion and the isolation structure are arranged in the same layer; Preferably, the display panel comprises a second connecting portion, and adjacent first conductive portions are electrically connected via the second connecting portion; Preferably, the second connecting portion and the first conductive portion are arranged in the same layer.

5. The display panel according to claim 1, characterized in that: The second conductive layer is located between the first conductive layer and the substrate; Preferably, the display panel includes an active layer located on one side of the substrate, and the second conductive layer is disposed on the same layer as the active layer; Preferably, the display panel further comprises a first metal layer, a second metal layer and a third metal layer which are sequentially arranged along the direction of the active layer away from the substrate, and the first conductive portion and one of the first metal layer, the second metal layer and the third metal layer are arranged on the same layer.

6. The display panel according to claim 1, characterized in that: The isolation structure is annular around the hole area; Preferably, the first conductive portion is ring-shaped around the hole area; Preferably, the second conductive portion is ring-shaped and surrounds the hole area.

7. The display panel according to claim 1, characterized in that: The orthographic projection of the second conductive portion on the substrate is located outside the orthographic projection of the first conductive portion on the substrate.

8. The display panel according to claim 1, characterized in that: The display panel further includes: The second insulating layer is located between the first conductive layer and the isolation structure. A second via hole is formed on the second insulating layer. The second via hole is located in the transition region. At least two adjacent isolation structures are electrically connected to the first conductive portion through the second via hole.

9. A display device, characterized in that: A display panel comprising any one of claims 1 to 8.

10. A method for preparing a display panel, characterized in that: The display panel comprises a display area and a non-display area adjacent to each other, the non-display area comprises a transition area and a hole area, the transition area is located between the display area and the hole area, and the method comprises: Preparing a second conductive layer on the substrate, the second conductive layer comprising a second conductive portion located in the transition area, the second conductive portion extending from a side of the display area to the hole area; preparing a first conductive layer on the substrate, wherein the first conductive layer includes a first conductive portion located in the transition region; An isolation structure is prepared on the side of the first conductive layer and the second conductive layer facing away from the substrate, at least two of the isolation structures are spaced apart and connected by a bridge of the first conductive part, some of the isolation structures are electrically connected to the second conductive part, and the resistivity of the second conductive part is greater than the resistivity of at least some of the isolation structures.

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