Light-emitting substrate and preparation method thereof, backlight module and display device

Abstract

A light emitting substrate includes a substrate, a light emitting device, a color conversion layer, and a first reflective layer. The substrate is provided with a first surface and a second surface which are oppositely arranged; the second surface of the substrate is provided with a second groove. The light-emitting device is arranged on the first surface of the substrate; the light-emitting device comprises a light emitting area. The color conversion layer is arranged on the side, facing the second surface, of the light-emitting device. The color conversion layer is located in the second groove, and the orthographic projection of the light emitting area of the light emitting device on the substrate is located in the range of the color conversion layer on the substrate. The first reflecting layer is arranged on the side, away from the substrate, of the light-emitting device and at least covers the light-emitting device.

Description

Luminescent substrate and preparation method thereof, backlight module, and display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a light-emitting substrate and a preparation method thereof, a backlight module, and a display device. Background Art

[0002] With the development of light-emitting diode (LED) technology, light-emitting substrates using submillimeter or even micron-scale light-emitting diodes (LEDs) have become widely used. This allows products such as liquid crystal displays (LCDs) to achieve contrast levels comparable to those of organic light-emitting diode (OLED) displays while retaining the technical advantages of LCDs. This improves display quality and provides users with a superior visual experience.

[0003] Summary of the Invention

[0004] In one aspect, a light-emitting substrate is provided. The light-emitting substrate includes a substrate, a light-emitting device, a color conversion layer, and a first reflective layer. The substrate has a first surface and a second surface disposed opposite each other; the second surface of the substrate is provided with a second groove. The light-emitting device is disposed on the first surface of the substrate; the light-emitting device includes a light exit area. The color conversion layer is disposed on the side of the light-emitting device facing the second surface. The color conversion layer is located within the second groove, and the orthographic projection of the light exit area of ​​the light-emitting device on the substrate is within the range of the color conversion layer on the substrate. The first reflective layer is disposed on the side of the light-emitting device facing away from the substrate and at least covers the light-emitting device.

[0005] In some embodiments, the light-emitting substrate further includes a first light-evening structure, which is disposed in the second groove of the substrate and configured to scatter received light.

[0006] In some embodiments, the first light homogenization structure includes a plurality of first protrusions, and the plurality of first protrusions are disposed on a bottom wall of the second groove of the substrate.

[0007] In some embodiments, the first protrusion is substantially in the shape of at least one of a cone, a pyramid, and a spherical segment.

[0008] In some embodiments, the first light uniforming structure includes a scattering layer, and the scattering layer is disposed on a side of the color conversion layer close to or away from the substrate.

[0009] In some embodiments, the light-emitting substrate further includes a reflective structure, the reflective structure being disposed in the second groove of the substrate and located on a side of the color conversion layer away from the substrate, and configured to reflect received light.

[0010] In some embodiments, the reflective structure includes a plurality of reflective patterns, and the plurality of reflective patterns are arranged at intervals.

[0011] In some embodiments, the shape of the orthographic projection of the reflective pattern on the substrate is substantially at least one of a circle, an ellipse, and a polygon.

[0012] In some embodiments, a first groove is provided on the first surface of the substrate, and at least a portion of the light-emitting device is located in the first groove.

[0013] In some embodiments, the light emitting substrate further includes a first transparent conductive layer, a first semiconductor layer, a first conductive layer, and a first conductive layer.

[0014] The first transparent conductive layer is disposed on the first surface of the substrate and is located on a side of the light-emitting device that is close to the substrate. The first transparent conductive layer includes a first electrode, which is located within the first groove and extends outside the first groove. The light-emitting device is connected to the portion of the first electrode that is located within the first groove on a side close to the substrate.

[0015] The first semiconductor layer is disposed on a side of the first transparent conductive layer away from the substrate. The first semiconductor layer includes a channel. The first conductive layer is disposed on a side of the first semiconductor layer away from the substrate. The first conductive layer includes a first gate line and a first connecting line. The first gate line overlaps the channel; the first connecting line is connected to a portion of the first electrode located outside the first groove.

[0016] The second conductive layer is disposed on a side of the first conductive layer away from the substrate. The second conductive layer includes a source electrode, a drain electrode, a second electrode, and a first connecting wire. The side of the light-emitting device away from the substrate is connected to the second electrode, and one of the source electrode and the drain electrode is connected to the second electrode via a first connecting wire. The source electrode and the drain electrode are each connected to the channel.

[0017] In some embodiments, the light emitting substrate further includes a second transparent conductive layer, a second semiconductor layer, a third conductive layer, and a fourth conductive layer.

[0018] The second transparent conductive layer is disposed on the first surface of the substrate and is located on a side of the light-emitting device that is close to the substrate. The second transparent conductive layer includes a first electrode and a second electrode, wherein the first electrode and the second electrode are located within the first groove and both extend outside the first groove. The light-emitting device is connected to the portion of the first electrode and the second electrode that is located within the first groove on a side close to the substrate.

[0019] The second semiconductor layer is disposed on a side of the second transparent conductive layer away from the substrate. The second semiconductor layer includes a channel. The third conductive layer is disposed on a side of the second semiconductor layer away from the substrate. The third conductive layer includes a second gate line and a second connecting line. The second gate line overlaps the channel. The second connecting line is connected to a portion of the first electrode located outside the first groove.

[0020] The fourth conductive layer is disposed on a side of the third conductive layer away from the substrate. The fourth conductive layer includes a source electrode, a drain electrode, and a third connecting line. One of the source electrode and the drain electrode is connected to the portion of the second electrode located outside the first recess via the third connecting line. The source electrode and the drain electrode are each connected to the channel.

[0021] In some embodiments, orthographic projections of at least two light-emitting devices on the second surface of the substrate are located within the range of an orthographic projection of the same first groove on the second surface of the substrate.

[0022] In some embodiments, a plurality of the light-emitting devices are arranged in an array, and the orthographic projections of the light emitting areas of at least two light-emitting devices located in the same row and / or the same column on the second surface of the substrate are located within the range of the orthographic projections of the same first groove on the second surface of the substrate.

[0023] In some embodiments, the light-emitting substrate includes a light-emitting unit, wherein the light-emitting unit includes a plurality of light-emitting devices connected in series and / or in parallel. The orthographic projections of the light emitting areas of the plurality of light-emitting devices belonging to the same light-emitting unit on the second surface of the substrate are located within the range of the orthographic projection of the same first groove on the second surface of the substrate.

[0024] In some embodiments, the orthographic projections of the light emitting areas of all the light emitting devices on the second surface of the substrate are located within the range of the orthographic projection of the same first groove on the second surface of the substrate.

[0025] In some embodiments, the substrate further includes a side surface connecting the first surface and the second surface, and the light-emitting substrate further includes a light leakage prevention layer, and the light leakage prevention layer is arranged on the side surface of the substrate.

[0026] In some embodiments, a first groove is provided on the first surface of the substrate, a first distance is defined between a boundary of an orthographic projection of a bottom wall of the first groove on the second surface of the substrate and a boundary of an orthographic projection of a light emitting area of ​​the light emitting device on the second surface of the substrate, and a second distance is defined between the light emitting device and the bottom wall of the first groove. The first distance is greater than or equal to the product of the second distance and a tangent of a light emitting angle of the light emitting area of ​​the light emitting device.

[0027] In some embodiments, a distance between a boundary of an orthographic projection of the bottom wall of the second groove on the second surface of the substrate and a boundary of an orthographic projection of the light emitting area of ​​the light emitting device on the second surface of the substrate is a third distance, and a distance between the light emitting device and the bottom wall of the second groove is a fourth distance. The third distance is greater than or equal to the product of the fourth distance and a tangent of a light exit angle of the light emitting area of ​​the light emitting device.

[0028] In some embodiments, the light-emitting substrate further includes a second reflective layer, and the second reflective layer at least exposes the area where the light emitting region of the light-emitting device is located.

[0029] In some embodiments, the light-emitting substrate further includes a first encapsulation layer, and the first encapsulation layer is disposed on a side of the color conversion layer away from the substrate.

[0030] In another aspect, a light-emitting substrate is provided. The light-emitting substrate includes a substrate, a light-emitting device, a color conversion layer, and a first reflective layer. The substrate has a first surface and a second surface disposed opposite each other. The first surface of the substrate is provided with a first groove, and the bottom wall of the first groove of the substrate is provided with a plurality of first protrusions. The light-emitting device is disposed on the first surface of the substrate. The light-emitting device includes a light emitting area. The color conversion layer is disposed on the side of the light-emitting device facing the second surface. The orthographic projection of the light emitting area of ​​the light-emitting device on the substrate is located within the range of the color conversion layer on the substrate. The first reflective layer is disposed on the side of the light-emitting device facing away from the substrate and at least covers the light-emitting device.

[0031] In some embodiments, the color conversion layer is located in the first groove; and / or at least a portion of the light emitting device is located in the first groove.

[0032] In another aspect, a light-emitting substrate is provided. The light-emitting substrate includes a substrate, a light-emitting device, a color conversion layer, a first reflective layer, and a reflective structure. The substrate has a first surface and a second surface disposed opposite each other. The first surface of the substrate is provided with a first groove. The light-emitting device is disposed on the first surface of the substrate. The light-emitting device includes a light exit area. The color conversion layer is disposed on the side of the light-emitting device facing the second surface. The orthographic projection of the light exit area of ​​the light-emitting device on the substrate is located within the range of the color conversion layer on the substrate. The first reflective layer is disposed on the side of the light-emitting device facing away from the substrate and at least covers the light-emitting device. The reflective structure is disposed in the first groove of the substrate; the reflective structure is configured to reflect received light.

[0033] In some embodiments, the color conversion layer is located in the first groove and on a side of the reflective structure away from the substrate; and / or at least a portion of the light-emitting device is located in the first groove.

[0034] In another aspect, a backlight module is provided. The backlight module comprises a light-emitting substrate according to any of the above embodiments, a diffuser, and a composite film. The light-emitting substrate has a light-emitting side and a non-light-emitting side opposite to each other. The diffuser is disposed on the light-emitting side of the light-emitting substrate. The composite film is disposed on a side of the diffuser away from the light-emitting substrate.

[0035] In another aspect, a display device is provided, comprising the backlight module of any one of the above embodiments and a display panel, wherein the display panel is disposed on a side of the composite film in the backlight module away from the light-emitting substrate.

[0036] In another aspect, a method for preparing a light-emitting substrate is provided. The method is used to prepare the aforementioned light-emitting substrate and includes: forming a second groove on the second surface of a substrate; forming a color conversion layer within the second groove; and forming a light-emitting device on the first surface of the substrate. The first and second surfaces are two opposing surfaces of the substrate. The light-emitting device includes a light emitting area, and the orthographic projection of the light emitting area of ​​the light-emitting device on the substrate is within the range of the orthographic projection of the color conversion layer on the substrate. A first reflective layer is formed on a side of the light-emitting device away from the substrate. The first reflective layer at least covers the light-emitting device.

[0037] In some embodiments, between forming the second groove on the second surface of the substrate and forming the color conversion layer in the second groove, the preparation method further includes: etching the bottom wall of the second groove to form a plurality of first protrusions on the bottom wall of the second groove.

[0038] In some embodiments, before forming the light-emitting device on the first surface of the substrate, the preparation method further comprises: forming a first groove on the first surface of the substrate, wherein the light-emitting device is at least partially located in the first groove.

[0039] In some embodiments, a reflective structure is formed in the second groove, and the reflective structure is disposed on a side of the color conversion layer away from the substrate.

[0040] In another aspect, a method for preparing a light-emitting substrate is provided. The method is used to prepare the aforementioned light-emitting substrate and includes: forming a first groove on a first surface of a substrate; etching the bottom wall of the first groove to form a plurality of first protrusions on the bottom wall of the first groove; and forming a color conversion layer. The color conversion layer is located on a second surface of the substrate or within the first groove; the first surface and the second surface are two opposing surfaces of the substrate. A light-emitting device is formed on the first surface of the substrate. The light-emitting device includes a light emitting area, the orthographic projection of the light emitting area of ​​the light-emitting device on the substrate being located within the range of the color conversion layer on the substrate. A first reflective layer is formed on a side of the light-emitting device away from the substrate. The first reflective layer at least covers the light-emitting device.

[0041] In another aspect, a method for preparing a light-emitting substrate is provided. The method is used to prepare the aforementioned light-emitting substrate and includes: forming a first groove on a first surface of a substrate; forming a reflective structure within the first groove; and forming a color conversion layer. The color conversion layer is disposed on a second surface of the substrate or within the first groove. The first and second surfaces are two opposing surfaces of the substrate. The color conversion layer is located on a side of the reflective structure facing away from the substrate. A light-emitting device is formed on the first surface of the substrate. The light-emitting device includes a light emitting area, the orthographic projection of the light emitting area of ​​the light-emitting device on the substrate being located within the range of the color conversion layer on the substrate. A first reflective layer is formed on a side of the light-emitting device facing away from the substrate; the first reflective layer at least covers the light-emitting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and do not limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, etc. involved in the embodiments of the present disclosure.

[0043] FIG1 is a structural diagram of a display device according to some embodiments;

[0044] FIG2 is a structural diagram of another display device according to some embodiments;

[0045] FIG3 is a cross-sectional view of a display device according to some embodiments;

[0046] FIG4 is a top view of a light emitting substrate according to some embodiments;

[0047] FIG5 is a structural diagram of a light-emitting substrate according to some embodiments;

[0048] FIG6 is a structural diagram of another light-emitting substrate according to some embodiments;

[0049] FIG7 is a structural diagram of yet another light-emitting substrate according to some embodiments;

[0050] FIG8 is a structural diagram of another light-emitting substrate according to some embodiments;

[0051] FIG9 is a structural diagram of another light-emitting substrate according to some embodiments;

[0052] FIG10 is a structural diagram of another light-emitting substrate according to some embodiments;

[0053] FIG11 is a structural diagram of another light-emitting substrate according to some embodiments;

[0054] FIG12 is a structural diagram of another light-emitting substrate according to some embodiments;

[0055] FIG13 is a top view of a light emitting substrate according to some embodiments;

[0056] FIG14 is a top view of another light emitting substrate according to some embodiments;

[0057] FIG15 is a top view of yet another light-emitting substrate according to some embodiments;

[0058] FIG16 is a top view of yet another light emitting substrate according to some embodiments;

[0059] 17 to 22 are flow charts of a method for preparing a light-emitting substrate according to some embodiments;

[0060] 23 to 26 are diagrams showing steps of a method for preparing a light-emitting substrate according to some embodiments;

[0061] FIG27 is a structural diagram of another light-emitting substrate according to some embodiments;

[0062] FIG28 is a flow chart of a method for preparing the light-emitting substrate shown in FIG27 ;

[0063] FIG29 is a diagram showing the steps of a method for preparing the light-emitting substrate shown in FIG27;

[0064] FIG30 is a structural diagram of another light-emitting substrate according to some embodiments;

[0065] FIG31 is a flow chart of a method for preparing the light-emitting substrate shown in FIG30 ;

[0066] FIG32 is a step diagram of a method for preparing the light-emitting substrate shown in FIG30 . DETAILED DESCRIPTION

[0067] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0068] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0069] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0070] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0071] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0072] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0073] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0074] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0075] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0076] As used herein, "parallel," "perpendicular," and "equal" include the stated conditions and conditions that are similar to the stated conditions, within an acceptable range of deviations as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "equal" includes both absolute equality and approximate equality, where the acceptable range of deviations for approximate equality may include, for example, a difference between two conditions that is less than or equal to 5% of either condition.

[0077] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0078] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0079] As shown in FIG. 1 , some embodiments of the present disclosure provide a display device 1000 , which may be any device that displays an image, whether in motion (eg, video) or stationary (eg, still image), and whether textual or graphic.

[0080] For example, referring to Figures 1 and 2, the display device 1000 can be any product or component with a display function, such as a television, a laptop computer, a tablet computer, a mobile phone, a personal digital assistant (PDA), a navigator, a wearable device, a virtual reality (VR) device, etc.

[0081] For example, as shown in FIG1 , the display device 1000 may be a portable display product; for example, the display device 1000 may be the mobile phone shown in FIG1 . For another example, referring to FIG2 , the display device 1000 may be a wearable device; for example, the display device 1000 may be the watch shown in FIG2 .

[0082] It should be noted that, depending on different application scenarios, the shape of the display surface of the display device 1000 is not unique. The shape of the display surface of the display device 1000 can be any one of circular, elliptical or polygonal, which is not specifically limited in the embodiments of the present disclosure.

[0083] In some embodiments, referring to FIG. 3 , the display device 1000 may be a liquid crystal display (LCD).

[0084] Exemplarily, referring to FIG. 3 , the display device 1000 includes a backlight module 100 and a display panel 200 .

[0085] Referring to FIG3 , the backlight module 100 includes a light-emitting substrate 300 having a light-emitting side and a non-light-emitting side. The light-emitting side refers to the side of the light-emitting substrate 300 from which light is emitted (the upper side of the light-emitting substrate 300 in FIG4 ), while the non-light-emitting side refers to the side opposite the light-emitting side (the lower side of the light-emitting substrate 300 in FIG4 ). The display panel 200 is disposed on the light-emitting side of the light-emitting substrate 300.

[0086] In some examples, referring to FIG. 4 , the light-emitting substrate 300 includes a light-emitting region A and a peripheral region B, with the peripheral region B disposed on at least one side of the light-emitting region A. FIG. 4 illustrates an example in which the peripheral region B surrounds the light-emitting region A. The light-emitting region A is configured to house the light-emitting device 10, while the peripheral region B is configured to house circuit traces and connect to a driver circuit board. For example, the peripheral region B may include a binding region M, which is configured to house connections to the driver circuit board.

[0087] As shown in FIG4 , the light-emitting substrate 300 includes a plurality of light-emitting devices 10, which are arranged in a light-emitting area A. The light-emitting devices 10 may include Micro LEDs and / or Mini LEDs. It should be noted that the size (e.g., length) of a Micro LED is less than 50 microns, for example, 10 to 50 microns. The size (e.g., length) of a Mini LED is 50 to 150 microns, for example, 80 to 120 microns.

[0088] In some examples, referring to FIG. 4 , a plurality of light-emitting devices 10 are arranged in an array. For example, the plurality of light-emitting devices 10 are arranged in multiple rows and columns, with each row including at least two light-emitting devices 10 arranged along a first direction X, and each column including at least two light-emitting devices 10 arranged along a second direction Y. It should be noted that the first direction X intersects the second direction Y; for example, the first direction X is perpendicular to the second direction Y.

[0089] In addition, referring to FIG3 , the backlight module 100 may further include a plurality of optical films 400. Light emitted by the light-emitting device 10 passes through the optical films 400 and is then emitted toward the display panel 200. Specifically, the display panel 200 is disposed on the side of the optical films 400 that is away from the light-emitting substrate 300. It should be noted that the optical films 400 modulate the wavelength and / or propagation direction of the light emitted by the light-emitting device 10.

[0090] As shown in FIG3 , the light emitting device 10 can directly emit white light, which is then modulated in its propagation direction after passing through the multiple optical films 400 and then emitted toward the display panel 200. Alternatively, the light emitting device 10 can also emit light of other colors (e.g., blue light), which is then modulated in its wavelength and / or propagation direction by the multiple optical films 400 and then emitted toward the display panel 200.

[0091] For example, referring to FIG3 , the plurality of optical films 400 include a scattering layer 410, a color conversion layer 420, a diffuser 430, and a composite film 440. The scattering layer 410, the color conversion layer 420, the diffuser 430, and the composite film 440 can be sequentially positioned away from the display panel 200. Specifically, the diffuser 430 can be positioned on the light-emitting side of the light-emitting substrate 300, the composite film 440 can be positioned on the side of the diffuser 430 away from the light-emitting substrate 300, the scattering layer 410 and the color conversion layer 420 can be positioned on the side of the diffuser 430 closer to the light-emitting substrate 300, and the display panel 200 can be positioned on the side of the composite film 440 away from the light-emitting substrate 300.

[0092] The scattering layer 410 blurs the light emitted by the light-emitting device 10 and provides support for the color conversion layer 420, the diffuser 430, and the composite film 440. The color conversion layer 420, when stimulated by light of a certain color emitted by the light-emitting device 10, converts that light into white light, thereby improving the utilization of the light energy of the light-emitting device 10. The diffuser 430 evens out the light passing through it. The composite film 440 improves the light extraction efficiency of the light-emitting substrate 300, thereby increasing the display brightness of the display device 1000.

[0093] It should be noted that the scattering layer 410 includes scattering particles, which include titanium dioxide and / or silicon dioxide. The color conversion layer 420 includes a quantum dot material or a fluorescent material. The composite film 440 may include a brightness enhancement film (BEF) and a reflective polarized brightness enhancement film (DBEF), which utilizes the principles of total reflection, refraction, and polarization to increase the light flux within a certain angle range, thereby improving the brightness of the display device 1000.

[0094] For example, as shown in FIG3 , the light-emitting device 10 emits blue light. The color conversion layer 420 may include a red quantum dot material, a green quantum dot material, and a transparent material. When the blue light emitted by the light-emitting device 10 passes through the red quantum dot material, it is converted into red light; when the blue light passes through the green quantum dot material, it is converted into green light; the blue light can directly pass through the transparent material; then, the blue light, red light, and green light are mixed and superimposed in a certain proportion to present white light. Finally, the scattering layer 410 and the diffuser 430 can modulate the incident light of different propagation directions and emit it in a more uniform state, thereby improving the light shadow produced by the light-emitting substrate 300 and improving the display quality of the display device 1000.

[0095] In some related technologies, a scattering layer, a color conversion layer, a diffuser, and a composite film are all disposed between the light-emitting substrate and the display panel, resulting in a large thickness of the entire display device, which is not conducive to a lightweight and thin design of the display device.

[0096] Based on this, referring to FIG. 5 to FIG. 12 , some embodiments of the present disclosure provide a light-emitting substrate 300 , including a light-emitting device 10 , a substrate 20 , a first reflective layer 30 and a color conversion layer 420 .

[0097] 5 to 12 , the substrate 20 has a first surface 20A, a second surface 20B, and a side surface 20C connecting the first surface 20A and the second surface 20B. A second groove 22 is formed on the second surface 20B of the substrate 20 .

[0098] It should be noted that the material of the substrate 20 may include a rigid material. For example, the material of the substrate 20 includes any one of glass, quartz, polymethyl methacrylate (PMMA), etc.

[0099] As shown in Figures 5 to 12, the light-emitting device 10 is arranged on the first surface 20A of the substrate 20. The light-emitting device 10 includes a light emitting area S, and the orthographic projection of the light emitting area S on the substrate 20 is located within the range of the orthographic projection of the color conversion layer 420 on the substrate 20. It should be noted that the light emitting area S refers to the area where the light emitted by the light-emitting device 10 can be emitted when it is working. Usually, the light-emitting device 10 has a pin structure 13 connected to an external circuit structure (such as a first solder pad 11 and a second solder pad 12). The pin structure 13 is usually made of a metal or alloy material with better conductivity. The light emitted by the light-emitting device 10 can be emitted from all areas except the area where the pin structure 13 is located. Figures 5 to 8 are illustrated by taking the example of the light emitting area S being located between the pin structures 13. The light emitting area S is not necessarily a regular area in practice, and the embodiments of the present disclosure do not make specific limitations on this.

[0100] As shown in FIG5 to FIG12 , the color conversion layer 420 is disposed on the side of the light emitting device 10 facing the second surface 20B and is located in the second groove 22 .

[0101] In this case, the color conversion layer 420 and the substrate 20 located in the second groove 22 jointly occupy part of the size of the display device 1000 in the third direction Z (the thickness direction of the display device 1000). That is, the color conversion layer 420 located in the second groove 22 does not need to occupy additional size of the display device 1000 in the third direction Z. Based on this, compared with the related art, the thickness of the display device 1000 provided in the embodiment of the present disclosure is thinner, making the display device 1000 lighter and thinner.

[0102] It should be noted that the third direction Z is perpendicular to the first surface 20A of the substrate 20 , that is, the third direction Z is perpendicular to the first direction X and perpendicular to the second direction Y.

[0103] As shown in Figures 5 to 12, the first reflective layer 30 is arranged on the side of the light-emitting device 10 away from the substrate 20 and at least covers the light-emitting device 10, so that the light emitted by the light-emitting device 10 toward the first reflective layer 30 is reflected and emitted from the second surface 20B of the substrate 20, thereby increasing the light extraction efficiency.

[0104] The reflectivity of the first reflective layer 30 is greater than or equal to 85%. For example, the material of the first reflective layer 30 may include a metal, such as at least one of aluminum, silver, copper, and platinum. For example, the material of the first reflective layer 30 may include white ink and / or silicone white glue.

[0105] As can be seen from the above, the color conversion layer 420 and the light-emitting device 10 are respectively arranged on opposite sides of the substrate 20, and the side of the light-emitting device 10 away from the substrate 20 is covered with the first reflective layer 30. In this way, after the light emitted by the light-emitting device 10 excites the color conversion layer 420, part of the light emitted by the color conversion layer 420 is directly emitted to the outside of the substrate 20, and the other part of the light is emitted into the substrate 20. After multiple reflections within the substrate 20, the light can be emitted more uniformly from the second surface 20B of the substrate 20, thereby improving the brightness uniformity of the light-emitting substrate 300. In addition, depending on actual conditions, the light-emitting substrate 300 can also be provided without the scattering layer 410 to further reduce the thickness of the display device 1000, making the display device 1000 even thinner and lighter.

[0106] It is understood that the orthographic projection of the light emitting area S on the substrate 20 is located within the range of the orthographic projection of the color conversion layer 420 on the substrate 20, and the color conversion layer 420 is located within the second groove 22. In other words, the orthographic projection of the light emitting area S on the substrate 20 is located within the second groove 22. It should be noted that the orthographic projection on the substrate 20 refers to the orthographic projection on the plane where the first surface 20A of the substrate 20 is located.

[0107] In some embodiments, referring to FIG11 , the orthographic projection of the light emitting area S of a light emitting device 10 on the substrate 20 can be located within the orthographic projection of a second groove 22 on the substrate 20. In this manner, the second groove 22 occupies a smaller area of ​​the substrate 20, and the substrate 20 can maintain a higher strength.

[0108] In other embodiments, referring to FIG12 , the orthographic projections of the light emitting areas S of at least two light emitting devices 10 on the substrate 20 may be located within the range of the orthographic projection of the same second groove 22 on the substrate 20. For example, the orthographic projections of the light emitting areas S of all the light emitting devices 10 on the substrate 20 may be located within the same second groove 22, thereby reducing the number of second grooves 22 and lowering the process difficulty.

[0109] The following uses an example in which the orthographic projection of the light emitting area S of a light emitting device 10 on the substrate 20 can be located within the range of the orthographic projection of a second groove 22 on the substrate 20 to exemplify some embodiments of the present disclosure, but the embodiments of the present disclosure are not limited thereto.

[0110] 5 and 6 , the distance between the boundary of the orthographic projection of the bottom wall of the second groove 22 on the second surface 20B of the substrate 20 and the boundary of the orthographic projection of the light emitting area S of the light emitting device 10 on the second surface 20B of the substrate 20 is a third distance L3, and the distance between the light emitting device 10 and the bottom wall of the second groove 22 is a fourth distance L4.

[0111] Among them, the third distance L3 is greater than or equal to the product of the fourth distance L4 and the tangent value of the light emitting angle α2 of the light emitting area S of the light emitting device 10, so that the light emitted by the light emitting device 10 can all be emitted toward the bottom wall of the second groove 22, and thus can all be converted by the color conversion layer 420 and emitted.

[0112] It should be noted that, in this article, the luminous intensity of the edge light emitted by the light-emitting device 10 is half of the luminous intensity corresponding to the normal direction of the light-emitting device 10, and the "light-emitting angle" is the maximum angle between the edge light and the normal of the light-emitting surface.

[0113] In some embodiments, as shown in Figures 11 and 12, due to the presence of the first reflective layer 30, part of the light incident on the substrate 20 from the color conversion layer 420 will be emitted toward the first reflective layer 30, and after being reflected by the first reflective layer 30, it will be emitted from the second surface 20B of the substrate 20, thereby improving the brightness uniformity of the light-emitting substrate 300.

[0114] 4 and 5 , the first reflective layer 30 is a continuous, integral structure and at least covers the entire light emitting area A. For example, referring to FIG4 and 5 , the boundary of the first reflective layer 30 and the boundary of the light emitting area A substantially coincide with each other.

[0115] In some embodiments, as shown in Figures 5 to 10 , the light-emitting substrate 300 further includes a second reflective layer 40, which is disposed on the first surface 20A of the substrate 20. The second reflective layer 40 exposes at least the area where the light emitting region S of the light-emitting device 10 is located. For example, as shown in Figure 6 , the second reflective layer 40 covers the area between the light-emitting devices 10 and exposes the area where the light-emitting device 10 is located.

[0116] In this case, due to the presence of the second reflective layer 40, part of the light incident on the substrate 20 from the color conversion layer 420 will be directed toward the second reflective layer 40, and after being reflected by the second reflective layer 40, will be emitted from the second surface 20B of the substrate 20, thereby improving the brightness uniformity of the light-emitting substrate 300.

[0117] At this time, referring to Figures 4, 5, and 7, the first reflective layer 30 can be a continuous, entire layer structure, or can include a plurality of reflective portions 31 disposed at intervals. For example, as shown in Figures 4 and 5, the first reflective layer 30 can be a continuous, entire layer structure, and can cover the entire light-emitting area A. For example, as shown in Figure 7, the first reflective layer 30 includes a plurality of reflective portions 31 disposed at intervals, and the orthographic projection of a light-emitting device 10 on the substrate 20 is located within the range of the orthographic projection of a reflective portion 31 on the substrate 20.

[0118] The reflectivity of the second reflective layer 40 is greater than or equal to 85%. Exemplarily, the material of the second reflective layer 40 includes a metal, such as at least one of aluminum, silver, copper, and platinum. Exemplarily, the material of the second reflective layer 40 includes white ink and / or silicone white glue.

[0119] On this basis, as shown in Figures 5 to 10, the light-emitting substrate 300 may further include a plurality of second light-homogenizing structures 50, which are disposed between the second reflective layer 40 and the substrate 20. The second light-homogenizing structures 50 are used to disperse the received light so that it is scattered in all directions. In this case, of the light incident on the substrate 20 by the color conversion layer 420, the portion of light that is totally reflected at the first surface 20A of the substrate 20 will be reflected to the second light-homogenizing structures 50, dispersed by the second light-homogenizing structures 50, changing the propagation direction of the light, and reflected by the second reflective layer 40 so that it can be emitted from the second surface 20B of the substrate 20, thereby improving the brightness uniformity of the light-emitting substrate 300.

[0120] For example, the second light homogenizing structure 50 may include a plurality of second protrusions, each of which is substantially in the shape of at least one of a cone, a pyramid, and a spherical segment. The second light homogenizing structure 50 may be made of a transparent resin.

[0121] In this document, "substantially conical or pyramidal" means that the shape of the object is generally conical or pyramidal, but is not limited to standard cones or pyramids. Specifically, "cones and pyramids" include not only basic cone and pyramid shapes, but also shapes similar to cones and pyramids. For example, the apex angle of a cone or pyramid is a curved surface.

[0122] In this context, "substantially spherical segment" means that the entire structure is spherical segment, but is not limited to a standard spherical segment. Specifically, "spherical segment" includes not only basic spherical segment shapes, but also shapes similar to spherical segments. For example, the upper half of a spherical segment may be a standard spherical segment, while the lower half may be cylindrical.

[0123] In some embodiments, referring to FIG. 5 and FIG. 7 , the light-emitting substrate 300 further includes a first light-homogenizing structure 60 . The first light-homogenizing structure 60 is disposed in the second groove 22 of the substrate 20 and is configured to scatter the received light.

[0124] In this case, the light emitted by the light-emitting device 10 toward the area where the second groove 22 is located can be dispersed by the first light-uniformity structure 60 and emitted from other areas, thereby reducing the light output from the area where the second groove 22 is located and increasing the light output from other areas between the second grooves 22, thereby improving the brightness uniformity of the light-emitting substrate 300.

[0125] Furthermore, the first light homogenizing structure 60 does not need to occupy additional dimensions of the display device 1000 in the third direction Z, which is beneficial for making the display device 1000 thinner and lighter. In other words, the light-emitting substrate 300 can improve the brightness uniformity of the light-emitting substrate 300 without increasing the thickness of the display device 1000.

[0126] In some examples, as shown in FIG7 , the bottom wall of the second groove 22 of the substrate 20 is provided with a plurality of first protrusions 201, which form a first light homogenizing structure 60. The first protrusions 20 are generally in the shape of at least one of a cone, a pyramid, and a spherical segment. In this case, the first protrusions 201 disperse the incident light, scattering it in all directions, thereby improving the brightness uniformity of the light-emitting substrate 300.

[0127] In addition, the first light homogenizing structure 60 is arranged inside the substrate 20, so there is no need to separately arrange other film layers that play a light homogenizing role in the second groove 22. This not only saves material, but also reduces the depth of the second groove 22. In this way, the thickness of the substrate 20 can be reduced, thereby reducing the thickness of the display device 1000, and making the display device 1000 thinner.

[0128] In other examples, as shown in FIG5 , the first light homogenizing structure 60 includes a scattering layer 410, which is disposed on a side of the color conversion layer 420 that is close to or away from the substrate 20. The scattering layer 410 may include scattering particles, such as titanium dioxide and / or silicon dioxide. In this case, the scattering layer 410 can be directly formed within the second groove 22 via an inkjet printing process, simplifying the manufacturing process. Furthermore, the scattering layer 410 is relatively thin, and the depth of the second groove 22 is relatively small, allowing the thickness of the substrate 20 to be reduced, thereby further reducing the thickness of the display device 1000 and making the display device 1000 even thinner and lighter.

[0129] In some embodiments, referring to FIG. 6 and FIG. 8 , the light emitting substrate 300 further includes a reflective structure 70 . The reflective structure 70 is disposed in the second groove 22 of the substrate 20 and is configured to reflect received light.

[0130] It should be noted that the reflective structure 70 is located on the side of the color conversion layer 420 away from the substrate 20 to prevent the light emitted by the light emitting device 10 from being directly emitted without being converted by the color conversion layer 420, thereby reducing the risk of color deviation.

[0131] In this case, part of the light emitted by the light-emitting device 10 toward the area where the second groove 22 is located can be reflected by the reflective structure 70 into the substrate 20 and emitted from other areas, thereby reducing the light output from the area where the second groove 22 is located and increasing the light output from other areas between the second grooves 22, thereby improving the brightness uniformity of the light-emitting substrate 300.

[0132] Furthermore, the reflective structure 70 does not require additional size of the display device 1000 in the third direction Z, which is beneficial for making the display device 1000 thinner and lighter. In other words, the light-emitting substrate 300 can improve the brightness uniformity of the light-emitting substrate 300 without increasing the thickness of the display device 1000.

[0133] 8 , the reflective structure 70 includes a plurality of reflective patterns 71 , which may be arranged at intervals, wherein the orthographic projection of the reflective patterns 71 on the substrate 20 is substantially in the shape of at least one of a circle, an ellipse, and a polygon.

[0134] As used herein, "substantially circular or elliptical" means that the shape is generally circular or elliptical, but is not limited to a perfect circle or ellipse. Specifically, "circular or elliptical" includes not only substantially circular or elliptical shapes but also shapes similar to circles or ellipses. For example, a circle or ellipse may have a portion of its boundaries formed by straight lines.

[0135] In this document, "substantially polygonal" means that the shape is generally polygonal, but is not limited to a standard polygon. Specifically, "polygonal" includes not only substantially circular or elliptical shapes, but also shapes similar to polygons. For example, a polygon may have curved corners, i.e., a polygon may have smooth corners and rounded corners.

[0136] Furthermore, the reflective pattern 71 may be formed of a metal, such as at least one of aluminum, silver, copper, and platinum. The reflective pattern 71 may be formed by an evaporation process. Due to the shadow effect of the evaporation process, the edges of the reflective pattern 71 may have a slope, i.e., the edge of the edge reflective pattern 71 may be a sloped surface.

[0137] In some embodiments, as shown in FIG12 , the light-emitting substrate 300 further includes a light leakage prevention layer 80 , which is disposed on the side surface 20C of the substrate 20 to prevent light leakage from the side surface 20C of the substrate 20 and cause ghosting and other defects in the display device 1000 .

[0138] In some embodiments, referring to Figures 5 to 12, the above-mentioned light-emitting substrate 300 also includes a first encapsulation layer 91. The first encapsulation layer 91 is arranged on the side of the color conversion layer 420 away from the substrate 20 to protect the color conversion layer 420, thereby reducing the risk of failure of the color conversion layer 420 due to water and oxygen corrosion.

[0139] 11 and 12 , the first encapsulation layer 91 can be located within the second groove 22, facilitating a thinner and lighter display device 1000. Referring to FIG8 , the first encapsulation layer 91 can also be a continuous, integral structure, covering the entire light-emitting area A, with a portion located within the second groove 22 and a portion located outside the second groove 22.

[0140] In some embodiments, referring to FIG. 5 and FIG. 6 , the first surface 20A of the substrate 20 is a flat surface, and the light-emitting device 10 is directly disposed on the first surface 20A of the substrate 20 .

[0141] In other embodiments, referring to Figures 7 to 10 , a first groove 21 is defined on the first surface 20A of the substrate 20, and at least a portion of the light-emitting device 10 is located within the first groove 21. For example, as shown in Figure 7 , the entire light-emitting device 10 is located within the first groove 21. For another example, as shown in Figure 8 , along a third direction Z of the display device 1000, the thickness of the light-emitting device 10 is greater than the depth of the first groove 21. Thus, a portion of the light-emitting device 10 is located within the first groove 21, while another portion extends beyond the opening of the first groove 21 and is exposed outside the first groove 21.

[0142] In this case, the portion of the light-emitting device 10 located in the first groove 21 and the substrate 20 jointly occupy part of the size of the display device 1000 in the third direction Z, that is, the portion of the light-emitting device 10 located in the first groove 21 does not need to additionally occupy the size of the display device 1000 in the third direction Z, which can further reduce the thickness of the display device 1000, making the display device 1000 thinner and lighter.

[0143] In the following, some embodiments of the present disclosure are exemplarily described by taking the example that the first surface 20A of the substrate 20 is provided with a first groove 21 and at least a portion of the light-emitting device 10 is located in the first groove 21 , but the embodiments of the present disclosure are not limited thereto.

[0144] 7 and 8 , the distance between the boundary of the orthographic projection of the bottom wall of the first groove 21 on the second surface 20B of the substrate 20 and the boundary of the orthographic projection of the light emitting area S of the light emitting device 10 on the second surface 20B of the substrate 20 is a first distance L1, and the distance between the light emitting device 10 and the bottom wall of the first groove 21 is a second distance L2.

[0145] In which, the first distance L1 is greater than or equal to the product of the second distance L2 and the tangent value of the light output angle α1 of the light output area S of the light emitting device 10, so that the light emitted by the light emitting device 10 can be emitted toward the bottom wall of the first groove 21 and toward the color conversion layer 420 in the second groove 22.

[0146] It should be noted that, in this article, the luminous intensity of the edge light emitted by the light-emitting device 10 is half of the luminous intensity corresponding to the normal direction of the light-emitting device 10, and the "light-emitting angle" is the maximum angle between the edge light and the normal of the light-emitting surface.

[0147] In some embodiments, referring to FIG. 5 to FIG. 8 , the light emitting device 10 is fixed to the first surface 20A of the substrate 20 by a die-bonding process.

[0148] Exemplarily, as shown in Figures 5 to 8, the light-emitting substrate 300 further includes a first circuit layer 301 and a first insulating layer 302. The first circuit layer 301 is provided on the first surface 20A of the substrate 20, and the first circuit layer 301 includes a first solder pad 11, a second solder pad 12, and a driving transistor (not shown in Figures 5 to 8). The first pin 131 of the light-emitting device 10 is soldered to the first solder pad 11, and the second pin 132 is soldered to the second solder pad 12. The first insulating layer 302 covers the light-emitting device 10 and fills the space between the light-emitting device 10 and the first circuit layer 301 to prevent reflective material from being formed between the light-emitting device 10 and the first circuit layer 301 or on the side of the light-emitting device 10 during the preparation of the first reflective layer 30, resulting in a decrease in the light extraction efficiency of the light-emitting device 10.

[0149] It should be noted that the first circuit layer 301 may include multiple conductive layers and multiple insulating layers for isolating adjacent conductive layers or for protecting conductive layers, which is not specifically limited in the present embodiment. The material of the first insulating layer 302 includes transparent resin.

[0150] In other embodiments, referring to FIG. 9 and FIG. 10 , the light emitting device 10 and the driving transistor T may also be directly fabricated on the substrate 20 to avoid yield loss caused by the die bonding process.

[0151] Exemplarily, referring to FIG. 9 , the light emitting substrate 300 includes a first transparent conductive layer 310 , a first semiconductor layer 320 , a first conductive layer 330 , and a second conductive layer 340 .

[0152] As shown in FIG9 , the first transparent conductive layer 310 is disposed on the first surface 20A of the substrate 20 and is located on a side of the light-emitting device 10 that is close to the substrate 20. The first transparent conductive layer 310 includes a first electrode 11, which is located within the first groove 21 and extends outside the first groove 21 to facilitate connection to a voltage signal line.

[0153] It should be noted that the material of the first transparent conductive layer 310 includes indium zinc oxide and / or indium tin oxide to reduce the shielding of the first electrode 11 on the light emitted by the light emitting device 10 and improve the light extraction efficiency of the light emitting substrate 300 .

[0154] 9 , the first semiconductor layer 320 is disposed on a side of the first transparent conductive layer 310 away from the substrate 20. The first semiconductor layer 320 includes a channel C.

[0155] It should be noted that the material of the first semiconductor layer 320 includes amorphous silicon, single crystal silicon, polycrystalline silicon or metal oxide semiconductor material. For example, the material of the first semiconductor layer 320 includes indium gallium zinc oxide and / or zinc oxide.

[0156] As shown in FIG9 , the first conductive layer 330 is disposed on a side of the first semiconductor layer 320 away from the substrate 20. The first conductive layer 330 includes a first gate line 331 and a first routing line 332. The first gate line 331 overlaps the channel C to form a driving transistor T. The first routing line 332 is connected to the portion of the first electrode 11 located outside the first groove 21 to transmit a voltage signal to the first electrode 11.

[0157] It should be noted that the material of the first conductive layer 330 includes metal. For example, the material of the first conductive layer 330 includes at least one of aluminum, copper, and molybdenum.

[0158] As shown in FIG9 , the second conductive layer 340 is disposed on a side of the first conductive layer 330 away from the substrate 20. The second conductive layer 340 includes a source S, a drain D, a second electrode 12, and a first connecting line. The source S and the drain D are respectively connected to the channel C, and one of the source S and the drain D can be connected to the second electrode 12 via the first connecting line.

[0159] It should be noted that the material of the second conductive layer 340 includes metal. For example, the material of the second conductive layer 340 includes at least one of aluminum, copper, and molybdenum.

[0160] Based on the above, the side of the light-emitting device 10 close to the substrate 20 can be connected to the portion of the first electrode 11 located in the first groove 21. The side of the light-emitting device 10 away from the substrate 20 can be connected to the second electrode 12, thereby emitting light under the drive of the first electrode 11 and the second electrode 12. In addition, the second electrode 12, the source electrode S, and the drain electrode D are made of the same material and are arranged in the same layer. The second electrode 12, the source electrode S, and the drain electrode D can be prepared in the same process, which is simple. The light-emitting device 10 and the driving transistor T can also be directly prepared on the substrate 20, avoiding the cost increase and yield loss caused by the die bonding process.

[0161] In addition, referring to FIG. 9 , the light-emitting substrate 300 may further include a first buffer layer BF1, a first gate insulating layer GI1, a first interlayer insulating layer ILD1, and a second encapsulation layer 92. The first buffer layer BF1 is located between the first transparent conductive layer 310 and the first semiconductor layer 320. The first gate insulating layer GI1 is located between the first semiconductor layer 320 and the first conductive layer 330. The first interlayer insulating layer ILD1 is disposed between the first conductive layer 330 and the second conductive layer 340. The second encapsulation layer 92 is disposed on the side of the second conductive layer 340 away from the substrate 20 to provide insulation and protection, reducing the risk of water and oxygen corrosion causing failure of the circuit and light-emitting device 10. The first wiring 332 penetrates the first buffer layer BF1 and the first gate insulating layer GI1 and connects to the portion of the first electrode 11 outside the first groove 21. The second electrode 12 penetrates the buffer layer BF1, the gate insulating layer GI1, and the interlayer insulating layer ILD1 to connect to the light-emitting device 10.

[0162] It should be noted that the material of the first buffer layer BF1 includes silicon oxide and / or a transparent resin. The material of the first gate insulating layer GI1 includes any one of silicon nitride, silicon oxynitride, and silicon oxide. The material of the first interlayer insulating layer ILD1 includes any one of silicon nitride, silicon oxynitride, and silicon oxide. The second encapsulation layer 92 may include, for example, at least one inorganic layer and at least one organic layer.

[0163] Exemplarily, referring to FIG. 10 , the light emitting substrate 300 includes a second transparent conductive layer 350 , a second semiconductor layer 360 , a third conductive layer 370 and a fourth conductive layer 380 .

[0164] As shown in FIG10 , the second transparent conductive layer 350 is disposed on the first surface 20A of the substrate 20 and is located on a side of the light-emitting device 10 close to the substrate 20. The second transparent conductive layer 350 includes a first electrode 11 and a second electrode 12. The first electrode 11 and the second electrode 12 are located in the first groove 21 and extend outside the first groove 21 to facilitate connection to corresponding voltage signal lines.

[0165] It should be noted that the material of the second transparent conductive layer 350 includes indium zinc oxide and / or indium tin oxide to reduce the shielding of the light emitted by the light emitting device 10 by the first electrode 11 and the second electrode 12 and improve the light extraction efficiency of the light emitting substrate 300.

[0166] As shown in FIG. 10 , the second semiconductor layer 360 is disposed on a side of the second transparent conductive layer 350 away from the substrate 20 ; the second semiconductor layer 360 includes a channel C.

[0167] It should be noted that the material of the second semiconductor layer 360 includes amorphous silicon, single crystal silicon, polycrystalline silicon or metal oxide semiconductor material. For example, the material of the second semiconductor layer 360 includes indium gallium zinc oxide and / or zinc oxide.

[0168] As shown, the third conductive layer 370 is disposed on a side of the second semiconductor layer 360 away from the substrate 20. The third conductive layer 370 includes a second gate line 371 and a second transfer line 372. The second gate line 371 overlaps the channel C to form the driving transistor T. The second transfer line 372 is connected to the portion of the first electrode 11 located outside the first groove 21 to transmit a voltage signal to the first electrode 11.

[0169] It should be noted that the material of the third conductive layer 370 includes metal. For example, the material of the third conductive layer 370 includes at least one of aluminum, copper, and molybdenum.

[0170] As shown in FIG10 , the fourth conductive layer 380 is disposed on a side of the third conductive layer 370 away from the substrate 20. The fourth conductive layer 380 includes a source S, a drain D, and a third connecting line 381. The source S and the drain D are respectively connected to the channel C, and one of the source S and the drain D can be connected to the portion of the second electrode 12 located outside the first recess 21 through the third connecting line 381.

[0171] It should be noted that the material of the fourth conductive layer 380 includes metal. For example, the material of the fourth conductive layer 380 includes at least one of aluminum, copper, and molybdenum.

[0172] Based on the above, the side of the light-emitting device 10 close to the substrate 20 can be connected to the portions of the first electrode 11 and the second electrode 12 located within the first groove 21, respectively, so as to emit light under the drive of the first electrode 11 and the second electrode 12. In addition, the light-emitting device 10 and the driving transistor T can be directly manufactured on the substrate 20 and connected via the third adapter 381, avoiding the cost increase and yield loss caused by the die bonding process.

[0173] In addition, referring to FIG. 10 , the light-emitting substrate 300 may further include a second buffer layer BF2, a second gate insulating layer GI2, a second interlayer insulating layer ILD2, and a third encapsulation layer 93. The second buffer layer BF2 is located between the second transparent conductive layer 350 and the second semiconductor layer 360 and fills the first groove 21. The second gate insulating layer GI1 is located between the second semiconductor layer 360 and the third conductive layer 370. The second interlayer insulating layer ILD1 is disposed between the third conductive layer 370 and the fourth conductive layer 380. The third encapsulation layer 93 is disposed on the side of the second conductive layer 340 away from the substrate 20 to provide insulation protection and reduce the risk of failure of the circuit and light-emitting device 10 due to water and oxygen corrosion. The second wiring 372 penetrates the second buffer layer BF2 and the second gate insulating layer GI2 and connects to the portion of the first electrode 11 outside the first groove 21. The third wiring 381 penetrates the buffer layer BF1, the gate insulating layer GI1, and the interlayer insulating layer ILD1 and connects to the portion of the second electrode 12 outside the first groove 21.

[0174] It should be noted that the material of the second buffer layer BF2 includes silicon oxide and / or a transparent resin. The material of the second gate insulating layer GI2 includes any one of silicon nitride, silicon oxynitride, and silicon oxide. The material of the second interlayer insulating layer ILD2 includes any one of silicon nitride, silicon oxynitride, and silicon oxide. The third encapsulation layer 93 may include, for example, at least one inorganic layer and at least one organic layer.

[0175] In some embodiments, referring to Figures 13 to 16, the orthographic projections of the light emitting areas S of at least two light-emitting devices 10 on the second surface 20B of the substrate 20 are located within the range of the orthographic projection of the same first groove 21 on the second surface 20B of the substrate 20 (see Figure 12), so as to reduce the number of first grooves 21 and reduce the process difficulty.

[0176] For example, referring to Figures 13, 14 and 15, a plurality of light-emitting devices 10 are arranged in an array, and the orthographic projections of the light emitting areas S of at least two light-emitting devices 10 located in the same row and / or the same column on the second surface 20B of the substrate 20 are located within the range of the orthographic projection of the same first groove 21 on the second surface 20B of the substrate 20, so as to reduce the process difficulty.

[0177] In some embodiments, as shown in FIG. 15 , the light emitting substrate 300 includes a plurality of light emitting units 110 , and the light emitting unit 110 includes a plurality of light emitting devices 10 connected in series and / or in parallel.

[0178] On this basis, the orthographic projections of the light emitting areas S (see FIG. 7 ) of the multiple light-emitting devices 10 in the same light-emitting unit 110 on the second surface 20B of the substrate 20 are located within the orthographic projection of the same first groove 21 on the second surface 20B of the substrate 20. In this way, by dividing and preparing the first grooves 21 according to the light-emitting units 110, the preparation process of the first grooves 21 can be simplified, circuit routing design can be facilitated, and the brightness uniformity of the light-emitting substrate 300 can be improved.

[0179] 15 , a plurality of light emitting devices 10 are arranged in an array, and the light emitting unit 110 includes four light emitting devices 10 connected in series, and the four light emitting devices 10 are arranged adjacently in two rows and two columns. The four light emitting devices 10 are located in the same first groove 21 to reduce the difficulty of the process.

[0180] In some embodiments, as shown in FIG16 , the orthographic projections of the light emitting areas S of all the light emitting devices 10 on the second surface 20B of the substrate 20 are located within the range of the orthographic projection of the same first groove 21 on the second surface 20B of the substrate 20 .

[0181] Exemplarily, as shown in FIG. 16 , the first groove 21 covers the entire light-emitting area A, and all the light-emitting devices 10 are disposed in the first groove 21 .

[0182] Some embodiments of the present disclosure further provide a method for preparing a light-emitting substrate 300 , which is used to prepare the light-emitting substrate 300 of any of the above embodiments. As shown in FIG. 17 , the preparation method includes S100 to S400 .

[0183] S100 : forming a second groove 22 on the second surface 20B of the substrate 20 .

[0184] In the above steps, as shown in FIG23 , the second groove 22 can be formed by etching the substrate 20 using a mask. For example, a mask can be separately provided on the second surface 20B of the substrate 20. The second groove 22 can then be formed by etching the substrate 20 using the mask, and then the mask can be removed. The mask can be made of, for example, molybdenum.

[0185] It should be noted that the etching may be performed using a wet etching process. In this case, due to the isotropic nature of the wet etching process, the maximum radial length of the opening of the mask plate is substantially equal to the maximum depth of the second groove 22 .

[0186] S200 : forming a color conversion layer 420 in the second groove 22 .

[0187] 23 , an inkjet printing process may be used to form the color conversion layer 420 in the second groove 22. For example, a fluorescent material or a quantum dot material may be printed in the second groove 22 using the inkjet printing process.

[0188] S300 : forming the light emitting device 10 on the first surface 20A of the substrate 20 .

[0189] In the above steps, as shown in FIG24 , the first surface 20A and the second surface 20B are two surfaces of the substrate 20 disposed opposite each other. The light-emitting device 10 includes a light emitting region S, and the orthographic projection of the light emitting region S of the light-emitting device 10 on the substrate 20 is located within the range of the orthographic projection of the color conversion layer 420 on the substrate 20.

[0190] In some embodiments, referring to FIG. 18 and FIG. 25 , S300 includes S311 to S315 .

[0191] S311 : forming a seed layer 101 .

[0192] In the above steps, as shown in Figure 25, a sputtering process can be used to form a whole seed layer 101 on the surface 20A of the substrate 20. The material of the seed layer 101 includes metal, such as molybdenum or copper.

[0193] S312 : forming a retaining wall 102 on the seed layer 101 .

[0194] In the above steps, as shown in Figure 25, the retaining wall 102 has a wiring gap 102A. The retaining wall 102 can be formed by sequentially adopting coating, exposure and development processes.

[0195] S313: forming a routing layer 103 .

[0196] In the above steps, as shown in Figure 25, the routing layer 103 is disposed in the routing gap 102A and includes a first pad 11 and a second pad 12. The routing layer 103 may be formed by electroplating. The routing layer 103 may be made of metal, such as copper.

[0197] S314 : peeling off the retaining wall 102 and patterning the seed layer 101 .

[0198] In the above steps, as shown in Figure 25, the seed layer 101 is patterned so that the orthographic projection of the seed layer 101 on the substrate 20 substantially coincides with the orthographic projection of the wiring layer 103. A stripping solution may be used to remove the retaining wall 102. The seed layer 101 may be patterned using an etching process.

[0199] S315 : Connecting the light emitting device 10 to the first pad 11 and the second pad 12 .

[0200] In the above steps, as shown in FIG. 25 , a die-bonding process may be used to connect the first lead 131 and the second lead 132 of the light-emitting device 10 to the first pad 11 and the second pad 12 , respectively.

[0201] In other embodiments, referring to FIG. 19 and FIG. 26 , S300 includes S321 to S328 .

[0202] S321 : forming a first transparent conductive layer 310 .

[0203] In the above steps, as shown in FIG26 , the first transparent conductive layer 310 is disposed on the first surface 20A of the substrate 20 and is located on the side of the light-emitting device 10 close to the substrate 20. The first transparent conductive layer 310 includes a first electrode 11, which is located in the first groove 21 and extends outside the first groove 21 to facilitate connection to a voltage signal line.

[0204] S322 : forming a first buffer layer BF1 .

[0205] In the above steps, as shown in FIG. 26 , the first buffer layer BF1 is located on a side of the first transparent conductive layer 310 away from the substrate 20 .

[0206] S323 : forming a first semiconductor layer 320 .

[0207] In the above steps, as shown in FIG26 , the first semiconductor layer 320 is disposed on a side of the first buffer layer BF1 away from the substrate 20. The first semiconductor layer 320 includes a channel C.

[0208] S324 : forming a first gate insulating layer GI1 .

[0209] In the above steps, as shown in FIG. 26 , the first gate insulating layer GI1 is located on a side of the first semiconductor layer 320 away from the substrate 20 .

[0210] S325 : forming a first conductive layer 330 .

[0211] In the above steps, as shown in FIG26 , a first conductive layer 330 is disposed on a side of the first semiconductor layer 320 away from the substrate 20. The first conductive layer 330 includes a first gate line 331 and a first connecting line 332. The first gate line 331 overlaps the channel C to form a driving transistor T. The first connecting line 332 is connected to the portion of the first electrode 11 located outside the first groove 21 to transmit a voltage signal to the first electrode 11.

[0212] S326 : forming a first interlayer insulating layer ILD1 .

[0213] In the above steps, as shown in FIG. 26 , the first interlayer insulating layer ILD1 is disposed on a side of the first conductive layer 330 away from the substrate 20 .

[0214] S327 : forming a second conductive layer 340 .

[0215] In the above steps, as shown in FIG26 , the second conductive layer 340 is disposed on a side of the first conductive layer 330 away from the substrate 20. The second conductive layer 340 includes a source S, a drain D, a second electrode 12, and a first connecting line. The source S and the drain D are respectively connected to the channel C, and one of the source S and the drain D can be connected to the second electrode 12 via the first connecting line.

[0216] S328 : forming a second encapsulation layer 92 .

[0217] In the above steps, as shown in FIG26 , the second encapsulation layer 92 is disposed on the side of the second conductive layer 340 away from the substrate 20 to provide insulation protection and reduce the risk of failure of the circuit and the light-emitting device 10 due to water and oxygen corrosion.

[0218] S400 : forming a first reflective layer 30 on a side of the light emitting device 10 away from the substrate 20 .

[0219] In the above steps, as shown in Fig. 24, the first reflective layer 30 at least covers the light emitting device 10. The first reflective layer 30 can be formed by a deposition process and / or a coating process.

[0220] In some embodiments, referring to FIG. 20 , between S100 and S200 , the preparation method further includes S500 .

[0221] S500 : etching the bottom wall of the second groove 22 so that a plurality of first protrusions 201 are formed on the bottom wall of the second groove 22 .

[0222] In the above steps, as shown in FIG23 , a plurality of first protrusions 201 form a first light-homogenizing structure 60. The first protrusions 201 are generally shaped like at least one of a cone, a pyramid, and a spherical segment. In this case, the first protrusions 201 disperse the incident light, scattering it in all directions, thereby improving the brightness uniformity of the light-emitting substrate 300.

[0223] As shown in FIG23 , the plurality of first protrusions 201 can be formed by etching the bottom wall of the second recess 22 of the substrate 20 using a mask. For example, a separate mask layer is provided on the second surface 20B of the substrate 20. The mask layer covers the area outside the second recess 22 and the area within the second recess 22 where the first protrusions 201 are to be formed. The bottom wall of the second recess 22 is etched to form the plurality of first protrusions 201, and the mask layer is then removed.

[0224] In some embodiments, referring to FIG. 21 , before S300 , the preparation method further includes S600 .

[0225] S600 : forming a first groove 21 on the first surface 20A of the substrate 20 .

[0226] In the above steps, as shown in FIG24 , the first groove 21 can be formed by etching the substrate 20 using a mask. For example, a separate mask can be placed on the first surface 20A of the substrate 20, and the substrate 20 can be etched using the mask to form the first groove 21, which can then be removed. The mask material can include molybdenum, for example. In step S300 , the light-emitting device 10 is at least partially located within the first groove 21.

[0227] It should be noted that the etching may be performed using a wet etching process. In this case, due to the isotropic characteristic of the wet etching process, the maximum radial length of the opening of the mask plate is substantially equal to the maximum depth of the first groove 21 .

[0228] In some embodiments, referring to FIG. 21 , the preparation method further includes S700 .

[0229] S700 : forming a reflective structure 70 in the second groove 22 .

[0230] In the above steps, as shown in FIG23 , the reflective structure 70 is disposed on the side of the color conversion layer 420 away from the substrate 20. The reflective structure 70 may include a plurality of reflective patterns 71, which are spaced apart. In this case, a vapor deposition process may be used to directly form the plurality of reflective patterns 71 within the second groove 22.

[0231] In some embodiments, referring to FIG. 22 , before S600 , the preparation method further includes S800 .

[0232] S800 : forming a second reflective layer 40 .

[0233] 24 , the second reflective layer 40 exposes at least the area where the light emitting region S of the light emitting device 10 is located. The reflective film may be formed by sputtering or evaporation, and then patterned by photolithography to form the second reflective layer 40.

[0234] On this basis, referring to FIG. 22 , before S800 , the above preparation method may further include S900 .

[0235] S900: forming a second light homogenizing structure 50.

[0236] In the above steps, as shown in FIG24 , the second light homogenizing structure 50 is disposed between the second reflective layer 40 and the substrate 20. A coating process can be used to coat a whole layer of resin material on the first surface 20A of the substrate 20, and then an exposure and development process is used to form a plurality of second protrusions, which form the second light homogenizing structure 50.

[0237] Some embodiments of the present disclosure further provide a light-emitting substrate 300 , referring to FIG. 27 , including a light-emitting device 10 , a substrate 20 , a first reflective layer 30 and a color conversion layer 420 .

[0238] As shown in FIG. 27 , the substrate 20 has a first surface 20A, a second surface 20B that are opposite to each other, and a side surface 20C connecting the first surface 20A and the second surface 20B.

[0239] 27 , the light emitting device 10 is disposed on the first surface 20A of the substrate 20 . The light emitting device 10 includes a light emitting area S, and the orthographic projection of the light emitting area S on the substrate 20 is within the range of the orthographic projection of the color conversion layer 420 on the substrate 20 .

[0240] As shown in FIG. 27 , the color conversion layer 420 is disposed on the side of the light emitting device 10 facing the second surface 20B.

[0241] As shown in Figure 27, the first reflective layer 30 is arranged on the side of the light-emitting device 10 away from the substrate 20, and at least covers the light-emitting device 10, so that the light emitted from the light-emitting device 10 toward the first reflective layer 30 is reflected and emitted from the second surface 20B of the substrate 20, thereby increasing the light extraction efficiency.

[0242] On this basis, the first surface 20A of the substrate 20 is further provided with a first groove 21. The bottom wall of the first groove 21 of the substrate 20 is provided with a plurality of first protrusions 201. The plurality of first protrusions 201 form a first light homogenizing structure 60. The first protrusions 201 are generally in the shape of at least one of a cone, a pyramid, and a spherical segment. In this case, the first protrusions 201 disperse the incident light, scattering it in all directions, thereby improving the brightness uniformity of the light-emitting substrate 300.

[0243] In addition, the first light homogenizing structure 60 is part of the substrate 20, and no other film layer that plays a light homogenizing role needs to be separately set in the first groove 21. This not only saves material, but also reduces the depth of the first groove 21, so that the thickness of the substrate 20 can be reduced, thereby reducing the thickness of the display device 1000, and making the display device 1000 thinner.

[0244] In some embodiments, referring to FIG. 27 , the color conversion layer 420 is also located within the first groove 21 . The color conversion layer 420 and the substrate 20 located within the first groove 21 jointly occupy a portion of the display device 1000's dimensions in the third direction Z. That is, the color conversion layer 420 located within the first groove 21 does not need to occupy any additional dimensions of the display device 1000 in the third direction Z. Therefore, compared to related technologies, the display device 1000 provided in the present embodiment is thinner, making the display device 1000 even thinner and lighter.

[0245] In other embodiments, referring to Figures 12 and 27, the color conversion layer 420 is located on the second surface 20B of the substrate 20 and covers the entire light-emitting area A (see Figure 4). After the light emitted by the light-emitting device 10 is homogenized by the first homogenizing structure 60, it can be converted by the color conversion layer 420 and emitted.

[0246] In some embodiments, referring to FIG. 27 , at least a portion of the light-emitting device 10 is located within the first groove 21. For example, the entire light-emitting device 10 is located within the first groove 21. For another example, along the third direction Z of the display device 1000, the thickness of the light-emitting device 10 is greater than the depth of the first groove 21. Thus, a portion of the light-emitting device 10 is located within the first groove 21, while another portion extends beyond the opening of the first groove 21 and is exposed outside the first groove 21.

[0247] In this case, the portion of the light-emitting device 10 located in the first groove 21 and the substrate 20 jointly occupy part of the size of the display device 1000 in the third direction Z, that is, the portion of the light-emitting device 10 located in the first groove 21 does not need to additionally occupy the size of the display device 1000 in the third direction Z, which can further reduce the thickness of the display device 1000, making the display device 1000 thinner and lighter.

[0248] In some embodiments, referring to FIG. 27 , the distance between the boundary of the orthographic projection of the bottom wall of the first groove 21 on the second surface 20B of the substrate 20 and the boundary of the orthographic projection of the light emitting area S of the light emitting device 10 on the second surface 20B of the substrate 20 is a first distance L1, and the distance between the light emitting device 10 and the bottom wall of the first groove 21 is a second distance L2.

[0249] In which, the first distance L1 is greater than or equal to the product of the second distance L2 and the tangent value of the light output angle α1 of the light output area S of the light emitting device 10, so that the light emitted by the light emitting device 10 can all be emitted toward the bottom wall of the first groove 21, and thus can all be emitted after being homogenized by the first homogenizing structure 60.

[0250] Some embodiments of the present disclosure further provide a method for preparing a light-emitting substrate 300 , which is used to prepare the light-emitting substrate 300 of the above embodiment. Referring to FIG. 28 and FIG. 29 , the preparation method includes S1 to S5 .

[0251] S1 : forming a first groove 21 on the first surface 20A of the substrate 20 .

[0252] In the above steps, as shown in FIG29 , the first groove 21 can be formed by etching the substrate 20 using a mask. For example, a mask can be separately provided on the first surface 20A of the substrate 20. The substrate 20 is etched using the mask to form the first groove 21, and then the mask is removed. The mask can be made of, for example, molybdenum.

[0253] It should be noted that the etching may be performed using a wet etching process. In this case, due to the isotropic characteristic of the wet etching process, the maximum radial length of the opening of the mask plate is substantially equal to the maximum depth of the first groove 21 .

[0254] S2 : etching the bottom wall of the first groove 21 so that a plurality of first protrusions 201 are formed on the bottom wall of the first groove 21 .

[0255] In the above steps, as shown in FIG29 , a plurality of first protrusions 201 form a first light-homogenizing structure 60. The first protrusions 201 are generally shaped like at least one of a cone, a pyramid, and a spherical segment. In this case, the first protrusions 201 disperse the incident light, scattering it in all directions, thereby improving the brightness uniformity of the light-emitting substrate 300.

[0256] As shown in FIG29 , the plurality of first protrusions 201 can be formed by etching the bottom wall of the first recess 21 of the substrate 20 using a mask. For example, a separate mask layer is provided on the first surface 20A of the substrate 20. The mask layer covers the area outside the first recess 21 and the area within the first recess 21 where the first protrusions 201 are to be formed. The plurality of first protrusions 201 are formed by etching the bottom wall of the first recess 21, and then the mask layer is removed.

[0257] S3: forming a color conversion layer 420 .

[0258] 29 , the color conversion layer 420 is disposed on the second surface 20B of the substrate 20 or in the first groove 21. The first surface 20A and the second surface 20B are two surfaces of the substrate 20 that are opposite to each other.

[0259] When the color conversion layer 420 is disposed in the first groove 21 of the substrate 20, the color conversion layer 420 may be formed in the first groove 21 using an inkjet printing process. For example, a fluorescent material or a quantum dot material may be printed in the first groove 21 using an inkjet printing process.

[0260] S4 : forming the light emitting device 10 on the first surface 20A of the substrate 20 .

[0261] In the above steps, as shown in FIG. 27 and FIG. 29 , the light emitting device 10 includes a light emitting area S, and the orthographic projection of the light emitting area S of the light emitting device 10 on the substrate 20 is located within the range of the color conversion layer 420 on the substrate 20 .

[0262] It should be noted that the steps for forming the light emitting device 10 can be referred to above, and the embodiments of the present disclosure will not be described in detail here.

[0263] S5 : forming a first reflective layer 30 on a side of the light emitting device 10 away from the substrate 20 .

[0264] In the above steps, as shown in Fig. 29, the first reflective layer 30 at least covers the light emitting device 10. The first reflective layer 30 can be formed by a deposition process and / or a coating process.

[0265] Some embodiments of the present disclosure further provide a light-emitting substrate 300 , referring to FIG. 30 , including a light-emitting device 10 , a substrate 20 , a first reflective layer 30 , a color conversion layer 420 and a reflective structure 70 .

[0266] 30 , the substrate 20 has a first surface 20A, a second surface 20B, and a side surface 20C connecting the first surface 20A and the second surface 20B. A first groove 21 is formed on the first surface 20A of the substrate 20 .

[0267] 30 , the light emitting device 10 is disposed on the first surface 20A of the substrate 20 , wherein the light emitting device 10 includes a light emitting area S, the orthographic projection of which is within the range of the orthographic projection of the color conversion layer 420 on the substrate 20 .

[0268] As shown in FIG. 30 , the color conversion layer 420 is disposed on the side of the light emitting device 10 facing the second surface 20B.

[0269] As shown in Figure 30, the first reflective layer 30 is arranged on the side of the light-emitting device 10 away from the substrate 20, and at least covers the light-emitting device 10, so that the light emitted from the light-emitting device 10 toward the first reflective layer 30 is reflected and emitted from the second surface 20B of the substrate 20, thereby increasing the light extraction efficiency.

[0270] As shown in FIG30 , the reflective structure 70 is disposed in the first groove 21 of the substrate 20 , and the reflective structure 70 is configured to reflect the received light. The reflective structure 70 may be specifically described above, and the embodiments of the present disclosure will not be described in detail here.

[0271] In this case, part of the light emitted by the light-emitting device 10 toward the area where the first groove 21 is located can be reflected by the reflective structure 70 into the substrate 20 and emitted from other areas, thereby reducing the light output from the area where the first groove 21 is located and increasing the light output from other areas between the first grooves 21, thereby improving the brightness uniformity of the light-emitting substrate 300.

[0272] Furthermore, the reflective structure 70 does not require additional size of the display device 1000 in the third direction Z, which is beneficial for making the display device 1000 thinner and lighter. In other words, the light-emitting substrate 300 can improve the brightness uniformity of the light-emitting substrate 300 without increasing the thickness of the display device 1000.

[0273] In some embodiments, referring to FIG. 30 , the color conversion layer 420 is further located in the first groove 21 , and the reflective structure 70 is located on the side of the color conversion layer 420 away from the substrate 20 , so as to prevent the light emitted by the light-emitting device 10 from being directly emitted without being converted by the color conversion layer 420 , thereby reducing the risk of color deviation.

[0274] The color conversion layer 420 and the substrate 20 located in the first groove 21 jointly occupy part of the size of the display device 1000 in the third direction Z. That is, the color conversion layer 420 located in the first groove 21 does not need to occupy additional size of the display device 1000 in the third direction Z. Based on this, compared with the related art, the thickness of the display device 1000 provided in the embodiment of the present disclosure is reduced, making the display device 1000 lighter and thinner.

[0275] In other embodiments, referring to FIG. 12 and FIG. 30 , the color conversion layer 420 is located on the second surface 20B of the substrate 20 and covers the entire light-emitting area A (see FIG. 4 ). The light emitted by the light-emitting device 10 is reflected by the reflective structure 70 and can be converted by the color conversion layer 420 and then emitted.

[0276] In some embodiments, referring to FIG. 30 , at least a portion of the light-emitting device 10 is located within the first groove 21. For example, the entire light-emitting device 10 is located within the first groove 21. For another example, along the third direction Z of the display device 1000, the thickness of the light-emitting device 10 is greater than the depth of the first groove 21. Thus, a portion of the light-emitting device 10 is located within the first groove 21, while another portion extends beyond the opening of the first groove 21 and is exposed outside the first groove 21.

[0277] In this case, the portion of the light-emitting device 10 located in the first groove 21 and the substrate 20 jointly occupy part of the size of the display device 1000 in the third direction Z, that is, the portion of the light-emitting device 10 located in the first groove 21 does not need to additionally occupy the size of the display device 1000 in the third direction Z, which can further reduce the thickness of the display device 1000, making the display device 1000 thinner and lighter.

[0278] In some embodiments, referring to Figure 30, the distance between the boundary of the orthographic projection of the bottom wall of the above-mentioned first groove 21 on the second surface 20B of the substrate 20 and the boundary of the orthographic projection of the light emitting area S of the light emitting device 10 on the second surface 20B of the substrate 20 is a first distance L1, and the distance between the light emitting device 10 and the bottom wall of the first groove 21 is a second distance L2.

[0279] In which, the first distance L1 is greater than or equal to the product of the second distance L2 and the tangent value of the light emission angle α1 of the light emitting area S of the light emitting device 10, so that the light emitted by the light emitting device 10 can be emitted toward the bottom wall of the first groove 21, and through the reflective structure 70, part of the light is directly emitted, and part of the light is reflected into the substrate 20 and emitted from other areas, thereby improving the brightness uniformity of the light emitting substrate 300.

[0280] Some embodiments of the present disclosure further provide a method for preparing a light-emitting substrate 300 , which is used to prepare the light-emitting substrate 300 of the above embodiment. As shown in FIG. 31 and FIG. 32 , the preparation method includes S10 to S50 .

[0281] S10 : forming a first groove 21 on the first surface 20A of the substrate 20 .

[0282] In the above steps, as shown in FIG32 , the first groove 21 can be formed by etching the substrate 20 using a mask. For example, a mask can be separately provided on the first surface 20A of the substrate 20. The substrate 20 is etched using the mask to form the first groove 21, and then the mask is removed. The mask can be made of, for example, molybdenum.

[0283] It should be noted that the etching may be performed using a wet etching process. In this case, due to the isotropic characteristic of the wet etching process, the maximum radial length of the opening of the mask plate is substantially equal to the maximum depth of the first groove 21 .

[0284] S20 : ​​forming a reflective structure 70 in the first groove 21 .

[0285] In the above steps, as shown in FIG32 , the reflective structure 70 is disposed on the side of the color conversion layer 420 away from the substrate 20. The reflective structure 70 may include a plurality of reflective patterns 71, which are spaced apart. In this case, an evaporation process may be used to directly form the plurality of reflective patterns 71 within the second groove 22.

[0286] S30: forming a color conversion layer 420.

[0287] 32 , the color conversion layer 420 is disposed on the second surface 20B of the substrate 20 or in the first groove 21, and the color conversion layer 420 is located on the side of the reflective structure 70 away from the substrate 20. The first surface 21A and the second surface 20B are two surfaces of the substrate 20 that are disposed opposite each other.

[0288] When the color conversion layer 420 is disposed in the first groove 21 of the substrate 20, the color conversion layer 420 may be formed in the first groove 21 using an inkjet printing process. For example, a fluorescent material or a quantum dot material may be printed in the first groove 21 using an inkjet printing process.

[0289] S40 : forming the light emitting device 10 on the first surface 20A of the substrate 20 .

[0290] In the above steps, as shown in FIG30 and FIG32 , the light emitting device 10 includes a light emitting area S, and the orthographic projection of the light emitting area S of the light emitting device 10 on the substrate 20 is located within the range of the color conversion layer 420 on the substrate 20 .

[0291] It should be noted that the steps for forming the light emitting device 10 can be referred to above, and the embodiments of the present disclosure will not be described in detail here.

[0292] S50 : forming a first reflective layer 30 on a side of the light emitting device 10 away from the substrate 20 .

[0293] In the above steps, as shown in Fig. 32, the first reflective layer 30 at least covers the light emitting device 10. The first reflective layer 30 can be formed by a deposition process and / or a coating process.

[0294] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0295] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A light-emitting substrate, comprising: A substrate having a first surface and a second surface disposed opposite to each other; The second surface of the substrate is provided with a second groove; A light emitting device is disposed on the first surface of the substrate; the light emitting device comprises a light emitting area; a color conversion layer, arranged on a side of the light emitting device facing the second surface; the color conversion layer is located in the second groove, and the orthographic projection of the light emitting area of ​​the light emitting device on the substrate is located within the range of the color conversion layer on the substrate; The first reflective layer is arranged on a side of the light emitting device away from the substrate and at least covers the light emitting device.

2. The light-emitting substrate according to claim 1, further comprising: A first light homogenizing structure is disposed in the second groove of the substrate; The first light homogenization structure is configured to scatter the received light.

3. The light-emitting substrate according to claim 2, wherein: The first light homogenizing structure includes a plurality of first protrusions, and the plurality of first protrusions are arranged on the bottom wall of the second groove of the substrate.

4. The light-emitting substrate according to claim 3, wherein: The first protrusion is substantially at least one of a cone, a pyramid and a spherical segment.

5. The light emitting substrate according to any one of claims 2 to 4, wherein The first light homogenization structure comprises: The scattering layer is arranged on a side of the color conversion layer close to or far from the substrate.

6. The light-emitting substrate according to any one of claims 1 to 5, further comprising: The reflective structure is disposed in the second groove of the substrate and is located at a side of the color conversion layer away from the substrate; the reflective structure is configured to reflect received light.

7. The light-emitting substrate according to claim 6, wherein: The reflective structure includes a plurality of reflective patterns, and the plurality of reflective patterns are arranged at intervals.

8. The light-emitting substrate according to claim 7, wherein: The shape of the orthographic projection of the reflection pattern on the substrate is substantially at least one of a circle, an ellipse and a polygon.

9. The light-emitting substrate according to any one of claims 1 to 8, wherein A first groove is provided on the first surface of the substrate, and at least a portion of the light emitting device is located in the first groove.

10. The light emitting substrate according to claim 9, further comprising: A first transparent conductive layer is disposed on the first surface of the substrate and is located on a side of the light emitting device close to the substrate; The first transparent conductive layer includes a first electrode, which is located in the first groove and extends outside the first groove; the light emitting device is close to the substrate and is connected to a portion of the first electrode located in the first groove; A first semiconductor layer is disposed on a side of the first transparent conductive layer away from the substrate; the first semiconductor layer includes a channel; The first conductive layer is disposed on a side of the first semiconductor layer away from the substrate; the first conductive layer includes a A gate line and a first switching line; the first gate line overlaps the channel; the first switching line is connected to a portion of the first electrode located outside the first groove; A second conductive layer is arranged on a side of the first conductive layer away from the substrate; the second conductive layer comprises a source electrode, a drain electrode, a second electrode and a first connecting line; The side of the light emitting device away from the substrate is connected to the second electrode, and one of the source and the drain is connected to the second electrode through a first connection line; the source and the drain are respectively connected to the channel.

11. The light emitting substrate according to claim 9, further comprising: A second transparent conductive layer is disposed on the first surface of the substrate and is located on a side of the light emitting device close to the substrate; The second transparent conductive layer includes a first electrode and a second electrode, the first electrode and the second electrode are located in the first groove and both extend outside the first groove; the light emitting device is close to the substrate and is connected to the first electrode and the second electrode located in the first groove; A second semiconductor layer is disposed on a side of the second transparent conductive layer away from the substrate; the second semiconductor layer comprises a channel; a third conductive layer, disposed on a side of the second semiconductor layer away from the substrate; the third conductive layer comprises a second gate line and a second switching line; the second gate line overlaps the channel; the second switching line is connected to a portion of the first electrode located outside the first groove; A fourth conductive layer is arranged on a side of the third conductive layer away from the substrate; the fourth conductive layer includes a source, a drain and a third switching line; and one of the source and the drain is connected to a portion of the second electrode located outside the first groove through the third switching line; the source and the drain are respectively connected to the channel.

12. The light-emitting substrate according to claim 10 or 11, wherein: The orthographic projections of at least two light-emitting devices on the second surface of the substrate are located within the range of the orthographic projection of the same first groove on the second surface of the substrate.

13. The light emitting substrate according to claim 12, wherein: A plurality of the light emitting devices are arranged in an array, and the orthographic projections of the light emitting areas of at least two light emitting devices in the same row and / or column on the second surface of the substrate are within the range of the orthographic projection of the same first groove on the second surface of the substrate.

14. The light-emitting substrate according to claim 12 or 13, comprising: A light-emitting unit, comprising a plurality of the light-emitting devices connected in series and / or in parallel; The orthographic projections of the light emitting areas of the plurality of light emitting devices belonging to the same light emitting unit on the second surface of the substrate are located within the range of the orthographic projection of the same first groove on the second surface of the substrate.

15. The light emitting substrate according to any one of claims 12 to 14, wherein The orthographic projections of the light emitting areas of all the light emitting devices on the second surface of the substrate are located within the range of the orthographic projection of the same first groove on the second surface of the substrate.

16. The light emitting substrate according to any one of claims 1 to 15, wherein The substrate further includes a side surface connecting the first surface and the second surface, and the light-emitting substrate further includes: The light leakage prevention layer is arranged on the side surface of the substrate.

17. The light emitting substrate according to any one of claims 1 to 16, wherein A first groove is provided on the first surface of the substrate, the distance between the boundary of the orthographic projection of the bottom wall of the first groove on the second surface of the substrate and the boundary of the orthographic projection of the light emitting area of ​​the light emitting device on the second surface of the substrate is a first distance, and the distance between the light emitting device and the bottom wall of the first groove is a second distance; The first distance is greater than or equal to the product of the second distance and the tangent value of the light emitting angle of the light emitting area of ​​the light emitting device.

18. The light emitting substrate according to any one of claims 1 to 17, wherein The distance between the boundary of the orthographic projection of the bottom wall of the second groove on the second surface of the substrate and the boundary of the orthographic projection of the light emitting area of ​​the light emitting device on the second surface of the substrate is a third distance, and the distance between the light emitting device and the bottom wall of the second groove is a fourth distance; The third distance is greater than or equal to the product of the fourth distance and the tangent value of the light emitting angle of the light emitting area of ​​the light emitting device.

19. The light-emitting substrate according to any one of claims 1 to 18, further comprising: The second reflective layer is disposed on the first surface of the substrate and at least exposes the area where the light emitting area of ​​the light emitting device is located.

20. The light-emitting substrate according to any one of claims 1 to 19, further comprising: The first encapsulation layer is arranged on a side of the color conversion layer away from the substrate.

21. A light-emitting substrate, comprising: A substrate having a first surface and a second surface arranged opposite to each other; a first groove is provided on the first surface of the substrate; and a plurality of first protrusions are provided on the bottom wall of the first groove of the substrate; A light emitting device is disposed on the first surface of the substrate; the light emitting device comprises a light emitting area; a color conversion layer, arranged on a side of the light emitting device facing the second surface; an orthographic projection of a light emitting area of ​​the light emitting device on the substrate is located within the range of the color conversion layer on the substrate; The first reflective layer is arranged on a side of the light emitting device away from the substrate and at least covers the light emitting device.

22. The light emitting substrate according to claim 21, wherein: The color conversion layer is located in the first groove; and / or at least a portion of the light emitting device is located in the first groove.

23. A light-emitting substrate, comprising: A substrate having a first surface and a second surface arranged opposite to each other; the first surface of the substrate is provided with a first groove; A light emitting device is disposed on the first surface of the substrate; the light emitting device comprises a light emitting area; a color conversion layer, arranged on a side of the light emitting device facing the second surface; an orthographic projection of a light emitting area of ​​the light emitting device on the substrate is located within the range of the color conversion layer on the substrate; A first reflective layer is disposed on a side of the light emitting device away from the substrate and at least covers the light emitting device; The reflective structure is disposed in the first groove of the substrate; the reflective structure is configured to reflect the received light.

24. The light-emitting substrate according to claim 23, wherein: The color conversion layer is located in the first groove and on a side of the reflective structure away from the substrate; and / or at least a portion of the light emitting device is located in the first groove.

25. A backlight module, comprising: The light-emitting substrate according to any one of claims 1 to 24; The light-emitting substrate has a light-emitting side and a non-light-emitting side opposite to each other; A diffusion sheet, arranged on the light-emitting side of the light-emitting substrate; The composite film is arranged on a side of the diffusion sheet away from the light-emitting substrate.

26. A display device comprising: The backlight module as claimed in claim 25; The display panel is arranged on a side of the composite film in the backlight module away from the light-emitting substrate.

27. A method for preparing a light-emitting substrate, for preparing the light-emitting substrate according to any one of claims 1 to 20, comprising: forming a second groove on the second surface of the substrate; forming a color conversion layer in the second groove; forming a light emitting device on a first surface of the substrate; The first surface and the second surface are two surfaces of the substrate arranged opposite to each other; the light emitting device comprises a light emitting area, and the orthographic projection of the light emitting area of ​​the light emitting device on the substrate is located within the range of the orthographic projection of the color conversion layer on the substrate; A first reflective layer is formed on a side of the light emitting device away from the substrate; the first reflective layer at least covers the light emitting device.

28. The preparation method according to claim 27, wherein Between forming the second groove on the second surface of the substrate and forming the color conversion layer in the second groove, the preparation method further includes: The bottom wall of the second groove is etched so that a plurality of first protrusions are formed on the bottom wall of the second groove.

29. The preparation method according to claim 27 or 28, wherein: Before forming the light emitting device on the first surface of the substrate, the preparation method further comprises: A first groove is formed on the first surface of the substrate; the light emitting device is at least partially located in the first groove.

30. The preparation method according to any one of claims 27 to 29, further comprising: A reflective structure is formed in the second groove; the reflective structure is arranged on a side of the color conversion layer away from the substrate.

31. A method for preparing a light-emitting substrate, for preparing the light-emitting substrate according to claim 21 or 22, comprising: forming a first groove on the first surface of the substrate; Etching the bottom wall of the first groove so that a plurality of first protrusions are formed on the bottom wall of the first groove; forming a color conversion layer; The color conversion layer is in the second surface of the substrate or in the first groove; the first surface and the second surface are two surfaces of the substrate arranged opposite to each other; A light emitting device is formed on the first surface of the substrate; the light emitting device comprises a light emitting area, and the orthographic projection of the light emitting area of ​​the light emitting device on the substrate is located within the range of the color conversion layer on the substrate; A first reflective layer is formed on a side of the light emitting device away from the substrate; the first reflective layer at least covers the light emitting device.

32. A method for preparing a light-emitting substrate, for preparing the light-emitting substrate according to claim 23 or 24, comprising: forming a first groove on the first surface of the substrate; forming a reflective structure in the first groove; forming a color conversion layer; The color conversion layer is disposed on the second surface of the substrate or in the first groove; the first surface and the second surface are two surfaces of the substrate disposed opposite to each other; the color conversion layer is located on a side of the reflective structure away from the substrate; A light emitting device is formed on the first surface of the substrate; the light emitting device comprises a light emitting area, and the orthographic projection of the light emitting area of ​​the light emitting device on the substrate is located within the range of the color conversion layer on the substrate; A first reflective layer is formed on a side of the light emitting device away from the substrate; the first reflective layer at least covers the light emitting device.

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