Electroplating method and electroplating apparatus

Abstract

The application provides a kind of electroplating method and electroplating device, it is related to semiconductor processing technical field, the electroplating method includes: S10, to middle part anode applies positive voltage, edge electrode does not work;S20, obtains the deposition rate of the plating layer of the middle part region is v1, obtains the deposition rate of the plating layer of the edge region is v2;S30, judge v1 and v2 size;S40, if v1>v2, then to edge electrode applies positive voltage, and exports current I;S50, if v1<v2, then to edge electrode applies negative voltage, and exports current I;S60, if v1=v2, keep the working state of edge electrode unchanged.The deposition rate of the plating layer of the middle part region and the edge region is obtained respectively in the application, according to this control edge electrode voltage and current, the deposition rate of the edge region can be dynamically adjusted, and then the deposition rate of the edge region and the middle part region can be balanced in real time, so as to improve the uniformity of electroplating.

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