Injection molding device for mobile phone liquid silica gel product

CN120023974APending Publication Date: 2025-05-23JINING AVOVE ELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202510409154.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-02
Publication Date
2025-05-23

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Abstract

The invention belongs to the technical field of injection molding, and particularly discloses a mobile phone liquid silica gel product injection molding device which comprises a sub-mold plate and a master mold plate, the sub-mold plate is arranged over the master mold plate, an annular storage groove is formed in the middle of the bottom of the sub-mold plate, and a fixing sleeve is installed on the top face of the interior of the annular storage groove. The bottom of the fixing sleeve extends towards the lower portion of the sub-mold plate, a plurality of position indicating devices are arranged on the outer surface of the fixing sleeve, a plurality of injection molding induction devices are arranged in the fixing sleeve, and a plurality of feeding devices are arranged in the fixing sleeve. According to the injection molding device, the position indicating device, the injection molding induction device and the feeding device are arranged, after the child mold plate and the mother mold plate are connected in a clamped mode, injection molding can be conducted on the interior of the molding box, and during injection molding, whether the child mold plate and the mother mold plate are in butt joint in place or not is inducted through the injection molding induction device, and whether the molding box is pressed to the lowest position or not is inducted; and meanwhile, the injection molding induction device can also control on-off of the feeding device.
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