High-reliability epoxy resin composition and application

Abstract

The invention relates to the technical field of epoxy molding compounds, in particular to a high-reliability epoxy resin composition and application thereof. The composition is composed of blended epoxy resin, phenolic resin, high-content filler and a plurality of functional aids, wherein the blended epoxy resin constructs a three-dimensional network structure through the synergistic effect of o-cresol formaldehyde type epoxy resin and organosilicon epoxy resin. The organic silicon epoxy resin is prepared from allyl glycidyl ether, D4H cyclotetrasiloxane and specific molecular weight single-ended vinyl silicone oil through a catalytic reaction. Through molecular structure design and filler interface regulation and control, on the premise of keeping high filler content, the thermal expansion coefficient of the material is accurately matched with the aluminum wire, the problem of thermal mismatch during packaging of a high-expansion-coefficient base material is solved, and the method is particularly suitable for aluminum wire bonding packaging of power devices.

Description

Technical Field

[0001] The invention relates to the technical field of epoxy molding compounds, and in particular to a high-reliability epoxy resin composition and application thereof. Background Art

[0002] Epoxy molding compound (EMC) has many excellent properties and has been widely used in the packaging field. It is the mainstream material for semiconductor components and integrated circuit packaging. At present, the biggest problem of EMC in electronic device packaging is stress. The thermal expansion coefficient of EMC does not match that of materials such as chips, basebands, conductive adhesives or frames. These effects will generate internal stress at the interface between the chip and the molding compound. The long-term existence and repeated action of internal stress (such as in a temperature cycle working environment) may lead to interface delamination, that is, separation of the chip and EMC, and may also cause cracking of the molding compound itself, making it easy for water vapor and impurities to enter the package. In subsequent reliability tests such as TCT 1000 cycle tests, delamination or even electrical performance failure will seriously affect the reliability and service life of the device. In addition, the volume shrinkage during the EMC curing process will also generate internal stress, which may also cause the above problems. For high-precision electronic device packaging, an inappropriate thermal expansion coefficient will affect the stability of the package size. If the coefficient of thermal expansion is too large, the size of the package will change beyond the allowable range when the temperature changes, which may affect the fine structure inside the device (such as the connection between the chip and the pins) and the electrical connection between the chip and the external circuit, causing problems such as short circuits or open circuits, reducing the reliability of the electronic device.

[0003] However, in power discrete devices or module packaging, in order to improve the efficiency of device transmission, aluminum wire is used in the bonding process. Aluminum wire has good oxidation resistance, hardness and ductility, obvious price advantages, and excellent electrical transmission performance, and occupies an important position in the localization plan; however, compared with conventional copper substrates, the expansion coefficient of aluminum wire is 23 (×10 -5 / K) is higher than copper wire 17 (×10 -5 / K); in the packaging, in view of the technical points of EMC, in order to match the aluminum wire, the expansion coefficient of EMC needs to be increased; the conventional approach is to reduce the content of EMC fillers to achieve this; but the reduction of filler content will also bring about its own flame retardancy and cost issues. Therefore, at present, when power devices use a material substrate with a high expansion coefficient (such as aluminum wire, aluminum strip), how to match it without losing filler content is an urgent problem to be solved. Summary of the invention

[0004] In view of this, the purpose of the present invention is to provide a high-reliability epoxy resin composition and its application to solve the problem that the expansion coefficient of the epoxy resin composition does not match that of a material substrate with a high expansion coefficient (such as aluminum wire, aluminum strip).

[0005] Based on the above purpose, the present invention provides a high-reliability epoxy resin composition, which is obtained by mixing 60-80 parts of blended epoxy resin, 25-32g parts of phenolic resin, 850-900 parts of filler, 1.5-3 parts of carbon black, 3-10 parts of coupling agent, 1-3 parts of oxidized polyethylene wax, 0.5-2 parts of ester wax, 1.5-2 parts of accelerator, 5-7 parts of stress modifier and 2-4 parts of ion capture agent.

[0006] Preferably, the mixing temperature is 90-110°C.

[0007] Furthermore, the blended epoxy resin is prepared by mixing an o-cresol-formaldehyde epoxy resin and an organosilicon epoxy resin in a weight ratio of 60-100:5-15.

[0008] Preferably, the preparation method of the blended epoxy resin is as follows: (2) the o-cresol-formaldehyde epoxy resin and the silicone epoxy resin are crushed and passed through a 60-100 mesh sieve, mixed, heated to 95-105° C., stirred for 1-2 hours, cooled naturally, and then crushed through a 60-100 mesh sieve to obtain a blended epoxy resin.

[0009] Furthermore, the preparation method of the silicone epoxy resin is as follows:

[0010] Add allyl glycidyl ether, D4H cyclotetrasiloxane and single-end vinyl silicone oil to anhydrous toluene, add catalyst under nitrogen protection, heat to 105-115°C, stir and react for 2-4h, add activated carbon to remove residual catalyst, filter, and rotary evaporate to obtain silicone epoxy resin.

[0011] Preferably, the weight ratio of allyl glycidyl ether, D4H cyclotetrasiloxane, single-end vinyl silicone oil, anhydrous toluene and KARSTEDT catalyst is 3.42:2.96:10:50-80:0.05-0.2.

[0012] Preferably, the weight average molecular weight of the single-ended vinyl silicone oil is 800-1200.

[0013] Preferably, the phenolic resin is a linear phenolic resin.

[0014] Preferably, the filler is one of silicon dioxide, aluminum oxide, talc, kaolin, carbon fiber, glass fiber, or a mixture of several of them in any proportion.

[0015] Preferably, the accelerator is one of imidazole compounds, tertiary amine compounds, organic phosphine compounds, and amide compounds, or a mixture of several of them in any proportion.

[0016] Preferably, the stress modifier is silicone rubber.

[0017] Preferably, the catalyst is a Karstedt catalyst.

[0018] Preferably, the mesh number of the activated carbon is 150 - 250 meshes.

[0019] Furthermore, the present invention adopts the application of a highly reliable epoxy resin composition for module encapsulation using aluminum wires in the bonding process.

[0020] Advantages of the present invention:

[0021] Through the synergistic effect of molecular structure design and interface regulation, the present invention realizes a breakthrough improvement in the comprehensive performance of the epoxy resin composition. The innovative organosilicon epoxy resin constructs a rigid-flexible three-dimensional network structure, and its unique architecture anchors rigid epoxy groups and flexible siloxane segments simultaneously through chemical bonding, endowing excellent deformation buffering ability while maintaining the mechanical strength of the material. The gradient-distributed interfacial transition layer effectively eliminates the thermal mismatch stress between the filler and the matrix, and establishes a stable multi-scale interfacial system through the synergistic effect of hydrogen bond interaction and chemical bonding.

[0022] The thermal expansion characteristics of the material are precisely matched with the aluminum substrate, significantly reducing the interfacial shear stress under temperature cycling conditions. The "molecular spring" effect in the interpenetrating network structure can efficiently dissipate mechanical impact energy, greatly improving the anti-cracking performance. The optimized rheological characteristics endow the system with both a wide processing window and the advantage of rapid curing, ensuring the complete filling and uniform curing of the melt front during the encapsulation of complex structures.

[0023] This composition maintains a stable interfacial bonding strength under harsh environments such as damp heat aging and temperature cycling, and is particularly suitable for aluminum wire bonding encapsulation of high-power density devices. The innovative pre-dispersion process enables the filler to be uniformly distributed as nanoscale primary particles, eliminating the agglomeration defects caused by traditional mechanical mixing. The silicone component with precisely regulated molecular weight effectively inhibits the tendency of phase separation, forming a homogeneous and transparent continuous phase structure. This multi-dimensional performance improvement enables the material to meet the long-life reliability requirements of high-end fields such as aerospace and automotive-grade electronics for encapsulation materials. Specific embodiments

[0024] To make the objectives, technical solutions, and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to specific embodiments.

[0025] In the specific embodiments of the present invention, the o-cresol novolac epoxy resin is purchased, with the model being,

[0026] Epoxy resin: o-cresol novolac epoxy resin (manufacturer: Nan Ya, grade: NPCN-701);

[0027] Linear phenolic resin (manufacturer: Ming He, grade: MEHC-7800M)

[0028] Filler: Spherical silica (Manufacturer: Lianrui, Brand: DQ1150)

[0029] Carbon black (manufacturer: Mitsubishi Chemical, brand: MA-600)

[0030] Coupling agent (manufacturer: Chenguang, brand: CG-0187)

[0031] Oxidized polyethylene wax (Manufacturer: Liuhe, Brand: LICOWAX PED522)

[0032] Ester wax (Manufacturer: Liuhe, Brand: Stearic acid monoglyceride (MG))

[0033] Accelerator (triphenylphosphine TPP (Manufacturer: Shanghai Huichuang)

[0034] Stress modifier: silicone rubber (manufacturer: Dow Corning, brand: 8421);

[0035] Ion scavenger (manufacturer: East Asia Synthetic, brand: IXE-700)

[0036] KARSTEDT catalyst (manufacturer: Shanghai Aladdin, brand: K110178)

[0037] Embodiment 1:

[0038] (1) 3.42 g of allyl glycidyl ether, 2.96 g of D4H cyclotetrasiloxane and 10 g of single-end vinyl silicone oil (weight average molecular weight of 1000) were added to 50 g of anhydrous toluene, and under nitrogen protection, 0.05 g of KARSTEDT catalyst was added, the temperature was raised to 105° C., and the reaction was stirred for 2 h. 3 g of activated carbon (200 mesh) was added to remove the residual catalyst, filtered, and rotary evaporated to obtain a silicone epoxy resin;

[0039] (2) 60 g of o-cresol epoxy resin and 5 g of silicone epoxy resin were ground and then mixed, heated to 95° C., stirred for 1 h, naturally cooled, and then ground again through a 60-mesh sieve to obtain a blended epoxy resin;

[0040] (3) 60 g of the blended epoxy resin, 25 g of the linear phenolic resin, 850 g of the filler, 1.5 g of carbon black, 3 g of the coupling agent, 1 g of the oxidized polyethylene wax, 0.5 g of the ester wax, 1.5 g of the accelerator, 5 g of the stress modifier and 2 g of the ion capture agent were mixed, and the mixture was uniformly mixed on an open rubber mixer at a temperature of 100° C., cooled naturally, and crushed through a 60-mesh sieve to obtain a high-reliability epoxy resin composition.

[0041] Embodiment 2:

[0042] (1) 3.42 g of allyl glycidyl ether, 2.96 g of D4H cyclotetrasiloxane and 10 g of single-end vinyl silicone oil (weight average molecular weight of 1000) were added to 60 g of anhydrous toluene, and 0.1 g of KARSTEDT catalyst was added under nitrogen protection, the temperature was raised to 110° C., and the reaction was stirred for 3 h. 5 g of activated carbon (200 mesh) was added to remove the residual catalyst, filtered, and rotary evaporated to obtain a silicone epoxy resin;

[0043] (2) 80 g of o-cresol epoxy resin and 10 g of silicone epoxy resin were ground and then mixed, heated to 100° C., stirred for 1.5 h, cooled naturally, and then ground again through an 80-mesh sieve to obtain a blended epoxy resin;

[0044] (3) 70 g of the blended epoxy resin, 29.3 g of the linear phenolic resin, 880 g of the filler, 2 g of carbon black, 5 g of the coupling agent, 2 g of the oxidized polyethylene wax, 1 g of the ester wax, 1.7 g of the accelerator, 6 g of the stress modifier and 3 g of the ion capture agent were mixed and kneaded evenly on an open rubber mixer at a temperature of 100° C., cooled naturally, and crushed through an 80-mesh sieve to obtain a high-reliability epoxy resin composition.

[0045] Embodiment 3:

[0046] (1) 3.42 g of allyl glycidyl ether, 2.96 g of D4H cyclotetrasiloxane and 10 g of single-end vinyl silicone oil (weight average molecular weight of 1000) were added to 80 g of anhydrous toluene, and 0.2 g of KARSTEDT catalyst was added under nitrogen protection, the temperature was raised to 115° C., and the reaction was stirred for 4 h. 10 g of activated carbon (200 mesh) was added to remove the residual catalyst, filtered, and rotary evaporated to obtain a silicone epoxy resin;

[0047] (2) 100 g of o-cresol epoxy resin and 15 g of silicone epoxy resin were ground and passed through a 100-mesh sieve, mixed, heated to 105° C., stirred for 2 h, cooled naturally, and then ground again through a 100-mesh sieve to obtain a blended epoxy resin;

[0048] (3) 80 g of the blended epoxy resin, 32 g of the linear phenolic resin, 900 g of the filler, 3 g of carbon black, 10 g of the coupling agent, 3 g of the oxidized polyethylene wax, 2 g of the ester wax, 2 g of the accelerator, 7 g of the stress modifier and 4 g of the ion scavenger were mixed, and the mixture was uniformly mixed on an open rubber mixer at a temperature of 110° C., cooled naturally, and crushed through a 100-mesh sieve to obtain a high-reliability epoxy resin composition.

[0049] Comparative Example 1:

[0050] The difference between Comparative Example 1 and Example 2 is that the silicone epoxy resin in step (2) is replaced by an equal weight of o-cresol-formaldehyde epoxy resin;

[0051] The specific steps are as follows:

[0052] (1) 3.42 g of allyl glycidyl ether, 2.96 g of D4H cyclotetrasiloxane and 10 g of single-end vinyl silicone oil (weight average molecular weight of 1000) were added to 60 g of anhydrous toluene, and 0.1 g of KARSTEDT catalyst was added under nitrogen protection, the temperature was raised to 110° C., and the reaction was stirred for 3 h. 5 g of activated carbon (200 mesh) was added to remove the residual catalyst, filtered, and rotary evaporated to obtain a silicone epoxy resin;

[0053] (2) 70 g of o-cresol-formaldehyde epoxy resin crushed through an 80-mesh sieve, 29.3 g of linear phenolic resin, 880 g of filler, 2 g of carbon black, 5 g of coupling agent, 2 g of oxidized polyethylene wax, 1 g of ester wax, 1.7 g of accelerator, 6 g of stress modifier and 3 g of ion scavenger were mixed, and the mixture was uniformly mixed on an open rubber mixer at a temperature of 100° C., cooled naturally, and crushed through an 80-mesh sieve to obtain an epoxy resin composition.

[0054] Comparative Example 2:

[0055] The difference between Comparative Example 2 and Example 2 is that the single-terminated vinyl silicone oil (weight average molecular weight of 1000) in step (1) is replaced by an equal molar amount of allyl glycidyl ether;

[0056] The specific steps are as follows:

[0057] (1) 4.56 g of allyl glycidyl ether and 2.96 g of D4H cyclotetrasiloxane were added to 60 g of anhydrous toluene, and 0.1 g of KARSTEDT catalyst was added under nitrogen protection, the temperature was raised to 110° C., and the reaction was stirred for 3 h. 5 g of activated carbon (200 mesh) was added to remove the residual catalyst, and the mixture was filtered and rotary evaporated to obtain an organosilicon epoxy resin;

[0058] (2) 80 g of o-cresol epoxy resin and 10 g of silicone epoxy resin were ground and then mixed, heated to 100° C., stirred for 1.5 h, cooled naturally, and then ground again through an 80-mesh sieve to obtain a blended epoxy resin;

[0059] (3) 70 g of the blended epoxy resin, 29.3 g of the linear phenolic resin, 880 g of the filler, 2 g of carbon black, 5 g of the coupling agent, 2 g of the oxidized polyethylene wax, 1 g of the ester wax, 1.7 g of the accelerator, 6 g of the stress modifier and 3 g of the ion capture agent were mixed and kneaded evenly on an open rubber mixer at a temperature of 100° C., cooled naturally, and crushed through an 80-mesh sieve to obtain an epoxy resin composition.

[0060] Comparative Example 3:

[0061] The difference between Comparative Example 3 and Example 2 is that the mono - terminal vinyl silicone oil (weight - average molecular weight of 1000) in step (1) is replaced with an equimolar amount of mono - terminal vinyl silicone oil (weight - average molecular weight of 2000);

[0062] The specific steps are as follows:

[0063] (1) Add 3.42 g of allyl glycidyl ether, 2.96 g of D4H cyclotetrasiloxane and 5 g of mono - terminal vinyl silicone oil (weight - average molecular weight of 2000) to 60 g of anhydrous toluene. Under nitrogen protection, add 0.1 g of KARSTEDT catalyst, heat up to 110 °C, stir and react for 3 h. Add 5 g of activated carbon (200 mesh) to remove the residual catalyst, filter, and rotary evaporate to obtain organosilicon epoxy resin;

[0064] (2) Mix 80 g of o - cresol novolac epoxy resin and 10 g of organosilicon epoxy resin after pulverizing and passing through an 80 - mesh sieve, heat up to 100 °C, stir for 1.5 h, naturally cool and then pulverize and pass through an 80 - mesh sieve to obtain a blended epoxy resin;

[0065] (3) Mix 70 g of the blended epoxy resin, 29.3 g of linear phenolic resin, 880 g of filler, 2 g of carbon black, 5 g of coupling agent, 2 g of oxidized polyethylene wax, 1 g of ester wax, 1.7 g of accelerator, 6 g of stress modifier and 3 g of ion scavenger, and knead evenly on an open - type rubber kneader at a temperature of 100 °C, naturally cool, pulverize and pass through an 80 - mesh sieve to obtain an epoxy resin composition.

[0066] Comparative Example 4:

[0067] The difference between Comparative Example 4 and Example 2 is that the molar ratio of allyl glycidyl ether, mono - terminal vinyl silicone oil and D4H cyclotetrasiloxane in step (1) is adjusted to 1:3:1;

[0068] The specific steps are as follows:

[0069] (1) Add 1.14 g of allyl glycidyl ether, 2.96 g of D4H cyclotetrasiloxane and 30 g of mono - terminal vinyl silicone oil (weight - average molecular weight of 1000) to 60 g of anhydrous toluene. Under nitrogen protection, add 0.1 g of KARSTEDT catalyst, heat up to 110 °C, stir and react for 3 h. Add 5 g of activated carbon (200 mesh) to remove the residual catalyst, filter, and rotary evaporate to obtain organosilicon epoxy resin;

[0070] (2) Mix 80 g of o - cresol novolac epoxy resin and 10 g of organosilicon epoxy resin after pulverizing and passing through an 80 - mesh sieve, heat up to 100 °C, stir for 1.5 h, naturally cool and then pulverize and pass through an 80 - mesh sieve to obtain a blended epoxy resin;

[0071] (3) 70 g of the blended epoxy resin, 29.3 g of the linear phenolic resin, 880 g of the filler, 2 g of carbon black, 5 g of the coupling agent, 2 g of the oxidized polyethylene wax, 1 g of the ester wax, 1.7 g of the accelerator, 6 g of the stress modifier and 3 g of the ion capture agent were mixed and kneaded evenly on an open rubber mixer at a temperature of 100° C., cooled naturally, and crushed through an 80-mesh sieve to obtain an epoxy resin composition.

[0072] Performance Test:

[0073] Referring to GB / T40564-2021 "Test Method for Epoxy Molding Materials for Electronic Packaging", the spiral flow length, gelation time, flash, and linear expansion coefficient of the epoxy resin compositions prepared in Examples 1-3 and Comparative Examples 1-4 were measured, and the results are shown in Table 1;

[0074] TCT test: The epoxy resin compositions prepared in Examples 1-3 and Comparative Examples 1-4 were pressed into products with a height of 50 mm, an inner diameter of 25 mm, and an outer diameter of 30 mm by a molding machine, and were molded under the conditions of a metal mold temperature of 175±2°C, an injection pressure of 80±2kg / cm2, and a curing time of 150s. The molded products were post-cured at a temperature of 175±2°C for 6 hours, then taken out and cooled at room temperature, and then placed in a hot and cold cycle impact test box from -35°C to 130°C, cycled once for 2 hours, and continued for 1000 cycles to check the cracking of the products. The results are shown in Table 1.

[0075] Table 1 Performance test results

[0076]

[0077] Data Analysis:

[0078] From the performance test results of Examples 1-3 in Table 1, it can be seen that with the increase in the amount of filler, the spiral flow length does not change much, and the flash data further decreases. This is mainly because the addition of the blended epoxy resin significantly promotes the interface compatibility between the filler and the resin, and the pre-dispersion treatment of the blended epoxy resin further improves the interface compatibility. Moreover, the linear expansion coefficient of the epoxy resin composition provided by the present invention is similar to the linear expansion coefficient of aluminum (23×10 -5 / K) has a high matching degree, so that it can pass the reliability test TCT 1000 cycles in aluminum wire bonding, and is suitable for the application requirements of high-reliability epoxy resin compositions that use aluminum wires in the bonding process.

[0079] As can be seen from the data of Example 2 and Comparative Example 1 in Table 1, the introduction of silicone epoxy resin significantly improves the comprehensive performance of the material system. Compared with conventional o-cresol epoxy resin systems, the addition of silicone components may form hydrogen bonds with the surface hydroxyl groups of inorganic fillers through its unique siloxane segments, thereby enhancing the interfacial bonding force between the resin matrix and the filler particles. This enhanced interfacial compatibility is conducive to the uniform dispersion of fillers in the matrix, reducing the local stress concentration phenomenon caused by filler agglomeration. At the same time, the flexible characteristics of the silicone segments can effectively buffer the internal stress generated during the thermal cycle, making the thermal expansion behavior of the material closer to the aluminum metal substrate, thereby passing the strict TCT test. In addition, the silicone component may optimize the melt flow behavior by adjusting the rheological properties of the system, so that the gelation time is shortened while maintaining an appropriate flow length, which is conducive to molding process control.

[0080] From the data of Example 2 and Comparative Example 2 in Table 2, it can be seen that compared with the use of allyl glycidyl ether alone, the long chain structure of vinyl silicone oil may form an interpenetrating network structure during the curing process, and its flexible siloxane chain segment can effectively absorb mechanical stress as a "molecular spring". This structural feature not only improves the material's anti-cracking performance, but also may slow down the curing reaction speed through the steric hindrance effect, allowing the resin system to maintain a more suitable fluidity window during the molding process.

[0081] As can be seen from the data of Example 2 and Comparative Example 3 in Table 2, the selection of silicone oil molecular weight has a significant impact on material properties. Single-end vinyl silicone oil (1000) with lower molecular weight may have better system compatibility and higher reactivity, and its shorter molecular chain is easier to form a homogeneous system with epoxy resin. The long chain structure of high molecular weight silicone oil (2000) may cause local phase separation, forming microscopic defect areas. This phase separation phenomenon may become the starting point for crack initiation during thermal cycling, and the migration tendency of high molecular weight silicone oil will destroy the filler-resin interface and reduce the integrity of the composite material. In addition, molecular weight differences may affect the crosslinking density, and low molecular weight silicone oil can form a denser and more elastic network structure.

[0082] From the data of Example 2 and Comparative Example 4 in Table 2, it can be seen that when the molar ratio of allyl glycidyl ether, single-end vinyl silicone oil and D4H cyclotetrasiloxane deviates from the optimal ratio, the molecular structure of the silicone epoxy resin may change significantly. The appropriate molar ratio ensures the precise grafting of the siloxane segment and the epoxy group to form a star-shaped structure with an ideal branching degree. This structure can maintain the material strength through the rigid epoxy group and provide deformation ability through the flexible siloxane segment.

[0083] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present invention is limited to these examples. Under the concept of the present invention, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity.

Claims

1. A high reliability epoxy resin composition, characterized in that, The invention is prepared by mixing, by weight, 60-80 parts of a blended epoxy resin, 25-32 parts of a phenolic resin, 850-900 parts of a filler, 1.5-3 parts of carbon black, 3-10 parts of a coupling agent, 1-3 parts of an oxidized polyethylene wax, 0.5-2 parts of an ester wax, 1.5-2 parts of an accelerator, 5-7 parts of a stress modifier and 2-4 parts of an ion capture agent; The blended epoxy resin is prepared by mixing an o-cresol-formaldehyde epoxy resin and an organosilicon epoxy resin in a weight ratio of 60-100:5-15; The preparation method of the organosilicon epoxy resin is as follows: Add allyl glycidyl ether, D4H cyclotetrasiloxane and single-end vinyl silicone oil to anhydrous toluene, add a catalyst under nitrogen protection, heat to 105-115°C, stir and react for 2-4h, add activated carbon to remove the residual catalyst, filter, and rotary evaporate to obtain an organosilicon epoxy resin; The weight ratio of allyl glycidyl ether, D4H cyclotetrasiloxane, single-end vinyl silicone oil, anhydrous toluene and KARSTEDT catalyst is 3.42:2.96:10:50-80:0.05-0.2; The weight average molecular weight of the single-end vinyl silicone oil is 800-1200.

2. The high reliability epoxy resin composition according to claim 1, characterized in that The phenolic resin is a linear phenolic resin.

3. The high reliability epoxy resin composition according to claim 1, characterized in that: The filler is one of silicon dioxide, aluminum oxide, talcum powder, kaolin, carbon fiber, glass fiber, or a mixture of several of them in any proportion.

4. The high reliability epoxy resin composition according to claim 1, characterized in that: The accelerator is one of imidazole compounds, tertiary amine compounds, organic phosphine compounds and amide compounds, or a mixture of several of them in any proportion.

5. The high reliability epoxy resin composition according to claim 1, characterized in that: The stress modifier is silicone rubber.

6. The high reliability epoxy resin composition according to claim 1, characterized in that: The catalyst is KARSTEDT catalyst.

7. The high reliability epoxy resin composition according to claim 1, characterized in that: The mesh number of the activated carbon is 150-250 meshes.

8. The high reliability epoxy resin composition according to claim 1, characterized in that: The preparation method of the blended epoxy resin is as follows: (2) the o-cresol epoxy resin and the silicone epoxy resin are crushed and passed through a 60-100 mesh sieve, mixed, heated to 95-105° C., stirred for 1-2 hours, naturally cooled, and then crushed through a 60-100 mesh sieve to obtain the blended epoxy resin.

9. The high reliability epoxy resin composition according to claim 1, characterized in that: The mixing temperature is 90-110°C.

10. An application of the high reliability epoxy resin composition according to any one of claims 1 to 9, characterized in that: For module packaging using aluminum wires in the bonding process.

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