Liquid cooling manifold and preparation method and application thereof
By using flexible polymer compounds graft-modified homopolypropylene and other materials, combined with other high-performance fillers, liquid-cooled manifolds with high thermal conductivity, corrosion resistance and high mechanical strength, it solves the problems of high cost, difficulty in maintenance and poor thermal conductivity of existing liquid-cooled manifold materials, and is suitable for data center liquid-cooled applications.
Patent Information
- Application Number
- CN202510270216.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-07
- Publication Date
- 2025-05-23
AI Technical Summary
Existing liquid-cooled manifold materials such as stainless steel have high costs, difficulty in maintenance, and poor thermal conductivity of engineering plastics, limiting the development and application of liquid-cooling technology.
Flexible polymer compound graft modified homopolypolypropylene is used as the main raw material, combined with polycarbonate, polyamide, carbon fiber, ceramic powder and talc powder, and through specific ratios and process treatment, liquid-cooled manifolds with high thermal conductivity, corrosion resistance and high mechanical strength are prepared.
It significantly reduces the production cost of liquid-cooled manifolds and improves its comprehensive performance. It is suitable for liquid-cooled application scenarios in data centers. It has excellent corrosion resistance, mechanical strength, thermal conductivity and heat resistance.
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Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of energy-saving and heat dissipation in the communication industry, and in particular to a liquid cooling manifold and a preparation method and application thereof. Background Art
[0002] With the development of emerging technologies such as artificial intelligence and big models, data centers have increasing requirements for technology, and chip performance is rapidly iterating, which brings new challenges to energy saving and heat dissipation. Liquid cooling technology uses water or other fluids with high thermal conductivity to cool high heat density racks, which can help data centers reduce energy consumption and carbon emissions while improving performance, and has become a new trend in the future development of data centers.
[0003] At present, liquid cooling manifolds in data centers are generally made of stainless steel. This material is heavy and difficult to transport; installation and welding require high precision, a large amount of welding materials are needed, the welds need to be pickled, the pipelines need to be straightened before use, and the subsequent maintenance costs are high. Due to the above defects, the cost of stainless steel manifolds remains high and the development of liquid cooling technology is slow.
[0004] In order to reduce manufacturing costs, some engineering plastics are gradually used in the field of liquid cooling manifolds. However, due to the poor thermal conductivity and limited high temperature resistance of engineering plastics, the application field of liquid cooling manifolds is limited. In order to adapt to the rapid development and wide application of liquid cooling technology, it is urgent to improve and develop a new material for liquid cooling manifolds, so as to further reduce costs and improve its comprehensive performance while ensuring the corrosion resistance, high thermal conductivity and high mechanical strength of the liquid cooling manifold. Summary of the invention
[0005] In response to the above problems, the present invention provides a liquid cooling manifold and a preparation method and application thereof. By rationally combining various raw materials, the comprehensive performance of the liquid cooling manifold is improved, while the production cost is greatly reduced, and it is suitable for liquid cooling application scenarios in data centers.
[0006] In order to solve the above technical problems, the technical solution provided by the present invention is: In a first aspect, the present invention provides a liquid cooling manifold, comprising the following raw materials in parts by mass: 100 parts of flexible polymer grafted modified homopolypropylene, 15 to 25 parts of polycarbonate, 8 to 15 parts of polyamide, 20 to 30 parts of carbon fiber, 10 to 18 parts of ceramic powder and 4 to 8 parts of talc.
[0007] Compared with the prior art, the liquid cooling manifold provided by the present invention uses homopolymer polypropylene (PPH) as the main raw material. PPH has a wider operating temperature and better heat resistance than ordinary polypropylene (PP). It can work stably at higher temperatures (below 100°C), is not easy to crack at low temperatures, and its mechanical properties will not drop significantly at high temperatures; PPH has extremely high chemical stability and excellent corrosion resistance to a variety of chemical substances (such as acids, alkalis, and salts), and is suitable for use in environments with corrosive cooling media; PPH is a good electrical insulating material and is suitable for liquid cooling application scenarios such as data centers that have high requirements for electrical insulation, ensuring the electrical safety of the system, and has low density and light weight, which is easy to install and transport, helping to reduce manual labor intensity and reduce the overall weight of the liquid cooling system; at the same time, PPH is an economical plastic with low raw material costs, easy to form and weld, and suitable for large-scale production or cost-sensitive applications.
[0008] The present invention adopts flexible polymer compounds for grafting modification, which can enhance the connection strength of molecular chains, improve the mechanical strength of PPH, and significantly enhance its impact resistance; polycarbonate (PC) has high toughness and high impact resistance, polyamide (PA) is an engineering plastic specially used in low-temperature environments, and has high strength and heat resistance. Polycarbonate and polyamide have good dimensional stability, which can greatly enhance the stability, mechanical strength and heat resistance of homopolymer polypropylene grafted with flexible polymer compounds; carbon fiber is a high thermal conductivity fiber, which can not only improve the continuity of the thermal conduction path, but also enhance the mechanical strength and rigidity of the liquid cooling manifold; ceramic powder has good thermal conductivity and is light in weight; talcum powder is a mineral filler, which can reduce the thermal expansion coefficient of homopolymer polypropylene grafted with flexible polymer compounds, improve its dimensional stability, and at the same time improve the density and uniformity of the material.
[0009] The invention adopts raw material components with specific proportions for matching, and the raw materials have a synergistic effect, which significantly improves the comprehensive performance of the liquid cooling manifold and has good market application prospects.
[0010] Preferably, the method for preparing the flexible polymer compound graft-modified homopolypropylene comprises the following steps: After homopolymer polypropylene, flexible polymer compound, compatibilizer and initiator are mixed, they are added into a twin-screw extruder and grafted at 160°C to 200°C to obtain flexible polymer compound grafted modified homopolymer polypropylene.
[0011] Further preferably, the flexible polymer compound includes at least one of ethylene-octene copolymer (POE), ethylene-propylene rubber (EPR) or ethylene-propylene-diene monomer rubber (EPDM).
[0012] In the present invention, the flexible polymer compound contains a relatively long flexible chain segment, has excellent flexibility, low temperature resistance and impact resistance, and exhibits rubber-like elasticity at room temperature, which can effectively improve the toughness and impact strength (especially low temperature impact resistance) of PPH, and transform the material from brittle fracture to ductile fracture, while also improving its heat resistance and mechanical strength to a certain extent.
[0013] Further preferably, the compatibilizer includes maleic anhydride grafted polypropylene (PP-g-MAH).
[0014] Further preferably, the initiator comprises a peroxide.
[0015] More preferably, the peroxide includes dicumyl peroxide or 1,4-di-tert-butylperoxycumene.
[0016] Further preferably, the mass ratio of the homopolypropylene, the flexible polymer compound, the compatibilizer and the initiator is (80-90):(20-10):(3-5):(0.1-0.5).
[0017] Further preferably, the screw speed of the twin-screw extruder is 100 r / min~200 r / min.
[0018] It should be noted that the time the material spends in the screw extruder is the time of the grafting reaction.
[0019] Illustratively, the polycarbonate may be PC-9800, PC-9821 or PC98-NX.
[0020] For example, the polyamide may be PA66, PA6, PA11 or PA12.
[0021] Preferably, the carbon fiber has a length of 3 mm to 6 mm and a diameter of 5 μm to 7 μm.
[0022] Preferably, the particle size of the ceramic powder is 50 μm to 80 μm.
[0023] Preferably, the particle size of the talcum powder is 1000 mesh to 2000 mesh.
[0024] In a second aspect, the present invention provides a method for preparing the liquid cooling manifold, comprising the following steps: The flexible polymer compound graft modified homopolymer polypropylene, polycarbonate, polyamide, carbon fiber, ceramic powder and talcum powder are mixed, added into an injection molding machine, melt blended at 190°C-230°C, the obtained mixture is injected into a mold, cooled and solidified to obtain a liquid-cooled manifold.
[0025] Preferably, the screw rotation speed of the injection molding machine is 50 r / min to 150 r / min, and the back pressure is 5 MPa to 20 MPa.
[0026] Preferably, the injection rate into the injection mold is 30 cm 3 / s to 100 cm 3 / s, and the injection pressure is 80 MPa to 200 MPa.
[0027] Preferably, the cooling and solidification time is 30 s to 60 s.
[0028] Exemplarily, after the cooling and solidification is completed, it further includes: demolding, surface treatment, to obtain a liquid-cooled manifold.
[0029] Exemplarily, the surface treatment includes: removing flash and burrs, painting, etc.
[0030] In a third aspect, the present invention provides an application of the described liquid-cooled manifold in a data center heat dissipation device.
[0031] The test results show that the liquid-cooled manifold provided by the present invention has excellent corrosion resistance, mechanical strength, thermal conductivity and heat resistance. The tensile strength is more than 20 MPa, the bending strength is more than 280 MPa, the elastic modulus is more than 10 GPa, the thermal conductivity is as high as more than 5 W / (m·K), the thermal resistance is below 0.65 °C·cm 2 / W, the heat distortion temperature under a load of 0.45 MPa can reach more than 230 °C, and the corrosion resistance (corrosion area ≤ 5%) in a salt spray environment can reach more than 240 h, which is particularly suitable for the field of data center heat dissipation devices with strict environmental requirements. Specific Embodiments
[0032] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.
[0033] In the present invention, unless otherwise specified, all materials are commercially available products.
[0034] Example 1 This example provides a liquid-cooled manifold, including the following parts by mass of raw materials: 100 parts of flexible polymer compound graft-modified homopolypropylene, 20 parts of polycarbonate (PC-9800), 10 parts of polyamide (PA6), 25 parts of carbon fiber, 15 parts of ceramic powder, and 6 parts of talc powder. Among them, the length of the carbon fiber is 5 mm and the diameter is 6 μm; the particle size of the ceramic powder is 60 μm; the particle size of the talc powder is 1500 mesh.
[0035] The preparation method of the above liquid-cooled manifold includes the following steps: S1, after PPH, flexible polymer compound (POE), compatibilizer (PP-g-MAH) and initiator (diisopropylbenzene peroxide) are mixed, the mass ratio of PPH, flexible polymer compound, compatibilizer and initiator is 85:15:4:0.3, add them into a twin-screw extruder, carry out grafting reaction at 180°C, and the screw speed is 150r / min to obtain flexible polymer grafted modified homopolypropylene.
[0036] S2, weigh each raw material according to the designed ratio, mix the flexible polymer compound graft modified homopolymer polypropylene, polycarbonate, polyamide, carbon fiber, ceramic powder and talcum powder, add them into the injection molding machine, melt blend at 210°C, the screw speed is 100r / min, the back pressure is 12MPa, and the obtained mixture is injected into the mold at an injection rate of 60cm 3 / s, the injection pressure is 140MPa, and after cooling and solidification for 50s, demoulding and surface treatment are performed to obtain a liquid-cooled manifold.
[0037] Example 2 This embodiment provides a liquid cooling manifold, comprising the following raw materials by mass: 100 parts of flexible polymer graft modified homopolypropylene, 15 parts of polycarbonate (PC-9821), 15 parts of polyamide (PA66), 20 parts of carbon fiber, 10 parts of ceramic powder and 8 parts of talc. The carbon fiber has a length of 3 mm and a diameter of 5 μm; the particle size of the ceramic powder is 50 μm; and the particle size of the talc is 1000 mesh.
[0038] The method for preparing the liquid cooling manifold comprises the following steps: S1, after PPH, flexible polymer compound (EPR), compatibilizer (PP-g-MAH) and initiator (1,4-di-tert-butylperoxyisopropylbenzene) are mixed, the mass ratio of PPH, flexible polymer compound, compatibilizer and initiator is 80:20:3:0.5, add them into a twin-screw extruder, carry out grafting reaction at 160°C, and the screw speed is 100r / min to obtain flexible polymer grafted modified homopolypropylene.
[0039] S2, weigh each raw material according to the designed ratio, mix the flexible polymer compound graft modified homopolymer polypropylene, polycarbonate, polyamide, carbon fiber, ceramic powder and talcum powder, add them into the injection molding machine, melt blend at 190°C, the screw speed is 50r / min, the back pressure is 18MPa, and the obtained mixture is injected into the mold at an injection rate of 30cm 3 / s, the injection pressure is 190MPa, and after cooling and solidification for 30s, demoulding and surface treatment are performed to obtain a liquid-cooled manifold.
[0040] Example 3 This embodiment provides a liquid cooling manifold, comprising the following raw materials by mass: 100 parts of flexible polymer graft modified homopolypropylene, 25 parts of polycarbonate (PC98-NX), 8 parts of polyamide (PA11), 30 parts of carbon fiber, 18 parts of ceramic powder and 4 parts of talc. The carbon fiber has a length of 6 mm and a diameter of 7 μm; the particle size of the ceramic powder is 80 μm; and the particle size of the talc is 2000 mesh.
[0041] The method for preparing the liquid cooling manifold comprises the following steps: S1, after PPH, flexible polymer compound (EPDM), compatibilizer (PP-g-MAH) and initiator (diisopropylbenzene peroxide) are mixed, the mass ratio of PPH, flexible polymer compound, compatibilizer and initiator is 90:10:5:0.1, add them into a twin-screw extruder, carry out grafting reaction at 200°C, and the screw speed is 200r / min to obtain flexible polymer grafted modified homopolypropylene.
[0042] S2, weigh each raw material according to the designed ratio, mix the flexible polymer compound graft modified homopolymer polypropylene, polycarbonate, polyamide, carbon fiber, ceramic powder and talcum powder, add them into the injection molding machine, melt blend at 230°C, the screw speed is 150r / min, the back pressure is 5MPa, and the obtained mixture is injected into the mold at an injection rate of 90cm 3 / s, the injection pressure is 80MPa, and after cooling and solidification for 60s, demoulding and surface treatment are performed to obtain a liquid-cooled manifold.
[0043] Example 4 This embodiment provides a liquid cooling manifold, comprising the following raw materials by mass: 100 parts of flexible polymer graft modified homopolypropylene, 19 parts of polycarbonate (PC-9800), 13 parts of polyamide (PA12), 26 parts of carbon fiber, 14 parts of ceramic powder and 6 parts of talc. The carbon fiber has a length of 4 mm and a diameter of 6 μm; the particle size of the ceramic powder is 70 μm; and the particle size of the talc is 1750 mesh.
[0044] The method for preparing the liquid cooling manifold comprises the following steps: S1, after PPH, flexible polymer compound (POE), compatibilizer (PP-g-MAH) and initiator (diisopropylbenzene peroxide) are mixed, the mass ratio of PPH, flexible polymer compound, compatibilizer and initiator is 85:15:4:0.4, add them into a twin-screw extruder, carry out grafting reaction at 190°C, and the screw speed is 160r / min to obtain flexible polymer grafted modified homopolypropylene.
[0045] S2, weigh each raw material according to the designed ratio, mix the flexible polymer compound graft modified homopolymer polypropylene, polycarbonate, polyamide, carbon fiber, ceramic powder and talcum powder, add them into the injection molding machine, melt blend at 220℃, the screw speed is 120r / min, the back pressure is 10MPa, and the obtained mixture is injected into the mold at an injection rate of 70cm 3 / s, the injection pressure is 120MPa, and after cooling and solidification for 45s, demoulding and surface treatment are performed to obtain a liquid-cooled manifold.
[0046] Comparative Example 1 This comparative example provides a liquid cooling manifold, which is similar to Example 1, except that the flexible polymer graft modified homopolypropylene is replaced with flexible polymer graft modified polyetheretherketone of the same mass. The remaining components and their amounts are the same as those in Example 1 and will not be described in detail.
[0047] The preparation method of the above liquid cooling manifold is similar to that of Example 1, except that: in S1, PPH is replaced with polyetheretherketone (PEEK5600LF30) of equal quality. Specifically, the following steps are included: S1, after polyetheretherketone, flexible polymer compound (POE), compatibilizer (PP-g-MAH) and initiator (diisopropylbenzene peroxide) are mixed, the mass ratio of polyetheretherketone, flexible polymer compound, compatibilizer and initiator is 85:15:4:0.3, add them into a twin-screw extruder, carry out grafting reaction at 180°C, and the screw speed is 150r / min to obtain flexible polymer grafted modified polyetheretherketone.
[0048] S2, weigh each raw material according to the designed ratio, mix the flexible polymer graft modified polyetheretherketone, polycarbonate, polyamide, carbon fiber, ceramic powder and talcum powder, add them into the injection molding machine, melt blend at 210°C, the screw speed is 100r / min, the back pressure is 12MPa, and the obtained mixture is injected into the mold at an injection rate of 60cm 3 / s, the injection pressure is 140MPa, and after cooling and solidification for 50s, demoulding and surface treatment are performed to obtain a liquid-cooled manifold.
[0049] Comparative Example 2 This comparative example provides a liquid cooling manifold, which is similar to Example 1, except that the flexible polymer compound graft modified homopolypropylene is replaced with PPH of the same mass. The remaining components and their amounts are the same as those in Example 1 and will not be described in detail.
[0050] The method for preparing the liquid cooling manifold comprises the following steps: Weigh each raw material according to the designed ratio, mix PPH, compatibilizer (PP-g-MAH), polycarbonate, polyamide, carbon fiber, ceramic powder and talcum powder, the mass ratio of PPH and compatibilizer is 85:4, add them into the injection molding machine, melt blend at 210℃, the screw speed is 100r / min, the back pressure is 12MPa, and the obtained mixture is injected into the mold at an injection rate of 60cm 3 / s, the injection pressure is 140MPa, and after cooling and solidification for 50s, demoulding and surface treatment are performed to obtain a liquid-cooled manifold.
[0051] Comparative Example 3 This comparative example provides a liquid cooling manifold, which is similar to Example 1, except that polycarbonate and polyamide are replaced with flexible polymer graft-modified homopolypropylene of equal mass, i.e., the flexible polymer graft-modified homopolypropylene is 130 parts in total. The remaining components and their amounts are the same as those in Example 1 and will not be described in detail.
[0052] The method for preparing the liquid cooling manifold comprises the following steps: S1 is the same as in Example 1 and will not be described in detail.
[0053] S2, weigh each raw material according to the designed ratio, mix the flexible polymer compound grafted modified homopolymer polypropylene, carbon fiber, ceramic powder and talcum powder, add them into the injection molding machine, melt blend at 210°C, the screw speed is 100r / min, the back pressure is 12MPa, and the obtained mixture is injected into the mold at an injection rate of 60cm 3 / s, the injection pressure is 140MPa, and after cooling and solidification for 50s, demoulding and surface treatment are performed to obtain a liquid-cooled manifold.
[0054] Comparative Example 4 This comparative example provides a liquid cooling manifold, which is similar to Example 4, except that polycarbonate is replaced with polyphenylene sulfide (PPS, R4-XT) of equal mass. The remaining components and their amounts are the same as those in Example 4 and will not be described in detail.
[0055] The method for preparing the liquid cooling manifold comprises the following steps: S1 is the same as in Example 4 and will not be described in detail.
[0056] S2, weigh each raw material according to the designed ratio, mix the flexible polymer compound grafted modified homopolymer polypropylene, PPS, polyamide, carbon fiber, ceramic powder and talcum powder, add them into the injection molding machine, melt blend at 210°C, the screw speed is 100r / min, the back pressure is 12MPa, and the obtained mixture is injected into the mold at an injection rate of 60cm 3 / s, the injection pressure is 140MPa, and after cooling and solidification for 50s, demoulding and surface treatment are performed to obtain a liquid-cooled manifold.
[0057] Comparative Example 5 This comparative example provides a liquid cooling manifold, which is similar to Example 4, except that the carbon fiber is replaced with glass fiber of the same mass with a length of 4 mm and a diameter of 9 μm. The remaining components and their amounts are the same as those in Example 4 and will not be described in detail.
[0058] The method for preparing the liquid cooling manifold comprises the following steps: S1 is the same as in Example 4 and will not be described in detail.
[0059] S2, weigh each raw material according to the designed ratio, mix the flexible polymer compound graft modified homopolymer polypropylene, polycarbonate, polyamide, glass fiber, ceramic powder and talcum powder, add them into the injection molding machine, melt blend at 220℃, the screw speed is 120r / min, the back pressure is 10MPa, and the obtained mixture is injected into the mold at an injection rate of 70cm 3 / s, the injection pressure is 120MPa, and after cooling and solidification for 45s, demoulding and surface treatment are performed to obtain a liquid-cooled manifold.
[0060] Comparative Example 6 This comparative example provides a liquid cooling manifold, which is similar to Example 4, except that the ceramic powder is replaced with talcum powder of the same mass, that is, 20 parts of talcum powder. The remaining ingredients and their amounts are the same as those in Example 4 and will not be described again.
[0061] The method for preparing the liquid cooling manifold comprises the following steps: S1 is the same as in Example 4 and will not be described in detail.
[0062] S2, weigh each raw material according to the designed ratio, mix the flexible polymer compound graft modified homopolymer polypropylene, polycarbonate, polyamide, carbon fiber and talcum powder, add them into the injection molding machine, melt blend at 220℃, the screw speed is 120r / min, the back pressure is 10MPa, and the obtained mixture is injected into the mold at an injection rate of 70cm 3 / s, the injection pressure is 120MPa, and after cooling and solidification for 45s, demoulding and surface treatment are performed to obtain a liquid-cooled manifold.
[0063] Verification test The mechanical properties, thermal conductivity and heat resistance of the liquid cooling manifolds provided in Examples 1 to 4 and Comparative Examples 1 to 6 were tested respectively, and the test results are shown in Table 1.
[0064] Table 1 Performance test results of the liquid cooling manifold of the embodiment and the comparative example
[0065] As can be seen from the table, the liquid cooling manifold provided by the embodiment of the present invention has excellent corrosion resistance, mechanical strength, thermal conductivity and heat resistance. Compared with the liquid cooling manifolds of Examples 1 to 4, after replacing PPH with PEEK in Comparative Example 1, although the heat resistance is improved, the thermal conductivity and toughness are greatly reduced, and the cost of raw materials increases; Comparative Example 2 does not graft PPH with flexible polymer compounds, and the toughness and thermal conductivity show different degrees of decline; Comparative Example 3 omits polycarbonate and polyamide, and Comparative Example 4 replaces polycarbonate with PPS, and the mechanical properties, thermal conductivity and heat resistance show different degrees of decline; Comparative Example 5 replaces carbon fiber with glass fiber, and the thermal conductivity is greatly reduced; Comparative Example 6 omits ceramic powder, and after increasing the amount of talcum powder, the mechanical strength and thermal conductivity decrease.
[0066] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modification, equivalent substitution or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims
1. A liquid cooling manifold, characterized in that: The invention comprises the following raw materials in parts by weight: 100 parts of flexible polymer compound grafted modified homopolypropylene, 15 parts to 25 parts of polycarbonate, 8 parts to 15 parts of polyamide, 20 parts to 30 parts of carbon fiber, 10 parts to 18 parts of ceramic powder and 4 parts to 8 parts of talc.
2. The liquid cooling manifold according to claim 1, characterized in that: The method for preparing the flexible polymer compound graft-modified homopolypropylene comprises the following steps: After homopolymer polypropylene, flexible polymer compound, compatibilizer and initiator are mixed, they are added into a twin-screw extruder and grafted at 160°C to 200°C to obtain flexible polymer compound grafted modified homopolymer polypropylene.
3. The liquid cooling manifold according to claim 2, characterized in that: The flexible polymer compound includes at least one of ethylene-octene copolymer, ethylene-propylene rubber or ethylene-propylene-diene monomer rubber; The compatibilizer includes maleic anhydride grafted polypropylene; The initiator includes a peroxide.
4. The liquid cooling manifold according to claim 2, characterized in that: The mass ratio of the homopolymer polypropylene, the flexible polymer compound, the compatibilizer and the initiator is (80-90):(20-10):(3-5):(0.1-0.5).
5. The liquid cooling manifold according to claim 1, characterized in that: The carbon fiber has a length of 3 mm to 6 mm and a diameter of 5 μm to 7 μm.
6. The liquid cooling manifold according to claim 1, characterized in that The particle size of the ceramic powder is 50 μm to 80 μm; The particle size of the talcum powder is 1000 mesh to 2000 mesh.
7. The method for preparing a liquid cooling manifold according to any one of claims 1 to 6, characterized in that: The following steps are involved: The flexible polymer compound graft modified homopolymer polypropylene, polycarbonate, polyamide, carbon fiber, ceramic powder and talcum powder are mixed, added into an injection molding machine, melt blended at 190°C-230°C, the obtained mixture is injected into a mold, cooled and solidified to obtain a liquid-cooled manifold.
8. The method for preparing a liquid cooling manifold according to claim 7, characterized in that: The screw speed of the injection molding machine is 50 r / min-150 r / min, and the back pressure is 5 MPa-20 MPa.
9. The method for preparing a liquid cooling manifold according to claim 7, characterized in that: The injection rate of the injection mold is 30cm 3 / s~100cm 3 / s, injection pressure is 80MPa~200MPa; The cooling and solidification time is 30s to 60s.
10. Use of the liquid cooling manifold according to any one of claims 1 to 6 or the liquid cooling manifold prepared by the preparation method of the liquid cooling manifold according to any one of claims 7 to 9 in a heat dissipation device of a data center.