Camera module

Abstract

The invention provides a camera module which comprises a photosensitive chip, a circuit board, an optical lens, a motor and a base, the photosensitive chip is installed on the circuit board and is in conduction connection with the circuit board, the optical lens is configured on a photosensitive path of the photosensitive chip, the base is integrally formed on the circuit board, and the motor is arranged on the base. The photosensitive chip is used for packaging at least one part of the circuit board, the photosensitive chip is exposed through a windowing area defined by the base, and the motor is assembled on the base; wherein the base is provided with a plurality of anti-shake conduction grooves and a plurality of mutually independent anti-shake conductive parts, the plurality of anti-shake conduction grooves are arranged on the same side of the base, the anti-shake conductive parts are arranged in the anti-shake conduction grooves, one ends of the anti-shake conductive parts are conducted to the circuit board, and the other ends of the anti-shake conductive parts are conducted to the motor.

Description

Technical Field

[0001] The present application relates to the field of camera modules, and more specifically to a camera module. Background Art

[0002] Camera modules are an essential part of mobile electronic devices. With the further development of camera module technology, users' demands for camera modules have become more and more refined and have higher requirements. The development of camera products not only needs to meet the requirements of high performance, but also needs to meet the requirements of miniaturization and lightness.

[0003] The camera module includes a lens, a motor and a photosensitive component. Light passes through the lens to the photosensitive component and is received by the photosensitive chip of the photosensitive component. The motor is used to drive the lens to move and adjust the position of the lens.

[0004] In order to further improve the image quality and realize more imaging functions, the camera module usually has an auto focus function (Auto Focus, AF function) and an optical image stabilization (Optical Image Stabilization, OIS function). The AF function is usually achieved by a motor driving the lens to move linearly along the optical axis. The OIS function is achieved by compensating for the jitter displacement by a motor. The jitter of the camera module includes translation in the direction perpendicular to the optical axis (translation in the x-axis and y-axis directions) and rotation (referring to the rotation in the xoy plane, and the direction of the axis of rotation can be roughly the same as the optical axis), as well as tilt jitter (referring to the rotation around the x and y axes. In the field of camera modules, tilt jitter is also called tilt jitter). When the gyroscope (or other position sensing element) of the camera module detects jitter in a certain direction, it can issue a command to drive the motor to move a certain distance in the opposite direction to compensate for the jitter of the lens.

[0005] The motor usually has a base to support the focus carrier and the anti-shake carrier. The focus carrier supports the lens for focusing movement, and the anti-shake carrier supports the lens for shake compensation movement. The design and assembly of the base, focus carrier, and anti-shake carrier will affect the size of the motor, and thus affect the size of the camera module.

[0006] The current market needs camera modules with higher imaging quality, and the lens size is getting larger and larger, which requires the motor to have a higher driving force. However, the installation space of the camera module in the electronic device is very limited, and the increase in the motor volume is limited, making it impossible to effectively increase the driving force. For example, the thickness of mobile phones is strictly restricted, resulting in the height of the camera module being severely limited. Under the condition of limited height, how to design increasingly complex motors to meet the requirements of higher imaging quality and smaller size is a major problem for technical personnel in this field. Summary of the invention

[0007] One advantage of the present application is that it provides a camera module in which the molded base of the photosensitive component of the camera module integrates the function of the base of the motor of the camera module, which can reduce the size and height of the camera module.

[0008] One advantage of the present application is that it provides a camera module that uses a base formed by a molding process to replace an independent motor component, thereby reducing parts and components, saving assembly steps, improving consistency between components, reducing the difficulty of assembling the camera module, and improving assembly accuracy.

[0009] One advantage of the present application is that it provides a camera module that forms a base with a support arm and a guide portion through a molding process, eliminating the need to separately configure a support and guide structure, further reducing the height and saving assembly steps.

[0010] One advantage of the present application is that it provides a camera module in which the support arm and the guide part are formed by a molding process, with higher precision, smaller assembly tolerance, and more stable structure, which is conducive to improving the performance and precision of the camera module.

[0011] One advantage of the present application is that it provides a camera module, in which a guide component is accommodated between the guide part and the motor carrier of the camera module. The guide part is formed by a molding process, and the flatness and precision are improved, the movement resistance is smaller, the guiding movement is more precise and flexible, the accuracy of the guiding movement is improved, and the movement stroke is increased.

[0012] One advantage of the present application is that it provides a camera module in which a magnetic attraction element and a position sensing element are built into a base during molding, thereby saving assembly steps.

[0013] One advantage of the present application is that it provides a camera module, wherein the base is provided with a conductive structure to connect the circuit board of the motor and the photosensitive component so that the photosensitive component can supply power to the motor.

[0014] One advantage of the present application is that it provides a camera module, wherein the conductive structure includes a conductive component of a support arm built into a base, which is used to form a focus conduction circuit, and also includes a conductive component arranged on the base, which is used to conduct to form an anti-shake conduction circuit, thereby enabling the motor to be driven to perform focus adjustment movement and anti-shake compensation movement, and the conductive component is small in size and simple to assemble.

[0015] One advantage of the present application is that it provides a camera module, a position sensing element and an anti-shake conduction circuit with a common conductive structure, which simplifies the conductive design.

[0016] According to one aspect of the present application, the present application provides a camera module, including:

[0017] A photosensitive chip, a circuit board and an optical lens, wherein the photosensitive chip is mounted on the circuit board and is conductively connected to the circuit board, and the optical lens is arranged in the light sensing path of the photosensitive chip; and

[0018] A motor and a base, wherein the base is integrally formed on the circuit board and encapsulates at least a portion of the circuit board, the photosensitive chip is exposed through a window area defined by the base, and the motor is assembled on the base;

[0019] Among them, the base is provided with multiple anti-shake conductive grooves and multiple independent anti-shake conductive parts, and the multiple anti-shake conductive grooves are arranged on the same side of the base. The anti-shake conductive part is arranged in the anti-shake conductive groove, one end of which is connected to the circuit board, and the other end of which is connected to the motor.

[0020] According to an example of the present application, the motor includes a flexible circuit board, the base includes a base, the flexible circuit board is mounted on the upper surface of the base, and the other end of the anti-shake conductive member is connected to the flexible circuit board.

[0021] According to an example of the present application, an actuating component is also included, the actuating component includes an anti-shake coil, the anti-shake coil is integrated in the flexible circuit board, the flexible circuit board is provided with a via hole, the lead end of the anti-shake coil is led to the inner wall defining the via hole, the other end of the anti-shake conductive part and the inner wall defining the via hole are fixed and conductively connected, so that the circuit board and the anti-shake coil are conductively connected, wherein the via hole and the anti-shake coil are arranged in an avoidance manner.

[0022] According to an example of the present application, the anti-shake conductive groove is formed by extending downward from the upper surface of the base directly facing the conductive hole to the circuit board.

[0023] According to an example of the present application, an anti-shake conductive groove is formed on the outer surface of the base, and an upper surface of the base is provided with a receiving groove whose two ends are respectively connected to the anti-shake conductive groove and the conductive hole. The anti-shake conductive part is accommodated in the receiving groove, one end extends to the outer surface of the base, extends along the anti-shake conductive groove to the circuit board, and is conductive with the circuit board, and the other end is aligned with the conductive hole and is conductive with the flexible circuit board.

[0024] According to an example of the present application, the camera module includes a focusing conductive member, the base includes a plurality of support arms, at least one of the support arms is provided with a focusing conductive groove, and the focusing conductive groove is formed by extending downward from the top of at least one of the support arms to the circuit board, and the focusing conductive member is arranged in the focusing conductive groove, one end of which is conducted to the circuit board, and the other end is exposed from the top of the support arm.

[0025] According to an example of the present application, the motor includes a focus coil, a focus carrier and an upper spring sheet, the upper spring sheet is installed on the upper side of the focus carrier, and a corner thereof is installed on the top of the support arm to suspend the focus carrier, the focus coil is installed on the focus carrier and is conductively connected to the focus coil, wherein at least one of the corners of the upper spring sheet forms at least one conductive terminal, and the conductive terminal and the focus conductive member are conductively connected.

[0026] According to an example of the present application, the base is integrally formed to form a base, a plurality of support arms and a plurality of guide portions, each of the support arms protrudes and extends from a corner of the base in a direction parallel to the optical axis, each of the guide portions and each of the support arms are adjacently arranged, each of the guide portions is rotationally symmetrically arranged around the optical axis, and respectively defines at least one lower guide groove, wherein the extension directions of at least two of the lower guide grooves are orthogonal and perpendicular to the optical axis of the camera module.

[0027] According to an example of the present application, the motor also includes a guide member and an anti-shake carrier, the bottom of the anti-shake carrier is provided with a plurality of upper guide portions, each defining at least one upper guide groove, and the guide member is assembled between the upper guide groove and the lower guide groove to guide the relative movement of the anti-shake carrier and the base.

[0028] According to an example of the present application, the camera module also includes a bracket and a filter, the bracket is located in the window area defined by the base, and the filter is installed on the bracket, wherein the bracket has a bracket through hole, the photosensitive area of ​​the photosensitive chip is exposed through the window area and the bracket through hole, and the filter is maintained in the photosensitive path of the photosensitive chip.

[0029] According to an example of the present application, the bracket includes a step portion, a boss and a recessed portion, the filter is installed on the step portion, the boss is raised and extended from the step portion, surrounding the filter, and the recessed portion is recessed from the bottom of the bracket to the step portion, forming a certain gap between the filter and the photosensitive chip.

[0030] According to an example of the present application, a corner of the bracket is provided with an avoidance space, the boss is divided into a plurality of raised portions by the avoidance space, and the raised portion adjacent to the anti-shake conductive groove is smaller than the other raised portions.

[0031] According to an example of the present application, the camera module further includes a magnetic element, which is disposed on the circuit board and is built into the base after the base is integrally formed on the circuit board.

[0032] According to an example of the present application, the camera module also includes a position sensing element, which is arranged on the circuit board, conductively connected to the circuit board, and is built into the base after the circuit board is integrally formed with the base.

[0033] According to an example of the present application, the position sensing element is conductively connected to the anti-shake conductive member and conductively connected to the motor, wherein at least one position sensing element is located outside the anti-shake conductive groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a schematic diagram of an exploded view of a camera module according to some examples of the present application.

[0035] Figure 2 It is a cross-sectional schematic diagram of a camera module according to some examples of the present application.

[0036] Figure 3 It is a schematic diagram of the photosensitive component of the camera module according to some examples of the present application.

[0037] Figure 4 is an exploded schematic diagram of a photosensitive component according to some examples of the present application.

[0038] Figure 5A This is a schematic diagram of an implementation of the conductive structure of a motor of a camera module according to some examples of the present application.

[0039] Figure 5B It is a schematic diagram of another embodiment of the conductive structure of the motor of the camera module according to some examples of the present application.

[0040] Fig. 6A This is a schematic cross-sectional view at one angle of the motor and photosensitive components of the camera module according to some examples of the present application.

[0041] Figure 6B This is a cross-sectional schematic diagram of the motor and photosensitive components of the camera module according to some examples of the present application from another angle.

[0042] Figure 6C This is a schematic diagram of an angle of the motor and photosensitive components of a camera module according to some examples of the present application.

[0043] Fig.6D This is a schematic diagram from another angle of the motor and photosensitive components of the camera module according to some examples of the present application.

[0044] Figure 7 The present invention is a schematic diagram of a photosensitive component being provided with a conductive structure according to some examples of the present application.

[0045] Figure 8Schematic diagram of the motor of the camera module according to some examples of the present application.

[0046] Fig. 9 Schematic diagram of an explosion of a motor of a camera module according to some examples of the present application.

[0047] Fig.10 is a schematic diagram of the molding manufacture of the base of the photosensitive component according to some examples of the present application. DETAILED DESCRIPTION

[0048] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

[0049] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0050] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0051] The present application provides a camera module suitable for being assembled in an electronic device for imaging. The motor base of the camera module is integrally formed with the photosensitive component to form a molded base of the photosensitive component, so that the motor base and the molded base of the photosensitive component are integrated, that is, the same structure, which reduces the height of the camera module and avoids the problem of the motor base being glued to the photosensitive component with glue, thereby reducing the difficulty of assembly. In addition, the base is integrally formed to form a support arm and a ball groove, further reducing the height of the camera module, reducing parts, and reducing the difficulty of assembly.

[0052] Reference Figure 1 As shown in FIG. 1 , the camera module includes a photosensitive component 10, a motor 20 and an optical lens 30 arranged along an optical axis. The optical lens 30 is held in the photosensitive path of the photosensitive component 10, and the motor 20 is configured to drive at least one of the optical lens 30 and the photosensitive component 10 to move.

[0053] Among them, according to actual needs, the motor 20 can be configured to drive the optical lens 30 to move along the optical axis to adjust the focus of the camera module to realize AF function (Auto Focus, AF function) or optical zoom, etc.; the motor can be configured to drive the optical lens 30 to translate, rotate, tilt and shake in a direction perpendicular to the optical axis to compensate for the shake and realize the OIS function (Optical Image Stabilization, optical image stabilization, OIS function); the motor can be configured to drive the photosensitive chip of the photosensitive component 10 to move in a direction perpendicular to the optical axis to compensate for the shake and realize the OIS function; the motor can also be configured to drive the photosensitive chip to move along the optical axis to realize focus adjustment.

[0054] The photosensitive component generally includes a base for supporting a motor and an optical lens. The motor also includes a base as a supporting structure for the main body of the motor. The base of the motor is usually assembled to the base of the photosensitive component, and the optical lens is assembled to the motor to form a camera module. Therefore, conventional camera modules usually have two base structures.

[0055] In order to reduce the height of the camera module while ensuring or improving the driving force of the motor, the present application designs the base of the camera module motor and the base of the photosensitive component to be the same structure, and uses a molding process to integrally mold the base into the photosensitive component, eliminating the need for an independent motor base structure, reducing parts, reducing height, and reducing assembly difficulty. Furthermore, the technical solution of the present application integrally molds the base and support guide structure of the motor into the base of the photosensitive component, which facilitates the assembly of the motor in the photosensitive component, while saving motor parts and reducing assembly tolerances.

[0056] Specifically, refer to Figure 2 and Figure 3 As shown in the figure, the photosensitive component 10 includes a circuit board 11, a photosensitive chip 12 and a base 13. The photosensitive chip 12 is mounted on the circuit board 11 and is conductively connected to the circuit board 11. The base 13 is integrally formed on the circuit board 11 and has a window area 130. The photosensitive chip 12 can be exposed through the window area 130. The photosensitive chip 12 has a photosensitive area 120 and a non-photosensitive area.

[0057] The base 13 includes a base 131, a support arm 132 and a guide portion 133, and the base 131, the support arm 132 and the guide portion 133 are integrally formed on the circuit board 11. The base 131 forms the base of the base 13, and is extended and formed on the circuit board 11 along the extension direction of the circuit board 11, has a certain thickness, and defines a window area 130 in the middle position of the base 131. The base 131 encapsulates the electronic components located on the circuit board 11, forms a molded base of the photosensitive component 10, protects the electronic components of the circuit board 11, and can support other components to form a supporting base for other parts. The motor 20 and the optical lens 30 of the camera module are installed on the photosensitive component 10 and supported by the base 131. The base 13 forms the base of the motor 20.

[0058] After the base 13 is formed by molding, the electronic components of the circuit board 11 are encapsulated inside the base 13, so that the top of the base 13 forms the top of the photosensitive component 10, thereby improving the flatness, precision and strength of the photosensitive component 10.

[0059] The periphery of the base 131 covers the periphery of the circuit board 11. The base 131 has an upper surface 1311, and the motor 20 has a bottom surface 201. The motor 20 is assembled to the photosensitive component 10, and the bottom surface 201 is abutted against the upper surface 1311. The upper surface 1311 of the base 131 has a high degree of flatness, which is convenient for assembly with the motor 20 and reduces assembly tolerance. The bottom surface 201 of the motor 20 and the circuit board 11 are opposite to each other with the base 131 spaced apart. The distance from the bottom surface 201 of the motor 20 to the circuit board 11 is mainly affected by the thickness of the base 131, so that the assembly height of the motor 20 in the photosensitive component 10 is greatly reduced, so as to reduce the height of the camera module.

[0060] The base 131 is molded in most areas of the circuit board 11, reducing the warping of the circuit board 11 and improving its flatness. In some embodiments, the base 131 extends and distributes on the circuit board 11, and a portion of the circuit board 11 is exposed at the window area 130, and there is a certain interval between the base 131 and the photosensitive chip 12 mounted on the circuit board 11, that is, the base 131 is integrally molded in most areas of the non-middle area of ​​the circuit board 11; in some other embodiments, the base 131 is distributed in the non-photosensitive areas of the circuit board 11 and the photosensitive chip 12, that is, the base 13 is molded in the non-photosensitive area of ​​the photosensitive chip 12 and the circuit board 11, and the photosensitive area 120 is exposed in the window area 130.

[0061] like Figure 3 In the example shown, the circuit board 11 includes an outer portion 111 and an inner portion 112 , the outer portion 111 surrounds the outer periphery of the inner portion 112 , the base 13 is molded on the outer portion 111 , and the inner portion 112 is exposed from the window area 130 .

[0062] Among them, the outline of the window area 130 is roughly square, which is compatible with the shape of the photosensitive chip 12, or the shape of the photosensitive chip 12 installed on the circuit board 11, and is convenient for the subsequent setting of the filter and the bracket; in other examples of the present application, the outline of the window area 130 is roughly circular, which is compatible with the outline shape of the motor 20 and / or the optical lens 30.

[0063] The base 131 has an outer surface 1312 and an inner surface 1313. The outer surface 1312 is formed on the outer periphery of the base 131, and the inner surface 1313 defines a window area 130. The inner surface 1313 extends upward and outward from the circuit board 11 at a certain angle, that is, there is a certain inclination angle between its extension direction and the optical axis, which is convenient for demolding after molding.

[0064] Furthermore, the circuit board 11 has a circuit board through hole 110, which is connected to the window area 130 and is fully exposed in the window area 130. The photosensitive chip 12 is installed in the circuit board through hole 110, thereby reducing the installation height of the photosensitive chip 12 on the circuit board 11 and saving space.

[0065] The support arm 132 and the guide portion 133 are formed to protrude from the base portion 131 along the optical axis direction. The support arm 132 and the guide portion 133 are disposed adjacent to each other and are formed at a corner of the base portion 131 .

[0066] The top end of the support arm 132 has a first top surface 1321, and the top end of the guide portion 133 has a second top surface 1331. The first top surface 1321 is higher than the second top surface 1331, and the second top surface 1331 is higher than the upper surface 1311 of the base 131, that is, the second top surface 1331 is higher than the bottom surface 201 of the motor 20 abutting against the upper surface 1311, thereby reducing the installation height of the motor 20 on the base 13.

[0067] The outer contour of the cross-section shape of the base 131 perpendicular to the optical axis direction is roughly square with four corners. The number of support arms 132 and guide portions 133 is four, and each support arm 132 and guide portion 133 is formed at the four corners of the base 131 respectively.

[0068] The support arm 132 is located at the corner of the base 131, and the guide portion 133 is located on the side of the support arm 132. Furthermore, the guide portion 133 is arranged rotationally symmetrically around the optical axis, so that a guide portion 133 is arranged on each side edge of the base 131 perpendicular to the optical axis to avoid occupying too much space on one side edge.

[0069] An assembly space is defined between the support arms 132 at the four corners, which is suitable for assembling the motor 20. The height of the support arm 132 is higher than the height of the base 131, and is adapted to the height of the motor 20. The bottom of the motor 20 is provided with a lower guide portion, which cooperates with the guide portion of the base 13 to accommodate the guide member. The bottom surface 201 of the motor 20 is abutted against the upper surface 1311 of the base 131, and the top corner of the motor 20 is positioned and installed on the top of the support arm 132. The lower guide portion of the motor 20 corresponds to the guide portion 133 of the base 13, so that the motor 20 is quickly positioned and installed on the base 13, thereby improving the assembly speed between the motor 20 and the photosensitive component 10, and the photosensitive chip 12 is positioned and installed on the circuit board 11, and the relative position in the window area 130 is fixed, and the warping degree of the circuit board 11 is low, which reduces the alignment steps or alignment time during assembly and improves assembly efficiency.

[0070] Reference Figure 1 As shown in FIG. 1 , the camera module further includes a housing 40, which is assembled to the photosensitive component 10 and the motor 20 to cover the photosensitive component 10 and the motor 20. The top of the support arm 132 is close to or abuts against the housing 40.

[0071] Reference Figure 4 and Figure 5A As shown in FIG. 1 , the base 13 is provided with a magnetic element 134, and the magnetic element 134 is built into the base 13. In one embodiment, the magnetic element 134 is attached to the circuit board 11, and then the base 13 is molded on the circuit board 11, so that the magnetic element 134 is built into the base 13.

[0072] The base 13 is provided with a position sensing element 135, and the position sensing element 135 is built into the base 13. In one embodiment, the position sensing element 135 is attached to the circuit board 11, and is conductively connected to the circuit board 11, and then the base 13 is molded on the circuit board 11, so that the position sensing element 135 is built into the base 13.

[0073] like Figure 5A As shown, the magnetic element 134 and the position sensing element 135 are arranged on the circuit board 11, and the base 13 is molded on the circuit board 11, so that the magnetic element 134 and the position sensing element 135 are built into the base 13, eliminating the subsequent assembly steps, avoiding occupying additional space, and the position setting is more precise.

[0074] When molding the base 13, the electronic components on the circuit board 11 and components such as the magnetic attraction element 134 and the position sensing element 135 arranged on the circuit board 11 can be packaged together so as to be built into the base 13 to avoid being exposed on the base 13, thereby improving the flatness of the base 13, improving the installation accuracy of the aforementioned components, and reducing assembly tolerances.

[0075] Reference Figure 2 and Figure 4 In the example shown, the photosensitive assembly 10 further includes a bracket 14 and a filter 15. The bracket 14 is disposed in the area of ​​the circuit board 11 exposed at the window area 130 of the base 13, that is, the inner side 112. The base 131 of the base 13 surrounds the bracket 14, and the bracket 14 surrounds the photosensitive chip 12. In other examples, the bracket 14 is disposed around the area of ​​the circuit board 11 where the photosensitive chip 12 is mounted. In other examples, the bracket 14 is disposed around the photosensitive area 120 of the photosensitive chip 12. The filter 15 is mounted on the bracket 14, and the bracket 14 supports the filter 15 so that the filter 15 is maintained in the photosensitive path of the photosensitive chip 12.

[0076] The window area 130 forms a recessed installation space from the top of the base 131 to reduce the installation height of the bracket 14 and the filter 15. The circuit board through hole 110 is formed in the inner portion 112 to reduce the installation height of the photosensitive chip 12, so that the height of the bracket 14 can be further reduced, and a certain distance can be ensured between the filter 15 and the photosensitive chip 12.

[0077] The bracket 14 has a bracket through hole 140, through which the photosensitive area 120 of the photosensitive chip 12 can be exposed. The bracket 14 includes a step portion 141, a boss 142 and a recessed portion 143. The step portion 141 forms a structure for supporting the optical filter 15 and defines the bracket through hole 140 around the optical axis. The boss 141 is formed by protruding from the step portion 141, and its height is higher than the step portion 141 and close to the height of the top of the optical filter 15 placed on the step portion 141, so as to surround the optical filter 15 and form a protective structure for the optical filter 15. The recessed portion 143 is formed on the other side relative to the boss 142, and is located between the step portion 141 and the photosensitive chip 12. It is recessed from the bottom of the bracket 14 to the step portion 141, so that the bottom of the step portion 141 has a certain height, and the position of the step portion 141 is raised to form a gap on the side of the photosensitive chip 12 where light is incident.

[0078] The connecting components (such as gold wires, pads, etc.) between the photosensitive chip 12 and the circuit board 11 can be accommodated in the aforementioned gap, so that the electronic components disposed on the inner side 112 exposed through the window area 130 on the circuit board 11 are shielded by the bracket 14 and the filter 15, forming a protective structure to avoid exposure. The electronic components on the outer side 111 of the circuit board 11 are built into the base 13, so that the photosensitive component 13 provides a flat mounting surface for assembling the motor 20, thereby improving assembly accuracy and assembly efficiency.

[0079] In addition, the height of the top of the boss 142 matches the height of the upper surface 1311 of the base 131 , or is higher than the upper surface 1311 of the base 131 .

[0080] Furthermore, the bosses 142 are formed around the filter 15 to form avoidance spaces 1420 at the corners.

[0081] Preferably, the bracket 14 is integrally formed by a molding process, and then the bracket 14 is attached to the circuit board 11 and the filter is installed on the bracket 14 .

[0082] There are many embodiments for setting the bracket 14 on the photosensitive component 10. In the aforementioned embodiment, the bracket 14 is mounted on the window area 130 of the base 13. In one embodiment, the bracket 14 is directly set on the base 13, optionally secondary molded on the base 13 through a molding process, and optionally, the base 13 and the bracket 14 are directly formed through a single molding process.

[0083] In other examples of the present application, the filter 15 is implemented to be directly mounted on the base 13. The base 131 is provided with a mounting portion formed at least around the photosensitive area 120 of the photosensitive chip 12, which is suitable for mounting the filter 15 so that the filter 15 is maintained in the photosensitive path of the photosensitive chip 120.

[0084] That is to say, the filter 15 can be indirectly installed on the photosensitive path of the photosensitive chip 12 through the bracket 14, or can be directly installed on the base 13 and held in the photosensitive path of the photosensitive chip 12.

[0085] In addition, optionally, the photosensitive component 10 further includes a reinforcing plate 16, which is disposed at the bottom of the circuit board 11 to strengthen the structure of the circuit board 11. Figure 4 As shown in FIG. 1 , the reinforcing plate 16 is disposed on the bottom surface of the circuit board 11 opposite to the base 13. The reinforcing plate 16 is mounted on the bottom of the circuit board 11, and the photosensitive chip 12 is mounted at the through hole 110 of the circuit board and supported and held at the through hole 110 of the circuit board by the reinforcing plate 16.

[0086] Next, an implementation of the assembly formed by the photosensitive component 10 and the motor 20 provided in the present application is described to further illustrate the advantage of the photosensitive component 10 provided in the present application using a molded base instead of a motor base.

[0087] The motor 20 needs to be connected to the photosensitive component 10 to obtain electrical energy from the photosensitive component 10 to convert it into kinetic energy. The circuit board 11 of the photosensitive component 10 and the motor 20 are connected through the conductive member 17. Preferably, the conductive member 17 is arranged on the base 13, at least one end of the conductive member 17 is connected to the circuit board 11, and at least one end is connected to the motor 20. At least one conductive portion is drawn out from the motor 20 and is connected to the conductive member 17.

[0088] Preferably, the conductive component 17 is integrally built into the base 13, the conductive component 17 and the circuit board 11 are fixed to form a conductive connection, and the base 13 is molded on the circuit board 11 so that the conductive component 17 is built into the base 13; in one embodiment, after the base 13 is formed by molding, the conductive component 17 is installed on the base 13, a portion of the circuit board 11 is exposed at the base 13, and is conductively connected to at least one end of the conductive component 17; in one embodiment, the conductive structure can be designed in combination with the above-mentioned two embodiments.

[0089] Next, an embodiment in which a part of the circuit board 11 is exposed on the base 13 is described. The base 13 is provided with a conducting groove, and the circuit board 11 has a contact 113 . The contact 113 is exposed through the conducting groove and is suitable for conducting with the conductive member 17 .

[0090] In some examples of the present application, the upper surface 1311 at the outer edge of the base 131 extends downward along the edge of the base 131 to the circuit board 11 to form a conductive groove. In some examples of the present application, the upper surface 1311 of the base 131 extends downward from the window area 130 near the inner side to the circuit board 11 to form a conductive groove. In some examples of the present application, the first top surface 1321 of the self-supporting arm 132 extends downward to the circuit board 11 to form a conductive groove.

[0091] The actuating assembly 21 leads out the conducting portion, which is aligned with the conducting groove, and connects the conducting portion and the circuit board 11 through the conductive member 17 to form a conducting connection between the motor 20 and the circuit board 11 .

[0092] Next, combine FIG. 5A to FIG. 9 The schematic diagram of the camera module using the photosensitive component 10 provided by the present application is described. The motor 20 is installed on the photosensitive component 10, and the base 13 supports the motor 20, replacing the independent motor base component, reducing the number of parts, and lowering the height of the motor 20. The bottom surface 201 of the motor 20 is in contact with the upper surface 1311 of the base 131, and the motor 20 is assembled in the assembly space defined between the support arms 132 at the four corners.

[0093] refer to Figure 6C As shown in FIG. 1 , the four corners of the motor 20 form an escape space 200 to escape the support arm 132 and the guide portion 133. The escape space 200 is defined to include a first escape space 2001 to escape the support arm 132 and a second escape space to escape the guide portion 133. After the motor 20 is mounted to the base 13, the support arm 132 is located in the first escape space 2001 and the guide portion 133 is located in the second escape space to avoid structural interference, reduce the installation height, and facilitate positioning and installation.

[0094] The motor 20 includes an actuating assembly 21, a bearing mechanism and a suspension member. The bearing mechanism is mounted on the base 13 and is suitable for bearing the optical lens 30. The suspension member suspends the bearing mechanism on the base 13. The actuating assembly 21 drives the bearing mechanism so that the bearing mechanism moves relative to the base 13.

[0095] Schematically, the motor 20 includes a flexible circuit board 211, an anti-shake carrier 22, a focus carrier 23, an upper spring sheet 24 and a lower spring sheet 25. The flexible circuit board 211 is suitable for being conductively connected with the circuit board 11. The anti-shake carrier 22 and the focus carrier 23 form a bearing mechanism for the optical lens 30. The bearing mechanism and the base 13 move relative to each other, so that the optical lens 30 and the photosensitive chip 12 move relative to each other. Among them, the anti-shake carrier 22 and the base 13 move relative to each other so that the camera module performs a shake compensation movement; the focus carrier 23 and the base 13 move relative to each other so that the camera module performs a focusing movement.

[0096] The flexible circuit board 211 is mounted on the upper surface of the base 13, and further, is disposed on the upper surface 1311 of the base 131. The corners of the flexible circuit board 211 avoid the support arm 132 and the guide portion 133. In this embodiment, the bottom of the flexible circuit board 211 forms the bottom surface 201 of the motor 20, and contacts the upper surface 1311 of the base 131. In other embodiments, the bottom of the supporting mechanism of the motor 20 forms the bottom surface 201 of the motor, and contacts the upper surface 1311 of the base 131.

[0097] The anti-shake carrier 22 is disposed on a side of the flexible circuit board 211 opposite to the base 13 along the optical axis. A first avoidance space 2001 for avoiding the support arm 132 and a second avoidance space 2002 for avoiding the guide portion 133 are disposed at a corner of the anti-shake carrier 22 .

[0098] The motor 20 further includes a guide member 26, which is mounted between the anti-shake carrier 22 and the base 13 to guide the relative movement between the anti-shake carrier 22 and the base 13. The bottom of the anti-shake carrier 22 forms an upper guide portion 221 on the surface facing the second avoidance space 220. The upper guide portion 221 and the guide portion 133 are located opposite to each other, defining a space for accommodating the guide member 26. The guide member 26 is mounted on the guide portion 133, and the anti-shake carrier 22 is mounted on the base 13 and supported on the base 13 by the guide member 26.

[0099] The actuating assembly 21 drives the anti-shake carrier 22 and the focus carrier 23 to move to realize the shake compensation function and the focus adjustment function. The actuating assembly 21 is connected to the photosensitive assembly 10 to obtain electrical energy from the photosensitive assembly 10 and convert it into kinetic energy. In one embodiment of the actuation of the present application, the actuating assembly 21 adopts an electromagnetic actuation form, including an anti-shake coil 212 and a magnet 213. The anti-shake coil 212 and the magnet 213 interact with each other, causing one of them to move relative to the other. One of the anti-shake coil 212 and the magnet 213 is installed on the base 13, and the other is installed on the anti-shake carrier. Under the interaction between the anti-shake coil 212 and the magnet 213, one of the base 13 and the anti-shake carrier moves relative to the other. The guiding member 26 is located between the anti-shake carrier 22 and the base 13, and guides one of the base 13 and the anti-shake carrier 22 to move relative to the other.

[0100] The upper spring piece 24 and the lower spring piece 25 form the suspension member of the motor, and are respectively mounted on the upper side (the side opposite to the photosensitive component 10 along the optical axis) and the lower side (the side facing the photosensitive component 10 along the optical axis) of the anti-shake carrier 22 and the focus carrier 23. The anti-shake carrier 22 and the focus carrier 23 are suspended relative to the base 13 by the upper spring piece 24 and the lower spring piece 25, so that the anti-shake carrier 22 and the focus carrier 23 can move relative to the base 13. The optical lens 30 is installed on the bearing mechanism and supported by the anti-shake carrier 22 and the focus carrier 23.

[0101] Taking the movement of the lens for shake compensation as an example, the actuator assembly 21 drives the anti-shake carrier 22 to move relative to the base 13 to realize the OIS function. The anti-shake coil 212 is integrated into the flexible circuit board 211 and arranged along the XY plane, and the magnet 213 is arranged on one side of the anti-shake coil along the Z axis.

[0102] That is, the anti-shake coil 212 is disposed on the base 13 along the Z axis, and the magnet 213 is opposite to the base 13 along the Z axis. Figure 7 The anti-shake coil 212 is directly formed on the flexible circuit board 211 to reduce the height; the magnet 213 is arranged inside the anti-shake carrier 22 or in the installation space formed by avoiding it, and interacts with the anti-shake coil 212 to cause the anti-shake carrier 22 to move.

[0103] The guiding part 133 defines a lower guiding groove 1330, and the guiding member 26 moves in the lower guiding groove 1330. The upper guiding part 221 defines an upper guiding groove 2210, and at least a part of the guiding member 26 is received in the upper guiding groove 2210, and the position is adapted to that of the lower guiding groove 1330. The guiding member 26 moves in the space defined by the upper guiding groove 2210 and the lower guiding groove 1330. When the anti-shake carrier 22 is driven by the actuating assembly 21 to perform shake compensation movement, the guiding member 26 guides the movement of the anti-shake carrier 22, reduces the movement friction between the anti-shake carrier 22 and the base 13, reduces the movement resistance of the anti-shake carrier 22, improves the movement parallelism, and increases the shake compensation movement stroke.

[0104] The guiding member 26 is implemented as a spherical object, such as a ball, or is implemented as a cylindrical object, a conical object, etc.

[0105] Optionally, at least one lower guiding groove 1330 has a length in the X-axis direction for the guiding member 26 to move in the X-axis direction to guide the relative movement between the anti-shake carrier 22 and the base 13 in the X-axis direction. At least one lower guiding groove 1330 has a length in the Y-axis direction for the guiding member 26 to move in the Y-axis direction to guide the relative movement between the anti-shake carrier 22 and the base 13 in the Y-axis direction.

[0106] As Figure 6C shown in the schematic diagram, the guiding part 133 is arranged symmetrically about the optical axis in a rotational manner, and a set of diagonal guiding grooves 1330 has a length in the X-axis direction, and another set of diagonal guiding grooves 1330 has a length in the Y-axis direction.

[0107] Optionally, correspondingly, the upper guiding part 2221 is arranged symmetrically about the optical axis at the bottom of the anti-shake carrier 22 in a rotational manner, and a set of diagonal upper guiding grooves 2210 has a length in the X-axis direction, and another set of diagonal upper guiding grooves 2210 has a length in the Y-axis direction.

[0108] Referring to Figure 6B shown in the schematic diagram, the magnetic attraction element 134 is arranged on the base 13, and at least a part of the magnetic attraction element 134 and at least a part of the magnet 213 are opposite to each other in the optical axis direction to generate magnetic attraction force to hold the motor 20 on the base 13 and prevent the guiding member 26 from falling off. In some examples, after relative displacement occurs between the anti-shake carrier 22 and the base 13, under the action of the magnetic attraction force between the magnetic attraction element 134 and the magnet 213, the relative position between the anti-shake carrier 22 and the base 13 can be restored to the initial state.

[0109] In one implementation manner of the magnetic attraction element 134, referring to Figure 5A, which includes a first portion 1341, a second portion 1342 and a third portion 1343. The first portion 1341 and the third portion 1342 extend in directions orthogonal to each other, and the second portion 1342 is bent to connect the first portion 1341 and the third portion 1343. The first portion 1341 and the third portion 1342 are at least partially adjacent to the magnet 213 along the optical axis to generate magnetic attraction.

[0110] In one embodiment, the magnetic element 134 is disposed at a position adjacent to a corner of the base 131. Optionally, the magnetic element 134 is disposed at positions adjacent to four corners of the base 131. Further, the two ends of the magnet 213 interact with at least a portion of the two magnetic elements 134 to generate two opposite magnetic forces, and move or reset in two opposite directions.

[0111] The actuator assembly 21 also includes a focus coil 214, referring to Fig. 9 , the focus coil 214 is arranged on the focus carrier 23, and the magnet 213 and the focus coil 214 interact with each other to drive the focus carrier 23 to move. The shake compensation movement and the focus adjustment movement share the magnet to save space and reduce the size. Further, the focus coil 214 is arranged around the focus carrier 23. The focus carrier 23 is arranged on the inner side of the anti-shake carrier 22 perpendicular to the optical axis direction. A part of the upper spring piece 24 is assembled on the anti-shake carrier 22, and a part is assembled on the focus carrier 23. A part of the lower spring piece 25 is assembled on the anti-shake carrier 22, and a part is assembled on the focus carrier 23. Through elastic deformation, the anti-shake carrier 22 and the focus carrier 23 are guided to move and / or reset.

[0112] Combination FIG. 5A to FIG. 9 As shown in the figure, a positioning column 1322 is provided on the top of the support arm 132, and a positioning hole 240 is provided on the corner of the upper spring piece 24. The positioning hole 240 and the positioning column 1322 cooperate with each other, so that the upper spring piece 24 is installed on the support arm 132, and then the anti-shake carrier 22 and the focus carrier 23 can be suspended on the base 13, located between the support arms 132 at the corners.

[0113] In addition, the position sensing element 135 is built into the base 13 to detect the relative position change between the supporting mechanism and the base 13 to control the motor 20 to drive the supporting mechanism and the base 13 to move relative to each other to adjust the focus and / or compensate for jitter.

[0114] Furthermore, the position sensing element 135 includes a first position sensing element 1351 and a second position sensing element 1352. The first position sensing element 1351 and the second position sensing element 1352 are configured in different directions and are respectively positioned relative to the magnets 213 in different directions to detect displacements in different directions, such as displacements in the X direction and the Y direction. The position sensing element 135 is connected to the actuator assembly 21 in communication to control the actuation of the actuator assembly 21 according to the detection result, thereby improving the flexibility and accuracy of the shake compensation movement. Figure 5A An example is shown in which the first position sensing element 1351 detects the displacement amount in the X-axis direction, and the second position sensing element 1352 detects the displacement amount in the Y-axis direction.

[0115] Figure 5A The conductive structure of the motor 20 and the photosensitive component 10 of the camera module of the present application is shown. Specifically, the camera module includes a conductive component 17, and the conductive component 17 conducts the photosensitive component 10 and the motor 20, specifically, the circuit board 11 and the actuator component 21.

[0116] The conductive member 17 conducts electricity between the circuit board 11 and the actuating assembly 21 to form a focus conducting loop and an anti-shake conducting loop, so that the motor 20 can drive the bearing mechanism and the base 13 to move relative to each other, thereby realizing the AF function and the OIS function.

[0117] In some examples, the conductive member 17 is built into the base 13. When the base 13 is formed by molding, the conductive member 17 is built into the base 13 and is conductively connected to the circuit board 11. At least a portion of the conductive member 17 is exposed on the base 13 and is conductively connected to the motor 20, so that the motor 20 and the photosensitive component 10 are conductively connected. In some embodiments, at least a portion of the conductive member 17 is exposed at the top of the support arm 132, and is conductively connected to the upper spring sheet 24, and then conductively connected to the focus coil 214 through the upper spring sheet 24, forming a focus conductive loop; at least a portion of the conductive member 17 is conductively connected to the flexible circuit board 211 at the base 131, and then conductively connected to the anti-shake coil 212, forming an anti-shake conductive loop.

[0118] In some embodiments, the flexible circuit board 211 extends a conductive portion outward from the base 131 and is directly conductively connected to the circuit board 11 to form an anti-shake conductive loop.

[0119] In some examples, reference Figure 5A and Figure 6CAs shown in the figure, the conductive component 17 includes a focusing conductive member 171 and an anti-shake conductive member 172. The focusing conductive member 171 is built into the support arm 132, extends from the circuit board 11 along the focusing conductive groove 1320 of the support arm 132 and is exposed at the top of the support arm 132, adjacent to the positioning column 1322. The corner of the upper spring sheet 24 forms a conductive terminal 241, and the conductive terminal 241 is adjacent to the positioning hole 240. The positioning hole 240 and the positioning column 1322 cooperate with each other to install the upper spring sheet 24 to the support arm 132, and the conductive terminal 241 serves as a conductive portion, and contacts the focusing conductive member 171, so that the upper spring sheet 24 and the circuit board 11 are conductive.

[0120] In other words, the support arm 132 is provided with a focus conductive groove 1320 for the built-in focus conductive member 171. The conductive terminal 241 of the upper spring sheet 24 forms the conductive part of the actuator assembly 21 and is aligned with the focus conductive groove 1320. The focus conductive member 171 conducts the circuit board 11 and the conductive terminal 241 to form a conductive loop.

[0121] A focusing conductive member 171 is disposed in at least one of the support arms 132. Figure 6C In one example shown, focus conductive members 171 are disposed in two diagonal support arms 132 .

[0122] The focusing conductive member 171 is a metal component. In one embodiment, the focusing conductive member 171 is first fixedly mounted to the circuit board 11, such as by welding to the circuit board 11, and then molded on the circuit board 11 to form the base 13, so that the focusing conductive member 171 is built into the base 13. One end of the focusing conductive member 171 is fixed to the circuit board 11 and is in conduction with the circuit board 11, and the other end is exposed at the top of the support arm 132 and is in contact with the conduction terminal 241 of the upper spring 24.

[0123] A portion of the upper spring piece 24 is mounted on the focus carrier 23, and the focus coil 214 is mounted on the focus carrier 224, and the upper spring piece 24 and the focus coil 214 are conductively connected. Therefore, the circuit board 11, the focus conductive member 171, the upper spring piece 24 and the focus coil 214 are conductively connected to form a focus conductive loop.

[0124] The anti-shake conductive member 172 is mounted to the base 131 to conduct the flexible circuit board 211 and the circuit board 11. The flexible circuit board 211 and the circuit board 11 are located on opposite sides of the base 131 along a direction parallel to the optical axis, and the thickness of the base 131 is small to shorten the conduction distance between the flexible circuit board 211 and the circuit board 11.

[0125] Specifically, in Figure 5AIn the example shown, a groove 1310 is formed on the upper surface 1311 of the base 131. The anti-shake conductive member 172 is installed in the groove 1310. The groove 1310 extends along the upper surface 1311 of the base 131 to the outer edge of the base 131, then bends and extends downward, and extends along the outer surface 1312 of the base 131 until it extends to the circuit board 11. The portion of the groove 1310 located on the upper surface 1311 forms a receiving groove 13101, and the portion located on the outer surface 1312 forms an anti-shake conductive groove 13102.

[0126] The anti-shake conductive member 172 includes a main body 1721, a first end 1722, and a second end 1723. The first end 1722 is suitable for conducting with the flexible circuit board 211, and the second end 1723 is suitable for conducting with the circuit board 11. The main body 1721 connects the first end 1722 and the second end 1723. The first end 1722 and the main body 1721 extend and are distributed in the receiving groove 13101, and the second end 1723 extends and is distributed in the anti-shake conducting groove 13102, and is conductively connected with the circuit board 11.

[0127] At least a portion of the circuit board 11 is exposed through the anti-shake conductive groove 13102 to be conductively connected to the contact of the conductive member 17. The second end 1723 of the anti-shake conductive member 172 extends from the anti-shake conductive groove 13102 to the exposed portion of the circuit board 11, and is conductively connected to the circuit board 11, so that the flexible circuit board 211 is conductively connected to the circuit board 11. In other words, the circuit board 11 has a contact 113, which is exposed through the anti-shake conductive groove 13102 and is suitable for being conductively connected to the second end 1723.

[0128] The anti-shake coil 212 is integrated into the flexible circuit board 211 , and is connected to the circuit board 11 via the flexible circuit board 211 and the anti-shake conductive member 172 , forming an anti-shake conductive loop.

[0129] Since the anti-shake conductive component 172 has a certain thickness, a groove 1310 is set on the base 131 to accommodate the anti-shake conductive component 172, so that the anti-shake conductive component 172 can be kept flat with the base 131, and the flexible circuit board 211 is laid on the base 131, and the flexible circuit board 211 can be kept flat.

[0130] Furthermore, an anti-shake conductive component 172 is provided on the edge of the same side of the base 131 to conduct the flexible circuit board 211 and the circuit board 11. The anti-shake conductive component 172 has a smaller volume and is accommodated in the groove 1310 in an evasive manner, and does not occupy other space, which is conducive to reducing the volume and saving space.

[0131] refer to Figure 5AThe flexible circuit board 211 is provided with a conducting hole 2110, which penetrates the flexible circuit board 211 in a direction parallel to the optical axis and serves as a conducting portion for leading out the motor 20. The conducting hole 2110 and the anti-shake coil 212 are arranged to avoid each other and do not overlap in space.

[0132] The position of the through hole 2110 matches the position of the first end 1722 of the anti-shake conductive member 172 on the base 111. After the flexible circuit board 211 is assembled to the base 131, the first end 1722 is exposed in the through hole 211, and the first end 1722 is welded to the peripheral wall defining the through hole 211, so that the first end 1722 and the flexible circuit board 211 can be conductively connected. The second end 1723 of the anti-shake conductive member 172 is conductively connected to the circuit board 11, so that the actuating component 21 and the photosensitive component 10 are conductively connected.

[0133] The peripheral wall of the through hole 2110 is plated with a conductive metal layer, such as a copper layer, and the lead of the anti-shake coil 212 is led to the peripheral wall defining the through hole 2110. Furthermore, the number of the through holes 2110 is four, the number of the anti-shake conductive members 172 is also four, the four anti-shake conductive members 172 are independent of each other, the through holes 2110 and the anti-shake conductive members 172 are connected one by one, and the anti-shake coil 212 includes two first anti-shake coils 2121 extending and distributed along the X-axis direction, and two second anti-shake coils 2122 extending and distributed along the Y-axis direction. After the two first anti-shake coils 2121 are connected in series, a positive terminal and a negative terminal are led out to one through hole 2110 respectively, and after the two second anti-shake coils 2122 are connected in series, a positive terminal and a negative terminal are led out to one through hole 2110 respectively.

[0134] The base 131 includes two first parts 1314 and two second parts 1315 that are oppositely distributed along the X-axis direction. The anti-shake conductive member 172 is centrally arranged in one of the first parts 1314 or one of the second parts 1315. Correspondingly, the four through holes 2110 are arranged on the same side of the flexible circuit board 211 to centrally conduct the conductive structure and reduce the occupied space. That is, the anti-shake conductive member 172 is arranged on the same side of the base 13 and the same side of the base 131.

[0135] Furthermore, four vias 2110 are arranged in groups of two on the flexible circuit board 211. Each group includes two adjacent vias 2110, with a certain interval between the two groups of vias 2110, which are close to two adjacent corners of the flexible circuit board 211.

[0136] In another embodiment of the present application, reference Figure 5B, extending downward from the upper surface 1311 of the base 131 to the circuit board 11 to form an anti-shake conductive groove 13102A, and the anti-shake conductive groove 13102A can be implemented to be located at a non-edge position of the base 111. Furthermore, multiple anti-shake conductive grooves 13102A are centrally arranged in one of the first parts 1314 or one of the second parts 1315. The position of the conductive hole 2110 of the flexible circuit board 211 matches the position of the anti-shake conductive groove 13102A. After the flexible circuit board 211 is assembled on the base 131, the conductive hole 2110 and the anti-shake conductive groove 13102A are aligned. The anti-shake conductive member 172A is implemented as a columnar shape, suitable for being embedded in the anti-shake conductive groove 13102A. The upper end of the anti-shake conductive member 172A is fixed to the peripheral wall defining the conductive hole 2110 and is conductively connected to the flexible circuit board 211 , and the lower end of the anti-shake conductive member 172A is conductively connected to the circuit board 11 .

[0137] In one embodiment of the anti-shake conductive member 172A, the anti-shake conductive member 172A is first welded and fixed to the circuit board 11, and then the base 13 is molded on the circuit board 11, so that at least a portion of the anti-shake conductive member 172A is built into the base 13; in another embodiment, the base 13 with the anti-shake conductive groove 13102A is molded on the circuit board 11, the contact of the circuit board 11 is exposed to the anti-shake conductive groove 13102A, and the anti-shake conductive member 172A is embedded in the anti-shake conductive groove 13102A. The end of the upper side of the anti-shake conductive member 172A is exposed to the anti-shake conductive groove 13102A of the base 13, and its cross section can be exposed from the upper surface 1311, or its end can be exposed from the upper surface 1311, so as to be conductively connected with the flexible circuit board 211.

[0138] The conductive hole 2110 of the flexible circuit board 211 is arranged at a position avoiding the anti-shake coil 212. Figure 5A , two first anti-shake coils 2121 are arranged in the first part 1314 extending along the X-axis of the base 131, and two second anti-shake coils 2122 are arranged in the second part 1315 extending along the Y-axis of the base 131. Taking the anti-shake conductive member 172 being arranged in one of the second parts 1315 as an example, the shapes of the remaining first part 1314 and the other second part 1315 are adapted to the shapes of the first anti-shake coil 2121 and the second anti-shake coil 2122. The second part 1315 where the anti-shake conductive member 172 is arranged extends a certain space toward the window area 130 relative to the remaining parts, so as to be distributed below the conductive hole 2110 of the flexible circuit board 211.

[0139] refer to Figure 7 The corner of the bracket 14 is provided with an escape space 1420 to escape the flexible circuit board 211 and avoid structural interference.

[0140] refer to Figure 5B and Figure 6C , the boss 142 is divided into a plurality of protrusions 1421 by the avoidance space 1420, and each protrusion 1421 is adjacent to the two first parts 1314 and the two second parts 1315 of the base 131 respectively. One of the protrusions 1421 is adjacent to the anti-shake conductive groove 13102. The anti-shake conductive groove 13102 avoids the anti-shake coil 212 and is arranged on the inner side of the anti-shake coil 212, which is closer to the window area 130 of the base 131, so that the corresponding second part 1315 provided with the anti-shake conductive groove 13102 is larger than the other second part 1315 and the first part 1314, and the protrusion 1421 adjacent to the anti-shake conductive groove 13102 is larger than the other protrusions 1421.

[0141] In addition, reference Figure 5A , the position sensing element 135 is built into the base 131 and is located below the anti-shake coil 212. One of the position sensing elements 135 is close to the anti-shake conductive groove 13102 and is adjacent to the anti-shake conductive part 172. Further, one of the position sensing elements 135 is located on the outside of the anti-shake conductive groove 13102, and accordingly, one of the position sensing elements 135 is located between the anti-shake conductive parts 172; or, one of the position sensing elements 135 is located on the outside of the anti-shake conductive part 172. The first position sensing element 1351 and the second position sensing element 1352 are arranged along the X-axis direction and the Y-axis direction, and are located in one of the first parts 1314 and one of the second parts 1315. Taking the second position sensing element 1352 close to the anti-shake conductive groove 13102 as an example, the second position sensing element 1352 is adjacent to the anti-shake conductive groove 13102 and the anti-shake conductive part 172. Figure 5A In the example shown, the second position sensing element 1352 is located between the anti-shake conductive members 172. Figure 5B In the example shown, the second position sensing element 1352 is located outside the anti-shake conductive member 172 .

[0142] The position sensing element 135 is disposed on the circuit board 11 and is conductively connected to the circuit board 11. The anti-shake conductive element 172 is conductively connected to the circuit board 11, and the position sensing element 135 is conductively connected to the anti-shake conductive element 172 to be conductively connected to the flexible circuit board 211. In one embodiment, a wire is provided between the circuit board 11 and the position sensing element 135, wherein the first position sensing element 1351 and the second position sensing element 1352 lead out positive and negative electrodes respectively, and the two positive electrodes and the two negative electrodes are conductively connected to the four anti-shake conductive elements 172 respectively, and the anti-shake conductive element 172 is fixed to the inner wall defining the conductive hole 2110, and is conductively connected to the flexible circuit board 211.

[0143] The position sensing element 135 and the anti-shake conductive loop share a conductive member, which simplifies the design of the conductive structure and reduces the lead wires. In addition, the base 13 replaces the motor base, shortening the distance between the position sensing element 135 and the motor 20, making it easier to design the conductive structure.

[0144] The base 13 of the present application is formed on the circuit board 11 in one step by a molding process. Fig.10 As shown in FIG. 1 , a flow channel 501 is provided on the side of the circuit board of the photosensitive component assembly, and a molding material is injected into a molding space 502 formed by the upper mold and the lower mold through the flow channel to form a base 13. It can be understood that the installation of the photosensitive chip 12 can be completed before the molding process, or the installation of the photosensitive chip 12 can be performed after the molding process.

[0145] Reference Figure 4 As shown in the figure, the circuit board 11 is provided with a circuit board through hole 110, and the photosensitive chip 12 can be exposed through the circuit board through hole 110. The reinforcing plate 16 covers the circuit board 11 and the photosensitive chip 12 to strengthen the support. The reinforcing plate 16 can be implemented to include a reinforcing element covering the circuit board 11 and a reinforcing element covering the circuit board 11 and the photosensitive chip 12. The photosensitive chip 12 is conductively connected to the connector provided on the circuit board 11 to be fixed and conductive with the circuit board 11. The circuit board 11 also includes a lead-out connecting strip 114 and a connector 115, which are connected to external electronic components. The reinforcing plate 1616 can also include a reinforcing element to strengthen the connector 115.

[0146] The base 13 of the photosensitive component 10 of the present application replaces the independent motor base component and is integrally formed on the circuit board 11 by a molding process, thereby avoiding the glue reliability problem caused by the adhesive assembly of the motor base. While reducing the height of the camera module, due to the characteristics of the molding process, the molded base 13 has high temperature resistance and strong impact resistance, which can greatly enhance the reliability of the camera module.

[0147] While molding the base 13, the support arm 132 and the guide portion 133 are integrally formed to form a support and guide structure for the motor, which saves assembly steps and reduces assembly difficulty. The support arm 132 forms a mounting support structure for the motor's spring sheet, avoiding the need to separately set up a mounting structure for the spring sheet, and a conductive structure is provided inside the support arm 132 to directly connect the spring sheet and the circuit board of the photosensitive component. The guide portion 133 forms a ball guide structure for the ball motor. The molding process is adopted to reduce the height, improve the flatness and precision, improve the precision of the jitter compensation movement, reduce the movement resistance, and increase the jitter compensation movement stroke.

[0148] The electronic components, magnetic elements 134, position sensing elements 135, etc. of the circuit board 11 are integrally packaged by the base 13, making the surface of the base 13 smoother, reducing assembly steps, improving assembly efficiency, saving internal space, improving positioning accuracy, and also helping to improve the performance of the camera module.

[0149] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept. For example, the above features are replaced with the technical features with similar functions disclosed in this application (but not limited to) by each other.

Claims

1. Camera module, It is characterized in that include: A photosensitive chip, a circuit board and an optical lens, wherein the photosensitive chip is mounted on the circuit board and is conductively connected to the circuit board, and the optical lens is arranged in the photosensitive path of the photosensitive chip; as well as A motor and a base, wherein the base is integrally formed on the circuit board and encapsulates at least a portion of the circuit board, the photosensitive chip is exposed through a window area defined by the base, and the motor is assembled on the base; Among them, the base is provided with multiple anti-shake conductive grooves and multiple independent anti-shake conductive parts, and the multiple anti-shake conductive grooves are arranged on the same side of the base. The anti-shake conductive part is arranged in the anti-shake conductive groove, one end of which is connected to the circuit board, and the other end of which is connected to the motor.

2. The camera module according to claim 1, in, The motor includes a flexible circuit board, the base includes a base, the flexible circuit board is mounted on the upper surface of the base, and the other end of the anti-shake conductive member is connected to the flexible circuit board.

3. The camera module according to claim 2, in, It also includes an actuating component, which includes an anti-shake coil, and the anti-shake coil is integrated in the flexible circuit board. The flexible circuit board is provided with a through hole, and the lead end of the anti-shake coil is led to the inner wall defining the through hole, and the other end of the anti-shake conductive part and the inner wall defining the through hole are fixed and conductively connected, so that the circuit board and the anti-shake coil are conductively connected, wherein the through hole and the anti-shake coil are arranged in an avoidance manner.

4. The camera module according to claim 3, in, The anti-shake conducting groove is formed by extending downward from the upper surface of the base portion facing the conducting hole to the circuit board.

5. The camera module according to claim 3, in, An anti-shake conductive groove is formed on the outer surface of the base, and an upper surface of the base is provided with a receiving groove whose two ends are respectively connected to the anti-shake conductive groove and the conductive hole. The anti-shake conductive part is accommodated in the receiving groove, one end of which extends to the outer surface of the base and extends along the anti-shake conductive groove to the circuit board and is conductive to the circuit board, and the other end is aligned with the conductive hole and is conductive to the flexible circuit board.

6. The camera module according to claim 1, in, The camera module includes a focusing conductive member, and the base includes a plurality of supporting arms, at least one of the supporting arms being provided with a focusing conductive groove, the focusing conductive groove being formed by extending downward from the top of at least one of the supporting arms to the circuit board, and the focusing conductive member being arranged in the focusing conductive groove, with one end being conducted to the circuit board and the other end being exposed from the top of the supporting arm.

7. The camera module according to claim 6, in, The motor includes a focus coil, a focus carrier and an upper spring sheet, wherein the upper spring sheet is installed on the upper side of the focus carrier, and a corner thereof is installed on the top of the support arm to suspend the focus carrier, and the focus coil is installed on the focus carrier and is conductively connected to the focus coil, wherein at least one of the corners of the upper spring sheet forms at least one conductive terminal, and the conductive terminal and the focus conductive member are conductively connected.

8. The camera module according to claim 1, in, The base is integrally formed to form a base, a plurality of support arms and a plurality of guide portions, each of the support arms protrudingly extending from a corner of the base in a direction parallel to the optical axis, each of the guide portions and each of the support arms being adjacently arranged, each of the guide portions being rotationally symmetrically arranged around the optical axis, and respectively defining at least one lower guide groove, wherein extension directions of at least two of the lower guide grooves are orthogonal and perpendicular to the optical axis of the camera module.

9. The camera module according to claim 8, in, The motor also includes a guiding member and an anti-shake carrier. The bottom of the anti-shake carrier is provided with a plurality of upper guiding parts, each defining at least one upper guiding groove. The guiding member is assembled between the upper guiding groove and the lower guiding groove to guide the relative movement of the anti-shake carrier and the base.

10. The camera module according to claim 1, in, The camera module also includes a bracket and a filter, wherein the bracket is located in a window area defined by the base, and the filter is installed on the bracket, wherein the bracket has a bracket through hole, and the photosensitive area of ​​the photosensitive chip is exposed through the window area and the bracket through hole, and the filter is held in the photosensitive path of the photosensitive chip.

11. The camera module according to claim 10, in, The bracket includes a step portion, a boss and a recessed portion, the filter is installed on the step portion, the boss is extended from the step portion and surrounds the filter, and the recessed portion is recessed from the bottom of the bracket to the step portion, forming a certain gap between the filter and the photosensitive chip.

12. The camera module according to claim 11, in, An escape space is provided at a corner of the bracket, and the boss is divided into a plurality of raised portions by the escape space, and the raised portion adjacent to the anti-shake conductive groove is smaller than the other raised portions.

13. The camera module according to claim 1, in, The camera module also includes a magnetic element, which is arranged on the circuit board and is built into the base after the base is integrally formed on the circuit board.

14. The camera module according to claim 1, in, The camera module also includes a position sensing element, which is arranged on the circuit board, is conductively connected to the circuit board, and is built into the base after the base is integrally formed on the circuit board.

15. The camera module according to claim 14, in, The position sensing element is conductively connected to the anti-shake conductive member and conductively connected to the motor, wherein at least one position sensing element is located outside the anti-shake conductive groove.

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