Camera module and electronic equipment

Abstract

The invention discloses a camera module and electronic equipment, and belongs to the technical field of camera modules, and the camera module comprises a circuit board, an image sensor, a driving motor, a lens and a supporting member. The circuit board is provided with a hollow part, and the image sensor is located in the hollow part. The driving motor is located on one side of the circuit board, a first bonding pad is arranged on the side, away from the driving motor, of the circuit board, a second bonding pad is arranged on the side, away from the driving motor, of the image sensor, and the second bonding pad is electrically connected with the first bonding pad. The lens is connected with the driving motor. The circuit board and the image sensor are connected to the supporting piece, the supporting piece is located on the side, away from the driving motor, of the circuit board, the supporting piece is provided with a containing part, and the first bonding pad and the second bonding pad face the containing part in the opening direction of the containing part.

Description

Technical Field

[0001] The present application belongs to the technical field of camera modules, and specifically relates to a camera module and an electronic device. Background Art

[0002] In order to meet consumers' growing photography needs and provide high-quality photo shooting effects, the photosensitive chips in smartphones are developing towards larger and larger photosensitive sizes. As the size of the photosensitive chip increases, the size of the camera module will also increase. In the limited space of the mobile phone, the increase in the size of the camera module will limit the layout of the printed circuit board, affect the battery capacity, and affect the thickness of the mobile phone.

[0003] The pads on the photosensitive chip and the pads on the printed circuit board are usually connected by connecting wires. The components on the printed circuit board need to maintain a certain safety distance from the pads on the photosensitive chip. The size of the camera module in the X or Y direction cannot be further reduced, resulting in the printed circuit board being too large, which affects the stacking of the entire machine. Summary of the invention

[0004] The present application aims to provide a camera module and an electronic device, which at least solves the problem in the related art that the components on the printed circuit board need to maintain a certain safety distance from the pads on the photosensitive chip, thereby causing the printed circuit board to be too large.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a camera module, including:

[0007] A circuit board, wherein the circuit board is provided with a hollow portion;

[0008] An image sensor is located in the hollow portion;

[0009] A driving motor is located on one side of the circuit board, a first pad is provided on the side of the circuit board away from the driving motor, a second pad is provided on the side of the image sensor away from the driving motor, and the second pad is electrically connected to the first pad;

[0010] A lens connected to a driving motor;

[0011] The support member, the circuit board and the image sensor are connected to the support member, the support member is located on the side of the circuit board away from the driving motor, the support member is provided with a receiving portion, along the opening direction of the receiving portion, the first solder pad and the second solder pad face the receiving portion.

[0012] In a second aspect, an embodiment of the present application provides an electronic device, including:

[0013] case;

[0014] Like the camera module in the first aspect, the camera module is connected to the shell.

[0015] In an embodiment of the present application, the first pad is arranged on the side of the circuit board away from the drive motor, that is, the first pad is located on the side of the circuit board facing the support member. The second pad is arranged on the side of the circuit board away from the drive motor, that is, the second pad is located on the side of the circuit board facing the support member. The first pad and the second pad are arranged in the opening direction of the accommodating portion, so that the first pad and the second pad are directly opposite to the accommodating portion, which facilitates the electrical connection operation of the first pad and the second pad on the side of the support member away from the circuit board.

[0016] The side of the circuit board facing the support is taken as the back of the circuit board for exemplary description. Since the first pad and the second pad are respectively arranged on the back of the circuit board and the image sensor, when components are arranged on the front of the circuit board, the components will not interfere with the second pad, so there is no need to consider the safety distance between the components and the second pad. The components can be arranged closer to the image sensor, which is conducive to reducing the size of the circuit board in the X or Y direction and avoiding affecting the stacking of the whole machine.

[0017] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0019] Figure 1 is a schematic structural diagram of a camera module according to an embodiment of the present application;

[0020] Figure 2 is a schematic diagram of a partial structure of a camera module according to an embodiment of the present application;

[0021] Figure 3 is a schematic structural diagram of a camera module according to an embodiment of the present application;

[0022] Figure 4 is a schematic structural diagram of a camera module according to an embodiment of the present application;

[0023] Figure 5 is a schematic structural diagram of a support member, a colloid, and a connecting line according to an embodiment of the present application;

[0024] Figure 6 is a schematic structural diagram of a camera module according to an embodiment of the present application;

[0025] Figure 7 It is a schematic diagram of the structure of an electronic device according to an embodiment of the present application.

[0026] Reference numerals:

[0027] 100 camera module, 110 circuit board, 111 hollow part, 120 image sensor, 130 drive motor, 141 first solder pad, 142 second solder pad, 143 connecting wire, 150 lens, 160 support, 161 accommodating part, 162 colloid, 170 support seat, 171 first part, 172 second part, 180 filter, 190 sealing part, 200 housing, 300 electronic equipment, 400 components. DETAILED DESCRIPTION

[0028] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0029] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0030] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0031] Combine the following Figures 1 to 7 Describe a camera module and an electronic device according to an embodiment of the present application.

[0032] Combination Figure 1 , Figure 2 , Figure 4 and Figure 6As shown, according to some embodiments of the camera module 100 of the present application, the camera module 100 includes: a circuit board 110, an image sensor 120, a drive motor 130, a lens 150 and a support member 160. The circuit board 110 is provided with a hollow portion 111, and the image sensor 120 is located in the hollow portion 111. The drive motor 130 is located on one side of the circuit board 110, and a first solder pad 141 is provided on the side of the circuit board 110 away from the drive motor 130, and a second solder pad 142 is provided on the side of the image sensor 120 away from the drive motor 130, and the second solder pad 142 is electrically connected to the first solder pad 141. The lens 150 is connected to the drive motor 130. The circuit board 110 and the image sensor 120 are connected to the support member 160, and the support member 160 is located on the side of the circuit board 110 away from the drive motor 130. The support member 160 is provided with a housing portion 161, and along the opening direction ( Figure 2 As shown in the figure, the arrow at A in FIG. 1 points to the direction of the first solder pad 141 and the second solder pad 142 face the accommodation portion 161 .

[0033] The lens 150 is mounted on the driving motor 130, and the driving motor 130 can drive the lens 150 to move, thereby adjusting the position of the lens 150 and realizing the focusing function of the camera module 100. The driving motor 130 is arranged on one side of the circuit board 110, and the driving motor 130 is electrically connected to the circuit board 110. The circuit board 110 can control the movement of the driving motor 130 to realize the position adjustment of the lens 150. The light outside the electronic device 300 passes through the lens 150 and is received by the image sensor 120.

[0034] A cavity (partial depression) design is made on the circuit board 110, and a hollow portion 111 is formed on the circuit board 110 by hollowing out the middle area of ​​the circuit board 110. The image sensor 120 is accommodated in the hollow portion 111, rather than the image sensor 120 being pressed against the circuit board 110, thereby realizing a sinking design of the image sensor 120 and reducing the size of the camera module 100 in the height direction.

[0035] A support member 160 is provided on the side of the circuit board 110 away from the driving motor 130. The image sensor 120 and the circuit board 110 are both provided on the support member 160. The support member 160 supports the image sensor 120 and the circuit board 110. The image sensor 120 is not in a suspended state, thereby ensuring the installation stability of the image sensor 120 and helping to reduce the damage rate of the image sensor 120.

[0036] A first solder pad 141 is provided on the circuit board 110, and a second solder pad 142 is provided on the image sensor 120. The first solder pad 141 and the second solder pad 142 are electrically connected to realize functions such as the circuit board 110 supplying power to the image sensor 120 and / or signal transmission between the circuit board 110 and the image sensor 120.

[0037] The first pad 141 is disposed on the side of the circuit board 110 away from the driving motor 130, that is, the first pad 141 is located on the side of the circuit board 110 facing the support member 160. The second pad 142 is disposed on the side of the circuit board 110 away from the driving motor 130, that is, the second pad 142 is located on the side of the circuit board 110 facing the support member 160. The first pad 141 and the second pad 142 are disposed in the opening direction of the accommodation portion 161, so that the first pad 141 and the second pad 142 are directly opposite to the accommodation portion 161, which facilitates the electrical connection operation of the first pad 141 and the second pad 142 on the side of the support member 160 away from the circuit board 110.

[0038] The side of the circuit board 110 facing the support member 160 is used as the back of the circuit board 110 for exemplary description. Since the first pad 141 and the second pad 142 are respectively arranged on the back of the circuit board 110 and the image sensor 120, when the component 400 is arranged on the front of the circuit board 110, the component 400 will not interfere with the second pad 142, so there is no need to consider the safety distance between the component 400 and the second pad 142, and the arrangement position of the component 400 can be closer to the image sensor 120, which is conducive to reducing the size of the circuit board 110 in the X or Y direction and avoiding affecting the stacking of the whole machine.

[0039] The components 400 on the circuit board 110 may include capacitors. When the capacitors are closer to the image sensor 120 , the quality of the power signal of the image sensor 120 is improved.

[0040] Exemplarily, the support member 160 in this embodiment may be a steel plate. In other embodiments, the support member 160 may also be made of other materials.

[0041] Figure 3 The space within the dotted frame B1 is used to represent the hollow portion 111 ( Figure 2 and Figure 3 is a partial view), Figure 3 The space within the dotted frame B2 is used to represent the accommodation portion 161. Figure 6 The area enclosed by the dotted frame represents the hollow portion 111.

[0042] Combination Figure 1 , Figure 2 and Figure 4 As shown, in some embodiments, optionally, the camera module 100 also includes: a connecting wire 143 , the connecting wire 143 connects the first solder pad 141 and the second solder pad 142 , and at least a portion of the connecting wire 143 extends into the accommodating portion 161 .

[0043] The first solder pad 141 and the second solder pad 142 are electrically connected via the connecting wire 143. Since the first solder pad 141 is arranged on the back of the circuit board 110 and the second solder pad 142 is arranged on the back of the image sensor 120, the connecting wire 143 is located on the back of the first solder pad 141 and the back of the image sensor 120. The connecting wire 143 is not arranged on the imaging surface of the image sensor 120, and the light will not be affected by the reflection of the connecting wire 143, thereby avoiding stray light in the imaging, which is beneficial to ensuring the imaging quality.

[0044] A portion of the connection line 143 extends into the accommodation portion 161. The connection line 143 between the first pad 141 and the second pad 142 usually has a certain arc height. Since the first pad 141 and the second pad 142 are directly opposite to the accommodation portion 161, the arc-bent connection line 143 can extend into the accommodation portion 161. The accommodation portion 161 provides an escape space for the connection line 143 to avoid interference between the connection line 143 and the support member 160. On this basis, there is no need to leave a gap between the image sensor 120 and the support member 160 to accommodate the connection line 143, and there is no need to leave a gap between the circuit board 110 and the support member 160 to accommodate the connection line 143. The image sensor 120 and the circuit board 110 can be attached to the support member 160, which is conducive to improving the support stability of the support member 160 for the image sensor 120 and the circuit board 110. The accommodating portion 161 can also protect the connecting wire 143 , so that the connecting wire 143 is not easily contacted with other components, thereby reducing the damage rate of the connecting wire 143 and improving the connection stability between the first pad 141 and the second pad 142 .

[0045] Exemplarily, the connection wire 143 in this embodiment is a gold wire. In other embodiments, the connection wire 143 may also be made of other materials.

[0046] Combination Figure 1 and Figure 2 As shown, in some embodiments, optionally, along the thickness direction ( Figure 2 The arrow at W in the figure points to the right), the maximum height difference between the connecting wire 143 and the image sensor 120 is H1, the thickness of the supporting member 160 is H2, and H2>H1.

[0047] The maximum height difference between the connecting wire 143 and the image sensor 120 is the arc height of the connecting wire 143 . The thickness of the supporting member 160 is greater than the arc height of the connecting wire 143 . The connecting wire 143 will not protrude from the supporting member 160 , thereby ensuring the protective effect of the supporting member 160 on the connecting wire 143 .

[0048] The arc height of the connecting wire 143 on the pad is usually 70um to 140um. The support member 160 in this embodiment is a steel sheet with a thickness of 0.15mm or 0.22mm. Therefore, the connecting wire 143 will not protrude from the support member 160. The support member 160 can effectively protect the connecting wire 143 from deformation caused by external force, thereby avoiding abnormalities such as short circuit or open circuit.

[0049] Combination Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, in some embodiments, optionally, the camera module 100 further includes: a colloid 162 , and the colloid 162 is filled in the receiving portion 161 .

[0050] The colloid 162 may be filled in the receiving portion 161 . By filling the receiving portion 161 with the non-conductive colloid 162 , the opening of the receiving portion 161 is filled and leveled, and other components will not extend into the receiving portion 161 , further ensuring the reliability of the connecting wire 143 .

[0051] Combination Figure 1 , Figure 2 and Figure 6 As shown, in some embodiments, optionally, the camera module 100 further includes: a support base 170 and a filter 180, wherein a first portion 171 of the support base 170 is mounted on the circuit board 110, and a second portion 172 of the support base 170 is mounted on the image sensor 120. The filter 180 is mounted on the support base 170, and the filter 180 is located between the lens 150 and the image sensor 120.

[0052] A support base 170 is provided on the front of the image sensor 120 and the front of the circuit board 110. The support base 170 includes a first portion 171 and a second portion 172. The first portion 171 is placed on the circuit board 110, and the second portion 172 is placed on the image sensor 120. During the process of injecting glue into the accommodating portion 161, the circuit board 110 and the support member 160 are attached, and the glue 162 is not easy to flow to the front of the circuit board 110, so as to avoid affecting the function of the circuit board 110. Similarly, when the image sensor 120 and the support member 160 are attached, the glue 162 is not easy to flow to the front of the image sensor 120, so as to avoid affecting the imaging.

[0053] The support seat 170 supports the filter 180, and the light from the outside entering the camera module 100 first passes through the filter 180 before reaching the image sensor 120. The filter 180 can filter some wavelengths of light. In this embodiment, the connecting line 143 is arranged on the side of the image sensor 120 and the circuit board 110 away from the support seat 170. The support seat 170 and the filter 180 do not need to avoid the connecting line 143, leaving more space for the arrangement of the support seat 170, and the thickness of the support seat 170 can be increased to ensure the structural stability of the support seat 170, so that the support seat 170 can stably support the filter 180.

[0054] Combination Figure 1 and Figure 2 As shown, in some embodiments, optionally, the bonding area between the first portion 171 and the circuit board 110 is larger than the bonding area between the second portion 172 and the image sensor 120 .

[0055] The first part 171 has a larger fitting area with the circuit board 110, while the second part 172 has a smaller fitting area with the image sensor 120, so that most of the support base 170 is fitted on the circuit board 110, which can avoid the support base 170 covering too large an area of ​​the image sensor 120, thereby avoiding affecting the imaging effect of the image sensor 120.

[0056] Combination Figure 1 and Figure 2 As shown, in some embodiments, optionally, the camera module 100 also includes: a seal 190 , the seal 190 seals the gap between the support base 170 and the image sensor 120 , and seals the gap between the support base 170 and the circuit board 110 .

[0057] A seal 190 is provided between the support base 170 and the image sensor 120, and the seal 190 can improve the sealing between the support base 170 and the image sensor 120, and prevent the colloid 162 from overflowing to the imaging surface of the image sensor 120. Similarly, a seal 190 is provided between the support base 170 and the circuit board 110, and the seal 190 improves the sealing between the support base 170 and the circuit board 110, and prevents the colloid 162 from overflowing to the front of the circuit board 110.

[0058] Exemplarily, the sealing member 190 may be a sealant or a sealing pad.

[0059] Combination Figure 1 and Figure 2 As shown, in some embodiments, optionally, along the thickness direction of the image sensor 120 , there is a height difference between the first portion 171 and the second portion 172 , the filter 180 is placed on the second portion 172 , and the first portion 171 is located on the side of the filter 180 .

[0060] The first part 171 is mounted on the circuit board 110, and the second part 172 is mounted on the image sensor 120. The height of the first part 171 is greater than the height of the second part 172. The second part 172 supports the filter 180. The first part 171 is located on the side of the filter 180. The first part 171 limits the filter 180 to prevent the filter 180 from moving relative to the second part 172, thereby ensuring the installation stability of the filter 180.

[0061] Combination Figure 1 and Figure 2 As shown, in some embodiments, optionally, the height difference between the first portion 171 and the second portion 172 is H3, the thickness of the filter 180 is H4, and H3 and H4 satisfy the following relationship: H3>H4.

[0062] The height difference between the first portion 171 and the second portion 172 is greater than the thickness of the optical filter 180, so the top of the first portion 171 is higher than the top of the optical filter 180, which is beneficial to improving the stability of the first portion 171 limiting the optical filter 180. Moreover, on this basis, other components are not easy to contact the side of the optical filter 180, which is beneficial to reducing the damage rate of the optical filter 180.

[0063] In the embodiment of the present application, the present invention utilizes the design of the back pad of the CIS (CMOS image sensor) chip to make steel sheet openings at the positions of the PCB (Printed Circuit Board) pad and CIS pad corresponding to the existing cavity board (support 160) foundation, so as to achieve the WB (wire bonding, pressure welding) connection between the CIS and the back of the PCB. At the same time, the base (support seat 170) design is further optimized on the above basis to improve the base strength and reduce the height of the IR (IR-cut filter) bearing surface.

[0064] For cavity design, since the image sensor 120 needs to be sunken and attached to the support 160, a certain safety distance needs to be reserved between the image sensor 120 and the hollow edge of the circuit board 110, generally the safety distance is ≥0.15mm, and the WB (wirebonding, pressure welding) pad is set on the top layer of the image sensor 120, and the support base 170, components 400, etc. need to be placed with a certain distance from the WB pad, generally the distance is ≥0.15mm, so that the X or Y dimension of the module cannot be further reduced, which will cause the PCB size to be too large during design (exceeding the size of the drive motor 130), thereby affecting the stacking of the whole machine.

[0065] The design of this embodiment can place the internal components 400 of the camera module 100 closer to the CIS, thereby compressing the X or Y size of the module PCB and realizing a miniaturized design of the module PCB. In addition, the reliability of the base and IR can be further improved, and the risk of stray light from the gold wire can be reduced.

[0066] The main difference between the present invention and the related art is:

[0067] First, the assembly method of the chip (image sensor 120) and the PCB. This solution is directly modified based on the cavity design in the related technology. The chip is attached to the steel sheet from the top, that is, the bottom of the CIS is connected to the steel sheet through DA (die attach) glue, which can ensure good heat dissipation and reliability of the CIS chip. The related technology is to assemble the chip from the back by designing a limit plate, and to limit the assembly of the CIS chip from the top through the limit plate, so the bottom of the chip is completely suspended.

[0068] Second, design requirements. The related art requires that the thickness of the image sensor be less than the thickness of the circuit board, and the thickness of the limit plate be greater than the thickness of the image sensor. This embodiment directly limits the position through the steel sheet at the bottom of the PCB, without the need to design a special limit plate, and there is no clear design requirement for the chip thickness of the CIS (based on miniaturization considerations, the PCB board can be designed to be thinner than the CIS).

[0069] Based on the cavity design of the related art, this embodiment uses a CIS chip with a back pad design. When designing the PCB, an opening is designed for the steel sheet in the back WB area to expose the CIS chip pad and the PCB back pad. The CIS chip pad and the PCB pad are connected with gold wire through the WB process to ensure the normal circuit connection of the CIS.

[0070] To protect the gold wire, after the support base 170 is assembled, glue (non-conductive) can be dispensed in the open groove of the steel sheet to fill and level the open groove, thereby further ensuring the reliability of the gold wire.

[0071] After designing the WB pad and gold wire on the back, the front base can be designed as Figure 1 The middle support base 170 has the following styles (including but not limited to), where a small part of the base is mounted on the CIS chip, and most of it is mounted on the PCB. When the support base 170 is assembled, appropriate glue is applied to the PCB and the chip to fix them. The main purpose of this design is to seal the camera module 100 internally. This ensures that glue does not overflow from the front when glue is applied to the opening groove of the back steel sheet.

[0072] Compared with the cavity design base in the related art, the height of the base designed can be further reduced, and the height of the IR carried can also be further reduced.

[0073] Compared with the cavity layout in the related art, in this embodiment, the internal space for placing components 400 of the camera module 100 is larger, and devices such as capacitors can be placed closer to the inside of the camera module 100, thereby further reducing the size of the PCB head of the camera module 100.

[0074] The beneficial effects of the embodiments of the present application are as follows:

[0075] Without considering the safe spacing of the front gold wire and the gold wire pad design, the components 400 can be placed closer to the CIS chip, which can reduce the X or Y dimension of the module PCB. In addition, the capacitor can be placed closer to the CIS chip, which is beneficial to improving the chip power signal quality.

[0076] Due to the size limitation of the inner cavity of the driving motor 130, it is necessary to consider avoiding the components 400 and the WB pads when designing the internal support base 170. In most cases, due to space limitations, the wall thickness needs to be designed to be very thin, which will affect the reliability of the support base 170. The solution in this embodiment can have sufficient space to design the base wall thickness, and the base design does not need to consider avoiding the pads, which can reduce the difficulty of designing and manufacturing the base and improve the reliability of the base.

[0077] Since WB needs to be performed on the CIS imaging surface, the gold wire has a certain arc height, and the gold wire needs to be avoided during IR design. Therefore, the IR needs to be raised to a certain height. In this way, the gap between the lens 150 and the support seat 170 is relatively small. When subjected to external force, the lens 150 is very likely to collide with the base, which often causes IR cracks and other problems. In addition, the gold wire is on the imaging surface, and light is very likely to be reflected on the gold wire, resulting in the generation of gold wire stray light, which affects the imaging quality. In this embodiment, the gold wire is not on the front side, which can avoid the risk of stray light caused by the gold wire and improve the optical effect.

[0078] The base design does not need to consider the arc height of the gold wire, and can reduce the height from IR to CIS, better avoid the collision between the base and the lens 150, and improve the reliability of IR.

[0079] like Figure 7 As shown, in an embodiment of the present application, an electronic device 300 is proposed. The electronic device 300 includes a housing 200 and a camera module 100 in any of the above embodiments, and the camera module 100 is connected to the housing 200.

[0080] The electronic device 300 in this embodiment can achieve the technical effects of the camera module 100 in any of the above embodiments, which will not be described in detail here.

[0081] Exemplarily, the electronic device is a mobile phone, a tablet computer, a smart wearable device, etc.

[0082] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0083] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A camera module, characterized in that: include: A circuit board, wherein the circuit board is provided with a hollow portion; An image sensor is located in the hollow portion; A driving motor is located on one side of the circuit board, a first pad is provided on the side of the circuit board away from the driving motor, a second pad is provided on the side of the image sensor away from the driving motor, and the second pad is electrically connected to the first pad; A lens connected to the driving motor; A support member, the circuit board and the image sensor are connected to the support member, the support member is located on the side of the circuit board away from the driving motor, the support member is provided with a receiving portion, along the opening direction of the receiving portion, the first solder pad and the second solder pad face the receiving portion.

2. The camera module according to claim 1, characterized in that: The camera module also includes: A connecting line connects the first pad and the second pad, and at least a portion of the connecting line extends into the accommodation portion.

3. The camera module according to claim 2, characterized in that: Along the thickness direction of the image sensor, the maximum height difference between the connecting line and the image sensor is H1, the thickness of the supporting member is H2, and H2>H1.

4. The camera module according to claim 1, characterized in that: The camera module also includes: The colloid is filled in the containing part.

5. The camera module according to any one of claims 1 to 4, characterized in that: The camera module also includes: A support base, wherein a first portion of the support base is mounted on the circuit board, and a second portion of the support base is mounted on the image sensor; The filter is mounted on the support seat, and the filter is located between the lens and the image sensor.

6. The camera module according to claim 5, characterized in that: The bonding area between the first portion and the circuit board is larger than the bonding area between the second portion and the image sensor.

7. The camera module according to claim 5, characterized in that: The camera module also includes: A sealing member is provided for sealing a gap between the support base and the image sensor, and a gap between the support base and the circuit board.

8. The camera module according to claim 5, characterized in that: Along the thickness direction of the image sensor, there is a height difference between the first portion and the second portion, the filter is placed on the second portion, and the first portion is located on the side of the filter.

9. The camera module according to claim 8, characterized in that: The height difference between the first portion and the second portion is H3, the thickness of the filter is H4, and H3 and H4 satisfy the following relationship: H3>H4.

10. An electronic device, characterized in that: include: case; The camera module as described in any one of claims 1 to 9, wherein the camera module is connected to the shell.

Images