Automatic patch processing device for high-precision computer mainboard

Abstract

The invention belongs to the technical field of computer mainboard production, and particularly relates to a high-precision computer mainboard automatic patch processing device which comprises a mainboard transportation platform, the mainboard transportation platform is provided with a jacking assembly, the jacking assembly is provided with a coating assembly, and the coating assembly is provided with an automatic patch processing device. An activation unit is arranged on one side of the coating assembly, a patch module is arranged on one side of the activation unit, and a cleaning assembly is arranged at the end, away from the patch module, of the mainboard conveying platform; the coating assembly comprises a scraper moving unit and a solder paste supplementing unit, the scraper moving unit drives a ratchet wheel and a corner wheel to rotate through movement of a telescopic plate, movable extrusion plates on the two sides move to drive a scraper to move, and the scraper penetrates through small holes in a silk-screen template through the extrusion effect of the scraper and coats the designated position of a circuit board. And meanwhile, the activation unit is driven to regulate and control the temperature of the solder paste, so that the solder paste enters the chip mounting module at a proper temperature for chip mounting.

Description

Technical Field

[0001] The invention belongs to the technical field of computer mainboard production, and in particular relates to a high-precision computer mainboard automatic patch processing device. Background Art

[0002] Currently, solder paste coating for computer motherboards is mostly done manually or through multi-step automated processes, which are inefficient when processing large numbers of motherboards. Manual coating is not only time-consuming and labor-intensive, but the coating quality is also greatly affected by the skill level of the operator. Although the multi-step automated process has improved efficiency to a certain extent, the connection and waiting time between each step is still long, resulting in limited overall efficiency improvement.

[0003] In response to several significant defects in the current computer motherboard solder paste coating process, especially the inefficiency caused by the commonly used manual coating or multi-step automated coating methods, and the displacement of the motherboard due to unstable fixation or improper operation during the coating process, the present application has developed a new coating mechanism that can accurately coat the computer motherboard while controlling the solder paste temperature and solder paste replenishment, greatly improving production efficiency. Summary of the invention

[0004] The purpose of the present invention is to provide a high-precision computer motherboard automatic patch processing device to solve the problems raised in the above background technology.

[0005] In order to solve the problems of the above-mentioned technology, the present invention provides the following technical solutions: a high-precision computer motherboard automatic patch processing device, comprising a motherboard transportation platform, the motherboard transportation platform is provided with a lifting component, the lifting component is provided with a coating component, one side of the coating component is provided with an activation unit, one side of the activation unit is provided with a patch module, and the end of the motherboard transportation platform away from the patch module is provided with a cleaning component; the coating component is composed of a scraper moving unit and a solder paste replenishing unit, the scraper moving unit includes a telescopic plate and a baffle, and the distance between the telescopic plate and the baffle is adjusted to control The ratchet wheel moves forward and backward, and the ratchet wheel rotates through the cooperation of the block, thereby driving the rotating rod to drive the angle wheel to rotate; the rotation of the angle wheel transmits the motion to the sliding rod and the moving rod on both sides of the telescopic plate, so that they dock with the circular grooves on the rods, and finally transmits the motion to the extrusion rod and the moving scraper. The extrusion of the scraper allows the solder paste to pass through the small holes on the silk screen template. The solder paste can be dynamically replenished by the solder paste replenishing unit, and the extrusion rod drives the activation unit to control the temperature of the solder paste; after the patch is completed, the cleaning component starts, and the driving motor drives the rotating rod and the arc sheet, and the arc sheet beats the vibration plate to shake off the excess solder paste on the motherboard. When the computer motherboard needs to be patched, the motherboard transportation platform is started, and the computer motherboard is transmitted to the lifting component through the conveyor belt. At this time, the lifting component lifts and fixes the computer motherboard to be processed. The coating component is started, and the scraper moving unit drives the scraper to move back and forth on the silk screen template to print the solder paste on the computer motherboard. At the same time, the solder paste replenishing unit can use the travel of the scraper moving unit to replenish the solder paste in the scraper. It also drives the activation unit to control the temperature of the solder paste on the computer motherboard, so that it enters the patch module for processing at the optimal temperature. Finally, the computer motherboard with completed patch is transported to the cleaning component by the conveyor belt, and the rotating rod drives the arc plate to reciprocate up and down on the vibration plate to shake off the excess solder paste and other impurities on the computer motherboard, thereby improving production efficiency.

[0006] As a preferred scheme, a telescopic plate is installed in the middle of the main board transport platform, and fixed blocks are provided on the front and rear sides of the telescopic plate, and wedge-shaped grooves are provided on the two fixed blocks, wherein a stopper and a moving rod are installed in the wedge-shaped groove, a circular groove is provided on the side of the moving rod away from the wedge-shaped groove, and a spring groove is provided on the other side of the moving rod, and the spring groove and the telescopic plate are connected by a spring, and an angle wheel is rotatably installed at the center of the telescopic plate, and a rotating rod is installed through the center of the angle wheel, a ratchet is fixedly installed above the rotating rod, and a scraper is fixedly installed below the rotating rod, a sliding rod is slidably installed at the coaxial position between the telescopic plate and the circular groove, and a spring rod and a contact round rod are installed on the side of the sliding rod close to the angle wheel. When the lifting assembly is running, the telescopic plate starts to push the baffle plate, driving the ratchet to rotate, and the ratchet drives the angle wheel to rotate through the rotating rod. At this time, the angle wheel pushes the contact round rod on one side, and the contact round rod pushes the spring rod and the sliding rod toward the fixed block, so that the sliding rod is inserted into the circular groove, and the sliding rod is driven by the sliding rod to slide in the wedge-shaped groove and squeeze the spring in the spring groove toward the baffle. At this time, the scraper follows the telescopic plate to move on the silk screen template. Through the extrusion effect of the scraper, the solder paste passes through the small holes on the silk screen template and is evenly coated on the designated position of the computer motherboard. At the same time, the temperature of the solder paste is regulated by the extrusion rod driven by the moving rod.

[0007] As a preferred solution, the solder paste replenishing unit includes a solder paste tube, a clamping block, a short rod and a J-shaped rod; the J-shaped rod is fixedly installed on the fixed block on one side, and a clamping block is provided at the arc-shaped tail end of the J-shaped rod. The clamping block is rotatably installed on the end away from the J-shaped rod, and the short rod is connected to the scraper through the rotating rod. A plurality of small holes are provided on the scraper, and an induction switch is provided at the inner diameter of the angle wheel. When the contact round rod contacts the induction switch, the solder paste tube can replenish solder paste into the small holes of the scraper, so that the solder paste coating of the mainboard is more uniform. When the telescopic plate drives the scraper to move, it will also drive the ratchet to move synchronously. The block will push the ratchet to rotate a certain angle under the limit of the J-rod, and the ratchet will drive the angle wheel to rotate through the rotating rod. At this time, the contact round rods on both sides of the angle wheel will contact the inner diameter and outer diameter of the angle wheel respectively. When the contact round rods touch the inner diameter, the induction switch will be triggered, and the solder paste tube will replenish solder paste into the scraper. Because the rotation of the angle wheel is bound to the forward and return stroke of the telescopic plate, the solder paste can be replenished through the small holes on the scraper rod to ensure that the amount of solder paste passing through the small holes on the silk screen template is fixed, thereby achieving precise and quantitative coating.

[0008] As a preferred solution, the lifting assembly includes a telescopic rod and a negative pressure suction control plate. The telescopic rod is fixedly installed at the lower middle part of the motherboard transport platform, and the negative pressure suction control plate is fixedly installed above the telescopic rod. When the computer motherboard is transported to the top of the lifting assembly through the motherboard transport platform, the telescopic rod is started to place the negative pressure suction control plate under the computer motherboard, and the computer motherboard is firmly adsorbed by the negative pressure suction control plate to avoid displacement during the coating process and avoid coating misalignment. After the coating is completed, the telescopic rod is retracted, and the negative pressure suction control plate places the computer motherboard at the initial position and is then transported to the next processing flow by the conveyor belt.

[0009] As a preferred solution, the activation unit includes an extrusion rod, an extrusion bin, an air bag and an air pipe; the two moving rods are fixedly installed with an extrusion rod on one side away from the ratchet wheel, the fixed block is provided with an extrusion bin on the side close to the extrusion rod, an air bag is provided in the extrusion bin, the extrusion rod is fixedly connected to the air bag, the air bag input end is connected to the gas storage chamber, the two extrusion bins are connected through an air pipe, a number of rows of holes are evenly opened on the air pipe, the air bag output end is connected to the air pipe, and one-way valves are provided at both ends of the air pipe. When the moving rod moves, it will drive the extrusion rod to exhaust and inhale the air bag in the extrusion bin. By setting up two groups of extrusion bins, the gas with suitable temperature obtained through testing can be continuously blown to the solder paste on the computer motherboard through the rows of holes on the air pipe, ensuring that the solder paste temperature enters the patch module at the most suitable temperature.

[0010] As a preferred solution, the cleaning component includes a rotating rod, an arc piece, a driving motor and a vibration plate; a vibration plate is provided at one end of the motherboard transport platform away from the activation unit, two groups of rotating rods are provided below the vibration plate, and a plurality of arc pieces are evenly mounted on the two groups of rotating rods, wherein a driving motor is provided at the input end of the rotating rod, and a transmission belt is sleeved on the output end of the driving motor and the input end of the rotating rod. When the computer motherboard is pasted, it is transported to the cleaning component via a conveyor belt, and the driving motor drives a plurality of arc pieces to continuously beat the vibration plate through two groups of rotating rods, so that the vibration plate vibrates to shake off the excess solder paste and other impurities on the computer motherboard.

[0011] As a preferred solution, the initial angles of the plurality of arc pieces are different, so that during the rotation process, there are always arc pieces in contact with the vibration plate, thus ensuring the vibration and impurity removal effect.

[0012] As a preferred solution, the motherboard transport platform is provided with row bars on both sides of the middle part, and a silk screen template is provided above the row bars. When the computer motherboard is transported to the middle part of the motherboard transport platform, the row bars can support the computer motherboard to prevent it from falling directly on the lifting assembly, and at the same time, the accuracy of its position can be ensured to prevent the lifting assembly from lifting the computer motherboard and deviating from the standard hole position of the silk screen template.

[0013] Compared with the prior art, the beneficial effects achieved by the present invention are: 1. A coating assembly is provided, and the ratchet wheel and the angle wheel are driven to rotate by the telescopic plate. When the angle wheel rotates and pushes the contact round rod on one side, the contact round rod pushes the spring rod and the sliding rod toward the fixed block, so that the sliding rod is inserted into the circular groove. The sliding rod is used to drive the moving rod to slide in the wedge-shaped groove and squeeze the spring in the spring groove toward the baffle. At this time, the scraper follows the telescopic plate to move on the silk screen template. Through the extrusion effect of the scraper, the solder paste passes through the small holes on the silk screen template and is evenly coated on the designated position of the computer motherboard. At the same time, the temperature of the solder paste is regulated by the extrusion rod driven by the moving rod.

[0014] 2. A cleaning component is provided, which drives two sets of rotating rods to rotate through a driving motor, and drives multiple arc pieces to continuously beat the vibration plate, so that the vibration plate vibrates to shake off excess solder paste and other impurities on the computer motherboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 is a schematic diagram of the structure of an embodiment of the present invention from a first viewing angle; Figure 2 is a schematic diagram of the structure of a second viewing angle of an embodiment of the present invention; Figure 3 is a schematic diagram of the structure from a third viewing angle of an embodiment of the present invention; Figure 4 is a schematic diagram of the structure of a fourth viewing angle of an embodiment of the present invention; Figure 5 is a schematic structural diagram of a coating assembly according to an embodiment of the present invention from a first viewing angle; Figure 6 It is a schematic diagram of the partial structure of the stopper of the coating assembly of an embodiment of the present invention; Figure 7 It is a schematic diagram of the partial structure of the cleaning component of an embodiment of the present invention; Figure 8 is a schematic structural diagram of a coating assembly according to an embodiment of the present invention from a second viewing angle; In the figure: 1. Motherboard transport platform; 2. Lifting assembly; 201. Telescopic rod; 202. Negative pressure suction control plate; 3. Coating assembly; 301. Ratchet; 302. Baffle; 303. Rotating rod; 304. Angle wheel; 305. Telescopic plate; 306. Moving rod; 307. Round groove; 308. Sliding rod; 310. Contact round rod; 311. Solder paste tube; 312. Block; 313. Short rod; 314 , J-rod; 315, fixing block; 316, wedge-shaped groove; 317, stopper; 318, spring; 319, scraper; 4, activation unit; 401, extrusion rod; 402, extrusion chamber; 403, air bag; 404, air pipe; 5, patch module; 6, cleaning component; 601, rotating rod; 602, arc sheet; 603, driving motor; 604, vibration plate; 7, sliding rod; 8, silk screen template. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] Example: Figure 1As shown, the high-precision computer motherboard automatic patch processing device includes a motherboard transportation platform 1, the motherboard transportation platform 1 is provided with a jacking component 2, the jacking component 2 is provided with a coating component 3, the coating component 3 is composed of a scraper moving unit 3-1 and a solder paste replenishing unit 3-2, the scraper moving unit 3-1 includes a telescopic plate 305 and a baffle 302, and the forward and backward movement of the ratchet 301 is controlled by adjusting the distance between the telescopic plate 305 and the baffle 302. The ratchet 301 is rotated by the cooperation of the clamping block 312, thereby driving the rotating rod 303 to drive the angle wheel 304 to rotate; the rotation of the angle wheel 304 The movement is transferred to the sliding rod 308 and the moving rod 306 on both sides of the telescopic plate 305, so that they are docked with the circular groove 307 opened on the rod, and finally the movement is transferred to the extrusion rod 401 and the scraper 319. The extrusion effect of the scraper 319 is used to make the solder paste pass through the small holes on the silk screen template 8. The solder paste can be dynamically replenished by the solder paste replenishment unit 3-2. At the same time, the extrusion rod 401 drives the activation unit 4 to control the temperature of the solder paste; after the patch is completed, the cleaning component is started, and the rotating rod 601 and the arc piece 602 are driven by the driving motor 603. The arc piece 602 beats the vibration plate 604 to shake off the excess solder paste on the motherboard. When it is necessary to patch the computer motherboard, the motherboard transportation platform 1 is started, and the computer motherboard is conveyed to the lifting component 2 through the conveyor belt. At this time, the lifting component 2 lifts and fixes the computer motherboard to be processed. The coating component 3 is started, and the scraper moving unit 3-1 drives the scraper 319 to move back and forth on the screen printing template 8 to print the solder paste on the computer motherboard. At the same time, the solder paste replenishing unit 3-2 can use the travel of the scraper moving unit 3-1 to replenish the solder paste in the scraper 319. And it drives the activation unit 4 to control the temperature of the solder paste on the computer motherboard, so that it enters the patch module 5 for processing at the optimal temperature. Finally, the computer motherboard with the patch is conveyed to the cleaning component 6 by the conveyor belt, and the arc sheet 602 is driven by the rotating rod 601 to move, so that the vibration plate 604 can move up and down to shake off the excess solder paste and other impurities on the computer motherboard, thereby improving production efficiency.

[0018] like Figure 1-Figure 6 Shown and Figure 8A telescopic plate 305 is installed in the middle of the mainboard transport platform 1, a baffle 302 is arranged on one side of the telescopic plate 305, and fixed blocks 315 are arranged on the front and rear sides of the telescopic plate 305. Wedge-shaped grooves 316 are provided on the two fixed blocks 315, wherein a baffle 317 and a moving rod 306 are installed in the wedge-shaped grooves 316, and a circular groove 307 is provided on the side of the moving rod 306 away from the wedge-shaped groove, and a spring groove is provided on the other side of the moving rod 306, and the spring groove and the telescopic plate 305 are provided. The retractable plate 305 is connected by a spring 318, and a corner wheel 304 is rotatably installed at the center of the retractable plate 305, and a rotating rod 303 is installed through the center of the corner wheel 304, a ratchet 301 is fixedly installed above the rotating rod 303, and a scraper 319 is fixedly installed below the rotating rod 303. A sliding rod 308 is slidably installed at the coaxial position of the retractable plate 305 and the circular groove 307, and a spring rod patch module and a contact round rod 310 are installed on the side of the sliding rod 308 close to the corner wheel 304. When the jacking assembly 2 is running, the retractable plate 305 starts the jacking baffle 302, driving the ratchet 301 to rotate, and the ratchet 301 drives the corner wheel 304 to rotate through the rotating rod 303. At this time, the angle wheel 304 pushes the contact round rod 310 on one side, and the contact round rod 310 pushes the spring rod patch module and the sliding rod 308 toward the fixed block 315, so that the sliding rod 308 is inserted into the circular groove 307, and the sliding rod 308 is used to drive the moving rod 306 to slide in the wedge-shaped groove 316, and squeeze the spring 318 in the spring groove toward the stop block 317. At this time, the scraper 319 follows the telescopic plate 305 to move on the silk screen template 8. Through the squeezing effect of the scraper 319, the solder paste passes through the small holes on the silk screen template 8 and is evenly coated on the designated position of the computer motherboard. At the same time, the temperature of the solder paste is controlled by the squeezing rod 401 driven by the moving rod 306.

[0019] like Figure 2-Figure 6 Shown and Figure 8A J-shaped rod 314 is fixedly installed on the fixed block 315 on one side, and a clamping block 312 is arranged at the arc-shaped tail end of the J-shaped rod 314. The clamping block 312 is rotatably installed on the end away from the J-shaped rod 314. The short rod 313 is rotated to install the end. The solder paste tube 311 is arranged at the center of the ratchet 301 and passes through the rotating rod 303 to connect the scraper 319. A plurality of small holes are opened on the scraper 319. An induction switch is arranged at the inner diameter of the angle wheel 304. When the contact round rod 310 contacts the induction switch, the solder paste tube 311 can replenish solder paste into the small hole of the scraper 319, so that the solder paste coating of the mainboard is more uniform. When the telescopic plate 305 drives the scraper 319 to move, it will also drive the ratchet 301 to move synchronously. Under the limit of the J-shaped rod 314, the block 312 will push the ratchet 301 to rotate a certain angle. The ratchet 301 drives the angle wheel 304 to rotate through the rotating rod 303. At this time, the contact round rods 310 on both sides of the angle wheel 304 will contact the inner diameter and outer diameter of the angle wheel 304 respectively. When the contact round rods 310 contact the inner diameter, the induction switch will be triggered, and the solder paste tube 311 will replenish solder paste into the scraper 319. Because the rotation of the angle wheel 304 is bound to the forward and return strokes of the telescopic plate 305, the solder paste can be replenished through the small holes on the scraper 319 to ensure that the amount of solder paste passing through the small holes on the silk screen template 8 is fixed, thereby achieving precise and quantitative coating.

[0020] like Figure 4 and Figure 5 As shown, the lifting assembly 2 includes a telescopic rod 201 and a negative pressure suction control plate 202. The telescopic rod 201 is fixedly installed at the lower middle part of the motherboard transport platform 1, and the negative pressure suction control plate 202 is fixedly installed above the telescopic rod 201. After the computer motherboard is transferred to the top of the lifting assembly 2 through the motherboard transport platform 1, the telescopic rod 201 is started to place the negative pressure suction control plate 202 under the computer motherboard, and the computer motherboard is firmly adsorbed by the negative pressure suction control plate 202 to avoid displacement during the coating process and avoid coating misalignment. After the coating is completed, the telescopic rod 201 is retracted, and the negative pressure suction control plate 202 places the computer motherboard in the initial position and is then transferred to the next processing flow by the conveyor belt.

[0021] like Figure 2-Figure 3As shown, the activation unit 4 includes an extrusion rod 401, an extrusion bin 402, an air bag 403 and an air pipe 404; the two moving rods 306 are fixedly installed with an extrusion rod 401 on one side away from the ratchet 301, the fixed block 315 is provided with a extrusion bin 402 on the side close to the extrusion rod 401, and the extrusion bin 402 is provided with an air bag 403, the extrusion rod 401 is fixedly connected to the air bag 403, the input end of the air bag 403 is connected to the gas storage chamber, the two extrusion bins 402 are connected by an air pipe 404, a plurality of rows of holes are evenly opened on the air pipe 404, the output end of the air bag 403 is connected to the air pipe 404, and one-way valves are provided at both ends of the air pipe 404. When the moving rod 306 moves, it will drive the squeezing rod 401 to exhaust and inhale the air bag 403 in the squeezing chamber 402. By setting up two groups of squeezing chambers 402, the gas with suitable temperature obtained through the test can be continuously blown to the solder paste on the computer motherboard through the discharge holes on the air pipe 404, ensuring that the solder paste enters the patch module 5 at the most suitable temperature.

[0022] like Figure 2 and Figure 7 As shown, the cleaning assembly 6 includes a rotating rod 601, an arc piece 602, a driving motor 603 and a vibration plate 604; a vibration plate 604 is provided at one end of the motherboard transport platform 1 away from the activation unit 4, two groups of rotating rods 601 are provided below the vibration plate 604, and a plurality of arc pieces 602 are evenly mounted on the two groups of rotating rods 601, wherein a driving motor 603 is provided at the input end of the rotating rod 601, and a transmission belt is sleeved on the output end of the driving motor 603 and the input end of the rotating rod 601. When the computer motherboard is finished with patching, it is transported to the cleaning assembly 6 via a conveyor belt, and the driving motor 603 drives the plurality of arc pieces 602 to continuously beat the vibration plate 604 through the two groups of rotating rods 601, so that the vibration plate 604 vibrates to shake off the excess solder paste and other impurities on the computer motherboard.

[0023] like Figure 7 As shown, the initial angles of the plurality of arc pieces 602 are different, so that the arc piece 602 can always contact the vibration plate 604 during the rotation process, thereby ensuring the effect of vibration and impurity removal.

[0024] like Figure 3 As shown, the two sides of the middle of the motherboard transport platform 1 are provided with row bars 7, and a silk screen template 8 is arranged above the row bars 7. When the computer motherboard is transported to the middle of the motherboard transport platform 1, the row bars 7 can support the computer motherboard to prevent it from falling directly on the lifting assembly 2, and at the same time, the accuracy of its position can be ensured to prevent the lifting assembly 2 from deviating from the standard hole position of the silk screen template 8 after lifting the computer motherboard.

[0025] The working principle of the present invention is as follows: First, when it is necessary to patch the computer motherboard, the motherboard transport platform 1 is started, and the computer motherboard is transported to the lifting assembly 2 through the conveyor belt. At this time, the lifting assembly 2 lifts up and fixes the computer motherboard to be processed. The coating assembly 3 is started, and the telescopic plate 305 starts to push the baffle plate 302, driving the ratchet 301 to rotate, and the ratchet 301 drives the angle wheel 304 to rotate through the rotating rod 303. At this time, the angle wheel 304 pushes the contact round rod 310 on one side, and the contact round rod 310 pushes the spring rod patch module and the sliding rod 308 toward the fixed block 315, so that the sliding rod 308 is inserted into the circular groove 307, and the sliding rod 308 is used to drive the moving rod 306 to slide in the wedge-shaped groove 316, and squeeze the spring 318 in the spring groove toward the stopper 317. At this time, the scraper 319 follows the telescopic plate 305 to move on the screen printing template 8. When the telescopic plate 305 drives the scraper 319 to move, it will also drive the ratchet 301 to move synchronously. The block 312 will push the ratchet 301 to rotate a certain angle under the limit of the J-shaped rod 314, and the ratchet 301 will drive the angle wheel 304 to rotate through the rotating rod 303. At this time, the contact rods 310 on both sides of the angle wheel 304 will contact the inner diameter and outer diameter of the angle wheel 304 respectively. When the contact rods 310 contact the inner diameter, the induction switch will be triggered, and the solder paste tube 311 will replenish solder paste into the scraper 319. Because the rotation of the angle wheel 304 is bound to the forward and return travel of the telescopic plate 305, solder paste can be replenished through the small holes on the scraper rod 319 to ensure that the amount of solder paste passing through the small holes on the screen printing template 8 is fixed, so as to achieve precise and quantitative coating. Through the extrusion effect of the scraper 319, the solder paste passes through the small holes on the silk screen template 8 and is evenly coated on the designated position of the computer motherboard. At the same time, the extrusion rod 401 driven by the moving rod 306 controls the temperature of the solder paste.

[0026] Secondly, when the moving rod 306 moves, it will drive the squeezing rod 401 to exhaust and inhale the air bag 403 in the squeezing chamber 402. By setting up two groups of squeezing chambers 402, the gas with suitable temperature obtained through testing can be continuously blown through the holes on the air pipe 404 to blow the solder paste on the computer motherboard, ensuring that the solder paste temperature enters the patch module 5 at the most suitable temperature.

[0027] Finally, when the computer motherboard is finished with patching, it is transported to the cleaning component 6 via the conveyor belt. The driving motor 603 drives multiple arc pieces 602 through two sets of rotating rods 601 to continuously beat the vibration plate 604, so that the vibration plate 604 vibrates to shake off the excess solder paste and other impurities on the computer motherboard.

[0028] It is obvious to those skilled in the art that the present invention is not limited to the details of the above-described exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present invention. Any reference signs in the claims should not be construed as limiting the claims involved.

Claims

1. A high-precision computer motherboard automatic patch processing device, characterized in that: It comprises a motherboard transport platform, the motherboard transport platform is provided with a jacking assembly, the jacking assembly is provided with a coating assembly, one side of the coating assembly is provided with an activation unit, one side of the activation unit is provided with a patch module, and one end of the motherboard transport platform away from the patch module is provided with a cleaning assembly; The coating assembly is composed of a scraper moving unit and a solder paste replenishing unit. The scraper moving unit includes a telescopic plate and a baffle. The distance between the telescopic plate and the baffle is adjusted to control the forward and backward movement of the ratchet wheel. The ratchet wheel is rotated by the cooperation of the clamping block, thereby driving the rotating rod to drive the angle wheel to rotate; the rotation of the angle wheel transmits the motion to the sliding rod and the moving rod on both sides of the telescopic plate, so that they are docked with the circular grooves provided on the rods, and finally the motion is transmitted to the extrusion rod and the moving scraper. The extrusion effect of the scraper is used to make the solder paste pass through the small holes on the silk screen template. The solder paste can be dynamically replenished through the solder paste replenishing unit, and at the same time, the extrusion rod drives the activation unit to control the temperature of the solder paste; After the patch is completed, the cleaning component is started, and the rotating rod and the arc piece are driven by the driving motor. The arc piece beats the vibration plate to shake off the excess solder paste on the motherboard.

2. A high-precision computer motherboard automatic patch processing device according to claim 1, characterized in that: A telescopic plate is installed in the middle of the main board transport platform, a baffle is provided on one side of the telescopic plate, and fixed blocks are provided on the front and rear sides of the telescopic plate. Wedge-shaped grooves are provided on the two fixed blocks, wherein a baffle and a moving rod are installed in the wedge-shaped groove, a circular groove is provided on the side of the moving rod away from the wedge-shaped groove, and a spring groove is provided on the other side of the moving rod, and the spring groove and the telescopic plate are connected by a spring, and an angle wheel is rotatably installed at the center of the telescopic plate, and a rotating rod is installed through the center of the angle wheel, a ratchet is fixedly installed above the rotating rod, and a scraper is fixedly installed below the rotating rod, a sliding rod is slidably installed at the coaxial position between the telescopic plate and the circular groove, and a spring rod and a contact round rod are installed on the side of the sliding rod close to the angle wheel.

3. A high-precision computer motherboard automatic patch processing device according to claim 2, characterized in that: A J-shaped rod is fixedly installed on the fixed block on one side, a clamping block is provided at the arc-shaped tail end of the J-shaped rod, and a short rod is rotatably installed on the end of the clamping block away from the J-shaped rod. The solder paste tube is arranged at the center of the ratchet and passes through the rotating rod to connect the scraper. A plurality of small holes are opened on the scraper, and an induction switch is provided at the inner diameter of the angle wheel. When the contact round rod contacts the induction switch, the solder paste tube can replenish solder paste into the small holes of the scraper, so that the solder paste coating of the mainboard is more uniform.

4. A high-precision computer motherboard automatic patch processing device according to claim 3, characterized in that: The lifting assembly includes a telescopic rod and a negative pressure suction control plate. The telescopic rod is fixedly installed below the middle of the mainboard transport platform, and the negative pressure suction control plate is fixedly installed above the telescopic rod.

5. A high-precision computer motherboard automatic patch processing device according to claim 4, characterized in that: The activation unit includes a squeezing rod, a squeezing bin, an air bag and an air pipe; a squeezing rod is fixedly installed on one side of the two moving rods away from the ratchet wheel, a squeezing bin is provided on the side of the fixed block close to the squeezing rod, an air bag is provided in the squeezing bin, the squeezing rod is fixedly connected to the air bag, the input end of the air bag is connected to the gas storage chamber, the two squeezing bins are connected by an air pipe, a plurality of rows of holes are evenly opened on the air pipe, the output end of the air bag is connected to the air pipe, and one-way valves are provided at both ends of the air pipe.

6. A high-precision computer motherboard automatic patch processing device according to claim 5, characterized in that: The cleaning assembly includes a rotating rod, an arc piece, a driving motor and a vibration plate; a vibration plate is arranged at one end of the mainboard transport platform away from the activation unit, two groups of rotating rods are arranged under the vibration plate, and a plurality of arc pieces are evenly installed on the two groups of rotating rods, wherein a driving motor is arranged at the input end of the rotating rod, and a transmission belt is sleeved on the output end of the driving motor and the input end of the rotating rod.

7. The high-precision computer motherboard automatic chip processing device according to claim 5, characterized in that: The initial angles of the plurality of arc segments are different.

8. The high-precision computer motherboard automatic patch processing device according to claim 1, characterized in that: Sliding rods are arranged on both sides of the middle part of the mainboard transport platform, and a silk screen template is arranged above the sliding rods.

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