Manufacturing method of light-emitting device, mold and light-emitting device

Abstract

The invention relates to the technical field of semiconductor light emitting, and discloses a manufacturing method of a light-emitting device, a mold and the light-emitting device. The manufacturing method comprises the following steps: step S1, fixing the light-emitting chip on the substrate; and S2, distributing the light-transmitting glue on the joint surface of the mold and / or the upper surface of the light-emitting chip. And S3, the light-transmitting glue is pressed to the upper surface of the light-emitting chip through a mold, and the limiting columns abut against the substrate. And meanwhile, the periphery of the light-emitting chip and a cavity structure between the mold and the substrate are filled with high-reflection glue, and the high-reflection glue at least covers the side face of the light-emitting chip. And S4, after curing, the mold is moved away, and the upper surface and the side face of the light-emitting chip are covered with a light-transmitting glue layer and a high-reflection glue layer correspondingly. According to the manufacturing method, the light-transmitting adhesive layers and the high-reflection adhesive layers which are uniform in thickness and stable in quality are formed in batches at the same time, the process is simple, the efficiency is high, the yield is high, and the production cost is low. The light-emitting device is uniform in light emission and high in light spot quality; and the quality of batch finished products is uniform and stable.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor light emitting technology, and in particular, relates to a method for manufacturing a light emitting device, a mold and a light emitting device thereof. Background Art

[0002] In order to realize the special optical function of the light-emitting device, it is necessary to coat the upper surface of the light-emitting chip with a light-transmitting adhesive layer and fill the side of the light-emitting chip with a high-reflective adhesive layer. Fig.10 , the light emitting chip 2 with its own light-transmitting adhesive layer 3 is fixed on the substrate 1, and then the high-reflective adhesive is applied around the light emitting chip 2 by glue dispensing. The upper surface of the high-reflective adhesive layer 4 formed by glue dispensing in this manufacturing method is uneven, the shape is unstable, the spatial color distribution is uneven, the gold wire 6 is easily exposed, and there is a reliability risk.

[0003] The preparation method of the prior art II, referring to Fig.11 The light emitting chip 2 with its own light-transmitting adhesive layer 3 is fixed in the bracket 7 with a bowl cup, and then high-reflective adhesive is dispensed around the light emitting chip 2 by dispensing. Because the bowl cup of the bracket 7 has poor consistency, the high-reflective adhesive layer 4 formed in the bracket 7 with the bowl cup has poor consistency, the spatial color distribution is uneven, and the cost of the bracket 7 with the bowl cup is relatively high.

[0004] Based on the above, the problem to be solved at present is: to provide a method for manufacturing a light-emitting device, a mold and a light-emitting device thereof, in which a light-transmitting adhesive layer and a high-reflecting adhesive layer are formed simultaneously, and the thickness of the light-transmitting adhesive layer and the high-reflecting layer are uniform and stable, and the process is simple. Summary of the invention

[0005] The object of the present invention is to provide a method for manufacturing a light-emitting device, a mold and a light-emitting device thereof, aiming to solve the problems in the prior art that the molding process of the light-transmitting adhesive layer and the high-reflecting adhesive layer of the light-emitting device is complicated, the quality of the light-transmitting adhesive layer and the high-reflecting adhesive layer molded in batches cannot be guaranteed to be uniform and stable, and the efficiency is low and the manufacturing cost is high.

[0006] The present invention is implemented in this way: a method for manufacturing a light emitting device comprises the following steps:

[0007] Step S1, fixing the light emitting chip on the substrate;

[0008] Step S2, dispensing light-transmitting glue on the joint surface of the mold and / or the upper surface of the light-emitting chip;

[0009] Step S3: The joint surface of the mold is provided with a limiting column, and the mold is used to press the light-transmitting glue onto the upper surface of the light-emitting chip, and the limiting column is against the substrate; at the same time, high-reflective glue is filled around the light-emitting chip and in the cavity structure between the mold and the substrate, and the high-reflective glue at least covers the side of the light-emitting chip;

[0010] Step S4: After the light-transmitting adhesive and the highly reflective adhesive are cured, the mold is removed, and the upper surface of the light-emitting chip is covered by the light-transmitting adhesive layer, and the side surface of the light-emitting chip is covered by the highly reflective adhesive layer.

[0011] Furthermore, in step S2, a groove is provided on the joint surface of the mold, and the side surface of the groove is an inclined surface which gradually moves away from the center of the groove from the top surface to the opening side, and the light-transmitting glue is distributed in the groove and / or on the upper surface of the light-emitting chip.

[0012] Furthermore, in step S3, there are a plurality of limit posts and gaps are left between them for the high-reflective glue to flow through.

[0013] Furthermore, the method further includes step S5, wherein a single light-emitting chip and its corresponding light-transmitting adhesive layer and high-reflective adhesive layer are used as units, and a plurality of units at different positions on the same substrate are cut to obtain a plurality of independent light-emitting devices.

[0014] The mold of the light emitting device comprises a pressing plate, one side of which is provided with a joint surface and spaced limiting columns, and the joint surface and a plurality of the limiting columns form a cavity structure.

[0015] Furthermore, the joint surface is provided with a groove for accommodating the light-transmitting glue, and the side surface of the groove is an inclined surface which gradually moves away from the center of the groove from the top surface toward the opening side.

[0016] Furthermore, a plurality of limiting columns and the cavity structures surrounded by them are grouped as one group, and a plurality of groups of limiting columns and cavity structures are arrayed or randomly arranged on one side of the pressure plate, and the limiting columns of adjacent groups are used independently or in common with each other.

[0017] A light emitting device, comprising:

[0018] substrate;

[0019] A light-emitting chip is disposed on the substrate;

[0020] A light-transmitting adhesive layer, which at least covers the upper surface of the light-emitting chip;

[0021] A high-reflective adhesive layer is disposed on the substrate and covers the surrounding sides of the light-emitting chip or covers the surrounding sides of the light-emitting chip and the light-transmitting adhesive layer.

[0022] Furthermore, the highest point of the upper surface of the high-reflective adhesive layer is higher than or equal to the highest point of the upper surface of the light-transmitting adhesive layer.

[0023] Furthermore, the thickness of the edges of the light-transmitting adhesive layer gradually becomes thinner from the middle to the edges.

[0024] Compared with the prior art, the optical device manufacturing method, fixture and light-emitting device provided by the present invention have the following beneficial effects:

[0025] The manufacturing method of the present invention is adopted to set the limiting column 52 on the mold 5, which ensures that the substrate 1 is flat and does not warp during the pressing process, and further ensures that the thickness of the light-transmitting adhesive layer 3 formed in batches is consistent, and a high-reflective adhesive layer 4 with uniform shape is formed on the basis of ensuring the consistency of the thickness of the light-transmitting adhesive layer 3. If the consistency of the thickness of the light-transmitting adhesive layer 3 formed in batches cannot be guaranteed, when filling the high-reflective adhesive, the high-reflective adhesive is easy to fill to the upper surface of the light-transmitting adhesive layer 3, resulting in a decrease in the product yield. Compared with the prior art one and the prior art two, the manufacturing method of the present invention forms the light-transmitting adhesive layer 3 and the high-reflective adhesive layer 4 at the same time, and the process is simple and efficient. The light-transmitting adhesive layer 3 and the high-reflective adhesive layer 4 of the light-emitting device formed in batches of the present invention have uniform thickness, stable shape, consistent spatial color, gold wire is not easy to be exposed, high quality reliability, high yield, and low production cost.

[0026] The groove 54 for accommodating the light-transmitting glue provided on the joint surface 51 of the mold 5 can accurately locate and isolate the light-transmitting glue and the highly reflective glue on the one hand; on the other hand, the light-transmitting glue can be pressed onto the upper surface of the light-emitting chip 2 to form a light-transmitting glue layer 3 of a preset shape. At the same time, the inclined surface 541 at the edge of the groove 54 shortens the length of the edge light travel channel, so that the distances traveled by the light in the middle and the surrounding edges of the light-transmitting glue layer 3 tend to be the same, and the brightness and color of the light output are uniform, further improving the light efficiency and luminous flux. The mold 5 of the present invention is easy to form uniform and stable light-transmitting glue layers 3 and highly reflective glue layers 4 simultaneously and in batches. The mold 5 has a simple, reasonable and stable structure and is easy to operate and manufacture. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of a state after the step S1 of the method for manufacturing a light-emitting device provided by the present invention is implemented;

[0028] Figure 2 It is a schematic diagram of a state after the step S2 of the method for manufacturing a light-emitting device provided by the present invention is implemented;

[0029] Figure 3 is another schematic diagram of a state after step S2 of the method for manufacturing a light-emitting device provided by the present invention is implemented;

[0030] Figure 4 It is a schematic diagram of a state after the step S3 of the method for manufacturing a light-emitting device provided by the present invention is implemented;

[0031] Figure 5 is a schematic cross-sectional structural diagram of a light-emitting device after step S4 of the method for manufacturing a light-emitting device provided by the present invention is implemented;

[0032] Figure 6It is a schematic three-dimensional structure diagram of the light-emitting device provided by the present invention;

[0033] Figure 7 It is a schematic cross-sectional structure diagram of the mold provided by the present invention;

[0034] Figure 8 It is a schematic diagram of a state of the limiting post and the light-emitting core chip used in cooperation provided by the present invention;

[0035] Fig. 9 It is another schematic diagram of a state of the limiting post and the light-emitting core chip used in cooperation provided by the present invention;

[0036] Fig.10 It is a schematic cross-sectional structure diagram of the light-emitting device of the prior art I;

[0037] Fig.11 It is a schematic cross-sectional structure diagram of the light-emitting device of the prior art II;

[0038] In the figure: 1 - substrate; 2 - light-emitting chip; 3 - light-transmitting glue layer; 4 - high-reflection glue layer; 5 - mold; 51 - joint surface; 52 - limiting post; 53 - cavity structure; 54 - groove; 541 - inclined surface; 55 - glue inlet; 56 - pressing plate; 6 - gold wire; 7 - bracket. Detailed implementation manners

[0039] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0040] The implementation of the present invention will be described in detail below with reference to specific embodiments.

[0041] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components; in the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship, they are based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the accompanying drawings are only for illustrative purposes and cannot be understood as a limitation of this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0042] Refer to Figure 1-9 As shown, it is a preferred embodiment provided by the present invention.

[0043] A method for manufacturing a light-emitting device includes the following steps:

[0044] Step S1: Fix the light emitting chip 2 on the substrate 1, referring to Figure 1 .

[0045] Step S2: distribute the light-transmitting glue on the joint surface 51 of the mold 5 or the upper surface of the light-emitting chip 2 or the joint surface 51 and the upper surface of the light-emitting chip 2, referring to Figure 2-3 .

[0046] Step S3: The joint surface 51 of the mold 5 is provided with spaced apart limiting posts 52, and a plurality of limiting posts 52 and the joint surface 51 form a cavity structure 53. Figure 4 , the mold 5 is used to press the light-transmitting glue onto the upper surface of the light-emitting chip 2, and the limiting pillars 52 are pressed against the substrate 1 around the light-emitting chip 2 to ensure the flatness of the substrate 1. At the same time, high-reflective glue is filled around the light-emitting chip 2 and in the cavity structure 53 between the mold 5 and the substrate 1, and the high-reflective glue at least covers the side of the light-emitting chip 2. The mold 5 can be pressed by heating.

[0047] Step S4: After the light-transmitting glue and the highly reflective glue are cured, the mold 5 is removed, and a light-transmitting glue layer 3 and a highly reflective glue layer 4 are formed on the upper surface and the side of the light-emitting chip 2, respectively. Figure 5 .

[0048] The manufacturing method of the present invention uses a mold to form a light-transmitting adhesive layer 3 and a highly reflective adhesive layer 4 at one time. Compared with the prior art, the process is simple, the production cost is low, and the production efficiency is high. The light-emitting devices mass-produced by this method have good quality consistency and high stability. A plurality of light-emitting chips 2 are arrayed or randomly distributed on the surface of the substrate 1. When a substrate 1 with a larger area is mass-formed, some areas of the substrate 1 are prone to warping and unevenness, which will cause the thickness of the formed light-transmitting adhesive layer 3 to be uneven, affecting the uniformity of the light output, and the consistency and stability of the same batch of products are poor. The present invention is provided with a limiting column 52, which effectively ensures the flatness of the substrate 1, further ensures the consistency of the thickness of the light-transmitting adhesive layer 3, and also ensures the consistency and stability of the quality of the light-emitting devices mass-produced. There are a plurality of limiting columns 52, and gaps are left between each other, and the gaps are used for the high-reflective adhesive to flow through. The high-reflective adhesive can be filled by direct dispensing and natural leveling. Since all the limiting pillars 52 of the entire mold 5 are arranged at intervals, one or two or more glue inlets 55 are set, and the amount of high-reflection glue is controlled. High reflection can fill all cavity structures 53, and the process is simple and efficient.

[0049] Optimization plan, refer to Figure 7, the joint surface 51 of the mold 5 is provided with a groove 54, and the groove 54 is used to accommodate the light-transmitting glue, press the light-transmitting glue to the upper surface of the light-emitting chip 2 and form a light-transmitting glue layer 3 of a preset shape. The groove 54 can be formed by the concave of the joint surface 51, or a protrusion is provided on the joint surface 51, and the protrusion surrounds the groove 54. The top surface of the groove 54 is preferably a plane or a micro-arc surface that is sunken in the direction close to the joint surface 51, and the inner side surface of the groove 54 is an inclined surface 541 that gradually moves away from the center of the groove 54 from the top surface of the groove 54 to the opening side. When the groove 54 is surrounded by the protrusion set on the joint surface 51, the outer side surface of the groove 54, that is, the outer side surface of the protrusion, can be set to different shapes as needed, for example, the outer side surface can be set to an inclined surface that gradually approaches the center of the groove 54 along the direction away from the joint surface 51. In step S2, the light-transmitting glue is distributed in the groove 54 and / or the upper surface of the light-emitting chip 2. The inclined surface 541 of the present invention shortens the length of the edge light travel channel, so that the distance traveled by the light in the middle and the surrounding edges of the light-transmitting adhesive layer 3 tends to be the same, and the brightness of the light is uniform. Preferably, the light-transmitting adhesive layer 3 is a fluorescent adhesive layer. For example, when the light-emitting chip 2 is a blue light chip, the edge blue light will not appear yellow due to the excitation of excessive fluorescent powder, so that the light output from the middle and the edge of the light-emitting device is uniform and the color is consistent, further improving the light efficiency and luminous flux. Furthermore, the groove 54 is provided with a gap structure for allowing the gold wire connecting the substrate 1 and the light-emitting chip 2 to pass through, and the gap structure ensures that the gold wire will not be damaged during the pressing process. Preferably, the gap structure is a notch set in the side wall of the groove 54.

[0050] In a further optimized solution, in step S1, a plurality of light-emitting chips 2 are arrayed or randomly arranged on the same substrate 1. In step 3, a plurality of groups of limit posts 52 and cavity structures 53 are arranged on the joint surface 51 of the mold 5 in correspondence with the plurality of light-emitting chips 2. Step S4 is followed by step S5. In step S5, a plurality of units at different positions on the same substrate 1 are cut with a single light-emitting chip 2 and the corresponding light-transmitting adhesive layer 3 and the high-reflective adhesive layer 4 as units to obtain a plurality of independent light-emitting devices.

[0051] The light-emitting device manufactured by the manufacturing method of the present invention comprises: a substrate 1, a light-emitting chip 2, a light-transmitting adhesive layer 3 and a highly reflective adhesive layer 4, Figure 5-6. The light-emitting chip 2 is arranged on the substrate 1. The light-transmitting adhesive layer 3 at least covers the light-emitting surface of the light-emitting chip 2. The light-transmitting adhesive layer 3 is a fluorescent adhesive layer. The high-reflective adhesive layer 4 is arranged on the substrate 1 and covers the surrounding sides of the light-emitting chip 2 or covers the surrounding sides of the light-emitting chip 2 and the light-transmitting adhesive layer 3. The upper surface of the light-transmitting adhesive layer 3 is preferably a plane or a convex micro-arc surface, so that the light is uniform. The highest point of the upper surface of the high-reflective adhesive layer 4 is higher than or equal to the highest point of the upper surface of the light-transmitting adhesive layer 3. The thickness of the surrounding edges of the light-transmitting adhesive layer 3 gradually becomes thinner from the middle to the surrounding edges. The above arrangement makes the distances that the light passes through the middle and the two side edges of the light-transmitting adhesive layer 3 tend to be the same, further ensuring the uniform brightness of the light. The light-emitting device is also provided with a gold wire, one end of which extends into the light-transmitting adhesive layer 3 to connect with the light-emitting chip 2, and the other end extends into the high-reflective adhesive layer 4 to connect with the bracket 7. The outer contour of the high-reflective adhesive layer 4 in the top view direction can be set to a rectangle or a quasi-rectangular shape with an arc chamfer. The outer contour of the light-transmitting adhesive layer 3 in the top view direction can be set to be circular or elliptical.

[0052] The mold 5 used in the manufacturing method of the present invention includes a pressing plate 56. Figure 7 . A joint surface 51 and a limiting column 52 are provided on one side of the pressing plate 56, and the joint surface 51 and a plurality of limiting columns 52 form a cavity structure 53. Gaps are left between the limiting columns 52 for the high-reflective glue to flow through. The cross-section of the limiting column 52 can be set to be circular or elliptical or rectangular or rhombus or a rhombus-like shape with four concave arcs, preferably a rhombus-like shape with four concave arcs. This preferred solution makes the top corners of the cut individual light-emitting devices smooth convex arcs without protruding edges and corners, thereby reducing the mutual friction between products and improving the appearance yield of batch products.

[0053] Furthermore, the joint surface 51 is provided with a groove 54 for accommodating the light-transmitting glue, and the inner side surface of the groove 54 is an inclined surface 541 that gradually moves away from the center of the groove 54 from the top surface of the groove 54 to the open side, that is, the inner side surface of the groove 54 is an inclined surface 541 that gradually expands outward, and the cross section of the groove 54 gradually increases in the direction away from the joint surface 51. The groove 54 can separate the light-transmitting glue and the highly reflective glue, and under the joint action of tension, it can effectively prevent the light-transmitting glue from flowing to the surrounding sides of the light-emitting chip 2. In addition, the groove 54 can also make the light-transmitting glue form a light-transmitting glue layer 3 of a preset shape, and the top surface of the groove 54 is preferably a plane or a micro-arc surface that is sunken in the direction of the joint surface 51. The thickness of the surrounding edges of the light-transmitting glue layer 3 formed by pressing the inclined surface 541 gradually becomes thinner from the middle to the edge direction. Such a setting makes the distances of the middle light and the edge light emitted by the light-emitting chip 2 to propagate in the light-transmitting glue layer 3 tend to be the same, so that the light output is relatively uniform. The mold 5 is further optimized, and the groove 54 is provided with a clearance structure for allowing the gold wire connecting the substrate 1 and the light-emitting chip 2 to pass through. Preferably, the clearance structure is a notch provided on the side wall of the groove 54 .

[0054] A plurality of limiting columns 52 and a cavity structure 53 formed by the limiting columns and the joint surface 51 are grouped together. Multiple groups of limiting columns 52 and cavity structures 53 are arrayed or randomly arranged on one side of the pressure plate 56. The limiting columns 52 of adjacent groups are used independently or in common. Figure 8-9 .

[0055] The present invention is not limited thereto; any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for manufacturing a light emitting device, It is characterized in that The steps include: Step S1, fixing the light-emitting chip (2) on the substrate (1); Step S2, dispensing light-transmitting glue on the joint surface (51) of the mold (5) and / or the upper surface of the light-emitting chip (2); Step S3: a limit post (52) is provided on the joint surface (51) of the mold (5), and the mold (5) is used to press the light-transmitting adhesive onto the upper surface of the light-emitting chip (2), with the limit post (52) abutting against the substrate (1); at the same time, highly reflective adhesive is filled around the light-emitting chip (2) and in the cavity structure (53) between the mold (5) and the substrate (1), and the highly reflective adhesive at least covers the side surfaces of the light-emitting chip (2); Step S4: After the light-transmitting adhesive and the highly reflective adhesive are cured, the mold (5) is removed, and the upper surface of the light-emitting chip (2) is covered by the light-transmitting adhesive layer (3), and the side surface of the light-emitting chip (2) is covered by the highly reflective adhesive layer (4).

2. The method according to claim 1, It is characterized in that In step S2, the joint surface (51) of the mold (5) is provided with a groove (54), and the side surface of the groove (54) is an inclined surface (541) that gradually moves away from the center of the groove (54) from the top surface to the opening side, and the light-transmitting glue is distributed in the groove (54) and / or on the upper surface of the light-emitting chip (2).

3. The method according to claim 1, It is characterized in that In the step S3, the number of the limiting posts (52) is several and gaps are left between them for the high-reflective glue to flow through.

4. The method according to claim 1, It is characterized in that The method further comprises step S5, wherein a single light-emitting chip (2) and its corresponding light-transmitting adhesive layer (3) and high-reflective adhesive layer (4) are used as units, and a plurality of units at different positions on the same substrate (1) are cut to obtain a plurality of independent light-emitting devices.

5. A mold for a light emitting device, It is characterized in that It comprises a pressing plate (56), one side of which is provided with a joint surface (51) and spaced-apart limiting columns (52), and the joint surface (51) and a plurality of spaced-apart limiting columns (52) form a cavity structure (53).

6. The mold according to claim 5, It is characterized in that The joint surface (51) is provided with a groove (54) for accommodating the light-transmitting glue, and the side surface of the groove (54) is an inclined surface (541) which gradually moves away from the center of the groove (54) from the top surface toward the opening side.

7. The mold according to claim 5, It is characterized in that A plurality of limiting columns (52) and the cavity structures (53) formed therefrom form a group, and a plurality of groups of limiting columns (52) and the cavity structures (53) are arranged in an array or randomly on one side of the pressing plate (56), and the limiting columns (52) of adjacent groups are used independently or in common.

8. A light emitting device, It is characterized in that include: substrate(1); A light-emitting chip (2), which is arranged on the substrate (1); A light-transmitting adhesive layer (3), which at least covers the upper surface of the light-emitting chip (2); A high-reflective adhesive layer (4) is provided on the substrate (1) and covers the surrounding side surfaces of the light-emitting chip (2) or covers the surrounding side surfaces of the light-emitting chip (2) and the light-transmitting adhesive layer (3).

9. The light emitting device according to claim 8, It is characterized in that The highest point of the upper surface of the highly reflective adhesive layer (4) is higher than or equal to the highest point of the upper surface of the light-transmissive adhesive layer (3).

10. The light emitting device according to claim 8, It is characterized in that The thickness of the edges of the light-transmitting adhesive layer (3) gradually becomes thinner from the middle to the edges.

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