Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, an isolation structure and a plurality of light-emitting devices, wherein the isolation structure and the light-emitting devices are located on the substrate. The isolation structure defines at least one light-transmitting opening and a plurality of isolation openings, the light-emitting devices are at least partially located in the isolation openings, the isolation structure comprises a lower portion and an upper portion which are stacked, the distance that the upper portion extends out of the lower portion is a first interval, and the first interval located in the light-transmitting opening is larger than the first interval located in the isolation openings. In the display panel, by increasing the first distance at the light-transmitting opening, light with a larger inclination angle can pass through the light-transmitting opening, so that the light transmittance of the display panel is increased under the condition that the setting mode of the isolation opening is not influenced.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular, to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) is an organic thin-film electroluminescent device. It has attracted great attention and has been widely used in electronic display products due to its advantages such as simple preparation process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and flexible display. In the preparation process of traditional display panels, the graphicization of luminous pixels is usually achieved through a fine metal mask (FMM). FMM technology is mature and has rich experience in mass production. However, FMM technology also has problems such as limited accuracy, high development cost and long development cycle. The non-fine metal mask technology eliminates the limitations of traditional OLED processes on display screen size, resolution and other screen performance, and has the advantages of high performance, full-domain size and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A record relevant contents of the non-fine metal mask technology for reference.

[0003] However, current electronic display products are limited by their own structural design. When applied to scenarios such as under-screen recognition and transparent display, it is difficult to improve light transmittance while ensuring high pixel density. Summary of the invention

[0004] In a first aspect, the present disclosure provides a display panel, which includes a substrate, an isolation structure and a plurality of light-emitting devices located on the substrate. The isolation structure defines at least one light-transmitting opening and a plurality of isolation openings, the light-emitting device is at least partially located in the isolation opening, the isolation structure includes a lower portion and an upper portion disposed on the lower portion, the distance that the upper portion extends along the edge of the lower portion is a first spacing, and the first spacing located in the light-transmitting opening is greater than the first spacing located in the isolation opening.

[0005] In the above scheme, by increasing the first spacing at the light-transmitting opening, light with a larger inclination angle can pass through the light-transmitting opening, thereby increasing the light transmittance of the display panel without affecting the setting mode (area, arrangement density, etc.) of the isolation opening.

[0006] In a specific embodiment of the first aspect of the present disclosure, the orthographic projection of the lower surface facing away from the substrate on the substrate is located within the orthographic projection of the upper surface close to the substrate on the substrate, and the distance between adjacent edges of the orthographic projections of the two is the first spacing.

[0007] In a specific embodiment of the first aspect of the present disclosure, the orthographic projection of the lower portion on the substrate is located within the orthographic projection of the upper portion on the substrate, and the distance between adjacent edges of the orthographic projections of the two is a second spacing, and the second spacing located in the light-transmitting opening is greater than the second spacing located in the isolation opening.

[0008] In a specific embodiment of the first aspect of the present disclosure, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence on a substrate, the light-emitting functional layer and the second electrode are at least partially located in corresponding isolation openings, a plurality of first electrodes are arranged at intervals, and the light-transmitting openings are respectively arranged between two adjacent first electrodes. In a specific embodiment of the first aspect of the present disclosure, the lower portion is a conductive structure, and the second electrode is connected to the lower portion. In this way, the isolation structure connects the second electrodes of each light-emitting device to form a common electrode.

[0009] In a specific embodiment of the first aspect of the present disclosure, the lower portion further includes a body portion and a bottom portion, and the bottom portion is located between the body portion and the substrate.

[0010] In a specific embodiment of the first aspect of the present disclosure, the orthographic projection of the bottom on the substrate is located within the orthographic projection of the upper portion on the substrate, and the orthographic projection of the body portion on the substrate is located within the orthographic projection of the bottom on the substrate. For example, in the isolation opening, the distance between the orthographic projection of the edge of the bottom on the substrate and the orthographic projection of the edge of the upper portion on the substrate is the second distance.

[0011] In the above solution, the second electrode is more easily deposited on the bottom compared to the side surface of the main body. Therefore, the arrangement of the bottom can reduce the impedance at the connection between the second electrode and the isolation structure.

[0012] In another specific embodiment of the first aspect of the present disclosure, the lower part includes a body part and a bottom part, the bottom part is located on the side of the body part away from the upper part, and the orthographic projection of the bottom part on the substrate is located within the orthographic projection of the upper part on the substrate. In the isolation opening, the orthographic projection of the edge of the body part on the substrate is located within the orthographic projection of the bottom part on the substrate, and in the isolation opening, the orthographic projection of the edge of the bottom part on the substrate and the orthographic projection of the edge of the upper part on the substrate are spaced at a second spacing, that is, the orthographic projection of the edge of the bottom part on the substrate and the orthographic projection of the edge of the upper part on the substrate are spaced at a second spacing. In the light-transmitting opening, the orthographic projection of the edge of the bottom part on the substrate coincides with the orthographic projection of the body part on the substrate, or the orthographic projection of the edge of the bottom part on the substrate is located within the orthographic projection of the body part on the substrate, and the orthographic projection of the edge of the end of the body part facing the bottom part on the substrate and the orthographic projection of the edge of the upper part on the substrate are spaced at a second spacing. For example, the distance between adjacent edges of the orthographic projections of the body part and the upper part is a third spacing. Optionally, the third spacing in the light-transmitting opening is greater than or equal to the third spacing in the isolation opening.

[0013] In the above scheme, in the isolation opening, the second electrode is more easily deposited on the bottom relative to the side surface of the main body, and therefore, the setting of the bottom can reduce the impedance at the connection between the second electrode and the isolation structure; in addition, relative to one side of the isolation opening, the portion of the bottom located on one side of the light-transmitting opening is removed, so that the bottom does not block the edge area of ​​the light-transmitting opening, thereby increasing the size of the first spacing at the light-transmitting opening to further increase the transmittance of large-angle light at the light-transmitting opening.

[0014] In a specific embodiment of the first aspect of the present disclosure, the etching resistance of the material of the bottom, the material of the main body, and the material of the upper part increases in sequence. In this way, in an etching process (such as wet etching), the bottom located at the bottommost layer can be etched so that the bottom is side-etched at the light-transmitting opening, thereby being blocked by the main body.

[0015] In a specific embodiment of the first aspect of the present disclosure, the material of the bottom, the material of the main body and the material of the upper part are molybdenum, aluminum and titanium respectively.

[0016] In a specific embodiment of the first aspect of the present disclosure, the display panel may further include a pixel defining layer, the pixel defining layer is located between the isolation structure and the substrate, the pixel defining layer includes a plurality of pixel openings corresponding to the isolation openings, and the pixel openings are connected to the corresponding isolation openings. The first electrode is located between the pixel defining layer and the substrate, and the pixel opening is used to limit the light-emitting device and expose the first electrode.

[0017] In a specific embodiment of the first aspect of the present disclosure, the pixel openings correspond to the isolation openings one-to-one, and the orthographic projection of the light-transmitting openings on the substrate is located within the orthographic projection of the pixel defining layer on the substrate.

[0018] Optionally, the pixel defining layer is an inorganic film layer.

[0019] In a specific embodiment of the first aspect of the present disclosure, the display panel may further include a first packaging layer, which is located on the side of the light-emitting device away from the substrate and includes a plurality of packaging units corresponding one to one with the isolation openings, and the packaging units cover the corresponding isolation openings.

[0020] In a specific embodiment of the first aspect of the present disclosure, the edge of the packaging unit extends to the side of the isolation structure (e.g., the upper part included therein) facing away from the substrate, and the portion of the packaging unit located on the side of the isolation structure (e.g., the upper part included therein) facing away from the substrate is spaced from the isolation structure (e.g., the upper part included therein) to form a suspended portion.

[0021] In a specific embodiment of the first aspect of the present disclosure, the plurality of light emitting devices are classified into a plurality of light emitting devices with different light emitting colors, and the packaging units corresponding to the light emitting devices with different light emitting colors are respectively and adjacently spaced from each other.

[0022] In a specific implementation of the first aspect of the present disclosure, the display panel may further include a second encapsulation layer and a third encapsulation layer covering the first encapsulation layer and the isolation structure, and the second encapsulation layer is located between the first encapsulation layer and the third encapsulation layer.

[0023] Optionally, the first encapsulation layer and the third encapsulation layer are inorganic layers, and the second encapsulation layer is an organic layer;

[0024] Optionally, the second encapsulation layer is a planarization layer.

[0025] In a specific embodiment of the first aspect of the present disclosure, the display panel may further include a display area, the display area includes a first area and a second area, the second area is located on at least one side of the first area, the transmittance of the first area is greater than the transmittance of the second area, and the light-transmitting opening is located in the first area.

[0026] A second aspect of the present disclosure provides a method for preparing a display panel, the method comprising: providing a substrate; forming a plurality of first electrodes on the substrate; forming an isolation structure on one side of the substrate, wherein the isolation structure is formed with at least one light-transmitting opening and a plurality of isolation openings, the isolation structure comprising a lower portion facing the substrate and an upper portion away from the substrate, the distance extending from the upper portion along the edge of the lower portion is a first spacing, the first spacing in the light-transmitting opening is greater than the first spacing in the isolation opening; forming a light-emitting functional layer and a second electrode in the isolation openings, respectively, the first electrode, the light-emitting functional layer and the second electrode stacked at each isolation opening constitute a light-emitting device; wherein after all the light-emitting devices are formed, the first spacing at the isolation openings is smaller than the first spacing at the light-transmitting openings.

[0027] In the display panel obtained by the above preparation method, the first spacing at the light-transmitting opening is increased so that light with a larger inclination angle can pass through the light-transmitting opening, thereby increasing the light transmittance of the display panel without affecting the setting mode (area, arrangement density, etc.) of the isolation opening.

[0028] In a specific embodiment of the second aspect of the present disclosure, the orthographic projection of the surface of the lower portion facing away from the substrate on the substrate is located within the orthographic projection of the surface of the upper portion close to the substrate on the substrate, and the distance between adjacent edges of the orthographic projections of the two is a first spacing, the orthographic projection of the lower portion on the substrate is located within the orthographic projection of the upper portion on the substrate, and the distance between adjacent edges of the orthographic projections of the lower and upper portions is a second spacing, and the second spacing located in the light-transmitting opening is greater than the second spacing located in the isolation opening.

[0029] In a specific embodiment of the second aspect of the present disclosure, the steps of forming an isolation structure and a light-emitting device on a substrate may include: after forming a plurality of first electrodes on the substrate, depositing a pixel defining material film layer covering the first electrodes; forming a first material layer and a second material layer stacked in sequence on the pixel defining material film layer, performing a composition process on the first material layer and the second material layer to form a lower portion and an upper portion, respectively, and forming an isolation opening and a light-transmitting opening enclosed by the lower portion and the upper portion; patterning the pixel defining material film layer to form a pixel opening corresponding to the isolation opening; sequentially depositing and etching a light-emitting functional material layer and a second electrode, respectively, twice to form light-emitting devices at the isolation openings, respectively; wherein the number of side etchings of the side wall of the isolation structure at the light-transmitting opening is greater than the number of side etchings of the side wall in the isolation opening, the first spacing at the isolation opening is smaller than the first spacing at the light-transmitting opening, and the second spacing at the isolation opening is smaller than the second spacing at the light-transmitting opening.

[0030] Optionally, the process of forming the isolation structure and the light-emitting device includes: in the process of forming the lower part and the upper part, forming a first type of isolation opening and a light-transmitting opening enclosed by the lower part and the upper part; patterning the pixel defining material film layer to form pixel openings corresponding to the first type of isolation openings respectively; sequentially depositing a light-emitting functional material layer and a conductive material layer to cover the isolation structure, the first type of isolation opening and the light-transmitting opening; forming an encapsulation material layer on the side of the conductive material layer away from the substrate, and then patterning the light-emitting functional material layer, the conductive material layer and the encapsulation material layer to remove the light-emitting functional material layer, the conductive material layer and the encapsulation material layer outside the position of the first type of isolation opening, wherein the remaining light-emitting functional material layer is The material layer forms a light-emitting functional layer, the remaining conductive material layer forms a second electrode, and the remaining packaging material layer forms a packaging unit; based on the process of the first type of isolation openings and the light-emitting devices therein, the second type of isolation openings and the third type of isolation openings are sequentially formed in the isolation structure, and light-emitting devices are respectively formed in the second type of isolation openings and the third type of isolation openings, and in the composition process of forming the second type of isolation openings and the third type of isolation openings, the isolation structure is etched on the side where the light-transmitting openings are located, so that after the second type of isolation openings and the third type of isolation openings are formed, the first spacing at the isolation openings is smaller than the first spacing at the light-transmitting openings, and the second spacing at the isolation openings is smaller than the second spacing at the light-transmitting openings.

[0031] In the above scheme, the light-emitting devices are prepared in batches, and the isolation openings corresponding to the light-emitting devices (including the first type of isolation openings, the second type of isolation openings, and the third type of isolation openings) are also prepared in batches. Therefore, the isolation structure is only etched once at each isolation opening, while the isolation structure is etched at least three times at the light-transmitting opening. Therefore, compared with the isolation openings, the side etching of the isolation structure at the light-transmitting openings will be more serious, so that the first spacing at the isolation openings is smaller than the first spacing at the light-transmitting openings.

[0032] In another specific embodiment of the second aspect of the present disclosure, the step of forming an isolation structure and a light-emitting device on a substrate may include: after forming a plurality of first electrodes on the substrate, depositing a pixel defining material film layer covering the first electrodes; forming a first material layer and a second material layer stacked in sequence on the pixel defining material film layer, performing a composition process on the first material layer and the second material layer to respectively form a bottom, a main body and an upper portion, and forming an isolation opening and a light-transmitting opening enclosed by the bottom, the main body and the upper portion, wherein the bottom and the main body constitute the lower portion; patterning the pixel defining material film layer to form a pixel opening corresponding to the isolation opening; sequentially depositing and etching a light-emitting functional material layer and a second electrode, respectively, to form light-emitting devices at the isolation openings, respectively; wherein the number of side etchings of the side wall of the isolation structure at the light-transmitting opening is greater than the number of side etchings of the side wall in the isolation opening, the first spacing at the isolation opening is smaller than the first spacing at the light-transmitting opening, and the second spacing at the isolation opening is smaller than the second spacing at the light-transmitting opening.

[0033] Optionally, the process of forming an isolation structure and a light-emitting device includes: in the process of forming a bottom, a main body and an upper part, forming a first type of isolation opening and a light-transmitting opening enclosed by the bottom, the main body and the upper part; patterning a pixel defining material film layer to form pixel openings corresponding to the first type of isolation openings respectively; sequentially depositing a light-emitting functional material layer and a conductive material layer to cover the isolation structure, the first type of isolation opening and the light-transmitting opening; forming a packaging material layer on the side of the conductive material layer away from the substrate, and then performing a composition process on the light-emitting functional material layer, the conductive material layer and the packaging material layer to remove the light-emitting functional material layer, the conductive material layer and the packaging material layer outside the position of the first type of isolation opening, wherein the remaining light-emitting functional material layer forms a light-emitting functional layer, the remaining conductive material layer forms a second electrode, and the remaining packaging material layer forms a packaging unit. Based on the process of forming the first type of isolation openings and the light-emitting devices therein, the second type of isolation openings and the third type of isolation openings are sequentially formed in the isolation structure, and light-emitting devices are respectively formed in the second type of isolation openings and the third type of isolation openings, and in the composition process of forming the second type of isolation openings and the third type of isolation openings, the main body and the bottom are etched from one side of the light-transmitting opening, so that after the second type of isolation openings and the third type of isolation openings are formed, in the light-transmitting openings, the orthographic projection of the bottom on the edge substrate coincides with the orthographic projection of the main body on the substrate, or the orthographic projection of the bottom on the edge substrate is located within the orthographic projection of the main body on the substrate, so that after the second type of isolation openings and the third type of isolation openings are formed, the first spacing at the isolation openings is smaller than the first spacing at the light-transmitting openings, and the second spacing at the isolation openings is smaller than the second spacing at the light-transmitting openings.

[0034] In the above scheme, the light-emitting devices are prepared in batches, and the isolation openings corresponding to the light-emitting devices (including the first type of isolation openings, the second type of isolation openings, and the third type of isolation openings) are also prepared in batches. Therefore, the isolation structure is etched only once at each isolation opening, while the isolation structure is etched at least three times at the light-transmitting opening, and the bottom will be subjected to more severe side etching, so that the bottom is blocked by the main body at the light-transmitting opening, so that the first spacing at the isolation opening can be smaller than the first spacing at the light-transmitting opening, and the second spacing at the isolation opening can be smaller than the second spacing at the light-transmitting opening.

[0035] In a specific embodiment of the second aspect of the present disclosure, in the process of forming the second type of isolation opening and the third type of isolation opening, the etching method of the first conductive material layer used to form the bottom includes wet etching, and the etching rate of the wet etching material on the first conductive material layer, the second conductive material layer and the third material layer decreases in sequence. In this way, during the wet etching process, the bottom formed by the first conductive material layer can be undercut to a greater extent relative to the main body formed by the second conductive material layer, so that the edge of the bottom is blocked by the main body.

[0036] A third aspect of the present disclosure provides a display device, which includes the display panel in the first aspect, or the display panel obtained by the preparation method of the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 A schematic diagram of a planar structure of a display panel provided in one embodiment of the present disclosure.

[0038] Figure 2 for Figure 1 An enlarged view of the S1 region of the display panel is shown.

[0039] Figure 3A for Figure 2 The shown display panel is a cross-sectional view along M1 - N1 in one design.

[0040] Figure 3B for Figure 2 The display panel is shown in a cross-sectional view along M2 - N2 .

[0041] Figure 3C FIG. 3B is an enlarged view of a portion of the isolation structure in the display panel located between two isolation openings.

[0042] Figure 3D It is an enlarged view of another isolation structure used as an analogy with the isolation structure in the display panel shown in 3C.

[0043] Figure 4A for Figure 2The cross-sectional view of the display panel along M1 - N1 in another design is shown.

[0044] Figure 4B for Figure 4A An enlarged view of the S2 region of the display panel is shown.

[0045] Figure 5A for Figure 2 The cross-sectional view of the display panel along M1 - N1 in another design is shown.

[0046] Figure 5B for Figure 5A An enlarged view of the S2 region of the display panel is shown.

[0047] Figure 6 for Figure 2 The cross-sectional view of the display panel along M1 - N1 in another design is shown.

[0048] Figure 7 A flow chart of a method for preparing a display panel provided in one embodiment of the present disclosure.

[0049] FIG. 8A to FIG. 8I for Figure 5A A process diagram of a method for preparing a display panel is shown.

[0050] Description of reference numerals:

[0051] 10-display panel; 11-display area; 12-frame area; 100-substrate; 210-isolation structure; 201-light-transmitting opening; 202-isolation opening; 202a-first type of isolation opening; 202b-second type of isolation opening; 203-pixel opening; 211-lower part; 211a-body part; 211b-bottom part; 2111-second conductive material layer; 2112-first conductive material layer; 212a-third material layer; 212-upper part; 2 13-pixel defining layer; 213a-pixel defining material layer; 220-light-emitting device; 221-first electrode; 222-second electrode; 223-light-emitting functional layer; 2231-first functional layer; 2232-light-emitting layer; 2233-second functional layer; 300-packaging structure; 310-first packaging layer; 311-packaging unit; 310a-packaging material film layer; 320-second packaging layer; 330-third packaging layer; 400-photoresist pattern. DETAILED DESCRIPTION

[0052] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this specification.

[0053] In display products, some functional film layers in the light-emitting devices are formed by evaporation, and there are multiple functional film layers in each light-emitting device, and the materials of some functional film layers (such as light-emitting layers) in the light-emitting devices that emit different light are different. Therefore, when evaporating these functional film layers through a mask plate (such as a fine mask plate), multiple alignments are required. In order to solve the position offset problem caused by the alignment accuracy error, sufficient space (and safety margin related to the alignment error) needs to be reserved between different light-emitting devices to ensure that the position of the actual light-emitting area of ​​the light-emitting device can have a certain overlap rate with the designed position (design area), which is equivalent to compressing the design area of ​​the light-emitting area of ​​the light-emitting device, which not only limits the light-emitting area of ​​the light-emitting device, but also prevents the arrangement density of the light-emitting device from being further increased, thereby making it difficult to further improve the PPI (pixel density) of the display panel.

[0054] In the present disclosure, an isolation structure is provided at the gap between the light-emitting devices to separate the functional film layers of the adjacent light-emitting devices. Thus, in the evaporation process of the functional film layer, it is only necessary to perform evaporation on the entire surface of the display panel without using a mask plate to prepare the functional film layer of each light-emitting device separately. The process does not need to consider the alignment accuracy during evaporation, so that the gap between the light-emitting devices can be designed to be smaller in size to increase the PPI (the principle can be referred to in the following and FIG. 8A to FIG. 8I (See also the relevant description in the relevant embodiments).

[0055] In some application scenarios, the display panel needs to have functions such as transparent display and under-screen recognition (fingerprint recognition, under-screen camera, infrared sensing) based on application requirements. In this way, a light-transmitting area will be divided in the display panel, and light-transmitting holes will be set in the gaps between the sub-pixels in the light-transmitting area to achieve light transmission. However, the isolation structure will block the incident light. Therefore, in the area where the light-transmitting hole is located, the isolation structure will limit the angle of the incident light and limit the amount of incident light with large inclination angles, thereby making it difficult to further improve the transmittance of the display panel without affecting the PPI and aperture ratio of the display panel.

[0056] At least one embodiment of the present disclosure provides a display panel, a method for preparing the same, and a display device to at least solve the above-mentioned technical problems. The display panel includes a substrate, an isolation structure and a plurality of light-emitting devices located on the substrate. The isolation structure defines at least one light-transmitting opening and a plurality of isolation openings. The light-emitting device is at least partially located in the isolation opening. The isolation structure includes a lower portion and an upper portion disposed on the lower portion. The distance that the upper portion extends along the edge of the lower portion is a first spacing. The first spacing located in the light-transmitting opening is greater than the first spacing located in the isolation opening. In the display panel, by increasing the first spacing at the light-transmitting opening, light with a larger inclination angle can pass through the light-transmitting opening, thereby increasing the light transmittance of the display panel without affecting the setting method (area, arrangement density, etc.) of the isolation opening.

[0057] The structure of the display panel in at least one embodiment of the present disclosure is described in detail below in conjunction with the accompanying drawings. In addition, in these drawings, a spatial rectangular coordinate system is established with the substrate in the display panel as a reference to intuitively present the positional relationship of each component in the display panel. In this spatial rectangular coordinate system, the X-axis and the Y-axis are parallel to the surface where the substrate is located, and the Z-axis is perpendicular to the surface where the substrate is located.

[0058] like Figure 1 , Figure 2 , Figure 3A and Figure 3B As shown, the display panel 10 includes a display area 11 and a non-display area 12 surrounding the display area 11, and the display area 11 includes a first area 13, and sub-pixels emitting light of different colors, such as R, G, and B, are arranged in the display area 11. A light-transmitting opening 201 is provided in the first area 13, and the setting of the light-transmitting opening 201 enables the first area 13 to have a certain light transmittance for under-screen recognition, video recording, infrared sensing or transparent display. It should be noted that in some embodiments of the present disclosure, some wiring in the non-display area 12 can be arranged in the display area 11, so that the non-display area 12 can be designed as a single-sided frame.

[0059] For example, the physical structure of the display panel 10 includes a substrate 100 , an isolation structure 210 and a plurality of light emitting devices 220 located on the substrate 100 . The light emitting devices 220 are physical light emitting structures of sub-pixels such as R, G, and B.

[0060] For example, the isolation structure 210 defines at least one light-transmitting opening 201 and a plurality of isolation openings 202, the isolation openings 202 are used to limit the light-emitting devices 220, and the light-transmitting openings 201 are arranged in the first area 13 and are located between the light-emitting devices 220, that is, the light-transmitting openings 201 for light transmission are set at the gaps between the light-emitting devices 220. The application of the isolation structure 210 can make it unnecessary to use a fine mask plate in the preparation process of the light-emitting device 220, so there is no need to consider the alignment accuracy of the preparation process, which is conducive to reducing the gap size of the light-emitting device 220 to improve the pixel PPI of the display panel 10 (this principle can be seen in FIG. 8A to FIG. 8I In addition, in the first area 13, by providing a light-transmitting opening 201 in the isolation structure 210, the area of ​​the display panel 10 provided with the light-transmitting opening 201 can be made light-transmitting, so that the first area 13 of the display panel 10 can realize a transparent display or an under-screen recognition function such as fingerprint recognition, under-screen camera, infrared sensing, etc.

[0061] The isolation structure 210 includes a lower portion 211 (lower end) facing the substrate 100 and an upper portion 212 (upper end) away from the substrate 100 . The distance that the upper portion 212 extends from the lower portion 211 (the distance that the upper portion 212 extends along the edge of the lower portion 211 ) is a first distance D1 .

[0062] like Figure 3A As shown, the first spacing D1-1 located at the light-transmitting opening 201 is greater than the first spacing D1-2 located at the isolation opening 202. In this way, the incident angle of the large-angle light L can be increased to increase the luminous flux of the light incident at the light-transmitting opening 201, thereby increasing the transmittance of the display panel.

[0063] It should be noted that the composition, preparation and other contents of the isolation structure 210 (which may be referred to as a partition structure or an isolation column) may also be referred to patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN20 The relevant instructions in 24 / 099072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117400332A are not repeated here.

[0064] In at least one embodiment of the present disclosure, FIG. 3A to FIG. 3CAs shown, the distance between the edge of the orthographic projection of the side surface of the lower portion 211 facing the upper portion 212 on the substrate 100 and the edge of the orthographic projection of the upper portion 212 on the substrate 100 is a first distance D1.

[0065] In the embodiments of the present disclosure, as long as the arrangement relationship between the lower portion 211 and the upper portion 212 can achieve the effect of isolating the film layer, on this basis, no further restrictions are imposed on other arrangement relationships between the two, and specific selections can be made according to actual process requirements. Below, the two arrangement relationships between the lower portion 211 and the upper portion 212 are described in different embodiments.

[0066] In some embodiments of the present disclosure, FIG. 3A to FIG. 3C As shown, the orthographic projection of the lower portion 211 on the substrate 100 is located within the orthographic projection of the upper portion 212 on the substrate 100. In this way, the isolation structure 210 as a whole presents a shape that is wide at the top and narrow at the bottom, so as to increase the isolation effect of the isolation structure 210 on the film layer of the light-emitting device 220; in addition, this solution can further reduce the shielding of the lower portion 211 on light incident at a large oblique angle, thereby increasing the luminous flux of light incident at the light-transmitting opening 201.

[0067] In other embodiments of the present disclosure, Figure 3D As shown, the orthographic projection of the surface of the lower portion 211 away from the substrate 100 on the substrate 100 is located within the orthographic projection of the upper portion 212 on the substrate 100, and the orthographic projection of the upper portion 212 on the substrate 100 is located within the orthographic projection of the surface of the lower portion 211 facing the substrate 100 on the substrate 100.

[0068] In at least one embodiment of the present disclosure, FIG. 3A to FIG. 3C As shown, the orthographic projection of the lower portion 211 on the substrate 100 is located within the orthographic projection of the upper portion 212 on the substrate 100, and the distance between the adjacent edges of the orthographic projections of the two is the second spacing D2, and the second spacing D2 located in the light-transmitting opening 201 is greater than the second spacing D2 located in the isolation opening. In this case, the edge of the surface of the lower portion 211 facing the substrate 100 and the edge of the upper portion 212 limit the incident angle of the large-angle light L, so that while not changing the height of the isolation structure 210, increasing the size of the second spacing D2 can increase the inclination angle of the incident light L, thereby increasing the luminous flux of the light incident at the light-transmitting opening 201.

[0069] In at least one embodiment of the present disclosure, Figure 3A and Figure 3BAs shown, the light emitting device 220 includes a first electrode 221, a second electrode 222 and a light emitting functional layer 223 sequentially stacked on the substrate 100, and the light emitting functional layer 223 and the second electrode 222 are at least partially located in the corresponding isolation opening 202. For example, the first electrode 221 can be set as an anode, and the second electrode 222 can be set as a cathode.

[0070] For example, the light-emitting functional layer 223 may include a first common layer 2231, a light-emitting layer 2232, and a second common layer 2233 stacked in sequence, and the first common layer 2231, the light-emitting layer 2232, and the second common layer 2233 are stacked in sequence on the first electrode 221. The first common layer 2231 may include a hole injection layer, a hole transport layer, an electron blocking layer, etc. The second common layer 2233 may include an electron injection layer, an electron transport layer, a hole blocking layer, etc. The isolation structure 210 is arranged so that the first common layer 2231 (the main film layer causing current crosstalk) of each light-emitting device 220 is electrically disconnected from each other.

[0071] In at least one embodiment of the present disclosure, Figure 3A and Figure 3B As shown, the isolation structure 210 includes a lower portion 211 and an upper portion 212 stacked on the substrate 100, the lower portion 211 is located between the upper portion 212 and the substrate 100, and the orthographic projection of the surface of the lower portion 211 facing away from the substrate 100 on the substrate 100 is located within the orthographic projection of the upper portion 212 on the substrate 100, that is, the edge of the upper portion 212 will exceed the edge of the lower portion 211. In this way, when evaporating the film layers (such as the light-emitting functional layer 223 and the second electrode 222) in the light-emitting device, the evaporation range of these film layers can be limited by the upper portion 212, so that part of the film layers (such as the light-emitting functional layer described below) are separated by the isolation structure 210, while ensuring that other parts of the film layers (such as the second electrode 222) are connected to the isolation structure 210. For example, the end of the lower portion 211 away from the upper portion 212 can be the above-mentioned lower portion, and the upper portion 212 can be the above-mentioned upper portion.

[0072] In at least one embodiment of the present disclosure, Figure 3A and Figure 3B As shown, the lower portion 211 is a conductive structure, and the second electrode 222 is connected to the lower portion 211. In this way, the isolation structure 210 connects the second electrodes 222 of each light emitting device 220 to form a common electrode.

[0073] It should be noted that the material of the second electrode 222 can be a metal material. The smaller the thickness of the second electrode 222, the higher its transmittance, but the higher its resistivity. If the thickness of the second electrode 222 is too small, when the isolation structure 210 is not set, the voltage drop of the second electrode 222 (the common electrode at this time) will be too large. In the embodiment of the present disclosure, the second electrode 222 is connected to the conductive lower part 211, which can remove the thickness restriction of the second electrode 222, so that the second electrode 222 has a smaller thickness to have a higher transmittance.

[0074] In at least one embodiment of the present disclosure, the lower portion 211 may be a metal conductive structure. The metal material has a high conductivity and can reduce the voltage drop when driving the second electrode. Accordingly, the metal material can only be light-transmissive when the thickness is extremely thin (e.g., tens of nanometers), and the isolation structure 210 requires a certain thickness to isolate the light-emitting functional layer 223 (the first common layer 2231 included therein). Accordingly, the lower portion 211 in the isolation structure 210 is almost light-proof. Therefore, the isolation structure 210 can only be light-transmissive by providing the light-transmitting opening 201.

[0075] In some embodiments of the present disclosure, Figure 3A and Figure 3B As shown, the isolation structure 210 may be a double-layer structure consisting of a lower portion 211 and an upper portion 212 , and the lower portion 211 is a single-layer structure.

[0076] In other embodiments of the present disclosure, Figure 4A and Figure 4B As shown, the isolation structure 210 is at least a three-layer structure. For example, the lower portion 211 of the isolation structure 210 includes a body portion 211 a and a bottom portion 211 b , and the bottom portion 211 b is located on a side of the body portion 211 a away from the upper portion 212 .

[0077] For example, the orthographic projection of the bottom 211b on the substrate 100 is located within the orthographic projection of the upper portion 212 on the substrate 100, and the orthographic projection of the body portion 211a on the substrate 100 is located within the orthographic projection of the bottom 211b on the substrate 100. For example, the second electrode 222 is connected to a region of the surface of the bottom 211b facing away from the substrate 100 that is not covered by the body portion 211a. For example, the bottom 211b is a conductive structure, so that the second electrode 222 is easier to deposit on the bottom 211b than on the side surface of the body portion 211a, thereby reducing the impedance at the connection between the second electrode 222 and the isolation structure 210.

[0078] In the isolation opening 202 , the distance between the orthographic projection of the edge of the bottom portion 211 b on the substrate 100 and the orthographic projection of the edge of the upper portion 212 on the substrate 100 is a second distance D2 .

[0079] In some embodiments of the present disclosure, Figure 4A and Figure 4B As shown, the orthographic projection of the bottom 211b on the substrate 100 is located within the orthographic projection of the upper portion 212 on the substrate 100, and the orthographic projection of the body portion on the substrate 100 is located within the orthographic projection of the bottom 211b on the substrate 100. Thus, in the light-transmitting opening 201 and the isolation opening 202, the distance between the orthographic projection of the edge of the bottom 211b on the substrate 100 and the orthographic projection of the edge of the upper portion 212 on the substrate 100 is the second distance D2.

[0080] In other embodiments of the present disclosure, Figure 5A and Figure 5B As shown, in the isolation opening 202, the orthographic projection of the edge of the body portion 211a on the substrate 100 is located within the orthographic projection of the bottom portion 211b on the substrate 100, and the distance between the orthographic projection of the edge of the bottom portion 211b on the substrate 100 and the orthographic projection of the edge of the upper portion 212 on the substrate 100 is a second distance D2. In the light-transmitting opening 201, the orthographic projection of the edge of the bottom portion 211b on the substrate 100 coincides with the orthographic projection of the body portion 211a on the substrate 100 ( Figure 5B ), or, the orthographic projection of the edge of the bottom 211b on the substrate 100 is within the orthographic projection of the body 211a on the substrate 100, and the distance between the orthographic projection of the edge of the end of the body 211a facing the bottom 211b on the substrate 100 and the orthographic projection of the edge of the upper portion 212 on the substrate 100 is the second distance. In this way, in the isolation opening 202, relative to the side surface of the body 211a, the second electrode 222 is more easily deposited on the bottom 211b, so the arrangement of the bottom 211b can reduce the impedance at the connection between the second electrode 222 and the isolation structure 210; in addition, relative to one side of the isolation opening 202, the portion of the bottom 211b located on one side of the light-transmitting opening 201 is removed, so that the bottom 211b does not block the edge area of ​​the light-transmitting opening 201, thereby increasing the size of the second distance D2 at the light-transmitting opening 201, so as to further increase the transmittance of the light with a large inclination angle at the light-transmitting opening 201.

[0081] It should be noted that the light emitting device 220 is prepared in batches. Therefore, in the actual process, Figure 5A and Figure 5B When the structure shown in FIG. 1 is formed, in the process of preparing each batch of light-emitting devices 220 (including forming the isolation openings 202 corresponding to the light-emitting devices 220), the isolation structure 210 can be etched multiple times (mainly side etching) in the light-transmitting opening 201, so that the portion of the bottom 211b originally existing in the light-transmitting opening 201 is etched to form the structure shown in FIG. Figure 5A and Figure 5B The form shown.

[0082] In one embodiment of the present disclosure, as Figure 4B and Figure 5B shown, in the isolation opening 202, the distance between the adjacent edges of the orthographic projections of the main body portion 211a and the upper portion 212 is the third spacing D3. For example, the third spacing D3 located within the light-transmitting opening 201 is greater than or equal to the third spacing D3 located within the isolation opening 202. In the process of manufacturing each batch of light-emitting devices 220 (including forming the isolation openings 202 corresponding to these light-emitting devices 220), the isolation structure 210 can be etched multiple times (mainly side etching) in the light-transmitting opening 201, so that the degree of side etching of the main body portion 211a at the light-transmitting opening 201 is greater than the degree of side etching of the main body portion 211a at the isolation opening 202, to form a morphology as Figure 4B and Figure 5B shown..

[0083] In at least one embodiment of the present disclosure, the etching resistance of the material of the bottom portion 211b, the material of the main body portion 211a, and the material of the upper portion 212 increases in sequence. In this way, in the etching process (such as wet etching), the bottom portion 211b located at the bottom layer can be etched, so that the bottom portion 211b is side-etched at the light-transmitting opening 201 and thus blocked by the main body portion 211a.

[0084] For example, the upper portion 212, the main body portion 211a, and the bottom portion 211b can be sequentially made of titanium, aluminum, and molybdenum, so that the isolation structure 210 as shown in FIG. 5 can be formed. It should be noted that in the process of etching to form the isolation opening and the light-transmitting opening, dry etching (mainly deep etching) can be first used, and then wet etching (mainly side etching) can be used, so that the edge of the bottom portion 211b is not blocked by the main body portion 211a at the isolation opening, so that the bottom portion 211b can be used to connect the second electrode 222.

[0085] In at least one embodiment of the present disclosure, referring back to Figure 3A and Figure 3B , the display panel may further include a pixel defining layer 213. The pixel defining layer 213 is located between the isolation structure 210 and the substrate 100. The pixel defining layer 213 includes a plurality of pixel openings 203 corresponding to the isolation openings 202. The pixel openings 203 communicate with the corresponding isolation openings 202. The first electrode 221 is located between the pixel defining layer 213 and the substrate 100. The pixel openings 203 are used to limit the light-emitting devices 220 and expose the first electrode 221. The pixel openings 203 correspond to the isolation openings 202.

[0086] In at least one embodiment of the present disclosure, referring back to Figure 3A and Figure 3B, the pixel opening 203 corresponds to the isolation opening 202 one by one, and the orthographic projection of the light-transmitting opening 201 on the substrate 100 is located within the orthographic projection of the pixel defining layer 213 on the substrate 100, that is, in the area where the light-transmitting opening 201 is located, the pixel defining layer 213 is a continuous film layer. In the process of preparing the light-emitting device 220 in batches through the isolation structure 210, multiple etching processes will be performed. In this way, at the light-transmitting opening 201, the etching process will further etch the light-transmitting opening 201. By retaining the pixel defining layer 213 here, the underlying structure (such as the circuit structure in the substrate 100) can be protected during the etching process.

[0087] In at least one embodiment of the present disclosure, the pixel defining layer 213 is an inorganic film layer. In the process of preparing the light-emitting device 220 based on the isolation structure 210, the pixel defining layer 213 does not need a high thickness to accommodate the light-emitting device 220, which is conducive to the thin and light design of the display panel; in addition, the pixel defining layer 213 as an inorganic film layer can have a high bonding strength with the isolation structure 210 and the first electrode 221 to reduce the risk of the isolation structure 210 and the first electrode 221 falling off; in addition, the inorganic film layer has a high density and can more effectively block the intrusion of water, oxygen, etc., thereby improving the packaging effect of the display panel. Furthermore, when the pixel defining layer 213 is an inorganic layer, it can have a smaller thickness, thereby reducing the break at the edge of the pixel opening 203, so as to improve the film continuity of the second electrode 222 at this location, so as to reduce the impedance of the second electrode 222, thereby ensuring the display effect of the display panel.

[0088] In at least one embodiment of the present disclosure, it is possible to refer to Figure 3A and Figure 3B The display panel may further include a packaging structure 300, which may include a first packaging layer 310, which is located on a side of the light-emitting device 220 away from the substrate 100 and includes a plurality of packaging units 311 corresponding to the isolation openings 202, and the packaging units 311 cover the corresponding isolation openings 202. The light-emitting device 220 is prepared in batches based on different luminous colors, and the packaging unit 311 is used to protect the light-emitting device 220 during the preparation process, so the packaging unit is also prepared in batches.

[0089] For example, see again Figure 3A and Figure 3B, the edge of the packaging unit 311 extends to the side of the isolation structure 210 (e.g., the upper portion 212 included therein) away from the substrate 100, and the portion of the packaging unit located on the side of the isolation structure 210 (e.g., the upper portion 212 included therein) away from the substrate 100 is spaced from the isolation structure 210 (e.g., the upper portion 212 included therein) to form a suspended portion. The reason for the formation of the suspended portion is related to the process of preparing the light-emitting device 200 based on the isolation structure 210, and the details can be referred to the following about FIG. 8A to FIG. 8I The relevant descriptions in the illustrated embodiments are not repeated here.

[0090] In at least one embodiment of the present disclosure, it is possible to refer to Figure 3A and Figure 3B , the plurality of light emitting devices 220 are classified into a plurality of light emitting devices with different light emitting colors, and the light emitting devices 220 with different light emitting colors correspond to each other and the adjacent encapsulation units 311 are spaced apart from each other. The reason for forming the first encapsulation layer 310 under this structure is related to the process of preparing the light emitting device 200 based on the isolation structure 210, which can be specifically referred to in the following FIG. 8A to FIG. 8I The relevant descriptions in the illustrated embodiments are not repeated here.

[0091] In at least one embodiment of the present disclosure, Figure 6 As shown, the encapsulation structure 300 may further include a second encapsulation layer 320 and a third encapsulation layer 330 covering the first encapsulation layer 310 and the isolation structure 210, and the second encapsulation layer 320 is located between the first encapsulation layer 310 and the third encapsulation layer 330. For example, the first encapsulation layer 310 and the third encapsulation layer 330 are inorganic layers, and the inorganic layers have high density to isolate water and oxygen, and the second encapsulation layer 320 is an organic layer as a planarization layer, so as to have a large thickness to planarize the surface of the display panel, so as to facilitate the preparation of functional structures such as a touch structure, an optical film, and a cover plate on the encapsulation layer 300.

[0092] It should be noted that in the embodiments of the present disclosure, there is no restriction on the design area of ​​the first region, and the design can be performed according to the actual process requirements and the application scenario of the display panel.

[0093] For example, in some embodiments of the present disclosure, the entire display area can be designed as the first area 13. Under this design, the display panel can be used in scenes such as transparent display.

[0094] For example, in some other embodiments of the present disclosure, refer to Figure 1, the display area further includes a second area (the area within the display area 11 and outside the first area 13), the second area is located on at least one side of the first area 13, the light-transmitting opening 201 is located in the first area, and the light transmittance of the first area is greater than that of the second area. For example, the first area 13 is a light-transmitting area, and the second area is a non-light-transmitting area. Under this design, the display panel can be used in scenarios such as fingerprint recognition or under-screen camera.

[0095] In at least one embodiment of the present disclosure, as Figure 6 shown, the substrate 100 may include a substrate and a driving circuit layer located on the substrate. The driving circuit layer includes a plurality of pixel driving circuits located in the display area, and the display function layer is located on the side of the driving circuit layer away from the substrate. For example, the pixel driving circuit may include a plurality of transistors TFTs, capacitors, etc., and may be formed in various forms such as 2T1C (i.e., 2 transistors (TFTs) and 1 capacitor (C)), 3T1C, or 7T1C. The pixel driving circuit is connected to the light-emitting device 220 in the display function layer to control the on / off state and light-emitting brightness of the light-emitting device 200.

[0096] At least one embodiment of the present disclosure provides a method for manufacturing a display panel, as Figure 7 shown, the specific process of this manufacturing method can refer to the following steps S110 to S140.

[0097] S110, provide a substrate.

[0098] S120, form a plurality of first electrodes on the substrate.

[0099] S130, form an isolation structure on one side of the substrate. Among them, the isolation structure is formed with at least one light-transmitting opening and a plurality of isolation openings. The isolation structure includes a lower part facing the substrate and an upper part away from the substrate. The distance that the upper part extends along the edge of the lower part is the first spacing. The first spacing within the light-transmitting opening is greater than the first spacing within the isolation opening.

[0100] S140, form a light-emitting function layer and a second electrode in the isolation openings respectively. The first electrode, the light-emitting function layer, and the second electrode stacked at each isolation opening constitute a light-emitting device.

[0101] It should be noted that the light-emitting devices are manufactured in batches. After all the light-emitting devices are formed, the first spacing at the isolation openings is smaller than the first spacing at the light-transmitting openings.

[0102] In the display panel obtained by the manufacturing method of the above steps S110 to S140, by increasing the first spacing at the light-transmitting openings, light with a larger inclination angle can pass through the light-transmitting openings, thereby increasing the light transmittance of the display panel without affecting the arrangement mode (area, arrangement density, etc.) of the isolation openings. The structure of the display panel obtained by the manufacturing method can be as follows: Figure 3A or Figure 3B As shown, the specific process steps can be found in the following FIG. 8A to FIG. 8I The relevant descriptions in the illustrated embodiments are not repeated here.

[0103] In the method for preparing a display panel provided in at least one embodiment of the present disclosure, the orthographic projection of the surface of the lower portion facing away from the substrate on the substrate is located within the orthographic projection of the surface of the upper portion close to the substrate on the substrate, and the distance between the adjacent edges of the orthographic projections of the two is a first spacing, the orthographic projection of the lower portion on the substrate is located within the orthographic projection of the upper portion on the substrate, and the distance between the adjacent edges of the orthographic projections of the lower portion and the upper portion is a second spacing, and the second spacing located in the light-transmitting opening is greater than the second spacing located in the isolation opening. The structure of the display panel in the preparation method can refer to the relevant description in the aforementioned embodiments, and will not be repeated here.

[0104] It should be noted that, in the manufacturing process of the display panel, as the isolation structure at the light-transmitting opening is etched, while the first spacing in the light-transmitting opening increases, the second spacing in the light-transmitting opening also increases.

[0105] In some embodiments of the present disclosure, Figure 3A or Figure 3B In the structure shown, in the above process steps S110 to S140, the preparation method for forming the light-emitting device and the isolation structure may also include: after forming a plurality of first electrodes on the substrate, depositing a pixel defining material film layer covering the first electrodes; forming a first material layer and a second material layer stacked in sequence on the pixel defining material film layer, performing a composition process on the first material layer and the second material layer to form a lower part and an upper part respectively, and forming an isolation opening and a light-transmitting opening enclosed by the lower part and the upper part; patterning the pixel defining material film layer to form a pixel opening corresponding to the isolation opening; depositing and etching the light-emitting functional material layer and the second electrode in sequence at least twice, respectively, to form a light-emitting device at the isolation opening, respectively; wherein the number of side etchings of the side wall of the isolation structure at the light-transmitting opening is greater than the number of side etchings of the side wall in the isolation opening, the first spacing at the isolation opening is smaller than the first spacing at the light-transmitting opening, and the second spacing at the isolation opening is smaller than the second spacing at the light-transmitting opening.

[0106] Specifically, the process may include the following steps S210 to S260.

[0107] S210, after forming a plurality of first electrodes on a substrate, depositing a pixel defining material film layer covering the first electrodes.

[0108] S220, forming a first material layer and a second material layer stacked in sequence on the pixel defining material film layer, performing a composition process on the first material layer and the second material layer to form a lower portion and an upper portion respectively, and forming a first type of isolation opening and a light-transmitting opening enclosed by the lower portion and the upper portion, that is, in the process of forming the lower portion and the upper portion, a first type of isolation opening and a light-transmitting opening enclosed by the lower portion and the upper portion are formed.

[0109] S230 , patterning the pixel definition material film layer to form a pixel opening corresponding to the isolation opening.

[0110] S240, sequentially depositing a light-emitting functional material layer and a conductive material layer to cover the isolation structure, the first type of isolation openings and the light-transmitting openings.

[0111] S250, forming a packaging material layer on the side of the conductive material layer away from the substrate, and then performing a composition process on the light-emitting functional material layer, the conductive material layer and the packaging material layer to remove the light-emitting functional material layer, the conductive material layer and the packaging material layer outside the position of the first type of isolation opening, wherein the remaining light-emitting functional material layer forms a light-emitting functional layer, the remaining conductive material layer forms a second electrode, and the remaining packaging material layer forms a packaging unit.

[0112] S260, based on the process of the first type of isolation openings and the light-emitting devices therein, the second type of isolation openings and the third type of isolation openings are sequentially formed in the isolation structure, and light-emitting devices are respectively formed in the second type of isolation openings and the third type of isolation openings, and in the composition process of forming the second type of isolation openings and the third type of isolation openings, the isolation structure is etched on the side where the light-transmitting openings are located, so that after the second type of isolation openings and the third type of isolation openings are formed, the first spacing at the isolation openings is smaller than the first spacing at the light-transmitting openings, and the second spacing at the isolation openings is smaller than the second spacing at the light-transmitting openings.

[0113] In the process of the above steps S210 to S260, the light-emitting devices are prepared in batches, and the isolation openings corresponding to the light-emitting devices (including the first type of isolation openings, the second type of isolation openings, and the third type of isolation openings) are also prepared in batches. Therefore, the isolation structure is etched only once at each isolation opening, and the isolation structure is etched at least three times at the light-transmitting opening. Therefore, compared with the isolation opening, the side etching of the isolation structure at the light-transmitting opening will be more serious, so that the first spacing at the isolation opening is smaller than the first spacing at the light-transmitting opening, and the second spacing at the isolation opening is smaller than the second spacing at the light-transmitting opening. The structure of the display panel obtained by the preparation method can be as follows: Figure 3A or Figure 3B shown.

[0114] In some embodiments of the present disclosure, Figure 5A or Figure 5B In the structure shown, in the above process steps S110 to S140, the preparation method for forming the light-emitting device and the isolation structure may also include: after forming a plurality of first electrodes on the substrate, depositing a pixel defining material film layer covering the first electrodes; forming a first material layer and a second material layer stacked in sequence on the pixel defining material film layer, performing a composition process on the first material layer and the second material layer to form a bottom, a main body and an upper part respectively, and forming an isolation opening and a light-transmitting opening surrounded by the bottom, the main body and the upper part, and the bottom and the main body constitute the lower part; patterning the pixel defining material film layer to form a pixel opening corresponding to the isolation opening; sequentially depositing and etching the light-emitting functional material layer and the second electrode respectively twice to form a light-emitting device at the isolation opening respectively; wherein the number of side etchings of the side wall of the isolation structure at the light-transmitting opening is greater than the number of side etchings of the side wall in the isolation opening, the first spacing at the isolation opening is smaller than the first spacing at the light-transmitting opening, and the second spacing at the isolation opening is smaller than the second spacing at the light-transmitting opening.

[0115] Specifically, the process may include the following process steps S310 to S360 .

[0116] S310, after forming a plurality of first electrodes on a substrate, depositing a pixel defining material film layer covering the first electrodes.

[0117] S320, forming a first conductive material layer, a second conductive material layer and a third material layer stacked in sequence on the pixel defining material film layer, performing a composition process on the first conductive material layer, the second conductive material layer and the third material layer to form a bottom, a main body and an upper part respectively, and forming a first type of isolation opening and a light-transmitting opening enclosed by the bottom, the main body and the upper part, and the bottom and the main body constitute the lower part, that is, the process of forming an isolation structure and a light-emitting device, including: in the process of forming the bottom, the main body and the upper part, forming a first type of isolation opening and a light-transmitting opening enclosed by the bottom, the main body and the upper part.

[0118] S330 , patterning the pixel defining material film layer to form pixel openings corresponding to the first type isolation openings respectively.

[0119] S340, depositing a light-emitting functional material layer and a conductive material layer in sequence to cover the isolation structure, the first type of isolation opening and the light-transmitting opening.

[0120] S350, forming a packaging material layer on the side of the conductive material layer away from the substrate, and then performing a composition process on the light-emitting functional material layer, the conductive material layer and the packaging material layer to remove the light-emitting functional material layer, the conductive material layer and the packaging material layer outside the position of the first type of isolation opening, wherein the remaining light-emitting functional material layer forms a light-emitting functional layer, the remaining conductive material layer forms a second electrode, and the remaining packaging material layer forms a packaging unit.

[0121] S360, based on the process of forming the first type of isolation opening and the light-emitting device therein, a second type of isolation opening and a third type of isolation opening are sequentially formed in the isolation structure, and light-emitting devices are respectively formed in the second type of isolation opening and the third type of isolation opening, and in the composition process of forming the second type of isolation opening and the third type of isolation opening, the body part and the bottom are etched from one side of the light-transmitting opening, so that after the second type of isolation opening and the third type of isolation opening are formed, in the light-transmitting opening, the orthographic projection of the edge of the bottom on the substrate coincides with the orthographic projection of the body part on the substrate (such as Figure 5B Alternatively, the orthographic projection of the bottom edge on the substrate is within the orthographic projection of the main body on the substrate, so that after forming the second type of isolation openings and the third type of isolation openings, the first spacing at the isolation openings is smaller than the first spacing at the light-transmitting openings, and the second spacing at the isolation openings is smaller than the second spacing at the light-transmitting openings.

[0122] In the process of the above steps S310 to S360, the light-emitting devices are prepared in batches, and the isolation openings corresponding to the light-emitting devices (including the first type of isolation openings, the second type of isolation openings, and the third type of isolation openings) are also prepared in batches. Therefore, the isolation structure is only etched once at each isolation opening, and the isolation structure is etched at least three times at the light-transmitting opening, and the bottom will be subjected to more severe side etching, so that the bottom is blocked by the main body at the light-transmitting opening, so that the first spacing at the isolation opening can be smaller than the first spacing at the light-transmitting opening, and the second spacing at the isolation opening can be smaller than the second spacing at the light-transmitting opening. The structure of the display panel obtained by the preparation method can be as follows: Figure 5A or Figure 5B shown.

[0123] In at least one embodiment of the present disclosure, in the process of forming the second type of isolation opening and the third type of isolation opening, the method of etching the first conductive material layer used to form the bottom includes wet etching, and the etching rate of the wet etching material on the first conductive material layer, the second conductive material layer and the third material layer decreases in sequence. In this way, during the wet etching process, the bottom formed by the first conductive material layer can be side-etched to a greater extent relative to the main body formed by the second conductive material layer, so that the edge of the bottom is blocked by the main body. The specific process of this process can be referred to as follows FIG. 8A to FIG. 8I The process shown.

[0124] Next, combine FIG. 8A to FIG. 8I right Figure 5A The preparation process of the display panel shown is described to intuitively demonstrate the principle that the isolation structure can increase the pixel arrangement density PPI and how to increase the transmittance at the light-transmitting opening.

[0125] like Fig. 8A As shown, a substrate 100 is provided and first electrodes 221 arranged in an array are formed on the substrate 100 ; a pixel defining material film layer 213 a (eg, an inorganic material film layer) is deposited on the substrate 100 formed with the first electrodes.

[0126] like Figure 8B As shown, a first conductive material layer 2112 , a second conductive material layer 2111 and a third material layer 212 a are sequentially formed on the pixel defining material film layer 213 a .

[0127] like Figure 8C As shown, the first conductive material layer 2112, the second conductive material layer 2111 and the third material layer 212a are subjected to a composition process so that the first conductive material layer 2112, the second conductive material layer 2111 and the third material layer 212a respectively form a bottom 211b, a main body 211a and an upper part 212, the bottom 211b and the main body 211a constitute the lower part 211, the lower part 211 and the upper part 212 constitute an isolation structure 210, and the lower part 211 and the upper part 212 enclose a light-transmitting opening 201 and a first type of isolation opening 202a.

[0128] It should be noted that when executing Figure 8C In the process stage shown, in the light-transmitting opening 201 and the first type isolation opening 202 a , the distances from the orthographic projection of the edge of the bottom 211 b on the substrate 100 to the orthographic projection of the edge of the upper portion 212 on the substrate 100 are equal.

[0129] In an embodiment of the present disclosure, the patterning process may be a photolithography process, which may include, for example, coating a photoresist on a structure layer to be patterned, exposing the photoresist using a mask, developing the exposed photoresist to obtain a photoresist pattern, etching the structure layer using the photoresist pattern (optionally wet etching or dry etching), and then optionally removing the photoresist pattern. It should be noted that, in the case where the material of the structure layer (such as the photoresist pattern 400 described below) includes photoresist, the structure layer may be directly exposed through a mask to form a desired pattern.

[0130] like Fig.8DAs shown, the pixel defining material film layer 213a is patterned to form a pixel defining layer 213 (the plane shape is a grid shape), the pixel defining layer 213 includes pixel openings 203 corresponding to the first type isolation openings 202a respectively, and the pixel defining layer 213 covers the gaps between adjacent first electrodes, so that the plane shape of the pixel defining layer 213 is a grid shape.

[0131] like Fig. 8E As shown, a light-emitting functional material layer and a conductive material layer covering the isolation structure 210, the light-transmitting opening 201 and the first type of isolation opening 202a are evaporated on the substrate 100, and the portion of the light-emitting functional material layer located in the first type of isolation opening 202a and the light-transmitting opening 201 forms a light-emitting functional layer, and the portion of the conductive material layer located in the isolation opening 202 and the light-transmitting opening 201 forms a second electrode, so that a light-emitting device 220 (first type of light-emitting device R) is formed in each first type of isolation opening 202a of the isolation structure 210. The evaporation in this process does not use a fine mask plate, so the evaporated material is also deposited on the upper part 212. For example, the evaporated light-emitting functional layer can emit red light (R), that is, at this stage, a light-emitting device 220 (first type of light-emitting device R) emitting red light is formed in each light-transmitting opening 201 and the isolation opening 202 of the isolation structure 210. It should be noted that the light-emitting device 220 at the light-transmitting opening 201 lacks a first electrode.

[0132] like Fig. 8E As shown, after the first type light emitting device R is formed, a packaging material layer 310 a is deposited to cover the first type light emitting device R. The packaging material layer 310 a will cover the entire display area at this stage.

[0133] like Fig.8F As shown, a photoresist is formed (eg, coated) on the packaging material layer 310a and then patterned to form a photoresist pattern 400, which only covers the first type isolation opening 202a (and can also cover the area near the first type isolation opening 202a).

[0134] like Figure 8G As shown, the surface of the display panel is etched using the photoresist pattern 400 as a mask to remove the encapsulation material layer 310a, the second electrode and the light-emitting functional layer not covered by the photoresist pattern 700; then the remaining photoresist pattern 400 is removed. The remaining part of the encapsulation material layer 310a forms an encapsulation unit 311.

[0135] like Figure 8HAs shown, continue the patterning process for the isolation structure 210 to form a second type of isolation opening 202b in the isolation structure 210; then perform a patterning process on the pixel defining layer 213 to form pixel openings 203 corresponding to the second type of isolation openings 202b respectively. During this process, the isolation structure 210 will be etched laterally at the light-transmitting opening 201 to increase the sizes of the first spacing and the second spacing in the light-transmitting opening 201.

[0136] As Figure 8I shown, repeat the above FIG. 8E to FIG. 8H shown process to form a second type of light-emitting device G at the second type of isolation opening 202b and form a packaging unit 311 covering the second type of light-emitting device G.

[0137] Continue to repeat the above FIG. 8E to FIG. 8H shown process steps to further form a third type of isolation opening and form a third type of light-emitting device B in the third type of isolation opening, and form a packaging unit 311 covering the third type of light-emitting device G, thereby obtaining a display panel as Figure 5A shown. It should be noted that all the packaging units 311 together constitute the first packaging layer 310.

[0138] It should be noted that the preparation sequence of the light-emitting devices 220 that emit red light, green light, and blue light can be designed according to actual requirements, and the embodiments of this announcement do not limit this.

[0139] At least one embodiment of the present disclosure provides a display device, which may include the display panel in the above embodiments. In addition, when the first region is an identification region, the display device may include an identification device, and the orthographic projection of the identification device on the substrate at least partially overlaps with the first region.

[0140] For example, in some embodiments of the present disclosure, the identification device includes at least one fingerprint recognition sensor. For example, the fingerprint recognition sensor may be disposed on a side of the substrate facing away from the display functional layer, or the fingerprint recognition sensor may also be disposed within the substrate.

[0141] For example, in some other embodiments of the present disclosure, the identification device may be a camera, and the camera is located on a side of the substrate facing away from the display functional layer.

[0142] For example, in the embodiments of the present disclosure, the display device may be any product or component with a display function such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a laptop computer, a navigator, etc.

[0143] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0144] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

[0145] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, etc. made within the spirit and principles of this specification should be included in the protection scope of this specification.

Claims

1. A display panel, characterized in that: include: substrate; An isolation structure, located on the substrate and defining at least one light-transmitting opening and a plurality of isolation openings; as well as a plurality of light emitting devices, wherein the light emitting devices are at least partially located within the isolation opening; The isolation structure includes a lower part and an upper part arranged on the lower part, the distance that the upper part extends along the edge of the lower part is a first spacing, and the first spacing in the light-transmitting opening is greater than the first spacing in the isolation opening.

2. The display panel according to claim 1, characterized in that: The orthographic projection of the lower surface facing away from the substrate on the substrate is located within the orthographic projection of the upper surface close to the substrate on the substrate, and the distance between adjacent edges of the orthographic projections of the two is the first spacing.

3. The display panel according to claim 2, characterized in that: The orthographic projection of the lower portion on the substrate is located within the orthographic projection of the upper portion on the substrate, and the distance between adjacent edges of the orthographic projections of the lower portion and the upper portion is a second spacing, and the second spacing located in the light-transmitting opening is greater than the second spacing located in the isolation opening.

4. The display panel according to claim 3, characterized in that: The lower portion further includes a body portion and a bottom portion, wherein the bottom portion is located between the body portion and the substrate.

5. The display panel according to claim 4, characterized in that: The orthographic projection of the bottom on the substrate is located within the orthographic projection of the upper portion on the substrate, and the orthographic projection of the main body on the substrate is located within the orthographic projection of the bottom on the substrate, in the isolation opening, the distance between the orthographic projection of the edge of the bottom on the substrate and the orthographic projection of the edge of the upper portion on the substrate is the second distance, and the distance between adjacent edges of the orthographic projections of the main body and the upper portion is the third distance; Preferably, the third spacing in the light-transmitting opening is greater than or equal to the third spacing in the isolation opening.

6. The display panel according to claim 4, characterized in that: The etching resistance of the material of the bottom, the material of the main body and the material of the upper part increases in sequence; Preferably, the material of the bottom, the material of the main body and the material of the upper part are molybdenum, aluminum and titanium respectively.

7. The display panel according to any one of claims 2 to 5, characterized in that: The light emitting device comprises a first electrode, a light emitting functional layer and a second electrode sequentially stacked on the substrate, wherein the light emitting functional layer and the second electrode are at least partially located in the corresponding isolation opening; Preferably, a plurality of the first electrodes are arranged at intervals, and the light-transmitting openings are respectively arranged between two adjacent first electrodes.

8. The display panel according to claim 7, characterized in that: The lower portion is a conductive structure, and the second electrode is connected to the lower portion.

9. The display panel according to claim 7, characterized in that: Also included is a pixel defining layer, wherein the pixel defining layer is located between the isolation structure and the substrate, the pixel defining layer includes a plurality of pixel openings corresponding to the isolation openings, and the pixel openings are connected to the corresponding isolation openings; Wherein, the first electrode is located between the pixel defining layer and the substrate, and the pixel opening limits the light-emitting device and exposes the first electrode; Preferably, the pixel defining layer is an inorganic film layer.

10. The display panel according to claim 9, characterized in that: The pixel openings correspond to the isolation openings one by one, and the orthographic projection of the light-transmitting openings on the substrate is located within the orthographic projection of the pixel defining layer on the substrate.

11. The display panel according to claim 1, characterized in that: It also includes a first packaging layer, wherein the first packaging layer is located on a side of the light-emitting device away from the substrate and includes a plurality of packaging units corresponding to the isolation openings one by one, and the packaging units cover the corresponding isolation openings.

12. The display panel according to claim 11, characterized in that: The edge of the packaging unit extends to a side of the isolation structure away from the substrate, and a portion of the packaging unit located on a side of the isolation structure away from the substrate is spaced from the isolation structure to form a suspended portion.

13. The display panel according to claim 11, characterized in that: The plurality of light emitting devices are classified into a plurality of light emitting devices with different light emission colors, The light emitting devices with different light emission colors correspond to each other and the adjacent packaging units are spaced apart from each other.

14. The display panel according to claim 11, characterized in that: It also includes a second encapsulation layer and a third encapsulation layer covering the first encapsulation layer and the isolation structure, wherein the second encapsulation layer is located between the first encapsulation layer and the third encapsulation layer; Preferably, the first encapsulation layer and the third encapsulation layer are inorganic layers, and the second encapsulation layer is an organic layer.

15. The display panel according to claim 1, characterized in that: It also includes a display area, wherein the display area includes a first area and a second area, the second area is located on at least one side of the first area, the transmittance of the first area is greater than the transmittance of the second area, and the light-transmitting opening is located in the first area.

16. A method for preparing a display panel, characterized in that: include: providing a substrate; forming a plurality of first electrodes on the substrate; An isolation structure is formed on one side of the substrate, wherein the isolation structure is formed with at least one light-transmitting opening and a plurality of isolation openings, the isolation structure includes a lower portion facing the substrate and an upper portion away from the substrate, the distance that the upper portion extends along the edge of the lower portion is a first spacing, and the first spacing in the light-transmitting opening is greater than the first spacing in the isolation opening; A light-emitting functional layer and a second electrode are formed in the isolation openings respectively, and the first electrode, the light-emitting functional layer and the second electrode stacked at each isolation opening constitute a light-emitting device; Wherein, after all the light-emitting devices are formed, the first spacing at the isolation opening is smaller than the first spacing at the light-transmitting opening.

17. The preparation method according to claim 16, characterized in that: The orthographic projection of the lower surface facing away from the substrate on the substrate is located within the orthographic projection of the upper surface close to the substrate on the substrate, and the distance between adjacent edges of the orthographic projections of the two is the first spacing, The orthographic projection of the lower portion on the substrate is located within the orthographic projection of the upper portion on the substrate, and the distance between adjacent edges of the orthographic projections of the lower portion and the upper portion is a second spacing, and the second spacing located in the light-transmitting opening is greater than the second spacing located in the isolation opening.

18. The preparation method according to claim 17, characterized in that: The step of forming the isolation structure and the light emitting device on the substrate comprises: After forming a plurality of first electrodes on the substrate, depositing a pixel defining material film layer covering the first electrodes; Forming a first material layer and a second material layer stacked in sequence on the pixel defining material film layer, performing a composition process on the first material layer and the second material layer to form the lower portion and the upper portion respectively, and forming an isolation opening and the light-transmitting opening enclosed by the lower portion and the upper portion; patterning the pixel defining material film layer to form a pixel opening corresponding to the isolation opening; Sequentially depositing and etching a light-emitting functional material layer and a second electrode at least twice to form the light-emitting devices at the isolation openings respectively; The number of side etchings of the side wall of the isolation structure at the light-transmitting opening is greater than the number of side etchings of the side wall in the isolation opening, the first spacing at the isolation opening is smaller than the first spacing at the light-transmitting opening, and the second spacing at the isolation opening is smaller than the second spacing at the light-transmitting opening; Preferably, the process of forming the isolation structure and the light-emitting device includes: In the process of forming the lower portion and the upper portion, a first type of isolation opening and the light-transmitting opening formed by the lower portion and the upper portion are formed; Patterning the pixel defining material film layer to form pixel openings corresponding to the first type of isolation openings respectively; Depositing a light-emitting functional material layer and a conductive material layer in sequence to cover the isolation structure, the first type of isolation opening and the light-transmitting opening; forming an encapsulation material layer on a side of the conductive material layer away from the substrate, and then performing a patterning process on the light-emitting functional material layer, the conductive material layer and the encapsulation material layer to remove the light-emitting functional material layer, the conductive material layer and the encapsulation material layer except for the location of the first type of isolation opening, wherein the remaining light-emitting functional material layer forms the light-emitting functional layer, the remaining conductive material layer forms the second electrode, and the remaining encapsulation material layer forms an encapsulation unit; and Based on the process of the first type of isolation openings and the light-emitting devices therein, the second type of isolation openings and the third type of isolation openings are sequentially formed in the isolation structure, and the light-emitting devices are respectively formed in the second type of isolation openings and the third type of isolation openings, and in the composition process of forming the second type of isolation openings and the third type of isolation openings, the isolation structure is etched on the side where the light-transmitting opening is located, so that after the second type of isolation openings and the third type of isolation openings are formed, the first spacing at the isolation openings is smaller than the first spacing at the light-transmitting openings, and the second spacing at the isolation openings is smaller than the second spacing at the light-transmitting openings.

19. The preparation method according to claim 17, characterized in that: The step of forming the isolation structure and the light emitting device on the substrate comprises: After forming a plurality of first electrodes on the substrate, depositing a pixel defining material film layer covering the first electrodes; Forming a first material layer and a second material layer stacked in sequence on the pixel defining material film layer, performing a composition process on the first material layer and the second material layer to form a bottom, the body portion and the upper portion respectively, and forming an isolation opening and the light-transmitting opening surrounded by the bottom, the body portion and the upper portion, wherein the bottom and the body portion constitute the lower portion; patterning the pixel defining material film layer to form a pixel opening corresponding to the isolation opening; Sequentially depositing and etching a light-emitting functional material layer and a second electrode at least twice to form the light-emitting devices at the isolation openings respectively; The number of side etchings of the side wall of the isolation structure at the light-transmitting opening is greater than the number of side etchings of the side wall in the isolation opening, the first spacing at the isolation opening is smaller than the first spacing at the light-transmitting opening, and the second spacing at the isolation opening is smaller than the second spacing at the light-transmitting opening; Preferably, the process of forming the isolation structure and the light-emitting device includes: In the process of forming the bottom, the body and the upper part, a first type of isolation opening and the light-transmitting opening formed by the bottom, the body and the upper part are formed; Patterning the pixel defining material film layer to form pixel openings corresponding to the first type of isolation openings respectively; Depositing a light-emitting functional material layer and a conductive material layer in sequence to cover the isolation structure, the first type of isolation opening and the light-transmitting opening; forming an encapsulation material layer on a side of the conductive material layer away from the substrate, and then performing a patterning process on the light-emitting functional material layer, the conductive material layer and the encapsulation material layer to remove the light-emitting functional material layer, the conductive material layer and the encapsulation material layer except for the location of the first type of isolation opening, wherein the remaining light-emitting functional material layer forms the light-emitting functional layer, the remaining conductive material layer forms the second electrode, and the remaining encapsulation material layer forms an encapsulation unit; and Based on the process of forming the first type of isolation openings and the light-emitting devices therein, the second type of isolation openings and the third type of isolation openings are sequentially formed in the isolation structure, and the light-emitting devices are respectively formed in the second type of isolation openings and the third type of isolation openings, and in the composition process of forming the second type of isolation openings and the third type of isolation openings, the main body and the bottom are etched from one side of the light-transmitting opening, so that after the second type of isolation openings and the third type of isolation openings are formed, in the light-transmitting opening, the orthographic projection of the edge of the bottom on the substrate coincides with the orthographic projection of the main body on the substrate, or the orthographic projection of the edge of the bottom on the substrate is located within the orthographic projection of the main body on the substrate, so that after the second type of isolation openings and the third type of isolation openings are formed, the first spacing at the isolation opening is smaller than the first spacing at the light-transmitting opening, and the second spacing at the isolation opening is smaller than the second spacing at the light-transmitting opening.

20. A display device, characterized in that: A display panel comprising any one of claims 1 to 15, or a display panel obtained by the preparation method according to any one of claims 16 to 19.

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