Array substrate, manufacturing method and display device

Abstract

The invention discloses an array substrate, a manufacturing method and a display device. The array substrate of one embodiment comprises a display area and a non-display area at least surrounding part of the display area, and the non-display area comprises a fan-out area, a bending area and a frame area; the fan-out area comprises a plurality of grooves distributed in the second direction, each groove extends in the first direction perpendicular to the second direction, the second direction is the direction from the fan-out area to the bending area, and the array substrate further comprises a substrate; the connecting line is connected with a signal line of the display area, the connecting line sequentially passes through one or more of the frame area, the fan-out area and the bending area, and the connecting line located in the fan-out area is arranged on the surface of the side, away from the substrate, of the groove; the insulating structures are located between adjacent connecting lines of at least part of the fan-out area, and the extending direction of the insulating structures is parallel to the extending direction of the connecting lines at the corresponding positions.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and more specifically, to an array substrate, a manufacturing method and a display device. Background Art

[0002] OLED display panels are mainly composed of display area, fan-out area, and bending area. Since the metal wiring of OLED display panels is densely arranged, a large number of metal wirings for transmitting signals are also distributed in the grooves of the fan-out area. However, due to the difference in depth inside and outside the grooves and the influence of existing manufacturing processes, insufficient exposure may cause metal residue at the bottom of the grooves. The residual metal may overlap adjacent metal wirings, causing signal line short circuit problems. Summary of the invention

[0003] An object of the present invention is to provide an array substrate, a manufacturing method and a display device to solve at least one of the problems existing in the prior art.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions:

[0005] A first aspect of the present invention provides an array substrate, the array substrate comprising a display area and a non-display area surrounding at least a portion of the display area.

[0006] The non-display area includes: a fan-out area located at one end of the non-display area, a bending area located at a side of the fan-out area away from the display area, and a frame area located at a corresponding position of an end other than the end where the fan-out area is located;

[0007] The fan-out region includes a plurality of grooves arranged in a second direction, each groove extending along a first direction perpendicular to the second direction, and the second direction is a direction from the fan-out region to the bending region,

[0008] The array substrate further includes:

[0009] substrate;

[0010] a connection line connected to a signal line of the display area, the connection line sequentially passing through one or more of the frame area, the fan-out area and the bending area, and the connection line located in the fan-out area is arranged on a surface of the groove away from the substrate; and

[0011] An insulating structure is located between at least part of adjacent connecting lines in the fan-out region, and an extending direction of the insulating structure is parallel to an extending direction of the connecting lines at corresponding positions.

[0012] In an optional embodiment, the orthographic projection of the plurality of grooves on the substrate includes a first groove area, a second groove area and a third groove area arranged in sequence in the second direction, and the first groove area is closer to the display area than the third groove area;

[0013] The fan-out region includes an extension portion extending from the end of the display region toward the groove, wherein the orthographic projection of the extension portion on the substrate ends at a boundary of the first groove region close to the display region;

[0014] The array substrate further comprises a plurality of isolation columns arranged along a second direction on the substrate of the fan-out region, wherein:

[0015] The first groove area corresponds to the area between the end of the extension portion and the isolation column closest to the display area.

[0016] The second groove region corresponds to the region between adjacent isolation pillars;

[0017] The third groove region corresponds to a region between the isolation column closest to the bending region and an end of the bending region close to the display region.

[0018] The insulating structure is distributed in one or more of the first tub region, the second tub region, and the third tub region.

[0019] In an optional embodiment, the connecting line includes a longitudinal routing portion extending along the second direction,

[0020] The orthographic projection of the longitudinal routing portion on the substrate is located in one or more of the first slot area, the second slot area and the third slot area.

[0021] The insulating structure comprises a first insulating column arranged between adjacent longitudinal wiring portions, wherein the first insulating column extends along a second direction.

[0022] The length of the first insulating column in the second direction is less than or equal to the length of the groove region where the first insulating column is located in the second direction.

[0023] In an optional embodiment, the connecting line further includes a transverse wiring portion extending along the first direction, and a first end of the transverse wiring portion is connected to a second end of the longitudinal wiring portion.

[0024] The insulating structure includes a second insulating column arranged between adjacent transverse wiring portions, wherein the second insulating column extends along a first direction.

[0025] The orthographic projection of the lateral routing portion on the substrate is located in one or more of the first slot area and the third slot area.

[0026] The length of the second insulating column in the first direction is less than or equal to the length of the horizontal wiring portion at a position corresponding to the first insulating column in the first direction.

[0027] In an optional embodiment, the connecting line further includes a fan-out routing portion, a first end of the fan-out routing portion is connected to a second end of the lateral routing portion, and the fan-out routing portion forms an inclined angle with the first direction or the second direction in an extension direction of an orthographic projection of the substrate,

[0028] The insulating structure includes a third insulating column arranged between adjacent fan-out wiring portions, wherein the extension direction of the third insulating column is the same as the extension direction of the fan-out wiring portion.

[0029] The orthographic projection of the fan-out routing portion on the substrate is located in one or more of the first slot area, the second slot area, and the third slot area.

[0030] In an optional embodiment, when the fan-out routing portion of the connection line farthest from the display area and the orthographic projection of the first groove area on the substrate do not overlap, the dimension of the display area from the end of the bending area close to one side of the display area is the first frame dimension;

[0031] When the fan-out routing portion of some connecting lines and the orthographic projection of the first groove area on the substrate have overlapping projections, the dimension of the display area from the end of the bending area close to one side of the display area is the second frame dimension;

[0032] The first frame size is larger than the second frame size.

[0033] In an optional embodiment, the extension portion includes a fan-out flat layer located on the substrate, and the fan-out flat layer includes a plurality of flat film layers stacked;

[0034] The isolation column material layer of the isolation column is arranged in the same layer as one or more layers of the flat film layer of the fan-out flat layer;

[0035] The bending region includes a plurality of stacked bending flat layers located on the substrate, wherein the bending flat layers are arranged in the same layer as one or more layers of the flat film layers of the fan-out flat layer;

[0036] The connection line is located at one or more surfaces of the fan-out flat layer, the isolation column material layer and the bending flat layer away from the substrate.

[0037] In an optional embodiment, the fan-out flat layer includes:

[0038] a first planar layer on the substrate;

[0039] A second flat layer located on a surface of the first flat layer away from the substrate;

[0040] A third flat layer is located on a surface of the second flat layer away from the substrate.

[0041] In an optional embodiment, the insulating column material layer of the insulating structure is arranged in the same layer as one or more of the first flat layer, the second flat layer, and the third flat layer;

[0042] or

[0043] The thickness of the second planar layer is greater than that of the first planar layer and greater than that of the third planar layer, and the insulating column material layer of the insulating structure is disposed in the same layer as the second planar layer.

[0044] A second aspect of the present invention provides a display device, comprising the array substrate described in the first aspect of the present invention.

[0045] A third aspect of the present invention provides a method for manufacturing an array substrate, the method comprising:

[0046] forming a flat film layer on a substrate;

[0047] Grooving the flat film layer at the position corresponding to the bending area to form grooves arranged in the second direction, each groove extending along a first direction perpendicular to the second direction, and the second direction is the direction from the fan-out area to the bending area;

[0048] Forming an insulating column material layer of an insulating structure on the substrate in the bending region;

[0049] forming a signal line in a display area;

[0050] A plurality of connecting lines are formed in a non-display area at least surrounding a portion of the display area, a fan-out area located on one side of the non-display area, a bending area connected to the fan-out area, and a binding area bound to the bending area. One end of the connecting line is electrically connected to the signal line, and after passing through the non-display area, the fan-out area and the bending area in sequence, it is arranged corresponding to the binding terminal of the binding area. The connecting line located in the bending area is arranged in the groove wall of the groove. The insulating structure is between at least part of adjacent connecting lines, and the extension direction of the insulating structure is parallel to the extension direction of the connecting line at the corresponding position.

[0051] The beneficial effects of the present invention are as follows:

[0052] The embodiment of the present invention designs the layer structure at the groove position of the fan-out area, and arranges an insulating structure between the connecting wires in the groove of the fan-out area. The extension direction of the insulating structure is the same as the extension direction of the connecting wire. The insulating structure is used to insulate adjacent connecting wires in the extension direction, thereby avoiding poor overlap of multiple connecting wires arranged in the groove with tight space, and avoiding poor overlap of the connecting wires arranged in the groove due to metal residue, thereby improving the product yield of the array substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] The specific implementation modes of the present invention are further described in detail below in conjunction with the accompanying drawings.

[0054] Figure 1 A schematic diagram showing a defect in which metal wiring in a groove in the related art overlaps;

[0055] Figure 2 A schematic diagram showing a top view of the structure of an array substrate according to an embodiment of the present invention;

[0056] Figure 3 Show Figure 2 A schematic diagram of the distribution of each slot area under the illustrated embodiment;

[0057] Figure 4 Show Figure 3 A schematic diagram of a structure in which an insulating structure is arranged in each slot area under the illustrated embodiment;

[0058] Figure 5 A schematic diagram showing a top view of the structure of a bending area and a fan-out area according to an embodiment of the present invention;

[0059] Figure 6 Show Figure 5 The insulating structure in the illustrated embodiment is a top view distribution diagram of the first insulating column;

[0060] Figure 7 Show Figure 5 A schematic diagram of a layer structure in which the first insulating column is located in the first groove region in the illustrated embodiment;

[0061] Figure 8 Show Figure 5 A schematic diagram of a layer structure in which the first insulating column is located in the second slot region or the third slot region in the illustrated embodiment;

[0062] Fig. 9 Shown Figure 5 A schematic diagram of the distribution of each slot area under the illustrated embodiment;

[0063] Fig.10 A schematic diagram showing a top view of an array substrate according to another embodiment of the present invention;

[0064] Fig.11 Show Fig.10The lower insulating structure of the illustrated embodiment is a top view distribution diagram of the second insulating pillar;

[0065] Fig.12 Show Fig.11 An example of an insulating structure shown is a schematic diagram of a layer structure of a second insulating column;

[0066] Fig.13 Show Fig.11 An example of an insulating structure shown is a schematic diagram of a layer structure of a second insulating column;

[0067] Fig.14 Show Fig.10 The lower insulating structure of the illustrated embodiment is a top view schematic diagram of the distribution of third insulating columns. DETAILED DESCRIPTION

[0068] In order to explain the present invention more clearly, the present invention is further described below in conjunction with embodiments and drawings. Similar components in the drawings are represented by the same reference numerals. It should be understood by those skilled in the art that the content specifically described below is illustrative rather than restrictive, and the protection scope of the present invention should not be limited thereto.

[0069] The OLED display panel mainly includes a display area and a non-display area. The non-display area includes a fan-out area and a bending area. Since the metal wiring of the OLED display panel is densely arranged, such as Figure 1 As shown, even in the groove 30' of the fan-out area SC, a large number of metal traces 20' for transmitting signals are distributed. However, due to the difference in depth between the inner and outer sides of the groove 30' and the influence of the existing manufacturing process, insufficient exposure may easily lead to metal residue at the bottom of the groove 30'. The residual metal may overlap the adjacent metal traces 20', causing the problem of signal line short circuit.

[0070] In view of this, the present invention proposes an array substrate, a manufacturing method and a display device to solve the above problems.

[0071] The first embodiment of the present invention provides an array substrate, such as Figure 2 , Figure 5 , Fig.10 and Fig.14 As shown, the array substrate includes a display area AA and a non-display area NA surrounding at least a portion of the display area AA;

[0072] The non-display area NA includes a fan-out area SC located at one end of the non-display area, a bending area WZ located at a side of the fan-out area SC away from the display area, and a frame area NA01 located at a corresponding position of an end other than the end where the fan-out area SC is located.

[0073] The fan-out area SC includes a plurality of grooves 30 arranged in a second direction to block water vapor. Each groove 30 extends along a first direction perpendicular to the second direction. The second direction is a direction from the fan-out area SC to the bending zone WZ.

[0074] In the embodiment of the present invention, Figure 2 to Figure 14 As shown, the array substrate further includes:

[0075] Substrate 10;

[0076] A connection line 20 connected to the signal line 60 of the display area AA, the connection line 20 sequentially passes through the frame area NA01, the fan-out area SC and one or more of the bending areas, and the connection line 20 located in the fan-out area SC is arranged on the surface of the groove 30 away from the substrate 10;

[0077] The insulating structure 50 ( 51 , 52 , 53 ) is located between at least part of the adjacent connecting lines 20 in the fan-out region SC, and the extending direction of the insulating structure 50 is parallel to the extending direction of the connecting line 20 at the corresponding position.

[0078] like Figure 2 As shown, the array substrate also includes a driving board 70 located on the side of the bending zone WZ away from the display area AA. The driving board 70 is electrically connected to the bending zone WZ, and is fixed to the backlight side of the array substrate after being folded by the bending zone WZ.

[0079] The embodiment of the present invention designs the structure in the groove 30 of the fan-out area SC, and arranges an insulating structure 50 between the connecting wires 20 in the groove 30 of the fan-out area SC. The extension direction of the insulating structure 50 is the same as the extension direction of the connecting wire 20. The insulating structure 50 is used to insulate adjacent connecting wires 20 in the extension direction, thereby avoiding poor overlap of multiple connecting wires 20 arranged in the groove 30 with limited space, and avoiding poor overlap of the connecting wires 20 arranged in the groove due to metal residue, thereby improving the product yield of the array substrate.

[0080] like Figure 3 3a, 3b and 3c show Figure 2 The distribution diagram of the groove 30 and each groove area under the embodiment shown in FIG. Figure 3 Taking two isolation columns 40 as an example, different groove areas formed by a plurality of grooves 30 according to an embodiment of the present invention are exemplarily described.

[0081] In an optional embodiment, if Figure 2 to Figure 6 As shown, the groove 30 includes a first groove area 301, a second groove area 302 and a third groove area 303 which are sequentially arranged in the second direction, and the first groove area 301 is closer to the display area AA than the third groove area 303;

[0082] The fan-out region SC includes an extension portion SC10 extending from the end of the display region AA toward the groove 30 , and an orthographic projection of the extension portion SC10 on the substrate 10 ends at a boundary of the first groove region 301 close to the display region AA.

[0083] The array substrate further includes a plurality of isolation columns 40 arranged along the second direction on the substrate 10 of the fan-out region SC, and the plurality of isolation columns 40, the extension portion SC10 and the end of the bending region WZ form respective groove regions, exemplarily:

[0084] The first groove area 301 corresponds to the orthographic projection area between the end of the extension portion SC10 and the isolation column 40 closest to the display area AA.

[0085] The second groove region 302 corresponds to the region of the adjacent isolation column 40;

[0086] The third groove area 303 corresponds to the area between the isolation column 40 closest to the bending area and the end of the bending area close to the display area.

[0087] The insulating structure 50 is distributed in one or more of the first tub region 301 , the second tub region 302 , and the third tub region 303 .

[0088] In this embodiment, Figure 3 As shown in Figure 3c, the side wall of the film layer corresponding to the end position of the extension portion SC10 (the end side wall of the third flat layer 63 at the position of the extension portion SC10), the vertical side wall of the first isolation column 40 close to the side of the extension portion SC10, and the horizontal film layer surface between the side walls at the two positions constitute the side wall and bottom wall of the first groove area 301.

[0089] The vertical sidewall corresponding to the first isolation column 40 away from the extension portion SC10, the vertical sidewall corresponding to the second isolation column 40 close to the extension portion SC10, and the horizontal film layer surface between the first isolation column 40 and the second isolation column 40 constitute the sidewall and bottom wall of the second groove area 302.

[0090] The vertical side wall corresponding to the second isolation column 40 close to the bending zone WZ, the film layer side wall at the end position (the end side wall of the third flat layer 63 at the bending zone WZ position), and the horizontal film layer surface between the side walls at the two positions constitute the side wall and bottom wall of the third groove area 303.

[0091] like Figure 3 As shown in FIG. 3c , the extension portion SC10 includes a fan-out flat layer SC60 located on the substrate 10. Figure 3FIG. 4 shows a schematic diagram of a layer structure without an insulating structure 50 in the fan-out region SC. In an optional embodiment, the fan-out flat layer SC60 includes:

[0092] A first planar layer 61 is provided on the substrate 10;

[0093] A second flat layer 62 located on a surface of the first flat layer 61 away from the substrate 10;

[0094] The third planar layer 63 is located on a surface of the second planar layer 62 that is away from the substrate 10 . For example, the third planar layer 63 may be a pixel defining layer.

[0095] In this embodiment, the end boundary of the positive projection of the third flat layer 63 at the position of the extension portion SC10 on the substrate 10 serves as the end boundary of the extension portion SC10, that is, the groove wall on one side of the first groove area 301 is the end side wall of the third flat layer 63, and the groove wall on the other side of the first groove area 301 is the side wall of the isolation column 40 closest to the extension portion SC10.

[0096] In an optional embodiment, the isolation column material layer 4010 of the isolation column 40 is disposed in the same layer as one or more layers of the planar film layer of the fan-out planar layer SC60 .

[0097] like Figure 3 As shown in FIG. 3c, the isolation column material layer 4010 of the first isolation column 40 is disposed in the same layer as the second flat layer 62 and the third flat layer 63. The isolation column material layer 4010 of the second isolation column 40 is disposed in the same layer as the first flat layer 61, the second flat layer 62 and the third flat layer 63. Based on the above same-layer structure, an isolation column 40 with a certain height is formed, and the isolation column 40 is used to prevent water and oxygen from invading.

[0098] In an optional embodiment, the bending zone includes a plurality of stacked bending flat layers on the substrate, and the bending flat layer WZ10 is disposed on the same layer as one or more layers of the flat film layer of the fan-out flat layer SC60. Figure 3 As shown in FIG. 3c , the bending flat layer WZ10 is disposed in the same layer as the first flat layer 61, the second flat layer 62 and the third flat layer 63. Based on this structure, one side wall of the third groove area 303 refers to the side wall of the isolation column 40 closest to the bending zone WZ, and the other side wall of the third groove area 303 refers to the end side wall of the third flat layer 63 in the bending zone WZ.

[0099] Based on the above embodiments, the film structure of the fan-out region SC, the film structure of the isolation pillar 40 , and the film structure of the bending region WZ can be formed simultaneously in the same process, thereby improving the process efficiency.

[0100] It is worth mentioning that the area definition of the film layer side wall at the end position of the extension portion SC10, the film layer side wall at the end position of the bending zone WZ, the first groove area 301 and the third groove area 303 in the embodiment of the present invention can be limited not only by the third flat layer 63, but also by the boundary of the positive projection of the first flat layer 61 and the second flat layer 62 on the substrate 10, which will not be repeated here.

[0101] In an optional embodiment, the connection line 20 is located at one or more surfaces of the fan-out flat layer SC60 , the isolation column material layer 4010 , and the bent flat layer WZ10 away from the substrate 10 .

[0102] In an optional embodiment, if Figure 3 As shown in 3c, the array substrate further includes:

[0103] A first inorganic layer 64 covering a surface of the third planar layer 63 away from the substrate 10;

[0104] The fourth organic layer 65 covers the surface of the first inorganic layer 64 on the side away from the substrate 10, and the thickness of the fourth organic layer 65 in the second direction gradually decreases, and the boundary of the fourth organic layer 65 ends at the side wall position of the isolation column 40 closest to the extension portion SC10 close to the extension portion SC10. Therefore, the isolation column 40 of this embodiment can also play a role in limiting the fourth organic layer 65.

[0105] In one embodiment, a second inorganic layer ( Figure 3 (not shown) to form an inorganic layer-organic layer-inorganic layer encapsulation stacked structure.

[0106] In this embodiment, the fourth organic layer 65 does not extend to the bending zone WZ, but is confined within the first groove region 301 by the isolation column 40 to prevent water and oxygen from invading.

[0107] In an optional embodiment, if Figure 4 , Figure 6 to Figure 13 As shown, when the insulating structure 50 is provided in the embodiment of the present invention, the insulating structure 50 is a protruding structure in the stacking direction from the substrate 10 to the first planar layer 61 .

[0108] The insulating column material layer 5010 of the insulating structure 50 of this embodiment is disposed in the same layer as one or more of the first planar layer 61, the second planar layer 62, and the third planar layer 63. Figure 4 Show Figure 6 The layer structure at the DD section position is as follows: Figure 4As shown, the insulating column material layer 5010 of the insulating structure 50 includes a first flat layer 61 and a second flat layer 62 , and the formed insulating structure 50 separates the connecting wires 20 adjacent to each other in the second direction.

[0109] When the insulating column material layer 5010 of the insulating structure 50 is formed of multiple film layers, a mask opening may be provided at a position corresponding to the insulating structure 50 , and the insulating structure 50 may be formed by a mask process.

[0110] However, the mask plate pattern design is required based on the mask process. When the insulating structure 50 includes multiple film layers, the mask plate pattern design needs to be re-performed for each layer structure, which will affect the manufacturing efficiency and product cost of the array substrate.

[0111] Therefore, in another embodiment, the thickness of the second planar layer 62 is greater than the thickness of the first planar layer 61 and greater than the thickness of the third planar layer 63 , and the insulating column material layer 5010 of the insulating structure 50 is disposed on the same layer as the second planar layer 62 .

[0112] When this embodiment uses one of the multiple flat layers in the fan-out area SC as the insulating column material layer 5010 of the insulating structure 50, the embodiment of the present invention selects the second flat layer 62 with the largest thickness to form the insulating structure 50, which can improve the short circuit defect of the connecting line 20 with the minimum process cost.

[0113] Exemplarily, the height of the connecting wire 20 in the stacking direction is 0.99 μm, and the height of the insulating column material layer 5010 of the insulating structure 50 away from the surface of the substrate 10 is 2.1 μm. Therefore, based on the height difference between the insulating structure 50 and the connecting wire 20, the connecting wire 20 can be insulated under the height difference, thereby avoiding short-circuiting of the connecting wire 20.

[0114] In an optional embodiment, if Figure 5 , Fig.10 and Fig.14 As shown, the connection line 20 is arranged from the edge side of the non-display area NA, and passes through the fan-out area SC and the bending area WZ in sequence. The connection line 20 passing through the fan-out area SC and the bending area SC includes a fan-out wiring portion 23, a horizontal wiring portion 22, and a vertical wiring portion 21. The first end of the fan-out wiring portion 23 is connected to the second end of the horizontal wiring portion 22. The extension direction of the fan-out wiring portion 23 on the orthographic projection of the substrate 10 is at an inclined angle to the first direction or the second direction.

[0115] The first end of the fan-out wiring portion 23, the second end of the horizontal wiring portion 22, the first end of the horizontal wiring portion 22, and the second end of the vertical wiring portion 21 described in this embodiment are all for clarifying the connection line 20 in different slot areas. The definition of each end does not limit the connection line 20 and has practical significance, which will not be repeated here. Now, the designs of different array substrates in the embodiments of the present invention and the corresponding embodiments of different insulation structures 50 are described.

[0116] In an optional embodiment, if Figure 5 As shown, when the fan-out routing portion of the connection line farthest from the display area and the orthographic projection of the first groove area on the substrate do not overlap, the size of the display area AA from the end of the bending area WZ close to the display area AA (the end of the transfer hole on the bending area) is the first frame size L1. In this embodiment, the array substrate adopts a conventional frame size, such as 600-1500μm.

[0117] like Figure 5 As shown, the fan-out routing portion 23 and the first groove area 301 have an overlapping gap in the second direction, that is, the orthographic projections of the two do not overlap. In this embodiment, the area between the end of the extension portion SC10 and the display area AA is provided with the fan-out routing portion 23 and each groove area (the first groove area 301, the second groove area 302 and the third groove area 303), and the orthographic projection of the fan-out routing portion 23 of the outermost connection line of the display area AA on the substrate 10 is provided in the orthographic projection of the extension portion SC10 on the substrate.

[0118] In this embodiment, the first frame size includes the length of the extension portion SC10 in the second direction and the length of the plurality of slots in the second direction, or in other words, the first frame size includes the length of the entire area of ​​the fan-out wiring portion 23 in the second direction and the length of the plurality of slots in the second direction. Therefore, the first frame size is relatively large.

[0119] In the subsequent binding process, the bending zone WZ is used as the folding portion, and the portion of the bending zone WZ away from the display area AA is folded to the non-light emitting side, and the fan-out wiring portion and each groove area are not folded.

[0120] In an optional embodiment, if Figures 5 to 8 As shown, the connecting line 20 includes a longitudinal routing portion 21 extending along the second direction, a first end of the longitudinal routing portion 21 is connected to the switching hole in the bending area, and the other end of the longitudinal routing portion 21 is connected to the connecting line 20 at the fan-out area SC.

[0121] like Figure 6 , Figure 7 and Figure 8As shown, the insulating structure 50 includes a first insulating column 51 arranged between adjacent longitudinal routing portions 21, the first insulating column 51 extends along the second direction, and the orthographic projection of the longitudinal routing portion 21 on the substrate 10 is located in one or more of the first groove area 301, the second groove area 302 and the third groove area 303.

[0122] The first insulating column 51 of this embodiment insulates the connecting wires 20 adjacent to each other in the lateral direction. Figure 1 and Fig. 9 As shown, a first insulating column 51 is provided in a first groove area 301 formed by the end of the extension portion SC10 and the first isolation column 40, in a second groove area 302 formed by the first isolation column 40 and the second isolation column 40, and in a third groove area 303 formed by the second isolation column 40 and the end of the bending zone WZ.

[0123] That is, if Figure 6 and Figure 7 As shown, the first insulating pillars 51 are disposed in the first slot area 301 , the second slot area 302 and the third slot area 303 , and the first insulating pillars 51 and the longitudinal wiring portions 21 in each slot area are arranged alternately.

[0124] The orthographic projection of the first insulating column 51 on the substrate 10 extends along the second direction, the orthographic projection of the groove 30 on the substrate 10 extends along the first direction, the orthographic projections of the first insulating column 51 and the groove 30 on the substrate 10 are perpendicular, and the orthographic projections of the first insulating column 51 and the groove 30 on the substrate 10 do not overlap. In this embodiment, the length of the first insulating column 51 in the second direction is less than or equal to the length of the groove area where the first insulating column 51 is located in the second direction, so as to insulate the connecting wires 20 in each groove area and avoid poor overlapping of the connecting wires 20.

[0125] like Fig. 9 As shown, Fig. 9 Show Figure 6 Schematic diagram of the layer structure at the cross-section GG position. A fourth organic layer 65 is formed in the first groove area 301, and the fourth organic layer 65 is not provided in the second groove area 302 and the third groove area 303. Therefore, the layer structure corresponding to the first groove area 301 is different from the layer structure corresponding to the second groove area 302.

[0126] Figure 7 Show Figure 6 A schematic diagram of the layer structure at the cross section EE position of the first groove area 301 in FIG. Figure 7As shown, in the first groove area 301, a second flat layer 62 is provided on the substrate 10, and the second flat layer 62 is used as an insulating column material layer 5010, so that a first insulating column 51 is formed in the first groove area 301, and the surface of the first insulating column 51 away from the substrate 10 is covered with a first inorganic layer 64, and the first inorganic layer 64 is covered with a fourth organic layer 65 on the side away from the substrate 10. In the second direction, the fourth organic layer 65 terminates at the first groove area 301. In the first direction, the connecting wire 20 is provided on the surface of the fourth organic layer 65 away from the substrate 10. The first insulating column 51 extending along the second direction is provided between the adjacent connecting wires 20 in the first direction, so that the adjacent connecting wires 20 in the first direction are blocked by the first insulating column 51, as shown in FIG. Figure 7 It can be seen that the height of the first insulating column 51 is greater than the height of the connecting wire 20 . Therefore, in the thickness direction, due to the step difference between the first insulating column 51 and the connecting wire 20 , the adjacent connecting wires 20 can also be insulated in the thickness direction.

[0127] Figure 8 A schematic diagram of the layer structure at the position of the second slot area 302 or the third slot area 303 is shown, for example Figure 8 Schematic diagram of the layer structure at the FF position in the middle section. The fourth organic layer 65 is not set at this position. In this embodiment, a first inorganic layer 64 is set on the surface of the first insulating column 51 on the side away from the substrate 10, and the first inorganic layer 64 is also covered on the surface of the film layer where the connecting line 20 is located. The connecting line 20 is formed on the surface of the first inorganic layer 64 on the side away from the substrate 10 and between adjacent first insulating columns 51.

[0128] based on Figures 5 to 9 Under the wide frame size structure, the present embodiment sets the first insulating column 51 between the longitudinal routing portions 21 of the adjacent connecting lines 20 in the fan-out area SC, and preferably sets the first insulating column 51 at the positions corresponding to the first groove area 301, the second groove area 302 and the third groove area 303. The first insulating column 51 is used to insulate the longitudinal routing portions 21 extending longitudinally in the first direction and the thickness direction to avoid poor overlap of the adjacent longitudinal routing portions 21.

[0129] Another embodiment of the present invention provides a schematic diagram of an array substrate with a narrow frame structure, such as Fig.10 As shown, in an optional embodiment, when the fan-out routing portion 23 of a part of the connecting wires 20 and the first groove area 301 have overlapping projections on the substrate 10, the size of the display area AA from the end of the bending area WZ close to one side of the display area AA (the end of the upper transfer hole of the bending area) is the second frame size L2, and the first frame size is greater than the second frame size. In this embodiment, the array substrate adopts a narrow frame size, for example, 400-600μm.

[0130] like Fig.10 As shown, the fan-out routing portion 23 and the first slot area 301 have overlapping projections, that is, compared to Figure 5 As shown, Fig.10 The distance between the first groove area 301 closest to the display area AA and the display area AA is further compressed. The area between the end of the extension portion SC10 and the display area AA includes the fan-out routing portion 23 of part of the connection line 20, and the area does not include the first groove area 301, the second groove area 302 and the third groove area 303. Therefore, the extension length of the extension portion SC10 in the second direction is relatively large. Figure 5 The embodiments are compressed.

[0131] In this embodiment, the second frame size includes the length of the extension portion SC10 in the second direction and the length of the plurality of groove areas in the second direction, so the second frame size L2 is smaller than the first frame size L1. In the subsequent binding process, the bending area WZ is used as the folding portion, and the bending area WZ is moved away from the display area AA side, and the frame size of the array substrate is reduced to achieve a narrow frame design.

[0132] like Fig.10 As shown, under the narrow frame design, the groove 30 located in the fan-out area SC extends laterally, and part of the routing of the connecting line 20 arranged in the fan-out area SC includes a longitudinal routing portion 21, a transverse routing portion 22 and a fan-out routing portion 23. The fan-out routing portion 23 can be arc-shaped or inclined.

[0133] for Fig.10 In the embodiment shown, when the connection line 20 in the fan-out region SC is a longitudinal wiring portion 21, the longitudinal wiring portion 21 can also adopt the design of the first insulating column 51, that is, the first insulating column 51 extending along the second direction is arranged between the longitudinal wiring portions 21 adjacent to each other in the first direction. Figure 7 As shown, in the fan-out area SC corresponding to the longitudinal routing portion 21 of the connecting line 20 in the first slot area 301, the layer structure at this position can be Figure 7 The same and reference principles are the same.

[0134] like Figure 8 As shown, in the fan-out area SC corresponding to the longitudinal wiring portion 21 of the connecting line 20 in the second slot area 302, or in the fan-out area SC corresponding to the longitudinal wiring portion 21 of the connecting line 20 in the third slot area 303, the layer structures at these positions can be the same as Figure 8 The same and reference principles are the same and will not be repeated here.

[0135] In an optional embodiment, if Fig.10As shown, the connecting line 20 also includes a transverse routing portion 22 extending along the first direction, and the first end of the transverse routing portion 22 is connected to the second end of the longitudinal routing portion 21, that is, when the fan-out routing portion 23 and the slot area (at least one of the first slot area 301, the second slot area 302 and the third slot area 303) have overlapping projections, the connecting line 20 includes not only the longitudinal routing portion 21, but also the transverse routing portion 22.

[0136] In this embodiment, for the horizontal wiring portion 22, as shown in FIG. Fig.11 As shown, the insulating structure 50 includes a second insulating column 52 arranged between adjacent lateral wiring portions 22, the second insulating column 52 extends along the first direction, and the orthographic projection of the lateral wiring portion 22 on the substrate 10 is located in one or more of the first groove area 301 and the third groove area 303.

[0137] The second insulating column 52 of this embodiment insulates the adjacent transverse wiring portions 22 in the longitudinal direction. Fig.10 and Fig.12 In the illustrated embodiment, second insulating pillars 52 are disposed in the first groove region 301 formed by the end of the extension portion SC10 and the first isolation pillar 40 , and in the third groove region 303 formed by the second isolation pillar 40 and the end of the bending zone WZ.

[0138] like Fig.10 and Fig.12 As shown, Fig.12 Show Fig.11 Schematic diagram of the layer structure at the position HH of the middle section, the second insulating column 52 and the lateral wiring portion 22 located in the same slot area are alternately arranged in the second direction. The orthographic projections of the second insulating column 52 and the groove 30 on the substrate 10 both extend along the first direction, that is, the second insulating column 52 and the groove 30 are arranged in parallel, and the orthographic projections of the first insulating column 51 and the groove 30 on the substrate 10 do not overlap. In this embodiment, the length of the second insulating column 52 in the first direction is less than or equal to the length of the lateral wiring portion 22 at the corresponding position of the first insulating column 51 in the first direction, thereby insulating the lateral wiring portions 22 of adjacent connecting wires 20 in the same slot area to avoid poor overlap of the connecting wires 20.

[0139] like Fig.10 and Fig.12 As shown, in the second slot area 302 formed by the first isolation column 40 and the second isolation column 40 , no connection line 20 is provided. Therefore, when the second slot area 302 is not provided with the horizontal wiring portion 22 , the second slot area 302 may also not be provided with the second insulating column 52 .

[0140] That is to say, in other embodiments, when multiple connecting lines 20 are arranged between adjacent isolation columns 40 of the second groove area 302, a second insulating column 52 can be set between the lateral routing portions 22 of adjacent connecting lines 20, and the lateral routing portions 22 of adjacent connecting lines 20 are insulated by using the second insulating column 52 which also extends in the lateral direction.

[0141] Fig.12 Show Fig.11 In the schematic diagram of the layer structure below the vertical cross-section line, a fourth organic layer 65 is formed in the first groove area 301 , and the fourth organic layer 65 is not provided in the second groove area 302 and the third groove area 303 .

[0142] like Fig.12 As shown, in the first groove area 301, a second flat layer 62 is provided on the substrate 10, and the second flat layer 62 is used as an insulating column material layer 5010, so as to form a second insulating column 52 in the first groove area 301, and the surface of the second insulating column 52 away from the substrate 10 is covered with the first inorganic layer 64, and the first inorganic layer 64 is covered with the fourth organic layer 65 on the side away from the substrate 10, that is, the fourth organic layer 65 is fully covered in the first direction and the second direction, and in the second direction, the fourth organic layer 65 ends at the first groove area 301. The connecting wires 20 are provided on the surface of the fourth organic layer 65 away from the substrate 10, and the connecting wires 20 are arranged in the second direction. The second insulating column 52 is provided between the lateral wiring portions 22 of the adjacent connecting wires 20 in the second direction.

[0143] like Fig.12 It can be seen that in the first groove area 301 , in the thickness direction, due to the difference between the second insulating column 52 and the lateral wiring portion 22 of the connecting wire 20 , the lateral wiring portions 22 of the adjacent connecting wires 20 can be insulated in the thickness direction.

[0144] like Fig.12 As shown, in the second groove area 302 formed by the first isolation column 40 and the second isolation column 40, the fourth organic layer 65 is not provided, and the connection line 20 is not provided. Fig.12 As shown, the first inorganic layer 64 covers the surface of the first isolation column 40 and the second isolation column 40 away from the substrate 10 and the surface of the film layer between the two isolation columns 40 .

[0145] In another embodiment, Fig.13 As shown, in the second groove area 302 formed by the first isolation column 40 and the second isolation column 40, the fourth organic layer 65 is not set in the second groove area 302, and multiple connecting lines 20 and second insulating columns 52 set between the horizontal routing parts 22 of adjacent connecting lines 20 are set in the second groove area 302.

[0146] like Fig.13 In the layer structure of the second groove area 302 shown, a second flat layer 62 is formed on the substrate 10 as an insulating material layer of the second insulating column 52, a first inorganic layer 64 is arranged on the surface of the second insulating column 52 away from the substrate 10, and the first inorganic layer 64 is also covered on the surface of the film layer where the connecting line 20 is located, and a connecting line 20 is formed between the surface of the first inorganic layer 64 away from the substrate 10 and the adjacent second insulating columns 52.

[0147] like Fig.12 As shown, in the third groove area 303 formed by the second isolation column 40 and the end of the bending zone WZ, the fourth organic layer 65 is not arranged in the third groove area 303, and a plurality of connection lines 20 and second insulating columns 52 arranged between the lateral wiring portions 22 of adjacent connection lines 20 are arranged in the third groove area 303. A second flat layer 62 is formed on the substrate 10 as an insulating material layer of the second insulating columns 52, a first inorganic layer 64 is arranged on the surface of the second insulating columns 52 away from the substrate 10, and the first inorganic layer 64 is also covered on the surface of the film layer where the connection line 20 is located, and the connection line 20 is formed between the surface of the first inorganic layer 64 away from the substrate 10 and the adjacent second insulating columns 52.

[0148] In an optional embodiment, if Fig.14 As shown, the insulating structure 50 includes a third insulating column 53 disposed between adjacent fan-out wiring portions 23, and the extension direction of the third insulating column 53 is the same as the extension direction of the fan-out wiring portion 23, that is, the structure of the orthographic projection of the fan-out wiring portion 23 on the substrate 10 is the same as the structure of the orthographic projection of the insulating structure 50 on the substrate 10. Exemplarily, when the orthographic projection of the fan-out wiring portion 23 on the substrate 10 is an arc structure, the orthographic projection of the third insulating column 53 on the substrate 10 is also an arc structure. In another example, when the orthographic projection of the fan-out wiring portion 23 on the substrate 10 is a right-angle structure, the orthographic projection of the third insulating column 53 on the substrate 10 is also a right-angle structure.

[0149] In the embodiment of the present invention, the orthographic projection of the fan-out routing portion 23 on the substrate 10 is located in one or more of the first slot area 301, the second slot area 302 and the third slot area 303. Fig.14 As shown, fan-out wiring sections 23 are provided in the first slot area 301, the second slot area 302 and the third slot area 303. According to the setting position of the fan-out area SC and the size setting of the narrow frame, the fan-out wiring section 23 may not be completely located in the three slot areas, and those skilled in the art will design it according to actual applications.

[0150] When the fan-out wiring portion 23 is disposed in the first slot area 301, the layer structure in the first slot area 301 can be seen in Figure 7 , Fig.12 and Fig.13 When the fan-out wiring portion 23 is disposed in the second slot area 302, the portion of the fan-out wiring portion 23 that is similar to the longitudinal wiring portion 21 can be seen in FIG. Figure 8 The layer structure of the longitudinal wiring section 21 is shown in FIG. The portion of the fan-out wiring section 23 similar to the lateral wiring section 22 can be seen in FIG. Fig.12 and Fig.13 The layer structure of the horizontal wiring portion 22 shown in the figure can be referred to in the description for related parts, which will not be described in detail here.

[0151] The embodiment of the present invention designs the structure in the groove 30 of the fan-out area SC, and arranges an insulating structure 50 between the connecting wires 20 in the groove 30 of the fan-out area SC. The extension direction of the insulating structure 50 is the same as the extension direction of the connecting wire 20. The insulating structure 50 is used to insulate adjacent connecting wires 20 in the extension direction, thereby avoiding poor overlap of multiple connecting wires 20 arranged in the groove 30 with limited space, and avoiding poor overlap of the connecting wires 20 arranged in the groove due to metal residue, thereby improving the product yield of the array substrate.

[0152] Another embodiment of the present invention provides a display device, and the display device of the embodiment of the present invention includes the array substrate of the above embodiment of the present invention. The display device of the embodiment of the present invention can be any product or component with a display function, such as an electronic paper, a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc., and this embodiment does not limit this.

[0153] Another embodiment of the present invention provides a method for manufacturing the array substrate of the above embodiment of the present invention, the method comprising:

[0154] forming a flat film layer on the substrate 10;

[0155] Grooving is performed on the flat film layer at the position corresponding to the fan-out area SC to form grooves 30 arranged in the second direction, each groove 30 extends along a first direction perpendicular to the second direction, and the second direction is the direction from the fan-out area SC to the bending area WZ;

[0156] An insulating column material layer 5010 of an insulating structure 50 is formed on the substrate 10 of the fan-out region SC;

[0157] Forming a signal line 60 in the display area AA;

[0158] A plurality of connection lines 20 are formed in a non-display area NA that at least partially surrounds the display area AA, a fan-out area SC located on one side of the non-display area NA, and a bending area WZ connected to the fan-out area SC. One end of the connection line 20 is electrically connected to the signal line 60. The connection line 20 located in the fan-out area is arranged on the surface of the groove 30 away from the substrate. The insulating structure 50 is at least partially between adjacent connection lines 20. The extension direction of the insulating structure 50 is parallel to the extension direction of the connection line 20 at the corresponding position.

[0159] Based on the above process, the manufacturing method of the embodiment of the present invention does not add complicated manufacturing processes. The insulating structure 50 can be set in the same layer as the material layer of the fan-out area SC. On the basis of ensuring the simplicity of the process, the added insulating structure 50 can insulate the adjacent connecting wires 20 set in the groove 30 structure, thereby avoiding the short circuit of the lines caused by the lead connection of multiple wirings in the groove 30 in a limited space due to the influence of the process.

[0160] It is worth noting that the specific embodiment of the method for manufacturing the array substrate of the embodiment of the present invention can refer to the array substrate of the aforementioned embodiment, which will not be described in detail here.

[0161] In the description of the present invention, relational terms such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0162] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the embodiments of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the embodiments here. All obvious changes or modifications derived from the technical solution of the present invention are still within the protection scope of the present invention.

Claims

1. An array substrate, characterized in that: The array substrate comprises a display area and a non-display area surrounding at least a portion of the display area. The non-display area includes: a fan-out area located at one end of the non-display area, a bending area located at a side of the fan-out area away from the display area, and a frame area located at a position corresponding to an end other than the end where the fan-out area is located; The fan-out region includes a plurality of grooves arranged in a second direction, each groove extending along a first direction perpendicular to the second direction, and the second direction is a direction from the fan-out region to the bending region, The array substrate further includes: substrate; a connection line connected to a signal line of the display area, the connection line sequentially passing through one or more of the frame area, the fan-out area and the bending area, and the connection line located in the fan-out area is arranged on a surface of the groove away from the substrate; and An insulating structure is located between at least part of adjacent connecting lines in the fan-out region, and an extending direction of the insulating structure is parallel to an extending direction of the connecting lines at corresponding positions.

2. The array substrate according to claim 1, characterized in that: The orthographic projections of the plurality of grooves on the substrate include a first groove area, a second groove area and a third groove area sequentially arranged in the second direction, and the first groove area is closer to the display area than the third groove area; The fan-out region includes an extension portion extending from the end of the display region toward the groove, wherein the orthographic projection of the extension portion on the substrate ends at a boundary of the first groove region close to the display region; The array substrate further comprises a plurality of isolation columns arranged along a second direction on the substrate of the fan-out region, wherein: The first groove area corresponds to the area between the end of the extension portion and the isolation column closest to the display area. The second groove region corresponds to the region between adjacent isolation pillars; The third groove region corresponds to a region between the isolation column closest to the bending region and an end of the bending region close to the display region. The insulating structure is distributed in one or more of the first tub region, the second tub region, and the third tub region.

3. The array substrate according to claim 2, characterized in that: The connecting line includes a longitudinal routing portion extending along the second direction, The orthographic projection of the longitudinal routing portion on the substrate is located in one or more of the first slot area, the second slot area and the third slot area. The insulating structure comprises a first insulating column arranged between adjacent longitudinal wiring portions, wherein the first insulating column extends along a second direction. The length of the first insulating column in the second direction is less than or equal to the length of the groove region where the first insulating column is located in the second direction.

4. The array substrate according to claim 3, characterized in that: The connecting line further includes a transverse wiring portion extending along a first direction, wherein a first end of the transverse wiring portion is connected to a second end of the longitudinal wiring portion. The insulating structure includes a second insulating column arranged between adjacent transverse wiring portions, wherein the second insulating column extends along a first direction. The orthographic projection of the lateral routing portion on the substrate is located in one or more of the first slot area and the third slot area. The length of the second insulating column in the first direction is less than or equal to the length of the horizontal wiring portion at a position corresponding to the first insulating column in the first direction.

5. The array substrate according to claim 4, characterized in that: The connecting line further includes a fan-out wiring portion, a first end of the fan-out wiring portion is connected to a second end of the lateral wiring portion, and the fan-out wiring portion forms an inclined angle with the first direction or the second direction in the extension direction of the orthographic projection of the substrate, The insulating structure includes a third insulating column arranged between adjacent fan-out wiring portions, wherein the extension direction of the third insulating column is the same as the extension direction of the fan-out wiring portion. The orthographic projection of the fan-out routing portion on the substrate is located in one or more of the first slot area, the second slot area, and the third slot area.

6. The array substrate according to claim 5, characterized in that: When the fan-out routing portion of the connection line farthest from the display area and the orthographic projection of the first groove area on the substrate do not overlap, the dimension of the display area from the end of the bending area close to one side of the display area is the first frame dimension; When the fan-out routing portion of some connecting lines and the orthographic projection of the first groove area on the substrate have overlapping projections, the dimension of the display area from the end of the bending area close to one side of the display area is the second frame dimension; The first frame size is larger than the second frame size.

7. The array substrate according to any one of claims 2 to 6, characterized in that: The extension portion includes a fan-out flat layer located on the substrate, and the fan-out flat layer includes a plurality of flat film layers stacked; The isolation column material layer of the isolation column is arranged in the same layer as one or more layers of the flat film layer of the fan-out flat layer; The bending region includes a plurality of stacked bending flat layers located on the substrate, wherein the bending flat layers are arranged in the same layer as one or more layers of the flat film layers of the fan-out flat layer; The connection line is located at one or more surfaces of the fan-out flat layer, the isolation column material layer and the bending flat layer away from the substrate.

8. The array substrate according to claim 7, characterized in that: The fan-out flat layer comprises: a first planar layer on the substrate; A second flat layer located on a surface of the first flat layer away from the substrate; A third flat layer is located on a surface of the second flat layer away from the substrate.

9. The array substrate according to claim 8, characterized in that: The insulating column material layer of the insulating structure is arranged in the same layer as one or more of the first flat layer, the second flat layer, and the third flat layer; or The thickness of the second planar layer is greater than that of the first planar layer and greater than that of the third planar layer, and the insulating column material layer of the insulating structure is disposed in the same layer as the second planar layer.

10. A display device, characterized in that: The display device comprises the array substrate according to any one of claims 1 to 9.

11. A method for manufacturing the array substrate according to any one of claims 1 to 9, characterized in that: The method comprises: forming a flat film layer on a substrate; Grooving is performed on the flat film layer at the position corresponding to the fan-out area to form grooves arranged in the second direction, each groove extends along a first direction perpendicular to the second direction, the fan-out area is located at one side boundary of the non-display area, the bending area is located at a side of the fan-out area away from the display area, and the second direction is the direction from the fan-out area to the bending area; Forming an insulating column material layer of an insulating structure on the substrate of the fan-out region; forming a signal line in a display area; A connection line electrically connected to the signal line is formed in the non-display area, and the connection line passes through one or more of the frame area, the fan-out area and the bending area in sequence. The connection line located in the fan-out area is arranged on the surface of the groove away from the substrate side. The insulating structure is at least partially between adjacent connection lines, and the extension direction of the insulating structure is parallel to the extension direction of the connection line at the corresponding position.

Images