Method for determining whether a <111> type crystal bar crystal orientation is in an optimal corner region, method and system for processing a <111> type crystal bar

Abstract

The application provides a method for judging whether a <111> type crystal bar crystal direction is in an optimal corner area, a <111> type crystal bar processing method and system, and belongs to the field of semiconductors. The <111> type crystal bar processing method comprises the following steps: providing a <111> type crystal bar, obtaining an initial X crystal direction deviation and an initial Y crystal direction deviation of the crystal bar crystal direction; judging whether the crystal bar crystal direction is in the optimal corner area; if the crystal bar crystal direction is in the optimal corner area, processing the crystal bar; if the crystal bar crystal direction is not in the optimal corner area, adjusting the X axis crystal direction and the Y axis crystal direction of the crystal bar, so that the crystal bar crystal direction is in the optimal corner area, and then processing the crystal bar. The crystal bar crystal direction is rotated from a random corner to an optimal corner range. Not only can the warp value of a silicon wafer after slicing be reduced, but also the warp value can be kept stable.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and particularly to a judgment method. <111> Methods for determining whether the crystal orientation of a crystal rod is in the optimal rotation region. <111> Methods and systems for processing crystal rods. Background Technology

[0002] The tumbling mill is processing <100> Crystal planes and orientations <111> When oriented crystal rods with crystal planes and orientations, no specific... <111> Dedicated module for crystal orientation development. During in-line crystal ingot cutting, <111> The anisotropy and high hardness of crystal rods with specific crystal planes and orientations necessitate cutting at the optimal rotation angle, which distinguishes them from... <100> Characteristics of crystal planes and orientations. Therefore, wire mesh and <111> The angle of the NOTCH groove in the crystal rod is an important factor affecting warp. <111> The crystal planes and orientations on both sides of the monocrystalline silicon are symmetrical about the cutting line. This means the elastic modulus, hardness, and fracture toughness values ​​on both sides of the monocrystalline silicon are symmetrical about the cutting line, resulting in consistent material removal rates on both sides of the cutting line. In other words, the cutting line does not shift, thus effectively reducing... <111> The issue of WARP on monocrystalline silicon wafers. However, the tumbling mill, during crystal orientation inspection, only targets the NOTCH groove. <110> or <100> The groove design does not align with the crystal plane or crystal orientation. <111> Inspection slot design.

[0003] conventional <111> The crystal orientation of the crystal rod and the corresponding slicing sticking angle are random, resulting in unstable warp values ​​of the silicon wafer after slicing.

[0004] It should be noted that the information disclosed in the background section of this invention is intended only to enhance the understanding of the general background of this invention, and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to provide a judgment <111> Methods for determining whether the crystal orientation of a crystal rod is in the optimal rotation region. <111> Methods and systems for processing crystal rods are proposed to solve the problem of how to cut and process crystal rods and avoid the problem of unstable warp values ​​of silicon wafers.

[0006] To solve the above-mentioned technical problems, the present invention provides a method for judging... <111> Methods for determining whether the crystal orientation of a crystal rod is in the optimal rotation region include:

[0007] When the crystal orientation of the crystal rod is in the optimal rotation region, the original data of the deviation of the X-axis crystal orientation and the deviation of the Y-axis crystal orientation of the crystal rod are obtained. The X-axis crystal orientation is the horizontal crystal orientation of the crystal rod, and the Y-axis crystal orientation is the vertical crystal orientation of the crystal rod. The deviation of the X-axis crystal orientation is defined as the X-axis crystal orientation deviation, and the deviation of the Y-axis crystal orientation is defined as the Y-axis crystal orientation deviation.

[0008] Based on the original data, a fitting model for X-axis deviation and Y-axis deviation was established;

[0009] The real-time X-axis deviation and real-time Y-axis deviation of the crystal rod are obtained. If the real-time Y-axis deviation of the crystal rod meets the preset range or the real-time X-axis deviation and real-time Y-axis deviation of the crystal rod meet the fitting model, then the crystal rod orientation is in the optimal turning region. If the real-time X-axis deviation and real-time Y-axis deviation of the crystal rod do not meet the fitting model or the real-time Y-axis deviation of the crystal rod does not meet the preset range, then the crystal rod orientation is not in the optimal turning region.

[0010] Preferably, when the optimal turning angle region is 0°±5°, the preset range is -0.05° to +0.05°. The optimal turning angle region also includes 60°±5° and -60°±5°. The step of establishing a fitting model for the X-axis deviation and Y-axis deviation based on the original data includes:

[0011] A fitting model was established for the original data with the optimal turning angle region of 60°±5°. The fitting model is as follows: the X-axis deviation and the Y-axis deviation have a linear functional relationship, and the regression coefficient R of the linear functional relationship is... 2 Greater than or equal to 0.96;

[0012] A fitting model was established for the original data with the optimal turning angle region of -60°±5°. The fitting model is as follows: the X-axis deviation and the Y-axis deviation have a linear functional relationship, and the regression coefficient R of the linear functional relationship is... 2 Greater than or equal to 0.96.

[0013] Preferably, if the real-time Y-axis deviation falls within the range of -0.05° to +0.05°, or if the real-time X-axis deviation and the real-time Y-axis deviation satisfy any one of the fitting models where the optimal rotation angle region is 60°±5° or -60°±5°, then the crystal rod orientation is at the optimal rotation angle.

[0014] Preferably, obtaining the real-time X-axis deviation and real-time Y-axis deviation of the crystal rod includes:

[0015] The X-ray of the first X-ray is placed at the center point of the end face of the crystal rod, and the real-time X-axis deviation and real-time Y-axis deviation of the crystal rod are obtained by the first X-ray measurement.

[0016] Based on the same inventive concept, the present invention also provides <111> Methods for processing crystal rods include:

[0017] Provide one <111> For a crystal rod, obtain the initial X-axis deviation and initial Y-axis deviation of the crystal rod.

[0018] Using the method described above, determine whether the crystal orientation of the crystal rod is in the optimal corner region. If the crystal orientation of the crystal rod is in the optimal corner region, process the crystal rod. If the crystal orientation of the crystal rod is not in the optimal corner region, adjust the X-axis and Y-axis crystal orientations of the crystal rod so that the crystal orientation of the crystal rod is in the optimal corner region before processing the crystal rod.

[0019] Preferably, if the process of adjusting the crystal orientation of the crystal rod to be in the optimal rotation area is before the cutting process, the physical cross-section of the crystal rod can be made consistent with the ideal cross-section of the crystal rod when it is adjusted to be in the optimal rotation area through the cutting process.

[0020] Preferably, if the process of adjusting the crystal orientation of the crystal rod to be in the optimal rotation area is after the cutting process, the physical cross-section of the crystal rod can be made consistent with the ideal cross-section of the crystal rod when it is adjusted to be in the optimal rotation area through the end face grinding process.

[0021] Preferably, the method for processing the crystal rod further includes:

[0022] The X-rays of the second X-ray are focused on the area on the circumference of the crystal rod where the notch groove is to be cut. The position of the notch groove is determined by the second X-ray, and the notch groove is cut on the processed crystal rod.

[0023] Preferably, obtaining the initial X-direction deviation and initial Y-direction deviation of the crystal rod includes:

[0024] The X-rays of the first X-ray are focused on the center point of the crystal rod end face, and the real-time X-axis deviation and real-time Y-axis deviation are obtained by measuring the first X-ray.

[0025] Preferably, the X-axis and Y-axis crystal orientations of the adjusting crystal rod include:

[0026] An orientation base is provided, the orientation base including a spherical base, a support platform, two first adjusting screws and two second adjusting screws, the spherical base being movably connected to the support platform, the first adjusting screws and the second adjusting screws both passing through the support platform and connecting to the spherical base, the two first adjusting screws being configured to adjust the X-axis crystal orientation of the crystal rod, and the two second adjusting screws being configured to adjust the Y-axis crystal orientation of the crystal rod.

[0027] Based on the same inventive concept, the present invention also provides <111> A system for processing crystal rods includes:

[0028] Measuring equipment used to obtain the initial X-direction deviation and initial Y-direction deviation of the crystal rod;

[0029] The judgment module is used to determine whether the crystal orientation of the crystal rod is in the optimal rotation region;

[0030] An adjustment device is used to adjust the crystal orientation of the crystal rod so that the crystal orientation of the crystal rod is in the optimal turning angle region; an end face trimming device is used to trim the end face of the crystal rod in the optimal turning angle region so that its physical cross-section is consistent with the ideal cross-section.

[0031] Preferably, the end-face trimming device is a cutting device, which cuts the crystal rod to make the physical cross-section of the crystal rod consistent with its ideal cross-section.

[0032] Preferably, the system further includes a cutting device for cutting the crystal rod, and the end face trimming device is an end face grinding device, which grinds the end face of the cut crystal rod to make the physical cross-section of the crystal rod consistent with its ideal cross-section.

[0033] Preferably, the system further includes a grooving device and a second X-ray, the second X-ray being used to determine the position of the NOTCH groove on the crystal rod, and the grooving device is used to groove the NOTCH groove on the crystal rod after the end face has been trimmed.

[0034] Preferably, the measuring device includes a first X-ray, the X-ray of which falls on the center point of the crystal rod end face, and the first X-ray is used to obtain the real-time X-axis deviation and real-time Y-axis deviation of the crystal rod.

[0035] Compared with the prior art, the present invention <111> The method of processing crystal rods has the following advantages:

[0036] This invention establishes a first X-ray and uses it to obtain the initial X-direction deviation and initial Y-direction deviation of the crystal ingot. It then determines whether the crystal ingot's orientation is within the optimal rotation angle region. If it is, the ingot is processed. If it is not, the orientation is adjusted to be within the optimal region before processing. This allows the crystal ingot's orientation to be rotated from a random angle to the optimal range. This not only reduces the warp value of the silicon wafer after slicing but also stabilizes the warp value.

[0037] The present invention provides <111> The system for processing crystal rods and the invention provided <111> The methods for processing crystal rods belong to the same inventive concept; therefore, the present invention provides... <111> The system for processing crystal rods has at least the features provided by this invention. <111> This method of processing crystal rods leverages all the advantages of rotation, allowing the crystal orientation of the rod to be rotated from random angles to an optimal range. It not only reduces the warp value of the silicon wafer after slicing but also stabilizes it. Attached Figure Description

[0038] Figure 1This is a judgment made in one embodiment of the present invention. <111> A flowchart of a method for determining whether the crystal orientation of a crystal rod is in the optimal rotation region;

[0039] Figure 2 This is a data distribution diagram corresponding to the optimal turning area of ​​0°±5° in one embodiment of the present invention;

[0040] Figure 3 This is the fitting model corresponding to the optimal turning area of ​​60°±5° in one embodiment of the present invention;

[0041] Figure 4 This is the fitting model corresponding to the optimal turning angle region of -60°±5° in one embodiment of the present invention;

[0042] Figure 5 This is one embodiment of the present invention. <111> Flowchart of the method for processing crystal rods;

[0043] Figure 6 This is a diagram showing the connection relationship between the directional base and the turntable in one embodiment of the present invention;

[0044] Figure 7 This is a schematic diagram of the orientation base in one embodiment of the present invention;

[0045] Figure 8 This is a schematic diagram showing the positional relationship between the first X-ray of the crystal rod and the crystal rod in one embodiment of the present invention;

[0046] Figure 9 This is a schematic diagram of the structure of the second X-ray in one embodiment of the present invention;

[0047] Figure 10 This is a schematic diagram showing the relationship between the X-axis crystal direction and the Y-axis crystal direction when the rotation region of the crystal rod is -60°±5° in one embodiment of the present invention.

[0048] Figure 11 This is a schematic diagram showing the relationship between the X-axis crystal direction and the Y-axis crystal direction when the crystal rod has an arbitrary rotation angle in one embodiment of the present invention.

[0049] Figure 12 This is a schematic diagram showing the relationship between the crystal rod rotation angle and the warp value in one embodiment of the present invention;

[0050] In the picture,

[0051] 100 - Base; 200 - Rotary table;

[0052] 300 - Adjustment base; 310 - First adjusting screw;

[0053] 320 - Second adjusting screw; 330 - Spherical base;

[0054] 340 - Support platform; 350 - Protrusion;

[0055] 400 - Fixture; 500 - Crystal rod;

[0056] 510-NOTCH slot; 520-first X-RAY;

[0057] 530 - Second X-ray; 540 - Ring saw;

[0058] 550 - First end; 560 - End to be cut. Detailed Implementation

[0059] To make the objectives, advantages, and features of the present invention clearer, the following description, in conjunction with the accompanying drawings and specific embodiments, outlines the key points of the present invention. <111> Methods for determining whether the crystal orientation of a crystal rod is in the optimal rotation region. <111> The method and system for processing crystal rods will be described in further detail. It should be noted that the accompanying drawings are all in a very simplified form and use non-precise scales, used only to facilitate and clarify the illustration of the embodiments of the present invention. It should be understood that the accompanying drawings do not necessarily show the specific structure of the invention to scale, and the illustrative features used to illustrate certain principles of the invention in the accompanying drawings are also drawn in a slightly simplified manner. Specific design features of the invention disclosed herein, including, for example, specific dimensions, orientations, positions, and shapes, will be determined in part by the specific application and environment in which they are used. Furthermore, in the embodiments described below, the same reference numerals are sometimes used across different drawings to denote the same parts or parts having the same function, and their repeated descriptions are omitted. In this specification, similar reference numerals and letters are used to denote similar items; therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0060] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0061] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0062] In existing technologies, when cutting crystal rods, for <111> The crystal planes and orientations of the cross-section do not have a slotted design, therefore the conventional <111> Due to the random distribution of crystal orientation angles in the crystal rods during the cutting process to form wafers, the warp value of the wafers after slicing is unstable.

[0063] The core idea of ​​this invention is to provide a <111> The method of processing crystal rods enables... <111> The crystal orientation of the crystal rod is in the optimal corner region so that the processed silicon wafer can reduce the silicon wafer warp value and keep the silicon wafer warp value stable.

[0064] To achieve the above-mentioned idea, the present invention provides a judgment <111> The method for determining whether the crystal orientation of a crystal rod is in the optimal rotation region is described in the following reference. Figures 1 to 4 The judgment revealed <111> One specific implementation of a method for determining whether the crystal orientation of a crystal rod is in the optimal rotation region. This determination... <111> The method for determining whether the crystal orientation of a crystal rod is in the optimal rotation region includes the following steps S11 to S13.

[0065] Step S11: Obtain the original data of the X-axis crystal orientation deviation and Y-axis crystal orientation deviation of the crystal rod when the crystal orientation of the crystal rod is in the optimal rotation angle region. The X-axis crystal orientation is the horizontal crystal orientation of the crystal rod, and the Y-axis crystal orientation is the vertical crystal orientation of the crystal rod. The X-axis crystal orientation deviation is defined as the X-axis crystal orientation deviation, and the Y-axis crystal orientation deviation is defined as the Y-axis crystal orientation deviation.

[0066] Specifically, refer to Figures 1 to 4As shown, the optimal rotation angle regions include 0°±5°, 60°±5°, and -60°±5°. From the original data, X-axis and Y-axis crystal orientation deviations falling within the optimal rotation angle region of 0°±5° are selected, and a relationship between them is established. From the original data, X-axis and Y-axis crystal orientation deviations falling within the optimal rotation angle region of 60°±5° are selected, and a fitting relationship between them is established. From the original data, X-axis and Y-axis crystal orientation deviations falling within the optimal rotation angle region of -60°±5° are selected, and a fitting relationship between them is established. Here, the difference between the actual value of the X-axis crystal orientation and the standard angle of the crystal plane is the X-axis crystal orientation deviation, and the difference between the actual value of the Y-axis crystal orientation and the standard angle of the crystal plane is the Y-axis crystal orientation deviation, where the standard angle of the crystal plane is a constant. For example, <111> The standard angle of the crystal plane orientation of the crystal rod is 14°14′.

[0067] Step S12: Based on the original data, establish fitting models for X-axis and Y-axis crystallographic deviations.

[0068] Specifically, refer to Figures 1 to 4 As shown, if the optimal rotation angle region is 0°±5°, the preset range is -0.05° to +0.05°. That is, when the optimal rotation angle region is 0°±5°, the Y-axis deviation falls within the range of -0.05° to +0.05°, indicating that the crystal rod's orientation is within the optimal rotation angle region. (See reference...) Figure 2 As shown in the example, if the Y-axis crystal orientation deviation falls within the range of -0.05° to +0.05°, then the optimal rotation angle region of the crystal rod's crystal orientation falls within the range of 0° ± 5°. Therefore, in determining whether the optimal rotation angle region of the crystal rod's crystal orientation is 0° ± 5°, it is sufficient to determine whether the Y-axis crystal orientation deviation falls within the range of -0.05° to +0.05°.

[0069] A fitting model was established for the original data with the optimal turning angle region of 60°±5°. The fitting model is as follows: the X-axis deviation and the Y-axis deviation have a linear functional relationship, and the regression coefficient R of the linear functional relationship is... 2 Greater than or equal to 0.96. For example, from the original data, the X-axis and Y-axis crystal orientation deviations falling within the optimal turning angle region of 60°±5° are selected. A fitting relationship between the two is established, revealing that when the X-axis and Y-axis crystal orientation deviations satisfy a linear fitting relationship, the crystal rod's orientation falls within the optimal turning angle region. The fitting model is: y = -1.73x + 0.0017, and the regression coefficient R0 of this function is... 2 =0.9875, R 2 Greater than or equal to 0.96. Where x is the X-axis crystal orientation deviation and y is the Y-axis crystal orientation deviation. That is, forming as... Figure 3 The graph shows the functional relationship.

[0070] A fitting model was established for the original data with the optimal turning angle region of -60°±5°. The fitting model is as follows: the X-axis deviation and the Y-axis deviation have a linear functional relationship, and the regression coefficient R of the linear functional relationship is... 2 Greater than or equal to 0.96. For example, the X-axis and Y-axis crystal orientation deviations falling within the optimal turning angle region of -60°±5° are selected from the original data. A fitting relationship between the two is established, revealing that when the X-axis and Y-axis crystal orientation deviations satisfy a linear fitting relationship, the crystal rod's orientation falls within the optimal turning angle region. The fitting model is: y = 1.7369x + 0.0047, with a regression coefficient R0. 2 =0.9895, R 2 Greater than or equal to 0.96. Where x is the X-axis crystal orientation deviation and y is the Y-axis crystal orientation deviation. That is, forming as... Figure 4 The graph shows the functional relationship.

[0071] Step S13: Obtain the real-time X-axis deviation and real-time Y-axis deviation of the crystal rod. If the real-time Y-axis deviation of the crystal rod meets the preset range or the real-time X-axis deviation and real-time Y-axis deviation of the crystal rod meet the fitting model, then the crystal rod orientation is in the optimal turning region. If the real-time X-axis deviation and real-time Y-axis deviation of the crystal rod do not meet the fitting model or the real-time Y-axis deviation of the crystal rod does not meet the preset range, then the crystal rod orientation is not in the optimal turning region.

[0072] Specifically, refer to Figures 1 to 4 As shown, the X-rays from the first X-ray 520 are focused on the center point of the crystal rod end face. The real-time X-axis deviation and real-time Y-axis deviation of the crystal rod are measured using the first X-ray 520. It is determined whether the Y-axis deviation falls within the range of -0.05° to +0.05°, or whether the real-time X-axis deviation and real-time Y-axis deviation satisfy any one of the fitting models in step S12. If the Y-axis deviation falls within the range of -0.05° to +0.05°, or the real-time X-axis deviation and real-time Y-axis deviation satisfy any one of the fitting models where the optimal rotation angle region is 60°±5° or -60°±5°, then the crystal rod orientation is in the optimal rotation angle region. This not only reduces the warp value of the silicon wafer after slicing but also keeps the warp value stable. If the real-time X-axis deviation and real-time Y-axis deviation do not satisfy any one of the fitting models, then the crystal rod orientation is not in the optimal rotation angle region, i.e., the crystal rod orientation is at an arbitrary rotation angle, which easily causes instability in the warp value of the silicon wafer after slicing. At this point, it is necessary to adjust the X-axis and Y-axis crystal orientations of the crystal rod so that the real-time X-axis and Y-axis deviations satisfy either of the fitting models, or the Y-axis deviation falls within the range of -0.05° to +0.05°, thereby placing the crystal rod at the optimal rotation angle. The specific adjustment process for the X-axis and Y-axis crystal orientations of the crystal rod is described below.

[0073] To achieve the above-mentioned ideas, the invention also discloses a... <111> Methods for processing crystal rods, see Figures 1 to 12 The revealed <111> One specific embodiment of a method for processing crystal rods. <111> The method for processing crystal rods includes the following steps S21 to S23.

[0074] Step S21: Provide one <111> The initial X-axis deviation and initial Y-axis deviation of the crystal rod are obtained.

[0075] Specifically, refer to Figures 5 to 8 As shown, a <111> A crystal ingot 500 is placed on a cutting device. The crystal ingot 500 has a first end 550 and an end 560 to be cut. The first end 550 has an end face (not shown in the figure). The end 560 to be cut has a cut surface (not shown in the figure). At this point, the cut surface has not yet been formed. The horizontal crystal direction of the crystal ingot 500 is defined as the X-axis crystal direction. The vertical crystal direction of the crystal ingot 500 is defined as the Y-axis crystal direction. The side of the crystal ingot 500 opposite to the end face is defined as a reference surface.

[0076] The cutting device includes at least a rotary table 200, a directional base 300, and a ring saw 540. The directional base 300 is fixedly connected to the rotary table 200. The crystal rod 500 is transverse (i.e., with...) Figure 8 The crystal rod 500 (located in the direction perpendicular to the center arrow N) is placed on the aligning base 300. The aligning base 300 is configured to adjust the X-axis and Y-axis crystal orientations of the crystal rod 500, applying a force to the circumferential direction of the rotary table 200. The rotary table 200 drives the aligning base 300 and the crystal rod 500 to rotate circumferentially. A ring saw 540 is fitted onto the crystal rod 500 for cutting the crystal rod 500.

[0077] The directional base 300 includes a spherical base 330, a support platform 340, two first adjusting screws 310, and two second adjusting screws 320. The spherical base 330 is movably connected to the support platform 340. Both the first adjusting screws 310 and the second adjusting screws 320 pass through the support platform 340 and connect to the spherical base 330. The two first adjusting screws 310 are configured to adjust the X-axis crystal orientation of the crystal rod 500, and the two second adjusting screws 320 are configured to adjust the Y-axis crystal orientation of the crystal rod 500. Both the first adjusting screws 310 and the second adjusting screws 320 are threadedly connected to the support platform 340 and the spherical base 330. The surface of the spherical base 330 has a protrusion 350, which is hemispherical in shape. The side of the support platform 340 near the spherical base 330 has a groove (not shown in the figure), which is also hemispherical in shape. The protrusion 350 matches the groove and is movably connected. When the first adjusting screw 310 and the second adjusting screw 320 are rotated, the protrusion 350 can move within the groove to adjust the X-axis and Y-axis crystal orientation of the crystal rod.

[0078] The cutting device also includes a base 100 and clamps 400. The clamps 400 are connected to the adjusting base 300 and are used to limit and fix the crystal rod 500 placed on the adjusting base 300. Two clamps 400 are provided, one on each side of the crystal rod 500. The two clamps 400 limit the crystal rod 500 from its sides, thereby fixing it in place. The rotary table 200 and the base 100 are rotatably connected via bearings. Therefore, the rotary table 200 can be manually rotated to make the crystal rod 500 rotate circumferentially around the rotary table 200. Alternatively, a drive device can be used for adjustment. As long as the rotary table 200 can rotate around its own circumferential direction, no specific limitations are imposed.

[0079] It should be noted that the specific structure of the cutting-off device is existing technology, and those skilled in the art are already familiar with its specific structure and working principle, so it will not be described in detail here.

[0080] Obtaining the initial X-axis deviation and initial Y-axis deviation of the crystal rod includes:

[0081] The X-rays from the first X-ray 520 are focused on the center point of the crystal rod end face, and the real-time X-axis deviation and real-time Y-axis deviation of the crystal rod are obtained by measuring the first X-ray 520.

[0082] Step S22: Determine whether the crystal orientation of the crystal rod is in the optimal corner region. If the crystal orientation of the crystal rod is in the optimal corner region, process the crystal rod. If the crystal orientation of the crystal rod is not in the optimal corner region, adjust the X-axis and Y-axis crystal orientations of the crystal rod so that the crystal orientation of the crystal rod is in the optimal corner region before processing the crystal rod.

[0083] Specifically, refer to Figures 5 to 12 As shown, if the real-time X-axis deviation and real-time Y-axis deviation of the crystal rod satisfy the condition that the Y-axis deviation falls within the range of -0.05° to +0.05°, or any of the fitting models in step S12, then the crystal rod's crystal orientation is in the optimal rotation angle region. Then, the crystal rod 500 is processed.

[0084] If the crystal orientation of the crystal rod is not in the optimal rotation angle region, adjust the X-axis and Y-axis crystal orientations of the crystal rod to bring the crystal orientation of the crystal rod into the optimal rotation angle region before processing the crystal rod.

[0085] In this embodiment, the direction along the length of the crystal ingot 500 is defined as the M direction, and the direction perpendicular to the M direction is defined as the N direction. The plane containing the M direction and the plane containing the N direction are perpendicular to each other. The orientation base 300 includes two first adjusting screws 310 arranged along the M-axis. The first adjusting screws 310 are used to adjust the crystal orientation angle of the crystal ingot end face. The orientation base 300 also includes two second adjusting screws 320 arranged along a direction perpendicular to the M-axis and located on the same horizontal plane as the M-axis. The two second adjusting screws 320 are used to adjust the crystal orientation angle of the cross-section of the crystal ingot 500.

[0086] Adjusting the X-axis and Y-axis crystal orientations of the crystal rod to place the crystal rod in the optimal rotation region includes:

[0087] First, adjust the two first adjusting screws 310 to adjust the crystal orientation angle of the crystal rod 500 until the current pointer of the first X-RAY 520 deflects, finding the maximum value of the X-axis crystal orientation deviation. Then, adjust the two first adjusting screws 310 to adjust the crystal orientation angle of the cross-section of the crystal rod 500 so that the X-axis crystal orientation falls within the optimal crystal orientation range.

[0088] Next, rotate the crystal rod 500 90° around its own circumference. Manually rotate the rotary table 200. This will rotate the crystal rod 500 90° around its own circumference. Adjust the two second adjusting screws 320 to adjust the crystal orientation angle of the crystal rod 500 until the current pointer of the first X-RAY 520 deflects, finding the maximum value of the Y-axis crystal orientation deviation. Then, continue to adjust the two second adjusting screws 320 to adjust the crystal orientation angle of the cross-section of the crystal rod 500 so that the Y-axis crystal orientation falls within the optimal crystal orientation range. At this time, the crystal orientation of the crystal rod 500 is within the optimal rotation angle.

[0089] The difference between the X-axis crystal orientation and the standard angle is the X-axis crystal orientation deviation. The difference between the Y-axis crystal orientation and the standard angle is the Y-axis crystal orientation deviation. When both the X-axis and Y-axis crystal orientations fall within the optimal crystal orientation range, the X-axis and Y-axis crystal orientation deviations satisfy any of the fitting models described above. In this case, the crystal orientation of the crystal rod is in the optimal rotation region.

[0090] Then, the angle of rotation of the crystal ingot 500 around its circumference from the initial position to the optimal rotation angle is obtained. Based on this angle, the crystal ingot is adjusted and then cut into segments, for example, 0.4 meters long. The cutting device also includes rollers (not shown in the figure). The rollers extend parallel to the crystal ingot 500 and support it so that it can rotate axially using the rollers. The angle of rotation of the crystal ingot 500 around its circumference from the initial position to the optimal rotation angle is obtained through the detection system of the cutting device. Then, based on this angle, the crystal ingot 500 is adjusted using the rollers. Figure 10 As shown, assuming the crystal orientation of the crystal rod is within the optimal rotation angle, for example, -60 degrees ± 5 degrees, the X-axis crystal orientation falls within the 0.19-0.5 degree range. The Y-axis crystal orientation value is greater than the X-axis crystal orientation value. (See reference...) Figure 11 As shown, when the crystal orientation of the crystal rod is within a random rotation angle, the values ​​of the X-axis and Y-axis crystal orientations are randomly distributed. (Ref) Figure 12 As shown, the embodiment provided <111> Silicon wafers obtained through the ingot processing method are analyzed, and their Warp values ​​are measured, as shown in the schematic diagram for interval a. The Warp value is below the reference line, indicating that the Warp value meets the process requirements for silicon wafer processing. The Warp value at interval a is stable. However, the Warp values ​​outside interval a are unstable and above the reference line, failing to meet the process requirements for silicon wafer processing.

[0091] If the process of adjusting the crystal orientation of the crystal rod to the optimal rotation angle region occurs before the cutting process, the physical cross-section of the crystal rod can be made consistent with the ideal cross-section of the crystal rod when it is adjusted to the optimal rotation angle region through the cutting process. The crystal rod 500 is cut using a ring saw 540.

[0092] If the process of adjusting the crystal orientation of the crystal rod to be in the optimal rotation area is after the cutting process, the physical cross-section of the crystal rod can be made consistent with the ideal cross-section of the crystal rod when it is adjusted to be in the optimal rotation area through the end face grinding process.

[0093] After cutting and processing, <111> The method of processing crystal rods also includes: grinding the cut crystal rods by tumbling.

[0094] Before the cutting process, <111> The method for processing crystal rods also includes: rough grinding of the crystal rod by tumbling, and inspection. Since rough grinding, inspection, and fine grinding of crystal rods are all existing technologies, those skilled in the art are already familiar with their specific operating procedures, and will not be described in detail here.

[0095] Step S23: Determine the position of the NOTCH groove 510 using the second X-RAY 530, and open the NOTCH groove 510 on the processed crystal ingot.

[0096] Specifically, refer to Figure 8 and Figure 9 As shown, the position of the NOTCH groove 510 is determined by the second X-RAY 530. The cross-section of the incident and exit angles of the second X-RAY 530 is perpendicular to the crystal rod axis (i.e., Figure 9 a) Vertical. Using the data obtained from the second X-ray 530 inspection, and based on the XRD analysis results of the root saw during the cutting process, engineers can calculate the optimal cutting angle relative to the crystal rod surface to ensure that the NOTCH groove 510 is cut along the desired crystal orientation. After the NOTCH groove 510 is cut into the crystal rod, the formed NOTCH groove 510 is as follows... Figure 8 The X-rays extend from one end of the crystal rod to the other. Since both X-ray systems are mounted on a tumbling mill for inspection, the equipment's operational functions are complex, and hardware space is limited. Therefore, the second X-ray 530 is integrated into the ring saw 540. The ring saw 540 is used to cut the crystal rod 500. The X-rays from the second X-ray 530 fall on the NOTCH groove 510 at the end 560 to be cut on the circumference of the crystal rod. The NOTCH groove 510 serves as a physical reference point, indicating the crystal orientation or other properties of the crystal rod 500.

[0097] The present invention also discloses a <111> A system for processing crystal rods includes:

[0098] Measuring equipment used to obtain the initial X-direction deviation and initial Y-direction deviation of the crystal rod;

[0099] The judgment module is used to determine whether the crystal orientation of the crystal rod is in the optimal rotation region;

[0100] An adjustment device is used to adjust the crystal orientation of a crystal rod so that the crystal orientation of the crystal rod is in the optimal rotation region;

[0101] An end-face trimming device is used to trim the end face of the crystal rod in the optimal corner region so that its physical cross-section is consistent with the ideal cross-section.

[0102] If the process of adjusting the crystal orientation of the crystal rod to the optimal rotation angle region occurs before the cutting process, the physical cross-section of the crystal rod can be made consistent with the ideal cross-section of the crystal rod when it is adjusted to the optimal rotation angle region through the cutting process. The end-face trimming equipment is a cutting equipment, which cuts the crystal rod to make the physical cross-section of the crystal rod consistent with its ideal cross-section.

[0103] If the process of adjusting the crystal orientation of the crystal rod to the optimal rotation angle region occurs after the cutting process, the physical cross-section of the crystal rod can be made consistent with the ideal cross-section of the crystal rod when it is adjusted to the optimal rotation angle region through end-face grinding. The system also includes a cutting device for cutting the crystal rod, and an end-face grinding device for grinding the end face of the cut crystal rod to make the physical cross-section of the crystal rod consistent with its ideal cross-section.

[0104] The system also includes a grooving device and a second X-RAY 530, which is used to determine the position of the NOTCH groove 510 of the crystal rod and to groove the NOTCH groove 510 of the crystal rod after the end face is trimmed by the grooving device.

[0105] The measuring device includes a first X-ray 520, the X-rays of which fall on the center point of the crystal rod end face, and the first X-ray 520 is used to obtain the real-time X-axis deviation and real-time Y-axis deviation of the crystal rod.

[0106] The judgment module is used to determine whether the crystal orientation of the crystal rod is in the optimal rotation angle region. The X-rays from the first X-ray 520 are focused on the center point of the crystal rod end face, and the real-time X-axis deviation and real-time Y-axis deviation of the crystal rod are measured using the first X-ray 520. It is determined whether the real-time X-axis deviation and real-time Y-axis deviation satisfy any one of the fitting models in step S12, or whether the Y-axis deviation falls within the range of -0.05° to +0.05°. If the Y-axis deviation falls within the range of -0.05° to +0.05°, or if the real-time X-axis deviation and real-time Y-axis deviation satisfy one of the fitting models where the optimal rotation angle is 60°±5° or -60°±5°, then the crystal orientation of the crystal rod is in the optimal rotation angle, which not only reduces the warp value of the silicon wafer after slicing but also keeps the warp value stable. If the real-time X-axis and Y-axis crystal orientation deviations do not satisfy either of the fitting models, the crystal orientation of the crystal rod is not at the optimal rotation angle, meaning the crystal orientation of the crystal rod is at an arbitrary rotation angle, which can easily cause unstable warp values ​​in the sliced ​​silicon wafers. In this case, it is necessary to adjust the X-axis and Y-axis crystal orientations of the crystal rod so that the real-time X-axis and Y-axis crystal orientation deviations of the crystal rod satisfy either of the fitting models, or the Y-axis deviation falls within the range of -0.05° to +0.05°.

[0107] An adjustment device includes an adjustment base 300. The adjustment base 300 includes a spherical base 330, a support platform 340, two first adjustment screws 310, and two second adjustment screws 320. The spherical base 330 is movably connected to the support platform 340. Both the first and second adjustment screws 310 and 320 pass through the support platform 340 and connect to the spherical base 330. The two first adjustment screws 310 are configured to adjust the X-axis crystal orientation of the crystal rod 500, and the two second adjustment screws 320 are configured to adjust the Y-axis crystal orientation of the crystal rod 500. Both the first and second adjustment screws 310 and 320 are threadedly connected to the support platform 340 and the spherical base 330. The surface of the spherical base 330 has a protrusion 350, which is hemispherical in shape. The support platform 340 has a groove (not shown in the figure) on the side near the spherical base 330, and the groove is hemispherical in shape. The protrusion 350 matches the groove and is movably connected. When the first adjusting screw 310 and the second adjusting screw 320 are rotated, the protrusion 350 can move within the groove to adjust the X-axis and Y-axis crystal orientation of the crystal rod.

[0108] The embodiment provided <111> The system for processing crystal rods and the one provided in this embodiment <111> The methods for processing crystal rods belong to the same inventive concept; therefore, the method provided in this embodiment... <111> The system for processing crystal rods has at least the features provided by this invention. <111> This method of processing crystal rods leverages all the advantages of rotation, allowing the crystal orientation of the rod to be rotated from random angles to an optimal range. It not only reduces the warp value of the silicon wafer after slicing but also stabilizes it.

[0109] In summary, the above embodiments are effective in determining... <111> Methods for determining whether the crystal orientation of a crystal rod is in the optimal rotation region. <111> The different configurations of the method and system for processing crystal rods have been described in detail. Of course, the above description is only a description of the preferred embodiments of the present invention and is not intended to limit the scope of the present invention. The present invention includes but is not limited to the configurations listed in the above embodiments. Those skilled in the art can draw inferences from the content of the above embodiments. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A judgment <111> A method for determining whether the crystal orientation of a crystal rod is in the optimal rotation region, characterized in that... include: When the crystal orientation of the crystal rod is in the optimal rotation region, the original data of the deviation of the X-axis crystal orientation and the deviation of the Y-axis crystal orientation of the crystal rod are obtained. The X-axis crystal orientation is the horizontal crystal orientation of the crystal rod, and the Y-axis crystal orientation is the vertical crystal orientation of the crystal rod. The deviation of the X-axis crystal orientation is defined as the X-axis crystal orientation deviation, and the deviation of the Y-axis crystal orientation is defined as the Y-axis crystal orientation deviation. Based on the original data with the optimal rotation regions of 60°±5° and -60°±5°, linear functional relationships between X-axis deviation and Y-axis deviation were established as fitting models. Set the preset range of Y-axis deviation when the optimal rotation angle region is 0°±5°; The real-time X-axis deviation and real-time Y-axis deviation of the crystal rod are obtained. If the real-time Y-axis deviation of the crystal rod meets the preset range or the real-time X-axis deviation and real-time Y-axis deviation of the crystal rod meet any of the fitting models, then the crystal rod is in the optimal rotation region. Otherwise, the crystal rod is not in the optimal rotation region.

2. The judgment according to claim 1 <111> A method for determining whether the crystal orientation of a crystal rod is in the optimal rotation region, characterized in that... The regression coefficient R of the linear functional relationship 2 Greater than or equal to 0.

96.

3. The judgment according to claim 1 <111> A method for determining whether the crystal orientation of a crystal rod is in the optimal rotation region, characterized in that... The preset range is -0.05° to +0.05°.

4. The judgment according to claim 1 <111> A method for determining whether the crystal orientation of a crystal rod is in the optimal rotation region, characterized in that... Obtaining the real-time X-axis deviation and real-time Y-axis deviation of the crystal rod includes: The X-ray of the first X-ray is placed at the center point of the end face of the crystal rod, and the real-time X-axis deviation and real-time Y-axis deviation of the crystal rod are obtained by the first X-ray measurement.

5. A kind <111> The method for processing crystal rods is characterized by, include: Provide one <111> For a crystal rod, obtain the initial X-axis deviation and initial Y-axis deviation of the crystal rod. Using the method described in any one of claims 1-4, determine whether the crystal orientation of the crystal rod is in the optimal corner region. If the crystal orientation of the crystal rod is in the optimal corner region, process the crystal rod. If the crystal orientation of the crystal rod is not in the optimal corner region, adjust the X-axis and Y-axis crystal orientations of the crystal rod so that the crystal orientation of the crystal rod is in the optimal corner region before processing the crystal rod.

6. The method according to claim 5 <111> The method for processing crystal rods is characterized by, If the process of adjusting the crystal orientation of the crystal rod to the optimal rotation angle region is performed before the cutting process, the physical cross-section of the crystal rod can be made consistent with the ideal cross-section of the crystal rod when it is adjusted to the optimal rotation angle region through the cutting process.

7. The method according to claim 5 <111> The method for processing crystal rods is characterized by, If the process of adjusting the crystal orientation of the crystal rod to be in the optimal rotation area is after the cutting process, the physical cross-section of the crystal rod can be made consistent with the ideal cross-section of the crystal rod when it is adjusted to be in the optimal rotation area through the end face grinding process.

8. The method according to claim 5 <111> The method for processing crystal rods is characterized by, The method for processing the crystal rod further includes: The X-rays of the second X-ray are focused on the area on the circumference of the crystal rod where the notch groove is to be cut. The position of the notch groove is determined by the second X-ray, and the notch groove is cut on the processed crystal rod.

9. The method according to claim 5 <111> The method for processing crystal rods is characterized by, Obtaining the initial X-axis deviation and initial Y-axis deviation of the crystal rod includes: The X-rays of the first X-ray are focused on the center point of the crystal rod end face, and the real-time X-axis deviation and real-time Y-axis deviation are obtained by measuring the first X-ray.

10. The method according to claim 5 <111> The method for processing crystal rods is characterized by, The X-axis and Y-axis crystal orientations of the adjusting crystal rod include: An orientation base is provided, the orientation base including a spherical base, a support platform, two first adjusting screws and two second adjusting screws, the spherical base being movably connected to the support platform, the first adjusting screws and the second adjusting screws both passing through the support platform and connecting to the spherical base, the two first adjusting screws being configured to adjust the X-axis crystal orientation of the crystal rod, and the two second adjusting screws being configured to adjust the Y-axis crystal orientation of the crystal rod.

11. A kind <111> The system for processing crystal rods is characterized by, include: Measuring equipment used to obtain the initial X-direction deviation and initial Y-direction deviation of the crystal rod; The judgment module is used to determine whether the crystal orientation of the crystal rod is in the optimal rotation region using the method described in any one of claims 1-4; An adjustment device is used to adjust the crystal orientation of a crystal rod so that the crystal orientation of the crystal rod is in the optimal rotation region; An end-face trimming device is used to trim the end face of the crystal rod in the optimal corner region so that its physical cross-section is consistent with the ideal cross-section.

12. The claim 11 <111> The system for processing crystal rods is characterized by, The system also includes a cutting device for cutting the crystal rod, and an end face trimming device for grinding the end face of the cut crystal rod to make the physical cross-section of the crystal rod consistent with the ideal cross-section.

13. The claim 11 <111> The system for processing crystal rods is characterized by, The system also includes a grooving device and a second X-ray, which is used to determine the position of the NOTCH groove on the crystal rod. The grooving device is used to groove the NOTCH groove on the crystal rod after the end face has been trimmed.

14. The claim 11 <111> The system for processing crystal rods is characterized by, The measuring device includes a first X-ray, the X-ray of which falls on the center point of the crystal rod end face. The first X-ray is used to obtain the real-time X-axis deviation and real-time Y-axis deviation of the crystal rod.

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