Camera module and manufacturing method thereof

Abstract

The invention provides a camera module and a manufacturing method thereof, the camera module comprises a photosensitive chip, a circuit board, an optical lens, a motor and a base, the photosensitive chip is conducted to the circuit board, the optical lens and the motor are configured on a photosensitive path of the photosensitive chip, the motor is assembled on the base, and the optical lens is assembled on the base. The base is integrally formed on the circuit board, at least one part of the circuit board is packaged, and a first packaging body and a second packaging body are formed on the first surface and the second surface of the circuit board respectively; the circuit board comprises an outer press-fit part and an inner press-fit part, the outer press-fit part extends outwards from the position between the first packaging body and the second packaging body and is located on the outer side of the base, and the inner press-fit part is formed by surrounding a circuit board through hole of the circuit board and is located on the outer side of the base. The inner pressing part extends from the position between the first packaging body and the second packaging body to the direction of the optical axis, the photosensitive chip is located below the inner pressing part, and the projection of the photosensitive chip and the projection of the inner pressing part in the direction of the optical axis coincide.

Description

Technical Field

[0001] This application relates to the field of camera modules, and more particularly to a camera module and a manufacturing method thereof. Background Art

[0002] The camera module is an essential part of mobile electronic devices. With the further development of camera module technology, users' requirements for camera modules have become increasingly refined and more demanding. The development of camera products not only needs to meet the requirements of high performance, but also needs to meet the requirements of miniaturization, light weight, and compactness.

[0003] The camera module includes a lens, a motor, and a photosensitive component. Light passes through the lens and reaches the photosensitive component, where it is received by the photosensitive chip of the photosensitive component. The motor is used to drive the lens to move to adjust the position of the lens.

[0004] In order to further improve the imaging quality and achieve more imaging functions, the camera module usually has an auto focus function (AF function) and an optical image stabilization function (Optical Image Stabilization, OIS function). The realization of these functions requires the motor to drive the optical lens to move. As the imaging quality requirements become higher, the number of lens elements of the optical lens is increasing, and the weight is getting heavier, which requires a corresponding increase in the driving force of the motor, resulting in an increase in the volume of the motor, which goes against the compactness requirements of the camera module.

[0005] The motor usually has a base for supporting the focusing carrier and the anti-shake carrier. The focusing carrier supports the lens for focusing movement, and the anti-shake carrier supports the lens for shake compensation movement. The design and assembly of the base, the focusing carrier, and the anti-shake carrier will affect the size of the motor, and thus affect the size of the camera module. However, the installation space of the camera module in the electronic device is highly restricted, and the increase in the volume of the motor is limited, making it impossible to effectively improve the driving force. For example, the thickness of a mobile phone is strictly restricted, resulting in a serious limitation on the height of the camera module. Under the condition of limited height, how to design a more and more complex motor to meet the requirements of higher imaging quality and smaller size is a major problem for those skilled in the art.

[0006] In addition, the performance of the circuit board will also affect the imaging quality of the camera module. The encapsulation of the circuit board will cause the circuit board to deform and warp, affecting the installation of the photosensitive chip and the flatness after installation. Summary of the Invention

[0007] One advantage of this application is to provide a camera module and a manufacturing method thereof, in which the base of the photosensitive component integrally forms a motor mounting portion and a filter mounting portion, reducing the height of the camera module.

[0008] One advantage of the present application is to provide an imaging module and a manufacturing method thereof, in which the base replaces the independent motor base structure and the filter holder structure, reducing the assembly parts, saving the assembly steps, and improving the assembly accuracy and efficiency.

[0009] One advantage of the present application is to provide an imaging module and a manufacturing method thereof, in which the motor mounting portion of the base integrally forms a support and guiding structure of the motor, further eliminating the independent support member and guiding member of the motor to further improve the assembly accuracy and efficiency.

[0010] One advantage of the present application is to provide an imaging module and a manufacturing method thereof, in which the base forms a two-layer molding structure, and the circuit board is placed between the two side moldings to strengthen the strength of the circuit board and reduce the warping of the circuit board.

[0011] One advantage of the present application is to provide an imaging module and a manufacturing method thereof, in which a first encapsulation body is formed on the top of the circuit board, and the first encapsulation body forms a sunken filter mounting portion to reduce the mounting height of the filter, which is beneficial to reducing the height of the imaging module.

[0012] One advantage of the present application is to provide an imaging module and a manufacturing method thereof, in which the support arm of the first encapsulation body is formed in one step and has a certain height, which is matched with the height of the motor.

[0013] One advantage of the present application is to provide an imaging module and a manufacturing method thereof, in which a second encapsulation body is formed at the bottom of the circuit board, and the second encapsulation body forms a mounting area sunken relative to the circuit board for mounting a photosensitive chip to reduce the mounting height of the photosensitive chip.

[0014] One advantage of the present application is to provide an imaging module and a manufacturing method thereof, in which a reinforcing plate is provided at the bottom of the second encapsulation body, and the reinforcing portion strengthens the strength of the bottom and forms a support for the photosensitive chip to improve the reliability of the imaging module.

[0015] One advantage of the present application is to provide an imaging module and a manufacturing method thereof, in which the circuit board is covered by a two-layer molding structure, with high strength and capable of meeting the requirements of the chip flip-chip process.

[0016] One advantage of the present application is to provide an imaging module and a manufacturing method thereof, in which the photosensitive chip can be installed after assembling the motor, and the photosensitive chip can be avoided from being damaged when the motor is tested without the photosensitive chip.

[0017] According to one aspect of the present application, the present application provides an imaging module, including:

[0018] A photosensitive chip, a circuit board, an optical lens, and a motor, wherein the photosensitive chip is electrically connected to the circuit board, and the optical lens and the motor are arranged on the photosensitive path of the photosensitive chip;

[0019] Further comprising:

[0020] A base, the motor is assembled on the base, the base is integrally formed on the circuit board, encapsulating at least a part of the circuit board, and forming a first encapsulation body and a second encapsulation body on the first surface and the second surface of the circuit board respectively;

[0021] The circuit board includes an outer press-fitting portion and an inner press-fitting portion. The outer press-fitting portion extends outward between the first encapsulation body and the second encapsulation body and is located outside the base. The inner press-fitting portion is formed around the circuit board through hole of the circuit board and extends out in the optical axis direction between the first encapsulation body and the second encapsulation body. The photosensitive chip is located below the inner press-fitting portion, and there is an overlap between the projection of the photosensitive chip and the inner press-fitting portion in the optical axis direction.

[0022] According to an example of the present application, the first surface has a first inner press-fitting portion, the first inner press-fitting portion surrounds the circuit board through hole and is exposed from the first opening area of the first encapsulation body.

[0023] According to an example of the present application, the first encapsulation body is integrally formed with a base portion and a filter mounting portion. The base portion encapsulates most of the area of the first surface. The filter mounting portion extends in the optical axis direction from the inner peripheral side surface of the base portion and is located between the base portion and the first inner press-fitting portion.

[0024] According to an example of the present application, the imaging module further includes a filter, the filter is mounted on the filter mounting portion, the top of the filter is lower than the top surface of the base portion, and the bottom of the filter is higher than the first surface.

[0025] According to an example of the present application, the second surface has a second inner press-fitting portion, the second inner press-fitting portion surrounds the circuit board through hole and is exposed from the second opening area of the second encapsulation body. The photosensitive chip is disposed in the second opening area. Wherein, the second inner press-fitting portion is provided with a conduction portion, the conduction portion is opposite to the non-photosensitive area of the photosensitive chip, and the non-photosensitive area is connected to the conduction portion, so that the photosensitive chip and the circuit board are flip-chip bonded.

[0026] According to an example of the present application, the corner of the circuit board has a clearance space, the periphery of the first encapsulation body is provided with steps, the clearance space is located between adjacent steps, and the outer press-fitting portion extends outward between the step on one side and the second encapsulation body.

[0027] According to an example of the present application, the first encapsulation body integrally forms a base portion, a plurality of support arms, and a plurality of guiding portions. The base portion extends convexly from the first surface of the circuit board. A plurality of the support arms extend convexly from the corners of the base portion. The guiding portions are disposed adjacent to the support arms. The motor is mounted in an assembly space defined between the support arms, and the bottom surface of the motor is abutted against the top surface of the base portion.

[0028] According to an example of the present application, the step extends outward from the periphery of the base portion. The top of the step is lower than the top surface of the base portion, and a first clearance space is formed between adjacent steps. The first clearance space is located outside the support arms and above the clearance space.

[0029] According to an example of the present application, a second clearance space is formed at the corner of the second encapsulation body. The second clearance space is located below the clearance space.

[0030] According to an example of the present application, the camera module further includes a reinforcing plate, and the reinforcing plate is mounted on the bottom of the second encapsulation body to cover the second encapsulation body and the photosensitive chip.

[0031] According to an example of the present application, the camera module further includes a connection component, and the connection component is connected to the external lamination portion.

[0032] According to an example of the present application, the base is provided with a plurality of anti-shake conduction grooves and a plurality of independent anti-shake conductive members. The plurality of anti-shake conduction grooves are disposed on a part of the same side of the base. The anti-shake conductive members are disposed in the anti-shake conduction grooves, with one end electrically connected to the circuit board and the other end electrically connected to the motor.

[0033] According to another aspect of the present application, the present application provides a manufacturing method of a camera module, including the following steps:

[0034] Form a base on the circuit board. Among them, an external lamination portion and an internal lamination portion are provided on the circuit board. A first encapsulation body is integrally formed on the first surface between the external lamination portion and the internal lamination portion, and a second encapsulation body is integrally formed on the second surface between the external lamination portion and the internal lamination portion;

[0035] Assemble the motor and the filter to the motor mounting portion and the filter mounting portion integrally formed by the first encapsulation body respectively;

[0036] And, mount the photosensitive chip in the second window area of the second encapsulation body and conduct electrical connection with the circuit board.

[0037] According to an example of the present application, it further includes the step of:

[0038] After forming the first encapsulation, flatten the circuit board; and

[0039] A conduction part is provided at a second inner lamination part where the inner lamination part is exposed from the second opening area.

[0040] According to an example of the present application, it further includes the step of:

[0041] Before assembling the motor, flatten the support arm and the guiding part integrally formed with the first encapsulation.

[0042] According to an example of the present application, it further includes the step of:

[0043] Steps are formed around the first encapsulation, and a first clearance space is provided between adjacent steps; and

[0044] The bottom of the housing is abutted against the steps. Description of the Drawings

[0045] Figure 1 are schematic diagrams and partial enlarged views of a camera module according to some examples of the present application.

[0046] Figure 2 are cross-sectional schematic diagrams and partial enlarged views of a camera module according to some examples of the present application.

[0047] Figure 3 are schematic diagrams and partial enlarged views of a photosensitive component of a camera module according to some examples of the present application.

[0048] Figure 4 is an exploded schematic diagram of a photosensitive component of a camera module according to some examples of the present application.

[0049] Figure 5A is a schematic diagram of a top view of a first encapsulation of a camera module according to some examples of the present application.

[0050] Figure 5B is a schematic diagram of a bottom view of a first encapsulation of a camera module according to some examples of the present application.

[0051] Figure 6 is an exploded schematic diagram of a partial structure of a photosensitive component of a camera module according to some examples of the present application.

[0052] Figure 7 is a schematic diagram of a conductive structure of a photosensitive component and a motor of a camera module according to some examples of the present application.

[0053] Figure 8A is a schematic diagram of a schematic implementation manner of a motor of a camera module according to some examples of the present application.

[0054] Figure 8B Another schematic diagram of a schematic implementation of the motor of the camera module according to some examples of the present application.

[0055] Figure 9 Schematic diagram of a schematic implementation of the motor of the camera module according to some examples of the present application. Detailed implementation manners

[0056] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments in the following description are only examples, and those skilled in the art can think of other obvious variations. The basic principles defined in the following description of the present invention can be applied to other embodiments, variations, improvements, equivalent solutions, and other technical solutions without departing from the spirit and scope of the present invention.

[0057] Those skilled in the art should understand that in the disclosure of the present invention, the orientation or positional relationships indicated by the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limiting the present invention.

[0058] It can be understood that the term "a" should be understood as "at least one" or "one or more". That is, in one embodiment, the number of an element can be one, while in other embodiments, the number of the element can be multiple. The term "a" should not be construed as limiting the quantity.

[0059] The present application provides a camera module, which is suitable for being assembled in an electronic device for imaging. The motor base of the camera module is integrally formed on the photosensitive component to form a molded base of the photosensitive component, so that the motor base and the molded base of the photosensitive component are of an integrated design, that is, the same structure, reducing the height of the camera module and also avoiding the problem that the motor base needs to be glued to the photosensitive component with glue, reducing the assembly difficulty. In addition, the base integrally forms a support arm and a ball groove, further reducing the height of the camera module, reducing the number of components, and reducing the assembly difficulty.

[0060] Referring to Figure 1 as shown in the figure, the camera module includes a photosensitive component 10, a motor 20, and an optical lens 30 arranged along the optical axis. The motor 20 and the optical lens 30 are arranged in the photosensitive path of the photosensitive component 10, and the motor 20 is configured to drive at least one of the optical lens 30 and the photosensitive component 10 to move.

[0061] Among them, according to actual requirements, the motor 20 can be configured to drive the optical lens 30 to move along the optical axis to adjust the focus of the camera module, realizing functions such as AF function or optical zoom; the motor can be configured to drive the optical lens 30 to perform translation, rotation, tilt jitter, etc. in a direction perpendicular to the optical axis to compensate for jitter and realize the OIS function; the motor can be configured to drive the photosensitive chip of the photosensitive component 10 to move in a direction perpendicular to the optical axis to compensate for jitter and realize the OIS function; the motor can also be configured to drive the photosensitive chip to move along the optical axis to realize focus adjustment.

[0062] The photosensitive component generally includes a base for carrying the motor and the optical lens. The motor also includes a base, which serves as a support structure for the main body of the motor. Usually, the base of the motor is assembled to the base of the photosensitive component, and the optical lens is assembled to the motor to form a camera module. Therefore, a conventional camera module usually has two base structures.

[0063] In order to reduce the height of the camera module and at the same time ensure or improve the driving force of the motor, in this application, the base of the camera module motor and the base of the photosensitive component are designed as the same structure. The base is integrally formed on the photosensitive component by a molding process, eliminating the independent motor base structure, reducing components, lowering the height, and reducing the assembly difficulty.

[0064] Furthermore, in the technical solution of this application, a motor mounting portion and a filter mounting portion are integrally formed on the base of the photosensitive component, simultaneously eliminating the motor base and the filter holder, saving multiple parts, reducing assembly steps, and further reducing the height of the base. The motor mounting portion integrally forms a support structure and a guiding structure, further saving the assembly parts and steps of the motor, and improving the assembly accuracy and efficiency.

[0065] Specifically, with reference to Figures 1 to 9 the schematic illustration, the implementation manner of the photosensitive component 10 of this application is described.

[0066] The photosensitive component 10 includes a circuit board 11 and a photosensitive chip 12, and the photosensitive chip 12 is electrically connected to the circuit board 11.

[0067] The photosensitive component 10 further includes a base 13, and the base 13 is integrally formed on the circuit board 11 to encapsulate at least a part of the circuit board 11. The base 13 includes a first encapsulation body 131 and a second encapsulation body 132. The first encapsulation body 131 is formed on the first surface 1101 of the circuit board 11, and the second encapsulation body 132 is formed on the second surface 1102 of the circuit board 11.

[0068] Among them, the first surface 1101 is the upper surface of the circuit board 11, facing the motor 20. The second surface 1102 is the lower surface of the circuit board 11, opposite to the first surface 1101.

[0069] That is, the base 13 forms a two-layer molding structure, and the circuit board 11 is placed between the two-layer molding structures, and its top and bottom are both molded, so that the circuit board 11 has higher structural strength and lower warpage.

[0070] Referring to Figures 1 to 5A As shown in the figure, a first encapsulation body 131 is integrally formed on the first surface 1101 of the circuit board 11. The first encapsulation body 131 integrally forms a base 1311, a filter mounting portion 1312, a support arm 1313, and a guiding portion 1314. The base 1311 forms the bottom of the first encapsulation body 131, and the filter mounting portion 1312 is formed on the inner peripheral portion of the base 1311 for mounting the filter 14. The support arm 1313 extends convexly from the corner of the base 1311, and the guiding portion 1314 is disposed adjacent to the support arm 1313.

[0071] The base 1311, the support arm 1313, and the guiding portion 1314 form a motor mounting portion, the motor 20 is assembled in the assembly space defined between the support arms 1313, and the bottom is abutted against the base 1311. The camera module further includes a filter 14, and the filter 14 is mounted on the filter mounting portion 1312.

[0072] The circuit board 11 has a circuit board through hole 110, and the bottom shape of the first encapsulation body 131 is adapted to the shape of the circuit board 11, and a first windowing area 1310 is defined around the circuit board through hole 110.

[0073] Among them, in some examples, the shape of the first windowing area 1310 is generally square; in some examples, the first windowing area 1310 is circular.

[0074] The base 1311 encapsulates most of the area of the circuit board 11, covering most of the area of the first surface 1101, and the electronic components (such as resistors, capacitors, etc.) provided on the first surface 1101 of the circuit board 11 are encapsulated inside the base 1311.

[0075] The base 1311 has a top surface 13111 and an inner peripheral side surface 13112, the bottom surface 201 of the motor 20 is abutted against the top surface 13111, and the inner peripheral side surface 13112 faces the first windowing area 1310.

[0076] The filter mounting portion 1312 extends a certain distance from the inner peripheral side surface 13112 of the motor mounting portion along the first surface 1101 of the circuit board 11 in the direction of the optical axis, forming a stepped structure within the inner periphery of the base portion 1311. The top of the filter mounting portion 1312 is lower than the top surface 13111 of the base portion 1311, forming a sunken mounting area 13120. The filter 14 is disposed in the mounting area 13120, and the bottom surface of the filter 14 is abutted against the top of the filter mounting portion 1312 for fixed connection between the filter mounting portion 1312 and the filter 14, so that the filter 14 is mounted to the first package 131.

[0077] The filter mounting portion 1312 has a certain height to raise the height of the filter 14 to a certain extent and avoid contact with the circuit board 11. The top of the filter mounting portion 1312 is lower than the top surface 13111 of the base portion 1311, and the height difference between the two is greater than the height of the filter 15, so that the base portion 1311 is higher than the filter 14, forming a protection structure around the outer peripheral side of the filter 14 to avoid impact and improve reliability.

[0078] The height of the filter mounting portion 1312 is lower than the height of the bottom of the motor mounting portion, and the filter 14 is lower than the bottom surface 201 of the motor 20 to avoid interference between the filter 14 and the motor 20.

[0079] In summary, the first package 131 integrally forms a motor mounting portion and a filter mounting portion on the upper surface of the circuit board 11, so as to eliminate the independent motor base structure and filter bracket structure, reduce the assembly steps, and reduce the mounting height of the motor and the filter, realizing the height reduction of the camera module. In addition, the first package 131 is integrally formed on the circuit board 11 by a molding process. Based on the characteristics of the molding process, the first package 131 has the characteristic of high flatness. Using the first package 131 as the base to assemble the motor 20 and the subsequent optical lens 30 reduces the inclination of the motor 20 and the optical lens 30 relative to the photosensitive component 10, which helps to achieve a function similar to active alignment. Moreover, the first package 131 provides a high-flatness mounting surface for the motor 20 and the filter 14, which can reduce the tilt of the camera module, reduce the assembly tolerance, and the assembly position is more accurate, eliminating the need for assembly calibration and improving the assembly accuracy.

[0080] Refer to Figures 1 to 4 and Figure 5B As shown in the schematic diagram, the second package 132 is integrally formed on the second surface 1102 of the circuit board 11 to further improve the strength of the circuit board 11 and reduce the deformation of the circuit board 11.

[0081] The second encapsulation body 132 has a second opening area 1320. The opening size of the second opening area 1320 is larger than the opening size of the circuit board through hole 110, such that a part of the circuit board 11 is exposed in the second opening area 1320 around the circuit board through hole 110.

[0082] The first opening area 1310, the circuit board through hole 110, and the second opening area 1320 are sequentially formed from top to bottom along the optical axis.

[0083] The photosensitive chip 12 is disposed in the second opening area 1320. The photosensitive chip 12 is located below the circuit board through hole 110, and its mounting height is lower than the height of the circuit board 11, such that the photosensitive chip 12 is mounted in a sunken manner relative to the circuit board 11, reducing the height of the photosensitive chip 12.

[0084] The photosensitive chip 12 includes a photosensitive area 1201 and a non - photosensitive area 1202, and the photosensitive area 1201 is exposed through the first opening area 1310, the circuit board through hole 110, and the second opening area 1320.

[0085] As Figure 2 shown, a conduction part 11021 is provided in the area around the circuit board through hole 110 on the second surface 1102, and the conduction part 11021 is exposed from the second opening area 1320. The conduction part 1142 and the non - photosensitive area 1202 are opposite, and at least part of their projections along the optical axis direction overlap, that is, there is an overlapping part in the projections of the circuit board 11 and the photosensitive chip 12 along the optical axis direction.

[0086] The photosensitive chip 12 and the circuit board 11 are conductively connected. Connection elements are respectively provided in the non - photosensitive area 1202 and the conduction part 11021, and a connecting piece is provided for conduction. Alternatively, the photosensitive chip 12 and the circuit board 11 are connected by the flip - chip process of FC (Flip Chip).

[0087] That is to say, the photosensitive chip 12 is located below the circuit board 11, such that the photosensitive chip 12 and the circuit board 11 are conductively connected through the flip - chip process. The projections of the photosensitive chip 12 and the circuit board 11 along the optical axis direction overlap, which helps to reduce the size of the circuit board 11 in the direction perpendicular to the optical axis, and further reduces the size of the photosensitive component 10 in the direction perpendicular to the optical axis.

[0088] In addition, the photosensitive chip 12 is located below the circuit board 11, such that the photosensitive chip 12 can be installed last. The circuit board 11 is molded to form a base 13, and the base 13 can be used as the base of the motor 20 and assembled with the components of the motor 20 for testing the performance of the motor 20. The photosensitive chip 12 can be not carried when testing the performance of the motor 20 to avoid damage to the photosensitive chip 12 during testing and reduce losses. After the testing is completed, the photosensitive chip 12 is assembled on the base 13 and flip - chip bonded with the circuit board 11.

[0089] Further, the second encapsulation body 132 has a certain height, which is higher than the height of the photosensitive chip 12, forming a protection structure for the photosensitive chip 12.

[0090] The second encapsulation body 132 has a second inner peripheral side surface 1321, and there is a certain interval between the second inner peripheral side surface 1321 and the photosensitive chip 12. Or rather, the second opening area 1320 of the second encapsulation body 132 is larger than the photosensitive chip 12, avoiding interference fit with the photosensitive chip 12 during the installation of the photosensitive chip 12 and also avoiding damage to the photosensitive chip 12.

[0091] A reinforcing plate 15 is provided at the bottom of the second encapsulation body 132. The reinforcing plate 15 covers the second encapsulation body 132 and its second opening area 1320 to further strengthen the structure of the circuit board 11. The reinforcing plate 15 is provided after the photosensitive chip 12 is installed to cover the second encapsulation body 132 and the photosensitive chip 12.

[0092] In addition, with reference to Figure 1 、 Figure 2 and Figure 6 for illustration, the structure of the motor mounting portion of the base 13 is specifically described. The motor mounting portion includes a base portion 1311, a support arm 1313 and a guiding portion 1312 which are integrally formed.

[0093] The base portion 1311 forms the bottom of the motor mounting portion. The outer contour of the cross-section of the base portion 1311 perpendicular to the optical axis direction is generally square, having four corner portions. The number of the support arms 1313 and the guiding portions 1314 is four, and each support arm 1313 and guiding portion 1314 are respectively formed at the four corner portions of the base portion 1311.

[0094] The support arms 1313 are located at the corner portions of the base portion 1311, and the guiding portions 1314 are located on the sides of the support arms 1313. Further, the guiding portions 1314 are rotationally symmetrically arranged around the optical axis, so that one guiding portion 1314 is respectively arranged on each side portion of the base portion 1311 perpendicular to the optical axis, avoiding occupying too much space on one side portion.

[0095] An assembly space is defined between the support arms 1313 at the four corners, which is suitable for assembling the motor 20. The height of the support arms 1313 is higher than that of the base 1311 and is adapted to the height of the motor 20. The bottom of the motor 20 is provided with a lower guiding portion, which cooperates with the guiding portion of the base 13 to accommodate the guiding member. The bottom surface 201 of the motor 20 is abutted against the top surface 13111 of the base 1311, the apex angles of the motor 20 are positioned and installed at the tops of the support arms 1313, and the lower guiding portion of the motor 20 corresponds to the guiding portion 1314 of the base 13, so that the motor 20 is quickly positioned and installed on the base 13, improving the assembly speed between the motor 20 and the photosensitive component 10. Moreover, the photosensitive chip 12 is positioned and installed on the circuit board 11, and the warpage degree of the circuit board 11 is low, reducing the alignment steps or alignment time during assembly and improving the assembly efficiency.

[0096] The height of the support arms 1313 is higher than that of the guiding portion 1314, determining the installation height of the top of the motor 20. When the first package 131 is formed in one molding, the support arms 1313 also need to be formed in one molding. Therefore, the outer surface 13131 of the support arms 1313 is designed to extend continuously and smoothly.

[0097] The housing 40 of the camera module is installed on the base 13 to cover the motor 20. The base 13 needs to be designed with a bearing structure for the housing 40. Further, a step 13113 is provided on the outside of the base 13 to form the bearing structure for the housing 40. Further, the step 13113 and the support arms 1313 need to be designed to avoid each other to prevent the step 13113 from extending to the outer surface 13131 of the support arms 1313. Therefore, steps 13113 are formed around the base 13, and a channel 100 is provided between adjacent steps 13113 to avoid the support arms 1313.

[0098] Specifically, the circuit board 11 includes a main body portion 111 and corner portions 112. The corner portions 112 are formed at the four corners of the main body portion 111. The outer edge of the main body portion 111 protrudes away from the optical axis relative to the outer edge of the corner portions 112 to form a clearance space 1120 outside the corner portions 112.

[0099] The corner portions of the first package 131 and the second package 132 are respectively formed with a first clearance space 13100 and a second clearance space 13200 corresponding to the shape of the circuit board 11. The outer peripheral side surface 1103 of the main body portion 111 is exposed between the first package 131 and the second package 132.

[0100] The support arm 1313 is located above the corner 112. The outer surface 13131 of the support arm 1313 is flush with the outer edge of the corner 112. The base 1311 extends upward from the main body 111, and the outer peripheral side of the base 1311 is flush with the outer peripheral side surface 1103 of the main body 111. An outwardly protruding step 13113 is formed on the outer periphery of the base 1311, and the outermost surface of the step 13113 forms the first outer peripheral side surface 1315 of the first encapsulation body 131, and the first outer peripheral side surface 1315 is flush with the outer peripheral side surface 1103 of the main body 111. Among them, a step 13113 is formed on the outer periphery of the base 1311 and / or on the outer periphery of the base 1311 and the guiding portion 1314.

[0101] The bottom of the housing 40 is abutted against the step 13113. Further, as Figure 2 shown, the bottom surface 401 of the housing is abutted against the step 13113. Among them, the step 13113 is located around the base 1311, and the first clearance space 13100 is located between two adjacent steps 13113.

[0102] The outer peripheral contour shape of the second encapsulation body 132 is adapted to the outer peripheral contour shapes of the circuit board 11 and the first encapsulation body 131. A second clearance space 13200 is formed at the corner of the second encapsulation body 132, and the second outer peripheral side surface 1322 of the second encapsulation body 132 is flush with the outer peripheral side surface 1103 of the main body 111.

[0103] Correspondingly, the outer peripheral contour shape of the reinforcing plate 15 is adapted to the outer peripheral contour shapes of the circuit board 11, the first encapsulation body 131 and the second encapsulation body 132. A third clearance space 150 is formed at the corner of the reinforcing plate 15, and the third outer peripheral side surface 151 of the reinforcing plate 15 is flush with the outer peripheral side surface of the main body 111.

[0104] From top to bottom along the optical axis at the corner of the photosensitive component 10, a first clearance space 13100, a clearance space 1120, a second clearance space 13200 and a third clearance space 150 are formed. A channel 100 is formed at the corner of the final photosensitive component 10. The channel 100 is located between adjacent steps 13113 and extends from the upper surface of the photosensitive component 10 (the top surface 13111 of the base 1311) to the lower surface of the photosensitive component 10 (the lower surface of the reinforcing plate 15). The bottom surface 401 of the housing 40 is abutted against the step 13113, and the bottom surface 201 of the motor 20 is abutted against the top surface 13111 of the base 1311.

[0105] The channel 100 is formed on the outer periphery of the support arm 1313. Or rather, the first clearance space 13100 is formed on the outer periphery of the support arm 1313. In some examples, the outer edge of the corner 112 is encapsulated by the first encapsulation body 131. That is, the first encapsulation body 131 covers the outer edge of the corner 112 of the circuit board 11.

[0106] When forming the first encapsulation body 131, a support arm 1313 is formed in one - step molding above the corner 112 of the circuit board 11. The outer surface 1313 of the support arm 1313 is arranged to continuously and smoothly extend, so that the molding material can be fully filled, and then the support arm 1313 is formed in one - step molding.

[0107] As Figure 1 and Figure 2 、 Figure 5A and Figure 5B As shown, the circuit board 11 includes an outer lamination part 113 and an inner lamination part 114, and a base 13 is formed in the space between the outer lamination part 113 and the inner lamination part 114. Further, the first encapsulation body 131 is integrally formed at the first surface 1101 between the outer lamination part 113 and the inner lamination part 114, and the second encapsulation body 132 is integrally formed at the second surface 1102 between the outer lamination part 113 and the inner lamination part 114.

[0108] The outer lamination part 113 extends outward from the edge on one side of the main body part 111. After molding the first encapsulation body 131 and the second encapsulation body 132, the outer lamination part 113 extends out between the first encapsulation body 131 and the second encapsulation body 132 and is located on one side of the base 13. Further, the outer lamination part 113 extends outward between the step 13113 and the second outer peripheral side surface 1322 of the second encapsulation body 132.

[0109] The photosensitive component 10 further includes a connection component 16. One end of the connection component 16 is connected to the outer lamination part 113 and is electrically connected to the circuit board 11, and the other end is adapted to be connected to an external device to electrically connect the circuit board 11 and the external device. The connection component 16 includes a connection band 161 and a connector 162. One end of the connection band 161 is connected to the outer lamination part 113, or rather, the connection band 161 extends outward from the outer lamination part 113 and is electrically connected to the circuit board 11. The connector 162 is connected to the other end of the connection band 161 and is adapted to be connected to an external device. The external device is an electronic component of an electronic device. When the imaging module is installed in the electronic device, the external device and the circuit board 11 are electrically connected through the connection component 16, so that the imaging module is electrically connected to the electronic device.

[0110] Further, the connector 162 is provided with a connector reinforcement plate 163, which is adapted to strengthen the structure of the connector 162.

[0111] As Figure 2 and Figure 5AAs shown, the opening size of the first opening area 1310 is larger than the opening size of the circuit board through hole 110, and a part of the circuit board 11 is exposed in the first opening area 1310 around the circuit board through hole 110. A part of the first surface 1101 of the circuit board 11 is exposed to the first opening area 1310, forming the first internal lamination part 1141.

[0112] Or rather, when forming the first package 131, the mold abuts against the first internal lamination part 1141 and the external lamination part 113, and a first lamination space between the circuit board 11 and the mold is formed at the first surface 1101 between the first internal lamination part 1141 and the external lamination part 113, so as to integrally form the first package 131 on the first surface 1101 of the circuit board 11.

[0113] The first package 131 integrally forms a motor mounting part and a filter mounting part 1312, and the filter mounting part 1312 is located between the motor mounting part and the first internal lamination part 1141.

[0114] As Figure 2 and Figure 5B shown, the exposed part of the second surface 1102 of the circuit board 11 faces the second opening area 1320, forming the second internal lamination part 1142. Or rather, when forming the second package 132, the mold abuts against the external lamination part 113 and the second internal lamination part 1142, and a second lamination space is formed at the second surface 1102 between the external lamination part 113 and the second internal lamination part 1142, so as to integrally form the second package 132 on the second surface 1102 of the circuit board 11.

[0115] The conduction part 11021 is arranged at the second internal lamination part 1142, and the projection of the second internal lamination part 1142 along the optical axis direction is larger than the projection of the first internal lamination part 11021 along the optical axis direction.

[0116] Furthermore, the projection of the second internal lamination part 1142 along the optical axis direction covers the projection of the first internal lamination part 11021 along the optical axis direction. The projection of the first package 131 along the optical axis direction covers the projection of the second package 132 along the optical axis direction.

[0117] In one example, after forming the first package 131, a connecting piece is arranged at the conduction part 11021, and then, the second package 132 is formed on the second surface 1102, obtaining the base 13.

[0118] In addition, referring to Figure 4 and Figure 7 for the schematic illustration, the base 13 is provided with a magnetic attraction element 133, and the magnetic attraction element 133 is built in the base 13. In one implementation manner, the magnetic attraction element 133 is attached to the circuit board 11, and then the base 13 is molded on the circuit board 11, so that the magnetic attraction element 133 is built in the base 13.

[0119] The base 13 is provided with a position sensing element 134, and the position sensing element 134 is built into the base 13. In one embodiment, the position sensing element 134 is attached to the circuit board 11 and conductively connected to the circuit board 11, and then the base 13 is molded on the circuit board 11, so that the position sensing element 134 is built into the base 13.

[0120] The magnetic attraction element 133 and the position sensing element 134 are arranged on the first surface 1101 of the circuit board 11. The first encapsulation body 131 is molded on the circuit board 11, so that the magnetic attraction element 133 and the position sensing element 134 are built into the base 13, eliminating subsequent assembly steps, avoiding occupying extra space, and having a more precise position setting.

[0121] When the base 13 is molded, electronic components on the circuit board 11, the magnetic attraction element 133, the position sensing element 134 and other components arranged on the circuit board 11 can be jointly encapsulated to be built into the base 13, avoiding being exposed outside the base 13, improving the flatness of the base 13, and improving the installation accuracy of the foregoing components and reducing assembly tolerances.

[0122] Next, with reference to Figures 1 to 9 the schematic diagram, the structure of the motor 20 of the present application will be further described.

[0123] As Figure 8A shown, avoiding spaces 200 are formed at the four corners of the motor 20 to avoid the support arms 1313 and the guiding portions 1314. It is defined that the avoiding space 200 includes a first avoiding space 2001 for avoiding the support arms 1313 and a second avoiding space 2002 for avoiding the guiding portions 1314. After the motor 20 is installed on the base 13, the support arms 1313 are located in the first avoiding space 2001, and the guiding portions 1314 are located in the second avoiding space, so as to avoid structural interference, reduce the installation height, and facilitate positioning and installation.

[0124] The motor 20 includes an actuating assembly 21, a bearing mechanism and a suspending member. The bearing mechanism is assembled on the base 13 and is adapted to bear the optical lens 30. The suspending member suspends the bearing mechanism on the base 13, and the actuating assembly 21 drives the bearing mechanism so that the bearing mechanism moves relative to the base 13.

[0125] Schematically, with reference to Figure 9, the motor 20 includes a flexible printed circuit board 211, an anti-shake carrier 22, a focusing carrier 23, an upper elastic piece 24, and a lower elastic piece 25. The flexible printed circuit board 211 is adapted to be electrically connected to the circuit board 11. The anti-shake carrier 22 and the focusing carrier 23 form a bearing mechanism for the optical lens 30. The bearing mechanism and the base 13 move relative to each other, so that the optical lens 30 and the photosensitive chip 12 move relative to each other. Among them, the anti-shake carrier 22 and the base 13 move relative to each other to enable the camera module to perform shake compensation movement; the focusing carrier 23 and the base 13 move relative to each other to enable the camera module to perform focusing movement.

[0126] Combined Figure 2 and Figure 7 As shown, the flexible printed circuit board 211 is installed on the upper surface of the base 13, and further, is disposed on the top surface 13111 of the base portion 1311. The corners of the flexible printed circuit board 211 are arranged to avoid the support arm 1313 and the guiding portion 1314. In this embodiment, the bottom of the flexible printed circuit board 211 forms the bottom surface 201 of the motor 20 and contacts the top surface 13111 of the base portion 1311. In other embodiments, the bottom of the bearing mechanism of the motor 20 forms the bottom surface 201 of the motor and contacts the top surface 13111 of the base portion 1311.

[0127] The anti-shake carrier 22 is disposed on the side of the flexible printed circuit board 211 opposite to the base 13 along the optical axis. The corners of the anti-shake carrier 22 are arranged to avoid the first avoidance space 2001 of the support arm 1313 and the second avoidance space 2002 of the guiding portion 1314.

[0128] As Figure 8A shown, the motor 20 further includes a guiding member 26, which is assembled between the anti-shake carrier 22 and the base 13 to guide the relative movement between the anti-shake carrier 22 and the base 13. The surface of the bottom of the anti-shake carrier 22 facing the second avoidance space 2002 forms an upper guiding portion 221. The upper guiding portion 221 and the guiding portion 1314 are relatively positioned to define a space for receiving the guiding member 26. The guiding member 26 is assembled to the guiding portion 1314, and the anti-shake carrier 22 is assembled to the base 13 and is supported by the guiding member 26 on the base 13.

[0129] The actuating assembly 21 drives the anti-shake carrier 22 and the focusing carrier 23 to move to achieve the shake compensation function and the focus adjustment function. The actuating assembly 21 is electrically connected to the photosensitive assembly 10 to obtain electrical energy from the photosensitive assembly 10 and convert it into kinetic energy. In one embodiment of the actuation in the present application, as Figure 7As shown in the figure, the actuating component 21 adopts an electromagnetic actuation form and includes an anti-shake coil 212 and a magnet 213. The anti-shake coil 212 and the magnet 213 interact with each other, causing one of them to move relative to the other. One of the anti-shake coil 212 and the magnet 213 is installed on the base 13, and the other is installed on the anti-shake carrier. Under the interaction of the anti-shake coil 212 and the magnet 213, one of the base 13 and the anti-shake carrier moves relative to the other. The guiding member 26 is located between the anti-shake carrier 22 and the base 13, guiding one of the base 13 and the anti-shake carrier 22 to move relative to the other.

[0130] The upper spring piece 24 and the lower spring piece 25 form the suspension members of the motor and are respectively assembled on the upper side (opposite to the photosensitive component 10 along the optical axis) and the lower side (towards the photosensitive component 10 along the optical axis) of the anti-shake carrier 22 and the focusing carrier 23. The anti-shake carrier 22 and the focusing carrier 23 are suspended relative to the base 13 by the upper spring piece 24 and the lower spring piece 25, enabling relative movement between the anti-shake carrier 22 and the focusing carrier 23 and the base 13. The optical lens 30 is installed on the carrying mechanism and is supported by the anti-shake carrier 22 and the focusing carrier 23.

[0131] Taking the lens movement for shake compensation movement as an example, the actuating component 21 drives the anti-shake carrier 22 to move relative to the base 13 to achieve the OIS function. The anti-shake coil 212 is integrated on the flexible circuit board 211 and is arranged along the XY plane, and the magnet 213 is arranged on one side of the anti-shake coil along the Z axis.

[0132] That is to say, the anti-shake coil 212 is arranged on the base 13 along the Z axis, and the magnet 213 is opposite to the base 13 along the Z axis. The anti-shake coil 212 is directly formed on the flexible circuit board 211 to reduce the height; the magnet 213 is arranged inside the anti-shake carrier 22 or in the formed installation space for avoidance, and interacts with the anti-shake coil 212, causing the anti-shake carrier 22 to move.

[0133] The guiding part 1314 defines the lower guiding groove 13140, and the guiding member 26 moves in the lower guiding groove 13140. The upper guiding part 221 defines the upper guiding groove 2210, and at least a part of the guiding member 26 is received in the upper guiding groove 2210, and the position is adapted to the lower guiding groove 13140. The guiding member 26 moves in the space defined by the upper guiding groove 2210 and the lower guiding groove 13140. When the anti-shake carrier 22 is driven by the actuating component 21 to perform shake compensation movement, the guiding member 26 guides the anti-shake carrier 22 to move, reducing the movement friction between the anti-shake carrier 22 and the base 13, reducing the movement resistance of the anti-shake carrier 22, improving the movement parallelism, and increasing the shake compensation movement stroke.

[0134] The guiding member 26 is implemented as a spherical object, such as a ball, or is implemented as a cylindrical object, a conical object, etc.

[0135] Optionally, at least one lower guiding groove 13140 has a length in the X-axis direction for guiding member 26 to move in the X-axis direction, so as to guide the relative movement of the anti-shake carrier 22 and the base 13 in the X-axis direction. At least one lower guiding groove 13140 has a length in the Y-axis direction for guiding member 26 to move in the Y-axis direction, so as to guide the relative movement of the anti-shake carrier 22 and the base 13 in the Y-axis direction.

[0136] The guiding portion 1314 is arranged rotationally symmetrically about the optical axis. A set of diagonal guiding grooves 13140 has a length in the X-axis direction, and another set of diagonal guiding grooves 13140 has a length in the Y-axis direction.

[0137] Optionally, correspondingly, the upper guiding portion 221 is arranged rotationally symmetrically about the optical axis at the bottom of the anti-shake carrier 22. A set of diagonal upper guiding grooves 2210 has a length in the X-axis direction, and another set of diagonal upper guiding grooves 2210 has a length in the Y-axis direction. Further, the upper guiding grooves 221 and the lower guiding grooves 13140 form a cross-shaped track groove.

[0138] The magnetic attraction element 133 is arranged on the base 13. At least a part of the magnetic attraction element 133 and at least a part of the magnet 213 face each other in the optical axis direction to generate a magnetic attraction force to hold the motor 20 on the base 13 and prevent the guiding member 26 from falling off. In some examples, after the relative displacement between the anti-shake carrier 22 and the base 13, under the action of the magnetic attraction force between the magnetic attraction element 133 and the magnet 213, the relative position between the anti-shake carrier 22 and the base 13 can be restored to the initial state.

[0139] The actuating assembly 21 further includes a focusing coil 214. The focusing coil 214 is arranged on the focusing carrier 23. The magnet 213 and the focusing coil 214 interact to drive the focusing carrier 23 to move. The shake compensation movement and the focus adjustment movement share the magnet to save space and reduce the size. Further, the focusing coil 214 is arranged around the focusing carrier 23. The focusing carrier 23 is arranged inside the anti-shake carrier 22 in a direction perpendicular to the optical axis. A part of the upper elastic piece 24 is assembled to the anti-shake carrier 22, and a part is assembled to the focusing carrier 23. A part of the lower elastic piece 25 is assembled to the anti-shake carrier 22, and a part is assembled to the focusing carrier 23. Through elastic deformation, the anti-shake carrier 22 and the focusing carrier 23 are guided to move and / or reset.

[0140] As Figure 8B shown, the top of the support arm 1313 is provided with a positioning post 13132, and the corner of the upper elastic piece 24 is provided with a positioning hole 240. The positioning hole 240 and the positioning post 13132 cooperate with each other, so that the upper elastic piece 24 is installed on the support arm 1313, and further, the anti-shake carrier 22 and the focusing carrier 23 can be suspended on the base 13 between the support arms 1313 at the corners.

[0141] In addition, a position sensing element 134 is built into the base 13 to detect changes in the relative position between the carrier mechanism and the base 13, so as to control the motor 20 to drive the relative movement between the carrier mechanism and the base 13 to adjust the focus and / or compensate for jitter.

[0142] Furthermore, the position sensing element 134 includes a first position sensing element 1341 and a second position sensing element 1342. The first position sensing element 1341 and the second position sensing element 1342 are configured in different directions and are respectively opposite to the positions of magnets 213 in different directions to detect displacement amounts in different directions, such as detecting displacement amounts in the X direction and the Y direction. The position sensing element 134 is communicatively connected to the actuating assembly 21 to control the actuation of the actuating assembly 21 according to the detection results, improving the flexibility and accuracy of the jitter compensation movement. Figure 7 An example is shown in which the first position sensing element 1341 detects the displacement amount in the X-axis direction and the second position sensing element 1342 detects the displacement amount in the Y-axis direction.

[0143] The motor 20 needs to be electrically connected to the photosensitive component 10 to obtain electrical energy from the photosensitive component 10 and convert it into kinetic energy. The camera module includes a conductive member 17, and the circuit board 11 of the photosensitive component 10 and the motor 20 are electrically connected through the conductive member 17. Preferably, the conductive member 17 is disposed on the base 13, at least one end of the conductive member 17 is electrically connected to the circuit board 11, and at least one end is connected to the motor 20. At least one conducting portion is led out from the motor 20 and is electrically connected to the conductive member 17.

[0144] Reference Figures 7 to 8B As shown in the schematic diagram, the conductive member 17 includes a focusing conductive member 171 and an anti-shake conductive member 172. The focusing conductive member 171 is built into the support arm 1313, extends from the circuit board 11 along the focusing conduction groove 13130 of the support arm 1313 and is exposed at the top of the support arm 1313, and is adjacent to the positioning post 13132. A conduction terminal 241 is formed at the corner of the upper elastic piece 24, and the conduction terminal 241 is adjacent to the positioning hole 240. The positioning hole 240 and the positioning post 13132 cooperate with each other to mount the upper elastic piece 24 to the support arm 1313. The conduction terminal 241 serves as a conducting portion and contacts the focusing conductive member 171, so that the upper elastic piece 24 is electrically connected to the circuit board 11.

[0145] Or rather, the support arm 1313 is provided with a focusing conduction groove 13130 for accommodating the built-in focusing conductive member 171. The conduction terminal 241 of the upper elastic piece 24 forms a conducting portion of the actuating assembly 21 and is aligned with the focusing conduction groove 13130. The focusing conductive member 171 electrically connects the circuit board 11 and the conduction terminal 241 to form a conduction loop.

[0146] A focusing conductive member 171 is disposed within at least one of the support arms 1313. In one example, the focusing conductive members 171 are disposed within two diagonal support arms 1313.

[0147] A portion of the upper elastic sheet 24 is assembled to the focusing carrier 23, the focusing coil 214 is assembled to the focusing carrier 224, and the upper elastic sheet 24 and the focusing coil 214 are conductively connected. Therefore, the circuit board 11, the focusing conductive member 171, the upper elastic sheet 24, and the focusing coil 214 are conductively connected to form a focusing conduction loop.

[0148] The anti-shake conductive member 172 is mounted to the base 1311 to conduct the flexible circuit board 211 and the circuit board 11. The flexible circuit board 211 and the circuit board 11 are located on opposite sides of the base 1311 along the direction parallel to the optical axis, and the thickness of the base 1311 is small to shorten the conduction distance between the flexible circuit board 211 and the circuit board 11.

[0149] Specifically, in combination with Figure 3 and Figure 7 the example of, a groove 13110 is formed on the top surface 13111 of the base 1311. The anti-shake conductive member 172 is mounted within the groove 13110. The groove 13110 extends along the top surface 13111 of the base 1311 to the outer edge of the base 1311 and then bends downward and extends along the step 13113 of the base 1311 until it extends to the circuit board 11. The portion of the groove 13110 located on the top surface 13111 forms a receiving groove 131101, and the portion located on the step 13113 forms an anti-shake conduction groove 131102.

[0150] The anti-shake conductive member 172 includes a main body portion 1721, a first end portion 1722, and a second end portion 1723. The first end portion 1722 is adapted to be conductively connected to the flexible circuit board 211, the second end portion 1723 is adapted to be conductively connected to the circuit board 11, and the main body portion 1721 connects the first end portion 1722 and the second end portion 1723. The first end portion 1722 and the main body portion 1721 extend and are distributed within the receiving groove 131101, and the second end portion 1723 extends and is distributed within the anti-shake conduction groove 131102 and is conductively connected to the circuit board 11.

[0151] At least a part of the circuit board 11 is exposed via the anti-shake conduction groove 131102 to be conductively connected to the contact of the conductive member 17. The second end portion 1723 of the anti-shake conductive member 172 extends from the anti-shake conduction groove 131102 to the exposed part of the circuit board 11 and is conductively connected to the circuit board 11 to conduct the flexible circuit board 211 and the circuit board 11. Or rather, the circuit board 11 has a contact 115, and the contact 115 is exposed through the anti-shake conduction groove 131102 and is adapted to be conductively connected to the second end portion 1723.

[0152] The anti-shake coil 212 is integrated into the flexible circuit board 211 and is electrically connected to the circuit board 11 via the flexible circuit board 211 and the anti-shake conductive member 172, forming an anti-shake conduction loop.

[0153] Since the anti-shake conductive member 172 has a certain thickness, a groove 13110 is provided in the base 1311 to accommodate the anti-shake conductive member 172, so that the anti-shake conductive member 172 can be set flat with the base 1311. The flexible circuit board 211 is laid on the base 1311, and the flexible circuit board 211 can be kept flat.

[0154] Further, the anti-shake conductive member 172 is provided at the edge of the same side of the base 1311 to conduct the flexible circuit board 211 and the circuit board 11. The anti-shake conductive member 172 has a smaller volume and is accommodated in the groove 13110 in a form of avoidance without occupying other spaces, which is beneficial to reducing the volume and saving space.

[0155] The flexible circuit board 211 is provided with a via hole 2110. The via hole 2110 penetrates the flexible circuit board 211 along the direction parallel to the optical axis and serves as the conduction part led out by the motor 20. The via hole 2110 and the anti-shake coil 212 are arranged in an avoidance manner, and their spatial positions do not overlap.

[0156] The position of the via hole 2110 is adapted to the position of the first end 1722 of the anti-shake conductive member 172 on the base 111. After the flexible circuit board 211 is assembled to the base 1311, the first end 1722 is exposed in the via hole 211, and the first end 1722 is welded to the peripheral wall defining the via hole 211, so that the first end 1722 and the flexible circuit board 211 are conductively connected. The second end 1723 of the anti-shake conductive member 172 is conductively connected to the circuit board 11, so that the actuating assembly 21 and the photosensitive assembly 10 are conducted.

[0157] The peripheral wall of the via hole 2110 is plated with a conductive metal layer, such as a copper layer. The lead wire of the anti-shake coil 212 is led to the peripheral wall defining the via hole 2110. Further, the number of the via holes 2110 is four, and the number of the anti-shake conductive members 172 is also four. The four anti-shake conductive members 172 are independent of each other. The via holes 2110 and the anti-shake conductive members 172 are conductively connected one by one. The anti-shake coil 212 includes two first anti-shake coils 2121 extending and distributed along the X-axis direction, and two second anti-shake coils 2122 extending and distributed along the Y-axis direction. After the two first anti-shake coils 2121 are connected in series, a positive terminal and a negative terminal are led out and respectively led to a via hole 2110. After the two second anti-shake coils 2122 are connected in series, a positive terminal and a negative terminal are led out and respectively led to a via hole 2110.

[0158] The base 1311 includes two first parts distributed oppositely along the X-axis direction and two second parts distributed oppositely along the Y-axis direction. The anti-shake conductive member 172 is centrally disposed in one of the first parts or one of the second parts. Correspondingly, four via holes 2110 are disposed in a part on the same side of the flexible printed circuit board 211 to centrally conduct the conductive structure and reduce the occupied space. That is, the anti-shake conductive member 172 is disposed in a part on the same side of the base 13 and in a part on the same side of the base 1311.

[0159] Further, the four via holes 2110 are arranged in pairs on the flexible printed circuit board 211. Each pair includes two adjacent via holes 2110, and there is a certain interval between the two pairs of via holes 2110, which are respectively close to two adjacent corners of the flexible printed circuit board 211.

[0160] According to another aspect of the present application, in combination with Figures 1 to 9 as shown, the present application further provides a manufacturing method of the foregoing camera module, including the steps of integrally forming a first encapsulation body 131 on the first surface 1101 of the circuit board 11. Wherein, the mold is abutted against the first inner lamination part 1141 and the outer lamination part 113, a first lamination space is formed between the first surface 1101 and the mold, and a molding material is injected to form the first encapsulation body 131 on the first surface 1101.

[0161] Further, the method further includes the step of disposing a magnetic attraction element 133 and a position sensing element 134 on the first surface 1101 so as to be integrally encapsulated inside the first encapsulation body 131 after the first encapsulation body 131 is formed.

[0162] Further, the method further includes the step of forming a step 13113 around the base 13. Wherein, a step 13113 is formed around the first encapsulation body 131, and a first clearance space 13100 is provided between adjacent steps 13113. Further, the housing 40 is installed on the base 13 such that the bottom surface 401 of the housing is abutted against the step 13113.

[0163] The manufacturing method further includes the step of integrally forming a second encapsulation body 132 on the second surface 1102 of the circuit board 11. Wherein, the mold is abutted against the outer lamination part 113 and the second inner lamination part 1142, a second lamination space is formed between the second surface 1102 and the mold, and a molding material is injected to form the second encapsulation body 132 on the second surface 1102. The first encapsulation body 131 and the second encapsulation body 132 are respectively formed on the first surface 1101 and the second surface 1102 of the circuit board 11 to form the base 13.

[0164] Among them, it further includes steps of: arranging a conduction part 11021 in the area of the circuit board through hole 110 around the second surface 1102, and arranging a connecting part on the conduction part 11021. After that, a second encapsulation body 132 is formed on the second surface 1102. Correspondingly, a space for avoiding the conduction part 11021 is arranged in the mold, so that the second internal lamination part 1142 and the conduction part 11021 avoid each other.

[0165] Furthermore, it further includes steps of: leveling the circuit board 11 to improve the flatness of the conduction part 11021. Among them, after the first encapsulation body 131 is formed, pressure baking is carried out to level the circuit board 11 and improve the flatness of the conduction part 11021.

[0166] The manufacturing method further includes a step of: assembling the filter 14 to the filter mounting part 1312 of the first encapsulation body 132.

[0167] The manufacturing method further includes a step of: installing the motor 20 to the base 13.

[0168] Specifically, the bottom surface 201 of the motor 20 is abutted against the top surface 13111 of the base part 1311, the motor 20 and the circuit board 11 are conducted, the support arm 1313 supports the motor 20, and the corner of the upper spring piece 24 of the suspension member is assembled to the top end of the support arm 1313 to suspend the bearing mechanism of the motor 20. The guiding part 1314 and the upper guiding part 221 face each other, and a guiding member 26 is assembled between the guiding part 1314 and the guiding part 221.

[0169] Among them, before installing the motor 20, it further includes a step of: leveling the first encapsulation body 132. Furthermore, through pressure baking, the support arm 1313 and the guiding part 1314 of the first encapsulation body 131 are leveled to improve the flatness of the motor mounting part.

[0170] The manufacturing method further includes a step of: assembling the photosensitive chip 12 into the second windowing area 1320 of the second encapsulation body 132 and performing flip-chip bonding with the circuit board 11. Among them, before this step, it may further include steps of: after assembling the motor 20 to the base 13, using the base 13 as a motor base to perform a test on the motor 20. After the test is completed, the photosensitive chip 12 is installed.

[0171] The manufacturing method further includes a step of: installing the reinforcing plate 15 to the bottom of the second encapsulation body 132. The reinforcing plate 15 covers the second encapsulation body 132 and the photosensitive chip 12.

[0172] The above description is only a preferred embodiment of the present application and an explanation of the technical principles applied. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solutions formed by the specific combination of the above technical features, and should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept. For example, the technical solutions formed by mutually replacing the above features with the technical features (but not limited to) disclosed in the present application that have similar functions.

Claims

1. Camera module, characterized in that, it includes: a photosensitive chip, a circuit board, an optical lens, and a motor, the photosensitive chip is electrically connected to the circuit board, and the optical lens and the motor are arranged on the photosensitive path of the photosensitive chip; It further includes: a base, the motor is assembled on the base, the base is integrally formed on the circuit board, encapsulates at least a part of the circuit board, and forms a first encapsulation body and a second encapsulation body on the first surface and the second surface of the circuit board respectively; The circuit board includes an outer lamination part and an inner lamination part, the outer lamination part extends outwards between the first encapsulation body and the second encapsulation body and is located outside the base, the inner lamination part is formed around the circuit board through hole of the circuit board and extends outwards in the optical axis direction between the first encapsulation body and the second encapsulation body, the photosensitive chip is located below the inner lamination part, and the projections of the photosensitive chip and the inner lamination part in the optical axis direction overlap.

2. The camera module according to claim 1, wherein, the first surface has a first inner lamination part, the first inner lamination part surrounds the circuit board through hole and is exposed from the first opening area of the first encapsulation body.

3. The camera module according to claim 2, wherein, the first encapsulation body integrally forms a motor mounting part and a filter mounting part, the motor mounting part encapsulates most of the first surface area, and the filter mounting part extends from the inner peripheral side surface of the motor mounting part in the optical axis direction and is located between the motor mounting part and the first inner lamination part.

4. The camera module according to claim 3, wherein, the camera module further includes a filter, the filter is mounted on the filter mounting part, the top of the filter is lower than the top surface of the base, and the bottom of the filter is higher than the first surface.

5. The camera module according to claim 1, wherein, the second surface has a second inner lamination part, the second inner lamination part surrounds the circuit board through hole and is exposed from the second opening area of the second encapsulation body, the photosensitive chip is arranged in the second opening area, wherein, the second inner lamination part is provided with a conduction part, the conduction part is opposite to the non-photosensitive area of the photosensitive chip, and the non-photosensitive area is connected to the conduction part, so that the photosensitive chip and the circuit board are flip-chip bonded.

6. The camera module according to claim 1, wherein, the corner of the circuit board has a clearance space, steps are provided around the first encapsulation body, the clearance space is located between adjacent steps, and the outer lamination part extends outwards between the step on one side and the second encapsulation body.

7. The camera module according to claim 6, wherein, The first encapsulation body integrally forms a base portion, a plurality of support arms, and a plurality of guiding portions. The base portion extends convexly from the first surface of the circuit board. The plurality of support arms extend convexly from the corner portions of the base portion. The guiding portions and the support arms are disposed adjacent to each other. The motor is installed in the assembly space defined between the support arms, and the bottom surface of the motor is abutted against the top surface of the base portion.

8. The camera module according to claim 7, wherein, The step extends outward from the periphery of the base portion. The top of the step is lower than the top surface of the base portion. A first clearance space is formed between adjacent steps. The first clearance space is located outside the support arms and above the clearance space.

9. The camera module according to claim 6, wherein, A second clearance space is formed at the corner of the second encapsulation body. The second clearance space is located below the clearance space.

10. The camera module according to claim 1 or 6, wherein, The camera module further includes a reinforcing plate, and the reinforcing plate is installed at the bottom of the second encapsulation body to cover the second encapsulation body and the photosensitive chip.

11. The camera module according to claim 1 or 6, wherein, The camera module further includes a connection component, and the connection component is connected to the external lamination portion.

12. The camera module according to claim 1 or 7, wherein the base is provided with a plurality of anti-shake conduction grooves and a plurality of independent anti-shake conductive members. The plurality of anti-shake conduction grooves are disposed in a part of the same side of the base. The anti-shake conductive members are disposed in the anti-shake conduction grooves, with one end electrically connected to the circuit board and the other end electrically connected to the motor.

13. A manufacturing method of a camera module, characterized in that, comprises the following steps: forming a base on the circuit board, wherein an external lamination portion and an internal lamination portion are provided on the circuit board, and a first encapsulation body is integrally formed on the first surface between the external lamination portion and the internal lamination portion, and a second encapsulation body is integrally formed on the second surface between the external lamination portion and the internal lamination portion; respectively assembling the motor and the filter to the motor mounting portion and the filter mounting portion integrally formed by the first encapsulation body; and mounting the photosensitive chip in the second window area of the second encapsulation body and electrically connecting it to the circuit board.

14. The camera module according to claim 13, wherein, further comprises the steps of: after forming the first encapsulation body, leveling the circuit board; and providing a conduction portion on the second internal lamination portion where the internal lamination portion is exposed from the second window area.

15. The camera module according to claim 13, wherein, further comprises the steps of: before assembling the motor, leveling the support arms and guiding portions integrally formed by the first encapsulation body.

16. The camera module according to claim 13, wherein, further comprises the steps of: forming steps around the first encapsulation body, and having a first clearance space between adjacent steps; and abutting the bottom of the housing against the steps.

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