电路板组件及其制造方法
By setting an anisotropic conductive layer and a homogeneous circuit layer on the electronic component pins of the circuit board assembly, the problem of drilling misalignment in the manufacturing of high-density circuit boards is solved, thereby improving manufacturing yield and product reliability and reducing scrap rate.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD
- Filing Date
- 2023-11-30
- Publication Date
- 2026-07-17
AI Technical Summary
In the manufacturing of high-density circuit boards, the reduction in the pin size of tiny electronic components in existing embedded component technology increases the difficulty of laser drilling accuracy and alignment, which may lead to open circuits or short circuits, affecting performance and reliability, and increasing manufacturing complexity and cost.
An anisotropic conductive layer is placed on the pins of electronic components, and a homotropic circuit layer is placed on top of it. By utilizing the selective conductivity of the anisotropic conductive layer, the connection area of the pins can be increased, and the drilling misalignment problem can be reduced.
It improves the manufacturing yield of circuit board assemblies, reduces scrap rates, and maintains or improves the overall performance and reliability of products without adding extra costs and complexity.
Smart Images
Figure CN120076191B_ABST