Preparation method of optical chip with graphene film sprayed on side surface and optical chip

Abstract

The invention provides a preparation method of an optical chip with the side face sprayed with a graphene film and the optical chip, and relates to the technical field of semiconductors. The method comprises the steps that an optical chip to be sprayed with graphene is placed on a metal sheet, a substrate makes direct contact with the metal sheet, and a wire is led out to be grounded; two baffles are placed on the side face of the optical chip, a hollowed-out part with the same length and width as the side face of the optical chip is arranged between the baffles, and the optical chip is fixed to the baffles through the hollowed-out parts. Graphene powder and air enter a spray gun through a powder supply pipe and an air supply pipe, and charged and uncharged graphene powder is generated; the powder is guided to fly to the side face of the optical chip through a nozzle, so that the charged graphene powder is attached to the powder; and finally, baking the optical chip in an oven, and cooling to room temperature to cure the graphene film. Equipment used by the method is simple and convenient to operate, the heat dissipation area of the SOA chip can be effectively increased, the heat dissipation efficiency is improved, the power consumption is reduced, and the efficiency of the semiconductor optical amplifier is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and particularly to a method for preparing an optical chip with a graphene film spray-coated on the side and the optical chip. Background Art

[0002] In today's era, semiconductor optical amplifiers (SOAs) are being widely used in optical transmission systems. A semiconductor optical amplifier is a key optoelectronic device for amplifying optical signals. During the operation of a semiconductor optical amplifier, a large amount of heat is generated, seriously affecting the operating efficiency of the semiconductor optical amplifier and even reducing its service life. Therefore, it is crucial to study the heat dissipation problem of semiconductor optical amplifiers. Summary of the Invention

[0003] In order to overcome the deficiencies of the prior art, the purpose of the present invention is to provide a method for preparing an optical chip with a graphene film spray-coated on the side and the optical chip, which can solve the problems of too low heat dissipation efficiency of a semiconductor optical amplifier in the current technology, resulting in excessive power consumption and low output efficiency of the semiconductor optical amplifier.

[0004] To achieve the above purpose, the present invention provides the following solution: A method for preparing an optical chip with a graphene film spray-coated on the side, comprising: Placing the optical chip to be spray-coated with graphene on a metal sheet, directly contacting the substrate of the optical chip with the metal sheet, and leading out a wire from the metal sheet to ground; Placing two baffle plates on the sides of the optical chip respectively; a hollowed-out part is provided in the middle of the baffle plates, and the length and width of the hollowed-out part are equal to the length and width of the side of the optical chip; the optical chip is fixed on the baffle plates respectively through the hollowed-out part; Feeding graphene powder and air into the pipeline of the gun body of a spray gun with an electro-negative material as the cavity material through a graphene powder supply pipe and an air supply pipe respectively to generate charged graphene powder and uncharged graphene powder; Guiding the obtained charged graphene powder and uncharged graphene powder to leave the gun body of the spray gun through a nozzle, and flying towards the side of the optical chip under the action of an air flow, so that the charged graphene powder adheres to the side of the optical chip; Placing the optical chip in an oven for baking, and then taking out the optical chip and cooling it to room temperature, so that the graphene powder coating on the side of the optical chip is cured to form a graphene film, and the prepared optical chip is obtained.

[0005] Preferably, the material of the baffle plate is a non-conductive material; the non-conductive material includes: plastic, rubber and glass.

[0006] Preferably, the height from the bottom edge of the hollowed-out part to the bottom edge of the baffle plate is equal to the thickness of the metal sheet.

[0007] Preferably, the diameter of the graphene powder is 35 to 45 microns.

[0008] Preferably, the material of the metal sheet is any one of silver, copper, aluminum, and sodium.

[0009] Preferably, the value of the width of the metal sheet is the value of the width of the optical chip minus the thickness values of the two baffles.

[0010] Preferably, the length of the metal sheet is greater than the length of the optical chip.

[0011] Preferably, the electronegative material includes any one of polyethylene, polytetrafluoroethylene, and polypropylene.

[0012] Preferably, the baking conditions are: baking at 200 °C for 10 min.

[0013] An optical chip is prepared by the above method.

[0014] According to the specific embodiments provided by the present invention, the following technical effects are disclosed by the present invention: The experimental equipment required by the present invention is simple and easy to operate. By applying graphene on the side of the SOA chip, the heat dissipation area of the SOA chip is increased, the heat dissipation efficiency is improved, the power consumption is reduced, and the efficiency of the semiconductor optical amplifier is improved. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0016] Figure 1 It is a flowchart of the method provided by the embodiment of the present invention; Figure 2 It is a schematic diagram of the overall operation provided by the embodiment of the present invention; Figure 3 It is a schematic diagram of the optical chip with a clean surface provided by the embodiment of the present invention; Figure 4 It is a schematic diagram of the baffle with a clean surface provided by the embodiment of the present invention; Figure 5 It is a schematic diagram of the metal sheet with a clean surface provided by the embodiment of the present invention; Figure 6 It is a schematic diagram after the optical chip is placed on the metal sheet provided by the embodiment of the present invention; Figure 7Schematic diagram of the baffle placed on the side of the optical chip after the metal connection wire for the embodiment of the present invention; Figure 8 Schematic diagram of the optical chip with a graphene film formed on the side for the embodiment of the present invention.

[0017] Explanation of reference numerals: 1. Graphene powder supply tube; 2. Gas supply tube; 3. Wall of the spray gun body; 4. Graphene in the gun body pipeline; 5. Charged graphene powder; 6. Uncharged graphene powder; 7. Baffle; 8. Optical chip; 9. Substrate; 10. Metal sheet; 11. Wire; 12. Side of the optical chip; 13. Graphene film. Detailed implementation manners

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0019] The purpose of the present invention is to provide a preparation method and an optical chip for an optical chip with a graphene film sprayed on the side, which can solve the problems of too low heat dissipation efficiency of a semiconductor optical amplifier, resulting in too high power consumption and low output efficiency of the semiconductor optical amplifier in the current technology.

[0020] To make the above objects, features, and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation manners.

[0021] Figure 1 For the method flowchart provided by the embodiment of the present invention, as Figure 1 shown, the present invention provides a preparation method for an optical chip with a graphene film sprayed on the side, including: Step 100: Place the optical chip to be sprayed with graphene on the metal sheet, directly contact the substrate of the optical chip with the metal sheet, and lead out a wire on the metal sheet to be grounded; Step 200: Place two baffles on the sides of the optical chip respectively; there is a hollowed-out part in the middle of the baffle, and the length and width of the hollowed-out part are equal to the length and width of the side of the optical chip; the optical chip is fixed on the baffle through the hollowed-out part respectively; Step 300: Let graphene powder and air enter the pipeline of the spray gun body made of an electro-negative material through the graphene powder supply tube and the gas supply tube respectively to generate charged graphene powder and uncharged graphene powder; Step 400: Guide the obtained charged graphene powder and uncharged graphene powder through the nozzle to leave the gun body of the spray gun, and fly towards the side of the optical chip under the action of the air flow, so that the charged graphene powder adheres to the side of the optical chip; Step 500: Bake the optical chip in an oven, and then take out the optical chip and cool it to room temperature, so that the graphene powder coating on the side of the optical chip cures to form a graphene film, and the prepared optical chip is obtained.

[0022] Specifically, the specific implementation steps of this embodiment include S1: Prepare two baffles with hollowed-out middle, graphene powder and conductive metal sheets.

[0023] S2: Place the optical chip on the metal sheet, with the substrate in direct contact with the metal sheet, and a wire is led out from the metal sheet to be grounded.

[0024] S3: Place the two baffles on the side of the optical chip that needs to be sprayed with graphene.

[0025] S4: Pass the graphene powder and air into the pipeline of the gun body of the spray gun made of an electro-negative material through the graphene powder supply pipe and the air supply pipe respectively.

[0026] S5: After the graphene in the gun body pipeline collides and rubs against the pipe wall, charged graphene powder and uncharged graphene powder are generated.

[0027] S6: The charged graphene powder and uncharged graphene powder leave the gun body through the guidance of the nozzle, fly towards the side of the optical chip under the action of the air flow, and the charged graphene powder adheres to the side of the optical chip. Demonstratively, the traditional optical chip does not use thermal conductive glue and there is nothing on the side. The film formed by the friction electrostatic adsorption technology in step S6 makes the graphene directly contact the side of the SOA chip, greatly improving the heat conduction ability.

[0028] S7: Bake the optical chip in an oven, take out the chip and cool it to room temperature, and the graphene powder coating on the side of the optical chip cures to form a graphene film.

[0029] The optical chip with a graphene film sprayed on the side prepared by the above method in this embodiment includes an optical chip and a graphene film. The graphene film is formed by friction electrostatic spraying on the side of the optical chip. The method of friction electrostatic spraying graphene on the side of the optical chip can increase the heat conduction and long-term stability through the graphene film, improving the optoelectronic characteristics and amplification function.

[0030] Optionally, the selected material of the baffle is a non-conductive material such as plastic, so that the charged graphene powder is not easily adsorbed on the baffle. The length and width of the hollowed-out part of the baffle need to be equal to the length and width of the side of the optical chip, so that the optical chip can just be placed in it, and the powder will not leak from the gap to other sides of the optical chip. The height from the bottom edge of the hollowed-out pattern in the middle of the baffle to the bottom edge of the baffle needs to be equal to the thickness of the metal sheet, so that the chip can be placed on the table for subsequent spraying operation.

[0031] Specifically, the diameter of the graphene powder added in this embodiment is 40 microns, and new graphene powder needs to be added regularly during the spraying process to adjust the deviation of the powder size distribution.

[0032] Furthermore, the selected material of the metal sheet in this embodiment is a material with good electrical conductivity such as copper, so that the current transmission effect between the metal sheet and the optical chip is better. The width of the metal sheet is the width of the optical chip minus the thickness of two baffles, so that the side of the optical chip can just be stuck into the hollowed-out part of the baffle. The length of the metal sheet needs to be slightly greater than the length of the optical chip to facilitate leading out a wire to ground above the metal sheet.

[0033] Even further, the cavity material of the gun body pipeline of the spray gun needs to be a strongly electro-negative material such as polytetrafluoroethylene, so that the powder becomes positively charged when it collides with the pipe wall. Through the electrostatic friction adsorption technology, a graphene film is formed, omitting the traditional thermal conductive adhesive part. The graphene is in direct contact with the side of the SOA chip, greatly improving the heat conduction ability.

[0034] As an alternative implementation, this embodiment also provides another implementation, specifically including: S1: Prepare an optically clean chip 8 with a clean surface, two baffles 7 with a hollow in the middle, a conductive metal sheet 10 and graphene powder: As Figure 3 shown, the length, width and height of the selected optically clean chip 8 are 0.9 mm × 0.4 mm × 0.1 mm; As Figure 4 shown, the length and width of the baffle 7 are 2 mm × 1 mm, and the length and width of the hollowed-out pattern in the middle are 0.9 mm × 0.1 mm; As Figure 5 shown, the length and width of the metal sheet 10 are 1.5 mm × 0.4 mm.

[0035] S2: As Figure 6 shown, place the optically clean chip 8 on the metal sheet 10, the substrate 9 is in direct contact with the metal sheet 10, and lead out a wire 11 to ground at a position on the metal sheet 10 that is not in contact with the optically clean chip 8. As Figure 7 shown, place two baffles 7 on the sides of the optically clean chip that need to be sprayed with graphene, and the side of the optically clean chip just fits into the hollowed-out part in the middle of the baffle 7.

[0036] S3: As Figure 2As shown, graphene powder and air enter the spray gun through the graphene powder supply tube 1 and the air supply tube 2 respectively. The pipeline 3 of the spray gun body uses the electro-negative material polytetrafluoroethylene as the cavity material.

[0037] S4: When the graphene powder 4 entering the gun body pipeline flows in the gun body, it collides and rubs against the inner wall 3 of the spray gun body, generating charged graphene powder 5.

[0038] S5: The charged graphene powder 5 and the uncharged graphene powder 6 leave the gun body under the guidance of the spray gun nozzle, fly towards the side 12 of the optical chip under the action of the air flow, and finally the charged graphene powder adheres to the side 12 of the optical chip.

[0039] S6: After baking the optical chip 8 in an oven at 200 °C for 10 min, take out the optical chip 8 and place it in a dust-free room at 23 °C to cool down. The graphene powder 5 adhering to the side 12 of the optical chip after cooling to room temperature solidifies to form a graphene film 13, as Figure 8 shown.

[0040] The beneficial effects of the present invention are as follows: The experimental equipment required by the present invention is simple and easy to operate. The inner wall of the gun body material polytetrafluoroethylene of the electro-cathode makes the graphene positively charged. Through the guidance of the nozzle, the charged graphene can be attached to the side of the SOA chip, omitting the traditional thermal conductive adhesive part. The graphene is in direct contact with the side of the SOA chip, greatly improving the heat conduction ability.

[0041] In this specification, each embodiment is described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. The same or similar parts among the embodiments can be referred to each other.

[0042] Specific examples are used in this article to elaborate on the principle and implementation mode of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation mode and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A method for preparing an optical chip with a graphene film sprayed on the side, characterized in that: include: The optical chip to be sprayed with graphene is placed on the metal sheet, and the substrate of the optical chip is in direct contact with the metal sheet, and a wire is led out from the metal sheet to be grounded; Two baffles are placed on the sides of the optical chip respectively; a hollow portion is provided in the middle of the baffle, and the length and width of the hollow portion are equal to the length and width of the side of the optical chip; the optical chip is fixed on the baffle through the hollow portion; The graphene powder and air are respectively introduced into the pipeline of the spray gun body with the negative-charged material as the cavity material through the graphene powder supply pipe and the air supply pipe to produce charged graphene powder and uncharged graphene powder; The charged graphene powder and the uncharged graphene powder are guided by the nozzle to leave the spray gun body and fly to the side of the optical chip under the action of the airflow, so that the charged graphene powder is attached to the side of the optical chip; After the optical chip is placed in an oven for baking, the optical chip is taken out and cooled to room temperature, so that the graphene powder coating on the side of the optical chip is cured to form a graphene film, thereby obtaining a prepared optical chip.

2. The method for preparing an optical chip with a graphene film sprayed on the side according to claim 1, characterized in that: The material of the baffle is a non-conductive material; the non-conductive material includes: plastic, rubber and glass.

3. The method for preparing an optical chip with a side-sprayed graphene film according to claim 1, characterized in that: The height from the bottom edge of the hollow portion to the bottom edge of the baffle is equal to the thickness of the metal sheet.

4. The method for preparing an optical chip with a side-sprayed graphene film according to claim 1, characterized in that: The diameter of the graphene powder is 35-45 microns.

5. The method for preparing an optical chip with a graphene film sprayed on the side according to claim 1, characterized in that: The material of the metal sheet is any one of silver, copper, aluminum and sodium.

6. The method for preparing an optical chip with a graphene film sprayed on the side according to claim 1, characterized in that: The width of the metal sheet is the value obtained by subtracting the thickness of the two baffles from the width of the optical chip.

7. The method for preparing an optical chip with a graphene film sprayed on the side according to claim 1, characterized in that: The length of the metal sheet is greater than the length of the optical chip.

8. The method for preparing an optical chip with a graphene film sprayed on the side according to claim 1, characterized in that: The electro-negative material includes any one of polyethylene, polytetrafluoroethylene, and polypropylene.

9. The method for preparing an optical chip with a graphene film sprayed on the side according to claim 1, characterized in that: The baking conditions are: baking at 200°C for 10 minutes.

10. An optical chip, characterized in that: It is prepared based on the method according to any one of claims 1 to 9.

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