Optical device package

Abstract

The invention provides an optical device package comprising: a carrier having a first surface and a second surface recessed relative to the first surface; and a cover disposed on the second surface of the carrier.

Description

[0001] This application is a divisional application of the application with the application date of October 21, 2020, application number 202011133244.9, and invention name of Optical Device Package. Technical Field

[0002] The present invention relates to an optical device package, and more particularly, to a package structure with low manufacturing cost and confidential performance. Background Art

[0003] An optical device package may include some semiconductor devices on a carrier. Some of the semiconductor devices may be integrated or embedded in the carrier to achieve miniaturization. However, it may be inevitable to increase the cost of integrating or embedding the semiconductor devices into the carrier. Summary of the Invention

[0004] In some embodiments, an optical device package includes a carrier and a cover. The carrier includes a first surface and a second surface recessed relative to the first surface. The cover is disposed on the second surface of the carrier.

[0005] In some embodiments, an optical device package includes a carrier and a cover. The carrier includes a first surface and a second surface. The cover includes a first surface supported by the second surface of the carrier. The first surface of the carrier and the first surface of the cover are not in the same plane.

[0006] In some embodiments, a method of manufacturing an optical device package includes: providing a carrier; removing a portion of the carrier such that the carrier has a first surface and a second surface recessed relative to the first surface; and disposing a cover on the second surface of the carrier. Brief Description of the Drawings

[0007] Figure 1 A cross-sectional view of an optical device package according to some embodiments of the present invention is shown;

[0008] Figure 2 A cross-sectional view of an optical device package according to some embodiments of the present invention is shown;

[0009] Figure 3 A cross-sectional view of an optical device package according to some embodiments of the present invention is shown;

[0010] Figure 4 A cross-sectional view of an optical device package according to some embodiments of the present invention is shown;

[0011] Figure 5 A cross-sectional view of an optical device package according to some embodiments of the present invention is shown;

[0012] Figure 6A cross-sectional view of an optical device package according to some embodiments of the present invention is shown;

[0013] Figure 7 A cross-sectional view of an optical device package according to some embodiments of the present invention is shown;

[0014] Figure 8 A cross-sectional view of an optical device package according to some embodiments of the present invention is shown;

[0015] Figure 9 A cross-sectional view of an optical device package according to some embodiments of the present invention is shown;

[0016] Figure 10 A cross-sectional view of an optical device package according to some embodiments of the present invention is shown;

[0017] Figure 11 A cross-sectional view of an optical device package according to some embodiments of the present invention is shown;

[0018] Figure 12 A cross-sectional view of an optical device package according to some embodiments of the present invention is shown;

[0019] Figure 13 A cross-sectional view of an optical device package according to some embodiments of the present invention is shown;

[0020] Figure 14 A cross-sectional view of an optical device package according to some embodiments of the present invention is shown;

[0021] Figure 15 A cross-sectional view of an optical device package according to some embodiments of the present invention is shown;

[0022] Figure 16 A cross-sectional view of an optical device package according to some embodiments of the present invention is shown; and

[0023] Figure 17A 、 17B 、17C, 17D, 17E, 17F, 17G, 17H, 17I and 17J show one or more stages of a method of manufacturing an optical device package according to some embodiments of the present invention.

[0024] Figure 18A 、 18B 、18C, 18D, 18E, 18F, 18G, 18H, 18I and 18J show one or more stages of a method of manufacturing an optical device package according to some embodiments of the present invention.

[0025] Like reference numerals are used throughout the drawings and the detailed description to indicate the same or similar components. The present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. Detailed Implementation Manner

[0026] The foregoing description and the following detailed description are exemplary for the purpose of further explaining the scope of the present invention. Other objectives and advantages related to the present invention will be described in the subsequent description and the accompanying drawings.

[0027] Unless otherwise specified, spatial descriptions such as "above", "below", "upward", "left", "right", "downward", "top", "bottom", "vertical", "horizontal", "side", "higher", "lower", "upper", "above", "below", etc. are indicated relative to the orientation shown in the figures. It should be understood that the spatial descriptions used herein are for illustrative purposes, and the actual implementation of the structures described herein can be spatially arranged in any orientation or manner, provided that the advantages of the embodiments of the present invention are not deviated by such an arrangement.

[0028] Figure 1 A cross-sectional view of an optical device package 1 according to some embodiments of the present invention is shown. The optical device package 1 includes a carrier 10 and a cover 17. In some embodiments, the carrier 10 may comprise a ceramic material or a metal plate. In some embodiments, the carrier 10 may be a substrate, an organic substrate, or a lead frame. In some embodiments, the carrier 10 may comprise a plurality of traces. Figure 1 The carrier 10 shown in includes a redistribution structure 11, electrical connectors 12, a encapsulant 13, a semiconductor device 14, an optical element 15, and an underfill layer 16.

[0029] The redistribution structure 11 has a surface 111 and a surface 112 opposite to the surface 111. At least one of the electrical connectors 12 is on the surface 112 of the redistribution structure 11. The encapsulant 13 encapsulates the surface 112 and the side surface 113 of the redistribution structure 11 and the electrical connectors 12. A part of each electrical connector 12 is exposed by the encapsulant 13.

[0030] The semiconductor device 14 is mounted on the surface 112 of the redistribution structure 11. The semiconductor device 14 and the redistribution structure 11 are electrically connected by bumps 141. In some embodiments, the space between the bumps 141 is filled with the underfill layer 16. The electrical connectors 12 surround the periphery of the semiconductor device 14 and are used to fan out the input and output of the semiconductor device 14. The optical element 15 (e.g., an optical transmitter or an optical detector) is mounted on the surface 111 of the redistribution structure 11 and is electrically connected to the redistribution structure.

[0031] As Figure 1As shown, the encapsulant 13 encapsulates the surface 112 and the side surface 113 of the redistribution structure 11 and the electrical connector 12. The encapsulant 13 has a surface 131, a surface 132 recessed with respect to the surface 131, and a surface 135 connecting the surface 131 and 132. The surface 131 of the encapsulant 13 can be substantially coplanar with the surface 111 of the redistribution structure 11, and thus the surface 132 of the encapsulant 13 is less in height than the surface 131 of the encapsulant 13 and the surface 111 of the redistribution structure 11. In addition, the surface 132 is adjacent to the side surface 133 of the encapsulant 13.

[0032] In view of the above, referring to Figure 1 , the carrier 10 has a recessed portion formed by the surfaces 132 and 135 on its side surface.

[0033] In addition, the cover 17 is disposed on the carrier 10. Referring to Figure 1 , the cover 17 is placed on the surface 132 of the encapsulant 13 by the adhesive 19. The adhesive 19 can be an optical adhesive, and the optical density (OD) value of the optical adhesive is greater than 3. Specifically, as Figure 1 shown, the adhesive 19 is substantially disposed on the surface 132 of the encapsulant 13 and the side surface 135 of the encapsulant 13, and the side surface is connected to the surfaces 131 and 132 of the encapsulant 13. That is, the adhesive 19 is disposed at the recessed portion of the carrier 10 and is substantially between the cover 17 and the carrier 10. In addition, since the adhesive 19 is disposed at the recessed portion of the carrier 10, the adhesive 19 may not migrate on the surfaces 131 and 111 to cover the wire 151. During an assembly process such as a heating or curing process, the wire 151 will not be pulled and dragged by the adhesive 19. The cover 17 has a surface 172 supported by the surface 132 of the encapsulant 13. Therefore, the surface 172 of the cover 17 is less in height than the surface 131 of the encapsulant 13 and the surface 111 of the redistribution structure 11. In other words, the surface 172 of the cover 17 is disposed at a different height from the surface 131 of the encapsulant 13 and the surface 111 of the redistribution structure 11. In some embodiments, the surface 173 of the cover 17 and the side surface 133 of the encapsulant 13 may not be coplanar with each other.

[0034] The cover 17 has a pore 175 at its top, and the pore 175 is substantially aligned with the optical element 15. The filter material 18 is disposed in the pore 175. In addition, since the cover 17 can be formed by injection molding, the roughness of the outer surface of the cover 17 can be substantially uniform. That is, the roughness of the side surface 173 of the cover 17 can be the same as the roughness of the top surface 171 of the cover 17.

[0035] Figure 2 A cross-sectional view of an optical device package 1 according to some embodiments of the present invention is shown. Figure 2The optical device package 1 shown in [reference] is similar in some aspects to Figure 1 the optical device package 1 shown in [reference], except that in Figure 2 substrate 100 is attached to surface 134 of encapsulant 13 and electrically connected to electrical connector 12, and surface 134 is opposite to surface 131 of encapsulant 13. In addition, electrical connector 12 may not be exposed. Thus, in at least some embodiments, optical device package 1 further includes substrate 100, and encapsulant 13 encapsulates surface 112 and side surface 113 of redistribution structure 11, surface 101 of substrate 100, and electrical connector 12.

[0036] Figure 3 FIG. [reference] shows a cross-sectional view of an optical device package 2 according to some embodiments of the present invention. Optical device package 2 includes carrier 20 and lid 27. In some embodiments, carrier 20 may comprise a ceramic material or a metal plate. In some embodiments, carrier 20 may be a substrate, an organic substrate, or a lead frame. In some embodiments, carrier 20 may include a plurality of traces. Figure 3 The carrier 20 shown in [reference] includes redistribution structure 21, electrical connectors 22, encapsulant 23, semiconductor device 24, optical element 25, and underfill layer 26.

[0037] Redistribution structure 21 has surface 211 and a surface 212 opposite to surface 211. At least one of electrical connectors 22 is on surface 212 of redistribution structure 21. Encapsulant 23 encapsulates surface 212 and side surface 213 of redistribution structure 21 and electrical connectors 22. A portion of each electrical connector 22 is exposed by encapsulant 23.

[0038] Semiconductor device 24 is mounted on surface 212 of redistribution structure 21. Semiconductor device 24 and redistribution structure 21 are electrically connected by bumps 241. In some embodiments, the space between bumps 241 is filled with underfill layer 26. Electrical connectors 22 surround the periphery of semiconductor device 24 and are used to fan out the inputs and outputs of semiconductor device 24. Optical element 25 is mounted on surface 211 of redistribution structure 21 and is electrically connected to the redistribution structure. Regarding the two optical elements 25, they may be two optical transmitters or two optical detectors, or one is an optical transmitter and the other is an optical detector.

[0039] As Figure 3As shown, the encapsulant 23 encapsulates the surface 212 and the side surface 213 of the redistribution structure 21 and the electrical connection member 22. The encapsulant 23 has a surface 231, a surface 232 recessed relative to the surface 231, and a surface 235 connecting the surface 231 and 232. The surface 231 of the encapsulant 23 may be substantially coplanar with the surface 211 of the redistribution structure 21, and thus the surface 232 of the encapsulant 23 is less in height than the surface 231 of the encapsulant 23 and the surface 211 of the redistribution structure 21. In addition, the surface 232 is adjacent to the side surface 233 of the encapsulant 23.

[0040] In view of the above, referring to Figure 3 , the carrier 20 has a recessed portion formed by the surfaces 232 and 235 on its side surface.

[0041] In addition, the cover 27 is disposed on the carrier 20. Referring to Figure 3 , the cover 27 is placed on the surface 211 of the redistribution structure 21 and the surface 232 of the encapsulant 23 by the adhesive 29. The adhesive 29 may be an optical adhesive, and the optical density (OD) value of the optical adhesive is greater than 3. Specifically, as Figure 3 shown, the adhesive 29 is substantially disposed on the surface 232 and the side surface 235 of the encapsulant 23 and on the first surface 211 of the redistribution structure 21, and the side surface is connected to the surfaces 231 and 232 of the encapsulant 23. That is, the adhesive 29 is disposed at the recessed portion of the carrier 20 and is substantially between the cover 27 and the carrier 20. In addition, since the adhesive 29 is disposed at the recessed portion of the carrier 20, the adhesive 29 may not migrate on the surfaces 231 and 211 to cover the wire 251. During an assembly process such as a heating or curing process, the wire 251 will not be pulled and dragged by the adhesive 29. The cover 27 has a surface 272 supported by the surface 232 of the encapsulant 23. Therefore, the surface 272 of the cover 27 is less in height than the surface 231 of the encapsulant 23 and the surface 211 of the redistribution structure 21. In other words, the surface 272 of the cover 27 and the surface 231 of the encapsulant 23 and the surface 211 of the redistribution structure 21 are arranged at different heights. In addition, the cover 27 may have an inner wall 274 that isolates the optical elements 25 from each other. The inner wall 274 of the cover 27 has a surface 276 supported by the surface 211 of the redistribution structure 21. Therefore, the surface 272 is less in height than the surface 276. That is, the surfaces 272 and 276 of the cover 27 are arranged at different heights. In some embodiments, the surface 273 of the cover 27 and the side surface 233 of the encapsulant 23 may not be coplanar with each other.

[0042] The cover 27 has two pores 275 at its top, and each of the pores 275 is generally aligned with the optical element 25. Additionally, filter materials 28 are respectively disposed within the pores 275. Moreover, since the cover 27 can be formed by injection molding, the roughness of the outer surface of the cover 27 can be generally uniform. That is, the roughness of the side surface 273 of the cover 27 can be the same as the roughness of the top surface 271 of the cover 27.

[0043] Figure 4 A cross-sectional view of an optical device package 2 according to some embodiments of the present invention is shown. Figure 4 The optical device package 2 shown in Figure 3 is somewhat similar to the optical device package 2 shown in Figure 4 except that in

[0044] Figure 5 A cross-sectional view of an optical device package 3 according to some embodiments of the present invention is shown. The optical device package 3 includes a carrier 30 and a cover 37. In some embodiments, the carrier 30 may comprise a ceramic material or a metal plate. In some embodiments, the carrier 30 may be a substrate, an organic substrate, or a lead frame. In some embodiments, the carrier 30 may include a plurality of traces. Figure 5 The carrier 30 shown in

[0045] includes a redistribution structure 31, electrical connectors 32, an encapsulant 33, a semiconductor device 34, an optical element 35, and an underfill layer 36.

[0046] The semiconductor device 34 is mounted on the surface 312 of the redistribution structure 31. The semiconductor device 34 and the redistribution structure 31 are electrically connected by bumps 341. In some embodiments, the space between the bumps 341 is filled by an underfill layer 36. The electrical connectors 32 surround the periphery of the semiconductor device 34 and are used to fan out the inputs and outputs of the semiconductor device 34. The optical element 35 (e.g., an optical transmitter or an optical detector) is mounted on the surface 311 of the redistribution structure 31 and is electrically connected to the redistribution structure.

[0047] As Figure 5 shown, the encapsulant 33 encapsulates the surface 312 of the redistribution structure 31 and the electrical connectors 32. Thus, the encapsulant 33 has a surface 331 that is recessed relative to the surface 311 of the redistribution structure 31 and adjacent to the side surface 313 of the redistribution structure 31. That is, the surface 331 of the encapsulant 33 is less in height than the surface 311 of the redistribution structure 31. Additionally, the surface 331 of the encapsulant 33 may be coplanar with the surface 312 of the redistribution structure 31.

[0048] In view of the above, referring to Figure 5 , the carrier 30 has a recessed portion formed by the surfaces 331 and 313 on its side surface.

[0049] In addition, a cover 37 is disposed on the carrier 30. Referring to Figure 5 , the cover 37 is placed on the surface 331 of the encapsulant 33 by an adhesive 39. The adhesive 39 can be an optical adhesive, and the optical density (OD) value of the optical adhesive is greater than 3. Specifically, as Figure 5 shown, the adhesive 39 is generally disposed on the surface 331 of the encapsulant 33 and the side surface 313 of the redistribution structure 31, which connects the surface 311 of the redistribution structure 31 and the surface 331 of the encapsulant 33. That is, the adhesive 39 is disposed at the recessed portion of the carrier 30 and is generally between the cover 37 and the carrier 30. Moreover, since the adhesive 39 is disposed at the recessed portion of the carrier 30, the adhesive 39 may not migrate on the surface 311 to cover the wire 351. During an assembly process such as a heating or curing process, the wire 351 will not be pulled and dragged by the adhesive 39. The cover 37 has a surface 372 supported by the surface 332 of the encapsulant 33. Thus, the surface 372 of the cover 37 is less in height than the surface 311 of the redistribution structure 31. In other words, the surface 372 of the cover 37 and the surface 311 of the redistribution structure 31 are disposed at different heights. In some embodiments, the surface 373 of the cover 37 and the side surface 333 of the encapsulant 33 may not be coplanar with each other.

[0050] The cover 37 has a pore 375 at its top, and the pore 375 is generally aligned with the optical element 35. The filter material 38 is disposed within the pore 375. In addition, since the cover 37 can be formed by injection molding, the roughness of the outer surface of the cover 37 can be generally uniform. That is, the roughness of the side surface 373 of the cover 37 can be the same as the roughness of the top surface 371 of the cover 37.

[0051] Figure 6 FIG. Cross-sectional view of an optical device package 3 according to some embodiments of the present invention. Figure 6 The optical device package 3 shown in is similar in some aspects to Figure 5 the optical device package 3 shown in, except that in Figure 6 the substrate 300 is attached to the surface 334 of the encapsulant 33 and electrically connected to the electrical connector 32, and the surface 334 is opposite to the surface 331 of the encapsulant 33. In addition, the electrical connector 32 may not be exposed. Therefore, in at least some embodiments, the optical device package 3 further includes a substrate 300, and the encapsulant 33 encapsulates the surface 312 of the redistribution structure 31, the surface 301 of the substrate 300, and the electrical connector 32.

[0052] Figure 7 FIG. Cross-sectional view of an optical device package 4 according to some embodiments of the present invention. The optical device package 4 includes a carrier 40 and a cover 47. In some embodiments, the carrier 40 may comprise a ceramic material or a metal plate. In some embodiments, the carrier 40 may be a substrate, an organic substrate, or a lead frame. In some embodiments, the carrier 40 may include a plurality of traces. Figure 7 The carrier 40 shown in includes a redistribution structure 41, electrical connectors 42, an encapsulant 43, a semiconductor device 44, an optical element 45, and an underfill layer 46.

[0053] The redistribution structure 41 has a surface 411 and a surface 412 opposite to the surface 411. At least one of the electrical connectors 42 is on the surface 412 of the redistribution structure 41. The encapsulant 43 encapsulates the surface 412 of the redistribution structure 41 and the electrical connectors 42. A part of each electrical connector 42 is exposed by the encapsulant 43. In addition, the redistribution structure 41 has a side surface 413, and some plating lines may be exposed on the side surface 413.

[0054] The semiconductor device 44 is mounted on the surface 412 of the redistribution structure 41. The semiconductor device 44 and the redistribution structure 41 are electrically connected by bumps 441. In some embodiments, the space between the bumps 441 is filled with an underfill layer 46. The electrical connector 42 surrounds the periphery of the semiconductor device 44 and is used to fan out the inputs and outputs of the semiconductor device 44. The optical element 45 is mounted on the surface 411 of the redistribution structure 41 and is electrically connected to the redistribution structure. Regarding the two optical elements 45, they can be two optical transmitters or two optical detectors, or one is an optical transmitter and the other is an optical detector.

[0055] As Figure 7 shown, the encapsulant 43 encapsulates the surface 412 of the redistribution structure 41 and the electrical connector 42. The encapsulant 43 has a surface 431 that is recessed relative to the surface 411 of the redistribution structure 41 and adjacent to the side surface 413 of the redistribution structure 41. Thus, the surface 431 of the encapsulant 43 is less in height than the surface 411 of the redistribution structure 41. In addition, the surface 431 of the encapsulant 43 can be coplanar with the surface 412 of the redistribution structure 41.

[0056] In view of the above, referring to Figure 7 , the carrier 40 has a recessed portion formed by the surfaces 431 and 413 on its side surface.

[0057] In addition, the cover 47 is arranged on the carrier 40. Referring to Figure 7 , the cover 47 is placed on the surface 411 of the redistribution structure 41 and the surface 431 of the encapsulant 43 by an adhesive 49. The adhesive 49 can be an optical adhesive, and the optical density (OD) value of the optical adhesive is greater than 3. Specifically, as Figure 7As shown, the adhesive 49 is generally disposed on the surface 431 of the encapsulant 43 and the side surface 413 of the redistribution structure 41, and on the surface 411 of the redistribution structure 41, the side surface being connected to the surface 411 of the redistribution structure 41 and the surface 431 of the encapsulant 43. That is, the adhesive 49 is disposed at the recessed portion of the carrier 40 and is generally between the cover 47 and the carrier 40. Further, since the adhesive 49 is disposed at the recessed portion of the carrier 40, the adhesive 49 may not migrate on the surface 411 to cover the wire 451. During an assembly process such as a heating or curing process, the wire 451 is not pulled and dragged by the adhesive 49. The cover 47 has a surface 472 supported by the surface 431 of the encapsulant 43. Thus, the surface 472 of the cover 47 is less in height than the surface 411 of the redistribution structure 41. In other words, the surface 472 of the cover 47 and the surface 411 of the redistribution structure 41 are disposed at different heights. Further, the cover 47 may have an inner wall 474 that isolates the optical elements 45 from each other. The inner wall 474 of the cover 47 has a surface 476 supported by the surface 411 of the redistribution structure 41. Thus, the surface 472 is less in height than the surface 476. That is, the surfaces 472 and 476 of the cover 47 are disposed at different heights. In some embodiments, the surface 473 of the cover 47 and the side surface 433 of the encapsulant 43 may not be coplanar with each other.

[0058] The cover 47 has two pores 475 at its top, and each of the pores 475 is generally aligned with the optical element 45. Additionally, the filter material 48 is disposed within the pores 475 respectively. Further, since the cover 47 can be formed by injection molding, the roughness of the outer surface of the cover 47 can be generally uniform. That is, the roughness of the side surface 473 of the cover 47 can be the same as the roughness of the top surface 471 of the cover 47.

[0059] Figure 8 A cross-sectional view of an optical device package 4 according to some embodiments of the present invention is shown. Figure 8 The optical device package 4 shown in Figure 7 is similar in some aspects to the optical device package 4 shown in Figure 8 except that in

[0060] Figure 9 the substrate 400 is attached to the surface 434 of the encapsulant 43 and is electrically connected to the electrical connector 42, the surface 434 being opposite to the surface 431 of the encapsulant 43. Further, the electrical connector 42 may not be exposed. Thus, in at least some embodiments, the optical device package 4 further includes a substrate 400, and the encapsulant 43 encapsulates the surface 412 of the redistribution structure 41, the surface 401 of the substrate 400, and the electrical connector 42.A cross-sectional view of an optical device package 5 according to some embodiments of the present invention is shown. The optical device package 5 includes a carrier 50 and a cover 57. In some embodiments, the carrier 50 may comprise a ceramic material or a metal plate. In some embodiments, the carrier 50 may be a substrate, an organic substrate, or a lead frame. In some embodiments, the carrier 50 may include a plurality of traces. Figure 9 The carrier 50 shown in includes a redistribution structure 51, electrical connectors 52, a encapsulant 53, a semiconductor device 54, an optical element 55, and an underfill layer 56.

[0061] The redistribution structure 51 has a surface 511, a surface 512 recessed relative to 511, a surface 513 opposite to the surfaces 511 and 512, a surface 514 connecting the surfaces 512 and 513, and a surface 515 connecting the surfaces 511 and 512. At least one of the electrical connectors 52 is on the surface 513 of the redistribution structure 51. The encapsulant 53 encapsulates the surface 513 and the side surface 514 of the redistribution structure 51 and the electrical connectors 52. A part of each electrical connector 52 is exposed by the encapsulant 53. In addition, some plating lines may be exposed on the surface 515 of the redistribution structure 51.

[0062] The semiconductor device 54 is mounted on the surface 513 of the redistribution structure 51. The semiconductor device 54 and the redistribution structure 51 are electrically connected by bumps 541. In some embodiments, the space between the bumps 541 is filled with the underfill layer 56. The electrical connectors 52 surround the periphery of the semiconductor device 54 and are used to fan out the inputs and outputs of the semiconductor device 54. The optical element 55 (e.g., an optical transmitter or an optical detector) is mounted on the surface 511 of the redistribution structure 51 and is electrically connected to the redistribution structure.

[0063] As mentioned above, the redistribution structure 51 has a surface 511, a surface 512 recessed relative to 511, and a surface 513 opposite to the surfaces 511 and 512, and the encapsulant 53 encapsulates the surface 513 and the side surface 514 of the redistribution structure 51 and the electrical connectors 52. The encapsulant 53 has a surface 531 that can be adjacent to and coplanar with the surface 512 of the redistribution structure 51. That is, the surface 512 of the redistribution structure 51 and the surface 531 of the encapsulant 53 are less in height than the surface 511 of the redistribution structure 51.

[0064] In view of the above, referring to Figure 9 , the carrier 50 has a recessed portion formed by the surfaces 515, 512, and 531 on its side surface.

[0065] In addition, the cover 57 is disposed on the carrier 50. Referring to Figure 9, the cover 57 is disposed on the surface 512 of the redistribution structure 51 and the surface 531 of the encapsulant 53 through an adhesive 59. The adhesive 59 can be an optical adhesive, and the optical density (OD) value of the optical adhesive is greater than 3. Specifically, as Figure 9 shown in, the adhesive 59 is generally disposed on the surface 531 of the encapsulant 53, the surface 512 of the redistribution structure 51, and the side surface 515 of the redistribution structure 51, and the side surface is connected to the surfaces 511 and 512 of the redistribution structure 51. That is, the adhesive 59 is disposed at the recessed portion of the carrier 50 and is generally between the cover 57 and the carrier 50. In addition, since the adhesive 59 is disposed at the recessed portion of the carrier 50, the adhesive 59 may not migrate on the surface 511 to cover the wire 551. During an assembly process such as a heating or curing process, the wire 551 will not be pulled and dragged by the adhesive 59. The cover 57 has a surface 572 supported by the surface 512 of the redistribution structure 51 and the surface 531 of the encapsulant 53. Therefore, the surface 572 of the cover 57 is less in height than the surface 511 of the redistribution structure 51. In other words, the surface 572 of the cover 57 and the surface 511 of the redistribution structure 51 are disposed at different heights. In some embodiments, the surface 573 of the cover 57 and the side surface 533 of the encapsulant 53 may not be coplanar with each other.

[0066] The cover 57 has a pore 575 at its top, and the pore 575 is generally aligned with the optical element 55. The filter material 58 is disposed within the pore 575. In addition, since the cover 57 can be formed by injection molding, the roughness of the outer surface of the cover 57 can be generally uniform. That is, the roughness of the side surface 573 of the cover 57 can be the same as the roughness of the top surface 571 of the cover 57.

[0067] Figure 10 A cross-sectional view of an optical device package 5 according to some embodiments of the present invention is shown. Figure 10 The optical device package 5 shown in is similar in some aspects to Figure 9 the optical device package 5 shown in, except that in Figure 10 the substrate 500 is attached to the surface 534 of the encapsulant 53 and is electrically connected to the electrical connector 52, and the surface 534 is opposite to the surface 531 of the encapsulant 53. In addition, the electrical connector 52 may not be exposed. Therefore, in at least some embodiments, the optical device package 5 further includes a substrate 500, and the encapsulant 53 encapsulates the surface 513 and the side surface 514 of the redistribution structure 51, the surface 501 of the substrate 500, and the electrical connector 52.

[0068] Figure 11FIG. 0 shows a cross-sectional view of an optical device package 6 according to some embodiments of the present invention. The optical device package 6 includes a carrier 60 and a cover 67. In some embodiments, the carrier 60 may comprise a ceramic material or a metal plate. In some embodiments, the carrier 60 may be a substrate, an organic substrate, or a lead frame. In some embodiments, the carrier 60 may include a plurality of traces. Figure 11 The carrier 60 shown in

[0069] includes a redistribution structure 61, electrical connectors 62, a encapsulant 63, a semiconductor device 64, an optical element 65, and an underfill layer 66.

[0070] The redistribution structure 61 has a surface 611, a surface 612 recessed relative to 611, a surface 613 opposite to surfaces 611 and 612, a surface 614 connecting surfaces 612 and 613, and a surface 615 connecting surfaces 611 and 612. At least one of the electrical connectors 62 is on the surface 613 of the redistribution structure 61. The encapsulant 63 encapsulates the surface 613 and the side surface 614 of the redistribution structure 61 and the electrical connectors 62. A part of each electrical connector 62 is exposed by the encapsulant 63. In addition, some plating lines may be exposed on the surface 615 of the redistribution structure 61.

[0071] As mentioned above, the redistribution structure 61 has a surface 611, a surface 612 recessed relative to 611, and a surface 613 opposite to surfaces 611 and 612, and the encapsulant 63 encapsulates the surface 613 and the side surface 614 of the redistribution structure 61 and the electrical connectors 62. The encapsulant 63 has a surface 631 that can be adjacent to and coplanar with the surface 612 of the redistribution structure 61. That is, the surface 612 of the redistribution structure 61 and the surface 631 of the encapsulant 63 are less in height than the surface 611 of the redistribution structure 61.

[0072] In view of the above, referring to Figure 11 FIG., the carrier 60 has a recessed portion formed by surfaces 615, 612, and 631 on its side surface.

[0073] In addition, the cover 67 is disposed on the carrier 60. Referring to Figure 11, the cover 67 is placed on the surface 611 of the redistribution structure 61, the surface 612 of the redistribution structure 61, and the surface 631 of the encapsulant 63 through an adhesive 69. The adhesive 69 can be an optical adhesive, and the optical density (OD) value of the optical adhesive is greater than 3. Specifically, as Figure 11 shown in, the adhesive 69 is generally arranged on the surface 611 of the redistribution structure 61, the surface 631 of the encapsulant 63, the surface 612 of the redistribution structure 61, and the side surface 615 of the redistribution structure 61, and the side surface is connected to the surfaces 611 and 612 of the redistribution structure 61. That is, the adhesive 69 is arranged at the recessed part of the carrier 60 and is generally between the cover 67 and the carrier 60. In addition, since the adhesive 69 is arranged at the recessed part of the carrier 60, the adhesive 69 may not migrate on the surface 611 to cover the wire 651. During an assembly process such as a heating or curing process, the wire 651 will not be pulled and dragged by the adhesive 69. The cover 67 has a surface 672 supported by the surface 612 of the redistribution structure 61 and the surface 631 of the encapsulant 63. Therefore, the surface 672 of the cover 67 is lower in height than the surface 611 of the redistribution structure 61. In other words, the surface 672 of the cover 67 and the surface 611 of the redistribution structure 61 are arranged at different heights. In addition, the cover 67 may have an inner wall 674 that isolates the optical elements 65 from each other. The inner wall 674 of the cover 67 has a surface 676 supported by the surface 611 of the redistribution structure 61. Therefore, the surface 672 is lower in height than the surface 676. That is, the surfaces 672 and 676 of the cover 67 are arranged at different heights. In some embodiments, the surface 673 of the cover 67 and the side surface 633 of the encapsulant 63 may not be coplanar with each other.

[0074] The cover 67 has two pores 675 at its top, and each of the pores 675 is generally aligned with the optical element 65. In addition, the filter material 68 is respectively arranged in the pores 675. In addition, since the cover 67 can be formed by injection molding, the roughness of the outer surface of the cover 67 can be generally uniform. That is, the roughness of the side surface 673 of the cover 67 can be the same as the roughness of the top surface 671 of the cover 67.

[0075] Figure 12 A cross-sectional view of an optical device package 6 according to some embodiments of the present invention is shown. Figure 12 The optical device package 6 shown in is similar to Figure 11 the optical device package 6 shown in in some aspects, except that in Figure 12The middle substrate 600 is attached to the surface 634 of the encapsulant 63 and electrically connected to the electrical connector 62. The surface 634 is opposite to the surface 631 of the encapsulant 63. In addition, the electrical connector 62 may not be exposed. Therefore, in at least some embodiments, the optical device package 6 further includes the substrate 600, and the encapsulant 63 encapsulates the surface 613 and the side surface 614 of the redistribution structure 61, the surface 601 of the substrate 600, and the electrical connector 62.

[0076] Figure 13 FIG. shows a cross-sectional view of an optical device package 7 according to some embodiments of the present invention. The optical device package 7 includes a carrier 70 and a cover 77. In some embodiments, the carrier 70 may comprise a ceramic material or a metal plate. In some embodiments, the carrier 70 may be a substrate, an organic substrate, or a lead frame. In some embodiments, the carrier 70 may include a plurality of traces. Figure 13 The carrier 70 shown in includes a redistribution structure 71, an electrical connector 72, an encapsulant 73, a semiconductor device 74, an optical element 75, and an underfill layer 76.

[0077] The redistribution structure 71 has a surface 711 and a surface 712 opposite to the surface 711. At least one of the electrical connectors 72 is on the surface 712 of the redistribution structure 71. The encapsulant 73 encapsulates the surface 712 of the redistribution structure 71 and the electrical connector 72. A part of each electrical connector 72 is exposed by the encapsulant 73. In addition, the redistribution structure 71 has a side surface 713, and some plating lines may be exposed on the side surface 713.

[0078] The semiconductor device 74 is mounted on the surface 712 of the redistribution structure 71. The semiconductor device 74 and the redistribution structure 71 are electrically connected by bumps 741. In some embodiments, the space between the bumps 741 is filled with the underfill layer 76. The electrical connectors 72 surround the periphery of the semiconductor device 74 and are used to fan out the input and output of the semiconductor device 74. The optical element 75 (e.g., an optical transmitter or an optical detector) is mounted on the surface 711 of the redistribution structure 71 and electrically connected to the redistribution structure.

[0079] As Figure 13 shown, the encapsulant 73 encapsulates the surface 712 of the redistribution structure 71 and the electrical connector 72. The encapsulant 73 has a surface 731, a surface 732 recessed relative to the surface 731, and a side surface 735 connecting the surface 731 and the surface 732. The surface 731 of the encapsulant 73 is generally attached to the 712 of the redistribution structure 71. The side surface 735 of the encapsulant 73 may be adjacent to the side surface 713 of the redistribution structure 71 and be generally coplanar with the side surface 713 of the redistribution structure 71. Refer to Figure 13 and the surface 732 of the encapsulant 73 is less than the surface 711 of the redistribution structure 71 in height.

[0080] In view of the above, referring to Figure 13 , the carrier 70 has a recessed portion formed by surfaces 713, 732, and 735 on its side surface.

[0081] In addition, a cover 77 is disposed on the carrier 70. Referring to Figure 13 , the cover 77 is placed on the surface 732 of the encapsulant 73 by an adhesive 79. The adhesive 79 can be an optical adhesive, and the optical density (OD) value of the optical adhesive is greater than 3. Specifically, as Figure 13 shown, the adhesive 79 is generally disposed on the surface 732 of the encapsulant 73, the side surface 735 of the encapsulant 73, and the side surface 713 of the redistribution structure 71. The side surface 735 connects the surface 732 of the encapsulant 73, and the side surface 713 is connected to the surface 711 of the redistribution structure 71. That is, the adhesive 79 is disposed at the recessed portion of the carrier 70 and is generally between the cover 77 and the carrier 70. In addition, since the adhesive 79 is disposed at the recessed portion of the carrier 70, the adhesive 79 may not migrate on the surface 711 to cover the wire 751. During an assembly process such as a heating or curing process, the wire 751 will not be pulled and dragged by the adhesive 79. The cover 77 has a surface 772 supported by the surface 732 of the encapsulant 73. Therefore, the surface 772 of the cover 77 is lower in height than the surface 731 of the encapsulant 73 and the surface 711 of the redistribution structure 71. In other words, the surface 772 of the cover 77 and the surface 731 of the encapsulant 73 and the surface 711 of the redistribution structure 71 are arranged at different heights. In some embodiments, the surface 773 of the cover 77 and the side surface 733 of the encapsulant 73 may not be coplanar with each other.

[0082] The cover 77 has a pore 775 at its top, and the pore 775 is generally aligned with the optical element 75. A filter material 78 is disposed in the pore 775. In addition, since the cover 77 can be formed by injection molding, the roughness of the outer surface of the cover 77 can be generally uniform. That is, the roughness of the side surface 773 of the cover 77 can be the same as the roughness of the top surface 771 of the cover 77.

[0083] Figure 14 A cross-sectional view of an optical device package 7 according to some embodiments of the present invention is shown. Figure 14 The optical device package 7 shown in Figure 13 is similar to the optical device package 7 shown in Figure 14The middle substrate 700 is attached to the surface 734 of the encapsulant 73 and electrically connected to the electrical connector 72. The surface 734 is opposite to the surfaces 731 and 732 of the encapsulant 73. In addition, the electrical connector 72 may not be exposed. Therefore, in at least some embodiments, the optical device package 7 further includes the substrate 700, and the encapsulant 73 encapsulates the surface 712 of the redistribution structure 71, the surface 701 of the substrate 700, and the electrical connector 72.

[0084] Figure 15 FIG. shows a cross-sectional view of an optical device package 8 according to some embodiments of the present invention. The optical device package 8 includes a carrier 80 and a cover 87. In some embodiments, the carrier 80 may comprise a ceramic material or a metal plate. In some embodiments, the carrier 80 may be a substrate, an organic substrate, or a lead frame. In some embodiments, the carrier 80 may include a plurality of traces. Figure 15 The carrier 80 shown in includes a redistribution structure 81, an electrical connector 82, an encapsulant 83, a semiconductor device 84, an optical element 85, and an underfill layer 86.

[0085] The redistribution structure 81 has a surface 811 and a surface 812 opposite to the surface 811. At least one of the electrical connectors 82 is on the surface 812 of the redistribution structure 81. The encapsulant 83 encapsulates the surface 812 of the redistribution structure 81 and the electrical connector 82. A part of each electrical connector 82 is exposed by the encapsulant 83. In addition, the redistribution structure 81 has a side surface 813, and some plating lines may be exposed on the side surface 813.

[0086] The semiconductor device 84 is mounted on the surface 812 of the redistribution structure 81. The semiconductor device 84 and the redistribution structure 81 are electrically connected by bumps 841. In some embodiments, the space between the bumps 841 is filled with the underfill layer 86. The electrical connectors 82 surround the periphery of the semiconductor device 84 and are used to fan out the input and output of the semiconductor device 84. The optical element 85 is mounted on the surface 811 of the redistribution structure 81 and electrically connected to the redistribution structure. Regarding the two optical elements 85, they may be two optical emitters or two optical detectors, or one is an optical emitter and the other is an optical detector.

[0087] As Figure 15 shown in, the encapsulant 83 encapsulates the surface 812 of the redistribution structure 81 and the electrical connector 82. The encapsulant 83 has a surface 831, a surface 832 recessed with respect to the surface 831, and a side surface 833 connecting the surface 831 and the surface 832. The surface 831 of the encapsulant 83 is generally attached to the 812 of the redistribution structure 81. The side surface 833 of the encapsulant 83 may be adjacent to the side surface 813 of the redistribution structure 81 and be generally coplanar with the side surface 813 of the redistribution structure 81. Refer to Figure 15, the surface 832 of the encapsulation body 83 is less than the surface 811 of the redistribution structure 81 in height.

[0088] In view of the above, referring to Figure 15 , the carrier 80 has a recessed portion formed by the surfaces 813, 832 and 835 on its side surface.

[0089] In addition, a cover 87 is arranged on the carrier 80. Referring to Figure 15 , the cover 87 is placed on the surface 811 of the redistribution structure 81 and the surface 832 of the encapsulation body 83 by an adhesive 89. The adhesive 89 can be an optical adhesive, and the optical density (OD) value of the optical adhesive is greater than 3. Specifically, as Figure 15 shown in, the adhesive 89 is generally arranged on the surface 811 of the redistribution structure 81, the surface 832 of the encapsulation body 83, the side surface 833 of the encapsulation body 83 and the side surface 813 of the redistribution structure 81. The side surface 833 connects the surface 832 of the encapsulation body 83, and the side surface 813 connects the surface 811 of the redistribution structure 81. That is, the adhesive 89 is arranged at the recessed portion of the carrier 80 and is generally between the cover 87 and the carrier 80. In addition, since the adhesive 89 is arranged at the recessed portion of the carrier 80, the adhesive 89 may not migrate on the surface 811 to cover the wire 851. During an assembly process such as a heating or curing process, the wire 851 will not be pulled and dragged by the adhesive 89. The cover 87 has a surface 872 supported by the surface 832 of the encapsulation body 83. Therefore, the surface 872 of the cover 87 is less than the surface 831 of the encapsulation body 83 and the surface 811 of the redistribution structure 81 in height. In other words, the surface 872 of the cover 87 and the surface 831 of the encapsulation body 83 and the surface 811 of the redistribution structure 81 are arranged at different heights. In addition, the cover 87 may have an inner wall 874 that isolates the optical elements 85 from each other. The inner wall 874 of the cover 87 has a surface 876 supported by the surface 811 of the redistribution structure 81. Therefore, the surface 872 is less than the surface 876 in height. That is, the surfaces 872 and 876 of the cover 87 are arranged at different heights. In some embodiments, the surface 873 of the cover 87 and the side surface 835 of the encapsulation body 83 may not be coplanar with each other.

[0090] The cover 87 has two pores 875 at its top, and each of the pores 875 is generally aligned with the optical element 85. In addition, filter material 88 is respectively arranged in the pores 875. In addition, since the cover 87 can be formed by injection molding, the roughness of the outer surface of the cover 87 can be generally uniform. That is, the roughness of the side surface 873 of the cover 87 can be the same as the roughness of the top surface 871 of the cover 87.

[0091] Figure 16 A cross-sectional view of an optical device package 8 according to some embodiments of the present invention is shown. Figure 16The optical device package 8 shown in Figure 15 is similar in some aspects to the optical device package 8 shown in Figure 16 where the substrate 800 is attached to the surface 834 of the encapsulant 83 and electrically connected to the electrical connector 82, and the surface 834 is opposite to the surfaces 831 and 832 of the encapsulant 83. In addition, the electrical connector 82 may not be exposed. Thus, in at least some embodiments, the optical device package 8 further includes a substrate 800, and the encapsulant 83 encapsulates the surface 812 of the redistribution structure 81, the surface 801 of the substrate 800, and the electrical connector 82.

[0092] Figure 17A , 17B , 17C, 17D, 17E, 17F, 17G, 17H, 17I, and 17J illustrate one or more stages of a method of manufacturing an optical device package 2 according to some embodiments of the present invention. Figure 17A Illustrated is a substrate (e.g., a redistribution structure) 21 that has been processed by the following stages: baking a strip of the substrate.

[0093] As Figure 17B shown in

[0094] As Figure 17C shown in

[0095] As Figure 17D shown in

[0096] As Figure 17E shown in

[0097] As Figure 17F shown in

[0098] As Figure 17G shown in

[0099] As Figure 17HAs shown, two optical elements 25 are mounted on the surface 211 of the redistribution structure 21. Regarding these two optical elements 25, they can be two optical transmitters or two optical detectors, or one is an optical transmitter and the other is an optical detector.

[0100] As Figure 17I shown, a part of the encapsulant 239 is removed. Thus, the encapsulant 23 has a surface 232 that is adjacent to the side surface 233 of the encapsulant 23 and is recessed with respect to the surface 231 of the encapsulant 23.

[0101] As Figure 17J shown, a cover 27 that can be formed by injection molding is placed on the surface 211 of the redistribution structure 21 and the surface 232 of the encapsulant 23 by an adhesive 29. The adhesive 29 can be an optical adhesive, and the optical density (OD) value of the optical adhesive is greater than 3. In addition, the pores 275 of the cover 27 are generally aligned with the optical elements 25. Additionally, the cover 27 is formed before the cover 27 is placed on the surface 211 of the redistribution structure 21 and the surface 232 of the encapsulant 23, and thus the side surface 273 of the cover 27 may not be coplanar with the side surface 233 of the encapsulant 23. Figure 17J An optical device package 2 according to some embodiments of the present invention is shown.

[0102] Figure 18A 、 18B 、18C, 18D, 18E, 18F, 18G, 18H, 18I, and 18J illustrate one or more stages of a method for manufacturing an optical device package 6' according to some embodiments of the present invention. Figure 18A Illustrates a substrate (e.g., a redistribution structure) 61 that has been processed by the following stages: baking a substrate strip. Additionally, the substrate 61 includes plating lines 617.

[0103] As Figure 18B shown, the following stages are then performed on the substrate 61: mounting a die 64 to the surface 613 of the substrate 61 by flip chip (FC) bonding.

[0104] As Figure 18C shown, the following stages are then performed on the substrate 61: dispensing underfill (UF) 66; and curing the UF 66.

[0105] As Figure 18D shown, the following stage is then performed on the substrate 61: mounting an electrical connector 62 to the surface 613 of the substrate 61.

[0106] As Figure 18E shown, the substrate 600 is attached and connected to the electrical connector 62.

[0107] As Figure 18FAs shown, a thin film molding material (e.g., an encapsulant) 63 is coated on a substrate 61, a substrate 600, an electrical connector 62, and a die 64. Accordingly, the encapsulant 63 encapsulates the side surface 614 and the surface 613 of the substrate 61, the surface 601 of the substrate 600, and the electrical connector 62 and the die 64.

[0108] As Figure 18G shown, the following stages are then performed on the substrate 61: cutting the substrate 600 and the encapsulant 63.

[0109] As Figure 18H shown, two optical elements 65 are mounted on the surface 611 of the redistribution structure 61. Regarding these two optical elements 65, they may be two optical emitters or two optical detectors, or one is an optical emitter and the other is an optical detector.

[0110] As Figure 18I shown, a part of the encapsulant 639 and a part of the substrate (redistribution structure) 619 are removed. Accordingly, the redistribution structure 61 has a surface 612 that is recessed with respect to the surface 611, a surface 615 that connects the surfaces 611 and 612, and the encapsulant 63 has a surface 631 that is substantially coplanar with the surface 612 of the redistribution structure 61. In addition, since a part of the substrate (redistribution structure) 619 is removed, the electroplated line 617 can be exposed on the surface 615 of the redistribution structure 61.

[0111] As Figure 18J shown, a cover 67 that can be formed by injection molding is placed on the surface 612 of the redistribution structure 61 and the surface 631 of the encapsulant 63 by an adhesive 69. The adhesive 69 can be an optical adhesive, and the optical density (OD) value of the optical adhesive is greater than 3. In addition, the pores 675 of the cover 67 are substantially aligned with the optical elements 65. Additionally, the cover 67 is formed before the cover 67 is placed on the surface 612 of the redistribution structure 61 and the surface 631 of the encapsulant 63, and thus the side surface 673 of the cover 67 may not be coplanar with the side surface 633 of the encapsulant 63. Figure 18J An optical device package 6' according to some embodiments of the present invention is shown.

[0112] As used herein, relative terms such as "inner", "inside", "outer", "outside", "top", "bottom", "front", "back", "upper", "upward", "lower", "downward", "vertical", "vertically", "lateral", "laterally", "above", and "below" refer to the orientation of a set of components relative to each other; this orientation is according to the drawings, but is not necessary during manufacturing or use.

[0113] Unless the context clearly dictates otherwise, as used herein, the singular terms "a / an" and "the" may include plural referents.

[0114] As used herein, the terms "connect", "connected", and "connection" refer to operative coupling or linking. Connected components may be directly or indirectly coupled to each other, for example, via another set of components.

[0115] As used herein, the terms "conduct", "conductive", and "conductivity" refer to the ability to conduct electric current. Conductive materials generally denote those materials that exhibit minimal or zero resistance to the flow of electric current. A measure of conductivity is Siemens per meter (S / m). Generally, conductive materials are those having a conductivity greater than about 10 4 S / m (e.g., at least 10 5 S / m or at least 10 6 S / m). The conductivity of a material may sometimes vary with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0116] As used herein, the terms "about", "substantially", "substantive", and "approximate" refer to a considerable degree or extent. When used in connection with an event or circumstance, the terms may refer to both the circumstance where the event or circumstance occurs precisely and the circumstance where the event or circumstance occurs approximately, e.g., when considering typical tolerance levels for the manufacturing methods described herein. For example, when used in connection with a numerical value, the terms may refer to a range of variation of less than or equal to ±10% of the numerical value, e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the difference between two numerical values is less than or equal to ±10% of the average value of the values, e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%, then the two numerical values may be considered to be "substantially" the same or equal.

[0117] If the displacement between two surfaces does not exceed 5 μm, does not exceed 2 μm, does not exceed 1 μm, or does not exceed 0.5 μm, then the two surfaces may be considered coplanar or substantially coplanar.

[0118] If the difference between the highest and lowest points on a surface does not exceed 5 μm, does not exceed 2 μm, does not exceed 1 μm, or does not exceed 0.5 μm, then the surface may be considered flat or substantially flat.

[0119] In addition, quantities, ratios, and other numerical values are sometimes presented in a range format in this document. It should be understood that such range formats are used for convenience and brevity and should be interpreted flexibly as including the values explicitly specified as range limits, as well as all individual values or sub-ranges subsumed within the said range, as if each value and sub-range were explicitly specified.

[0120] In the description of some embodiments, a component being “on” or “above” another component can encompass the situation where the former component is directly above the latter component (e.g., in physical contact therewith), as well as the situation where one or more intervening components are located between the former component and the latter component.

[0121] Although the present invention has been described and illustrated with reference to specific embodiments thereof, such description and illustration do not limit the present invention. Those skilled in the art should understand that various changes can be made and equivalents can be substituted without departing from the true spirit and scope of the present invention as defined by the appended claims.

[0122] The configurations and arrangements of the structures and methods shown in the various exemplary embodiments are illustrative only. Accordingly, all such modifications are intended to be included within the scope of the present invention. The order or sequence of any process or method steps can be varied or re-sequenced according to alternative embodiments. Other substitutions, modifications, changes, and omissions can be made in the design, operating conditions, and arrangements of the exemplary embodiments without departing from the scope of the present invention.

Claims

1. An optical device package, comprising: A carrier, comprising: A first layer; and A second layer located on the first layer, wherein there is an interface between the first layer and the second layer; An optical element disposed on an upper surface of the carrier; A cover disposed on the upper surface of the carrier; and An adhesive located between the cover and the carrier; Wherein, A horizontal extension line of the interface intersects the adhesive.

2. The optical device package according to claim 1, wherein the horizontal extension line is not higher than a first upper surface of the adhesive.

3. The optical device package according to claim 1, wherein the horizontal extension line is higher than a second upper surface of the adhesive.

4. The optical device package according to claim 1, wherein the adhesive has a horizontal portion and a vertical portion, wherein the horizontal portion extends substantially horizontally between the cover and the carrier and contacts a bottom surface of the cover, and the vertical portion extends substantially vertically between the cover and the carrier and does not contact the bottom surface of the cover, wherein a bottom surface of the vertical portion is not lower than a bottom surface of the horizontal portion.

5. The optical device package according to claim 4, wherein the horizontal extension line intersects the vertical portion.

6. The optical device package according to claim 5, wherein a distance from a position where the horizontal extension line intersects the vertical portion to a bottom surface of the vertical portion is less than a distance from the position where the horizontal extension line intersects the vertical portion to a top surface of the vertical portion.

7. The optical device package according to claim 4, wherein a top surface of the first layer of the carrier is higher than a top surface of the horizontal portion.

8. The optical device package according to claim 4, wherein a height of the horizontal extension line is higher than a top surface of the horizontal portion.

9. The optical device package according to claim 4, wherein a bottom surface of the second layer of the carrier is higher than a top surface of the horizontal portion.

10. The optical device package according to claim 1, wherein the horizontal extension line intersects a side wall of the cover.

11. The optical device package according to claim 1, Wherein, In a cross-section, the first layer of the carrier has a first width, the second layer of the carrier has a second width, and wherein the first width is greater than the second width.

12. The optical device package according to claim 1, wherein the adhesive has at least a portion, a height of the at least a portion is lower than the optical element, and wherein the upper surface of the carrier includes a first portion and a second portion recessed relative to the first portion, and the adhesive is disposed on the second portion of the upper surface of the carrier.

13. An optical device package, comprising A carrier having a first layer and a second layer located above the first layer, wherein there is an interface between the first layer and the second layer; A cover disposed on the carrier; and A first adhesive located between the cover and the carrier, wherein the first adhesive has a horizontal portion and a vertical portion; Wherein a height of the interface is higher than a top surface of the horizontal portion of the first adhesive.

14. The optical device package as claimed in claim 13, wherein the cover has an intermediate portion away from two opposite sides of the carrier, and the height of the interface is not higher than a bottom surface of the intermediate portion of the cover.

15. The optical device package as claimed in claim 14, further comprising an optical device disposed on the carrier, and a second adhesive disposed between the intermediate portion of the cover and the carrier, wherein the second adhesive overlaps the optical device in a horizontal direction.

16. The optical device package as claimed in claim 15, wherein a bottom surface of the optical device is not lower than a top surface of the second layer of the carrier.

17. The optical device package as claimed in claim 13, wherein a bottom surface of the cover is not higher than the height of the interface.

18. An optical device package, comprising: a carrier having a first layer and a second layer located above the first layer, wherein an interface exists between the first layer and the second layer; a cover disposed on the carrier; and an adhesive located between the cover and the carrier; wherein the adhesive is in direct contact with the first layer and the second layer.

19. The optical device package as claimed in claim 18, wherein the adhesive has a horizontal portion and a vertical portion, and wherein the vertical portion is in direct contact with the first layer and the second layer of the carrier.

20. The optical device package as claimed in claim 18, wherein the adhesive has a horizontal portion and a vertical portion, and wherein the vertical portion is located between the second layer of the carrier and the cover, and is in direct contact with the second layer of the carrier and the cover.

21. An optical device package, comprising: a carrier comprising a capsule and a redistribution structure disposed on the capsule, wherein the capsule and the redistribution structure together form a recessed portion, and the recessed portion comprises a side surface of the capsule and a side surface of the redistribution structure; a cover disposed on the carrier, wherein a first bottom surface of the cover is supported by the capsule, and a second bottom surface of the cover is supported by the redistribution structure; a first adhesive disposed on the recessed portion and covering the side surface of the capsule and the side surface of the redistribution structure, and disposed between the first bottom surface of the cover and the capsule, and a second adhesive disposed between the second bottom surface of the cover and the redistribution structure.

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