Display panel, manufacturing method thereof and display device

Abstract

The invention relates to the technical field of display, and discloses a display panel, a manufacturing method thereof and a display device.The display panel comprises a substrate, a driving array layer, a first conductive layer comprising a plurality of electrodes and a light-emitting device, and the sides, away from the substrate, of the electrodes comprise first conductive parts; the side, facing the substrate, of each light-emitting device comprises a second conductive part, the multiple electrodes comprise a first electrode and a second electrode, and the multiple light-emitting devices comprise a first light-emitting device, a second light-emitting device, a material of the second conductive part between the first electrode and the first light-emitting device and a material of the second conductive part between the second electrode and the second light-emitting device. The two are different; and / or, the material of the first conductive part between the first electrode and the first light-emitting device is different from the material of the first conductive part between the second electrode and the second light-emitting device. The manufacturing method is used for manufacturing the display panel, and the display device comprises the display panel. According to the invention, the product manufacturing yield can be improved, and the bonding reliability and the display quality are ensured.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and particularly to a display panel, a manufacturing method thereof, and a display device. Background Art

[0002] Micro light-emitting diodes (microLEDs) are a new generation of display technologies. Due to their display characteristics of high brightness, high contrast, and high color gamut, they have a wide range of application scenarios in fields such as in-vehicle display products and borderless seamless display products.

[0003] However, their technical difficulties are numerous and complex. For example, in the manufacturing process of a microLED display panel, generally after the micro-LED chips are manufactured, the microLED chips need to be die-bonded and soldered onto the driving circuit layer of the substrate through mass transfer, laser bonding, or other bonding technologies. However, it has been found in the current production process that the bonding yield between the microLED chips and the substrate is relatively low, resulting in product rework or ineffective improvement in the finished product yield.

[0004] Therefore, how to improve the product manufacturing yield, ensure bonding reliability, and display quality is a technical problem that needs to be urgently solved by those skilled in the art. Summary of the Invention

[0005] In order to solve the above technical problems, the present disclosure provides a display panel, a manufacturing method thereof, and a display device to solve the problems that the bonding yield between micro LED chips and the substrate cannot be improved and the reliability is reduced in the display products of the prior art.

[0006] The present disclosure provides a display panel, including:

[0007] A substrate;

[0008] A driving array layer located on one side of the substrate;

[0009] A first conductive layer located on the side of the driving array layer away from the substrate. The first conductive layer includes a plurality of electrodes, and the side of the electrode away from the substrate includes a first conductive portion;

[0010] A plurality of light-emitting devices. The side of the light-emitting device facing the substrate includes a second conductive portion. The light-emitting device is electrically connected to the electrode through the welded first conductive portion and second conductive portion, and the electrode is electrically connected to the driving array layer;

[0011] The plurality of electrodes at least include a first electrode and a second electrode, and the plurality of light-emitting devices at least include a first light-emitting device and a second light-emitting device. The first electrode is electrically connected to the first light-emitting device, and the second electrode is electrically connected to the second light-emitting device;

[0012] The material of the second conductive part between the first electrode and the first light-emitting device is different from that of the second conductive part between the second electrode and the second light-emitting device; and / or,

[0013] The material of the first conductive part between the first electrode and the first light-emitting device is different from that of the first conductive part between the second electrode and the second light-emitting device.

[0014] Based on the same inventive concept, the present disclosure also provides a method for manufacturing a display panel, including:

[0015] Providing an array substrate, the array substrate includes a substrate and a driving array layer and a first conductive layer located on one side of the substrate. The first conductive layer includes a plurality of electrodes, and the side of the electrode away from the substrate includes a first conductive part; the plurality of electrodes at least include a first electrode and a second electrode;

[0016] Providing a plurality of light-emitting devices, one side of the light-emitting device includes a second conductive part; the plurality of light-emitting devices at least include a first light-emitting device and a second light-emitting device;

[0017] Performing a first bonding, the first light-emitting device is electrically connected to the first electrode through the welded first conductive part and second conductive part;

[0018] Performing a second bonding, the second light-emitting device is electrically connected to the second electrode through the welded first conductive part and second conductive part;

[0019] Wherein, the material of the second conductive part for bonding the first electrode and the first light-emitting device is different from that of the second conductive part for bonding the second electrode and the second light-emitting device; and / or,

[0020] The material of the first conductive part for bonding the first electrode and the first light-emitting device is different from that of the first conductive part for bonding the second electrode and the second light-emitting device;

[0021] The welding temperature during the first bonding is different from the welding temperature during the second bonding.

[0022] Based on the same inventive concept, the present disclosure also provides a display device, and the display device includes the above display panel.

[0023] The technical solutions provided by the embodiments of the present disclosure have the following advantages compared with the prior art:

[0024] In the display panel provided by the present disclosure, at least a first electrode and a second electrode are included in multiple electrodes, and at least a first light-emitting device and a second light-emitting device are included in multiple light-emitting devices. The first electrode is electrically connected to the first light-emitting device through a first conductive part and a second conductive part by welding. The second electrode is electrically connected to the second light-emitting device through a first conductive part and a second conductive part by welding. The materials of the second conductive parts between the first electrode and the first light-emitting device and between the second electrode and the second light-emitting device are different from each other; and / or, the materials of the first conductive parts between the first electrode and the first light-emitting device and between the second electrode and the second light-emitting device are different from each other. Therefore, the display panel of the present disclosure can be fabricated using light-emitting devices provided by different suppliers with different second conductive parts, or an array substrate with different materials for the first conductive parts can be used. That is, the display panel can use light-emitting devices with different incoming materials or an array substrate with different materials, and has a wider range of use. The display panel of the present disclosure does not have to be limited by the diversification of the incoming materials of the light-emitting devices. When different light-emitting devices with different incoming materials are mixed and used, in view of the problem that they cannot be bonded and bound at one time due to the differences in the incoming materials of the light-emitting devices, a display panel including a double bonding system is designed. The double bonding system means that when the materials of the second conductive parts between the first electrode and the first light-emitting device and between the second electrode and the second light-emitting device are different from each other, the first conductive part and the second conductive part between the first electrode and the first light-emitting device form one bonding system, and the first conductive part and the second conductive part between the second electrode and the second light-emitting device form another bonding system. Furthermore, during the fabrication process of the display panel, through multiple bonding methods, the bonding yield of different light-emitting devices and electrodes can still be ensured, which is beneficial to ensuring the bonding reliability and display quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings herein are incorporated into the specification and constitute a part of this specification, showing embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure.

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0027] Figure 1 is a schematic plan view of a display panel provided by an embodiment of the present disclosure;

[0028] Figure 2 is Figure 1 a schematic cross-sectional view taken along the line A-A' in

[0029] Figure 3 is Figure 1 A schematic cross-sectional structure diagram in the B-B' direction in

[0030] Figure 4 is Figure 1 Another schematic cross-sectional structure diagram in the B-B' direction in

[0031] Figure 5 is Figure 1 Another schematic cross-sectional structure diagram in the B-B' direction in

[0032] Figure 6 is Figure 1 Another schematic cross-sectional structure diagram in the A-A' direction in

[0033] Figure 7 Another schematic plan view structure diagram of the display panel provided by the embodiment of the present disclosure;

[0034] Figure 8 is Figure 7 A schematic cross-sectional structure diagram in the C-C' direction in

[0035] Figure 9 is Figure 7 Another schematic cross-sectional structure diagram in the C-C' direction in

[0036] Figure 10 is Figure 1 Another schematic cross-sectional structure diagram in the B-B' direction in

[0037] Figure 11 is Figure 7 Another schematic cross-sectional structure diagram in the C-C' direction in

[0038] Figure 12 is Figure 7 Another schematic cross-sectional structure diagram in the C-C' direction in

[0039] Figure 13 is Figure 7 Another schematic cross-sectional structure diagram in the C-C' direction in

[0040] Figure 14 is Figure 7 Another schematic cross-sectional structure diagram in the C-C' direction in

[0041] Figure 15 is Figure 7 Another schematic cross-sectional structure diagram in the C-C' direction in

[0042] Figure 16 A flowchart of a manufacturing method of the display panel provided by the embodiment of the present disclosure;

[0043] Figure 17 isFigure 16 Schematic structural diagram of an array substrate provided in the manufacturing method of

[0044] Figure 18 is Figure 16 Schematic structural diagram of multiple light-emitting devices provided in the manufacturing method of

[0045] Figure 19 is Figure 16 Schematic structural diagram after the first bonding is completed in the manufacturing method of

[0046] Figure 20 is Figure 16 Schematic structural diagram after the second bonding is completed in the manufacturing method of

[0047] Figure 21 Schematic plan view of the display device provided in the embodiment of the present invention. Detailed implementation manners

[0048] In order to more clearly understand the above-mentioned objects, features, and advantages of the present disclosure, the solutions of the present disclosure will be further described below. It should be noted that, without conflict, the embodiments of the present disclosure and the features in the embodiments may be combined with each other.

[0049] Many specific details are set forth in the following description in order to fully understand the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only a part of the embodiments of the present disclosure, rather than all of the embodiments.

[0050] Please refer to Figure 1 and Figure 2 , Figure 1 is a schematic plan view of a display panel provided in an embodiment of the present disclosure. Figure 2 is Figure 1 A schematic cross-sectional structure along the A-A' direction in

[0051] Substrate 10;

[0052] Drive array layer 20, located on one side of the substrate 10;

[0053] First conductive layer 30, located on the side of the drive array layer 20 away from the substrate 10. The first conductive layer 30 includes a plurality of electrodes 301, and the side of the electrode 301 away from the substrate 10 includes a first conductive portion 401;

[0054] A plurality of light-emitting devices 50. The side of the light-emitting device 50 facing the substrate 10 includes a second conductive portion 601. The light-emitting device 50 is electrically connected to the electrode 301 through the welded first conductive portion 401 and second conductive portion 601, and the electrode 301 is electrically connected to the drive array layer 20;

[0055] The plurality of electrodes 301 includes at least a first electrode 3011 and a second electrode 3012, and the plurality of light-emitting devices 50 includes at least a first light-emitting device 501 and a second light-emitting device 502. The first electrode 3011 is electrically connected to the first light-emitting device 501, and the second electrode 3012 is electrically connected to the second light-emitting device 502;

[0056] The materials of the second conductive portion 601 between the first electrode 3011 and the first light-emitting device 501 and the materials of the second conductive portion 601 between the second electrode 3012 and the second light-emitting device 502 are different; and / or,

[0057] The materials of the first conductive portion 401 between the first electrode 3011 and the first light-emitting device 501 and the materials of the first conductive portion 401 between the second electrode 3012 and the second light-emitting device 502 are different.

[0058] Specifically, the display panel 000 provided in this embodiment can be a micro light-emitting diode (micro LED) display panel or a mini light-emitting diode (mini LED) display panel. The film layer structure of the display panel 000 includes a substrate 10, and the substrate 10 can be used as a carrier substrate of the display panel 000 for fabricating and disposing the remaining structures of the display panel 000 on the substrate 10. For example, in this embodiment, the substrate 10 is used to fabricate film layer structures such as a driving array layer 20, a first conductive layer 30, and each insulating layer on one side of the substrate 10.

[0059] The driving array layer 20 of this embodiment is generally used to dispose circuit and signal line structures such as thin-film transistors 20T for driving the light-emitting devices 50 to emit light. The surface of the driving array layer 20 away from the substrate 10 can be provided with a planarization layer 70 of an organic material to achieve a planarization effect, ensure the flatness of the electrodes 301 fabricated on the first conductive layer 30, and facilitate subsequent bonding. On the side of the first conductive layer 30 away from the substrate 10, a protective layer 80 of an inorganic material can also be provided to protect the surface of the array substrate and isolate the erosion of water and oxygen. The protective layer 80 of the inorganic material can be provided with through holes to expose some of the electrodes 301, facilitating the bonding of the exposed partial electrode 301 regions to the light-emitting devices 50. It can be understood that the driving array layer 20 of this embodiment can be a combination of multiple conductive film layers and multiple inorganic layers, or a combination of multiple conductive film layers and multiple inorganic layers or organic layers. This embodiment does not make any limitations in this regard. During specific implementation, the film layer arrangement of the driving array layer 20 can be determined according to the actual design requirements of the panel. Optionally, such as Figure 2For example, the driving array layer 20 shown schematically may include, in the direction Z perpendicular to the plane of the substrate 10, a gate metal layer 20A where the gates of the thin-film transistors 20T are located, a source-drain metal layer 20B where the sources and drains of the thin-film transistors 20T are located, a capacitive metal layer 20C where the capacitive plates are located, a semiconductor layer 20P where the active parts of the thin-film transistors 20T are located, a second conductive layer 20D for making driving signal lines such as power signal traces, etc. The second conductive layer 20D can be understood as a certain conductive layer in the driving array layer 20 closest to the first conductive layer 30. It may also include an inorganic layer or an organic layer between adjacent conductive film layers, etc. The driving array layer 20 can be understood as a film layer for making the driving circuit structure for driving the light-emitting device 50 to emit light. Optionally, the thin-film transistor 20T can be a double-gate transistor. Its top gate can be made of the gate metal layer 20A, and its bottom gate can be located on the side of the semiconductor layer 20P facing the substrate 10. At the same time, the metal layer where the bottom gate is located can be used as a light-shielding metal layer to shield the channel region of the thin-film transistor 20T from light, preventing light from irradiating the channel region of the thin-film transistor 20T to generate carriers and affecting the performance of the thin-film transistor 20T. In this embodiment, Figure 2 This is only an example. In specific implementation, the film layer structure of the driving array layer 20 includes but is not limited to this.

[0060] In this embodiment, the first conductive layer 30 is located on the side of the driving array layer 20 away from the substrate 10, and the first conductive layer 30 includes a plurality of electrodes 301. It can be understood that in this embodiment, the plurality of electrodes 301 can be located outside the frame of the display panel 000 to transmit the driving signals provided by the subsequent bonded driving chip or flexible circuit board, or the plurality of electrodes 301 can also be located in the non-frame area of the display panel 000 (which can be understood as the display area or the light-emitting area of the display panel 000), that is, the plurality of electrodes 301 can be used as bonding electrodes. After the light-emitting device 50 is bonded to the electrodes 301, the signals for driving the light-emitting device 50 to emit light are transmitted to the bonded light-emitting device 50 to drive it to emit light. In this embodiment and subsequent embodiments, the electrodes 301 are taken as an example of bonding electrodes for schematic illustration.

[0061] Optionally, the first conductive layer 30 in this embodiment can be made of a metal material or a transparent conductive material. This embodiment does not make a limitation, and only needs to satisfy that the first conductive layer 30 has electrical conductivity.

[0062] Optionally, as Figure 2As shown, when the driving array layer 20 is used to fabricate circuit structures such as thin film transistors 20T for driving the light-emitting device 50 to emit light, after the light-emitting device 50 is bonded to the electrode 301, the source or drain of the thin film transistor 20T in the driving array layer 20 can be electrically connected to the light-emitting device 50 through the electrode 301, achieving the driving and light-emitting effect after the light-emitting device 50 is bonded to the electrode 301. Further optionally, the driving array layer 20 may further include multiple conductive signal lines (such as scan signal lines, data signal lines, power supply signal lines, etc.) to transmit driving signals to each light-emitting device 50 and drive the normal light-emitting display effect of the light-emitting device 50.

[0063] On the side of the electrode 301 in this embodiment away from the substrate 10, there is a first conductive portion 401. On the side of the light-emitting device 50 facing the substrate 10, there is a second conductive portion 601. The first conductive portion 401 can be understood as a bump structure formed on the electrode 301 of the driving array layer 20, generally a bump structure formed on the surface of the array substrate after the fabrication of film layers such as the driving array layer 20 and the first conductive layer 30. The second conductive portion 601 can be understood as the bump metal material for bonding the cathode pin and anode pin of the light-emitting device 50, or can also be understood as the cathode pin and anode pin of the light-emitting device 50. Optionally, the light-emitting device 50 in this embodiment can be a light-emitting chip such as a micro LED or a mini LED. The packaging form of the light-emitting device 50 in the display panel 000 can be a horizontal light-emitting chip. Specifically in implementation, the packaging form of the light-emitting device 50 can also be a vertical light-emitting chip. This embodiment does not limit this, and this embodiment Figure 2 merely takes the packaging form of the light-emitting device 50 being a horizontal light-emitting chip as an example for illustration.

[0064] During the fabrication process of the display panel 000, the light-emitting device 50 can be transferred to the array substrate on which film layers such as the driving array layer 20 and the first conductive layer 30 have been fabricated through a mass transfer technology, such that the light-emitting device 50 is electrically connected to the electrode 301 through the welded first conductive portion 401 and second conductive portion 601, and the electrode 301 is electrically connected to the driving array layer 20, thereby realizing the driving circuit structure of the driving array layer 20 to drive the light-emitting device 50 to emit light and achieving the display function. It can be understood that after the light-emitting device 50 and the electrode 301 are bonded, the first conductive portion 401 and the second conductive portion 601 after welding can form a eutectic layer after eutectic crystallization.

[0065] In the prior art, generally, a display panel uses a single type of incoming light-emitting chips, that is, the relevant light-emitting chips come from the same manufacturer. At this time, the incoming light-emitting chips are generally made by a single supplier, which can ensure better consistency of the incoming materials. Then, for the incoming materials from a single supplier, the bonding of the light-emitting chips, that is, the light-emitting devices, to the fabricated array substrate can be achieved by simultaneously bonding all the light-emitting chips at once (such as simultaneously bonding the light-emitting chips of RGB three colors at once). However, with the development of display technology, limited by the diversification of the incoming materials, the light-emitting chips for the massive transfer of the display panel may not necessarily come from the same supplier. At this time, the bonding bump structures and materials of different suppliers may be different. If the single simultaneous bonding method is still used, problems such as inability to obtain a qualified or high bonding yield, an increase in dark spots after bonding, a decrease in reliability, and a significant increase in bonding difficulty will occur. Therefore, improvements are needed.

[0066] To solve the above problems, in the display panel 000 provided in this embodiment, at least two electrodes 301 include a first electrode 3011 and a second electrode 3012, and at least two light-emitting devices 50 include a first light-emitting device 501 and a second light-emitting device 502. The first electrode 3011 is electrically connected to the first light-emitting device 501 through a first conductive part 401 and a second conductive part 601 for welding, and the second electrode 3012 is electrically connected to the second light-emitting device 502 through the first conductive part 401 and the second conductive part 601 for welding.

[0067] It can be understood that in this embodiment, the encapsulation form of the light-emitting device 50 is taken as an example of a horizontal light-emitting chip for illustration. At this time, the first electrode 3011 is electrically connected to the first light-emitting device 501 through the first conductive part 401 and the second conductive part 601 for welding. The number of the first electrodes 3011 can be a pair (as shown in Figure 2 ), and they are respectively electrically connected to the second conductive parts 601 on the anode pin and the cathode pin of the first light-emitting device 501. Similarly, the second electrode 3012 is electrically connected to the second light-emitting device 502 through the first conductive part 401 and the second conductive part 601 for welding. The number of the second electrodes 3012 can be a pair (as shown in Figure 2 ), and they are respectively electrically connected to the second conductive parts 601 on the anode pin and the cathode pin of the second light-emitting device 502.

[0068] Among them, as shown in Figure 3 , Figure 3 is Figure 1 a schematic cross-sectional structure diagram in the B-B' direction in Figure 3In the figure, different filling patterns are used to distinguish that the materials of the first conductive part are different and the materials of the second conductive part are different, and the same filling pattern is used to distinguish that the materials of the first conductive part are the same and the materials of the second conductive part are the same). The materials of the second conductive part 601 between the first electrode 3011 and the first light-emitting device 501 and the materials of the second conductive part 601 between the second electrode 3012 and the second light-emitting device 502 are different from each other, while the materials of the first conductive part 401 between the first electrode 3011 and the first light-emitting device 501 and the materials of the first conductive part 401 between the second electrode 3012 and the second light-emitting device 502 are the same;

[0069] Or, as Figure 4 shown, Figure 4 is Figure 1 Another schematic cross-sectional structure diagram in the B-B' direction in the figure (for clearly showing the solution of this embodiment, Figure 4 In the figure, different filling patterns are used to distinguish that the materials of the first conductive part are different and the materials of the second conductive part are different, and the same filling pattern is used to distinguish that the materials of the first conductive part are the same and the materials of the second conductive part are the same). The materials of the first conductive part 401 between the first electrode 3011 and the first light-emitting device 501 and the materials of the first conductive part 401 between the second electrode 3012 and the second light-emitting device 502 are different from each other, while the materials of the second conductive part 601 between the first electrode 3011 and the first light-emitting device 501 and the materials of the second conductive part 601 between the second electrode 3012 and the second light-emitting device 502 are the same.

[0070] Or, as Figure 5 shown, Figure 5 is Figure 1 Another schematic cross-sectional structure diagram in the B-B' direction in the figure (for clearly showing the solution of this embodiment, Figure 5 In the figure, different filling patterns are used to distinguish that the materials of the first conductive part are different and the materials of the second conductive part are different, and the same filling pattern is used to distinguish that the materials of the first conductive part are the same and the materials of the second conductive part are the same). The materials of the second conductive part 601 between the first electrode 3011 and the first light-emitting device 501 and the materials of the second conductive part 601 between the second electrode 3012 and the second light-emitting device 502 are different from each other, and the materials of the first conductive part 401 between the first electrode 3011 and the first light-emitting device 501 and the materials of the first conductive part 401 between the second electrode 3012 and the second light-emitting device 502 are also different from each other.

[0071] It can be seen from this that the display panel 000 provided in this embodiment can be fabricated using light-emitting devices 50 with different incoming materials provided by different suppliers, or an array substrate with different materials for the first conductive portion 401. That is, the display panel 000 of this embodiment can use light-emitting devices 50 with different incoming materials, or an array substrate with different materials, and has a wider range of use. Moreover, for different incoming materials of the bump structure, the display panel 000 of this embodiment can also ensure the bonding yield and bonding reliability. Specifically,

[0072] In the display panel 000, the plurality of electrodes 301 at least include a first electrode 3011 and a second electrode 3012, and the plurality of light-emitting devices 50 at least include a first light-emitting device 501 and a second light-emitting device 502. The first electrode 3011 is electrically connected to the first light-emitting device 501 through the first conductive portion 401 and the second conductive portion 601 by welding, and the second electrode 3012 is electrically connected to the second light-emitting device 502 through the first conductive portion 401 and the second conductive portion 601 by welding;

[0073] Among them, as Figure 3 shown, if the materials of the second conductive portion 601 between the first electrode 3011 and the first light-emitting device 501 and the materials of the second conductive portion 601 between the second electrode 3012 and the second light-emitting device 502 are different, while the materials of the second conductive portion 601 between the first electrode 3011 and the first light-emitting device 501 and the materials of the second conductive portion 601 between the second electrode 3012 and the second light-emitting device 502 are the same, that is, the incoming materials of the bump structure of the first light-emitting device 501 and the incoming materials of the bump structure of the second light-emitting device 502 are different, then during the fabrication process of the display panel 000, a two-time bonding method can be adopted. For example, for the different materials of the second conductive portion 601 between the first electrode 3011 and the first light-emitting device 501 and the second conductive portion 601 between the second electrode 3012 and the second light-emitting device 502, the first conductive portion 401 and the second conductive portion 601 between the first electrode 3011 and the first light-emitting device 501 can be bonded and welded first, and then the first conductive portion 401 and the second conductive portion 601 between the second electrode 3012 and the second light-emitting device 502 can be bonded and welded, or the first conductive portion 401 and the second conductive portion 601 between the second electrode 3012 and the second light-emitting device 502 can be bonded and welded first, and then the first conductive portion 401 and the second conductive portion 601 between the first electrode 3011 and the first light-emitting device 501 can be bonded and welded. The process conditions for the two-time bonding can be designed differently, so as to ensure the bonding yield of the light-emitting devices with different incoming materials and the array substrate through at least two-time bonding.

[0074] The display panel 000 of the present embodiment does not need to be limited by the diversification of the incoming materials of the light-emitting device. In view of the problem that different incoming materials of the light-emitting device cannot be bonded at one time due to the difference in the incoming bump materials when different incoming materials of the light-emitting device are used in combination, the display panel 000 is designed to include a double bonding bump system, wherein the double bonding bump system refers to the material of the second conductive portion 601 between the first electrode 3011 and the first light-emitting device 501, and the material of the second conductive portion 601 between the second electrode 3012 and the second light-emitting device 502. When the two are different, the first conductive portion 401 and the second conductive portion 601 between the first electrode 3011 and the first light-emitting device 501 are a bonding bump system, and the first conductive portion 601 between the second electrode 3012 and the second light-emitting device 502 is a bonding bump system. Part 401 and the second conductive part 601 are another bonding bump system. The conditions for realizing the double bonding bump system are that at least the material of the second conductive part 601 between the first electrode 3011 and the first light-emitting device 501, and the material of the second conductive part 601 between the second electrode 3012 and the second light-emitting device 502 are different, and / or, at least the material of the first conductive part 401 between the first electrode 3011 and the first light-emitting device 501, and the material of the first conductive part 401 between the second electrode 3012 and the second light-emitting device 502 are different. Furthermore, through multiple bonding methods in the process of manufacturing the display panel 000, the bonding yield of different light-emitting devices 50 and the electrode 301 can still be guaranteed, which is beneficial to ensuring bonding reliability and display quality.

[0075] It should be noted that the figure of this embodiment only illustrates the structure of the display panel by way of example. In specific implementation, the structure of the display panel includes but is not limited to this, and may also include other structures that can realize the display function. For details, please refer to the structure of the mini LED or micro LED display panel in the related technology for understanding, and this embodiment will not be elaborated here.

[0076] Optional, such as Figure 1 and Figure 6 As shown, Figure 6 yes Figure 1 Another schematic cross-sectional structure diagram along the AA′ direction, in this embodiment, an adhesion layer 001 and an isolation layer 002 are further included between the electrode 301 and the first conductive part 401 .

[0077] This embodiment explains that the first conductive portion 401 for bonding the electrode 301 and the light-emitting device 50 can be fabricated on the surface of the array substrate after the fabrication of film layers such as the driving array layer 20 and the first conductive layer 30. The first conductive portion 401 can be understood as a bump structure formed on the electrode 301. Generally, an adhesion layer 001 and a barrier layer 002 are also included between the electrode 301 and the first conductive portion 401. That is, on the surface of the array substrate after the fabrication of film layers such as the driving array layer 20 and the first conductive layer 30, after fixing the barrier layer 002 through the adhesion layer 001 in sequence, the first conductive portion 401 is fabricated on the surface of the barrier layer 002 away from the electrode 301. The adhesion layer 001 and the barrier layer 002 enhance the adhesion between the first conductive portion 401 and the electrode 301 on the surface of the array substrate, which is beneficial to preventing the peeling problem of the first conductive portion 401 on the surface of the array substrate, and thus can improve the reliability of the product and is beneficial to further improving the bonding yield between the subsequent electrode 301 and the light-emitting device 50.

[0078] It can be understood that the adhesion layer 001 can be understood as a conductive material with adhesiveness, and the barrier layer 002 can be understood as a conductive material with adhesiveness and capable of isolating the intrusion of impurities, water, oxygen, etc., such as a metal material with good conductivity. In this embodiment, the specific materials for fabricating the adhesion layer 001 and the barrier layer 002 are not limited, and in specific implementation, they can be set according to actual requirements.

[0079] In some alternative embodiments, please continue to refer to Figures 1-3 , in this embodiment, when the materials of the second conductive portion 601 between the first electrode 3011 and the first light-emitting device 501 and the materials of the second conductive portion 601 between the second electrode 3012 and the second light-emitting device 502 are different,

[0080] the materials of the first conductive portion 401 between the first electrode 3011 and the first light-emitting device 501 and the materials of the first conductive portion 401 between the second electrode 3012 and the second light-emitting device 502 are the same.

[0081] This embodiment explains that the display panel 000 is provided with a double-bonded bump system. The double-bonded bump system may refer to the material of the second conductive portion 601 between the first electrode 3011 and the first light-emitting device 501, and the material of the second conductive portion 601 between the second electrode 3012 and the second light-emitting device 502. When they are different, the material of the first conductive portion 401 between the first electrode 3011 and the first light-emitting device 501 and the material of the first conductive portion 401 between the second electrode 3012 and the second light-emitting device 502 are the same. At this time, the first conductive portion 401 and the second conductive portion 601 between the first electrode 3011 and the first light-emitting device 501 form one bonded bump system, and the first conductive portion 401 and the second conductive portion 601 between the second electrode 3012 and the second light-emitting device 502 form another bonded bump system. And although the material of the second conductive portion 601 between the first electrode 3011 and the first light-emitting device 501 and the material of the second conductive portion 601 between the second electrode 3012 and the second light-emitting device 502 are different, the material of the first conductive portion 401 between the first electrode 3011 and the first light-emitting device 501 and the material of the first conductive portion 401 between the second electrode 3012 and the second light-emitting device 502 are the same. That is, whether on the first electrode 3011 corresponding to the first light-emitting device 501 or on the second electrode 3012 corresponding to the second light-emitting device 501, the first conductive portion 401 fabricated on the surface of the array substrate after fabricating film layers such as the driving array layer 20 and the first conductive layer 30 is made of the same material. Each first conductive portion 401 on the surface of the array substrate of the display panel 000 can be fabricated in one-time with the same process, which is beneficial to reducing the fabrication difficulty of the array substrate and improving the manufacturing efficiency of the display panel 000.

[0082] Optionally, when the materials of the second conductive part 601 between the first electrode 3011 and the first light-emitting device 501 and the materials of the second conductive part 601 between the second electrode 3012 and the second light-emitting device 502 are different, but the materials of the first conductive part 401 between the first electrode 3011 and the first light-emitting device 501 and the materials of the first conductive part 401 between the second electrode 3012 and the second light-emitting device 502 are the same, that is, whether on the first electrode 3011 corresponding to the first light-emitting device 501 or on the second electrode 3012 corresponding to the second light-emitting device 501, when the first conductive part 401 made on the surface of the array substrate after fabricating film layers such as the driving array layer 20 and the first conductive layer 30 is made of the same material, the material of the first conductive part 401 may include one of Sn or AgSn alloy. Sn (pure tin) has a lower price and is suitable for cost-sensitive product applications. It has good wettability, is easy to form uniform solder joints on the metal surface, and generally has a lower melting point, about 232 °C, which is suitable for low-temperature soldering. It has good electrical conductivity and corrosion resistance, can effectively resist oxidation and corrosion, and ensure the reliability of electrical conduction. AgSn alloy (which can be understood as doping a certain amount of silver metal in tin), the addition of silver improves the mechanical strength of the AgSn alloy, is suitable for high-stress environments, and its electrical conductivity has been effectively improved, making it suitable for high-conductive requirements. It also has good heat dissipation performance, good wettability, excellent welding performance, and high-quality solder joints.

[0083] It can be understood that in this embodiment, the material of the first conductive part 401 made on the side of the electrode 301 away from the driving array layer 20 is not limited. Specifically, in implementation, the material of the first conductive part 401 includes but is not limited to the above materials, and can be set according to actual needs, as long as even though the materials of the second conductive part 601 between the first electrode 3011 and the first light-emitting device 501 and the materials of the second conductive part 601 between the second electrode 3012 and the second light-emitting device 502 are different, the materials of the first conductive part 401 between the first electrode 3011 and the first light-emitting device 501 and the materials of the first conductive part 401 between the second electrode 3012 and the second light-emitting device 502 are still the same, so as to improve the panel manufacturing efficiency.

[0084] In some alternative embodiments, please refer to Figures 7-9 , Figure 7 which is another schematic plan view of the display panel provided by the embodiment of the present disclosure, Figure 8 is Figure 7 a schematic cross-sectional structure view in the C-C' direction of Figure 9 is Figure 7Another schematic cross-sectional structure view in the C-C' direction. In this embodiment, the display panel 000 may include a plurality of light-emitting devices 50 with different colors, and the color of the first light-emitting device 501 is different from that of the second light-emitting device 502( Figure 7 , Figure 8 and Figure 9 wherein light-emitting devices with different colors are represented by different filling patterns). In this embodiment, the material of the second conductive part 601 between the first light-emitting device 501 and the first electrode 3011 is different from that of the first conductive part 401, and the material of the second conductive part 601 between the second light-emitting device 502 and the second electrode 3012 is the same as that of the first conductive part 401.

[0085] This embodiment explains that if the materials of the second conductive part 601 between the first electrode 3011 and the first light-emitting device 501 and the second conductive part 601 between the second electrode 3012 and the second light-emitting device 502 are different, but the materials of the first conductive part 401 between the first electrode 3011 and the first light-emitting device 501 and the first conductive part 401 between the second electrode 3012 and the second light-emitting device 502 are the same, the color of the first light-emitting device 501 is different from that of the second light-emitting device 502. That is, the first conductive part 401 and the second conductive part 601 between the first electrode 3011 and the first light-emitting device 501 of one color form a bonding bump system, and the first conductive part 401 and the second conductive part 601 between the second electrode 3012 and the second light-emitting device 502 of another color form another bonding bump system. Thus, the display panel 000 includes a double bonding bump system, and during manufacturing, it is not necessary to be limited by the diversification of the incoming light-emitting devices. When different incoming light-emitting devices are mixed and used, the problem of inability to perform one-time bonding due to differences in bump incoming materials can be avoided, ensuring the bonding yield.

[0086] Optionally, in this embodiment, the color of the first light-emitting device 501 includes one of red, green, and blue, and the color of the second light-emitting device 502 includes another one or two of red, green, and blue. The color of the first light-emitting device 501 can be red, and the color of the second light-emitting device 502 can be blue and green; the color of the first light-emitting device 501 can be green, and the color of the second light-emitting device 502 can be red and blue; the color of the first light-emitting device 501 can be blue, and the color of the second light-emitting device 502 can be red and green (as Figure 8 shown); or the color of the first light-emitting device 501 can be red and green, and the color of the second light-emitting device 502 can be blue; the color of the first light-emitting device 501 can be green and blue, and the color of the second light-emitting device 502 can be red; the color of the first light-emitting device 501 can be blue and red, and the color of the second light-emitting device 502 can be green (asFigure 9 As shown). Although the epitaxial growth process for manufacturing the red light-emitting device is different from that of the blue and green light-emitting devices, the manufacturing of the second conductive part 601 (bonding bump structure) is not involved. Therefore, there can be various combinations of the colors of the first light-emitting device 501 and the second light-emitting device 502, and it only needs to satisfy that the colors of the first light-emitting device 501 and the second light-emitting device 502 are different.

[0087] Optionally, the material of the second conductive part 601 between the first light-emitting device 501 and the first electrode 3011 includes one of AuSn alloy or AuSnAg alloy, and the material of the second conductive part 601 between the second light-emitting device 502 and the second electrode 3012 includes one of Sn or AgSn alloy. Using AuSnAg alloy (gold-tin-silver alloy) material to make the second conductive part 601 has good wettability, can well wet the surface of the substrate, form a uniform and reliable solder joint. After welding, the solder joint is dense, reducing pores and defects, improving the welding quality. The addition of gold improves the mechanical strength of the alloy, is suitable for high-stress environments. Under high temperature or long-term load, the solder joint is not easy to deform and remains stable. Moreover, the conductivity of gold and silver is excellent, which is suitable for welding environments with high conductivity requirements.

[0088] For example, the material of the second conductive part 601 between the first light-emitting device 501 and the first electrode 3011 includes AuSn alloy, and the material of the second conductive part 601 between the second light-emitting device 502 and the second electrode 3012 includes Sn. And the materials of the first conductive part 401 between the first light-emitting device 501 and the first electrode 3011 and the first conductive part 401 between the second light-emitting device 502 and the second electrode 3012 are the same, both being Sn. At this time, the first conductive part 401 and the second conductive part 601 between the first electrode 3011 and the first light-emitting device 501 of one color form a bonding bump system (AuSn alloy on the first light-emitting device 501 side + Sn high-temperature bonding bump system on the first electrode 3011 side), and the first conductive part 401 and the second conductive part 601 between the second electrode 3012 and the second light-emitting device 502 of another color form another bonding bump system (Sn on the second light-emitting device 502 side + Sn low-temperature bonding bump system on the second electrode 3012 side). The first conductive part 401 and the second conductive part 601 between the first light-emitting device 501 and the first electrode 3011 can be first bonded and welded at high temperature for the first time, and then the first conductive part 401 and the second conductive part 601 between the second light-emitting device 502 and the second electrode 3012 can be bonded and welded at low temperature for the second time, avoiding the problem that the high temperature of the second bonding melts the bonding structure of the previous time, which is beneficial to ensuring the process yield.

[0089] Alternatively, if the material of the second conductive portion 601 between the first light-emitting device 501 and the first electrode 3011 includes an AuSnAg alloy, and the material of the second conductive portion 601 between the second light-emitting device 502 and the second electrode 3012 includes Sn, while the materials of the first conductive portions 401 between the first light-emitting device 501 and the first electrode 3011 and between the second light-emitting device 502 and the second electrode 3012 are the same, both being Sn; at this time, the first conductive portion 401 and the second conductive portion 601 between the first electrode 3011 and the first light-emitting device 501 of one color form a bonding bump system (the AuSnAg alloy on the side of the first light-emitting device 501 + the Sn high-temperature bonding bump system on the side of the first electrode 3011), and the first conductive portion 401 and the second conductive portion 601 between the second electrode 3012 and the second light-emitting device 502 of another color form another bonding bump system (the Sn on the side of the second light-emitting device 502 + the Sn low-temperature bonding bump system on the side of the second electrode 3012). The first conductive portion 401 and the second conductive portion 601 between the first light-emitting device 501 and the first electrode 3011 can be first bonded and welded at a high temperature for the first time, and then the first conductive portion 401 and the second conductive portion 601 between the second light-emitting device 502 and the second electrode 3012 can be bonded and welded at a low temperature for the second time, avoiding the problem that the bonding structure of the previous time is melted by the high temperature of the second bonding, which is beneficial to ensuring the process yield.

[0090] In some alternative embodiments, please continue to refer to Figure 1 、 Figure 2 and Figure 5 . In this embodiment, when the materials of the second conductive portions 601 between the first electrode 3011 and the first light-emitting device 501 and between the second electrode 3012 and the second light-emitting device 502 are different,

[0091] the materials of the first conductive portions 401 between the first electrode 3011 and the first light-emitting device 501 and between the second electrode 3012 and the second light-emitting device 502 are also different.

[0092] This embodiment explains that the display panel 000 is provided with a double-bonded bump system. The double-bonded bump system may refer to the material of the second conductive part 601 between the first electrode 3011 and the first light-emitting device 501, and the material of the second conductive part 601 between the second electrode 3012 and the second light-emitting device 502. When the two are different, the material of the first conductive part 401 between the first electrode 3011 and the first light-emitting device 501 and the material of the first conductive part 401 between the second electrode 3012 and the second light-emitting device 502 are also different. At this time, the first conductive part 401 and the second conductive part 601 between the first electrode 3011 and the first light-emitting device 501 form one bonded bump system, and the first conductive part 401 and the second conductive part 601 between the second electrode 3012 and the second light-emitting device 502 form another bonded bump system. Furthermore, the display panel 000 can be made to include a double-bonded bump system. During production, it is not necessary to be restricted by the diversity of the light-emitting device incoming materials. When different light-emitting device incoming materials are mixed and used, the problem of inability to bond and bind in one go due to differences in bump incoming materials can be avoided, and the bonding yield can be guaranteed.

[0093] Optionally, as Figure 1 , Figure 2 , Figure 10 shown, Figure 10 is Figure 1 another schematic cross-sectional structure diagram in the B-B' direction of Figure 10 (for clearly showing the solution of this embodiment,

[0094] in

[0095] different filling patterns are used to distinguish that the materials of the first conductive part are different and the materials of the second conductive part are different, and the same filling pattern is used to distinguish that the materials of the first conductive part are the same and the materials of the second conductive part are the same). In this embodiment, although the material of the second conductive part 601 between the first electrode 3011 and the first light-emitting device 501 and the material of the second conductive part 601 between the second electrode 3012 and the second light-emitting device 502 are different, and the material of the first conductive part 401 between the first electrode 3011 and the first light-emitting device 501 and the material of the first conductive part 401 between the second electrode 3012 and the second light-emitting device 502 are also different, the material of the second conductive part 601 between the first electrode 3011 and the first light-emitting device 501 is the same as the material of the first conductive part 401;

[0094] The material of the second conductive part 601 between the second electrode 3012 and the second light-emitting device 502 is the same as the material of the first conductive part 401.

[0095] This embodiment explains that the first conductive part 401 fabricated on the surface of the array substrate after fabricating film layers such as the driving array layer 20 and the first conductive layer 30 can be made of different materials. Through multiple processes, the first conductive part 401 made of the same material as the second conductive part 601 corresponding to the first light-emitting device 501 can be fabricated at the positions where the first light-emitting device 501 and the second light-emitting device 502 need to be bonded respectively. For example, if the material of the second conductive part 601 corresponding to the first light-emitting device 501 is AuSn alloy and the material of the second conductive part 601 corresponding to the second light-emitting device 502 is Sn, then the material of the first conductive part 401 on the first electrode 3011 corresponding to the first light-emitting device 501 is also selected as AuSn alloy, and the material of the first conductive part 401 on the second electrode 3012 corresponding to the second light-emitting device 502 is also selected as Sn. Thus, the first conductive part 401 and the second conductive part 601 between the first electrode 3011 and the first light-emitting device 501 form a bonding bump system (the AuSn alloy on the first light-emitting device 501 side + the high-temperature bonding bump system of the AuSn alloy on the first electrode 3011 side), and the first conductive part 401 and the second conductive part 601 between the second electrode 3012 and the second light-emitting device 502 form another bonding bump system (the Sn on the second light-emitting device 502 side + the low-temperature bonding bump system of the Sn on the second electrode 3012 side). Furthermore, a display panel 000 including a double-bonding bump system can be realized. During fabrication, it is not necessary to be restricted by the diversification of the light-emitting device incoming materials. When different light-emitting device incoming materials are mixed and used, the problem of non-one-time bonding and binding caused by the difference in bump incoming materials can be solved, and the bonding yield can be guaranteed.

[0096] In some alternative embodiments, please refer to Figure 7 and Figure 11 、 Figure 12 , Figure 11 is Figure 7 another schematic cross-sectional structure diagram in the C-C' direction in Figure 12 is Figure 7 another schematic cross-sectional structure diagram in the C-C' direction in . In this embodiment, the display panel 000 may include a plurality of light-emitting devices 50 with different colors, and the color of the first light-emitting device 501 is different from that of the second light-emitting device 502 (different filling patterns in the figure represent light-emitting devices with different colors). In this embodiment, the material of the first conductive part 401 between the first light-emitting device 501 and the first electrode 3011 includes one of AuSn alloy or AuSnAg alloy, and the material of the second conductive part 601 between the first light-emitting device 501 and the first electrode 3011 includes one of AuSn alloy or AuSnAg alloy; the material of the second conductive part 601 between the first electrode 3011 and the first light-emitting device 501 is the same as that of the first conductive part 401;

[0097] The material of the first conductive part 401 between the second light-emitting device 502 and the second electrode 3012 includes one of Sn or an AgSn alloy, and the material of the second conductive part 601 between the second light-emitting device 502 and the second electrode 3012 includes one of Sn or an AgSn alloy; the material of the second conductive part 601 between the second electrode 3012 and the second light-emitting device 502 is the same as the material of the first conductive part 401.

[0098] This embodiment explains that if the materials of the second conductive parts 601 between the first electrode 3011 and the first light-emitting device 501 and between the second electrode 3012 and the second light-emitting device 502 are different, and the materials of the first conductive parts 401 between the first electrode 3011 and the first light-emitting device 501 and between the second electrode 3012 and the second light-emitting device 502 are also different, but the material of the second conductive part 601 between the first electrode 3011 and the first light-emitting device 501 is the same as the material of the first conductive part 401, and the material of the second conductive part 601 between the second electrode 3012 and the second light-emitting device 502 is the same as the material of the first conductive part 401, then the color of the first light-emitting device 501 is different from the color of the second light-emitting device 502, that is, the light-emitting devices of the same color and their corresponding electrodes are the same bonding system. The first conductive part 401 and the second conductive part 601 between the first electrode 3011 and the first light-emitting device 501 of one color form a bonding bump system, and the first conductive part 401 and the second conductive part 601 between the second electrode 3012 and the second light-emitting device 502 of another color form another bonding bump system. Furthermore, it is realized that the display panel 000 includes a double-bonding bump system. When manufacturing, it is not necessary to be limited by the diversification of the incoming light-emitting devices. When different incoming light-emitting devices are mixed and used, the problem of inability to bond and bind at one time caused by the difference in the incoming bump can be ensured to have a good bonding yield.

[0099] Optionally, in this embodiment, the color of the first light-emitting device 501 includes one of red, green, and blue, and the color of the second light-emitting device 502 includes another one or two of red, green, and blue. The color of the first light-emitting device 501 can be red, and the color of the second light-emitting device 502 can be blue and green; the color of the first light-emitting device 501 can be green, and the color of the second light-emitting device 502 can be red and blue; the color of the first light-emitting device 501 can be blue, and the color of the second light-emitting device 502 can be red and green (such as Figure 8as shown); or the color of the first light-emitting device 501 can be red and green, and the color of the second light-emitting device 502 can be blue; the color of the first light-emitting device 501 can be green and blue, and the color of the second light-emitting device 502 can be red; the color of the first light-emitting device 501 can be blue and red, and the color of the second light-emitting device 502 can be green (as Figure 9 shown). Although the epitaxial growth processes for manufacturing red light-emitting devices, blue light-emitting devices, and green light-emitting devices are different, the manufacturing of the second conductive portion 601 (bonding bump structure) is not involved. Therefore, there can be multiple combinations of the colors of the first light-emitting device 501 and the second light-emitting device 502, and it only needs to satisfy that the colors of the first light-emitting device 501 and the second light-emitting device 502 are different.

[0100] Optionally, if the material of the second conductive portion 601 between the first light-emitting device 501 and the first electrode 3011 includes an AuSn alloy, the material of the first conductive portion 401 between the first light-emitting device 501 and the first electrode 3011 also includes an AuSn alloy, the material of the second conductive portion 601 between the second light-emitting device 502 and the second electrode 3012 includes Sn, and the material of the first conductive portion 401 between the second light-emitting device 502 and the second electrode 3012 also includes Sn; at this time, the first conductive portion 401 and the second conductive portion 601 between the first electrode 3011 and the first light-emitting device 501 of one color form a bonding bump system (a high-temperature bonding bump system of AuSn alloy on the side of the first light-emitting device 501 + AuSn alloy on the side of the first electrode 3011), and the first conductive portion 401 and the second conductive portion 601 between the second electrode 3012 and the second light-emitting device 502 of another color form another bonding bump system (a low-temperature bonding bump system of Sn on the side of the second light-emitting device 502 + Sn on the side of the second electrode 3012). The first conductive portion 401 and the second conductive portion 601 between the first light-emitting device 501 and the first electrode 3011 can be first bonded and welded at a high temperature, and then the first conductive portion 401 and the second conductive portion 601 between the second light-emitting device 502 and the second electrode 3012 can be second bonded and welded at a low temperature, avoiding the problem that the high temperature of the second bonding melts the bonding structure of the previous time, which is beneficial to ensuring the process yield.

[0101] Alternatively, if the material of the second conductive portion 601 between the first light-emitting device 501 and the first electrode 3011 includes an AuSnAg alloy, and the material of the first conductive portion 401 between the first light-emitting device 501 and the first electrode 3011 also includes an AuSnAg alloy, and the material of the second conductive portion 601 between the second light-emitting device 502 and the second electrode 3012 includes Sn, and the material of the first conductive portion 401 between the second light-emitting device 502 and the second electrode 3012 also includes Sn; wherein, using the AuSnAg alloy (gold-tin-silver alloy) material to make the second conductive portion 601 has good wettability, can well wet the surface of the substrate, form a uniform and reliable solder joint, the solder joint is dense after welding, reduce pores and defects, improve the welding quality, the addition of gold improves the mechanical strength of the alloy, is suitable for high-stress environments, under high temperature or long-term load, the solder joint is not easy to deform and remains stable, and the conductivity of gold and silver is excellent, suitable for welding environments with high conductivity requirements. At this time, the first conductive portion 401 and the second conductive portion 601 between the first electrode 3011 and the first light-emitting device 501 of one color are a bonding bump system (the AuSnAg alloy on the first light-emitting device 501 side + the AuSnAg alloy high-temperature bonding bump system on the first electrode 3011 side), and the first conductive portion 401 and the second conductive portion 601 between the second electrode 3012 and the second light-emitting device 502 of another color are another bonding bump system (the Sn on the second light-emitting device 502 side + the Sn low-temperature bonding bump system on the second electrode 3012 side). The first conductive portion 401 and the second conductive portion 601 between the first light-emitting device 501 and the first electrode 3011 can be first bonded and welded at high temperature for the first time, and then the first conductive portion 401 and the second conductive portion 601 between the second light-emitting device 502 and the second electrode 3012 can be bonded and welded at low temperature for the second time, avoiding the problem that the bonding structure of the previous time is melted by the high temperature of the second bonding, which is beneficial to ensuring the process yield.

[0102] In some alternative embodiments, please refer to Figure 7 and Figure 13 , Figure 13 is Figure 7 Another schematic cross-sectional structure diagram in the C-C' direction of

[0103] In the direction Z perpendicular to the plane where the substrate 10 is located, the sum of the heights of the first conductive portion 401 and the second conductive portion 601 between the first light-emitting device 501 and the first electrode 3011 is H1, and the sum of the heights of the first conductive portion 401 and the second conductive portion 601 between the second light-emitting device 502 and the second electrode 3012 is H2, and H1 < H2.

[0104] In this embodiment, it is explained that the display panel 000 includes a plurality of light-emitting devices 50. The light-emitting devices 50 are microLEDs. When the color of the first light-emitting device 501 is different from that of the second light-emitting device 502, the luminous efficiency of the first light-emitting device 501 may be different from that of the second light-emitting device 502. For example, if the color of the first light-emitting device 501 is red and the color of the second light-emitting device 502 is blue or green, the luminous efficiency of the first light-emitting device 501 will be less than that of the second light-emitting device 502. The main reasons for the low luminous efficiency of the red first light-emitting device 501 include material characteristics, low external quantum efficiency (EQE), and wavelength conversion loss, etc. Therefore, in order to ensure the light output uniformity of the display panel 000, generally, the thickness or the light output area of the first light-emitting device 501 and the second light-emitting device 502 with different colors in the display panel 000 is designed differently. For example, if the luminous efficiency of the first light-emitting device 501 is less than that of the second light-emitting device 502, the thickness of the first light-emitting device 501 in the display panel 000 in the direction Z perpendicular to the plane of the substrate 10 can be greater than the thickness of the second light-emitting device 502 in the direction Z perpendicular to the plane of the substrate 10, or the light output area of the first light-emitting device 501 is greater than that of the second light-emitting device 502. Therefore, in this embodiment, along the direction Z perpendicular to the plane of the substrate 10, the sum of the heights of the first conductive part 401 and the second conductive part 601 between the first light-emitting device 501 and the first electrode 3011 is H1, and the sum of the heights of the first conductive part 401 and the second conductive part 601 between the second light-emitting device 502 and the second electrode 3012 is H2, and H1 < H2. Even if the thickness of the first light-emitting device 501 in the direction Z perpendicular to the plane of the substrate 10 is greater than the thickness of the second light-emitting device 502 in the direction Z perpendicular to the plane of the substrate 10, by designing the sum of the heights H1 of the first conductive part 401 and the second conductive part 601 between the first light-emitting device 501 and the first electrode 3011 to be less than the sum of the heights H2 of the first conductive part 401 and the second conductive part 601 between the second light-emitting device 502 and the second electrode 3012, the overall height difference after the final light-emitting device 50 is transferred to the array substrate can be balanced, so that after each light-emitting device 50 is bonded to the electrode 301, the surfaces of each light-emitting device 50 on the side away from the substrate 10 can be kept on the same horizontal plane as much as possible, which is beneficial to ensuring the packaging effect of the subsequent panel.

[0105] It should be noted that in the above embodiment, generally, an adhesion layer 001 and an isolation layer 002 need to be included between the electrode 301 and the first conductive part 401 to enhance the reliability of the first conductive part 401 and the electrode 301, but the drawings do not fully show it. When an adhesion layer 001 and an isolation layer 002 are included between the electrode 301 and the first conductive part 401, such asFigure 7 and Figure 14 as shown Figure 14 is Figure 7 Another schematic cross-sectional structure diagram in the C-C' direction in [figure reference], in this embodiment, along the direction Z perpendicular to the plane where the substrate 10 is located, the sum of the heights H1 of the first conductive portion 401 and the second conductive portion 601 between the first light-emitting device 501 and the first electrode 3011 can be understood as the overall height of the adhesion layer 001, the isolation layer 002, the first conductive portion 401, and the second conductive portion 601 between the first light-emitting device 501 and the first electrode 3011. The sum of the heights H2 of the first conductive portion 401 and the second conductive portion 601 between the second light-emitting device 502 and the second electrode 3012 can be understood as the overall height of the adhesion layer 001, the isolation layer 002, the first conductive portion 401, and the second conductive portion 601 between the second light-emitting device 502 and the second electrode 3012.

[0106] In some alternative embodiments, please refer to Figure 7 and Figure 15 , Figure 15 is Figure 7 Another schematic cross-sectional structure diagram in the C-C' direction in [figure reference]. In this embodiment, the display panel 000 further includes a first planarization layer 701 and a second planarization layer 901;

[0107] The first planarization layer 701 is located between the driving array layer 20 and the first conductive layer 30, and the second planarization layer 901 is located on the side of the first conductive layer 30 away from the substrate 10;

[0108] The second planarization layer 901 includes a plurality of first openings 901K that penetrate the thickness of the second planarization layer 901;

[0109] Along the direction Z perpendicular to the plane where the substrate 10 is located, the first opening 901K exposes at least a part of the electrode 301.

[0110] This embodiment explains that in the film layer structure of the display panel 000, a first planarization layer 701 can be provided between the driving array layer 20 and the first conductive layer 30. The first planarization layer 701 can be an organic film layer. The driving array layer 20 is generally used to set circuit and signal line structures such as thin film transistors 20T for driving the light-emitting devices to emit light. Therefore, the surface of the driving array layer 20 on the side away from the substrate 10 can be flattened by the first planarization layer 701, facilitating the flatness of the subsequent first conductive layer 30, and further ensuring the bonding effect between the electrode 301 of the first conductive layer 30 and the light-emitting device 50 in the future.

[0111] In addition to including a plurality of electrodes 301, the first conductive layer 30 of this embodiment may further include other patterned conductive structures, such as signal traces, one plate structure of a capacitor, etc. Therefore, after the first conductive layer 30 is patterned, there are obvious concave and convex structures on the surface of the side away from the substrate 10. Therefore, a second planarization layer 901 may be further provided on the side of the patterned first conductive layer 30 away from the substrate 10. The material of the second planarization layer 901 may be the same as that of the first planarization layer 701, that is, the second planarization layer 901 may be an organic film layer, so as to planarize the surface of the first conductive layer 30 on the side away from the substrate 10, so that the surface of the patterned first conductive layer 30 can be covered by the second planarization layer 901 made of organic material, playing a role in flattening the surface of the first conductive layer 30. That is, a large number of concave and convex structures presented by the patterned first conductive layer 30 can be flattened by the second planarization layer 901, which can improve the flatness problem of the substrate, and is beneficial to improving the substrate performance and display effect. The second planarization layer 901 of this embodiment includes a plurality of first openings 901K, and the first openings 901K penetrate through the thickness of the second planarization layer 901. In the direction Z perpendicular to the plane where the substrate 10 is located, the first openings 901K expose at least part of the electrodes 301, so as to facilitate the subsequent bonding of the light-emitting device 50 with the electrodes 301 in the first openings 901K. In this embodiment, a second planarization layer 901 is further provided on the side of the first conductive layer 30 away from the substrate 10. Through the high flatness performance of the second planarization layer 901 made of organic material, the flatness problem of the substrate can be improved, the reliability of the substrate performance can be ensured, and the display effect can be enhanced. And because a surface with high flatness is beneficial to improving the diffusion speed and covering ability of the ink, the setting of the second planarization layer 901 can improve the ink packaging quality on the side of the array substrate away from the substrate 10, ensure the reliability of the subsequent substrate ink packaging, and enhance the display effect.

[0112] It can be understood that a protective layer 80 made of inorganic material may be further provided on the side of the second planarization layer 901 away from the substrate 10. The protective layer 80 may cover the second planarization layer 901, playing a role in protecting the surface of the array substrate and isolating the erosion of water and oxygen. The protective layer 80 made of inorganic material may be provided with through holes to expose part of the electrodes 301, so as to facilitate the bonding of the exposed part of the electrode 301 area with the light-emitting device 50.

[0113] In some alternative embodiments, please refer to Figures 1-5 、 Figure 16 , Figure 16 which is a flowchart of a method for manufacturing a display panel provided by an embodiment of the present disclosure. The method for manufacturing a display panel provided by this embodiment can be used to manufacture the display panel 000 in any of the above embodiments. The manufacturing method includes:

[0114] S10: Provide an array substrate 00, where the array substrate 00 includes a substrate 10, a driving array layer 20 located on one side of the substrate 10, and a first conductive layer 30. The first conductive layer 30 includes a plurality of electrodes 301, and the side of the electrode 301 away from the substrate includes a first conductive portion 401; the plurality of electrodes 301 includes at least a first electrode 3011 and a second electrode 3012; as Figure 17 shown, Figure 17 is Figure 16 a schematic structural diagram of the array substrate provided in the manufacturing method of;

[0115] S11: Provide a plurality of light-emitting devices 50, where one side of the light-emitting device 50 includes a second conductive portion 601; the plurality of light-emitting devices 50 includes at least a first light-emitting device 501 and a second light-emitting device 502; as Figure 18 shown, Figure 18 is Figure 16 a schematic structural diagram of the plurality of light-emitting devices provided in the manufacturing method of;

[0116] S12: Perform a first bonding. The first light-emitting device 501 is electrically connected to the first electrode 3011 through the welded first conductive portion 401 and second conductive portion 601; as Figure 19 shown, Figure 19 is Figure 16 a schematic structural diagram after the first bonding is completed in the manufacturing method of;

[0117] S13: Perform a second bonding. The second light-emitting device 502 is electrically connected to the second electrode 3012 through the welded first conductive portion 401 and second conductive portion 601; as Figure 20 shown, Figure 20 is Figure 16 a schematic structural diagram after the second bonding is completed in the manufacturing method of;

[0118] Among them, the materials of the second conductive portion 601 for bonding the first electrode 3011 and the first light-emitting device 501 and the materials of the second conductive portion 601 for bonding the second electrode 3012 and the second light-emitting device 502 are different; and / or,

[0119] the materials of the first conductive portion 401 for bonding the first electrode 3011 and the first light-emitting device 501 and the materials of the first conductive portion 401 for bonding the second electrode 3012 and the second light-emitting device 502 are different;

[0120] The welding temperature during the first bonding is different from the welding temperature during the second bonding.

[0121] The manufacturing method of the display panel provided in this embodiment can manufacture the display panel of any of the above embodiments. Specifically, the manufacturing method of the display panel includes providing an array substrate 00, and the array substrate 00 can be pre-manufactured and completed before the massive transfer of the light-emitting devices 50. The array substrate 00 includes a substrate 10 and a driving array layer 20 and a first conductive layer 30 located on one side of the substrate 10. The structure of the driving array layer 20 can be as Figure 2 shown, and it can include a gate metal layer 20A where the gate of the thin-film transistor 20T is located, a source-drain metal layer 20B where the source and drain of the thin-film transistor 20T are located, a capacitor metal layer 20C where the capacitor electrode plate is located, a semiconductor layer 20P where the active part of the thin-film transistor 20T is located, a second conductive layer 20D for manufacturing driving signal lines such as power signal traces, etc. The second conductive layer 20D can be understood as a certain conductive layer in the driving array layer 20 closest to the first conductive layer 30, and it can also include an inorganic layer or an organic layer between adjacent conductive film layers, etc. The driving array layer 20 can be understood as a film layer for manufacturing a driving circuit structure for driving the light-emitting device 50 to emit light. The Figure 2 in this embodiment is only an example. Specifically in implementation, the film layer structure of the driving array layer 20 includes but is not limited to this. The first conductive layer 30 is located on the side of the driving array layer 20 away from the substrate 10. The first conductive layer 30 includes a plurality of electrodes 301, and the side of the electrode 301 away from the substrate includes a first conductive part 401; optionally, the first conductive part 401 can be fixed to the electrode 301 through an adhesion layer 001 and an isolation layer 002. The plurality of electrodes 301 at least include a first electrode 3011 and a second electrode 3012; the structure of the first conductive part 401 fabricated on one side of the electrode 301 of the array substrate 00 is as Figure 17 shown. It can be understood that the manufacturing process of the array substrate 00 in this embodiment will not be elaborated, and specifically, it can be understood by referring to the manufacturing process of the array substrate of the display panel in the related art.

[0122] Then, a plurality of light-emitting devices 50 are provided. One side of the light-emitting device 50 includes a second conductive part 601; the plurality of light-emitting devices 50 at least include a first light-emitting device 501 and a second light-emitting device 502. Due to different suppliers, the materials of the second conductive part 601 of the first light-emitting device 501 and the second conductive part 601 of the second light-emitting device 502 may be different, as Figure 18 uses different filling patterns to indicate that the materials of the second conductive part 601 of the first light-emitting device 501 and the second conductive part 601 of the second light-emitting device 502 are different. It can be understood that this embodiment takes the packaging form of the light-emitting device 50 as a horizontal light-emitting chip as an example for illustration. At this time, the number of pairs of the first electrodes 3011 corresponding to the first light-emitting device 501 reserved on the array substrate 00 can be one pair, and the number of pairs of the second electrodes 3012 corresponding to the second light-emitting device 502 can be one pair.

[0123] In the structure of manufacturing the display panel 000 in this embodiment, the materials of the second conductive portion 601 for bonding the first electrode 3011 and the first light-emitting device 501 and the materials of the second conductive portion 601 for bonding the second electrode 3012 and the second light-emitting device 502 are different from each other, while the materials of the first conductive portion 401 for bonding the first electrode 3011 and the first light-emitting device 501 and the materials of the first conductive portion 401 for bonding the second electrode 3012 and the second light-emitting device 502 are the same; or, the materials of the first conductive portion 401 for bonding the first electrode 3011 and the first light-emitting device 501 and the materials of the first conductive portion 401 for bonding the second electrode 3012 and the second light-emitting device 502 are different from each other, while the materials of the second conductive portion 601 for bonding the first electrode 3011 and the first light-emitting device 501 and the materials of the second conductive portion 601 for bonding the second electrode 3012 and the second light-emitting device 502 are the same; or, the materials of the second conductive portion 601 for bonding the first electrode 3011 and the first light-emitting device 501 and the materials of the second conductive portion 601 for bonding the second electrode 3012 and the second light-emitting device 502 are different from each other, and the materials of the first conductive portion 401 for bonding the first electrode 3011 and the first light-emitting device 501 and the materials of the first conductive portion 401 for bonding the second electrode 3012 and the second light-emitting device 502 are also different from each other. Therefore, the display panel 000 is a double-bonding bump system. Among them, the double-bonding bump system means that the first conductive portion 401 and the second conductive portion 601 between the first electrode 3011 and the first light-emitting device 501 form a bonding bump system, and the first conductive portion 401 and the second conductive portion 601 between the second electrode 3012 and the second light-emitting device 502 form another bonding bump system. That is, the bonding of the first electrode 3011 and the first light-emitting device 501 and the bonding of the second electrode 3012 and the second light-emitting device 502 need to be fabricated in two processes. During the first bonding, the first light-emitting device 501 is electrically connected to the first electrode 3011 through the welded first conductive portion 401 and second conductive portion 601 (as Figure 19 shown); during the second bonding, the second light-emitting device 502 is electrically connected to the second electrode 3012 through the welded first conductive portion 401 and second conductive portion 601 (as Figure 20 shown); and the welding temperature during the first bonding is different from the welding temperature during the second bonding.

[0124] Optionally, the soldering temperature during the first bonding is higher than that during the second bonding. Assume that the material of the second conductive part 601 between the first light-emitting device 501 and the first electrode 3011 during fabrication includes AuSn alloy, and the material of the second conductive part 601 between the second light-emitting device 502 and the second electrode 3012 includes Sn. The materials of the first conductive parts 401 between the first light-emitting device 501 and the first electrode 3011 and between the second light-emitting device 502 and the second electrode 3012 are the same, both being Sn. At this time, the first conductive part 401 and the second conductive part 601 between the first electrode 3011 and the first light-emitting device 501 form a bonding bump system (AuSn alloy on the side of the first light-emitting device 501 + Sn high-temperature bonding bump system on the side of the first electrode 3011), and the first conductive part 401 and the second conductive part 601 between the second electrode 3012 and the second light-emitting device 502 form another bonding bump system (Sn on the side of the second light-emitting device 502 + Sn low-temperature bonding bump system on the side of the second electrode 3012). The first bonding can first solder the first conductive part 401 and the second conductive part 601 between the first light-emitting device 501 and the first electrode 3011 at a high temperature, and then the second bonding solders the first conductive part 401 and the second conductive part 601 between the second light-emitting device 502 and the second electrode 3012 at a low temperature. That is, the soldering temperature during the first bonding is different from that during the second bonding, and the soldering temperature during the first bonding is higher than that during the second bonding. That is, the high-temperature bonding is fabricated first to avoid the problem that the subsequent second bonding at a high temperature melts the previous bonding structure, which is beneficial to ensuring the process yield.

[0125] It can be understood that in the fabrication method of this embodiment, the first bonding and the second bonding can solder the light-emitting device on the electrode of the array substrate through techniques such as mass transfer process, laser bonding, or other bonding techniques. This embodiment does not elaborate on the mass transfer process and bonding techniques, and specific understanding can be referred to the fabrication methods of micro LED display panels in related technologies.

[0126] In some alternative embodiments, please refer to Figure 21 , Figure 21 is a schematic plan view of the display device provided by the embodiment of the present invention. The display device 111 provided in this embodiment includes the display panel 000 provided by the above embodiment of the present invention. Figure 21The embodiment only takes a mobile phone as an example to illustrate the display device 111. It can be understood that the display device 111 provided by the embodiments of the present invention can be other display devices 111 with display functions such as computers, televisions, in-vehicle display devices, etc. The present invention does not make specific limitations thereto. The display device 111 provided by the embodiments of the present invention has the beneficial effects of the display panel 000 provided by the embodiments of the present invention. For specific descriptions of the display panel 000, reference can be made to the above embodiments, and details are not described herein again.

[0127] It should be noted that in this text, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0128] The above are only specific embodiments of the present disclosure, enabling those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to these embodiments described herein, but rather to the broadest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display panel, characterized in that: include: substrate; A driving array layer, located on one side of the substrate; A first conductive layer, located at a side of the driving array layer away from the substrate, the first conductive layer comprising a plurality of electrodes, and a side of the electrodes away from the substrate comprising a first conductive portion; A plurality of light emitting devices, wherein the light emitting devices include a second conductive portion on a side facing the substrate, the light emitting devices are electrically connected to the electrode through the first conductive portion and the second conductive portion that are welded, and the electrode is electrically connected to the drive array layer; The plurality of electrodes include at least a first electrode and a second electrode, the plurality of light-emitting devices include at least a first light-emitting device and a second light-emitting device, the first electrode is electrically connected to the first light-emitting device, and the second electrode is electrically connected to the second light-emitting device; The material of the second conductive portion between the first electrode and the first light-emitting device is different from the material of the second conductive portion between the second electrode and the second light-emitting device; and / or, A material of the first conductive portion between the first electrode and the first light emitting device and a material of the first conductive portion between the second electrode and the second light emitting device are different.

2. The display panel according to claim 1, characterized in that: When the material of the second conductive portion between the first electrode and the first light-emitting device and the material of the second conductive portion between the second electrode and the second light-emitting device are different, A material of the first conductive portion between the first electrode and the first light emitting device and a material of the first conductive portion between the second electrode and the second light emitting device are the same.

3. The display panel according to claim 2, characterized in that: The material of the first conductive portion includes one of Sn and AgSn alloy.

4. The display panel according to any one of claims 2 or 3, characterized in that: The color of the first light emitting device is different from the color of the second light emitting device; A material of the second conductive portion between the first light emitting device and the first electrode is different from a material of the first conductive portion, and a material of the second conductive portion between the second light emitting device and the second electrode is the same as a material of the first conductive portion.

5. The display panel according to claim 4, characterized in that: A material of the second conductive portion between the first light emitting device and the first electrode includes one of an AuSn alloy or an AuSnAg alloy, and a material of the second conductive portion between the second light emitting device and the second electrode includes one of Sn or an AgSn alloy.

6. The display panel according to claim 4, characterized in that: The color of the first light emitting device includes one of red, green, and blue, and the color of the second light emitting device includes another one of red, green, and blue, or the other two.

7. The display panel according to claim 1, characterized in that: When the material of the second conductive portion between the first electrode and the first light-emitting device and the material of the second conductive portion between the second electrode and the second light-emitting device are different, A material of the first conductive portion between the first electrode and the first light emitting device and a material of the first conductive portion between the second electrode and the second light emitting device are different.

8. The display panel according to claim 7, characterized in that: The material of the second conductive part between the first electrode and the first light emitting device is the same as the material of the first conductive part; A material of the second conductive portion between the second electrode and the second light emitting device is the same as a material of the first conductive portion.

9. The display panel according to claim 8, characterized in that: The color of the first light emitting device is different from the color of the second light emitting device; The material of the first conductive portion between the first light emitting device and the first electrode includes one of AuSn alloy or AuSnAg alloy, and the material of the second conductive portion between the first light emitting device and the first electrode includes one of AuSn alloy or AuSnAg alloy; A material of the first conductive portion between the second light emitting device and the second electrode includes one of Sn or an AgSn alloy, and a material of the second conductive portion between the second light emitting device and the second electrode includes one of Sn or an AgSn alloy.

10. The display panel according to claim 1, characterized in that: An adhesion layer and an isolation layer are further included between the electrode and the first conductive part.

11. The display panel according to claim 1, characterized in that: The color of the first light emitting device is different from the color of the second light emitting device; Along a direction perpendicular to the plane of the substrate, the sum of heights of the first conductive portion and the second conductive portion between the first light-emitting device and the first electrode is H1, and the sum of heights of the first conductive portion and the second conductive portion between the second light-emitting device and the second electrode is H2, and H1<H2.

12. The display panel according to claim 1, characterized in that: The display panel further includes a first planarization layer and a second planarization layer; The first planarization layer is located between the driving array layer and the first conductive layer, and the second planarization layer is located on a side of the first conductive layer away from the substrate; The second planarization layer comprises a plurality of first openings, wherein the first openings penetrate through the second planarization layer; Along a direction perpendicular to a plane where the substrate is located, the first opening exposes at least a portion of the electrode.

13. A method for manufacturing a display panel, characterized in that: include: An array substrate is provided, the array substrate comprising a substrate, a driving array layer located on one side of the substrate, and a first conductive layer, the first conductive layer comprising a plurality of electrodes, a side of the electrode away from the substrate comprising a first conductive portion; the plurality of electrodes at least comprising a first electrode and a second electrode; Providing a plurality of light emitting devices, wherein one side of the light emitting devices comprises a second conductive portion; the plurality of light emitting devices comprises at least a first light emitting device and a second light emitting device; Performing a first bonding, wherein the first light-emitting device is electrically connected to the first electrode through the welded first conductive portion and the second conductive portion; Performing a second bonding, the second light emitting device is electrically connected to the second electrode through the welded first conductive portion and the second conductive portion; wherein the material used to bond the first electrode and the second conductive portion of the first light-emitting device and the material used to bond the second electrode and the second conductive portion of the second light-emitting device are different; and / or, A material used for bonding the first electrode and the first conductive portion of the first light-emitting device, and a material used for bonding the second electrode and the first conductive portion of the second light-emitting device are different; The soldering temperature during the first bonding is different from the soldering temperature during the second bonding.

14. The manufacturing method according to claim 13, characterized in that: The welding temperature during the first bonding is greater than the welding temperature during the second bonding.

15. A display device, characterized in that: A display panel comprising any one of claims 1 to 12.

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