High-luminous-efficiency LED module and preparation method thereof

Abstract

According to the high-luminous-efficiency LED module and the preparation method provided by the invention, the plurality of boss structures are arranged on the luminous surface of the ceramic heat dissipation body base, and the LED chips are placed on the bosses, so that heat generated by the LED chips can be directly conducted to the heat dissipation body base through the colloid, the heat dissipation speed is remarkably improved through the design, rapid heat conduction is realized, and the service life of the LED module is prolonged. Therefore, the heat dissipation performance of the LED module is improved. High-reflection filling materials are filled among the bosses, so that the effect of improving the lighting effect of a product is achieved. In addition, the surface tension effect of the fluorescent glue between the box dam glue is utilized, so that the fluorescent glue does not flow randomly in the curing process, and the purpose of packaging the LED chip is achieved. The whole high-luminous-efficiency LED module is simple in preparation process and low in cost, and the high-luminous-efficiency LED module manufactured through the method is uniform in light emitting and small in glare.

Description

Technical Field

[0001] The present application relates to the field of LED lighting technology, and in particular to a high-light-efficiency LED module and a preparation method thereof. Background Art

[0002] With the growing demand for energy conservation and environmental protection, LED lighting devices have gradually become the mainstream choice in the lighting market due to their advantages such as high efficiency, energy saving and long life. Compared with traditional lighting technology, LED can achieve higher illumination at lower power, significantly reducing energy consumption, which is in line with the development trend of green and low-carbon. However, despite the many advantages of LED technology, it still faces some technical bottlenecks in practical applications, among which the heat dissipation problem is particularly prominent.

[0003] When LED lighting devices are working, part of the electrical energy will be converted into heat energy. If the heat cannot be dissipated in time, the temperature of the LED chip will rise, which will affect its light efficiency, life and reliability. Especially in high-power LED devices, the heat dissipation problem is more significant. Due to the small size of LED chips and the high heat density per unit area, if the heat dissipation design is not appropriate, it is easy to cause heat accumulation, resulting in accelerated light decay, color temperature drift and even device damage. Therefore, heat dissipation performance has become an important factor limiting the development of LED lighting devices towards higher power and smaller size. How to achieve efficient heat dissipation in a limited space while taking into account cost, reliability and miniaturization requirements has become a key issue that needs to be urgently solved in the field of LED lighting technology. Summary of the invention

[0004] In view of the above-mentioned shortcomings of the prior art, the present invention provides a high-light-efficiency LED module and a preparation method, which are used to solve the problem that the LED lighting device in the prior art has poor heat dissipation performance and limits the manufacturing of high-power LED devices within a certain volume.

[0005] To achieve the above objectives and other related objectives, the first aspect of the present application provides a high light efficiency LED module, comprising:

[0006] A heat sink base, the heat sink base comprising a light emitting surface;

[0007] A metal circuit layer, the metal circuit layer is coated on the light-emitting surface of the heat sink base;

[0008] A plurality of raised components, each of which is evenly arranged on the light-emitting surface of the heat sink base;

[0009] A plurality of LED chips, each of the LED chips being fixed on each of the protruding components respectively;

[0010] A high reflective layer is laid on the light-emitting surface and fills the space between the raised parts;

[0011] A fluorescent layer is disposed above the high-reflection layer, and each of the LED chips is encapsulated within the fluorescent layer.

[0012] In some embodiments of the first aspect of the present application, the fluorescent layer includes a dam structure disposed on the outer periphery of the light-emitting surface and a fluorescent glue filled within the dam structure; the dam structure is used to prevent the outflow of the fluorescent glue. The fluorescent layer is used to encapsulate the LED chips. The fluorescent glue is silicone. The dam structure 8 is used to enclose the fluorescent glue to ensure that it does not overflow into other areas, mainly functioning to fix the fluorescent glue.

[0013] In some embodiments of the first aspect of the present application, the dam structure is made of dam glue; the dam structure includes a first dam and a second dam. The dam glue is pasted on both sides of the LED chip to form the first dam and the second dam, and the fluorescent glue is filled between the first dam and the second dam to form the fluorescent layer.

[0014] In some embodiments of the first aspect of the present application, the width between the first dam and the second dam is -mm.

[0015] In some embodiments of the first aspect of the present application, each of the LED chips is fixed on the protruding member by insulating glue or conductive glue.

[0016] In some embodiments of the first aspect of the present application, the heat dissipation body base is a ceramic heat dissipation body base.

[0017] In some embodiments of the first aspect of the present application, a through hole 0 is axially disposed in the middle of the heat dissipation body base.

[0018] In some embodiments of the first aspect of the present application, each of the LED chips is electrically connected by gold wires; the gold wires are then connected to the metal circuit layer.

[0019] To achieve the above and other related objectives, a second aspect of the present application provides a method for manufacturing a high luminous efficiency LED module, including:

[0020] Coat a metal circuit layer on the light-emitting surface of the heat dissipation body base and bake at a high temperature until dry;

[0021] Uniformly coat a high-reflection filling material between the protruding members on the heat dissipation body base to form a high-reflection layer;

[0022] Directly fix the LED chips on the protruding members of the heat dissipation body base;

[0023] Use gold wires to electrically connect the LED chips in a series-parallel manner;

[0024] The series-connected and parallel-connected LED chips are electrically connected through a metal paste to form a loop on the metal wiring layer;

[0025] Dam glue is pasted on both sides of the LED chip to form a dam structure;

[0026] The fluorescent glue is poured into the dam structure to form a fluorescent layer, and the LED chip is completely coated in the fluorescent layer.

[0027] In some embodiments of the second aspect of the present application, the surface of the high-reflection layer is lower than the upper surface of the convex member on the heat sink base.

[0028] As described above, the high-light-efficiency LED module and the preparation method provided by the present application have the following beneficial effects:

[0029] The high-light-efficiency LED module provided by the present application, without changing the size of the ceramic heat sink base, changes the local structure of the ceramic heat sink base, that is, a plurality of convex structures are provided on the light-emitting surface of the ceramic heat sink base, and these convex structures are used to place the LED chips. Placing the LED chips on the convex platforms enables the heat generated by the LED chips to be directly conducted to the heat sink base through the colloid. This design significantly improves the heat dissipation speed, realizes the rapid export of heat, and thus improves the heat dissipation performance of the LED module. The present application fills high-reflection filling materials between the respective convex platforms to achieve the effect of improving the light efficiency of the product. The present application also utilizes the surface tension of the fluorescent glue between the dam glues, so that it does not flow randomly during the curing process, thereby achieving the purpose of encapsulating the LED chips. The preparation process of the entire high-light-efficiency LED module in the present application is simple and the cost is low. The high-light-efficiency LED module manufactured by this method has uniform light output and less glare. Description of the Drawings

[0030] Figure 1 It shows a partial cross-sectional view of a high-light-efficiency LED module in an embodiment of the present application.

[0031] Figure 2 It shows a front top view of the heat sink base of a high-light-efficiency LED module in an embodiment of the present application.

[0032] Figure 3 It shows a front top view of a high-light-efficiency LED module in an embodiment of the present application.

[0033] Description of Component Labels

[0034] 1 Heat sink base

[0035] 2 Light-emitting surface

[0036] 3 Metal wiring layer

[0037] 4 Convex member

[0038] 5 LED chips

[0039] 6 High-reflection layer

[0040] 7 Fluorescent layer

[0041] 8 Dam structure

[0042] 81 First dam

[0043] 82 Second dam

[0044] 9 Gold wire

[0045] 10 Through hole Detailed implementation manners

[0046] The following uses specific specific examples to illustrate the implementation manners of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. The present application can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0047] The following uses specific specific examples to illustrate the implementation manners of the present invention. Those familiar with this technology can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0048] It should be noted that the structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limited conditions under which the present invention can be implemented. Therefore, they do not have technical essential meanings. Any modification of the structure, change of the proportional relationship, or adjustment of the size should still fall within the scope covered by the technical content disclosed in the present invention without affecting the effects that the present invention can produce and the purposes that can be achieved. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is only defined by the claims of the published patent. The terms used here are only for describing specific embodiments and are not intended to limit the present application. Spatially related terms, such as "upper", "lower", "left", "right", "below", "beneath", "lower part", "above", "upper part", etc., may be used in the text to facilitate the description of the relationship between one element or feature shown in the figure and another element or feature.

[0049] In the present invention, unless otherwise clearly specified or limited, terms such as "installed", "connected", "linked", "fixed", "held" and the like shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] Furthermore, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should be further understood that the terms "comprising", "including" indicate the presence of the described features, operations, elements, components, items, kinds, and / or groups, but do not exclude the presence, occurrence or addition of one or more other features, operations, elements, components, items, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or meaning any one or any combination. Thus, "A, B or C" or "A, B and / or C" means "any one of the following: A; B; C; A and B; A and C; B and C; A, B and C". An exception to this definition occurs only when the combination of elements, functions or operations are mutually exclusive in some manner.

[0051] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the technical solutions in the embodiments of the present invention will be further described in detail through the following embodiments in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the invention.

[0052] Before further elaborating on the present invention, the nouns and terms involved in the embodiments of the present invention are described. The nouns and terms involved in the embodiments of the present invention are applicable to the following explanations:

[0053] COB packaging: That is, Chip on Board. The way of adopting COB integrated packaging is to adhere the bare chip on the interconnection substrate with conductive or non-conductive adhesive, and then perform wire bonding to achieve its electrical connection. The LED light source adopting the way of COB integrated packaging has a small light-emitting area and concentrated light emission, so that it can be adapted to a variety of secondary optical structures, including optical designs such as lenses, Fresnel lenses, and reflector cups circulating in the market, and can be widely used in the production of lamps such as spotlights and functional indoor lighting, such as ceiling lights and functional downlights.

[0054] As Figures 1-3 shown, the present application provides a structural schematic diagram of a high luminous efficiency LED module, including:

[0055] A heat sink base 1, wherein the heat sink base 1 comprises a light emitting surface 2;

[0056] A metal circuit layer 3, wherein the metal circuit layer 3 is coated on the light-emitting surface 2 of the heat sink base 1;

[0057] A plurality of raised parts 4, each of the raised parts 4 is evenly arranged on the light-emitting surface 2 of the heat sink base 1;

[0058] A plurality of LED chips 5, each of the LED chips 5 is fixed on each of the protruding parts 4 respectively;

[0059] A high reflective layer 6 is laid on the light-emitting surface 2 and fills the space between the raised parts 4;

[0060] The fluorescent layer 7 is disposed above the high reflective layer 6 , and each of the LED chips 5 is encapsulated in the fluorescent layer 7 .

[0061] It should be noted that the heat dissipation problem of LED lighting devices limits the manufacture of high-power LED devices within a certain volume. Therefore, it is crucial to solve the heat dissipation problem of LED lighting devices. Usually, in order to solve the heat dissipation problem of LED lighting, improvements are mainly made in two aspects: one is to shorten the heat dissipation path, that is, the COB packaging mode; the other is to improve the light output efficiency of the LED in the COB packaging mode, that is, under the same lamp volume and power, the illumination of the lamp is improved to meet the lighting needs.

[0062] In this embodiment, the heat dissipation problem of the LED lighting device is improved by improving the light efficiency in the COB packaging mode. Figure 1 and Figure 2 As shown, in this embodiment, the size of the heat sink base 1 is not changed, and a plurality of raised parts 4 are provided on the light-emitting surface 2 of the heat sink base 1. The raised parts 4 are preferably trapezoidal boss structures, which are used to support the LED chips 5. Each LED chip 5 is fixedly placed on the boss, and the position of the LED chip 5 is lifted by the raised parts 4. The heat generated by the LED chip 5 is directly conducted to the heat sink base 1 through the boss, and then quickly dissipated into the air, which greatly reduces the thermal resistance, improves the heat dissipation speed, and achieves the effect of rapid heat extraction.

[0063] The metal circuit layer 3 is coated on the light-emitting surface 2 to form a conductive circuit, providing electrical connection for the entire high-light-efficiency LED module.

[0064] Further, a highly reflective filling material is evenly coated between the convex platforms to form a highly reflective layer 6. Through the reflection function of the highly reflective filling material in the highly reflective layer 6, the light that is not directly emitted can be reflected, increasing the reflection effect of the light emitted by the LED chip 5, thereby achieving the effect of improving the light extraction efficiency of the LED product.

[0065] The fluorescent layer 7 evenly coats the LED chip 5, which can protect the LED chip 5 from mechanical damage and environmental erosion, and at the same time assist in light diffusion, making the light emission more uniform.

[0066] In one embodiment, as Figure 1 shown, the fluorescent layer 7 includes a dam structure 8 provided on the outer circle of the light-emitting surface 2 and a fluorescent glue filled in the dam structure 8; the dam structure 8 is used to prevent the outflow of the fluorescent glue. The fluorescent glue is silicone glue.

[0067] It should be noted that the fluorescent layer 7 is used to encapsulate the LED chip. Among them, the material of the fluorescent glue is silicone glue, which has good heat resistance and optical properties and is suitable for LED packaging. The dam structure 8 is used to enclose the fluorescent glue to ensure that it will not overflow into other areas, mainly playing a role in fixing the fluorescent glue.

[0068] In one embodiment, as Figure 1 shown, the dam structure 8 is made of dam glue; the dam structure 8 includes a first dam 81 and a second dam 82. Specifically, the dam structure 8 includes a first dam 81 and a second dam 82 formed by pasting dam glue on both sides of the LED chip, and fluorescent glue is filled between the first dam 81 and the second dam 82 to form the fluorescent layer 7.

[0069] In some examples, the thickness of the fluorescent glue is greater than the thickness of the dam glue. The thickness of the fluorescent glue poured in the dam structure is greater than the thickness of the dam glue pasted to form the dam structure.

[0070] In one embodiment, as Figure 1 shown, the width between the first dam 81 and the second dam 82 is 5 - 15 mm. Each LED chip 5 is evenly arranged between the first dam 81 and the second dam 82. Therefore, the width between the first dam 81 and the second dam 82 is set according to the distribution of the LED chips in the LED module.

[0071] By using the design of a specific width between the first dam 81 and the second dam 82, the fluorescent glue does not flow randomly under the action of surface tension between the dam structures, and then the fluorescent glue solidifies to achieve the effect of encapsulating the LED chip.

[0072] In one embodiment, as Figure 1 shown, each of the LED chips 5 is fixed on the convex member 4 by insulating glue or conductive glue.

[0073] In this embodiment, the heat generated by the LED chip 5 is directly conducted to the convex member 4 through insulating glue or conductive glue, and then conducted to the heat dissipation body base 1 through the convex member 4, improving the heat dissipation speed and effect.

[0074] In some examples, the arrangement of each of the LED chips on the light-emitting surface 2 of the heat dissipation body base 1 includes:

[0075] Mode 1: Each of the LED chips is arranged in a circular belt form perpendicular to the axis of the heat dissipation body base 1 on the light-emitting surface 2 of the heat dissipation body base 1.

[0076] Mode 2: A plurality of LED chips are distributed along the axis of the heat dissipation body base 1 to form at least one light band.

[0077] Mode 3: Each of the LED chips is arranged in a longitudinal multi-column form along the axis of the heat dissipation body base 1 on the light-emitting surface 2 of the heat dissipation body base 1.

[0078] It should be understood that different arrangement modes are adopted based on different light-emitting requirements of the high-light-efficiency LED module. Therefore, this is not limited in this embodiment and can be selected according to actual design requirements.

[0079] In one embodiment, the heat dissipation body base 1 is a ceramic heat dissipation body base, and the convex member 4 is also a ceramic boss. The LED chip 5 is directly pasted on the ceramic boss of the ceramic heat dissipation body base through colloid. The heat generated by the LED chip 5 is directly conducted to the ceramic heat dissipation body base through the ceramic boss and then quickly dissipated into the air, greatly reducing the thermal resistance and improving the heat dissipation speed and effect of the high-light-efficiency LED module.

[0080] Compared with traditional metal materials, the ceramic heat dissipation body base and the ceramic boss have significant advantages in heat dissipation performance, insulation performance, durability, etc., and can solve the heat dissipation problem of high-power LED modules. By using ceramic materials, the light efficiency, life and reliability of the LED module are significantly improved. The preparation process of the entire high-light-efficiency LED module is simple, the cost is low, and the energy consumption and maintenance cost are reduced.

[0081] In one embodiment, as Figure 2 and Figure 3 shown, a through hole 10 is axially provided in the middle of the heat dissipation body base 1. The through hole 10 is used to install a power line and can also be used for heat dissipation of the high-light-efficiency LED module.

[0082] In one embodiment, as Figure 3As shown, the LED chips 5 are electrically connected by gold wires 9; the gold wires 9 are then connected to the metal circuit layer 3. It should be noted that the LED chips 5 are electrically connected in series and parallel by gold wires 2, and then the gold wires 9 are electrically connected to the metal circuit layer 3 to form a circuit.

[0083] This application also provides a method for manufacturing a high luminous efficiency LED module, and the manufacturing method includes:

[0084] Coat the metal circuit layer 3 on the light emitting surface 2 of the heat dissipation body base 1 and bake it at high temperature until dry;

[0085] Uniformly coat the high-reflection filling material between the protruding parts 4 on the heat dissipation body base 1 to form a high-reflection layer 6;

[0086] Directly fix the LED chips 5 on the protruding parts 4 of the heat dissipation body base 1;

[0087] Use gold wires 9 to electrically connect the LED chips 5 in series and parallel;

[0088] Electrically connect the series and parallel LED chips 5 to the metal circuit layer 3 through a metal paste to form a circuit;

[0089] Paste dam glue on both sides of the LED chips 5 to form a dam structure 8;

[0090] Pour the fluorescent glue into the dam structure 8 to form a fluorescent layer 7, and completely cover the LED chips in the fluorescent layer 7.

[0091] In one embodiment, as Figure 1 shown, the surface of the high-reflection layer 6 is lower than the upper surface of the protruding parts 4 on the heat dissipation body base 1.

[0092] Specifically, when the high-reflection filling material is uniformly coated between the protruding parts 4 on the heat dissipation body base 1, the coating thickness of the high-reflection material cannot exceed the upper surface of the protruding parts 4 to avoid affecting the fixed placement of the LED chips 5 on the subsequent protruding parts 4.

[0093] It should be emphasized that for the high luminous efficiency LED module provided by this application, without changing the size of the ceramic heat dissipation body base, by changing the local structure of the ceramic heat dissipation body base, that is, setting a plurality of convex platform structures on the light emitting surface of the ceramic heat dissipation body base, these convex platforms are used to place the LED chips. Placing the LED chips on the convex platforms enables the heat generated by the LED chips to be directly conducted to the heat dissipation body base through the colloid. This design significantly improves the heat dissipation speed, realizes the rapid export of heat, and thus improves the heat dissipation performance of the LED module.

[0094] In this application, a highly reflective filling material is filled between each boss to achieve the effect of improving the light efficiency of the product. This application also utilizes the surface tension of the fluorescent glue between the dam glues to prevent it from flowing randomly during the curing process, thereby achieving the purpose of encapsulating the LED chip. The preparation process of the entire high-light-efficiency LED module in this application is simple and low-cost. The high-light-efficiency LED module fabricated by this method has uniform light output and less glare.

[0095] Without changing the size of the base, the high-light-efficiency LED module provided in this application realizes the dual improvement of heat dissipation and light efficiency by changing the local structure. This design not only improves the heat dissipation efficiency of the product but also enhances the light efficiency and light output quality of the product through the application of highly reflective materials and fluorescent glue.

[0096] As described above, it is only the specific implementation manner of this application, but the protection scope of this application is not limited thereto. Any person skilled in the art within the technical scope disclosed in this application can easily think of changes or substitutions, which should all be covered within the protection scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

[0097] In summary, this application provides a high-light-efficiency LED module and a preparation method, including: a heat dissipation body base, the heat dissipation body base includes a light-emitting surface; a metal circuit layer, the metal circuit layer is coated on the light-emitting surface of the heat dissipation body base; a plurality of raised components, each of the raised components is uniformly arranged on the light-emitting surface of the heat dissipation body base; a plurality of LED chips, each of the LED chips is respectively fixed on each of the raised components; a highly reflective layer, laid on the light-emitting surface and filling the space between the raised components; a fluorescent layer, the fluorescent layer is arranged above the highly reflective layer, and each of the LED chips is coated within the fluorescent layer.

[0098] Under the condition of not changing the size of the ceramic heat dissipation body base, this application changes the local structure of the ceramic heat dissipation body base, that is, a plurality of boss structures are arranged on the light-emitting surface of the ceramic heat dissipation body base, and these bosses are used to place the LED chips. Placing the LED chips on the bosses enables the heat generated by the LED chips to be directly conducted to the heat dissipation body base through the colloid. This design significantly improves the heat dissipation speed, realizes the rapid export of heat, and thus improves the heat dissipation performance of the LED module. In this application, a highly reflective filling material is filled between each boss to achieve the effect of improving the light efficiency of the product. This application also utilizes the surface tension of the fluorescent glue between the dam glues to prevent it from flowing randomly during the curing process, thereby achieving the purpose of encapsulating the LED chip. The preparation process of the entire high-light-efficiency LED module in this application is simple and low-cost. The high-light-efficiency LED module fabricated by this method has uniform light output and less glare. Therefore, this application effectively overcomes various shortcomings in the prior art and has high industrial utilization value.

[0099] The above embodiments are only illustrative of the principles and effects of the present application and are not intended to limit the present application. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in the present application should still be covered by the claims of the present application.

Claims

1. A high light efficiency LED module, characterized in that: include: A heat sink base (1), the heat sink base (1) comprising a light-emitting surface (2); A metal circuit layer (3), the metal circuit layer (3) being coated on the light-emitting surface (2) of the heat sink base (1); A plurality of raised components (4), each of the raised components (4) being evenly arranged on the light-emitting surface (2) of the heat sink base (1); A plurality of LED chips (5), each of the LED chips (5) being fixed on each of the protruding components (4) respectively; A high reflection layer (6) is laid on the light-emitting surface (2) and fills the space between the raised parts (4); A fluorescent layer (7), wherein the fluorescent layer (7) is arranged above the high reflective layer (6), and each of the LED chips (5) is coated in the fluorescent layer (7).

2. The high light efficiency LED module according to claim 1, characterized in that: The fluorescent layer (7) comprises a dam structure (8) arranged on the outer circle of the light-emitting surface (2) and fluorescent glue filled in the dam structure (8); the dam structure (8) is used to prevent the fluorescent glue from flowing out.

3. The high light efficiency LED module according to claim 2, characterized in that: The dam structure (8) is made of dam glue; The dam structure (8) comprises a first dam (81) and a second dam (82).

4. The high light efficiency LED module according to claim 3, characterized in that: The width between the first dam (81) and the second dam (82) is 5-15 mm.

5. The high light efficiency LED module according to claim 1, characterized in that: Each LED chip (5) is fixed on the protruding component (4) by means of insulating glue or conductive glue.

6. The high light efficiency LED module according to claim 1, characterized in that: The heat sink base (1) is a ceramic heat sink base.

7. The high light efficiency LED module according to claim 1, characterized in that: A through hole (10) is axially arranged in the middle of the heat sink base (1).

8. The high light efficiency LED module according to claim 1, characterized in that: The LED chips (5) are electrically connected to each other via gold wires (9); the gold wires (9) are then connected to the metal circuit layer (3).

9. A method for preparing a high-light-efficiency LED module, characterized in that: include: Coating a metal circuit layer (3) on the light-emitting surface (2) of the heat sink base (1), and baking at high temperature until dry; Uniformly coating a high-reflection filling material between the protruding parts (4) on the heat sink base (1) to form a high-reflection layer (6); The LED chip (5) is directly fixed on the raised component (4) of the heat sink base (1); The LED chips (5) are electrically connected in series and parallel using gold wires (9); The LED chips (5) connected in series and in parallel are electrically connected on the metal circuit layer (3) through metal paste to form a loop; A dam glue is pasted on both sides of the LED chip (5) to form a dam structure (8); Fluorescent glue is poured into the dam structure (8) to form a fluorescent layer (7), and the LED chip is completely covered in the fluorescent layer (7).

10. The method for preparing a high light-efficiency LED module according to claim 9, characterized in that: The surface of the high reflection layer (6) is lower than the upper surface of the protruding component (4) on the heat sink base (1).

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