Display panel and display device

Abstract

The invention discloses a display panel and a display device.The display panel comprises a display area and a non-display area arranged on the periphery of the display area, the display panel comprises a substrate, a bonding pad and an insulating part, and the substrate is located in the display area and the non-display area; the bonding pad is arranged on one side of the substrate and located in the non-display area, and the bonding pad comprises a first surface deviating from the substrate; the insulating part is arranged on one side of the substrate and located in the non-display area, at least part of the bonding pad is located on the side, away from the cutting edge of the display panel, of the insulating part in the direction parallel to the substrate, the insulating part comprises a second surface away from the substrate, and the first surface and the second surface are sequentially arranged in the direction away from the substrate. According to the display panel provided by the invention, the electrical reject ratio between the display panel and the driving part can be reduced.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a display panel and a display device. Background Art

[0002] Flat panel display devices based on technologies such as Organic Light Emitting Display (OLED) and Light Emitting Diode (LED) are widely used in various consumer electronic products such as mobile phones, TVs, laptop computers, and desktop computers due to advantages such as high image quality, power saving, thin body, and wide application range, and have become the mainstream in display devices.

[0003] However, the process performance of current OLED display products needs to be improved. Summary of the Invention

[0004] The present application provides a display panel and a display device, which can reduce the electrical defect rate between the display panel and the driving component.

[0005] In a first aspect of an embodiment of the present application, a display panel is provided. The display panel includes a display area and a non-display area disposed around the display area. The display panel includes a substrate, a pad, and an insulating member. The substrate is located in the display area and the non-display area; the pad is disposed on one side of the substrate and is located in the non-display area. The pad includes a first surface facing away from the substrate; the insulating member is disposed on one side of the substrate and is located in the non-display area. Wherein, in a direction parallel to the substrate, at least a part of the pad is located on a side of the insulating member away from the cutting edge of the display panel. The insulating member includes a second surface facing away from the substrate, and the first surface and the second surface are sequentially disposed in a direction away from the substrate.

[0006] In a second aspect of an embodiment of the present application, a display device is provided, including the display panel in any one of the above embodiments and a driving component bonded to the pad. Wherein, a part of the driving component is located on a side of the pad away from the substrate, and a part of the driving component is located on a side of the insulating member away from the substrate.

[0007] The beneficial effect is that: in the present application, an insulating member is disposed on one side of the substrate and in a direction parallel to the substrate, and at least a part of the pad is located on a side of the insulating member away from the cutting edge of the display panel. Wherein, the insulating member includes a second surface facing away from the substrate, and the first surface and the second surface are sequentially disposed in a direction away from the substrate. When the first surface of the pad is bonded to the driving component, a part of the driving component covers the second surface of the insulating member. Therefore, the driving component and the cutting edge are isolated by the insulating member, so that there is a gap between the driving component and the cutting edge, and thus the conductive substances near the cutting edge cannot contact the driving component, and further the electrical defect rate between the display panel and the driving component can be reduced. Description of the Drawings

[0008] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings, where:

[0009] Figure 1 is a schematic diagram of the relative positions of the display area and the non-display area of the display panel of the present application;

[0010] Figure 2 is a schematic structural diagram of an embodiment of the positional relationship between the insulating member and the pad of the present application;

[0011] Figure 3 is Figure 2 a schematic structural diagram of an embodiment of the positional relationship between the pad, the insulating member, and the metal pins of the driving member in;

[0012] Figure 4 is a schematic structural diagram of another embodiment of the positional relationship between the insulating member and the pad of the present application;

[0013] Figure 5 is Figure 4 a schematic structural diagram of an embodiment of the positional relationship between the pad, the insulating member, and the metal pins of the driving member in;

[0014] Figure 6 is a schematic structural diagram of an embodiment of the insulating member of the present application;

[0015] Figure 7 is a schematic structural diagram of an embodiment of the display panel of the present application. Detailed Embodiments

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all of them. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0017] It should be noted that the terms "first" and "second" in this application are only for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of this application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or devices.

[0018] Refer to Figure 1 , Figure 1 FIG. is a schematic diagram of the relative positions of the display area and the non-display area of the display panel of this application. The display panel 100 includes a display area AA and a non-display area NA provided on the periphery of the display area AA. Specifically, the display area AA is used to display images, and the non-display area NA does not emit light and is usually provided with structures such as peripheral circuits. The non-display area NA further includes at least one bonding area A1, and the bonding area A1 is used to bond driving components, such as driving chips or flexible circuit boards, etc.

[0019] Combined with Figure 1 and Figure 2 , the display panel 100 includes a substrate 110, a pad 120, and an insulating member 130.

[0020] The substrate 110 is located in the display area AA and the non-display area NA. The substrate 110 plays a supporting role in the display panel 100. The substrate 110 can be flexible, and thus can be stretched, folded, bent, or curled, so that the display panel 100 can be stretchable, foldable, bendable, or curlable. The substrate 110 can be a single-layer structure or a laminated structure. In an application scenario, the substrate 110 can include at least one organic layer and at least one inorganic layer arranged in a stacked manner. The material of the organic layer can be a flexible material such as polyimide, and the material of the inorganic layer can be a material with better water vapor barrier performance such as silicon nitride. At the same time, the substrate 110 can be transparent, semi-transparent, or opaque. Of course, the substrate 110 can also be a rigid substrate, for example, its material is glass. In short, this application does not limit the specific structure of the substrate 110.

[0021] The pad 120 is disposed on one side of the substrate 110 and located in the non-display area NA (specifically, it can be located in the bonding area A1). The pad 120 includes a first surface 121 facing away from the substrate 110. The pad 120 is used to bond with the driving member 200 to achieve electrical connection, signal connection, etc. of the display panel 100. Specifically, the driving member 200 can be a flexible circuit board, a driving chip, etc., which is not limited herein. Among them, the pad 120 can be a metal layer, and the material of the metal layer includes at least one of titanium, aluminum, molybdenum, copper, iron, and gold. In one embodiment, the pad 120 can be a multi-layer structure. In another embodiment, the pad can be a single-layer structure. The specific structure of the pad 120 is not limited herein.

[0022] In the manufacturing process of the display panel 100, usually a display panel mother board with a larger size is first manufactured, and then the display panel mother board is cut into several single display panels by a cutting device. Therefore, the single display panel includes a cutting edge formed after cutting, that is, the cutting edge 101 of the display panel 100 of the present application. Laser cutting technology is often used for cutting the display panel mother board. During the cutting of the display panel mother board by the laser, a large amount of carbonized foreign matter will remain at the cutting position. Since the carbonized foreign matter has electrical conductivity, there is a situation where conductive substances remain at the position near the cutting edge 101. Due to the presence of the conductive substances, there is a situation where the conductive substances short-circuit the adjacent pads on the driving member 200 after the pad 120 is tested and connected or bonded to the driving member 200, resulting in an electrical defect between the display panel 100 and the driving member 200. Therefore, in order to avoid this situation, an insulating member 130 is further provided.

[0023] The insulating member 130 is disposed on one side of the substrate 110 and located in the non-display area NA (specifically, it can be located in the bonding area A1). Among them, in the direction parallel to the substrate 110, at least part of the pad 120 is located on the side of the insulating member 130 away from the cutting edge 101. The insulating member 130 includes a second surface 131 facing away from the substrate, and the first surface 121 and the second surface 131 are sequentially arranged in the direction away from the substrate 110. Among them, at least part of the pad 120 is located on the side of the insulating member 130 away from the cutting edge 101. That is to say, in the plane parallel to the substrate 110, the insulating member 130 can be located between the pad 120 and the cutting edge 101, or the insulating member 130 can also be disposed on the side of part of the pad 120 close to the cutting edge 101. In the direction away from the substrate 110, the first surface 121 of the pad 120 and the second surface 131 of the insulating member 130 are sequentially arranged, that is, compared with the second surface 131, the first surface 121 is closer to the substrate 110. This setting can make it possible that when the pad 120 is bonded to the driving member 200, the driving member 200 partially covers the first surface 121 of the pad 120 and the driving member 200 partially covers the second surface 131 of the insulating member 130. Therefore, the driving member 200 and the cutting edge 101 are isolated by the insulating member 130, so that there is a gap between the driving member 200 and the cutting edge 101, so that the conductive substances near the cutting edge 101 cannot contact the driving member 200, and thus the electrical defect rate between the display panel 100 and the driving member 200 can be reduced.

[0024] Refer to Figure 3 , in one way, the number of pads 120 is multiple, and the multiple pads 120 are arranged at intervals along the first direction X. Among them, in the direction parallel to the substrate 110, at least part of the multiple pads 120 are located on the side of the insulating member 130 away from the cutting edge 101, and the extending direction of the insulating member 130 is parallel to the first direction X. The first direction X is parallel to the cutting edge 101. That is, multiple pads 120 are provided on one side of the substrate 110, and at least part of the multiple pads 120 are located on the side of the insulating member 130 away from the cutting edge 101, so that after the metal pins 210 of the multiple pads 120 are tested and connected or bonded to the driving member 200, the metal pins 210 corresponding to the pads 120 and the cutting edge 101 are both isolated by the insulating member 130, thereby reducing the electrical defect rate between the display panel 100 and the driving member 200.

[0025] It should be noted that in other embodiments, the extending direction of the insulating member 130 can also be different from the first direction X. For example, the extending direction of the insulating member 130 intersects with the first direction X.

[0026] Continue to refer to Figure 2 And Figure 3, in one embodiment, the insulating member 130 is located on the side of the pad 120 away from the substrate 110, and at least a part of the orthographic projection of the pad 120 on the substrate 110 is located outside the orthographic projection of the insulating member 130 on the substrate 110. Specifically, the insulating member 130 can be disposed on a part of the first surface 121 of the pad 120, and the part of the first surface 121 of the pad 120 not covered by the insulating member 130 can be used for bonding with the driving member 200.

[0027] In one embodiment, the number of pads 120 is multiple, and the multiple pads 120 are arranged at intervals along the first direction X. Among them, the insulating member 130 is simultaneously mounted on the multiple pads 120, so that the driving member 200 and the cutting edge 101 are isolated by the insulating member 130.

[0028] Refer to Figure 4 and Figure 5 , and Figure 2 and Figure 3 Different from the embodiment, at this time, the insulating member 130 and the pad 120 are arranged on the substrate 110 in the same layer, and the insulating member 130 is located between the pad 120 and the cutting edge 101. Among them, the thickness of the insulating member 130 is greater than the thickness of the pad 120, so that the insulating member 130 raises the driving member 200, so that there is a gap between the driving member 200 and the cutting edge 101, so that the driving member 200 cannot contact the conductive substance, thereby reducing the electrical defect rate between the display panel 100 and the driving member 200.

[0029] Continue to refer to Figure 4 , in one embodiment, the number of pads 120 is multiple, and the multiple pads 120 are arranged at intervals along the first direction X. The insulating member 130 is simultaneously located between the multiple pads 120 and the cutting edge 101, and the multiple metal pins 210 of the driving member 200 are correspondingly connected to the multiple pads 120. In another embodiment, the number of pads 120 is multiple, and the multiple pads 120 are arranged at intervals along the first direction X. The insulating member 130 extends along the first direction X, and the first direction X is parallel to the cutting edge 101. The side of the insulating member 130 close to the cutting edge 101 covers the cutting edge 101, or the side of the insulating member 130 close to the cutting edge 101 is flush with the cutting edge 101. At the same time, the other side of the insulating member 130 away from the cutting edge 101 is located between the multiple pads 120 and the cutting edge 101.

[0030] In one embodiment, the material of the insulating member 130 can include at least one of inorganic materials and organic materials. Specifically, considering that inorganic materials and organic materials are common film layer materials in the display panel 100, setting the insulating member 130 to select inorganic materials and / or organic materials can enable the insulating member 130 to be prepared simultaneously with the relevant film layers in the display panel 100, thereby improving the preparation efficiency.

[0031] In one embodiment, considering that organic materials are softer than inorganic materials, in order to avoid damage to the driving member 200 caused by the insulating member 130, the material of the insulating member 130 is set to include organic materials.

[0032] Among them, the insulating member 130 can be a flexible insulating member or a rigid insulating member. In one embodiment, the insulating member 130 is a rigid insulating member, and the material of the rigid insulating member includes at least one of glass and plastic. In another embodiment, the insulating member 130 is a flexible insulating member, and the material of the flexible insulating member includes at least one of polyimide and silica gel.

[0033] In one embodiment, the width range of the insulating member 130 is 100 to 300 micrometers. For example, the width range of the insulating member is 100 micrometers, 150 micrometers, 180 micrometers, 200 micrometers, 220 micrometers, 260 micrometers, 270 micrometers, or 300 micrometers, etc. Among them, the width direction of the insulating member 130 refers to the direction perpendicular to the cutting edge 101 and parallel to the substrate 110 at the same time, that is, the direction Y in the drawing. Specifically, by setting the width range of the insulating member 130 to be 100 to 300 micrometers, the conductive substance cannot contact the driving member 200, thereby reducing the electrical defect rate between the display panel 100 and the driving member 200. Among them, in one embodiment, the insulating member 130 may include a plurality of sub-insulating members, and the plurality of sub-insulating members are arranged at intervals along the first direction X and are correspondingly arranged with the plurality of pads 120 to ensure that after each pad 120 is tested and connected to the driving member 200 or bonded, both the driving member 200 and the cutting edge 101 are isolated by the sub-insulating members. In another embodiment, the insulating member 130 is an integral structure, and the extending direction of the insulating member 130 is parallel to the first direction.

[0034] Refer to Figure 6 , the insulating member 130 further includes a first side surface 132 facing away from the cutting edge 101 and a slope surface 133 facing away from the substrate, and the slope surface 133 connects the first side surface 132 and the second surface 131. The slope surface 133 can be used as the position in contact with the driving member 200, which can avoid damage to the driving member 200 caused by the contact between the edge of the insulating member 130 and the driving member 200, and further reduce the electrical defect rate between the display panel 100 and the driving member 200; at the same time, the slope surface 133 can also be used as a support surface for the driving member 200, which can increase the contact area between the driving member 200 and the insulating member 130 and enhance the connection stability between the driving member 200 and the display panel 100. In one embodiment, the slope surface 133 is a curved surface, and the curved slope surface can reduce the edges of the slope surface, further reducing the defect rate of the electrical connection between the display panel 100 and the driving member 200. Of course, in other embodiments, the slope surface 133 can also be an inclined plane.

[0035] See also Figure 7 The display panel 100 further includes an array layer 140 and a light emitting layer 150 .

[0036] The array layer 140 is arranged on one side of the substrate 110 and is located in the display area AA. The array layer 140 includes a pixel driving circuit 141, and the pixel driving circuit 141 includes a transistor 1411 and a storage capacitor 1412. The transistor 1411 includes a semiconductor portion, a gate, a source and a drain. The capacitor 1412 includes a first electrode and a second electrode. Among them, the gate and the first electrode can be located in the first metal layer 1401, the second electrode can be located in the second metal layer 1402, and the source and the drain can be located in the third metal layer 1403. An interlayer insulating layer is provided between the first metal layer 1401 and the second metal layer 1402, and between the second metal layer 1402 and the third metal layer 1403. Meanwhile, the array layer 140 may also include a fourth metal layer 1404, the fourth metal layer 1404 is provided with a signal line, the signal line electrically connects the pixel driving circuit 141 and the light emitting element 151 in the light emitting layer 150, and a first planarization layer 1405 is provided between the fourth metal layer 1404 and the third metal layer 1403, and a second planarization layer 1406 is also provided on the side of the fourth metal layer 1404 away from the substrate 110, and the first planarization layer 1405 and the second planarization layer 1406 are used for planarization to ensure the flatness of the display panel 100. Among them, the materials of the above-mentioned interlayer insulating layer, the first planarization layer 1405 and the second planarization layer 1406 are all insulating materials, that is, the above-mentioned interlayer insulating layer and the first planarization layer 1405 and the second planarization layer 1406 are all insulating layers, and for the convenience of description, the insulating layer in the array layer 140 is defined as the first insulating layer.

[0037] The pixel driving circuit 141 may be, for example, a 2T1C circuit, a 7T1C circuit, a 7T2C circuit, or a 9T1C circuit, and the present application does not limit its specific structure. The "2T1C circuit" refers to a pixel circuit including two thin film transistors (T) and one capacitor (C) in the pixel circuit, and the other "7T1C circuit", "7T2C circuit", "9T1C circuit", etc. are analogous.

[0038] The light-emitting layer 150 includes a light-emitting element 151. The number of the light-emitting element 151 can be one or more. When the number of the light-emitting element 151 is more than one, some of the light-emitting elements 151 emit red light, some emit green light, and some emit blue light. It should be noted that the color of the light emitted by the light-emitting element 151 is not limited to red, green, and blue, but can also be yellow or other colors, which are not limited here.

[0039] Meanwhile, the simultaneous light-emitting element 151 includes a first electrode, a light-emitting material layer, and a second electrode that are sequentially stacked in a direction away from the substrate 110.

[0040] The simultaneous light-emitting layer 150 further includes a pixel definition layer 152 disposed on a side of the array layer 140 away from the substrate 110. The pixel definition layer 152 is provided with a pixel opening, and the light-emitting element 151 is disposed in the pixel opening. Among them, the material of the pixel definition layer 152 is an insulating material, that is, the pixel definition layer 152 is also an insulating layer. For the sake of convenience of description, the insulating layer in the light-emitting layer 150 is defined as the second insulating layer.

[0041] Among them, in order to ensure the preparation efficiency, the insulating member 130 can be prepared simultaneously with the first insulating layer in the array layer 140 (such as the above-mentioned first planarization layer 1405 and second planarization layer 1406), or can be prepared simultaneously with the second insulating layer in the light-emitting layer 150 (such as the above-mentioned pixel definition layer 151). It can be understood that when the insulating member 130 is prepared simultaneously with the first insulating layer in the array layer 140, the insulating member 130 and the first insulating layer are disposed on the same layer and have the same material. When the insulating member 130 is prepared simultaneously with the second insulating layer in the light-emitting layer 150, the insulating member 130 and the second insulating layer are disposed on the same layer and have the same material.

[0042] Among them, when the pad 120 is a single-layer structure, the pad 120 can be prepared simultaneously with the metal layer in the array layer 140. The metal layer here can specifically be the above-mentioned first metal layer 1401, second metal layer 1402, third metal layer 1403, or fourth metal layer 1404, which is not limited herein.

[0043] In addition, it should be noted that the display panel 100 of the present application can be an OLED display panel (Organic Light Emitting Diode Display Panel), and the display panel 100 can also be other types of display panels such as an LCD display panel (Liquid Crystal Display Panel) or a Micro-LED display panel (Micro Light Emitting Diode Display Panel). The present application does not limit the specific type of the display panel 100.

[0044] In addition, the present application further includes a display device, which includes the display panel 100 in any of the above embodiments and the driving member 200 bonded to the pads 120. For the specific structure, reference may be made to the above relevant content. In one embodiment, the driving member 200 is a flexible circuit board, and the flexible circuit board includes metal pins 210. The metal pins 210 and the pads 120 of the display panel 100 can be electrically connected through a crimping process, or can be electrically connected through an anisotropic conductive film (ACF) adhesive connection. Among them, the display device can be any device with a display function such as a mobile phone, a computer, a game console, a smart watch, etc., and no limitation is made here.

[0045] The above are only the embodiments of the present application, and thus do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel includes a display area and a non-display area arranged outside the display area, and the display panel includes: A substrate, located in the display area and the non-display area; A pad, disposed on one side of the substrate and located in the non-display area, the pad comprising a first surface facing away from the substrate; An insulating member is arranged on one side of the substrate and located in the non-display area, wherein, in a direction parallel to the substrate, at least a portion of the pad is located on a side of the insulating member away from a cutting edge of the display panel, the insulating member includes a second surface away from the substrate, and the first surface and the second surface are arranged sequentially in a direction away from the substrate.

2. The display panel according to claim 1, characterized in that: There are a plurality of pads, and the pads are arranged at intervals along a first direction, wherein at least a portion of the pads are located on a side of the insulating member away from the cutting edge in a direction parallel to the substrate; Preferably, an extending direction of the insulating member is parallel to the first direction.

3. The display panel according to claim 1, characterized in that: The insulating member is located on a side of the pad facing away from the substrate, and at least a portion of an orthographic projection of the pad on the substrate is located outside the orthographic projection of the insulating member on the substrate; Preferably, there are a plurality of the pads, and the plurality of pads are spaced apart along the first direction, wherein the insulating member is simultaneously mounted on the plurality of pads.

4. The display panel according to claim 1, characterized in that: The insulating member is disposed on the substrate in the same layer as the pad, and the insulating member is located between the pad and the cutting edge, wherein the thickness of the insulating member is greater than the thickness of the pad; Preferably, there are a plurality of pads, and the plurality of pads are arranged at intervals along the first direction, and the insulating member is simultaneously located between the plurality of pads and the cutting edge; Preferably, an extending direction of the insulating member is parallel to the first direction.

5. The display panel according to claim 1, characterized in that: The material of the insulating member includes at least one of an inorganic material and an organic material; Preferably, the material of the insulating member includes organic material.

6. The display panel according to claim 1, characterized in that: The width of the insulating member is in the range of 100 micrometers to 300 micrometers, wherein the width direction of the insulating member is perpendicular to the cutting edge and parallel to the substrate.

7. The display panel according to claim 1, characterized in that: The display panel further includes: An array layer, disposed on one side of the substrate and located in the display area, the array layer comprising a first insulating layer; A light-emitting layer, arranged on a side of the array layer away from the substrate and located in the display area, the light-emitting layer comprising a second insulating layer; Wherein, the insulating member is disposed in the same layer as the first insulating layer and is made of the same material, or the insulating member is disposed in the same layer as the second insulating layer and is made of the same material; Preferably, the first insulating layer is a planarization layer; Preferably, the second insulating layer is a pixel definition layer; Preferably, the array layer further comprises a metal layer, and the pad is arranged in the same layer as the metal layer and is made of the same material.

8. The display panel according to claim 1, characterized in that: The insulating member comprises a first side surface facing away from the cutting edge and a slope surface facing away from the substrate, wherein the slope surface connects the first side surface and the second surface; Preferably, the slope surface is a curved surface.

9. The display panel according to claim 1, characterized in that: The insulating member is a flexible insulating member or a rigid insulating member; Preferably, the material of the rigid insulating member includes at least one of glass and plastic; Preferably, the material of the flexible insulating member includes polyimide.

10. A display device, characterized in that: The display panel comprises the display panel as claimed in any one of claims 1 to 9 and a driving member bonded to the pad; wherein the driving member is partially located on a side of the pad away from the substrate and partially located on a side of the insulating member away from the substrate; Preferably, the driving member is a flexible circuit board.

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