Display panel, manufacturing method thereof and display device

By designing multiple sets of metal traces in the border area of ​​the OLED display panel and setting up an insulation layer, the problem of short circuit between metal traces is solved, and the compatibility of display quality and narrow frame design is improved.

CN120076620APending Publication Date: 2025-05-30BOE TECHNOLOGY GROUP CO LTD +1
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Patent Information

Application Number
CN202311628616.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-11-30
Publication Date
2025-05-30

AI Technical Summary

Technical Problem

In the narrowed border design of OLED display panels, the short circuit problem between metal traces is difficult to effectively solve, especially in the presence of organic layer segment difference areas, which can easily lead to metal layer residues and line short circuits.

Method used

By designing multiple sets of metal traces in the border area of ​​the display panel, and setting a first insulating layer and a second insulating layer, it is ensured that the metal trace spacing between the first and second regions is d1, and 10d2≥d1≥1.5d2, thereby avoiding short circuits between the metal traces.

Benefits of technology

It effectively avoids the short circuit problem between metal traces in the border area, improves the display quality of the display panel, and meets the requirements of narrow border design.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a display panel, a manufacturing method thereof and a display device. The display panel comprises a display area and a frame area located on at least one side of the display area. The first insulating layer is arranged on one side of the substrate and extends from the display area to the frame area; the metal wires are sequentially arranged in the direction, close to the frame area, of the display area, the metal wires comprise a first area and a second area, the orthographic projection, on the first insulating layer, of the metal wires in the first area and the first insulating layer have an overlapping area, and the first insulating layer is not arranged under the metal wires in the second area; the distance between the metal wire closest to the second area in the first area and the metal wire closest to the first area in the second area is d1, the distance between the adjacent metal wires in the first area is d2, and 10d2 > = d1 > = 1.5 d2. According to the display panel, short circuit between two adjacent metal wires in the first area and the second area can be effectively prevented, so that the display quality of the display panel can be effectively improved.
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Description

Technical Field

[0001] The present invention relates to the field of display technology, and specifically, to a display panel, a manufacturing method thereof, and a display device. Background Art

[0002] With the development of OLED, bezel narrowing has become increasingly popular. There is a step difference in a region under the touch trace under the narrowed bezel. For example, there is a region where the organic layer (IJP) does not fill up. The existence of this organic layer step difference region easily causes residue when patterning the metal layer at the corresponding position, and further causes a short circuit in the circuit. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems in the related art to some extent. For this reason, an object of the present invention is to provide a display panel, in which the short - circuit problem between the metal traces in the bezel area can be effectively avoided.

[0004] In one aspect of the present invention, a display panel is provided. According to an embodiment of the present invention, the display panel includes a display area and a bezel area located on at least one side of the display area. The bezel area includes: a substrate; a first insulating layer, the first insulating layer is disposed on one side of the substrate and extends from the display area to the bezel area; multiple groups of metal traces, each group of the metal traces includes at least one metal layer, and the multiple groups of metal traces are arranged in sequence in the direction from the display area to the bezel area. The metal traces include a first area and a second area. The first area is located between the display area and the second area. The orthographic projection of the metal traces in the first area on the first insulating layer has an overlapping area with the first insulating layer. The first insulating layer is not provided directly below the metal traces in the second area. The distance between the metal trace closest to the second area in the first area and the metal trace closest to the first area in the second area is d1, and the distance between adjacent metal traces in the first area is d2, where 10d2≥d1≥1.5d2. Thus, by increasing the distance between two adjacent metal traces in the first area and the second area, even if there is a certain amount of metal residue in the gap between them, they can still remain in a non - contact state, that is, the short - circuit between two adjacent metal traces in the first area and the second area can be effectively prevented, and further the display quality of the display panel can be effectively improved.

[0005] According to an embodiment of the present invention, 20 μm≥d1≥4.1 μm.

[0006] According to an embodiment of the present invention, 20 μm≥d1≥7 μm.

[0007] According to an embodiment of the present invention, the display panel further includes: a second insulating layer disposed on a side of the first insulating layer away from the substrate. The metal trace includes a first metal layer and a second metal layer. The second metal layer is disposed on a side of the second insulating layer away from the substrate, and the first metal layer is disposed on a side of the second insulating layer close to the substrate. The first metal layer in the first region is located between the first insulating layer and the second insulating layer, and a positive projection of the second metal layer on the substrate overlaps a positive projection of the first metal layer on the substrate.

[0008] According to an embodiment of the present invention, positive projections of all the metal traces on the first insulating layer are all located within the first insulating layer.

[0009] According to an embodiment of the present invention, the positive projection of the second metal layer on the substrate substantially overlaps the positive projection of the first metal layer on the substrate.

[0010] According to an embodiment of the present invention, at least for the metal trace closest to the second region in the first region and the metal trace closest to the first region in the second region, the positive projection of the second metal layer on the substrate is located within the positive projection of the first metal layer on the substrate and does not overlap.

[0011] According to an embodiment of the present invention, a distance between an edge line of the positive projection of the second metal layer on the substrate and an edge line of the positive projection of the first metal layer on the substrate is greater than or equal to 1.2 micrometers.

[0012] According to an embodiment of the present invention, a distance d4 between the second metal layer in the metal trace closest to the second region in the first region and the second metal layer in the metal trace closest to the first region in the second region is greater than a distance d1 between the metal trace closest to the second region in the first region and the metal trace closest to the first region in the second region.

[0013] According to an embodiment of the present invention, the first metal trace satisfies at least one of the following conditions: only for the metal trace closest to the second region in the first region and the metal trace closest to the first region in the second region, the orthographic projection of the second metal layer on the substrate is located within the orthographic projection of the first metal layer on the substrate and does not overlap; for all the metal traces, the orthographic projection of the second metal layer on the substrate is located within the orthographic projection of the first metal layer on the substrate and does not overlap, and the widths of all the first metal layers are the same; for all the metal traces, the orthographic projection of the second metal layer on the substrate is located within the orthographic projection of the first metal layer on the substrate and does not overlap, and for the second metal layer in the metal traces in the first region, the width gradually decreases in the direction from the display region to the second region, and for the second metal layer in the metal traces in the second region, the width gradually increases in the direction from the first region to the edge of the display panel.

[0014] According to an embodiment of the present invention, at least for the metal trace closest to the second region in the first region and the metal trace closest to the first region in the second region, wherein the edge line of the orthographic projection of the second metal layer on the substrate close to the display region is located inside the orthographic projection of the first metal layer on the substrate, and the edge line of the orthographic projection of the first metal layer on the substrate far from the display region is located inside the orthographic projection of the second metal layer on the substrate.

[0015] According to an embodiment of the present invention, the orthographic projection of the second metal layer in the metal trace closest to the second region in the first region on the substrate and the orthographic projection of the first metal layer in the metal trace closest to the first region in the second region on the substrate do not overlap.

[0016] According to an embodiment of the present invention, the display panel further includes: a second insulating layer, the second insulating layer is disposed on a side of the first insulating layer away from the substrate, the metal trace includes a first metal layer and a second metal layer, and the first metal layer and the second metal layer are disposed in the same layer and are located on a side of the second insulating layer close to the first insulating layer.

[0017] According to an embodiment of the present invention, the metal trace farthest from the display region is not electrically connected to any of the other metal traces.

[0018] In another aspect of the present invention, the present invention provides a method for manufacturing the aforementioned display panel. The display panel includes a display area and a border area located on at least one side of the display area. The method for manufacturing the display panel includes a step of manufacturing the border area, including: providing a substrate; forming a first insulating layer on one side of the substrate and extending from the display area to the border area; forming multiple groups of metal traces. Each group of the metal traces includes at least one metal layer. The multiple groups of metal traces are arranged in sequence in the direction from the display area to the border area. The metal traces include a first area and a second area. The first area is located between the display area and the second area. The orthographic projection of the metal traces in the first area on the first insulating layer has an overlapping area with the first insulating layer. The first insulating layer is not provided directly below the metal traces in the second area. The distance between the metal trace closest to the second area in the first area and the metal trace closest to the first area in the second area is d1, and the distance between adjacent metal traces in the first area is d2, where 10d2≥d1≥1.5d2. Thus, in the above manufacturing process, by increasing the distance between two adjacent metal traces in the first area and the second area, even if there is a certain amount of metal residue in the gap between them, they can still maintain a non-contact state, that is, it can effectively prevent short circuits between two adjacent metal traces in the first area and the second area.

[0019] According to an embodiment of the present invention, the method for manufacturing the display panel further includes: forming a second insulating layer on the side of the first insulating layer away from the substrate. The metal traces include a first metal layer and a second metal layer. Among them, the second metal layer is formed on the side of the second insulating layer away from the substrate, and the first metal layer is formed on the side of the second insulating layer close to the substrate. And the first metal layer in the first area is located between the first insulating layer and the second insulating layer. The orthographic projection of the second metal layer on the substrate overlaps with the orthographic projection of the first metal layer on the substrate, or the first metal layer and the second metal layer are provided on the same layer and are located on the side of the second insulating layer close to the first insulating layer.

[0020] In yet another aspect of the present invention, the present invention provides a display device. According to an embodiment of the present invention, the display device includes the aforementioned display panel. Thus, the reliability of the display device is relatively high and the display quality is relatively good. Those skilled in the art can understand that the display device has all the features and advantages of the aforementioned display panel, and will not be elaborated here too much. Description of the Drawings

[0021] The above and / or additional aspects and advantages of the present invention will become apparent and easy to understand from the description of the embodiments in conjunction with the following drawings, where:

[0022] Figure 1 is a schematic structural diagram of a display panel in an embodiment of the present invention;

[0023] Figure 2 is Figure 1 a schematic plan view between the metal trace and the first insulating layer in

[0024] Figure 3 is a schematic structural diagram of a display panel in the prior art;

[0025] Figure 4 is Figure 3 a scanning electron microscope image of a partial structure in

[0026] Figure 5 is a schematic structural diagram of a display panel in another embodiment of the present invention;

[0027] Figure 6 is Figure 5 a schematic plan view between the metal trace and the first insulating layer in

[0028] Figure 7 is a schematic structural diagram of a display panel in yet another embodiment of the present invention;

[0029] Figure 8 is a schematic structural diagram of a display panel in yet another embodiment of the present invention;

[0030] Figure 9 is a schematic structural diagram of a display panel in yet another embodiment of the present invention;

[0031] Figure 10 is a schematic structural diagram of a display panel in yet another embodiment of the present invention;

[0032] Figure 11 is a schematic structural diagram of a display panel in yet another embodiment of the present invention;

[0033] Figure 12 is a schematic structural diagram of a display panel in yet another embodiment of the present invention;

[0034] Figure 13 is a schematic structural flow diagram of manufacturing a display panel in yet another embodiment of the present invention. Detailed implementation manners

[0035] The solution of the present invention will be explained below in conjunction with embodiments. Those skilled in the art will understand that the following embodiments are only used to illustrate the present invention and should not be regarded as limiting the scope of the present invention. For those embodiments where specific techniques or conditions are not indicated, the techniques or conditions described in the literature in this field or according to the product description are followed. Those reagents or instruments for which the manufacturer is not indicated are all conventional products that can be obtained through commercial procurement.

[0036] The present invention will be described below with reference to specific embodiments. It should be noted that these embodiments are merely descriptive and do not limit the present invention in any way.

[0037] In one aspect of the present invention, the present invention provides a display panel. According to an embodiment of the present invention, with reference to Figure 1 and Figure 2, the display panel includes a display area and a border area located on at least one side of the display area. The border area includes: a substrate 100; a first insulating layer 210, which is disposed on one side of the substrate 100 and extends from the display area to the border area; multiple groups of metal traces 300, each group of metal traces 300 includes at least one metal layer (for example, including a first metal layer 310 and a second metal layer 320), the multiple groups of metal traces 300 are arranged in sequence in the direction from the display area to the border area. The metal traces 300 include a first area S1 and a second area S2. The first area S1 is located between the display area and the second area S2. The orthographic projection of the metal traces 300 in the first area S1 on the first insulating layer 210 has an overlapping area with the first insulating layer 210. The first insulating layer 210 is not provided directly below the metal traces 300 in the second area S2 (that is, the metal traces 300 in the second area S2 have no orthographic projection on the first insulating layer 210, or in other words, the orthographic projection of the metal traces 300 in the second area S2 on the substrate has no overlap with the orthographic projection of the first insulating layer on the substrate). The distance between the metal trace 300 in the first area S1 closest to the second area S2 and the metal trace 300 in the second area S2 closest to the first area S1 is d1, and the distance between the metal traces in the first area S1 is d2, where 10d2≥d1≥1.5d2, such as d1 = 1.5d2, d1 = 2d2, d1 = 3d2, d1 = 4d2, d1 = 5d2, d1 = 6d2, d1 = 7d2, d1 = 8d2, d1 = 9d2, d1 = 10d2, etc. Thus, by increasing the distance between two adjacent metal traces in the first area and the second area (that is, the metal trace 300 in the first area S1 closest to the second area S2 and the metal trace 300 in the second area S2 closest to the first area S1), even if there is a certain amount of metal residue in the gap between them, they can still maintain a non-contact state, that is, it can effectively prevent a short circuit between two adjacent metal traces in the first area and the second area, and thus can effectively improve the display quality of the display panel; moreover, the design requirement of 10d2≥d1≥1.5d2 can not only effectively prevent a short circuit between two adjacent metal traces in the first area and the second area, but also will not have a great impact on the width of the border area, that is, it can still achieve the narrow border design of the display panel; in addition, since there is usually no residue of metal chips between adjacent metal traces in the first area and between adjacent metal traces in the second area, there is no need to increase the distance between adjacent metal traces in the first area and between adjacent metal traces in the second area, that is, a relatively small distance can still be maintained, which helps to achieve the narrow border design of the display panel.

[0038] It should be noted that in the above definitions of the first region and the second region in the present invention, the first region includes the gaps between the metal traces in the first region, and the gap between the metal trace 300 closest to the second region S2 in the first region S1 and the metal trace 300 closest to the first region S1 in the second region S2 (i.e., the gap corresponding to the pitch d1); the second region includes the gaps between the metal traces in the second region.

[0039] Currently, in all the metal traces of a general display panel, the pitch between two adjacent metal traces is basically the same, that is, d1 = d2, which is about 2.5 micrometers. Referring to Figure 3 and Figure 4 , for two adjacent metal traces in the first region and the second region, since the metal trace in the first region is at the end of the first insulating layer, the step difference generated by the first insulating layer causes the metal traces, especially the second metal layer located in the upper layer when the first metal layer and the second metal layer are arranged in a layered manner (step differences are generated in both the two-layer structure of the first metal layer and the first insulating layer). Due to process reasons and other factors, it is very easy for metal debris to remain in the gap between the two metal traces in the second metal layer during the manufacturing process (such as the dashed box in Figure 3 and the elliptical box in Figure 4 ), resulting in their connection and further causing a short circuit. However, there is usually no or very little metal debris remaining between the first metal layers located in the lower layer, and no short circuit problem will be caused. In short, the above short circuit problem caused by the remaining metal debris is usually generated by the second metal layer at the step difference of the first insulating layer in the first region. The technical solution of the present invention can effectively solve the above technical problems and prevent the occurrence of short circuits.

[0040] According to some embodiments of the present invention, there are no special requirements for the specific structure of the above substrate, and those skilled in the art can flexibly select according to the actual situation such as the specific product type of the display panel. In some embodiments, the substrate includes a substrate; a buffer layer provided on one side of the substrate; a thin film transistor provided on the side of the buffer layer away from the substrate. Among them, the thin film transistor includes a source electrode, a gate electrode, a source electrode and a drain electrode, and the specific structure of the thin film transistor can be a top-gate structure or a bottom-gate structure; various signal lines such as data signal lines, gate lines, power supply lines, and ground lines, and the data signal lines, gate lines, power supply lines, and ground lines can be arranged on the same layer as structures such as the source electrode or the gate electrode.

[0041] According to some embodiments of the present invention, referring to Figure 1As shown above, the positive projection of the metal trace 300 in the first region S1 on the first insulating layer 210 has an overlapping region with the first insulating layer 210. Specifically, it means that: the first part 01 of the metal trace 300 in the first region S1 closest to the second region S2 is located in the first insulating layer 210 in the positive projection on the first insulating layer, and the second part 02 (the part close to the second region S2) of the metal trace 300 has no overlapping region with the first insulating layer 210 in the positive projection on the first insulating layer. Among them, there is no special requirement for the proportion of the second part, and those skilled in the art can flexibly design according to actual needs; except for the metal trace 300 in the first region S1 closest to the second region S2, the positive projections of the other metal traces 300 in the first region on the first insulating layer 210 are all located within the first insulating layer 210.

[0042] According to some embodiments of the present invention, 20 μm ≥ d1 ≥ 4.1 μm. For example, d1 is 4.1 μm, 4.2 μm, 4.5 μm, 4.8 μm, 5.0 μm, 5.2 μm, 5.5 μm, 5.8 μm, 6 μm, 6.3 μm, 6.5 μm, 6.8 μm, 7 μm, 7.2 μm, 7.5 μm, 7.7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, 20 μm, etc. The above spacing can well prevent the remaining metal chips from electrically connecting the metal trace 300 in the first region S1 closest to the second region S2 and the metal trace 300 in the second region S2 closest to the first region S1, thereby avoiding short circuits between the two. Moreover, the design of the above spacing can still meet the design requirements of the narrow border of the border region of the display panel. Further, in some specific embodiments, 20 μm ≥ d1 ≥ 7 μm. In this way, the effect of avoiding short circuits is better and the product yield is higher.

[0043] According to some embodiments of the present invention, referring to Figure 1 As shown, the display panel further includes: a second insulating layer 220, the second insulating layer 220 is disposed on a side of the first insulating layer 210 away from the substrate 100. The metal trace 300 includes a first metal layer 310 and a second metal layer 320. The second metal layer 320 is disposed on a side of the second insulating layer 220 away from the substrate 100, and the first metal layer 310 is disposed on a side of the second insulating layer 220 close to the substrate 100. And the first metal layer 310 in the first region S1 is located between the first insulating layer 210 and the second insulating layer 220, and the positive projection of the second metal layer 320 on the substrate 100 overlaps with the positive projection of the first metal layer 310 on the substrate 100. That is, the first metal layer and the second metal layer are arranged in layers. In this way, it can not only effectively ensure the good working performance of the metal trace, but also effectively ensure the avoidance of short circuits between the two second metal layers in two adjacent metal traces in the first region and the second region.

[0044] There are no special requirements for the specific materials of the first insulating layer and the second insulating layer. Those skilled in the art can flexibly select applicable materials in the prior art according to the actual situation. In some embodiments, the first insulating layer may be a flat layer extending from the display area, and its forming material is an organic material (such as acrylic insulating organic material, etc.), or may be an inorganic material, such as silicon nitride, silicon oxide, silicon oxynitride and other materials. The material of the second insulating layer may be an organic material (such as acrylic insulating organic material, etc.), or may be an inorganic material, such as silicon nitride, silicon oxide, silicon oxynitride and other materials.

[0045] According to some embodiments of the present invention, referring to Figure 5 and Figure 6 , the orthographic projection of all the metal traces 300 on the first insulating layer 210 is located within the first insulating layer 210. That is, all the metal traces are arranged in the first area, and the number of metal traces in the second area is 0. In this way, the first insulating layer is further extended in a direction away from the display area, thereby eliminating the step difference caused by the first insulating layer in the first area. Without the existence of the step difference, it is possible to avoid the residue of metal chips caused by the step difference (that is, no or less metal chip residue is generated), thereby further improving the problem of short circuit of the second metal layer and further improving the product yield.

[0046] According to some embodiments of the present invention, referring to Figure 1 and 5 , the orthographic projection of the second metal layer 320 on the substrate 100 substantially overlaps with the orthographic projection of the first metal layer 310 on the substrate 100. That is, the sizes of the first metal layer and the second metal layer are basically the same. In this way, the same mask plate can be used when manufacturing the first metal layer and the second metal layer, thereby accelerating the manufacturing rate and reducing the manufacturing cost. At this time, the distance d2 between the metal trace 300 closest to the second area S2 in the first area S1 and the metal trace 300 closest to the first area S1 in the second area S2 is the distance between the first metal layer in the metal trace 300 closest to the second area S2 in the first area S1 and the first metal layer in the metal trace 300 closest to the first area S1 in the second area S2.

[0047] According to some embodiments of the present invention, referring to Figure 7 , Figure 8 and Figure 9, at least for the metal trace 300 closest to the second region S2 in the first region S1 and the metal trace 300 closest to the first region S1 in the second region S2, the orthographic projection of the second metal layer 320 on the substrate 100 is located within the orthographic projection of the first metal layer 310 on the substrate and does not overlap, that is, the second metal layer is retracted relative to the first metal layer to reduce its size. Thus, the distance d4 between the second metal layer 320 in the metal trace 300 closest to the second region S2 in the first region S1 and the second metal layer 320 in the metal trace 300 closest to the first region S1 in the second region S2 can be further increased, thereby further avoiding the short-circuit problem caused by metal debris residue, improving the product yield, and relative to Figure 1 In the structure, it does not affect the frame width, that is, it still helps to meet the design requirements of the narrow frame for the display panel. In Figure 7 , only the second metal layer 320 in the metal trace 300 closest to the second region S2 in the first region S1 and the second metal layer 320 in the metal trace 300 closest to the first region S1 in the second region S2 are retracted. In Figure 8 , the second metal layer in all metal traces is retracted, and the sizes of the second metal layers are the same, so that the manufacturing process difficulty can be reduced.

[0048] Optionally, in some embodiments of the present invention, referring to Figure 7 , Figure 8 and Figure 9 , the distance (i.e., the size of the unilateral retraction of the second metal layer in the first region) d3 between the edge line of the orthographic projection of the second metal layer 320 on the substrate and the edge line of the orthographic projection of the first metal layer 310 on the substrate is greater than or equal to 1.2 microns. In this way, there is enough space in the process to design the retraction structure of the second metal layer, which is convenient for the implementation of the manufacturing process and does not affect the working effect of the second metal layer. Further, according to the above description, it can be seen that in this structure, due to the retraction setting of the second metal layer, the distance d4 between the second metal layer 320 in the metal trace 300 closest to the second region S2 in the first region S1 and the second metal layer 320 in the metal trace 300 closest to the first region S1 in the second region S2 is d4 > d1, and d4 > d2, where the size relationship between d1 and d2 needs to be determined according to the size value of d3.

[0049] Optionally, in some embodiments of the present invention, referring to Figure 7, only for the metal trace 300 closest to the second region S2 in the first region S1 and the metal trace 300 closest to the first region S1 in the second region S2, the orthographic projection of the second metal layer 320 on the substrate 100 is located within the orthographic projection of the first metal layer 310 on the substrate 100 and does not overlap. In other words, only the width of the second metal layer 320 in the metal trace 300 closest to the second region S2 in the first region S1 and the width of the second metal layer 320 in the metal trace 300 closest to the first region S1 in the second region S2 are reduced to make it shrink relative to the first metal layer. That is, the width of the second metal layer 320 in the metal trace 300 closest to the second region S2 in the first region S1 is less than the width of the second metal layer 320 in the metal trace 300 in the first region S1, and both are less than the width of the second metal layer 320 in the metal trace 300 in the second region S2. In this way, the distance d4 between the second metal layer 320 in the metal trace 300 closest to the second region S2 in the first region S1 and the second metal layer 320 in the metal trace 300 closest to the first region S1 in the second region S2 can be further increased, thereby further avoiding the short-circuit problem caused by metal chip residue, improving the product yield, and relative Figure 1 In the structure in, it will not affect the border width, that is, it still helps to meet the design requirements of the narrow border of the display panel. In this embodiment, for the remaining metal traces 300, the orthographic projection of the first metal layer 310 on the substrate 100 may overlap with the orthographic projection of the first metal layer 310 on the substrate 100.

[0050] Optionally, in some embodiments of the present invention, referring to Figure 8 , the widths of all the first metal layers in the border region are reduced, and the widths of all the first metal layers are the same. In this way, on the basis of further avoiding the short-circuit problem caused by metal chip residue and improving the product yield, since the sizes of the second metal layers are consistent, the manufacturing process difficulty can be reduced, and relative Figure 1 In the structure in, it will not affect the border width, that is, it still helps to meet the design requirements of the narrow border of the display panel.

[0051] Optionally, in some embodiments of the present invention, referring to Figure 9, for all metal traces 300, the orthographic projection of the second metal layer 320 on the substrate 100 is located within and does not overlap with the orthographic projection of the first metal layer 310 on the substrate 100. However, for the metal traces 300 in the first region S1, in the direction from the display region to the second region S2, the width of the second metal layer 320 gradually decreases (i.e., the size d3 of the unilateral inward contraction of the second metal layer in the first region gradually increases). For example, the width of the second metal layer 320 in the metal trace 300 closest to the second region S2 in the first region S1 is one-half of the width of the first metal layer 310 in the corresponding metal trace 300. And for the metal traces 300 in the second region S2, in the direction from the first region S1 to the edge of the display substrate, the width of the second metal layer 320 gradually increases. For example, the width of the second metal layer 320 in the metal trace 300 closest to the first region S1 in the second region S2 is one-half of the width of the first metal layer 310 in the corresponding metal trace 300. In this way, there is sufficient space in the process to design the inward contraction structure of the second metal layer, facilitating the implementation of the manufacturing process, and at the same time, it will not affect the working effect of the second metal layer. It can also further avoid the short-circuit problem caused by metal chip residues, improve the product yield, and relative to the structure in Figure 1 , it will not affect the border width, that is, it still helps to meet the design requirements of the narrow border of the display panel.

[0052] According to some embodiments of the present invention, referring to Figure 10 , in order to better solve the above short-circuit problem, at least the second metal layer 320 in the metal trace 300 closest to the second region S2 in the first region S1 and the second metal layer 320 in the metal trace 300 closest to the first region S1 in the second region S2 can be misaligned relative to the first metal layer. Specifically, in some embodiments, the edge line I of the orthographic projection of the second metal layer 320 on the substrate 100 close to the display region is located inside the orthographic projection of the first metal layer 310 on the substrate 100, and the edge line K of the orthographic projection of the first metal layer 310 on the substrate 100 away from the display region is located inside the orthographic projection of the second metal layer 320 on the substrate 100. That is, the second metal layer moves a certain distance away from the display region relative to the first metal layer, so that the edge line J of the second metal layer 320 in the metal trace 300 closest to the second region S2 in the first region S1 away from the display region falls into the first groove 201 of the second insulating layer (the first groove 201 refers to the groove generated by the second insulating layer 220 between the metal trace 300 closest to the second region S2 in the first region S1 and the metal trace 300 closest to the first region S1 in the second region S2. In other words, it refers to the groove generated by the metal trace 300 closest to the second region in the first region S1 and the second insulating layer 220, such as Figure 10as shown, so that even if there are metal chips generated in the second metal layer of the metal trace 300 closest to the second region S2 in the first region S1 ( Figure 10 as shown by the dotted circle in), due to the existence of the first groove and the above-mentioned misalignment setting of the second metal layer in the metal trace 300 closest to the first region S1 in the second region S2, the metal chips can be prevented from going out across the first groove, thereby avoiding the contact between the metal chips and the second metal layer in the metal trace 300 closest to the first region S1 in the second region S2, and further avoiding short circuit.

[0053] Optionally, as Figure 10 shown, the width of the above-mentioned first groove in the first region S1 is greater than that of the second groove 202 (the second groove 202 refers to the groove generated by the metal trace 300 and the second insulating layer 220 in the first region S1). As described above, this setting method can better avoid the problem of short circuit.

[0054] Optionally, as Figure 10 shown, the orthographic projection of the second metal layer 320 in the metal trace 300 closest to the second region in the first region on the substrate 100 and the orthographic projection of the first metal layer 310 in the metal trace closest to the first region in the second region on the substrate 100 do not overlap. As described above, this setting method can better avoid the problem of short circuit.

[0055] According to some embodiments of the present invention, the above-mentioned first metal layer and second metal layer are both arranged in a double-layer position. As described above, there will be no residue of metal chips or only very little residue of metal chips between the first metal layers located below. Therefore, according to some embodiments of the present invention, referring to Figure 10 , the first metal layer 310 and the second metal layer 320 are arranged in the same layer and are located on the side of the second insulating layer 220 close to the first insulating layer 210, that is to say, the second metal layer is also arranged at the same layer position as the first metal layer. In this way, the short circuit problem between adjacent metal layers can still be avoided. Among them, the distance between the first metal layer and the second metal layer can be flexibly adjusted as long as short circuit is not caused. At the same time, considering the design of the narrow border, the width design with a distance d2 between the metal layers is retained.

[0056] According to some embodiments of the present invention, referring to Figure 1 , Figures 5 to 12, the second region S2 includes one or two sets of metal traces 300. Thus, the first insulating layer can have an appropriate length in the border region, which helps to improve the performance of the display panel. In some embodiments, the second region S2 includes two sets of metal traces 300, that is, the two sets of metal traces 300 farthest from the display region; in other embodiments, the second region may also include only one set of metal traces 300, that is, only the metal trace 300 farthest from the display region.

[0057] According to some embodiments of the present invention, referring to Figure 1 , Figures 5 to 12 , the metal trace 300 farthest from the display region (i.e., the metal trace 300 at the outermost edge of the border region, that is, Figure 12 the metal trace in the dashed box in) is not electrically connected to the other metal traces. In this way, the metal trace 300 farthest from the display region (i.e., the metal trace 300 at the outermost edge of the border region) can be used as a shielding protection to avoid interference from the external environment to the electrical signals of other metal traces.

[0058] According to some embodiments of the present invention, the metal traces are provided on the same layer as the touch electrodes in the touch panel. For example, the metal traces are provided on the same layer as the touch electrode TX or the touch electrode RX in the touch panel.

[0059] According to some embodiments of the present invention, the above-mentioned border region of the present invention is located on at least one side of the display region. A plurality of touch electrodes TX or touch electrodes RX are distributed in the first direction of the display region (for example, the border region is located below the display region, and a plurality of touch electrodes TX (such as TX0, TX1, TX2, TX3,..., TX14, TX15, etc.) are distributed in the first direction of the display region). There are no special requirements for the specific positions of the plurality of touch electrodes TX corresponding to the gap between the metal trace 300 closest to the second region S2 in the first region S1 and the metal trace closest to the first region S1 in the second region S2. Those skilled in the art can select flexibly according to the actual situation. In some embodiments, the gap between the metal trace 300 closest to the second region S2 in the first region S1 and the metal trace closest to the first region S1 in the second region S2 corresponds to TX12.

[0060] In another aspect of the present invention, the present invention provides a method for manufacturing the display panel described above. The display panel includes a display region and a border region located on at least one side of the display region. Referring to Figure 13 , the method for manufacturing the display panel includes the steps of manufacturing the border region, including:

[0061] S100: Provide a substrate 100;

[0062] S200: Form a first insulating layer 210. The first insulating layer 210 is on one side of the substrate 100 and extends from the display region to the border region;

[0063] S300: Form multiple groups of metal traces 300. Each group of metal traces 300 includes a first metal layer 210 and a second metal layer 220. The multiple groups of metal traces 300 are arranged in sequence in the direction of the display area close to the border area. The metal traces 300 are divided into a first area S1 and a second area S2. The first area S1 is located between the display area and the second area S2. The orthographic projection of the metal traces 300 in the first area S1 on the first insulating layer 210 has an overlapping area with the first insulating layer 210. The first insulating layer 210 is not provided directly below the metal traces 300 in the second area SS2. The distance between the metal traces 300 in the first area S1 that is closest to the second area S2 and the metal traces 300 in the second area S2 that is closest to the first area S1 is d1, and the distance between adjacent two of the first metal layers among the metal traces in the first area is d2, where 10d2 ≥ d1 ≥ 1.5d2.

[0064] According to an embodiment of the present invention, in the above manufacturing process, by increasing the distance between two adjacent metal traces in the first area and the second area, even if there is a certain amount of metal residue in the gap between them, they can still maintain a non-contact state, that is, it can effectively prevent short circuits between two adjacent metal traces in the first area and the second area, thereby improving the manufacturing yield and productivity.

[0065] According to an embodiment of the present invention, referring to Figure 13 and Figure 11 , the method for manufacturing a display panel further includes: forming a second insulating layer 220, which is formed on the side of the first insulating layer 210 away from the substrate 100. The metal traces include a first metal layer and a second metal layer. At this time, there are two setting methods for the first metal layer and the second metal layer. The first is the double-layer position setting, and the other is the same-layer position setting. Specifically:

[0066] Referring to Figure 13 , the second metal layer 320 is formed on the side of the second insulating layer 220 away from the substrate 100, and the first metal layer 310 is formed on the side of the second insulating layer 220 close to the substrate 100. And the first metal layer 310 in the first area S1 is located between the first insulating layer 210 and the second insulating layer 220. The orthographic projection of the second metal layer 320 on the substrate 100 overlaps with the orthographic projection of the first metal layer 310 on the substrate 100. Among them, the specific setting requirements for the first metal layer and the second metal layer can refer to 1, Figures 4 to 10 and the above description, and will not be elaborated again here.

[0067] Referring to Figure 11, the first metal layer 310 and the second metal layer 320 are arranged on the same layer and are located on the side of the second insulating layer 220 close to the first insulating layer 210. That is to say, the second metal layer is also arranged at the same layer position as the first metal layer. In this way, the problem of short circuit between adjacent metal layers can still be avoided. Among them, the distance between the first metal layer and the second metal layer can be adjusted flexibly as long as short circuit is not caused. At the same time, the design of a narrow border can also be considered, and the width design with a distance of d2 between the metal layers is retained.

[0068] In another aspect of the present invention, the present invention provides a display device. According to an embodiment of the present invention, the display device includes the display panel described above. Therefore, the reliability of the display device is relatively high and the display quality is relatively good. Those skilled in the art can understand that the display device has all the features and advantages of the display panel described above, and will not be elaborated here too much.

[0069] According to an embodiment of the present invention, there is no special requirement for the specific type of the display device, and those skilled in the art can flexibly select according to the actual situation. For example, the display device can be a mobile phone, a computer, an iPad, a Kindle, a game console, or any other display device with a display function.

[0070] Those skilled in the art can understand that in addition to the display panel described above, the display device further includes the structures or components necessary for a conventional display device. Taking a mobile phone as an example, in addition to the above-mentioned display panel, it further includes a cover plate, a touch panel, a fingerprint film group, an audio module, a camera module, a CPU, a battery, a rear cover, a middle frame, and other structures or components necessary for a mobile phone.

[0071] The terms "first" and "second" in the text are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.

[0072] In the description of this specification, the description with reference to terms such as "an embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0073] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. A display panel, characterized in that, the display panel includes a display area and a border area located on at least one side of the display area, and the border area includes: a substrate; a first insulating layer, the first insulating layer is disposed on one side of the substrate and extends from the display area to the border area; multiple groups of metal traces, each group of the metal traces includes at least one metal layer, and the multiple groups of metal traces are arranged in sequence in a direction from the display area close to the border area. The metal traces include a first area and a second area. The first area is located between the display area and the second area. The orthographic projection of the metal traces in the first area on the first insulating layer has an overlapping area with the first insulating layer. The first insulating layer is not disposed directly below the metal traces in the second area. The distance between the metal trace closest to the second area in the first area and the metal trace closest to the first area in the second area is d1, and the distance between adjacent metal traces in the first area is d2, where 10d2≥d1≥1.5d2.

2. The display panel according to claim 1, characterized in that, 20 μm≥d1≥4.1 μm.

3. The display panel according to claim 1, characterized in that, 20 μm≥d1≥7 μm.

4. The display panel according to claim 1, characterized in that, further comprising: a second insulating layer, the second insulating layer is disposed on a side of the first insulating layer away from the substrate. The metal traces include a first metal layer and a second metal layer. The second metal layer is disposed on a side of the second insulating layer away from the substrate, and the first metal layer is disposed on a side of the second insulating layer close to the substrate. And the first metal layer in the first area is located between the first insulating layer and the second insulating layer. The orthographic projection of the second metal layer on the substrate overlaps with the orthographic projection of the first metal layer on the substrate.

5. The display panel according to claim 1, characterized in that, the orthographic projection of all the metal traces on the first insulating layer is located within the first insulating layer.

6. The display panel according to claim 4, characterized in that, the orthographic projection of the second metal layer on the substrate substantially overlaps with the orthographic projection of the first metal layer on the substrate.

7. The display panel according to claim 4, characterized in that, at least for the metal trace closest to the second area in the first area and the metal trace closest to the first area in the second area, the orthographic projection of the second metal layer on the substrate is located within the orthographic projection of the first metal layer on the substrate and does not overlap.

8. The display panel according to claim 7, characterized in that, the distance between the edge line of the orthographic projection of the second metal layer on the substrate and the edge line of the orthographic projection of the first metal layer on the substrate is greater than or equal to 1.2 μm.

9. The display panel according to claim 7, characterized in that, The pitch d4 between the second metal layer in the metal trace closest to the second region in the first region and the second metal layer in the metal trace closest to the first region in the second region is greater than the pitch d1 between the metal trace closest to the second region in the first region and the metal trace closest to the first region in the second region.

10. The display panel according to claim 7, wherein, the first metal trace satisfies at least one of the following conditions: Only for the metal trace closest to the second region in the first region and the metal trace closest to the first region in the second region, the orthographic projection of the second metal layer on the substrate is located within the orthographic projection of the first metal layer on the substrate and does not overlap; For all the metal traces, the orthographic projection of the second metal layer on the substrate is located within the orthographic projection of the first metal layer on the substrate and does not overlap, and the widths of all the first metal layers are the same; For all the metal traces, the orthographic projection of the second metal layer on the substrate is located within the orthographic projection of the first metal layer on the substrate and does not overlap. For the second metal layer in the metal traces in the first region, the width gradually decreases in the direction from the display region to the second region, and for the second metal layer in the metal traces in the second region, the width gradually increases in the direction from the first region to the edge of the display panel.

11. The display panel according to claim 4, wherein, At least for the metal trace closest to the second region in the first region and the metal trace closest to the first region in the second region, wherein the edge line of the orthographic projection of the second metal layer on the substrate close to the display region is located inside the orthographic projection of the first metal layer on the substrate, and the edge line of the orthographic projection of the first metal layer on the substrate far from the display region is located inside the orthographic projection of the second metal layer on the substrate.

12. The display panel according to claim 10, wherein, The orthographic projection of the second metal layer in the metal trace closest to the second region in the first region on the substrate and the orthographic projection of the first metal layer in the metal trace closest to the first region in the second region on the substrate do not overlap.

13. The display panel according to claim 1, wherein, further comprising: a second insulating layer, the second insulating layer is disposed on a side of the first insulating layer away from the substrate. The metal trace includes a first metal layer and a second metal layer, and the first metal layer and the second metal layer are disposed in the same layer and are located on a side of the second insulating layer close to the first insulating layer.

14. The display panel according to any one of claims 1 to 13, wherein, The metal trace farthest from the display region is not electrically connected to any of the remaining metal traces.

15. A method for manufacturing a display panel according to any one of claims 1 to 14, characterized in that, the display panel includes a display area and a border area located on at least one side of the display area, and the method for manufacturing the display panel includes a step of manufacturing the border area, including: providing a substrate; forming a first insulating layer on one side of the substrate, and the first insulating layer extends from the display area to the border area; forming multiple groups of metal traces, each group of the metal traces includes at least one metal layer, and the multiple groups of metal traces are arranged in sequence in a direction from the display area close to the border area, the metal traces include a first area and a second area, the first area is located between the display area and the second area, a positive projection of the metal traces in the first area on the first insulating layer has an overlapping area with the first insulating layer, the first insulating layer is not provided directly below the metal traces in the second area, a distance between the metal trace closest to the second area in the first area and the metal trace closest to the first area in the second area is d1, and a distance between adjacent metal traces in the first area is d2, wherein 10d2≥d1≥1.5d2.

16. The method according to claim 15, characterized in that, further comprising: forming a second insulating layer on a side of the first insulating layer away from the substrate, the metal traces include a first metal layer and a second metal layer, wherein, the second metal layer is formed on a side of the second insulating layer away from the substrate, the first metal layer is formed on a side of the second insulating layer close to the substrate, and the first metal layer in the first area is located between the first insulating layer and the second insulating layer, a positive projection of the second metal layer on the substrate overlaps with a positive projection of the first metal layer on the substrate, or, the first metal layer and the second metal layer are provided on the same layer and are located on a side of the second insulating layer close to the first insulating layer.

17. A display device, characterized in that, comprises the display panel according to any one of claims 1 to 14.