Display panel, preparation method thereof and display device

Abstract

The invention discloses a display panel and a preparation method thereof, and a display device, the display panel comprises a substrate, an isolation structure, a light-emitting unit and a first packaging layer, the isolation structure is formed on one side of the substrate and comprises a first isolation structure and a second isolation structure which are connected with each other, the first isolation structure is located in a display area and forms a first opening in an enclosing manner, and the second isolation structure is located in a second opening; the second isolation structure is located in the non-display area; the light-emitting unit is formed on one side of the substrate and located in the first opening. The first packaging layer comprises a first packaging part located in the display area and a second packaging part located in the non-display area, the first packaging part is located on the side, away from the substrate, of the light-emitting unit, and at least part of the second packaging part is located on the side, away from the substrate, of the second isolation structure. And the orthographic projection of the second packaging part on the substrate covers the orthographic projection of the second isolation structure on the substrate. According to the display panel provided by the invention, the film layer yield of the non-display area can be improved, so that the yield of the display panel is improved.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and in particular, relates to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] With the development of display technology, the performance of display devices is getting higher and higher. AMOLED has become more and more widely used and has a growing influence due to its excellent color saturation and image quality. However, existing display devices are prone to film fractures at the frame, which seriously affects the performance of the display devices. Summary of the invention

[0003] The embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device, which can improve the yield of a film layer in a non-display area, thereby improving the yield of a display panel.

[0004] An embodiment of a first aspect of the embodiments of the present application provides a display panel, comprising a display area and a non-display area disposed around at least a portion of the display area; the display panel comprises:

[0005] substrate;

[0006] An isolation structure, formed on one side of the substrate, comprising a first isolation structure and a second isolation structure connected to each other, wherein the first isolation structure is located in the display area and encloses a first opening, and the second isolation structure is located in the non-display area;

[0007] A light-emitting unit, formed on one side of the substrate and located at the first opening, the light-emitting unit comprising a first electrode, a light-emitting functional layer, and a second electrode stacked in a direction away from the substrate;

[0008] The first encapsulation layer includes a first encapsulation portion located in the display area and a second encapsulation portion located in the non-display area, the first encapsulation portion is located on the side of the light-emitting unit away from the substrate, at least a portion of the second encapsulation portion is located on the side of the second isolation structure away from the substrate, and the orthographic projection of the second encapsulation portion on the substrate covers the orthographic projection of the second isolation structure on the substrate.

[0009] According to an embodiment of the first aspect of the present invention, the second isolation structure encloses to form a second opening;

[0010] Preferably, the first encapsulation portion covers a side of the light emitting unit away from the substrate and a side wall of the first isolation structure facing the first opening, and extends to a side of the first isolation structure away from the substrate, and adjacent first encapsulation portions are spaced apart on a side of the first isolation structure away from the substrate;

[0011] Preferably, the second packaging portion also covers the side wall of the second isolation structure facing the second opening and the second opening;

[0012] Preferably, the second isolation structure encloses and forms a plurality of the second openings, and the second packaging portion covers the plurality of the second openings simultaneously;

[0013] Preferably, the second packaging part and at least a portion of the first packaging part are manufactured using the same process.

[0014] According to any of the aforementioned embodiments of the first aspect of the present invention, it further includes a shielding layer, wherein the shielding layer is located between the second packaging portion and the substrate and is electrically connected to the isolation structure;

[0015] Preferably, the orthographic projection of the shielding layer on the substrate covers the orthographic projection of the second opening on the substrate;

[0016] Preferably, the shielding layer includes a first layer, the first layer is arranged at the same layer as the first electrode and is electrically connected to the second isolation structure; and / or,

[0017] The shielding layer includes a second layer, the second layer is arranged on the same layer as the second electrode, the second layer includes a first area located in the second opening and a second area located on a side of the second isolation structure away from the substrate, and the first area is electrically connected to the second isolation structure.

[0018] According to any of the aforementioned embodiments of the first aspect of the present invention, the first layer includes a plurality of shielding sub-parts, the shielding sub-parts are arranged at intervals, and the orthographic projection of the second opening on the substrate is located within the orthographic projection of the shielding sub-part on the substrate;

[0019] Preferably, the display panel further comprises a pixel definition layer, the pixel definition layer is located between the first layer and the isolation structure, the pixel definition layer comprises an opening for exposing the shielding sub-section, and the second isolation structure is electrically connected to the shielding sub-section via a via hole penetrating the pixel definition layer;

[0020] Preferably, the orthographic projection of the opening on the substrate is located within the orthographic projection of the second opening on the substrate;

[0021] Preferably, adjacent shielding subsections are electrically connected via connecting wires;

[0022] Preferably, the connection line includes a first connection line and a second connection line. The shielding portions are distributed in rows and columns. The shielding portions adjacent to each other in the row direction are connected by the first connection line. The shielding portions at the ends of different rows away from the display area are connected to the same second connection line by the first connection line. The width of the second connection line is greater than the width of the first connection line. The second isolation structure is electrically connected to the second connection line;

[0023] Preferably, the second connection line extends in the column direction;

[0024] Preferably, the distribution pattern of the shielding portions is the same as that of the first electrodes.

[0025] According to any of the foregoing embodiments of the first aspect of the present invention, the first layer is in a mesh shape and includes a plurality of apertured portions distributed in an array. The orthographic projections of the second opening and the apertured portions on the substrate do not overlap.

[0026] According to any of the foregoing embodiments of the first aspect of the present invention, a touch layer is further included. The touch layer is disposed on a side of the first encapsulation layer away from the substrate and includes touch traces located in the non-display area. The orthographic projections of the second isolation structure and the shielding layer on the substrate form a projection area. The orthographic projection of the touch traces on the substrate is located within the projection area;

[0027] Preferably, in the orthographic projection of the touch traces in the touch layer away from the display area on the substrate, the minimum distance between the edge away from the display area and the edge of the projection area is greater than 30 microns.

[0028] According to any of the foregoing embodiments of the first aspect of the present invention, the display panel further includes a light-emitting material layer located between the first encapsulation layer and the substrate. The light-emitting material layer includes a first portion located within the second opening and a second portion located on a side of the second isolation structure away from the substrate. The orthographic projection of the second encapsulation portion on the substrate simultaneously covers the orthographic projections of the first portion and the second portion on the array substrate;

[0029] Preferably, a second electrode material layer is further provided between the light-emitting material layer and the first encapsulation layer,

[0030] Preferably, at least a part of the second electrode material layer is electrically connected to the isolation structure and reused as a shielding layer;

[0031] Preferably, the light-emitting material layer and the light-emitting functional layer are provided on the same layer.

[0032] According to any of the foregoing embodiments of the first aspect of the present invention, the display panel further includes a dam area, the dam area is located on the side of the non-display area away from the display area, and the second encapsulation part also extends from the non-display area to the dam area;

[0033] Preferably, the display panel further includes a second encapsulation layer formed on the side of the first encapsulation layer away from the substrate, and the second encapsulation layer includes a part located in the display area and a part located in the non-display area;

[0034] Preferably, at least part of the second encapsulation layer fills the gap between adjacent first encapsulation parts and contacts the surface of the first isolation structure away from the substrate;

[0035] Preferably, the material of the second encapsulation layer includes an organic material;

[0036] Preferably, the material of the first encapsulation layer includes an inorganic material;

[0037] Preferably, a third encapsulation layer is further included, the third encapsulation layer is located on the side of the second encapsulation layer away from the substrate, and extends from the display area to the non-display area and the dam area, and the material of the third encapsulation layer includes an inorganic material.

[0038] According to any of the foregoing embodiments of the first aspect of the present invention, the isolation structure includes a first isolation part and a second isolation part, the second isolation part is located on the side of the first isolation part away from the substrate, and the orthographic projection of the second isolation part on the substrate covers the orthographic projection of the first isolation part on the substrate;

[0039] Preferably, the second electrode is electrically connected to the isolation structure.

[0040] An embodiment of the second aspect of the present application further provides a method for manufacturing a display panel, including:

[0041] Providing a substrate;

[0042] Forming an isolation structure on one side of the substrate, the isolation structure includes a first isolation structure and a second isolation structure, the first isolation structure is located in the display area and encloses a first opening, and the second isolation structure is located in the non-display area and encloses a second opening;

[0043] Forming a light-emitting unit in the first opening;

[0044] A first encapsulation layer is formed. The first encapsulation layer includes a first encapsulation portion located in the display area and a second encapsulation portion located in the non-display area. The first encapsulation portion is located on the side of the light-emitting unit facing away from the substrate, and the second encapsulation portion covers the orthographic projection of the second isolation structure on the substrate in the orthographic projection of the second encapsulation portion on the substrate.

[0045] An embodiment of the third aspect of the present application further provides a display device, including any one of the display panels provided by the first aspect of the present application.

[0046] The display panel provided by the present application includes a display area and a non-display area. The display panel includes a substrate, an isolation structure, a light-emitting unit, and a first encapsulation layer. The isolation structure is formed on one side of the substrate and includes a first isolation structure located in the display area and a second isolation structure located in the non-display area. The first isolation structure and the second isolation structure are connected. The first isolation structure includes a plurality of first openings for accommodating the light-emitting unit, and the first openings can prevent the isolation structure from blocking the light emitted by the light-emitting unit. The second isolation structure is located in the non-display area. The first encapsulation layer includes a first encapsulation portion located in the display area and a second encapsulation portion located in the non-display area. The first encapsulation portion is located on the side of the light-emitting unit facing away from the substrate and is used to encapsulate the light-emitting unit to improve the yield of the light-emitting unit. At least a part of the second encapsulation portion is located on the side of the second isolation structure facing away from the substrate, and the orthographic projection of the second encapsulation portion on the substrate covers the orthographic projection of the second isolation structure on the substrate, so that the part of the second encapsulation portion located on the surface of the second isolation structure facing away from the substrate is continuously arranged, which helps the film layer (such as the organic layer) on the side of the second encapsulation portion facing away from the substrate to level on the second isolation structure, so as to provide a flat surface for the film layer on the side of the film layer facing away from the substrate, improve the yield of the subsequent film layer, and reduce the risk of fracture. Description of the Drawings

[0047] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0048] Figure 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application;

[0049] Figure 2 is a schematic structural diagram of an isolation structure in a display panel provided by an embodiment of the present application;

[0050] Figure 3 is Figure 1 a cross-sectional view along P-P';

[0051] Figure 4Yes Figure 1 Another cross-sectional view along P-P’;

[0052] Figure 5 It is a schematic structural diagram of the junction between the first layer and the first electrode in a display panel provided by an embodiment of the present application;

[0053] Figure 6 It is another schematic structural diagram of the junction between the first layer and the first electrode in a display panel provided by an embodiment of the present application;

[0054] Figure 7 It is a flowchart of a method for manufacturing a display panel provided by an embodiment of the present application;

[0055] Figure 8 It is a schematic structural diagram of a display device provided by an embodiment of the present application.

[0056] In the drawings:

[0057] 1 - Display panel; AA - Display area; NA - Non-display area; 11 - Substrate; 12 - Isolation structure; 121 - First isolation structure; 1211 - First opening; 122 - Second isolation structure; 1221 - Second opening; 123 - First isolation part; 124 - Second isolation part; 13 - Light-emitting unit; 131 - First electrode; 132 - Light-emitting functional layer; 1320 - Light-emitting material layer; 1321 - First sub-portion; 1322 - Second sub-portion; 133 - Second electrode; 14 - Shielding layer; 141 - First layer; 1411 - Shielding sub-portion; 1412 - Connection line; 1413 - First connection line; 1414 - Second connection line; 1415 - Opening portion; 142 - Second layer; 1421 - First region; 1422 - Second region; 15 - Touch layer; 151 - Touch trace; NA1 - Levelling area; NA2 - Blocking area; 20 - Dam; 16 - First encapsulation layer; 161 - First encapsulation portion; 162 - Second encapsulation portion; 17 - Second encapsulation layer; 18 - Third encapsulation layer; 19 - Pixel definition layer; 191 - Opening; 21 - Via hole; 2 - Display device. Detailed Description of the Embodiments

[0058] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the following detailed description, many specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to those skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely provided to better understand the present application by showing examples of the present application.

[0059] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variation thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising..." does not exclude the existence of additional identical elements in the process, method, article or device comprising the element.

[0060] For a better understanding of the present application, the following will be a detailed description of Figures 1 to 8 a display panel and its manufacturing method and a display device according to an embodiment of the present application.

[0061] Please refer to Figure 1 、 Figure 2 and Figure 3 , an embodiment of the present application provides a display panel 1, including a display area AA and a non-display area NA1 disposed around at least a part of the display area AA. The display panel 1 includes a substrate 11, an isolation structure 12, a light-emitting unit 13, and a first encapsulation layer 16. The isolation structure 12 is formed on one side of the substrate 11 and includes a first isolation structure 121 and a second isolation structure 122 connected to each other. The first isolation structure 121 is located in the display area AA and encloses a first opening 1211, and the second isolation structure 122 is located in the non-display area NA1. The light-emitting unit 13 is formed on one side of the substrate 11 and located in the first opening 1211. The light-emitting unit 13 includes a first electrode 131, a light-emitting functional layer 132, and a second electrode 133 stacked in a direction away from the substrate 11. The first encapsulation layer 16 includes a first encapsulation portion 161 located in the display area AA and a second encapsulation portion 162 located in the non-display area NA1. The first encapsulation portion 161 is located on the side of the light-emitting unit 13 away from the substrate 11, at least a part of the second encapsulation portion 162 is located on the side of the second isolation structure 122 away from the substrate 11, and the orthographic projection of the second encapsulation portion 162 on the substrate 11 covers the orthographic projection of the second isolation structure 122 on the substrate 11.

[0062] The display panel 1 provided in the present application includes a display area AA and a non-display area NA1. The display panel 1 includes a substrate 11, an isolation structure 12, a light-emitting unit 13 and a first encapsulation layer 16. The isolation structure 12 is formed on one side of the substrate 11, including a first isolation structure 121 located in the display area AA and a second isolation structure 122 located in the non-display area NA1. The first isolation structure 121 and the second isolation structure 122 are connected. The first isolation structure 121 includes a plurality of first openings 1211. The first openings 1211 are used to accommodate the light-emitting unit 13. The first openings 1211 can prevent the isolation structure 12 from blocking the light of the light-emitting unit 13. The second isolation structure 122 is located in the non-display area NA1. The first encapsulation layer 16 includes a first encapsulation portion 161 located in the display area AA and a second encapsulation portion 162 located in the non-display area NA1. The first encapsulation portion 161 is located on the side of the light-emitting unit 13 away from the substrate 11, and is used to encapsulate the light-emitting unit 13 to improve the yield of the light-emitting unit 13. At least a portion of the second packaging portion 162 is located on the side of the second isolation structure 122 away from the substrate 11, and the orthographic projection of the second packaging portion 162 on the substrate 11 covers the orthographic projection of the second isolation structure 122 on the substrate 11, so that the second packaging portion 162 is located on the portion of the surface of the second isolation structure 122 away from the substrate 11. The portion is continuously arranged, which helps to level the film layer (for example, an organic layer) on the side of the second packaging portion 162 away from the substrate 11 above the second isolation structure 122, so as to provide a flat surface for the film layer on the side of the film layer away from the substrate 11, thereby improving the yield of subsequent film layers and reducing the risk of breakage.

[0063] In the above embodiment, the light-emitting unit 13 may include a first electrode 131, a light-emitting functional layer 132 and a second electrode 133 stacked in a direction away from the substrate 11. At least one light-emitting unit 13 may be formed in each first opening 1211. The second electrode 133 of the light-emitting unit 13 may be electrically connected to the isolation structure, specifically, may be electrically connected to the first isolation structure 121, so as to realize synchronous power supply to the second electrode 133.

[0064] In the above embodiment, the first isolation structure 121 may be a mesh structure. In a feasible embodiment, the second isolation structure 122 encloses and forms a second opening 1221 .

[0065] In the above implementation mode, if Figure 2 As shown, the second isolation structure 122 and the first isolation structure 121 may both be mesh structures, and the first isolation structure 121 and the second isolation structure 122 are connected to form a mesh structure disposed on the entire surface.

[0066] The second isolation structure 122 encloses to form a second opening 1221. The second opening 1221 can be formed by the same preparation process as the first opening 1211 during the preparation process, which can reduce the contact area between the second isolation structure 122 and the underlying film layer, and achieve the alternate contact between the second isolation structure 122, the film layer within the second opening 1221 and the underlying film layer along the direction parallel to the substrate 11, preventing the problem of easy peeling when a large area of metal contacts the underlying film layer, and at the same time preventing the generation of static electricity to protect the signal lines within the substrate 11. Static electricity can cause the signal lines within the substrate 11 to turn black, be punctured, or broken, resulting in open circuit and short circuit problems.

[0067] In the above embodiment, the first isolation structure 121 and the second isolation structure 122 are connected, which can achieve the synchronous power supply for the first isolation structure 121 and the second isolation structure 122. By supplying a fixed potential to the isolation structure 12, the synchronous power supply for the second isolation structure 122 and the first isolation structure 121 and the second electrode 133 can be realized. Passing a fixed potential through the second isolation structure 122 can achieve a good shielding effect.

[0068] In a feasible embodiment, as Figure 3 shown, the first encapsulation part 161 covers the side of the light-emitting unit 13 facing away from the substrate 11 and the side wall of the first isolation structure 121 facing the first opening 1211, and extends to the side of the first isolation structure 121 facing away from the substrate 11, and adjacent first encapsulation parts 161 are arranged at intervals on the side of the first isolation structure 121 facing away from the substrate 11.

[0069] In the above embodiment, the first encapsulation part 161 can correspond to the light-emitting unit 13 one by one and achieve the independent encapsulation of each light-emitting unit 13. Specifically, the first encapsulation part 161 covers the side of the light-emitting unit 13 facing away from the substrate 11, and covers the side wall of the first isolation structure 121 facing the first opening 1211 and extends to the side of the first isolation structure 121 facing away from the substrate 11, so that the first isolation structure 121 completely covers and wraps the first opening 1211, thereby improving the encapsulation yield of the first light-emitting unit 13.

[0070] In a feasible embodiment, as Figure 3As shown, the second encapsulation part 162 also covers the side wall of the second isolation structure 122 facing the second opening 1221 and the second opening 1221, preventing the film layer (such as the organic layer) on the side of the second encapsulation part 162 away from the substrate 11 from directly contacting the isolation structure, that is, the film layer on the side of the second encapsulation part 162 away from the substrate 11 directly contacts the second encapsulation part 162, which helps the film layer (such as the organic layer) on the side of the second encapsulation part 162 away from the substrate 11 to level. At the same time, this design can also reduce the step difference between the side of the second isolation structure 122 away from the substrate 11 and the second opening 1221, further improving the flatness of the film layer (such as the organic layer) on the side of the second encapsulation part 162 above the second isolation structure 122, so as to improve the yield of the subsequent film layer and reduce the risk of fracture.

[0071] In a feasible implementation, as Figure 3 shown, the second isolation structure 122 encloses to form a plurality of second openings 1221, and the second encapsulation part 162 covers the plurality of second openings 1221 at the same time. Thereby, the continuity of the second encapsulation part 162 in the non-display area NA1 can be stronger, reducing the contact between the film layer (such as the organic layer) on the side of the second encapsulation part 162 away from the substrate 11 and the isolation structure, etc., and increasing the contact area between the film layer (such as the organic layer) on the side of the second encapsulation part 162 away from the substrate 11 and the second encapsulation part, which is beneficial to the leveling of the film layer (such as the organic layer) on the side of the second encapsulation part 162 away from the substrate 11, so as to further improve the flatness of the film layer (such as the organic layer) on the side of the second encapsulation part 162 above the second isolation structure 122.

[0072] In a feasible implementation, as Figure 3 shown, the second encapsulation part 162 is made by the same process as at least part of the first encapsulation part 161. Thereby, the preparation process can be simplified and the preparation cost can be saved. In a feasible implementation, a shielding layer 14 is further included. The shielding layer 14 is located between the second encapsulation part 162 and the substrate 11 and is electrically connected to the isolation structure 12. The shielding layer 14 is electrically connected to the isolation structure 12 to facilitate providing a fixed potential for the shielding layer 14 through the isolation structure 12 to achieve a good shielding effect.

[0073] In the above implementation, the second encapsulation part 162 is used to encapsulate the second isolation structure 122 and the shielding layer 14 to improve the yield of the second isolation structure 122 and the shielding layer 14 and reduce the probability of damage to the second isolation structure 122 and the shielding layer 14, so that the shielding reliability can be better.

[0074] In a feasible implementation, as Figure 3As shown, the orthographic projection of the shielding layer 14 on the substrate 11 covers the orthographic projection of the second opening 1221 on the substrate 11. Thus, shielding is performed at the second isolation structure 122 through the second isolation structure 122, and the shielding range is supplemented through the shielding layer 14 at the second opening 1221, thereby achieving a relatively airtight shielding effect.

[0075] In a feasible implementation, as Figure 4 shown, the shielding layer 14 includes a first layer 141. The first layer 141 is arranged on the same layer as the first electrode 131 and is electrically connected to the second isolation structure 122.

[0076] In the above implementation, the first layer 141 can be prepared in the non-display area NA1 synchronously when preparing the first electrode 131 to save the manufacturing process. The first layer 141 can supplement the shielding at the second opening 1221 and form a continuous shielding film layer with the second isolation structure 122 to enhance the shielding effect.

[0077] In another feasible implementation, as Figure 3 shown, the shielding layer 14 includes a second layer 142. The second layer 142 is arranged on the same layer as the second electrode 133. The second layer 142 includes a first region 1421 located within the second opening 1221 and a second region 1422 located on the side of the second isolation structure 122 away from the substrate 11. The first region 1421 is electrically connected to the second isolation structure 122.

[0078] In the above implementation, the second layer 142 can be prepared on the same layer as the second electrode 133, that is, the same process can be used, which can reduce the manufacturing process and save the manufacturing cost. The first region 1421 can be used to supplement the shielding of the second opening 1221 part to cooperate with the second isolation part 124 to achieve a more airtight shielding effect, and the first region 1421 is electrically connected to the second isolation part, so as to facilitate synchronous power supply to the first region 1421 and the second isolation part, reduce the number of power supply lines, simplify the wiring, and both the first region 1421 and the second isolation part are connected to a fixed potential, so as to achieve a better shielding effect. The second region 1422 is located on the side of the second isolation structure 122 away from the substrate 11, so as to facilitate improving the continuity of the second encapsulation part 162 on the surface of the second isolation structure 122 away from the substrate 11.

[0079] Specifically, the shielding layer 14 may include at least one of the first layer 141 and the second layer 142.

[0080] In the above-described embodiment, when the shielding layer 14 includes the first layer 141 and the second layer 142, the first layer 141 and the second region 1422 are electrically connected to the second isolation structure 122 respectively, which can add a protection function to the shielding layer 14. When either the first layer 141 or the second layer 142 fails, the other layer can still provide a shielding effect. Specifically, when the second layer 142 fails due to the intrusion of water and oxygen, the first layer 141 can form a continuous and sealed film layer with the second isolation structure 122 to ensure the shielding effect. Thereby, the corrosion resistance and reliability of the shielding layer 14 can be improved.

[0081] In a feasible embodiment, as Figure 5 shown, the first layer 141 includes a plurality of shielding segments 1411, the shielding segments 1411 are arranged at intervals, and the orthographic projection of the second opening 1221 on the substrate 11 is located within the orthographic projection of the shielding segments 1411 on the substrate 11.

[0082] In the above-described embodiment, the first layer 141 can adopt the form of a plurality of shielding segments 1411 arranged at intervals, and the second opening 1221 corresponds to the shielding segments 1411 one by one, thereby reducing the area of the first layer 141 to reduce the probability of peeling after the first layer 141 contacts the underlying film layer. The orthographic projection of the second opening 1221 on the substrate 11 is located within the orthographic projection of the shielding segments 1411 on the substrate 11, so that the second opening 1221 region can be shielded by the shielding segments 1411. By forming a continuous and sealed film layer with the second isolation structure 122 using the shielding segments 1411, the shielding effect can be ensured.

[0083] In a feasible embodiment, as Figure 4 shown, the display panel 1 further includes a pixel definition layer 19, the pixel definition layer 19 is located between the first layer 141 and the isolation structure 12, the pixel definition layer 19 includes an opening 191 for exposing the shielding segments 1411, and the second isolation structure 122 is electrically connected to the shielding segments 1411 through a via hole penetrating the pixel definition layer 19.

[0084] The part of the pixel definition layer 19 located in the display area AA covers the edge of the first electrode 131, thereby protecting the first electrode 131 and achieving mutual insulation between adjacent first electrodes 131, reducing the interference between adjacent first electrodes 131. The part of the pixel definition layer 19 located in the display area AA includes at least a first pixel opening, a second pixel opening, and a third pixel opening. Specifically, when the display panel 1 includes light-emitting units 13 of three colors, the first pixel opening is used to form a red light-emitting unit 13, the second pixel opening is used to form a green light-emitting unit 13, and the third pixel opening is used to form a blue light-emitting unit 13. When the display panel 1 further includes a white light-emitting unit 13, the pixel definition layer 19 may further include a fourth pixel opening for forming a white light-emitting unit 13.

[0085] A part of the pixel definition layer 19 located in the non-display area NA1 can be in direct contact with the substrate 11, thereby providing a flat surface for subsequent film layers, facilitating the improvement of the reliability of the touch trace 151, and reducing the occurrence of open circuit and short circuit defects. When the shielding layer 14 includes the first layer 141, the pixel definition layer 19 may include an opening 191 for exposing the shielding portion 1411 to achieve consistency with the display area AA. At this time, the second isolation structure 122 and the shielding portion 1411 can be electrically connected through a via hole penetrating the pixel definition layer 19.

[0086] In a feasible implementation, as Figure 4 shown, the orthographic projection of the opening 191 on the substrate 11 is located within the orthographic projection of the second opening 1221 on the substrate 11. The material of the pixel definition layer 19 can be formed first, and then the isolation structure 12 is prepared. After patterning the isolation structure 12, the material of the pixel definition layer 19 is patterned to form the pixel definition layer 19, so that the orthographic projection of the opening 191 on the substrate 11 is located within the orthographic projection of the second opening 1221 on the substrate 11.

[0087] Specifically, as Figure 5 shown, adjacent shielding portions 1411 are connected by a connection line 1412; the connection line 1412 is used to electrically connect each shielding portion 1411 to achieve synchronous power supply for each shielding portion 1411.

[0088] Specifically, the connection line 1412 includes a first connection line 1413 and a second connection line 1414. The shielding portions 1411 are arranged in rows and columns. The shielding portions 1411 adjacent in the row direction are connected by the first connection line 1413. The shielding portions 1411 at one end far from the display area AA in different rows are connected to the same second connection line 1414 through the first connection line 1413. The width of the second connection line 1414 is greater than the width of the first connection line 1413. The second isolation structure 122 is electrically connected to the second connection line 1414.

[0089] Among them, setting the first connection line 1413 to be thinner can reduce the probability of peeling after contacting the underlying film layer. Setting the second connection line 1414 to be thicker facilitates the connection of the second isolation structure 122 through a via hole 21 penetrating the film layer between the second isolation structure 122 and the second connection line 1414. Setting the second connection line 1414 to be thicker can increase the outer diameter of the via hole to increase the connection area, thereby improving the connection stability. At the same time, it can avoid the situation that the via hole cannot be opposite to the second connection line 1414 due to process deviation, that is, the operation precision requirement can be reduced and the process can be simplified.

[0090] Specifically, the second connection line 1414 extends in the column direction, so that the second connection line 1414 can be a straight line and set shorter while ensuring connection with each first connection line 1413, so as to reduce the area of ​​the second connection line 1414 and reduce the probability of the second connection line 1414 peeling off after contacting the underlying film layer.

[0091] Specifically, the shielding sub-portion 1411 is distributed in the same manner as the first electrode 131. Therefore, the shielding sub-portion 1411 can be prepared while the first electrode 131 is prepared, thus simplifying the preparation process.

[0092] In a possible implementation, Figure 6 As shown, the first layer 141 is in a mesh shape, including a plurality of openings 1435 distributed in an array, and the orthographic projections of the second openings 1221 and the openings 1435 on the substrate 11 do not overlap.

[0093] In the above embodiment, the openings 1435 between adjacent rows are arranged oppositely along the column direction, and a flat area is formed between adjacent rows, so that the subsequent film layer is easy to form a uniform convex portion in the area opposite to the adjacent rows. In the row, since there is material of the first layer 141 between the adjacent openings 1435, a convex portion is easy to form at the position opposite to the openings 1435 in the row, and a concave portion is easy to form at the position opposite to the openings 1435, so that the subsequent film layer with strong fluidity (such as the second encapsulation layer 17 located on the first encapsulation layer) can flow along the row direction. This design of the first layer 141 is more conducive to the leveling of the subsequent film layer, so as to provide a flat surface for the touch wiring 151, improve the yield of the touch wiring 151, and prevent the occurrence of breakage. At the same time, the openings 1435 are arranged in the first layer 141 to improve the air permeability, prevent the film layer below the first layer 141 from bulging and causing the first layer 141 to peel off from the film layer below, which is conducive to improving the preparation yield of the first layer 141.

[0094] In the above embodiment, the orthographic projections of the second opening 1221 and the opening portion 1435 on the substrate 11 do not overlap, so that the second opening 1221 is opposite to the position where the material is in the first layer 141, so that the second opening 1221 is shielded by the position where the material is in the first layer 141.

[0095] In a feasible implementation, a touch layer 15 is further included, the touch layer 15 is disposed on the side of the first encapsulation layer 16 away from the substrate 11, and includes a touch line 151 located in the non-display area NA1, and the orthographic projection of the second isolation structure 122 and the shielding layer 14 on the substrate 11 forms a projection area, and the orthographic projection of the touch line 151 on the substrate 11 is located in the projection area. Thus, the second isolation structure 122 and the shielding layer 14 can achieve a good shielding effect on the touch line 151 and the signal line in the substrate 11.

[0096] In a feasible implementation, as Figure 3 and Figure 4 shown, in the orthographic projection of the touch trace 15 away from the display area AA on the substrate 11 in the touch layer 15, the minimum distance D between the edge away from the display area AA and the edge of the projection area is greater than 30 microns.

[0097] In the above implementation, the projection area is maintained to cover the touch trace 15 and expand more than 30 microns beyond the outer edge of the touch trace 15 to ensure the shielding effect and improve the shielding failure caused by process deviation.

[0098] In a feasible implementation, as Figure 3 and Figure 4 shown, the display panel 1 further includes a light-emitting material layer 1320 located between the first encapsulation layer 16 and the substrate 11. The light-emitting material layer 1320 includes a first part 1321 located in the second opening 1221 and a second part 1322 located on the side of the second isolation structure 122 away from the substrate 11. The orthographic projection of the second encapsulation part 162 on the substrate 11 simultaneously covers the orthographic projections of the first part 1321 and the second part 1322 on the array substrate 11.

[0099] In the above implementation, the second part 1322 in the light-emitting material layer 1320 is formed on the side of the second isolation structure 122 away from the substrate 11, which helps to make the second encapsulation part 162 continuous on the side of the second isolation structure 122 away from the substrate 11, thereby encapsulating and protecting the second isolation structure 122, reducing the probability of exposure of the second isolation structure 122, and preventing the second isolation structure 122 from being eroded by water vapor after exposure and causing shielding failure.

[0100] In the above embodiment, the light-emitting material layer 1320 can be prepared in the same layer as the light-emitting functional layer 132, thereby simplifying the preparation process, and the present application does not make any special limitation on this. Specifically, in the display panel 1 having the isolation structure 12, the light-emitting unit 13 of each color can be prepared as a whole layer first and then patterned, thereby omitting the use of a mask plate to reduce costs. Light-emitting units 13 of different colors are prepared in different orders. In the preparation process of patterning the light-emitting unit 13 prepared later, the isolation structure 12 can be used for isolation, thereby improving the yield of the patterning process and reducing the impact of patterning on the yield of the light-emitting unit 13. In the process of preparing the last color light-emitting unit 13, the part of the material layer of the light-emitting functional layer 132, the second electrode 133 and the first encapsulation layer 16 located in the non-display area NA1 for forming the light-emitting functional layer 132, the second electrode 133 and the first encapsulation layer 16 of the light-emitting unit 13 of this color can be retained, and the part of the material layer of the light-emitting functional layer 132, the second electrode 133 and the first encapsulation layer 16 located in the non-display area NA1 is not etched, so that the light-emitting material layer 1320, the second layer 142 and the second encapsulation part 162 can be formed in the non-display area NA1, and the continuity of the second encapsulation part 162 is ensured, thereby improving the encapsulation effect of the second encapsulation part and improving the shielding reliability.

[0101] In a feasible embodiment, a second electrode material layer is further provided between the light-emitting material layer 1320 and the first packaging layer 16. The second electrode material layer can be prepared in the same layer as the second electrode 133 to simplify the preparation process. In the preparation process of the last color light-emitting unit 13, in the process of preparing the second electrode 133, a planar second electrode material layer arranged on the entire surface can be first formed, and the portion of the second electrode material layer located in the display area AA is separated by the isolation structure 12 to form the second electrode 133, and the portion of the second electrode material layer located in the non-display area NA1 can be retained, thereby omitting the removal process of the portion to retain the second electrode material layer located in the non-display area NA1. When the portion of the second electrode material layer located in the second isolation structure 122 away from the substrate 11 is retained, the continuity of the portion of the second packaging portion 162 located on the side of the second isolation structure 122 away from the substrate 11 can be improved, so as to improve the flatness of the subsequent film layer.

[0102] In a feasible embodiment, at least part of the second electrode material layer is electrically connected to the isolation structure 12 and reused as a shielding layer 14; in particular, the part of the second electrode material layer located within the second opening 1221 can shield the second opening 1221 area, and the part between adjacent second openings 1221 is shielded by the second isolation structure 122, thereby achieving a more closed shielding effect.

[0103] In a possible implementation, Figure 3 and Figure 4As shown, the display panel 1 further includes a dam area NA2, the dam area NA2 is located on the side of the non-display area NA1 away from the display area AA, and the second encapsulation part 162 also extends from the non-display area NA1 to the dam area NA2.

[0104] In the above embodiment, by forming the dam area NA2, the second encapsulation layer 17 (organic material layer) can be effectively blocked. Since the material of the second encapsulation layer 17 includes organic materials and the organic materials have strong fluidity, blocking it with the dam 20 can improve its leveling effect and prevent overflow. The second encapsulation part 162 extends from the non-display area NA1 to the dam area NA2, which can increase the coverage range of the second encapsulation layer 17 to achieve a good encapsulation effect on the underlying shielding layer 14 and the second isolation structure 122, and improve the problem of the shielding effect degradation after the encapsulation failure of the shielding layer 14 and the second isolation structure 122.

[0105] In a feasible embodiment, as Figure 3 and Figure 4 shown, the display panel 1 further includes a second encapsulation layer 17, formed on the side of the first encapsulation layer 16 away from the substrate 11. The second encapsulation layer 17 includes a part located in the display area AA and a part located in the non-display area NA1.

[0106] In the above embodiment, the second encapsulation layer 17 includes a part located in the non-display area NA1, thereby improving the encapsulation reliability of the non-display area NA1. At the same time, since the second encapsulation part 162 of the first encapsulation layer 16 is a continuous film layer in the non-display area NA1, it helps to achieve the planarization of the second encapsulation layer 17, improve the preparation yield of the touch layer 15, and reduce the risk of the touch trace 151 breaking.

[0107] Specifically, at least part of the second encapsulation layer 17 fills the gap between adjacent first encapsulation parts 161 and contacts the surface of the first isolation structure 121 away from the substrate 11.

[0108] In the above embodiment, the first encapsulation parts 161 are independent of each other and form a gap on the side of the first isolation structure 121 away from the substrate 11 to achieve the spaced arrangement of different first encapsulation parts 161, thereby reducing the mutual interference between adjacent first encapsulation parts 161. At least part of the second encapsulation layer 17 fills the gap between adjacent first encapsulation parts 161. On the one hand, the second encapsulation layer 17 can assist in encapsulating between adjacent first encapsulation parts 161 to reduce the risk of water and oxygen entering the coverage range of the first encapsulation part 161 through the gap between adjacent first encapsulation parts 161. On the other hand, the second encapsulation part 162 can fill the gap position between adjacent first encapsulation parts 161, so that the flatness of the thick film layer is better, and the problem that the subsequent film layer is prone to break at the position opposite to the gap is improved.

[0109] In the above embodiment, the material of the second encapsulation layer 17 includes organic material; the organic material has strong fluidity, so as to provide a flat surface for the preparation of subsequent film layers, especially the touch layer 15 .

[0110] In the above embodiment, the material of the first encapsulation layer 16 includes an inorganic material; the inorganic material has a strong ability to isolate water and oxygen, and can achieve a good encapsulation effect.

[0111] In a possible implementation, Figure 3 and Figure 4 As shown, a third encapsulation layer 18 is further included. The third encapsulation layer 18 is located on the side of the second encapsulation layer 17 away from the substrate 11 and extends from the display area AA to the non-display area NA1 and the dam area NA2. The material of the third encapsulation layer 18 includes an inorganic material.

[0112] In the above embodiment, the third encapsulation layer 18 includes an inorganic material, which can further improve the encapsulation effect of the display panel 1. The third encapsulation layer 18 extends from the display area AA to the non-display area NA1 and the dam area NA2, which can improve the encapsulation yield of the non-display area NA1, isolate the shielding layer 14 and the second isolation structure 122 from water and oxygen, and ensure the shielding effect of the shielding layer 14 and the second isolation structure 122.

[0113] Specifically, the second encapsulation layer 17 and the third encapsulation layer 18 are both continuous film layers in the display panel 1 , that is, the parts located in the display area AA and the non-display area NA1 are connected as one and are prepared in the entire surface.

[0114] In a possible implementation, Figure 3 and Figure 4 As shown, the isolation structure 12 includes a first isolation portion 123 and a second isolation portion 124 , the second isolation portion 124 is located on a side of the first isolation portion 123 away from the substrate 11 , and the orthographic projection of the second isolation portion 124 on the substrate 11 covers the orthographic projection of the first isolation portion 123 on the substrate 11 .

[0115] In the above embodiment, the first isolation structure 121 and the second isolation structure 122 of the isolation structure 12 may include a first isolation portion 123 and a second isolation portion 124 .

[0116] In the above embodiment, a step portion is formed between the first isolation portion 123 and the second isolation portion 124, which can be used to isolate the light-emitting functional layer 132 and the second electrode 133 in the display area AA, so as to realize the independence of the light-emitting functional layers 132 in adjacent light-emitting units 13, and the independence of the second electrodes 133 in adjacent light-emitting units 13. The light-emitting material layer 1320 and the shielding layer 14 (specifically, the second layer 142 of the shielding layer 14) can be isolated in the non-display area NA1.

[0117] In the above embodiments, the second electrodes 133 are independent of each other, so it is not easy to supply power to each second electrode 133. At least some of the second electrodes 133 are electrically connected through the first isolation structure 121 of the isolation structure 12 and then supplied with power synchronously, so as to realize the synchronous power supply to each second electrode 133, simplifying the number of power supply lines and the manufacturing process. At the same time, since the material of the second electrode 133 is often selected as a magnesium-silver alloy, and the material of the isolation structure 12 includes aluminum, which has a smaller resistance than the magnesium-silver alloy, the connection method of the isolation structure 12 and the second electrode 133 has a lower resistance than the traditional second electrode 133 with a whole surface, which can reduce the power consumption of the display panel 1, and thus can reduce the difference caused by the attenuation (IR-DROP) during the signal transmission between the near driving end and the far driving end due to the large resistance, which helps to improve the uniformity of the panel display.

[0118] In the above embodiments, the shielding layer 14 includes a second layer 142. When the second layer 142 of the shielding layer 14 is arranged on the same layer as the second electrode 133, the second layer 142 of the shielding layer 14 is partitioned by the second isolation structure 122 to form a first region 1421 located in the second opening 1221 and a second region 1422 located on the side of the second isolation structure 122 away from the substrate 11. The electrical connection of the second isolation structure 122 and the first region 1421 can realize the electrical connection of multiple first regions 1421, so as to facilitate the synchronous power supply of the second isolation structure 122 and the first region 1421 to form a closed film layer and realize the shielding function.

[0119] The present application also provides a manufacturing method of the display panel 1, as Figure 7 shown, including:

[0120] S100, providing a substrate 11.

[0121] S200, forming an isolation structure 12 on one side of the substrate 11. The isolation structure 12 includes a first isolation structure 121 and a second isolation structure 122. The first isolation structure 121 is located in the display area AA and encloses a first opening 1211, and the second isolation structure 122 is located in the non-display area NA1 and encloses a second opening 1221.

[0122] S300, forming a light-emitting unit 13 in the first opening 1211.

[0123] S400, forming a first encapsulation layer 16. The first encapsulation layer 16 includes a first encapsulation part 161 located in the display area AA and a second encapsulation part 162 located in the non-display area NA1. The first encapsulation part 161 is located on the side of the light-emitting unit 13 away from the substrate 11, and the orthographic projection of the second encapsulation part 162 on the substrate 11 covers the orthographic projection of the second isolation structure 122 on the substrate 11.

[0124] In the display panel 1 prepared by the above-described embodiment, the first encapsulation layer 16 includes a first encapsulation portion 161 located in the display area AA and a second encapsulation portion 162 located in the non-display area NA1. The first encapsulation portion 161 is located on the side of the light-emitting unit 13 away from the substrate 11 and is used to encapsulate the light-emitting unit 13, thereby improving the yield of the light-emitting unit 13. The positive projection of the second encapsulation portion 162 on the substrate 11 covers the positive projection of the second isolation structure 122 on the substrate 11. That is, the second encapsulation portion 162 is a continuous film layer disposed on the side of the second isolation structure 122 away from the substrate 11. The second encapsulation portion 162 is used to encapsulate the second isolation structure 122 to facilitate the leveling of subsequent film layers, thereby improving the preparation yield of subsequent film layers. At the same time, the second isolation structure 122 can be encapsulated to improve the yield of the second isolation structure 122 and reduce the probability of damage to the second isolation structure 122, thereby making the shielding reliability better.

[0125] In the above-described embodiment, the steps of forming the light-emitting unit 13 and the first encapsulation layer 16 in the first opening 1211 include:

[0126] Light-emitting units 13 of multiple colors are successively formed in different first openings 1211, specifically including:

[0127] The first opening 1211 includes a first preset opening, a second preset opening, and a third preset opening;

[0128] First, a light-emitting unit 13 having a first color is prepared, specifically including: first, a light-emitting functional material layer having the first color is formed over the entire surface, and a second electrode material layer and a first encapsulation material layer are prepared. Then, the portions of the light-emitting functional material layer having the first color, the second electrode material layer, and the first encapsulation material layer that are opposite to the second preset opening, the third preset opening, and the non-display area NA1 are synchronously removed, and only the portions opposite to the first preset opening are retained to form a light-emitting unit 13 having the first color and a first encapsulation portion 161 disposed opposite to the light-emitting unit 13 having the first color.

[0129] Then, a light-emitting unit 13 having a second color is prepared in the same manner. Specifically, a light-emitting functional material layer having the second color is first formed over the entire surface, and a second electrode material layer and a first encapsulation material layer are prepared. Then, the portions of the light-emitting functional material layer having the second color, the second electrode material layer, and the first encapsulation material layer that are opposite to the first preset opening, the third preset opening, and the non-display area NA1 are synchronously removed, and only the portions opposite to the second preset opening are retained to form a light-emitting unit 13 having the second color and a first encapsulation portion 161 located above the light-emitting unit 13 having the second color.

[0130] Finally, a light-emitting unit 13 with a third color is fabricated. Specifically, it includes: first, forming a light-emitting functional material layer with the third color over the entire surface, and disposing a second electrode material layer and a first encapsulation material layer over the entire surface, and simultaneously removing the portions of the light-emitting functional material layer with the third color, the second electrode material layer, and the first encapsulation material layer that are opposite to the first preset opening and the second preset opening, and retaining the portions opposite to the third preset opening and the non-display area NA1, so as to form a light-emitting unit 13 with the third color, a first encapsulation portion 161 above the light-emitting unit 13 with the third color, and a second encapsulation portion 162 in the non-display area NA1.

[0131] The present application also provides a display device 2, as Figure 8 shown, including any one of the display panels 1 provided in the above embodiments of the present application. In this display device 2, the film layer flatness above the second isolation structure 122 in the non-display area NA1 is relatively good, so that the fabrication yield of subsequent film layers can be improved, and further the yield of the display device 2 is improved.

[0132] This display device 2 can be a mobile terminal such as a mobile phone or a laptop computer, or a fixed terminal such as a television or a computer monitor, or can also be a wearable device such as a watch, etc., and the present application does not make special limitations.

[0133] According to the embodiments of the present application as described above, these embodiments do not describe all the details in detail, nor do they limit the invention to only the specific embodiments. Obviously, many modifications and variations can be made according to the above description. The present specification selects and specifically describes these embodiments to better explain the principle and practical application of the present application, so that those skilled in the art can make good use of the present application and its modifications based on the present application. The present application is only limited by the claims and their full scope and equivalents.

Claims

1. A display panel, It is characterized in that The display panel comprises a display area and a non-display area disposed around at least a portion of the display area; the display panel comprises: substrate; An isolation structure, formed on one side of the substrate, comprising a first isolation structure and a second isolation structure connected to each other, wherein the first isolation structure is located in the display area and encloses a first opening, and the second isolation structure is located in the non-display area; A light-emitting unit, formed on one side of the substrate and located at the first opening, the light-emitting unit comprising a first electrode, a light-emitting functional layer, and a second electrode stacked in a direction away from the substrate; The first encapsulation layer includes a first encapsulation portion located in the display area and a second encapsulation portion located in the non-display area, the first encapsulation portion is located on the side of the light-emitting unit away from the substrate, at least a portion of the second encapsulation portion is located on the side of the second isolation structure away from the substrate, and the orthographic projection of the second encapsulation portion on the substrate covers the orthographic projection of the second isolation structure on the substrate.

2. The display panel according to claim 1, It is characterized in that The second isolation structure encloses to form a second opening; Preferably, the first encapsulation portion covers a side of the light emitting unit away from the substrate and a side wall of the first isolation structure facing the first opening, and extends to a side of the first isolation structure away from the substrate, and adjacent first encapsulation portions are spaced apart on a side of the first isolation structure away from the substrate; Preferably, the second packaging portion also covers the side wall of the second isolation structure facing the second opening and the second opening; Preferably, the second isolation structure encloses and forms a plurality of the second openings, and the second packaging portion covers the plurality of the second openings simultaneously; Preferably, the second packaging part and at least a portion of the first packaging part are manufactured using the same process.

3. The display panel according to claim 2, It is characterized in that Also includes a shielding layer, the shielding layer is located between the second packaging part and the substrate, and is electrically connected to the isolation structure; Preferably, the orthographic projection of the shielding layer on the substrate covers the orthographic projection of the second opening on the substrate; Preferably, the shielding layer includes a first layer, the first layer is arranged at the same layer as the first electrode and is electrically connected to the second isolation structure; and / or, The shielding layer includes a second layer, the second layer is arranged on the same layer as the second electrode, the second layer includes a first area located in the second opening and a second area located on a side of the second isolation structure away from the substrate, and the first area is electrically connected to the second isolation structure.

4. The display panel according to claim 3, It is characterized in that The first layer comprises a plurality of shielding sub-parts, the shielding sub-parts are arranged at intervals, and the orthographic projection of the second opening on the substrate is located within the orthographic projection of the shielding sub-part on the substrate; Preferably, the display panel further includes a pixel definition layer located between the first layer and the isolation structure. The pixel definition layer includes an opening for exposing the shielding portion, and the second isolation structure is electrically connected to the shielding portion through a via hole penetrating the pixel definition layer. Preferably, the orthographic projection of the opening on the substrate is located within the orthographic projection of the second opening on the substrate. Preferably, adjacent shielding portions are electrically connected through a connecting line. Preferably, the connecting line includes a first connecting line and a second connecting line. The shielding portions are arranged in rows and columns. The shielding portions adjacent in the row direction are connected through the first connecting line. The shielding portions at one end away from the display area in different rows are connected to the same second connecting line through the first connecting line. The width of the second connecting line is greater than the width of the first connecting line, and the second isolation structure is electrically connected to the second connecting line. Preferably, the second connecting line extends in the column direction. Preferably, the distribution pattern of the shielding portions is the same as that of the first electrodes.

5. The display panel according to claim 3, wherein, the first layer is in a mesh shape and includes a plurality of apertures distributed in an array. The orthographic projections of the second opening and the apertures on the substrate do not overlap.

6. The display panel according to claim 2, wherein, it further includes a touch control layer disposed on a side of the first encapsulation layer away from the substrate and including touch control traces located in the non-display area. The orthographic projections of the second isolation structure and the shielding layer on the substrate form a projection area, and the orthographic projection of the touch control traces on the substrate is located within the projection area. Preferably, in the orthographic projection of the touch control traces in the touch control layer away from the display area on the substrate, the minimum distance between the edge away from the display area and the edge of the projection area is greater than 30 micrometers.

7. The display panel according to claim 2, wherein, the display panel further includes a light-emitting material layer located between the first encapsulation layer and the substrate. The light-emitting material layer includes a first portion located within the second opening and a second portion located on a side of the second isolation structure away from the substrate. The orthographic projection of the second encapsulation portion on the substrate simultaneously covers the orthographic projections of the first portion and the second portion on the array substrate. Preferably, a second electrode material layer is further provided between the light-emitting material layer and the first encapsulation layer. Preferably, at least a part of the second electrode material layer is electrically connected to the isolation structure and reused as a shielding layer. Preferably, the light-emitting material layer and the light-emitting functional layer are provided on the same layer.

8. The display panel according to claim 2, wherein, the display panel further includes a dam area located on a side of the non-display area away from the display area, and the second encapsulation portion further extends from the non-display area to the dam area. Preferably, the display panel further includes a second encapsulation layer formed on a side of the first encapsulation layer away from the substrate. The second encapsulation layer includes a portion located in the display area and a portion located in the non-display area. Preferably, at least a part of the second encapsulation layer fills a gap between adjacent first encapsulation parts and contacts a surface of the first isolation structure away from the substrate. Preferably, the material of the second encapsulation layer includes an organic material. Preferably, the material of the first encapsulation layer includes an inorganic material. Preferably, a third encapsulation layer is further included. The third encapsulation layer is located on a side of the second encapsulation layer away from the substrate and extends from the display area to the non-display area and the dam area. The material of the third encapsulation layer includes an inorganic material.

9. The display panel according to claim 1, wherein, the isolation structure includes a first isolation part and a second isolation part. The second isolation part is located on a side of the first isolation part away from the substrate, and a positive projection of the second isolation part on the substrate covers a positive projection of the first isolation part on the substrate. Preferably, the second electrode is electrically connected to the isolation structure.

10. A method for manufacturing a display panel, wherein, it includes: providing a substrate; forming an isolation structure on one side of the substrate. The isolation structure includes a first isolation structure and a second isolation structure. The first isolation structure is located in the display area and encloses a first opening. The second isolation structure is located in the non-display area and encloses a second opening; forming a light-emitting unit in the first opening; forming a first encapsulation layer. The first encapsulation layer includes a first encapsulation part located in the display area and a second encapsulation part located in the non-display area. The first encapsulation part is located on a side of the light-emitting unit away from the substrate, and a positive projection of the second encapsulation part on the substrate covers a positive projection of the second isolation structure on the substrate.

11. A display device, wherein, it includes the display panel according to any one of claims 1-9.

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