Display panel, manufacturing method thereof and display device

Abstract

The invention discloses a display panel, a manufacturing method thereof and a display device. The manufacturing method comprises the following steps: forming a first organic layer on a substrate; wherein the first organic layer covers the pixel region and the light-transmitting region, and the first organic layer is provided with a via hole in the pixel region for connecting the bottom electrode; forming a pixel definition layer material arranged on the whole surface of the bottom electrode and the first organic layer; removing a pixel definition layer material on the bottom electrode to form an opening region, and reserving the pixel definition layer in a non-opening region and a light-transmitting region; forming a suspension structure on the pixel definition layer at the position of the non-opening area; forming a light-emitting unit in the opening area by using the suspension structure; removing the pixel definition layer and the first organic layer in the light-transmitting area; according to the invention, the first organic layer of the light-transmitting region is reserved, so that a larger flat space is obtained to form the overhanging structure under the condition that the areas of the opening region and the non-opening region are not changed, the stability of the overhanging structure is improved, and the yield of the light-emitting unit is improved.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and in particular, to a display panel, a manufacturing method thereof, and a display device. Background Art

[0002] With the continuous development of OLED (Organic Light-Emitting Diode) display technology, the application of OLED in displays such as smart phones, tablets, computers, and TVs is becoming more and more widespread. OLED displays have the advantages of being thin and light, having high contrast, fast response, wide viewing angles, high brightness, and full color. With the development of technology, the screen-to-body ratio of display panels is getting higher and higher, and the concept of a full-screen display has gradually emerged, that is, the screen-to-body ratio reaches 100%. Among them, the most critical technology for achieving a full-screen display is to set the camera under the screen, and a transmissive display area with relatively high light transmittance is set on the corresponding display panel. Since a pixel area for display is also provided in the transmissive display area, the transmissive display area can also display a normal picture.

[0003] However, when forming the light-emitting units in the transmissive display area by current maskless evaporation, usually due to space limitations, the area of the pixel definition layer in the transmissive display area is limited, and there is a problem that a standing and hanging structure cannot be used for evaporating the light-emitting units. Summary of the Invention

[0004] The purpose of the present application is to provide a display panel, a manufacturing method thereof, and a display device. By retaining the first organic layer in the light-transmitting area, a larger flat space can be obtained to form a hanging structure without changing the areas of the opening area and the non-opening area, thereby improving the stability of the hanging structure and further improving the yield of the light-emitting units.

[0005] The present application discloses a manufacturing method of a display panel. The display panel includes a normal display area and a transmissive display area. An optical element is provided below the display panel corresponding to the transmissive display area. The transmissive display area includes a pixel area and a light-transmitting area. The manufacturing method includes the steps of:

[0006] Providing a substrate;

[0007] Forming a first organic layer on the substrate; wherein, the first organic layer covers the pixel area and the light-transmitting area, and a via is provided in the pixel area of the first organic layer for connecting to the bottom electrode;

[0008] Patterning and forming a bottom electrode on the first organic layer;

[0009] Form a pixel definition layer material that is disposed over the entire surface on the bottom electrode and the first organic layer; Remove the pixel definition layer material on the bottom electrode to form an opening region, and retain the pixel definition layer in the non-opening region and the light-transmitting region;

[0010] Form a hanging structure on the pixel definition layer at the non-opening region position;

[0011] Utilize the hanging structure to form a light-emitting functional layer and a top electrode in the opening region to form a light-emitting unit;

[0012] Remove the pixel definition layer and the first organic layer in the light-transmitting region;

[0013] Wherein, the pixel region includes an opening region and a non-opening region, and the light-emitting unit includes a bottom electrode, a light-emitting functional layer, and a top electrode that are sequentially disposed from the substrate.

[0014] Optionally, in the step of forming the first organic layer on the substrate, it includes:

[0015] Form a pixel driving layer; wherein, a plurality of pixel active switches are provided in the pixel driving layer;

[0016] Deposit a first organic layer that covers the entire surface on the pixel active switch array layer, and the first organic layer extends from the pixel region to the light-transmitting region;

[0017] Through a patterning process, make the first organic layer form vias in the region where the pixel active switches are located;

[0018] In the step of patterning and forming the bottom electrode on the first organic layer, it includes:

[0019] Deposit a bottom electrode material that covers the entire surface on the first organic layer, and through a patterning process, retain the bottom electrode on the opening region in the pixel region, and the bottom electrode is connected to the pixel active switch through the via;

[0020] In the step of forming a hanging structure on the pixel definition layer at the non-opening region position, it includes:

[0021] Sequentially form a conductive part material and a partition part material that cover the entire surface on the pixel definition layer;

[0022] Pattern the partition part material to form a partition part;

[0023] Use the partition part as a protective layer to etch the conductive part material to form a hanging structure in which the radial width of the conductive part is smaller than the radial width of the partition part.

[0024] Optionally, in the step of making the first organic layer form vias in the region where the pixel active switches are located through a patterning process, it includes:

[0025] Etch the first organic layer using a semi-transparent mask so that the first organic layer forms a first organic portion with a first thickness in the opening region, a second organic portion with a second thickness in the non-opening region and the light-transmitting region, and form vias in the region of the first organic portion corresponding to the pixel active switch; wherein the first thickness is greater than the second thickness;

[0026] The step of patterning and forming the bottom electrode on the first organic layer includes:

[0027] Deposit a whole-surface bottom electrode material on the first organic layer, and retain the bottom electrode on the first organic portion through a patterning process. The bottom electrode is connected to the pixel active switch through the via;

[0028] The step of patterning the partition portion material to form the partition portion further includes:

[0029] Retain the partition portion material on the second organic portion in the non-opening region to form a partition portion;

[0030] Wherein, in the orthographic projection of the substrate, the overhanging structure overlaps with the second organic portion.

[0031] Optionally, the step of forming a via in the region of the pixel active switch by etching the first organic layer through a patterning process further includes:

[0032] Etch the first organic layer using a semi-transparent mask so that the first organic layer forms a first groove in the non-opening region; the thickness of the first organic layer in the first groove region is less than the thickness of the first organic layer in the non-first groove region;

[0033] The step of forming a whole-surface pixel definition layer material on the bottom electrode and the first organic layer; removing the pixel definition layer material on the bottom electrode to form an opening region, and retaining the pixel definition layer in the non-opening region and the light-transmitting region further includes;

[0034] At the position of the first groove, the pixel definition layer covers the first groove to form a second groove;

[0035] The step of patterning the partition portion material to form the partition portion further includes:

[0036] Retain the partition portion material in the region of the second groove in the non-opening region to form a partition portion;

[0037] Wherein, in the orthographic projection of the substrate, the overhanging structure overlaps with the second groove.

[0038] Optionally, the non-opening area includes a first non-opening area and a second non-opening area. The first non-opening area is disposed between two adjacent opening areas, and the second non-opening area is disposed between the opening area and the light-transmitting area. The hanging structure includes a first hanging structure and a second hanging structure.

[0039] The step of forming the hanging structure on the pixel definition layer at the non-opening area position includes:

[0040] Forming a second hanging structure in the first non-opening area and forming a first hanging structure in the second non-opening area;

[0041] Wherein, the second organic part or the first groove is only disposed in the second non-opening area;

[0042] The surface of the first hanging structure on the side away from the substrate is higher than the surface of the second hanging structure on the side away from the substrate.

[0043] Optionally, before the step of forming the first organic layer on the substrate, it further includes:

[0044] Forming a light-shielding layer on the substrate corresponding to the transmissive display area;

[0045] Removing the light-shielding layer in the light-transmitting area;

[0046] The step of removing the pixel definition layer and the first organic layer in the light-transmitting area includes:

[0047] Between the non-opening area and the light-transmitting area, etching the pixel definition layer and the first organic layer according to the boundary of the light-shielding layer, so that part of the pixel definition layer and the first organic layer on the light-shielding layer are removed.

[0048] The present application also discloses a display panel manufactured by the manufacturing method of the display panel as described above. The display panel includes a normal display area and a transmissive display area. An optical element is disposed below the transmissive display area of the display panel. The transmissive display area includes a pixel area and a light-transmissive area. The pixel area includes an opening area and a non-opening area. The display panel further includes a substrate, a first organic layer, a pixel definition layer, a light-emitting unit, and a hanging structure. The first organic layer is disposed on the substrate and located in the pixel area. The pixel definition layer is disposed on the first organic layer and located in the non-opening area. The light-emitting units are disposed on the first organic layer, and adjacent two light-emitting units are separated by the pixel definition layer. And the hanging structure is disposed on the pixel definition layer. Wherein, the light-emitting unit includes a bottom electrode, a light-emitting functional layer, and a top electrode sequentially disposed from the substrate. The first organic layer is provided with vias corresponding to the pixel area, and the bottom electrode overlaps with the vias in the orthographic projection on the substrate. Between the non-opening area and the light-transmissive area, the section plane of the pixel definition layer and the section plane of the first organic layer are at the same position.

[0049] Optionally, the display panel further includes a pixel driving layer. The pixel driving layer is disposed between the substrate and the first organic layer, and the pixel driving layer is provided with a plurality of pixel active switches.

[0050] In each of the opening areas, the bottom electrode is connected to the pixel active switch through the via.

[0051] The first organic layer includes a first organic part and a second organic part. The first organic part is disposed in the opening area, and the second organic part is disposed in the non-opening area and the light-transmissive area. The thickness of the first organic part is greater than that of the second organic part.

[0052] In the orthographic projection on the substrate, the hanging structure overlaps with the second organic part.

[0053] Optionally, the non-opening area includes a first non-opening area and a second non-opening area. The first non-opening area is disposed between two adjacent opening areas, and the second non-opening area is disposed between the opening area and the light-transmissive area. The hanging structure includes a first hanging structure and a second hanging structure.

[0054] The first hanging structure is disposed in the second non-opening area, and the second hanging structure is disposed in the first non-opening area. Wherein, the second organic part is only disposed in the second non-opening area.

[0055] The surface of the first hanging structure away from the substrate is higher than the surface of the second hanging structure away from the substrate.

[0056] The present application also discloses a display device, including a driving circuit and the above-mentioned display panel, wherein the driving circuit is configured to drive the display panel to display.

[0057] Before forming the overhanging structure, the present application does not remove the first organic layer and the pixel definition layer in the non-opening area and the light-transmitting area, so that when the overhanging structure is formed, the pixel definition layer in the non-opening area is relatively flat, and there will be no problem that the first organic layer is removed at the boundary position between the non-opening area and the light-transmitting area to form a film layer step, resulting in a film layer step or slope in the area where the overhanging structure is about to be formed after the pixel definition layer is formed, and ultimately the overhanging structure cannot stand, thus affecting the manufacturing process of the light-emitting unit. In this embodiment, by retaining the film layers of the first organic layer and the pixel definition layer at the boundary between the non-opening area and the light-transmitting area and its extended area before forming the overhanging structure and not removing them in the patterning process, when the overhanging structure is formed, the pixel definition layer and the first organic layer below are not patterned at the boundary position between the non-opening area and the light-transmitting area, so that the area where the overhanging structure stands is increased, and thus a larger flat space is obtained to form the overhanging structure without changing the areas of the opening area and the non-opening area, thereby improving the stability of the overhanging structure and further improving the yield of the light-emitting unit. Description of the Drawings

[0058] The accompanying drawings included are used to provide a further understanding of the embodiments of the present application, which form a part of the specification, illustrate the embodiments of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts. In the drawings:

[0059] Figure 1 is a schematic diagram of the manufacturing method of the display panel according to the first embodiment of the present application;

[0060] Figure 2 is a schematic diagram of the manufacturing of the display panel according to the first embodiment of the present application;

[0061] Figure 3 is a schematic diagram of the display panel according to the first embodiment of the present application;

[0062] Figure 4 is a schematic diagram of the steps of the manufacturing method of the display panel according to the second embodiment of the present application;

[0063] Figure 5 is a schematic diagram of the display panel according to the second embodiment of the present application;

[0064] Figure 6It is a schematic diagram of the steps of another method for manufacturing a display panel according to the second embodiment of the present application;

[0065] Figure 7 It is a schematic diagram of another display panel according to the second embodiment of the present application;

[0066] Figure 8 It is a top view schematic diagram of the display panel of the present application;

[0067] Figure 9 It is a cross-sectional schematic diagram of the display panel of the present application;

[0068] Figure 10 It is a schematic diagram of the display device of the present application.

[0069] Among them, 100, display panel; 102, transmissive display area; 103, pixel area; 1031, opening area; 1032, non-opening area; 10321, first non-opening area; 10322, second non-opening area; 104, light-transmitting area; 110, substrate; 111, pixel driving layer; 112, pixel active switch; 113, pixel defining layer; 1131, second groove; 120, first organic layer; 1201, via hole; 121, first organic part; 122, second organic part; 123, first groove; 130, light-emitting unit; 131, bottom electrode; 132, light-emitting functional layer; 133, top electrode; 140, hanging structure; 1401, first hanging structure; 1402, second hanging structure; 141, conductive part; 142, partition part; 150, light-shielding layer; 200, display device; 210, driving circuit. Detailed implementation manners

[0070] It should be understood that the terms, specific structures and functional details disclosed here are only for describing specific embodiments and are representative. However, the present application can be specifically implemented in many alternative forms and should not be construed as being limited only to the embodiments described herein.

[0071] In the description of the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating relative importance or implicitly indicating the quantity of the indicated technical features. Thus, unless otherwise specified, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features; the meaning of "a plurality" is two or more. Additionally, terms indicating orientation or positional relationships such as "upper", "lower", "left", "right", "vertical", "horizontal", etc. are described based on the orientation or relative positional relationship shown in the drawings, and are only for facilitating the simplified description of the present application, rather than indicating that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present application. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0072] The present application will be described in detail below with reference to the drawings and optional embodiments.

[0073] Figure 1 is a schematic diagram of a method for manufacturing a display panel according to a first embodiment of the present application, Figure 2 is a schematic diagram of manufacturing a display panel according to a first embodiment of the present application. Refer to Figures 1 to 2 As shown, the present application discloses a method for manufacturing a display panel. The display panel includes a normal display area and a transmissive display area. An optical element is disposed below the display panel corresponding to the transmissive display area. The transmissive display area includes a pixel area and a light-transmissive area. The manufacturing method includes the steps of:

[0074] S10: Provide a substrate;

[0075] S20: Form a first organic layer on the substrate. Wherein, the first organic layer covers the pixel area and the light-transmissive area, and the first organic layer is provided with vias in the pixel area for connecting the bottom electrode;

[0076] S30: Pattern and form a bottom electrode on the first organic layer;

[0077] S40: Form a pixel definition layer material disposed over the entire surface on the bottom electrode and the first organic layer; Remove the pixel definition layer material on the bottom electrode to form an opening area, and retain the pixel definition layer in the non-opening area and the light-transmissive area;

[0078] S50: Form a hanging structure on the pixel definition layer at the non-opening area position;

[0079] S60: Use the hanging structure to form a light-emitting functional layer and a top electrode in the opening area to form a light-emitting unit;

[0080] S70: Remove the pixel definition layer and the first organic layer in the light-transmitting region;

[0081] Among them, the pixel region includes an opening region and a non-opening region, and the light-emitting unit includes a bottom electrode, a light-emitting functional layer, and a top electrode sequentially arranged from the substrate.

[0082] In this application, before forming the overhanging structure 140, the first organic layer 120 and the pixel definition layer 113 in the non-opening region 1032 and the light-transmitting region 104 are not removed, so that when the overhanging structure 140 is formed, the pixel definition layer 113 in the non-opening region 1032 is relatively flat, and there will be no situation where the first organic layer 120 is removed at the boundary position between the non-opening region 1032 and the light-transmitting region 104 to form a film layer step difference, resulting in problems such as film layer step difference or slope in the region where the overhanging structure 140 is about to be formed after the pixel definition layer 113 is formed, and ultimately the overhanging structure 140 cannot stand, thus affecting the manufacturing process of the light-emitting unit 130. In this embodiment, by retaining the film layers of the first organic layer 120 and the pixel definition layer 113 in the region from the non-opening region 1032 to the boundary of the light-transmitting region 104 and its extended region before the overhanging structure 140 is formed and not removing them in the patterning process, when the overhanging structure 140 is formed, the underlying pixel definition layer 113 and the first organic layer 120 are not patterned at the boundary position between the non-opening region 1032 and the light-transmitting region 104, so that the area where the overhanging structure 140 stands is increased, and thus without changing the areas of the opening region 1031 and the non-opening region 1032, a larger flat space is obtained to form the overhanging structure 140, thereby improving the stability of the overhanging structure 140 and further improving the yield of the light-emitting unit 130.

[0083] Among them, it can be understood that through the above solution, this application can not change the areas of the opening region 1031 and the non-opening region 1032, thereby improving the flatness of the non-opening region 1032. The main reason is that generally when the via hole 1201 is formed in the first organic layer 120, the first organic layer 120 in the light-transmitting region 104 will be etched synchronously, so that the first organic layer 120 in the boundary region between the non-opening region 1032 and the light-transmitting region 104 is etched away, forming a film layer step difference. In the subsequent process of forming the pixel definition layer 113, due to this part of the film layer step difference affecting the pixel definition layer 113, when the pixel definition layer 113 covers this film layer step difference, a larger film layer inclined surface is often formed, resulting in the further reduction of the standing area of the overhanging structure 140, and even insufficient to stand. Moreover, the etching of the first organic layer 120 generally exceeds the light-transmitting region 104 and over-etches into the non-opening region 1032 to some extent, so that a part of the first organic layer 120 under the non-opening region 1032 will also be etched. In this case, the flat area of the pixel definition layer 113 in the non-opening region 1032 is smaller, resulting in the situation where the overhanging structure 140 cannot stand.

[0084] In this embodiment, before forming the overhanging structure 140, by not etching the first organic layer 120 and the pixel definition layer 113, the flatness of the pixel definition layer 113 can be better at the position of the non-opening region 1032, and the overhanging structure 140 formed has stronger blocking ability.

[0085] Among them, the step of S20 further includes:

[0086] S201: Form a pixel driving layer; wherein, a plurality of pixel active switches are provided in the pixel driving layer;

[0087] S202: Deposit a whole-surface first organic layer on the pixel active switch array layer, and the first organic layer extends from the pixel region to the light-transmitting region;

[0088] S203: Through a patterning process, make the first organic layer form vias in the region where the pixel active switches are located.

[0089] In this embodiment, the first organic layer 120 generally serves as a planarization film layer of the pixel driving layer 111, mainly used for planarizing a plurality of devices provided in the pixel driving layer 111. The pixel driving layer 111 is generally formed by laminating multiple metal layers and multiple insulating layers, and generally provides pixel active switches 112 for driving the light-emitting unit 130 to emit light, controls the active switches, scan lines, data lines, etc. In addition to the planarization function, the first organic layer 120 also needs to form vias 1201 between the light-emitting unit 130 and the pixel active switch 112 for conductive wires to connect the two. Therefore, in the manufacturing process of the first organic layer 120, a patterning process has been carried out before forming the pixel definition layer 113. It also further illustrates that the current process forms the pixel definition layer 113 after patterning the first organic layer 120. The main improvement of this embodiment is to retain the original via 1201 etching process of the first organic layer 120, but improve the etched area, so that the first organic layer 120 between the light-transmitting region 104 and the non-opening region 1032 can be retained until after the light-emitting unit 130 is formed, and finally etch the multi-layer film in the light-transmitting region 104.

[0090] The step of S30 includes:

[0091] S301: Deposit a whole-surface bottom electrode material on the first organic layer, and retain the bottom electrode on the opening region in the pixel region through a patterning process. The bottom electrode is connected to the pixel active switch through the via. Among them, the bottom electrode 131 is generally formed on the first organic layer 120, the bottom electrodes 131 in different opening regions 1031 are independently provided respectively, and are connected to different pixel active switches 112. Through the driving of the pixel active switch 112, the light-emitting units 130 at different positions can be controlled separately.

[0092] The steps in S50 include:

[0093] S501: Sequentially form a whole-surface conductive portion material and a partition portion material on the pixel definition layer;

[0094] S502: Pattern the partition portion material to form a partition portion;

[0095] S503: Use the partition portion as a protective layer to etch the conductive portion material, so as to form an overhanging structure in which the radial width of the conductive portion is smaller than the radial width of the partition portion.

[0096] The overhanging structure 140 in this embodiment mainly refers to the overhanging structure 140 provided in the pixel region 103 within the transmissive display region 102. The overhanging structure 140 in the normal display region is generally formed through one process. That is, first deposit a conductive portion 141 material layer and a partition portion 142 material layer on the whole surface in sequence, form the partition portion 142 in different non-opening regions 1032 through a patterning process, and further etch the conductive portion 141 material layer by using the photoresist on the partition portion 142. Due to the side etching phenomenon during the etching process, the conductive portion 141 under the photoresist is over-etched, so that the radial width of the conductive portion 141 is smaller than the radial width of the partition portion 142, thereby forming the overhanging structure 140, which is also called an eaves structure or a conductive partition structure. It has a certain partitioning ability. During the process of forming the light-emitting unit 130, even without using a metal mask, the adjacent light-emitting units 130 can be partitioned through the overhanging structure 140, so as to realize the independent setting of the light-emitting unit 130.

[0097] Figure 3 It is a schematic diagram of a display panel according to the first embodiment of the present application. Refer to Figure 3As shown in the figure, the display panel 100 formed according to the above manufacturing method in the present application. The display panel 100 includes a normal display area and a transmissive display area 102. An optical element is disposed below the display panel 100 corresponding to the transmissive display area 102. The transmissive display area 102 includes a pixel area 103 and a light-transmissive area 104. The pixel area 103 includes an opening area 1031 and a non-opening area 1032. The display panel 100 further includes a substrate 110, a first organic layer 120, a pixel definition layer 113, a light-emitting unit 130, and a hanging structure 140. The first organic layer 120 is disposed on the substrate 110 and is located in the pixel area 103. The pixel definition layer 113 is disposed on the first organic layer 120 and is located in the non-opening area 1032. The light-emitting units 130 are disposed on the first organic layer 120, and adjacent two light-emitting units 130 are separated by the pixel definition layer 113. And the hanging structure 140 is disposed on the pixel definition layer 113. Wherein, the light-emitting unit 130 includes a bottom electrode 131, a light-emitting functional layer 132, and a top electrode 133 sequentially disposed from the substrate 110. The first organic layer 120 is provided with a via hole 1201 corresponding to the pixel area 103, and the bottom electrode 131 overlaps with the via hole 1201 in the orthographic projection on the substrate 110. Between the non-opening area 1032 and the light-transmissive area 104, the cross-section of the pixel definition layer 113 and the cross-section of the first organic layer 120 are in the same position.

[0098] In the present application, at the junction of the non-opening area 1032 and the light-transmissive area 104, after the process of the hanging structure 140 is completed, the pixel definition layer 113 and the first organic layer 120 are etched in sequence, so that the same cross-section is formed on the pixel definition layer 113 and the first organic layer 120. Of course, in another embodiment, the first organic layer 120 and the pixel definition layer 113 in the light-transmissive area 104 may not be removed. In this case, light loss of part of the light in the light-transmissive area 104 will be caused. Generally speaking, in addition to the above-mentioned pixel definition layer 113 and the first organic layer 120, for other film layers formed by the pixel driving layer 111, especially the film layers without patterning process, the film layers in the light-transmissive area 104 can also be removed in this process. On the one hand, it makes the light loss in the light-transmissive area 104 smaller. On the other hand, it makes the cross-sections of each film layer, such as the pixel definition layer 113 and the first organic layer 120, smoother, without an interface height difference, thereby avoiding the destruction of the light path, etc.

[0099] Specifically, the display panel 100 further includes a pixel driving layer 111 disposed between the substrate 110 and the first organic layer 120. The pixel driving layer 111 is provided with a plurality of pixel active switches 112. In each of the opening regions 1031, the bottom electrode 131 is connected to the pixel active switch 112 through the via 1201.

[0100] It is worth mentioning that the insulating layer used in the pixel driving layer is generally an inorganic insulating layer, which causes less loss of light and can be removed or retained in the light-transmitting region. The organic layer generally has a larger thickness, and the loss of light caused by it is also greater than that of the inorganic layer. Therefore, in the light-transmitting region, the organic layer generally needs to be removed to obtain a better light collection accuracy.

[0101] Figure 4 It is a schematic diagram of the steps of the manufacturing method of the display panel 100 according to the second embodiment of the present application. Refer to Figure 4 As shown, on the basis of the above embodiment, this embodiment further improves the first organic layer 120.

[0102] Specifically, the step S20 further includes:

[0103] S211: Form a pixel driving layer; wherein, the pixel driving layer is provided with a plurality of pixel active switches;

[0104] S212: Deposit a whole surface of the first organic layer on the pixel active switch array layer, and the first organic layer extends from the pixel region to the light-transmitting region;

[0105] S213: Etch the first organic layer using a semi-transparent mask, so that the first organic layer forms a first organic part with a first thickness in the opening region, forms a second organic part with a second thickness in the non-opening region and the light-transmitting region, and forms a via in the region corresponding to the pixel active switch in the first organic part. Wherein, the first thickness is greater than the second thickness.

[0106] In this embodiment, when etching a plurality of vias 1201 in the first organic layer 120, a half-tone mask etching is performed on the first organic layer 120. That is, in the direction where the non-opening area 1032 extends toward the light-transmitting area 104, a second organic part 122 with a second thickness is provided, and a first organic part 121 with a first thickness is provided in the opening area 1031. The first organic part 121 and the second organic part 122 are connected to each other, and the connection part between the two can be located in the non-opening area 1032. The width of the first organic part 121 needs to be greater than the width of the bottom electrode 131 to avoid the situation where the end of the bottom electrode 131 cannot be supported during the etching process. Therefore, a first organic part 121 is also provided at the junction between the opening area 1031 and the non-opening area 1032, and a part of the first organic part 121 extends into the non-opening area 1032. In other words, a first organic part 121 is also provided at a position near the opening area 1031 below the pixel definition layer 113, and a second organic part 122 is provided at a position near the light-transmitting area 104. Generally, in this embodiment, the junction between the opening area 1031 and the non-opening area 1032 is based on the end of the pixel definition layer 113, that is, the opening etched in the opening area 1031 by the pixel definition layer 113 is used as the range of the opening area 1031. In addition to being provided in the opening area 1031, the bottom electrode 131, the light-emitting functional layer 132, the top electrode 133, etc. of the light-emitting unit 130 also extend a certain distance into the non-opening area 1032.

[0107] The steps in S30 include:

[0108] S311: Deposit a whole-surface bottom electrode material on the first organic layer, and retain the bottom electrode on the first organic part through a patterning process. The bottom electrode is connected to the pixel active switch through the via.

[0109] The steps in S50 include:

[0110] S511: Sequentially form a whole-surface conductive part material and a partition part material on the pixel definition layer;

[0111] S512: Pattern the partition part material and retain the partition part material on the second organic part in the non-opening area to form a partition part;

[0112] S513: Use the partition part as a protective layer to etch the conductive part material to form an overhanging structure in which the radial width of the conductive part is smaller than the radial width of the partition part.

[0113] Among them, in the orthographic projection of the substrate 110, the overhanging structure 140 overlaps with the second organic part 122. In this embodiment, after the thickness of the second organic part 122 in the non-opening area 1032 is reduced, the film layer height of the pixel definition layer 113 in the second organic part 122 will decrease. Correspondingly, when the overhanging structure 140 is formed, the height of the overhanging structure 140 will be lower, thereby reducing the height difference between the bottom electrode 131 and the overhanging structure 140, improving the yield and luminous efficiency of the manufacturing process of the light-emitting unit 130. The non-opening area 1032 mentioned here mainly refers to the non-opening area 1032 in the pixel area 103, excluding the non-opening area 1032 in the normal display area. In other words, the main improvement point of this application focuses on the pixel area 103 of the transmissive display area 102.

[0114] Figure 5 It is a schematic diagram of the display panel according to the second embodiment of the present application. Refer to Figure 5 As shown, corresponding to the manufacturing method of this embodiment, the present application also discloses a display panel 100. The basic structure of the display panel 100 is the same as that of the above embodiment, except for the improvement of the first organic layer 120.

[0115] The first organic layer 120 includes a first organic part 121 and a second organic part 122. The first organic part 121 is disposed in the opening area 1031, and the second organic part 122 is disposed in the non-opening area 1032 and the light-transmitting area 104. The thickness of the first organic part 121 is greater than the thickness of the second organic part 122; in the orthographic projection of the substrate 110, the overhanging structure 140 overlaps with the second organic part 122.

[0116] In this embodiment, the thickness of the first organic part 121 is greater than the thickness of the second organic part 122. When the film layer surfaces of the first organic part 121 and the second organic part 122 on the side close to the substrate 110 are in the same plane, correspondingly, for the film layer surfaces on the side far from the substrate 110, the film layer surface of the first organic part 121 is higher than the film layer surface of the second organic part 122, that is, a stepped surface is formed between the first organic part 121 and the second organic part 122. In this embodiment, by disposing the overhanging structure 140 on the second organic part 122,

[0117] Continuing from the above, since a portion of the bottom electrode 131 extends a certain length into the non-opening region 1032, the first organic portion 121 in this embodiment also extends a certain length into the non-opening region 1032, causing the first organic portion 121 to slightly protrude beyond the bottom electrode 131, so that the bottom electrode 131 can be supported by the first organic portion 121. It can be understood that generally, there is a certain distance between the overhanging structure 140 and the bottom electrode 131, and the junction of the first organic portion 121 and the second organic portion 122 is set within the distance between the overhanging structure 140 and the bottom electrode 131.

[0118] Specifically, the display panel 100 further includes a pixel driving layer 111, which is disposed between the substrate 110 and the first organic layer 120. The pixel driving layer 111 is provided with a plurality of pixel active switches 112; within each opening region 1031, the bottom electrode 131 is connected to the pixel active switch 112 through the via 1201; the via 1201 is disposed on the first organic portion 121.

[0119] Of course, in another embodiment, it is also possible to consider laying the entire pixel definition layer 113 and then, when forming the pixel opening, performing a half-mask etching on the pixel definition layer 113 at the position of the overhanging structure 140 to form a stepped surface on the pixel definition layer 113, so that the overhanging structure 140 has a flatter film layer. However, since the pixel definition layer 113 in the maskless evaporation technology is generally formed of an inorganic insulating material and has a relatively thin thickness, the effect is not as obvious as that of the first organic layer 120.

[0120] In this embodiment, by forming the first organic portion 121 and the second organic portion 122 with different thicknesses on the first organic layer 120, on the one hand, it is by means of the process of etching the via 1201 of the first organic layer 120, so that two portions with different thicknesses are formed on the first organic layer 120, making the height difference formed between the overhanging structure 140 and the bottom electrode 131 smaller, thereby improving the blocking ability of the overhanging structure 140 and improving the manufacturing yield of the light-emitting unit 130. On the other hand, by providing the second organic portion 122, when forming the opening of the pixel definition layer 113, after removing the pixel definition layer 113 material on the first organic portion 121, the distance between the overhanging structure 140 and the bottom electrode 131 is closer, which is more conducive to realizing the process of the light-emitting unit 130.

[0121] Specifically, before the step of S20, it further includes:

[0122] S101: Form a light-shielding layer on the substrate corresponding to the transmissive display region;

[0123] S102: Remove the light-shielding layer in the light-transmitting region;

[0124] The steps in S70 include:

[0125] S701: Between the non-opening area and the light-transmitting area, etch the pixel definition layer and the first organic layer according to the boundary of the light-shielding layer, so that part of the pixel definition layer and the first organic layer on the light-shielding layer are removed.

[0126] In this embodiment, when finally removing the first organic layer 120 and the pixel definition layer 113 of the light-transmitting area 104, the film layer of this part of the light-transmitting area 104 can be etched according to the area of the light-shielding layer 150. The main function of the light-shielding layer 150 is to prevent part of the light passing through the pixel area 103 from entering the optical element arranged below the transmissive display area 102 and causing interference. The light-shielding layer 150 can generally be formed by using the metal material in the pixel driving layer 111, and is generally located at the position closest to the substrate 110 in the pixel driving layer 111.

[0127] Figure 6 It is a schematic diagram of the steps of another manufacturing method of a display panel according to the second embodiment of the present application. Figure 7 It is a schematic diagram of another display panel according to the second embodiment of the present application. Refer to Figures 6 to 7 As shown, in this embodiment, the first groove can also be formed at the position of the first organic layer corresponding to the overhanging structure through the semi-mask etching process mentioned above, and the overhanging structure is formed in the first groove to increase the stability of the overhanging structure.

[0128] Specifically, the steps in S20 further include:

[0129] S223: Use a semi-transparent mask to etch the first organic layer, so that the first organic layer forms a first groove in the non-opening area; wherein, the thickness of the first organic layer in the area of the first groove is less than the thickness of the first organic layer in the area other than the first groove area.

[0130] The steps in S40 further include;

[0131] S421: At the position of the first groove, the pixel definition layer covers the first groove to form a second groove.

[0132] The steps in S50 include:

[0133] S521: Sequentially form a whole-surface conductive part material and a partition part material on the pixel definition layer;

[0134] S522: Pattern the partition part material, and retain the partition part material in the area of the second groove in the non-opening area to form a partition part;

[0135] S523: Use the partition part as a protective layer to etch the conductive part material to form an overhanging structure in which the radial width of the conductive part is smaller than the radial width of the partition part.

[0136] Wherein, in the orthographic projection of the substrate 110, the overhanging structure 140 overlaps with the second groove 1131. In this embodiment, the differences from the above embodiment are mainly shown, and the processes omitted therein are the same as those in the first embodiment and will not be elaborated here.

[0137] In this embodiment, a groove is mainly formed at the position of the pixel definition layer 113 and the first organic layer 120 corresponding to the overhanging structure 140 to accommodate the overhanging structure 140, so that when the overhanging structure 140 is formed, the film layer below has better supporting ability for the overhanging structure 140. By forming a groove on the first organic layer 120, instead of completely forming the above-mentioned first organic part 121 and second organic part 122. It can be understood that the width of the second groove 1131 should be greater than or equal to the width of the conductive part 141 of the overhanging structure 140, so that when etching the conductive part 141, it can be etched into the second groove 1131 as much as possible, so that there is a certain gap between the side wall of the conductive part 141 and the side wall of the second groove 1131.

[0138] Figure 8 is a top view schematic diagram of the display panel 100 of the present application, Figure 9 is a cross-sectional schematic diagram of the display panel 100 of the present application. Refer to Figures 8 to 9 As shown, generally in the transmissive display area 102, a plurality of light-transmitting areas 104 are provided around each pixel area 103, such as the four light-transmitting areas 104 shown in the figure. And a plurality of opening areas 1031 are provided in each pixel area 103. Generally, at least three opening areas 1031 are used to form sub-pixels of different colors, and three sub-pixels form a pixel, and various colors are displayed by adjusting the gray levels of the three sub-pixels. Adjacent two opening areas 1031 are separated by a non-opening area 1032, and the opening area 1031 and the light-transmitting area are also separated by a non-opening area 1032. In this regard, the two non-opening areas 1032 are distinguished in this embodiment. Specifically, the non-opening area 1032 includes a first non-opening area 10321 and a second non-opening area 10322. The first non-opening area 10321 is provided between two adjacent opening areas 1031, and the second non-opening area 10322 is provided between the opening area 1031 and the light-transmitting area 104. Correspondingly, the overhanging structure 140 includes a first overhanging structure 1401 and a second overhanging structure 1402. The first overhanging structure 1401 is provided in the second non-opening area 10322, and the second overhanging structure 1402 is provided in the first non-opening area 10321.

[0139] The step of forming the overhang structure 140 on the pixel definition layer 113 at the non-opening area 1032 position includes: forming a second overhang structure 1402 in the first non-opening area 10321, and forming a first overhang structure 1401 in the second non-opening area 10322; wherein, the second organic part 122 or the first groove 123 is only arranged in the second non-opening area 10322; the surface of the first overhang structure 1401 on the side away from the substrate 110 is higher than the surface of the second overhang structure 1402 on the side away from the substrate 110.

[0140] In this embodiment, since the distance between two adjacent light-emitting units 130 is limited, if the first groove 123 or the thickness difference scheme is also set in the first organic layer 120 between the two light-emitting units 130, it is easy to cause the film layer of the first organic layer 120 to be uneven, resulting in the transmissive display area 102, and of course the normal display area is also included in this setting, and it is easy to have the problem that the stability of the light-emitting unit 130 is poor due to uneven film layers. In this regard, in this embodiment, the height of the first overhang structure 1401 in the second non-opening area 10322 can be appropriately lowered, so that the stability of the first overhang structure 1401 is better.

[0141] Figure 10 is a schematic diagram of the display device of the present application, see Figure 10 As shown, the present application also discloses a display device, the display device 200 includes a driving circuit 210 and any one of the display panels 100 in the above embodiments, wherein the driving circuit 210 drives the display panel 100 to display.

[0142] It should be noted that the inventive concept of the present application can form a very large number of embodiments, but the space of the application documents is limited and it is impossible to list them all. Therefore, on the premise of not conflicting, the above-described embodiments or technical features can be arbitrarily combined to form new embodiments, and after the combination of each embodiment or technical feature, the original technical effect will be enhanced.

[0143] The above content is a further detailed description of the present application in combination with specific optional implementation manners, and it cannot be determined that the specific implementation of the present application is only limited to these descriptions. For those of ordinary skill in the technical field to which the present application belongs, without departing from the concept of the present application, several simple deductions or substitutions can still be made, and all should be regarded as belonging to the protection scope of the present application.

Claims

1. A method for manufacturing a display panel, wherein the display panel comprises a normal display area and a transmissive display area, wherein an optical element is disposed below the transmissive display area corresponding to the normal display area, and the transmissive display area comprises a pixel area and a light-transmitting area; characterized in that: The production method comprises the steps of: Providing a substrate; A first organic layer is formed on the base substrate; wherein the first organic layer covers the pixel area and the light-transmitting area, and the first organic layer is provided with a via hole in the pixel area for connecting the bottom electrode; Patterning a bottom electrode on the first organic layer; Forming a pixel definition layer material disposed entirely on the bottom electrode and the first organic layer; removing the pixel definition layer material on the bottom electrode to form an opening area, and retaining the pixel definition layer in the non-opening area and the light-transmitting area; forming an overhang structure on the pixel definition layer at a position of the non-opening area; Using the overhanging structure to form a light-emitting functional layer and a top electrode in the opening area to form a light-emitting unit; removing the pixel definition layer and the first organic layer in the light-transmitting area; The pixel area includes an opening area and a non-opening area, and the light-emitting unit includes a bottom electrode, a light-emitting functional layer and a top electrode which are arranged in sequence from a base substrate.

2. The method for manufacturing a display panel according to claim 1, characterized in that: The step of forming a first organic layer on the base substrate comprises: A pixel driving layer is formed; wherein the pixel driving layer is provided with a plurality of pixel active switches; Depositing a first organic layer on the pixel active switch array layer, wherein the first organic layer extends from the pixel area to the light-transmitting area; Through a patterning process, the first organic layer forms a via hole in the area where the pixel active switch is located; The step of patterning the bottom electrode on the first organic layer comprises: Depositing a whole surface of bottom electrode material on the first organic layer, retaining the bottom electrode on the opening area of ​​the pixel area through a patterning process, and connecting the bottom electrode to the pixel active switch through the via hole; The step of forming an overhang structure on the pixel definition layer at the non-opening area position includes: sequentially forming a conductive portion material and a partition portion material on the entire surface of the pixel definition layer; Patterning the partition material to form a partition; The conductive part material is etched using the partition part as a protective layer to form an overhang structure in which the radial width of the conductive part is smaller than the radial width of the partition part.

3. The method for manufacturing a display panel according to claim 2, characterized in that: The step of forming a via hole in the first organic layer in the area where the pixel active switch is located by a patterning process includes: The first organic layer is etched using a semi-transparent mask so that the first organic layer forms a first organic portion with a first thickness in the opening area, forms a second organic portion with a second thickness in the non-opening area and the light-transmitting area, and forms a via hole in the first organic portion corresponding to the area where the pixel active switch is located; wherein the first thickness is greater than the second thickness; The step of patterning the bottom electrode on the first organic layer comprises: Depositing a whole surface of bottom electrode material on the first organic layer, retaining the bottom electrode on the first organic part through a patterning process, wherein the bottom electrode is connected to the pixel active switch through the via hole; The step of patterning the partition material to form the partition also includes: Retaining the partitioning portion material on the second organic portion in the non-opening area to form a partitioning portion; Wherein, in the orthographic projection of the base substrate, the overhanging structure overlaps with the second organic part.

4. The method for manufacturing a display panel according to claim 2, wherein: The step of forming a via hole in the area where the pixel active switch is located by the first organic layer through a patterning process further includes: The first organic layer is etched using a semi-transparent mask so that the first organic layer forms a first groove in the non-opening area; the thickness of the first organic layer in the first groove area is less than the thickness of the first organic layer in the non-first groove area; The step of forming a pixel definition layer material disposed entirely on the bottom electrode and the first organic layer; removing the pixel definition layer material on the bottom electrode to form an opening area, and retaining the pixel definition layer in the non-opening area and the light-transmitting area also includes: At the position of the first groove, the pixel definition layer covers the first groove to form a second groove; The step of patterning the partition material to form the partition also includes: Retain the partition material in the area where the second groove of the non-opening area is located to form a partition; Wherein, on the orthographic projection of the base substrate, the overhanging structure overlaps with the second groove.

5. The method for manufacturing a display panel according to claim 3 or 4, characterized in that: The non-opening area includes a first non-opening area and a second non-opening area, the first non-opening area is arranged between two adjacent opening areas, and the second non-opening area is arranged between the opening area and the light-transmitting area; the overhang structure includes a first overhang structure and a second overhang structure The step of forming an overhang structure on the pixel definition layer at the non-opening area position includes: forming a second overhanging structure in the first non-opening area, and forming a first overhanging structure in the second non-opening area; Wherein, the second organic portion or the first groove is only provided in the second non-opening area; A surface of the first overhanging structure away from the substrate is higher than a surface of the second overhanging structure away from the substrate.

6. The method for manufacturing a display panel according to claim 2, wherein: Before the step of forming the first organic layer on the base substrate, the step further includes: forming a light shielding layer on the base substrate corresponding to the transmissive display area; Remove the light-shielding layer in the light-transmitting area; The step of removing the pixel definition layer and the first organic layer in the light-transmitting area includes: Between the non-opening area and the light-transmitting area, the pixel definition layer and the first organic layer are etched according to the boundary of the light-shielding layer, so that parts of the pixel definition layer and the first organic layer on the light-shielding layer are removed.

7. A display panel manufactured by the manufacturing method of a display panel according to any one of claims 1 to 6, comprising a normal display area and a transmissive display area, wherein an optical element is arranged below the transmissive display area corresponding to the display panel, and the transmissive display area comprises a pixel area and a light-transmitting area; the pixel area comprises an opening area and a non-opening area; characterized in that: The display panel further includes: substrate substrate; A first organic layer is disposed on the base substrate and located in the pixel area; A pixel definition layer, disposed on the first organic layer and located in the non-opening area; A light-emitting unit is disposed on the first organic layer, and two adjacent light-emitting units are separated by the pixel definition layer; and A suspension structure is disposed on the pixel definition layer; The light-emitting unit comprises a bottom electrode, a light-emitting functional layer and a top electrode sequentially arranged from the base substrate, the first organic layer is provided with a via hole corresponding to the pixel area, and the bottom electrode and the via hole overlap under the orthographic projection of the base substrate; Between the non-opening area and the light-transmitting area, a section of the pixel definition layer and a section of the first organic layer are located at the same position.

8. The method for manufacturing a display panel according to claim 7, characterized in that: The display panel further comprises a pixel driving layer, the pixel driving layer is arranged between the base substrate and the first organic layer, and the pixel driving layer is provided with a plurality of pixel active switches; In each of the opening regions, the bottom electrode is connected to the pixel active switch through the via hole; The first organic layer includes a first organic part and a second organic part, the first organic part is arranged in the opening area, the second organic part is arranged in the non-opening area and the light-transmitting area, and the thickness of the first organic part is greater than the thickness of the second organic part; In an orthographic projection of the base substrate, the overhanging structure overlaps the second organic portion.

9. The method for manufacturing a display panel according to claim 8, characterized in that: The non-opening area includes a first non-opening area and a second non-opening area, the first non-opening area is arranged between two adjacent opening areas, and the second non-opening area is arranged between the opening area and the light-transmitting area; the overhang structure includes a first overhang structure and a second overhang structure; The first overhanging structure is arranged in the second non-opening area, and the second overhanging structure is arranged in the first non-opening area; wherein the second organic part is arranged only in the second non-opening area; A surface of the first overhanging structure away from the substrate is higher than a surface of the second overhanging structure away from the substrate.

10. A display device, characterized in that: It comprises a driving circuit and the display panel according to any one of claims 7 to 9, wherein the driving circuit is used to drive the display panel to display.

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