An epoxy plastic packaging film for automotive-grade chips and a preparation method thereof

Abstract

The present application relates to a kind of epoxy plastic sealing film for car-grade chip and its preparation method, epoxy plastic sealing film includes material and solvent;The material includes the component by weight fraction count: special epoxy resin 4.7~21.5 parts, fluorine-containing epoxy resin 3~6 parts, silicone-modified epoxy resin 3~5 parts, low viscosity epoxy resin 2~3 parts, curing agent 10~15 parts, accelerator 0.1~0.5 parts, defoaming agent 0.1~0.2 parts;Coupling agent 0.2~0.3 parts, dispersing agent 0.1~0.3 parts;Powder filler 60~65 parts;Material total 100 parts;The solvent 20~30 parts, preparation method includes the following steps: step S1, material stirring mixes, step S2, glue liquid forms;Step S3, glue film curing;The present application has the advantages that epoxy plastic sealing film has high Tg, high temperature resistance, low hygroscopicity, high reliability, low warping, stability and the characteristics of strong reliability.

Description

Technical Field

[0001] This invention relates to the field of chip encapsulation films, and in particular to an automotive-grade epoxy encapsulation film for chips and its preparation method. Background Technology

[0002] With the development of technology, the development of chips plays a crucial role in industrial innovation. Currently, with the rise of new energy vehicles, the usage and popularity of automotive chips are increasing exponentially. Automotive chips, also known as automotive-grade chips, differ from consumer chips in many ways. The main reason is that the operating environment of automobiles is highly variable, requiring them to adapt to various harsh natural environments and application scenarios, which places higher demands on the reliability of the chips.

[0003] Firstly, the area around the car engine needs to withstand temperatures ranging from -40℃ to 150℃, while the passenger compartment requires -40℃ to 85℃. Automotive-grade chips need to possess excellent temperature adaptability. Secondly, the typical lifespan of a car is designed to be 15 years or 200,000 kilometers, which also demands outstanding reliability from automotive chips. Vehicles need to operate in low-temperature and low-humidity environments, so chips also have strict requirements for resistance to damp heat. Epoxy resin films, as chip encapsulation materials, also need correspondingly high Tg, high temperature resistance, low moisture absorption, high reliability, and low warpage performance. However, traditional epoxy resin films are difficult to meet the requirements of automotive-grade chips.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention discloses an epoxy encapsulation film for automotive-grade chips and its preparation method.

[0006] The technical solution adopted in this invention is as follows:

[0007] An automotive-grade epoxy encapsulating film for chips comprises materials and a solvent; the materials include the following components by weight: 4.7–21.5 parts of special epoxy resin, 3–6 parts of fluorinated epoxy resin, 3–5 parts of silicone-modified epoxy resin, 2–3 parts of low-viscosity epoxy resin, 10–15 parts of curing agent, 0.1–0.5 parts of accelerator, 0.1–0.2 parts of defoamer; 0.2–0.3 parts of coupling agent, 0.1–0.3 parts of dispersant; 60–65 parts of powder filler; totaling 100 parts of materials; and 20–30 parts of the solvent.

[0008] Furthermore, the special epoxy resin is a trifunctional phenolic epoxy resin with an epoxy equivalent of 150-180 g / eq.

[0009] Furthermore, the fluorinated epoxy resin is a fluorinated bisphenol A type epoxy resin with an epoxy equivalent of 190-230 g / eq, and its structural formula is shown in formula (1):

[0010]

[0011] Furthermore, the organosilicon-modified epoxy resin is a POSS-type cage-like polysilsesquioxane with an epoxy equivalent of 150–190 g / eq.

[0012] Furthermore, the POSS-type cage-like polysilsesquioxane includes one of cage-like γ-glycidyl etheroxypropyl silsesquioxane, octapoly(propylglycidyl ether) silsesquioxane, and octacyclooxycyclohexylethyl cage-like polysilsesquioxane.

[0013] Furthermore, the low-viscosity epoxy resin is a glycidyl ether, which includes castor oil triglycidyl ether (ERISYS GE-35), neopentyl glycol diglycidyl ether (ERISYS GE-20), and cyclohexanediethanol diglycidyl ether (ARALDITE DY-C).

[0014] Furthermore, the curing agent is dicyclopentadienol resin with a hydroxyl equivalent of 180-220 g / eq.

[0015] Furthermore, the powder filler is spherical silica, and the particle size of the spherical silica ranges from 0.5 to 1.0 μm.

[0016] Furthermore, the accelerator is imidazole, specifically one of 2E4MZ, C11Z-A, 2MZA-PW, and 2-MI; the defoamer is one of BYK-A530, KS-603, BYK-066N, and Defom5300; the coupling agent is one of KBM-13, KBM-8603, and KBM-303; the dispersant is one of BYK-9011, BYK-163, BYK-9076, and TEGO Dispers685; and the solvent is one or a combination of two of butanone, butyl acetate, ethylene glycol methyl ether, and propylene glycol methyl ether acetate.

[0017] A method for preparing an epoxy encapsulation film for automotive-grade chips includes the following steps:

[0018] Step S1: Mixing materials. Add all materials except the powder filler and solvent to a planetary mixer and heat and mix. The mixing temperature range is 65-80℃ and the mixing time range is 2-3h. Then add the powder filler and continue mixing for 1h. Filter to obtain the adhesive solution.

[0019] Step S2: Adhesive liquid molding. The adhesive liquid is processed into an adhesive film using a coating machine. The coating temperature range is 60-90℃, the coating speed range is 0.8-1.5m / min, the coating tension is 50-60N, and the resulting adhesive film thickness is 50-150μm.

[0020] Step S3: Adhesive film curing. Adhere the adhesive film to the chip or substrate, then cure it at 120°C for 1-2 hours, followed by curing at 180°C for 2-3 hours to complete the product curing and shaping.

[0021] The beneficial effects of this invention are as follows:

[0022] 1. The film is made of trifunctional phenolic epoxy resin, which has a high benzene ring content and high crosslinking density, exhibiting excellent performance in terms of temperature resistance, thermal properties, and mechanical properties, significantly improving the overall performance of the product. Organosilicon-modified epoxy resin has outstanding aging resistance and high temperature resistance, while also possessing flexibility. Adding this raw material to the formulation system can improve warpage and curing shrinkage. Fluorinated epoxy resin and dicyclopentadienol resin can enhance the product's moisture absorption effect, while the introduction of various special additives can produce synergistic effects, further improving the overall performance of the product.

[0023] 2. A combination of fluorinated epoxy resin and dicyclopentadienol resin as a curing agent is used. Fluorinated polymers have outstanding hydrophobicity. The introduction of fluorinated epoxy resin into the formulation system results in a large number of hydrophobic groups in the molecular chain of the product. In humid environments, the encapsulation material exhibits excellent moisture resistance. Due to its strong non-polarity, dicyclopentadienol resin has weak interaction forces with water molecules, which can prevent water molecules from entering the resin interior, reducing moisture absorption. Furthermore, during the resin curing process, it can form a tight cross-linked structure, restricting the movement of molecular chain segments, making it difficult for water molecules to diffuse and penetrate inside the resin, thus improving the product's hygroscopicity.

[0024] 3. POSS cage-like polysilsesquioxane is a reactive monomer with a special structure. It contains both multifunctional epoxy groups that can participate in chemical reactions and cage-like siloxanes. The cage-like siloxanes open rings to form high molecular weight compounds, which can counteract the volume shrinkage caused by polymerization. By adjusting the proportion of POSS cage-like polysilsesquioxane, polymers with zero warpage and no shrinkage, or even expansion, can be obtained. Therefore, using POSS cage-like polysilsesquioxane can solve the warpage and shrinkage problem.

[0025] 4. Imidazole-based latent films have very low reactivity at temperatures of 150-190°C. The reaction proceeds smoothly at medium to high temperatures. Their function is to accelerate the chemical reaction between the resin and the curing agent, shorten the curing time, and select a temperature of 150-190°C that matches the polymerization system. This not only improves the curing efficiency but also reduces the enthalpy of the reaction, effectively controlling the heat release in the reaction and minimizing the warping and deformation of the cured product.

[0026] 5. The epoxy molding film is manufactured in roll or sheet form and adhered to the chip or substrate using a vacuum lamination process. It is then cured at medium to high temperatures to complete the chip encapsulation. Firstly, the film production efficiency is high, enabling automation on the production line and reducing labor input. Secondly, the use of this film material, compared to traditional molding processes, significantly reduces equipment investment and operating costs, maximizing economic benefits. Thirdly, the film material adheres tightly to the chip or substrate, allowing for cutting according to the chip's shape, minimizing raw material waste, reducing unnecessary losses, and controlling production costs. Attached Figure Description

[0027] Figure 1 This is a schematic diagram illustrating the steps of a method for preparing an epoxy encapsulation film for automotive-grade chips. Detailed Implementation

[0028] The specific embodiments of the present invention will now be described with reference to the accompanying drawings.

[0029] Example 1:

[0030] An automotive-grade epoxy encapsulation film for chips, comprising a solute and a solvent.

[0031] The solutes include 14.6 parts of trifunctional phenolic epoxy resin SQTN-331; 4.5 parts of fluorinated bisphenol A type epoxy resin; 3 parts of cage-type γ-glycidyl etheroxypropyl silsesquioxane; 2 parts of low-viscosity epoxy resin ERISYS GE-35; 10 parts of dicyclopentadienol resin SH-7090; 0.3 parts of accelerator imidazole 2E4MZ; 0.2 parts of defoamer KS-603; 0.2 parts of coupling agent KBM-13; 0.2 parts of dispersant BYK-9011; and powder fillers including 45 parts of spherical silica NQ2110B and 20 parts of SC 2500-SXJ, totaling 100 parts.

[0032] The solvent consists of 15 parts butyl acetate and 5 parts ethylene glycol methyl ether.

[0033] The trifunctional phenolic epoxy resin SQTN-331 has an epoxy equivalent of 150 g / eq.

[0034] The epoxy equivalent of the fluorinated bisphenol A type epoxy resin is 190 g / eq, and its structural formula is shown in formula (1):

[0035]

[0036] The epoxy equivalent of the dicyclopentadienol resin SH-7090 is 180 g / eq.

[0037] The particle size range of spherical silica is 0.5–1.0 μm.

[0038] Its preparation method, such as Figure 1 As shown, it includes the following steps:

[0039] Step S1: Mixing materials. Add all materials except the powder filler and solvent to a planetary mixer and heat and mix at 70°C for 2.5 hours. Then add the powder filler and mix for 1 hour. Finally, filter to obtain a fluid adhesive.

[0040] Step S2: The adhesive liquid is processed into an adhesive film of a specified thickness using a precision coating machine. The temperature is controlled at 70-80℃, the coating speed is 1.2m / min, the tension is 55N, and the thickness of the adhesive film is 110μm. The resulting epoxy sealing film is presented in roll or sheet form.

[0041] Step S3: The obtained epoxy encapsulation film is adhered to the chip or substrate using a vacuum lamination process. The product is then cured at 120°C for 1.5 hours, followed by curing at 180°C for 2 hours.

[0042] Example 2:

[0043] An automotive-grade epoxy encapsulation film for chips, comprising a solute and a solvent.

[0044] The solute includes 15.45 parts of trifunctional phenolic epoxy resin EPPN-501H, 3 parts of fluorinated epoxy resin, 5 parts of octameric (propyl glycidyl ether) silsesquioxane, 2.5 parts of low-viscosity epoxy resin cyclohexanediethanol diglycidyl ether ARALDITE DY-C, 13 parts of curing agent dicyclopentadienol resin SH-7110, 0.5 parts of accelerator imidazole C11Z-A, 0.15 parts of defoamer BYK-066N, 0.3 parts of coupling agent KBM-8603, 0.1 parts of dispersant BYK-9076, 45 parts of powder filler spherical silica SE015X and 15 parts of DQ005, totaling 100 parts.

[0045] The solvent consists of 20 parts butyl acetate and 10 parts propylene glycol methyl ether acetate.

[0046] The trifunctional phenolic epoxy resin SQTN-331 has an epoxy equivalent of 160 g / eq.

[0047] The fluorinated epoxy resin is a fluorinated bisphenol A type epoxy resin with an epoxy equivalent of 210 g / eq and a structural formula as shown in formula (1):

[0048]

[0049] Its preparation method includes the following steps:

[0050] Step S1: Mixing and stirring materials. Add all materials except the powder filler and solvent to a planetary mixer and heat and stir at 80°C for 2 hours. Then add the powder filler and stir for 1 hour. Finally, filter to obtain a fluid adhesive.

[0051] Step S2: The adhesive liquid is processed into an adhesive film of a specified thickness using a precision coating machine. The temperature is controlled at 70-90℃, the coating speed is 1.0m / min, the tension is 50N, and the thickness of the adhesive film is 150μm. The resulting epoxy sealing film is presented in roll or sheet form.

[0052] Step S3: The obtained epoxy encapsulation film is adhered to the chip or substrate using a vacuum lamination process. The product is then cured at 120°C for 2 hours, followed by curing at 180°C for 1 hour.

[0053] Example 3:

[0054] An automotive-grade epoxy encapsulation film for chips, comprising a solute and a solvent.

[0055] The solutes include 8.3 parts of special epoxy resin SQTN-333, 6 parts of fluorinated epoxy resin, 4 parts of octacyclohexylethyl cage-like polysilsesquioxane, 3 parts of low-viscosity epoxy resin ERISYS GE-20, 15 parts of curing agent dicyclopentadienol resin SH-7117, 0.1 parts of accelerator imidazole 2MZA-PW, 0.1 parts of defoamer Defom5300, 0.2 parts of coupling agent KBM-303, 0.3 parts of dispersant BYK-163, and 43 parts and 20 parts of powder filler spherical silica NQ2110B and NQ1040G.

[0056] The solvents include 15 parts butanone and 10 parts ethylene glycol methyl ether.

[0057] The preparation method includes the following steps:

[0058] Step S1: Mixing and stirring materials. Add all materials except the powder filler and solvent to a planetary mixer and heat and stir at 65°C for 3 hours. Then add the powder filler and stir for 1 hour. Finally, filter to obtain a fluid adhesive.

[0059] Step S2: The adhesive liquid is processed into an adhesive film of a specified thickness using a precision coating machine. The temperature is controlled at 60-80℃, the coating speed is 0.8m / min, the tension is 60N, and the thickness of the adhesive film is 150μm. The resulting epoxy sealing film is presented in roll or sheet form.

[0060] Step S3: The obtained epoxy encapsulation film is adhered to the chip or substrate using a vacuum lamination process. The product is then cured at 120°C for 1 hour, followed by curing at 180°C for 3 hours.

[0061] Example 4:

[0062] An automotive-grade epoxy encapsulation film for chips, comprising a solute and a solvent.

[0063] The solutes include 16.7 parts of trifunctional phenolic epoxy resin SQTN-331; 5 parts of fluorinated bisphenol A type epoxy resin; 3.5 parts of cage-type γ-glycidyl etheroxypropyl silsesquioxane; 2 parts of low-viscosity epoxy resin ERISYS GE-20; 12 parts of dicyclopentadienol resin SH-7110; 0.2 parts of accelerator imidazole 2-MI; 0.1 parts of defoamer TEGO Dispers 685; 0.3 parts of coupling agent KBM-303; 0.2 parts of dispersant B-163; and powder fillers including 30 parts of spherical silica NQ2110B and 30 parts of NQ005, totaling 100 parts.

[0064] The solvents include 12 parts butanone and 8 parts ethylene glycol methyl ether.

[0065] The trifunctional phenolic epoxy resin SQTN-331 has an epoxy equivalent of 150 g / eq.

[0066] The epoxy equivalent of the fluorinated bisphenol A type epoxy resin is 190 g / eq, and its structural formula is shown in formula (1):

[0067]

[0068] The epoxy equivalent of the dicyclopentadienol resin SH-7110 is 180 g / eq.

[0069] The particle size range of spherical silica is 0.5–1.0 μm.

[0070] Its preparation method, such as Figure 1 As shown, it includes the following steps:

[0071] Step S1: Mixing materials. Add all materials except the powder filler and solvent to a planetary mixer and heat and mix at 75°C for 3 hours. Then add the powder filler and mix for 1 hour. Finally, filter to obtain a fluid adhesive.

[0072] Step S2: The adhesive liquid is processed into an adhesive film of a specified thickness using a precision coating machine at a temperature of 60-70℃, a coating speed of 1.3m / min, a tension of 55N, and a film thickness of 130μm. The resulting epoxy sealing film is presented in roll or sheet form.

[0073] Step S3: The obtained epoxy encapsulation film is adhered to the chip or substrate using a vacuum lamination process. The product is then cured at 120°C for 2 hours, followed by curing at 180°C for 2.2 hours.

[0074] Product performance testing:

[0075] Samples were randomly selected from the products in Examples 1 to 4 for testing, and the test results are shown in Table 1.

[0076] Table 1 Performance Test Table of Epoxy Encapsulation Film for Automotive-Grade Chips

[0077]

[0078] Analysis of test results:

[0079] In Examples 1-4, the shear strength of all three samples was higher than 13 MPa, and the elastic modulus was lower than 15 MPa, demonstrating that the products possess both rigidity and toughness. The glass transition temperature was higher than 190℃, and the coefficient of linear expansion α1 was less than 15 ppm / K. After baking at 200℃ for 72 hours, the weight loss was less than 3%, the curing shrinkage was no higher than 0.3%, and the warpage was less than 2%. Furthermore, the samples performed excellently in PCT and thermal shock tests, indicating promising performance indicators.

[0080] Among them, Example 1 has good overall performance and a moderate cost-effectiveness. Example 2 has a higher glass transition temperature and high reliability. Example 3 has the best performance in terms of resistance to damp heat. Example 4 has good performance in terms of deformation and warpage.

[0081] Comparative experiment:

[0082] Comparative Example 1: Keeping other raw materials unchanged, the special epoxy resin SQTN-331 in Example 1 was replaced with bisphenol A type epoxy resin E-51, and the ratio of epoxy resin to curing agent was adjusted to ensure that the equivalent ratio was 1:1. Epoxy molding film was prepared, and the performance of the product was tested. The results are shown in Table 2.

[0083] As can be seen from the data in Table 2, replacing epoxy resin SQTN-331 with E-51 significantly alters the product's performance, primarily in terms of mechanical properties, thermal properties, and reliability. SQTN-331 is a trifunctional epoxy resin, resulting in a high crosslinking density and numerous network structures after curing, thus greatly improving product performance. E-51, on the other hand, is a difunctional epoxy resin with a lower crosslinking density, leading to a lower glass transition temperature, reduced temperature resistance, and poor performance in thermal shock tests (as seen in Comparative Example 1). Therefore, the main resin SQTN-331 used in this invention plays an irreplaceable role in the formulation system.

[0084] Comparative Example 2:

[0085] Keeping other raw materials unchanged, the fluorinated epoxy resin in Example 1 was replaced with epoxy resin SQTN-331, and the ratio of epoxy resin to curing agent was adjusted to ensure that the equivalent ratio was 1:1. Epoxy molding film was prepared, and the performance of the product was tested.

[0086] Fluorinated epoxy resins possess low surface energy and hydrophobic properties; introducing this structural unit can improve the product's moisture resistance. Table 2 shows that replacing the fluorinated epoxy resin with trifunctional SQTN-331 increases the rigidity of the formulation system, raises the glass transition temperature to 201.3℃, and improves mechanical properties; however, the PCT water absorption rate increases to 0.89%. This indicates that fluorinated epoxy resins perform well in reducing water absorption, and the addition of fluorinated epoxy resins achieves the goal of improving moisture absorption.

[0087] Comparative Example 3:

[0088] Keeping other raw materials unchanged, replace the cage-type γ-glycidoxypropylsilsesquioxane in Example 1 with epoxy resin SQTN-331, adjust the ratio of epoxy resin to curing agent to ensure that the equivalent ratio is 1:1, prepare epoxy molding film, and test the performance of the product.

[0089] POSS cage-like polysilsesquioxane has a unique structure, containing both multiple reactive epoxy groups and cage-like siloxane groups, exhibiting both rigidity and flexibility. The presence of siloxane bonds improves the product's temperature resistance, as demonstrated in Table 2. Comparative Example 3 had a glass transition temperature of 223.7℃ and a thermal shock test duration of 165 cycles, indicating a loss of flexibility. The product's temperature resistance significantly deteriorated to 6.23%, and the curing shrinkage increased to 0.93%. This demonstrates that the siloxane structural units can improve the product's temperature resistance and warpage, highlighting the crucial role of this raw material in the formulation system.

[0090] Comparative Example 4:

[0091] Keeping other raw materials unchanged, the special coupling agent KBM-13 in Example 1 was replaced with the conventional coupling agent KH-560 to prepare an epoxy molding film, and the performance of the product was tested.

[0092] Coupling agents play two roles in epoxy resin systems: firstly, they improve the dispersion of epoxy resin and powder fillers; secondly, they enhance the adhesion between epoxy resin and the bonding interface. Some coupling agents with special structures exhibit excellent hydrophobic effects and outstanding moisture resistance; KBM-13 used in this invention is a typical example. Replacing KBM-13 with KH-560 increases the PCT water absorption rate of the product from 0.18% to 0.55%, resulting in poorer moisture absorption. Therefore, this invention prefers KBM-13 as the coupling agent.

[0093] Comparative Example 5:

[0094] Keeping other raw materials unchanged, the curing agent SH-7090 in Example 1 was replaced with linear phenol-formaldehyde resin PF8011, and the ratio of epoxy resin to curing agent was adjusted to ensure that the equivalent ratio was 1:1. Epoxy molding film was prepared and the performance of the product was tested.

[0095] Curing agents are an important component of epoxy resins. Selecting an appropriate curing agent not only improves the overall performance of the product but also closely relates to its application effect. This invention uses dicyclopentadiene phenol resin as the curing agent. Unlike linear phenol-formaldehyde resins, SH-7090 has more dicyclopentadiene structural units, exhibiting excellent performance in terms of water absorption and reliability. Replacing SH-7090 with PF8011 increases the product's PCT water absorption rate to 0.73%, and the thermal shock test result is 225 cycles, fully demonstrating the beneficial effects of using SH-7090 as the curing agent in this invention.

[0096] Table 2 Comparative Test of Epoxy Encapsulation Film for Automotive-Grade Chips

[0097]

[0098] In summary, this invention utilizes special epoxy resin, fluorinated epoxy resin, organosilicon-modified epoxy resin POSS cage-like polysilsesquioxane, combined with dicyclopentadienol resin, spherical silica, and necessary auxiliary additives, along with a reasonable processing technology, to produce a series of epoxy encapsulation films with excellent comprehensive performance, suitable for automotive-grade chip packaging. These films possess outstanding substantive characteristics and solve current technical challenges in the industry.

[0099] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0100] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. An epoxy encapsulation film for automotive-grade chips, characterized in that: Including materials and solvents; The material comprises the following components by weight: 4.7-21.5 parts of special epoxy resin, 3-6 parts of fluorinated epoxy resin, 3-5 parts of silicone-modified epoxy resin, 2-3 parts of low-viscosity epoxy resin, 10-15 parts of curing agent, 0.1-0.5 parts of accelerator, and 0.1-0.2 parts of defoamer. 0.2-0.3 parts coupling agent, 0.1-0.3 parts dispersant; 60-65 parts of powder filler; total material 100 parts; The solvent is 20-30 parts; The special epoxy resin is a trifunctional phenolic epoxy resin with an epoxy equivalent of 150~180g / eq. The fluorinated epoxy resin is a fluorinated bisphenol A type epoxy resin with an epoxy equivalent of 190~230 g / eq and a structural formula as shown in formula (1): (Equation 1); The organosilicon-modified epoxy resin is a POSS-type cage-like polysilsesquioxane with an epoxy equivalent of 150~190 g / eq. The POSS-type cage-like polysilsesquioxane includes one of cage-like γ-glycidyl etheroxypropyl silsesquioxane, octameric (propyl glycidyl ether) silsesquioxane, and octacyclooxycyclohexylethyl cage-like polysilsesquioxane. The low-viscosity epoxy resin is a glycidyl ether, which includes castor oil triglycidyl ether ERISYSGE-35, neopentyl glycol diglycidyl ether ERISYSGE-20, and cyclohexanediethanol diglycidyl ether ARALDITE DY-C. The curing agent is dicyclopentadienol resin with a hydroxyl equivalent of 180-220 g / eq; The powder filler is spherical silica, and the particle size of the spherical silica ranges from 0.5 to 1.0 μm; The accelerator is imidazole, specifically one of 2E4MZ, C11Z-A, 2MZA-PW, and 2-MI; the defoamer is one of BYK-A530, KS-603, BYK-066N, and Defom5300; the coupling agent is one of KBM-13 and KBM-303; the dispersant is one of BYK-9011, BYK-163, BYK-9076, and TEGO Dispers 685; and the solvent is one or a combination of two of butanone, butyl acetate, ethylene glycol methyl ether, and propylene glycol methyl ether acetate.

2. A method for preparing an epoxy encapsulating film for automotive-grade chips as described in claim 1, characterized in that, Includes the following steps: Step S1: Mixing materials. Add all materials except the powder filler and solvent to a planetary mixer and heat and mix. The mixing temperature range is 65~80℃ and the mixing time range is 2~3h. Then add the powder filler and continue mixing for 1h. Filter to obtain the adhesive solution. Step S2: Adhesive liquid molding. The adhesive liquid is processed into an adhesive film using a coating machine. The coating temperature range is 60~90℃, the coating speed range is 0.8~1.5m / min, the coating tension is 50~60N, and the resulting adhesive film thickness is 50~150μm. Step S3: Adhesive film curing. Adhere the adhesive film to the chip or substrate, then cure it at 120°C for 1-2 hours, followed by curing at 180°C for 2-3 hours to complete the product curing and shaping.

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