Copper electroplating solution for electroplating crystalline silicon solar cell and preparation method and application of copper electroplating solution
By using a copper plating solution containing a specific accelerator, the problems of poor binding force between the plating and the substrate, uneven thickness distribution and poor flatness are solved, and an efficient electroplating process and excellent solar cell performance are achieved.
CN120099598APending Publication Date: 2025-06-06DONGFANG HUANSHENG PHOTOVOLTAIC (JIANGSU) CO LTD
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Patent Information
- Application Number
- CN202510370663.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-26
- Publication Date
- 2025-06-06
Abstract
The invention provides a copper electroplating solution for electroplating a crystalline silicon solar cell as well as a preparation method and application of the copper electroplating solution, and relates to the technical field of metallization of solar cells. The copper electroplating solution for electroplating the crystalline silicon solar cell comprises copper sulfate pentahydrate, concentrated sulfuric acid, concentrated hydrochloric acid, a cylinder opening agent, a brightener, an accelerant and high-purity water, wherein the accelerant comprises one or a combination of more of glycine, aminopropionic acid and sodium propargyl sulfonate. Through combined use of the raw materials, a relatively good synergistic compatibility effect can be achieved. Experiments prove that the copper electroplating liquid can effectively improve the electroplating deposition speed, the current efficiency and the binding force of copper grid lines in the electroplating process of crystalline silicon solar cells.
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