Wafer caching device and semiconductor process equipment

Abstract

The application discloses a wafer caching device and a semiconductor process equipment. The wafer caching device comprises a protection box, one side of which is provided with an opening for wafer entry and exit, and a plurality of resting layers arranged along a first direction are arranged in the protection box, wherein the first direction is perpendicular to the movement direction of wafer entry and exit; at least one air blowing member is arranged on the side of the opening of the protection box in parallel with the first direction, the air blowing member comprises a first end and a second end, the first end is used for connecting an external air source, and a plurality of blowing holes arranged along the first direction are arranged on the side of the air blowing member facing the protection box, the blowing holes are one-to-one corresponding to the resting layers and are arranged staggeredly; a rotating mechanism corresponding to the air blowing member is arranged, the rotating mechanism is connected with the second end of the corresponding air blowing member and is used for driving the corresponding air blowing member to rotate, so that the airflow blown out of the blowing hole can cover the whole surface of the corresponding wafer. The application can blow and clean the whole wafer surface and remove corrosive gas.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing equipment technology, specifically to a wafer cache device and semiconductor process equipment. Background Technology

[0002] Wafer cache devices are used to store wafers that are to be processed or have been processed. Some semiconductor processes, such as CCP (Capacitively Coupled Plasma) etching, use corrosive gases such as C4F4, Cl2, and HF. These gases may remain on the surface of the processed wafer. If not controlled, these residual gases will continuously evaporate into the wafer cache device, corroding the wafer cache device, robotic fingers, and other equipment structures, increasing equipment maintenance and repair work.

[0003] Currently, the main method involves setting up air extraction ports on the wafer cache device and connecting them to the plant exhaust system to remove corrosive gases remaining in the wafer cache device. However, the airflow generated by this method is not targeted, and the removal effect is limited. Summary of the Invention

[0004] To address the aforementioned technical problems, this application provides a wafer cache device and semiconductor process equipment, which can improve the problem that existing wafer cache devices cannot effectively remove internal corrosive gases.

[0005] To address the aforementioned technical problems, in a first aspect, embodiments of this application provide a wafer cache device, comprising:

[0006] A protective box has an opening on one side for wafer entry and exit. The protective box contains multiple shelving layers arranged along a first direction for storing the wafer. The first direction is perpendicular to the direction of wafer entry and exit.

[0007] At least one air blowing element is disposed parallel to the first direction on the side of the protective box where the opening is located. The air blowing element includes a first end and a second end. The first end is used to connect to an external air source. The side of the air blowing element facing the inside of the protective box is provided with a plurality of blow holes arranged along the first direction. The plurality of blow holes correspond one-to-one with the plurality of shelf layers and are staggered. The blow holes are used to blow the wafers on the corresponding shelf layer.

[0008] A rotating mechanism corresponding to each of the air blowing elements is connected to the second end of the corresponding air blowing element and is used to drive the corresponding air blowing element to rotate so that the airflow blown out of the blow hole can cover the entire surface of the corresponding wafer.

[0009] Optionally, the protective box includes a first enclosure and a second enclosure disposed opposite to each other along the first direction;

[0010] The first enclosure is provided with a first connection hole corresponding to each of the at least one air blowing element, and the first end is rotatably connected to the corresponding first connection hole.

[0011] The second enclosure is provided with a second connecting hole corresponding to each of the at least one air blowing element, and the second end is rotatably connected to the corresponding second connecting hole.

[0012] Optionally, the wafer cache device further includes:

[0013] The connecting shaft is hollow and rotatably disposed in the first connecting hole, and the end of the connecting shaft facing the air blowing element is provided with a first external thread;

[0014] The first locking nut is connected to the connecting shaft via the first external thread;

[0015] The first end is provided with a first internal thread that mates with the first external thread, and the first locking nut is used to lock the first end after it is connected to the connecting shaft.

[0016] Optionally, the wafer cache device further includes a directional quick-connect connector;

[0017] The steering quick-connect joint includes:

[0018] The inner tube is connected to the end of the connecting shaft away from the air blowing element;

[0019] An outer tube is rotatably fitted onto the end of the inner tube away from the connecting shaft, and the end of the outer tube away from the inner tube is used to connect to the external air source.

[0020] Optionally, the rotating mechanism includes an output shaft and a drive assembly for driving the output shaft to rotate;

[0021] The output shaft rotatably passes through the second connecting hole and is connected to the second end.

[0022] Optionally, the output shaft is provided with a second external thread;

[0023] The second end is provided with a second internal thread that mates with the second external thread;

[0024] The output shaft is also provided with a second locking nut that is connected to the second external thread. The second locking nut is used to lock the second end after it is connected to the output shaft.

[0025] Optionally, the driving component includes:

[0026] The base includes a mounting surface facing the air blowing element, the mounting surface being provided with a groove;

[0027] A slider is disposed within the groove;

[0028] The crank is connected at one end to the slider;

[0029] A rocker arm, one end of which is hinged to the mounting surface and connected to the end of the output shaft away from the air blowing element, and the other end of the rocker arm is connected to the other end of the crank;

[0030] A drive source, connected to the slider, is used to drive the slider to reciprocate along the groove.

[0031] Optionally, it also includes a solenoid valve assembly connected between the air blowing component and the external air source. The solenoid valve assembly is also electrically connected to the rotating mechanism for receiving on / off signals, controlling the on / off of the external air source, and controlling the opening and closing of the rotating mechanism.

[0032] Optionally, the protective box includes:

[0033] The housing, wherein the opening is located on one side of the housing;

[0034] A support is disposed within the housing, and the plurality of shelving layers are arranged on the support along the first direction.

[0035] Optionally, two air blowing components are provided, located on opposite sides of the opening;

[0036] The housing is also provided with folded edges on both sides to conceal the two air blowing components.

[0037] In a second aspect, embodiments of this application provide a semiconductor process apparatus, including a front-end module, a loading chamber, a transfer chamber, and a process chamber connected in sequence.

[0038] The device front-end module is equipped with a wafer cache device as described in the above embodiments.

[0039] As described above, the wafer cache device of this application controls the rotation of the air blowing component through a rotating mechanism, allowing the blowing holes to blow air onto the wafer surface at different angles, achieving full coverage of the wafer surface. This accelerates the evaporation and removal of corrosive gases from the wafer surface, preventing corrosion of the overall structure of the wafer cache device and the robotic arm fingers. It also prevents corrosive gases from leaking outside the wafer cache device and corroding other structures or contaminating the wafers to be processed, effectively reducing equipment maintenance and repair work. Furthermore, the wafer cache device of this embodiment uses a conventional pressure air source, without the need to increase the air source pressure. Attached Figure Description

[0040] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0041] Figure 1 This is a schematic diagram of the structure of a wafer cache device in related technologies;

[0042] Figure 2 This is a schematic diagram of the structure of a wafer cache device provided in an embodiment of this application;

[0043] Figure 3 yes Figure 2 An exploded view of the wafer cache device;

[0044] Figure 4 This is a schematic diagram of the structure of an air blowing component provided in an embodiment of this application;

[0045] Figure 5 This is a schematic diagram illustrating the purge effect of a wafer cache device provided in an embodiment of this application;

[0046] Figure 6 This is a schematic diagram of a connecting shaft provided in an embodiment of this application;

[0047] Figure 7 This is a cross-sectional view of the connection between the first end of an air blowing component and the first connecting hole, provided in an embodiment of this application.

[0048] Figure 8 This is a schematic diagram of the connection structure at both ends of an air blowing component provided in an embodiment of this application;

[0049] Figure 9 This is a cross-sectional view of the connection between the second end of an air blowing component and the second connecting hole, provided in an embodiment of this application.

[0050] Figure 10 This is an exploded structural diagram of a rotating mechanism provided in an embodiment of this application;

[0051] Figure 11 This is a schematic diagram of the structure of a base provided in an embodiment of this application;

[0052] Figure 12 This is a schematic diagram of an air blowing control structure provided in an embodiment of this application;

[0053] Figure 13This is a schematic diagram of the structure of a semiconductor process equipment provided in an embodiment of this application.

[0054] The realization of the objectives, functional features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. The accompanying drawings have illustrated specific embodiments of this application, which will be described in more detail below. These drawings and textual descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this application to those skilled in the art through reference to specific embodiments. Detailed Implementation

[0055] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0056] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, components, features, and elements with the same names in different embodiments of this application may have the same meaning or different meanings, the specific meaning of which must be determined by its interpretation in that specific embodiment or further in conjunction with the context of that specific embodiment.

[0057] It should be further understood that the terms "comprising" or "including" indicate the presence of the stated features, steps, operations, elements, components, items, types, and / or groups, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, types, and / or groups. The terms "or," "and / or," and "comprising at least one of the following," as used in this application, can be interpreted as inclusive, or mean any one or any combination thereof. For example, "comprising at least one of the following: A, B, C" means "any one of the following: A; B; C; A and B; A and C; B and C; A and B and C," and similarly, "A, B, or C" or "A, B, and / or C" means "any one of the following: A; B; C; A and B; A and C; B and C; A and B and C." Exceptions to this definition only occur when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

[0058] It should be understood that although the terms first, second, third, etc., may be used in this document to describe various types of information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this document, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the singular forms “a,” “an,” and “the” used in this document are intended to also include the plural forms, unless the context indicates otherwise.

[0059] It should be understood that the terms "top", "bottom", "upper", "lower", "vertical", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application.

[0060] For ease of description, the following embodiments are all illustrated using an orthogonal space formed by a horizontal plane and a vertical direction as an example. This premise should not be construed as a limitation of this application.

[0061] As mentioned above, the current method mainly involves setting up an exhaust port on the wafer cache device and connecting it to the plant exhaust system to remove the corrosive gases remaining in the wafer cache device. However, the airflow generated by this method is not targeted and the removal effect is limited.

[0062] Please see Figure 1 , Figure 1 This is a schematic diagram of a wafer cache device in related technologies. It includes a mounting bracket 1a, a frame 2a, a wafer support 3a, a housing 4a, and an exhaust structure 5a. The mounting bracket 1a connects to the Equipment Front-End Module (EFEM) of the semiconductor process equipment. The frame 2a supports the wafer support 3a and connects to other structures. The wafer support 3a is a supporting component for the wafers. The housing 4a is an external shield for the wafer cache device, reducing gas leakage into the EFEM. The exhaust structure 5a connects to the plant's exhaust pipe to discharge waste gas from the wafer cache device, preventing contamination. However, the airflow generated during exhaust in this wafer cache device is not targeted, failing to ensure complete purging of each wafer, resulting in limited cleaning effectiveness. Therefore, this application provides a process chamber and semiconductor process equipment.

[0063] Please see Figure 2 and Figure 3 , Figure 2 This is a schematic diagram of the structure of a wafer cache device provided in an embodiment of this application. Figure 3 yes Figure 2An exploded view of a wafer cache device, which may include: a protective box 10, at least one air blowing element 20, and a rotating mechanism 24 corresponding to the air blowing element 20.

[0064] The protective box 10 has an opening 111 on one side for wafer entry and exit. The protective box 10 contains multiple shelf layers 123 arranged along a first direction Z for storing wafers. The first direction Z is perpendicular to the wafer entry and exit direction X. As an example, each shelf layer 123 can form a three-point support with the edge of the wafer.

[0065] The air blowing component 20 can be a tubular structure, and the shape of the cross-section of the tubular structure is not limited. One, two, or more air blowing components 20 can be provided. The air blowing component 20 is positioned parallel to the first direction Z on the side of the protective box 10 where the opening 111 is located. Taking two air blowing components 20 as an example, they can be located on opposite sides of the opening 111. The air blowing component 20 includes a first end 21 and a second end 22. The first end 21 is used to connect to an external air source, which can be N2 or XCDA. The side of the air blowing component 20 facing the inside of the protective box 10 has multiple purge holes 23 arranged along the first direction Z, such as... Figure 4 As shown, the purge holes 23 correspond one-to-one with the shelf layers 123 and are staggered. The purge holes 23 are used to purge the wafers on the corresponding shelf layers 123. For example, the diameter of the purge holes 23 can be 1 mm, and the spacing between the purge holes 23 is equal to the spacing between two adjacent shelf layers 123, which can be 10 mm. When the wafer is placed on the shelf layer 123, the purge holes 23 are aligned with the gaps between the wafers.

[0066] The rotating mechanism 24 corresponds one-to-one with the air blowing element 20. The rotating mechanism 24 is connected to the second end 22 of the corresponding air blowing element 20 and is used to drive the corresponding air blowing element 20 to rotate so that the airflow blown out of the blow hole 23 can cover the entire surface of the corresponding wafer. As an example, the rotating mechanism 24 can be a motor, which directly controls the rotation of the air blowing element 20. The embodiments of this application do not impose any particular limitation on the rotating mechanism 24.

[0067] Please see Figure 5 , Figure 5This is a schematic diagram illustrating the purging effect of a wafer cache device provided in this embodiment. By controlling the rotation of the air blowing element 20 through the rotating mechanism 24, the purging holes 23 can be used to blow air onto the wafer surface at different angles, achieving full coverage of the wafer surface. This accelerates the evaporation and removal of corrosive gases from the wafer surface, preventing corrosion of the overall structure of the wafer cache device and the robotic fingers. It also prevents corrosive gases from leaking outside the wafer cache device and corroding other structures or contaminating the wafers to be processed, effectively reducing equipment maintenance and repair work. Furthermore, the wafer cache device in this embodiment can use a conventional pressure air source without increasing the air source pressure. In particular, when two air blowing elements 20 are provided, they can respectively form a purging area A and a purging area B, providing better purging of the wafer edges and ensuring complete coverage of the entire wafer.

[0068] As an example of a protective case, please continue reading. Figure 2 and Figure 3 The protective box 10 may include a housing 11 and a support 12. The housing 11 may be made of an insulating material, such as acrylic, and the support 12 may be made of aluminum alloy. To improve its corrosion resistance, the surface may be anodized. An opening 111 may be located on one side of the housing 11, for example, on... Figure 2 The front side of the inner shell 11. A bracket 12 is disposed inside the shell 11, and a shelf 123 is arranged along the first direction Z on the bracket 12. The shelf 123 can be made of polyetheretherketone (PEEK). An external air extraction structure 13 can also be connected to the shell 11. When air is blown into the protective box 10 by the air blowing component 20, air can be simultaneously extracted outward by the air extraction structure 13 to discharge the corrosive gases inside the protective box 10. The specific shape of the shell 11 is not particularly limited in this embodiment. For example, the shell 11 may include a top plate 113, a bottom plate 114, and side panels 115, with an opening 111 disposed on the side panels 115. The side panels 115 can be an integrally formed panel or can be formed by splicing and assembling multiple panels.

[0069] Taking the example of having two air blowing components 20, the two air blowing components 20 can be located on opposite sides of the opening 111, parallel to the first direction Z. The housing 11 can also be provided with folded edges 112 on the opposite sides, and the air blowing components 20 are inside the protective box 10 and located behind the folded edges 112, thus being hidden.

[0070] In one embodiment, please continue reading Figure 2 and Figure 3The protective box 10 may include a first enclosure 121 and a second enclosure 122 disposed opposite to each other along the first direction Z. It should be noted that the first enclosure 121 may be the aforementioned top plate 113 or a part of the support 12; the second enclosure 122 may be the aforementioned bottom plate 114 or a part of the support 12. The embodiments of this application are not particularly limited.

[0071] The first enclosure plate 121 is provided with first connecting holes 1211 corresponding to the air blowing components 20. The first end 21 of the air blowing component 20 is rotatably connected to the corresponding first connecting hole 1211. It should be noted that the first end 21 can be rotatably connected directly to the corresponding first connecting hole 1211, or it can be rotatably connected indirectly to the corresponding first connecting hole 1211 through other connecting components. This application embodiment does not make any special limitation.

[0072] The second enclosure 122 is provided with second connecting holes 1221 corresponding to the air blowing components 20. The second end 22 of the air blowing component 20 is rotatably connected to the corresponding second connecting hole 1221. It should be noted that the second end 22 can be rotatably connected directly to the corresponding second connecting hole 1221, or it can be rotatably connected indirectly to the corresponding second connecting hole 1221 through other connecting components. This application embodiment does not make any special limitation.

[0073] In this embodiment, the air blowing component 20 is assembled along the first direction Z by the first enclosure plate 121 and the second enclosure plate 122, and the air blowing component 20 is rotatably connected so that the airflow blown by the air blowing component 20 can cover the entire surface of the corresponding wafer.

[0074] As an example of a first end 21 being rotatably and indirectly connected to a corresponding first connecting hole 1211 via other connectors, please refer to Figure 3 , Figure 4 , Figures 6-8 , Figure 6 This is a schematic diagram of a connecting shaft provided in an embodiment of this application. Figure 7 This is a cross-sectional view of the connection between the first end of an air blowing component and the first connecting hole, according to an embodiment of this application. Figure 8This is a schematic diagram of the connection structure at both ends of an air blowing component provided in an embodiment of this application. The wafer cache device may further include a connecting shaft 30 and a first locking nut 41. The connecting shaft 30 is hollow (with a through hole 31 inside) and is rotatably disposed within the first connecting hole 1211 of the first enclosure plate 121. Dust-free grease can be used to lubricate and seal the contact surface between the connecting shaft 30 and the first connecting hole 1211 to ensure that no particles enter the wafer cache device. The end of the connecting shaft 30 facing the air blowing component 20 has a first external thread, and the first end 21 of the air blowing component 20 has a first internal thread that mates with the first external thread. The first locking nut 41 is connected to the connecting shaft 30 via the first external thread, and when the first end 21 is connected to the connecting shaft 30 via the threaded structure, the first locking nut 41 can be tightened onto one end of the air blowing component 20 to lock the air blowing component 20 and the connecting shaft 30. In practical applications, the air blowing hole 23 of the air blowing component 20 can be adjusted to a suitable spray angle, and then locked with the first locking nut 41.

[0075] In one embodiment, please continue reading Figure 7 The wafer cache device may also include a quick-connect swivel joint 50. The quick-connect swivel joint 50 may include an inner tube 51 and an outer tube 52. The inner tube 51 is connected to the end of the connecting shaft 30 away from the air blower 20, for example, via a threaded connection. The outer tube 52 is rotatably fitted onto the end of the inner tube 51 away from the connecting shaft 30, and the end of the outer tube 52 away from the inner tube 51 is used to connect to an external air source. When the air blower 20 rotates, the outer tube 52 can remain stationary to ensure a stable connection to the external air source.

[0076] In one embodiment, see Figure 3 , Figure 4 , Figure 8 and Figure 9 , Figure 9 This is a cross-sectional view of an air blowing component connected to a second connecting hole according to an embodiment of this application. The rotating mechanism 24 may include an output shaft 241 and a drive assembly for driving the output shaft 241 to rotate. The output shaft 241 rotatably passes through the second connecting hole 1221 of the second enclosure plate 122 and is connected to the second end 22 of the air blowing component 20.

[0077] As an example, please continue reading Figure 9A second external thread can be provided on the output shaft 241, and a second internal thread that mates with the second external thread is provided on the second end 22 of the air blowing component 20. A second locking nut 42 that mates with the second external thread is also provided on the output shaft 241. The second locking nut 42 is used to lock the connection between the second end 22 and the output shaft 241. For example, after the air blowing hole 23 of the air blowing component 20 is adjusted to a suitable spray angle, the second locking nut 42 is tightened towards the second end 22, thereby locking the connection between the air blowing component 20 and the output shaft 241.

[0078] It should be noted that the rotating mechanism 24 can be a reciprocating mechanism, such as a cam mechanism, a crank-rocker mechanism, a crank-slider mechanism, etc. For one embodiment, please refer to... Figure 10 and Figure 11 , Figure 10 This is an exploded structural diagram of a rotating mechanism provided in an embodiment of this application. Figure 11 This is a schematic diagram of the structure of a base provided in an embodiment of this application. The rotating mechanism 24 may include an output shaft 241 and a drive assembly for driving the output shaft 241 to rotate. The drive assembly may include: a base 242, a slider 243, a crank 244, a rocker arm 245, and a drive source 246.

[0079] The base 242 includes a mounting surface 2421 facing the air blowing element 20, and the mounting surface 2421 is provided with a groove 2422. A slider 243 is disposed within the groove 2422. One end of a crank 244 is connected to the slider 243. One end of a rocker arm 245 is hinged to the mounting surface 2421 and connected to the end of the output shaft 241 away from the air blowing element 20; the other end of the rocker arm 245 is connected to the other end of the crank 244. A drive source 246 is connected to the slider 243 and is used to drive the slider 243 to reciprocate along the groove 2422. The drive source 246 can be a low-speed cylinder, driven and controlled by an air source.

[0080] This embodiment uses a crank-slider mechanism to achieve the reciprocating rotation of the output shaft 241, thereby driving the rotation of the air blowing component 20. For an example, please refer to the following... Figure 10 The rotating mechanism 24 may also include a top cover 247, which covers the base 242. The two can be connected by screws 2422 to install the crank-slider mechanism inside. A through hole 2471 can be formed in the top cover 247 to allow the output shaft 241 to extend from the through hole 2471. Furthermore, the top cover 247 can be connected to the bottom of the protective box by screws 2472, thereby achieving assembly and fixation of the entire rotating mechanism 24.

[0081] In one embodiment, see Figure 12 , Figure 12This is a schematic diagram of a blowing control structure provided in an embodiment of this application. The wafer cache device may further include a solenoid valve assembly 60, which is connected between the blowing element 20 and an external air source. For example, the solenoid valve assembly 60 may be connected to a quick-connect coupling 50. The solenoid valve assembly 60 is also electrically connected to the rotating mechanism 24 to receive on / off signals, control the on / off of the external air source, and control the opening and closing of the rotating mechanism 24. When there are no wafers in the wafer cache device, the blowing function is stopped to reduce air source waste.

[0082] The wafer buffer device may further include a manual switch 70, a pressure regulating valve 80, and a digital pressure switch 90. The manual switch 70 serves as an external start / stop component, enabling the mechanical switching of the external air supply. The pressure regulating valve 80 and the digital pressure switch 90 work together to adjust the appropriate pressure for the purging function, achieving the best purging effect.

[0083] This application also provides a semiconductor process apparatus; please refer to [link / reference]. Figure 13 , Figure 13 This is a schematic diagram of a semiconductor process equipment provided in an embodiment of this application. The semiconductor process equipment may include an Equipment Front End Module (EFEM) 100, a Load Lock 200, a Transfer Chamber (TC) 300, and a Process Chamber (PM) 400 connected in sequence. The Equipment Front End Module 100 is equipped with wafer cache devices as described in the above embodiments. Multiple wafer cache devices can be provided; some can be used to store wafers to be processed, and some can store wafers that have already been processed. Two Load Lock Chambers 200 can be provided, namely LLA and LLB, one for wafer inlet and the other for wafer outlet. Multiple Process Chambers 400 (PM1, PM2, PM3, PM4) can be arranged around the Transfer Chamber 300 to improve production efficiency. The Process Chambers 400 can be used for CCP etching processes.

[0084] The wafer transfer process is as follows: the atmospheric EFEM converts the atmosphere to vacuum via the LLA, and a vacuum robot removes the wafer from the LLA, then places it in the PM via the TC for etching. After the etching process is completed, the vacuum robot removes the wafer again, places it in the LLB via the TC and returns it to the EFEM, where it is then taken away by an overhead crane for the next process.

[0085] For other working principles and processes of the semiconductor process equipment in this embodiment, please refer to the description of the wafer cache device in the foregoing embodiments of the present invention, which will not be repeated here.

[0086] The foregoing has provided a detailed description of a wafer cache device and semiconductor process equipment provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. It should be noted that the descriptions of each embodiment in this application have different emphases; parts not described in detail in a particular embodiment can be referred to in the relevant descriptions of other embodiments.

[0087] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. The technical features of the technical solution of this application can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are also included within the patent protection scope of this application, as long as the combination of these technical features does not contradict each other.

Claims

1. A wafer cache device, characterized in that, include: A protective box has an opening on one side for wafer entry and exit. The protective box contains multiple shelving layers arranged along a first direction for storing the wafer. The first direction is perpendicular to the direction of wafer entry and exit. At least one air blowing element is disposed parallel to the first direction on the side of the protective box where the opening is located. The air blowing element includes a first end and a second end. The first end is used to connect to an external air source. The side of the air blowing element facing the inside of the protective box is provided with a plurality of blow holes arranged along the first direction. The plurality of blow holes correspond one-to-one with the plurality of shelf layers and are staggered. The blow holes are used to blow the wafers on the corresponding shelf layer. A rotating mechanism corresponding to each of the air blowing elements, the rotating mechanism being connected to the second end of the corresponding air blowing element, is used to drive the corresponding air blowing element to rotate relative to the shelf layer, so that the airflow blown out by the blow hole can cover the entire surface of the corresponding wafer. The protective box includes a first enclosure and a second enclosure disposed opposite to each other along the first direction; The first enclosure is provided with a first connection hole corresponding to each of the at least one air blowing element, and the first end is rotatably connected to the corresponding first connection hole. The second enclosure is provided with a second connecting hole corresponding to each of the at least one air blowing element, and the second end is rotatably connected to the corresponding second connecting hole.

2. The wafer cache device according to claim 1, characterized in that, Also includes: The connecting shaft is hollow and rotatably disposed in the first connecting hole, and the end of the connecting shaft facing the air blowing element is provided with a first external thread; The first locking nut is connected to the connecting shaft via the first external thread; The first end is provided with a first internal thread that mates with the first external thread, and the first locking nut is used to lock the first end after it is connected to the connecting shaft.

3. The wafer cache device according to claim 2, characterized in that, It also includes a steering quick-connect fitting; The steering quick-connect joint includes: The inner tube is connected to the end of the connecting shaft away from the air blowing element; An outer tube is rotatably fitted onto the end of the inner tube away from the connecting shaft, and the end of the outer tube away from the inner tube is used to connect to the external air source.

4. The wafer cache device according to claim 1, characterized in that, The rotating mechanism includes an output shaft and a drive assembly for driving the output shaft to rotate; The output shaft rotatably passes through the second connecting hole and is connected to the second end.

5. The wafer cache device according to claim 4, characterized in that, The output shaft is provided with a second external thread; The second end is provided with a second internal thread that mates with the second external thread; The output shaft is also provided with a second locking nut that is connected to the second external thread. The second locking nut is used to lock the second end after it is connected to the output shaft.

6. The wafer cache device according to claim 4, characterized in that, The driving component includes: The base includes a mounting surface facing the air blowing element, the mounting surface being provided with a groove; A slider is disposed within the groove; The crank is connected at one end to the slider; A rocker arm, one end of which is hinged to the mounting surface and connected to the end of the output shaft away from the air blowing element, and the other end of the rocker arm is connected to the other end of the crank; A drive source, connected to the slider, is used to drive the slider to reciprocate along the groove.

7. The wafer cache device according to any one of claims 1-6, characterized in that, It also includes a solenoid valve assembly connected between the air blowing component and the external air source. The solenoid valve assembly is also electrically connected to the rotating mechanism and is used to receive on / off signals, control the on / off of the external air source, and control the opening and closing of the rotating mechanism.

8. The wafer cache device according to claim 1, characterized in that, The protective box includes: The housing, wherein the opening is located on one side of the housing; A support is disposed within the housing, and the plurality of shelving layers are arranged on the support along the first direction.

9. The wafer cache device according to claim 8, characterized in that, Two air blowing components are provided, located on opposite sides of the opening; The housing is also provided with folded edges on both sides to conceal the two air blowing components.

10. A semiconductor process apparatus, characterized in that, It includes a front-end module, a loading chamber, a transfer chamber, and a process chamber connected in sequence; The device front-end module is provided with a wafer cache device as described in any one of claims 1-9.

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