Bisphenol af diglycidyl ether, method for preparing the same, and adhesive prepared using the same and method for preparing the same

Abstract

The application belongs to the technical field of epoxy resin, and particularly relates to a bisphenol AF type glycidyl ether, a preparation method thereof, and an adhesive prepared from the bisphenol AF type glycidyl ether and a preparation method thereof. The preparation method of the bisphenol AF type glycidyl ether comprises the following steps: stirring and dissolving bisphenol AF and epichlorohydrin in a reaction container, heating and maintaining, then adding a catalyst, heating again to perform ring-opening reaction, removing excess epichlorohydrin by rotary evaporation after the reaction is completed and recycling; adding NaOH solution dropwise to perform ring-closing reaction at room temperature to obtain a crude product of ring-closed chlorohydrin ether solution; adding the crude product of ring-closed chlorohydrin ether solution into a reaction container, dissolving by adding an organic solvent, heating and refluxing, washing, and then removing the solvent by rotary evaporation to obtain the bisphenol AF type glycidyl ether. The bisphenol AF type glycidyl ether has excellent productivity and operability, and is low in viscosity and excellent in anti-blocking property.

Description

Technical Field

[0001] This invention belongs to the field of epoxy resin technology, specifically relating to bisphenol AF diglycidyl ether and its preparation method, as well as adhesives prepared using the same and their preparation methods. Background Technology

[0002] Epoxy resins possess excellent adhesion, water resistance, mechanical strength, and electrical properties, making them widely used in various fields such as adhesives, coatings, civil engineering materials, and insulating materials for electrical and electronic components. In particular, they are extensively used in the electrical and electronic fields for insulating injection molding, laminated materials, and sealing materials. Therefore, epoxy resins are widely applied in all sectors of the national economy: from high-tech fields to general technology fields, from defense and military industries to civilian industries, and even in people's daily lives.

[0003] There are many publicly available reports on the synthesis and preparation of epoxy resins. In addition to bisphenol A type epoxy resins and phenolic type epoxy resins, there are also many publicly available reports on the preparation methods of glycidylamine type epoxy resins.

[0004] As epoxy resins have become increasingly important materials for electrical and electronic components such as laminates used in electrical and electronic circuits in recent years, low viscosity (low melt viscosity) has become a growing requirement. This is because, compared to existing multilayer circuit boards, the content of particulate fillers such as silica is increased to improve dimensional stability associated with thinner designs and to suppress energy loss in communication signals due to increased information volume and communication speed. However, when high filler content is used to suppress energy loss in communication signals, the flowability of the epoxy resin composition is impaired; therefore, to improve this reduced flowability, a low viscosity epoxy resin is desirable.

[0005] Bisphenol AF type epoxy resin has excellent dielectric properties, so it is often used in laminates for electrical and electronic circuits. However, bisphenol AF type diglycidyl ether is viscous and difficult to handle when it is in liquid form. In addition, its solid form has a high viscosity when melted.

[0006] In bisphenol AF type diglycidyl ethers, when there is one repeating unit of bisphenol AF (n=0 units), it is crystalline. However, when there are two or more repeating units (n≥1 units), it is resinous, and therefore its properties change to a viscous liquid at room temperature.

[0007] Patent CN100465206C discloses a method for preparing a glycidylamine type multifunctional epoxy resin. Its main feature is that an aromatic amine compound is reacted with epichlorohydrin to produce tetrachloropropanol, which is then cyclized under alkaline conditions to obtain a multifunctional epoxy resin.

[0008] Patent CN117586476A discloses an epoxy resin-based electronic potting compound. It is prepared by mixing a self-made fluorinated epoxy resin with a bisphenol A type epoxy resin, and then compounding it with a curing agent, filler, and related additives. The resulting potting compound exhibits good sealing properties and thermal conductivity. Performance tests show that the cured potting compound has a high glass transition temperature (greater than 108℃), a low coefficient of thermal expansion, a dielectric constant below 3.1, a dielectric loss below 0.03, a tensile strength greater than 98MPa, and a water absorption rate less than 0.25%. The product has low internal stress and good compatibility with electronic devices, making it widely applicable for the encapsulation of precision electronic components.

[0009] Patent CN116745274A discloses a bisphenol AF type diglycidyl ether, its manufacturing method, curable composition, cured product, electrical and electronic components, insulating materials, laminates for electrical and electronic circuits, and polycrystalline bisphenol AF type diglycidyl ether. The bisphenol AF type diglycidyl ether has a fast crystallization speed and excellent productivity. In addition, it is a crystalline solid with excellent operability, and has low viscosity and excellent anti-blocking properties. Summary of the Invention

[0010] To address the shortcomings of existing technologies, the present invention aims to provide a bisphenol AF diglycidyl ether that exhibits rapid crystallization, excellent production rate, good compatibility with various epoxy resins, and good chemical reactivity in improving hydrophobicity and dielectric properties.

[0011] This invention also provides a scientific and reasonable preparation method.

[0012] The present invention also provides adhesives prepared using the same, which have a reasonable formulation and good performance.

[0013] This invention also provides a simple and easy method for preparing adhesives.

[0014] The bisphenol AF diglycidyl ether of the present invention has the following molecular structure as shown in Formula I:

[0015]

[0016] The preparation method of bisphenol AF diglycidyl ether according to the present invention includes the following steps:

[0017] (1) Add bisphenol AF and epichlorohydrin to a reaction vessel and stir to dissolve. Heat and maintain the temperature. Then add a catalyst and heat again to carry out the ring-opening reaction. After the reaction is completed, remove excess epichlorohydrin by rotary evaporation and recycle it.

[0018] (2) Add a 30 wt.% NaOH solution to carry out a closed-ring reaction to obtain the crude product of bisphenol AF diglycidyl ether;

[0019] (3) Add the crude product of bisphenol AF diglycidyl ether to a reaction vessel, add organic solvent, heat and stir to dissolve into a homogeneous phase, wash, and remove the solvent by rotary evaporation to obtain bisphenol AF diglycidyl ether.

[0020] The heating and maintenance step (1) is to heat to 50-60℃ and maintain for 5-30 min, preferably to heat to 50℃ and maintain for 5 min. The ring-opening reaction temperature in step (1) is 70-110℃ and the reaction time is 5-20 h. The molar ratio of bisphenol AF to epichlorohydrin in step (1) is 1:2-10.

[0021] Preferably, the ratios are 1:5, 1:6, 1:7, 1:8, 1:9, or 1:10. More preferably, it is 1:10. At higher epichlorohydrin (ECH) molar ratios (e.g., 1:10), an excess of ECH as a reactant can drive the reaction towards the target product more effectively because it increases the probability of reactant collisions and the likelihood of epoxy resin formation. An excess of ECH typically leads to an increased concentration of epoxy groups in the epoxy resin, resulting in a higher epoxy value.

[0022] The catalyst in step (1) is one or more of tetramethylammonium bromide, tetraethylammonium bromide, tetrabutylammonium bromide, tetrabutylammonium chloride, benzyltriethylammonium chloride, benzyltriethylammonium bromide, tetramethylammonium chloride, tetraethylammonium chloride, benzyltriethylammonium chloride, benzyltriethylammonium bromide, benzyltrimethylammonium chloride, benzyltrimethylammonium bromide, benzyltributylammonium chloride, and benzyltributylammonium bromide; the mass ratio of the catalyst to bisphenol AF is 0.02-0.5:1.

[0023] Preferably, the mass ratio of the catalyst to bisphenol AF is 0.02-0.1:1.

[0024] Step (1) removes excess ECH to prevent ECH from reacting with sodium hydroxide and hydrolyzing to produce byproducts. Higher sodium hydroxide concentration results in better catalytic effect and is more conducive to the ring-closing reaction in step (2). The reaction time is 4-5 hours, and the molar ratio of sodium hydroxide is greater than 2. In addition to participating in the reaction, it also plays a catalytic role.

[0025] The dropping rate in step (2) is 20 drops / min-40 drops / min, the temperature of the closed-loop reaction in step (2) is 30-40℃, the time is 6-20h, and the molar ratio of NaOH to bisphenol AF in step (2) is 2-3:1.

[0026] The mass ratio of the organic solvent to the crude bisphenol AF diglycidyl ether product in step (3) is 1-10:1, and the organic solvent in step (3) is one or more of toluene, xylene, chlorobenzene, o-dichlorobenzene, and heptane.

[0027] Toluene is preferred.

[0028] The heating and stirring process in step (3) involves a temperature of 70-90℃ and a time of 30-60 minutes.

[0029] Preferably, the heating and stirring dissolution in step (3) is carried out at a temperature of 70°C for 30 minutes.

[0030] The temperature of rotary evaporation in step (3) is 90-180℃, and the time is 2-10h.

[0031] The adhesive prepared using bisphenol AF diglycidyl ether according to the present invention comprises the following components in parts by weight:

[0032]

[0033] More preferably, it includes the following components in parts by mass:

[0034]

[0035] The method for preparing the adhesive according to the present invention includes the following steps:

[0036] Bisphenol AF diglycidyl ether and QCA-48995 were added to a container, heated and stirred until homogeneous, cooled to room temperature, and then DMAB136-2.9 and DMDAC238-1.68 were added and stirred until homogeneous to obtain the adhesive.

[0037] QCA-48995, DMAB136-2.9, and DMDAC238-1.68 are commercially available products of Zhejiang Yingruiyun New Materials Technology Co., Ltd.

[0038] The temperature for heating and stirring is 80-100℃. Preferably, the temperature for heating and stirring is 80℃.

[0039] The bisphenol AF diglycidyl ether of the present invention, such as Figure 3 , Figure 4 The bisphenol AF type diglycidyl ether shown has a melting point and a small molecular weight. Therefore, when the bisphenol AF type diglycidyl ether of the present invention is heated or otherwise heated, it melts, and the viscosity is immediately suppressed to a low level after melting. Furthermore, at room temperature, the surface of the bisphenol AF type diglycidyl ether of the present invention is dry, thus exhibiting excellent anti-blocking properties.

[0040] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0041] 1) This invention reduces hydrolysis in the epichlorohydrin reaction and reduces the generation of solid waste.

[0042] 2) The bisphenol AF type diglycidyl ether of the present invention exhibits excellent productivity and operability, and is characterized by low viscosity and excellent anti-blocking properties. The bisphenol AF type diglycidyl ether of the present invention can reduce the viscosity of the curable composition, thus enabling an increase in the amount of filler added and improved impregnation in glass cloth.

[0043] 3) The ring-closure reaction of this invention does not require the addition of an organic solvent because the etherified product obtained from the reaction is immiscible with toluene. During the addition of alkaline solution, it separates into layers and cannot form a clear ring-closure reaction solution. After the ring closure is completed, an organic solvent is added for extraction without the addition of alkaline solution, resulting in an organic solvent glycidyl ether solution and an aqueous layer. After filtration and separation, solid waste and liquid waste are removed. Washing only requires pure water, without the need for hot alkaline water, which is environmentally friendly. The resulting product has a lower chloride value and higher purity.

[0044] 4) After the closed-loop process is completed in this invention, organic solvent extraction is added. Avoiding the addition of alkaline solution has the following advantages:

[0045] Simple operation: Omitting the alkali addition step simplifies the operation procedure, making the process more efficient and easier to control. At the same time, it reduces the complexity of the liquid system, facilitating subsequent separation and purification.

[0046] Lower chloride value: In this process, the product has a lower chloride value, which may be because the reaction between the alkali solution and chloride is avoided, thereby reducing the formation of chloride and maintaining the purity of the final product;

[0047] Improving purity: Direct extraction with organic solvents without adding alkali may make it easier to separate the target product from impurities, thus improving the purity of the final product.

[0048] Simplified waste treatment: Solid and liquid waste are removed by filtration and separation, which reduces the difficulty and cost of subsequent waste treatment. Because the waste liquid generated is more homogeneous and easier to treat, it can be removed without the addition of alkali.

[0049] 5) The process of this invention is simple, the cost is low, and it can be mass-produced.

[0050] 6) The epoxy value of the bisphenol AF type diglycidyl ether obtained by the present invention is greater than or equal to 0.40. Attached Figure Description

[0051] Figure 1 This is the infrared spectrum of bisphenol AF diglycidyl ether obtained in Example 1;

[0052] Figure 2 This is the 1H NMR spectrum of bisphenol AF diglycidyl ether obtained in Example 1;

[0053] Figure 3 This is the DSC chromatogram of bisphenol AF diglycidyl ether obtained in Example 1;

[0054] Figure 4 This is the DSC chromatogram of bisphenol AF diglycidyl ether obtained in Example 2;

[0055] Figure 5 The DSC diagram of bisphenol AF diglycidyl ether obtained in Comparative Example 2 is shown.

[0056] Figure 6 This is the temperature-viscosity curve of the adhesive obtained in Example 1;

[0057] Figure 7 This is the temperature-gelation curve of the adhesive obtained in Example 1;

[0058] Figure 8 This is a dielectric loss curve of the adhesive obtained in Example 1;

[0059] Figure 9 This is a capacitance curve of the adhesive obtained in Example 1;

[0060] Figure 10 This is a graph showing the relative permittivity of the adhesive obtained in Example 1;

[0061] Figure 11 This is a non-isothermal curing kinetic curve of the adhesive obtained in Example 1;

[0062] Figure 12 The adhesive obtained in Example 1 right The linear fitting curve;

[0063] Figure 13 The lnβ of the adhesive obtained in Example 1 is relative to 1 / T p The linear fitting curve;

[0064] Figure 14 This is a graph showing the ultraviolet transmittance of the adhesive obtained in Example 1. Detailed Implementation

[0065] The present invention will be further described below with reference to the embodiments.

[0066] Unless otherwise specified, all raw materials used in the examples were commercially available.

[0067] Example 1

[0068] The preparation method of the aforementioned bisphenol AF diglycidyl ether includes the following steps:

[0069] (1) 168g (0.5 mol) of bisphenol AF and 462.5g (5 mol) of epichlorohydrin were added to a four-necked flask and heated and stirred at 50°C for 5 min to dissolve. Then, 3.3g of tetrabutylammonium bromide was added and reacted at 100°C for 5 h. The excess epichlorohydrin was removed by rotary evaporation (recycled). The recovery rate was 90.5%.

[0070] (2) Cool to room temperature, add 30 wt.% sodium hydroxide solution at 40°C, the molar ratio of NaOH to bisphenol AF is 2.1:1, react for 6 h, and obtain 227.5 g of crude bisphenol AF diglycidyl ether product;

[0071] (3) Add 300g of toluene to the crude bisphenol AF diglycidyl ether product, heat to 90℃ and stir for 1h to form a homogeneous phase. Filter and wash to remove the sodium chloride produced in the reaction. Wash 5 times with hot water at 75±5℃. Rotate the obtained bisphenol AF diglycidyl ether toluene solution at 90℃ for 2h to obtain 223.7g of transparent liquid (theoretical 244g). After cooling, it becomes a white solid, which is bisphenol AF diglycidyl ether, with a yield of 91.7%. Its infrared spectrum is as follows: Figure 1 As shown, its hydrogen NMR spectrum is as follows: Figure 2 As shown, the epoxy value is 0.42, and its DSC diagram is as follows. Figure 3 As shown, the melting point is 72.4℃.

[0072] The adhesive prepared using bisphenol AF diglycidyl ether comprises the following components in parts by weight:

[0073]

[0074] The method for preparing the adhesive includes the following steps:

[0075] Bisphenol AF diglycidyl ether and QCA-48995 were added to a container, heated to 80℃ and stirred until homogeneous. After cooling to room temperature, DMAB136-2.9 and DMDAC238-1.68 were added and stirred until homogeneous to obtain adhesive JQD-1. Its curing conditions are RT-60℃ / 0.5h-80℃ / 0.5h-120℃ / 1h-RT.

[0076] Example 2

[0077] The preparation method of the aforementioned bisphenol AF diglycidyl ether includes the following steps:

[0078] (1) 67.2 g (0.2 mol) of bisphenol AF and 185 g (2 mol) of epichlorohydrin were added to a four-necked flask and heated and stirred at 50 °C for 5 min to dissolve. Then, 1.3 g of tetrabutylammonium bromide was added and reacted at 100 °C for 5 h. The excess epichlorohydrin was removed by rotary evaporation (recycled). The recovery rate was 92.7%.

[0079] (2) Cool to room temperature, add 30 wt.% sodium hydroxide solution at 35°C, the molar ratio of NaOH to bisphenol AF is 2.1:1, react for 10 h, and obtain 80.4 g of crude bisphenol AF diglycidyl ether product;

[0080] (3) Add 160g of toluene to the crude bisphenol AF diglycidyl ether product, heat to 90℃ and stir for 1h to form a homogeneous phase. Filter and wash to remove the sodium chloride produced in the reaction. Wash 5 times with hot water at 75±5℃. Rotary evaporate the resulting resin toluene solution at 90℃ for 2h to obtain 78.6g of transparent liquid (theoretical 89.6g). After cooling, it becomes a white solid, which is the bisphenol AF epoxy resin, with a yield of 87.7% and an epoxy value of 0.41. Its DSC chromatogram is shown below. Figure 4 As shown, the melting point is 66.2℃.

[0081] The adhesive prepared using bisphenol AF diglycidyl ether comprises the following components in parts by weight:

[0082]

[0083] The method for preparing the adhesive includes the following steps:

[0084] Bisphenol AF diglycidyl ether and QCA-48995 were added to a container, heated to 80℃ and stirred until homogeneous. After cooling to room temperature, DMAB136-2.9 and DMDAC238-1.68 were added and stirred until homogeneous to obtain adhesive JQD-1. Its curing conditions are RT-60℃ / 0.5h-80℃ / 0.5h-120℃ / 1h-RT.

[0085] Example 3

[0086] The preparation method of the aforementioned bisphenol AF diglycidyl ether includes the following steps:

[0087] (1) 67.2 g (0.2 mol) of bisphenol AF and 92.5 g (1 mol) of epichlorohydrin were added to a four-necked flask and heated and stirred at 50 °C for 20 min to dissolve. Then, 1.3 g of tetrabutylammonium bromide was added and reacted at 90 °C for 6 h. The excess epichlorohydrin was removed by rotary evaporation (recycled). The recovery rate was 89.1%.

[0088] (2) After cooling to room temperature, a 30 wt.% sodium hydroxide solution was added dropwise at 30°C. The molar ratio of NaOH to bisphenol AF was 2.1:1. After reacting for 20 h, 78.5 g of crude bisphenol AF diglycidyl ether was obtained.

[0089] (3) Add 160g of toluene to the crude product of bisphenol AF diglycidyl ether, heat to 90℃ and stir for 1h to form a homogeneous phase, filter and wash to remove sodium chloride produced in the reaction, wash 5 times with hot water at 75±5℃, and rotary evaporate the obtained resin toluene solution at 90℃ for 2h to obtain 74.3g of transparent liquid (theoretical 89.6g), which turns into a white solid after cooling, which is bisphenol AF epoxy resin with a yield of 82.9% and an epoxy value of 0.40.

[0090] The adhesive prepared using bisphenol AF diglycidyl ether comprises the following components in parts by weight:

[0091]

[0092] The method for preparing the adhesive includes the following steps:

[0093] Bisphenol AF diglycidyl ether and QCA-48995 were added to a container, heated to 80℃ and stirred until homogeneous. After cooling to room temperature, DMAB136-2.9 and DMDAC238-1.68 were added and stirred until homogeneous to obtain adhesive JQD-1. Its curing conditions are RT-60℃ / 0.5h-80℃ / 0.5h-120℃ / 1h-RT.

[0094] Comparative Example 1 (Repeated experiments were conducted on the embodiment of patent CN117586476A)

[0095] Weigh 0.1 mol of bisphenol AF and 0.5 mol of epichlorohydrin. Add the epichlorohydrin and bisphenol AF sequentially to a four-necked flask equipped with a thermometer, condenser, and dropping funnel. Stir and dissolve at 50°C, then raise the temperature to 110°C and react for 3 hours. Cool to room temperature and remove excess unreacted epichlorohydrin by rotary evaporation to obtain the etherified product. Dissolve the etherified product in an appropriate amount of organic solvent toluene to form an etherification reaction solution. Using a 1:1 molar ratio of bisphenol AF to NaOH in the alkali solution, and with 0.1 mol of NaOH in the alkali solution, select a 20% (100g alkali solution contains 20g NaOH) alkali solution. Add the alkali solution dropwise to the etherification reaction solution. After the addition is complete, raise the temperature to 85°C and react for 2 hours. Cool to room temperature and filter under reduced pressure to remove the generated inorganic salts, obtaining a clear, closed-ring reaction solution. A 10% (w / w) alkaline solution (containing 10g NaOH per 100g of alkaline solution) was added dropwise to the closed-ring reaction solution at a molar ratio of bisphenol AF to NaOH in the alkaline solution. The reaction was carried out at 90℃ for 1 hour. After cooling to room temperature, the inorganic salts were removed by vacuum filtration to obtain a fluorinated epoxy resin organic solution. The crude fluorinated epoxy resin product was repeatedly washed with hot alkaline water (0.1mol / L NaOH aqueous solution) and hot pure water, followed by extraction and layering at 80℃ until the aqueous phase was neutral. The organic solvent and a small amount of water were removed by rotary evaporation.

[0096] The etherified product obtained from the reaction is immiscible with toluene, and separates into layers during the addition of alkaline solution, failing to form a clear closed-ring reaction solution.

[0097] Comparative Example 2 (Repeated experiments were conducted on the embodiment of patent CN116745274A)

[0098] 200 g of 2,2-bis(4-hydroxyphenyl)hexafluoropropane, 661 g of epichlorohydrin, 258 g of isopropanol, and 275 g of pure water were added to a 2 L flask and stirred at 40 °C to form a homogeneous solution. Then, 114 g of 48.5 wt.% sodium hydroxide solution was added dropwise over 1.5 h at a temperature ranging from 40 to 65 °C, and the mixture was maintained at 65 °C for 30 min to complete the epoxidation reaction. After the reaction was complete, the temperature was raised to 145 °C while distilling under reduced pressure to remove unreacted epichlorohydrin and isopropanol. Next, 400 g of methyl isobutyl ketone was added to the system to dissolve it, and the temperature was raised to 65 °C. 6 g of 48.5 wt.% sodium hydroxide solution was then added, and the reaction was allowed to proceed for 1 h. The reaction solution was washed four times with pure water. Methyl isobutyl ketone was removed by distillation under reduced pressure at 100–150 °C, yielding 231.4 g of a transparent liquid. After stirring with a clean glass rod, the liquid was allowed to stand at room temperature for at least 30 minutes to solidify. The epoxy value of the obtained product was 0.38, and its DSC chromatogram is shown below. Figure 5 As shown, the melting point is 71.6℃.

[0099] The temperature-viscosity curve of adhesive JQD-1 prepared in Example 1 is shown in the figure below. Figure 6 As shown, the temperature-gelation curve is as follows: Figure 7 As shown in the figure, the dielectric loss curve is as follows: Figure 8 As shown, the capacitance curve is as follows: Figure 9 As shown in the figure, the relative permittivity curve is as follows: Figure 10 As shown, the non-isothermal curing kinetic curve is as follows: Figure 11 As shown, right The linear fitting curve is shown in the figure. Figure 12 As shown, lnβ versus 1 / T p The linear fitting curve is shown in the figure. Figure 13 As shown in the figure, the ultraviolet transmittance curve is as follows: Figure 14 As shown.

[0100] The test results for transmittance are shown in Table 1 below:

[0101] Table 1 Transmittance Test Results

[0102]

[0103] Within the visible light range, the maximum transmittance reaches 89.95%, making it suitable for optical design, filter development, or research on material transmittance.

[0104] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.

[0105] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A method for preparing bisphenol AF diglycidyl ether, characterized in that, Includes the following steps: (1) Add bisphenol AF and epichlorohydrin to the reaction vessel and stir to dissolve. Heat and maintain the temperature. Then add the catalyst and heat again to carry out the ring-opening reaction. After the reaction is completed, remove excess epichlorohydrin by rotary evaporation and recycle it. (2) Add NaOH solution dropwise to carry out the ring-closing reaction and obtain the crude product of bisphenol AF diglycidyl ether; (3) Add the crude product of bisphenol AF diglycidyl ether to a reaction vessel, add organic solvent, heat and stir to dissolve into a homogeneous phase, wash, and remove the solvent by rotary evaporation to obtain bisphenol AF diglycidyl ether. The molecular structure of the bisphenol AF diglycidyl ether is shown in Formula I below: Formula I; The dropping rate in step (2) is 20 drops / min-40 drops / min, and the temperature of the closed-loop reaction in step (2) is 30-40℃, and the time is 6-20h.

2. The method for preparing bisphenol AF diglycidyl ether according to claim 1, characterized in that, The heating and maintenance in step (1) is to raise the temperature to 50-60℃ and maintain it for 5-30 min. The ring-opening reaction temperature in step (1) is 70-110℃ and the reaction time is 5-20 h. The molar ratio of bisphenol AF to epichlorohydrin in step (1) is 1:2-10.

3. The method for preparing bisphenol AF diglycidyl ether according to claim 1, characterized in that, The catalyst in step (1) is one or more of tetramethylammonium bromide, tetraethylammonium bromide, tetrabutylammonium bromide, tetrabutylammonium chloride, tetramethylammonium chloride, tetraethylammonium chloride, benzyltriethylammonium chloride, benzyltriethylammonium bromide, benzyltrimethylammonium chloride, benzyltrimethylammonium bromide, benzyltributylammonium chloride, and benzyltributylammonium bromide; the mass ratio of the catalyst to bisphenol AF is 0.02-0.5:

1.

4. The method for preparing bisphenol AF diglycidyl ether according to claim 1, characterized in that, The molar ratio of NaOH to bisphenol AF in step (2) is 2-3:

1.

5. The method for preparing bisphenol AF diglycidyl ether according to claim 1, characterized in that, The mass ratio of the organic solvent to the crude bisphenol AF diglycidyl ether product in step (3) is 1-10:1, and the organic solvent in step (3) is one or more of toluene, xylene, chlorobenzene, o-dichlorobenzene, and heptane.

6. The method for preparing bisphenol AF diglycidyl ether according to claim 1, characterized in that, The heating and stirring process in step (3) is carried out at a temperature of 70-90℃ for 30-60 minutes.

7. An adhesive prepared from bisphenol AF diglycidyl ether obtained by the method according to any one of claims 1-6, characterized in that, The components include the following parts by mass: Bisphenol AF diglycidyl ether: 100 parts; QCA-48995: 10-15 copies; DMAB136-2.9: 2-4 doses; DMDAC238-1.68: 18-25 copies.

8. A method for preparing the adhesive according to claim 7, characterized in that, Includes the following steps: Bisphenol AF diglycidyl ether and QCA-48995 were added to a container, heated and stirred until homogeneous, cooled to room temperature, and then DMAB136-2.9 and DMDAC238-1.68 were added and stirred until homogeneous to obtain the adhesive.

9. The method for preparing the adhesive according to claim 8, characterized in that, The temperature for heating and stirring is 80-100℃.

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